Preparation method of display panel, display panel and display device

Abstract

The embodiment of the invention provides a preparation method of a display panel, the display panel and a display device, and the display panel comprises a substrate; the isolation structure is arranged on one side of the substrate and encloses a plurality of isolation openings; the light-emitting layer comprises light-emitting units located in the isolation openings; the light filtering layer comprises light filtering units which are located in the isolation openings and located on the sides, away from the substrate, of the light emitting units; the second packaging layer is located on the side, away from the substrate, of the light filtering layer. According to the display panel and the manufacturing method thereof, before the rear light-emitting unit is manufactured, the front light-emitting unit can be covered with the light filtering unit, and when the rear light-emitting unit is manufactured through the etching process, due to protection of the light filtering unit, the influence on the front light-emitting unit can be reduced, the yield of the front light-emitting unit is improved, and then the process performance of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing a display panel, a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a method for manufacturing a display panel, a display panel, and a display device, aiming to improve the process performance of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, comprising: a substrate; an isolation structure, which is arranged on one side of the substrate and encloses a plurality of isolation openings; a light-emitting layer, comprising a light-emitting unit located in each isolation opening; a filter layer, comprising a filter unit located in the isolation opening and located on the side of the light-emitting unit away from the substrate; and a second encapsulation layer, located on the side of the filter layer away from the substrate.

[0006] According to the implementation of the first aspect of the present application, it also includes: a first encapsulation layer, including a first encapsulation part, at least a part of the first encapsulation part is located between the light-emitting unit and the filter unit.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the first encapsulation layer includes an inorganic material.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, there are multiple first packaging parts, and each first packaging part is used to encapsulate each light-emitting unit.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the plurality of first packaging portions are arranged at intervals, and the orthographic projection of the filter unit on the substrate is located within the orthographic projection range of the first packaging portion on the substrate.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the first packaging part includes a first section and a second section, the first section is located in the isolation opening, and the second section is connected to the peripheral side of the first section and extends to a side of the isolation structure away from the substrate.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the filter unit has a first top surface facing away from the substrate, the second section has a second top surface facing away from the substrate, the first top surface is located on the side of the second top surface facing the substrate, or the first top surface is flush with the second top surface.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the second packaging layer includes a second packaging portion located on a side of each filter unit facing away from the substrate, and the orthographic projection of the second packaging portion on the substrate covers the orthographic projection of the filter unit on the substrate.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the second packaging portion is contact-connected with a portion of the first packaging portion.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the second packaging portion is in contact and connected with the first packaging portion located on a side of the isolation structure facing away from the substrate.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the second encapsulation layer includes an inorganic material.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the plurality of second packaging portions are arranged at intervals.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of each second packaging part on the substrate overlaps with the orthographic projection of each first packaging part on the substrate.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a light-shielding layer, the light-shielding layer further includes a light-shielding portion, and the light-shielding portion is located on a side of the isolation structure facing away from the substrate.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the shading portion is located in a gap between adjacent second packaging portions.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the shading portion has a third top surface facing away from the substrate, the second packaging portion has a fourth top surface facing away from the substrate, the third top surface is located on the side of the fourth top surface facing the substrate, or the third top surface is flush with the fourth top surface.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the shading portion includes a first sub-shading portion and a second sub-shading portion, the first sub-shading portion is located between adjacent second packaging portions, and the second sub-shading portion fills the gap between the first packaging portion and the isolation structure.

[0022] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a touch electrode layer located on a side of the second packaging layer facing away from the substrate.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, it also includes a third packaging layer located on a side of the second packaging layer facing away from the substrate.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the third encapsulation layer includes organic material.

[0025] According to any of the aforementioned implementations of the first aspect of the present application, it further includes a fourth packaging layer located on a side of the third packaging layer facing away from the substrate.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the fourth encapsulation layer includes an inorganic material.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, at least two of the first encapsulation layer, the second encapsulation layer and the fourth encapsulation layer are made of the same material.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first sublayer and a second sublayer stacked in a direction away from the substrate, and the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the second sublayer on the substrate.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the isolation structure includes a conductive material, a second electrode is arranged between the light-emitting unit and the filtering unit, and the second electrode is electrically connected to the isolation structure.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, it also includes a pixel definition layer, the pixel definition layer includes a pixel limiting portion and a pixel opening, the orthographic projection of the pixel opening on the substrate and the orthographic projection of the isolation opening on the substrate at least partially overlap, and the light-emitting unit is located at the pixel opening.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure is located on a side of the pixel defining portion facing away from the substrate, or a clearance opening is provided on the pixel defining portion, and the isolation structure is located in the clearance opening.

[0032] An embodiment of the first aspect of the present application provides a display panel, comprising: a substrate; an isolation structure, which is arranged on the substrate and encloses a plurality of isolation openings; a light-emitting layer, comprising a light-emitting unit located at each isolation opening; a first encapsulation layer, comprising a first encapsulation portion located at a side of the light-emitting unit facing away from the substrate, a filter layer, comprising a filter unit located at the isolation opening and at a side of the first encapsulation portion facing away from the substrate, the filter unit having a first top surface facing away from the substrate, the first encapsulation portion having a second top surface facing away from the substrate, and a maximum distance from the first top surface to the substrate being less than or equal to a maximum distance from the second top surface to the substrate.

[0033] The embodiment of the second aspect of the present application further provides a method for preparing a display panel, including:

[0034] An isolation structure is prepared on the substrate, wherein the isolation structure encloses a plurality of isolation openings;

[0035] preparing a light emitting unit in the isolation opening;

[0036] A filter unit is prepared on a side of the light emitting unit in the isolation opening facing away from the substrate;

[0037] A second encapsulation layer is prepared on the side of the filter unit facing away from the light-emitting unit.

[0038] According to an embodiment of the second aspect of the present application, the step of preparing a light-emitting unit in the isolation opening further includes: preparing a light-emitting unit in the isolation opening, and preparing a first packaging material layer on a side of the light-emitting unit away from the substrate, wherein the first packaging material layer covers the isolation structure and the light-emitting unit.

[0039] The step of preparing a filter unit on the side of the light emitting unit in the isolation opening away from the substrate includes: preparing a filter layer on the side of the first packaging material layer away from the substrate, patterning the filter layer, and forming the filter unit in the isolation opening.

[0040] According to any of the aforementioned embodiments of the first aspect of the present application, the step of preparing a second encapsulation layer on a side of the filter unit away from the light-emitting unit comprises:

[0041] A second packaging material layer is prepared on a side of the filter layer facing away from the substrate, and the second packaging material layer is in contact with and connected to the first packaging material layer;

[0042] The first encapsulation material layer and the second encapsulation material layer are patterned to form a first encapsulation portion and a second encapsulation portion.

[0043] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening, the filter unit includes a first filter unit, a second filter unit, and a third filter unit, the first packaging portion includes a first sub-portion, a second sub-portion, and a third sub-portion, and the second packaging portion includes a fourth sub-portion, a fifth sub-portion, and a sixth sub-portion;

[0044] In the step of preparing the light emitting unit in the isolation opening:

[0045] A first light-emitting material layer is disposed on one side of the isolation structure and the substrate, and a portion of the first light-emitting material layer falls into the first isolation opening to form a first light-emitting unit;

[0046] In the step of preparing the filter unit on the side of the first packaging material layer facing away from the substrate: preparing the first filter unit on the side of the first packaging material layer facing away from the substrate;

[0047] In the step of patterning the first encapsulation material layer and the second encapsulation material layer to form the first encapsulation part and the second encapsulation part, the first encapsulation material layer and the second encapsulation material layer are patterned to form the first sub-part and the fourth sub-part located on the side of the first light-emitting unit away from the substrate, and the first light-emitting material layer not covered by the first sub-part and the fourth sub-part is removed.

