Preparation method of display panel, display panel and display device

Abstract

The embodiment of the invention provides a preparation method of a display panel, the display panel and a display device.The preparation method of the display panel comprises the steps that an isolation structure is prepared on a substrate, and a first isolation opening, a second isolation opening and a third isolation opening are defined by the isolation structure; a first preparation material layer is arranged on the side, away from the substrate, of the isolation structure, and part of the first preparation material layer falls into the first isolation opening to form a first light-emitting unit and a first packaging part; removing the first preparation material layer in the area where the second isolation opening is located so as to expose the second isolation opening, and reserving the first preparation material layer in the area where the third isolation opening is located; a second preparation material layer is arranged on the side, away from the substrate, of the isolation structure, and part of the second preparation material layer falls into the second isolation opening to form a second light-emitting unit and a second packaging part. According to the embodiment of the invention, the large influence on the shape of the wall surface, facing the third isolation opening, of the isolation structure can be improved, and the processing performance of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing a display panel, a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a method for manufacturing a display panel, a display panel, and a display device, aiming to improve the process performance of the display panel.

[0005] An embodiment of the first aspect of the present application provides a method for preparing a display panel, comprising:

[0006] An isolation structure is prepared on the substrate, wherein the isolation structure encloses a first isolation opening, a second isolation opening and a third isolation opening;

[0007] A first preparation material layer is arranged on a side of the isolation structure facing away from the substrate, and a portion of the first preparation material layer falls into the first isolation opening to form a first light-emitting unit and a first encapsulation portion;

[0008] removing the first preparation material layer in the area where the second isolation opening is located to expose the second isolation opening, and retaining the first preparation material layer in the area where the third isolation opening is located;

[0009] A second preparation material layer is disposed on a side of the isolation structure facing away from the substrate, and a portion of the second preparation material layer falls into the second isolation opening to form a second light-emitting unit and a second encapsulation portion.

[0010] According to an embodiment of the first aspect of the present application, after the step of disposing a second preparation material layer on a side of the isolation structure away from the substrate and partially dropping the second preparation material layer into the second isolation opening to form a second light-emitting unit and a second encapsulation portion, the step further includes:

[0011] removing the first preparation material layer in the area where the first isolation opening is located, and removing the first preparation material layer and the second preparation material layer in the area where the third isolation opening is located, so that the third isolation opening is exposed;

[0012] A third preparation material layer is disposed on a side of the isolation structure facing away from the substrate, and a portion of the third preparation material layer falls into the third isolation opening to form a third light-emitting unit and a third encapsulation portion.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, in the step of removing the first preparation material layer in the area where the first isolation opening is located, and removing the first preparation material layer and the second preparation material layer in the area where the third isolation opening is located to expose the third isolation opening: the third isolation opening and part of the isolation structure surrounding the third isolation opening are exposed.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the first packaging portion and the second packaging portion are spaced apart on a side of the isolation structure facing away from the substrate.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the step of removing the first preparation material layer in the area where the first isolation opening is located, and removing the first preparation material layer and the second preparation material layer in the area where the third isolation opening is located, so as to expose the third isolation opening comprises:

[0016] removing the second preparation material layer in the area where the third isolation opening is located, so that the first preparation material layer in the area where the third isolation opening is located is exposed;

[0017] The second preparation material layer in the area where the first isolation opening is located and the first preparation material layer in the area where the third isolation opening is located are removed to expose the third isolation opening.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, in the step of removing the second preparation material layer in the area where the third isolation opening is located to expose the first preparation material layer in the area where the third isolation opening is located: removing the second preparation material layer in the area where the third isolation opening is located, so that a portion of the second preparation material layer in the area where the second isolation opening is located overlaps with the first preparation material layer in the area where the third isolation opening is located on a side of the isolation structure facing away from the substrate to form an overlapping portion, and the first preparation material layer in the area where the third isolation opening is located is exposed;

[0019] In the step of removing the second preparation material layer in the area where the first isolation opening is located and the first preparation material layer in the area where the third isolation opening is located to expose the third isolation opening, the overlapping portion is also removed.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, after the step of disposing a second preparation material layer on a side of the isolation structure away from the substrate, and partially dropping the second preparation material layer into the second isolation opening to form a second light-emitting unit and a second encapsulation portion, the method further includes:

[0021] A photoresist material layer is covered on the side of the second preparation material layer facing away from the substrate, and the photoresist material layer is patterned to form a first photoresist layer and a first photolithography opening opened in the first photoresist layer, wherein the orthographic projection of the first photolithography opening on the substrate is located within the orthographic projection of the third isolation opening on the substrate.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the step of removing the first preparation material layer in the area where the first isolation opening is located, and removing the first preparation material layer and the second preparation material layer in the area where the third isolation opening is located, so as to expose the third isolation opening comprises:

[0023] removing the second preparation material layer in the area where the first isolation opening and the third isolation opening are located, so that the first preparation material layer of the third isolation opening is exposed;

[0024] The first preparation material layer in the area where the third isolation opening is located is removed to expose the third isolation opening.

[0025] According to any of the foregoing embodiments of the first aspect of the present application, after the step of disposing a third preparation material layer on a side of the isolation structure away from the substrate, and partially dropping the third preparation material layer into the third isolation opening to form a third light-emitting unit and a third encapsulation portion, the step further includes:

[0026] The third preparation material layer is removed from the regions where the first isolation opening and the second isolation opening are located.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the third encapsulation part and the first encapsulation part are spaced apart on a side of the isolation structure facing away from the substrate, and / or the third encapsulation part and the second encapsulation part are spaced apart on a side of the isolation structure facing away from the substrate.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, in the step of removing the third preparation material layer in the area where the first isolation opening and the second isolation opening are located: the third preparation material layer in the first isolation opening, on the side of the isolation structure surrounding the first isolation opening facing away from the substrate, in the second isolation opening, on the side of the isolation structure surrounding the second isolation opening facing away from the substrate, and partially surrounding the third isolation opening on the side of the isolation structure facing away from the substrate are removed.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, in the step of removing the first preparation material layer in the area where the second isolation opening is located to expose the second isolation opening, and retaining the first preparation material layer in the area where the third isolation opening is located:

[0030] The first preparation material layer in the second isolation opening and the isolation structure partially surrounding the second isolation opening on the side facing away from the substrate is removed to expose the second isolation opening and the isolation structure partially surrounding the second isolation opening, and the third isolation opening and the isolation structure partially surrounding the third isolation opening are covered by the first preparation material layer.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the step of preparing an isolation structure on a substrate, wherein the isolation structure encloses a first isolation opening, a second isolation opening, and a third isolation opening, comprises:

[0032] Disposing a first insulating material layer on one side of the substrate;

[0033] An isolation structure is prepared on a side of the first insulating material layer facing away from the substrate, wherein the isolation structure encloses a first isolation opening, a second isolation opening, and a third isolation opening;

[0034] The first insulating material layer exposed by the first isolation opening is patterned to form a first pixel opening, the first insulating material layer exposed by the second isolation opening is patterned to form a second pixel opening, and the first insulating material layer exposed by the third isolation opening is patterned to form a third pixel opening.

[0035] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first sublayer and a second sublayer stacked in a direction away from the substrate, and the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the second sublayer on the substrate.

