Alignment forming method of assembled optical film

Abstract

The invention discloses an alignment forming method of an assembled optical film, which comprises the following steps of: forming a plurality of two-dimensional alignment marks positioned at a plurality of corners of an alignment block of a base material and two rotary alignment marks positioned at two of the corners respectively on the alignment block of the base material, and forming an imprinting layer positioned at the inner side of the alignment block on the base material, manufacturing an impressing photomask; forming a plurality of adhesive layers arranged at intervals on a carrier; aligning the plurality of two-dimensional alignment marks and the two rotary alignment marks of the imprinting photomask to a plurality of carrier alignment marks of the carrier around each adhesive layer, and rotating the imprinting photomask to eliminate deviation when the two rotary alignment marks and the corresponding carrier alignment marks form deviation; and the imprinting layer is imprinted on the corresponding adhesive layer. Therefore, the alignment forming method of the assembled optical film can effectively enable the plurality of adhesive layers to maintain high precision and low accumulated tolerance after the plurality of adhesive layers are impressed.

Description

Technical Field

[0001] The invention relates to an optical film forming method, in particular to an alignment forming method of a modular optical film. Background Art

[0002] Most existing optical film forming methods use rolling or plate-making methods, but the rolling method has its limitations, so it is difficult to make further substantial improvements or developments. Furthermore, the plate-making method used in the existing optical film forming method has a large error in the forming process, so it is difficult to meet the high-precision requirements that are increasing year by year. Therefore, the inventors believe that the above defects can be improved, so they have devoted themselves to research and combined with the application of scientific principles, and finally proposed a reasonable design and effective improvement of the above defects. Summary of the invention

[0003] The embodiment of the present invention provides a method for aligning and forming a modular optical film, which can effectively improve the defects that may be produced by the existing optical film forming method.

[0004] The embodiment of the present invention discloses a method for aligning and forming a modular optical film, which comprises: a pre-step: manufacturing an imprinting mask, including: providing a substrate, which has a penetration block, an alignment block in a ring shape and surrounding the penetration block, and a non-penetrating block in a ring shape and surrounding the alignment block; wherein the alignment block has a plurality of corners of which the number is not less than four; the substrate only provides a curing light to pass through the penetration block, and the alignment block can allow the alignment light to pass through, and the wavelength of the curing light is different from the wavelength of the alignment light; a plurality of two-dimensional alignment marks respectively located at the plurality of corners and two rotational alignment marks respectively located at two of the corners are formed in the alignment block; wherein the two rotational alignment marks are respectively adjacent to the two two-dimensional alignment marks; an imprinting layer is formed in the penetration block, which can allow the curing light to pass through. The light passes through and has a unit pattern on the surface away from the substrate; a placement step: forming a plurality of glue layers arranged at intervals on a carrier; wherein the carrier forms a plurality of carrier alignment marks corresponding to the plurality of two-dimensional alignment marks and two rotation alignment marks around each glue layer; an alignment step: aligning the plurality of carrier alignment marks around each glue layer with the plurality of two-dimensional alignment marks and the two rotation alignment marks of the imprint mask to achieve a multi-dimensional alignment operation on each glue layer; wherein, in each multi-dimensional alignment operation, when the two rotation alignment marks and the corresponding carrier alignment marks form an angular deviation, the imprint mask is rotated to eliminate the deviation; and a forming step: after the imprint mask completes each multi-dimensional alignment operation, the imprint layer immediately performs an imprint operation on the corresponding glue layer.

[0005] Preferably, in the forming step, when the imprinting mask performs any imprinting operation, a curing light is passed through the imprinting mask to irradiate and cure the glue layer imprinted by the imprinting layer.

[0006] Preferably, in the preceding step, the imprint layer is formed by irradiating a photoresist layer coated on the transmission area with an exposure ultraviolet ray through a mask or interference, and the wavelength of the exposure ultraviolet ray falls outside the wavelength band of the curing light.

