Display panel, manufacturing method thereof, mother board and display device

Abstract

The invention provides a display panel and a manufacturing method thereof, a mother board and a display device, and relates to the technical field of display, and the display panel provided by the invention comprises a substrate, a first wire and a packaging structure. The frame area of the substrate at least partially surrounds the display area, the frame area comprises a main frame area and a first cutting area, and at least part of array wires of the substrate are located in the display area; the first wires are arranged on the substrate and connected with the array wires, and at least part of the first wires are located in the main frame area; the packaging structure is located on the side, away from the substrate, of the first wire, and the orthographic projection of the packaging structure on the substrate covers the orthographic projection of the first wire on the substrate. The orthographic projection of the packaging structure located in the first cutting area on the substrate has a first boundary far away from the display area, the orthographic projection of the first wire on the substrate has a second boundary far away from the display area, and the first boundary is located on the side, far away from the display area, of the second boundary. Therefore, the display panel provided by the invention is beneficial to improving the use performance of the display device.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, relates to a display panel and a manufacturing method thereof, a motherboard and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin-film electroluminescent device. It has the advantages of good display effect, good heat dissipation, low cost and small thickness. It is widely used in electronic products such as mobile phones, televisions, tablets, laptops, desktop computers, car display terminals, wearable devices, human-computer interaction terminal equipment, etc.

[0003] However, the performance and process performance of the display device need to be further improved. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a display panel and a manufacturing method thereof, a motherboard and a display device, so as to improve the use performance / process performance of the display device.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] In a first aspect, a display panel is provided, comprising a substrate, a first routing line and a packaging structure. The substrate comprises a display area and a frame area, the frame area at least partially surrounds the display area, the frame area comprises a main frame area close to the display area and a first cutting area away from the display area, the substrate comprises an array routing line, at least part of the array routing line is located in the display area; the first routing line is arranged on the substrate and connected to the array routing line, at least part of the first routing line is located in the main frame area; the packaging structure is located on the side of the first routing line away from the substrate, and the orthographic projection of the packaging structure on the substrate covers the orthographic projection of the first routing line on the substrate. Among them, at least part of the packaging structure is located in the first cutting area, the orthographic projection of the packaging structure located in the first cutting area on the substrate has a first boundary away from the display area, the orthographic projection of the first routing line on the substrate has a second boundary away from the display area, and the first boundary is located on the side of the second boundary away from the display area.

[0007] Through the above technical solution, at least part of the first wiring is located in the main frame area, and the packaging structure can cover the first wiring to avoid wiring exposure. In this way, the display panel provided by the present application can avoid first wiring exposure, which is conducive to improving reliability and thus improving performance.

[0008] Therefore, the display panel provided in the present application is helpful to improve the performance of the display device.

[0009] In some embodiments, the package structure includes a first package structure and a second package structure, and the first package structure and the second package structure are connected.

[0010] Optionally, the first packaging structure covers a surface of the first wiring facing away from the substrate and two first side surfaces that are oppositely arranged along an extension direction perpendicular to the first wiring.

[0011] Optionally, the second packaging structure covers a second side surface of the first wiring away from the display area.

[0012] Optionally, the second packaging structure covers the first cutting area.

[0013] Optionally, the array routing includes a plurality of sub-routings arranged in layers, and the first routing is arranged in the same layer as one of the sub-routings.

[0014] Optionally, an angle between the second side surface of the array wiring away from the display area and the substrate is less than 90 degrees.

[0015] Optionally, along the thickness direction of the substrate, a surface of the first packaging structure facing away from the substrate is higher than a surface of the second packaging structure facing away from the substrate.

[0016] In this way, the first packaging structure and the second packaging structure jointly cover the first wiring, thereby preventing the first wiring from being exposed.

[0017] Optionally, the display panel provided in the present application also includes an isolation structure and a light-emitting unit, the isolation structure is located on the side of the array routing facing away from the substrate, and the isolation structure is located on the side of the second packaging structure facing the substrate, the isolation structure is located in the display area, the isolation structure defines an isolation opening, and the light-emitting unit is arranged in the isolation opening; the second packaging structure is located on the side of the light-emitting unit facing away from the substrate and covers the light-emitting unit.

[0018] In this way, the display panel provided in the present application can use the second packaging structure to cover the light-emitting unit and the isolation structure, and can also use the second packaging structure to cover the hollow area, which is helpful in saving process flow and thus helps to improve the process performance of the display device.

[0019] In a second aspect, the present application provides a display panel, including a substrate, array wiring, wiring, and a packaging structure. The substrate includes a display area and a frame area, the frame area at least partially surrounds the display area, the frame area includes a main frame area close to the display area and a first cutting area away from the display area, the substrate includes array wiring, at least part of the array wiring is located in the display area; the first wiring is arranged on the substrate; the first packaging structure is located on the side of the first wiring away from the substrate, and covers at least part of the first wiring; the second packaging structure is connected to the first packaging structure and covers the first cutting area. Among them, one end of the first wiring is connected to the array wiring, and the other end of the first wiring is spaced apart from the first edge of the first cutting area away from the display area, and the other end of the first wiring is located on the side of the first edge close to the display area.

[0020] Through the above technical solution, one end of the first routing line is connected to the array routing line, the other end of the first routing line is spaced apart from the first edge of the cutting area away from the display area, and the other end of the first routing line is located on the side of the first edge close to the display area, and the first packaging structure and the second packaging structure can cover the routing line, which can prevent the first routing line from being exposed at the first edge of the first cutting area away from the display area. In this way, the display panel provided by the present application can prevent the first routing line from being exposed, which is beneficial to improving reliability and thus improving performance.

[0021] Therefore, the display panel provided in the present application is helpful to improve the performance of the display device.

[0022] In some embodiments, the other end of the first trace is located in the first cutting area. The second packaging structure covers the first cutting area while covering the other end of the first trace, thereby preventing the first trace from being exposed in the first cutting area. In this way, the first trace may remain in the first cutting area, thereby reducing the difficulty of processing.

[0023] In a third aspect, the present application provides a method for manufacturing a display panel, the manufacturing method comprising:

[0024] Providing a substrate, the substrate comprising a cutting area and a detection line at least located in the cutting area, the substrate further comprising a first packaging material layer, the first packaging material layer at least partially located in the cutting area, and an orthographic projection of the first packaging material layer on the substrate covering an orthographic projection of the detection line on the substrate;

[0025] Removing a portion of the first packaging material layer in the cutting area to form a hollow area, so that at least a portion of the detection wiring in the hollow area is exposed;

[0026] Remove the exposed part of the detection line in the hollow area;

[0027] A second packaging structure is formed on the substrate so that the second packaging structure covers the hollow area.

[0028] Through the above technical solution, at least part of the detection line in the cutting area can be removed, and then the hollow area can be covered with the second packaging structure. In this way, when the cutting area is subsequently cut, the detection line can be avoided from being exposed, which is conducive to improving reliability and thus improving performance.

