Display panel, preparation method thereof and display device

Abstract

The invention relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, and a plurality of light-emitting structures are arranged on one side of the substrate at intervals; the first electrode is located on the side, away from the substrate, of the light-emitting structure; the optical structures are located on the sides, away from the substrate, of the light-emitting structures, and at least part of the orthographic projections of the optical structures on the substrate are located between the orthographic projections of the adjacent light-emitting structures on the substrate. The optical structure is formed on the side, away from the substrate, of the light-emitting structure, the optical structure can change the light path of the large-angle light emitted by the light-emitting structure, and therefore the large-angle light is prevented from entering the positions of the adjacent pixels, the light crosstalk problem is avoided, the light emitting rate of the light-emitting structure is improved, the brightness of the display panel is improved, and the display effect is improved. The display quality of the display panel is improved, and the light utilization rate is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] The light-emitting structure (e.g., pixel) is the smallest unit that makes up the image on the display panel. Display panels are often equipped with multiple light-emitting structures of three basic colors: red, green, and blue. By controlling different light-emitting structures to have different brightness, various colors can be displayed on the display panel.

[0003] In the related art, the integration of the display panel is usually improved by shortening the distance between adjacent light-emitting structures, but this makes it easy for the light emitted by one light-emitting structure to be emitted from the position of the adjacent light-emitting structure, thus causing the problem of light crosstalk. Summary of the invention

[0004] Based on this, it is necessary to provide a display panel and a manufacturing method thereof, and a display device to address the problem of optical crosstalk in the prior art.

[0005] In order to achieve the above object, on the one hand, a display panel is provided, comprising:

[0006] A substrate, a plurality of light-emitting structures are arranged at intervals on one side of the substrate;

[0007] A first electrode, located on a side of the light emitting structure away from the substrate;

[0008] The optical structure is located on a side of the light emitting structure away from the substrate, and the orthographic projection of the optical structure on the substrate is at least partially located between the orthographic projections of adjacent light emitting structures on the substrate.

[0009] In one embodiment, the display panel further includes:

[0010] The isolation structure is located on a side of the light emitting structure away from the substrate and is surrounded to form a first opening, wherein the first opening at least exposes a portion of the light emitting structure. The optical structure is located on a side of the isolation structure away from the substrate.

[0011] In one embodiment, the optical structure is arranged to form a second opening, and the orthographic projection of the first opening on the substrate at least partially overlaps with the orthographic projection of the second opening on the substrate;

[0012] Optionally, an orthographic projection of the second opening on the substrate covers an orthographic projection of the first opening on the substrate.

[0013] In one embodiment, the optical structure covers at least a portion of a side surface of the isolation structure facing the first opening.

[0014] In one embodiment, the isolation structure includes a filling portion and a top portion, the top portion is located on a side of the filling portion away from the substrate, and the optical structure covers a side of the top portion facing the first opening;

[0015] Optionally, an orthographic projection of the top portion on the substrate covers an orthographic projection of the filling portion on the substrate.

[0016] In one embodiment, the top has a top surface away from the substrate, the optical structure also covers the top surface of the top, the optical structure has a top surface away from the substrate and a side surface facing the second opening, the first electrode covers the top surface of the optical structure and the side surface of the optical structure and continuously covers the multiple light-emitting structures.

[0017] In one embodiment, the optical structure covers the top surface of the isolation structure away from the substrate.

[0018] In one embodiment, the isolation structure includes a filling portion and a top portion, the top portion is located on a side of the filling portion away from the substrate, and an opening enclosed by the top portion is connected to the second opening and exposes the light-emitting structure;

[0019] Optionally, the orthographic projection of the top portion on the substrate covers the orthographic projection of the filling portion on the substrate;

[0020] Optionally, the optical structure has a top surface away from the substrate and a side surface facing the second opening, and the first electrode continuously covers the multiple light-emitting structures and extends along the top of the isolation structure toward the side surface of the first opening to the side surface of the optical structure and the top surface of the optical structure.

[0021] In one of the embodiments, a longitudinal section of the top portion above the adjacent light emitting structure along the thickness direction of the substrate is in the shape of a right trapezoid.

[0022] In one embodiment, the display panel further includes:

[0023] A pixel definition layer is located on one side of the substrate, the pixel definition layer has a plurality of light-emitting openings, the light-emitting structure is at least partially located in the light-emitting openings, and the isolation structure is located on a side of the pixel definition layer away from the substrate;

[0024] A second electrode is located on a side of the light emitting structure close to the substrate;

[0025] Optionally, the display panel further comprises a sacrificial layer, and along the thickness direction of the substrate, the sacrificial layer is located between the light emitting structure and the optical structure;

[0026] Optionally, the sacrificial layer includes a first sacrificial layer and a second sacrificial layer which are stacked;

[0027] Optionally, the display panel further includes a side protection layer, wherein the side protection layer covers a side of the light emitting structure away from the light emitting opening;

[0028] Optionally, the side protection layer extends along the side of the sacrificial layer away from the light-emitting opening to the top surface of the sacrificial layer away from the substrate, and the isolation structure is located on the side of the side protection layer away from the substrate;

[0029] Optionally, the display panel further includes an encapsulation layer, and the encapsulation layer covers the first electrode and the optical structure.

[0030] In one embodiment, the optical structure includes a reflective layer and a protective layer, the first electrode is located on a side of the protective layer away from the isolation structure, the reflective layer is located on a side of the protective layer close to the isolation structure, and the protective layer is located between the first electrode and the reflective layer;

[0031] Optionally, the material of the reflective layer includes metal;

[0032] Optionally, the material of the protection layer includes a transparent insulating material.

[0033] In one embodiment, the display panel further includes:

[0034] A common layer is located between the first electrode and the optical structure along the thickness direction of the substrate, and the common layer continuously covers the plurality of light-emitting structures.

[0035] In one aspect, a method for preparing a display panel is also provided, comprising:

[0036] providing a substrate;

[0037] forming a plurality of light-emitting structures spaced apart from each other on one side of the substrate;

[0038] An optical structure is formed on a side of the light-emitting structure away from the substrate, and an orthographic projection of the optical structure on the substrate is at least partially located between orthographic projections of adjacent light-emitting structures on the substrate;

[0039] A first electrode covering the plurality of light emitting structures is formed on a side of the light emitting structure away from the substrate.

