Packaging device for small electronic components

Abstract

The invention belongs to the technical field of part packaging, and particularly discloses a packaging device for small electronic components, which comprises a multifunctional packaging assembly, a self-adaptive heating and packaging mechanism, a pressing type overlapping mechanism and a conveying mechanism, the self-adaptive heating and packaging mechanism is arranged on the conveying mechanism, the multifunctional packaging assembly is arranged on the conveying mechanism, and the pressing type overlapping mechanism is arranged on the conveying mechanism. And the pressing type overlapping mechanism is arranged on the conveying mechanism. The metal layer provided by the invention not only can be used as an electric heating device to complete the combination of the plastic frame and the plastic packaging film, but also can avoid the damage of static electricity to components by utilizing the conductivity of the metal layer; moreover, through lifting of the self-adaptive heating packaging mechanism, overturning and laminating of the plastic packaging film can be completed, power can be automatically supplied to the metal layer, and the thermal packaging effect is achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of parts packaging, and specifically refers to a packaging device for small electronic components. Background Art

[0002] The packaging of small electronic components mainly considers mechanical protection and electrical protection. The traditional packaging method is to use plastic bags directly, which only has a sealing function and almost no mechanical protection strength. Since unpowered components are generally not affected by electromagnetic waves, static electricity may still cause damage to them, which is why many electronic components use high-cost anti-static packaging. Not only are there shortcomings in the packaging method, but the equipment currently used for packaging also has many steps, and often multiple processes must be performed at multiple stations to complete packaging and sealing. Summary of the invention

[0003] In view of the above situation, in order to overcome the defects of the prior art, the present invention proposes a new packaging device for small electronic components that takes into account both mechanical protection and electrical protection and has a simple structure and steps; by combining the metal layer and the plastic frame, a better balance can be achieved between weight, cost and mechanical strength; on the other hand, the metal layer can not only be used as an electric heating device to complete the combination of the plastic frame and the plastic packaging film, but also use its own conductivity to avoid static electricity damage to components; not only that, through the lifting and lowering of the adaptive heating packaging mechanism, not only can the plastic packaging film be flipped and stacked, but the metal layer can also be automatically powered to achieve the effect of thermal packaging.

[0004] The technical solution adopted by the present invention is as follows: The present invention proposes a packaging device for small electronic components, including a multifunctional packaging assembly, an adaptive heating packaging mechanism, a press-type overlapping mechanism and a conveying mechanism, wherein the adaptive heating packaging mechanism is arranged on the conveying mechanism, the multifunctional packaging assembly is arranged on the conveying mechanism, and the press-type overlapping mechanism is arranged on the conveying mechanism.

[0005] Multifunctional packaging components can provide mechanical and electrical protection for electronic components, thereby improving safety and stability during transportation and storage.

[0006] Furthermore, the multifunctional packaging component includes a metal layer, a plastic frame, shock-absorbing foam and a plastic packaging film, the metal layer is located in the plastic frame, both ends of the metal layer are provided with external contact points extending from the plastic frame, the shock-absorbing foam is located in the plastic frame, the shock-absorbing foam covers the upper and lower sides of the components, and the plastic frame is placed on a flat plastic packaging film.

[0007] The frame formed by the composite of the metal layer and the plastic frame can achieve a good balance between weight, cost and mechanical strength on the one hand, and on the other hand, the metal layer can be heated through the external contact points, so as to complete the connection between the plastic packaging film and the plastic frame by heating and melting, thereby completing the wrapping and packaging of the components.

[0008] Moreover, although the width of the metal layer is not large and can only protect the sides of the components, when the encapsulated multifunctional packaging components are stacked vertically, the entire row of metal layers forms a metal shell with a larger protection range. The metal shell can not only shield the electrostatic field, but also guide the accumulated static electricity to the ground when the external contact points on the entire row of multifunctional packaging components are connected by a ground wire, thereby protecting the internal electronic components from damage by static electricity.

[0009] Furthermore, the adaptive heating packaging mechanism includes a lifting assembly, a sliding power supply assembly, a sliding drive assembly and a wing assembly, the lifting assembly is arranged on the conveying mechanism, the sliding drive assembly is arranged on the lifting assembly, the sliding power supply assembly is arranged on the sliding drive assembly, and the wing assembly is arranged on both sides of the lifting assembly.

