Display panel and display device

Abstract

The invention discloses a display panel and a display device. The display panel is provided with a display area and a frame area at least partially surrounding the display area. The display panel comprises a substrate, a first electrode layer, a light-emitting layer and a second electrode layer, wherein the first electrode layer, the light-emitting layer and the second electrode layer are sequentially stacked in the direction away from the substrate; the connecting electrode layer is located on one side of the substrate, the connecting electrode layer is provided with a connecting electrode located in the frame area, and the connecting electrode transmits signals to the second electrode layer; and the first wiring layer is provided with a signal connection structure for transmitting signals to the connection electrodes. Signal transmission of the second electrode is realized, and the wiring flexibility of the display panel is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the continuous development of display technology, display panels have shown a diversified development trend. Regardless of the type of display panel, a better wiring method is pursued. Summary of the invention

[0003] The present invention provides a display panel and a display device to realize signal transmission of the display panel and improve the flexibility of wiring.

[0004] To achieve the above technical objectives, the embodiments of the present invention provide the following technical solutions:

[0005] A display panel has a display area and a frame area at least partially surrounding the display area, the display panel comprising:

[0006] A first electrode layer, a light-emitting layer, and a second electrode layer are sequentially stacked in a direction away from the substrate;

[0007] A connecting electrode layer, located at one side of the substrate, the connecting electrode layer is provided with connecting electrodes located in the border area, and the connecting electrodes transmit signals to the second electrode layer;

[0008] A first wiring layer, wherein the first wiring layer is provided with a signal connection structure for transmitting a signal to the connection electrode.

[0009] Optionally, the display panel further includes:

[0010] The isolation structure is arranged on one side of the substrate, and the isolation structure is provided with a first isolation opening.

[0011] Optionally, the connecting electrode electrically connects the isolation structure with the signal connection structure, and the connecting electrode and the isolation structure are provided in the same layer and with the same material.

[0012] Optionally, the connecting electrode is integrated with the isolation structure.

[0013] Optionally, the display panel further comprises a pixel definition layer located on a side of the first electrode layer away from the substrate, the pixel definition layer comprises a pixel opening exposing the first electrode, and the pixel opening is connected to the isolation opening.

[0014] Optionally, the pixel definition layer comprises an inorganic insulating material.

[0015] Optionally, the isolation structure further includes a second isolation opening located in the border area, and the second isolation opening is a dummy isolation opening.

[0016] Optionally, the size, shape, arrangement and distribution density of the second isolation openings are the same as those of the first isolation openings.

[0017] Optionally, the display panel further comprises a first planarization layer located on a side of the first electrode layer close to the substrate;

[0018] The first planarization layer is provided with a first via hole located in the border area, and the pixel definition layer is provided with a second via hole located in the border area;

[0019] The orthographic projection of the first via hole on the substrate overlaps with the orthographic projection of the second via hole on the substrate, and the connection electrode is connected to the signal connection structure through the overlapping area of ​​the first via hole and the second via hole.

[0020] Optionally, a size of the first via hole is greater than a size of the second via hole, and an orthographic projection of the second via hole on the substrate is located within an orthographic projection of the first via hole on the substrate.

[0021] Optionally, the first routing layer further includes a third via hole, and the third via hole is located in the border area.

[0022] Optionally, the third via includes a third A via and a third B via; the orthographic projection of the third A via on the substrate is located within the orthographic projection of the connecting electrode on the substrate, and the orthographic projection of the third B via on the substrate is located outside the orthographic projection of the connecting electrode on the substrate.

[0023] Optionally, the display panel also includes a dam structure, which is located on a side of the area where the signal connection structure is located, away from the display area; the first routing layer extends from the area where the signal connection structure is located to the area where the dam structure is located; the orthographic projection of the third via on the substrate overlaps with the orthographic projection of the dam structure on the substrate.

[0024] Optionally, the isolation structure includes a first isolation portion and a second isolation portion which are sequentially stacked in a direction away from the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate.

[0025] Optionally, the second electrode is electrically connected to the first isolation portion.

[0026] Optionally, the isolation structure further includes a third isolation portion located on a side of the first isolation portion away from the substrate, an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the third isolation portion on the substrate, and the second electrode is electrically connected to the third isolation portion.

[0027] Optionally, the material of the third isolation portion includes molybdenum metal; and / or the material of the first isolation portion includes aluminum metal; and / or the material of the second isolation portion includes titanium metal.

[0028] Optionally, the connecting electrode includes a first connecting electrode portion, a second connecting electrode portion located on a side of the first connecting electrode portion facing away from the substrate, and a third connecting electrode portion located on a side of the first connecting electrode portion facing the substrate, the second connecting electrode portion is arranged to protrude from the side of the first connecting electrode portion; and the third connecting electrode portion is arranged to protrude from the side of the first connecting electrode portion.

[0029] Optionally, an orthographic projection of the third connecting electrode portion on the substrate is located within an orthographic projection of the second connecting electrode portion on the substrate.

[0030] Optionally, the first connecting electrode portion and the first isolating portion are provided in the same layer and material; the second connecting electrode portion and the second isolating portion are provided in the same layer and material; and the third connecting electrode portion and the third isolating portion are provided in the same layer and material.

[0031] Optionally, the connection electrode is in a block shape, and / or the signal connection structure is in a block shape.

[0032] Optionally, the number of the connecting electrodes is at least one, and the number of the signal connecting structures is at least one; the signal connecting structures correspond one-to-one to the connecting electrodes; and / or the signal connecting structures correspond many-to-one to the connecting electrodes; and / or the signal connecting structures correspond one-to-many to the connecting electrodes.

[0033] Optionally, the electrical signals transmitted by the connecting electrodes are the same electrical signals; or, the electrical signals transmitted by the connecting electrodes are different.

[0034] Optionally, the display panel further includes at least two second wiring layers located between the substrate and the first wiring layer.

[0035] Optionally, at least two of the second wiring layers include a first metal layer, a second metal layer, a third metal layer and a fourth metal layer stacked in sequence in a direction away from the substrate; and the first wiring layer is a fifth metal layer.

[0036] Optionally, at least in the display area, the first metal layer is provided with a gate of the transistor, the second metal layer is provided with a capacitor plate, the third metal layer is provided with a source and a drain of the transistor, and the fourth metal layer is provided with a first intermediate wiring connected to the first electrode.

[0037] Optionally, at least two of the second routing layers include a first metal layer, a second metal layer and a third metal layer; and the first routing layer is a fourth metal layer.

[0038] Optionally, at least in the display area, the first metal layer is provided with a gate of the transistor, the second metal layer is provided with a capacitor plate, and the third metal layer is provided with a source and a drain of the transistor.

[0039] Optionally, the first electrode layer includes a first electrode, the light-emitting layer includes a light-emitting portion, and the second electrode layer includes a second electrode; the first electrode, the light-emitting portion and the second electrode constitute a light-emitting device;

[0040] The light-emitting device includes a first light-emitting device and a second light-emitting device emitting different colors, and the signal connection structure includes a first signal connection structure and a second signal connection structure, the first signal connection structure is electrically connected to the first light-emitting device, and the second signal connection structure is electrically connected to the second light-emitting device.