[0036] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a third sublayer, which is located on the side of the first sublayer facing the substrate, and the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the third sublayer on the substrate.

[0037] According to any of the aforementioned embodiments of the first aspect of the present application, the first preparation material layer includes a first light-emitting material layer, a first conductive material layer, and a first packaging material layer stacked in a direction away from the substrate, the first preparation material layer is arranged on a side of the isolation structure away from the substrate, and a portion of the first preparation material layer falls into the first isolation opening to form a first light-emitting unit and a first packaging portion, thereby forming a first light-emitting unit, a first sub-electrode, and a first packaging portion stacked in a direction away from the substrate;

[0038] And / or, the second preparation material layer includes a second light-emitting material layer, a second conductive material layer and a second packaging material layer stacked in a direction away from the substrate, and the second preparation material layer is arranged on the side of the isolation structure away from the substrate, and part of the second preparation material layer falls into the second isolation opening to form a second light-emitting unit and a second packaging part, thereby forming a second light-emitting unit, a second sub-electrode and a second packaging part stacked in a direction away from the substrate.

[0039] The embodiment of the second aspect of the present application further provides a display panel, which is prepared by the preparation method provided by any of the above-mentioned embodiments of the first aspect.

[0040] An embodiment of the second aspect of the present application also provides a display panel, comprising: a substrate; an isolation structure, arranged on one side of the substrate and enclosing an isolation opening, the isolation opening comprising a first isolation opening, a second isolation opening and a third isolation opening; a light-emitting layer, comprising a first light-emitting unit located at the first isolation opening, a second light-emitting unit located at the second isolation opening and a third light-emitting unit located at the third isolation opening; wherein the isolation structure comprises a first sublayer and a second sublayer stacked in a direction away from the substrate, the second sublayer protrudes toward the isolation opening relative to the first sublayer, and the length of the second sublayer protruding toward the first isolation opening relative to the first sublayer is a first length, the length of the second sublayer protruding toward the second isolation opening relative to the first sublayer is a second length, the length of the second sublayer protruding toward the third isolation opening relative to the first sublayer is a third length, and the absolute value of the difference between the second length and the third length is less than or equal to 0.1 μm.

[0041] According to an embodiment of the second aspect of the present application, the first length is smaller than the second length, and / or the first length is smaller than the third length.

[0042] According to any of the aforementioned embodiments of the second aspect of the present application, the first length is smaller than the second length, and the absolute value of the difference between the first length and the second length is 0.05 μm to 0.15 μm;

[0043] And / or, the first length is smaller than the third length, and the absolute value of the difference between the first length and the third length is 0.05 μm to 0.15 μm.

[0044] According to any of the aforementioned embodiments of the second aspect of the present application, the first length is less than the second length, and the second length is less than or equal to the third length, and the absolute value of the difference between the first length and the second length is greater than the absolute value of the difference between the second length and the third length;

[0045] Alternatively, the first length is smaller than the third length, and the third length is smaller than or equal to the second length, and the absolute value of the difference between the first length and the third length is greater than the absolute value of the difference between the second length and the third length.

[0046] According to any of the aforementioned embodiments of the second aspect of the present application, the second length is equal to the third length.

[0047] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the isolation structure includes a conductive material;

[0048] The display panel also includes a second electrode located at a side of each light emitting unit away from the substrate, and the second electrode is electrically connected to the isolation structure.

[0049] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the first sublayer includes a conductive material, and the second electrode and the first sublayer are electrically connected.

[0050] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the second sub-layer includes a conductive material.

[0051] According to any of the aforementioned embodiments of the second aspect of the present application, the isolation structure further includes a third sublayer located on a side of the first sublayer facing the substrate.

[0052] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the third sublayer includes a conductive material, and the second electrode and the third sublayer are electrically connected.

[0053] According to any of the aforementioned embodiments of the second aspect of the present application, it also includes: a pixel definition layer, which is arranged on one side of the substrate and includes a pixel defining portion and a pixel opening, and the pixel opening and the isolation opening are connected.

[0054] According to any of the aforementioned embodiments of the second aspect of the present application, the isolation structure is located on a side of the pixel defining portion facing away from the substrate, or a clearance opening is provided on the pixel defining portion, and the isolation structure is located in the clearance opening.

[0055] An embodiment of the third aspect of the present application further provides a display device, comprising a display panel provided by any of the above-mentioned embodiments of the second aspect.

[0056] In the preparation method provided in the embodiment of the present application, an isolation structure is first prepared on a substrate, and the isolation structure encloses a first isolation opening, a second isolation opening, and a third isolation opening. Different isolation openings can be used to accommodate different light-emitting units, which can improve the crosstalk problem of light output between different light-emitting units. Then, a first preparation material layer is set on the substrate with an isolation structure, and the first preparation material layer will fall into the first isolation opening, the second isolation opening, and the third isolation opening, and the first preparation material layer will also fall on the side of the isolation structure away from the substrate. The first preparation material layer that falls into the first isolation opening forms a first light-emitting unit. Then, the first preparation material layer in the area where the second isolation opening is located is removed, and the first preparation material layer in the area where the third isolation opening is located is retained. In this step, the first preparation material layer in the area where the third isolation opening is located will not be removed. Finally, the second preparation material layer continues to be set, so that a second light-emitting unit is formed in the second isolation opening. In an embodiment of the present application, when the first preparation material layer is removed to expose the second isolation opening, the first preparation material layer in the area where the second isolation opening is located is removed, and the first preparation material layer in the area where the third isolation opening is located is not removed. This can improve the situation where the preparation material layer in the third isolation opening is removed multiple times, which has a significant impact on the shape of the wall of the isolation structure facing the third isolation opening, thereby improving the process performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0058] Figure 1 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0059] Figures 2 to 5 It is a structural schematic diagram of a manufacturing process of a display panel provided in an embodiment of the present application;

[0060] Figure 6 is a schematic flow chart of a method for preparing a display panel provided in another embodiment of the present application;

[0061] Figures 7 to 9 is a structural schematic diagram of a manufacturing process of a display panel provided by another embodiment of the present application;

[0062] Fig.10 is a schematic flow chart of a method for preparing a display panel provided in another embodiment of the present application;

[0063] Figures 11 to 13 is a structural schematic diagram of a display panel manufacturing process provided by another embodiment of the present application;

[0064] Fig.14 is a schematic flow chart of a method for preparing a display panel provided in yet another embodiment of the present application;

[0065] Fig.15 and Fig.16 is a structural schematic diagram of a display panel manufacturing process provided by another embodiment of the present application;

[0066] Fig.17 is a schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0067] Fig.18 yes Fig.17 Cross-sectional view at the middle BB.