[0040] In one embodiment, before forming the optical structure on the side of the light emitting structure away from the substrate, the method includes:

[0041] An isolation structure is formed on a side of the light emitting structure away from the substrate, wherein the isolation structure is surrounded to form a first opening, and the first opening at least exposes a portion of the light emitting structure;

[0042] The optical structure is formed on a side of the light emitting structure away from the substrate, comprising:

[0043] The optical structure is formed on the top surface and the side wall of the isolation structure, the optical structure is arranged to form a second opening, and the orthographic projection of the first opening on the substrate and the orthographic projection of the second opening on the substrate at least partially overlap;

[0044] The first electrode covering the plurality of light emitting structures is formed on a side of the light emitting structure away from the substrate, comprising:

[0045] forming a first electrode covering the optical structure and the plurality of light-emitting structures;

[0046] Optionally, the optical structure includes a reflective layer and a protective layer, and the optical structure is formed on the top surface and sidewall of the isolation structure, including:

[0047] forming the reflective layer on the top surface and sidewalls of the isolation structure;

[0048] forming the protective layer covering the reflective layer;

[0049] Optionally, the forming of a first electrode covering the optical structure and the plurality of light-emitting structures comprises:

[0050] forming a common layer covering the protective layer and the plurality of light emitting structures;

[0051] forming a first electrode covering the common layer;

[0052] Optionally, the optical structure comprises a reflective structure, and the reflective layer comprises a reflective layer.

[0053] In one embodiment, while forming a plurality of light emitting structures spaced apart from each other on the substrate, an initial sacrificial layer is also formed on the light emitting structures;

[0054] An optical structure is formed on the top surface and sidewalls of the isolation structure, including:

[0055] forming an optical material layer on the isolation structure and the initial sacrificial layer;

[0056] The optical material layer and the initial sacrificial layer are sequentially etched until the light-emitting structure is exposed, and the remaining optical material layer forms the optical structure, and the remaining initial sacrificial layer forms a sacrificial layer;

[0057] Optionally, the initial sacrificial layer includes a first initial sacrificial layer close to the light emitting structure and a second initial sacrificial layer far from the light emitting structure.

[0058] The step of sequentially etching the optical material layer and the initial sacrificial layer until the light emitting structure is exposed comprises:

[0059] Using the first initial sacrificial layer as an etching stop layer, sequentially etching the optical material layer and the second initial sacrificial layer, leaving the optical material layer and the second initial sacrificial layer, the remaining optical material layer forming the optical structure, and the remaining second initial sacrificial layer forming a second sacrificial layer;

[0060] Using the optical structure and the second sacrificial layer as mask layers, etching the first initial sacrificial layer until the light-emitting structure is exposed, and the remaining first initial sacrificial layer forms a first sacrificial layer;

[0061] Optionally, after forming an initial sacrificial layer on the light emitting structure, the method further comprises:

[0062] forming a side protection material layer covering the initial sacrificial layer, the light emitting structure and the substrate;

[0063] The step of sequentially etching the optical structure and the initial sacrificial layer until the light emitting structure is exposed comprises:

[0064] The optical material layer, the side protection material layer and the initial sacrificial layer are sequentially etched until the light-emitting structure is exposed, and the remaining side protection material layer forms a side protection layer;

[0065] Optionally, forming an isolation structure on a side of the light emitting structure away from the substrate includes:

[0066] forming an isolation material layer on the side protection material layer;

[0067] Etching the isolation material layer to form the isolation structure, wherein the isolation structure includes a filling portion and a top portion, wherein the filling portion fills the area between adjacent light-emitting structures, and the top portion is located on a side of the filling portion away from the substrate;

[0068] Optionally, a longitudinal section of a top portion of the isolation structure above the adjacent light-emitting structure along a thickness direction of the substrate is in the shape of a right trapezoid.

[0069] In one embodiment, while forming a plurality of light-emitting structures spaced apart on the substrate, an initial sacrificial layer is also formed on the light-emitting structure, and the optical structure is formed on a side of the light-emitting structure away from the substrate, including:

[0070] forming an isolation material layer on the initial sacrificial layer and the substrate;

[0071] forming the optical material layer covering the isolation material layer;

[0072] The optical material layer, the isolation material layer and the initial sacrificial layer are sequentially etched until the light-emitting structure is exposed, and the remaining optical material layer, the isolation material layer and the initial sacrificial layer form the optical structure, the isolation structure and the sacrificial layer.

[0073] On the one hand, a display device is also provided, comprising a display panel as described in any one or more of the above items and combinations thereof.

[0074] The display panel, preparation method and display device of the present specification have the following beneficial effects: by forming an optical structure on the side of the light-emitting structure away from the substrate, the optical structure can change the optical path of the large-angle light emitted by the light-emitting structure, thereby preventing the large-angle light from entering the position of adjacent pixels, thereby avoiding the problem of optical crosstalk, improving the light output rate of the light-emitting structure, increasing the brightness of the display panel, improving the display quality of the display panel, and improving light utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0076] Figure 1 is a schematic diagram of a light-emitting structure provided in an embodiment;

[0077] Figure 2 A schematic diagram of an initial sacrificial layer provided in an embodiment;

[0078] Figure 3 is a schematic diagram of an optical material layer provided in an embodiment;

[0079] Figure 4 is a schematic diagram of a patterned photoresist layer provided in an embodiment;

[0080] Figure 5 is a schematic diagram of an optical structure provided in an embodiment;

[0081] Figure 6 A schematic diagram of a sacrificial layer provided in an embodiment;

[0082] Figure 7 is a schematic diagram of a display panel provided in an embodiment;

[0083] Figure 8 is a schematic diagram of an isolation material layer provided in an embodiment;

[0084] Fig. 9 A schematic diagram of a patterned photoresist layer provided in another embodiment;

[0085] Fig.10 is a schematic diagram of an isolation structure provided in an embodiment;

[0086] Fig.11 A schematic diagram of a sacrificial layer provided in another embodiment;

[0087] Fig.12 is a schematic diagram of a display panel provided in another embodiment;

[0088] Fig.13 FIG. 4 is a flow chart of a method for preparing a display panel provided in an embodiment.

[0089] Explanation of the accompanying drawings: display panel-100; substrate-110; light-emitting structure-120; first electrode-130; second electrode-131; optical structure-140; reflective layer-141; optical material layer-1410; protective layer-142; protective material layer-1420; isolation structure-150; isolation material layer-1500; filling part-151; top-152; top surface-1521; side-1522; pixel definition layer-160; sacrificial layer-170; initial sacrificial layer-1700; first sacrificial layer-171; first initial sacrificial layer-1710; second sacrificial layer-172; second initial sacrificial layer-1720; side protective layer-180; side protective material layer-1800; encapsulation layer-190; second opening-200; first opening-210; patterned photoresist layer-300.

[0090] In order to better describe and illustrate the embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more drawings. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed inventions, the embodiments and / or examples currently described, and the best modes of these inventions currently understood. DETAILED DESCRIPTION

[0091] In order to facilitate understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thorough and comprehensive.

[0092] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure.

