Wiring board, package for housing electronic component, and electronic device

Abstract

The wiring substrate has a base body, a signal line located on the base body, and a waveguide tube-type waveguide located on the base body, the signal line having a first end portion, which is one end in the signal transmission direction, and the waveguide having: a second end portion, which is one end in the signal transmission direction; a central portion in a direction in which the signal is transmitted; and an intermediate portion closer to the central portion than the second end portion, connecting the first end portion and the second end portion, a width of the waveguide on the second end portion being greater than a width of the waveguide on the intermediate portion.

Description

Technical Field

[0001] The present disclosure relates to a wiring board, an electronic component housing package, and an electronic device. Background Art

[0002] Patent Document 1 shows a signal transmission path in which a microstrip line and a waveguide type waveguide are connected in a wiring substrate.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2004-153368. Summary of the invention

[0006] Problems to be solved by the invention

[0007] A transmission path that connects a signal line to a waveguide of a waveguide type can sometimes effectively transmit a high-frequency signal. In recent years, there has been a demand for further high frequencies of transmission signals.

[0008] An object of the present disclosure is to provide a wiring board, an electronic component housing package, and an electronic device that can achieve a further increase in the frequency of a transmission path that connects a signal line to a waveguide of a waveguide type.

[0009] Technical solutions to problems

[0010] The wiring board of the present disclosure comprises:

[0011] matrix;

[0012] A signal circuit is located on the substrate; and

[0013] a waveguide of waveguide type, located on the substrate;

[0014] The signal line has one end in the direction of signal transmission, namely, a first end.

[0015] The waveguide has: a second end portion, which is one end in the direction in which a signal is transmitted; a central portion in the direction in which a signal is transmitted; and an intermediate portion closer to the central portion than the second end portion.

[0016] The first end and the second end are connected,

[0017] The width Wa of the waveguide at the second end portion is greater than the width Wb of the waveguide at the middle portion.

[0018] The electronic component housing package of the present disclosure includes the above-mentioned wiring board.

[0019] The electronic device disclosed herein comprises:

[0020] The electronic component storage package described above, and

[0021] An electronic component is housed in the electronic component housing package.

[0022] Effects of the Invention

[0023] According to the present disclosure, a high-frequency signal can be transmitted via a transmission path that connects a signal line and a waveguide of a waveguide type, and further high frequency of the transmission path can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1A is a plan view showing a wiring substrate according to an embodiment of the present disclosure.

[0025] Figure 1B is a side view showing a wiring substrate according to an embodiment of the present disclosure.

[0026] Figure 1C is a rear view showing a wiring substrate according to an embodiment of the present disclosure.

[0027] Figure 1D It is a front view showing a wiring board according to an embodiment of the present disclosure.

[0028] Figure 2A 3. This is a perspective view showing a wiring board of Reference Example 1.

[0029] Figure 2B This is an enlarged view showing a portion C1 of the wiring board of Reference Example 1.

[0030] Figure 3A Graphs showing reflection characteristics of Reference Examples 1a to 1d having different pullback lengths.

[0031] Figure 3B It is a graph showing the transmission characteristics of Reference Examples 1a to 1d having different pullback lengths.

[0032] Figure 4A This is a perspective view showing a wiring board according to Embodiment 1 of the present disclosure.

[0033] Figure 4B This is a perspective view showing a wiring board according to Embodiment 1 of the present disclosure.

[0034] Figure 5A It is a graph showing the reflection characteristics of Embodiments 1a to 1e and Reference Example 1a having different ratios "Wa / Wb".

[0035] Figure 5B It is a graph showing the transmission characteristics of Embodiments 1a to 1e and Reference Example 1a having different ratios "Wa / Wb".

[0036] Fig. 6A It is a graph showing the reflection characteristics of Embodiments 1f to 1j and Reference Example 1a having different width section lengths.

[0037] Figure 6B It is a graph showing the transmission characteristics of Embodiments 1f to 1j and Reference Example 1a having different width section lengths.

[0038] Figure 7 This is a perspective view showing a wiring board according to Embodiment 2 of the present disclosure.

[0039] Fig. 8A It is a graph showing the reflection characteristics of Embodiments 2a to 2e and Reference Example 1a having different widths of wide ranges.

[0040] Figure 8B It is a graph showing the transmission characteristics of Embodiments 2a to 2e and Reference Example 1a having different widths of wide ranges.

[0041] Fig.9A This is a plan view showing a part of a wiring board according to Embodiment 3a of the present disclosure.

[0042] Fig. 9B This is a plan view showing a part of a wiring board according to Embodiment 3b of the present disclosure.

[0043] Fig. 9C This is a plan view showing a portion of a wiring board according to Embodiment 3c of the present disclosure.

[0044] Fig. 10A It is a graph showing the reflection characteristics of the wiring substrates of Embodiments 3a to 3c and the wiring substrate of Reference Example 1a.

[0045] Fig. 10B It is a graph showing the transmission characteristics of the wiring substrates of Embodiments 3a to 3c and the wiring substrate of Reference Example 1a.

[0046] Fig.11A It is a perspective view showing Embodiment 4a of the present disclosure.

[0047] Fig. 11B It is a perspective view showing embodiment 4b of the present disclosure.

[0048] Fig. 11C It is a perspective view showing reference example 2.

[0049] Fig. 12A It is a graph showing the reflection characteristics of the wiring substrates of Embodiments 4a and 4b and the wiring substrate of Reference Example 2.

[0050] Fig. 12B It is a graph showing the transmission characteristics of the wiring substrates of Embodiments 4a and 4b and the wiring substrate of Reference Example 2.

[0051] Fig.13A This is a perspective view showing a wiring board according to Embodiment 5 of the present disclosure.

[0052] Fig. 13B 3. It is a perspective view showing a wiring board of Reference Example 3.

