Display panel, preparation method of display panel and display equipment

Abstract

The invention provides a display panel, a preparation method of the display panel and display equipment. The display panel comprises a substrate, an isolation structure, a plurality of light emitting devices and a plurality of packaging parts, the isolation structure is located on one side of the substrate, and a plurality of isolation openings are defined; the light-emitting device is located in the isolation opening; the packaging part corresponds to the isolation opening and is located on the side, away from the substrate, of the light-emitting device, and the orthographic projection of the packaging part on the substrate covers the orthographic projection of the isolation opening on the substrate; the packaging part comprises first packaging units, and the first packaging units corresponding to the at least two light-emitting devices are different in thickness in the direction away from the substrate; the first packaging unit is used for reducing reflection of target light; the target light comprises light emitted by the light-emitting device corresponding to the first packaging unit. Therefore, the first packaging units with different thicknesses are arranged, so that light rays with corresponding colors can be transmitted as much as possible, and the display effect of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] With the development of display technology, display panels are increasingly widely used in people's production and life. At the same time, people's requirements for display panels are getting higher and higher. Among them, how to improve the display effect of display panels has always attracted people's attention. Summary of the invention

[0003] In view of this, the present application is dedicated to providing a display panel, a method for preparing a display panel, and a display device, which can effectively improve the display effect of the display panel.

[0004] In a first aspect, the present application provides a display panel, comprising:

[0005] substrate;

[0006] An isolation structure, located on one side of the substrate, defining a plurality of isolation openings;

[0007] a plurality of light emitting devices, wherein the light emitting devices are located in the isolation openings;

[0008] A plurality of packaging parts corresponding to the isolation openings; the packaging parts are located on a side of the light-emitting device away from the substrate, and the orthographic projections of the packaging parts on the substrate cover the orthographic projections of the corresponding isolation openings on the substrate;

[0009] The packaging part includes a first packaging unit; the first packaging units corresponding to at least two of the light-emitting devices have different thicknesses in a direction away from the substrate; the first packaging unit is used to reduce reflection and increase transmittance of target light; the target light includes light emitted by the light-emitting device corresponding to the first packaging unit.

[0010] Optionally, the light-emitting device includes a first color light-emitting device; the first packaging unit corresponding to the first color light-emitting device and located in the light-emitting area has a first thickness in a direction away from the substrate; and the first thickness is 1 / 4 of the wavelength of the first color light.

[0011] Optionally, the first color light emitting device includes a red light emitting device;

[0012] The first thickness ranges from 155 nm to 190 nm.

[0013] Optionally, the light-emitting device also includes a second color light-emitting device; the first packaging unit corresponding to the second color light-emitting device and located in the light-emitting area has a second thickness in a direction away from the substrate; and the second thickness is 1 / 4 of the wavelength of the second color light.

[0014] Optionally, the second color light emitting device includes a green light emitting device;

[0015] The second thickness ranges from 123 nm to 145 nm.

[0016] Optionally, the light-emitting device also includes a third color light-emitting device; the first packaging unit corresponding to the third color light-emitting device and located in the light-emitting area has a third thickness in a direction away from the substrate; and the third thickness is 1 / 4 of the wavelength of the third color light.

[0017] Optionally, the third color light emitting device includes a blue light emitting device;

[0018] The third thickness ranges from 108 nm to 123 nm.

[0019] Optionally, the packaging unit further includes a second packaging unit stacked with the first packaging unit;

[0020] The thickness of the second packaging unit in a direction away from the substrate is greater than or equal to the thickness of the corresponding first packaging unit in the direction away from the substrate.

[0021] Optionally, the second packaging unit is located on a side of the first packaging unit away from the substrate;

[0022] Optionally, the orthographic projection of the first packaging unit on the substrate completely covers the orthographic projection of the isolation opening on the substrate;

[0023] Optionally, an orthographic projection of the second packaging unit on the substrate coincides with an orthographic projection of the first packaging unit on the substrate.

[0024] Optionally, the second packaging unit is located on a side of the first packaging unit close to the substrate;

[0025] Optionally, the orthographic projection of the second packaging unit on the substrate covers the orthographic projection of the isolation opening on the substrate;

[0026] Optionally, an orthographic projection of the first packaging unit on the substrate coincides with an orthographic projection of the second packaging unit on the substrate.

[0027] Optionally, the first packaging unit and the second packaging unit are made of different materials;

[0028] Optionally, the material of the first packaging unit includes at least one of silicon oxide and silicon oxynitride;

[0029] Optionally, the material of the second packaging unit includes silicon nitride.

[0030] Optionally, the light-emitting device comprises a first electrode, a light-emitting functional layer, and a second electrode which are sequentially stacked in a direction away from the substrate;

[0031] The packaging portion is located on a side of the second electrode away from the substrate;

[0032] Optionally, a side edge of the second electrode overlaps a side wall of the isolation structure.

[0033] Optionally, an insulating layer is also included;

[0034] The insulating layer defines a plurality of pixel openings; the pixel openings expose at least a portion of the first electrode; the pixel openings are connected to the isolation openings, and the orthographic projections of the pixel openings on the substrate are located within the orthographic projections of the isolation openings on the substrate;

[0035] Optionally, the isolation structure is located on a side of the insulating layer away from the substrate; or,

[0036] The insulating layer is further provided with a receiving opening, and the isolation structure is located in the receiving opening of the insulating layer; or,

[0037] The insulating layer comprises a plurality of insulating parts arranged at intervals, the insulating parts cover the side edges of the first electrode and are arranged in a ring shape around the side edges of the first electrode, and the isolation structure is located in the intervals between adjacent insulating parts;

[0038] Optionally, the insulating layer includes a pixel defining layer.

