Pressure head constant-temperature water cooling mechanism in AR laminating vacuum cavity

Abstract

The invention discloses a pressure head constant-temperature water cooling mechanism in an AR laminating vacuum cavity. The pressure head constant-temperature water cooling mechanism comprises a pressure head assembly and a water cooling assembly. The pressure head assembly comprises a pressure head, a heating plate, a water cooling plate and a temperature sensor, the temperature of the pressure head is dynamically adjusted through heating of the heating plate and circulating cooling of the water cooling plate, and constant-temperature control is achieved in combination with temperature feedback; the water cooling assembly is composed of a water tank, a water pump, a heat dissipation radiator and a pipeline, heat of the pressure head is taken away through circulation of cooling liquid, and the cooling efficiency is ensured through a filter and a flow meter. The device solves the problems of uneven product softening and poor laminating quality caused by temperature fluctuation in AR vacuum laminating, has the characteristics of high constant-temperature precision, fast response and compact structure, and is suitable for a precise laminating process of a liquid crystal display panel and an AR / VR / MR device.

Description

Technical Field

[0001] The present invention relates to the technical field of bonding equipment, and in particular to a constant temperature water cooling mechanism for a pressure head in an AR bonding vacuum chamber. Background Art

[0002] During the vacuum bonding process of AR screens, the temperature of the pressure head directly affects the fluidity and curing uniformity of the OCA optical adhesive. In the prior art, the pressure head mostly adopts a single heating or natural heat dissipation method, which has the following defects:

[0003] (1) The traditional heating head heats up slowly and cannot cool down quickly after overheating, resulting in bubbles or warping of the adhesive layer;

[0004] (2) It is difficult to dissipate heat in a vacuum environment. It is difficult to maintain a constant temperature by air cooling alone. The temperature fluctuation range can reach ±5°C, which affects the bonding yield.

[0005] (3) Cooling relies on an external cooling system, which has redundant structure and high energy consumption. Summary of the invention

[0006] In order to solve the above defects, the present invention provides a constant temperature water cooling mechanism for the pressure head in the AR bonding vacuum chamber, which can accurately control the temperature of the pressure head so that the product can achieve a better bonding effect during the heating process.

[0007] The present invention provides a constant temperature water cooling mechanism for a pressure head in an AR laminating vacuum chamber, comprising: a pressure head assembly (1), comprising a pressure head (16), a heating plate (15), a water cooling plate (14) and a temperature sensor, wherein the water cooling plate (14) is arranged on the top of the pressure head (16) and connected to the water cooling assembly (2) through a circulation pipeline, the heating plate (15) is tightly fitted between the water cooling plate (14) and the pressure head (16), and the temperature sensor is embedded in the surface of the pressure head (16) for real-time feedback of a temperature signal; and a water cooling assembly (2), comprising a water tank (201), a water pump (205), a heat dissipation radiator (204) and a filter (207) which are sequentially connected by pipelines, wherein the coolant is driven by the water pump (205), flows sequentially through the water tank (201), the heat dissipation radiator (204) and the filter (207), and then enters the water cooling plate (14), and returns to the water tank through a reflux pipeline to form a closed-loop circulation.

[0008] In one embodiment of the present invention, a serpentine or spiral flow channel is provided inside the water cooling plate (14), the flow channel inlet is connected to the pipeline of the water cooling component (2) through the coolant outlet (209), and the outlet returns to the water tank (201) through the hot water return port (208).

[0009] In one embodiment of the present invention, the heating plate (15) is a resistive heating film, and the heating plate (15) is electrically connected to a temperature control system, and the heating power is adjusted according to a temperature signal from a temperature sensor.

[0010] In one embodiment of the present invention, the heat sink (204) adopts an aluminum fin structure and is equipped with a forced air cooling or liquid cooling module. After the coolant flows through the heat sink (204), the temperature is reduced by 5-15°C.

[0011] In one embodiment of the present invention, the top of the water-cooling plate (14) is connected to the guide mounting plate (11) via columns (12, 13), and the guide mounting plate (11) can be connected to a liftable mechanism fixed in the vacuum chamber.

[0012] In one embodiment of the present invention, the surface of the pressure head (16) is plated with a high thermal conductivity metal layer.

[0013] In one embodiment of the present invention, during the pressing process, the contact surface between the pressing head (16) and the workpiece is kept at a constant temperature of 25-80°C.

[0014] In one embodiment of the present invention, a flow meter is provided on the pipeline between the water pump (205) and the heat sink (204).

[0015] In summary, the present invention provides a constant temperature water cooling mechanism for a pressure head in an AR laminating vacuum chamber, and its beneficial effects are:

[0016] The pressure head assembly has a heating function and is equipped with a water cooling assembly to achieve rapid cooling of the pressure head. The temperature sensor provides real-time feedback of temperature information and accurately controls the switch status of the heating plate and the water cooling assembly to maintain a constant temperature environment. This design enables the product to achieve a better fitting effect during the heating process.

