Display panel, preparation method thereof and display device

Abstract

The invention relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. The display panel is provided with a display area and a non-display area. The display panel comprises a substrate; a planarization layer on the substrate; the light-emitting structure is located on the planarization layer in the display area; the isolation structure covers the planarization layer located in the display area, the isolation structure comprises a first opening, a touch control structure and an isolation structure, the isolation structure surrounds to form the first opening, and the first opening exposes the light-emitting structure; and the protection layer at least covers the planarization layer in the non-display area. According to the display panel, the protective layer is formed on the planarization layer in the non-display area, so that the planarization layer below the protective layer does not absorb water, and the display effect of the display panel is improved. Moreover, the touch control structure and the isolation structure are arranged on the same layer, an insulating layer does not need to be arranged between the touch control structure and the isolation structure, and the thickness of the display panel can be further reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] In the related art, when preparing the light-emitting unit of the display panel, multiple etching processes are often involved, which causes part of the film layer of the display panel to absorb water during the etching process, thereby affecting the display effect of the display panel. Summary of the invention

[0003] Based on this, it is necessary to provide a display panel and a manufacturing method thereof, and a display device to address the problem that part of the film layer of the display panel in the prior art absorbs water during the etching process.

[0004] In order to achieve the above object, on the one hand, a display panel is provided, wherein the display panel has a display area and a non-display area, and the display panel includes:

[0005] substrate;

[0006] a planarization layer, located on the substrate;

[0007] an isolation structure, at least part of which is located on a side of the planarization layer in the display area away from the substrate, at least part of which is arranged to form a first opening, and at least part of which is arranged to form a second opening;

[0008] a light emitting structure, at least partially located in the first opening;

[0009] A touch structure, at least partially located in the second opening;

[0010] The protective layer is at least partially located on a side of the touch structure away from the substrate, and at least a portion of the protective layer's orthographic projection on the substrate overlaps with an orthographic projection of the planarization layer in the non-display area on the substrate.

[0011] In one embodiment, the isolation structure includes a first sub-isolation structure, and the first sub-isolation structure encloses and forms the first opening and the second opening;

[0012] The protective layer is disposed on a side of the first sub-isolation structure facing away from the substrate;

[0013] Optionally, the display panel further includes a first encapsulation layer, which is at least partially disposed in the first opening, the first encapsulation layer is located on a side of the light emitting structure away from the substrate, and at least a portion of the first encapsulation layer is located on a side of the first sub-isolation structure away from the substrate;

[0014] Optionally, there is a gap between the first encapsulation layer located on a side of the first sub-isolation structure away from the substrate and the protection layer located on a side of the first sub-isolation structure away from the substrate;

[0015] Optionally, there is an overlapping portion between the first encapsulation layer located on a side of the first sub-isolation structure away from the substrate and the protection layer located on a side of the first sub-isolation structure away from the substrate;

[0016] Optionally, the first encapsulation layer of the overlapping portion is located on a side of the protective layer facing away from the substrate;

[0017] Optionally, the material of the protective layer is consistent with the material of the first encapsulation layer;

[0018] Optionally, the isolation structure located in the second opening is reused as a touch control structure.

[0019] In one embodiment, the substrate comprises:

[0020] a wiring layer, the wiring layer being electrically connected to at least a portion of the light-emitting structure, and in the non-display area, the protective layer being located on a side of the wiring layer away from the substrate, an orthographic projection of the protective layer on the substrate and an orthographic projection of at least a portion of the wiring layer located in the non-display area on the substrate having an overlapping portion;

[0021] Optionally, the planarization layer includes a plurality of sub-layers, and at least some of the sub-layers are located on a side of the routing layer away from the substrate;

[0022] Optionally, in the non-display area, an orthographic projection of the protection layer on the substrate, an orthographic projection of the wiring layer on the substrate, and an orthographic projection of at least part of the sublayer located on a side of the wiring layer away from the substrate on the substrate have overlapping parts;

[0023] Optionally, the wiring layer extends from the display area to the non-display area;

[0024] Optionally, the material of the planarization layer includes an organic material, and the material of the protection layer includes an inorganic material.

[0025] In one embodiment, the display panel further includes:

[0026] A first electrode, located on a side of the planarization layer away from the substrate;

[0027] a pixel definition layer, located on a side of the first electrode away from the substrate, and having a pixel opening, the pixel opening being connected to the first opening, the pixel opening exposing at least a portion of the first electrode, and the protective layer in the second opening covering the pixel definition layer;

[0028] Optionally, the material of the pixel definition layer is consistent with the material of the protection layer.

[0029] In one embodiment, the protective layer extends from the display area to the non-display area;

[0030] Optionally, the isolation structure of the display area is located on a side of the protection layer facing away from the substrate.

[0031] In one embodiment, the display panel further includes:

[0032] A first electrode, located on a side of the planarization layer away from the substrate;

[0033] a pixel definition layer covering the first electrode, wherein the pixel definition layer has a pixel opening, the pixel opening is connected to the first opening and exposes at least a portion of the first electrode;

[0034] Optionally, the protective layer is located between the pixel definition layer and the first electrode;

[0035] Optionally, the protection layer is located between the pixel definition layer and the isolation structure.

[0036] In one embodiment, the non-display area includes a first non-display sub-area and a second non-display sub-area, the first non-display sub-area is located between the display area and the second non-display sub-area, and the protective layer at least covers the planarization layer located in the second non-display sub-area.

[0037] In one embodiment, the planarization layer includes a first planarization layer and a second planarization layer, the first planarization layer extends from the display area to the non-display area, the second planarization layer is located on a side of the first planarization layer in the second non-display sub-area away from the substrate, and the protective layer at least covers the second planarization layer located in the second non-display sub-area;

[0038] Optionally, the planarization layer includes a third planarization layer, the third planarization layer is located between the substrate and the first planarization layer, and in the second non-display sub-area, the first planarization layer covers the top surface and sidewalls of the third planarization layer;

[0039] Optionally, the second planarization layer covers the top surface and sidewalls of the first planarization layer;

[0040] Optionally, the protection layer covers the top surface and side walls of the second planarization layer;

[0041] Optionally, the protective layer also extends to the surface of the substrate.

[0042] In one embodiment, the first non-display sub-area includes a binding area, and the protective layer covers the planarization layer located in the first non-display sub-area outside the binding area;

[0043] Optionally, the binding area includes a first binding area and a second binding area, and the first binding area and the second binding area are used to connect to an external circuit.

[0044] In one aspect, a method for preparing a display panel is provided, wherein the display panel has a display area and a non-display area, and the method for preparing the display panel comprises:

[0045] providing a substrate;

[0046] forming a planarization layer on the substrate;

[0047] forming an isolation structure on the planarization layer in the display area, wherein at least a portion of the isolation structure surrounds a first opening;

[0048] forming a protective layer at least on the planarization layer in the non-display area, wherein at least a portion of the protective layer overlaps with the orthographic projection of the planarization layer in the non-display area on the substrate;

[0049] At least a portion of the light emitting structure is formed in the first opening.

[0050] In one embodiment, forming an isolation structure on the planarization layer in the display area includes:

[0051] forming a first sub-isolation structure on the planarization layer of the display area, wherein the first sub-isolation structure encloses the first opening and the second opening, and at least a portion of the isolation structure located in the second opening is configured as a touch control structure;

[0052] The forming of a protective layer on the planarization layer at least in the non-display area comprises:

[0053] forming the protection layer covering the first sub-isolation structure;

[0054] After forming the light emitting structure in the first opening, the method includes:

[0055] forming a first encapsulation layer at least partially located within the first opening;

[0056] Optionally, a material of the protection layer is consistent with a material of the first encapsulation layer.

