Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel, a manufacturing method thereof and a display device. The display panel comprises a display area and a first packaging area, and the first packaging area surrounds the display area; the display panel further comprises a substrate; the signal wire is positioned on one side of the substrate; wherein the signal wire passes through the first packaging area along a first direction, and the signal wire is divided into at least two signal wire sections along the first direction; the signal wire comprises at least two structure parts which are stacked in the thickness direction of the display panel; in the adjacent structure parts corresponding to at least one signal wiring section of the first packaging area, the orthographic projection of the structure part close to the substrate on the substrate in the second direction covers the orthographic projection of the structure part away from the substrate on the substrate; the second direction intersects with the first direction; and the insulating layer is positioned on one side, far away from the substrate, of the signal wire. Water and oxygen can be prevented from entering the display area through the first packaging area, the packaging effect of the display panel is improved, and the reliability of the display panel is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic light emitting diode (OLED) display panels have the advantages of self-luminescence, low energy consumption, low production cost, high contrast, and more realistic color display, so OLED display panels have become the mainstream choice.

[0003] However, OLED display panels now often have the problem of packaging failure. Summary of the invention

[0004] The present invention provides a display panel and a manufacturing method thereof, and a display device, which can prevent water and oxygen from entering a display area through a first packaging area, thereby improving the packaging effect of the display panel and ensuring the reliability of the display panel.

[0005] According to one aspect of the present invention, a display panel is provided, the display panel comprising: a display area and a first encapsulation area, the first encapsulation area surrounding the display area;

[0006] The display panel further includes:

[0007] substrate;

[0008] A signal routing line is located on one side of the substrate; wherein the signal routing line passes through the first packaging area along a first direction, and the signal routing line is divided into at least two signal routing segments along the first direction; the signal routing line comprises at least two structural parts stacked along the thickness direction of the display panel; in the adjacent structural parts corresponding to at least one of the signal routing segments in the first packaging area, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate; the second direction intersects with the first direction;

[0009] The insulating layer is located on a side of the signal wiring away from the substrate.

[0010] Optionally, the signal routing includes a first structure portion, a second structure portion and a third structure portion which are stacked in sequence;

[0011] The first structure portion is located between the second structure portion and the substrate;

[0012] In at least one of the signal routing segments, along the second direction, a side surface of the first structure portion in the first packaging area protrudes beyond a side surface of the second structure portion in the first packaging area and in the same direction;

[0013] Preferably, the side surface of the second structure part in the first packaging area protrudes from the side surface of the third structure part in the first packaging area and in the same direction, or the side surface of the second structure part in the first packaging area is in the same plane as the side surface of the third structure part in the first packaging area;

[0014] Preferably, the material of the first structural part is the same as the material of the third structural part;

[0015] Preferably, the material of the first structure part includes titanium; the material of the second structure part includes aluminum; and the material of the third structure part includes titanium.

[0016] Optionally, in at least one of the signal routing segments, the second structure portion includes a first step portion and a second step portion, the second step portion is located on a side of the first step portion away from the substrate, and along the second direction, a side of the first step portion in the first packaging area protrudes beyond a side of the second step portion in the first packaging area and in the same direction; the third structure portion is located on a side of the second step portion away from the first structure portion;

[0017] Preferably, in at least one of the signal routing segments, in the second direction, a side surface of the first step portion in the first packaging area protrudes beyond a side surface of the third structure portion in the first packaging area and in the same direction;

[0018] Preferably, in at least one of the signal routing segments, in the second direction, the side surface of the third structure portion in the first packaging area is connected to the side surface of the second step portion in the first packaging area;

[0019] Preferably, in the second direction, the side surface of the third structure portion in the first packaging area protrudes beyond the side surface of the second step portion in the first packaging area and in the same direction, and the distance between the side surface of the second step portion in the first packaging area and the third structure portion at the junction of the side surface of the second step portion in the first packaging area and the side surface of the third structure portion in the first packaging area and in the same direction is less than a set distance value;

[0020] Preferably, the set distance value is less than or equal to 0.5 μm;

[0021] Preferably, the first step portion and the second step portion are an integral structure.

[0022] Optionally, the signal line includes a first power line; the display panel further includes a plurality of light-emitting devices, the light-emitting devices including a first electrode, a light-emitting layer, and a second electrode that are stacked; the first power line is electrically connected to the second electrode of at least part of the light-emitting devices;

[0023] Preferably, the first power line includes a first power sub-line, a second power sub-line and a third power sub-line; the first power sub-line, the second power sub-line and the third power sub-line all extend from the display area through the first packaging area;

[0024] The first power sub-line at least partially surrounds the display area; the second power sub-line is electrically connected to a first end of the first power sub-line, and the third power sub-line is electrically connected to a second end of the first power sub-line;

[0025] In the first packaging area, among the adjacent structural parts in the second power sub-line, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate;

[0026] In the first packaging area, among the adjacent structural parts in the third power sub-line, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate;

[0027] Preferably, the second power sub-line and the third power sub-line are electrically connected to the second electrode.

[0028] Optionally, the display panel further comprises an isolation structure located in the display area, the isolation structure encloses an isolation opening, the light-emitting layer is located in the isolation opening, and the isolation structure is used to isolate the light-emitting layer of the adjacent light-emitting device; the isolation structure overlaps the second electrode of at least part of the light-emitting device;

[0029] The first power line is electrically connected to the isolation structure;

[0030] Preferably, the isolation structure further includes a first connection portion and a second connection portion, the first connection portion is located on a side of the second power sub-line close to the display area, and the second connection portion is located on a side of the third power sub-line close to the display area; the second power sub-line is electrically connected to the first connection portion, and the third power sub-line is electrically connected to the second connection portion;

[0031] Preferably, the first power line and the isolation structure are an integrated structure;

[0032] Preferably, the first power line and the isolation structure are made of the same material;

[0033] Preferably, the first power line is located in a conductive layer on a side of the light emitting device close to the substrate.

[0034] Optionally, the display panel further includes a pixel defining layer, the pixel defining layer is located between the substrate and the isolation structure, the pixel defining layer includes a plurality of pixel openings, and the first electrode is at least partially exposed in the pixel openings;

[0035] The orthographic projection of the isolation structure on the pixel defining layer is located between adjacent pixel openings;

[0036] The isolation structure comprises a supporting portion and a partitioning portion, wherein the supporting portion is located between the partitioning portion and the pixel defining layer; the orthographic projection of the partitioning portion on the pixel defining layer covers the orthographic projection of the supporting portion on the pixel defining layer; the second electrode of the light emitting device on at least one side of the isolation structure overlaps with the isolation structure;

[0037] Preferably, the second electrode of the light-emitting device on at least one side of the isolation structure overlaps with a support portion of the isolation structure, and the support portion is conductive;

[0038] Preferably, in the second direction, at a position where the support portion and the partition portion meet, a size of the support portion is smaller than a size of the partition portion;

[0039] Preferably, the isolation structure further comprises an auxiliary support portion, wherein the auxiliary support portion is located between the support portion and the pixel defining layer, and an orthographic projection of the support portion on the substrate is located within an orthographic projection of the auxiliary support portion on the substrate;

[0040] Preferably, the second electrode of the light-emitting device on at least one side of the isolation structure overlaps the auxiliary supporting portion.

[0041] Optionally, the display panel further includes a second encapsulation area and an encapsulation layer, and in the second encapsulation area, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are stacked;

[0042] In at least a part of the first packaging area, the packaging layer includes the second inorganic packaging layer, and the second inorganic packaging layer serves as the insulating layer to cover the signal trace;

[0043] Preferably, the second packaging area includes a display area.

[0044] Optionally, the second electrodes of the light-emitting devices are electrically connected to each other to form a whole-surface structure;

[0045] Preferably, the signal wiring is located in a conductive layer in the display panel, and in the display area, the conductive layer where the signal wiring is located is located between the light-emitting device and the substrate.

[0046] Optionally, the display panel includes a plurality of conductive layers stacked in layers; the signal routing includes a first signal sub-routing and a second signal sub-routing, and the first signal sub-routing and the second signal sub-routing are located in the same conductive layer;

[0047] Preferably, the first signal sub-route and the second signal sub-route transmit different signals, and a break is formed between the first signal sub-route and the second signal sub-route;

[0048] Preferably, the first signal sub-route at least partially surrounds the display area; the second signal sub-route is located between the first end of the first signal sub-route and the second end of the first signal sub-route;

[0049] In the first packaging area, the structure portion of the first signal sub-line close to the substrate is on a side close to the break, and protrudes from the side of the structure portion away from the substrate close to the break;

[0050] In the first packaging area, the structural portion of the second signal sub-route close to the substrate is located on a side close to the break, and protrudes from the side of the structural portion away from the substrate close to the break.

[0051] Optionally, the display panel further includes a pixel circuit; the signal wiring is electrically connected to the pixel circuit;

[0052] Preferably, the signal wiring includes a second power line, the pixel circuit includes a driving module, and the driving current generated by the driving module is related to the power voltage transmitted by the second power line;

[0053] Preferably, the signal wiring includes a third power line; the pixel circuit includes an initialization module, the initialization module is used to initialize the control end or the light-emitting device of the driving module, and the third power line is used to transmit an initialization voltage;

[0054] Preferably, the signal wiring includes a first power line, and the first power line is electrically connected to an electrode of the light-emitting device.

[0055] Optionally, the first packaging area includes a dam;

[0056] The dam is arranged on one side of the substrate and surrounds the display area, and a side of the dam close to the display area and / or away from the display area comprises a groove; the dam and the groove are arranged in the first packaging area;

[0057] The signal trace and the dam are arranged on the same side of the substrate;

[0058] The signal routing includes a first signal routing segment and a second signal routing segment, the first signal routing segment is located on a side of the dam away from the substrate, and the second signal routing segment is located on a side of the groove away from the substrate; in the second signal routing segment, among the adjacent structural parts, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part away from the substrate on the substrate;

[0059] Preferably, in the first signal routing segment, among the adjacent structural parts, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate;

[0060] Preferably, in the first packaging area, the signal wiring is located on a side of the dam away from the substrate and in the groove.