[0068] Description of reference numerals:

[0069] 100. Substrate;

[0070] 200, first electrode layer; 210, first electrode;

[0071] 300, pixel definition layer; 310, pixel definition portion; 320, pixel opening; 321, first pixel opening; 322, second pixel opening; 323, third pixel opening; 330, light emitting unit; 331, first light emitting unit; 332, second light emitting unit; 333, third light emitting unit;

[0072] 400, isolation structure; 410, isolation opening; 411, first isolation opening; 412, second isolation opening; 413, third isolation opening; 420, side wall surface; 401, first sublayer; 402, second sublayer; 403, third sublayer;

[0073] 500, second electrode; 510, first sub-electrode; 520, second sub-electrode; 530, third sub-electrode;

[0074] 600, packaging unit; 610, first packaging unit; 620, second packaging unit; 630, third packaging unit;

[0075] 700, second encapsulation layer; 800, third encapsulation layer;

[0076] 11. first light emitting material layer; 21. first conductive material layer; 31. first packaging material layer;

[0077] 12. second light emitting material layer; 22. second conductive material layer; 32. second packaging material layer;

[0078] 13. third light emitting material layer; 23. third conductive material layer; 33. third packaging material layer;

[0079] 40. A first photoresist layer; 41. A first photolithography opening;

[0080] 50. second photoresist layer; 51. second photolithography opening;

[0081] 60. Overlapping portion. DETAILED DESCRIPTION

[0082] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0083] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating directions or positional relationships, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0084] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0085] In order to better understand this application, Figures 1 to 18 The manufacturing method of the display panel, the display panel and the display device according to the embodiments of the present application are described in detail.

[0086] like Figure 1 As shown, an embodiment of the first aspect of the present application provides a method for preparing a display panel, comprising:

[0087] Step S01: Figure 2 As shown, an isolation structure 400 is prepared on a substrate 100 , and the isolation structure 400 encloses a first isolation opening 411 , a second isolation opening 412 , and a third isolation opening 413 .

[0088] Step S02: Figure 3 As shown, a first preparation material layer is disposed on a side of the isolation structure 400 facing away from the substrate 100 , and a portion of the first preparation material layer falls into the first isolation opening 411 to form the first light emitting unit 331 and the first encapsulation portion 610 .

[0089] Step S03: Figure 4 As shown, the first preparation material layer in the area where the second isolation opening 412 is located is removed to expose the second isolation opening 412 , and the first preparation material layer in the area where the third isolation opening 413 is located is retained.

[0090] Step S04: Figure 5As shown, a second preparation material layer is disposed on the side of the isolation structure 400 facing away from the substrate 100 , and a portion of the second preparation material layer falls into the second isolation opening 412 to form a second light emitting unit 332 and a second encapsulation portion 620 .

[0091] In the preparation method provided in the embodiment of the present application, firstly, an isolation structure 400 is prepared on the substrate 100 through step S01, and the isolation structure 400 encloses a first isolation opening 411, a second isolation opening 412 and a third isolation opening 413. Different isolation openings 410 can be used to accommodate different light-emitting units 330, which can improve the crosstalk problem of light output between different light-emitting units 330. In step S02, a first preparation material layer is set on the substrate 100 with the isolation structure 400, and the first preparation material layer will fall into the first isolation opening 411, the second isolation opening 412, and the third isolation opening 413, and the first preparation material layer will also fall on the side of the isolation structure 400 away from the substrate 100. The first preparation material layer falling into the first isolation opening 411 forms the first light-emitting unit 331. In step S03, the first preparation material layer in the area where the second isolation opening 412 is located is removed, and the first preparation material layer in the area where the third isolation opening 413 is located is retained, and the first preparation material layer in the area where the third isolation opening 413 is located is not removed in step S03. In step S04, the second preparation material layer continues to be set, so that the second light-emitting unit 332 is formed in the second isolation opening 412. In the embodiment of the present application, in step S02, the first preparation material layer in the area where the second isolation opening 412 is located is removed, and the first preparation material layer in the area where the third isolation opening 413 is located is not removed. This can improve the shape of the wall of the isolation structure 400 facing the third isolation opening 413 when the preparation material layer in the third isolation opening 413 is removed multiple times, thereby improving the process performance of the display panel.

[0092] Among them, patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 record the relevant technical solutions of the isolation structure and the encapsulation layer, and their contents are incorporated into this application by reference for reference. There are many ways to set the substrate 100. The substrate 100 may include a substrate and a first conductive layer, a second conductive layer, and a third conductive layer arranged on one side of the substrate and stacked. An insulating layer is provided between adjacent conductive layers. Optionally, a drive device layer is provided on the substrate, and a pixel drive circuit is provided in the drive device layer, and the pixel drive circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source and a drain. The storage capacitor includes a first plate and a second plate. As an example, the gate and the first electrode plate may be located in the first conductive layer, the second electrode plate may be located in the second conductive layer, and the source and the drain may be located in the third conductive layer.

[0093] Optionally, before step S01, a first electrode layer 200 may be prepared on the substrate 100, and the first electrode layer 200 includes first electrodes 210 arranged at intervals. In step S01, each first electrode 210 is exposed by each first isolation opening 411, so that the first electrode 210 can be in contact with and connected to the light-emitting unit 330 located in each isolation opening 410.

[0094] In some optional embodiments, such as Figure 6 As shown, after step S04, the following steps are also included:

[0095] Step S05: Figure 7 As shown, the first preparation material layer in the area where the first isolation opening 411 is located is removed, and the first preparation material layer and the second preparation material layer in the area where the third isolation opening 413 is located are removed to expose the third isolation opening 413 .

[0096] Step S06: Figure 8 As shown, a third preparation material layer is disposed on the side of the isolation structure 400 facing away from the substrate 100 , and a portion of the third preparation material layer falls into the third isolation opening 413 to form a third light emitting unit 333 and a third encapsulation portion 630 .

[0097] The isolation structure 400 has a side wall surface 420 facing the third isolation opening 413. In the related art, the first preparation material layer outside the area where the first isolation opening 411 is located is usually removed in step S03, that is, the first preparation material layer in the area where the second isolation opening 412 and the third isolation opening 413 are located is removed in step S03. And after step S04, the second preparation material layer in the area where the third isolation is located continues to be removed. In the related art, the material layer in the third isolation opening 413 is removed at least twice in succession to expose the third isolation opening 413, which causes the side wall surface 420 to be repeatedly patterned, for example, the side wall is repeatedly etched, which will affect the shape of the side wall surface 420. When the third light-emitting unit 333 is prepared later, it will affect the preparation and molding of the third light-emitting unit 333, and may also affect the overlap of the second electrode 500 and the isolation structure 400 in the third isolation opening 413.

[0098] In the embodiment of the present application, the first preparation material layer in the area where the third isolation opening 413 is located is not removed in step S03, and when the second preparation material layer in the third isolation opening 413 is removed in step S05, the side wall surface 420 is not exposed. Finally, the preparation material layer in the area where the third isolation opening 413 is located is removed, so that the side wall surface 420 is etched at most once, which can improve the yield of the side wall surface 420 and thereby improve the process performance of the display panel.

[0099] Optionally, in step S05, the third isolation opening 413 and a portion of the isolation structure 400 surrounding the third isolation opening 413 are exposed. That is, the removal range is larger, which can improve the impurity residue in the third isolation opening 413 and improve the incomplete material removal in the third isolation opening 413 caused by process error.

[0100] Optionally, after step S05, the first encapsulation part 610 and the second encapsulation part 620 are spaced apart on the side of the isolation structure 400 away from the substrate 100. That is, after the first preparation material layer in the area where the second isolation opening 412 is located and the second preparation material layer in the area where the first isolation opening 411 is located are removed, a portion of the isolation structure 400 located between the first encapsulation part 610 and the second encapsulation part 620 will be exposed to ensure complete removal.