[0057] In one embodiment, providing a substrate includes:

[0058] providing a substrate;

[0059] forming a wiring layer on the substrate, wherein the wiring layer is used to be electrically connected to at least a portion of the light-emitting structure;

[0060] The step of forming a planarization layer on the substrate comprises:

[0061] forming a planarization layer covering the routing layer;

[0062] Optionally, forming a wiring layer on the substrate includes:

[0063] A wiring layer is formed from the display area and extends to the non-display area.

[0064] In one embodiment, forming a protective layer on the planarization layer at least in the non-display area comprises:

[0065] A protection layer is formed on the planarization layer in the display area and the non-display area.

[0066] In one embodiment, after forming a planarization layer on the substrate, the method further comprises:

[0067] forming a first electrode on the planarization layer in the display area;

[0068] forming a pixel definition layer covering the first electrode, wherein the pixel definition layer has a pixel opening, and the pixel opening at least exposes a portion of the first electrode;

[0069] The forming of the protection layer covering the isolation structure comprises:

[0070] At least a protection layer is formed to cover the planarization layer in the non-display area, the pixel definition layer in the second opening, and a side of the isolation structure away from the substrate.

[0071] In one embodiment, the non-display area includes a first non-display sub-area and a second non-display sub-area, the first non-display sub-area is located between the display area and the second non-display sub-area,

[0072] The step of forming a protective layer on the planarization layer at least in the non-display area comprises:

[0073] forming at least the protective layer covering the second non-display sub-area;

[0074] Optionally, the step of forming at least the protective layer covering the second non-display sub-area comprises:

[0075] forming the protective layer covering the first non-display sub-area and the second non-display sub-area;

[0076] Optionally, the first non-display sub-area includes a binding area, the binding area is used to connect an external circuit, and the forming of the protection layer covering the binding area and the second non-display sub-area includes:

[0077] forming a protective material layer covering the first non-display sub-area and the second non-display sub-area;

[0078] The protective material layer located in the binding area is removed, and the remaining protective material layer forms a protective layer.

[0079] In one aspect, a method for preparing a display panel is provided, wherein the display panel has a display area and a non-display area, and the method for preparing the display panel comprises:

[0080] providing a substrate;

[0081] forming a planarization layer on the substrate;

[0082] forming a protective layer at least on the planarization layer in the non-display area, wherein at least a portion of the protective layer overlaps with the orthographic projection of the planarization layer in the non-display area on the substrate;

[0083] After forming the protection layer, forming an isolation structure on the planarization layer in the display area, at least a portion of the isolation structure surrounds a first opening;

[0084] At least a portion of the light emitting structure is formed in the first opening.

[0085] In one embodiment, after forming a planarization layer on the substrate, the method further comprises:

[0086] forming a first electrode on the planarization layer in the display area;

[0087] The step of forming a protective layer on the planarization layer at least in the non-display area comprises:

[0088] forming a protection layer covering the first electrode and the planarization layer, wherein the protection layer has a protection opening, and the protection opening exposes the first electrode;

[0089] After forming a protective layer on the planarization layer at least in the non-display area, the method comprises:

[0090] forming a pixel definition layer located on a side of the protection layer away from the substrate, wherein the pixel definition layer has a pixel opening, the pixel opening is connected to the protection opening and exposes the first electrode;

[0091] The isolation structure is formed on the planarization layer in the display area, comprising:

[0092] The isolation structure is formed on a side of the pixel definition layer away from the substrate.

[0093] In one embodiment, after forming a planarization layer on the substrate, the method further comprises:

[0094] forming a first electrode on the planarization layer in the display area;

[0095] forming a pixel definition layer covering the first electrode, wherein the pixel definition layer has a pixel opening, and the pixel opening exposes the first electrode;

[0096] The step of forming a protective layer on the planarization layer at least in the non-display area comprises:

[0097] forming a protection layer covering the pixel definition layer, wherein the protection layer has a plurality of protection openings, wherein the protection openings are connected to the pixel openings and expose the first electrode;

[0098] The isolation structure is formed on the planarization layer in the display area, comprising:

[0099] The isolation structure is formed on the protection layer.

[0100] In one aspect, a display device is provided, comprising the display panel described in any one of the aforementioned embodiments.

[0101] The display panel and its preparation method and display device of the present specification have the following beneficial effects: during the multiple wet etching processes required for the display panel, the display panel of the present specification forms a protective layer on the planarization layer in the non-display area, and the protective layer can prevent the planarization layer below it from absorbing water, thereby improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0102] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0103] Figure 1 is a schematic diagram of a display panel provided in an embodiment;

[0104] Figure 2 is a flow chart of a method for preparing a display panel provided in an embodiment;

[0105] Figure 3 is a cross-sectional view of a display panel provided in an embodiment;

[0106] Figure 4 is a schematic diagram of a non-display area provided in an embodiment;

[0107] Figure 5 is a cross-sectional view of a display panel provided in another embodiment;

[0108] Figure 6 is a cross-sectional view of a display panel provided in yet another embodiment;

[0109] Figure 7 A schematic diagram of a first binding area and a second binding area provided in another embodiment;

[0110] Figure 8 is a cross-sectional view of a display panel provided in yet another embodiment;

[0111] Fig. 9 It is a flow chart of a method for preparing a display panel provided in another embodiment.

[0112] Explanation of the reference numerals: display panel-100; display area-110; non-display area-120; second non-display sub-area-121; first non-display sub-area-122; first binding area-1221; second binding area-1222; substrate-130; substrate-131; wiring layer-132; planarization layer-140; partition structure-150; touch structure-151; isolation structure-152; top-153; support part-154; protection layer-160; light-emitting structure-170; first electrode-171; second electrode-172; functional layer-173; first encapsulation layer-180; pixel definition layer-190; first opening-200; second opening-210.

[0113] In order to better describe and illustrate the embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more drawings. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed inventions, the embodiments and / or examples currently described, and the best modes of these inventions currently understood. DETAILED DESCRIPTION

[0114] In order to facilitate understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thorough and comprehensive.

[0115] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure.

[0116] In each embodiment, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in each embodiment can be understood according to the specific situation.

[0117] It should be understood that when an element or layer is referred to as being "on, adjacent to, or connected to other elements or layers, it may be directly on, adjacent to, or connected to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, or directly connected to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present embodiment, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part.

[0118] Spatial relationship terms such as "under", "below", "below", "under", "above", "above", etc., may be used herein to describe the relationship between an element or feature shown in the figures and other elements or features. It should be understood that in addition to the orientations shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, the element or feature described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0119] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0120] Embodiments of the embodiments are described herein with reference to cross-sectional illustrations that are schematic representations of idealized embodiments (and intermediate structures) of the present specification, and variations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are anticipated. Thus, embodiments of the present embodiments should not be limited to the particular shapes of the regions illustrated herein, but are to include deviations in shapes due to, for example, manufacturing techniques. The regions shown in the figures are schematic in nature, and their shapes do not represent the actual shapes of the regions of the device and do not limit the scope of the present embodiments.

[0121] In one embodiment, see Figure 1 , a method for manufacturing a display panel 100 is provided, wherein the display panel 100 has a display area 110 and a non-display area 120. As an example, the non-display area 120 may surround the display area 110. This embodiment does not limit the specific area and distribution of the display area 110 and the non-display area 120. Please refer to Figure 2 , Figure 3 and Figure 4 , the method for preparing the display panel 100 comprises the following steps:

[0122] Step S100: providing a substrate 130 .

[0123] Step S200 : forming a planarization layer 140 on the substrate 130 .

