Semiconductor test packaging sealing detection device

By using a negative pressure box and a detection mechanism in the packaging bag seal detection device, the packaging damage is detected by negative pressure and liquid circulation, and the problem of difficulty in detecting tiny gaps or damage in the prior art is solved, and higher detection accuracy and efficiency are achieved.

CN119915441AActive Publication Date: 2025-05-02SUZHOU OUYIMU SEMICON EQUIP TECH CO LTD
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Patent Information

Application Number
CN202510362374.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-26
Publication Date
2025-05-02
Estimated Expiration
2045-03-26

AI Technical Summary

Technical Problem

Existing packaging bag sealing detection devices are difficult to accurately detect tiny gaps or damage, resulting in incomplete detection.

Method used

A semiconductor test package seal detection device is designed, using a negative pressure box and a detection mechanism to detect damage by entering the packaging under a negative pressure state, and to achieve detection by airflow refueling and liquid recycling.

Benefits of technology

Accurate detection of slight damage to the packaging bag, and can detect that even slight damage can be introduced into the packaging of liquid, improving the accuracy and efficiency of the inspection.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the field of packaging bag sealing detection, and discloses a semiconductor test packaging sealing detection device which comprises a negative pressure box and a detection mechanism arranged in the negative pressure box, the detection mechanism comprises a sliding transverse plate arranged in the negative pressure box, a liquid storage assembly is arranged above the sliding transverse plate, a telescopic electric cylinder is arranged above the sliding transverse plate, and the telescopic electric cylinder is connected with the negative pressure box. The packages are placed in the containing grooves respectively, the air pump extracts air in the negative pressure box through the connecting pipeline, if the packages of the semiconductor products are not damaged, the packages can break down, and if the packages of the semiconductor products are damaged, the packages which are not damaged swell greatly or even do not swell. The valve between the liquid storage shell and the liquid storage tank is opened, after liquid enters the containing tank and the liquid storage tank, due to the fact that the pressure outside a package is lower than the pressure inside the package, the package is damaged, the liquid can be sucked into the package, and bubbles can occur, and due to the fact that the low pressure outside tries to balance the high pressure inside the package.
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Description

Technical Field

[0001] The invention relates to the technical field of packaging bag sealing detection, in particular to a semiconductor test package sealing detection device. Background Art

[0002] In the patent application with application publication number CN222144420U, it includes a detection box, a hinge is fixedly provided on the front side of the detection box, a box cover is hingedly provided on the surface of the detection box through the hinge, an auxiliary support assembly is provided at the bottom of the box cover, a mounting frame is overlapped on the top of the box cover, the mounting frame is connected to the box cover through bolts, and a mounting plate is fixedly provided inside the mounting frame. Through the arrangement of the box cover, the mounting frame, the mounting plate, the lower fixed magnet, the upper fixed magnet, the movable plate and the vacuum assembly, it is convenient to detect the sealing of multiple packaging bags at the same time, avoiding the reduction of the packaging bag detection speed due to the sealing of only one packaging bag at a time, thereby accelerating the packaging bag detection speed, and the lower fixed magnet and the upper fixed magnet are used to clamp the side of the packaging bag, avoiding the obstruction of the packaging bag surface and causing errors in the detection results.

[0003] In the above-mentioned patent, if there is a tiny gap in the package, it will still not be detected, and it is impossible to accurately detect whether the product package is damaged. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor test package sealing detection device to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the technical solution of the present invention is: a semiconductor test package sealing detection device, comprising a negative pressure box and a detection mechanism arranged in the negative pressure box, the detection mechanism comprising a sliding horizontal plate arranged in the negative pressure box, a liquid storage component is arranged above the sliding horizontal plate, and a telescopic electric cylinder for moving the sliding horizontal plate up and down in the negative pressure box is arranged above the sliding horizontal plate; The liquid storage assembly includes six liquid storage shells fixedly arranged above the sliding horizontal plate, a connecting horizontal tube is fixedly arranged between every two adjacent liquid storage shells, a connecting hose is fixedly arranged on the outer side of one of the connecting horizontal tubes, and air holes are opened above the multiple connecting horizontal tubes.