[0010] When the lifting head is lifted, the extension and retraction of the sliding table can be adaptively controlled by flattening and unfolding the wing plate body, so that after the plastic packaging film is stacked, the heating packaging step is automatically completed by controlling the height of the lifting head.

[0011] Furthermore, the lifting assembly includes a lifting head and a central pressing plate, and the central pressing plate is fixedly connected below the lifting head.

[0012] As a further preferred embodiment of the present invention, the sliding power supply assembly includes a sliding platform, a telescopic power supply contact and a contact telescopic spring. The sliding platform is arranged on the sliding drive assembly. The sliding platform is provided with a sleeve portion with the same spacing as the external contact. The telescopic power supply contact is slidably arranged in the sleeve portion, and the contact telescopic spring is arranged between the bottom of the sleeve portion and the telescopic power supply contact.

[0013] The contact telescopic spring not only allows the telescopic power supply contact to telescope, but also continuously provides pressure for the telescopic power supply contact, and can still ensure stable contact with the external contact when the specifications of the multifunctional packaging component are different or the lateral position is inaccurate.

[0014] Furthermore, the sliding drive assembly includes a guide rail, a slider, a ball head connecting rod and a connecting ball head. The guide rail is arranged at one end of the central pressure plate, the slider is slidably arranged on the guide rail, the sliding platform is fixed to the slider, ball sockets are provided at both ends of the ball head connecting rod, the connecting ball head is rotatably arranged in the ball sockets, and one of the connecting ball heads is fixed to the slider.

[0015] As a further preferred embodiment of the present invention, the wing assembly includes a wing body, a telescopic connecting rod and a wing pressure spring, the wing body is hinged to both sides of the center pressure plate, a connecting seat is provided on the wing body, the other of the connecting ball head is fixedly connected to the connecting seat, the two ends of the telescopic connecting rod are respectively hinged to the lifting head and the wing body, and the wing pressure spring is sleeved on the telescopic rod of the telescopic connecting rod.

[0016] The wing plate body is gently tilted downward in a free state. On the one hand, it can generate a certain pressure when the wing plate body presses the multifunctional packaging component horizontally. On the other hand, it can push the slider to slide outward by flipping up itself, so as to realize the extension and avoidance of the sliding power supply component.

[0017] Furthermore, the press-type overlapping mechanism includes an overlapping bracket, a press-type intermittent lifting platform and an overlapping assembly, the overlapping bracket is arranged on the conveying mechanism, a horizontal plate portion is provided on the outer side of the overlapping bracket, the press-type intermittent lifting platform is arranged in the middle position of the overlapping bracket, and when the press-type intermittent lifting platform is pressed, the press-type intermittent lifting platform can be stationary at two height positions, and the overlapping assembly is rotatably arranged in the overlapping bracket.

[0018] The mechanical movement of the push-type intermittent lift is similar to that of a push-type switch or a ballpoint pen. When pressed periodically, the lifting part of the push-type intermittent lift will alternately stay at two different height positions; when the push-type intermittent lift retracts, the wing plate body can be flipped up through the blocking of the overlapping bracket.

[0019] Furthermore, a groove portion is provided on the overlapping bracket, and the overlapping assembly includes a overlapping shaft and a overlapping plate, the overlapping shaft is fixedly connected in the groove portion, the overlapping plate is rotatably arranged on the overlapping shaft, and a torsion spring is arranged between the overlapping shaft and the overlapping plate.

[0020] When the press-type intermittent lifting platform is extended, the press-type intermittent lifting platform presses the stacking plate, and the stacking plate is folded in the groove portion. When the press-type intermittent lifting platform is retracted, the stacking plate will rotate and unfold under the action of the torsion spring, so that the plastic packaging film located outside the plastic frame is flipped over and covers the top of the plastic frame.