[0124] Step S500 : forming an isolation structure 152 on the planarization layer 140 of the display area 110 , wherein at least a portion of the isolation structure 152 surrounds the first opening 200 .

[0125] Step S600 : forming a protective layer 160 on the planarization layer 140 at least in the non-display area 120 , wherein at least a portion of the orthographic projection of the protective layer 160 on the substrate 130 overlaps with the orthographic projection of the planarization layer 140 in the non-display area 120 on the substrate 130 .

[0126] Step S700 : forming at least a portion of the light emitting structure 170 in the first opening 200 .

[0127] In step S100, refer to Figure 3 and Figure 4 , the substrate 130 may include a packaging substrate, etc. As an example, the substrate 130 may include a multi-layer film layer.

[0128] In step S200 , the planarization layer 140 may be used to form a flat surface. For example, when forming the planarization layer 140 , the surface of the planarization layer 140 away from the substrate 130 may be flattened by mechanical grinding or the like, so that the planarization layer 140 has a flat surface.

[0129] A plurality of planarization layers 140 may be formed on the substrate 130. At this time, as an example, the material of at least one of the planarization layers 140 may include an organic material. Further, the material of the top planarization layer 140 may include an organic material.

[0130] In step S500, the isolation structure 152 can be used to form a structure such as the light emitting structure 170. As an example, the isolation structure 152 may include a plurality of conductive film layers. For example, the isolation structure 152 may include a titanium layer and an aluminum layer. Further, the isolation structure 152 may include a top 153 away from the substrate 130 and a support portion 154 close to the substrate 130. In one possible example, the orthographic projection of the top 153 on the substrate 130 may cover the orthographic projection of the support portion 154 on the substrate 130. In another possible example, the cross-sectional view of the top 153 and the support portion 154 may be a positive trapezoid.

[0131] The isolation structure 152 is surrounded by a plurality of first openings 200, and the first openings 200 expose the film layer below. The composition, preparation, etc. of the isolation structure 152 mentioned in this embodiment and the following embodiments are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A for reference.

[0132] In step S600, a protective layer 160 may be formed on at least the planarization layer 140 in the non-display area 120. As an example, the material of the protective layer 160 may include an inorganic material, such as but not limited to silicon oxide, silicon nitride, aluminum oxide, or silicon oxynitride.

[0133] In step S700, in one possible example, the light emitting structure 170 may include multiple colors. For example, the light emitting structure 170 may include a red light structure, a green light structure, and a blue light structure. In another possible example, the light emitting structure 170 may also include a single color. For example, the light emitting structure 170 may include a white light structure. It is understood that the light emitting structure 170 may also be provided with corresponding first electrodes 171 (anode), second electrodes 172 (cathode), and other structures. In addition, a functional layer 173 may be included below the light emitting structure 170. The functional layer 173 may include a transmission layer, etc.

[0134] The following is an exemplary description of the process of forming a light-emitting structure 170 of multiple colors in the first opening 200. The first opening 200 includes a red light opening, a green light opening, and a blue light opening, and the light-emitting structure 170 includes a red light structure formed in the red light opening, a green light structure formed in the green light opening, and a blue light structure formed in the blue light opening. First, after forming a first electrode 171 in each red light opening, green light opening, and blue light opening, a red light structure is formed on the first electrode 171 of each red light opening, green light opening, and blue light opening. Next, a first encapsulation layer 180 is formed on each red light structure and a second electrode 172 is evaporated. Subsequently, the cathode, the filling structure, and the red light structure in the green light opening and the blue light opening are removed. Further, in the process of removing the cathode, the filling structure, and the red light structure in the green light opening and the blue light opening, a wet etching method can be used. Thereafter, the above process is repeated to form a green light structure and a blue light structure in sequence.

[0135] It can be understood that in the above exemplary description, the display panel 100 needs to undergo multiple wet etchings. In this process, the present embodiment forms a protective layer 160 on the planarization layer 140 in the non-display area 120, so that the protective layer 160 can prevent the planarization layer 140 below from absorbing water, thereby improving the display effect of the display panel 100. Furthermore, the protective layer 160 is located in the non-display area 120, so that the protective layer 160 will not affect the light emitting effect of the light emitting structure 170.

[0136] In one embodiment, step S500 includes:

[0137] Step S510 : forming a first sub-isolation structure on the planarization layer 140 of the display area 110 , the first sub-isolation structure encloses the first opening 200 and the second opening 210 , and at least a portion of the isolation structure 152 in the second opening 210 is configured as a touch structure 151 .

[0138] Accordingly, step S600 includes:

[0139] Step S610: forming a protection layer 160 covering the first sub-isolation structure.

[0140] Accordingly, step S700 includes:

[0141] Step S800 : forming a first encapsulation layer 180 at least partially located in the first opening 200 .

[0142] In step S510, the first sub-isolation structure may be surrounded to form a plurality of first openings 200 and second openings 210, and the first openings 200 and the second openings 210 may expose the bottom film layer. The touch structure 151 may be located in the second opening 210. The touch structure 151 may be used to implement a touch function. For example, the touch structure 151 may include a touch electrode. When a human body part (e.g., a finger) is located above the touch electrode, the capacitance between the touch electrode and the ground may change. By monitoring the capacitance change, the meaning of the action performed by the human body part (e.g., a finger) may be determined.

[0143] At this time, both sides of the first opening 200 may be the isolation structure 152. As an example, when the material of the light emitting structure 170 is formed on the entire surface, the material of the light emitting structure 170 may be formed in the first opening 200 and on the sidewalls of the isolation structure 152.

[0144] The touch structure 151 and the isolation structure 152 can be formed simultaneously in one process step. In this case, at least a portion of the isolation structure 152 located in the second opening 210 is configured as the touch structure 151. In this case, the touch structure 151 and the isolation structure 152 can be arranged in the same layer, and the touch structure 151 and the isolation structure 152 can have the same structure. For example, the touch structure 151 and the isolation structure 152 can be arranged at intervals, and the touch structure 151 can be located between adjacent isolation structures 152. Of course, one, two, or more touch structures 151 can be provided between adjacent isolation structures 152.

[0145] In step S610, the protective layer 160 may be formed on the entire surface of the display panel 100. At this time, the protective layer 160 may be located not only in the non-display area 120 but also in the display area 110. The protective layer 160 not only reduces the encapsulation damage in the display area 110, but also improves the encapsulation reliability in the dam area and increases the product reliability of the display panel. This embodiment does not limit the specific position of the protective layer 160 in the multiple film layers of the display panel 100.

[0146] In step S800 , the first encapsulation layer 180 may not only cover the light emitting structure 170 , but also cover the film layer located in the first opening 200 .

[0147] The first encapsulation layer 180 and the protective layer 160 may overlap, or the first encapsulation layer 180 and the protective layer 160 may be spaced apart. In one example, the material of the protective layer 160 is consistent with the material of the first encapsulation layer 180. For example, the material of the protective layer 160 and the material of the first encapsulation layer 180 may both be inorganic materials. Figure 3 As shown, the first encapsulation layer 180 and the protective layer 160 may have overlapping portions. The first encapsulation layer 180 and the protective layer 160 are made of the same material and can be integrated into a whole, thereby protecting the underlying structure in its entirety. Figure 8 As shown, the first encapsulation layer 180 and the protective layer 160 may be spaced apart to leave a gap, thereby allowing a certain process deviation to exist when evaporating the first encapsulation layer 180 and the protective layer 160 .