[0017] Furthermore, the pressure head assembly cleverly embeds a heating film between the water-cooling plate and the pressure head, forming a closed-loop temperature control system of "heating-water cooling-feedback" with a temperature control accuracy of up to ±0.5℃.

[0018] In addition, the water cooling component adopts a micro water pump and a compact heat sink design, which uses a circulation system outside the vacuum chamber to quickly conduct heat away, allowing the pressure head to achieve a rapid cooling of 20°C within 30 seconds.

[0019] In terms of structural design, the flow channel of the water cooling plate perfectly matches the shape of the pressure head, maximizing the heat conduction efficiency. At the same time, the overall thickness is controlled within 15mm, making it adaptable to the narrow vacuum cavity environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Shown is a three-dimensional structural schematic diagram of the constant temperature water cooling mechanism of the pressure head in the AR bonding vacuum chamber.

[0021] Figure 2 Display as Figure 1 Schematic diagram of the three-dimensional structure of the medium pressure head assembly.

[0022] Figure 3 Display as Figure 2 Schematic diagram of the three-dimensional structure of the water cooling plate.

[0023] Figure 4 Shown is a schematic diagram of the water cooling component piping connections.

[0024] In the figure, 1, pressure head assembly; 11, guide mounting plate; 12, first column; 13, second column; 14, water cooling plate; 15, heating plate; 16, pressure head; 2, water cooling assembly; 201, water tank; 202, pipeline; 203, liquid sensor; 204, heat sink; 205, water pump; 206, flow meter; 207, filter; 208, hot water return port; 209, coolant outlet; 210, compressed air inlet; 211, liquid recovery barrel. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] like Figure 1 As shown, the embodiment provides a constant temperature water cooling mechanism for a press head in an AR bonding vacuum chamber, which includes: a press head assembly 1 and a water cooling assembly 2.

[0027] Among them, the pressure head assembly 1 includes a pressure head 16, a heating plate 15, a water-cooling plate 14 and a temperature sensor. The water-cooling plate 14 is arranged on the top of the pressure head 16 and is connected to the water-cooling assembly 2 through a circulation pipeline. The heating plate 15 fits tightly between the water-cooling plate 14 and the pressure head 16. The temperature sensor is embedded in the surface of the pressure head 16 for real-time feedback of the temperature signal.

[0028] Furthermore, the top of the water-cooling plate 14 is connected to the guide mounting plate 11 through the second column 13 and the first column 12, and the guide mounting plate 11 can be connected to a liftable mechanism fixed in the vacuum chamber.

[0029] A serpentine or spiral flow channel is provided inside the water cooling plate 14 , the flow channel inlet is connected to the pipeline 202 of the water cooling component 2 through the coolant outlet 209 , and the outlet returns to the water tank 201 through the hot water return port 208 .

[0030] The heating plate 15 is a resistive heating film, and is electrically connected to a temperature control system to adjust the heating power according to a temperature signal from a temperature sensor.

[0031] Furthermore, the surface of the ram 16 is plated with a high thermal conductivity metal layer. For example, a high thermal conductivity material such as copper or aluminum is used. When the ram 16 needs to be heated, the heat can be quickly transferred from the heating plate 15 to the surface of the ram 16; when cooling is required, the cooling effect of the water cooling system can also be more quickly transferred to the part of the ram 16 that contacts the workpiece, maintaining a uniform temperature and avoiding local overheating or overcooling.

[0032] In other embodiments, the water cooling plate 14 and the pressure head 16 are integrated into one design, and the thickness is reduced by 40% compared with the traditional solution, so as to meet the requirements of high-precision fitting.

[0033] Next, the water cooling assembly 2 includes a water tank 201, a water pump 205, a heat sink 204 and a filter 207 which are sequentially connected by a pipeline 202. The coolant is driven by the water pump 205, flows sequentially through the water tank 201, the heat sink 204, the filter 207, and then enters the water cooling plate 14, and returns to the water tank 201 through the reflux pipeline to form a closed loop.

[0034] A liquid sensor 203 is provided at the bottom of the water tank 201. The liquid sensor 203 is used to monitor the water level of the coolant, ensure sufficient coolant supply, detect leakage in time, avoid overheating or damage of the equipment, and maintain the stability of system operation.

[0035] The heat sink 204 adopts an aluminum fin structure and is equipped with a forced air cooling or liquid cooling module. The temperature of the coolant is reduced by 5-15° C. after flowing through the heat sink 204. During the pressing process, the contact surface between the pressing head 16 and the workpiece is kept at a constant temperature of 25-80° C.

[0036] A flow meter 206 is provided on the pipeline between the water pump 205 and the heat sink 204. The flow meter 206 ensures sufficient coolant flow to avoid overheating, detects blockage or leakage, improves energy efficiency, or regulates flow as part of closed-loop control. If the flow is too low, the system will trigger an alarm or adjust the speed of the water pump 205.