[0101] In some optional embodiments, after step S06, the following steps are further included:

[0102] Step S07: Fig. 9 As shown, the third preparation material layer is removed from the area where the first isolation opening 411 and the second isolation opening 412 are located, so that the first light-emitting unit 331 and the second light-emitting unit 332 are not covered by the third preparation material layer.

[0103] Optionally, after step S07, a second encapsulation layer 700 and a third encapsulation layer 800 may be further provided. Optionally, the material of the encapsulation part 600 includes an inorganic material, the material of the second encapsulation layer 700 includes an organic material, and the material of the third encapsulation layer 800 includes an inorganic material.

[0104] Optionally, in step S07, the third preparation material layer may be removed in the first isolation opening 411, on the side of the isolation structure 400 surrounding the first isolation opening 411 facing away from the substrate 100, in the second isolation opening 412, on the side of the isolation structure 400 surrounding the second isolation opening 412 facing away from the substrate 100, and partially surrounding the third isolation opening 413 on the side of the isolation structure 400 facing away from the substrate 100. That is, not only the third preparation material layer in the first isolation opening 411 and the second isolation opening 412 is removed, but also the third preparation material layer on a portion of the isolation structure 400 is removed.

[0105] After step S07, the first encapsulation part 610 and the second encapsulation part 620 are exposed, and when the first isolation opening 411 and the third isolation opening 413 are adjacent, the adjacent first encapsulation part 610 and the adjacent third encapsulation part 630 are spaced apart on the side of the isolation structure 400 facing away from the substrate 100. When the second isolation opening 412 and the third isolation opening 413 are adjacent, the adjacent second encapsulation part 620 and the adjacent third encapsulation part 630 are spaced apart on the side of the isolation structure 400 facing away from the substrate 100.

[0106] Optionally, the display panel further includes a third light emitting unit 333 and a third encapsulation portion 630 located at the third isolation opening 413. Optionally, the first isolation opening 411, the second isolation opening 412 and the third isolation opening 413 are collectively referred to as the isolation opening 410, and the isolation opening 410 includes the first isolation opening 411, the second isolation opening 412 and the third isolation opening 413. The first light emitting unit 331, the second light emitting unit 332 and the third light emitting unit 333 are collectively referred to as the light emitting unit 330, and the light emitting unit 330 includes the first light emitting unit 331, the second light emitting unit 332 and the third light emitting unit 333. Each light emitting unit 330 is located at each isolation opening 410. Optionally, the first encapsulation portion 610, the second encapsulation portion 620 and the third encapsulation portion 630 are collectively referred to as the encapsulation portion 600, and the encapsulation portion 600 includes the first encapsulation portion 610, the second encapsulation portion 620 and the third encapsulation portion 630.

[0107] There are many ways to set step S05. In some optional embodiments, for example Fig.10 As shown, step S05 includes:

[0108] Step S051: Fig.11 and Fig.12As shown, the second preparation material layer in the area where the third isolation opening 413 is located is removed to expose the first preparation material layer in the area where the third isolation opening 413 is located.

[0109] Step S052: Fig.13 As shown, the second preparation material layer in the area where the first isolation opening 411 is located and the first preparation material layer in the area where the third isolation opening 413 is located are removed to expose the third isolation opening 413 .

[0110] In the embodiment of the present application, firstly, the second preparation material layer in the third isolation opening 413 is removed in step S051, so that the first preparation material layer can be exposed, and the side wall surface 420 is covered by the first preparation material layer. In step S052, the second preparation material layer in the area where the first isolation opening 411 is located and the first preparation material layer in the area where the third isolation opening 413 is located are removed, so that the third isolation opening 413 is exposed, and the first light-emitting unit 331 and the first packaging part 610 are exposed.

[0111] Optional, such as Fig.12 As shown, after the second preparation material layer in the area where the third isolation opening 413 is located is removed in step S051, not only will the first preparation material layer in the area where the third isolation opening 413 is located be exposed, but also part of the second preparation material layer in the area where the second isolation opening 412 adjacent to the third isolation opening 413 is located overlaps with the first preparation material layer in the area where the third isolation opening 413 is located on the side of the isolation structure 400 facing away from the substrate 100 to form an overlapping portion 60.

[0112] Optionally, the overlapping portion 60 includes a portion of the second preparation material layer and the first preparation material layer that are stacked. The second preparation material layer may include at least one of a light-emitting material layer for preparing the second light-emitting unit 332, a conductive material layer for preparing the second sub-electrode 520, and a packaging material layer for preparing the second encapsulation portion 620. Similarly, the first preparation material layer may include at least one of a light-emitting material layer for preparing the first light-emitting unit 331, a conductive material layer for preparing the first sub-electrode 510, and a packaging material layer for preparing the first packaging portion 610. The overlapping portion 60 may include a light-emitting material layer for preparing the second light-emitting unit 332, a conductive material layer for preparing the second sub-electrode 520, a packaging material layer for preparing the second packaging portion 620, a light-emitting material layer for preparing the first light-emitting unit 331, a conductive material layer for preparing the first sub-electrode 510, and a packaging material layer for preparing the first packaging portion 610.

[0113] Optionally, when wet etching is used to remove the second preparation material layer in the area where the third isolation opening 413 is located in step S051, the etching solution may enter between the first preparation material layer and the second preparation material layer to remove the light-emitting material layer used to prepare the second light-emitting unit 332 and the conductive material layer used to prepare the second sub-electrode 520. At this time, the overlapping portion 60 may include a packaging material layer for preparing the second packaging portion 620, a light-emitting material layer for preparing the first light-emitting unit 331, a conductive material layer for preparing the first sub-electrode 510, and a packaging material layer for preparing the first packaging portion 610.

[0114] Optionally, when the second preparation material layer in the area where the third isolation opening 413 is located is removed in step S051 using a dry etching process, the first preparation material layer and the second preparation material layer are not affected, and the overlapping portion 60 may include a light-emitting material layer for preparing the second light-emitting unit 332, a conductive material layer for preparing the second sub-electrode 520, a packaging material layer for preparing the second packaging portion 620, a light-emitting material layer for preparing the first light-emitting unit 331, a conductive material layer for preparing the first sub-electrode 510, and a packaging material layer for preparing the first packaging portion 610.

[0115] For example, Fig.11 As shown, after step S04, a photoresist material layer is covered on the side of the second preparation material layer facing away from the substrate 100, and the photoresist material layer is patterned to form a first photoresist layer 40 and a first photolithography opening 41 opened in the first photoresist layer 40, and the orthographic projection of the first photolithography opening 41 on the substrate 100 is located within the orthographic projection of the third isolation opening 413 on the substrate 100, so that the size of the first photolithography opening 41 is less than or equal to the size of the third isolation opening 413, and the second preparation material layer on the isolation structure 400 enclosing the third isolation opening 413 is covered by the first photoresist layer 40.

[0116] After the first photoresist layer 40 is provided, after the second preparation material layer in the area where the third isolation opening 413 is located is removed through the first photolithography opening 41 in step S051, part of the first preparation material layer and the second preparation material layer are retained on the isolation structure 400 around the third isolation opening 413, and the part of the first preparation material layer and the second preparation material layer are stacked to form an overlapping portion 60. The overlapping portion 60 can provide protection for the isolation structure 400, and when the second preparation material layer in the area where the first isolation opening 411 is located and the first preparation material layer in the area where the third isolation opening 413 is located are removed in step S052, due to the existence of the overlapping portion 60, the first preparation material layer in the third isolation opening 413 can continue to cover the isolation structure 400 and the sidewall surface 420.