[0148] In this embodiment, the touch structure 151 and the isolation structure 152 may be formed first, and then the protection layer 160 covering the touch structure 151 and the isolation structure 152 may be formed. The isolation structure 152 includes the touch structure 151 and the isolation structure 152, and the protection layer 160 may cover the touch structure 151 and the isolation structure 152 at the same time, or the protection layer 160 may cover either the touch structure 151 or the isolation structure 152. In this embodiment, the isolation structure 152 may be formed first, and then the protection layer 160 covering the isolation structure 152 may be formed, so that the protection layer 160 may protect the isolation structure 152 during multiple wet etchings. Moreover, the material of the protection layer 160 may be consistent with the material of the first encapsulation layer 180, and the protection layer 160 may be connected to the first encapsulation layer 180 and form a whole with the encapsulation layer 180, thereby preventing the first encapsulation layer 180 from being broken and reducing the risk of damage to the first encapsulation layer 180 and its bottom film layer. Moreover, in this embodiment, the touch structure 151 and the isolation structure 152 are arranged in the same layer, and no insulating layer is required between them. This embodiment can further reduce the thickness of the display panel 100.

[0149] In one embodiment, step S100 includes:

[0150] Step S110 : providing a substrate 131 .

[0151] Step S120 : forming a wiring layer 132 on the substrate 131 , wherein the wiring layer 132 is used to be electrically connected to at least a portion of the light emitting structure 170 .

[0152] Accordingly, step S200 includes:

[0153] Step S210 : forming a planarization layer 140 covering the wiring layer 132 .

[0154] In steps S110 to S120, a plurality of wiring layers 132 may be formed on the substrate 131. The wiring layers 132 may be electrically connected to the light emitting structure 170, the touch control structure 151, and the isolation structure 152. For example, five wiring layers 132 may be formed on the substrate 131, the bottom wiring layer 132 may include an array circuit or a touch control circuit, etc., and the middle wiring layer 132 may include a transistor, etc. The wiring layer 132 may extend from the display area 110 to the non-display area 120.

[0155] In step S210 , the planarization layer 140 covers the wiring layer 132 . The wiring layer 132 may extend from the display area 110 to the non-display area 120 . Accordingly, the planarization layer 140 may also extend from the display area 110 to the non-display area 120 .

[0156] In addition, it can be understood that the display panel can be provided with multiple layers of planarization layer 140. Among them, in the thickness direction of the display panel, part of the planarization layer 140 can be located on the side of the wiring layer 132 away from the substrate 130, and at least part of the planarization layer 140 can be located on the side of the wiring layer 132 close to the substrate 130. Further, the planarization layer 140 located on the side of the wiring layer 132 away from the substrate 130 can also be provided with multiple layers. This embodiment does not specifically limit the number of layers of the planarization layer 140.

[0157] At this time, in the non-display area 120, when the protective layer 160 is located on the side of the wiring layer 132 facing away from the substrate 130, the orthographic projection of the protective layer 160 on the substrate 130 overlaps with the orthographic projection of the wiring layer 132 located in the non-display area 120 on the substrate 130. Further, in the non-display area 120, the orthographic projection of the protective layer 160 on the substrate 130, the orthographic projection of the wiring layer 132 on the substrate 130, and the orthographic projection of the planarization layer 140 located on the side of the wiring layer 132 facing away from the substrate 130 overlap.

[0158] In this embodiment, by setting a protective layer 160 to cover the planarization layer 140, and the planarization layer 140 covers the wiring layer 132, the protective layer 160 can not only prevent the planarization layer 140 from absorbing water, but also, further, the protective layer 160 can prevent the wiring layer 132 from being corroded by etching liquid during multiple wet etchings, thereby further improving the display effect of the display panel 100.

[0159] In one embodiment, step S200 includes:

[0160] Step S300 : forming a first electrode 171 on the planarization layer 140 in the display area 110 .

[0161] Step S310 : forming a pixel definition layer 190 covering the first electrode 171 , wherein the pixel definition layer 190 has a pixel opening, and the pixel opening exposes the first electrode 171 .

[0162] Accordingly, step S60 includes:

[0163] Step S61 : forming a protection layer 160 that at least covers the planarization layer 140 in the non-display area 120 , the pixel definition layer 190 in the second opening 210 , and the side of the isolation structure 152 facing away from the substrate 130 .

[0164] In step S300 , the first electrode 171 may be an anode. A plurality of anodes arranged at intervals are formed on the planarization layer 140 in the display area 110 . The anodes may be electrically connected to the wiring layer 132 .

[0165] In step S310, the pixel definition layer 190 covers the first electrode 171, and the pixel opening of the pixel definition layer 190 exposes the first electrode 171. As an example, the material of the pixel definition layer 190 may include an organic material or an inorganic material. In the case where the material of the pixel definition layer 190 is an inorganic material, further, the pixel definition layer 190 may extend to the non-display area 120 to form a protective layer 160.

[0166] Accordingly, an isolation material layer may be formed on the pixel definition layer 190. The isolation material layer may include multiple conductive film layers. Then, as an example, a patterned photoresist layer may be formed on the isolation material layer. Based on the patterned photoresist layer, the isolation material layer is etched to form an isolation structure 152.

[0167] The first opening 200 penetrates the isolation structure 152, communicates with the pixel opening and exposes the first electrode 171. It can be understood that the first opening 200 is arranged corresponding to the first electrode 171. The isolation structure 152 also has a second opening 210, and the second opening 210 exposes the pixel definition layer 190. As an example, in the cross-sectional view of the isolation structure 152, the touch structure 151 can be located between adjacent isolation structures 152. At this time, one side of the second opening 210 can be the touch structure 151, and the other side can be the isolation structure 152.

[0168] In step S611 , the protection layer 160 not only covers the planarization layer 140 and the top surface of the isolation structure 152 in the non-display area 120 , but also covers the pixel definition layer 190 at the bottom of the second opening 210 .

[0169] In this example, when the material of the pixel definition layer 190 is an inorganic material, the material of the pixel definition layer 190 can be consistent with the material of the protective layer 160. In this case, the protective layer 160 can form an integral body with the pixel definition layer 190, thereby preventing the pixel definition layer 190 from being broken. When the material of the pixel definition layer 190 is an organic material, the pixel definition layer 190 may absorb water during multiple wet etchings, and the protective layer 160 can prevent the pixel definition layer 190 from absorbing water, thereby protecting the pixel definition layer 190 and the film layer thereunder.

[0170] In one embodiment, the non-display area 120 includes a first non-display sub-area 122 and a second non-display sub-area 121, and the first non-display sub-area 122 is located between the display area 110 and the second non-display sub-area 121. The first non-display sub-area 122 can be used for welding the display panel 100. At this time, step S600 includes:

[0171] Step S630 : forming a protection layer 160 at least covering the second non-display sub-region 121 .

[0172] The second non-display sub-region 121 may be a bending or folding region of the display panel 100. The protective layer 160 may only cover the second non-display sub-region 121, thereby preventing the film layer of the second non-display sub-region 121 from swelling and deforming due to water absorption.

[0173] In addition, the protective layer 160 may also cover the first non-display sub-area 122. Figure 7 , exemplarily, the first non-display sub-area 122 includes a binding area. The binding area may include a first binding area 1221 and a second binding area 1222. The first binding area 1221 and the second binding area 1222 are used to connect to an external circuit. The first binding area 1221 (Flexible On Plastic, FOP) is used to connect a flexible circuit board, and the second binding area 1222 (Chip On Plastic, COP) is used to connect an external chip. The protective layer 160 may cover the area outside the first binding area 1221 and the second binding area 1222 in the first non-display sub-area 122. For example, step S630 includes:

[0174] Step S631 : forming a protective material layer covering the first non-display sub-region 122 and the second non-display sub-region 121 .

[0175] Step S632 : removing at least a portion of the protective material layer located in the binding area, and the remaining protective material layer forms a protective layer 160 .