[0061] Optionally, the insulating layer is an inorganic layer; and a first organic part is further included on a side of the dam away from the substrate, wherein the first organic part is on a side of the encapsulation layer in the display panel close to the substrate;

[0062] Preferably, the first organic part is located in a first organic layer, the first organic layer further comprises a second organic part located in the display area, the second organic part is in contact with the first electrode of the light emitting device in the display area, and is located on a side of the first electrode close to the substrate;

[0063] Preferably, the dam comprises a third organic portion, the third organic portion is located in the second organic layer, and the second organic layer is located on a side of the first organic layer close to the substrate;

[0064] Preferably, the display panel further comprises a pixel defining layer, and in the non-display area, the pixel defining layer is located on a side of the dam away from the substrate and between the signal wiring and the insulating layer;

[0065] Preferably, in the groove, the signal wiring contacts the insulating layer on a side of the signal wiring away from the substrate.

[0066] According to another aspect of the present invention, a method for manufacturing a display panel is provided, wherein the display panel comprises a display area and a first encapsulation area, wherein the first encapsulation area surrounds the display area;

[0067] The manufacturing method of the display panel includes:

[0068] providing a substrate;

[0069] A signal routing is formed on one side of the substrate; wherein the signal routing passes through the first packaging area along a first direction, and the signal routing is divided into at least two signal routing segments along the first direction; the signal routing includes at least two structural parts stacked along the thickness direction of the display panel; in the adjacent structural parts corresponding to at least one of the signal routing segments in the first packaging area, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate; the second direction intersects with the first direction;

[0070] An insulating layer is formed on a side of the signal wiring away from the substrate.

[0071] Optionally, the display panel further includes a non-display area, and the non-display area includes the first packaging area; and forming a signal wiring on one side of the substrate specifically includes:

[0072] A display transition film layer is provided, wherein the display transition film layer comprises the substrate, the signal routing layer and the pixel definition transition layer which are sequentially stacked; the signal routing layer passes through the first packaging area along the first direction, and the signal routing layer comprises at least two structural part layers which are stacked along the thickness direction of the display panel;

[0073] Performing a patterning process on the pixel definition transition layer in the non-display area, and removing at least a portion of the pixel definition transition layer located on one side of the signal wiring layer in the first packaging area;

[0074] forming an isolation layer on a side of the pixel defining transition layer away from the substrate;

[0075] Performing a patterning process on the isolation layer to form an isolation structure;

[0076] The pixel defining transition layer of the display area is patterned to form a pixel defining layer including a plurality of pixel openings, and the side of the signal routing layer is etched to form a structure in which, in the adjacent structural parts in the first packaging area, the orthographic projection of the structural part close to the substrate on the substrate along the second direction covers the orthographic projection of the structural part far from the substrate on the substrate;

[0077] Preferably, a dam and a groove are provided in the first packaging area, and the pixel defining transition layer in the non-display area is patterned, and the pixel defining transition layer located on one side of the signal wiring layer at the position of the groove in the first packaging area is removed;

[0078] Preferably, the step of patterning the isolation layer to form an isolation structure comprises:

[0079] Patterning the isolation layer in the display area to form an isolation structure, and removing at least a portion of the isolation layer in the non-display area;

[0080] Preferably, while the pixel-defining transition layer of the display area is being patterned, the side of the signal routing layer is etched to form a structure in which, in the adjacent structural parts in the first packaging area, the orthographic projection of the structural part close to the substrate on the substrate along the second direction covers the orthographic projection of the structural part far from the substrate on the substrate.

[0081] Optionally, before etching the side surface of the signal routing layer, the method includes:

[0082] In the first packaging area, a side of the signal routing layer away from the substrate is coated with photoresist and developed so that the developed photoresist forms a photolithography opening, wherein the photolithography opening exposes the side surfaces of each structural layer in the signal routing layer, and exposes a surface area of ​​a set structural layer that is a set distance away from the side surfaces of the set structural layer, and the set structural layer is the structural layer farthest from the substrate.

[0083] According to another aspect of the present invention, a display device is provided. The display device includes the display panel provided by any embodiment of the present invention.

[0084] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0085] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0086] Figure 1 is a schematic structural diagram of a first packaging area of ​​an existing display panel;

[0087] Figure 2 is a schematic diagram of a top view structure of a display panel provided according to an embodiment of the present invention;

[0088] Figure 3 is along Figure 2 A schematic diagram of a structure obtained by cutting along the section line A1A2 in FIG.

[0089] Figure 4 is along Figure 2Another structural schematic diagram obtained by cutting the section line A1A2 in FIG.

[0090] Figure 5 is along Figure 2 Another structural schematic diagram obtained by cutting the section line A1A2 in FIG.

[0091] Figure 6 is a schematic structural diagram of another display panel provided according to an embodiment of the present invention;

[0092] Figure 7 is an enlarged view of the isolation structure;

[0093] Figure 8 is a schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0094] Fig. 9 is a structural schematic diagram of a pixel circuit provided according to an embodiment of the present invention;

[0095] Fig.10 is a schematic structural diagram of another display panel provided according to an embodiment of the present invention;

[0096] Fig.11 A schematic diagram of a top view of a portion of a first packaging area in a display panel provided by an embodiment of the present invention;

[0097] Fig.12 is a schematic flow chart of a method for manufacturing a display panel provided according to an embodiment of the present invention;

[0098] Figure 13-Figure 15 To make a structural diagram during signal routing;

[0099] Fig.16 It is a structural schematic diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0100] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0101] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0102] The inventor has found through research that one of the reasons why packaging failure occurs in current display panels is that the display panel includes a display area and a first packaging area surrounding the display area. Figure 1 is a schematic diagram of the structure of the first packaging area of ​​an existing display panel, referring to Figure 1 The display panel also includes a signal line 100, which includes at least two structural parts 111 stacked along the thickness direction of the display panel. The signal line 100 extends from the display area through the first packaging area. The signal line 100 in the first packaging area is affected by the subsequent film layer manufacturing process of the signal line 100, and there is a large side engraving on the side, so that there is a gap 201 between the insulating layer 200 in the first packaging area and the side of the signal line 100. The insulating layer 200 cannot completely seal the signal line 100 in the first packaging area, resulting in water vapor easily invading from the gap 201 and entering the display area of ​​the display panel, thereby causing the display panel packaging to fail.

[0103] Based on the above reasons, this embodiment provides a display panel. Figure 2 is a schematic diagram of a top view of a display panel provided according to an embodiment of the present invention, with reference to Figure 2 The display panel provided in this embodiment includes: a display area AA and a first encapsulation area FA, and the first encapsulation area FA surrounds the display area AA. Figure 3 is along Figure 2 A structural schematic diagram obtained by cutting the section line A1A2 in FIG. Figure 4 is along Figure 2 Another structural schematic diagram obtained by cutting the section line A1A2 in FIG. Figure 2-Figure 4, the display panel further includes: a substrate 300, a signal line 100 and an insulating layer 200; the signal line 100 is located on one side of the substrate 300; and the insulating layer 200 is located on the side of the signal line 100 away from the substrate 300. The signal line 100 passes through the first packaging area FA along the first direction Y, and the signal line 100 is divided into at least two signal line segments along the first direction Y; the signal line 100 includes at least two structural parts 111 stacked along the thickness direction of the display panel; in the adjacent structural parts 111 corresponding to at least one signal line segment in the first packaging area FA, along the second direction X, the orthographic projection of the structural part 111 close to the substrate 300 on the substrate 300 covers the orthographic projection of the structural part 111 away from the substrate 300 on the substrate 300; the second direction X intersects with the first direction Y.

[0104] The display panel provided in this embodiment may be an OLED display panel. The first encapsulation area FA is located in the non-display area NAA of the display panel, and the signal line 100 may extend from the display area AA to the non-display area NAA and pass through the first encapsulation area FA, that is, in the same direction, the width of the signal line 100 may be greater than the width of the first encapsulation area FA, and the direction refers to the direction from the display area AA to the non-display area NAA. This arrangement facilitates the electrical connection of some conductive structures in the display area AA with the signal line 100 located at the inner boundary FA1 of the first encapsulation area FA, thereby eliminating the need for the conductive structures in the display area NA to extend to the non-display area NAA to be electrically connected to the signal line 100; it also facilitates the electrical connection of some conductive structures at the outer boundary FA2 of the first encapsulation area FA with the signal line 100 located at the outer boundary FA2 of the first encapsulation area FA, thereby eliminating the need for the conductive structures in the non-display area NAA to extend to the first encapsulation area FA or the display area AA to be electrically connected to the signal line 100; at the same time, it can also reduce the resistance of the signal line 100, thereby reducing the voltage drop caused by the signal line 100, which is beneficial to the uniformity of the display of the display panel. The boundary of the first encapsulation area FA close to the display area AA is the inner boundary FA1 of the first encapsulation area FA, and the boundary of the first encapsulation area FA away from the display area AA is the outer boundary FA2 of the first encapsulation area FA. The first encapsulation area FA is provided with a dam 310 and a groove 320 (see Figure 6), in the case where the structure closest to the display area AA among the dams 310 and the grooves 320 of the first encapsulation area FA is the groove 320, the boundary of the groove 320 closest to the display area AA in the first encapsulation area FA closest to the display area AA is the inner boundary FA1 of the first encapsulation area FA, wherein the boundary of the groove 320 closest to the display area AA may be on the side wall of the groove 320. In the case where the structure closest to the display area AA among the dams 310 and the grooves 320 of the first encapsulation area FA is the dam 310, the boundary of the dam 310 closest to the display area AA in the first encapsulation area FA closest to the display area AA is the inner boundary FA1 of the first encapsulation area FA, wherein the boundary of the dam 310 closest to the display area AA may be on the side of the dam 310. In the case where the structure farthest from the display area AA among the dams 310 and the grooves 320 of the first encapsulation area FA is the groove 320, the boundary farthest from the display area AA among the grooves 320 farthest from the display area AA in the first encapsulation area FA is the outer boundary FA2 of the first encapsulation area FA, wherein the boundary farthest from the display area AA among the grooves 320 may be on the side wall of the groove 320. In the case where the structure farthest from the display area AA among the dams 310 and the grooves 320 of the first encapsulation area FA is the dam 310, the boundary farthest from the display area AA among the dams 310 farthest from the display area AA in the first encapsulation area FA is the outer boundary FA2 of the first encapsulation area FA, wherein the boundary farthest from the display area AA among the dams 310 may be on the side of the dam 310.

