Copper-tin composite plating solution, preparation method thereof and plated part

Abstract

The invention discloses a copper-tin composite plating solution, a preparation method thereof and a plated part, the copper-tin composite plating solution comprises copper salt, stannate, cyanide, hydroxide, a complexing agent, a cylinder opening agent and water, the cylinder opening agent comprises a first brightener and a second brightener, the first brightener comprises metal sulfate and potassium sodium tartrate, and the second brightener comprises metal sulfate and potassium sodium tartrate. The second brightener comprises polypeptide and a surfactant. The copper-tin composite plating solution comprises the first brightening agent and the second brightening agent, and under the synergistic effect of the first brightening agent and the second brightening agent, a copper-tin alloy plating layer prepared from the copper-tin composite plating solution can have high brightness and high corrosion resistance.

Description

Technical Field

[0001] The present application relates to the field of electroplating technology, and in particular to a copper-tin composite plating solution and a preparation method thereof, and a plated part. Background Art

[0002] Copper-tin alloy plating, also known as bronze plating, is the most widely used and largest-scale alloy plating in China. It is also a widely used excellent nickel substitute.

[0003] Copper-tin alloy plating has two notable characteristics: first, the color of the plating can appear in different colors such as red, golden yellow, light yellow and silver white depending on the tin content; second, the plating has good corrosion resistance and can be comparable to nickel layers of the same thickness.

[0004] However, the existing copper-tin alloy mixed plating solution produces a poor coating brightness and low corrosion resistance when used, resulting in a reduced application range of the copper-tin alloy coating. Summary of the invention

[0005] In view of this, the present application provides a copper-tin composite plating solution, aiming to improve the problem of poor brightness of the coating prepared by the existing copper-tin composite plating solution.

[0006] The embodiment of the present application is implemented as follows: a copper-tin composite plating solution includes a copper salt, a stannate, a cyanide, a hydroxide, a complexing agent, a plating agent and water, wherein the plating agent includes a first brightener and a second brightener, the first brightener includes a metal sulfate and potassium sodium tartrate, and the second brightener includes a polypeptide and a surfactant.

[0007] Optionally, in some embodiments, in the copper-tin composite plating solution,

[0008] The concentration of the metal sulfate is 0.01 to 0.05 g / L; and / or

[0009] The concentration of the potassium sodium tartrate is 0.04-0.5 g / L.

[0010] Optionally, in some embodiments, in the first brightener, the mass ratio of the metal sulfate to the potassium sodium tartrate is 1:(4-10).

[0011] Optionally, in some embodiments, in the copper-tin composite plating solution,

[0012] The concentration of the polypeptide is 0.1-0.4 g / L; and / or

[0013] The concentration of the surfactant is 0.1-0.8 g / L.

[0014] Optionally, in some embodiments, in the second brightener, the mass ratio of the polypeptide to the surfactant is (5-6): (5-12)

[0015] Optionally, in some embodiments, in the copper-tin composite plating solution,

[0016] The concentration of the copper salt is 20-35 g / L; and / or

[0017] The concentration of the stannate is 35 to 55 g / L; and / or

[0018] The concentration of the cyanide is 25-40 g / L; and / or

[0019] The concentration of the hydroxide is 5 to 13 g / L; and / or

[0020] The concentration of the complexing agent is 20-60 g / L.

[0021] Optionally, in some embodiments, the metal sulfate includes one or more of bismuth sulfate, antimony sulfate, and indium sulfate; and / or

[0022] The polypeptide comprises one or more of dodecapeptide, thirteencapeptide, tetradecapeptide, pentadecapeptide, hexadecapeptide, heptadecapeptide, eighteencapeptide, nonadecapeptide, and twenty-capeptide; and / or

[0023] The surfactant includes one or more of OP-10, OP-7, and OP-20; and / or

[0024] The copper salt comprises cuprous cyanide; and / or

[0025] The stannate includes one or more of sodium stannate, potassium stannate and hydrates thereof; and / or

[0026] The cyanide comprises one or more of potassium cyanide and sodium cyanide; and / or

[0027] The hydroxide includes one or more of potassium hydroxide and sodium hydroxide; and / or

[0028] The complexing agent includes one or more of potassium pyrophosphate and sodium pyrophosphate.