[0053] Fig.14A It is a graph showing the reflection characteristics of the wiring substrates of Embodiments 5a and 5b and the wiring substrate of Reference Example 3.

[0054] Fig. 14B It is a graph showing the transmission characteristics of the wiring substrates of Embodiments 5a and 5b and the wiring substrate of Reference Example 3.

[0055] Fig.15 This is a perspective view showing a wiring board according to Embodiment 6 of the present disclosure.

[0056] Fig.16A It is a graph showing the reflection characteristics of the wiring substrates of Embodiment 6, Embodiment 1b, and Reference Example 1a.

[0057] Fig. 16B It is a graph showing the transmission characteristics of the wiring substrates of Embodiment 6, Embodiment 1b, and Reference Example 1a.

[0058] Fig.17 This is a perspective view showing a wiring board according to Embodiment 7 of the present disclosure.

[0059] Fig.18A It is a side view of the wiring board of Embodiments 1 to 7.

[0060] Fig.18B It is a cross-sectional view taken along the line BB of the wiring substrate of Embodiments 1 to 7.

[0061] Fig.18C It is a side view of the wiring board according to the eighth embodiment of the present disclosure.

[0062] Fig.18D This is a cross-sectional view taken along line DD of the wiring substrate of the eighth embodiment.

[0063] Fig.19A It is a side view of the wiring board according to the ninth embodiment of the present disclosure.

[0064] Fig.19B This is a cross-sectional view taken along line BB of the wiring substrate of the ninth embodiment.

[0065] Fig.19CThis is a side view of a wiring board according to Embodiment 10 of the present disclosure.

[0066] Fig.19D This is a cross-sectional view taken along line DD of the wiring substrate of the tenth embodiment.

[0067] Fig. 20 It is an exploded perspective view showing an electronic component storage package and an electronic device according to an embodiment of the present disclosure.

[0068] Fig.21 It is a plan view showing an electronic component storage package and an electronic device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0069] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings.

[0070] (Implementation Method 1)

[0071] Figure 1A to Figure 1D 1 is a diagram showing a wiring board according to Embodiment 1 of the present disclosure. Figure 1A It is a top view. Figure 1B is a side view, Figure 1C is the rear view, Figure 1D is the main view. Figure 1A to Figure 1D In FIG. 1 , the thickness of the film conductor is exaggerated.

[0072] like Figure 1A to Figure 1D As shown, the wiring board 10 of the first embodiment includes a base 11, a signal line 13 located on the base 11, and a waveguide type waveguide 15 located on the base 11. The signal line 13 may include a first signal line 13A located on one side and a second signal line 13B located on the other side with the waveguide 15 sandwiched therebetween.

[0073] The substrate 11 is plate-shaped and may have a first main surface 111 and a second main surface 112 opposite to the first main surface 111. The main surface may refer to the widest surface of the plate and the surface on the opposite side of the surface. The substrate 11 may be a dielectric. As the material of the substrate 11, ceramics such as alumina sintered body, glass ceramic sintered body, mullite sintered body or aluminum nitride sintered body, or resin may be used.

[0074] Hereinafter, the signal transmission direction is described as the front-to-back direction, the direction between the first main surface 111 and the second main surface 112 is described as the up-down direction, and the direction perpendicular to the front-to-back direction and the up-down direction is described as the left-to-right direction.

[0075] The wiring substrate 10 may be a structure for transmitting signals from the front to the rear, from the rear to the front, or from the front to the rear and from the rear to the front. The wiring substrate 10 may be a structure in which a first partition 210 where the first signal line 13A is located on one side, a second partition 220 where the waveguide 15 is located, and a third partition 230 where the second signal line 13B is located on the other side are arranged in this order in the front-to-back direction (see Figure 1A to Figure 1C The rear end portion 13Aa (equivalent to the "first end") of the first signal line 13A can be connected to the front end portion 15a (equivalent to the "second end") of the waveguide 15 (see Figure 1A ), the rear end portion 15d (equivalent to the "second end") of the waveguide 15 can be connected to the front end portion 13Ba (equivalent to the "first end") of the second signal line 13B (refer to Figure 1A ). The connection may mean connection in a manner capable of transmitting signals.

[0076] The first signal line 13A may be a microstrip line. The first signal line 13A may be a structure including a film conductor 131 located on the second main surface 112 of the substrate 11 and a strip conductor 132 located on the first main surface 111. The film conductor 131 of the first signal line 13A is a ground potential surface, and in the first partition 210, it may be located in the entire area of ​​the second main surface 112. The strip conductor 132 of the first signal line 13A may extend in the front-to-back direction and be located from the front end to the rear end of the first partition 210. The strip conductor 132 of the first signal line 13A may have a shape in which the width (i.e., the length in the left-right direction) gradually widens from the front end to the rear end. The first signal line 13A may be in a left-right symmetrical shape. The first signal line 13A may be a structure that transmits a transmission signal in a TEM (Transverse Electro Magnetic) mode.

[0077] The waveguide 15 may include film conductors 151, 152 and wall conductors 153, 154 that separate the signal transmission path from top to bottom and from left to right. The film conductors 151, 152 may be located on the first main surface 111 and the second main surface 112, respectively. The upper end and the lower end of each of the wall conductors 153, 154 may be connected to the film conductors 151, 152, respectively. The wall conductors 153, 154 may be a plurality of through-hole conductors arranged at intervals in the front-to-back direction. Even if the wall conductors 153, 154 are separated by intervals, since the intervals are narrow relative to the wavelength of the transmission signal, the leakage of the transmission signal is small, and the transmission signal functions as a partition that limits the transmission signal to the transmission path. In the second partition 220, the film conductors 151, 152 may be located on the entire area of ​​the first main surface 111 and the entire area of ​​the second main surface 112, respectively. The film conductors 151, 152 and the wall conductors 153, 154 may be grounded. The waveguide 15 may have a shape that is symmetrical in the left-right direction. The waveguide 15 may have a shape that is symmetrical in the front-back direction. The waveguide 15 may have a structure that transmits a transmission signal in a mode different from the TEM mode.