[0093] In each embodiment, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in each embodiment can be understood according to the specific situation.

[0094] It should be understood that when an element or layer is referred to as being "on, adjacent to, or connected to other elements or layers, it may be directly on, adjacent to, or connected to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, or directly connected to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present embodiment, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part.

[0095] Spatial relationship terms such as "under", "below", "below", "under", "above", "above", etc., may be used herein to describe the relationship between an element or feature shown in the figures and other elements or features. It should be understood that in addition to the orientations shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, the element or feature described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0096] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0097] Embodiments of the embodiments are described herein with reference to schematic diagrams that are idealized embodiments (and intermediate structures) of the present specification, and such variations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are anticipated. Thus, embodiments of the present embodiments should not be limited to the particular shapes of the regions illustrated herein, but rather include deviations in shapes due to, for example, manufacturing techniques. The regions shown in the figures are schematic in nature, and their shapes do not represent the actual shapes of the regions of the device and do not limit the scope of the present embodiments.

[0098] See also Figure 1 , this embodiment provides a display panel 100. Please refer to Figures 2 to 12 , Figures 2 to 12 The manufacturing process of the display panel 100 is shown. The display panel 100 provided in this embodiment includes a substrate 110 , a light emitting structure 120 , a first electrode 130 and an optical structure 140 .

[0099] The substrate 110 may include an array substrate, etc. The substrate 110 may include multiple film layers. For example, the substrate 110 may include a pixel circuit, etc.

[0100] The substrate 110 may include a plurality of light emitting structures 120 (for example, the light emitting structures 120 may be pixels), and the plurality of light emitting structures 120 may be arranged at intervals on one side of the substrate 110. For example, the light emitting structure 120 may include a red light emitting film layer, a green light emitting film layer, and a blue light emitting film layer, and the red light emitting film layer, the green light emitting film layer, and the blue light emitting film layer may be arranged on the substrate 110 according to a preset order. Of course, the light emitting structure 120 may also include a white light emitting film layer. A plurality of white light emitting film layers are arranged in an array on the substrate 110.

[0101] The light emitting structure 120 has a light emitting direction (eg, Figure 7 The middle line segment AB shows the light emitting direction). Most of the light emitted by the light emitting structure 120 can be emitted in the light emitting direction. However, the light path of a small part of the light emitted by the light emitting structure 120 will form a large angle with the light emitting direction and be emitted to the position of the adjacent light emitting structure 120, which will cause light crosstalk problems. For example, Figure 7 The center line segment CD shows the optical path of large-angle light.

[0102] The first electrode 130 is located on a side of the light emitting structure 120 away from the substrate 110. For example, the first electrode 130 may be a cathode. The first electrode 130 may connect a plurality of light emitting structures 120. For example, the first electrode 130 may cover a plurality of light emitting structures 120 continuously.

[0103] Accordingly, the display panel 100 may further include a second electrode 131. The second electrode 131 may be an anode. The second electrode 131 may be located on a side of the light emitting structure 120 close to the substrate 110 and connected to the pixel circuit. It is understood that a second electrode 131 may be separately provided between each light emitting structure 120 and the substrate 110, and a plurality of light emitting structures 120 may share the first electrode 130.

[0104] The optical structure 140 is located on a side of the light emitting structure 120 away from the substrate 110. As an example, the optical structure 140 may include a reflective structure capable of reflecting light, an absorbing structure capable of absorbing light, or other prisms or lenses capable of changing the optical path of light. This embodiment does not specifically limit the composition of the optical structure 140.

[0105] The orthographic projection of the optical structure 140 on the substrate 110 is at least partially located between the orthographic projections of the adjacent light emitting structures 120 on the substrate 110. As an example, the orthographic projection of the optical structure 140 on the substrate 110 may be entirely located between the orthographic projections of the adjacent light emitting structures 120 on the substrate 110, or the orthographic projection of the optical structure 140 on the substrate 110 may be located between the orthographic projections of the adjacent light emitting structures 120 on the substrate 110, while covering part of the orthographic projections of the light emitting structures 120 on the substrate 110. It can be understood that in the cross-sectional view of the display panel 100, the optical structure 140 is located between the adjacent light emitting structures 120. Further, the optical structure 140 may extend in the horizontal direction of the display panel 100. In another possible example, the optical structure 140 may extend in the thickness direction of the display panel 100.

[0106] In this embodiment, by forming an optical structure 140 on the side of the light-emitting structure 120 away from the substrate 110, the optical structure 140 can change the optical path of the large-angle light emitted by the light-emitting structure 120, thereby preventing the large-angle light from entering the position of adjacent pixels, thereby avoiding the problem of optical crosstalk, improving the light output rate of the light-emitting structure 120, increasing the brightness of the display panel 100, improving the display quality of the display panel 100, and improving light utilization.

[0107] In one embodiment, the display panel 100 further includes an isolation structure 150 .

[0108] The isolation structure 150 is located on a side of the light emitting structure 120 away from the substrate 110 , and the isolation structure 150 surrounds and forms a first opening 210 .

[0109] The isolation structure 150 may be formed between adjacent light emitting structures 120, and the first electrode 130 may connect a plurality of light emitting structures 120. At this time, the isolation structure 150 may have a relatively flat top surface and sidewalls, so as to facilitate the overlapping of the first electrode 130.

[0110] In one possible example, the optical structure 140 is located on a side of the isolation structure 150 away from the substrate 110, thereby preventing most of the large-angle light from being emitted to the position of the adjacent light-emitting structure 120. In another possible example, the optical structure 140 is located on a side of the isolation structure 150 close to the substrate 110, thereby preventing part of the large-angle light from being emitted to the position of the adjacent light-emitting structure 120. In yet another possible example, the optical structure 140 may be located on both the side of the isolation structure 150 away from the substrate 110 and the side of the isolation structure 150 close to the substrate 110.

[0111] In this embodiment, firstly, by disposing the isolation structure 150 on the side of the light emitting structure 120 away from the substrate 110, it is convenient to overlap the first electrode 130. Secondly, in this embodiment, the optical structure 140 is disposed on the side of the isolation structure 150 away from the substrate 110, thereby preventing most of the large-angle light from being emitted to the position of the adjacent light emitting structure 120, thereby avoiding the problem of optical crosstalk.

[0112] In one embodiment, the optical structure 140 is surrounded to form a second opening 200, and the second opening 200 exposes the light emitting structure 120. The orthographic projection of the first opening 210 on the substrate 110 at least partially overlaps with the orthographic projection of the second opening 200 on the substrate 110. Further, the orthographic projection of the second opening 200 on the substrate 110 covers the orthographic projection of the first opening 210 on the substrate 110. It can be understood that the orthographic projection of the first opening 210 on the substrate 110 can be the orthographic projection of the side wall of the first opening 210 surrounded by the isolation structure 150 on the substrate 110, and the orthographic projection of the second opening 200 on the substrate 110 can include the orthographic projection of the side wall of the second opening 200 surrounded by the optical structure 140 on the substrate 110.