[0105] The signal wiring 100 can be used for signal transmission. Optionally, the signal wiring 100 can be used to transmit the signal from the non-display area NAA to the display area AA. In some optional embodiments, the signal wiring 100 can be prepared simultaneously with the component structure of the pixel circuit in the display area AA or the component structure of the light-emitting device.

[0106] An insulating layer 200 is disposed on the side of the signal line 100 away from the substrate 300. Optionally, at least one insulating layer 200 is disposed on the side of each layer of signal line 100 away from the substrate 300. On the one hand, the insulation between the signal line 100 and other conductive structures is ensured. On the other hand, in the first packaging area FA, the insulating layer 200 covers the signal line 100, which can play a partial packaging effect. In an optional embodiment of the present invention, at least one insulating layer 200 is an inorganic insulating layer.

[0107] In the first packaging area FA, a part of the signal routing segments in the signal routing 100 may include an organic material layer and an insulating layer 200 on a side away from the substrate 300. The organic material layer may fill the side of the signal routing segment so that the side of the signal routing segment may contact the organic material layer without a gap. The positional relationship of each structural part in the signal routing segment covered by the organic material layer may be as follows: Figure 1The positional relationship shown may also be that in the adjacent structural parts 111, along the second direction X, the orthographic projection of the structural part 111 close to the substrate 300 on the substrate 300 covers the orthographic projection of the structural part 111 far from the substrate 300 on the substrate 300. However, in the first packaging area FA, at least a part of the signal routing segment on the side away from the substrate 300 only includes the insulating layer 200. In this embodiment, in the adjacent structural parts 111 corresponding to at least one signal routing segment, along the second direction X, the orthographic projection of the structural part close to the substrate 300 on the substrate 300 covers the orthographic projection of the structural part 111 far from the substrate 300 on the substrate 300, so that the insulating layer 200 can be completely in contact with the part of the signal routing segment.

[0108] In this embodiment, the orthographic projection of the structure portion 111 close to the substrate 300 on the substrate 300 is set to cover the orthographic projection of the structure portion 111 far from the substrate 300 on the substrate 300. Specifically, the orthographic projection of the structure portion 111 close to the substrate 300 on the substrate 300 may coincide with the orthographic projection of the structure portion 111 far from the substrate 300 on the substrate 300, or the orthographic projection of the structure portion 111 far from the substrate 300 on the substrate 300 may be located within the orthographic projection of the structure portion 111 close to the substrate 300 on the substrate 300 (that is, the boundary of the orthographic projection of the structure portion 111 far from the substrate 300 on the substrate 300 and the boundary of the orthographic projection of the structure portion 111 close to the substrate 300 on the substrate 300 are at a distance greater than 0 in the same direction). For example, reference is made to Figure 3 , the outermost side surface S1 of the structure portion 111 close to the substrate 300 protrudes from the side surface S2 of the structure portion 111 away from the substrate 300, referring to Figure 4 , the side surface S1 of the structure part 111 close to the substrate 300 is inclined and is in the same plane as the side surface S2 of the structure part 111 far from the substrate 300. The arrangement between the above-mentioned structure parts 111 can ensure that there is no gap between the insulating layer 200 and the signal wiring 100 on the side surface of the first packaging area FA, that is, the signal wiring 100 is in contact with the insulating layer 200 at each position on the side surface of the first packaging area FA, thereby preventing external water vapor from entering the display area AA from the side surface where the insulating layer 200 contacts the signal wiring 100, thereby improving the problem of display panel packaging failure.

[0109] The present embodiment provides a display panel, which includes a substrate, a signal line and an insulating layer. The signal line is located on one side of the substrate, and the insulating layer is located on a side of the signal line away from the substrate. The signal line passes through the first packaging area along the first direction, and the insulating layer also passes through the first packaging area along the first direction. Part of the side edge of the signal line is located in the first packaging area. The signal line is divided into at least two signal line segments along the first direction. The signal line includes at least two structural parts stacked along the thickness direction of the display panel. In the adjacent structural parts corresponding to at least one signal line segment in the first packaging area, along the second direction, the positive projection of the structural part close to the substrate on the substrate covers the positive projection of the structural part away from the substrate on the substrate. Such an arrangement can avoid the side of the structural part away from the substrate protruding from the outermost side of the structural part close to the substrate in the same direction, thereby avoiding a gap between the insulating layer and the side of the signal line in the first packaging area, ensuring that the insulating layer covers the side of the signal line in the first packaging area, so that there is no gap between the insulating layer and the side of the signal line in the first packaging area, thereby preventing water and oxygen from entering the display area through the first packaging area, improving the packaging effect of the display panel, and ensuring the reliability of the display panel.

[0110] Optional, continue to refer to Figure 3 The signal routing 100 includes a first structure portion 101, a second structure portion 102 and a third structure portion 103 which are stacked in sequence; the first structure portion 101 is located between the second structure portion 102 and the substrate 300; in at least one signal routing segment, along the second direction X, the side surface of the first structure portion 101 in the first packaging area protrudes from the side surface of the second structure portion 102 in the first packaging area and in the same direction.

[0111] Optionally, the side surface of the second structure portion 102 in the first packaging area protrudes from the side surface of the third structure portion 103 in the first packaging area and in the same direction (see Figure 3 ), or the side S1 of the second structure portion 102 in the first packaging area and the side S2 of the third structure portion 103 in the first packaging area are in the same plane (refer to Figure 4 ).

[0112] Specifically, the second direction X includes a positive direction and a negative direction, wherein the positive direction is opposite to the negative direction, and the side in the same direction refers to the side in the same direction. Exemplarily, the side of the first structure portion 101 in the first packaging area and in the positive direction in the second direction X protrudes from the side of the second structure portion 102 in the first packaging area and in the positive direction in the second direction X; the side of the second structure portion 102 in the first packaging area and in the positive direction in the second direction X protrudes from the side of the third structure portion 103 in the first packaging area and in the positive direction in the second direction X.

[0113] In this embodiment, the side surface of the first structure part 101 in the first packaging area protrudes from the side surface of the second structure part 102 in the first packaging area and in the same direction, and the side surface of the second structure part 102 in the first packaging area protrudes from the side surface of the third structure part 103 in the first packaging area and in the same direction. When the insulating layer 200 is located on the side of the signal wiring 100 away from the substrate 300, the insulating layer 200 can be completely in contact with the side surface of the first structure part 101 in the first packaging area, the side surface of the second structure part 102 in the first packaging area, and the side surface of the third structure part 103 in the first packaging area, thereby avoiding the existence of a gap between the insulating layer 200 and the side surface of the signal wiring 100 in the first packaging area, and further improving the packaging reliability of the display panel.

[0114] Optional, continue to refer to Figure 3 The substrate 300 includes a first sub-substrate 3011 and a second sub-substrate. The height of the first sub-substrate 3011 is lower than that of the second sub-substrate. The first sub-substrate 3011 is adjacent to the side of the signal trace 100 in the first packaging area. The second sub-substrate is the other substrate in the substrate 300 except the first sub-substrate 3011.

[0115] Specifically, in the process of manufacturing the signal routing 100, if the third structure part 103 protrudes from the second structure part 102, a portion of the substrate 300 can be exposed by the developed photoresist (the substrate 300 exposed by the photoresist is etched to become the first sub-substrate 3011) so that the third structure part 103 is completely exposed on the side of the first packaging area, so that the side of the third structure part 103 can be fully etched to ensure that the side of the third structure part 103 after etching is concave than the side of the part of the second structure part 102 in the first packaging area.

[0116] Optionally, the material of the first structure portion is the same as the material of the third structure portion. In this way, the first structure portion and the third structure portion can be manufactured using the same process, and the replacement of different materials for manufacturing the first structure portion and the third structure portion during the signal routing process can be avoided.

[0117] Optionally, the material of the first structure part includes titanium; the material of the second structure part includes aluminum; and the material of the third structure part includes titanium.

[0118] Specifically, the material of the first structure part and the material of the third structure part include titanium, which can improve the corrosion resistance and wear resistance of the signal line, and the material of the second structure part includes aluminum, which can enhance the mechanical properties of the signal line.

[0119] Optional, continue to refer to Figure 3In at least one signal routing segment, the second structure portion 102 includes a first step portion 110 and a second step portion 120, the second step portion 120 is located on a side of the first step portion 110 away from the substrate 300, and along the second direction X, the side of the first step portion 110 in the first packaging area protrudes beyond the side of the second step portion 120 in the first packaging area and in the same direction; the third structure portion 103 is located on a side of the second step portion 120 away from the first structure portion 101.