[0007] Preferably, the alignment forming method of the group-type optical film further includes a preparation step between the pre-step and the placement step: providing a multi-dimensional alignment group-type device, which includes an imprinting mask and a carrier; wherein the multi-dimensional alignment group-type device further includes: a workbench; wherein the carrier is arranged on the workbench; a rotating mechanism connected to the imprinting mask; and a displacement mechanism, which is arranged on the workbench, and the displacement mechanism can move relative to the workbench along a height direction, a first direction, and a second direction that are orthogonal to each other; wherein the imprinting mask and the rotating mechanism can be moved synchronously through the displacement mechanism; wherein, in the alignment step, when two rotation alignment marks and corresponding carrier alignment marks form an angular deviation, the rotating mechanism can rotate the imprinting mask by a unit angle to eliminate the deviation, and the unit angle is less than or equal to 0.01 degrees.

[0008] Preferably, in the preparation step, the multi-dimensional alignment typesetting equipment further includes: a camera mechanism, which is arranged corresponding to the imprint mask, and the camera mechanism can be moved by the displacement mechanism but is not driven to rotate by the rotation mechanism; wherein, in the alignment step, the camera mechanism emits an alignment light toward the alignment block, and in each multi-dimensional alignment operation, confirms whether the multiple two-dimensional alignment marks and the two rotation alignment marks are respectively aligned with the multiple carrier alignment marks.

[0009] Preferably, in the preparation step, the multi-dimensional alignment and typesetting equipment further comprises: a coating mechanism, arranged corresponding to the workbench; and a curing light source, connected to the displacement mechanism and arranged corresponding to the imprint mask; wherein, in the placement step, the coating mechanism sequentially forms a plurality of adhesive layers which are spaced apart from each other and have uniform thickness on the carrier; wherein, in the forming step, when the imprint mask performs any imprinting operation, the curing light source emits curing light to pass through the imprint mask to irradiate and cure the adhesive layer imprinted by the imprint layer.

[0010] Preferably, the two rotation alignment marks are formed at two diagonally opposite corners, and each rotation alignment mark is disposed at intervals outside an adjacent two-dimensional alignment mark.

[0011] Preferably, the imprint mask defines a horizontal direction and a vertical direction perpendicular to the horizontal direction; in each rotational alignment mark and its adjacent two-dimensional alignment mark, the length of the rotational alignment mark in the horizontal direction is at least three times the length of the two-dimensional alignment mark in the horizontal direction, and the length of the rotational alignment mark in the vertical direction is at least three times the length of the two-dimensional alignment mark in the vertical direction.

[0012] Preferably, in each rotation alignment mark and its adjacent two-dimensional alignment mark, the two-dimensional alignment mark is in a cross shape, while the rotation alignment mark is in a right angle shape, and the two-dimensional alignment mark is located within a range area surrounded by the rotation alignment mark.

[0013] Preferably, the two rotational alignment marks are arranged along the outer edge of the alignment block, and the total length of each rotational alignment mark is 10% to 25% of the circumference of the outer edge of the alignment block.

[0014] In summary, the alignment forming method of the assembly type optical film disclosed in the embodiment of the present invention forms the imprinting mask with two rotational alignment marks in the previous step, so as to effectively detect and eliminate the angle deviation in the alignment step, thereby maintaining high-precision imprinting of each of the adhesive layers, thereby effectively maintaining high precision and low cumulative tolerance of the multiple adhesive layers after imprinting.

[0015] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The figure is a schematic flow chart of a method for aligning and forming a group-type optical film according to an embodiment of the present invention.

[0017] Figure 2 for Figure 1 Schematic diagram of the pre-processing steps in .

[0018] Figure 3 for Figure 1 Schematic diagram of the preparation and placement steps in .

[0019] Figure 4 for Figure 1 Schematic diagram of the alignment steps in .

[0020] Figure 5 for Figure 4 Schematic diagram showing deviations formed during the alignment step.

[0021] Figure 6 To eliminate Figure 5 Schematic diagram of the deviation in .

[0022] Figure 7 for Figure 1 Schematic diagram of the forming steps in .

[0023] Figure 8It is a schematic diagram of sequentially performing embossing operations in the alignment forming method of the group-type optical film according to an embodiment of the present invention.