[0039] Optionally, the isolation structure includes a first structure and a second structure sequentially stacked in a direction away from the substrate;

[0040] The orthographic projection of the second structure on the substrate covers the orthographic projection of the first structure on the substrate;

[0041] Optionally, the first structure and the second structure are made of different materials;

[0042] Optionally, the material of the second structure includes titanium;

[0043] Optionally, the isolation structure further includes a third structure located on a side of the first structure close to the substrate;

[0044] Optionally, the orthographic projection of the third structure on the substrate covers the orthographic projection of the first structure on the substrate;

[0045] Optionally, the third structure is made of a different material from the first structure;

[0046] Optionally, the material of the third structure includes molybdenum or titanium;

[0047] Optionally, the material of the first structure includes aluminum.

[0048] Optionally, a second encapsulation layer is also included;

[0049] The second encapsulation layer is located on a side of the plurality of encapsulation portions away from the substrate; an orthographic projection of the second encapsulation layer on the substrate covers the substrate;

[0050] Optionally, a third encapsulation layer is further included;

[0051] The third encapsulation layer is located on a side of the second encapsulation layer away from the substrate; the orthographic projection of the third encapsulation layer on the substrate covers the substrate;

[0052] Optionally, the material of the encapsulation part includes an inorganic material; and / or the material of the second encapsulation layer includes an organic material; and / or the material of the third encapsulation layer includes an inorganic material.

[0053] In a second aspect, the present application further provides a display panel, including:

[0054] substrate;

[0055] An isolation structure, located on one side of the substrate, defining a plurality of isolation openings;

[0056] A plurality of light-emitting devices, each of which comprises a light-emitting functional layer and a second electrode which are sequentially stacked in a direction away from the substrate; the light-emitting functional layer and the second electrode are located in the isolation opening;

[0057] The anti-reflection film layer is located on the side of the second electrode away from the substrate, and includes a plurality of anti-reflection units corresponding to the light-emitting devices; at least two anti-reflection units corresponding to the light-emitting devices have different thicknesses in a direction away from the substrate; the anti-reflection units are used to reduce reflection and increase transmittance of target light; the target light includes light emitted by the light-emitting device corresponding to the anti-reflection units.

[0058] Optionally, the thickness of the anti-reflection film layer in a direction away from the substrate is a target thickness; the target thickness is 1 / 4 of the wavelength of the target light.

[0059] Optionally, it further comprises a plurality of packaging parts located on a side of the anti-reflection film layer away from the substrate and corresponding to the isolation openings;

[0060] The orthographic projection of the packaging portion on the substrate covers the orthographic projection of the isolation opening on the substrate.

[0061] In a third aspect, the present application provides a method for preparing a display panel, comprising:

[0062] providing a substrate;

[0063] An isolation structure, a plurality of light-emitting devices and a plurality of packaging parts are formed on the substrate; the isolation structure is located on one side of the substrate and defines a plurality of isolation openings; the light-emitting devices are located in the isolation openings; the packaging part corresponds to the isolation openings; the orthographic projection of the packaging part on the substrate covers the orthographic projection of the corresponding isolation opening on the substrate; the packaging part includes a first packaging unit; the first packaging units corresponding to at least two of the light-emitting devices have different thicknesses in a direction away from the substrate; the first packaging unit is used for reducing reflection and increasing transmittance of target light; the target light includes light emitted by the light-emitting device corresponding to the first packaging unit.

[0064] In a fourth aspect, the present application provides a display device, comprising the display panel as described in the first aspect or the second aspect of the present application.

[0065] In the scheme of the present application, the display panel includes a substrate, an isolation structure, a plurality of light-emitting devices and a plurality of packaging parts, the isolation structure is located on one side of the substrate, and defines a plurality of isolation openings; the light-emitting device is located in the isolation opening; the packaging part corresponds to the isolation opening, and is located on the side of the light-emitting device away from the substrate, and the orthographic projection of the packaging part on the substrate covers the orthographic projection of the isolation opening on the substrate; the packaging part includes a first packaging unit, and the first packaging units corresponding to at least two light-emitting devices have different thicknesses in the direction away from the substrate; the first packaging unit is used to reduce reflection and increase transmittance of the target light; the target light includes the light emitted by the light-emitting device corresponding to the first packaging unit. In this way, first packaging units of different thicknesses can be set for light-emitting devices with different light-emitting colors, so that the first packaging unit can transmit as much light of the corresponding color as possible for different light-emitting colors, thereby achieving the effect of reducing reflection and increasing transmittance, thereby greatly improving the efficiency of the first packaging layer in extracting the light emitted by the light-emitting device, and then increasing the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0067] Figure 1 It is a structural schematic diagram of a display panel provided by the existing related technology;

[0068] Figure 2 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present application;

[0069] Figure 3 Yes Figure 2 The cross-sectional structure diagram of the display panel after being cut along the cutting line AA′ is shown;

[0070] Figure 4 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0071] Figure 5 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0072] Figure 6 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0073] Figure 7 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0074] Figure 8 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0075] Fig. 9 is a structural schematic diagram of a display panel provided by another embodiment of the present application;

[0076] Fig.10 It is a schematic flow chart of a method for preparing a display panel provided in one embodiment of the present application;

[0077] Fig.11 It is a schematic diagram of the structure of a display device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0078] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this specification shall have the common meanings understood by persons with ordinary skills in the field to which this specification belongs. The words "first", "second" and similar words used in the embodiments of this specification do not indicate any order, quantity or importance, but are only used to avoid confusion of constituent elements.

[0079] Unless the context requires otherwise, throughout the specification, "plurality" means "at least two", and "including" is interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" are intended to indicate that a particular feature, structure, material or characteristic associated with the embodiment or example is included in at least one embodiment or example of the specification. The schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0080] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0081] With the development and progress of display technology, the application of organic light emitting diode (OLED) display panels is becoming more and more widespread. Accordingly, how to improve the display effect of display panel preparation has always been the focus of people's attention.

[0082] The inventors have found that during the preparation of OLED display panels, sub-pixel level packaging is used during packaging, such as Figure 1 As shown, for each light emitting device 121 of light emitting color, there is a separate packaging part 20A, and for light emitting devices 121 of different colors, the corresponding packaging parts 20A are basically the same. The unified packaging part 20A makes the extraction efficiency of each color of light still have room for improvement.