[0029] In some embodiments, providing a substrate comprises:

[0030] forming array traces on a substrate;

[0031] forming a detection circuit and a detection wiring on the substrate, wherein the detection circuit and the array wiring are located on different sides of the cutting area, and the detection wiring passes through the cutting area and connects the detection circuit and the array wiring;

[0032] A first packaging material layer is formed on a side of the array wiring and the detection wiring facing away from the substrate.

[0033] In this way, the detection line can use the detection circuit to detect the array line. When the detection circuit is removed from the cutting area later, the detection line can be avoided from being exposed, which is beneficial to improving reliability and thus improving performance.

[0034] Optionally, the substrate includes a screen body area and an outer-screen area, the cutting area includes a portion located in the screen body area and a portion located in the outer-screen area, the array wiring is located in the screen body area, and the detection circuit is located in the outer-screen area.

[0035] In this way, the substrate can be cut in the cutting area to remove the off-screen area and the detection circuit located in the off-screen area.

[0036] In some embodiments, the substrate further includes a pixel definition layer covering the array wiring; and removing a portion of the first packaging material layer in the cutting area to form a hollow area includes:

[0037] forming an isolation structure on the pixel definition layer;

[0038] forming a first isolation opening on the isolation structure to expose a portion of the pixel definition layer located in the first isolation opening;

[0039] A first pixel opening is formed on a portion of the pixel definition layer located at the first isolation opening, and a portion of the first packaging material layer in the cutting area is removed to form a hollow area.

[0040] In this way, the manufacturing method provided in the present application can, when processing the first pixel opening on the pixel definition layer, remove part of the first packaging material layer in the cutting area to form a hollow area, thereby forming a first packaging structure. This is beneficial for saving process flow and thus is beneficial for improving the process performance of the display device.

[0041] In some embodiments, after removing the portion of the first packaging material layer in the cutting area to form a hollow area, and before removing the exposed portion of the detection trace in the hollow area, the manufacturing method further includes:

[0042] forming a first light emitting unit in the first isolation opening;

[0043] The first light emitting unit is encapsulated by using the first encapsulation portion of the first encapsulation layer.

[0044] In this way, the manufacturing method provided in the present application can form the first light-emitting unit according to the normal process flow, and removing part of the first packaging material layer in the cutting area to form a hollow area does not affect the normal process flow.

[0045] In some embodiments, removing the exposed portion of the detection trace in the hollow area includes:

[0046] A second isolation opening is formed on the isolation structure to expose a portion of the pixel definition layer located in the second isolation opening, and at the same time, the exposed portion of the detection wiring in the hollow area is removed.

[0047] In this way, the manufacturing method provided in the present application can remove the exposed portion of the detection wiring in the hollow area while forming the second isolation opening on the isolation structure, which is beneficial to saving process flow and thus beneficial to improving the process performance of the display device.

[0048] In some embodiments, after removing the exposed portion of the detection trace in the hollow area and before forming the second packaging structure on the substrate, the manufacturing method provided by the present application further includes:

[0049] forming a second pixel opening on a portion of the pixel definition layer located at the second isolation opening;

[0050] forming a second light emitting unit in the second isolation opening;

[0051] The second light emitting unit is encapsulated by the second encapsulation portion of the first encapsulation layer.

[0052] In this way, the manufacturing method provided in the present application can form the second light-emitting unit according to the normal process flow, and removing the exposed portion of the detection wiring in the hollow area does not affect the normal process flow.

[0053] In some embodiments, after removing at least a portion of the first packaging material layer in the cutting area and before removing the exposed portion of the detection trace in the hollow area, the manufacturing method further includes:

[0054] forming a second isolation opening on the isolation structure to expose a portion of the pixel definition layer located in the second isolation opening;

[0055] forming a second pixel opening on a portion of the pixel definition layer located at the second isolation opening;

[0056] forming a second light emitting unit in the second isolation opening;

[0057] The second light emitting unit is encapsulated by the second encapsulation portion of the first encapsulation layer.

[0058] In this way, the manufacturing method provided in the present application can form the second light-emitting unit according to the normal process flow, and removing part of the first packaging material layer in the cutting area to form a hollow area does not affect the normal process flow.

[0059] In some embodiments, removing the exposed portion of the detection trace in the hollow area includes:

[0060] A third isolation opening is formed on the isolation structure to expose a portion of the pixel definition layer located in the third isolation opening, and at the same time, the exposed portion of the detection wiring in the hollow area is removed.

[0061] In this way, the manufacturing method provided in the present application can remove the exposed portion of the detection wiring in the hollow area while forming the third isolation opening on the isolation structure, which is beneficial to saving process flow and thus beneficial to improving the process performance of the display device.

[0062] Optionally, after the exposed portion of the detection wiring in the hollowed-out area and before the second packaging structure is formed on the substrate, the manufacturing method further includes:

[0063] forming a third pixel opening on a portion of the pixel definition layer located at the third isolation opening;

[0064] forming a third light emitting unit in the third isolation opening;

[0065] The third light emitting unit is encapsulated by using the third encapsulation portion of the first encapsulation layer.

[0066] In this way, the manufacturing method provided in the present application can form the third light-emitting unit according to the normal process flow, and removing the portion of the wiring in the cutting area does not affect the normal process flow.

[0067] In some embodiments, the substrate further includes a pixel definition layer covering the array wiring; and removing a portion of the first packaging material layer in the cutting area to form a hollow area includes:

[0068] forming an isolation structure on the pixel definition layer;

[0069] forming a second isolation opening on the isolation structure to expose a portion of the pixel definition layer located in the second isolation opening;

[0070] A second pixel opening is formed on a portion of the pixel definition layer located at the second isolation opening, and a portion of the first packaging material layer in the cutting area is removed to form a hollow area.

[0071] In this way, the manufacturing method provided in the present application can remove part of the first packaging material layer in the cutting area to form a hollow area when processing the second pixel opening on the pixel definition layer, which is beneficial to saving process flow and thus beneficial to improving the process performance of the display device.

[0072] In some embodiments, after removing the portion of the first packaging material layer in the cutting area to form a hollow area, and before removing the exposed portion of the detection trace in the hollow area, the manufacturing method further includes:

[0073] forming a second light emitting unit in the second isolation opening;

[0074] The second light emitting unit is encapsulated by the second encapsulation portion of the first encapsulation layer.

[0075] In this way, the manufacturing method provided in the present application can form the second light-emitting unit according to the normal process flow, and removing at least part of the first packaging material layer in the cutting area does not affect the normal process flow.

[0076] In some embodiments, removing the exposed portion of the detection trace in the hollow area includes:

[0077] A third isolation opening is formed on the isolation structure, and the exposed portion of the detection wiring in the hollow area is removed.