[0029] Accordingly, the present application also provides a method for preparing a copper-tin composite plating solution, comprising:

[0030] mixing water and a hydroxide to obtain a hydroxide solution;

[0031] adding cyanide to the hydroxide solution to obtain a first intermediate solution;

[0032] Providing copper salt and water, mixing to obtain a paste of copper salt, adding the paste of copper salt to the first intermediate solution, reacting to obtain a second intermediate solution;

[0033] adding a complexing agent to the second intermediate solution to obtain a third intermediate solution;

[0034] Adding stannate to the third intermediate solution, and then adding a tank opening agent solution to obtain a copper-tin composite plating solution;

[0035] The tank opening agent solution includes a tank opening agent and water, the tank opening agent includes a first brightener and a second brightener, the first brightener includes metal sulfate and potassium sodium tartrate, and the second brightener includes a polypeptide and a surfactant.

[0036] Optionally, in some embodiments, the method for preparing the cylinder opening agent solution includes:

[0037] Mixing metal sulfate, sodium potassium tartrate and water to obtain a first brightener solution;

[0038] The polypeptide and the surfactant are added into the first brightener solution to obtain the cylinder opening agent solution.

[0039] Optionally, in some embodiments, after obtaining the copper-tin composite plating solution, the method further includes: adding the workpiece to be plated into the copper-tin composite plating solution for pre-electroplating.

[0040] Optionally, in some embodiments, during pre-electroplating, the current density of the cathode is 1 to 3 A / dm 2 ; and / or

[0041] During pre-plating, the current density of the anode is 2 to 6A / dm 2 ; and / or

[0042] The pre-plating time is 1 to 3 hours.

[0043] Correspondingly, an embodiment of the present application also provides a plated component, comprising a conductive substrate and a copper-tin alloy coating bonded to at least one surface of the conductive substrate, wherein the copper-tin alloy coating is prepared from the above-mentioned copper-tin composite plating solution through an electroplating process, or the copper-tin alloy coating is prepared from the copper-tin composite plating solution prepared by the above-mentioned preparation method through an electroplating process.

[0044] Optionally, in some embodiments, the plated component is an electrical contact conductor; and / or

[0045] The material of the conductive substrate includes one or more of iron, copper, aluminum, silver, and tungsten.

[0046] The copper-tin composite plating solution described in the present application includes the first brightener and the second brightener. Under the synergistic effect of the first brightener and the second brightener, the copper-tin alloy coating prepared by the copper-tin composite plating solution can have higher brightness and stronger corrosion resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0048] Figure 1 This is a flow chart of a method for preparing a copper-tin composite plating solution provided in an embodiment of the present application 。 DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application.

[0050] In this application, unless otherwise stated, directional words such as "upper" and "lower" generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inner" and "outer" refer to the outline of the device. In addition, in the description of this application, the term "including" means "including but not limited to". The terms first, second, third, etc. are used only as labels and do not impose numerical requirements or establish an order.

[0051] In this application, "and / or" describes the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural.

[0052] In the present application, "at least one" means one or more, and "plurality" means two or more. "At least one", "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single items or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can all mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, c can be single or multiple, respectively.

[0053] Various embodiments of the present application may be presented in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity, and should not be understood as a rigid limitation on the scope of the present application; therefore, the range description should be considered to have specifically disclosed all possible sub-ranges and single numerical values ​​within the range. For example, the range description from 1 to 6 should be considered to have specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, which apply regardless of the range. In addition, whenever a numerical range is indicated herein, it is meant to include any cited number (fractional or integer) within the indicated range.

[0054] The technical solution of this application is as follows:

[0055] In a first aspect, an embodiment of the present application provides a copper-tin composite plating solution, comprising a copper salt, a stannate, a cyanide, a hydroxide, a complexing agent, a plating agent and water, wherein the plating agent comprises a first brightener and a second brightener, the first brightener comprises a metal sulfate and potassium sodium tartrate, and the second brightener comprises a polypeptide and a surfactant.

[0056] The copper-tin composite plating solution described in the present application includes the first brightener and the second brightener. Under the synergistic effect of the first brightener and the second brightener, the copper-tin alloy coating prepared by the copper-tin composite plating solution can have higher brightness and stronger corrosion resistance.