[0083] To this end, the present application provides a solution that can effectively improve the display effect. By setting first packaging units of different thicknesses for light-emitting devices of different colors, the first packaging unit corresponding to each light-emitting device can transmit as much light of the corresponding color as possible, thereby achieving the effect of reducing reflection and increasing transmittance, thereby greatly improving the efficiency of extracting light emitted by the light-emitting device and increasing the display effect of the display panel.

[0084] Specifically, as an optional implementation of the contents disclosed in this application, an embodiment of this application provides a display panel. Figure 2 is a schematic diagram of the structure of a display panel provided by an embodiment of the present application, Figure 3 Yes Figure 2 The cross-sectional structure diagram of the display panel after being cut along the cutting line AA′ is shown in FIG. Figure 2 and Figure 3 As shown, the display panel may at least include: a substrate 10 , an isolation structure 11 , a light emitting layer 12 and a first encapsulation layer 20 .

[0085] The substrate 10 mainly plays the role of supporting and bearing. Specifically, the substrate 10 may include a rigid substrate such as a glass substrate or a silicon substrate, or a flexible substrate such as stainless steel (SUS) or flexible polyimide (PI). That is, the display panel in the embodiment of the present application may include a non-bendable rigid display panel, or a bendable flexible display panel.

[0086] like Figure 3 As shown, the light emitting layer 12 may include a plurality of light emitting devices 121 .

[0087] like Figure 4 As shown, the isolation structure 11 is located on one side of the substrate 10 and defines a plurality of isolation openings K. The light emitting device 121 is located in the isolation openings K.

[0088] Specifically, the light emitting device 121 may include a light emitting functional layer 1211 . With such a configuration, the light emitting functional layer 1211 of each light emitting device 121 may be isolated by the isolation structure 11 , thereby obtaining each independent sub-pixel.

[0089] It should be noted that patent applications CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 record relevant technologies of the isolation structure 11, and their contents are incorporated into this application by reference for reference.

[0090] like Figure 4 As shown, the light emitting device 121 may further include a first electrode 1212 located on a side of the light emitting functional layer 1211 close to the substrate 10 , and a second electrode 1213 located on a side of the light emitting functional layer 1211 away from the substrate 10 .

[0091] Specifically, the light-emitting functional layer 1211 may include a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer and an electron injection layer stacked in sequence on the side of the first electrode 1212 facing away from the substrate 10. A second electrode 1213 is provided on the side of the electron injection layer facing away from the substrate 10.

[0092] Among them, the light-emitting material layer may include a material with electroluminescence (EL) properties (hereinafter referred to as the light-emitting material). The first electrode 1212 may also be called an anode, which is used to provide holes to the light-emitting functional layer 1211, and the second electrode 1213 may also be called a cathode, which is used to provide electrons to the light-emitting material layer. The holes provided by the first electrode 1212 and the electrons provided by the second electrode 1213 can excite the light-emitting material of the light-emitting material layer to emit light after the light-emitting material layer is recombined. The hole injection layer and the hole transport layer can be made of a material with high hole mobility, so that the holes generated by the first electrode 1212 are better transferred to the light-emitting material layer. Similarly, the electron injection layer and the electron transport layer can be made of a material with high electron mobility, so that the electrons generated by the second electrode 1213 are better transferred to the light-emitting material layer.

[0093] The first encapsulation layer 20 is located on the side of the light-emitting layer 12 away from the substrate 10, and may include multiple encapsulation parts 20A corresponding to the isolation openings K; the multiple encapsulation parts 20A are respectively located on the side of the multiple light-emitting devices 121 away from the substrate 10; the orthographic projection of the encapsulation part 20A on the substrate 10 covers the orthographic projection of the corresponding isolation opening K on the substrate 10.

[0094] In this way, each packaging part 20A can be used to package each light emitting device 121 respectively, so as to achieve independent packaging of each light emitting device 121 , which provides structural guarantee for the effectiveness of each light emitting device 121 .

[0095] like Figure 4 As shown, the encapsulation part 20A may include a first encapsulation unit 201. The first encapsulation units 201 corresponding to at least two light-emitting devices 121 have different thicknesses h1 in a direction away from the substrate 10. The first encapsulation unit 201 is used to reduce reflection and increase transmittance of target light; the target light includes light emitted by the light-emitting device 121 corresponding to the first encapsulation unit 201.

[0096] It should be understood that in this specification, the thickness of the first packaging unit 201 refers to the thickness h1 of the first packaging unit 201 in the direction away from the substrate 10. Moreover, the first packaging unit 201 has different thicknesses, and its transmittance to the target light is also different.

[0097] Specifically, at least two light emitting devices 121 with different thicknesses h1 refer to at least two light emitting devices 121 with different light emitting colors. In this way, first packaging units 201 with different thicknesses can be set for light emitting devices 121 with different light emitting colors, so that the first packaging unit 201 can achieve the effect of anti-reflection and anti-transmission for the target light, thereby improving the light extraction efficiency of the first packaging unit 201 for the target light and increasing the display effect of the display panel.

[0098] In the embodiment of the present application, first packaging units 201 of different thicknesses are set for light-emitting devices 121 with different light-emitting colors, so that the first packaging unit 201 can achieve the effect of reducing reflection and increasing transmittance for target light. Compared with setting the first packaging unit 201 of the same thickness for light-emitting devices 121 with different light-emitting colors, it is obvious that the former can improve the light extraction efficiency to a greater extent and has a better display effect.

[0099] Specifically, in order to improve the transmittance of the first packaging unit 201 to the target light, in some implementations, Figure 4 As shown, the thickness h1 of the first encapsulation unit 201 located in the light emitting region S in the direction away from the substrate 10 may be a target thickness; the target thickness is 1 / 4 of the wavelength of the target light.