[0078] In the connection portion between the first signal line 13A and the waveguide 15, the strip conductor 132 of the first signal line 13A and the film conductor 151 of the waveguide 15 may be physically connected. Similarly, the film conductor 131 of the first signal line 13A and the film conductor 152 of the waveguide 15 may be physically connected. The first signal line 13A may be connected to the center of the waveguide 15 in the left-right direction.

[0079] The second signal line 13B may have the same structure as the first signal line 13A except that the orientation in the front-to-back direction is different and the second signal line 13B is connected to the rear end portion 15d of the waveguide 15. Specifically, the strip conductor 132 of the second signal line 13B may extend in the front-to-back direction from the rear end to the front end of the third partition 230. The strip conductor 132 of the second signal line 13B may have a shape in which the width (i.e., the length in the left-right direction) gradually widens from the rear end to the front end.

[0080] The film conductors 121 and 122 may be located on the left and right side surfaces of the substrate 11 (see Figure 1D The film conductors 121 and 122 may be located in the entire area of ​​the side surface. The film conductors 121 and 122 may be grounded. The second main surface 112 of the substrate 11 may be entirely covered by the film conductor 131 of the first signal line 13A, the film conductor 131 of the second signal line 13B, and the film conductor 152 of the waveguide 15.

[0081] According to the wiring substrate 10 configured as described above, when a high-frequency signal is input from the front of the wiring substrate 10, the high-frequency signal is transmitted in the order of the first signal line 13A, the waveguide 15, and the second signal line 13B, and is output from the rear of the wiring substrate 10. The high-frequency signal is transmitted in the first signal line 13A and the second signal line 13B in the TEM mode, and the high-frequency signal is transmitted in the waveguide 15 in a mode different from the TEM mode.

[0082] <Detailed structure and characteristics>

[0083] Next, the detailed structure and characteristics of the wiring board 10 are shown. The characteristics are reflection characteristics (i.e., S11 parameters) and transmission characteristics (i.e., S21 parameters), which are obtained by simulation. In the simulation, the thickness of the substrate 11 (i.e., the dimension in the vertical direction) is set to 0.2 mm, the relative dielectric constant of the substrate 11 is set to 9.5, and the frequency band of the transmission signal is set to 57 GHz to 71 GHz, and the width of the strip conductor 132 and the width of the waveguide 15 (e.g., the reference width 1 mm described later) are set in a manner to match the impedance. The center frequency of the above-mentioned transmission signal is 64 GHz.

[0084] (Reference Example 1)

[0085] Figure 2A 3. This is a perspective view showing a wiring board of Reference Example 1. Figure 2B It is an enlarged view of a portion C1 of Reference Example 1. A wiring substrate 10L of Reference Example 1 is configured similarly to the above-described wiring substrate 10 except that the structure related to the width W of the waveguide 15 is different.

[0086] In the wiring substrate 10L of Reference Example 1, the width W of the waveguide 15 is kept constant at a reference width (e.g., 1 mm) from the front end to the rear end of the waveguide 15. The width W of the waveguide 15 is equivalent to the distance between the left wall conductor 153 and the right wall conductor 154 in the left-right direction, and can be called the width of the signal transmission path.

[0087] In the case where the wall conductors 153 and 154 have a structure in which a plurality of conductors are arranged at intervals, the width W can be determined by assuming that the plurality of conductors are connected to each other in the following manner. That is, among the plurality of wall conductors (e.g., a plurality of through-hole conductors) 153 located on the left side, each group of wall conductors 153 adjacent to each other at a distance of less than 1 / 4 to less than 1 / 8 of the effective wavelength of the transmission signal (i.e., the effective wavelength of the center frequency) can be regarded as being filled with a surface conductor of the smallest area. Similarly, among the plurality of wall conductors 154 located on the right side, a pair of wall conductors 154 adjacent to each other at a distance of less than 1 / 4 to less than 1 / 8 of the effective wavelength of the transmission signal (i.e., the effective wavelength of the center frequency) can be regarded as being filled with a surface conductor of the smallest area. Moreover, as described above, the distance in the left-right direction from the left wall conductor 153 to the right wall conductor 154 filled with surface conductors can be regarded as the width W.

[0088] Figure 3A and Figure 3B Graphs showing the reflection characteristics and transmission characteristics of reference examples 1a to 1d with different pullback lengths are shown. In the wiring substrate 10L of reference example 1, a plurality of structures having different pullback lengths L11 are referred to as reference examples 1a to 1d. Figure 2B As shown, the pull-back length L11 is equivalent to the length from the front end of the film conductor 151 to the front end of the wall conductors 153 and 154. The same applies to the rear end side. The pull-back lengths L11 of reference examples 1a to 4 are "0.05mm" (= 0.03λ), "0.1mm" (= 0.07λ), "0.2mm" (= 0.14λ), and "0.3mm" (= 0.2λ), respectively. The above-mentioned "λ" is the effective wavelength of the center frequency of the transmission signal.

[0089] from Figure 3A and Figure 3B It is shown that good characteristics can be obtained in a structure in which the pullback length L11 is 0.14λ or less.

[0090] In the simulations of the embodiments 1a to 1j, 2a to 2e, and 3a to 3c described below, the pullback length L11 is uniformly set to “0.05 mm.” In some characteristic graphs showing simulation results, the characteristics of the reference example 1a having the same pullback length L11 are shown as a comparison object.

[0091] (Implementation Method 1)

[0092] Figure 4A and Figure 4B It is a perspective view showing wiring board 10 according to Embodiment 1 of the present disclosure. Figure 4A and Figure 4B The same wiring substrate 10 is shown.