[0117] After step S051, Fig.13As shown, a second photoresist material layer may be provided, and the second photoresist material layer may be patterned to form a second photoresist layer 50, a second photolithography opening 51 may be provided on the second photoresist layer 50, and the first isolation opening 411 and the third isolation opening 413 may be exposed through the second photolithography opening 51. In step S052, the second preparation material layer in the area where the first isolation opening 411 is located and the first preparation material layer in the area where the third isolation opening 413 is located may be removed through the second photolithography opening 51.

[0118] In some other optional embodiments, Fig.14 As shown, step S05 may also include:

[0119] Step S051': Fig.15 As shown, the second preparation material layer in the area where the first isolation opening 411 and the third isolation opening 413 are located is removed to expose the first preparation material layer of the third isolation opening 413 .

[0120] Step S052': Fig.16 As shown, the first preparation material layer in the area where the third isolation opening 413 is located is removed to expose the third isolation opening 413 .

[0121] In these optional embodiments, the second preparation material layer in the area where the first isolation opening 411 and the third isolation opening 413 are located can be removed in step S051', and then the first preparation material layer in the area where the third isolation opening 413 is located can be removed in step S052' to expose the third isolation opening 413.

[0122] Before step S051', a photoresist material layer may be provided on the second preparation material layer, and the photoresist material layer may be patterned to form photolithographic openings, and in step S051', the photolithographic openings are used to remove the second preparation material layer in the area where the first isolation opening 411 and the third isolation opening 413 are located. Similarly, before step S052', a photoresist layer having photolithographic openings may be provided, and in step S052', the photolithographic openings are used to remove the first preparation material layer in the area where the third isolation opening 413 is located.

[0123] In some optional embodiments, in step S03, the first preparation material layer of the isolation structure 400 in the second isolation opening 412 and partially surrounding the second isolation opening 412 facing away from the substrate 100 is removed, so that the second isolation opening 412 and the isolation structure 400 partially surrounding the second isolation opening 412 are exposed, and the third isolation opening 413 and the isolation structure 400 partially surrounding the third isolation opening 413 are covered by the first preparation material layer.

[0124] In these optional embodiments, when removing the first preparation material layer in the second isolation opening 412 , a portion of the first preparation material layer on the isolation structure 400 surrounding the second isolation structure 400 is also removed, which can expand the removal range and improve the impurity residue in the second isolation opening 412 .

[0125] Optional, such as Fig.17 As shown, in step S01, it may include:

[0126] Step S011 : disposing a first insulating material layer on one side of the substrate 100 .

[0127] Step S012 : preparing an isolation structure 400 on the side of the first insulating material layer facing away from the substrate 100 , wherein the isolation structure 400 encloses a first isolation opening 411 , a second isolation opening 412 and a third isolation opening 413 . That is, the isolation structure 400 encloses an isolation opening 410 .

[0128] Step S013: patterning the first insulating material layer exposed by the first isolation opening 411 to form a first pixel opening 321, patterning the first insulating material layer exposed by the second isolation opening 412 to form a second pixel opening 322, and patterning the first insulating material layer exposed by the third isolation opening 413 to form a third pixel opening 323. That is, patterning the first insulating material layer exposed by each isolation opening 410 to form each pixel opening 320.

[0129] The first pixel opening 321, the second pixel opening 322 and the third pixel opening 323 are collectively referred to as the pixel opening 320, and the pixel opening 320 includes the first pixel opening 321, the second pixel opening 322 and the third pixel opening 323. In step S013, the first insulating material forms the pixel defining portion 310, and the pixel opening 320 is opened in the pixel defining portion 310. The pixel opening 320 and the pixel defining portion 310 form the pixel definition layer 300.

[0130] When the display panel includes the first electrodes 210 , in step S013 , each first electrode 210 is exposed from each pixel opening 320 . When the light emitting unit 330 is subsequently prepared, each light emitting unit 330 falls into the pixel opening 320 and contacts and connects with each first electrode 210 .

[0131] There are many ways to set the isolation structure 400. For example, the isolation structure 400 includes a first sublayer 401 and a second sublayer 402 stacked in a direction away from the substrate 100, and the orthographic projection of the first sublayer 401 on the substrate 100 is located within the orthographic projection of the second sublayer 402 on the substrate 100. The size of the first sublayer 401 is smaller than the size of the second sublayer 402, and a concave can be formed under the second sublayer 402. When the first preparation material layer and the second preparation material layer are subsequently placed on the isolation structure 400, the first preparation material layer can be broken at the edge of the isolation structure 400, thereby forming an independently set first light-emitting unit 331. Similarly, the second preparation material layer can also be broken at the edge of the second sublayer 402 to form mutually independent second light-emitting units 332.

[0132] Optionally, the isolation structure 400 further includes a third sublayer 403, which is located on the side of the first sublayer 401 facing the substrate 100, and the orthographic projection of the first sublayer 401 on the substrate 100 is located within the orthographic projection of the third sublayer 403 on the substrate 100. When the first sublayer 401 is side-engraved, the third sublayer 403 can protect the film layer on the substrate 100 side.

[0133] Optionally, the display panel includes a second electrode 500 located at a side of each light-emitting unit 330 away from the substrate 100, and the encapsulation portion 600 is located at a side of the second electrode 500 away from the substrate 100. The second electrode 500 may include a first sub-electrode 510 located at the first isolation opening 411, a second sub-electrode 520 located at the second isolation opening 412, and a third sub-electrode 530 located at the third isolation opening 413. The second electrode 500 and the first electrode 210 are used to work together to drive the light-emitting unit 330 to emit light.

[0134] There are many ways to set the first preparation material layer. Optionally, the first preparation material layer includes a first light-emitting material layer 11, a first conductive material layer 21 and a first packaging material layer 31 stacked in a direction away from the substrate 100. In step S02, a first light-emitting unit 331, a first sub-electrode 510 and a first packaging portion 610 stacked in a direction away from the substrate 100 are formed.

[0135] Optionally, the second preparation material layer includes a second light-emitting material layer 12, a second conductive material layer 22 and a second packaging material layer 32 stacked in a direction away from the substrate 100. In step S04, a second light-emitting unit 332, a second sub-electrode 520 and a second packaging part 620 stacked in a direction away from the substrate 100 are formed.

[0136] Optionally, the third preparation material layer includes a third light-emitting material layer 13, a third conductive material layer 23 and a third encapsulation material layer 33 stacked in a direction away from the substrate 100. In step S04, a third light-emitting unit 333, a third sub-electrode 530 and a third encapsulation part 630 stacked in a direction away from the substrate 100 are formed.

[0137] like Fig.17 and Fig.18 As shown, the second aspect embodiment of the present application further provides a display panel, which is prepared and formed by the preparation method of any of the above-mentioned first aspect embodiments.