[0006] Preferably, a plurality of exhaust pipes are fixedly arranged above the sliding horizontal plate, two sliding circular grooves are provided on the sliding horizontal plate, two vertical rods are slidably connected inside the sliding circular grooves, the lower ends of the vertical rods are fixedly connected to the lower part of the negative pressure box, a plurality of liquid storage tanks are provided below the sliding horizontal plate, the position of each liquid storage tank corresponds to the position of the liquid storage shell, a rubber pad is fixedly arranged on the outside of the liquid storage tank, a fixed shell is fixedly connected to one side of the inside of the liquid storage tank, an interception line is provided on one side of the fixed shell, and one end of the interception line is fixedly connected to a side of the inside of the liquid storage tank away from the fixed shell.

[0007] Preferably, a winding rod and a sensor are provided inside the fixed shell, one end of the intercepting wire is fixedly provided on the winding rod inside the fixed shell, and a torsion spring is provided between the winding rod and the fixed shell.

[0008] Preferably, the exhaust pipe is connected to the liquid storage tank, the liquid storage shell is connected to the liquid storage tank, a water stop valve is provided at the connection between the liquid storage shell and the liquid storage tank, and the exhaust pipe is connected to the inside of the liquid storage tank.

[0009] Preferably, a revolving door is rotatably provided on one side of the negative pressure box, a plurality of legs are fixedly connected to the bottom of the negative pressure box, an air pump is fixedly provided on one side above the negative pressure box, and a reflux assembly is provided on one side of the negative pressure box.

[0010] Preferably, an observation glass is fixedly provided on the rotating door, a connecting pipe is fixedly provided on one side of the air pump, the other end of the connecting pipe is fixedly connected to the negative pressure box, and the connecting pipe is connected through the inside of the negative pressure box.

[0011] Preferably, the reflux assembly includes a water pump fixedly connected to one side of the negative pressure tank, a connecting elbow fixedly connected to one side of the water pump, the other end of the connecting elbow fixedly connected to the top of the negative pressure tank, the connecting elbow penetrates the negative pressure tank and is connected to the connecting hose, the other side of the water pump is fixedly connected to a connecting vertical pipe, a valve is provided inside the connecting vertical pipe, one end of the connecting vertical pipe is fixedly connected to a U-shaped tube, a plurality of connecting short tubes are provided on the U-shaped tube, the U-shaped tube is fixedly connected to the negative pressure tank through the plurality of connecting short tubes, and the U-shaped tube is located directly below the negative pressure tank.

[0012] Preferably, a plurality of placement grooves are provided at the lower part of the negative pressure box, the placement grooves correspond to the positions of the liquid storage tanks, a drainage groove is provided at the lower part of the placement grooves, a protrusion is fixedly provided on the outside of the drainage groove, and the drainage groove is connected to the U-shaped tube through a connecting short tube.

[0013] Preferably, a pressure gauge for detecting the air pressure in the negative pressure box is provided above the negative pressure box, a pressure relief assembly for pressure relief is provided on the negative pressure box, and a threaded groove is provided on the negative pressure box.

[0014] Preferably, the pressure relief assembly includes a threaded rod threadedly connected to a threaded groove on the negative pressure box, a handle is fixedly connected to the upper end of the threaded rod, a ventilation groove is opened inside the threaded rod, a ventilation hole is opened on the outside of the threaded rod, and the ventilation hole is through-connected with the ventilation groove.