[0120] Specifically, the first step portion 110 is arranged to protrude from the side of the second step portion 120 in the first packaging area and in the same direction, so that the insulating layer 200 can fully cover the side of the first step portion 110 in the first packaging area and the side of the second step portion 120 in the first packaging area, avoiding the existence of a gap between the insulating layer 200 and the side of the second structure 102 in the first packaging area, thereby further improving the packaging reliability of the display panel.

[0121] Optional, continue to refer to Figure 3 In at least one signal wiring segment, in the second direction X, the side surface of the first step portion 110 in the first packaging area protrudes beyond the side surface of the third structure portion 103 in the first packaging area and in the same direction. This arrangement can avoid the problem of a gap between the insulating layer 200 and the second step portion 120 caused by the side surface of the third structure portion 103 protruding beyond the side edge of the first step portion 110. The insulating layer 200 can contact the second step portion 120 at the side surface of the first packaging area, avoiding a gap between the insulating layer 200 and the signal wiring 100 at the side surface of the first packaging area, and further improving the packaging reliability of the display panel.

[0122] Optional, Figure 5 is along Figure 2 Another structural schematic diagram obtained by cutting the section line A1A2 in FIG. Figure 5 In at least one signal routing segment, in the second direction X, the third structure portion 103 is connected to the second step portion 120 on the side of the first packaging area. This arrangement allows the third structure portion 103 to be flush with the second step portion 120 on the side of the first packaging area, thereby further ensuring that the insulating layer 200 is in full contact with the second step portion 120 on the side of the first packaging area, avoiding a gap between the insulating layer 200 and the signal routing 100 on the side of the first packaging area, and improving the packaging reliability of the display panel.

[0123] Optional, continue to refer to Figure 3, in the second direction X, the side surface of the third structure portion 103 in the first packaging area protrudes beyond the side surface of the second step portion 120 in the first packaging area and in the same direction, and the distance between the side surface of the second step portion 120 in the first packaging area and the third structure portion 103 at the junction of the side surface of the first packaging area and the third structure portion 103 is less than or equal to the set distance value.

[0124] Specifically, the set distance value can be set according to actual needs, and the set distance value can ensure that there is no gap between the insulating layer 200 and the side of the signal trace 100 of the first packaging area.

[0125] Optionally, set the distance value to less than or equal to 0.5 μm.

[0126] Specifically, the set distance value may be 0.1 μm, 0.15 μm, 0.2 μm, 0.35 μm, 0.4 μm, 0.45 μm or 0.5 μm, etc. Setting the set distance value less than or equal to 0.5 μm can ensure that there is no gap between the insulating layer and the side of the signal trace in the first packaging area, thereby ensuring the reliability of the display panel packaging.

[0127] Optionally, the first step portion and the second step portion are an integrated structure, and in this configuration, the first step portion and the second step portion can be manufactured at the same time, thereby reducing the manufacturing process steps of the display panel and improving the manufacturing efficiency of the display panel.

[0128] Optional, Figure 6 is a schematic diagram of the structure of another display panel provided according to an embodiment of the present invention, referring to Figure 6 The signal line 100 includes a first power line 130; the display panel also includes a plurality of light-emitting devices 160, the light-emitting devices 160 include a first electrode 161, a light-emitting layer 162 and a second electrode 163 which are stacked; the first power line is electrically connected to the second electrode 163 of at least part of the light-emitting devices 160.

[0129] Among them, the first electrode 161 can be the anode of the light-emitting device 160, and the second electrode 163 can be the cathode of the light-emitting device 160. The first electrode 161, that is, the anode, is a reflective electrode, that is, an opaque electrode. The anode can adopt a three-layer structure, wherein the first layer and the third layer can be metal oxide layers, such as indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), and the second layer in the middle can be a metal layer (such as silver or copper). The cathode can be an ITO transparent electrode or a magnesium-silver alloy. The light-emitting layer 162 can include only a single film layer, that is, only a light-emitting material layer; it can also include a multilayer structure formed by a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer, an electron injection layer, etc. stacked from the first electrode 161 to the second electrode 163.

[0130] Optionally, the light emitting layer 162 includes at least a red light emitting layer, a green light emitting layer and a blue light emitting layer, thereby realizing a display of multiple colors. In this embodiment, the first power line 130 is electrically connected to the second electrode 163 of at least part of the light emitting device 160, thereby transmitting a corresponding electrical signal to the second electrode 163.

[0131] Optional, continue to refer to Figure 2 The first power line 130 includes a first power sub-line 131, a second power sub-line 132 and a third power sub-line 133; the first power sub-line 131, the second power sub-line 132 and the third power sub-line 133 all extend from the display area AA through the first packaging area FA; the first power sub-line 131 at least partially surrounds the display area AA; the second power sub-line 132 is electrically connected to the first end of the first power sub-line 131, and the third power sub-line 133 is electrically connected to the second end of the first power sub-line 131; in the first packaging area FA, in the adjacent structural parts in the second power sub-line 132, along the second direction X, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far away from the substrate on the substrate; in the first packaging area FA, in the adjacent structural parts in the third power sub-line 133, along the second direction X, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far away from the substrate on the substrate.

[0132] Specifically, the second power sub-line 132 and the third power sub-line 133 can be electrically connected to the flexible circuit board in the non-display area of ​​the display panel, and can receive the first power signal transmitted by the flexible circuit board. For example, the first power signal can be a VSS signal. For example, the first power signal can be a ground signal or a negative power signal. The first power sub-line 131 is electrically connected to the second power sub-line 132 and the third power sub-line 133, so that the first power sub-line 131 can transmit the first power signal. The first power sub-line 131 can be connected to the second power sub-line 132 and the third power sub-line 133 as a whole.

[0133] In this embodiment, the projection relationship of each structural part in the second power sub-line 132 in the first packaging area FA and the projection relationship of each structural part in the third power sub-line 133 in the first packaging area FA are set on the substrate, so that there is no gap between the insulating layer and the side surfaces of the second power sub-line 132 and the third power sub-line 133 in the first packaging area FA, thereby further ensuring the packaging reliability of the display panel.

[0134] Optionally, the second power sub-line and the third power sub-line are electrically connected to the second electrode. This arrangement can avoid the second electrode being electrically connected to the first power sub-line and increasing the area of ​​the second electrode in the display region.

[0135] Optional, continue to refer to Figure 6The display panel also includes an isolation structure 170 located in the display area AA, the isolation structure 170 encloses an isolation opening 171, and the light-emitting layer 162 is located in the isolation opening 171; the isolation structure 170 overlaps the second electrode 163 of at least part of the light-emitting device 160; and the first power line 130 is electrically connected to the isolation structure 170.

[0136] Among them, the isolation structure 170 can be arranged around the light-emitting device 160, and the isolation structure 170 is used to separate the light-emitting layer 162 of the adjacent light-emitting device 160. The isolation structure 170 has a certain thickness, so that the light-emitting layer 162 of the adjacent light-emitting device 160 is separated at the isolation structure 170, so as to avoid the adjacent light-emitting devices 160 from emitting different colors at the same time. The isolation structure 170 has a certain thickness, and specifically, the thickness of the isolation structure 170 is greater than the thickness of the second electrode 163. Exemplarily, when preparing the display panel, after the isolation structure 170 is prepared, the light-emitting layer 162 can be evaporated using the isolation structure 170 as a mask, and then the light-emitting layer 162 of the adjacent light-emitting device 160 is separated at the isolation structure 170 by the isolation structure 170, and the light-emitting layer 162 can be non-contact with the isolation structure 170, so as to avoid the adjacent light-emitting devices 160 from emitting different colors at the same time. In addition, the use of the precision mask for evaporating the light-emitting layer 162 in the prior art can be saved. When preparing the second electrode 163 on the light-emitting layer 162, for example, when the second electrode 163 is evaporated using a universal mask, due to the existence of the isolation structure 170, the second electrode 163 is divided into a plurality of independent second electrodes 163 corresponding to the light-emitting devices 160, wherein the preparation process of the second electrode 163 is not limited to the evaporation process described above, and a sputtering process or other processes may also be used, which is not specifically limited in this embodiment. It should be noted that when both the light-emitting layer 162 and the second electrode 163 are prepared using the evaporation process, the light-emitting layer 162 and the isolation structure 170 can be made to have no contact by adjusting the different evaporation angles, and the second electrodes 163 of at least some of the light-emitting devices 160 are in contact with the isolation structure 170 to achieve overlap between the two, thereby achieving interconnection between the second electrodes 163 of at least some of the light-emitting devices 160 in the display panel. In this embodiment, the first power line 130 is electrically connected to the second electrode 163 of at least part of the light-emitting device 160 through the isolation structure 170, and the electrical signal can be transmitted to the second electrode 163 of the light-emitting device 160 through the first power line 130 and the isolation structure 170. Among them, the first power line 130 and the isolation structure 170 are in the same layer, and optionally, the first power line 130 and the isolation structure 170 are made of the same material, and there is no need to add an additional film layer in the display panel to prepare the first power line 130, which can simplify the structure and preparation process of the display panel.

[0137] The vertical projection of the isolation structure 170 on the substrate 300 does not overlap with the vertical projection of the first electrode 161 on the substrate 300 . This arrangement can prevent the first electrode 161 and the isolation structure 170 from overlapping.

[0138] The composition, preparation and other contents of the isolation structure 170 are further described in patent CN118251982A, patent 202410864269.8, patent PCT / CN2024 / 098407, patent PCT / CN2024 / 102783, patent PCT / CN2024 / 098217, patent PCT / CN2024 / 099419, and patent PCT / CN2024 / 099072, the contents of which are incorporated into this application by reference for reference.

[0139] Optional, continue to refer to Figure 2 The isolation structure 170 also includes a first connection portion 410 and a second connection portion 420. The first connection portion 410 is located on a side of the second power sub-line 132 close to the display area AA, and the second connection portion 420 is located on a side of the third power sub-line 133 close to the display area AA; the second power sub-line 132 is electrically connected to the first connection portion 410, and the third power sub-line 133 is electrically connected to the second connection portion 420.