[0138] In the display panel prepared by any of the above-mentioned first aspect embodiments, the shape of the side wall surface 420 of the isolation structure 400 facing the third isolation opening 413 is more in line with expectations, which can improve the yield of the third light-emitting unit 333 and the third sub-electrode 530 and improve the process performance of the display panel.

[0139] Optionally, as described above, the display panel includes a substrate 100 , an isolation structure 400 and a light emitting unit 330 . The configuration of the isolation structure 400 and the light emitting unit 330 is as described above and will not be repeated here. Optionally, the display panel may further include a pixel definition layer 300 .

[0140] Optionally, first electrodes 210 are disposed on the substrate 100 and are distributed at intervals.

[0141] Optionally, the pixel definition layer 300 is arranged on the side of the first electrode layer 200 facing away from the substrate 100, and the pixel definition layer 300 includes a pixel defining portion 310 and a first pixel opening 321, a second pixel opening 322 and a third pixel opening 323 opened in the pixel defining portion 310, and the first electrode 210 is exposed by the first pixel opening 321, the second pixel opening 322 and the third pixel opening 323.

[0142] Optionally, the isolation structure 400 is located on a side of the pixel defining portion 310 facing away from the substrate 100, and the isolation structure 400 encloses a first isolation opening 411, a second isolation opening 412, and a third isolation opening 413. The first isolation opening 411 is connected to the first pixel opening 321, the second isolation opening 412 is connected to the second pixel opening 322, and the third isolation opening 413 is connected to the third pixel opening 323. The isolation structure 400 includes the first sublayer 401 and the second sublayer 402 described above.

[0143] Optionally, a first light-emitting unit 331 is disposed in the first pixel opening 321, and a first sub-electrode 510 is disposed on a side of the first light-emitting unit 331 facing away from the substrate 100. The first sub-electrode 510 extends to a side of the pixel defining portion 310 facing away from the substrate 100 and overlaps with the first sub-layer 401. A first encapsulation portion 610 is disposed on a side of the first sub-electrode 510 facing away from the substrate 100, and a portion of the first encapsulation portion 610 extends to a side of the isolation structure 400 facing away from the substrate 100. Optionally, there is a gap between the first encapsulation portion 610 and a surface of the isolation structure 400 facing away from the substrate 100.

[0144] Optionally, a second light-emitting unit 332 is disposed in the second pixel opening 322, and a second sub-electrode 520 is disposed on the side of the second light-emitting unit 332 facing away from the substrate 100, and the second sub-electrode 520 extends to the side of the pixel defining portion 310 facing away from the substrate 100 and overlaps with the first sub-layer 401. A second encapsulation portion 620 is disposed on the side of the second sub-electrode 520 facing away from the substrate 100, and a portion of the second encapsulation portion 620 extends to the side of the isolation structure 400 facing away from the substrate 100, and the second encapsulation portion 620 is spaced apart from the first encapsulation portion 610 on the side of the isolation structure 400 facing away from the substrate 100. Optionally, there is a gap between the second encapsulation portion 620 and the surface of the isolation structure 400 facing away from the substrate 100.

[0145] Optionally, a third light emitting unit 333 is disposed in the third pixel opening 323, and a third sub-electrode 530 is disposed on the side of the third light emitting unit 333 facing away from the substrate 100. The third sub-electrode 530 extends to the side of the pixel defining portion 310 facing away from the substrate 100 and overlaps with the first sub-layer 401. A third encapsulation portion 630 is disposed on the side of the third sub-electrode 530 facing away from the substrate 100, and a portion of the third encapsulation portion 630 extends to the side of the isolation structure 400 facing away from the substrate 100, and the third encapsulation portion 630 is spaced from the first encapsulation portion 610 and / or the second encapsulation portion 620 on the side of the isolation structure 400 facing away from the substrate 100. Optionally, there is a gap between the third encapsulation portion 630 and the surface of the isolation structure 400 facing away from the substrate 100.

[0146] Optionally, the display panel further includes a second encapsulation layer 700 and a third encapsulation layer 800 , wherein the second encapsulation layer 700 covers the isolation structure 400 , the first encapsulation part 610 , the second encapsulation part 620 and the third encapsulation part 630 . The third encapsulation layer 800 covers the second encapsulation layer 700 .

[0147] like Fig.17 and Fig.18As shown, the second embodiment of the present application further provides a display panel, which can be prepared and formed by the preparation method of any of the above-mentioned first embodiment. The display panel includes: a substrate 100; an isolation structure 400, which is arranged on one side of the substrate 100 and encloses an isolation opening 410, and the isolation opening 410 includes a first isolation opening 411, a second isolation opening 412 and a third isolation opening 413; a light-emitting layer, including a first light-emitting unit 331 located at the first isolation opening 411, a second light-emitting unit 332 located at the second isolation opening 412 and a third light-emitting unit 333 located at the third isolation opening 413; wherein the isolation structure 400 includes a first sublayer 401 and a second sublayer 400 stacked in a direction away from the substrate 100. The second sublayer 402 is arranged to protrude relative to the first sublayer 401 toward the isolation opening 410, and the length of the second sublayer 402 protruding relative to the first sublayer 401 toward the first isolation opening 411 is the first length SA1, the length of the second sublayer 402 protruding relative to the first sublayer 401 toward the second isolation opening 412 is the second length SA2, and the length of the second sublayer 402 protruding relative to the first sublayer 401 toward the third isolation opening 413 is the third length SA3, and the absolute value of the difference between the second length SA2 and the third length SA3 is less than or equal to 0.1μm. Optionally, the absolute value of the difference between the second length SA2 and the third length SA3 can be 0.1μm, 0.09μm, 0.085μm, 0.07μm, 0.05μm or less.

[0148] In the display panel provided in the embodiment of the present application, referring to the above-mentioned preparation method, the first light-emitting unit 331 can be prepared first, and then the second light-emitting unit 332 and the third light-emitting unit 333 can be prepared in sequence, and the side wall surface 420 of the isolation structure 400 facing the third isolation opening 413 and the side wall surface facing the second isolation opening 412 are etched at most once, so that the second length SA2 and the third length SA3 are close, that is, the absolute value of the difference between the second length SA2 and the third length SA3 is less than or equal to 0.1μm. The shape of the side wall surface 420 of the isolation structure 400 facing the third isolation opening 413 is more in line with expectations, which can improve the yield of the third light-emitting unit 333 and the third sub-electrode 530, and improve the process performance of the display panel.

[0149] Optionally, the first length SA1 is smaller than the second length SA2, and / or the first length SA1 is smaller than the third length SA3.

[0150] In the embodiment of the present application, before preparing the first light-emitting unit 331, the side wall surface of the isolation structure 400 facing the first isolation opening 411 is not side-etched, so the inner wall surface of the first sublayer 401 facing the first isolation opening 411 is not damaged, and the surface of the first sublayer 401 facing the second isolation opening 412 and the third isolation opening 413 are etched once, so the first length SA1 is smaller, while the second length SA2 and the third length SA3 are larger.

[0151] Optionally, the first length SA1 is smaller than the second length SA2, and the absolute value of the difference between the first length SA1 and the second length SA2 is 0.05μm to 0.15μm. For example, the absolute value of the difference between the first length SA1 and the second length SA2 is 0.05μm, 0.06μm, 0.08μm, 0.09μm, 0.095μm, 0.10μm, 0.106μm, 0.12μm / 0.14μm, or 0.15μm, so as to improve the display effect of the display panel affected by the absolute value of the difference between the first length SA1 and the second length SA2 being too long.