[0015] Compared with the prior art, the technical solution of the present invention has the following advantages: (1) A placement slot and a sliding horizontal plate are provided in the negative pressure box. By placing the packages in the placement slots respectively, the telescopic electric cylinder drives the sliding horizontal plate to move downward, so that the packages are placed in the placement slots and the liquid storage tank. At this time, the interception line is located above the packages, the rotating door is closed, and the air pump extracts the air in the negative pressure box through the connecting pipe, so that the negative pressure box is in a negative pressure state. If the semiconductor product package is not damaged, the package will fail. When the semiconductor product package is damaged, the package will swell more than the damaged package, or even not swell. The valve between the liquid storage shell and the liquid storage tank is opened, and the liquid enters the placement slot and the liquid storage tank. Since the pressure outside the package is lower than the internal pressure, the package is damaged, and the liquid will be sucked into the package, and bubbles will appear, because the low pressure outside tries to balance the higher pressure inside. (2) Turn the handle so that the handle drives the threaded rod upward. After the vent hole is exposed from the threaded groove on the negative pressure box, the air flows into the vent groove through the vent hole, and the air pressure in the negative pressure box returns to normal. The air pressure in the placement tank and the liquid storage tank also returns to normal. The package will slowly return to its original state. There will be no abnormality in the undamaged package. For the package with slight damage, at this time, because the external pressure is higher than the pressure inside the package, the air flow will be backflowed and bring in some liquid. After the test, it can be seen whether the package is damaged by observing whether there is liquid in the package. Even the slight damage liquid can be detected. After the test is completed, the valve is opened, and the water pump extracts the liquid in the placement tank and the liquid storage tank through the connecting vertical pipe and the U-shaped pipe, so that the liquid enters the connecting hose from the connecting elbow, and then is injected from the connecting hose into the connecting horizontal pipe. The connecting horizontal pipe is used to inject the replenishing liquid into multiple liquid storage shells to achieve liquid recycling. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure of the negative pressure box of the present invention; Figure 3 It is a schematic diagram of the structure of the barometer of the present invention; Figure 4 It is a schematic diagram of the structure of the reflux component of the present invention; Figure 5 It is a schematic diagram of the planar structure of the reflux component of the present invention; Figure 6 This is a schematic diagram of the placement slot structure of the present invention; Figure 7 It is a schematic diagram of the structure of the pressure relief assembly of the present invention; Figure 8 It is a schematic diagram of the structure of the detection mechanism of the present invention; Fig. 9 This is a schematic diagram of the structure of the liquid storage component of the present invention; Fig.10 This is a schematic diagram of the structure of the sliding horizontal plate of the present invention; Fig.11 It is a schematic diagram of the sliding horizontal plate flipping structure of the present invention.

[0017] In the figure: 1, negative pressure box; 11, revolving door; 111, observation glass; 12, support leg; 13, air pump; 131, connecting pipe; 14, reflux assembly; 141, water pump; 142, connecting elbow; 143, connecting vertical pipe; 144, U-shaped pipe; 145, valve; 15, pressure gauge; 16, pressure relief assembly; 161, threaded rod; 162, handle; 163, ventilation groove; 164, ventilation hole; 1 7. Placement groove; 171. Drain groove; 172. Bump; 2. Detection mechanism; 21. Sliding horizontal plate; 211. Exhaust pipe; 212. Sliding circular groove; 213. Vertical rod; 214. Rubber pad; 215. Liquid storage tank; 216. Fixed shell; 217. Intercept line; 22. Liquid storage assembly; 221. Liquid storage shell; 222. Connecting horizontal pipe; 223. Connecting hose; 224. Air hole; 23. Telescopic electric cylinder. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0019] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. "Include" or "comprise" and other similar words used in the present disclosure mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and other similar words are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0020] like Figures 1 to 11As shown, a semiconductor test package sealing detection device provided by the present invention comprises a negative pressure box 1 and a detection mechanism 2 arranged in the negative pressure box 1, the detection mechanism 2 comprises a sliding horizontal plate 21 arranged in the negative pressure box 1, a liquid storage component 22 is arranged above the sliding horizontal plate 21, a telescopic electric cylinder 23 for moving the sliding horizontal plate 21 up and down in the negative pressure box 1 is arranged above the sliding horizontal plate 21, and the sliding horizontal plate 21 is made of a transparent acrylic plate as a whole; The liquid storage assembly 22 includes six liquid storage shells 221 fixedly arranged above the sliding horizontal plate 21. The liquid storage shells 221 are filled with liquid, which can be pure water or insulating coolant, etc. A connecting horizontal tube 222 is fixedly arranged between every two adjacent liquid storage shells 221. A connecting hose 223 is fixedly arranged on the outside of one of the connecting horizontal tubes 222, and air holes 224 are opened above the multiple connecting horizontal tubes 222.