[0113] Exemplarily, the optical structure 140 forms a plurality of second openings 200 , and the second openings 200 expose at least a portion of the light emitting structure 120 . The first opening 210 is connected to the second openings 200 and exposes the light emitting structure 120 together.

[0114] In this embodiment, the second opening 200 is formed by disposing the optical structure 140 so that the optical structure 140 does not affect the normal light emission of the light emitting structure 120 .

[0115] In one embodiment, the optical structure 140 may include a reflective layer 141 and a protective layer 142. The reflective layer 141 may be used to change the optical path of the large-angle light emitted by the light emitting structure 120 so that the large-angle light is emitted in the light emitting direction of the light emitting structure 120, thereby preventing the large-angle light from entering the position of the adjacent pixel. For example, see Figure 7 , line segment CD shows the optical path of the high-angle light. After the high-angle light is reflected by the reflective layer 141, its optical path is shown by line segment C'D'. At this time, in a possible example, the material of the reflective layer 141 can be selected from a material that can reflect light. For example, the material of the reflective layer 141 can be a metal material. For example, the metal material can be selected from titanium, aluminum, molybdenum, silver, copper or alloy. In another possible example, the reflective layer 141 may include a single film layer or a multi-layer film layer. For example, the reflective layer 141 may be a stacked film layer composed of a double titanium layer. In another possible example, the reflective layer 141 may have a shape that can reflect light. For example, the cross-sectional view of the reflective layer 141 may be arched.

[0116] The protective layer 142 may be located between the first electrode 130 and the reflective layer 141, thereby isolating the first electrode 130 from the reflective layer 141. It is understood that the present embodiment does not limit the specific positional relationship between the reflective layer 141 and the first electrode 130. For example, the reflective layer 141 may be far away from the substrate 110, and the first electrode 130 may be close to the substrate 110. Alternatively, the first electrode 130 may be far away from the substrate 110, and the reflective layer 141 may be close to the substrate 110.

[0117] The reflective layer 141 may be made of a conductive material. In this case, in a possible example, the material of the protective layer 142 may include SiN x , SiO2, SiON, Al2O3 or Ta2O5 and other insulating transparent materials, so as to prevent the protective layer 142 from reducing the light extraction efficiency of the light emitting structure 120. For example, the material of the protective layer 142 may include photosensitive polyimide or acrylic material. Of course, the reflective layer 141 may include a single film layer or a multi-layer film layer.

[0118] In this embodiment, a protective layer 142 is provided between the first electrode 130 and the reflective layer 141, thereby isolating the first electrode 130 and the reflective layer 141, preventing the current of the first electrode 130 from being conducted to the reflective layer 141, thereby reducing the possibility of leakage, and also reducing the possibility of increased power consumption due to leakage. Furthermore, the reflective layer 141 may be connected between adjacent light-emitting structures 120, resulting in lateral leakage. In this case, the protective layer 142 can also reduce the possibility of electrical crosstalk of the light-emitting structure 120 due to lateral leakage.

[0119] Furthermore, the first electrode 130 may be located on a side of the protective layer 142 away from the substrate 110, and the reflective layer 141 may be located on a side of the protective layer 142 close to the substrate 110. In this case, when preparing the display panel 100, the reflective layer 141 may be prepared first, and then the first electrode 130 may be prepared on the reflective layer 141, so as to protect the first electrode 130 and prevent the first electrode 130 from being damaged due to the preparation of the reflective layer 141. Of course, the first electrode 130 may also be located on a side of the protective layer 142 close to the substrate 110, and the reflective layer 141 may also be located on a side of the protective layer 142 away from the substrate 110.

[0120] In this embodiment, the optical structure 140 can be arranged to be located on the side of the isolation structure 150 away from the substrate 110, and the first electrode 130 can be located on the side of the protective layer 142 away from the substrate 110, and the reflective layer 141 can be located on the side of the protective layer 142 close to the substrate 110, thereby not only preventing most of the large-angle light from being emitted to the position of the adjacent light-emitting structure 120, but also preventing the first electrode 130 from being damaged due to the preparation of the reflective layer 141.

[0121] In one embodiment, the optical structure 140 may cover at least a portion of the side surface of the isolation structure 150 facing the first opening 210 . Of course, the optical structure 140 may also cover the entire side surface of the isolation structure 150 facing the first opening 210 .

[0122] The isolation structure 150 includes a filling portion 151 and a top portion 152 , wherein the top portion 152 is located on a side of the filling portion 151 away from the substrate 110 . Exemplarily, an orthographic projection of the top portion 152 may cover an orthographic projection of the filling portion 151 .

[0123] In one possible example, see Figure 2 , the top 152 of the isolation structure 150 may have a top surface 1521 and a side surface 1522 away from the substrate 110. The top surface 1521 of the top 152 may include a horizontal surface, for example, the top surface 1521 of the top 152 may be perpendicular to the light emitting direction. The side surface 1522 of the top 152 may also include an inclined surface, for example, the side surface 1522 of the top 152 may be an acute angle with the light emitting direction. At this time, the optical structure 140 may cover the side surface 1522 of the top 152 facing the first opening 210 to better reflect large-angle light. Of course, the optical structure 140 may also cover the top surface 1521 while covering the side surface 1522 of the top 152 facing the first opening 210.

[0124] In another possible example, see Fig.10, the top 152 of the isolation structure 150 may have a top surface 1521 away from the substrate 110, and the top surface 1521 may include a horizontal plane. For example, the top surface 1521 of the top 152 may be perpendicular to the light emitting direction. The opening enclosed by the top 152 may be connected to the second opening 200 and expose the light emitting structure 120. The optical structure 140 may cover the top surface 1521, and the side wall of the top 152 extends along the side wall of the optical structure 140. At this time, in one possible example, the side wall of the top 152 has a first angle with the light emitting direction, and the side wall of the optical structure 140 has a second angle with the light emitting direction, the first angle is equal to the second angle, and the first angle and the second angle are both acute angles. In another possible example, the orthographic projection of the top 152 on the substrate 110 covers the orthographic projection of the filling portion 151 on the substrate 110.

[0125] In this embodiment, a cover plate or the like may be provided in the light emitting direction of the light emitting structure 120, and the light emitted from the light emitting structure 120 toward the cover plate may be reflected downward by the cover plate (i.e., the cover plate may reflect the light toward the substrate 110). When the optical structure 140 covers the top surface 1521 of the top 152, the optical structure 140 has a top surface away from the substrate 110 and a side surface facing the second opening 200, and the optical structure 140 may reflect the light reflected by the cover plate again to increase the light emitting efficiency of the light emitting structure 120. Moreover, in the above two examples, the top 152 of the isolation structure 150 above the adjacent light emitting structure 120 may be in a right trapezoidal shape in the longitudinal section along the thickness direction of the substrate 110.