[0100] It should be understood that when the film thickness is designed to be 1 / 4 of the wavelength of the incident light in the thin film medium, the reflected light can be effectively reduced, thereby maximizing the intensity of the transmitted light. Therefore, designing the thickness of the first packaging unit 201 to be 1 / 4 of the wavelength of the target light can maximize the transmittance of the first packaging unit 201 to the target light, that is, maximize the light extraction efficiency of the first packaging unit 201 to the target light.

[0101] In some embodiments, the light emitting device 121 may include a first color light emitting device.

[0102] Correspondingly, the first encapsulation unit 201 corresponding to the first color light emitting device and located in the light emitting area S has a first thickness in a direction away from the substrate 10; the first thickness is 1 / 4 of the wavelength of the first color light.

[0103] In this way, the light extraction efficiency of the display panel for the first color light emitted by the first color light emitting device can be greatly improved, thereby improving the display effect of the display panel.

[0104] In implementation, the first color light emitting device may include a red light emitting device.

[0105] The light color of the red light emitting device is red, and the wavelength of the red light is 620nm to 760nm. Accordingly, the range of the first thickness may include: 155nm to 190nm.

[0106] For example, the first thickness may be 155 nm, and the first packaging unit 201 corresponding to the red light-emitting device may maximize the light extraction efficiency of the red light with a thinner thickness; or, the first thickness may be 160 nm, and the first packaging unit 201 corresponding to the red light-emitting device may appropriately improve the packaging effect by increasing the thickness while taking into account the improvement of the light extraction efficiency of the red light; or, the first thickness may be 190 nm, and the first packaging unit 201 corresponding to the red light-emitting device may improve the packaging effect of the first packaging unit 201 to a greater extent while taking into account the improvement of the light extraction efficiency of the red light.

[0107] In some implementations, the light emitting device may further include a second color light emitting device.

[0108] Correspondingly, the first encapsulation unit 201 corresponding to the second color light emitting device and located in the light emitting region S has a second thickness in a direction away from the substrate 10; the second thickness is 1 / 4 of the wavelength of the second color light.

[0109] In this way, the light extraction efficiency of the display panel for the second color light emitted by the second color light emitting device can be greatly improved, thereby improving the display effect of the display panel.

[0110] Specifically, the second color light emitting device may include a green light emitting device.

[0111] The light color of the green light emitting device is green, and the wavelength of the green light is 500nm to 570nm. Accordingly, the range of the second thickness may include: 123nm to 145nm.

[0112] For example, the second thickness may be 123 nm, and the first packaging unit 201 corresponding to the green light-emitting device may maximize the light extraction efficiency of the green light with a thinner thickness; or, the second thickness may be 130 nm, and the first packaging unit 201 corresponding to the green light-emitting device may appropriately improve the packaging effect by increasing the thickness while taking into account the improvement of the light extraction efficiency of the green light; or, the second thickness may be 145 nm, and the first packaging unit 201 corresponding to the green light-emitting device may improve the packaging effect of the first packaging unit 201 to a greater extent while taking into account the improvement of the light extraction efficiency of the green light.

[0113] In some implementations, the light emitting device may further include a third color light emitting device.

[0114] Correspondingly, the first encapsulation unit 201 corresponding to the third color light emitting device and located in the light emitting region S has a third thickness in a direction away from the substrate 10; the third thickness is 1 / 4 of the wavelength of the third color light.

[0115] In this way, the light extraction efficiency of the display panel for the third color light emitted by the third color light emitting device can be greatly improved, thereby improving the display effect of the display panel.

[0116] Specifically, the third color light emitting device may include a blue light emitting device.

[0117] The light color of the blue light emitting device is blue, and the wavelength of the blue light is 440nm to 485nm. Accordingly, the range of the third thickness may include: 108nm to 123nm.

[0118] For example, the third thickness may be 108 nm, and the first packaging unit 201 corresponding to the blue light-emitting device may maximize the light extraction efficiency of the blue light with a thinner thickness; or, the third thickness may be 111 nm, and the first packaging unit 201 corresponding to the blue light-emitting device may appropriately improve the packaging effect by increasing the thickness while taking into account the improvement of the light extraction efficiency of the blue light; or, the third thickness may be 123 nm, and the first packaging unit 201 corresponding to the blue light-emitting device may improve the packaging effect of the first packaging unit 201 to a greater extent while taking into account the improvement of the light extraction efficiency of the blue light.

[0119] During implementation, the light-emitting device 121 may include at least one of a first color light-emitting device, a second color light-emitting device and a third color light-emitting device. Accordingly, according to the light-emitting devices 121 of different colors, the first packaging units 201 of different thicknesses are set, so that the first packaging units 201 can have the effect of reducing reflection and increasing transmittance on the light emitted by the corresponding light-emitting device 121, thereby greatly improving the light extraction efficiency of the display panel and enhancing the display effect.

[0120] It should be understood that the embodiments of the present application are only described using the light output color of the light emitting device 121 including red, green and / or blue as an example, but the present application is not limited to this. In some other embodiments, the light output color of the light emitting device 121 may also include other colors, such as yellow, purple, and the like.

[0121] When the packaging part 20A packages the corresponding light emitting device 121, in order to achieve the effect of the first packaging unit 201 on anti-reflection and anti-transmission of the target light, the thickness of the first packaging unit 201 will be relatively thin, which will lead to insufficient packaging performance of the first packaging unit 201. Figure 5 As shown, the packaging unit 20A of the display panel may further include a second packaging unit 202 stacked with the first packaging unit 201 .

[0122] By adding the second packaging unit 202 , the packaging effect of the packaging portion 20A can be further improved, thereby improving the reliability of the display panel and increasing the product yield.

[0123] During implementation, the thickness of the second packaging unit 202 in the direction away from the substrate 10 may be greater than or equal to the thickness of the corresponding first packaging unit 201 in the direction away from the substrate 10 .

[0124] For example, Figure 5 In the light emitting region S, a thickness h2 of the second encapsulation unit 202 in a direction away from the substrate 10 may be greater than or equal to a thickness h1 of the corresponding first encapsulation unit 201 in a direction away from the substrate 10 .