[0048] According to any of the aforementioned implementations of the first aspect of the present application, further comprising:

[0049] A second light-emitting material layer is disposed on one side of the isolation structure and the substrate, and a portion of the second light-emitting material layer falls into the second isolation opening to form a second light-emitting unit;

[0050] A third packaging material layer is disposed on a side of the second light-emitting material layer facing away from the substrate,

[0051] A second filter unit is arranged on a side of the third packaging material layer facing away from the substrate, and the second filter unit is located at the second isolation opening;

[0052] A fourth packaging material layer is arranged on a side of the second filter unit facing away from the substrate, and the fourth packaging material layer is in contact and connected with the third packaging material layer on a side of the isolation structure facing away from the substrate;

[0053] The third packaging material layer, the fourth packaging material layer and the second light-emitting material layer are patterned to form a second sub-portion and a fifth sub-portion located on the side of the second light-emitting unit away from the substrate, and the second light-emitting material layer not covered by the second sub-portion and the fifth sub-portion is removed.

[0054] According to any of the aforementioned implementations of the first aspect of the present application, further comprising:

[0055] A third light-emitting material layer is disposed on one side of the isolation structure and the substrate, and a portion of the third light-emitting material layer falls into the third isolation opening to form a third light-emitting unit;

[0056] A fifth packaging material layer is disposed on a side of the third light-emitting material layer facing away from the substrate,

[0057] A third filter unit is arranged on a side of the third packaging material layer facing away from the substrate, and the third filter unit is located at the third exit;

[0058] A sixth packaging material layer is disposed on a side of the third filter unit facing away from the substrate, and the sixth packaging material layer is in contact and connected with the fourth packaging material layer on a side of the isolation structure facing away from the substrate;

[0059] The fourth packaging material layer, the sixth packaging material layer and the third light-emitting material layer are patterned to form a third sub-portion and a sixth sub-portion located on the side of the third light-emitting unit away from the substrate, and the third light-emitting material layer not covered by the third sub-portion and the sixth sub-portion is removed.

[0060] In the display panel provided in the embodiment of the present application, the display panel includes a substrate, an isolation structure, a light-emitting layer and a filter layer. The isolation structure is used to enclose and form an isolation opening, so that the light-emitting unit of the light-emitting layer is located in the isolation opening, thereby improving the problem of light interference between light-emitting units of different colors. A filter unit is provided on the light-emitting unit, and the light extraction efficiency of the display panel can be improved by providing the filter unit to filter stray light. In addition, since the filter unit is also located in the isolation opening and is located on the light-emitting unit, when the light-emitting units are prepared sequentially by etching and other processes, before preparing the rear light-emitting unit, the filter unit can be covered on the front light-emitting unit. When the rear light-emitting unit is prepared by etching, due to the protection of the filter unit, the influence on the front light-emitting unit can be reduced, the yield of the front light-emitting unit can be improved, and the process performance of the display panel can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0062] Figure 1 is a structural schematic diagram of a display panel provided in an embodiment of the present application;

[0063] Figure 2 In one example Figure 1 Sectional view at AA in the middle;

[0064] Figure 3 In another example Figure 1 Sectional view at AA in the middle;

[0065] Figure 4 yes Figure 3 A schematic diagram of a local enlarged structure;

[0066] Figure 5 It is a schematic diagram of a display panel manufacturing method provided in an embodiment of the present application;

[0067] Figure 6 is a schematic flow chart of a method for preparing a display panel provided by another embodiment of the present application;

[0068] Figures 7 to 11 is a process diagram of a display panel manufacturing method provided in an embodiment of the present application;

[0069] Fig.12 is a schematic flow chart of a method for preparing a display panel provided by another embodiment of the present application;

[0070] Fig.13 is a schematic flow chart of a method for preparing a display panel provided by another embodiment of the present application;

[0071] Fig.14 is a schematic diagram of a display panel manufacturing method provided by another embodiment of the present application;

[0072] Fig.15 This is a schematic diagram of a display panel manufacturing method provided in another embodiment of the present application.

[0073] Description of reference numerals:

[0074] 100, substrate; 110, first electrode; 120, second electrode;

[0075] 200, isolation structure; 210, isolation opening; 211, first isolation opening; 212, second isolation opening; 213, third isolation opening; 201, first sublayer; 202, second sublayer;

[0076] 300, pixel definition layer; 310, pixel definition portion; 320, pixel opening; 330, light emitting unit; 331, first light emitting unit; 332, second light emitting unit; 333, third light emitting unit;

[0077] 400, filter layer; 410, filter unit; 401, first top surface; 411, first filter unit; 412, second filter unit; 413, third filter unit; 420, light shielding portion; 421, third top surface; 422, first sub-light shielding portion; 423, second sub-light shielding portion;

[0078] 500, first encapsulation layer; 510, first encapsulation part; 511, first sub-part; 512, second sub-part; 512a, second top surface; 513, first sub-part; 514, second sub-part; 515, third sub-part;

[0079] 600, second encapsulation layer; 610, second encapsulation part; 601, fourth top surface; 611, fourth sub-part; 612, fifth sub-part; 613, sixth sub-part;

[0080] 700, third encapsulation layer; 800, fourth encapsulation layer;

[0081] 900, touch electrode layer; 910, touch electrode; 920, bridge electrode. DETAILED DESCRIPTION

[0082] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0083] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating directions or positional relationships, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0084] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0085] In the process of realizing this application, the inventors have found the following problems in the related technology: in some display panels, an isolation structure is used to disconnect the light-emitting material layer and the cathode layer of adjacent sub-pixels, so that light-emitting material layers of different colors can be formed in different isolation openings by whole-layer evaporation and etching. Patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, and 202311346196.5 record the relevant technical solutions of the isolation structure 140, and their contents are incorporated into this application by reference for reference.

[0086] In order to better understand this application, Figures 1 to 15 The manufacturing method of the display panel, the display panel and the display device according to the embodiments of the present application are described in detail.

[0087] Please also read Figure 1 to Figure 2 , Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application; Figure 2 yes Figure 1 Schematic diagram of the local enlarged structure at AA in the middle.

[0088] like Figure 1 and Figure 2 As shown, an embodiment of the first aspect of the present application provides a display panel, which includes a substrate 100, an isolation structure 200, a light-emitting layer, a filter layer 400, and a second encapsulation layer 600. The isolation structure 200 is disposed on the substrate 100 and encloses a plurality of isolation openings 210; the light-emitting layer includes a light-emitting unit 330 located in each isolation opening 210; the filter layer 400 includes a filter unit 410 located in the isolation opening 210 and located on the side of the light-emitting unit 330 away from the substrate 100. The second encapsulation layer 600 is located on the side of the filter layer 400 away from the substrate 100.