[0093] The waveguide 15 includes a front end portion 15a and an intermediate portion 15b closer to the central portion 15c in the front-rear direction than the front end portion 15a (see Figure 4A and Figure 1A ). Moreover, the width Wa of the front end portion 15a may be wider than the width Wb of the intermediate portion 15b (see Figure 4A ). As shown by the simulation results described later (see Figure 5A and Figure 5B ), good characteristics can be obtained with this structure. The width Wb of the intermediate portion 15b may be the above-mentioned reference width (e.g., 1 mm). In Embodiment 1, the width Wd of the rear end portion 15d of the waveguide 15 and the width Wb of the intermediate portion 15e behind may be the same as the width Wa of the front end portion 15a and the width Wb of the intermediate portion 15b. That is, the width Wd of the rear end portion 15d may be wider than the width Wb of the intermediate portion 15e behind, and good characteristics can be obtained with this structure. Since it is the same as the width Wa of the front end portion 15a, the width Wd of the rear end portion 15d may be replaced with the width Wa.

[0094] The ratio “Wa / Wb” of the width Wa of the front end portion 15a to the width Wb of the intermediate portion 15b may be 1 < Wa / Wb ≤ 1.4. As shown by the simulation results described later (see Figure 5A and Figure 5B ), more excellent characteristics can be obtained with this structure. Similarly, the ratio “Wd / Wb” of the width Wd of the rear end portion 15d to the width Wb of the intermediate portion 15e may be 1 < Wd / Wb ≤ 1.4. More excellent characteristics can be obtained with this structure.

[0095] The width of the waveguide 15 may be wider than the width Wb of the intermediate portion 15b in a certain section extending backward from the front end portion 15a. This section is denoted as the wide-width section (equivalent to the “first section”) 221 (see Figure 4B ). The rear end of the wide-width section 221 corresponds to the boundary between the region where the width becomes wider and the region where the width is the same as the width Wb of the intermediate portion 15b. The front end of the wide-width section 221 is the front end of the wall conductors 153 and 154. The section length of the wide-width section 221 is denoted as the length La (see Figure 4B ). In Embodiment 1, the size of the wide-width section (equivalent to the “first section”) 222 on the rear side of the waveguide 15 may be the same as that of the wide-width section 221 on the front side.

[0096] The waveguide 15 may have the wide-width sections 221 and 222 as described above. As shown by the simulation results described later (see Fig. 6A and Figure 6B ), good characteristics can be obtained with this structure.

[0097] Furthermore, the length La of the wide sections 221 and 222 of the waveguide 15 can be less than 1 / 3 (= 0.5 mm) of the effective wavelength λ of the transmission signal. The effective wavelength λ of the transmission signal refers to the effective wavelength of the center frequency of the frequency band of the transmission signal. Fig. 6A and Figure 6B ) As shown in FIG. 1 , this structure can achieve better characteristics.

[0098] like Figure 4A and Figure 4B As shown, the widths Wa and Wd of the wide intervals 221 and 222 may be constant from the front end to the rear end of the wide intervals 221 and 222. The width Wa of the wide interval 221 on one side and the width Wd of the wide interval 222 on the other side may be the same. The width Wb of the intervals other than the wide intervals 221 and 222 may be constant from the front end to the other end of the interval.

[0099] Figure 5A and 5B Graphs showing reflection characteristics and transmission characteristics of embodiments 1a to 1e and reference example 1a having different ratios "Wa / Wb" are shown. In the wiring substrate 10 of embodiment 1, a plurality of structures in which only the ratios "Wa / Wb" and "Wd / Wb" are different are recorded as embodiments 1a to 1e. The ratios "Wa / Wb" of embodiments 1a to 1e are "×1.1", "×1.2", "×1.3", "×1.4", and "×1.6", respectively. In embodiments 1a to 1e, the length La of the wide width section 221 is the same as 0.3 mm, the width Wa is the same throughout the wide width section 221, and the width Wb is the reference width. In embodiments 1a to 1e, the length La of the wide width section 222 on the other side is the same as 0.3 mm, and the width Wd is the same throughout the wide width section 222. In each of embodiments 1a to 1e, the width Wa of the wide width section 221 on one side is the same as the width Wd of the wide width section 222 on the other side.

[0100] Figure 5A and 5B It is shown that in embodiments 1a to 1e, good characteristics can be obtained in most frequency bands of the transmission signal. It is shown that, in particular, in a structure where the ratio "Wa / Wb" is 1.4 or less, better characteristics are obtained than in reference example 1a, and further, it is shown that in a structure where the ratio "Wa / Wb" is 1.4 or less, the characteristics of the lower limit frequency of the transmission signal are further improved. Similarly, it is shown that, in particular, in a structure where the ratio "Wd / Wb" is 1.4 or less, better characteristics are obtained than in reference example 1a, and further, it is shown that in a structure where the ratio "Wd / Wb" is 1.4 or less, the characteristics of the lower limit frequency of the transmission signal are further improved.

[0101] Fig. 6A and Figure 6B Graphs showing the reflection characteristics and transmission characteristics of embodiments 1f to 1j and reference example 1a having different lengths of wide-width intervals, respectively. In the wiring substrate 10 of embodiment 1, a plurality of structures in which only the length La of the wide-width interval 221 is different are recorded as embodiments 1f to 1j. The length La of the wide-width interval 221 of embodiments 1f to 1j is "0.1mm" (= 0.07λ), "0.2mm" (= 0.14λ), "0.3mm" (= 0.2λ), "0.5mm" (= 0.33λ), and "0.7mm" (= 0.5λ), respectively. In embodiments 1f to 1j, the ratio of width Wa / Wb is the same as "×1.2". In each of embodiments 1f to 1j, the length La and width Wa of the wide-width interval 221 on one side are the same as the length La and width Wd of the wide-width interval 222 on the other side. The above-mentioned "λ" is the effective wavelength of the center frequency of the transmission signal.