[0125] Specifically, the thickness h2 of the second packaging unit 202 in the direction away from the substrate 10 may be equal to the thickness h1 of the first packaging unit 201 in the direction away from the substrate 10 , so that the packaging performance of the packaging portion 20A can be improved and the reflection can be reduced.

[0126] The thickness h2 of the second packaging unit 202 in the direction away from the substrate 10 may also be greater than the thickness h1 of the corresponding first packaging unit 201 in the direction away from the substrate 10. In this way, the second packaging unit 202 can be used to ensure sufficient packaging performance, and the first packaging unit 201 can be used to achieve anti-reflection and anti-transmission of the target light, thereby ensuring the packaging effect of the packaging part 20A while improving the light output efficiency of the light-emitting device 121.

[0127] In a specific implementation, the second packaging unit 202 can be located on the side of the first packaging unit 201 away from the substrate 10 , so that the first packaging unit 201 is used to reduce reflection and increase transmittance of the target light, and the second packaging unit 202 is used to improve the packaging effect of the light-emitting device 121 .

[0128] Among them, the orthographic projection of the first packaging unit 201 on the substrate 10 can cover the orthographic projection of the isolation opening K on the substrate 10, that is, the first packaging unit 201 covers the second electrode 1213 exposed by the isolation opening K, thereby realizing the packaging of the light-emitting device 121 by the packaging part 20A. At the same time, it ensures that the first packaging unit 201 can cover the light-emitting area of ​​the light-emitting device 121, laying a structural foundation for the first packaging unit 201 to achieve anti-reflection and anti-transmission of the target light.

[0129] Furthermore, the orthographic projection of the second packaging unit 202 on the substrate 10 coincides with the orthographic projection of the first packaging unit 201 on the substrate 10 , and the second packaging unit 202 can be used to improve the packaging performance of the packaging part 20A on the basis of the first packaging unit 201 to ensure the packaging effect.

[0130] On the other hand, Figure 6 As shown, the second packaging unit 202 may also be located on a side of the first packaging unit 201 close to the substrate 10 .

[0131] The orthographic projection of the second encapsulation unit 202 on the substrate 10 covers the orthographic projection of the isolation opening K on the substrate 10 . Thus, the second encapsulation unit 202 covers the second electrode 1213 exposed by the isolation opening K, thereby achieving encapsulation of the light-emitting device 121 by the encapsulation part 20A.

[0132] Furthermore, the orthographic projection of the first packaging unit 201 on the substrate 10 coincides with the orthographic projection of the second packaging unit 202 on the substrate 10 , and the first packaging unit 201 can be used to reduce reflection and increase transmittance of light emitted by the light-emitting device 121 , thereby improving the light extraction efficiency of the display panel.

[0133] During application, the first packaging unit 201 and the second packaging unit 202 are made of different materials.

[0134] Specifically, the material of the first packaging unit 201 may include at least one of silicon oxide or silicon oxynitride, so as to achieve better light transmittance.

[0135] The material of the second packaging unit 202 may include silicon nitride to achieve a better packaging effect.

[0136] In a specific implementation, each packaging part 20A of the first packaging layer 20 may be formed by combining a chemical vapor deposition (CVD) method and an etching method.

[0137] It should be noted that the specification of the present application is only based on the example that the packaging part 20A includes a first packaging unit 201 and a second packaging unit 202 which are stacked, but the present application is not limited to this. In some other embodiments, the number of the first packaging unit 201 and the second packaging unit 202 can be multiple, and the stacking position of the multiple first packaging units 201 and / or the multiple second packaging units 202 can be set according to requirements, which is not specifically limited here.

[0138] In some embodiments, Figure 7 As shown, the display panel may further include an insulating layer 13 .

[0139] The insulating layer 13 defines a plurality of pixel openings R; the pixel openings R expose at least a portion of the first electrode 1212; the pixel openings R are connected to the isolation openings K, and the orthographic projection of the pixel openings R on the substrate 10 is located within the orthographic projection of the isolation openings K on the substrate 10.

[0140] The light emitting function layer 1211 of the light emitting device 11 is located within the pixel opening R.

[0141] During implementation, the isolation structure 11 may be located on a side of the insulating layer 13 facing away from the substrate 10 .

[0142] In some other embodiments, a receiving opening may be further provided on the insulating layer 13, and the isolation structure 11 is located in the receiving opening of the insulating layer 13; alternatively, the insulating layer 13 may include a plurality of insulating portions arranged at intervals, the insulating portions covering the side edges of the first electrode 1212 and being arranged in a ring shape around the side edges of the first electrode 1212, and the isolation structure 11 is located in the intervals between adjacent insulating portions.

[0143] The insulating property of the insulating layer 13 can insulate the first electrode 1212 from the isolation structure 11. In addition, since the area of ​​the first electrode 1212 of the light-emitting device 121 exposed by the pixel opening R is the light-emitting area S of the light-emitting device 121, the pixel opening R of the insulating layer 13 can better define the light-emitting area S.

[0144] When applicable, the insulating layer 13 may include a pixel defining layer.

[0145] In some embodiments, Figure 4 As shown, the second electrode 1213 is located in the isolation opening K, and the packaging portion 20A is located on the side of the second electrode 1213 away from the substrate 10 ; at least part of the side edge of the second electrode 1213 overlaps the side wall of the isolation structure 11 .

[0146] Specifically, all sides of the second electrode 1213 can overlap with the side walls of the isolation structure 11, or part of the sides of the second electrode 1213 can overlap with the side walls of the isolation structure 11. In this way, the electrical connection between the second electrode 1213 and the isolation structure 11 can be achieved, which provides convenience for simplifying the preparation process and improving the display effect.

[0147] In some embodiments, Figure 8 As shown, the isolation structure 11 may include a first structure 111 and a second structure 112 sequentially stacked in a direction away from the substrate 10 ; the orthographic projection of the second structure 112 on the substrate 10 covers the orthographic projection of the first structure 111 on the substrate 10 .