[0078] In this way, the manufacturing method provided in the present application can remove the exposed portion of the detection wiring in the hollow area while forming the third isolation opening on the isolation structure, which is beneficial to saving process flow and thus beneficial to improving the process performance of the display device.

[0079] Optionally, after removing the exposed portion of the detection trace in the hollow area and before forming the second packaging structure on the substrate, the manufacturing method further includes:

[0080] forming a third pixel opening on a portion of the pixel definition layer located at the third isolation opening;

[0081] forming a third light emitting unit in the third isolation opening;

[0082] The third light emitting unit is encapsulated by using the third encapsulation portion of the first encapsulation layer.

[0083] In this way, the manufacturing method provided in the present application can form the third light-emitting unit according to the normal process flow, and removing the exposed portion of the detection wiring in the hollow area does not affect the normal process flow.

[0084] In some embodiments, after forming the isolation structure on the pixel definition layer and before forming the second isolation opening on the isolation structure, removing a portion of the first encapsulation material layer in the cutting area to form the hollow area further includes:

[0085] forming a first isolation opening on the isolation structure to expose a portion of the pixel definition layer located in the first isolation opening;

[0086] forming a first pixel opening on a portion of the pixel definition layer located at the first isolation opening;

[0087] forming a first light emitting unit in the first isolation opening;

[0088] The first light emitting unit is encapsulated by using the first encapsulation portion of the first encapsulation layer.

[0089] In this way, the manufacturing method provided in the present application can form the first light-emitting unit according to the normal process flow, and can form the first light-emitting unit before removing at least part of the first packaging material layer in the cutting area and removing the exposed part of the detection line in the hollow area, without affecting the normal process flow.

[0090] In some embodiments, the manufacturing method provided by the present application further includes:

[0091] The substrate is cut in a cutting area, and the cutting direction is perpendicular to the length direction of the detection trace.

[0092] In this way, the display panel can be obtained by cutting the substrate in the cutting area, and the wiring can be prevented from being exposed in the cutting area.

[0093] In a fourth aspect, the present application provides a display panel, which is manufactured by the manufacturing method of any of the above embodiments. The display panel provided by the present application has the same or similar technical effects as the above manufacturing method, which will not be described in detail here.

[0094] In a fifth aspect, the present application provides a motherboard, which includes the display panel of the above embodiment. The motherboard provided by the present application can be cut into the above display panel, and has the same or similar technical effects as the above display panel, which will not be described in detail here.

[0095] In a sixth aspect, the present application provides a display device, which includes the display panel of the above embodiment. The display device provided by the present application has the same or similar technical effects as the above display panel, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0096] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0097] Figure 1 One of the structural schematic diagrams of the display panel provided in the embodiment of the present application;

[0098] Figure 2 for Figure 1 One of the partial enlarged views at A in the middle;

[0099] Figure 3 For along Figure 2 One of the cross-sectional structural diagrams of the middle BB line;

[0100] Figure 4 The second structural schematic diagram of the display panel provided in the embodiment of the present application;

[0101] Figure 5 For along Figure 4 One of the cross-sectional structural diagrams of the CC line;

[0102] Figure 6 For along Figure 4 The second cross-sectional structure diagram of the CC line;

[0103] Figure 7 The third structural diagram of the display panel provided in the embodiment of the present application;

[0104] Figure 8 One of the flow charts of the manufacturing method provided in the embodiment of the present application;

[0105] Fig. 9 For along Figure 2 The second cross-sectional structure diagram of the middle BB line;

[0106] Fig.10 For along Figure 2 The third cross-sectional structure diagram of the middle BB line;

[0107] Fig.11 For along Figure 2 The fourth cross-sectional structure diagram of the middle BB line;

[0108] Fig.12 for Figure 1 The second partial enlarged view of point A in the middle;

[0109] Fig.13 For along Fig.12 Cross-sectional structural diagram of the middle DD line;

[0110] Fig.14 The second flowchart of the manufacturing method provided in the embodiment of the present application;

[0111] Fig.15 The third flowchart of the manufacturing method provided in the embodiment of the present application;

[0112] Fig.16 One of the structural schematic diagrams of the display panel provided in the embodiment of the present application during the manufacturing process;

[0113] Fig.17 The second structural schematic diagram of the display panel during the manufacturing process provided by the embodiment of the present application;

[0114] Fig.18 The third structural schematic diagram of the display panel during the manufacturing process provided by the embodiment of the present application;

[0115] Fig.19 The fourth flowchart of the manufacturing method provided in the embodiment of the present application;

[0116] Fig. 20 A fourth structural schematic diagram of a display panel during the manufacturing process provided by an embodiment of the present application;

[0117] Fig.21 A fifth structural diagram of a display panel during the manufacturing process provided by an embodiment of the present application;

[0118] Fig. 22 The sixth structural diagram of the display panel during the manufacturing process provided by the embodiment of the present application;

[0119] Fig.23 The fifth flowchart of the manufacturing method provided in the embodiment of the present application;

[0120] Fig.24 The seventh structural diagram of the display panel during the manufacturing process provided by the embodiment of the present application;

[0121] Fig.25 The eighth structural diagram of the display panel during the manufacturing process provided by the embodiment of the present application;

[0122] Fig.26 The sixth flowchart of the manufacturing method provided in the embodiment of the present application;

[0123] Fig. 27 Schematic diagram of the seventh process of the manufacturing method provided in the embodiment of the present application;

[0124] Fig.28 A schematic diagram of the structure of a motherboard provided in an embodiment of the present application.

[0125] Among them, the reference numerals in the figure are:

[0126] 100-display panel; 110-screen area; 111-display area; 112-frame area; 1121-main frame area; 120-outside screen area; 130-cutting area; 131-first cutting area; 132-second cutting area;

[0127] 10-substrate; 20-routing; 30-first packaging structure; 40-second packaging structure; 50-anode; 60-pixel definition layer; 61-first pixel opening; 62-second pixel opening; 63-third pixel opening; 70-isolation structure; 71-first isolation opening; 72-second isolation opening; 73-third isolation opening; 81-first light-emitting unit; 82-second light-emitting unit; 83-third light-emitting unit; 90-first packaging layer; 91-first packaging part; 92-first packaging part; 93-first packaging part;

[0128] 1000-motherboard; 1010-mask; 1011-mask boundary. DETAILED DESCRIPTION

[0129] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0130] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0131] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0132] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0133] Organic Light-Emitting Diode (OLED) is an organic thin-film electroluminescent device. It has the advantages of good display effect, good heat dissipation, low cost and small thickness. It is widely used in electronic products such as mobile phones, televisions, tablets, laptops, desktop computers, car display terminals, wearable devices, human-computer interaction terminal equipment, etc.

[0134] However, the performance and process performance of the display device need to be further improved.

[0135] The isolation structure introduced below is recorded in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A, please refer to them.

[0136] Please also read Figure 1 , Figure 2 , Figure 3 and Figure 4 In some embodiments, the present application provides a display panel 100 , which includes a substrate, the substrate including a substrate 10 and an array wiring arranged on one side of the substrate 10 in a thickness direction.