[0041] Optionally, the first electrode layer includes a first electrode, the light-emitting layer includes a light-emitting portion, and the second electrode layer includes a second electrode; the first electrode, the light-emitting portion and the second electrode constitute a light-emitting device;

[0042] The light emitting device comprises a first light emitting device and a second light emitting device that emit light of different colors, and the signal connection structure transmits the same signal to the first light emitting device and the second light emitting device.

[0043] Correspondingly, the present invention further provides a display device, comprising: a display panel as described in any embodiment of the present invention.

[0044] The present invention further provides a display panel having a display area and a frame area at least partially surrounding the display area, comprising:

[0045] substrate;

[0046] A first electrode layer, a light-emitting layer, and a second electrode layer are sequentially stacked in a direction away from the substrate;

[0047] At least two insulating layers are stacked in sequence in the frame area in a direction away from the substrate; the at least two insulating layers have through-holes;

[0048] A connecting electrode layer and a first wiring layer, wherein the connecting electrode layer is provided with a connecting electrode located in the border area, and the first wiring layer is provided with a signal connection structure, wherein the signal connection structure transmits a signal to the connecting electrode through the sleeve hole, and the connecting electrode transmits a signal to the second electrode layer.

[0049] Optionally, the at least two insulating layers include:

[0050] A first planarization layer, located on a side of the first electrode layer close to the substrate, the first planarization layer being provided with a first via hole located in the border area;

[0051] The pixel definition layer is located on a side of the first electrode layer away from the substrate, and the pixel definition layer is provided with a second via hole located in the frame area; wherein the first via hole and the second via hole constitute the sleeve hole.

[0052] Optionally, an orthographic projection of the first via hole on the substrate overlaps with an orthographic projection of the second via hole on the substrate, and the connection electrode is connected to the signal connection structure through an overlapping area of ​​the first via hole and the second via hole.

[0053] Optionally, a size of the first via hole is greater than a size of the second via hole, and an orthographic projection of the first via hole on the substrate covers an orthographic projection of the second via hole on the substrate.

[0054] In the embodiment of the present invention, the second electrode is connected to the first wiring layer via the connecting electrode in the frame area, so that signal transmission of the second electrode is realized and the wiring flexibility of the display panel is improved.

[0055] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0057] Figure 1 A schematic cross-sectional structure diagram of a display panel provided by an embodiment of the present invention;

[0058] Figure 2 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0059] Figure 3 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0060] Figure 4 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0061] Figure 5 A schematic diagram of a top view structure of a display panel provided by an embodiment of the present invention;

[0062] Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure along the middle line AA;

[0063] Figure 7 A schematic diagram of a top view of another display panel provided by an embodiment of the present invention;

[0064] Figure 8 for Figure 7 Schematic diagram of the cross-sectional structure of EE;

[0065] Fig. 9 A schematic diagram of a top view structure of another display panel provided by an embodiment of the present invention;

[0066] Fig.10 for Fig. 9 Schematic diagram of the cross-sectional structure along the middle line BB;

[0067] Fig.11 A schematic diagram of a top view structure of another display panel provided by an embodiment of the present invention;

[0068] Fig.12 for Fig.11 Schematic diagram of the cross-sectional structure of the middle edge CC;

[0069] Fig.13 A schematic diagram of a top view structure of another display panel provided by an embodiment of the present invention;

[0070] Fig.14 A schematic diagram of a top view structure of another display panel provided by an embodiment of the present invention;

[0071] Fig.15 A schematic diagram of a top view structure of another display panel provided by an embodiment of the present invention;

[0072] Fig.16 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0073] Fig.17 A schematic diagram of a top view structure of another display panel provided by an embodiment of the present invention;

[0074] Fig.18 For along Fig.17 Schematic diagram of the cross-sectional structure of the middle DD;

[0075] Fig.19 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0076] Fig. 20 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention;

[0077] Fig.21 A schematic diagram of the structure formed in each step of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0078] Fig. 22 A schematic diagram of the structure formed in each step of another method for manufacturing a display panel provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0079] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0080] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0081] An embodiment of the present invention provides a display panel. Figure 1 A schematic cross-sectional structure diagram of a display panel provided by an embodiment of the present invention. Figure 1 The display panel includes a display area 10 and a frame area 20 at least partially surrounding the display area 10, and the display panel further includes:

[0082] substrate 600;

[0083] A first electrode layer 501, a light-emitting layer 502, and a second electrode layer 503 are sequentially stacked in a direction away from the substrate 600;

[0084] The connecting electrode layer 100 is located at one side of the substrate 600 . The connecting electrode layer 100 is provided with a connecting electrode 110 located in the border area 20 . The connecting electrode 110 transmits a signal to the second electrode layer 503 .

[0085] The first wiring layer 200 is provided with a signal connection structure 210 that transmits a signal to the connection electrode 110 .

[0086] The first electrode layer 501 includes a first electrode, the light-emitting layer 502 includes a light-emitting portion, the second electrode layer 503 includes a second electrode, and the first electrode, the light-emitting portion and the second electrode constitute a light-emitting device 500. Exemplarily, the first electrode is an anode, the second electrode is a cathode, and the anode of each light-emitting device 500 is powered separately through the pixel circuit 401, that is, the anode of each light-emitting device 500 is discretely arranged, and the cathode of each light-emitting device 500 is connected to the same potential (i.e., a common potential), and the connecting electrode 100 is used to provide a common potential to the cathode. The connecting electrode 110 can be arranged in one piece to reduce the loss of the common potential during the transmission process.

[0087] Further, the first wiring layer 200 is a conductive film layer in the array layer, and other film layers 400 of the array layer are also arranged between the substrate 600 and the first wiring layer 200. The array layer can be, for example, a film layer provided with devices such as transistors or capacitors, and the transistors and capacitors constitute the pixel circuit 401. The first wiring layer 200 can be provided in the same layer and material as the film layer where the devices such as transistors or capacitors are located, or it can be a separately provided film layer. The first electrode (for example, the anode) connected to the pixel circuit 401 is closer to the array layer, and the second electrode (for example, the cathode) connected to the common potential is farther away from the array layer.

[0088] In an embodiment of the present invention, a second electrode is connected to the first wiring layer 200 via a connecting electrode 110, and a required signal is accessed via the first wiring layer 200, thereby realizing signal transmission on the connecting electrode 110. An embodiment of the present invention provides a wiring method for transmitting signals to the second electrode that is completely different from the related art, thereby improving the wiring flexibility of the display panel.

[0089] Furthermore, in some related technologies, the second electrode layer directly extends from the display area 10 to the frame area 20 and is connected to the signal transmission line. Since the second electrode layer is a film layer close to the top layer of the display panel, the second electrode layer located in the display area 10 has a complete encapsulation layer for water vapor isolation, while the second electrode layer located in the frame area 20 is usually weakly encapsulated (for example, the number of encapsulation layers is reduced or there is no encapsulation layer), so the wiring structure of the related technology is susceptible to water vapor invasion, resulting in corrosion. Compared with the second electrode layer, the connecting electrode layer 100 can resist water vapor invasion and is not prone to corrosion.

[0090] Continue to see Figure 1On the basis of the above embodiments, optionally, the display panel further includes an insulating layer 300, the insulating layer 300 is located between the connecting electrode layer 100 and the first wiring layer 200, and the insulating layer 300 is provided with a via 301, and the connecting electrode 110 is connected to the signal connection structure 210 through the via 301. The provision of the insulating layer 300 between the connecting electrode layer 100 and the first wiring layer 200 indicates that the connecting electrode layer 100 and the first wiring layer 200 are located in different film layers.