[0152] And / or, the first length SA1 is smaller than the third length SA3, and the absolute value of the difference between the first length SA1 and the third length SA3 is 0.05 μm to 0.15 μm. For example, the absolute value of the difference between the first length SA1 and the third length SA3 is 0.05 μm, 0.06 μm, 0.08 μm, 0.09 μm, 0.095 μm, 0.10 μm, 0.106 μm, 0.12 μm / 0.14 μm, 0.15 μm, so as to improve the display effect of the display panel affected by the absolute value of the difference between the first length SA1 and the third length SA3 being too long.

[0153] Optionally, the second length SA2 may be slightly greater than the third length SA3, or the second length SA2 may be slightly less than the third length SA3. When the first length SA1 is less than the second length SA2, and the second length SA2 is less than or equal to the third length SA3, the absolute value of the difference between the first length SA1 and the second length SA2 is greater than the absolute value of the difference between the second length SA2 and the third length SA3, or, when the first length SA1 is less than the third length SA3, and the third length SA3 is less than or equal to the second length SA2, the absolute value of the difference between the first length SA1 and the third length SA3 is greater than the absolute value of the difference between the second length SA2 and the third length SA3. Since the surfaces of the isolation structure 400 facing the second isolation opening 412 and the third isolation opening 413 are etched at most once, the second length SA2 and the third length SA3 are close, but the side of the isolation structure 400 facing the first isolation opening 411 is not etched, so the first length SA1 is significantly smaller than the second length SA2 and the third length SA3.

[0154] Optionally, the second length SA2 and the third length SA3 are equal, so that the sizes of the isolation structures 400 at different positions are closer and the isolation effects of the isolation structures 400 on different luminescent materials are closer, so as to further improve the manufacturing yield and display uniformity of the display panel.

[0155] Optionally, the display panel may also include the above-mentioned first electrode layer 200, pixel definition layer 300, second electrode 500, packaging part 600, second packaging layer 700 and third packaging layer 800. The arrangement of the first electrode layer 200, pixel definition layer 300, isolation structure 400, second electrode 500, packaging part 600, second packaging layer 700 and third packaging layer 800 is as described above and will not be repeated here.

[0156] For example, optionally, the display panel includes a second electrode 500 located at a side of each light-emitting unit 330 away from the substrate 100. The second electrode 500 may include a first sub-electrode 510 located at the first isolation opening 411, a second sub-electrode 520 located at the second isolation opening 412, and a third sub-electrode 530 located at the third isolation opening 413. The second electrode 500 and the first electrode 210 are used to work together to drive the light-emitting unit 330 to emit light.

[0157] Optionally, the material of the isolation structure 400 includes a conductive material, and the second electrode 500 and the isolation structure 400 are electrically connected, so that a plurality of second electrodes 500 can be interconnected through the isolation structure 400 to form a surface electrode.

[0158] Optionally, the material of the first sublayer 401 may include a conductive material, and the second electrode 500 is electrically connected to the first sublayer 401. Optionally, the second sublayer 402 may include a conductive material to increase the distribution area of ​​the conductive material and reduce the voltage drop of the second electrode 500.

[0159] Optionally, the isolation structure 400 further includes the third sublayer 403 mentioned above, and the third sublayer 403 may include a conductive material. The second electrode 500 and the third sublayer 403 are electrically connected to further reduce the voltage drop of the second electrode 500 at different positions.

[0160] As described above, the display panel further includes a pixel definition layer 300. The isolation structure 400 may be located on the side of the pixel definition portion 310 facing away from the substrate 100 to simplify the structure of the pixel definition layer 300 and simplify the preparation of the display panel. Alternatively, a clearance opening is provided on the pixel definition portion 310, and the isolation structure 400 is located in the clearance opening to reduce the thickness of the display panel.

[0161] The embodiment of the third aspect of the present application also provides a display device, including the display panel of any of the second aspect embodiments. Since the display device provided by the embodiment of the third aspect of the present application includes the display panel of any of the second aspect embodiments, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel of any of the second aspect embodiments, which will not be described in detail here.

[0162] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0163] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for preparing a display panel, characterized in that: include: An isolation structure is prepared on the substrate, wherein the isolation structure encloses a first isolation opening, a second isolation opening and a third isolation opening; A first preparation material layer is disposed on a side of the isolation structure away from the substrate, and a portion of the first preparation material layer falls into the first isolation opening to form a first light-emitting unit and a first packaging portion; removing the first preparation material layer in the area where the second isolation opening is located to expose the second isolation opening, and retaining the first preparation material layer in the area where the third isolation opening is located; A second preparation material layer is disposed on a side of the isolation structure away from the substrate, and a portion of the second preparation material layer falls into the second isolation opening to form a second light-emitting unit and a second packaging portion.

2. The preparation method according to claim 1, characterized in that: After the step of disposing a second preparation material layer on a side of the isolation structure away from the substrate, and partially dropping the second preparation material layer into the second isolation opening to form a second light-emitting unit and a second encapsulation portion, the step further includes: removing the first preparation material layer in the area where the first isolation opening is located, and removing the first preparation material layer and the second preparation material layer in the area where the third isolation opening is located, so that the third isolation opening is exposed; A third preparation material layer is disposed on a side of the isolation structure away from the substrate, and a portion of the third preparation material layer falls into the third isolation opening to form a third light-emitting unit and a third encapsulation portion; Preferably, in the step of removing the first preparation material layer in the area where the first isolation opening is located, and removing the first preparation material layer and the second preparation material layer in the area where the third isolation opening is located, so as to expose the third isolation opening: the third isolation opening and a portion of the isolation structure surrounding the third isolation opening are exposed; Preferably, the first encapsulation portion and the second encapsulation portion are spaced apart on a side of the isolation structure away from the substrate.

3. The preparation method according to claim 2, characterized in that: The step of removing the first preparation material layer in the area where the first isolation opening is located, and removing the first preparation material layer and the second preparation material layer in the area where the third isolation opening is located, so as to expose the third isolation opening comprises: removing the second preparation material layer in the area where the third isolation opening is located, so that the first preparation material layer in the area where the third isolation opening is located is exposed; The second preparation material layer in the area where the first isolation opening is located and the first preparation material layer in the area where the third isolation opening is located are removed to expose the third isolation opening.

4. The preparation method according to claim 3, characterized in that: In the step of removing the second preparation material layer in the area where the third isolation opening is located to expose the first preparation material layer in the area where the third isolation opening is located: removing the second preparation material layer in the area where the third isolation opening is located to overlap the second preparation material layer in the area where a portion of the second isolation opening is located with the first preparation material layer in the area where the third isolation opening is located on a side of the isolation structure facing away from the substrate to form an overlapping portion, and exposing the first preparation material layer in the area where the third isolation opening is located; In the step of removing the second preparation material layer in the area where the first isolation opening is located and the first preparation material layer in the area where the third isolation opening is located so as to expose the third isolation opening, the overlapping portion is also removed; Preferably, after the step of arranging a second preparation material layer on a side of the isolation structure away from the substrate, and partially letting the second preparation material layer fall into the second isolation opening to form the second light-emitting unit and the second packaging part, the method further includes: A photoresist material layer is covered on the side of the second preparation material layer facing away from the substrate, and the photoresist material layer is patterned to form a first photoresist layer and a first photolithography opening opened in the first photoresist layer, wherein the orthographic projection of the first photolithography opening on the substrate is located within the orthographic projection of the third isolation opening on the substrate.