[0024] Fig. 9 The diagram is a schematic diagram showing a structured optical film formed after the alignment and forming method of the structured optical film according to the embodiment of the present invention is implemented. DETAILED DESCRIPTION

[0025] The following is an explanation of the implementation method of the "alignment forming method of the assembly type optical film" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0026] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0027] See also Figures 1 to 9 As shown, it is an embodiment of the present invention. Figure 1 As shown, this embodiment discloses a method S100 for aligning and forming a typesetting optical film and a multi-dimensional alignment typesetting device 100, and the method S100 for aligning and forming a typesetting optical film is preferably implemented by the multi-dimensional alignment typesetting device 100, but is not limited thereto. The method S100 for aligning and forming a typesetting optical film in this embodiment includes (or is implemented in sequence) a pre-step S110, a preparation step S120, a placement step S130, an alignment step S140, and a forming step S150.

[0028] In order to facilitate understanding of the present embodiment, the following will first describe the respective contents of the pre-step S110, the preparation step S120, the placement step S130, the alignment step S140, and the forming step S150, and introduce the structure of the multi-dimensional alignment typesetting device 100 when appropriate, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, any step included in the alignment forming method S100 for the typesetting optical film, and the structure of each component of the multi-dimensional alignment typesetting device 100 can be adjusted, changed or omitted according to design requirements.

[0029] The preceding step S110: Figure 1 and Figure 2 As shown, an imprint mask 1 is manufactured. The manufacturing process of the imprint mask 1 generally includes: providing a substrate 11, forming a plurality of two-dimensional alignment marks 12 and two rotation alignment marks 13 on the substrate 11, and forming an imprint layer 14 located inside the plurality of two-dimensional alignment marks 12 and inside the two rotation alignment marks 13 on the substrate 11.

[0030] In more detail, the substrate 11 is described as a flat plate structure in this embodiment, and the substrate 11 has a penetration block 111, an alignment block 112 in a ring shape and surrounding the penetration block 111, and a non-penetration block 113 in a ring shape and surrounding the alignment block 112. The alignment block 112 has a plurality of corners 1121 of not less than four, and the number of the plurality of corners 1121 is described as four in this embodiment, but is not limited thereto.

[0031] Furthermore, the substrate 11 only provides a curing light L (eg, Figure 7 That is, the curing light L cannot pass through the alignment block 112 and the non-penetrating block 113. The alignment block 112 is in a square ring shape in this embodiment and can provide a alignment light IR (such as: Figure 4 The infrared light shown in the figure passes through, the alignment light IR is preferably unable to pass through the non-penetrating block 113, and the wavelength of the curing light L is different from the wavelength of the alignment light IR.

[0032] The plurality of two-dimensional alignment marks 12 are respectively located at the plurality of corners 1121 of the alignment block 112, the two rotational alignment marks 13 are respectively located at two of the corners 1121, and the two rotational alignment marks 13 are respectively adjacent to two of the two-dimensional alignment marks 12. It should be additionally noted that the imprint mask 1 can further achieve a better alignment effect by having at least some of the following features, but is not limited thereto.

[0033] In this embodiment, the plurality of two-dimensional alignment marks 12 have the same shape and are each in a cross shape, and each of the rotational alignment marks 13 is in a right angle shape. The two rotational alignment marks 13 are formed at the two corners 1121 located at diagonally opposite corners, and each of the rotational alignment marks 13 is disposed at intervals outside the adjacent two-dimensional alignment mark 12 (e.g., the two-dimensional alignment mark 12 is located within the range area surrounded by the rotational alignment mark 13).

[0034] Furthermore, the two rotation alignment marks 13 are arranged along the outer edge of the alignment block 112, and the total length of each rotation alignment mark 13 is 10% to 25% of the circumference of the outer edge of the alignment block 112. Further, the imprint mask 1 is defined with a lateral direction D1 and a longitudinal direction D2 perpendicular to the lateral direction D1. In each of the rotation alignment marks 13 and the adjacent two-dimensional alignment mark 12, the length of the rotation alignment mark 13 in the lateral direction D1 is at least three times the length of the two-dimensional alignment mark 12 in the lateral direction D1, and the length of the rotation alignment mark 13 in the longitudinal direction D2 is at least three times the length of the two-dimensional alignment mark 12 in the longitudinal direction D2.