[0126] In addition, the first electrode 130 can cover the top surface of the optical structure 140 away from the substrate 110 and the side surface toward the second opening 200 and continuously cover a plurality of light-emitting structures 120, and the first electrode 130 can continuously cover a plurality of light-emitting structures 120 and extend along the top 152 of the isolation structure 150 toward the side surface of the first opening 210 to the side surface of the optical structure 140 and the top surface of the optical structure 140, which is conducive to the continuous formation of the first electrode 130.

[0127] In one embodiment, see Figure 7 The display panel 100 further includes any one or more of structures such as a pixel definition layer 160, a sacrificial layer 170, a side protection layer 180, an encapsulation layer 190, and a common layer.

[0128] The pixel definition layer 160 is located on one side of the substrate 110. The pixel definition layer 160 is used to form the light emitting structure 120. The pixel definition layer 160 has a plurality of light emitting openings, and the light emitting structure 120 is at least partially located in the light emitting openings. In addition, the light emitting structure 120 can also be located on the upper surface of the light emitting opening. The isolation structure 150 can be located on the side of the pixel definition layer 160 away from the substrate 110.

[0129] Along the thickness direction of the substrate 110, the sacrificial layer 170 may be located between the light emitting structure 120 and the optical structure 140. The sacrificial layer 170 may be used to prepare the light emitting structure 120. The sacrificial layer 170 includes a first sacrificial layer 171 and a second sacrificial layer 172 stacked. Of course, the sacrificial layer 170 may also include a third sacrificial layer, a fourth sacrificial layer, etc.

[0130] The side protection layer 180 can be used to form the isolation structure 150. The side protection layer 180 can cover the side of the substrate 110, the sacrificial layer 170 and the light emitting structure 120 away from the light emitting opening, and the isolation structure 150 can be located on the side of the side protection layer 180 away from the substrate 110 and the sacrificial layer 170. Moreover, the side protection layer 180 can also extend along the side of the sacrificial layer 170 away from the light emitting opening to the top surface of the sacrificial layer 170 away from the substrate 110. Further, when the optical structure 140 is located on the side of the isolation structure 150 close to the substrate 110, the side protection layer 180 can be shared with the reflective layer 141.

[0131] The encapsulation layer 190 may cover the first electrode 130 and the optical structure 140, thereby protecting the first electrode 130 and the optical structure 140. The material of the encapsulation layer 190 may include a transparent material.

[0132] Along the thickness direction of the substrate 110, the common layer is located between the first electrode 130 and the optical structure 140, and the common layer can continuously cover the plurality of light-emitting structures 120. As an example, the common layer can include an organic functional layer of a light-emitting device such as an electron transport layer, an electron injection layer, a hole transport layer, or a hole injection layer. The present application does not specifically limit the composition of the common layer.

[0133] In addition, the display panel 100 further includes a polarizer, etc. The polarizer may be located on a side of the encapsulation layer 190 away from the substrate 110. The polarizer may be used to reduce reflections and improve the display effect of the display panel 100.

[0134] In this embodiment, by disposing any one or more of the structures such as the pixel definition layer 160 , the sacrificial layer 170 , the side protection layer 180 , and the encapsulation layer 190 in the display panel 100 , the display effect of the display panel 100 is improved.

[0135] Based on the same inventive concept, in one embodiment, a method for manufacturing a display panel is provided. The method for manufacturing a display panel is used to manufacture a display panel 100 formed by any one of the above embodiments or a combination of multiple embodiments. Fig.13 , the method for preparing the display panel comprises the following steps:

[0136] Step S10: providing a substrate 110 .

[0137] Step S20 : ​​forming a plurality of light emitting structures 120 disposed at intervals on one side of the substrate 110 .

[0138] Step S40 : forming an optical structure 140 on a side of the light emitting structure 120 away from the substrate 110 , wherein the orthographic projection of the optical structure 140 on the substrate 110 is at least partially located between the orthographic projections of adjacent light emitting structures 120 on the substrate 110 .

[0139] Step S50 : forming a first electrode 130 covering the plurality of light emitting structures 120 on a side of the light emitting structure 120 away from the substrate 110 .

[0140] In step S10, the substrate 110 may include a packaging substrate 110. The substrate 110 may include multiple film layers. For example, the substrate 110 may include a pixel circuit and the like.

[0141] In step S20, in one example, the light emitting structure 120 may include a red light emitting film layer, a green light emitting film layer, and a blue light emitting film layer. The red light emitting film layer, the green light emitting film layer, and the blue light emitting film layer may be arranged on the substrate 110 according to a preset order. In another example, the light emitting structure 120 may also include a white light emitting film layer. A plurality of white light emitting film layers are arranged in an array on the substrate 110.

[0142] A pixel definition layer 160 may be provided on one side of the substrate 110. The pixel definition layer 160 has a plurality of light-emitting openings, and in this case, a light-emitting structure 120 may be formed on the bottom surface, sidewalls, and upper surface of the light-emitting openings. Of course, an anode (second electrode 131) may also be provided on the substrate 110, and the light-emitting openings may expose a portion of the anode.

[0143] In step S40, the optical structure 140 may include a reflective structure, an absorption structure, a prism or a lens, etc. As an example, in the case where the optical structure 140 includes a reflective structure, the optical structure 140 may include a reflective layer 141 and a protective layer 142. This embodiment does not limit the order in which the reflective layer 141 and the protective layer 142 are formed. Exemplarily, the reflective layer 141 and the protective layer 142 may be formed by one or more processes such as a chemical vapor deposition process, an atomic layer deposition process, a high-density plasma deposition process, a plasma enhanced deposition process, and a spin-coated dielectric layer.

[0144] The orthographic projection of the optical structure 140 on the substrate 110 is at least partially located between the orthographic projections of the adjacent light emitting structures 120 on the substrate 110. As an example, the orthographic projection of the optical structure 140 on the substrate 110 may be entirely located between the orthographic projections of the adjacent light emitting structures 120 on the substrate 110, or the orthographic projection of the optical structure 140 on the substrate 110 may be located between the orthographic projections of the adjacent light emitting structures 120 on the substrate 110, while covering part of the orthographic projections of the light emitting structures 120 on the substrate 110. It can be understood that in the cross-sectional view of the display panel 100, the optical structure 140 is located between the adjacent light emitting structures 120.