[0091] In the above embodiments, according to different types of display panels and different positions of the first wiring layer 200 , the insulating layer 300 between the connecting electrode layer 100 and the first wiring layer 200 is disposed in different ways.

[0092] Continue to see Figure 1 In one embodiment of the present invention, optionally, the insulating layer 300 is a first planarization layer, that is, the connecting electrode layer 100 is arranged on the first planarization layer, and the first wiring layer 200 is arranged under the first planarization layer. Among them, the first planarization layer is a film layer with a planarization effect. By arranging the first planarization layer on the array layer, it is beneficial to flatten the uneven surface of the array layer where the wiring such as transistors is arranged. Exemplarily, the material of the first planarization layer is an insulating material such as an organic material and / or an inorganic material. In practical applications, the thickness of the first planarization layer can be set thicker or thinner as needed. The first planarization layer can be a single-layer film layer, a two-layer film layer, or a multi-layer film layer. In the embodiment of the present invention, the insulating layer 300 is set as the first planarization layer, that is, the connecting electrode layer 100, the first planarization layer and the first wiring layer 200 are stacked in sequence. Vias are arranged on the first planarization layer, which is beneficial to connecting the connecting electrode layer 100 and the first wiring layer 200.

[0093] Continue to see Figure 1 In another embodiment of the present invention, the insulating layer 300 is optionally a pixel definition layer, that is, the connecting electrode layer 100 is disposed on the pixel definition layer, and the first wiring layer 200 is disposed under the pixel definition layer. The pixel definition layer is a film layer having a pixel definition function. By arranging a pixel opening ( Figure 1(not shown), and a film layer forming the light-emitting device 500 is arranged in the pixel opening, so that a light-emitting device 500 whose shape is determined by the shape of the pixel opening can be formed. Exemplarily, the material of the pixel definition layer is an organic insulating material and / or an inorganic insulating material, etc. In practical applications, the thickness of the pixel definition layer can be set thicker or thinner as needed, and the pixel definition layer can be a single-layer film layer, a double-layer film layer, or a multi-layer film layer. In an embodiment of the present invention, the insulating layer 300 is arranged as a pixel definition layer, that is, the connecting electrode layer 100, the pixel definition layer and the first wiring layer 200 are stacked in sequence. Providing vias on the pixel definition layer is conducive to connecting the connecting electrode layer 100 and the first wiring layer 200.

[0094] Figure 2 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention. Figure 2 In another embodiment of the present invention, optionally, the insulating layer 300 includes a first planarization layer 310 and a pixel definition layer 320, and the first routing layer 200, the first planarization layer 310, the pixel definition layer 320 and the connection electrode layer 100 are stacked in sequence; the first planarization layer 310 is provided with a first via hole 311 located in the border area 20, and the pixel definition layer 320 is provided with a second via hole 321 located in the border area, and the orthographic projection of the first via hole 311 on the substrate 600 and the orthographic projection of the second via hole 321 on the substrate 600 overlap, and the first via hole 311 and the second via hole 321 form a sleeve hole, and the connection electrode 110 is connected to the signal connection structure 210 through the overlapping area of ​​the first via hole 311 and the second via hole 321.

[0095] Optionally, the size of the first via hole 311 is larger than the size of the second via hole 321, and the orthographic projection of the second via hole 321 on the substrate 600 is located within the orthographic projection of the first via hole 311 on the substrate 600. The advantage of such a configuration is that after the first planarization layer 310 is formed, a whole layer of pixel definition material layer is formed thereon, including a film layer located in the first via hole 311 and a film layer outside the first via hole 311, and then the second via hole 321 located in the first via hole 311 is formed by etching. The preparation process is simple, and etching residues are not easily generated in the sleeve hole formed by the first via hole 311 and the second via hole 321, which is conducive to the reliable connection of the connection electrode 110 and the signal connection structure 210.

[0096] In some embodiments, the insulating layer 300 includes a first planarization layer 310 and a pixel definition layer 320, wherein the first planarization layer 310 and the pixel definition layer 320 are insulating layers located on the array layer, which indicates that the first wiring layer 200 is a wiring layer located on the top layer of the array layer. In the embodiment of the present invention, the insulating layer 300 disposed between the connecting electrode layer 100 and the first wiring layer 200 only includes the first planarization layer 310 and the pixel definition layer 320, so that the number of layers of the insulating layer 300 between the connecting electrode layer 100 and the first wiring layer 200 is small, which is conducive to reducing the difficulty of the connecting electrode layer 100 to transmit signals through the first wiring layer 200 and simplifying the preparation process.

[0097] In other embodiments, optionally, the insulating layer 300 further includes other film layers, which is not limited in the present invention.

[0098] Continue to see Figure 2 On the basis of the above embodiments, optionally, the size of the first via hole 311 is larger than the size of the second via hole 321, and the orthographic projection of the first via hole 311 on the substrate 600 covers the orthographic projection of the second via hole 321 on the substrate 600. Such a setting is conducive to reducing the difficulty of manufacturing the display panel and is easy to implement.

[0099] Figure 3 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention. Figure 3 On the basis of the above embodiments, optionally, the connection electrode layer 100 includes at least two conductive layers. Exemplarily, the connection electrode layer 100 includes a first conductive layer 111 and a second conductive layer 112 stacked in layers. This arrangement of the embodiment of the present invention is conducive to reducing the resistance of the connection electrode layer 100, thereby improving the uniformity of display.

[0100] Figure 4 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention. Figure 4 On the basis of the above embodiments, optionally, the connection electrode layer 100 includes a third conductive layer 113, a first conductive layer 111, and a second conductive layer 112 which are stacked. Optionally, the material of the third conductive layer 113 includes molybdenum metal, the material of the first conductive layer 111 includes aluminum metal, and the material of the second conductive layer 112 includes titanium metal. Such a configuration of the embodiment of the present invention is conducive to reducing the resistance of the connection electrode layer 100, thereby improving the uniformity of display.

[0101] Figure 5 A schematic diagram of a top view of a display panel provided by an embodiment of the present invention. Figure 5On the basis of the above embodiments, optionally, the display panel includes a display area 10 and a frame area 20, and the signal connection structure 210 is located in the frame area 20. The signal connection structure 210 is provided in the frame area 20 to transmit the signal of the connection electrode layer 100 of the display area 10 to the frame area 20.

[0102] Continue to see Figure 5 On the basis of the above embodiments, optionally, the connection electrode 110 is in a block shape, and the signal connection structure 210 is in a block shape. This arrangement makes the cross-sectional area of ​​the connection electrode 110 and the signal connection structure 210 larger, which is beneficial to reducing the voltage drop of the signal of the second electrode layer during the transmission process, improving the uniformity of signal transmission, and further improving the uniformity of display.

[0103] Continue to see Figure 5 Based on the above embodiments, optionally, the number of the connecting electrode 110 is one, the number of the signal connecting structure 210 is one, and the signal connecting structure 210 corresponds to the connecting electrode 110 one by one. Figure 1-Figure 5 In the border area 20 , the connection electrode 110 and the signal connection structure 210 overlap, and are thus connected through the via hole 301 on the insulating layer 300 .