[0021] Furthermore, the conveying mechanism includes a frame bottom plate, a conveyor belt device and a lifting drive assembly, the conveyor belt device is arranged on the frame bottom plate, the overlapping bracket and the pressing intermittent lifting platform are arranged on the frame bottom plate, and the multifunctional packaging assembly is located on the pressing overlapping mechanism and the conveyor belt device.

[0022] Furthermore, the lifting drive assembly includes a crossbeam and a lifting cylinder, the crossbeam is arranged on an external frame, a slidable screw module is arranged on the crossbeam, and the lifting cylinder is arranged on a slide plate of the screw module.

[0023] As a further preferred embodiment of the present invention, the lifting head is arranged at the end of the telescopic part of the lifting cylinder, and the central pressure plate can press and separate the multifunctional packaging component through the telescopic movement of the lifting cylinder.

[0024] The beneficial effects achieved by the present invention using the above structure are as follows: (1) The frame formed by the composite of metal layer and plastic frame can achieve a good balance between weight, cost and mechanical strength. On the other hand, the metal layer can be heated through the external contact point, so as to complete the connection between the plastic packaging film and the plastic frame by heating and melting, thereby completing the wrapping and packaging of components.

[0025] (2) Moreover, although the width of the metal layer is not large and can only protect the sides of the components, when the encapsulated multifunctional packaging components are stacked vertically, the entire row of metal layers forms a metal shell with a larger protection range. The metal shell can not only shield the electrostatic field, but also guide the accumulated static electricity to the ground when the external contact points on the entire row of multifunctional packaging components are connected by a ground wire, thereby protecting the internal electronic components from damage by static electricity.

[0026] (3) When the lifting head is raised or lowered, the extension and retraction of the sliding table can be adaptively controlled by flattening and unfolding the wing plate body, so that after the plastic packaging film is stacked, the heating packaging step is automatically completed by controlling the height of the lifting head.

[0027] (4) The contact expansion and contraction spring not only allows the telescopic power supply contact to expand and contract, but also continuously provides pressure to the telescopic power supply contact, so that when the specifications of the multifunctional packaging component are different or the lateral position is inaccurate, it can still ensure stable contact with the external contact point.

[0028] (5) The wing plate body is gently tilted downward in a free state. On the one hand, it can generate a certain pressure when the wing plate body presses the multifunctional packaging component horizontally. On the other hand, it can push the slider to slide outward by flipping up, so as to achieve the extension and avoidance of the sliding power supply component.

[0029] (6) The mechanical movement of the push-type intermittent lift is similar to that of a push-type switch or a ballpoint pen. When pressed periodically, the lifting part of the push-type intermittent lift will alternately stay at two different height positions; when the push-type intermittent lift retracts, the wing plate body can be flipped up by blocking the overlapping bracket.

[0030] (7) When the push-type intermittent lifting platform is extended, the push-type intermittent lifting platform presses against the stacking plate, and the stacking plate is folded in the groove. When the push-type intermittent lifting platform is retracted, the stacking plate rotates and unfolds under the action of the torsion spring, so that the plastic packaging film located outside the plastic frame is flipped over and covers the top of the plastic frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is an overall diagram of a packaging device for small electronic components proposed by the present invention; Figure 2 This is a front view of a packaging device for small electronic components proposed by the present invention; Figure 3 A top view of a packaging device for small electronic components proposed by the present invention; Figure 4 for Figure 2 A cross-sectional view along the cutting line AA; Figure 5 for Figure 4 A cross-sectional view along the cutting line BB; Figure 6 for Figure 2 A cross-sectional view along the cutting line CC; Figure 7 for Figure 5 A partial enlarged view of point Ⅰ in the middle; Figure 8 for Figure 4 A partial enlarged view of the middle II; Fig. 9 for Figure 6 A partial enlarged view of the middle part III; Fig.10 for Figure 1 A partial enlarged view of the middle IV; Fig.11 Schematic diagram of the positions of some moving parts in different pressing states.