[0057] In some embodiments, the metal sulfate includes, but is not limited to, one or more of bismuth sulfate, antimony sulfate, and indium sulfate.

[0058] In some embodiments, the polypeptide includes but is not limited to one or more of a dodecapeptide, a tridecapeptide, a tetradecapeptide, a pentadecapeptide, a hexadecapeptide, a heptadecapeptide, an octadecapeptide, a nonadecapeptide, and an eicocapeptide.

[0059] In some embodiments, the surfactant includes an OP series surfactant. Further, the OP series surfactant includes but is not limited to one or more of OP-10 (alkylphenol polyoxyethylene ether), OP-7 (octylphenol polyoxyethylene ether), and OP-20.

[0060] In some embodiments, in the copper-tin composite plating solution, the concentration of the metal sulfate is 0.01 to 0.05 g / L, for example, 0.01 g / L, 0.02 g / L, 0.03 g / L, 0.04 g / L, 0.05 g / L, etc.

[0061] In some embodiments, in the copper-tin composite plating solution, the concentration of potassium sodium tartrate is 0.04-0.5 g / L, for example, 0.04 g / L, 0.1 g / L, 0.2 g / L, 0.3 g / L, 0.4 g / L, 0.5 g / L, etc.

[0062] Within the concentration range of the metal sulfate and the potassium sodium tartrate, the copper-tin alloy coating prepared from the copper-tin composite plating solution can have higher brightness and stronger corrosion resistance.

[0063] Further, in some embodiments, in the first brightener, the mass ratio of the metal sulfate to the potassium sodium tartrate is 1:(4-10), for example, 1:4, 1:5, 1:6, 1:7, 1:8, 1:9, 1:10, etc. Within the mass ratio range, the copper-tin alloy coating prepared by the copper-tin composite plating solution can be further effectively made to have higher brightness and stronger corrosion resistance.

[0064] In some embodiments, in the copper-tin composite plating solution, the concentration of the polypeptide is 0.1-0.4 g / L, for example, 0.1 g / L, 0.2 g / L, 0.3 g / L, 0.4 g / L, etc.

[0065] In some embodiments, in the copper-tin composite plating solution, the concentration of the surfactant is 0.1-0.8 g / L, for example, 0.1 g / L, 0.2 g / L, 0.3 g / L, 0.4 g / L, 0.5 g / L, 0.6 g / L, 0.7 g / L, 0.8 g / L, etc.

[0066] Within the concentration range of the polypeptide and the surfactant, the copper-tin alloy coating prepared from the copper-tin composite plating solution can have higher brightness and stronger corrosion resistance.

[0067] Further, in some embodiments, in the second brightener, the mass ratio of the polypeptide to the surfactant is (5-6): (5-12), for example, 5:5, 5:8, 5:10, 5:12, 5.5:5, 5.5:6, 5.5:9, 5.5:11, 5.5:12, 6:5, 6:7, 6:8, 6:10, 6:12, etc. Within the mass ratio range, the copper-tin alloy coating prepared by the copper-tin composite plating solution can be further effectively made to have higher brightness and stronger corrosion resistance.

[0068] In some embodiments, the concentration of the copper salt in the copper-tin composite plating solution is 20-35 g / L, for example, 20 g / L, 22 g / L, 25 g / L, 26 g / L, 28 g / L, 30 g / L, 32 g / L, 34 g / L, 35 g / L, etc.

[0069] In some embodiments, in the copper-tin composite plating solution, the concentration of the stannate is 35-55 g / L, for example, 35 g / L, 36 g / L, 38 g / L, 40 g / L, 42 g / L, 45 g / L, 46 g / L, 48 g / L, 50 g / L, 52 g / L, 55 g / L, etc.

[0070] In some embodiments, the concentration of cyanide in the copper-tin composite plating solution is 25-40 g / L, for example, 25 g / L, 28 g / L, 30 g / L, 32 g / L, 35 g / L, 36 g / L, 38 g / L, 40 g / L, etc.

[0071] In some embodiments, in the copper-tin composite plating solution, the concentration of the hydroxide is 5 to 13 g / L, for example, 5 g / L, 8 g / L, 10 g / L, 12 g / L, 13 g / L, etc.