[0104] Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure along the middle line AA. Figure 5 and Figure 6 On the basis of the above implementations, optionally, the first wiring layer 200 further includes a third via 220, and the third via 220 is located in the border area 20. Since the signal connection structure 210 is a block structure in the border area 20, and its area is relatively large, the third via 220 is provided in the signal connection structure 210, which is conducive to discharging the water vapor generated by the lower film layer during the preparation process, thereby avoiding the problem of film separation and shedding caused by the inability to discharge the water vapor.

[0105] Continue to see Figure 5 and Figure 6 On the basis of the above embodiments, the insulating layer 300 fills the third via hole 220. Exemplarily, the film layer in the insulating layer 300 that is in direct contact with the signal connection structure 210 is the first planarization layer 310, and the first planarization layer 310 is filled in the third via hole 220. This arrangement is conducive to simplifying the process and improving the stability of the structure of the display panel.

[0106] Figure 7 A schematic diagram of a top view of another display panel provided by an embodiment of the present invention, Figure 8 for Figure 7 Schematic diagram of the cross-sectional structure of EE. Figure 7 and Figure 8 On the basis of the above embodiments, optionally, the third via 220 includes a third A via 221 and a third B via 222; the orthographic projection of the third A via 221 on the substrate 600 is located within the orthographic projection of the connecting electrode 110 on the substrate 600, and the orthographic projection of the third B via 222 on the substrate 600 is located outside the orthographic projection of the connecting electrode 110 on the substrate 600. The third A via 221 and the third B via 222 are distributed at different positions of the first wiring layer 200, which is further conducive to discharging the water vapor generated by the lower film layer during the preparation process, thereby avoiding the problem of film separation and shedding caused by the inability to discharge the water vapor.

[0107] The difference between the third B via hole 222 and the third A via hole 221 is that the third B via hole 222 is not covered by the connection electrode 110. The shape and size of the third B via hole 222 can be the same as or different from the third A via hole 221, and can be set as needed in practical applications.

[0108] Continue to see Figure 7 and Figure 8 In one embodiment, the display panel further comprises a dam structure 800, which is located at a side of the area where the signal connection structure 210 is located, away from the display area 10; the first wiring layer 200 extends from the area where the signal connection structure 210 is located to the area where the dam structure 800 is located; the orthographic projection of the third B via hole 222 on the substrate 600 overlaps with the orthographic projection of the dam structure 800 on the substrate 600. Optionally, in order to adapt to the size of the dam structure 800, the size of the third B via hole 222 is smaller than the third A via hole 221. This arrangement is conducive to the discharge of water vapor generated by the film layer of the dam structure 800, enhances the air permeability of the signal dam structure 800, prevents the problem of film layer separation and falling off, and thus enhances the stability of the dam structure 800.

[0109] Fig. 9 A schematic diagram of a top view of another display panel provided by an embodiment of the present invention is shown. Fig.10 for Fig. 9 Schematic diagram of the cross-sectional structure along the middle line BB. Fig. 9 and Fig.10On the basis of the above embodiments, optionally, the connection electrode layer 100 further includes a fourth via hole 120, which is located in the frame area 20 and penetrates the connection electrode layer 100. The material of the insulating layer 300 located under the connection electrode layer 100 may be, for example, an organic material, and the material of the connection electrode layer 100 may be, for example, a metal material. In the process of preparing the connection electrode layer 100, a physical vapor deposition (PVD) process is adopted, and the process involves heating the display panel. During the heating process, water vapor is generated in the insulation layer 300. The water vapor can evaporate through the fourth via hole 120 and discharge the water vapor, thereby avoiding the problem of film separation and shedding caused by the inability to discharge the water vapor.

[0110] Continue to see Fig. 9 and Fig.10 On the basis of the above embodiments, optionally, in the first direction X, the orthographic projection of the fourth via hole 120 on the substrate 600 and the orthographic projection of the via holes (e.g., the first via hole 311 and the second via hole 321) of the insulating layer 300 on the substrate 600 are arranged alternately. Exemplarily, the first direction X is the arrangement direction of the display area 10 and the frame area 20. Preferably, the first direction X is the long side direction of the display panel. Fig. 9 and Fig.10 The frame area 20 shown is an upper frame or a lower frame. This arrangement is conducive to ensuring reliable contact between the connection electrode 110 and the signal connection structure 210, that is, the arrangement of the fourth via hole 120 does not affect the continuity of the signal of the connection electrode 110.

[0111] Fig.11 A schematic diagram of a top view of another display panel provided by an embodiment of the present invention is shown. Fig.12 for Fig.11 Schematic diagram of the cross-sectional structure of the middle edge CC. Fig.11 and Fig.12 In one embodiment of the present invention, optionally, in the second direction Y, the orthographic projection of the fourth via hole 120 on the substrate 600 is staggered with the orthographic projection of the third via hole A 221 on the substrate 600. Exemplarily, the second direction Y intersects the first direction X, and preferably the second direction Y intersects the first direction X perpendicularly.

[0112] It should be noted that the arrangement of the via holes (eg, the first via hole 311 and the second via hole 321 ), the third via hole 220 and the fourth via hole 120 of the insulating layer 300 may be varied, for example: Figure 5 In the illustrated embodiment, in the first direction X, the orthographic projections of the via holes (eg, the first via hole 311 and the second via hole 321 ) of the insulating layer 300 on the substrate 600 are alternately arranged with the orthographic projections of the third via hole 220 on the substrate 600 .

[0113] It should also be noted that in the above embodiments, the signal connection structure 210 is exemplarily shown to be located in the frame area 20, which is not a limitation of the present invention. In other embodiments, the signal connection structure 210 may be partially located in the display area 10, etc.

[0114] It should also be noted that in the above embodiments, the number of the connecting electrode 110 and the number of the signal connecting structure 210 are both shown as one, which is not a limitation of the present invention. In other embodiments, the number of the connecting electrodes 110 can be at least two, and the number of the signal connecting structures 210 can be at least two. Fig.13 As shown, the number of the signal connection structure 210 is one, the number of the connection electrodes 110 is two, and the signal connection structure 210 and the connection electrodes 110 are in a one-to-many relationship; as shown Fig.14 As shown, the number of signal connection structures 210 is two, the number of connection electrodes 110 is one, and the signal connection structure 210 and the connection electrode 110 are in a many-to-one relationship; as shown Fig.15 As shown, the number of the signal connection structures 210 is three, the number of the connection electrodes 110 is three, and the signal connection structures 210 and the connection electrodes 110 are in a one-to-one correspondence.

[0115] Continue to see Fig.15 In one embodiment of the present invention, optionally, the signal applied to each connecting electrode 110 is the same electrical signal.

[0116] Continue to see Fig.15 In another embodiment of the present invention, optionally, the electrical signals transmitted on each connecting electrode 110 are different. For example, different connecting electrodes 100 transmit electrical signals of different common potentials to light-emitting devices 500 of different colors, respectively, so as to realize separate control of the connecting electrodes 110 of light-emitting devices 500 of various colors.

[0117] Fig.16 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention. Fig.16 On the basis of the above embodiments, optionally, the display panel further includes an isolation structure 700. The isolation structure 700 is disposed on one side of the substrate 600, and the isolation structure 700 is provided with a first isolation opening 730. Among them, at least part of the light-emitting device 500 is disposed in the first isolation opening 730, and adjacent light-emitting devices 500 are separated at the isolation structure 700 to avoid crosstalk between adjacent light-emitting devices 500 (for example, the first light-emitting device 510 and the second light-emitting device 520).