5. The preparation method according to claim 2, characterized in that: The step of removing the first preparation material layer in the area where the first isolation opening is located, and removing the first preparation material layer and the second preparation material layer in the area where the third isolation opening is located, so as to expose the third isolation opening comprises: removing the second preparation material layer in the area where the first isolation opening and the third isolation opening are located, so that the first preparation material layer in the third isolation opening is exposed; The first preparation material layer in the area where the third isolation opening is located is removed to expose the third isolation opening.

6. The preparation method according to claim 2, characterized in that: After the step of disposing a third preparation material layer on a side of the isolation structure away from the substrate, and partially dropping the third preparation material layer into the third isolation opening to form a third light-emitting unit and a third encapsulation portion, the step further includes: removing the third preparation material layer in the area where the first isolation opening and the second isolation opening are located; Preferably, the third encapsulation part and the first encapsulation part are arranged at intervals on a side of the isolation structure away from the substrate, and / or the third encapsulation part and the second encapsulation part are arranged at intervals on a side of the isolation structure away from the substrate; Preferably, in the step of removing the third preparation material layer in the area where the first isolation opening and the second isolation opening are located: the third preparation material layer in the first isolation opening, the isolation structure surrounding the first isolation opening facing away from the substrate, the isolation structure in the second isolation opening, the isolation structure surrounding the second isolation opening facing away from the substrate, and the isolation structure partially surrounding the third isolation opening facing away from the substrate are removed.

7. The preparation method according to claim 1, characterized in that: In the step of removing the first preparation material layer in the area where the second isolation opening is located to expose the second isolation opening and retaining the first preparation material layer in the area where the third isolation opening is located: The first preparation material layer on the side of the isolation structure in the second isolation opening and partially surrounding the second isolation opening facing away from the substrate is removed, so that the second isolation opening and the isolation structure partially surrounding the second isolation opening are exposed, and the third isolation opening and the isolation structure partially surrounding the third isolation opening are covered by the first preparation material layer.

8. The preparation method according to claim 1, characterized in that: The step of preparing an isolation structure on a substrate, wherein the isolation structure encloses a first isolation opening, a second isolation opening, and a third isolation opening comprises: Disposing a first insulating material layer on one side of the substrate; An isolation structure is prepared on a side of the first insulating material layer facing away from the substrate, wherein the isolation structure encloses a first isolation opening, a second isolation opening, and a third isolation opening; Performing patterning on the first insulating material layer exposed by the first isolation opening to form a first pixel opening, performing patterning on the first insulating material layer exposed by the second isolation opening to form a second pixel opening, and performing patterning on the first insulating material layer exposed by the third isolation opening to form a third pixel opening; Preferably, the isolation structure comprises a first sublayer and a second sublayer stacked in a direction away from the substrate, and an orthographic projection of the first sublayer on the substrate is located within an orthographic projection of the second sublayer on the substrate; Preferably, the isolation structure further includes a third sublayer, the third sublayer is located on a side of the first sublayer facing the substrate, and the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the third sublayer on the substrate.

9. The preparation method according to claim 1, characterized in that: The first preparation material layer includes a first light-emitting material layer, a first conductive material layer and a first packaging material layer stacked in a direction away from the substrate, the first preparation material layer is arranged on a side of the isolation structure away from the substrate, and a part of the first preparation material layer falls into the first isolation opening to form a first light-emitting unit and a first packaging part, thereby forming a first light-emitting unit, a first sub-electrode and a first packaging part stacked in a direction away from the substrate; And / or, the second preparation material layer includes a second light-emitting material layer, a second conductive material layer and a second packaging material layer stacked in a direction away from the substrate, and the second preparation material layer is arranged on the side of the isolation structure away from the substrate, and part of the second preparation material layer falls into the second isolation opening to form a second light-emitting unit and a second packaging part, thereby forming a second light-emitting unit, a second sub-electrode and a second packaging part stacked in a direction away from the substrate.

10. A display panel, characterized in that: The display panel is prepared by the method according to any one of claims 1 to 9.

11. A display panel, characterized in that: include: substrate; An isolation structure is disposed on one side of the substrate and encloses an isolation opening, wherein the isolation opening includes a first isolation opening, a second isolation opening and a third isolation opening; a light-emitting unit, comprising a first light-emitting unit located at the first isolation opening, a second light-emitting unit located at the second isolation opening, and a third light-emitting unit located at the third isolation opening; In which, the isolation structure includes a first sublayer and a second sublayer stacked in a direction away from the substrate, the second sublayer protrudes toward the isolation opening relative to the first sublayer, and the length of the second sublayer protruding toward the first isolation opening relative to the first sublayer is a first length, the length of the second sublayer protruding toward the second isolation opening relative to the first sublayer is a second length, and the length of the second sublayer protruding toward the third isolation opening relative to the first sublayer is a third length, and the absolute value of the difference between the second length and the third length is less than or equal to 0.1μm.

12. The display panel according to claim 11, characterized in that: The first length is smaller than the second length, and / or the first length is smaller than the third length.

13. The display panel according to claim 12, characterized in that: The first length is smaller than the second length, and the absolute value of the difference between the first length and the second length is 0.05 μm to 0.15 μm; And / or, the first length is smaller than the third length, and an absolute value of a difference between the first length and the third length is 0.05 μm to 0.15 μm.

14. The display panel according to claim 12, characterized in that: The first length is smaller than the second length, and the second length is smaller than or equal to the third length, and the absolute value of the difference between the first length and the second length is larger than the absolute value of the difference between the second length and the third length; Alternatively, the first length is smaller than the third length, and the third length is smaller than or equal to the second length, and the absolute value of the difference between the first length and the third length is larger than the absolute value of the difference between the second length and the third length.

15. The display panel according to claim 11, characterized in that: The second length and the third length are equal.

16. The display panel according to claim 11, characterized in that: The material of the isolation structure includes a conductive material; The display panel further comprises a second electrode located at a side of each of the light-emitting units away from the substrate, and the second electrode is electrically connected to the isolation structure; Preferably, the material of the first sublayer includes a conductive material, and the second electrode is electrically connected to the first sublayer; Preferably, the material of the second sub-layer includes a conductive material; Preferably, the isolation structure further comprises a third sublayer located on a side of the first sublayer facing the substrate; Preferably, the material of the third sublayer includes a conductive material, and the second electrode and the third sublayer are electrically connected.

17. The display panel according to claim 11, characterized in that: Also includes: A pixel definition layer, the pixel definition layer is disposed on one side of the substrate and includes a pixel defining portion and a pixel opening, the pixel opening is connected to the isolation opening; Preferably, the isolation structure is located on a side of the pixel defining portion facing away from the substrate, or a clearance opening is provided on the pixel defining portion, and the isolation structure is located in the clearance opening.

18. A display device, characterized in that: A display panel formed by the preparation method according to any one of claims 1 to 9, or a display panel according to any one of claims 10 to 17.

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