[0037] Furthermore, the constant temperature water cooling mechanism of the pressure head in the AR fitting vacuum chamber also includes a compressed air pipeline and a liquid recovery barrel 211. The pipeline between the heat dissipation radiator 204 and the filter 207 is connected to the compressed air pipeline, and the compressed air pipeline is connected to the compressed air equipment through the compressed air inlet 210. The liquid recovery barrel 211 is connected to the bottom of the water tank 201 and the coolant outlet pipeline downstream of the filter 207 through two pipelines. The coolant in the water tank 201 flows directly into the liquid recovery barrel 211, and is blown into the pipeline through compressed air to discharge the remaining coolant in the pipeline into the liquid recovery barrel 211. The system needs to replace the coolant regularly or perform maintenance. At this time, it is necessary to empty the residual liquid in the pipeline. The use of compressed air may be to quickly and effectively discharge the coolant to the recovery barrel to avoid residue. When the system fails or requires emergency drainage, the drainage process is accelerated by compressed air. When cleaning the pipeline, use compressed air to blow away the residual liquid and impurities to ensure the cleanliness of the system.

[0038] Combination Figure 1-4 The pressure head assembly 1 is fixed to the vacuum chamber lifting mechanism through the guide mounting plate 11. The water cooling assembly 2 is placed outside the chamber. The coolant is driven by the water pump 205 and flows from the water tank 201 through the heat sink 204 and the filter 207 and then enters the spiral flow channel of the water cooling plate 14 (such as Figure 3 As shown), it absorbs heat and returns to the water tank 201. The heating plate 15 performs PID adjustment according to the pressure head surface temperature sensor signal to ensure a constant temperature of 60±0.5℃ during the pressing stage. In the fast cooling mode, the heating plate 15 is turned off and the flow rate of the water cooling component is increased to 2L / min. The pressure head 16 is reduced from 80℃ to 45℃ within 28 seconds to avoid overheating and carbonization of the optical glue.

[0039] In summary, the present invention integrates heating and water cooling in the vacuum bonding head to solve the hysteresis problem of a single temperature control method, and the bonding yield is increased to 99.2%.

[0040] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A constant temperature water cooling mechanism for a pressure head in an AR laminating vacuum chamber, characterized in that: It includes: A pressure head assembly (1), comprising a pressure head (16), a heating plate (15), a water cooling plate (14) and a temperature sensor, wherein the water cooling plate (14) is arranged on the top of the pressure head (16) and is connected to the water cooling assembly (2) via a circulation pipeline, the heating plate (15) is tightly fitted between the water cooling plate (14) and the pressure head (16), and the temperature sensor is embedded in the surface of the pressure head (16) for real-time feedback of temperature signals; The water cooling assembly (2) comprises a water tank (201), a water pump (205), a heat sink (204) and a filter (207) which are connected in sequence by pipelines. The coolant is driven by the water pump (205), flows through the water tank (201), the heat sink (204) and the filter (207) in sequence, enters the water cooling plate (14), and returns to the water tank through a return pipeline to form a closed loop.

2. The constant temperature water cooling mechanism for the pressure head in the AR bonding vacuum chamber according to claim 1, characterized in that: A serpentine or spiral flow channel is provided inside the water cooling plate (14); the flow channel inlet is connected to the pipeline of the water cooling component (2) through the coolant outlet (209); and the outlet returns to the water tank (201) through the hot water return port (208).

3. The constant temperature water cooling mechanism for the pressure head in the AR bonding vacuum chamber according to claim 1, characterized in that: The heating plate (15) is a resistive heating film, and the heating plate (15) is electrically connected to the temperature control system, and the heating power is adjusted according to the temperature signal of the temperature sensor.

4. The constant temperature water cooling mechanism for the pressure head in the AR bonding vacuum chamber according to claim 1, characterized in that: The heat sink (204) adopts an aluminum fin structure and is equipped with a forced air cooling or liquid cooling module. The temperature of the coolant is reduced by 5-15° C. after flowing through the heat sink (204).

5. The constant temperature water cooling mechanism for the pressure head in the AR bonding vacuum chamber according to claim 1, characterized in that: The top of the water cooling plate (14) is connected to the guide mounting plate (11) through columns (12, 13), and the guide mounting plate (11) can be connected to a liftable mechanism fixed in the vacuum chamber.

6. The constant temperature water cooling mechanism for the pressure head in the AR bonding vacuum chamber according to claim 1, characterized in that: The surface of the pressure head (16) is plated with a high thermal conductivity metal layer.

7. According to claim 1, the constant temperature water cooling mechanism for the pressure head in the AR bonding vacuum chamber is characterized in that: During the pressing process, the contact surface between the pressing head (16) and the workpiece is kept at a constant temperature of 25-80°C.

8. According to claim 1, the constant temperature water cooling mechanism for the pressure head in the AR bonding vacuum chamber is characterized in that: A flow meter is provided on the pipeline between the water pump (205) and the heat dissipation radiator (204).

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