[0072] In some embodiments, in the copper-tin composite plating solution, the concentration of the complexing agent is 20-60 g / L, for example, 20 g / L, 25 g / L, 30 g / L, 35 g / L, 40 g / L, 45 g / L, 50 g / L, 55 g / L, 60 g / L, etc.

[0073] Within the concentration range of the copper salt, stannate, cyanide, hydroxide and complexing agent, the copper-tin alloy coating prepared from the copper-tin composite plating solution can have high brightness and strong corrosion resistance.

[0074] In some embodiments, the copper salt includes but is not limited to cuprous cyanide.

[0075] In some embodiments, the stannate includes, but is not limited to, one or more of sodium stannate, potassium stannate, and hydrates thereof.

[0076] In some embodiments, the cyanide includes, but is not limited to, one or more of potassium cyanide (KCN) and sodium cyanide (NaCN).

[0077] In some embodiments, the hydroxide includes but is not limited to one or more of potassium hydroxide and sodium hydroxide.

[0078] In some embodiments, the complexing agent includes, but is not limited to, one or more of potassium pyrophosphate and sodium pyrophosphate.

[0079] The copper-tin composite plating solution described in the present application, under the synergistic effect of various components and their concentrations, enables the copper-tin alloy coating prepared by the copper-tin composite plating solution to have high brightness and strong corrosion resistance.

[0080] Second, see Figure 1 The present application also provides a method for preparing the copper-tin composite plating solution, comprising the following steps:

[0081] Step S11: mixing water and hydroxide to obtain a hydroxide solution;

[0082] Step S12: adding cyanide to the hydroxide solution to obtain a first intermediate solution;

[0083] Step S13: providing copper salt and water, mixing to obtain a paste of copper salt, slowly adding the paste of copper salt into the first intermediate solution, stirring, and then weakly electrolyzing for a period of time to obtain a second intermediate solution;

[0084] Step S14: adding a complexing agent to the second intermediate solution to obtain a third intermediate solution;

[0085] Step S15: adding stannate to the third intermediate solution, and then adding a tank opening agent solution to obtain a copper-tin composite plating solution.

[0086] In the above preparation method, the types of the hydroxide, cyanide, copper salt, complexing agent, and stannate as well as their concentrations in the copper-tin composite plating solution are respectively as described above and will not be described in detail here.

[0087] In some embodiments, the weak electrolysis reaction time is 1 to 2 hours, such as 1 hour, 1.5 hours, 2 hours, etc.

[0088] The cylinder opening agent solution includes the cylinder opening agent mentioned above and water.

[0089] The concentration of the opening agent in the copper-tin composite plating solution is as described above and will not be repeated here.

[0090] There is no restriction on the concentration of the cylinder opening agent solution, as long as the metal sulfate, potassium sodium tartrate, polypeptide and surfactant can be fully dissolved.

[0091] In some embodiments, the method for preparing the cylinder opening agent solution comprises:

[0092] Step S21, mixing metal sulfate, potassium sodium tartrate and water to cause a complex reaction between the metal sulfate and potassium sodium tartrate to obtain a first brightener solution;

[0093] Step S22: adding the polypeptide and the surfactant to the first brightener solution to obtain a cylinder opening agent solution.

[0094] In some embodiments, the step S22 is: first adding the polypeptide to the first brightener solution, and then adding the surfactant to the first brightener solution to obtain a cylinder opening agent solution.

[0095] In some other embodiments, the step S22 is: first adding a surfactant to the first brightener solution, and then adding a polypeptide to the first brightener solution to obtain a cylinder opening agent solution.

[0096] In some other embodiments, step S22 is: mixing the polypeptide, the surfactant and water to obtain a second brightener solution, and mixing the second brightener solution with the first brightener solution to obtain a cylinder opening agent solution.

[0097] In some embodiments, after obtaining the copper-tin composite plating solution, the method further includes: adding the workpiece to be plated into the copper-tin composite plating solution, pre-electroplating the workpiece to be plated, and allowing the impurity metal in the plating solution to be electroplated onto the workpiece to be plated, so as to purify the copper-tin composite plating solution, so that the copper-tin composite plating solution reaches a better state, so that the copper-tin alloy coating prepared by the copper-tin composite plating solution has higher brightness and stronger corrosion resistance.