[0137] It should be noted that after the array wiring is formed on the substrate 10 , it is usually necessary to use a detection circuit to detect the array wiring.

[0138] For example, the substrate of the display panel 100 includes a substrate 10 and array wiring, the substrate includes a screen body area 110, an off-screen area 120 and a cutting area 130, the cutting area 130 includes a portion located in the screen body area 110 (a first cutting area 131) and a portion located in the off-screen area 120 (a first cutting area 131), the array wiring is located in the screen body area 110, and the detection circuit is located in the off-screen area 120.

[0139] The substrate further includes a display area 111 and a border area 112 . The border area 112 at least partially surrounds the display area 111 . The border area 112 includes a main frame area 1121 close to the display area 111 and a first cutting area 131 away from the display area 111 . At least part of the array wiring is located in the display area 111 .

[0140] It can be understood that the screen area 110 includes a display area 111 and a frame area 112 .

[0141] The inventors found that it is usually necessary to use detection lines to connect the detection circuit and the array lines. However, after the detection is completed, the detection lines need to be cut in the cutting area 130 to remove the off-screen area 120 with the detection circuit, and the detection lines are easily exposed.

[0142] Please also read Figure 4 and Figure 5 The display panel 100 provided in the embodiment of the present application further includes a first wiring 20 and a packaging structure. The first wiring 20 is arranged on the substrate, and at least part of the first wiring 20 is located in the main frame area 1121. The packaging structure is located on the side of the first wiring 20 away from the substrate, and the orthographic projection of the packaging structure on the substrate covers the orthographic projection of the first wiring 20 on the substrate.

[0143] It can be understood that the first trace 20 is the portion left after the detection trace is cut.

[0144] In the display panel 100 provided in the embodiment of the present application, at least part of the first wiring 20 is located in the main frame area 1121, and the packaging structure can cover the first wiring 20, thereby preventing the first wiring 20 from being exposed. In addition, at least part of the packaging structure is located in the first cutting area 131, and the orthographic projection of the packaging structure located in the first cutting area 131 on the substrate has a first boundary away from the display area 111, and the orthographic projection of the first wiring 20 on the substrate has a second boundary away from the display area 111, and the first boundary is located on the side of the second boundary away from the display area 111. In this way, the packaging structure can completely cover the first wiring 20 in the first cutting area 131, so that the first wiring 20 is exposed and will not be exposed in the first cutting area 131.

[0145] Therefore, the display panel 100 provided in the present application can prevent the first wiring 20 from being exposed, which is beneficial to improving reliability and thus improving performance.

[0146] Therefore, the display panel 100 provided in the present application is helpful to improve the performance of the display device.

[0147] Optionally, the packaging structure includes a first packaging structure 30 and a second packaging structure 40, and the first packaging structure 30 and the second packaging structure 40 are connected. The first packaging structure 30 is an inorganic layer formed on the substrate 10 after processing the array wiring.

[0148] The first packaging structure 30 may cover the first trace 20 , the second packaging structure 40 may cover the first cutting area, and the first packaging structure 30 and the second packaging structure 40 may cover the first trace 20 together, thereby preventing the first trace 20 from being exposed.

[0149] Exemplarily, the first packaging structure 30 covers the surface of the first trace 20 facing away from the substrate and two first side surfaces that are oppositely arranged along an extension direction perpendicular to the first trace 20 .

[0150] Exemplarily, the second packaging structure 40 covers the second side surface of the first trace 20 away from the display area 111 .

[0151] Exemplarily, the second encapsulation structure 40 covers the first cutting region 131 .

[0152] Exemplarily, the array routing includes a plurality of sub-routings arranged in layers, and the first routing 20 is arranged in the same layer as one of the sub-routings.

[0153] Exemplarily, the angle between the second side surface of the array wiring away from the display area 111 and the substrate is less than 90 degrees.

[0154] Exemplarily, along the thickness direction of the substrate, a surface of the first encapsulation structure 30 facing away from the substrate is higher than a surface of the second encapsulation structure 40 facing away from the substrate.

[0155] In some embodiments, the display panel 100 provided in the present application further includes an isolation structure 70 and a light-emitting unit, wherein the isolation structure 70 is located on the side of the array wiring away from the substrate, and the isolation structure 70 is located on the side of the second packaging structure 40 facing the substrate. The isolation structure 70 is located in the display area 111, and the isolation structure 70 defines an isolation opening, and the light-emitting unit is disposed in the isolation opening. The second packaging structure 40 is located on the side of the light-emitting unit away from the substrate, and covers the light-emitting unit.

[0156] In this way, the display panel 100 provided in the present application can use the second packaging structure 40 to cover the light-emitting unit and the isolation structure 70, and can also use the second packaging structure 40 to cover the hollow area, which is beneficial to saving process flow and thus beneficial to improving the process performance of the display device.

[0157] It can be understood that the second encapsulation structure 40 is formed by evaporating the light-emitting unit of the display panel 100 and performing ink jet printing (IJP) and then chemical vapor deposition (CVD).

[0158] In other embodiments, please refer to Figure 4 , Figure 5 and Figure 6 , an embodiment of the present application provides a display panel 100. Similar to the previous embodiment, the display panel 100 of the embodiment of the present application also includes a substrate and a first wiring 20. The substrate includes a display area 111 and a frame area 112, the frame area 112 surrounds the display area 111, the frame area 112 includes a main frame area 1121 close to the display area 111 and a first cutting area 131 away from the display area 111, the array wiring is arranged on one side of the substrate 10 in the thickness direction, and at least part of the array wiring is located in the display area 111.

[0159] Different from the previous embodiment, the display panel 100 further includes a first encapsulation structure 30 and a second encapsulation structure 40, the first wiring 20 is arranged on the substrate, the first encapsulation structure 30 is located on the side of the first wiring 20 away from the substrate, and the first encapsulation structure 30 covers at least part of the first wiring 20, the second encapsulation structure 40 is connected to the first encapsulation structure 30, and the second encapsulation structure 40 covers the first cutting area 131. Among them, one end of the first wiring 20 is connected to the array wiring, and the other end of the first wiring 20 is spaced apart from the first edge of the display area 111 of the first cutting area 131, and the other end of the first wiring 20 is located on the side of the first edge close to the display area 111.

[0160] In the display panel 100 of the embodiment of the present application, one end of the first wiring 20 is connected to the array wiring, and the other end of the first wiring 20 is spaced apart from the first edge of the cutting area 130 away from the display area 111, and the other end of the first wiring 20 is located on the side of the first edge close to the display area 111, and the first packaging structure 30 and the second packaging structure 40 can cover the first wiring 20, which can prevent the first wiring 20 from being exposed at the first edge of the first cutting area 131 away from the display area 111. In this way, the display panel 100 provided by the present application can prevent the first wiring 20 from being exposed, which is conducive to improving reliability and thus improving performance.