[0089] In the display panel provided in the embodiment of the present application, the display panel includes a substrate 100, an isolation structure 200, a light-emitting layer, a filter layer 400 and a second encapsulation layer 600. The isolation structure 200 is used to enclose and form an isolation opening 210, so that the light-emitting unit 330 of the light-emitting layer is located in the isolation opening 210, thereby improving the problem of light interference between light-emitting units 330 of different colors. A filter unit 410 is provided on the light-emitting unit 330. By providing the filter unit 410 to filter stray light, the light extraction efficiency of the display panel can be improved. The second encapsulation layer 600 is used to provide encapsulation protection for the filter layer 400. In addition, since the filter unit 410 is also located in the isolation opening 210 and is located on the light-emitting unit 330, when the light-emitting units 330 are prepared sequentially using processes such as etching, before preparing the rear light-emitting unit 330, the filter unit 410 can be covered on the front light-emitting unit 330. When the rear light-emitting unit 330 is prepared using the etching process, due to the protection of the filter unit 410, the impact on the front light-emitting unit 330 can be reduced, the yield of the front light-emitting unit 330 can be improved, and the process performance of the display panel can be improved.

[0090] Optionally, the light-emitting unit 330 includes a first light-emitting unit 331, a second light-emitting unit 332, and a third light-emitting unit 333, and the light-emitting colors of the first light-emitting unit 331, the second light-emitting unit 332, and the third light-emitting unit 333 are different, so as to realize the color display of the display panel. The filter unit 410 includes a first filter unit 411, a second filter unit 412, and a third filter unit 413, the first filter unit 411 is located on the side of the first light-emitting unit 331 away from the substrate 100, the second filter unit 412 is located on the side of the second light-emitting unit 332 away from the substrate 100, and the third filter unit 413 is located on the side of the third light-emitting unit 333 away from the substrate 100. Optionally, the isolation opening 210 includes a first isolation opening 211 for accommodating the first light-emitting unit 331, a second isolation opening 212 for accommodating the second light-emitting unit 332, and a third isolation opening 213 for accommodating the third light-emitting unit 333.

[0091] Optionally, preparing the light emitting units 330 in sequence means preparing a plurality of first light emitting units 331, a plurality of second light emitting units 332 and a plurality of third light emitting units 333 in sequence. The front light emitting unit 330 refers to the light emitting unit 330 prepared in front, and the rear light emitting unit 330 refers to the light emitting unit 330 prepared in the rear.

[0092] A plurality of first light-emitting units 331 can be prepared and formed in the same process step, a plurality of second light-emitting units 332 can be prepared and formed in the same process step, and a plurality of third light-emitting units 333 can be prepared and formed in the same process step. Optionally, a plurality of first light-emitting units 331 can be prepared first, and then a plurality of second light-emitting units 332 can be prepared, and finally a plurality of third light-emitting units 333 can be prepared. In other embodiments, the first light-emitting unit 331, the second light-emitting unit 332, and the third light-emitting unit 333 can also be prepared in other orders.

[0093] When the second light-emitting unit 332 is prepared by an etching process, the second light-emitting material layer deposited on the first light-emitting unit 331 needs to be etched, and the etching process may affect the yield of the first light-emitting unit 331. In the embodiment of the present application, since the first light-emitting unit 331 is provided with the first filter unit 411, the first filter unit 411 can be prepared on the first light-emitting unit 331 before preparing the second light-emitting unit 332. When the second light-emitting material layer deposited on the first light-emitting unit 331 is etched, due to the protective effect of the first filter unit 411, the influence on the first light-emitting unit 331 can be improved, thereby improving the yield of the first light-emitting unit 331 and improving the process performance of the display panel.

[0094] There are many ways to set the substrate 100. The substrate 100 may include a substrate and a first conductive layer, a second conductive layer, and a third conductive layer that are arranged on one side of the substrate and are stacked. An insulating layer is provided between adjacent conductive layers. Exemplarily, the substrate 100 includes a pixel driving circuit. The pixel driving circuit includes a transistor and a storage capacitor. The transistor includes a channel region, a gate, a source and a drain. The storage capacitor includes a first plate and a second plate. As an example, the gate and the first plate may be located in the first conductive layer, the second plate may be located in the second conductive layer, and the source and the drain may be located in the third conductive layer. Optionally, the substrate 100 may also include a fourth conductive layer, which is located on the side of the third conductive layer away from the substrate, and the fourth conductive layer may be provided with a connecting signal line.

[0095] Optionally, the display panel further includes a first electrode layer and a second electrode layer, the first electrode layer includes a plurality of first electrodes 110 arranged at intervals, each first electrode 110 is located on a side of each light-emitting unit 330 facing the substrate 100. The second electrode layer includes a plurality of second electrodes 120, each second electrode 120 is located on a side of each light-emitting unit 330 away from the substrate 100, and the first electrode 110 and the second electrode 120 work together to drive the light-emitting unit 330 to emit light. One of the first electrode 110 and the second electrode 120 is an anode, and the other is a cathode. The embodiment of the present application is described by taking the first electrode 110 as an anode and the second electrode 120 as a cathode.

[0096] Optionally, the filter unit 410 is located on a side of the second electrode 120 facing away from the substrate 100 to prevent the filter unit 410 from affecting the normal light emission of the light emitting unit 330 .

[0097] In some optional embodiments, please continue to refer to Figure 1 and Figure 2 The display panel further includes a first encapsulation layer 500, the first encapsulation layer 500 includes a first encapsulation portion 510, and at least a portion of the first encapsulation portion 510 is located between the light emitting unit 330 and the light filtering unit 410. The first encapsulation portion 510 is used to provide encapsulation protection for the light emitting unit 330, and the first encapsulation portion 510 is located between the light emitting unit 330 and the light filtering unit 410, that is, the light filtering unit 410 is located on a side of the first encapsulation portion 510 away from the substrate 100, which can improve the encapsulation effect of the first encapsulation portion 510.

[0098] Optionally, the first encapsulation layer 500 includes a plurality of first encapsulation parts 510 arranged at intervals, and each first encapsulation part 510 is used to encapsulate each light-emitting unit 330 to achieve independent encapsulation of the light-emitting unit 330. When one of the light-emitting units 330 is invaded by water and oxygen, impurities such as water and oxygen are prevented from moving along the first encapsulation layer 500 and affecting the yield of other light-emitting units 330.

[0099] Optionally, the first packaging portion 510 is located on a side of the second electrode 120 away from the substrate 100 , so as to prevent the first packaging portion 510 from affecting the second electrode 120 driving the light-emitting unit 330 to emit light.

[0100] Optionally, the material of the first encapsulation layer 500 includes an inorganic material, so that the first encapsulation part 510 has good compactness and thin thickness, and after the light-emitting unit 330 and the first encapsulation part 510 are arranged in the isolation opening 210, there is still enough space to arrange the filter unit 410.

[0101] Optionally, a plurality of first encapsulation parts 510 are arranged at intervals, and the orthographic projection of the filter unit 410 on the substrate 100 is located within the orthographic projection range of the first encapsulation part 510 on the substrate 100. The filter unit 410 is located in the isolation opening 210, so that part of the first encapsulation part 510 can extend out of the filter unit 410 to contact and connect with the second encapsulation layer 600, and the filter unit 410 is completely encapsulated.

[0102] There are many ways to configure the shape of the first packaging portion 510 . For example, the first packaging portion 510 is completely located in the isolation opening 210 .

[0103] In some other optional embodiments, the first packaging portion 510 includes a first sub-portion 511 and a second sub-portion 512 , wherein the first sub-portion 511 is located in the isolation opening 210 , and the second sub-portion 512 is connected to the peripheral side of the first sub-portion 511 and extends to a side of the isolation structure 200 away from the substrate 100 .