[0032] Among them, 1. Multifunctional packaging component, 2. Adaptive heating packaging mechanism, 3. Press-type overlapping mechanism, 4. Conveying mechanism, 5. Metal layer, 6. Plastic frame, 7. Shock-absorbing foam, 8. Plastic packaging film, 9. External contact point, 10. Lifting component, 11. Sliding power supply component, 12. Sliding drive component, 13. Wing plate component, 14. Lifting head, 15. Center pressure plate, 16. Sliding table, 17. Telescopic power supply contact, 18. Contact telescopic spring, 19. Guide rail, 2 0. Slider, 21. Ball head connecting rod, 22. Connecting ball head, 23. Wing plate body, 24. Telescopic connecting rod, 25. Wing plate pressure spring, 26. Sleeve part, 27. Ball socket, 28. Connecting seat, 29. Overlapping bracket, 30. Press-type intermittent lifting platform, 31. Overlapping assembly, 32. Cross plate part, 33. Groove part, 34. Overlapping shaft, 35. Overlapping plate, 36. Rack bottom plate, 37. Conveyor belt device, 38. Lifting drive assembly, 39. Crossbeam, 40. Lifting cylinder.

[0033] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0035] In the description of the present invention, it should be understood that terms such as “upper”, “lower”, “front”, “back”, “left”, “right”, “top”, “bottom”, “inside” and “outside” indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0036] like Figure 1 to Figure 10 As shown, the present invention proposes a packaging device for small electronic components, including a multifunctional packaging assembly 1, an adaptive heating packaging mechanism 2, a press-type overlapping mechanism 3 and a conveying mechanism 4, the adaptive heating packaging mechanism 2 is arranged on the conveying mechanism 4, the multifunctional packaging assembly 1 is arranged on the conveying mechanism 4, and the press-type overlapping mechanism 3 is arranged on the conveying mechanism 4.

[0037] The multifunctional packaging assembly 1 can provide mechanical and electrical protection to electronic components, thereby improving safety and stability during transportation and storage.

[0038] The conveying mechanism 4 includes a frame bottom plate 36, a conveyor belt device 37 and a lifting drive assembly 38. The conveyor belt device 37 is arranged on the frame bottom plate 36, the overlapping bracket 29 and the pressing intermittent lifting platform 30 are arranged on the frame bottom plate 36, and the multifunctional packaging assembly 1 is located on the pressing overlapping mechanism 3 and the conveyor belt device 37.

[0039] The lifting drive assembly 38 includes a crossbeam 39 and a lifting cylinder 40. The crossbeam 39 is arranged on an external frame. A slidable screw module is arranged on the crossbeam 39. The lifting cylinder 40 is arranged on a slide plate of the screw module.

[0040] The lifting head 14 is disposed at the end of the telescopic portion of the lifting cylinder 40 . Through the telescopic movement of the lifting cylinder 40 , the central pressing plate 15 can press and separate the multifunctional packaging component 1 .

[0041] The pressing-type overlapping mechanism 3 includes an overlapping bracket 29, a pressing-type intermittent lifting platform 30 and a overlapping assembly 31. The overlapping bracket 29 is arranged on the conveying mechanism 4. A horizontal plate portion 32 is provided on the outer side of the overlapping bracket 29. The pressing-type intermittent lifting platform 30 is arranged in the middle position of the overlapping bracket 29. When the pressing-type intermittent lifting platform 30 is pressed, the pressing-type intermittent lifting platform 30 can be stationary at two height positions. The overlapping assembly 31 is rotatably arranged in the overlapping bracket 29.

[0042] The mechanical movement of the push-type intermittent lifting platform 30 is similar to that of a push-type switch or a ballpoint pen. When pressed periodically, the lifting part of the push-type intermittent lifting platform 30 will alternately stay at two different height positions; when the push-type intermittent lifting platform 30 retracts, the wing plate body 23 can be flipped up through the blocking of the overlapping bracket 29.

[0043] The stacking bracket 29 is also provided with a groove portion 33, and the stacking assembly 31 includes a stacking shaft 34 and a stacking plate 35. The stacking shaft 34 is fixedly connected to the groove portion 33, and the stacking plate 35 is rotatably arranged on the stacking shaft 34. A torsion spring is arranged between the stacking shaft 34 and the stacking plate 35.