[0118] It should be noted that the relevant schemes regarding the isolation structure are described in patents (applications) PCT / CN2023 / 134518, CN202310619767.1, CN202310492119.4, CN202311346196.5, CN202310775778.9, etc., and their contents are incorporated into this application by reference for reference.

[0119] Continue to see Fig.16 On the basis of the above embodiments, optionally, the first electrode layer includes a first electrode (e.g., first electrodes 511, 521, and 531), the second electrode layer includes a second electrode (e.g., second electrodes 513, 523, and 533), and the second electrode is located in the first isolation opening 730 and is electrically connected to the isolation structure 700. Optionally, in the display area 10, the orthographic projection of the isolation structure 700 on the substrate 600 is a mesh structure. Among them, the first isolation opening 730 is a mesh structure. The light-emitting layer includes a light-emitting portion (e.g., light-emitting portions 512, 522, and 532), and the light-emitting portion is located in the first isolation opening 730.

[0120] Among them, the isolation structure 700 has a certain thickness. Specifically, the thickness of the isolation structure 700 is greater than the thickness of the second electrode (for example, the cathode). Exemplarily, when preparing the display panel, after the isolation structure 700 is prepared, the isolation structure 700 can be used as a mask to evaporate the light-emitting layer, and then the light-emitting parts (including the light-emitting parts 512, 522 and 532) of the adjacent light-emitting devices 500 are separated at the isolation structure 700 by the isolation structure 700. The light-emitting parts can be non-contacting with the isolation structure 700, so as to avoid the generation of cross-color when the light-emitting colors of the adjacent light-emitting devices 700 are different. In addition, the use of the precision mask for evaporating the light-emitting parts in the related art can be saved. When preparing the second electrode on the light-emitting part, for example, when the second electrode layer is evaporated using a universal mask, due to the existence of the isolation structure 700, the second electrode layer is divided into a plurality of independent second electrodes corresponding to the light-emitting devices 500 one by one, wherein the preparation process of the second electrode layer is not limited to the evaporation process as described above, and a sputtering process or other processes can also be used, which is not specifically limited in this embodiment. It should be noted that when both the light-emitting layer and the second electrode layer are prepared by evaporation process, the evaporation angle can be adjusted to achieve that at least part of the light-emitting part is not in contact with the isolation structure 700, and the second electrode is in contact with the isolation structure 700 to achieve overlap between the two.

[0121] The isolation structure 700 serves to isolate the light-emitting layers of different light-emitting devices 500, so the isolation structure 700 has a certain thickness. For example, the thickness of the isolation structure 700 is greater than the thickness of the second electrode. Therefore, the block resistance of the isolation structure 700 is small (optionally, the block resistance of the isolation structure 700 is less than or equal to 0.005 ohms), thereby reducing the overlapping resistance of the second electrode through the isolation structure 700, thereby reducing the heat generated at the overlapping point, reducing the temperature rise rate of the screen, reducing the power consumption of the screen, reducing the accelerated aging of the light-emitting device 500 near the overlapping area, and improving the display quality.

[0122] Continue to see Fig.16 On the basis of the above embodiments, optionally, the pixel definition layer 320 is located on a side of the first electrode layer away from the substrate 600, and the first planarization layer 310 is located on a side of the first electrode layer close to the substrate 600, that is, the first electrode layer is located between the first planarization layer 310 and the pixel definition layer 320. The pixel definition layer 320 includes a pixel opening exposing the first electrode (for example, the first electrode 513 and the first electrode 523), and the pixel opening is connected to the first isolation opening 730.

[0123] Fig.17 A schematic diagram of a top view of another display panel provided by an embodiment of the present invention is shown. Fig.18 For along Fig.17 Schematic diagram of the cross-sectional structure of DD. Fig.17 and Fig.18 On the basis of the above embodiments, optionally, the isolation structure 700 further includes a second isolation opening 740 located in the frame area 20, and the second isolation opening 740 is a dummy isolation opening. The second isolation opening 740 is similar to the first isolation opening, and each film layer of the light-emitting device 500 is also arranged in the second isolation opening 740. Unlike the first isolation opening, the light-emitting device 500 in the second isolation opening 740 does not emit light, so the light-emitting device 500 in the second isolation opening 740 does not need to be provided with a corresponding pixel circuit. Such a setting is conducive to improving the uniformity of the display panel.

[0124] Optionally, the size, shape, arrangement and distribution density of the second isolation openings 740 are the same as those of the first isolation openings, thereby further improving the uniformity of the display panel.

[0125] It should be noted that, due to the provision of the second isolation opening 740 , the connection electrode 110 and the isolation structure 700 are separated by the outer side of the second isolation opening 740 which is farthest from the display area 10 .

[0126] Continue to see Fig.17 and Fig.18On the basis of the above embodiments, optionally, the connecting electrode 110 electrically connects the isolation structure 700 and the signal connection structure 210, and the connecting electrode 110 and the isolation structure 700 are arranged in the same layer and the same material. Optionally, the connecting electrode 110 and the isolation structure 700 are connected as one. With this arrangement, there is no need to add an additional film layer structure in the display panel for the production of the connecting electrode 110. The connecting electrode 110 and the isolation structure 700 can be prepared simultaneously in the same layer using the same preparation process, which is conducive to the simplification of the display panel preparation process. Therefore, the thickness of the connecting electrode 110 is the same as the thickness of the isolation structure 700, and the material and thickness are also the same. The square resistance of the connecting electrode 110 and the isolation structure 700 is relatively small.

[0127] Continue to see Fig.17 and Fig.18 On the basis of the above embodiments, optionally, the isolation structure 700 includes a first isolation portion 711 and a second isolation portion 712 which are sequentially stacked in a direction away from the substrate 600, and the orthographic projection of the first isolation portion 711 on the substrate 600 is located within the orthographic projection of the second isolation portion 712 on the substrate 600. That is, the size of the first isolation portion 711 is smaller than the size of the second isolation portion 712. In this way, the cross-sectional shape of the isolation structure 700 is an undercut structure, which is conducive to cutting off the light-emitting layer of the adjacent light-emitting device 500 at the position of the isolation structure 700 when evaporating the light-emitting layer of the light-emitting device 500 in the display panel.

[0128] Optionally, the second electrode is electrically connected to the first isolation portion 711. Exemplarily, the second electrode of the light-emitting device 500 can also be formed by an evaporation process, and by controlling different evaporation angles when evaporating the second electrode and the light-emitting layer, the second electrode can be connected to the first isolation portion 711. Specifically, the second electrode overlaps the side wall of the first isolation portion 711, so that the second electrodes of each light-emitting device 500 in the display panel are interconnected through the isolation structure 700.

[0129] Fig.19 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention. Fig.19In another embodiment of the present invention, optionally, the isolation structure 700 further includes a third isolation portion 713 located on the side of the first isolation portion 711 close to the substrate 600, the orthographic projection of the first isolation portion 711 on the substrate 600 is located within the orthographic projection of the third isolation portion 713 on the substrate 600, and the second electrode (for example, the second electrode 513, 523) is electrically connected to the third isolation portion 713. That is, the size of the first isolation portion 711 is smaller than the size of the third isolation portion 713. In this way, the cross-sectional shape of the isolation structure 700 is an undercut structure, which is conducive to cutting off the light-emitting layer of the adjacent light-emitting device 500 at the position of the isolation structure 700 when evaporating the light-emitting layer of the light-emitting device 500 in the display panel. The second electrode of the light-emitting device 500 can also be formed by an evaporation process. By controlling the different evaporation angles when evaporating the second electrode and the light-emitting layer, the second electrode overlaps the side wall of the third isolation portion 713, and then the second electrodes of each light-emitting device 500 in the display panel can be connected to each other through the isolation structure 700.