[0140] Specifically, the first connection portion 410 and the second connection portion 420 are provided, and the power signal transmitted by the first power line 130 can be transmitted to the entire isolation structure 170 through the first connection portion 410 and the second connection portion 420 .

[0141] Optional, continue to refer to Figure 6 , the first power line 130 and the isolation structure 170 are an integrated structure.

[0142] Specifically, during the preparation of the display panel, a whole conductive layer of material can be formed in the display area AA and the non-display area NAA of the display panel, and then the whole conductive layer is patterned to remove the conductive layer at the position of the isolation opening 171 to obtain an integrated first power line 130 and an isolation structure 170.

[0143] Optional, continue to refer to Figure 6 The display panel further includes a pixel defining layer 180 , which is located between the substrate 300 and the isolation structure 170 . The pixel defining layer 180 includes a plurality of pixel openings 181 , and the first electrode 161 is at least partially exposed in the pixel opening 181 .

[0144] Specifically, a light-emitting layer 162 of a light-emitting device 160 is set in each pixel opening 181, and the pixel defining layer 180 can adopt organic materials such as acrylic organic compounds, polyamide, or polyimide, and can also adopt inorganic materials such as silicon oxide, silicon nitride, silicon oxynitride, or aluminum oxide. The embodiment of the present invention is not specifically limited here.

[0145] Optional, continue to refer to Figure 6 , the orthographic projection of the isolation structure 170 on the pixel defining layer 180 is located between adjacent pixel openings 181; the isolation structure 170 includes a support portion 172 and a partition portion 173, the support portion 172 is located between the partition portion 173 and the pixel defining layer 180; the orthographic projection of the partition portion 173 on the pixel defining layer 180 covers the orthographic projection of the support portion 172 on the pixel defining layer 180; the second electrode 163 of the light emitting device 160 on at least one side of the isolation structure 170 overlaps with the isolation structure 170;

[0146] Optionally, the second electrode 163 of the light-emitting device 160 on at least one side of the isolation structure 170 overlaps with the support portion 172 of the isolation structure 170 , and the support portion 172 is conductive.

[0147] Optionally, the orthographic projection of the pixel opening 181 on the substrate 300 is within the orthographic projection of the isolation opening 171 on the substrate 300. In an optional embodiment, the orthographic projection of the pixel opening 181 on the substrate 300 completely overlaps with the orthographic projection of the isolation opening 171 on the substrate 300. In another optional embodiment, the orthographic projection of the pixel opening 181 on the substrate 300 partially overlaps with the orthographic projection of the isolation opening 171 on the substrate 300, and the orthographic projection of the pixel opening 181 on the substrate 300 is completely within the orthographic projection of the isolation opening 171 on the substrate 300.

[0148] The isolation structure 170 includes a support portion 172 and a partition portion 173. The second electrodes 163 of adjacent light-emitting devices 160 are connected to the support portion 172, so that the second electrodes 163 of adjacent light-emitting devices 160 are electrically connected through the support portion 172. The material of the support portion 172 may be aluminum. The material of the partition portion 173 may include a conductive material and / or an insulating material, for example, the material of the partition portion 173 includes titanium, silicon nitride, or silicon oxide.

[0149] The orthographic projection of the partition part 173 on the pixel defining layer 180 covers the orthographic projection of the support part 172 on the pixel defining layer 180, so that the isolation structure 170 as a whole is wide at the top and narrow at the bottom, so that the light-emitting functional layer in the light-emitting device 160 is blocked by the partition part 173 in the isolation structure 170 during the evaporation process and is disconnected from other parts formed on the partition part 173, so that the orthographic projection of the light-emitting functional layer in the light-emitting device 160 on the substrate 300 is located outside the orthographic projection of the support part 172 on the substrate 300, and the light-emitting functional layer is prevented from overlapping with the support part 172 in the isolation structure 170. The light-emitting functional layer in the light-emitting device 160 may include at least one of a hole injection layer, a hole transport layer, an electron blocking layer, an electron injection layer, an electron transport layer, and a hole blocking layer.

[0150] Optional, Figure 7 This is an enlarged view of the isolation structure, refer to Figure 6 and Figure 7 In the second direction X, at the position where the support portion 172 and the partition portion 173 meet, the size of the support portion 172 (represented as the first size d1) is smaller than the size of the partition portion 173 (represented as the second size d2).

[0151] Specifically, in the direction of the isolation openings 171 on both sides of the isolation structure 170, at the position where the support portion 172 and the partition portion 173 meet, the size of the support portion 172 is smaller than the size of the partition portion 173, so that an undercut structure is formed on the side of the isolation structure 170, and then when the light-emitting layer 162 of the light-emitting device 160 in the display panel is evaporated, the light-emitting layer 162 of the adjacent light-emitting device 160 can be cut off at the position of the isolation structure 170. It should be noted that in this embodiment, the shape of the isolation structure 170 is not limited to 6 and Figure 7 The shape shown can also block the light emitting layer 162 of the light emitting device 160 , and the size of the supporting portion 172 is smaller than the size of the blocking portion 173 at the position where the supporting portion 172 and the blocking portion 173 meet.

[0152] Optionally, the isolation structure also includes an auxiliary supporting portion, which is located between the supporting portion and the pixel defining layer, and the orthographic projection of the supporting portion on the substrate is located within the orthographic projection of the auxiliary supporting portion on the substrate. This arrangement can increase the height of the isolation structure.

[0153] Optionally, the second electrode of the light-emitting device on at least one side of the isolation structure is overlapped with the auxiliary support portion, wherein the auxiliary support portion is conductive.

[0154] Optional, continue to refer to Figure 6The display panel provided in this embodiment further includes a second encapsulation area and an encapsulation layer 190. In the second encapsulation area, the encapsulation layer 190 includes a first inorganic encapsulation layer 191, an organic encapsulation layer 192, and a second inorganic encapsulation layer 193 stacked in layers. In at least a portion of the first encapsulation area FA, the encapsulation layer 190 includes a second inorganic encapsulation layer 193, and the second inorganic encapsulation layer 193 serves as an insulating layer 200 to cover the signal trace 100. The second encapsulation area includes the display area AA.

[0155] Specifically, in a display panel including an isolation structure 170, devices of different light-emitting colors are evaporated and packaged independently. Exemplarily, after the pixel defining layer 180 and the isolation structure 170 are prepared, the light-emitting layer 162, the second electrode 163 and the first inorganic encapsulation layer 191 of the light-emitting device 160 of the first light-emitting color are firstly evaporated in all pixel openings 181, and then the light-emitting layer 162 and the second electrode 163 in the first pixel opening 181 corresponding to the light-emitting device 160 of the first light-emitting color are retained, and the first inorganic encapsulation layer 191 on the second electrode 163 of the light-emitting device 160 of the first light-emitting color and the first inorganic encapsulation layer 191 on the isolation structure 170 around the second electrode 163 of the light-emitting device 160 of the first light-emitting color are retained, and the light-emitting layer 162, the second electrode 163 and the first inorganic encapsulation layer 191 at the corresponding positions at other pixel openings 181 and the isolation structure 170 are removed. Then, the light-emitting layer 162, the second electrode 163 and the first inorganic encapsulation layer 191 of the light-emitting device 160 of the second light-emitting color are patterned in the same manner, and only the light-emitting layer 162 and the second electrode 163 in the second pixel opening 181 corresponding to the light-emitting device 160 of the second light-emitting color are retained, and the first inorganic encapsulation layer 191 on the second electrode 163 of the light-emitting device 160 of the second light-emitting color and the first inorganic encapsulation layer 191 on the isolation structure 170 around the second electrode 163 of the light-emitting device 160 of the second light-emitting color are retained. In the case where the display panel also includes light-emitting devices 160 of other light-emitting colors, the above preparation method can also be used for preparation. Therefore, the first inorganic encapsulation layer 191 in the first encapsulation area FA will be removed, and due to the blocking effect of the dam 310 in the display panel on the organic encapsulation layer 192 in the encapsulation layer 190, at least part of the first encapsulation area FA does not include the organic encapsulation layer 192, but only includes the second inorganic encapsulation layer 193.

[0156] In this embodiment, the positional relationship of the structural part in the signal wiring 100 on the side in the first packaging area FA is one of the positional relationships described in any of the above embodiments. Even if the packaging layer 190 of the first packaging area FA only includes the second inorganic packaging layer 193, it can also fit well with the signal wiring 100, that is, in the first packaging area FA, there will be no gap between the second inorganic packaging layer 193 and the side of the signal wiring 100, and there will be no invasion path for water and oxygen, thereby improving the packaging performance of the display panel.

[0157] Optional, Figure 8 is a schematic diagram of the structure of another display panel provided by an embodiment of the present invention, referring to Figure 8 The second electrodes 163 of the light-emitting devices are electrically connected to each other to form a whole surface structure. This arrangement allows the second electrodes 163 of all light-emitting devices in the display panel to be formed by one-time evaporation or sputtering, and the preparation method is simple. The signal line 100 can be electrically connected to the second electrode 163. When the signal line 100 and the second electrode 163 are in different layers, the signal line 100 can be electrically connected to the second electrode 163 through a via.

[0158] Optionally, the signal wiring 100 is located in a conductive layer in the display panel, and in the display area, the conductive layer where the signal wiring 100 is located is located between the light-emitting device and the substrate 300 .