[0098] It can be understood that the part to be plated can be a known part to be plated for electroplating a copper-tin alloy coating, or it can be conductive waste that can be electroplated, etc., to save costs.

[0099] In some embodiments, during the pre-electroplating, the current density of the cathode is 1 to 3 A / dm 2 , for example 1A / dm 2 , 1.5A / dm 2 , 2A / dm 2 , 2.5A / dm 2 、3A / dm 2 The current density of the anode is 2~6A / dm 2 , for example, 2A / dm 2 , 2.5A / dm 2 、3A / dm 2 、3.5A / dm 2 , 4A / dm2 , 4.5A / dm 2 , 5A / dm 2 , 5.5A / dm 2 、6A / dm 2 In the current density range, the impure metal in the plating solution can be effectively electroplated onto the workpiece to be plated, thereby effectively purifying the copper-tin composite plating solution.

[0100] In some embodiments, the pre-plating time is 1 to 3 hours, for example, 1 hour, 1.5 hours, 2 hours, 2.5 hours, 3 hours, etc. Within the time range, combined with the current density of the anode and the cathode, the impurity metal in the plating solution can be further effectively plated onto the workpiece to be plated, thereby more effectively purifying the copper-tin composite plating solution.

[0101] In a third aspect, an embodiment of the present application further provides a plated component, comprising a conductive substrate and a copper-tin alloy coating bonded to at least one surface of the conductive substrate, wherein the copper-tin alloy coating is prepared from the copper-tin composite plating solution mentioned above through an electroplating process, or the copper-tin alloy coating is prepared from the copper-tin composite plating solution prepared by the above preparation method through an electroplating process.

[0102] In some embodiments, the material of the conductive substrate includes one or more of iron, copper, aluminum, silver, and tungsten.

[0103] In at least one embodiment, the plated component is an electrical contact conductor.

[0104] The present application is described in detail below through specific embodiments. The following embodiments are only partial embodiments of the present application and are not limitations of the present application.

[0105] Plating solution example 1

[0106] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0107] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of octadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0108] Plating solution example 2

[0109] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0110] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 20 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.03 g / L, the concentration of potassium sodium tartrate is 0.18 g / L, the concentration of octadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0111] The difference between this embodiment and plating solution embodiment 1 is that, in this embodiment, the concentration of cuprous cyanide is 20 g / L, the concentration of bismuth sulfate is 0.03 g / L, and the concentration of potassium sodium tartrate is 0.18 g / L.

[0112] Plating solution example 3

[0113] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0114] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 26 g / L, the concentration of sodium stannate trihydrate is 35 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of 18-peptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0115] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of cuprous cyanide is 26 g / L, and the concentration of sodium stannate trihydrate is 35 g / L.

[0116] Plating solution example 4

[0117] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0118] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.01 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of 18-peptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0119] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of bismuth sulfate is 0.01 g / L.

[0120] Plating solution example 5

[0121] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0122] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.05 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of octadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0123] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of bismuth sulfate is 0.05 g / L.

[0124] Plating solution example 6

[0125] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0126] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.04 g / L, the concentration of octadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0127] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of potassium sodium tartrate is 0.04 g / L.

[0128] Plating solution example 7

[0129] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0130] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.5 g / L, the concentration of octadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0131] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of potassium sodium tartrate is 0.5 g / L.

[0132] Plating solution example 8

[0133] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0134] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.2 g / L, the concentration of octadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0135] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of potassium sodium tartrate is 0.2 g / L.

[0136] Plating solution example 9

[0137] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0138] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.14 g / L, the concentration of octadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0139] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of potassium sodium tartrate is 0.14 g / L.

[0140] Plating solution example 10

[0141] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0142] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of 18-peptide is 0.1 g / L, and the concentration of OP-10 is 0.2 g / L.

[0143] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of 18-peptide is 0.1 g / L.

[0144] Plating solution example 11

[0145] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0146] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of 18-peptide is 0.4 g / L, and the concentration of OP-10 is 0.2 g / L.

[0147] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of 18-peptide is 0.4 g / L.

[0148] Plating solution example 12

[0149] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0150] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of 18-peptide is 0.22 g / L, and the concentration of OP-10 is 0.2 g / L.

[0151] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of 18-peptide is 0.22 g / L.