[0102] Fig. 6A and Figure 6B It is shown that in embodiments 1f to 1j, better characteristics can be obtained than in reference example 1a. In particular, in a structure where the length La is 0.5 mm or less, that is, 1 / 3 of the effective wavelength λ or less, better characteristics can be obtained.

[0103] (Implementation Method 2)

[0104] Figure 7 1 is a perspective view showing a wiring board according to Embodiment 2 of the present disclosure. The wiring board 10A according to Embodiment 2 may be the same as that of Embodiment 1 except that the structure of the wide section 221 of the waveguide 15 is different.

[0105] In Embodiment 2, the wide sections 221 and 222 of the waveguide 15 may include gradually widening sections 156 and 157 whose widths gradually widen toward the ends of the waveguide 15. As shown in the simulation results described later (see Fig. 8A and Figure 8B ) As shown in FIG. 1 , good characteristics can be obtained by this structure. The gradually widening portion 156 can be located across the entire area of ​​the wide width interval 221. The gradually widening portion 157 can be located across the entire area of ​​the wide width interval 222.

[0106] Fig. 8A and Figure 8BGraphs showing the reflection characteristics and transmission characteristics of Embodiments 2a to 2e and Reference Example 1a respectively having different widths of wide intervals. In the wiring substrate 10A of Embodiment 2, a plurality of structures in which only the lengths La of the wide intervals 221 and 222 are different are recorded as Embodiments 2a to 2e. The lengths La of the wide intervals 221 and 222 of Embodiments 2a to 2e are respectively "0.1mm" (= 0.07λ), "0.2mm" (= 0.14λ), "0.3mm" (= 0.2λ), "0.5mm" (= 0.33λ), and "0.7mm" (= 0.5λ), and in each embodiment, the gradually widening portions 156 and 157 are located in the entire area of ​​the wide intervals 221 and 222. In Embodiments 2a to 2e, the ratios of the widths "Wa / Wb" and "Wd / Wb" are both 1.2. The width Wa of the front end portion 15a corresponds to the maximum width in the wide interval 221. The width Wd of the rear end portion 15d corresponds to the maximum width in the wide-width section 222. The above-mentioned "λ" is an effective wavelength of the center frequency of the transmission signal.

[0107] Fig. 8A and Figure 8B It is shown that in Embodiments 2a to 2e, better characteristics than those in Reference Example 1a are obtained. Fig. 8A and Figure 8B The characteristics and Fig. 6A and Figure 6B From the comparison of the characteristics, it can be seen that when the wide intervals 221 and 222 include the gradually widening parts 156 and 157, better characteristics can be obtained.

[0108] (Implementation modes 3a to 3c)

[0109] Figures 9A to 9C These are plan views showing a portion of wiring boards according to Embodiment 3a, Embodiment 3b, and Embodiment 3c of the present disclosure, respectively. Figures 9A to 9C The periphery of the wall conductor 154 in the connection portion between the first signal line 13A and the waveguide 15 is shown in a plan view. The wiring substrates 10Ba to 10Bc of the embodiments 3a to 3c may be the same as the embodiment 2 except that the pattern of the gradually widening portion 156 on the front end side and the pattern of the gradually widening portion 157 on the rear end side are different. Although the pattern of the gradually widening portion 157 on the rear end side is omitted from the illustration, it may be the same as the pattern of the gradually widening portion 156 on the front end side (for example, mirror symmetry).

[0110] like Fig.9A As in the embodiment 3a of the present invention, the gradually widening portion 156 may include a stepped portion 156A whose width gradually widens. Fig. 9B and Fig. 9CAs shown in the embodiments 3b and 3c, the gradually widening portion 156 may include an inclined portion 156B whose width continuously widens. Fig. 10A and Fig. 10B ) as shown, in this structure, good characteristics brought about by the gradually widening portion 156 can also be obtained.

[0111] In the case of a structure in which the wall conductor 153 is a plurality of conductors arranged at intervals, it can be identified as follows whether the width widens in a step-like manner or continuously widens. That is, a pair of wall conductors 153 adjacent to each other at a distance of less than 1 / 4 to less than 1 / 8 of the effective wavelength of the transmission signal (i.e., the effective wavelength of the center frequency) can be regarded as being filled with a surface conductor of the smallest area. In addition, in a structure filled with the surface conductor, it can be identified whether the width widens in a step-like manner or continuously widens.

[0112] Fig. 10A and Fig. 10B These are graphs showing the reflection characteristics and transmission characteristics of the wiring substrates 10Ba to 10Bc of the embodiments 3a to 3c and the wiring substrate of the reference example 1a, respectively. Fig. 10A and Fig. 10B This shows that good characteristics can be obtained regardless of whether the gradually widening portion 156 widens in a stepwise manner or continuously.

[0113] In embodiments 3a to 3c, the ratio "Wa / Wb" of the width of the front end portion 15a to the width of the middle portion 15b is different from the "×1.4", "×1.2", and "×1.2" portions, and the length La of the wide width interval 221 is different from the "0.3mm", "0.4mm", and "0.3mm" portions. In addition, the ratio "Wd / Wb" of the width of the rear end portion 15d to the width of the middle portion 15e and the length La of the wide width interval 222 are also different from the above ratio "Wa / Wb" and the length La of the wide width interval 221. Due to this difference, Fig. 10A and Fig. 10B The characteristic deviation of embodiments 3a to 3c is relatively large.