[0159] Specifically, a plurality of conductive layers are included between the light-emitting device and the substrate 300, and the signal wiring 100 is located in the conductive layer between the light-emitting device and the substrate 300, and can be prepared simultaneously with the component structure of the pixel circuit or the signal line in the display area AA, thereby simplifying the preparation process. In addition, the conductive layer between the light-emitting device and the substrate 300 includes a metal layer, and the conductive layer between the light-emitting device and the substrate 300 has a smaller resistance than the material of the first electrode 161 and the second electrode 163 of the light-emitting device. Therefore, setting the signal wiring 100 in the conductive layer between the light-emitting device and the substrate 300 can make the signal wiring 100 have a smaller resistance, so that the voltage drop of the signal wiring 100 transmitting the electrical signal is smaller, which is conducive to improving the display effect.

[0160] It should be noted that Figure 8 Only the insulating layer 200 is shown in the non-display area NAA. Figure 8 It can be seen from the figure that part of the signal routing segments in the first packaging area FA is in direct contact with the insulating layer 200, and part of the signal routing segments and the insulating layer 200 include other film layers (which may be the first organic portion 330).

[0161] Optional, continue to refer to Figure 2The display panel includes a plurality of conductive layers stacked together; the signal routing 100 includes a first signal sub-routing 140 and a second signal sub-routing 150, and the first signal sub-routing 140 and the second signal sub-routing 150 are located in the same conductive layer; the first signal sub-routing 140 and the second signal sub-routing 150 transmit different signals, and a break is formed between the first signal sub-routing 140 and the second signal sub-routing 150.

[0162] Specifically, the first signal sub-route 140 and the second signal sub-route 150 can be manufactured at the same time. The first signal sub-route 140 in this embodiment can be the first power line in the above embodiment.

[0163] Optional, continue to refer to Figure 2 , the first signal sub-route 140 at least partially surrounds the display area AA; the second signal sub-route 150 is located between the first end of the first signal sub-route 140 and the second end of the first signal sub-route 140; in the first packaging area FA, the structural portion close to the substrate in the first signal sub-route 140 is on the side close to the fracture, and the structural portion protruding away from the substrate is on the side close to the fracture; in the first packaging area, the structural portion close to the substrate in the second signal sub-route 150 is on the side close to the fracture, and the structural portion protruding away from the substrate is on the side close to the fracture.

[0164] Specifically, the first signal sub-route 140 is adjacent to the fracture on the side of the first packaging area FA, and the second signal sub-route 150 is adjacent to the fracture on the side of the first packaging area FA. They are arranged near the fracture, and the structural portion of the first signal sub-route 140 close to the substrate protrudes from the side of the structural portion away from the substrate, and the structural portion of the second signal sub-route 150 close to the substrate protrudes from the side of the structural portion away from the substrate. This allows for no gap between the insulating layer and the side of the first signal sub-route in the first packaging area FA and the side of the second signal sub-route 150 in the first packaging area FA, thereby ensuring the display effect of the display panel.

[0165] Optional, Fig. 9 is a schematic diagram of a pixel circuit according to an embodiment of the present invention, with reference to Fig. 9 The display panel also includes a pixel circuit; the signal line 100 is electrically connected to the pixel circuit.

[0166] Specifically, the pixel circuit provided in this embodiment may be a 7T1C circuit, which includes seven transistors and one storage capacitor.

[0167] Optional, continue to refer to Fig. 9 The signal line 100 includes a second power line VDD, the pixel circuit includes a driving module 210, and the driving current generated by the driving module 210 is related to the power voltage transmitted by the second power line VDD.

[0168] The driving module 210 is connected in series between the second power line VDD and the light-emitting device. The driving module 210 can generate a driving current according to the data voltage written by the data writing module and the power voltage transmitted by the second power line VDD, and output the driving current to the light-emitting device to drive the light-emitting device. The second power line VDD in this embodiment can be the second signal sub-routing in the above embodiment.

[0169] Optional, continue to refer to Fig. 9 The signal line 100 includes a third power line Vref; the pixel circuit includes an initialization module, the initialization module is used to initialize the control end or the light-emitting device of the driving module 210, and the third power line Vref is used to transmit the initialization voltage.

[0170] Optional, continue to refer to Fig. 9 The initialization module includes a first initialization unit 221 and / or a second initialization unit 222. The first initialization unit 221 is electrically connected to the control end of the driving module 210 and is used to initialize the control end of the driving module 210; the second initialization unit 222 is electrically connected to the light-emitting device and is used to initialize the light-emitting device.

[0171] Optionally, the signal wiring includes a first power line, and the first power line is electrically connected to an electrode of the light-emitting device.

[0172] Specifically, the first power line may be electrically connected to the second electrode of the light emitting device.

[0173] Optional, continue to refer to Figure 6 The first packaging area FA also includes a dam 310; the dam 310 is arranged on one side of the substrate 300 and is arranged around the display area AA, and the side of the dam 310 close to the display area AA and / or away from the display area AA includes a groove 320; the dam 310 and the groove 320 are arranged in the first packaging area FA; the signal line 100 and the dam 310 are arranged on the same side of the substrate 300.

[0174] Specifically, during the formation of the dam 310 , at least a portion of the film layer structure in a portion of the first packaging area FA needs to be patterned to form a groove 320 . The groove 320 and the dam 310 form a concave-convex structure, which can extend the water and oxygen intrusion path.

[0175] Optional, Fig.10 is a schematic structural diagram of another display panel provided according to an embodiment of the present invention, Fig.11 FIG. 1 is a schematic diagram of a top view of a portion of a first packaging area in a display panel provided in an embodiment of the present invention, with reference to FIG. Fig.10 and Fig.11The signal routing 100 includes a first signal routing segment 104 and a second signal routing segment 105 (not shown), the first signal routing segment 104 is located on a side of the dam 310 away from the substrate 300, and the second signal routing segment 105 is located on a side of the groove 320 away from the substrate 300; in the second signal routing segment 105, among adjacent structural portions, along the second direction X, the orthographic projection of the structural portion close to the substrate 300 on the substrate 300 covers the orthographic projection of the structural portion away from the substrate 300 on the substrate 300.

[0176] Specifically, the first signal routing segment 104 and the insulating layer 200 include other insulating film layers (which may be the first organic portion 330), and the first signal routing segment 104 is not in direct contact with the insulating layer 200. The second signal routing segment 105 is located in the groove 320 and is in direct contact with the insulating layer 200. Therefore, the positional relationship of each structural portion in the second signal routing segment 105 can ensure that the side of the second signal routing segment 105 is in full contact with the insulating layer 200 without a gap, thereby improving the packaging reliability of the display panel. Optionally, continue to refer to Fig.10 and Fig.11 In the first signal routing segment 104, among the adjacent structural parts, along the second direction X, the orthographic projection of the structural part close to the substrate 300 on the substrate 300 covers the orthographic projection of the structural part far from the substrate 300 on the substrate 300. This arrangement can make the film layer covering the first signal routing segment 104 completely contact with the side surface of the first signal routing segment 104, further improving the packaging reliability of the display panel.

[0177] Optional, continue to refer to Fig.10 In the first packaging area FA, the signal trace 100 is located on a side of the dam 310 away from the substrate 300 and in the groove 320 .

[0178] Specifically, the display panel includes multiple conductive layers, some of which are formed before the dam 310 and the groove 320 are formed and are relatively located at the bottom; other conductive layers are formed after the dam 310 and the groove 320 are formed and are relatively located at the top. In this embodiment, the signal wiring 100 in the first packaging area is located on the side of the dam 310 away from the substrate 300 and in the groove 320. Accordingly, the signal wiring 100 is formed after the dam 310 and the groove 320 are formed. In this way, in the process of patterning and removing some film layer structures during the formation of the groove 320, the signal wiring 100 will not be over-etched, thereby ensuring the continuity and thickness uniformity of the signal wiring 100.

[0179] Optional, continue to refer to Fig.10 , the insulating layer 200 is an inorganic layer; on the side of the dam 310 away from the substrate 300, the display panel further includes a first organic portion 330, and the first organic portion 330 is on the side of the encapsulation layer in the display panel close to the substrate 300.

[0180] Specifically, a groove 320 needs to be formed in the first encapsulation area FA. Since the thickness of the organic layer is usually thicker than that of the inorganic layer, the organic layer needs to be removed at the position corresponding to the groove 320. Accordingly, in the first encapsulation area FA, the insulating layer 200 is an inorganic layer, so that the depth of the groove 320 occupied by the insulating layer 200 in the groove 320 is small. On the side of the dam 310 away from the substrate 110, the first organic part 310 is included, so that the first organic part 330 serves as a supplementary structure of the dam 310. The sum of the heights of the first organic part 330 and the dam 310 is greater than the height of the dam 310, so that the overall structure of the first organic part 330 and the dam 310 and the groove 320 form a concave-convex structure with a greater height difference, which is conducive to further extending the invasion path of water and oxygen.

[0181] Optional, continue to refer to Fig.10 The first organic portion 330 is located in the first organic layer, and the first organic layer further includes a second organic portion 340 located in the display area AA. The second organic portion 340 contacts the first electrode 161 of the light-emitting device 160 in the display area AA and is located on a side of the first electrode 161 close to the substrate 300.

[0182] The first organic layer may be a planarization layer in the display panel (eg Fig.10 The first planarization layer 301 in the display panel is used, and the portion of the planarization layer in the first encapsulation area FA is used as the first organic part 330, which can be prepared simultaneously with the structure of the planarization layer in the display area AA, thereby simplifying the display panel preparation process.

[0183] Optional, continue to refer to Fig.10 The dam 310 includes a third organic portion 350 . The third organic portion 350 is located in the second organic layer 302 . The second organic layer 302 is located on a side of the first organic layer close to the substrate 300 .