[0176] In step S631 to step S632, a protective material layer may be formed on the entire surface, and then photolithography is used to remove the protective material layer located in the binding area (for example, remove the protective material layer located in the first binding area 1221 and the second binding area 1222) to expose the binding area (for example, expose the first binding area 1221 and the second binding area 1222).

[0177] In this embodiment, the first binding area 1221 and the second binding area 1222 continue to connect to the flexible circuit board or the external chip. At the same time, the protective layer 160 covers other areas and absorbs water during multiple wet etchings. The protective layer 160 can prevent the planarization layer 140 and other film layers from absorbing water.

[0178] Based on the same inventive concept, in one embodiment, a method for manufacturing a display panel is provided. The display panel 100 has a display area 110 and a non-display area 120. As an example, the non-display area 120 may surround the display area 110. This embodiment does not limit the specific area and distribution of the display area 110 and the non-display area 120. Please refer to Fig. 9 , the method for preparing the display panel 100 comprises the following steps:

[0179] Step S10: providing a substrate 130 .

[0180] Step S20 : ​​forming a planarization layer 140 on the substrate 130 .

[0181] Step S30 : forming a protective layer 160 on the planarization layer 140 at least in the non-display area 120 , wherein at least a portion of the orthographic projection of the protective layer 160 on the substrate 130 overlaps with the orthographic projection of the planarization layer 140 in the non-display area 120 on the substrate 130 .

[0182] Step S60 : After forming the protection layer 160 , an isolation structure 152 is formed on the planarization layer 140 of the display area 110 , and at least a portion of the isolation structure 152 surrounds the first opening 200 .

[0183] Step S70 : forming at least a portion of the light emitting structure 170 in the first opening 200 .

[0184] In step S10, the substrate 130 may include a package substrate 130, etc. As an example, the substrate 130 may include a plurality of film layers.

[0185] In step S20, the planarization layer 140 may be used to form a flat surface. For example, when forming the planarization layer 140, the surface of the planarization layer 140 away from the substrate 130 may be flattened by mechanical grinding or the like, so that the planarization layer 140 has a flat surface.

[0186] A plurality of planarization layers 140 may be formed on the substrate 130. At this time, as an example, the material of at least one of the planarization layers 140 may include an organic material. Further, the material of the top planarization layer 140 may include an organic material.

[0187] In step S30, a protective layer 160 is formed on the planarization layer 140 at least in the non-display area 120. The orthographic projection of at least part of the protective layer 160 on the substrate 130 overlaps with the orthographic projection of the planarization layer 140 in the non-display area 120 on the substrate 130, that is, in the thickness direction of the display panel 100, the protective layer 160 covers the planarization layer 140. As an example, the material of the planarization layer 140 may include an organic material, and the material of the protective layer 160 may include an inorganic material. For example, the inorganic material may include, but is not limited to, silicon oxide, silicon nitride, aluminum oxide, or silicon oxynitride.

[0188] In addition, the protective layer 160 may be deposited on the entire surface. It is understood that the protective layer 160 may also be located in the display area 110 .

[0189] In step S60, the isolation structure 152 can be used to form a structure such as the light emitting structure 170. As an example, the isolation structure 152 may include a plurality of conductive film layers. For example, the isolation structure 152 may include a titanium layer and an aluminum layer. Further, the isolation structure 152 may include a top 153 away from the substrate 130 and a support portion 154 close to the substrate 130. In one possible example, the orthographic projection of the top 153 on the substrate 130 may cover the orthographic projection of the support portion 154 on the substrate 130. In another possible example, the cross-sectional view of the top 153 and the support portion 154 may be a positive trapezoid.

[0190] At least a portion of the isolation structure 152 is surrounded to form a first opening 200 , and further, at least a portion of the isolation structure 152 is surrounded to form a second opening 210 . The second opening 210 can be used to form a touch control structure 151 .

[0191] In step S70, in one possible example, the light emitting structure 170 may include multiple colors. For example, the light emitting structure 170 may include a red light structure, a green light structure, and a blue light structure. In another possible example, the light emitting structure 170 may also include a single color. For example, the light emitting structure 170 may include a white light structure. It is understood that the light emitting structure 170 may also be provided with corresponding first electrodes 171 (anode), second electrodes 172 (cathode), and other structures. In addition, a functional layer 173 may be included below the light emitting structure 170. The functional layer 173 may include a transmission layer, etc.

[0192] It can be understood that in the above-mentioned multiple embodiments and combinations thereof in the present application, it can be known that the display panel 100 needs to undergo multiple wet etchings. In this process, the present embodiment forms a protective layer 160 on the planarization layer 140 in the non-display area 120, and the protective layer 160 can prevent the planarization layer 140 therebelow from absorbing water, thereby improving the display effect of the display panel 100. Moreover, in the present embodiment, the touch structure 151 and the isolation structure 152 are arranged in the same layer, and there is no need to arrange an insulating layer between the two. The present embodiment can further reduce the thickness of the display panel 100. Furthermore, the protective layer 160 is located in the non-display area 120, so that the protective layer 160 will not affect the light emitting effect of the light emitting structure 170.

[0193] In one embodiment, see Figure 5 , after step S20, the following steps are included:

[0194] Step S41 : forming a first electrode 171 on the planarization layer 140 in the display area 110 .

[0195] Accordingly, step S30 includes:

[0196] Step S31 : forming a protection layer 160 covering the planarization layer 140 and the first electrode 171 , wherein the protection layer 160 has a plurality of protection openings, and the protection openings expose the first electrode 171 .

[0197] After step S30, the following steps are included:

[0198] Step S50 : forming a pixel definition layer 190 on a side of the protection layer 160 away from the substrate 130 . The pixel definition layer 190 has a pixel opening, which is connected to the protection opening and exposes the first electrode 171 .

[0199] Step S60 includes:

[0200] Step S61 : forming an isolation structure 152 on a side of the pixel definition layer 190 away from the substrate 130 .

[0201] In step S41 , the first electrode 171 may be an anode. A plurality of anodes arranged at intervals are formed on the planarization layer 140 in the display area 110 . The anode may be electrically connected to the wiring layer 132 .

[0202] In step S31, as an example, a protective material layer covering the planarization layer 140 and the first electrode 171 can be formed on the entire surface, and then a patterned photoresist layer can be formed on the protective material layer. Based on the patterned photoresist layer, the protective material layer is etched to form a protective layer 160. The protective opening exposes the first electrode 171. It can be understood that the protective opening and the first electrode 171 are set accordingly. At this time, the orthographic projection of the protective opening on the substrate 130 overlaps at least partially with the orthographic projection of the first electrode 171 on the substrate 130.

[0203] In step S50, a pixel definition layer 190 is formed to cover the protection layer 160. At this time, the protection opening and the pixel opening are connected, and the first electrode 171 is exposed. As an example, the material of the pixel definition layer 190 can be the same as that of the protection layer 160.

[0204] In step S61 , after forming the protection layer 160 , the isolation structure 152 is formed on the side of the pixel definition layer 190 away from the substrate 130 . At this time, the second opening 210 may expose the pixel definition layer 190 .

[0205] In this embodiment, by first forming the protective layer 160 and then forming the pixel definition layer 190, the first electrode 171 can be protected from damage by the etching liquid during multiple wet etchings. Moreover, in this example, a protective opening can be formed first to more accurately expose the first electrode 171. In addition, in this embodiment, a protective material layer and a pixel definition material layer can also be formed in sequence, and a protective opening and a pixel opening can be formed simultaneously in one etching process, thereby saving process steps and improving the manufacturing efficiency of the display panel 100.