[0148] The first structure 111 and the second structure 112 may be an integrated structure, or the first structure 111 and the second structure 112 may be two independent film layers.

[0149] Specifically, the isolation structure 11 can be wide at the top and narrow at the bottom. For example, in the thickness direction of the display panel, the cross-sectional structure of the isolation structure 11 can be an inverted trapezoid or T-shaped, so that the orthographic projection of the second structure 112 on the substrate 10 covers the orthographic projection of the first structure 111 on the substrate 10.

[0150] During implementation, the light-emitting functional layer 1211 will be isolated by the isolation structure 11 during the evaporation process, and the light-emitting functional layer 1211 of the adjacent light-emitting device 121 will be isolated by the isolation structure 11. In addition, when the second electrode 1213 is formed, the second electrode 1213 will also be isolated by the isolation structure 11, resulting in the second electrodes 1213 of adjacent light-emitting devices 121 being arranged at intervals. In order to enable the second electrodes 1213 of adjacent light-emitting devices 121 to be electrically connected, the first structure 111 can be designed as a conductive structure, and the side edges of the second electrodes 1213 of the adjacent light-emitting devices 121 can be overlapped to the first structure 111, so that the production of the entire cathode can be facilitated and the preparation process can be simplified.

[0151] The first structure 111 and the second structure 112 may be two structures made of different materials. The first structure 111 and the second structure 112 may be made of different metals, such as the first structure 111 may be made of aluminum, or a laminate of aluminum and molybdenum, and the material of the second structure 112 may be titanium. Alternatively, the second structure 112 may be made of a metal material, and the first structure 111 may be made of an inorganic insulating material or an organic insulating material, such as inorganic insulating materials such as silicon oxide (SiOx) and silicon nitride (SiNx), or organic insulating materials such as PI, which may be selected according to actual conditions.

[0152] In some implementations, still Figure 8 As shown, the isolation structure 11 may further include a third structure 113 located on a side of the first structure 111 close to the substrate 10 .

[0153] Correspondingly, the cross-sectional structure of the isolation structure 11 may also be an I-shaped structure.

[0154] In implementation, the first structure 111, the second structure 112 and the third structure 113 may be three structures made of different materials. Specifically, the material of the first structure 111 may include aluminum, the material of the second structure 112 may include titanium, and the material of the third structure 113 may include titanium or molybdenum.

[0155] In some embodiments, Fig. 9 As shown, the display panel may further include a second encapsulation layer 21 ; the second encapsulation layer 21 is located on a side of the plurality of encapsulation portions 20A away from the substrate 10 ; and the orthographic projection of the second encapsulation layer 21 on the substrate 10 covers the substrate 10 .

[0156] The orthographic projection of the second encapsulation layer 21 on the substrate 10 covers the substrate 10 , thereby achieving further encapsulation of the light-emitting device 121 .

[0157] Specifically, the material of the second encapsulation layer 21 can be an organic material or an inorganic material. In implementation, the second encapsulation layer 21 can be an organic encapsulation film formed by inkjet printing.

[0158] In some implementations, still Fig. 9 As shown, the display panel may further include a third encapsulation layer 22; the third encapsulation layer 22 is located on the side of the second encapsulation layer 21 away from the substrate 10; the orthographic projection of the third encapsulation layer 22 on the substrate 10 covers the substrate 10. In this way, further encapsulation can be performed on the basis of the second encapsulation layer 21 to improve the encapsulation effect.

[0159] When used, the third encapsulation layer 22 can be made of inorganic materials, and the second encapsulation layer 21 can be made of organic materials. The second encapsulation layer 21 made of organic materials is located between the plurality of encapsulation parts 20A and the third encapsulation layer 22 made of inorganic materials, and can form an encapsulation structure. While improving the light extraction efficiency, the encapsulation structure can also better isolate water and oxygen, further improving the encapsulation effect.

[0160] Of course, in other embodiments, other film layers may be provided as needed. For example, a polarizer, an optical adhesive layer and a cover plate may be provided in sequence on the side of the third packaging layer 22 facing away from the substrate 10, so as to enhance the protection of the display panel while improving the display effect. Alternatively, when there is a touch demand, a touch function layer may be provided on the side of the third packaging layer 22 facing away from the substrate 10 to realize the touch function of the display panel, and so on. Details will not be repeated here.

[0161] As another optional implementation of the contents disclosed in the present application, an embodiment of the present application further provides a display panel, which may include: a substrate, an isolation structure, a light-emitting layer and an anti-reflection film layer.

[0162] The substrate mainly plays the role of supporting and bearing. Specifically, the substrate may include a rigid substrate such as a glass substrate or a silicon substrate, or a flexible substrate such as stainless steel (SUS) or flexible polyimide (PI). That is, the display panel in the embodiment of the present application may include a non-bendable rigid display panel, or a bendable flexible display panel.

[0163] The light emitting layer may include a plurality of light emitting devices, and the light emitting devices include a light emitting functional layer and a second electrode which are sequentially stacked in a direction away from the substrate.

[0164] The isolation structure is located on one side of the substrate, defining a plurality of isolation openings. The light-emitting functional layers and the second electrodes of the plurality of light-emitting devices are respectively located in the plurality of isolation openings. In this way, the light-emitting functional layers of the light-emitting devices can be isolated by the isolation structure, thereby obtaining independent sub-pixels.

[0165] The light emitting device may further include a first electrode located on a side of the light emitting functional layer close to the substrate, and a second electrode located on a side of the light emitting functional layer away from the substrate.

[0166] Specifically, the light-emitting functional layer may include a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer and an electron injection layer stacked in sequence on the side of the first electrode facing away from the substrate. The second electrode is arranged on the side of the electron injection layer facing away from the substrate.