[0035] In addition, the embossing layer 14 is formed in the penetration block 111, and the embossing layer 14 allows the curing light L to pass through and has a unit pattern 141 on the surface away from the substrate 11. In this embodiment, the embossing layer 14 is formed by irradiating a photoresist layer coated on the penetration block 111 with an exposure ultraviolet light UV through a mask M or interference, and the wavelength of the exposure ultraviolet light UV falls outside the wavelength band of the curing light L. For example, the wavelength of the exposure ultraviolet light UV can be 190 nanometers (nm) to 250 nanometers, which is preferably at least 100 nanometers different from the wavelength band of the curing light L (e.g., the wavelength band is 350 nanometers to 410 nanometers). Accordingly, the embossing layer 14 can form the unit pattern 141 with high precision.

[0036] The preparation step S120: Figures 1 to 3As shown, the multi-dimensional alignment typesetting device 100 equipped with the imprint mask 1 is provided. Among them, the multi-dimensional alignment typesetting device 100 in this embodiment further includes a workbench 2, a carrier 3 arranged on the workbench 2, a displacement mechanism 4 arranged on the workbench 2 and corresponding to the carrier 3, a rotation mechanism 5 connected to the imprint mask 1, a camera mechanism 6 arranged corresponding to the imprint mask 1, a coating mechanism 7 arranged corresponding to the workbench 2, and a curing light source 8 arranged corresponding to the imprint mask 1, but the present invention is not limited thereto. That is to say, in other embodiments not shown in the present invention, the components included in the multi-dimensional alignment typesetting device 100 can be adjusted and changed according to design requirements.

[0037] In this embodiment, the carrier 3 is a flat plate-shaped structure and is formed with a plurality of embossing areas 31, and the plurality of embossing areas 31 are arranged adjacent to each other in a matrix. The carrier 3 is formed with a plurality of carrier alignment marks 32 in each of the embossing areas 31, and the shapes and positions thereof correspond to the plurality of the two-dimensional alignment marks 12 and the two rotation alignment marks 13, respectively, so as to facilitate the implementation of the subsequent alignment step S140 (e.g.: Figure 4 ).

[0038] The displacement mechanism 4 can move relative to the workbench 2 (or the carrier 3) along a height direction H, a first direction D1, and a second direction D2 that are orthogonal to each other. The first direction D1 and the second direction D2 refer to the horizontal direction D1 and the vertical direction D2 in this embodiment, but are not limited thereto.

[0039] Furthermore, the imprint mask 1, the rotating mechanism 5, the camera mechanism 6, the coating mechanism 7, and the curing light source 8 may be directly or indirectly connected to the displacement mechanism 4, so as to be able to move synchronously through the displacement mechanism 4, and the imprint mask 1 may also be able to move relative to the camera mechanism 6 and the curing light source 8 along the height direction H, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the coating mechanism 7 and / or the curing light source 8 may also be operated by configuring an independent moving mechanism but not connected to the displacement mechanism 4.

[0040] The rotating mechanism 5 can rotate the imprint mask 1 at a unit angle; that is, the imprint mask 1 can be driven by the rotating mechanism 5 to rotate a multiple of the unit angle, and the unit angle is less than or equal to 0.01 degrees. Furthermore, the imaging mechanism 6 is used to emit the alignment light IR (e.g., Figure 4 ), and the imaging mechanism 6 is not driven to rotate by the rotating mechanism 5.

[0041] The coating mechanism 7 is used to sequentially form a plurality of adhesive layers 200a spaced apart from each other on the plurality of embossing areas 31 of the carrier 3. Furthermore, the curing light source 8 can emit the curing light L (e.g., Figure 7 ) to pass through the penetration block 111 and the embossing layer 14.

[0042] The step S130 of placing components: Figures 1 to 4 As shown, a plurality of adhesive layers 200a are formed on the carrier 3 at intervals. In this embodiment, the placement step S130 is achieved by the coating mechanism 7 sequentially forming a plurality of adhesive layers 200a that are spaced apart and have uniform thickness on the carrier 3; that is, one adhesive layer 200a is formed on each of the stamping areas 31 of the carrier 3, so that a plurality of carrier alignment marks 32 corresponding to the plurality of two-dimensional alignment marks 12 and the two rotation alignment marks 13 are arranged around the adhesive layer 200a.

[0043] The alignment step S140: Figure 1 ,and Figures 4 to 6 As shown, the plurality of two-dimensional alignment marks 12 and the two rotation alignment marks 13 of the imprint mask 1 are aligned with the plurality of carrier alignment marks 32 around each adhesive layer 200a, so as to implement a multi-dimensional alignment operation on each adhesive layer 200a. In each multi-dimensional alignment operation, when the two rotation alignment marks 13 and the corresponding carrier alignment marks 32 form an angular deviation, the imprint mask 1 is rotated to eliminate the deviation.