[0130] Optionally, the material of the third isolation portion 713 includes molybdenum metal; and / or the material of the first isolation portion 711 includes aluminum metal; and / or the material of the second isolation portion 712 includes titanium metal. This arrangement is conducive to reducing the sheet resistance of the connection electrode layer 100 while ensuring the stability of the film layer, thereby improving the uniformity of the display.

[0131] Continue to see Fig.19 In one embodiment, optionally, the connection electrode 110 includes a first connection electrode portion 111, a second connection electrode portion 112 located on the side of the first connection electrode portion 111 away from the substrate 600, and a third connection electrode portion 113 located on the side of the first connection electrode portion 111 facing the substrate 600, the second connection electrode portion 112 is arranged to protrude from the side of the first connection electrode portion 111; and the third connection electrode portion 113 is arranged to protrude from the side of the first connection electrode portion 111. Such an arrangement is conducive to the first connection electrode portion 111 and the first isolation portion 711 of the isolation structure 700 being arranged in the same layer and the same process, and improving the overlap effect between the second electrode and the third isolation portion 713 of the isolation structure 700, or improving the overlap effect between the second electrode and the third connection electrode portion 113, thereby improving the stability of signal transmission.

[0132] Continue to see Fig.19 Optionally, the orthographic projection of the third connection electrode portion 113 on the substrate 600 is located within the orthographic projection of the second connection electrode portion 112 on the substrate 600 .

[0133] Continue to see Fig.19On the basis of the above embodiments, optionally, the first connection electrode portion 111 and the first isolation portion 711 are provided in the same layer and material; the second connection electrode portion 112 and the second isolation portion 712 are provided in the same layer and material; and the third connection electrode portion 113 and the third isolation portion 713 are provided in the same layer and material. This arrangement allows each film layer of the connection 110 and each film layer of the isolation structure 700 to be completed in the same preparation process, thereby eliminating the need to add an additional process flow for the connection electrode 110, thereby simplifying the process flow.

[0134] Fig. 20 A schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention. Fig. 20 On the basis of the above embodiments, optionally, the first light emitting device 510 and the second light emitting device 520 have different light colors; the signal connection structure 210 transmits signals to the first light emitting device 510 and the second light emitting device 520 at the same time. Exemplarily, the number of the connection electrode 110 is one, the second electrode 511 of the first light emitting device 510 is connected to the connection electrode 110, and the second electrode 521 of the second light emitting device 520 is electrically connected to the connection electrode 110, and the connection electrode 110 is connected to the first light emitting device 510 and the second light emitting device 520 at the same time, and transmits a common potential to the first light emitting device 510 and the second light emitting device 520. The connection electrode 110 located in the border area 20 transmits the common potential through the signal connection structure 210.

[0135] In another embodiment, optionally, the signal connection structure 210 includes a first signal connection structure and a second signal connection structure, the first signal connection structure transmits a signal to the first light-emitting device 510, and the second signal connection structure transmits a signal to the second light-emitting device 520. This arrangement is conducive to providing different common potentials to light-emitting devices 500 of different colors, thereby helping to reduce the power consumption of the display panel.

[0136] Further, the light emitting device 500 further includes a third light emitting device, and the light emitting color of the third light emitting device is different from that of the first light emitting device 510 and the second light emitting device 520. Exemplarily, the first light emitting device 510 is a green light emitting device, the second light emitting device 520 is a red light emitting device, and the third light emitting device is a blue light emitting device. The signal connection structure 210 further includes a third signal connection structure, and the third signal connection structure transmits a signal to the third light emitting device.

[0137] Continue to see Fig. 20On the basis of the above embodiments, optionally, the display panel further includes at least two second wiring layers 410; in the thickness direction Z of the display panel, the distance between the first wiring layer 200 and the connecting electrode layer 100 is smaller than the distance between the second wiring layer 410 and the connecting electrode layer 100. This arrangement makes the first wiring layer 200 a film layer closer to the connecting electrode layer 100, which is beneficial to the wiring design of the display panel and reduces the difficulty of preparation.

[0138] Continue to see Fig. 20 In one embodiment of the present invention, optionally, at least two second wiring layers 410 are divided into a first metal layer 411, a second metal layer 412 and a third metal layer 413; the first wiring layer 200 is a fourth metal layer. Exemplarily, the first metal layer 411 is used to lay out gates and scan lines, etc., the second metal layer 412 is used to lay out capacitor plates, etc., the third metal layer 413 is used to lay out source electrodes, drain electrodes and data lines, etc., and the fourth metal layer (i.e., the first wiring layer 200) is used to lay out the first intermediate wiring 240 connected to the first electrode (e.g., anode), the signal connection structure 210, etc. Among them, the first electrode is located in the first electrode layer, and the first electrode layer is located between the first wiring layer 200 and the connection electrode layer 100.

[0139] Continue to see Fig. 20 Optionally, other film layers 400 of the array layer further include an intermediate insulating layer 420 between the metal layers, a buffer layer 440 and a substrate 430, etc. Among them, the intermediate insulating layer 420 includes a gate insulating layer between the active layer 450 and the first metal layer 411, a capacitor insulating layer between the first metal layer 411 and the second metal layer 412, a first intermediate insulating layer between the second metal layer 412 and the third metal layer 413, a second intermediate insulating layer and a second planarization layer between the third metal layer 413 and the fourth metal layer, etc.

[0140] In another embodiment of the present invention, optionally, at least two second wiring layers are divided into a first metal layer, a second metal layer, a third metal layer and a fourth metal layer; the first wiring layer is a fifth metal layer. Exemplarily, the first metal layer is used to lay out gates and scan lines, etc., the second metal layer is used to lay out capacitor plates, etc., the third metal layer is used to lay out source electrodes, drain electrodes and data lines, etc., the fourth metal layer is used to lay out the first middle wiring connected to the anode, etc., and the fifth metal layer (i.e., the first wiring layer) is used to lay out the third middle wiring connected to the anode, the crossover wire of the data line, the signal connection structure, etc.

[0141] The embodiment of the present invention further provides a display panel, see Figure 1-Figure 20 The display panel has a display area 10 and a frame area 20 at least partially surrounding the display area 10. The display panel includes:

[0142] substrate 600;

[0143] A first electrode layer 501, a light-emitting layer 502, and a second electrode layer 503 are sequentially stacked in a direction away from the substrate 600;

[0144] At least two insulating layers 300 are stacked in sequence in the frame area 20 in a direction away from the substrate 600; at least two insulating layers 300 have through-holes;

[0145] The connecting electrode layer 100 and the first wiring layer 200 are connected. The connecting electrode layer 100 is provided with a connecting electrode 110 located in the border area 20. The first wiring layer 200 is provided with a signal connection structure 210. The signal connection structure 210 transmits signals to the connecting electrode 110 through the sleeve hole, and the connecting electrode 110 transmits signals to the second electrode layer 503.