[0145] In step S50, the first electrode 130 may be a cathode, and the first electrode 130 may continuously cover a plurality of light emitting structures 120. It is understood that the present embodiment does not limit the order of step S40 and step S50. That is, the present embodiment may first form the optical structure 140, and then form the first electrode 130. The present embodiment may also first form the first electrode 130, and then form the optical structure 140.

[0146] In this embodiment, an optical structure 140 is formed on the side of the light-emitting structure 120 away from the substrate 110. The optical structure 140 can change the optical path of large-angle light, thereby preventing large-angle light from entering the position of adjacent pixels, thereby avoiding the problem of optical crosstalk, improving the light output rate of the light-emitting structure 120, increasing the brightness of the display panel 100, and improving the display quality of the display panel 100.

[0147] In one embodiment, before step S40, the following steps are included:

[0148] Step S30 : forming an isolation structure 150 on a side of the light emitting structure 120 away from the substrate 110 . The isolation structure 150 surrounds a first opening 210 . The first opening 210 at least exposes a portion of the light emitting structure 120 .

[0149] At this time, step S40 includes:

[0150] Step S41 : forming an optical structure 140 on the top surface and sidewall of the isolation structure 150 , the optical structure 140 surrounds the second opening 200 , and the orthographic projection of the first opening 210 on the substrate 110 at least partially overlaps with the orthographic projection of the second opening 200 on the substrate 110 .

[0151] Furthermore, step S50 includes:

[0152] Step S51 : forming a first electrode 130 covering the optical structure 140 and the plurality of light emitting structures 120 .

[0153] In step S30, the first opening 210 is connected to the second opening 200 and exposes the light emitting structure 120. At this time, the orthographic projection of the first opening 210 on the substrate 110 at least partially overlaps with the orthographic projection of the second opening 200 on the substrate 110. Further, the orthographic projection of the second opening 200 on the substrate 110 can cover the orthographic projection of the first opening 210 on the substrate 110.

[0154] In one possible example, the optical structure 140 may include a reflective layer 141 and a protective layer 142. In this case, the reflective layer 141 may be first formed on the top surface and sidewall of the isolation structure 150, and then the protective layer 142 covering the reflective layer 141 may be formed to form a stacked structure of the isolation structure 150-reflective layer 141-protective layer 142-first electrode 130. In another possible example, after the protective layer 142 is formed, a common layer covering the protective layer 142 and the plurality of light emitting structures 120 may be formed, and the first electrode 130 covering the common layer may be formed.

[0155] For example, when forming any one of the isolation structure 150 , the reflective layer 141 , the protective layer 142 , the common layer and the first electrode 130 , the above-mentioned film layer may be first formed on the entire surface and then patterned.

[0156] In this embodiment, first, the optical structure 140 is arranged on the side of the isolation structure 150 away from the substrate 110, so as to prevent most of the large-angle light from being directed to the position of the adjacent light-emitting structure 120. Secondly, in this embodiment, the optical structure 140 is first prepared, and then the first electrode 130 is prepared, so as to prevent the first electrode 130 from being damaged due to the preparation of the optical structure 140. Afterwards, in this embodiment, a protective layer 142 is arranged between the first electrode 130 and the reflective layer 141, so as to isolate the first electrode 130 and the reflective layer 141, and prevent the current of the first electrode 130 from being conducted to the reflective layer 141, thereby reducing the possibility of leakage, and also reducing the possibility of increased power consumption due to leakage, and can also reduce the possibility of pixel electrical crosstalk due to lateral leakage.

[0157] In one embodiment, see Figures 2 to 12 At the same time as step S20 , an initial sacrificial layer 1700 is also formed on the light emitting structure 120 . It can be understood that the initial sacrificial layer 1700 can be formed on the light emitting structure 120 .

[0158] At this time, step S41 includes:

[0159] Step S410 : forming an optical material layer 1410 on the isolation structure 150 and the initial sacrificial layer 1700 in sequence.

[0160] Step S411 : etching the optical material layer 1410 and the initial sacrificial layer 1700 in sequence until the light emitting structure 120 is exposed, the remaining optical material layer 1410 forms the optical structure 140 , and the remaining initial sacrificial layer 1700 forms the sacrificial layer 170 .

[0161] In step S410 to step S411, please refer to Figure 3 , the optical material layer 1410 may be formed on the entire surface first, and then the optical material layer 1410 and the initial sacrificial layer 1700 may be etched in sequence to form the second opening 200 to expose the light emitting structure 120. As an example, when etching the optical material layer 1410 and the initial sacrificial layer 1700, dry etching or wet etching may be used. Dry etching may include any one of reactive ion etching, inductively coupled plasma etching or high concentration plasma etching. Of course, please refer to Figure 4 Before etching the optical material layer 1410 and the initial sacrificial layer 1700 , a patterned photoresist layer 300 may be formed on the optical material layer 1410 , and a plurality of film layers may be etched based on the patterned photoresist layer 300 .

[0162] In a possible example, the initial sacrificial layer 1700 includes a first initial sacrificial layer 1710 close to the light emitting structure 120 and a second initial sacrificial layer 1720 far from the light emitting structure 120. In this case, step S411 may be a step-by-step etching. For example, see Figure 5 , the first initial sacrificial layer 1710 can be used as an etching stop layer, and the optical material layer 1410 and the second initial sacrificial layer 1720 can be etched in sequence, and the remaining optical material layer 1410 and the second initial sacrificial layer 1720 can be formed, and the remaining optical material layer 1410 forms the optical structure 140, and the remaining second initial sacrificial layer 1720 forms the second sacrificial layer 172. Afterwards, refer to Figure 6 , using the optical structure 140 and the second sacrificial layer 172 as mask layers, the first initial sacrificial layer 1710 is etched until the light emitting structure 120 is exposed, and the remaining first initial sacrificial layer 1710 forms the first sacrificial layer 171. Of course, the initial sacrificial layer 1700 may also include more film layers. In this example, by setting the initial sacrificial layer 1700 to include the first initial sacrificial layer 1710 and the second initial sacrificial layer 1720, the initial sacrificial layer 1700 can be etched step by step, and the light emitting structure 120 can be exposed more accurately.

[0163] In yet another possible example, the protective material layer 1420 may be formed on the optical material layer 1410 , and at the same time, the protective material layer 1420 may be etched before the optical material layer 1410 , and the remaining protective material layer 1420 may form the protective layer 142 .

[0164] In another possible example, after forming the initial sacrificial layer 1700 on the light emitting structure 120, the method includes:

[0165] Step S21 : forming a side protection material layer 1800 covering the initial sacrificial layer 1700 , the light emitting structure 120 and the substrate 110 .

[0166] At this time, step S30 includes:

[0167] Step S31 : forming an isolation material layer 1500 on the side protection material layer 1800 .