[0161] Therefore, the display panel 100 provided in the present application is helpful to improve the performance of the display device.

[0162] Please also read Figure 4 and Figure 6 In some embodiments, the other end of the first trace 20 is located in the first cutting area 131. The second encapsulation structure 40 covers the first cutting area 131 and the other end of the first trace 20, thereby preventing the first trace 20 from being exposed in the first cutting area 131. In this way, the first trace 20 may remain in the first cutting area 131, thereby reducing the difficulty of processing.

[0163] See also Figure 5 In other embodiments, the other end of the first wiring 20 is located in the main frame area 1121, that is, the first wiring 20 is entirely located in the main frame area 1121. The display panel 100 of the embodiment of the present application is the same as the display panel 100 of the first embodiment.

[0164] See also Figure 7 In some embodiments, the display panel provided in the embodiments of the present application further includes a pixel definition layer 60, an isolation structure 70, a light-emitting unit and a first encapsulation layer 90. The pixel definition layer 60 is disposed on one side of the substrate in the thickness direction, the isolation structure 70 is disposed on the side of the pixel definition layer 60 away from the substrate, and the isolation structure 70 encloses a plurality of isolation openings.

[0165] The plurality of isolation openings may include a first isolation opening 71, a second isolation opening 72, and a third isolation opening 73. The light emitting unit may include a first light emitting unit 81, a second light emitting unit 82, and a third light emitting unit 83. The first light emitting unit 81 is disposed in the first isolation opening 71, the second light emitting unit 82 is disposed in the second isolation opening 72, and the third light emitting unit 83 is disposed in the third isolation opening 73. The first encapsulation layer 90 includes a first encapsulation portion 91, a second encapsulation portion 92, and a third encapsulation portion 93. The first encapsulation portion 91 covers the first light emitting unit 81, the second encapsulation portion 92 covers the second light emitting unit 82, and the third encapsulation portion 93 covers the third light emitting unit 83.

[0166] Optionally, the display panel provided in the embodiment of the present application further includes a second encapsulation layer (not shown in the figure) and a third encapsulation layer (not shown in the figure), the second encapsulation layer is located on the side of the first encapsulation layer 90 away from the substrate, and the third encapsulation layer is located on the side of the second encapsulation layer away from the substrate.

[0167] Optionally, the first encapsulation layer 90 may be an inorganic layer formed by chemical vapor deposition (CVD).

[0168] Optionally, the second encapsulation layer may be an organic layer formed by ink jet printing (IJP).

[0169] Optionally, the third encapsulation layer may be an inorganic layer formed by chemical vapor deposition (CVD). The second encapsulation structure 40 may be a part of the third encapsulation layer.

[0170] Please also read Figure 8 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 and Fig.13 The embodiment of the present application further provides a method for manufacturing a display panel 100, the method comprising the following steps:

[0171] S1. Provide a substrate, wherein the substrate includes a cutting area 130 and a detection line at least located in the cutting area 130, and the substrate also includes a first packaging material layer, the first packaging material layer is at least partially located in the cutting area 130, and the orthographic projection of the first packaging material layer on the substrate covers the orthographic projection of the detection line on the substrate.

[0172] S2, removing a portion of the first packaging material layer in the cutting area 130 to form a hollow area, so that at least a portion of the detection wiring in the hollow area is exposed, and the remaining portion of the first packaging material layer forms a first packaging structure 30.

[0173] S3, remove the exposed part of the detection line in the hollow area.

[0174] S4, forming a second packaging structure 40 on the substrate so that the second packaging structure 40 covers the hollow area.

[0175] S5, cutting the substrate in the cutting area 130, wherein the cutting direction is perpendicular to the length direction of the detection line. Fig.12 As shown, the substrate is cut along line EE, and line EE is perpendicular to the length direction of the detection line. After the detection line is cut, the remaining part is the first line 20.

[0176] The manufacturing method provided in the embodiment of the present application can remove the exposed part of the detection line in the hollow area, and then cover the hollow area with the second packaging structure 40. In addition, the manufacturing method provided in the embodiment of the present application can obtain the display panel 100 by cutting the substrate in the cutting area 130. In this way, the manufacturing method provided in the embodiment of the present application can avoid the exposure of the detection line when cutting the cutting area 130, which is beneficial to improve reliability and thus improve performance.

[0177] See also Fig.14 In some embodiments, step S1, providing a substrate comprises:

[0178] S11, forming array traces on the substrate 10. Optionally, the substrate includes a screen area 110 and an off-screen area 120, the cutting area 130 includes a portion located in the screen area 110 (a first cutting area 131) and a portion located in the off-screen area 120 (a second cutting area 132), the array traces are located in the screen area 110, and the detection circuit is located in the off-screen area 120.

[0179] S12, forming a detection circuit and a detection wiring on the substrate 10, wherein the detection circuit and the array wiring are located on different sides of the cutting area 130, and the detection wiring passes through the cutting area 130 and connects the detection circuit and the array wiring.

[0180] S13 , forming a first packaging material layer on a side of the array wiring and the detection wiring facing away from the substrate 10 .

[0181] In this way, the detection line can use the detection circuit to detect the array line. When the cutting area 130 is subsequently cut to remove the detection circuit, the part of the detection line left after cutting (the first line 20) can be avoided from being exposed, which is beneficial to improving reliability and thus improving performance.

[0182] In addition, the substrate may be cut in the cutting area 130 to remove the off-screen area 120 and the detection circuit located in the off-screen area 120 .

[0183] Please also read Fig.15 , Fig.16 , Fig.17 as well as Fig.18 In some embodiments, the substrate further includes a pixel definition layer (Pixel Define Layer, PDL) 60 covering the array wiring, the pixel definition layer 60 is disposed on one side of the substrate in the thickness direction, and the anode 50 is located between the pixel definition layer 60 and the substrate 10. In step S2, removing the first packaging material layer in the cutting area 130 to form a hollow area includes:

[0184] S21 , forming an isolation structure 70 on the pixel definition layer 60 .

[0185] S22 , forming a first isolation opening 71 on the isolation structure 70 to expose a portion of the pixel definition layer 60 located in the first isolation opening 71 .

[0186] S23 , forming a first pixel opening 61 on a portion of the pixel definition layer 60 located at the first isolation opening 71 , and removing a portion of the first packaging material layer in the cutting area 130 to form a hollow area.

[0187] In this way, the manufacturing method provided in the embodiment of the present application can remove part of the first packaging material layer in the cutting area 130 to form a hollow area when processing the first pixel opening 61 on the pixel definition layer 60, which is beneficial to saving process flow and thus beneficial to improving the process performance of the display device.

[0188] In some embodiments, after step S2, removing the portion of the first packaging material layer in the cutting area 130 to form a hollow area, and before step S3, removing the exposed portion of the detection trace in the hollow area, the manufacturing method provided in the embodiment of the present application further includes:

[0189] S24 , forming a first light emitting unit 81 in the first isolation opening 71 .