[0021] A plurality of exhaust pipes 211 are fixedly arranged above the sliding horizontal plate 21, and the exhaust pipes 211 are used to discharge the gas below the sliding horizontal plate 21 so that the pressure above the sliding horizontal plate 21 is the same as the pressure below the sliding horizontal plate 21. Two sliding circular grooves 212 are provided on the sliding horizontal plate 21, and two vertical rods 213 are slidably connected inside the sliding circular grooves 212. The lower ends of the vertical rods 213 are fixedly connected to the lower part of the negative pressure box 1. A plurality of liquid storage tanks 215 are provided below the sliding horizontal plate 21, and the position of each liquid storage tank 215 corresponds to the position of the liquid storage shell 221. A rubber pad 214 is fixedly arranged on the outside of the liquid storage tank 215, and a fixed shell 216 is fixedly connected to one side of the inside of the liquid storage tank 215. An interception line 217 is provided on one side of the fixed shell 216, and one end of the interception line 217 is fixedly connected to the side of the inside of the liquid storage tank 215 away from the fixed shell 216.

[0022] A winding rod and a sensor are provided inside the fixed shell 216. The sensor is used to detect the number of rotations of the winding rod and upload it to the terminal. One end of the interception line 217 is fixedly set on the winding rod inside the fixed shell 216, and a torsion spring is set between the winding rod and the fixed shell 216.

[0023] The exhaust pipe 211 is connected to the liquid storage tank 215 , the liquid storage shell 221 is connected to the liquid storage tank 215 , a water stop valve is provided at the connection between the liquid storage shell 221 and the liquid storage tank 215 , and the exhaust pipe 211 is connected to the inside of the liquid storage tank 215 .

[0024] A rotating door 11 is rotatably provided on one side of the negative pressure box 1 , a plurality of legs 12 are fixedly connected to the bottom of the negative pressure box 1 , an air pump 13 is fixedly provided on one side above the negative pressure box 1 , and a reflux component 14 is provided on one side of the negative pressure box 1 .

[0025] An observation glass 111 is fixedly provided on the rotating door 11, an observation glass 111 is fixedly provided on the other side of the negative pressure box 1, a connecting pipe 131 is fixedly provided on one side of the air pump 13, the other end of the connecting pipe 131 is fixedly connected to the negative pressure box 1, and the connecting pipe 131 is connected to the inside of the negative pressure box 1.

[0026] The reflux component 14 includes a water pump 141 fixedly connected to one side of the negative pressure tank 1, a connecting elbow 142 fixedly connected to one side of the water pump 141, the other end of the connecting elbow 142 fixedly connected to the top of the negative pressure tank 1, the connecting elbow 142 penetrates the negative pressure tank 1 and is connected to the connecting hose 223, and a connecting vertical pipe 143 is fixedly connected to the other side of the water pump 141, a valve 145 is arranged inside the connecting vertical pipe 143, and a U-shaped tube 144 is fixedly connected to one end of the connecting vertical pipe 143, a plurality of connecting short tubes are arranged on the U-shaped tube 144, the U-shaped tube 144 is fixedly connected to the negative pressure tank 1 through the plurality of connecting short tubes, and the U-shaped tube 144 is located directly below the negative pressure tank 1.

[0027] A plurality of placement grooves 17 are provided at the lower part of the negative pressure box 1, and the placement grooves 17 correspond to the positions of the liquid storage grooves 215. A drainage groove 171 is provided at the lower part of the placement grooves 17, and a protrusion 172 is fixedly provided on the outside of the drainage groove 171. The drainage groove 171 is connected to the U-shaped tube 144 through a connecting short tube.

[0028] A pressure gauge 15 for detecting the air pressure in the negative pressure box 1 is also arranged above the negative pressure box 1 , a pressure relief assembly 16 for pressure relief is arranged on the negative pressure box 1 , and a threaded groove is arranged on the negative pressure box 1 , which runs through the negative pressure box 1 .

[0029] The pressure relief assembly 16 includes a threaded rod 161 threadedly connected to a threaded groove on the negative pressure box 1, a handle 162 is fixedly connected to the upper end of the threaded rod 161, a ventilation groove 163 is opened inside the threaded rod 161, a ventilation hole 164 is opened on the outside of the threaded rod 161, and the ventilation hole 164 is connected with the ventilation groove 163.