[0168] Step S32 : etching the isolation material layer 1500 to form an isolation structure 150 , wherein the isolation structure 150 includes a filling portion 151 and a top portion 152 . The filling portion 151 fills the area between adjacent light emitting structures 120 , and the top portion 152 is located on a side of the filling portion 151 away from the substrate 110 .

[0169] Accordingly, step S411 includes:

[0170] Step S4111 : etching the optical material layer 1410 , the side protection material layer 1800 and the initial sacrificial layer 1700 in sequence until the light emitting structure 120 is exposed, and the remaining side protection material layer 1800 forms the side protection layer 180 .

[0171] In step S21 , the side protection material layer 1800 can be used to maintain the etching morphology in subsequent steps. The side protection material layer 1800 can be formed on the entire surface, thereby covering each film layer structure on the substrate 110 .

[0172] In step S31 and step S32, an isolation material layer 1500 is first formed on the entire surface of the side protection material layer 1800, and then the isolation material layer 1500 is patterned to expose the initial sacrificial layer 1700 to form an isolation structure 150. For example, see Figure 2 , the longitudinal section of the top 152 of the isolation structure 150 above the adjacent light emitting structure 120 is a regular trapezoid. At this time, the top 152 of the isolation structure 150 may have a top surface 1521 and a side surface 1522 away from the substrate 110. The top surface 1521 of the top 152 may include a horizontal surface, for example, the top surface 1521 of the top 152 may be perpendicular to the light emitting direction. The side surface 1522 of the top 152 may also include an inclined surface, for example, the side surface 1522 of the top 152 may be an acute angle with the light emitting direction.

[0173] In step S4111 , a portion of the side protection material layer 1800 above the light emitting structure 120 is removed, and the remaining side protection material layer 1800 forms a side protection layer 180 .

[0174] In this embodiment, the isolation material layer 1500 is patterned to form the isolation structure 150, so as to form the side 1522 of the inclined top 152, so as to form the inclined optical structure 140, thereby better reflecting light. Moreover, the first electrode 130 covering the protective layer 142 can be formed later, and the isolation structure 150 can make the first electrode 130 cover the multiple light-emitting structures 120 more continuously. In addition, the side protection material layer 1800 can also help maintain the morphology of the film layer during the etching process, so as to obtain a more regular second opening 200 and the first opening 210.

[0175] In one embodiment, see Figures 8 to 11 At the same time as step S20, an initial sacrificial layer 1700 is formed on the light emitting structure 120. Step S40 includes:

[0176] Step S420 : forming an isolation material layer 1500 on the initial sacrificial layer 1700 and the substrate 110 .

[0177] Step S421 : forming an optical material layer 1410 covering the isolation material layer 1500 .

[0178] Step S422 : The optical material layer 1410 , the isolation material layer 1500 and the initial sacrificial layer 1700 are sequentially etched to expose the light emitting structure 120 , and the remaining optical material layer 1410 , the isolation material layer 1500 and the initial sacrificial layer 1700 form the optical structure 140 , the isolation structure 150 and the sacrificial layer 170 .

[0179] In step S420 to step S422, the isolation material layer 1500 may have a flat upper surface. After forming the optical material layer 1410, the optical material layer 1410 may be flattened by mechanical grinding or the like to obtain a flat upper surface. Thereafter, a patterned photoresist layer 300 may be formed on the upper surface of the optical material layer 1410, and based on the patterned photoresist layer 300, the optical material layer 1410, the isolation material layer 1500 and the initial sacrificial layer 1700 may be etched in a single etching process to expose the light emitting structure 120.

[0180] In this embodiment, by forming an optical material layer 1410 covering the isolation material layer 1500, a protective layer 142, a reflective layer 141 and an isolation structure 150 can be obtained through a single etching process, thereby improving the preparation efficiency of the display panel 100 and reducing the number of masks used in preparing the display panel 100.

[0181] It should be understood that although Fig.13The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Fig.13 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

[0182] Based on the same inventive concept, in one embodiment, a display device is provided, which includes a display panel formed by any one or a combination of the foregoing embodiments, or is prepared using a display device preparation method provided by any one or a combination of the foregoing embodiments.

[0183] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that "this embodiment" or "one embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present disclosure. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification may not necessarily refer to the same embodiment.

[0184] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0185] The embodiments described above only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all fall within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the attached claims. The above description is only a preferred implementation method of the present disclosure, and does not limit the scope of the patent of the present disclosure. All equivalent structural transformations made by using the contents of the present disclosure specification and drawings under the inventive concept of the present disclosure, or direct / indirect application in other related technical fields are included in the scope of protection of the patent of the present disclosure.

Claims

1. A display panel, characterized in that: include: substrate; A plurality of light emitting structures are located on one side of the substrate, and the plurality of light emitting structures are arranged at intervals; A first electrode, located on a side of the light emitting structure away from the substrate; The optical structure is located on a side of the light emitting structure away from the substrate, and the orthographic projection of the optical structure on the substrate is at least partially located between the orthographic projections of adjacent light emitting structures on the substrate.

2. The display panel according to claim 1, characterized in that: The display panel further includes: The isolation structure is located on a side of the light emitting structure away from the substrate and is surrounded to form a first opening, wherein the first opening at least partially exposes the light emitting structure. The optical structure is located on a side of the isolation structure away from the substrate.

3. The display panel according to claim 2, characterized in that: The optical structure is arranged to form a second opening, and an orthographic projection of the first opening on the substrate at least partially overlaps with an orthographic projection of the second opening on the substrate; Optionally, an orthographic projection of the second opening on the substrate covers an orthographic projection of the first opening on the substrate.

4. The display panel according to claim 3, characterized in that: The optical structure covers at least a portion of a side surface of the isolation structure facing the first opening.

5. The display panel according to claim 4, characterized in that: The isolation structure comprises a filling portion and a top portion, wherein the top portion is located on a side of the filling portion away from the substrate, and the optical structure covers a side surface of the top portion facing the first opening; Optionally, an orthographic projection of the top portion on the substrate covers an orthographic projection of the filling portion on the substrate.

6. The display panel according to claim 5, characterized in that: The top has a top surface away from the substrate, the optical structure also covers the top surface of the top, the optical structure has a top surface away from the substrate and a side surface facing the second opening, the first electrode covers the top surface and the side surface of the optical structure and continuously covers the multiple light-emitting structures.

7. The display panel according to claim 3, characterized in that: The optical structure covers a top surface of the isolation structure away from the substrate.