[0190] S25 , encapsulating the first light emitting unit 81 by using the first encapsulation portion 91 of the first encapsulation layer 90 .

[0191] In other words, step S2, removing the portion of the first packaging material layer in the cutting area 130 to form a hollow area, further includes:

[0192] S24 , forming a first light emitting unit 81 in the first isolation opening 71 .

[0193] S25 , encapsulating the first light emitting unit 81 by using the first encapsulation portion 91 of the first encapsulation layer 90 .

[0194] In this way, the manufacturing method provided in the embodiment of the present application can form the first light-emitting unit 81 according to the normal process flow, and removing part of the first packaging material layer in the cutting area 130 to form a hollow area does not affect the normal process flow.

[0195] Please also read Fig.19 , Fig. 20 , Fig.21 as well as Fig. 22 In some embodiments, step S3, removing the exposed portion of the detection line in the hollow area includes:

[0196] S31 , forming a second isolation opening 72 on the isolation structure 70 to expose the portion of the pixel definition layer 60 located in the second isolation opening 72 , and removing the exposed portion of the detection wiring in the hollow area.

[0197] In this way, the manufacturing method provided in the embodiment of the present application can remove the exposed portion of the detection line in the hollow area when forming the second isolation opening 72 on the isolation structure 70, which is beneficial to saving process flow and thus beneficial to improving the process performance of the display device.

[0198] In some embodiments, after removing the exposed portion of the detection trace in the hollow area in step S3, and before forming the second packaging structure 40 on the substrate in step S4, the manufacturing method provided in the embodiment of the present application further includes:

[0199] The second pixel opening 62 is formed on a portion of the pixel definition layer 60 located at the second isolation opening 72 .

[0200] A second light emitting unit 82 is formed in the second isolation opening 72 .

[0201] The second light emitting unit 82 is encapsulated by the second encapsulation portion 92 of the first encapsulation layer 90 .

[0202] In other words, step S3, removing the exposed portion of the detection line in the hollow area, further includes:

[0203] S32 , forming a second pixel opening 62 on a portion of the pixel definition layer 60 located at the second isolation opening 72 .

[0204] S33 , forming a second light emitting unit 82 in the second isolation opening 72 .

[0205] S34 , encapsulating the second light emitting unit 82 by using the second encapsulation portion 92 of the first encapsulation layer 90 .

[0206] In this way, the manufacturing method provided in the embodiment of the present application can form the second light-emitting unit 82 according to the normal process flow, and removing the exposed portion of the detection wiring in the hollow area does not affect the normal process flow.

[0207] In some embodiments, after step S2, removing the portion of the first packaging material layer in the cutting area 130 to form a hollow area, and before step S3, removing the exposed portion of the detection trace in the hollow area, the manufacturing method provided in the embodiment of the present application further includes:

[0208] A second isolation opening 72 is formed on the isolation structure 70 to expose a portion of the pixel definition layer 60 located at the second isolation opening 72 ;

[0209] forming a second pixel opening 62 on a portion of the pixel definition layer 60 located at the second isolation opening 72;

[0210] forming a second light emitting unit 82 in the second isolation opening 72;

[0211] The second light emitting unit 82 is encapsulated by the second encapsulation portion 92 of the first encapsulation layer 90 .

[0212] That is, different from step S31 of the manufacturing method of the previous embodiment, the manufacturing method provided in the embodiment of the present application does not remove the exposed portion of the detection trace in the hollow area when forming the second isolation opening 72 on the isolation structure 70 .

[0213] In this way, the manufacturing method provided in the embodiment of the present application can form the second light-emitting unit 82 according to the normal process flow, and removing part of the first packaging material layer in the cutting area 130 to form a hollow area does not affect the normal process flow.

[0214] Please also read Figure 7 , Fig.23 , Fig.24 as well as Fig.25 In some embodiments, step S3, removing the exposed portion of the detection line in the hollow area includes:

[0215] S31 ′, forming a third isolation opening 73 on the isolation structure 70 to expose the portion of the pixel definition layer 60 located in the third isolation opening 73 , and removing the exposed portion of the detection wiring in the hollow area.

[0216] In this way, the manufacturing method provided in the present application can remove the exposed portion of the detection line in the hollow area while forming the third isolation opening 73 on the isolation structure 70, which is beneficial to saving process flow and thus beneficial to improving the process performance of the display device.

[0217] In some embodiments, after removing the exposed portion of the detection trace in the hollow area in step S3, and before forming the second packaging structure 40 on the substrate in step S4, the manufacturing method provided in the embodiment of the present application further includes:

[0218] forming a third pixel opening 63 on a portion of the pixel definition layer 60 located at the third isolation opening 73;

[0219] forming a third light emitting unit 83 in the third isolation opening 73;

[0220] The third light emitting unit 83 is encapsulated by the third encapsulation portion 93 of the first encapsulation layer 90 .

[0221] In other words, step S3, removing the exposed portion of the detection line in the hollow area, further includes:

[0222] S32 ′, forming a third pixel opening 63 on a portion of the pixel definition layer 60 located at the third isolation opening 73 .

[0223] S33 ′, forming a third light emitting unit 83 in the third isolation opening 73 .

[0224] S34 ′, encapsulating the third light emitting unit 83 using the third encapsulation portion 93 of the first encapsulation layer 90 .

[0225] In this way, the manufacturing method provided in the embodiment of the present application can form the third light-emitting unit 83 according to the normal process flow, and removing the exposed portion of the detection wiring in the hollow area does not affect the normal process flow.

[0226] See also Fig.26 In some embodiments, in step S2, removing a portion of the first packaging material layer in the cutting area 130 to form a hollow area includes:

[0227] S21 ′, forming an isolation structure 70 on the pixel definition layer 60 .

[0228] S22 ′, forming a second isolation opening 72 on the isolation structure 70 to expose a portion of the pixel definition layer 60 located in the second isolation opening 72 .

[0229] S23 ′, forming a second pixel opening 62 on the portion of the pixel definition layer 60 located at the second isolation opening 72 , and removing the portion of the first packaging material layer in the cutting area 130 to form a hollow area.

[0230] In this way, the manufacturing method provided in the present application can remove part of the first packaging material layer in the cutting area 130 to form a hollow area when processing the second pixel opening 62 on the pixel definition layer 60, which is beneficial to saving process flow and thus beneficial to improving the process performance of the display device.

[0231] It can be understood that before S22', that is, before forming the second isolation opening 72 on the isolation structure 70, the manufacturing method provided by the present application includes:

[0232] A first isolation opening 71 is formed on the isolation structure 70 to expose a portion of the pixel definition layer 60 located in the first isolation opening 71 ;

[0233] forming a first pixel opening 61 on a portion of the pixel definition layer 60 located at the first isolation opening 71;

[0234] forming a first light emitting unit 81 in the first isolation opening 71;

[0235] The first light emitting unit 81 is encapsulated by the first encapsulation portion 91 of the first encapsulation layer 90 .