[0044] When the press-type intermittent lifting platform 30 is extended, the press-type intermittent lifting platform 30 presses against the stacking plate 35, and the stacking plate 35 is folded in the groove portion 33. When the press-type intermittent lifting platform 30 is retracted, the stacking plate 35 will rotate and unfold under the action of the torsion spring, so that the plastic packaging film 8 located outside the plastic frame 6 is flipped over and covers the top of the plastic frame 6.

[0045] The multifunctional packaging component 1 includes a metal layer 5, a plastic frame 6, a shock-absorbing foam 7 and a plastic packaging film 8. The metal layer 5 is located in the plastic frame 6. Both ends of the metal layer 5 are provided with external contact points 9 extending from the plastic frame 6. The shock-absorbing foam 7 is located in the plastic frame 6. The shock-absorbing foam 7 covers the upper and lower sides of the components. The plastic frame 6 is placed on the flat plastic packaging film 8.

[0046] The frame formed by the composite of the metal layer 5 and the plastic frame 6 can, on the one hand, achieve a good balance between weight, cost and mechanical strength; on the other hand, the metal layer 5 can be heated through the external contact point 9, so as to complete the connection between the plastic packaging film 8 and the plastic frame 6 by heating and melting, thereby completing the wrapping and packaging of the components.

[0047] Moreover, although the metal layer 5 is not wide and can only protect the sides of components, when the packaged multifunctional packaging components 1 are stacked vertically, the entire row of metal layers 5 forms a metal shell with a larger protection range. The metal shell can not only shield the electrostatic field, but also guide the accumulated static electricity to the ground when the external contact points 9 on the entire row of multifunctional packaging components 1 are connected by a ground wire, thereby protecting the internal electronic components from damage by static electricity.

[0048] The adaptive heating packaging mechanism 2 includes a lifting assembly 10, a sliding power supply assembly 11, a sliding drive assembly 12 and a wing assembly 13. The lifting assembly 10 is arranged on the conveying mechanism 4, the sliding drive assembly 12 is arranged on the lifting assembly 10, the sliding power supply assembly 11 is arranged on the sliding drive assembly 12, and the wing assembly 13 is arranged on both sides of the lifting assembly 10.

[0049] When the lifting head 14 is lifted or lowered, the extension and retraction of the sliding platform 16 can be adaptively controlled by flattening and unfolding the wing plate body 23 , so that after the plastic packaging film 8 is stacked, the heating and packaging steps are automatically completed by controlling the height of the lifting head 14 .

[0050] The lifting assembly 10 includes a lifting head 14 and a central pressing plate 15 . The central pressing plate 15 is fixedly connected to the lower side of the lifting head 14 .

[0051] The sliding power supply assembly 11 includes a sliding platform 16, a telescopic power supply contact 17 and a contact telescopic spring 18. The sliding platform 16 is arranged on the sliding drive assembly 12. The sliding platform 16 is provided with a sleeve portion 26 with the same spacing as the external contact 9. The telescopic power supply contact 17 is slidably arranged in the sleeve portion 26, and the contact telescopic spring 18 is arranged between the bottom of the sleeve portion 26 and the telescopic power supply contact 17.

[0052] The contact telescopic spring 18 not only allows the telescopic power supply contact 17 to telescope, but also continuously provides pressure for the telescopic power supply contact 17, and can still ensure stable contact with the external contact 9 when the specifications of the multifunctional packaging component 1 are different or the lateral position is inaccurate.

[0053] The sliding drive assembly 12 includes a guide rail 19, a slider 20, a ball head connecting rod 21 and a connecting ball head 22. The guide rail 19 is arranged at one end of the central pressure plate 15. The slider 20 is slidably arranged on the guide rail 19. The sliding platform 16 is fixed to the slider 20. Ball sockets 27 are arranged at both ends of the ball head connecting rod 21. The connecting ball head 22 is rotatably arranged in the ball sockets 27. One of the connecting ball heads 22 is fixed to the slider 20.

[0054] The wing assembly 13 includes a wing body 23, a telescopic connecting rod 24 and a wing pressure spring 25. The wing body 23 is hinged on both sides of the central pressure plate 15. A connecting seat 28 is provided on the wing body 23. The other end of the connecting ball head 22 is fixedly connected to the connecting seat 28. The two ends of the telescopic connecting rod 24 are respectively hinged to the lifting head 14 and the wing body 23. The wing pressure spring 25 is sleeved on the telescopic rod of the telescopic connecting rod 24.