[0104] In these optional embodiments, a portion of the first encapsulation portion 510 is located in the isolation opening 210 to provide encapsulation protection for the light emitting unit 330, and the second encapsulation portion 610 extends to the side of the isolation structure 200 away from the substrate 100 to increase the coverage area of ​​the first encapsulation portion 510 and increase the protection area of ​​the light emitting unit 330. In addition, the boundary of the first encapsulation portion 510 is located on the isolation structure 200, and when the first encapsulation portion 510 is prepared by an etching process, the over-etching caused by process error can be improved, and the light emitting unit 330 is not covered by the first encapsulation portion 510.

[0105] Optionally, there is a gap between two adjacent first packaging parts 510 on the side of the isolation structure 200 facing away from the substrate 100 , so that the two first packaging parts 510 are discontinuous, thereby achieving independent packaging of each light-emitting unit 330 .

[0106] Optional, such as Figure 3As shown, the display panel further includes a light shielding layer, and the light shielding layer includes a light shielding portion 420. At least part of the light shielding portion 420 may be located in the gap between two adjacent first encapsulation portions 510. The light shielding portion 420 is used to prevent different color lights emitted by adjacent light emitting units 330 from crosstalking with each other, thereby affecting the display effect of the light emitting units 330.

[0107] In some optional implementations, such as Figures 1 to 4 As shown, the filter unit 410 has a first top surface 401 facing away from the substrate 100, the second section 512 has a second top surface 512a facing away from the substrate 100, the first top surface 401 is located on the side of the second top surface 512a facing the substrate 100, or the first top surface 401 and the second top surface 512a are flush.

[0108] In these optional embodiments, the first top surface 401 of the filter unit 410 facing away from the substrate 100 is not higher than the second top surface 512a of the second section 512 facing away from the substrate 100, which can ensure the flatness from the first top surface 401 to the second top surface 512a, and improve the yield of other film layers when other film layers are subsequently prepared.

[0109] In other embodiments, the first top surface 401 may also be slightly higher than the second top surface 512a, but does not extend onto the second top surface 512a, that is, the first top surface 401 is located on the side of the second top surface 512a away from the substrate 100, so as to ensure that the filter unit 410 has sufficient thickness and improve the filtering effect of the filter unit 410.

[0110] In some optional embodiments, such as Figures 1 to 4 As shown, the second encapsulation layer 600 includes a second encapsulation portion 610 located on a side of each filter unit 410 away from the substrate 100 , and the orthographic projection of the second encapsulation portion 610 on the substrate 100 covers the orthographic projection of the filter unit 410 on the substrate 100 .

[0111] In these optional embodiments, each filter unit 410 is further provided with a second packaging portion 610, which can provide packaging protection for the filter unit 410, improve the yield of the filter unit 410, and improve the effect of the preparation of the post-light emitting unit 330 on the filter unit 410.

[0112] In some optional embodiments, the second encapsulation portion 610 is in contact with a portion of the first encapsulation portion 510 , so that the second encapsulation portion 610 and the first encapsulation portion 510 can completely wrap the filter unit 410 , thereby providing better protection for the filter unit 410 .

[0113] Optionally, the second packaging portion 610 is in contact with the first packaging portion 510 located on the side of the isolation structure 200 facing away from the substrate 100 , for example, the second packaging portion 610 is in contact with the second sub-portion 512 , so that the second packaging portion 610 and the second sub-portion 512 can completely wrap the filter unit 410 .

[0114] In addition, the second packaging part 610 also covers the second sub-part 512 , which can improve the effect of the etching process on the second sub-part 512 during the preparation of the post-unit, ensure that the first packaging part 510 has a larger coverage area, and improve the yield of the light-emitting unit 330 .

[0115] During the preparation of the front light-emitting unit 330, for example, during the preparation of the first light-emitting unit 331, the first light-emitting material layer and the first packaging material layer will be covered on the entire surface of the isolation structure 200, and a portion of the first light-emitting material layer and the first packaging material layer will fall into the second isolation opening 212 and the third isolation opening 213. Then, the first light-emitting material layer and the first packaging material layer in the second isolation opening 212 and the third isolation opening 213 are etched away. When the etching force is insufficient, light-emitting material or packaging material residues will be left on the inner wall surface of the isolation structure 200 facing the second isolation opening 212 and the third isolation opening 213, affecting the yield of the rear light-emitting unit 330. When the etching force is too large, the yield of the first light-emitting unit 331, especially the first packaging part 510, will be affected, causing the first packaging part 510 to be over-etched.

[0116] In the embodiment of the present application, a filter unit 410 and a second packaging unit 610 are provided on the first packaging unit 510, and the second packaging unit 610 covers the second sub-portion 512, so that the first packaging unit 510 is not easily affected by the preparation of the rear light-emitting unit 330. Therefore, a suitable etching strength can be selected to better remove the light-emitting material and packaging material in the second isolation opening 212 and the third isolation opening 213, and improve the problem of residual light-emitting material or packaging material on the inner wall surface of the isolation structure 200 facing the second isolation opening 212 and the third isolation opening 213.

[0117] Optionally, the material of the second encapsulation layer 600 includes an inorganic material, so that the second encapsulation layer 600 has good compactness and a thin thickness.

[0118] In some optional embodiments, a plurality of second packaging parts 610 are arranged at intervals to achieve independent packaging of the filter unit 410 and improve the problem of water and oxygen intrusion.

[0119] Optionally, the orthographic projection of each second encapsulation part 610 on the substrate 100 overlaps with the orthographic projection of each first encapsulation part 510 on the substrate 100. For example, the orthographic projection of each second encapsulation part 610 on the substrate 100 and the orthographic projection of each first encapsulation part 510 on the substrate 100 have the same shape and area, so as to minimize the distribution area of ​​the second encapsulation part 610 and increase the spacing between adjacent second encapsulation parts 610 to ensure the independent encapsulation effect, while ensuring that the second encapsulation part 610 has sufficient protection for the first sub-portion 511.

[0120] Optionally, the display panel further includes a light shielding layer, the light shielding layer includes a light shielding portion 420 , and the light shielding portion 420 is located on a side of the isolation structure 200 facing away from the substrate 100 .

[0121] In these embodiments, by providing a shading portion 420 on the isolation structure 200, on the one hand, the gap between adjacent second packaging portions 610 can be filled to ensure the flatness of the film structure; on the other hand, when the isolation structure 200 is made of metal material and has a large reflectivity, the shading portion 420 can block part of the isolation structure 200, thereby reducing the reflectivity of the area where the isolation structure 200 is located and improving the display effect of the display panel in the screen-off state; in addition, the shading portion 420 can also improve the problem of light crosstalk between adjacent filtering units 410.

[0122] Optionally, the material of the light shielding portion 420 includes a light-absorbing insulating material. For example, the material of the light shielding portion 420 includes a black matrix material or the like.

[0123] Optionally, the shading portion 420 is located in the gap between adjacent second packaging portions 610 to improve the flatness of the film layer in the display area of ​​the display panel. The combination of the shading portion 420 and the filtering unit 410 can fill the pit formed by the isolation structure 200 and the gap formed by the first packaging portion 510 and the second packaging portion 610 on the surface of the isolation structure 200.

[0124] Optionally, the shading portion 420 has a third top surface 421 facing away from the substrate 100, the second packaging portion 610 has a fourth top surface 601 facing away from the substrate 100, the third top surface 421 is located on the side of the fourth top surface 601 facing the substrate 100, or the third top surface 421 is flush with the fourth top surface 601.