[0114] (Implementation 4a, 4b)

[0115] Figures 11A to 11C The three-dimensional diagrams respectively show the embodiment 4a, the embodiment 4b and the reference example 2 of the present disclosure. The wiring substrate 10Ca of the embodiment 4a can be the same as the embodiment 1 except that the interval between the plurality of wall conductors (e.g., through-hole conductors) 153 and 154 is widened to approximately 0.2 mm. The wiring substrate 10Cb of the embodiment 4b can be the same as the embodiment 2 except that the interval between the plurality of wall conductors (e.g., through-hole conductors) 153 and 154 is widened to approximately 0.2 mm.

[0116] The above pitch refers to the distance between the centers of the wall conductors 153 and 154, which are through-hole conductors. The pitch of the wall conductors 153 and 154 in the embodiments 1a to 1j, 2a to 2e, and 3a to 3c is approximately 0.1 mm.

[0117] like Fig.11A and Fig. 11B As shown, the spacing between the wall conductors 153 and 154 can be less than λ / 4 (for example, 0.38 mm). "λ" is the effective wavelength of the center frequency of the transmission signal. According to this structure, it is possible to reduce the leakage of the transmission signal from the gap between the wall conductors 153 and 154, which are multiple through-hole conductors, and obtain good characteristics.

[0118] like Fig.11A and Fig. 11B As shown in FIG. 1 , the spacing between the wall conductors 153 and 154 can be as large as λ / 8 or more and λ / 4 or less. Fig. 12A and Fig. 12B ) shows that good characteristics can also be obtained in this structure. Furthermore, by adopting a large pitch, the diameter of each wall conductor (eg, through-hole conductor) 153, 154 can be made thicker, thereby improving the ease of manufacturing of the wall conductors 153, 154.

[0119] Fig. 12A and Fig. 12B Graphs showing the reflection characteristics and transmission characteristics of the wiring substrates of Embodiments 4a and 4b and the wiring substrate of Reference Example 2, respectively. Fig. 11C As shown, the wiring board 10M of Reference Example 2 is the same as the wiring board 10L of Reference Example 1a, except that the pitch between the plurality of wall conductors 153 and 154 is set to approximately 0.2 mm. Fig. 12A and Fig. 12B It is shown that even if the pitch between the wall conductors 153 and 154 is increased, the characteristics are improved by increasing the width of the end portion of the waveguide 15 .

[0120] (Implementation 5)

[0121] Fig.13A This is a perspective view showing a wiring board according to Embodiment 5 of the present disclosure. Fig. 13B : is a perspective view showing a wiring board of reference example 3. Except that the shapes of the strip conductors 132 of the first signal line 13A and the second signal line 13B are different, the wiring board 10D of embodiment 5 can be the same as embodiment 1. Except that the widths of the strip conductors 132 of the first signal line 13A and the second signal line 13B are made the same, the wiring board 10N of reference example 3 is the same as reference example 1a.

[0122] like Fig.13AAs shown, the width of the strip conductor 132 of the first signal line 13A can be made uniform from one end to the other end. The same is true for the strip conductor 132 of the second signal line 13B. In this structure, good characteristics can also be obtained by making the width of the end of the waveguide 15 wider.

[0123] Fig.14A and Fig. 14B Graphs showing the reflection characteristics and transmission characteristics of the wiring substrates of Embodiments 5a and 5b and the wiring substrate of Reference Example 3, respectively. In the wiring substrate 10D of Embodiment 5, a plurality of structures in which only the length La of the wide width interval 221 is different are recorded as Embodiments 5a and 5b. The length La of the wide width interval 221 of Embodiments 5a and 5b is "0.1 mm" (= 0.07λ) and "0.2 mm" (= 0.14λ), respectively. In Embodiments 5a and 5b, the ratio Wa / Wb of the width on the front end side is the same as "×1.2", and the width of the waveguide 15 is set to be uniform throughout the wide width interval 221. Similarly, in Embodiments 5a and 5b, the ratio Wd / Wb of the width on the rear end side is the same as "×1.2", and the width of the waveguide 15 is set to be uniform throughout the wide width interval 222.

[0124] The above-mentioned "λ" is the effective wavelength of the center frequency of the transmission signal.

[0125] Fig.14A and Fig. 14B This shows that even when the strip conductor 132 is formed to have the same width in one or both of the first signal line 13A and the second signal line 13B, the characteristics can be improved by increasing the width of the end of the waveguide 15 .

[0126] from Fig.14A and Fig. 14B The characteristics of "0.1mm" and "0.2mm" Fig. 6A and Figure 6B Comparison of the characteristics of “0.1 mm” and “0.2 mm” shows that better characteristics can be obtained when the strip conductor 132 of the first signal line 13A and the second signal line 13B has a portion that becomes wider as it approaches the waveguide 15 .

[0127] (Implementation method 6)

[0128] Fig.15 1 is a perspective view showing a wiring substrate of Embodiment 6 of the present disclosure. The wiring substrate 10E of Embodiment 6 may be the same as Embodiment 1 except that the wide section 221 is provided only on one side of the waveguide 15 in the front-rear direction. In this structure, good characteristics can also be obtained by providing the wide section 221 at the front of the waveguide 15.

[0129] Fig.16A and Fig. 16B Graphs showing reflection characteristics and transmission characteristics of wiring substrates of Embodiment 6 and Embodiment 1b and of Reference Example 1a. Embodiment 6 is a structure having wide width section 221 only on one side in the front-back direction, Embodiment 1b is a structure having wide width sections 221 and 222 on both sides in the front-back direction, and Reference Example 1a is a structure having a uniform width of waveguide 15.

[0130] from Fig.16A and Fig. 16B It is found that the characteristics are improved even if the width of the end of the waveguide 15 is widened only on one side in the front-rear direction. Furthermore, it is shown that the characteristics can be further improved by widening the width of the waveguide 15 on both sides in the front-rear direction.