[0146] In an embodiment of the present invention, a second electrode is connected to a connecting electrode 110, and the connecting electrode 110 is connected to the first wiring layer 200 through a sleeve hole. The required signal is accessed through the first wiring layer 200, thereby realizing signal transmission on the connecting electrode 110. The embodiment of the present invention provides a wiring method for transmitting signals to the second electrode that is completely different from the related art, thereby improving the wiring flexibility of the display panel.

[0147] Furthermore, in some related technologies, the second electrode layer directly extends from the display area 10 to the frame area 20 and is connected to the signal transmission line. Since the second electrode layer is a film layer close to the top layer of the display panel, the second electrode layer located in the display area 10 has a complete encapsulation layer for water vapor isolation, while the second electrode layer located in the frame area 20 is usually weakly encapsulated (for example, the number of encapsulation layers is reduced or there is no encapsulation layer), so the wiring structure of the related technology is susceptible to water vapor invasion, resulting in corrosion. Compared with the second electrode layer, the connecting electrode layer 100 can resist water vapor invasion and is not prone to corrosion.

[0148] Optionally, the at least two insulating layers 300 include:

[0149] A first planarization layer 310 is located on a side of the first electrode layer 501 close to the substrate 600 . The first planarization layer 310 is provided with a first via hole 311 located in the border area 20 .

[0150] The pixel definition layer 320 is located on the side of the first electrode layer 501 away from the substrate 600. The pixel definition layer 320 is provided with a second via hole 321 located in the frame area 20. The first via hole 311 and the second via hole 321 constitute a sleeve hole.

[0151] Optionally, the orthographic projection of the first via hole 311 on the substrate 600 overlaps with the orthographic projection of the second via hole 321 on the substrate 600 , and the connection electrode 110 is connected to the signal connection structure 210 through the overlapping area of ​​the first via hole 311 and the second via hole 321 .

[0152] Optionally, the size of the first via hole 311 is greater than the size of the second via hole 321 , and the orthographic projection of the first via hole 311 on the substrate 600 covers the orthographic projection of the second via hole 321 on the substrate 600 .

[0153] An embodiment of the present invention further provides a method for manufacturing a display panel, and the manufacturing method can be used to manufacture the display panel provided by any embodiment of the present invention. Fig.21 A schematic diagram of the structure formed in each step of a method for manufacturing a display panel provided by an embodiment of the present invention. Fig.21 The manufacturing method of the display panel comprises the following steps:

[0154] S110, forming a first wiring layer 200 on the substrate 600, and patterning a signal connection structure 210 on the first wiring layer 200 for transmitting a signal to the connection electrode 110;

[0155] S120, forming an insulating layer 300 on the first wiring layer 200, and forming a via hole 301 on the insulating layer 300, wherein the via hole 301 exposes the signal connection structure 210;

[0156] S130 , forming a connection electrode layer 100 on the insulating layer 300 , and patterning a connection electrode 110 on the connection electrode layer 100 ; the connection electrode 110 is connected to the signal connection structure 210 through the via hole 301 .

[0157] In the embodiment of the present invention, the connection electrode 110 is connected to the first wiring layer 200 via the via hole 301 in the insulating layer 300, so as to realize signal transmission on the connection electrode 110, which is beneficial to realize signal transmission of the connection electrode 110 and improve the wiring flexibility of the display panel.

[0158] Fig. 22 A schematic diagram of the structure formed in each step of another method for manufacturing a display panel provided by an embodiment of the present invention. Fig. 22 Based on the above embodiments, optionally, the method for manufacturing the display panel includes the following steps:

[0159] S210 , forming a first wiring layer 200 on the substrate 600 , and patterning a signal connection structure 210 and a third via hole 220 on the first wiring layer 200 for transmitting a signal to the connection electrode 110 .

[0160] Exemplarily, the material of the first wiring layer 200 is one or a combination of gold, silver, copper (Cu), lithium (Li), sodium (Na), potassium (K), magnesium (Mg), aluminum (Al) and zinc (Zn). The signal connection structure 210 and the third via 220 can be formed by photolithography. Specifically, other film layers 400 of the array layer are also provided between the first wiring layer 200 and the substrate 600. First, a whole metal layer is formed on the other film layers 400 of the array layer, and then a photoresist is formed on the metal layer. The pattern of the signal connection structure 210 and the third via 220 are formed by a dry etching process, and then the photoresist is removed. The provision of the third via 220 is conducive to the discharge of water vapor generated by the lower film layer, thereby avoiding the problem of film separation and shedding caused by the inability to discharge water vapor.

[0161] S220 , forming a first planarization layer 310 on the first routing layer 200 , and forming a first via hole 311 on the first planarization layer 310 , wherein the first via hole 311 exposes the signal connection structure 210 .

[0162] The material of the first planarization layer 310 is an organic glue, which may be a photoresist. Specifically, the organic glue is coated on the first wiring layer 200 in an entire layer, and then a patterning process is performed to form the first via hole 311 .

[0163] S230 , forming a pixel definition layer 320 covering the first planarization layer 310 on the first planarization layer 310 , and forming a second via hole 321 on the pixel definition layer 320 , wherein the second via hole 321 exposes the signal connection structure 210 .

[0164] S240, sequentially forming a third connection electrode portion 113, a first connection electrode portion 111 and a second connection electrode portion 112 on the pixel definition layer 320, and performing a photolithography process to form a connection electrode 110 and a fourth via hole 120; the connection electrode 110 is connected to the signal connection structure 210 through the second via hole 321.

[0165] Exemplarily, the material of the third connection electrode portion 113 includes molybdenum, the material of the second connection electrode portion 112 includes aluminum, and the material of the second connection electrode portion 111 includes titanium. The third connection electrode portion 113, the first connection electrode portion 111, and the second connection electrode portion 112 are formed by a physical vapor deposition process, and then a photoresist is applied, and the second connection electrode portion 112 and a part of the first connection electrode portion 111 are etched by a dry etching process, and then the remaining first connection electrode portion 111 and the third connection electrode portion 113 are etched by a wet etching process, thereby forming the connection electrode 110 and the fourth via 120.

[0166] It should be noted that the preparation of the array layer in the display panel may refer to the relevant technology, and the present invention will not elaborate on it.

[0167] The embodiment of the present invention further provides a display device, which may be, for example, a mobile phone, a tablet computer, a wearable device, a computer, a television, etc. The display device includes a display panel provided by any embodiment of the present invention, and its technical principles and effects are similar and will not be described in detail.

[0168] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0169] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display panel comprising a display area and a frame area at least partially surrounding the display area, characterized in that: The display panel comprises: substrate; A first electrode layer, a light-emitting layer, and a second electrode layer are sequentially stacked in a direction away from the substrate; A connecting electrode layer, located at one side of the substrate, the connecting electrode layer is provided with connecting electrodes located in the border area, and the connecting electrodes transmit signals to the second electrode layer; A first wiring layer, wherein the first wiring layer is provided with a signal connection structure that transmits the signal to the connection electrode.

2. The display panel according to claim 1, characterized in that: Also includes: The isolation structure is arranged on one side of the substrate, and the isolation structure is provided with a first isolation opening.

3. The display panel according to claim 2, characterized in that: The connecting electrode electrically connects the isolation structure with the signal connection structure, and the connecting electrode and the isolation structure are provided in the same layer and with the same material; Preferably, the connecting electrode is integrated with the isolation structure.