[0044] In this embodiment, the alignment step S140 is to emit the alignment light IR toward the alignment block 112 by the imaging mechanism 6, and to confirm whether the plurality of two-dimensional alignment marks 12 and the two rotation alignment marks 13 are respectively aligned with the plurality of carrier alignment marks 32 in each multi-dimensional alignment operation. In other words, when the two rotation alignment marks 13 and the corresponding carrier alignment marks 32 form an angular deviation, the alignment step S140 can rotate the imprint mask 1 by the unit angle less than or equal to 0.01 degrees through the rotating mechanism 5 to eliminate the deviation.

[0045] The forming step S150: Figure 1 and Figure 7As shown, after the embossing mask 1 completes each multi-dimensional alignment operation, the embossing layer 14 immediately performs an embossing operation on the corresponding glue layer 200a. When the embossing mask 1 performs any of the embossing operations, the curing light L passes through the embossing mask 1 to irradiate and cure the glue layer 200a embossed by the embossing layer 14 to form a unit film layer 200b. Accordingly, the forming step S150 is preferably performed by curing the glue layer 200a while being embossed, so as to effectively ensure the shape accuracy of the unit film layer 200b.

[0046] Furthermore, if Figure 8 and Fig. 9 After the plurality of adhesive layers 200a are sequentially embossed and cured to form the plurality of unit film layers 200b, the plurality of unit film layers 200b together form a set of format optical films 200. In this embodiment, the forming step S150 sequentially implements the plurality of embossing operations by collocation of the displacement mechanism 4 and the embossing mask 1, and when the embossing mask 1 performs any embossing operation, the curing light source 8 emits the curing light L to pass through the embossing mask 1 to irradiate and cure the adhesive layer 200a embossed by the embossing layer 14.

[0047] [Technical Effects of Embodiments of the Invention]

[0048] In summary, the alignment forming method of the assembly type optical film disclosed in the embodiment of the present invention forms the imprinting mask with two rotational alignment marks in the previous step, so as to effectively detect and eliminate the angle deviation in the alignment step, thereby maintaining high-precision imprinting of each of the adhesive layers, thereby effectively maintaining high precision and low cumulative tolerance of the multiple adhesive layers after imprinting.

[0049] Furthermore, the multi-dimensional alignment and plate-making equipment disclosed in the embodiment of the present invention has the imprint mask which can be matched with the rotating mechanism with a unit angle less than 0.01 degree by the two rotation alignment marks, thereby effectively reducing the cumulative tolerance generated by multiple imprinting processes, thereby meeting the accuracy requirements that are increasing year by year.

[0050] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the patent scope of the present invention.

Claims

1. A method for forming a layout-type optical film, characterized in that: The alignment forming method of the group-type optical film comprises: A pre-step: manufacturing an imprint mask, comprising: A substrate is provided, which has a penetration block, an alignment block in a ring shape and surrounding the penetration block, and a non-penetration block in a ring shape and surrounding the alignment block; wherein the alignment block has a plurality of corners of which the number is not less than four; the substrate provides a curing light to pass only through the penetration block, and the alignment block can allow the alignment light to pass through, and the wavelength of the curing light is different from the wavelength of the alignment light; A plurality of two-dimensional alignment marks respectively located at the plurality of corners and two rotational alignment marks respectively located at two of the corners are formed in the alignment block; Wherein, two of the rotational alignment marks are respectively adjacent to two of the two-dimensional alignment marks; An imprint layer is formed in the penetration block, which allows the curing light to pass through and has a unit pattern on the surface away from the substrate; A placement step: forming a plurality of adhesive layers arranged at intervals on a carrier; wherein the carrier is provided with a plurality of carrier alignment marks respectively corresponding to the plurality of two-dimensional alignment marks and the two rotation alignment marks around each of the adhesive layers; An alignment step: aligning the plurality of two-dimensional alignment marks of the embossing mask and the two rotational alignment marks with the plurality of carrier alignment marks around each of the adhesive layers to achieve a multi-dimensional alignment operation on each of the adhesive layers; wherein, in each of the multi-dimensional alignment operations, when the two rotational alignment marks and the corresponding carrier alignment marks form an angular deviation, the embossing mask is rotated to eliminate the deviation; and A forming step: after the embossing mask completes each multi-dimensional alignment operation, the embossing layer immediately performs an embossing operation on the corresponding adhesive layer.