[0152] Plating solution example 13

[0153] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0154] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of 18-peptide is 0.24 g / L, and the concentration of OP-10 is 0.2 g / L.

[0155] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of 18-peptide is 0.24 g / L.

[0156] Plating solution example 14

[0157] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0158] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of 18-peptide is 0.2 g / L, and the concentration of OP-10 is 0.1 g / L.

[0159] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of OP-10 is 0.1 g / L.

[0160] Plating solution example 15

[0161] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0162] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of octadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.8 g / L.

[0163] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of OP-10 is 0.8 g / L.

[0164] Plating solution example 16

[0165] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0166] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of 18-peptide is 0.2 g / L, and the concentration of OP-10 is 0.34 g / L.

[0167] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of OP-10 is 0.34 g / L.

[0168] Plating solution example 17

[0169] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0170] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of octadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.48 g / L.

[0171] The difference between this embodiment and plating solution embodiment 1 is that in this embodiment, the concentration of OP-10 is 0.48 g / L.

[0172] Plating solution example 18

[0173] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, antimony sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0174] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of antimony sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of 18-peptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0175] Plating solution example 19

[0176] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, indium sulfate, potassium sodium tartrate, octadecapeptide, OP-10 and water.

[0177] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of indium sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of octadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0178] Plating solution example 20

[0179] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, indium sulfate, potassium sodium tartrate, hexadecapeptide, OP-10 and water.

[0180] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of indium sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of hexadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0181] Plating Solution Example 21

[0182] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, indium sulfate, potassium sodium tartrate, hexadecapeptide, OP-7 and water.

[0183] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of indium sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of hexadecapeptide is 0.2 g / L, and the concentration of OP-7 is 0.2 g / L.

[0184] Plating solution example 22

[0185] The copper-tin composite plating solution of this embodiment includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, indium sulfate, potassium sodium tartrate, hexadecapeptide, OP-20 and water.

[0186] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of indium sulfate is 0.02 g / L, the concentration of potassium sodium tartrate is 0.08 g / L, the concentration of hexadecapeptide is 0.2 g / L, and the concentration of OP-20 is 0.2 g / L.

[0187] Plating solution comparative example 1

[0188] The copper-tin composite plating solution of this comparative example comprises cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate and water.

[0189] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, and the concentration of bismuth sulfate is 0.02 g / L.

[0190] The difference between this comparative example and Example 1 is that the copper-tin composite plating solution of this comparative example does not include potassium sodium tartrate, octadecapeptide and OP-10 in the copper-tin composite plating solution of Plating Solution Example 1.

[0191] Plating solution comparative example 2

[0192] The copper-tin composite plating solution of this comparative example comprises cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, potassium sodium tartrate and water.

[0193] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, and the concentration of potassium sodium tartrate is 0.08 g / L.

[0194] The difference between this comparative example and Example 1 is that the copper-tin composite plating solution of this comparative example does not include bismuth sulfate, octadecapeptide and OP-10 in the copper-tin composite plating solution of Plating Solution Example 1.

[0195] Plating solution comparative example 3

[0196] The copper-tin composite plating solution of this comparative example comprises cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, octadecapeptide and water.

[0197] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, and the concentration of 18-peptide is 0.2 g / L.

[0198] The difference between this comparative example and Example 1 is that the copper-tin composite plating solution of this comparative example does not include bismuth sulfate, potassium sodium tartrate and OP-10 in the copper-tin composite plating solution of Plating Solution Example 1.

[0199] Plating solution comparative example 4

[0200] The copper-tin composite plating solution of this comparative example includes cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, OP-10 and water.

[0201] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, and the concentration of OP-10 is 0.2 g / L.

[0202] The difference between this comparative example and Example 1 is that the copper-tin composite plating solution of this comparative example does not include bismuth sulfate, potassium sodium tartrate and octadecapeptide in the copper-tin composite plating solution of Plating Solution Example 1.

[0203] Plating solution comparative example 5

[0204] The copper-tin composite plating solution of this comparative example comprises cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, octadecapeptide, OP-10 and water.

[0205] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of octadecapeptide is 0.2 g / L, and the concentration of OP-10 is 0.2 g / L.