[0125] In these optional embodiments, the third top surface 421 of the shading portion 420 is not protruding relative to the fourth top surface 601 of the second packaging portion 610, which can further improve the flatness between the third top surface 421 and the fourth top surface 601. In addition, it can also improve the overall thickness of the display panel affected by the excessive thickness of the shading portion 420.

[0126] In some optional embodiments, the light shielding portion 420 includes a first sub-light shielding portion 422 and a second sub-light shielding portion 423, wherein the first sub-light shielding portion 422 is located between adjacent second packaging portions 610, and the second sub-light shielding portion 423 fills the gap between the first packaging portion 510 and the isolation structure 200. This increases the distribution area of ​​the light shielding portion 420 and reduces the size of the pores between the first packaging portion 510 and the isolation structure 200, thereby improving the pores storing air and affecting the packaging performance.

[0127] In some optional embodiments, the display panel also includes a third encapsulation layer 700, which is located on the side of the second encapsulation layer 600 away from the substrate 100. By setting the third encapsulation layer 700, the third encapsulation layer 700 covers the multiple second encapsulation parts 610, which can further improve the encapsulation effect, and the top surface of the third encapsulation layer 700 away from the substrate 100 is smoother than the fourth top surface 601 of the multiple second encapsulation parts 610.

[0128] Optionally, the material of the third encapsulation layer 700 includes organic material, so that the third encapsulation layer has an appropriate thickness, can flatten the surface of the shading portion 420 and the filter unit 410, and improve the flatness of the display panel. Since the filter unit 410 is also an organic material, it has good adhesion to the third encapsulation layer 700, and the surfaces of the shading portion 420 and the filter unit 410 are relatively flat, which effectively improves the phenomenon of the third encapsulation layer 700 and the isolation structure 200 or the first encapsulation layer 500 being bonded and separated.

[0129] Optionally, the display panel further includes a fourth encapsulation layer 800 , and the fourth encapsulation layer 800 is located on a side of the third encapsulation layer 700 away from the substrate 100 , so as to further improve the encapsulation effect.

[0130] Optionally, the material of the fourth encapsulation layer 800 includes an inorganic material, so that the fourth encapsulation layer 800 has good compactness and a thin thickness.

[0131] Optionally, at least two of the first encapsulation layer 500 , the second encapsulation layer 600 and the fourth encapsulation layer 800 are made of the same material, which can simplify the manufacturing process of the display panel.

[0132] In some optional embodiments, the display panel further includes a touch electrode layer 900 , and the touch electrode layer 900 is located on a side of the second encapsulation layer 600 facing away from the substrate 100 .

[0133] First, the touch electrode layer 900 is located on the fourth packaging layer 800 with a higher flatness, which can improve the yield of the touch electrode layer 900. In addition, the adjustment of the position of the filter unit 410 to between the light-emitting unit 330 and the touch electrode layer 900 can increase the distance from the light-emitting unit 330 to the touch electrode layer 900, increase the spacing between the touch electrode layer 900 and the conductive layer in the substrate 100, reduce the parasitic capacitance between the touch electrode layer 900 and the second electrode 120 and the conductive layer in the substrate 100, improve the mutual influence between the touch electrode layer 900 and the conductive layer in the substrate 100, and improve the touch accuracy of the touch electrode layer 900.

[0134] Secondly, the combination of the filter unit 410 and the shading portion 420 eliminates the need to set a polarization structure on the surface of the touch electrode layer 900 away from the substrate 100, thereby reducing the distance between the touch electrode layer 900 and an external touch device such as a hand or a capacitive pen on the display panel, thereby improving the sensing accuracy of the touch electrode layer 900.

[0135] Optionally, the touch electrode layer 900 includes touch electrodes 910 and bridge electrodes 920 , and at least two adjacent touch electrodes 910 may be connected to each other via the bridge electrode 920 .

[0136] There are many ways to dispose the isolation structure 200 . For example, the isolation structure 200 is disposed integrally, and the height difference caused by the isolation structure 200 is used to break the light-emitting material around the isolation structure 200 .

[0137] In some other optional embodiments, the isolation structure 200 includes a first sublayer 201 and a second sublayer 202 stacked in a direction away from the substrate 100 , and the orthographic projection of the first sublayer 201 on the substrate 100 is located within the orthographic projection of the second sublayer 202 on the substrate 100 .

[0138] In these optional embodiments, the size of the first sublayer 201 is smaller than the size of the second sublayer 202, so that a recess can be formed under the second sublayer 202. When the light-emitting material layer falls on the isolation structure 200, the light-emitting material layer can be broken on the peripheral side of the isolation structure 200, thereby forming light-emitting units 330 located in each isolation opening 210 and independent of each other, which can simplify the preparation process of the light-emitting unit 330.

[0139] Optionally, the material of the isolation structure 200 includes a conductive material, a second electrode 120 is disposed between the light emitting unit 330 and the filter unit 410, and the second electrode 120 is electrically connected to the isolation structure 200, so that a plurality of second electrodes 120 can be interconnected through the isolation structure 200 to form a whole-surface electrode.

[0140] Optionally, the display panel further includes a pixel definition layer 300 , the pixel definition layer 300 includes a pixel defining portion 310 and a pixel opening 320 , the orthographic projection of the pixel opening 320 on the substrate 100 is located within the orthographic projection range of the isolation opening 210 on the substrate 100 , and the light emitting unit 330 is located at the pixel opening 320 .

[0141] In these optional embodiments, the display panel also includes a pixel definition layer 300, the pixel opening 320 of the pixel definition layer 300 is connected to the isolation opening 210, and the light-emitting unit 330 is located in the pixel opening 320, so that there is enough space in the isolation opening 210 to set the filter unit 410.

[0142] Optionally, the isolation structure 200 is located on a side of the pixel defining portion 310 facing away from the substrate 100 , or a clearance opening is provided on the pixel defining portion 310 , and the isolation structure 200 is located in the clearance opening.

[0143] like Figures 1 to 4 As shown, an embodiment of the first aspect of the present application also provides a display panel, including: a substrate 100; an isolation structure 200, which is arranged on the substrate 100 and encloses a plurality of isolation openings 210; a light-emitting layer, including a light-emitting unit 330 located in each isolation opening 210; a first encapsulation layer 500, including a first encapsulation portion 510 located on the side of the light-emitting unit 330 away from the substrate 100, and a filter layer 400, including a filter unit 410 located in the isolation opening 210 and on the side of the first encapsulation portion 510 away from the substrate 100, the filter unit 410 having a first top surface 401 away from the substrate 100, the first encapsulation portion 510 having a second top surface 512a away from the substrate 100, and the maximum distance from the first top surface 401 to the substrate 100 is less than or equal to the maximum distance from the second top surface 512a to the substrate 100.

[0144] In the display panel provided in the embodiment of the present application, the display panel includes a substrate 100, an isolation structure 200, a light-emitting layer and a filter layer 400. The isolation structure 200 is used to enclose and form an isolation opening 210, so that the light-emitting unit 330 of the light-emitting layer is located in the isolation opening 210, thereby improving the problem of light interference between light-emitting units 330 of different colors. A filter unit 410 is provided on the light-emitting unit 330, and by providing the filter unit 410 to filter stray light, the light extraction efficiency of the display panel can be improved. In addition, since the filter unit 410 is also located in the isolation opening 210 and is located on the light-emitting unit 330, when the light-emitting units 330 are prepared sequentially using processes such as etching, before preparing the rear light-emitting unit 330, the filter unit 410 can be covered on the front light-emitting unit 330. When the rear light-emitting unit 330 is prepared using the etching process, due to the protection of the filter unit 410, the impact on the front light-emitting unit 330 can be reduced, the yield of the front light-emitting unit 330 can be improved, and the process performance of the display panel can be improved.