[0206] Of course, see Figure 6 In one embodiment, step S20 includes:

[0207] Step S42 : forming a first electrode 171 on the planarization layer 140 in the display area 110 .

[0208] Step S52 : forming a pixel definition layer 190 covering the first electrode 171 , wherein the pixel definition layer 190 has a pixel opening, and the pixel opening exposes the first electrode 171 .

[0209] Accordingly, step S30 includes:

[0210] Step S32 : forming a protection layer 160 covering the pixel definition layer 190 , wherein the protection layer 160 has a plurality of protection openings, and the protection openings are connected to the pixel openings and expose the first electrodes 171 .

[0211] Step S60 includes:

[0212] Step S62 : forming an isolation structure 152 on the protection layer 160 .

[0213] In step S42 to step S62, the pixel definition layer 190 may be formed first and then the protection layer 160, and then the isolation structure 152 may be formed on the protection layer 160. The isolation structure 152 may also be etched, and the protection layer 160 may protect the pixel definition layer 190 during this process.

[0214] It should be understood that although Figure 2 and Fig. 9 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 2 and Fig. 9 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

[0215] Based on the same invention concept, please continue to refer to Figures 3 to 6 In one embodiment, a display panel 100 is provided. The display panel 100 has a display area 110 and a non-display area 120. The display panel 100 includes a substrate 130, a planarization layer 140, a light emitting structure 170, a partition structure 150 and a protective layer 160.

[0216] The substrate 130 may include a package substrate 130 . As an example, the substrate 130 may include a plurality of film layers. A wiring layer 132 may be formed on the substrate 130 . The wiring layer 132 may be electrically connected to at least the light emitting structure 170 . The wiring layer 132 extends from the display area 110 to the non-display area 120 .

[0217] The planarization layer 140 covers the wiring layer 132 to form a flat surface. As an example, the material of the planarization layer 140 includes an organic material.

[0218] The partition structure 150 may include a touch structure 151 and an isolation structure 152. Among them, the isolation structure 152 is at least partially located on the side of the planarization layer 140 in the display area 110 away from the substrate 130, at least part of the isolation structure 152 is surrounded to form a first opening 200, and at least part of the isolation structure 152 is surrounded to form a second opening 210. The touch structure 151 can be used to implement a touch function. For example, the touch structure 151 may include a touch electrode. Further, the touch structure 151 and the isolation structure 152 may be arranged in the same layer, and the touch structure 151 and the isolation structure 152 may have the same structure. For example, the touch structure 151 and the isolation structure 152 may be arranged at intervals, and the touch structure 151 may be located in the middle of adjacent isolation structures 152. Of course, one, two or more touch structures 151 may be provided in the middle of adjacent isolation structures 152.

[0219] The light emitting structure 170 may be at least partially located within the first opening 200. In one possible example, the light emitting structure 170 may include multiple colors. For example, the light emitting structure 170 may include a red light structure, a green light structure, and a blue light structure. In another possible example, the light emitting structure 170 may also include a single color. For example, the light emitting structure 170 may include a white light structure.

[0220] The protective layer 160 is at least partially located on the side of the touch structure 151 away from the substrate 130, and at least a portion of the orthographic projection of the protective layer 160 on the substrate 130 overlaps with the orthographic projection of the planarization layer 140 in the non-display area 120 on the substrate 130. As an example, the material of the protective layer 160 may include an inorganic material.

[0221] In this embodiment, when forming the light emitting structure 170, multiple wet etchings may be involved. At this time, the protective layer 160 can prevent the planarization layer 140 below it from absorbing water, thereby improving the display effect of the display panel 100. Moreover, in this embodiment, the touch structure 151 and the isolation structure 152 are arranged in the same layer, and there is no need to arrange an insulating layer between the two. This embodiment can further reduce the thickness of the display panel 100. In addition, when the wiring layer 132 extends from the display area 110 to the non-display area 120, this embodiment reduces the probability of the wiring layer 132 being corroded by controlling the planarization layer 140 not to absorb water.

[0222] In one embodiment, the isolation structure 152 includes a first sub-isolation structure, which encloses a first opening 200 and a second opening 210 . A protection layer 160 is disposed on a side of the first sub-isolation structure facing away from the substrate 130 .

[0223] As an example, two first sub-isolation structures may be located on both sides of the touch structure 151. When forming the first sub-isolation structure and the touch structure 151, the isolation structure located in the second opening is reused as the touch structure 151. At this time, the touch structure 151 may have the same morphological features as the first sub-isolation structure.

[0224] In one example, the display panel further includes a first encapsulation layer 180, and the first encapsulation layer 180 is at least partially disposed in the first opening. The first encapsulation layer 180 is located on a side of the light emitting structure away from the substrate, and at least a portion of the first encapsulation layer 180 is located on a side of the first sub-isolation structure away from the substrate. Figure 8 There is a gap between the first encapsulation layer 180 located on the side of the first sub-isolation structure away from the substrate and the protective layer located on the side of the first sub-isolation structure away from the substrate. Alternatively, see Figure 3 There is an overlapping portion between the first encapsulation layer 180 located on the side of the first sub-isolation structure facing away from the substrate and the protective layer located on the side of the first sub-isolation structure facing away from the substrate, and the first encapsulation layer 180 of the overlapping portion is located on the side of the protective layer facing away from the substrate. It can be understood that when the material of the protective layer 160 is consistent with the material of the first encapsulation layer 180, there may be an overlapping portion between the first encapsulation layer 180 and the protective layer 160, so that the first encapsulation layer 180 and the protective layer 160 can be better integrated into a whole to better protect the structure underneath. Alternatively, the first encapsulation layer 180 and the protective layer 160 can be spaced apart to leave a gap, thereby allowing a certain process deviation to occur when evaporating the first encapsulation layer 180 and the protective layer 160.

[0225] In addition, the display panel further includes a second encapsulation layer, which may be located on a side of the first encapsulation layer 180 , the protective layer 160 and other structures away from the substrate 130 .

[0226] In one embodiment, the substrate 130 includes a routing layer 132 .

[0227] The wiring layer 132 extends from the display area to the non-display area and is electrically connected to at least a portion of the light emitting structure 170. In the non-display area 120, when the protective layer 160 is located on the side of the wiring layer 132 away from the substrate 130, the orthographic projection of the protective layer 160 on the substrate 130 overlaps with the orthographic projection of the wiring layer 132 located in the non-display area 120 on the substrate 130. At this time, in the thickness direction of the display panel 100, the wiring layer 132, at least a portion of the planarization layer 140, and the protective layer 160 are arranged in this way.

[0228] Further, the planarization layer 140 includes a plurality of sub-layers, at least some of which are located on the side of the wiring layer 132 away from the substrate 130. At the same time, at least some of the sub-layers can also be located on the side of the wiring layer 132 close to the side away from the substrate 130. In the non-display area 120, the orthographic projection of the protective layer 160 on the substrate 130, the orthographic projection of the wiring layer 132 on the substrate 130, and the orthographic projection of at least some of the sub-layers on the substrate 130 have overlapping parts. In the first example, the planarization layer 140 may include a first planarization layer and a second planarization layer stacked in sequence. The first planarization layer extends from the display area 110 to the non-display area 120, the second planarization layer is located in the second non-display sub-area 121 on the side of the first planarization layer away from the substrate 130, and the protective layer 160 at least covers the second planarization layer located in the second non-display sub-area 121. In the second example, the planarization layer 140 includes a third planarization layer, and the third planarization layer is located between the substrate 130 and the first planarization layer. In the second non-display sub-area 121, the first planarization layer covers the top surface and side walls of the third planarization layer. In the third example, the second planarization layer covers the top surface and side walls of the first planarization layer. In the fourth example, the protective layer 160 covers the top surface and side walls of the second planarization layer, and further, the protective layer 160 can also extend to the substrate 130. In the above multiple examples, by covering the top surface and side walls of the adjacent planarization layer, the film layer below it is more completely protected. Moreover, the protective layer 160 extends to the substrate 130 and can also be fused with other film layers on the substrate 130, thereby protecting multiple film layers or structures thereunder.