[0167] Among them, the light-emitting material layer may include a material with electroluminescence (EL) properties (hereinafter referred to as the light-emitting material). The first electrode may also be called an anode, which is used to provide holes to the light-emitting functional layer, and the second electrode may also be called a cathode, which is used to provide electrons to the light-emitting material layer. The holes provided by the first electrode and the electrons provided by the second electrode can excite the light-emitting material of the light-emitting material layer to emit light after the light-emitting material layer is recombined. The hole injection layer and the hole transport layer can be made of a material with high hole mobility, so that the holes generated by the first electrode can be better transferred to the light-emitting material layer. Similarly, the electron injection layer and the electron transport layer can be made of a material with high electron mobility, so that the electrons generated by the second electrode can be better transferred to the light-emitting material layer.

[0168] The anti-reflection film layer is located on the side of the second electrode away from the substrate, and may include a plurality of anti-reflection units corresponding to the light-emitting devices; the thickness of the anti-reflection units corresponding to at least two light-emitting devices is different in the direction away from the substrate. The anti-reflection unit is used to reduce reflection and increase transmittance of the target light; the target light includes the light emitted by the light-emitting device corresponding to the anti-reflection unit.

[0169] The at least two light emitting devices refer to light emitting devices that emit light of different colors.

[0170] In this embodiment, anti-reflection units of different thicknesses are provided for light-emitting devices with different light-emitting colors, so that the anti-reflection units can achieve the effect of reducing reflection and increasing transmittance for the target light, thereby improving the light extraction efficiency of the target light emitted by the light-emitting device and enhancing the display effect of the display panel.

[0171] In some embodiments, the thickness of the antireflection film layer in a direction away from the substrate is a target thickness, and the target thickness is 1 / 4 of the wavelength of the target light.

[0172] In this way, the thickness of the anti-reflection film layer is designed to be 1 / 4 of the wavelength of the target light, which can maximize the transmittance of the anti-reflection film layer to the target light, that is, maximize the light extraction efficiency of the anti-reflection film layer to the target light, further improving the display effect of the display panel.

[0173] In some implementations, the display panel may further include a plurality of packaging portions located on a side of the anti-reflection film layer facing away from the substrate and corresponding to the isolation openings.

[0174] The orthographic projection of the encapsulation part on the substrate covers the orthographic projection of the isolation opening on the substrate. In this way, the encapsulation part can be used to realize independent encapsulation of each light-emitting device.

[0175] It should be noted that the present application only describes the anti-reflection film layer as a film layer added separately between the packaging part and the light-emitting device, but the present application is not limited to this. In some other embodiments, the anti-reflection film layer may also be a film layer arranged at other positions, such as between the first packaging layer and the second packaging layer; or, the anti-reflection film layer may also be other film layers, such as the first packaging layer or the second packaging layer, and so on.

[0176] In some other implementation manners, the structures of other film layers of the display panel can be implemented by referring to the specific structures of other film layers described in any of the above embodiments, and will not be described in detail here.

[0177] As another optional implementation of the content disclosed in this application, the embodiment of this application also provides a method for preparing a display panel, such as Fig.10 As shown, the method for preparing the display panel may include at least the following implementation steps:

[0178] S1001. Provide a substrate.

[0179] S1002. An isolation structure, a plurality of light-emitting devices and a plurality of packaging parts are formed on a substrate; the isolation structure is located on one side of the substrate, defining a plurality of isolation openings; the light-emitting devices are located in the isolation openings; the packaging part corresponds to the isolation openings; the orthographic projection of the packaging part on the substrate covers the orthographic projection of the corresponding isolation opening on the substrate; the packaging part includes a first packaging unit; the first packaging units corresponding to at least two light-emitting devices have different thicknesses in a direction away from the substrate; the first packaging unit is used for reducing reflection and increasing transmittance of target light; the target light includes light emitted by the light-emitting device corresponding to the first packaging unit.

[0180] In the present embodiment, first packaging units of different thicknesses are provided for light-emitting devices with different light-emitting colors, so that the first packaging unit can transmit as much light of corresponding colors as possible for different light-emitting colors, thereby achieving the effect of reducing reflection and increasing transmittance, thereby greatly improving the efficiency of the first packaging layer in extracting light emitted by the light-emitting device and enhancing the display effect of the display panel.

[0181] The structure of each layer of the display panel obtained by the preparation method and the corresponding description refer to the corresponding description of the display panel mentioned above.

[0182] As an optional implementation of the content disclosed in this application, the embodiment of this application further provides a display device, which includes: a display panel provided in any of the above embodiments. Fig.11 As shown, Fig.11This is a schematic diagram of the structure of a display device provided in one embodiment of the present application. The display device may be a smart phone, a tablet computer, a digital camera, etc., which will not be described in detail here.

[0183] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0184] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure, located on one side of the substrate, defining a plurality of isolation openings; a plurality of light emitting devices, wherein the light emitting devices are located in the isolation openings; a plurality of packaging parts corresponding to the isolation openings; The packaging portion is located on a side of the light-emitting device away from the substrate, and the orthographic projection of the packaging portion on the substrate covers the orthographic projection of the corresponding isolation opening on the substrate; The packaging part includes a first packaging unit; the first packaging units corresponding to at least two of the light-emitting devices have different thicknesses in a direction away from the substrate; the first packaging unit is used to reduce reflection and increase transmittance of target light; the target light includes light emitted by the light-emitting device corresponding to the first packaging unit.

2. The display panel according to claim 1, characterized in that: The light-emitting device includes a first color light-emitting device; the first packaging unit corresponding to the first color light-emitting device and located in the light-emitting area has a first thickness in a direction away from the substrate; and the first thickness is 1 / 4 of the wavelength of the first color light.

3. The display panel according to claim 2, characterized in that: The first color light emitting device comprises a red light emitting device; The first thickness ranges from 155 nm to 190 nm.

4. The display panel according to claim 2, characterized in that: The light-emitting device also includes a second color light-emitting device; the first packaging unit corresponding to the second color light-emitting device and located in the light-emitting area has a second thickness in a direction away from the substrate; and the second thickness is 1 / 4 of the wavelength of the second color light.

5. The display panel according to claim 4, characterized in that: The second color light emitting device comprises a green light emitting device; The second thickness ranges from 123 nm to 145 nm.