[0055] The wing plate body 23 is gently tilted downward in a free state. On the one hand, it can generate a certain pressure when the wing plate body 23 presses the multifunctional packaging component 1 horizontally. On the other hand, it can push the slider 20 to slide outward by its own upward flipping, so as to realize the extension and avoidance of the sliding power supply component 11.

[0056] like Fig.11 As shown, a, b, and c are schematic diagrams of the positions of the central pressing plate 15, the wing plate body 23, the multifunctional packaging component 1, the cross plate portion 32, and the overlapping bracket 29 in different states; wherein, a is the initial stage, at which the top of the pressing intermittent lifting platform 30 is flush with the top of the overlapping bracket 29, the plastic packaging film 8 is laid flat on the overlapping bracket 29 and the pressing intermittent lifting platform 30, and the plastic frame 6 is located on the pressing intermittent lifting platform 30; b is the stage in which the lifting cylinder 40 pushes the lifting component 10 downward and presses the pressing intermittent lifting platform 30 to retract, and the blocking The stacking plate 35 is flipped over and pressed on the end of the plastic frame 6, and the wing plate body 23 is in an upward state relative to the central pressure plate 15; at this time, the lifting cylinder 40 is retracted, as shown in C. At this time, since the press-type intermittent lifting platform 30 does not rebound, the multifunctional packaging component 1 is still located below; the multifunctional packaging component 1 is pressed again by extending the lifting cylinder 40, and the press-type intermittent lifting platform 30 and the multifunctional packaging component 1 will be reset. The difference from a at this time is that the plastic packaging film 8 is already overlapped on the top of the plastic frame 6 and is pressed by the central pressure plate 15 and the wing plate body 23.

[0057] The mechanical movement form of the push-type intermittent lifting platform 30 is similar to that of a push-type switch or a ballpoint pen. When pressed periodically, the lifting part of the push-type intermittent lifting platform 30 will alternately stay at two different height positions; of course, other structural modules in the prior art that can achieve this movement form can also be used.

[0058] In specific use, the metal layer 5 and the plastic frame 6 are an integral component assembled together before packaging. The multifunctional packaging component 1 that has been laid flat is moved laterally by the conveyor belt device 37. It is also possible not to use a transmission mechanism such as the conveyor belt device 37, and directly lay and stack the multifunctional packaging component 1 on the overlapping bracket 29 and the pressing intermittent lifting platform 30 by a manipulator. The components to be packaged need to be placed between the two layers of shock-absorbing foam 7. When laying flat, there may be excess plastic packaging film 8 at both ends of the plastic frame 6, or there may be excess plastic packaging film 8 at only one end of the plastic frame 6. The following is an example of an example where there is excess plastic packaging film 8 at only one end. After stacking is completed, the lifting cylinder 40 is moved to the top of the multifunctional packaging assembly 1 through the screw module on the crossbeam 39, and then the lifting cylinder 40 is extended to bring the lifting head 14 and the center pressing plate 15 down. First, the wing plate body 23 will first press against the plastic frame 6, thereby preventing the elastic force of the contact telescopic spring 18 from pushing the plastic frame 6; after the center pressing plate 15 presses against the plastic frame 6, it will push the plastic frame 6 down, and at the same time, the press-type intermittent lifting platform 30 will retract; When the central pressure plate 15 moves to the bottom of the overlapping bracket 29, the wing plate body 23 will flip up relative to the central pressure plate 15 under the obstruction of the overlapping bracket 29. At this time, through the linkage of the ball head connecting rod 21, the slider 20 can be pushed to slide with the sliding power supply assembly 11 toward the outside to avoid the position; When the press-type intermittent lifting platform 30 retracts to the bottom of the groove portion 33, the stacking plate 35 that has lost its restriction will flip over under the action of the torsion spring, and the plastic packaging film 8 located on the side of the plastic frame 6 will be flipped over to cover the top of the plastic frame 6. However, since the central pressing plate 15 is still pressed on the plastic frame 6 at this time, the plastic packaging film 8 cannot completely cover the upper surface of the plastic frame 6. At this time, the adaptive heating packaging mechanism 2 is raised by the retraction of the lifting cylinder 40, but since the press-type intermittent lifting platform 30 is not extended to reset, the multifunctional packaging component 1 is still located below the stacking bracket 29 at this time. After the central pressing plate 15 leaves the plastic frame 6, the flipped plastic packaging film 8 will completely cover the top of the plastic frame 6.

