A method, device, electronic device and storage medium for monitoring a lithium plating layer of a reference electrode

Abstract

The present invention discloses a method, device, electronic device and storage medium for monitoring the lithium plating layer of a reference electrode. The method for monitoring the lithium plating layer of a reference electrode includes: obtaining voltage data during the preparation process of the reference electrode and voltage data during the storage process of the reference electrode under different lithium plating influencing factors; establishing a reference electrode standard library according to the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode under different lithium plating influencing factors; obtaining voltage monitoring data of the reference electrode being monitored; comparing the voltage monitoring data with the voltage data in the reference electrode standard library, and evaluating the reference electrode being monitored according to the comparison result. The present invention can determine whether the quality of the lithium plating layer of the reference electrode is good, and has the advantages of simple operation, high recognition and low cost.

Description

Technical Field

[0001] The present invention relates to the technical field of reference electrodes, and in particular, to a method, device, electronic device and storage medium for monitoring a lithium plating layer of a reference electrode. Background Art

[0002] The use of reference electrode technology can obtain information on positive and negative potentials and guide the formulation of fast charging strategy solutions. However, during the use process, the lithium plating layer in the reference electrode is often unstable, resulting in premature failure and affecting the test results. Therefore, it is particularly important to identify the quality of the lithium plating layer in the initially formed reference electrode.

[0003] In the prior art, it is generally necessary to disassemble the battery to take out the reference electrode for morphological characterization of the quality of the lithium plating layer. The operation is complex, and the original structure of the battery is damaged, resulting in inability to be reused, and the evaluation cost is relatively high. Summary of the Invention

[0004] The present invention provides a method, device, electronic device and storage medium for monitoring a lithium plating layer of a reference electrode, so as to determine whether the quality of the lithium plating layer of the reference electrode is good with simple operation and low cost.

[0005] According to an aspect of the present invention, there is provided a method for monitoring a lithium plating layer of a reference electrode, the method for monitoring a lithium plating layer of a reference electrode including:

[0006] Obtaining voltage data during the preparation process of the reference electrode and voltage data during the shelving process of the reference electrode under different lithium plating influencing factors;

[0007] Establishing a reference electrode standard library according to the voltage data during the preparation process of the reference electrode and the voltage data during the shelving process of the reference electrode under different lithium plating influencing factors;

[0008] Obtaining voltage monitoring data of the reference electrode being monitored;

[0009] Comparing the voltage monitoring data with the voltage data in the reference electrode standard library, and evaluating the reference electrode being monitored according to the comparison result.

[0010] Further, the lithium plating influencing factors include excessive charging current during the lithium plating process of the reference electrode, rough surface of the reference electrode, and impurities in the reference electrode electrolyte.

[0011] Further, establishing a reference electrode standard library according to the voltage data during the preparation process of the reference electrode and the voltage data during the shelving process of the reference electrode under different lithium plating influencing factors includes:

[0012] Determine the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the storage process based on the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode;

[0013] Establish a reference electrode standard library based on the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the storage process.

[0014] Furthermore, establish a reference electrode standard library based on the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the storage process, including:

[0015] Determine the lithium plating nucleation potential according to the corresponding relationship between the reference voltage and time during the preparation process;

[0016] Determine the average depolarization rate according to the corresponding relationship between the reference voltage and time during the storage process;

[0017] Establish a reference electrode standard library based on the lithium plating nucleation potential and the average depolarization rate.

[0018] Furthermore, based on the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode, determine the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the storage process. After that, it also includes:

[0019] Determine the corresponding relationship between the first-order potential and time during the preparation process according to the corresponding relationship between the reference voltage and time during the preparation process of the reference electrode;

[0020] Determine the corresponding relationship between the first-order potential and time during the storage process according to the corresponding relationship between the reference voltage and time during the storage process of the reference electrode.

[0021] Furthermore, the depolarization rate is determined according to the reference voltage data at the end of the preparation, the reference voltage data at the beginning of the preparation, and the preparation time.

[0022] According to another aspect of the present invention, there is provided a device for monitoring the lithium plating layer of a reference electrode. The device for monitoring the lithium plating layer of a reference electrode includes:

[0023] A voltage data acquisition module, configured to acquire the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode under different lithium plating influencing factors;

[0024] A standard library establishment module, configured to establish a reference electrode standard library according to the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode under different lithium plating influencing factors;

[0025] A voltage monitoring data acquisition module, configured to acquire voltage monitoring data of a reference electrode being monitored;

[0026] An evaluation module, configured to compare the voltage monitoring data with voltage data in a reference electrode standard library, and evaluate the reference electrode being monitored according to the comparison result.

[0027] According to another aspect of the present invention, there is provided an electronic device, the electronic device comprising:

[0028] At least one processor; and

[0029] A memory communicatively connected to the at least one processor; wherein,

[0030] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for monitoring the lithium plating layer of the reference electrode according to any embodiment of the present invention.