[0184] The display panel may include at least one second organic layer 302. Fig.10 FIG. 2 schematically shows a case where the display panel includes two second organic layers 302. The second organic layer 302 may also be a planarization layer (eg, Fig.10 The second planarization layer 303 and the third planarization layer 304 are formed in the display panel, and the planarization layer in the first encapsulation area FA is used as the dam 310, which can be prepared simultaneously with the structure of the planarization layer in the display area AA, thereby simplifying the display panel preparation process.

[0185] Optional, continue to refer to Fig.10The display panel further includes a pixel defining layer 180. In the non-display area NAA, the pixel defining layer 180 is located on the side of the dam 310 away from the substrate 300 and between the signal trace 100 and the insulating layer 200. In this way, it is not necessary to separately form other film layers on the side of the dam 310 away from the substrate 300 to increase the height of the dam 310, thereby simplifying the display panel manufacturing process.

[0186] Optional, continue to refer to Fig.10 In the groove 320 , the signal trace 100 contacts the insulating layer 200 on the side of the signal trace 100 away from the substrate 300 , and the side surface of the signal trace 100 in the groove 320 may completely contact the insulating layer 200 .

[0187] Optional, continue to refer to Fig.10 The second power line 1311 is located in the conductive layer of the light emitting device 160 close to the substrate 300 , and the second power line 1311 may be electrically connected to the first electrode 161 of the light emitting device 160 .

[0188] Specifically, the second power line 1311 may be Fig.10 The second adapter portion 152 in.

[0189] Fig.12 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present invention, with reference to Fig.12 , the display panel includes a display area and a first packaging area, and the first packaging area surrounds the display area;

[0190] The method for manufacturing a display panel comprises the following steps:

[0191] S110 , providing a substrate.

[0192] S120. Form a signal routing on one side of the substrate; wherein the signal routing passes through the first packaging area along a first direction, and the signal routing is divided into at least two signal routing segments along the first direction; the signal routing includes at least two structural parts stacked along the thickness direction of the display panel; in the adjacent structural parts corresponding to at least one signal routing segment in the first packaging area, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate; the second direction intersects with the first direction.

[0193] S130, forming an insulating layer on a side of the signal wiring away from the substrate.

[0194] The present embodiment provides a method for manufacturing a display panel, wherein part of the side edges of the signal routing in the display panel manufactured by the manufacturing method are located in the first packaging area. The signal routing includes at least two structural parts stacked along the thickness direction of the display panel. Along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate. Such an arrangement can avoid the side of the structural part far from the substrate protruding in the same direction from the outermost side of the structural part close to the substrate, thereby avoiding a gap between the insulating layer and the side of the signal routing in the first packaging area, ensuring that the insulating layer covers the side of the signal routing in the first packaging area, so that there is no gap between the insulating layer and the side of the signal routing in the first packaging area, thereby preventing water and oxygen from entering the display area through the first packaging area, improving the packaging effect of the display panel, and ensuring the reliability of the display panel.

[0195] Optionally, the display panel further includes a non-display area, and the non-display area includes a first encapsulation area;

[0196] The steps of forming a signal trace on one side of the substrate include:

[0197] S121. Provide a display transition film layer, wherein the display transition film layer includes a substrate, a signal routing layer and a pixel defining transition layer stacked in sequence; the signal routing layer passes through a first packaging area along a first direction, and the signal routing layer includes at least two structural layer stacked along a thickness direction of the display panel.

[0198] Specifically, the side surfaces of each structural portion layer in the signal routing layer may be connected.

[0199] S122, performing a patterning process on the pixel definition transition layer in the non-display area, and removing at least a portion of the pixel definition transition layer located on one side of the signal wiring layer in the first packaging area.

[0200] Specifically, refer to Fig.13 , Fig.13 This is a schematic diagram of the signal routing layer 400 after removing the pixel defining transition layer on one side of the signal routing layer in the first packaging area. Before forming the pixel defining layer, the pixel defining transition layer needs to be etched and developed, resulting in a large side engraving of the signal routing layer 400.

[0201] Optionally, dams and grooves are provided in the first packaging area, and the pixel-defining transition layer in the non-display area is patterned, and the pixel-defining transition layer on the side of the signal wiring layer at the position of the groove in the first packaging area is removed, thereby facilitating the etching of the side of the signal wiring layer in subsequent steps.

[0202] S123, forming an isolation layer on a side of the pixel defining transition layer away from the substrate.

[0203] Specifically, the isolation layer includes a support layer and a partition layer which are stacked.

[0204] S124, performing graphic processing on the isolation layer to form an isolation structure.

[0205] Specifically, by patterning the isolation layer, the support layer is patterned to form a support portion of the isolation structure, and the partition layer is patterned to form a partition portion of the isolation structure.

[0206] Optionally, patterning the isolation layer to form the isolation structure includes: patterning the isolation layer in the display area to form the isolation structure, and removing at least a portion of the isolation layer in the non-display area. In some optional embodiments, while patterning the isolation layer in the display area to form the isolation structure, the isolation layer on the signal routing layer in the non-display area can be removed.

[0207] S125. Graphically process the pixel defining transition layer of the display area to form a pixel defining layer including a plurality of pixel openings, and etch the side of the signal routing layer to form a structure in which, in adjacent structural parts in the first packaging area, the orthographic projection of the structural part close to the substrate on the substrate along the second direction covers the orthographic projection of the structural part far from the substrate on the substrate.

[0208] Specifically, after S123, the material of the pixel defining transition layer at the position of the signal wiring layer is removed, and in this step, the side of the signal wiring layer can be etched at the same time to form Fig.14 The structure on the side of the signal routing layer is shown. Fig.14 For Fig.13 Schematic diagram of the structure of the signal routing layer 400 after the side of the signal routing layer is etched.

[0209] Optionally, while the pixel-defining transition layer of the display area is being patterned, the side of the signal routing layer is etched to form a structure in which, in adjacent structural parts in the first packaging area, the orthographic projection of the structural part close to the substrate on the substrate along the second direction covers the orthographic projection of the structural part far from the substrate on the substrate.

[0210] Specifically, when the pixel defining transition layer and the signal wiring layer are provided in the same layer, the pixel defining layer and the signal wiring can be formed simultaneously, so as to reduce the manufacturing process steps of the display panel and improve the manufacturing efficiency of the display panel.

[0211] Optionally, before etching the side of the signal routing layer, the method includes: coating photoresist on a side of the signal routing layer away from the substrate in the first packaging area and developing the photoresist so that the developed photoresist forms a photolithography opening, wherein the photolithography opening exposes the side of each structural layer in the signal routing layer, and exposes a surface area of ​​a set structural layer that is a set distance away from the side of the set structural layer, and the set structural layer is the structural layer farthest from the substrate.

[0212] Specifically, Fig.15 It is a schematic diagram of the structure after coating the photoresist PR and developing. The exposed part of the photoresist PR after the development sets the structural part layer. Fig.15 The photoresist PR applied is Fig.13 The distance length d3 can be set according to actual needs.

[0213] An embodiment of the present invention further provides a display device, Fig.16 is a schematic diagram of a display device provided by an embodiment of the present invention, with reference to Fig.16 The display device 10 includes the display panel 400 of any of the above embodiments of the present invention, and has the beneficial effects of the display panel 400 of any of the above embodiments of the present invention, which will not be described in detail herein.

[0214] Specifically, the display device 10 provided in this embodiment can be a device with a display function, such as a mobile phone, a computer, a smart watch, or a tablet computer.

[0215] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0216] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display panel, characterized in that: include: A display area and a first packaging area, wherein the first packaging area surrounds the display area; The display panel further includes: substrate; A signal routing line is located on one side of the substrate; wherein the signal routing line passes through the first packaging area along a first direction, and the signal routing line is divided into at least two signal routing segments along the first direction; the signal routing line comprises at least two structural parts stacked along the thickness direction of the display panel; in the adjacent structural parts corresponding to at least one of the signal routing segments in the first packaging area, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate; the second direction intersects with the first direction; The insulating layer is located on a side of the signal wiring away from the substrate.

2. The display panel according to claim 1, characterized in that: The signal routing line comprises a first structure portion, a second structure portion and a third structure portion which are stacked in sequence; The first structure portion is located between the second structure portion and the substrate; In at least one of the signal routing segments, along the second direction, a side surface of the first structure portion in the first packaging area protrudes beyond a side surface of the second structure portion in the first packaging area and in the same direction; Preferably, the side surface of the second structure part in the first packaging area protrudes from the side surface of the third structure part in the first packaging area and in the same direction, or the side surface of the second structure part in the first packaging area is in the same plane as the side surface of the third structure part in the first packaging area; Preferably, the material of the first structural part is the same as the material of the third structural part; Preferably, the material of the first structure part includes titanium; the material of the second structure part includes aluminum; and the material of the third structure part includes titanium.

3. The display panel according to claim 2, characterized in that: In at least one of the signal routing segments, the second structure portion includes a first step portion and a second step portion, the second step portion is located on a side of the first step portion away from the substrate, and along the second direction, a side of the first step portion in the first packaging area protrudes beyond a side of the second step portion in the first packaging area and in the same direction; the third structure portion is located on a side of the second step portion away from the first structure portion; Preferably, in at least one of the signal routing segments, in the second direction, a side surface of the first step portion in the first packaging area protrudes beyond a side surface of the third structure portion in the first packaging area and in the same direction; Preferably, in at least one of the signal routing segments, in the second direction, the side surface of the third structure portion in the first packaging area is connected to the side surface of the second step portion in the first packaging area; Preferably, in the second direction, the side surface of the third structure portion in the first packaging area protrudes beyond the side surface of the second step portion in the first packaging area and in the same direction, and the distance between the side surface of the second step portion in the first packaging area and the third structure portion and the side surface of the third structure portion in the first packaging area and in the same direction is less than or equal to a set distance value; Preferably, the set distance value is less than or equal to 0.5 μm; Preferably, the first step portion and the second step portion are an integral structure.