[0229] In this embodiment, the material of the planarization layer 140 includes an organic material, and the material of the protection layer 160 includes an inorganic material. The planarization layer 140 is easy to absorb water during the aforementioned multiple wet etching processes, and the protection layer 160 can prevent this from happening, thereby preventing water vapor from invading the wiring layer 132, thereby preventing the wiring layer 132 from being corroded.

[0230] In one embodiment, the display panel 100 further includes a first electrode 171 and a pixel definition layer 190. The first electrode 171 is located on the planarization layer 140. For example, the first electrode 171 may be an anode. The pixel definition layer 190 covers the first electrode 171, and the pixel definition layer 190 has a pixel opening, which is connected to the first opening 200 and exposes the first electrode 171. At this time, the protective layer 160 in the display area 110 also covers the pixel definition layer 190. Specifically, the display panel 100 further includes a second opening 210, the bottom of the second opening 210 exposes the pixel definition layer 190, and the protective layer 160 covers the pixel definition layer 190 located at the bottom of the second opening 210. The material of the pixel definition layer 190 may be consistent with the material of the protective layer 160. At this time, the protective layer 160 may form a whole with the pixel definition layer 190, thereby preventing the pixel definition layer 190 from being broken. When the material of the pixel definition layer 190 is an organic material, the pixel definition layer 190 may absorb water during multiple wet etchings. The protection layer 160 can prevent the pixel definition layer 190 from absorbing water, thereby protecting the pixel definition layer 190 and the film layer thereunder.

[0231] In another possible example, the protective layer 160 may be located between the pixel definition layer 190 and the first electrode 171, and the protective layer 160 has a protective opening, which is connected to the first opening 200. In this case, the protective layer 160 may protect the first electrode 171 from being damaged by the etching liquid during multiple wet etchings.

[0232] Of course, see Figure 6 Alternatively, the protective layer 160 may be located between the pixel definition layer 190 and the partition structure 150. When forming the partition structure 150, etching is also required. At this time, the protective layer 160 can protect the pixel definition layer 190 during this process.

[0233] In one embodiment, the non-display area 120 includes a first non-display sub-area 122 and a second non-display sub-area 121, the first non-display sub-area 122 is located between the display area 110 and the second non-display sub-area 121, and the protective layer 160 covers at least the planarization layer 140 located in the second non-display sub-area 121. The first non-display sub-area 122 may include a binding area, and the binding area is used for welding the display panel 100. The second non-display sub-area 121 may be a bending or folding area of ​​the display panel 100. The protective layer 160 may only cover the second non-display sub-area 121, so as to prevent the film layer of the second non-display sub-area 121 from swelling and deforming due to water absorption.

[0234] For further information, see Figure 7The binding area includes a first binding area 1221 and a second binding area 1222. The first binding area 1221 and the second binding area 1222 are used to connect to an external circuit. For example, the first binding area 1221 (Flexible On Plastic, FOP) is used to connect to a flexible circuit board, and the second binding area 1222 (Chip On Plastic, COP) is used to connect to an external chip. The protective layer 160 covers the planarization layer 140 located in the first non-display sub-area 122 outside the first binding area 1221 and the second binding area 1222.

[0235] In this embodiment, the protective layer 160 can cover other areas except the first binding area 1221 and the second binding area 1222. During the multiple wet etchings, the protective layer 160 can prevent the planarization layer 140 and other film layers from absorbing water. The protective layer 160 exposes the first binding area 1221 and the second binding area 1222, so that the protective layer 160 does not affect the connection of the first binding area 1221 and the second binding area 1222 to the external circuit.

[0236] Based on the same inventive concept, a display device is provided, which may include the display panel 100 provided in any one of the foregoing embodiments or a combination of multiple embodiments.

[0237] It can be understood that the display device in the embodiments of the present application can be an OLED display device, a QLED display device, electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a wearable device, an Internet of Things device, or any other product or component with a display function, and the embodiments disclosed in the present application are not limited to this.

[0238] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that "this embodiment" or "one embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present disclosure. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification may not necessarily refer to the same embodiment.

[0239] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0240] The embodiments described above only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all fall within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the attached claims. The above description is only a preferred implementation method of the present disclosure, and does not limit the scope of the patent of the present disclosure. All equivalent structural transformations made by using the contents of the present disclosure specification and drawings under the inventive concept of the present disclosure, or direct / indirect application in other related technical fields are included in the scope of protection of the patent of the present disclosure.

Claims

1. A display panel, characterized in that: The display panel has a display area and a non-display area, and the display panel includes: substrate; a planarization layer, located on the substrate; an isolation structure, at least part of which is located on a side of the planarization layer in the display area away from the substrate, at least part of which is arranged to form a first opening, and at least part of which is arranged to form a second opening; a light emitting structure, at least partially located in the first opening; A touch structure, at least partially located in the second opening; The protective layer is at least partially located on a side of the touch structure away from the substrate, and at least a portion of the protective layer's orthographic projection on the substrate overlaps with an orthographic projection of the planarization layer in the non-display area on the substrate.

2. The display panel according to claim 1, characterized in that: The isolation structure includes a first sub-isolation structure, and the first sub-isolation structure encloses and forms the first opening and the second opening; The protective layer is disposed on a side of the first sub-isolation structure facing away from the substrate; Optionally, the display panel further includes a first encapsulation layer, which is at least partially disposed in the first opening, the first encapsulation layer is located on a side of the light emitting structure away from the substrate, and at least a portion of the first encapsulation layer is located on a side of the first sub-isolation structure away from the substrate; Optionally, there is a gap between the first encapsulation layer located on a side of the first sub-isolation structure away from the substrate and the protection layer located on a side of the first sub-isolation structure away from the substrate; Optionally, there is an overlapping portion between the first encapsulation layer located on a side of the first sub-isolation structure away from the substrate and the protection layer located on a side of the first sub-isolation structure away from the substrate; Optionally, the first encapsulation layer of the overlapping portion is located on a side of the protective layer facing away from the substrate; Optionally, the material of the protective layer is consistent with the material of the first encapsulation layer; Optionally, the isolation structure located in the second opening is reused as the touch control structure.

3. The display panel according to claim 1, characterized in that: The substrate comprises: a wiring layer, the wiring layer being electrically connected to at least a portion of the light-emitting structure, and in the non-display area, the protective layer being located on a side of the wiring layer away from the substrate, an orthographic projection of the protective layer on the substrate and an orthographic projection of at least a portion of the wiring layer located in the non-display area on the substrate having an overlapping portion; Optionally, the planarization layer includes a plurality of sub-layers, and at least some of the sub-layers are located on a side of the routing layer away from the substrate; Optionally, in the non-display area, an orthographic projection of the protection layer on the substrate, an orthographic projection of the wiring layer on the substrate, and an orthographic projection of at least part of the sublayer located on a side of the wiring layer away from the substrate on the substrate have overlapping parts; Optionally, the wiring layer extends from the display area to the non-display area; Optionally, the material of the planarization layer includes an organic material, and the material of the protection layer includes an inorganic material.

4. The display panel according to claim 1, characterized in that: The display panel further includes: A first electrode, located on a side of the planarization layer away from the substrate; a pixel definition layer, located on a side of the first electrode away from the substrate, and having a pixel opening, the pixel opening being connected to the first opening, the pixel opening exposing at least a portion of the first electrode, and the protective layer in the second opening covering the pixel definition layer; Optionally, the material of the pixel definition layer is consistent with the material of the protection layer.