[0236] In other words, after forming the isolation structure 70 on the pixel definition layer 60 and before forming the second isolation opening 72 on the isolation structure 70, step S2 of removing a portion of the first packaging material layer in the cutting area 130 to form a hollow area further includes:

[0237] A first isolation opening 71 is formed on the isolation structure 70 to expose a portion of the pixel definition layer 60 located in the first isolation opening 71 ;

[0238] forming a first pixel opening 61 on a portion of the pixel definition layer 60 located at the first isolation opening 71;

[0239] forming a first light emitting unit 81 in the first isolation opening 71;

[0240] The first light emitting unit 81 is encapsulated by the first encapsulation portion 91 of the first encapsulation layer 90 .

[0241] In this way, the manufacturing method provided in the present application can form the first light-emitting unit 81 according to the normal process flow, and can form the first light-emitting unit 81 before removing part of the first packaging material layer in the cutting area 130 to form a hollow area and removing the exposed part of the detection line in the hollow area, without affecting the normal process flow.

[0242] In some embodiments, after step S2, removing the portion of the first packaging material layer in the cutting area 130 to form a hollow area, and before step S3, removing the exposed portion of the detection trace in the hollow area, the manufacturing method provided in the embodiment of the present application further includes:

[0243] S24 ′, forming a second light emitting unit 82 in the second isolation opening 72 ;

[0244] S25 ′, encapsulating the second light emitting unit 82 using the second encapsulation portion 92 of the first encapsulation layer 90 .

[0245] In this way, the manufacturing method provided in the present application can form the second light-emitting unit 82 according to the normal process flow, and removing part of the first packaging material layer in the cutting area 130 to form a hollow area does not affect the normal process flow.

[0246] See also Fig. 27Based on the above embodiment, in step S3, removing the exposed portion of the detection line in the hollow area includes:

[0247] S31 , forming a third isolation opening 73 on the isolation structure 70 , and removing the exposed portion of the detection line in the hollow area. When forming the third isolation opening 73 on the isolation structure 70 , the portion of the pixel definition layer 60 located in the third isolation opening 73 is exposed.

[0248] In this way, the manufacturing method provided in the present application can remove the exposed portion of the detection line in the hollow area while forming the third isolation opening 73 on the isolation structure 70, which is beneficial to saving process flow and thus beneficial to improving the process performance of the display device.

[0249] On the basis of the above embodiment, after removing the exposed portion of the detection trace in the hollow area in step S3, and before forming the second packaging structure 40 on the substrate in step S4, the manufacturing method provided in the embodiment of the present application further includes:

[0250] forming a third pixel opening 63 on a portion of the pixel definition layer 60 located at the third isolation opening 73;

[0251] forming a third light emitting unit 83 in the third isolation opening 73;

[0252] The third light emitting unit 83 is encapsulated by the third encapsulation portion 93 of the first encapsulation layer 90 .

[0253] In other words, step S3, removing the exposed portion of the detection line in the hollow area, further includes:

[0254] S32 , forming a third pixel opening 63 on a portion of the pixel definition layer 60 located at the third isolation opening 73 .

[0255] S33 ″, forming a third light emitting unit 83 in the third isolation opening 73 .

[0256] S34 , encapsulating the third light emitting unit 83 by using the third encapsulation portion 93 of the first encapsulation layer 90 .

[0257] In this way, the manufacturing method provided in the present application can form the third light-emitting unit 83 according to the normal process flow, and removing the exposed portion of the detection wiring in the hollow area does not affect the normal process flow.

[0258] It can be understood that some display panels 100 provided in the implementation of the present application can be manufactured by the manufacturing method of any of the above embodiments.

[0259] See also Fig.28The embodiment of the present application further provides a motherboard 1000, which may include the display panel 100 of any of the above embodiments. The motherboard 1000 provided in the embodiment of the present application can be cut into the above display panel 100, and has the same or similar technical effects as the above display panel 100, which will not be described in detail here.

[0260] It is understandable that when the display panel 100 is processed using the motherboard 1000, a mask plate 1010 can be set on the motherboard 1000, and a mask boundary 1011 can be set on the mask plate 1010. The mask boundary 1011 corresponds to the display area 111 of the display panel 100. The area of ​​the area enclosed by the mask boundary 1011 is larger than the area of ​​the display area 111, and the mask boundary 1011 surrounds the display area 111. In this way, a light-emitting unit can be processed in the display area 111 of the display panel 100 through the mask boundary 1011.

[0261] The embodiment of the present application also provides a display device, which includes the display panel 100 of any of the above embodiments. The display device provided by the embodiment of the present application has the same or similar technical effects as the display panel 100 of the above embodiments, which will not be described in detail here.

[0262] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: A substrate, comprising a display area and a frame area, wherein the frame area at least partially surrounds the display area, and the frame area comprises a main frame area close to the display area and a first cutting area away from the display area; The substrate includes array wiring, and at least part of the array wiring is located in the display area; A first routing line is disposed on the substrate and connected to the array routing line, and at least a portion of the first routing line is located in the main frame area; A packaging structure, located on a side of the first wiring away from the substrate, and an orthographic projection of the packaging structure on the substrate covers an orthographic projection of the first wiring on the substrate; At least part of the packaging structure is located in the first cutting area, the packaging structure located in the first cutting area has a first boundary away from the display area in the orthographic projection of the substrate, the first routing line has a second boundary away from the display area in the orthographic projection of the substrate, and the first boundary is located on the side of the second boundary away from the display area.

2. The display panel according to claim 1, wherein: The packaging structure includes a first packaging structure and a second packaging structure, wherein the first packaging structure and the second packaging structure are connected; Preferably, the first packaging structure covers a surface of the first wiring facing away from the substrate and two first side surfaces arranged opposite to each other in a direction perpendicular to the extension of the first wiring; Preferably, the second packaging structure covers a second side surface of the first wiring away from the display area; Preferably, the second packaging structure covers the first cutting area; Preferably, the array routing includes a plurality of sub-routings arranged in layers, and the first routing is arranged in the same layer as one of the sub-routings; Preferably, an angle between the second side surface of the array wiring away from the display area and the substrate is less than 90 degrees; Preferably, along the thickness direction of the substrate, a surface of the first packaging structure facing away from the substrate is higher than a surface of the second packaging structure facing away from the substrate; Preferably, the display panel further includes: An isolation structure, located on a side of the array wiring away from the substrate and on a side of the second packaging structure facing the substrate, at least a portion of the isolation structure is located in the display area, and the isolation structure encloses an isolation opening; The light emitting unit is disposed in the isolation opening. The second packaging structure is located on a side of the light emitting unit away from the substrate and covers the light emitting unit.