8. The display panel according to claim 7, characterized in that: The isolation structure comprises a filling portion and a top portion, wherein the top portion is located at a side of the filling portion away from the substrate, and an opening enclosed by the top portion is connected to the second opening and exposes the light emitting structure; Optionally, the orthographic projection of the top portion on the substrate covers the orthographic projection of the filling portion on the substrate; Optionally, the optical structure has a top surface away from the substrate and a side surface facing the second opening, and the first electrode continuously covers the multiple light-emitting structures and extends along the top of the isolation structure toward the side surface of the first opening to the side surface of the optical structure and the top surface of the optical structure.

9. The display panel according to claim 5 or 8, characterized in that: The top portion above the adjacent light emitting structure has a vertical section in a right trapezoidal shape along the thickness direction of the substrate.

10. The display panel according to claim 3, characterized in that: The display panel further includes: A pixel definition layer is located on one side of the substrate, the pixel definition layer has a plurality of light-emitting openings, the light-emitting structure is at least partially located in the light-emitting openings, and the isolation structure is located on a side of the pixel definition layer away from the substrate; A second electrode is located on a side of the light emitting structure close to the substrate; Optionally, the display panel further comprises a sacrificial layer, and along the thickness direction of the substrate, the sacrificial layer is located between the light emitting structure and the optical structure; Optionally, the sacrificial layer includes a first sacrificial layer and a second sacrificial layer which are stacked; Optionally, the display panel further includes a side protection layer, wherein the side protection layer covers a side of the light emitting structure away from the light emitting opening; Optionally, the side protection layer extends along the side of the sacrificial layer away from the light-emitting opening to the top surface of the sacrificial layer away from the substrate, and the isolation structure is located on the side of the side protection layer away from the substrate; Optionally, the display panel further includes an encapsulation layer, and the encapsulation layer covers the first electrode and the optical structure.

11. The display panel according to claim 2, characterized in that: The optical structure comprises a reflective layer and a protective layer, the first electrode is located on a side of the protective layer away from the isolation structure, and the reflective layer is located on a side of the protective layer close to the isolation structure; Optionally, the material of the reflective layer includes metal; Optionally, the material of the protection layer includes a transparent insulating material.

12. The display panel according to claim 1, characterized in that: The display panel further includes: A common layer is located between the first electrode and the optical structure along the thickness direction of the substrate, and the common layer continuously covers the plurality of light-emitting structures.

13. A method for preparing a display panel, characterized in that: include: providing a substrate; forming a plurality of light-emitting structures spaced apart from each other on one side of the substrate; An optical structure is formed on a side of the light-emitting structure away from the substrate, and an orthographic projection of the optical structure on the substrate is at least partially located between orthographic projections of adjacent light-emitting structures on the substrate; A first electrode covering the plurality of light emitting structures is formed on a side of the light emitting structure away from the substrate.

14. The method for preparing a display panel according to claim 13, characterized in that: Before forming the optical structure on the side of the light emitting structure away from the substrate, the method comprises: An isolation structure is formed on a side of the light emitting structure away from the substrate, wherein the isolation structure is surrounded to form a first opening, and the first opening at least exposes a portion of the light emitting structure; The optical structure is formed on a side of the light emitting structure away from the substrate, comprising: The optical structure is formed on the top surface and the side wall of the isolation structure, the optical structure is arranged to form a second opening, and the orthographic projection of the first opening on the substrate and the orthographic projection of the second opening on the substrate at least partially overlap; The first electrode covering the plurality of light emitting structures is formed on a side of the light emitting structure away from the substrate, comprising: forming a first electrode covering the optical structure and the plurality of light-emitting structures; Optionally, the optical structure includes a reflective layer and a protective layer, and the optical structure is formed on the top surface and sidewall of the isolation structure, including: forming the reflective layer on the top surface and sidewalls of the isolation structure; forming the protective layer covering the reflective layer; Optionally, the forming of a first electrode covering the optical structure and the plurality of light-emitting structures comprises: forming a common layer covering the protective layer and the plurality of light emitting structures; forming a first electrode covering the common layer; Optionally, the optical structure comprises a reflective structure, and the reflective layer comprises a reflective layer.

15. The method for preparing a display panel according to claim 14, characterized in that: forming a plurality of light emitting structures spaced apart from each other on the substrate, and forming an initial sacrificial layer on the light emitting structures; An optical structure is formed on the top surface and sidewalls of the isolation structure, including: forming an optical material layer on the isolation structure and the initial sacrificial layer; The optical material layer and the initial sacrificial layer are sequentially etched until the light-emitting structure is exposed, and the remaining optical material layer forms the optical structure, and the remaining initial sacrificial layer forms a sacrificial layer; Optionally, the initial sacrificial layer includes a first initial sacrificial layer close to the light emitting structure and a second initial sacrificial layer far from the light emitting structure. The step of sequentially etching the optical material layer and the initial sacrificial layer until the light emitting structure is exposed comprises: Using the first initial sacrificial layer as an etching stop layer, sequentially etching the optical material layer and the second initial sacrificial layer, the remaining optical material layer forms the optical structure, and the remaining second initial sacrificial layer forms a second sacrificial layer; Using the optical structure and the second sacrificial layer as mask layers, etching the first initial sacrificial layer until the light-emitting structure is exposed, and the remaining first initial sacrificial layer forms a first sacrificial layer; Optionally, after forming an initial sacrificial layer on the light emitting structure, the method further comprises: forming a side protection material layer covering the initial sacrificial layer, the light emitting structure and the substrate; The step of sequentially etching the optical material layer and the initial sacrificial layer until the light emitting structure is exposed comprises: The optical material layer, the side protection material layer and the initial sacrificial layer are sequentially etched until the light-emitting structure is exposed, and the remaining side protection material layer forms a side protection layer; Optionally, forming an isolation structure on a side of the light emitting structure away from the substrate includes: forming an isolation material layer on the side protection material layer; Etching the isolation material layer to form the isolation structure, wherein the isolation structure includes a filling portion and a top portion, wherein the filling portion fills the area between adjacent light-emitting structures, and the top portion is located on a side of the filling portion away from the substrate; Optionally, a longitudinal section of a top portion of the isolation structure above the adjacent light-emitting structure along a thickness direction of the substrate is in the shape of a right trapezoid.

16. The method for preparing a display panel according to claim 13, characterized in that: The method comprises forming a plurality of light emitting structures spaced apart from each other on the substrate, forming an initial sacrificial layer on the light emitting structure, and forming an optical structure on a side of the light emitting structure away from the substrate, comprising: forming an isolation material layer on the initial sacrificial layer and the substrate; forming an optical material layer covering the isolation material layer; The optical material layer, the isolation material layer and the initial sacrificial layer are sequentially etched until the light-emitting structure is exposed, and the remaining optical material layer, the isolation material layer and the initial sacrificial layer form the optical structure, the isolation structure and the sacrificial layer.

17. A display device, characterized in that: The invention comprises the display panel as claimed in any one of claims 1 to 12.

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