[0030] The working principle of the present invention is as follows: when testing the packaged semiconductor products, the packages are placed in the placement slots 17 respectively. At this time, the output end of the telescopic electric cylinder 23 moves downward, and the output end of the telescopic electric cylinder 23 drives the sliding horizontal plate 21 to move downward. The sliding horizontal plate 21 drives the liquid storage tank 215 to contact the lower part of the negative pressure box 1, so that the package is in the placement slot 17 and the liquid storage tank 215. At this time, the interception line 217 is located above the package, the rotating door 11 is closed, and the air pump 13 starts to work, and the air in the negative pressure box 1 is extracted through the connecting pipe 131, so that the negative pressure box 1 is in a negative pressure state, and the barometer 15 is observed. When the negative pressure is appropriate, the air pump 13 is stopped; When the air pump 13 extracts the air in the negative pressure box 1, the air in the placement tank 17 and the liquid storage tank 215 is discharged from the exhaust pipe 211, so that the liquid storage tank 215 and the placement tank 17 are also in a negative pressure state. If the packaging of the semiconductor product is not damaged, the packaging will malfunction. When the packaging of the semiconductor product is damaged, the packaging will not swell as much as the undamaged packaging, and may not even swell. The valve between the liquid storage shell 221 and the liquid storage tank 215 opens, and the liquid in the liquid storage shell 221 flows into the liquid storage tank 215, and the liquid does not fill the placement tank 17 and the liquid storage tank 215, and part of the packaging leaks out. When the liquid enters the placement tank 17 and the liquid storage tank 215, since the pressure outside the packaging is lower than the internal pressure, the packaging is damaged, the liquid will be sucked into the packaging, and bubbles will appear. Bubbles can be observed through the observation glass 111 and the sliding cross plate 21, because the low pressure outside tries to balance the higher pressure inside. Then, the handle 162 is turned to make the handle 162 drive the threaded rod 161 upward. After the vent hole 164 is exposed from the threaded groove on the negative pressure box 1, the airflow enters the vent groove 163 through the vent hole 164, and then enters the negative pressure box 1. At this time, the air pressure in the negative pressure box 1 returns to normal, and the air pressure in the placement tank 17 and the liquid storage tank 215 also returns to normal. The package will slowly return to its original state. There will be no abnormality for the undamaged package. For the package with slight damage, at this time, because the external pressure is higher than the pressure inside the package, the airflow will be backfilled and bring in some liquid. After the test, it can be seen whether the package is damaged by observing whether there is liquid in the package. Even slight damage liquid can be detected. After the detection is completed, the valve 145 is opened, and the water pump 141 extracts the liquid in the placement tank 17 and the liquid storage tank 215 through the connecting vertical pipe 143 and the U-shaped pipe 144, so that the liquid enters the connecting hose 223 from the connecting elbow 142, and then is injected from the connecting hose 223 into the connecting cross pipe 222, and the connecting cross pipe 222 injects the replenishing liquid into the multiple liquid storage shells 221.

[0031] The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present invention.

Claims

1. A semiconductor test package sealing detection device, comprising a negative pressure box (1) and a detection mechanism (2) arranged in the negative pressure box (1), characterized in that: The detection mechanism (2) comprises a sliding transverse plate (21) arranged in the negative pressure box (1), a liquid storage assembly (22) is arranged above the sliding transverse plate (21), and a telescopic electric cylinder (23) is arranged above the sliding transverse plate (21) for moving the sliding transverse plate (21) up and down in the negative pressure box (1); The liquid storage assembly (22) comprises six liquid storage shells (221) fixedly arranged above the sliding horizontal plate (21), a connecting horizontal tube (222) fixedly arranged between every two adjacent liquid storage shells (221), a connecting hose (223) fixedly arranged on the outside of one of the connecting horizontal tubes (222), and air holes (224) opened above the plurality of connecting horizontal tubes (222).