[0131] (Other embodiments)

[0132] The wiring substrates 10 to 10E of the first to sixth embodiments have been described above, but the wiring substrates of the present disclosure are not limited to the structures of the first to sixth embodiments. For example, in the first to sixth embodiments, as the wall conductors 153 and 154 of the waveguide 15, simulated conductor walls in which a plurality of through-hole conductors are arranged at intervals are shown. However, as the wall conductors 153 and 154, instead of the through-hole conductors that are circular in plan view, through-hole conductors that are long in plan view may be used, or film-shaped, wall-plate-shaped, or block-shaped conductors that separate the transmission path from the side may be used.

[0133] Fig.17 1 is a perspective view showing a wiring board 10F according to a seventh embodiment of the present disclosure. In the first to sixth embodiments described above, a structure having a plurality of rows of through-hole conductors is shown as the left wall conductor 153. Fig.17 As shown in the wiring substrate 10F of FIG. 1 , the left wall conductor 153 may be a structure having only one row of through-hole conductors arranged on the signal transmission path side. The same is true for the right wall conductor 154. The above example refers to a row connected in the front-to-back direction. In addition, as Fig.17 As shown in FIG. 1 , the film conductor 151 may not be located in the entire area of ​​the second section 220, but may be located in a range above the transmission path of the signal covering the waveguide 15. The same applies to the film conductor 152 below. Fig.17 As shown, the base 11 may be exposed on the side surface of the wiring substrate 10F.

[0134] FIG. 18A to FIG. 18D as well as Figures 19A to 19D 1 is a schematic diagram for explaining a change in the arrangement of the first signal line 13A, the waveguide 15, and the second signal line 13B in the vertical direction. Fig.18A1 is a side view of wiring substrates 10 and 10A to 10F according to Embodiments 1 to 7. Fig.18B is along Fig.18A The cross-sectional view taken along line BB, Fig.18C 1 is a side view of a wiring board 10G according to an eighth embodiment of the present disclosure. Fig.18D is along Fig.18C A cross-sectional view taken along line DD. Fig.19A 1 is a side view of a wiring board 10H according to Embodiment 9 of the present disclosure. Fig.19B is along Fig.19A The cross-sectional view taken along line BB, Fig.19C 1 is a side view of a wiring board 10I according to Embodiment 10 of the present disclosure, Fig.19D is along Fig.19C A cross-sectional view taken along line DD.

[0135] In the above embodiments 1 to 7, if Fig.18A and Fig.18B , an example is shown in which the first signal line 13A, the waveguide 15, and the second signal line 13B have the same thickness, and the first signal line 13A, the waveguide 15, and the second signal line 13B are located on the same layer of the substrate 11. However, any one of the first signal line 13A, the waveguide 15, and the second signal line 13B may have different thicknesses, and the first signal line 13A and the waveguide 15 may be connected in a mutually offset configuration in the up-down direction. Similarly, the waveguide 15 and the second signal line 13B may be connected in a mutually offset configuration in the up-down direction.

[0136] Fig.18C and Fig.18D The wiring board 10G of the eighth embodiment is an example in which the first signal line 13A and the second signal line 13B straddle the first layer 117 and the second layer 118 of the base 11 , and the waveguide 15 is located in the second layer 118 of the base 11 .

[0137] Fig.19A and Fig.19B The wiring board 10H of the ninth embodiment is an example in which the first signal line 13A and the second signal line 13B are located in the second layer 118 of the base 11 , and the waveguide 15 spans the first layer 117 and the second layer 118 of the base 11 .

[0138] Fig.19C and Fig.19D The wiring substrate 10I of the embodiment 10 is an example in which the thickness of the base 11 is different in the partition of the first signal line 13A and the second signal line 13B and in the partition of the waveguide 15. The first signal line 13A and the second signal line 13B may be located on the second layer 118, and the waveguide 15 may be arranged across the first layer 117 and the second layer 118.

[0139] In the above-mentioned first to tenth embodiments, the waveguide 15 is sandwiched between the first signal line 13A and the second signal line 13B. However, the present invention is not limited to this structure, and the wiring board only needs to have at least one signal line and one waveguide connected to each other.

[0140] (Package for storing electronic components and electronic device)

[0141] Fig. 20 It is an exploded perspective view showing an electronic component storage package and an electronic device according to an embodiment of the present disclosure. Fig.21 It is a plan view showing an electronic component storage package and an electronic device according to an embodiment of the present disclosure.

[0142] The electronic component storage package 300 of the present embodiment includes the wiring substrate 10 of the first embodiment. The wiring substrates 10A to 10I of other embodiments may be applied instead of the wiring substrate 10. The electronic component storage package 300 may include a recess 310 for storing the electronic component 410 and a cover 320 for closing the opening of the recess 310. The wiring substrate 10 may be located in a through hole 312 located in a part of the side wall of the recess 310. The through hole 312 leads from the inside of the recess 310 to the outside. One end of the signal transmission path of the wiring substrate 10 may be located in the recess 310, and the other end may be located outside the recess 310. The side wall of the recess 310 is a conductor, and may be in contact with the film conductor 151 of the wiring substrate 10 and grounded. The wiring substrate 10 may bond the film conductors 131, 151, 152, 121, 122 to the inner surface of the through hole 312 via a bonding material, thereby closing the through hole 312. With this structure, high airtightness of the through hole 312 can be ensured.

[0143] The electronic component storage package 300 may include a plurality of wiring substrates 10. The electronic component storage package 300 may include a substrate 330 for transmitting power supply voltage or other signals between the outside and the inside of the recess 310.

[0144] The electronic device 400 of this embodiment includes an electronic component storage package 300 and an electronic component 410 stored in the electronic component storage package 300. The electronic component 410 may be a structure for inputting or outputting a high-frequency signal or both. The high-frequency signal terminal of the electronic component 410 may be connected to the strip conductor 132 of the second signal line 13B of the wiring substrate 10 via a connecting conductor.