[0145] In addition, the maximum distance from the first top surface 401 to the substrate 100 is less than or equal to the maximum distance from the second top surface 512a to the substrate 100, so that the first top surface 401 is retracted toward the substrate 100 relative to the second top surface 512a, which can reduce the height of the filter unit 410 protruding from the isolation structure 200 and improve the flatness of the film layer.

[0146] The arrangement of the substrate 100, the light emitting layer, the isolation structure 200, the first encapsulation layer 500 and the filter layer 400 is as described above and will not be repeated here. The display panels provided in different embodiments of the present application can be referenced to each other.

[0147] like Figure 5 As shown, the embodiment of the second aspect of the present application further provides a method for preparing a display panel. The display panel can be the display panel provided by any of the embodiments of the first aspect above. Please refer to Figures 1 to 5 , the preparation method comprises:

[0148] Step S01 : preparing an isolation structure 200 on a substrate 100 , wherein the isolation structure 200 encloses a plurality of isolation openings 210 .

[0149] Step S02 : preparing the light-emitting unit 330 in the isolation opening 210 .

[0150] Step S03 : preparing a filter unit 410 on a side of the light emitting unit 330 facing away from the substrate 100 in the isolation opening 210 .

[0151] Step S04 : preparing a second encapsulation layer 600 on a side of the filter unit 410 facing away from the light emitting unit 330 .

[0152] In the display panel prepared in the embodiment of the present application, the display panel includes a substrate 100, an isolation structure 200, a light-emitting layer and a filter layer 400. The isolation structure 200 is used to enclose and form an isolation opening 210, so that the light-emitting unit 330 of the light-emitting layer is located in the isolation opening 210, thereby improving the problem of light interference between light-emitting units 330 of different colors. A filter unit 410 is provided on the light-emitting unit 330. By providing the filter unit 410 to filter stray light, the light extraction efficiency of the display panel can be improved. The second encapsulation layer 600 can provide encapsulation protection for the filter unit 410. In addition, since the filter unit 410 is also located in the isolation opening 210 and is located on the light-emitting unit 330, when the light-emitting units 330 are prepared sequentially using processes such as etching, before preparing the rear light-emitting unit 330, the filter unit 410 can be covered on the front light-emitting unit 330. When the rear light-emitting unit 330 is prepared using the etching process, due to the protection of the filter unit 410, the impact on the front light-emitting unit 330 can be reduced, the yield of the front light-emitting unit 330 can be improved, and the process performance of the display panel can be improved.

[0153] In some optional embodiments, step S02 may include: preparing a light emitting unit 330 in the isolation opening 210, and preparing a first packaging material layer on a side of the light emitting unit 330 away from the substrate 100, the first packaging material layer covering the isolation structure 200 and the light emitting unit 330. Then in step S03, a filter layer 400 may be prepared on a side of the first packaging material layer away from the substrate 100, the filter layer 400 may be patterned, and a filter unit 410 may be formed in the isolation opening 210.

[0154] In these optional embodiments, before step S03, a first packaging material layer is disposed on the light emitting material layer, and the first packaging material layer can provide packaging protection for the first light emitting material layer, thereby improving the yield of the light emitting unit 330. In step S03, the filter unit 410 falls on the first packaging material layer, and the filter unit 410 is not directly in contact with the light emitting unit 330, thereby reducing the influence of the filter unit 410 on the light emitting unit 330.

[0155] In some optional embodiments, such as Figures 1 to 6 As shown, step S04 also includes:

[0156] Step S041: preparing a second packaging material layer on the side of the filter unit 410 facing away from the substrate 100, and the second packaging material layer is in contact with the first packaging material layer.

[0157] Step S042 : patterning the first encapsulation material layer and the second encapsulation material layer to form a first encapsulation portion 510 and a second encapsulation portion 610 .

[0158] In these optional embodiments, after step S03, a second packaging material layer is formed on the filter unit 410 through step S04, and the second packaging material layer can provide packaging protection for the filter unit 410, thereby improving the yield of the filter unit 410. The contact connection between the first packaging material layer and the second packaging material layer can also improve the sealing effect. After step S04, the first packaging material layer and the second packaging material layer are patterned in the same process step to form the first packaging part 510 and the second packaging part 610, which can improve the manufacturing efficiency and simplify the manufacturing difficulty.

[0159] Optionally, the specific configuration of the first encapsulation part 510 and the second encapsulation part 610 may refer to the display panel provided in the above-mentioned first aspect embodiment.

[0160] As described above, the isolation opening 210 includes the first isolation opening 211, the second isolation opening 212 and the third isolation opening 213, the filter unit 410 includes the first filter unit 411, the second filter unit 412 and the third filter unit 413, the first packaging part 510 includes the first sub-part 513, the second sub-part 514 and the third sub-part 515, and the second packaging part 610 includes the fourth sub-part 611, the fifth sub-part 612 and the sixth sub-part 613. The light-emitting unit 330 includes the first light-emitting unit 331, the second light-emitting unit 332 and the third light-emitting unit 333.

[0161] Optionally, the first light-emitting unit 331, the first sub-unit 513, the first filter unit 411 and the fourth sub-unit 611 are sequentially stacked in the first isolation opening 211 in a direction away from the substrate 100. The second light-emitting unit 332, the second sub-unit 514, the second filter unit 412 and the fifth sub-unit 612 are sequentially stacked in the second isolation opening 212 in a direction away from the substrate 100. The third light-emitting unit 333, the third sub-unit 515, the third filter unit 413 and the sixth sub-unit 613 are sequentially stacked in the third isolation opening 213 in a direction away from the substrate 100. The first light-emitting unit 331, the second light-emitting unit 332 and the third light-emitting unit 333 can be prepared in sequence. For example, the first light-emitting unit 331 and the first sub-unit 513, the first filter unit 411 and the fourth sub-unit 611 can be prepared first.

[0162] like Figure 6 As shown, in step S02, it may include:

[0163] Step S021: Figure 7 As shown, a first light emitting material layer is disposed on one side of the isolation structure 200 and the substrate 100 , and a portion of the first light emitting material layer falls into the first isolation opening 211 to form a first light emitting unit 331 .

[0164] Step S022: Figure 7As shown, a first encapsulation material layer is prepared on a side of the first light-emitting material layer facing away from the substrate 100 .

[0165] like Figure 8 As shown, in step S03, a first filter layer can be prepared on the side of the first packaging material layer away from the substrate 100, and the first filter material layer can be patterned to form a first filter unit 411 located on the first light emitting unit 331. Fig.10 As shown, in step S04, a second packaging material layer is prepared on the side of the first filter unit 411 facing away from the substrate 100, and the second packaging material layer is in contact with the first packaging material layer.

[0166] like Fig.10 and Fig.11 As shown, step S042 may include patterning the first encapsulation material layer and the second encapsulation material layer to form a first sub-portion 513 and a fourth sub-portion 611 located on the side of the first light-emitting unit 331 away from the substrate 100, and removing the first light-emitting material layer not covered by the first sub-portion 513 and the fourth sub-portion 611.

[0167] In these optional embodiments, the patterning of the first light-emitting material layer, the first encapsulation material layer, and the second encapsulation material layer is performed in the same process step, which can improve the manufacturing efficiency.