2. A semiconductor test package sealing detection device according to claim 1, characterized in that: A plurality of exhaust pipes (211) are fixedly arranged above the sliding horizontal plate (21), two sliding circular grooves (212) are provided on the sliding horizontal plate (21), two vertical rods (213) are slidably connected inside the sliding circular grooves (212), the lower ends of the vertical rods (213) are fixedly connected to the lower part of the negative pressure box (1), a plurality of liquid storage tanks (215) are provided below the sliding horizontal plate (21), the position of each liquid storage tank (215) corresponds to the position of the liquid storage shell (221), a rubber pad (214) is fixedly arranged on the outside of the liquid storage tank (215), a fixed shell (216) is fixedly connected to one side of the liquid storage tank (215), an interception line (217) is provided on one side of the fixed shell (216), and one end of the interception line (217) is fixedly connected to a side of the liquid storage tank (215) away from the fixed shell (216).

3. A semiconductor test package sealing detection device according to claim 2, characterized in that: A winding rod and a sensor are arranged inside the fixed shell (216); one end of the interception wire (217) is fixedly arranged on the winding rod inside the fixed shell (216); and a torsion spring is arranged between the winding rod and the fixed shell (216).

4. A semiconductor test package sealing detection device according to claim 3, characterized in that: The exhaust pipe (211) is in communication with the liquid storage tank (215), the liquid storage shell (221) is in communication with the liquid storage tank (215), a water stop valve is provided at the connection point between the liquid storage shell (221) and the liquid storage tank (215), and the exhaust pipe (211) is in communication with the inside of the liquid storage tank (215).

5. A semiconductor test package sealing detection device according to claim 4, characterized in that: A rotating door (11) is rotatably provided on one side of the negative pressure box (1), a plurality of legs (12) are fixedly connected to the bottom of the negative pressure box (1), an air pump (13) is fixedly provided on one side of the top of the negative pressure box (1), and a reflux assembly (14) is provided on one side of the negative pressure box (1).

6. The semiconductor test package sealing detection device according to claim 5, characterized in that: An observation glass (111) is fixedly provided on the rotating door (11), a connecting pipe (131) is fixedly provided on one side of the air pump (13), the other end of the connecting pipe (131) is fixedly connected to the negative pressure box (1), and the connecting pipe (131) is connected to the inside of the negative pressure box (1).

7. A semiconductor test package sealing detection device according to claim 6, characterized in that: The reflux assembly (14) comprises a water pump (141) fixedly connected to one side of the negative pressure box (1); a connecting elbow (142) is fixedly connected to one side of the water pump (141); the other end of the connecting elbow (142) is fixedly connected to the top of the negative pressure box (1); the connecting elbow (142) passes through the negative pressure box (1) and is connected to the connecting hose (223); the other side of the water pump (141) is fixedly connected to a connecting vertical pipe (143); a valve (145) is provided inside the connecting vertical pipe (143); one end of the connecting vertical pipe (143) is fixedly connected to a U-shaped pipe (144); a plurality of connecting short pipes are provided on the U-shaped pipe (144); the U-shaped pipe (144) is fixedly connected to the negative pressure box (1) via the plurality of connecting short pipes; the U-shaped pipe (144) is located directly below the negative pressure box (1).

8. The semiconductor test package sealing detection device according to claim 7, characterized in that: A plurality of placement grooves (17) are provided at the lower part of the negative pressure box (1), the placement grooves (17) corresponding to the positions of the liquid storage grooves (215), a drainage groove (171) is provided at the lower part of the placement grooves (17), a protrusion (172) is fixedly provided on the outer side of the drainage groove (171), and the drainage groove (171) is connected to the U-shaped tube (144) via a connecting short tube.

9. The semiconductor test package sealing detection device according to claim 8, characterized in that: A pressure gauge (15) for detecting the air pressure in the negative pressure box (1) is also provided above the negative pressure box (1), a pressure relief assembly (16) for pressure relief is provided on the negative pressure box (1), and a threaded groove is provided on the negative pressure box (1).

10. The semiconductor test package sealing detection device according to claim 9, characterized in that: The pressure relief assembly (16) comprises a threaded rod (161) threadedly connected to a threaded groove on the negative pressure box (1); a handle (162) is fixedly connected to the upper end of the threaded rod (161); a ventilation groove (163) is provided inside the threaded rod (161); a ventilation hole (164) is provided on the outer side of the threaded rod (161); and the ventilation hole (164) is connected to the ventilation groove (163).

Citation Information

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