4. The display panel according to claim 2, characterized in that: The display panel further comprises a pixel definition layer located on a side of the first electrode layer away from the substrate, the pixel definition layer comprising a pixel opening exposing the first electrode, the pixel opening being connected to the isolation opening; Preferably, the pixel definition layer comprises an inorganic insulating material.

5. The display panel according to claim 4, characterized in that: The isolation structure further includes a second isolation opening located in the border area, wherein the second isolation opening is a dummy isolation opening; Preferably, the size, shape, arrangement and distribution density of the second isolation openings are the same as those of the first isolation openings.

6. The display panel according to claim 4, characterized in that: The display panel further includes a first planarization layer located on a side of the first electrode layer close to the substrate; The first planarization layer is provided with a first via hole located in the border area, and the pixel definition layer is provided with a second via hole located in the border area; The orthographic projection of the first via hole on the substrate overlaps with the orthographic projection of the second via hole on the substrate, and the connection electrode is connected to the signal connection structure through the overlapping area of ​​the first via hole and the second via hole; Preferably, a size of the first via hole is greater than a size of the second via hole, and an orthographic projection of the second via hole on the substrate is located within an orthographic projection of the first via hole on the substrate.

7. The display panel according to claim 6, characterized in that: The first routing layer further includes a third via hole, and the third via hole is located in the border area.

8. The display panel according to claim 7, characterized in that: The third via hole comprises a third A via hole and a third B via hole; the orthographic projection of the third A via hole on the substrate is located within the orthographic projection of the connecting electrode on the substrate, and the orthographic projection of the third B via hole on the substrate is located outside the orthographic projection of the connecting electrode on the substrate; Preferably, the display panel also includes a dam structure, which is located on a side of the area where the signal connection structure is located, away from the display area; the first routing layer extends from the area where the signal connection structure is located to the area where the dam structure is located; the orthographic projection of the third via on the substrate overlaps with the orthographic projection of the dam structure on the substrate.

9. The display panel according to claim 2, characterized in that: The isolation structure includes a first isolation portion and a second isolation portion which are sequentially stacked in a direction away from the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate.

10. The display panel according to claim 9, characterized in that: The second electrode is electrically connected to the first isolation portion.

11. The display panel according to claim 9, characterized in that: The isolation structure further includes a third isolation portion located on a side of the first isolation portion close to the substrate, the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate, and the second electrode is electrically connected to the third isolation portion; Preferably, the material of the third isolation portion includes molybdenum metal; and / or the material of the first isolation portion includes aluminum metal; and / or the material of the second isolation portion includes titanium metal.

12. The display panel according to claim 11, characterized in that: The connecting electrode comprises a first connecting electrode portion, a second connecting electrode portion located on a side of the first connecting electrode portion away from the substrate, and a third connecting electrode portion located on a side of the first connecting electrode portion facing the substrate, wherein the second connecting electrode portion is arranged to protrude from a side of the first connecting electrode portion; and the third connecting electrode portion is arranged to protrude from a side of the first connecting electrode portion; Preferably, the orthographic projection of the third connecting electrode portion on the substrate is located within the orthographic projection of the second connecting electrode portion on the substrate.

13. The display panel according to claim 12, characterized in that: The first connecting electrode portion is provided in the same layer and material as the first isolating portion; the second connecting electrode portion is provided in the same layer and material as the second isolating portion; and the third connecting electrode portion is provided in the same layer and material as the third isolating portion.

14. The display panel according to claim 1, characterized in that: The connection electrode is in a block shape, and / or the signal connection structure is in a block shape; And / or, the number of the connecting electrodes is at least one, and the number of the signal connecting structures is at least one; the signal connecting structures correspond to the connecting electrodes one-to-one; and / or the signal connecting structures correspond to the connecting electrodes in a many-to-one manner; and / or the signal connecting structures correspond to the connecting electrodes in a one-to-many manner; Preferably, the electrical signals transmitted by the connecting electrodes are the same electrical signals; or, the electrical signals transmitted by the connecting electrodes are different.

15. The display panel according to claim 1, characterized in that: The display panel further includes at least two second wiring layers located between the substrate and the first wiring layer.

16. The display panel according to claim 15, characterized in that: At least two of the second wiring layers include a first metal layer, a second metal layer, a third metal layer and a fourth metal layer stacked in sequence in a direction away from the substrate; the first wiring layer is a fifth metal layer; Preferably, at least in the display area, the first metal layer is provided with a gate of the transistor, the second metal layer is provided with a capacitor plate, the third metal layer is provided with a source and a drain of the transistor, and the fourth metal layer is provided with a first intermediate wiring connected to the first electrode.

17. The display panel according to claim 15, characterized in that: At least two of the second wiring layers include a first metal layer, a second metal layer and a third metal layer; the first wiring layer is a fourth metal layer; Preferably, at least in the display area, the first metal layer is provided with a gate of the transistor, the second metal layer is provided with a capacitor plate, and the third metal layer is provided with a source and a drain of the transistor.

18. The display panel according to claim 1, characterized in that: The first electrode layer includes a first electrode, the light-emitting layer includes a light-emitting portion, and the second electrode layer includes a second electrode; the first electrode, the light-emitting portion, and the second electrode constitute a light-emitting device; The light-emitting device includes a first light-emitting device and a second light-emitting device emitting different colors, and the signal connection structure includes a first signal connection structure and a second signal connection structure, the first signal connection structure is electrically connected to the first light-emitting device, and the second signal connection structure is electrically connected to the second light-emitting device.

19. The display panel according to claim 1, characterized in that: The first electrode layer includes a first electrode, the light-emitting layer includes a light-emitting portion, and the second electrode layer includes a second electrode; the first electrode, the light-emitting portion, and the second electrode constitute a light-emitting device; The light emitting device comprises a first light emitting device and a second light emitting device that emit light of different colors, and the signal connection structure transmits the same signal to the first light emitting device and the second light emitting device.

20. A display device, characterized in that: include: A display panel as claimed in any one of claims 1 to 19.

21. A display panel comprising a display area and a frame area at least partially surrounding the display area, characterized in that: include: substrate; A first electrode layer, a light-emitting layer, and a second electrode layer are sequentially stacked in a direction away from the substrate; At least two insulating layers are stacked in sequence in the frame area in a direction away from the substrate; the at least two insulating layers have through-holes; A connecting electrode layer and a first wiring layer, wherein the connecting electrode layer is provided with a connecting electrode located in the border area, and the first wiring layer is provided with a signal connection structure, wherein the signal connection structure transmits a signal to the connecting electrode through the sleeve hole, and the connecting electrode transmits a signal to the second electrode layer.

22. The display panel according to claim 21, characterized in that: The at least two insulating layers include: A first planarization layer, located on a side of the first electrode layer close to the substrate, the first planarization layer being provided with a first via hole located in the border area; A pixel definition layer, located on a side of the first electrode layer away from the substrate, the pixel definition layer is provided with a second via hole located in the border area; wherein the first via hole and the second via hole constitute the sleeve hole; Preferably, the orthographic projection of the first via hole on the substrate overlaps with the orthographic projection of the second via hole on the substrate, and the connection electrode is connected to the signal connection structure through the overlapping area of ​​the first via hole and the second via hole; Preferably, a size of the first via hole is greater than a size of the second via hole, and an orthographic projection of the first via hole on the substrate covers an orthographic projection of the second via hole on the substrate.

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