[0168] Optionally, the display panel may further include a second electrode layer. Before step S032, an electrode material layer may be set on the first light-emitting material layer. In step S032, a second packaging material layer falls on the electrode material layer. In step S042, a second electrode 120 may be formed on the side of the second light-emitting unit 332 away from the substrate 100.

[0169] In the application embodiment, since the first light-emitting unit 331 is covered with the first packaging material layer, the first filter unit 411 and the second packaging material layer, the first light-emitting unit 331 is well sealed and protected. Therefore, in step S042, the etching force can be appropriately increased to better remove the first light-emitting material layer, the first packaging material layer and the second packaging material layer in the second isolation opening 212 and the third isolation opening 213.

[0170] After the first light-emitting unit 331 is prepared, the second light-emitting unit 332 may be prepared in sequence, for example, Fig.12 As shown, after step S042, the following steps are also included:

[0171] Step S06 : a second light emitting material layer is disposed on one side of the isolation structure 200 and the substrate 100 , and a portion of the second light emitting material layer falls into the second isolation opening 212 to form a second light emitting unit 332 .

[0172] Step S07 : disposing a third encapsulation material layer on the side of the second light-emitting material layer facing away from the substrate 100 .

[0173] Step S08 : disposing a second filter unit 412 on a side of the third packaging material layer facing away from the substrate 100 , wherein the second filter unit 412 is located in the second isolation opening 212 .

[0174] Step S09 : a fourth packaging material layer is disposed on the side of the second filter unit 412 facing away from the substrate 100 , and the fourth packaging material layer is in contact with and connected to the third packaging material layer on the side of the isolation structure 200 facing away from the substrate 100 .

[0175] Step S010: Fig.15 As shown, the third encapsulation material layer, the fourth encapsulation material layer and the second light-emitting material layer are patterned to form a second sub-portion 514 and a fifth sub-portion 612 located on the side of the second light-emitting unit 332 away from the substrate 100, and the second light-emitting material layer not covered by the second sub-portion 514 and the fifth sub-portion 612 is removed.

[0176] In the embodiment of the present application, since the fourth sub-section 611, the first sub-section 513, and the first filter unit 411 can provide better protection for the first light-emitting unit 331, and the fourth sub-section 611 and the first filter unit 411 can fill the first isolation opening 211, reducing the step difference of the isolation structure 200, the second electrode layer and the second light-emitting material layer can be well formed on the surface of the fourth sub-section 611, effectively avoiding the influence of the etching process of the second light-emitting unit 332 on the first filter unit 411. Therefore, in step S010, when the second light-emitting material layer, the third packaging material layer, and the fourth packaging material layer in the area where the first isolation opening 211 is located are removed, the influence of the etching process on the first light-emitting unit 331 can be improved, and the yield of the first light-emitting unit 331 can be improved.

[0177] As described above, when the display panel includes a second electrode layer, a conductive material layer may be provided on the second light emitting material layer before step S07 . In step S010 , the conductive material layer may be patterned to form a second electrode 120 on the second light emitting unit 332 .

[0178] like Fig.13 As shown, after step S010, the following steps may also be included:

[0179] Step S011 : a third light emitting material layer is disposed on one side of the isolation structure 200 and the substrate 100 , and a portion of the third light emitting material layer falls into the third isolation opening 213 to form a third light emitting unit 333 .

[0180] Step S012 : disposing a fifth encapsulation material layer on a side of the third light emitting material layer facing away from the substrate 100 .

[0181] Step S013 : a third light filtering unit 413 is disposed on a side of the third packaging material layer facing away from the substrate 100 , and the third light filtering unit 413 is located at the third exit.

[0182] Step S014 : a sixth packaging material layer is disposed on the side of the third filter unit 413 facing away from the substrate 100 , and the sixth packaging material layer is in contact with and connected to the fourth packaging material layer on the side of the isolation structure 200 facing away from the substrate 100 .

[0183] Step S015: Fig.14 As shown, the fourth encapsulation material layer, the sixth encapsulation material layer and the third light-emitting material layer are patterned to form a third sub-portion 515 and a sixth sub-portion 613 located on the side of the third light-emitting unit 333 away from the substrate 100, and the third light-emitting material layer not covered by the third sub-portion 515 and the sixth sub-portion 613 is removed.

[0184] In the embodiment of the present application, since the fourth sub-section 611, the first sub-section 513, and the first filter unit 411 can provide better protection for the first light-emitting unit 331, the fifth sub-section 612, the second filter unit 412, and the second sub-section 514 can provide better protection for the second light-emitting unit 332. Therefore, in step S015, when the third light-emitting material layer, the fifth packaging material layer, and the sixth packaging material layer in the area where the first isolation opening 211 and the second isolation opening 212 are located are removed, the influence of the etching process on the first light-emitting unit 331 and the second light-emitting unit 332 can be improved, and the yield of the first light-emitting unit 331 and the second light-emitting unit 332 can be improved.

[0185] As described above, when the display panel includes a second electrode layer, a conductive material layer may be provided on the second light emitting material layer before step S012 . In step S015 , the conductive material layer may be patterned to form a second electrode 120 on the third light emitting unit 333 .

[0186] like Fig.15 As shown, after the second packaging material layer is prepared, the light shielding portion 420 can be prepared. The light shielding portion 420 fills the gap between adjacent second packaging portions 610.

[0187] An embodiment of the present application also provides a display panel, which can be prepared by the preparation method of any of the above-mentioned second aspect embodiments.

[0188] An embodiment of the third aspect of the present application further provides a display device, which includes a display panel according to any of the above-mentioned embodiments of the first aspect or a display panel prepared by the preparation method of any of the above-mentioned embodiments of the second aspect.

[0189] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure is disposed on one side of the substrate and encloses a plurality of isolation openings; A light-emitting layer, comprising light-emitting units located in each of the isolation openings; A filter layer, comprising a filter unit located at the isolation opening and at a side of the light emitting unit away from the substrate; The second packaging layer is located on the side of the filter layer facing away from the substrate.

2. The display panel according to claim 1, characterized in that: Also includes: A first encapsulation layer, comprising a first encapsulation portion, at least a portion of which is located between the light emitting unit and the light filtering unit; Preferably, the material of the first encapsulation layer includes an inorganic material; Preferably, there are multiple first packaging parts, and each first packaging part is used to package each light-emitting unit; Preferably, a plurality of the first packaging parts are arranged at intervals, and the orthographic projection of the filter unit on the substrate is located within the range of the orthographic projection of the first packaging part on the substrate.

3. The display panel according to claim 2, characterized in that: The first packaging portion includes a first sub-portion and a second sub-portion. The first sub-portion is located in the isolation opening, and the second sub-portion is connected to a peripheral side of the first sub-portion and extends to a side of the isolation structure away from the substrate.

4. The display panel according to claim 3, characterized in that: The filter unit has a first top surface facing away from the substrate, the second section has a second top surface facing away from the substrate, the first top surface is located on a side of the second top surface facing the substrate, or the first top surface is flush with the second top surface.

5. The display panel according to claim 2, characterized in that: The second encapsulation layer comprises a second encapsulation portion located on a side of each filter unit away from the substrate, and an orthographic projection of the second encapsulation portion on the substrate covers an orthographic projection of the filter unit on the substrate; Preferably, the second packaging part is in contact with a portion of the first packaging part; Preferably, the second packaging part is in contact and connected with the first packaging part located on a side of the isolation structure away from the substrate; Preferably, the material of the second encapsulation layer includes inorganic material.