3. A display panel, characterized in that: include: A substrate, comprising a display area and a frame area, wherein the frame area at least partially surrounds the display area, and the frame area comprises a main frame area close to the display area and a first cutting area away from the display area; The substrate includes array wiring, and at least part of the array wiring is located in the display area; A first wiring is arranged on the substrate; A first packaging structure is located on a side of the first wiring away from the substrate and covers at least a portion of the first wiring; a second packaging structure connected to the first packaging structure and covering the first cutting area; One end of the first wiring is connected to the array wiring, and the other end of the first wiring is spaced apart from a first edge of the first cutting area away from the display area and is located on a side of the first edge close to the display area.

4. The display panel according to claim 3, wherein: The other end of the first wiring is located in the first cutting area.

5. A method for manufacturing a display panel, characterized in that: include: Providing a substrate, the substrate comprising a cutting area and a detection line at least located in the cutting area, the substrate further comprising a first packaging material layer, the first packaging material layer at least partially located in the cutting area, and an orthographic projection of the first packaging material layer on the substrate covering an orthographic projection of the detection line on the substrate; Removing the first packaging material layer from the portion in the cutting area to form a hollow area, so that at least a portion of the detection trace in the cutting area is exposed in the hollow area; Removing the exposed portion of the detection wiring in the hollow area; A second packaging structure is formed on the substrate, so that the second packaging structure covers the hollow area.

6. The method according to claim 5, characterized in that: The providing of the substrate comprises: forming array traces on a substrate; forming a detection circuit and the detection wiring on the substrate, wherein the detection circuit and the array wiring are located on different sides of the cutting area, and the detection wiring passes through the cutting area and connects the detection circuit and the array wiring; Forming the first packaging material layer on a side of the array wiring and the detection wiring away from the substrate; Preferably, the substrate includes a screen body area and an off-screen area, the cutting area includes a portion located in the screen body area and a portion located in the off-screen area, the array wiring is located in the screen body area, and the detection circuit is located in the off-screen area.

7. The method according to claim 5, characterized in that: The substrate further includes a pixel definition layer; and removing the first packaging material layer in the portion of the cutting area to form a hollow area includes: forming an isolation structure on the pixel definition layer; forming a first isolation opening on the isolation structure to expose a portion of the pixel definition layer located at the first isolation opening; A first pixel opening is formed on a portion of the pixel definition layer located at the first isolation opening, and the first encapsulation material layer is removed at a portion of the cutting area to form a hollow area.

8. The method according to claim 7, characterized in that: After removing the first packaging material layer to form a hollow area in the cutting area, and before removing the detection trace to expose the exposed part of the hollow area, the manufacturing method further includes: forming a first light emitting unit in the first isolation opening; The first light emitting unit is encapsulated by using a first encapsulation portion of a first encapsulation layer.

9. The method according to claim 7, characterized in that: The removing of the exposed portion of the detection line in the hollow area includes: A second isolation opening is formed on the isolation structure to expose the portion of the pixel definition layer located in the second isolation opening, and at the same time, the exposed portion of the detection wiring in the hollow area is removed.

10. The manufacturing method according to claim 9, characterized in that: After removing the exposed portion of the detection trace in the hollow area and before forming the second packaging structure on the substrate, the manufacturing method further includes: forming a second pixel opening on a portion of the pixel definition layer located at the second isolation opening; forming a second light emitting unit in the second isolation opening; The second light emitting unit is encapsulated by using the second encapsulation part of the first encapsulation layer.

11. The method according to claim 7, characterized in that: After removing the first packaging material layer to form a hollow area in the cutting area, and before removing the detection trace to expose the exposed part of the hollow area, the manufacturing method further includes: forming a second isolation opening on the isolation structure to expose a portion of the pixel definition layer located at the second isolation opening; forming a second pixel opening on a portion of the pixel definition layer located at the second isolation opening; forming a second light emitting unit in the second isolation opening; The second light emitting unit is encapsulated by using the second encapsulation part of the first encapsulation layer.

12. The method according to claim 11, characterized in that: The removing of the exposed portion of the detection line in the hollow area includes: forming a third isolation opening on the isolation structure to expose the portion of the pixel definition layer located in the third isolation opening, and removing the exposed portion of the detection wiring in the hollow area; Preferably, after removing the exposed portion of the detection trace in the hollow area and before forming the second packaging structure on the substrate, the manufacturing method further includes: forming a third pixel opening on a portion of the pixel definition layer located at the third isolation opening; forming a third light emitting unit in the third isolation opening; The third light emitting unit is encapsulated by using the third encapsulation part of the first encapsulation layer.

13. The manufacturing method according to claim 5, characterized in that: The substrate further includes a pixel definition layer; and removing the first packaging material layer in the portion of the cutting area to form a hollow area includes: forming an isolation structure on the pixel definition layer; forming a second isolation opening on the isolation structure to expose a portion of the pixel definition layer located at the second isolation opening; A second pixel opening is formed on a portion of the pixel definition layer located at the second isolation opening, and the first packaging material layer is removed at a portion of the cutting area to form a hollow area.

14. The method according to claim 13, characterized in that: After removing the first packaging material layer to form a hollow area in the cutting area, and before removing the detection trace to expose the exposed part of the hollow area, the manufacturing method further includes: forming a second light emitting unit in the second isolation opening; The second light emitting unit is encapsulated by using the second encapsulation part of the first encapsulation layer.

15. The method according to claim 13, characterized in that: The removing of the exposed portion of the detection line in the hollow area includes: forming a third isolation opening on the isolation structure, and removing the exposed portion of the detection wiring in the hollow area; Preferably, after removing the exposed portion of the detection trace in the hollow area and before forming the second packaging structure on the substrate, the manufacturing method further includes: forming a third pixel opening on a portion of the pixel definition layer located at the third isolation opening; forming a third light emitting unit in the third isolation opening; The third light emitting unit is encapsulated by using the third encapsulation part of the first encapsulation layer.

16. The method according to claim 13, characterized in that: After forming an isolation structure on the pixel definition layer and before forming a second isolation opening on the isolation structure, removing the first packaging material layer from the portion of the cutting area to form a hollow area further comprises: forming a first isolation opening on the isolation structure to expose a portion of the pixel definition layer located at the first isolation opening; forming a first pixel opening on a portion of the pixel definition layer located at the first isolation opening; forming a first light emitting unit in the first isolation opening; The first light emitting unit is encapsulated by using a first encapsulation portion of a first encapsulation layer.

17. The manufacturing method according to claim 5, characterized in that: The production method further comprises: The substrate is cut in the cutting area, and the cutting direction is perpendicular to the length direction of the detection line.

18. A display panel, characterized in that: The display panel is manufactured by the manufacturing method according to any one of claims 5 to 17.

19. A motherboard, characterized in that: The motherboard includes a plurality of display panels according to any one of claims 1 to 4 and 18.

20. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 4 and 18.

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