[0206] The difference between this comparative example and Example 1 is that the copper-tin composite plating solution of this comparative example does not include bismuth sulfate and potassium sodium tartrate in the copper-tin composite plating solution of Plating Solution Example 1.

[0207] Plating solution comparative example 6

[0208] The copper-tin composite plating solution of this comparative example comprises cuprous cyanide, sodium stannate trihydrate, potassium cyanide, potassium hydroxide, potassium pyrophosphate, bismuth sulfate, potassium sodium tartrate and water.

[0209] In the copper-tin composite plating solution, the concentration of cuprous cyanide is 28 g / L, the concentration of sodium stannate trihydrate is 48 g / L, the concentration of potassium cyanide is 29 g / L, the concentration of potassium hydroxide is 10 g / L, the concentration of potassium pyrophosphate is 40 g / L, the concentration of bismuth sulfate is 0.02 g / L, and the concentration of potassium sodium tartrate is 0.08 g / L.

[0210] The difference between this comparative example and Example 1 is that the copper-tin composite plating solution of this comparative example does not include the octadecapeptide and OP-10 in the copper-tin composite plating solution of Plating Solution Example 1.

[0211] Plated Example 1

[0212] The plated part of this embodiment includes a copper substrate and a copper-tin alloy plating layer bonded to the surface of the copper substrate. The copper-tin alloy plating layer is obtained by electroplating the copper-tin composite plating solution of Plating Solution Example 1 on the surface of the copper substrate.

[0213] Plated Parts Examples 2 to 22

[0214] Plated component embodiments 2 to 22 are substantially the same as plated component embodiment 1, except that the copper-tin alloy plating layers of plated component embodiments 2 to 22 use the copper-tin composite plating solutions of plating solution embodiments 2 to 22, respectively.

[0215] Plated Comparative Examples 1 to 6

[0216] The plated parts of comparative examples 1 to 6 are basically the same as the plated parts of embodiment 1, except that the copper-tin alloy plating layers of the plated parts of comparative examples 1 to 6 use the copper-tin composite plating solutions of plating solution comparative examples 1 to 6, respectively.

[0217] The brightness of the coatings of the plated parts of Examples 1 to 22 and Comparative Examples 1 to 6 was observed, and the corrosion resistance of the copper-tin alloy coatings of the plated parts of Examples 1 to 22 and Comparative Examples 1 to 6 was tested. The observation and test results are shown in Table 1.

[0218] Among them, the corrosion resistance test method is: place the plated part in a closed environment, then pass atomized sodium chloride into the closed environment, observe the time from the start of the test to the start of the production of verdigris on the copper substrate of the plated part, and obtain the salt spray resistance time of the copper-tin alloy coating.

[0219] Table 1:

[0220]

[0221]

[0222] From Table 1 we can see that:

[0223] Compared with the copper-tin alloy coatings of the plated comparative examples 1 to 6, the copper-tin alloy coatings of the plated examples 1 to 22 have stronger corrosion resistance and higher brightness. It can be seen that the copper-tin alloy coatings prepared by the composite plating solution of the present application can have higher brightness and stronger corrosion resistance.

[0224] The salt spray resistance time of the copper-tin alloy coatings of Examples 2, 4-5 is shorter than that of Example 1, and the salt spray resistance time of the copper-tin alloy coatings of Examples 6-7 is shorter than that of Examples 1, 8-9. It can be seen that in the first brightener, when the mass ratio of the bismuth sulfate to the potassium sodium tartrate is 1: (4-10), a better corrosion resistance effect can be achieved;

[0225] The salt spray resistance time of the copper-tin alloy coating of Examples 10 to 11 is shorter than that of Examples 1 and 12 to 13, and the salt spray resistance time of the copper-tin alloy coating of Examples 14 to 15 is shorter than that of Examples 1 and 16 to 17. It can be seen that in the second brightener, when the mass ratio of the 18-peptide to the OP-10 is (5 to 6): (5 to 12), a better corrosion resistance effect can be achieved.

[0226] The technical solutions provided by the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A copper-tin composite plating solution, characterized in that It includes copper salt, stannate, cyanide, hydroxide, complexing agent, tank opening agent and water, wherein the tank opening agent includes a first brightener and a second brightener, the first brightener includes metal sulfate and potassium sodium tartrate, and the second brightener includes a polypeptide and a surfactant.