6. The display panel according to claim 2, characterized in that: The light-emitting device also includes a third color light-emitting device; the first packaging unit corresponding to the third color light-emitting device and located in the light-emitting area has a third thickness in a direction away from the substrate; and the third thickness is 1 / 4 of the wavelength of the third color light.

7. The display panel according to claim 6, characterized in that: The third color light emitting device comprises a blue light emitting device; The third thickness ranges from 108 nm to 123 nm.

8. The display panel according to claim 1, characterized in that: The packaging unit further includes a second packaging unit stacked with the first packaging unit; The thickness of the second packaging unit in a direction away from the substrate is greater than or equal to the thickness of the corresponding first packaging unit in the direction away from the substrate.

9. The display panel according to claim 8, characterized in that: The second packaging unit is located at a side of the first packaging unit away from the substrate; Optionally, the orthographic projection of the first packaging unit on the substrate completely covers the orthographic projection of the isolation opening on the substrate; Optionally, an orthographic projection of the second packaging unit on the substrate coincides with an orthographic projection of the first packaging unit on the substrate.

10. The display panel according to claim 8, characterized in that: The second packaging unit is located on a side of the first packaging unit close to the substrate; Optionally, the orthographic projection of the second packaging unit on the substrate covers the orthographic projection of the isolation opening on the substrate; Optionally, an orthographic projection of the first packaging unit on the substrate coincides with an orthographic projection of the second packaging unit on the substrate.

11. The display panel according to claim 8, characterized in that: The first packaging unit and the second packaging unit are made of different materials; Optionally, the material of the first packaging unit includes at least one of silicon oxide and silicon oxynitride; Optionally, the material of the second packaging unit includes silicon nitride.

12. The display panel according to claim 1, characterized in that: The light emitting device comprises a first electrode, a light emitting functional layer and a second electrode which are sequentially stacked in a direction away from the substrate; The packaging portion is located on a side of the second electrode away from the substrate; Optionally, a side edge of the second electrode overlaps a side wall of the isolation structure.

13. The display panel according to claim 12, characterized in that: Also includes an insulation layer; The insulating layer defines a plurality of pixel openings; The pixel opening exposes at least a portion of the first electrode; The pixel opening is connected to the isolation opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate; Optionally, the isolation structure is located on a side of the insulating layer away from the substrate; or, The insulating layer is further provided with a receiving opening, and the isolation structure is located in the receiving opening of the insulating layer; or, The insulating layer comprises a plurality of insulating parts arranged at intervals, the insulating parts cover the side edges of the first electrode and are arranged in a ring shape around the side edges of the first electrode, and the isolation structure is located in the intervals between adjacent insulating parts; Optionally, the insulating layer includes a pixel defining layer.

14. The display panel according to claim 1, characterized in that: The isolation structure includes a first structure and a second structure which are sequentially stacked in a direction away from the substrate; The orthographic projection of the second structure on the substrate covers the orthographic projection of the first structure on the substrate; Optionally, the first structure and the second structure are made of different materials; Optionally, the material of the second structure includes titanium; Optionally, the isolation structure further includes a third structure located on a side of the first structure close to the substrate; Optionally, the orthographic projection of the third structure on the substrate covers the orthographic projection of the first structure on the substrate; Optionally, the third structure is made of a different material from the first structure; Optionally, the material of the third structure includes molybdenum or titanium; Optionally, the material of the first structure includes aluminum.

15. The display panel according to claim 1, characterized in that: Also comprising a second encapsulation layer; The second encapsulation layer is located on a side of the plurality of encapsulation portions away from the substrate; an orthographic projection of the second encapsulation layer on the substrate covers the substrate; Optionally, a third encapsulation layer is further included; The third encapsulation layer is located on a side of the second encapsulation layer away from the substrate; the orthographic projection of the third encapsulation layer on the substrate covers the substrate; Optionally, the material of the encapsulation part includes an inorganic material; and / or the material of the second encapsulation layer includes an organic material; and / or the material of the third encapsulation layer includes an inorganic material.

16. A display panel, characterized in that: include: substrate; An isolation structure, located on one side of the substrate, defining a plurality of isolation openings; A plurality of light-emitting devices, each of which comprises a light-emitting functional layer and a second electrode which are sequentially stacked in a direction away from the substrate; the light-emitting functional layer and the second electrode are located in the isolation opening; The anti-reflection film layer is located on the side of the second electrode away from the substrate, and includes a plurality of anti-reflection units corresponding to the light-emitting devices; at least two anti-reflection units corresponding to the light-emitting devices have different thicknesses in a direction away from the substrate; the anti-reflection units are used to reduce reflection and increase transmittance of target light; the target light includes light emitted by the light-emitting device corresponding to the anti-reflection units.

17. The display panel according to claim 16, characterized in that: The thickness of the anti-reflection film layer in the direction away from the substrate is a target thickness; the target thickness is 1 / 4 of the wavelength of the target light.

18. The display panel according to claim 16, characterized in that: It also includes a plurality of packaging parts located on a side of the anti-reflection film layer away from the substrate and corresponding to the isolation openings; The orthographic projection of the packaging portion on the substrate covers the orthographic projection of the isolation opening on the substrate.

19. A method for preparing a display panel, characterized in that: include: providing a substrate; forming an isolation structure, a plurality of light-emitting devices and a plurality of packaging parts on the substrate; The isolation structure is located on one side of the substrate and defines a plurality of isolation openings; The light emitting device is located in the isolation opening; The packaging portion corresponds to the isolation opening; The orthographic projection of the packaging part on the substrate covers the orthographic projection of the corresponding isolation opening on the substrate; the packaging part includes a first packaging unit; the first packaging units corresponding to at least two of the light-emitting devices have different thicknesses in a direction away from the substrate; the first packaging unit is used to reduce reflection and increase transmittance of target light; the target light includes light emitted by the light-emitting device corresponding to the first packaging unit.

20. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-18.

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