[0059] At this time, the central pressing plate 15 is lowered again by the extension of the lifting cylinder 40 and presses the plastic frame 6 and the pressing intermittent lifting platform 30. Then, when the lifting cylinder 40 rises and resets, the pressing intermittent lifting platform 30 and the multifunctional packaging component 1 will rise together with the central pressing plate 15 until the top of the multifunctional packaging component 1 is slightly higher than the top of the overlapping bracket 29 and stays for a period of time. At this position, on the one hand, the wing plate body 23 can be flattened to form a plane with the central pressing plate 15 to evenly press the plastic packaging film 8 covering the plastic frame 6; on the other hand, when the wing plate body 23 is flattened, the sliding platform 16 retracts, and the telescopic power supply contact 17 can contact the external contact point 9, and the telescopic power supply contact 17 is connected to the external power supply. At this time, the metal layer 5 acts as a heating wire to heat the plastic frame 6 and the plastic packaging film 8; The surface layers of the plastic frame 6 and the plastic packaging film 8 will fuse after being heated, and can be formed into a whole again after the heating is stopped and the plastic frame 6 is cooled again. At this time, it is necessary to pay attention not to heat the plastic frame 6 for too long to prevent the plastic frame 6 from being over-melted.

[0060] Although the adaptive heating packaging mechanism 2 will also go through the above state during the initial pressing process, since there is no stop, the metal layer 5 cannot be heated to a temperature capable of fusing the plastic frame 6 and the plastic packaging film 8 during this process.

[0061] Continue to retract the lifting cylinder 40 until the adaptive heating packaging mechanism 2 leaves the packaged multifunctional packaging component 1, and then the packaged multifunctional packaging component 1 can be removed by an external mechanism.

[0062] During transportation and storage, the packaged multifunctional packaging components 1 need to be stacked vertically in a row. At this time, the metal layer 5 of the entire row forms a metal shell with a larger protection range. The metal shell can not only shield the electrostatic field, but also when the external contact points 9 on the entire row of multifunctional packaging components 1 are connected by a ground wire, it can also guide the accumulated static electricity to the ground, thereby protecting the internal electronic components from damage by static electricity.

[0063] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0064] The present invention and its embodiments are described above, and such description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the present invention.

Claims

1. A packaging device for small electronic components, characterized in that: It comprises a multifunctional packaging component (1), an adaptive heating packaging mechanism (2) and a conveying mechanism (4), wherein the adaptive heating packaging mechanism (2) is arranged on the conveying mechanism (4), and the multifunctional packaging component (1) is arranged on the conveying mechanism (4); The multifunctional packaging component (1) comprises a metal layer (5), a plastic frame (6), a shock-absorbing foam (7) and a plastic packaging film (8), wherein the metal layer (5) is located in the plastic frame (6), and both ends of the metal layer (5) are provided with external contact points (9) extending from the plastic frame (6), the shock-absorbing foam (7) is located in the plastic frame (6), and the shock-absorbing foam (7) covers the upper and lower sides of the component, and the plastic frame (6) is placed on the flat plastic packaging film (8); The adaptive heating packaging mechanism (2) comprises a lifting component (10), a sliding power supply component (11), a sliding drive component (12) and a wing plate component (13); the lifting component (10) is arranged on the conveying mechanism (4); the sliding drive component (12) is arranged on the lifting component (10); the sliding power supply component (11) is arranged on the sliding drive component (12); and the wing plate component (13) is arranged on both sides of the lifting component (10).