2. The copper-tin composite plating solution according to claim 1, characterized in that In the copper-tin composite plating solution, The concentration of the metal sulfate is 0.01 to 0.05 g / L; and / or The concentration of the potassium sodium tartrate is 0.04-0.5 g / L.

3. The copper-tin composite plating solution according to claim 1 or 2, characterized in that: In the first brightener, the mass ratio of the metal sulfate to the potassium sodium tartrate is 1:(4-10).

4. The copper-tin composite plating solution according to claim 1, characterized in that In the copper-tin composite plating solution, The concentration of the polypeptide is 0.1-0.4 g / L; and / or The concentration of the surfactant is 0.1-0.8 g / L.

5. The copper-tin composite plating solution according to claim 1 or 4, characterized in that: In the second brightener, the mass ratio of the polypeptide to the surfactant is (5-6):(5-12).

6. The copper-tin composite plating solution according to claim 1, characterized in that: In the copper-tin composite plating solution, The concentration of the copper salt is 20-35 g / L; and / or The concentration of the stannate is 35 to 55 g / L; and / or The concentration of the cyanide is 25-40 g / L; and / or The concentration of the hydroxide is 5 to 13 g / L; and / or The concentration of the complexing agent is 20-60 g / L.

7. The copper-tin composite plating solution according to claim 1, characterized in that: The metal sulfate includes one or more of bismuth sulfate, antimony sulfate and indium sulfate; and / or The polypeptide comprises one or more of dodecapeptide, tridecapeptide, tetradecapeptide, pentadecapeptide, hexadecapeptide, heptadecapeptide, octadecapeptide, nonadecapeptide, and eicocapeptide; and / or The surfactant includes one or more of OP-10, OP-7, and OP-20; and / or The copper salt comprises cuprous cyanide; and / or The stannate includes one or more of sodium stannate, potassium stannate and hydrates thereof; and / or The cyanide comprises one or more of potassium cyanide and sodium cyanide; and / or The hydroxide includes one or more of potassium hydroxide and sodium hydroxide; and / or The complexing agent includes one or more of potassium pyrophosphate and sodium pyrophosphate.

8. A method for preparing a copper-tin composite plating solution as claimed in any one of claims 1 to 7, characterized in that: include: mixing water and a hydroxide to obtain a hydroxide solution; adding cyanide to the hydroxide solution to obtain a first intermediate solution; Providing copper salt and water, mixing to obtain a paste of copper salt, adding the paste of copper salt to the first intermediate solution, reacting to obtain a second intermediate solution; adding a complexing agent to the second intermediate solution to obtain a third intermediate solution; Adding stannate to the third intermediate solution, and then adding a tank opening agent solution to obtain a copper-tin composite plating solution; The tank opening agent solution includes a tank opening agent and water, the tank opening agent includes a first brightener and a second brightener, the first brightener includes metal sulfate and potassium sodium tartrate, and the second brightener includes a polypeptide and a surfactant.

9. The preparation method according to claim 8, characterized in that: The preparation method of the cylinder opening agent solution comprises: Mixing metal sulfate, sodium potassium tartrate and water to obtain a first brightener solution; The polypeptide and the surfactant are added into the first brightener solution to obtain the cylinder opening agent solution.

10. The preparation method according to claim 8, characterized in that: After obtaining the copper-tin composite plating solution, the method further comprises: adding the to-be-plated parts into the copper-tin composite plating solution for pre-electroplating, wherein: During pre-plating, the cathode current density is 1 to 3A / dm 2 ; and / or During pre-plating, the current density of the anode is 2 to 6A / dm 2 ; and / or The pre-plating time is 1 to 3 hours.

11. A plated part, comprising a conductive substrate and a copper-tin alloy plating layer bonded to at least one surface of the conductive substrate, characterized in that: The copper-tin alloy coating is prepared by electroplating the copper-tin composite plating solution described in any one of claims 1 to 7, or the copper-tin alloy coating is prepared by electroplating the copper-tin composite plating solution prepared by the preparation method described in any one of claims 8 to 10.

12. The plated article according to claim 11, characterized in that: The plated component is an electrical contact conductor; and / or The material of the conductive substrate includes one or more of iron, copper, aluminum, silver, and tungsten.

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