2. The alignment forming method of the assembled optical film according to claim 1, characterized in that: In the forming step, when the imprint mask performs any imprinting operation, the curing light passes through the imprint mask to irradiate and cure the glue layer imprinted by the imprint layer.

3. The alignment forming method of the assembled optical film according to claim 1, characterized in that: In the preceding step, the imprint layer is formed by irradiating a photoresist layer coated on the penetration block with an exposure ultraviolet ray through a mask or interference, and the wavelength of the exposure ultraviolet ray falls outside the wavelength band of the curing light.

4. The alignment forming method of the assembled optical film according to claim 1, characterized in that: The alignment forming method of the panel-type optical film further comprises a preparation step between the pre-step and the placement step: providing a multi-dimensional alignment panel-forming device, which comprises the embossing mask and the carrier; wherein the multi-dimensional alignment panel-forming device further comprises: a workbench; wherein the carrier is arranged on the workbench; a rotating mechanism connected to the imprint mask; and a displacement mechanism, disposed on the workbench, and capable of moving relative to the workbench in a height direction, a first direction, and a second direction that are orthogonal to each other; wherein the imprint mask and the rotating mechanism can be synchronously moved by the displacement mechanism; Wherein, in the alignment step, when two of the rotation alignment marks and the corresponding carrier alignment marks form an angular deviation, the rotation mechanism can rotate the imprint mask by a unit angle to eliminate the deviation, and the unit angle is less than or equal to 0.01 degrees.

5. The alignment forming method of the assembled optical film according to claim 4, characterized in that: In the preparation step, the multi-dimensional alignment and typesetting device further comprises: a camera mechanism, arranged corresponding to the imprint mask, and the camera mechanism can be moved by the displacement mechanism but is not driven to rotate by the rotation mechanism; Among them, in the alignment step, the camera mechanism emits the alignment light toward the alignment block, and in each multi-dimensional alignment operation, confirms whether the multiple two-dimensional alignment marks and the two rotation alignment marks are respectively aligned with the multiple carrier alignment marks.

6. The alignment forming method of the assembled optical film according to claim 4, characterized in that: In the preparation step, the multi-dimensional alignment and typesetting device further comprises: a coating mechanism, arranged corresponding to the workbench; and a curing light source connected to the displacement mechanism and arranged corresponding to the imprint mask; Wherein, in the step of placing the components, the coating mechanism sequentially forms a plurality of adhesive layers which are spaced apart from each other and have uniform thickness on the carrier; Wherein, in the forming step, when the embossing mask performs any embossing operation, the curing light source emits the curing light to pass through the embossing mask to irradiate and cure the glue layer embossed by the embossing layer.

7. The alignment forming method of the assembled optical film according to claim 1, characterized in that: The two rotation alignment marks are formed at two corners located at diagonally opposite angles, and each of the rotation alignment marks is arranged at intervals on the outer sides of the adjacent two-dimensional alignment marks.

8. The alignment forming method of the assembled optical film according to claim 1, characterized in that: The imprint mask is defined with a horizontal direction and a vertical direction perpendicular to the horizontal direction; among each of the rotational alignment marks and the adjacent two-dimensional alignment marks, the length of the rotational alignment mark in the horizontal direction is at least three times the length of the two-dimensional alignment mark in the horizontal direction, and the length of the rotational alignment mark in the vertical direction is at least three times the length of the two-dimensional alignment mark in the vertical direction.

9. The alignment forming method of the assembled optical film according to claim 1, characterized in that: In each of the rotation alignment marks and the adjacent two-dimensional alignment marks, the two-dimensional alignment mark is in a cross shape, while the rotation alignment mark is in a right angle shape, and the two-dimensional alignment mark is located within a range area surrounded by the rotation alignment mark.

10. The alignment forming method of the assembled optical film according to claim 1, characterized in that: The two rotation alignment marks are arranged along the outer edge of the alignment block, and the total length of each rotation alignment mark is 10% to 25% of the circumference of the outer edge of the alignment block.

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