2. A packaging device for small electronic components according to claim 1, characterized in that: The lifting assembly (10) comprises a lifting head (14) and a central pressing plate (15), wherein the central pressing plate (15) is fixedly connected below the lifting head (14).

3. A packaging device for small electronic components according to claim 2, characterized in that: The sliding power supply component (11) comprises a sliding platform (16), a telescopic power supply contact (17) and a contact telescopic spring (18); the sliding platform (16) is arranged on the sliding drive component (12); a sleeve portion (26) having the same spacing as the external contact (9) is provided on the sliding platform (16); the telescopic power supply contact (17) is slidably arranged in the sleeve portion (26); and the contact telescopic spring (18) is arranged between the bottom of the sleeve portion (26) and the telescopic power supply contact (17).

4. A packaging device for small electronic components according to claim 3, characterized in that: The sliding drive assembly (12) comprises a guide rail (19), a slider (20), a ball head connecting rod (21) and a connecting ball head (22); the guide rail (19) is arranged at one end of the central pressure plate (15); the slider (20) is slidably arranged on the guide rail (19); the sliding platform (16) is fixedly connected to the slider (20); ball sockets (27) are arranged at both ends of the ball head connecting rod (21); the connecting ball head (22) is rotatably arranged in the ball sockets (27); and one of the connecting ball heads (22) is fixedly connected to the slider (20).

5. A packaging device for small electronic components according to claim 4, characterized in that: The wing assembly (13) comprises a wing body (23), a telescopic connecting rod (24) and a wing pressure spring (25), wherein the wing body (23) is hinged to both sides of the central pressure plate (15), a connecting seat (28) is provided on the wing body (23), the other end of the connecting ball head (22) is fixedly connected to the connecting seat (28), the two ends of the telescopic connecting rod (24) are respectively hinged to the lifting head (14) and the wing body (23), and the wing pressure spring (25) is sleeved on the telescopic rod of the telescopic connecting rod (24).

6. A packaging device for small electronic components according to claim 5, characterized in that: The invention also comprises a pressing-type overlapping mechanism (3), wherein the pressing-type overlapping mechanism (3) comprises an overlapping bracket (29), a pressing-type intermittent lifting platform (30) and an overlapping assembly (31); the overlapping bracket (29) is arranged on the conveying mechanism (4); a horizontal plate portion (32) is arranged on the outer side of the overlapping bracket (29); the pressing-type intermittent lifting platform (30) is arranged at a middle position of the overlapping bracket (29); when the pressing-type intermittent lifting platform (30) is pressed, the pressing-type intermittent lifting platform (30) can be stationary at two height positions; and the overlapping assembly (31) is rotatably arranged in the overlapping bracket (29).

7. A packaging device for small electronic components according to claim 6, characterized in that: The stacking bracket (29) is also provided with a groove portion (33), and the stacking assembly (31) comprises a stacking shaft (34) and a stacking plate (35), wherein the stacking shaft (34) is fixedly connected to the groove portion (33), and the stacking plate (35) is rotatably arranged on the stacking shaft (34), and a torsion spring is arranged between the stacking shaft (34) and the stacking plate (35).

8. A packaging device for small electronic components according to claim 7, characterized in that: The conveying mechanism (4) comprises a frame bottom plate (36), a conveyor belt device (37) and a lifting drive assembly (38); the conveyor belt device (37) is arranged on the frame bottom plate (36); the overlapping bracket (29) and the pressing intermittent lifting platform (30) are arranged on the frame bottom plate (36); and the multifunctional packaging assembly (1) is located on the pressing overlapping mechanism (3) and the conveyor belt device (37).

9. A packaging device for small electronic components according to claim 8, characterized in that: The lifting drive assembly (38) comprises a crossbeam (39) and a lifting cylinder (40); the crossbeam (39) is arranged on an external frame; a slidable screw module is arranged on the crossbeam (39); and the lifting cylinder (40) is arranged on a slide plate of the screw module.

10. A packaging device for small electronic components according to claim 9, characterized in that: The lifting head (14) is arranged at the end of the telescopic part of the lifting cylinder (40), and the central pressing plate (15) can press and separate the multifunctional packaging component (1) through the telescopic movement of the lifting cylinder (40).

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