5. The display panel according to claim 1, characterized in that: The protective layer extends from the display area to the non-display area; Optionally, the isolation structure of the display area is located on a side of the protection layer facing away from the substrate.

6. The display panel according to claim 5, characterized in that: The display panel further includes: A first electrode, located on a side of the planarization layer away from the substrate; a pixel definition layer covering the first electrode, wherein the pixel definition layer has a pixel opening, the pixel opening is connected to the first opening and exposes at least a portion of the first electrode; Optionally, the protective layer is located between the pixel definition layer and the first electrode; Optionally, the protection layer is located between the pixel definition layer and the isolation structure; Optionally, the protective layer includes a protective opening, and at least a portion of the first electrode is exposed in the protective opening; Optionally, the protection opening is communicated with the pixel opening.

7. The display panel according to claim 1, characterized in that: The non-display area includes a first non-display sub-area and a second non-display sub-area, the first non-display sub-area is located between the display area and the second non-display sub-area, and the protection layer at least covers the planarization layer located in the second non-display sub-area.

8. The display panel according to claim 7, characterized in that: The planarization layer comprises a first planarization layer and a second planarization layer, the first planarization layer extends from the display area to the non-display area, the second planarization layer is located on a side of the first planarization layer in the second non-display sub-area away from the substrate, and the protective layer at least covers the second planarization layer in the second non-display sub-area; Optionally, the planarization layer includes a third planarization layer, the third planarization layer is located between the substrate and the first planarization layer, and in the second non-display sub-area, the first planarization layer covers the top surface and sidewalls of the third planarization layer; Optionally, the second planarization layer covers the top surface and sidewalls of the first planarization layer; Optionally, the protection layer covers the top surface and side walls of the second planarization layer; Optionally, the protective layer also extends to the surface of the substrate.

9. The display panel according to claim 7, characterized in that: The first non-display sub-area includes a binding area, and the protective layer covers the planarization layer outside the binding area; Optionally, the first non-display sub-area includes a first binding structure and a second binding structure, and the first binding structure and the second binding structure are used to connect to an external circuit.

10. A method for preparing a display panel, characterized in that: The display panel has a display area and a non-display area. The method for preparing the display panel includes: providing a substrate; forming a planarization layer on the substrate; forming an isolation structure on the planarization layer in the display area, wherein at least a portion of the isolation structure surrounds a first opening; forming a protective layer at least on the planarization layer in the non-display area, wherein at least a portion of the protective layer overlaps with the orthographic projection of the planarization layer in the non-display area on the substrate; At least a portion of the light emitting structure is formed in the first opening.

11. The method for preparing a display panel according to claim 10, characterized in that: The isolation structure is formed on the planarization layer in the display area, comprising: forming a first sub-isolation structure on the planarization layer of the display area, wherein the first sub-isolation structure encloses the first opening and the second opening, and at least a portion of the isolation structure located in the second opening is configured as a touch control structure; The forming of a protective layer on the planarization layer at least in the non-display area comprises: forming the protection layer covering the first sub-isolation structure; After forming the light emitting structure in the first opening, the method includes: forming a first encapsulation layer at least partially located within the first opening; Optionally, a material of the protection layer is consistent with a material of the first encapsulation layer.

12. The method for preparing a display panel according to claim 10, characterized in that: The providing of the substrate comprises: providing a substrate; forming a wiring layer on the substrate, wherein the wiring layer is used to be electrically connected to at least a portion of the light-emitting structure; The step of forming a planarization layer on the substrate comprises: forming a planarization layer covering the routing layer; Optionally, forming a wiring layer on the substrate includes: A wiring layer is formed extending from the display area to the non-display area.

13. The method for preparing a display panel according to claim 12, characterized in that: After forming a planarization layer on the substrate, the method further comprises: forming a first electrode on the planarization layer in the display area; forming a pixel definition layer covering the first electrode, wherein the pixel definition layer has a pixel opening, and the pixel opening at least exposes a portion of the first electrode; The forming of the protection layer covering the isolation structure comprises: At least the planarization layer covering the non-display area, the pixel definition layer in the second opening surrounded by at least a portion of the isolation structure, and a protection layer on a side of the isolation structure away from the substrate are formed.

14. The method for preparing a display panel according to claim 10, characterized in that: The non-display area includes a first non-display sub-area and a second non-display sub-area, wherein the first non-display sub-area is located between the display area and the second non-display sub-area. The step of forming a protective layer on the planarization layer at least in the non-display area comprises: forming at least the protective layer covering the second non-display sub-area; Optionally, the step of forming at least the protective layer covering the second non-display sub-area comprises: forming the protective layer covering the first non-display sub-area and the second non-display sub-area; Optionally, the first non-display sub-area includes a binding area, the binding area is used to connect an external circuit, and the forming of the protection layer covering the binding area and the second non-display sub-area includes: forming a protective material layer covering the first non-display sub-area and the second non-display sub-area; removing at least a portion of the protective material layer located in the binding area, and the remaining protective material layer forms a protective layer; Optionally, forming a planarization layer on the substrate includes: forming a first planarization layer extending from the display area to the non-display area; forming a second planarization layer of the first planarization layer located in the second non-display sub-area; The step of forming at least the protective layer covering the second non-display sub-area comprises: The protection layer is formed to at least cover the second planarization layer located in the second non-display sub-area.

15. A method for preparing a display panel, characterized in that: The display panel has a display area and a non-display area. The method for preparing the display panel includes: providing a substrate; forming a planarization layer on the substrate; forming a protective layer at least on the planarization layer in the non-display area, wherein at least a portion of the protective layer overlaps with the orthographic projection of the planarization layer in the non-display area on the substrate; After forming the protection layer, forming an isolation structure on the planarization layer in the display area, at least a portion of the isolation structure surrounds a first opening; At least a portion of the light emitting structure is formed in the first opening.

16. The method for preparing a display panel according to claim 15, characterized in that: After forming a planarization layer on the substrate, the method further comprises: forming a first electrode on the planarization layer in the display area; The step of forming a protective layer on the planarization layer at least in the non-display area comprises: forming a protection layer covering the first electrode and the planarization layer, wherein the protection layer has a protection opening, and the protection opening exposes the first electrode; After forming a protective layer on the planarization layer at least in the non-display area, the method comprises: forming a pixel definition layer located on a side of the protection layer away from the substrate, wherein the pixel definition layer has a pixel opening, the pixel opening is connected to the protection opening and exposes the first electrode; The isolation structure is formed on the planarization layer in the display area, comprising: The isolation structure is formed on a side of the pixel definition layer away from the substrate.

17. The method for preparing a display panel according to claim 15, characterized in that: After forming a planarization layer on the substrate, the method further comprises: forming a first electrode on the planarization layer in the display area; forming a pixel definition layer covering the first electrode, wherein the pixel definition layer has a pixel opening, and the pixel opening exposes the first electrode; The step of forming a protective layer on the planarization layer at least in the non-display area comprises: forming a protection layer covering the pixel definition layer, wherein the protection layer has a plurality of protection openings, the protection openings being connected to the pixel openings and exposing the first electrode; The isolation structure is formed on the planarization layer in the display area, comprising: The isolation structure is formed on the protection layer.

18. A display device, characterized in that: A display panel comprising the display panel as described in any one of claims 1 to 9, or a display panel prepared by the method for preparing a display panel as described in any one of claims 10 to 14, or a display panel prepared by the method for preparing a display panel as described in any one of claims 15 to 17.

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