6. The display panel according to claim 5, characterized in that: A plurality of the second packaging parts are arranged at intervals; Preferably, the orthographic projection of each of the second packaging parts on the substrate overlaps with the orthographic projection of each of the first packaging parts on the substrate.

7. The display panel according to claim 6, characterized in that: The display panel further includes a light shielding layer, the light shielding layer further includes a light shielding portion, and the light shielding portion is located on a side of the isolation structure away from the substrate; Preferably, the light shielding portion is located in a gap between adjacent second packaging portions; Preferably, the light shielding portion has a third top surface away from the substrate, the second packaging portion has a fourth top surface away from the substrate, the third top surface is located on a side of the fourth top surface facing the substrate, or the third top surface is flush with the fourth top surface; Preferably, the light shielding portion includes a first sub-light shielding portion and a second sub-light shielding portion, the first sub-light shielding portion is located between adjacent second packaging portions, and the second sub-light shielding portion fills a gap between the first packaging portion and the isolation structure; Preferably, the display panel further comprises a touch electrode layer located on a side of the second encapsulation layer away from the substrate.

8. The display panel according to claim 5, characterized in that: Also includes a third encapsulation layer, located on a side of the second encapsulation layer away from the substrate; Preferably, the material of the third encapsulation layer includes organic material; Preferably, it further comprises a fourth encapsulation layer, which is located on a side of the third encapsulation layer away from the substrate; Preferably, the material of the fourth encapsulation layer includes an inorganic material; Preferably, at least two of the first encapsulation layer, the second encapsulation layer and the fourth encapsulation layer are made of the same material.

9. The display panel according to claim 1, characterized in that: The isolation structure comprises a first sublayer and a second sublayer stacked in a direction away from the substrate, wherein an orthographic projection of the first sublayer on the substrate is located within an orthographic projection of the second sublayer on the substrate; Preferably, the material of the isolation structure includes a conductive material, a second electrode is provided between the light emitting unit and the filter unit, and the second electrode is electrically connected to the isolation structure; Preferably, it further comprises a pixel definition layer, the pixel definition layer comprises a pixel defining portion and a pixel opening, the orthographic projection of the pixel opening on the substrate and the orthographic projection of the isolation opening on the substrate at least partially overlap, and the light emitting unit is located at the pixel opening; Preferably, the isolation structure is located on a side of the pixel defining portion facing away from the substrate, or a clearance opening is provided on the pixel defining portion, and the isolation structure is located in the clearance opening.

10. A display panel, characterized in that: include: substrate; An isolation structure, disposed on the substrate and enclosing a plurality of isolation openings; A light-emitting layer, comprising light-emitting units located in each of the isolation openings; The first encapsulation layer includes a first encapsulation portion located on a side of the light emitting unit away from the substrate, The filter layer includes a filter unit located at the isolation opening and at the side of the first packaging part facing away from the substrate, the filter unit has a first top surface facing away from the substrate, the first packaging part has a second top surface facing away from the substrate, and the maximum distance from the first top surface to the substrate is less than or equal to the maximum distance from the second top surface to the substrate.

11. A method for preparing a display panel, characterized in that: include: Preparing an isolation structure on a substrate, wherein the isolation structure encloses a plurality of isolation openings; preparing a light-emitting unit in the isolation opening; A filter unit is prepared on a side of the light emitting unit in the isolation opening facing away from the substrate; A second encapsulation layer is prepared on a side of the filter unit facing away from the light-emitting unit.

12. The preparation method according to claim 11, characterized in that: The step of preparing the light-emitting unit in the isolation opening further includes: preparing the light-emitting unit in the isolation opening, and preparing a first packaging material layer on a side of the light-emitting unit away from the substrate, wherein the first packaging material layer covers the isolation structure and the light-emitting unit. The step of preparing a filter unit on a side of the light emitting unit away from the substrate in the isolation opening includes: preparing a filter layer on a side of the first packaging material layer away from the substrate, patterning the filter layer, and forming a filter unit in the isolation opening.

13. The preparation method according to claim 12, characterized in that: The step of preparing a second encapsulation layer on a side of the filter unit away from the light-emitting unit comprises: A second packaging material layer is prepared on a side of the filter layer facing away from the substrate, wherein the second packaging material layer is in contact with and connected to the first packaging material layer; The first encapsulation material layer and the second encapsulation material layer are patterned to form a first encapsulation portion and a second encapsulation portion.

14. The preparation method according to claim 13, characterized in that: The isolation opening includes a first isolation opening, a second isolation opening and a third isolation opening, the filter unit includes a first filter unit, a second filter unit and a third filter unit, the first packaging part includes a first sub-part, a second sub-part and a third sub-part, and the second packaging part includes a fourth sub-part, a fifth sub-part and a sixth sub-part; In the step of preparing the light-emitting unit in the isolation opening: A first light-emitting material layer is disposed on one side of the isolation structure and the substrate, and a portion of the first light-emitting material layer falls into the first isolation opening to form a first light-emitting unit; In the step of preparing a filter unit on a side of the first packaging material layer away from the substrate: preparing a first filter unit on a side of the first packaging material layer away from the substrate; In the step of patterning the first encapsulation material layer and the second encapsulation material layer to form a first encapsulation part and a second encapsulation part, the first encapsulation material layer and the second encapsulation material layer are patterned to form a first sub-part and a fourth sub-part located on the side of the first light-emitting unit away from the substrate, and the first light-emitting material layer not covered by the first sub-part and the fourth sub-part is removed.

15. The preparation method according to claim 14, characterized in that: Also includes: A second light-emitting material layer is disposed on one side of the isolation structure and the substrate, and a portion of the second light-emitting material layer falls into the second isolation opening to form a second light-emitting unit; A third packaging material layer is disposed on a side of the second light emitting material layer away from the substrate, A second filter unit is disposed on a side of the third packaging material layer away from the substrate, and the second filter unit is located at the second isolation opening; A fourth packaging material layer is disposed on a side of the second filter unit facing away from the substrate, and the fourth packaging material layer is in contact and connected with the third packaging material layer on a side of the isolation structure facing away from the substrate; Performing patterning on the third encapsulation material layer, the fourth encapsulation material layer and the second light-emitting material layer to form a second sub-portion and a fifth sub-portion located on a side of the second light-emitting unit away from the substrate, and removing the second light-emitting material layer not covered by the second sub-portion and the fifth sub-portion; Preferably, it also includes: A third light-emitting material layer is disposed on one side of the isolation structure and the substrate, and a portion of the third light-emitting material layer falls into the third isolation opening to form a third light-emitting unit; A fifth packaging material layer is disposed on a side of the third light emitting material layer away from the substrate, A third filter unit is arranged on a side of the third packaging material layer away from the substrate, and the third filter unit is located at the third exit; A sixth packaging material layer is disposed on a side of the third filter unit away from the substrate, and the sixth packaging material layer is in contact and connected with the fourth packaging material layer on a side of the isolation structure away from the substrate; The fourth packaging material layer, the sixth packaging material layer and the third light-emitting material layer are patterned to form a third sub-portion and a sixth sub-portion located on the side of the third light-emitting unit away from the substrate, and the third light-emitting material layer not covered by the third sub-portion and the sixth sub-portion is removed.

16. A display device, characterized in that: A display panel comprising the display panel according to any one of claims 1 to 10 or a display panel prepared by the preparation method according to any one of claims 11 to 15.

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