4. The display panel according to claim 1, characterized in that: The signal line includes a first power line; the display panel also includes a plurality of light-emitting devices, the light-emitting devices include a first electrode, a light-emitting layer, and a second electrode that are stacked; the first power line is electrically connected to the second electrode of at least part of the light-emitting devices; Preferably, the first power line includes a first power sub-line, a second power sub-line and a third power sub-line; the first power sub-line, the second power sub-line and the third power sub-line all extend from the display area through the first packaging area; The first power sub-line at least partially surrounds the display area; the second power sub-line is electrically connected to a first end of the first power sub-line, and the third power sub-line is electrically connected to a second end of the first power sub-line; In the first packaging area, among the adjacent structural parts in the second power sub-line, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate; In the first packaging area, among the adjacent structural parts in the third power sub-line, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate; Preferably, the second power sub-line and the third power sub-line are electrically connected to the second electrode.

5. The display panel according to claim 4, characterized in that: The display panel further comprises an isolation structure located in the display area, the isolation structure encloses an isolation opening, and the light-emitting layer is located in the isolation opening; the isolation structure overlaps with at least part of the second electrode of the light-emitting device; The first power line is electrically connected to the isolation structure; Preferably, the isolation structure further includes a first connection portion and a second connection portion, the first connection portion is located on a side of the second power sub-line close to the display area, and the second connection portion is located on a side of the third power sub-line close to the display area; the second power sub-line is electrically connected to the first connection portion, and the third power sub-line is electrically connected to the second connection portion; Preferably, the first power line and the isolation structure are an integrated structure; Preferably, the first power line and the isolation structure are made of the same material; Preferably, the first power line is located in a conductive layer on a side of the light emitting device close to the substrate.

6. The display panel according to claim 5, characterized in that: The display panel further includes a pixel defining layer, the pixel defining layer is located between the substrate and the isolation structure, the pixel defining layer includes a plurality of pixel openings, and the first electrode is at least partially exposed in the pixel openings; The orthographic projection of the isolation structure on the pixel defining layer is located between adjacent pixel openings; The isolation structure comprises a supporting portion and a partitioning portion, wherein the supporting portion is located between the partitioning portion and the pixel defining layer; the orthographic projection of the partitioning portion on the pixel defining layer covers the orthographic projection of the supporting portion on the pixel defining layer; the second electrode of the light emitting device on at least one side of the isolation structure overlaps with the isolation structure; Preferably, the second electrode of the light-emitting device on at least one side of the isolation structure overlaps with a support portion of the isolation structure, and the support portion is conductive; Preferably, in the second direction, at a position where the support portion and the partition portion meet, a size of the support portion is smaller than a size of the partition portion; Preferably, the isolation structure further comprises an auxiliary support portion, wherein the auxiliary support portion is located between the support portion and the pixel defining layer, and an orthographic projection of the support portion on the substrate is located within an orthographic projection of the auxiliary support portion on the substrate; Preferably, the second electrode of the light-emitting device on at least one side of the isolation structure overlaps the auxiliary supporting portion.

7. The display panel according to claim 1, characterized in that: It also includes a second encapsulation area and an encapsulation layer, wherein in the second encapsulation area, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are stacked; In at least a part of the first packaging area, the packaging layer includes the second inorganic packaging layer, and the second inorganic packaging layer serves as the insulating layer to cover the signal trace; Preferably, the second packaging area includes a display area.

8. The display panel according to claim 4, characterized in that: The second electrodes of the light-emitting devices are electrically connected to each other to form a whole-surface structure; Preferably, the signal wiring is located in a conductive layer in the display panel, and in the display area, the conductive layer where the signal wiring is located is located between the light-emitting device and the substrate.

9. The display panel according to claim 1, characterized in that: The display panel includes a plurality of conductive layers stacked in layers; the signal routing includes a first signal sub-routing and a second signal sub-routing, and the first signal sub-routing and the second signal sub-routing are located in the same conductive layer; Preferably, a break is formed between the first signal sub-route and the second signal sub-route; Preferably, the first signal sub-route at least partially surrounds the display area; the second signal sub-route is located between the first end of the first signal sub-route and the second end of the first signal sub-route; In the first packaging area, the structure portion of the first signal sub-line close to the substrate is on a side close to the break, and protrudes from the side of the structure portion away from the substrate close to the break; In the first packaging area, the structural portion of the second signal sub-route close to the substrate is located on a side close to the break, and protrudes from the side of the structural portion away from the substrate close to the break.

10. The display panel according to claim 1 or 9, characterized in that: The display panel further includes a pixel circuit; the signal line is electrically connected to the pixel circuit; Preferably, the signal wiring includes a second power line, the pixel circuit includes a driving module, and the driving current generated by the driving module is related to the power voltage transmitted by the second power line; Preferably, the signal wiring includes a third power line; the pixel circuit includes an initialization module, the initialization module is used to initialize the control end or the light-emitting device of the driving module, and the third power line is used to transmit an initialization voltage; Preferably, the signal wiring includes a first power line, and the first power line is electrically connected to an electrode of the light-emitting device.

11. The display panel according to claim 1, characterized in that: The first encapsulation region includes a dam; The dam is arranged on one side of the substrate and surrounds the display area, and a side of the dam close to the display area and / or away from the display area comprises a groove; the dam and the groove are arranged in the first packaging area; The signal trace and the dam are arranged on the same side of the substrate; Preferably, the signal routing includes a first signal routing segment and a second signal routing segment, the first signal routing segment is located on a side of the dam away from the substrate, and the second signal routing segment is located on a side of the groove away from the substrate; in the second signal routing segment, among the adjacent structural parts, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part away from the substrate on the substrate; Preferably, in the first signal routing segment, among the adjacent structural parts, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate; Preferably, in the first packaging area, the signal wiring is located on a side of the dam away from the substrate and in the groove.

12. The display panel according to claim 11, characterized in that: The insulating layer is an inorganic layer; a first organic part is also included on a side of the dam away from the substrate, and the first organic part is on a side of the encapsulation layer in the display panel close to the substrate; Preferably, the first organic part is located in a first organic layer, the first organic layer further comprises a second organic part located in the display area, the second organic part is in contact with the first electrode of the light emitting device in the display area, and is located on a side of the first electrode close to the substrate; Preferably, the dam comprises a third organic portion, the third organic portion is located in the second organic layer, and the second organic layer is located on a side of the first organic layer close to the substrate; Preferably, the display panel further comprises a pixel defining layer, and in the non-display area, the pixel defining layer is located on a side of the dam away from the substrate and between the signal wiring and the insulating layer; Preferably, in the groove, the signal wiring contacts the insulating layer on a side of the signal wiring away from the substrate.

13. A method for manufacturing a display panel, characterized in that: The display panel comprises a display area and a first encapsulation area, wherein the first encapsulation area surrounds the display area; The manufacturing method of the display panel includes: providing a substrate; A signal routing is formed on one side of the substrate; wherein the signal routing passes through the first packaging area along a first direction, and the signal routing is divided into at least two signal routing segments along the first direction; the signal routing includes at least two structural parts stacked along the thickness direction of the display panel; in the adjacent structural parts corresponding to at least one of the signal routing segments in the first packaging area, along the second direction, the orthographic projection of the structural part close to the substrate on the substrate covers the orthographic projection of the structural part far from the substrate on the substrate; the second direction intersects with the first direction; An insulating layer is formed on a side of the signal wiring away from the substrate.

14. The manufacturing method according to claim 13, characterized in that: The display panel further includes a non-display area, and the non-display area includes the first packaging area; and forming a signal wiring on one side of the substrate specifically includes: A display transition film layer is provided, wherein the display transition film layer comprises the substrate, the signal routing layer and the pixel definition transition layer which are sequentially stacked; the signal routing layer passes through the first packaging area along the first direction, and the signal routing layer comprises at least two structural part layers which are stacked along the thickness direction of the display panel; Performing a patterning process on the pixel definition transition layer in the non-display area, and removing at least a portion of the pixel definition transition layer located on one side of the signal wiring layer in the first packaging area; forming an isolation layer on a side of the pixel defining transition layer away from the substrate; Performing a patterning process on the isolation layer to form an isolation structure; The pixel defining transition layer of the display area is patterned to form a pixel defining layer including a plurality of pixel openings, and the side of the signal routing layer is etched to form a structure in which, in the adjacent structural parts in the first packaging area, the orthographic projection of the structural part close to the substrate on the substrate along the second direction covers the orthographic projection of the structural part far from the substrate on the substrate; Preferably, a dam and a groove are provided in the first packaging area, and the pixel defining transition layer in the non-display area is patterned, and the pixel defining transition layer located on one side of the signal wiring layer at the position of the groove in the first packaging area is removed; Preferably, the step of patterning the isolation layer to form an isolation structure comprises: Patterning the isolation layer in the display area to form an isolation structure, and removing at least a portion of the isolation layer in the non-display area; Preferably, while the pixel-defining transition layer of the display area is being patterned, the side of the signal routing layer is etched to form a structure in which, in the adjacent structural parts in the first packaging area, the orthographic projection of the structural part close to the substrate on the substrate along the second direction covers the orthographic projection of the structural part far from the substrate on the substrate.

15. The manufacturing method according to claim 14, characterized in that: Before etching the side surface of the signal wiring layer, the method includes: In the first packaging area, a side of the signal routing layer away from the substrate is coated with photoresist and developed so that the developed photoresist forms a photolithography opening, wherein the photolithography opening exposes the side surfaces of each structural layer in the signal routing layer, and exposes a surface area of ​​a set structural layer that is a set distance away from the side surfaces of the set structural layer, and the set structural layer is the structural layer farthest from the substrate.

16. A display device, characterized in that: A display panel comprising any one of claims 1 to 12.

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