[0145] In addition, the electronic component storage package of the present disclosure is not limited to the above-mentioned examples. For example, the wiring substrate may be arranged in a recessed portion storing the electronic component, and a high-frequency signal may be transmitted in the recessed portion.

[0146] An embodiment of the present disclosure is shown below. In one embodiment,

[0147] (1) A wiring board has:

[0148] matrix;

[0149] A signal circuit is located on the substrate; and

[0150] a waveguide of waveguide type, located on the substrate;

[0151] The signal line has one end in the direction of signal transmission, namely, a first end.

[0152] The waveguide has: a second end portion, which is one end in the direction in which a signal is transmitted; a central portion in the direction in which a signal is transmitted; and an intermediate portion closer to the central portion than the second end portion.

[0153] The first end and the second end are connected,

[0154] The width Wa of the waveguide at the second end portion is greater than the width Wb of the waveguide at the middle portion.

[0155] (2) In the wiring substrate of (1) above, a ratio Wa / Wb of a width Wa of the waveguide at the second end portion to a width Wb of the waveguide at the middle portion is 1<Wa / Wb≤1.4.

[0156] (3) In the wiring substrate of (1) or (2) above, the width of the waveguide is wider in a first section extending from the second end in the direction in which the signal is transmitted than in the middle section,

[0157] The length of the first interval is less than 1 / 3 of the effective wavelength of the transmission signal.

[0158] (4) In the wiring substrate according to any one of (1) to (2) above, the waveguide has a gradually widening portion so that the width of the waveguide gradually increases toward the second end portion.

[0159] (5) In the wiring substrate of (4) above, the gradually widening portion includes a stepped portion where the width of the waveguide widens in a stepwise manner.

[0160] (6) In the wiring substrate of (4) above, the gradually widening portion includes an inclined portion where the width of the waveguide continuously widens.

[0161] (7) The wiring board according to any one of (1) to (6) above,

[0162] The substrate includes a plurality of through-hole conductors located at the edge of the waveguide.

[0163] The pitch of the plurality of through-hole conductors is less than 1 / 4 of an effective wavelength of a transmission signal.

[0164] (8) The wiring board according to any one of (1) to (7) above,

[0165] The width of the signal line gradually increases toward the first end.

[0166] (9) In one embodiment, an electronic component housing package includes the wiring board according to any one of (1) to (8) above.

[0167] (10) In one embodiment, the electronic device comprises:

[0168] The electronic component storage package of (9) above; and

[0169] An electronic component is housed in the electronic component housing package.

[0170] Industrial Applicability

[0171] The present disclosure can be used for a wiring board, an electronic component housing package, and an electronic device.

[0172] Description of Reference Numerals

[0173] 10, 10A, 10Ba~10Bc, 10Ca, 10Cb, 10D~10I: Wiring board

[0174] 11: Matrix

[0175] 111: First main surface

[0176] 112: Second main surface

[0177] 13: Signal line

[0178] 13A: First signal line

[0179] 13Aa: rear end portion (first end portion)

[0180] 13B: Second signal line

[0181] 13Ba: Front end (first end)

[0182] 131: Film conductor

[0183] 132: Strip conductor

[0184] 15: Waveguide

[0185] 15a: Front end (second end)

[0186] 15b, 15e: middle part

[0187] 15c: Central

[0188] 15d: rear end portion (second end portion)

[0189] 151, 152: Film conductor

[0190] 153, 154: Wall conductor

[0191] 156, 157: Gradually widening part

[0192] 156A: Stepped part

[0193] 156B: Inclined part

[0194] 221, 222: wide range

[0195] 300: Package for storing electronic components

[0196] 310: concave part

[0197] 312: Through hole

[0198] 400: Electronic devices

[0199] 410: Electronic components

[0200] La: length of wide range

[0201] W: Width of the waveguide

[0202] Wa: Width of the front end

[0203] Wb: Width of the middle part

[0204] Wd: Width of the rear end

[0205] Wa / Wb: Ratio

[0206] Wd / Wb: Ratio

Claims

1. A wiring substrate, wherein: have: matrix; A signal circuit is located on the substrate; and a waveguide of waveguide type, located on the substrate; The signal line has one end in the direction of signal transmission, namely, a first end. The waveguide has: a second end portion, which is one end in the direction in which a signal is transmitted; a central portion in the direction in which a signal is transmitted; and an intermediate portion closer to the central portion than the second end portion. The first end and the second end are connected, The width Wa of the waveguide at the second end portion is greater than the width Wb of the waveguide at the middle portion.

2. The wiring substrate according to claim 1, wherein The ratio Wa / Wb of the width Wa to the width Wb is 1 <Wa / Wb≤1.4。 3. The wiring substrate according to claim 1, wherein The width of the waveguide is wider than that of the middle portion in a first section extending from the second end portion in a direction in which a signal is transmitted, The length of the first interval is less than 1 / 3 of the effective wavelength of the transmission signal.

4. The wiring substrate according to claim 1, wherein The waveguide has a gradually widening portion in which a width of the waveguide gradually widens toward the second end portion.

5. The wiring substrate according to claim 4, wherein The gradually widening portion includes a step-shaped portion where the width of the waveguide widens in a stepwise manner.

6. The wiring substrate according to claim 4, wherein The gradually widening portion includes an inclined portion where the width of the waveguide continuously widens.

7. The wiring substrate according to claim 1, wherein The substrate includes a plurality of through-hole conductors located at the edge of the waveguide. The pitch of the plurality of through-hole conductors is less than 1 / 4 of an effective wavelength of a transmission signal.

8. The wiring substrate according to claim 1, wherein The width of the signal line gradually increases toward the first end.

9. A package for storing electronic components, wherein: A wiring board according to claim 1 is provided.

10. An electronic device, wherein: have: The electronic component storage package according to claim 9; and An electronic component is housed in the electronic component housing package.

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