[0031] According to another aspect of the present invention, there is provided a computer-readable storage medium storing computer instructions for causing a processor to implement the method for monitoring the lithium plating layer of the reference electrode according to any embodiment of the present invention when executed.

[0032] According to another aspect of the present invention, there is provided a computer program product comprising a computer program which, when executed by a processor, implements the method for monitoring the lithium plating layer of the reference electrode according to any embodiment of the present invention.

[0033] The method for monitoring the lithium plating layer of the reference electrode provided by the embodiments of the present invention acquires voltage data during the preparation process of the reference electrode and voltage data during the storage process of the reference electrode under different lithium plating influencing factors, and establishes a reference electrode standard library according to the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode under different lithium plating influencing factors. Then, voltage monitoring data of the reference electrode being monitored is acquired, the voltage monitoring data is compared with the voltage data in the reference electrode standard library, and the reference electrode being monitored is evaluated according to the comparison result. Compared with the prior art in which the battery needs to be disassembled to take out the reference electrode for morphological characterization of the quality of the lithium plating layer, the embodiments of the present invention can determine whether the quality of the lithium plating layer of the reference electrode is good only by acquiring the voltage monitoring data of the reference electrode being monitored and comparing the voltage monitoring data with the voltage data in the reference electrode standard library. The operation is simple, the recognition is high, and the cost is low.

[0034] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. Description of the Drawings

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0036] Figure 1 It is a flowchart of a method for monitoring the lithium plating layer of a reference electrode provided according to an embodiment of the present invention;

[0037] Figure 2 It is a schematic diagram of the lithium plating layer of a reference electrode under standard lithium plating parameters provided according to an embodiment of the present invention;

[0038] Figure 3 It is a schematic diagram of the lithium plating layer of a reference electrode when the charging current is too large provided according to an embodiment of the present invention;

[0039] Figure 4 It is a schematic diagram of the lithium plating layer of a reference electrode when the roughness is too large provided according to an embodiment of the present invention;

[0040] Figure 5 It is a schematic diagram of the lithium plating layer of a reference electrode when the electrolyte impurity concentration is relatively high provided according to an embodiment of the present invention;

[0041] Figure 6 It is a schematic diagram of the correspondence between the positive reference voltage and time provided according to an embodiment of the present invention;

[0042] Figure 7 It is a schematic diagram of the correspondence between the negative reference voltage and time provided according to an embodiment of the present invention;

[0043] Figure 8 It is a schematic diagram of the correspondence between the positive reference voltage and time during the storage process provided according to an embodiment of the present invention;

[0044] Figure 9 It is a schematic diagram of the correspondence between the negative reference voltage and time during the storage process provided according to an embodiment of the present invention;

[0045] Figure 10 It is a schematic diagram of the correspondence between the first-order potential of the positive electrode and time provided according to an embodiment of the present invention;

[0046] Figure 11 It is a schematic diagram showing the correspondence between the first-order potential and time of a negative electrode according to an embodiment of the present invention;

[0047] Figure 12 It is a schematic diagram showing the correspondence between the first-order potential and time of a positive electrode during storage according to an embodiment of the present invention;

[0048] Figure 13 It is a schematic diagram showing the correspondence between the first-order potential and time of a negative electrode during storage according to an embodiment of the present invention;

[0049] Figure 14 It is a schematic structural diagram of a device for monitoring the lithium plating layer of a reference electrode according to an embodiment of the present invention;

[0050] Figure 15 It shows a schematic structural diagram of an electronic device that can be used to implement the embodiments of the present invention. Detailed Embodiments

[0051] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0052] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order different from those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0053] The embodiments of the present invention provide a method for monitoring the lithium plating layer of a reference electrode, Figure 1 It is a flowchart of a method for monitoring the lithium plating layer of a reference electrode according to an embodiment of the present invention. Refer to Figure 1 , the method for monitoring the lithium plating layer of a reference electrode includes:

[0054] S110. Obtain the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode under different lithium plating influencing factors.

[0055] Among them, the lithium plating influencing factors include the charging current during the lithium plating process of the reference electrode, the surface roughness of the reference electrode, and the impurity concentration of the reference electrode electrolyte. For better illustration, here it is defined that when the charging current ≥ 100 μA, it is considered that the charging current is too large; when the charging current ≥ 10 μA and < 50 μA, it is considered that the charging current is appropriate. In the following embodiments, when the charging current is selected as 200 μA, it is considered that the charging current is too large; when the charging current of the standard group is selected as 20 μA, it is considered that the charging current is appropriate. In order to avoid the cross - influence of multiple factors, when the roughness is large or the electrolyte impurity concentration is high, the charging current is the appropriate charging current. In the embodiments, the charging current in the above two cases is selected as 20 μA.

[0056] Specifically, Figure 2 is a schematic diagram of the lithium plating layer of a reference electrode under standard lithium plating parameters according to an embodiment of the present invention. Refer to Figure 2 , the voltage data during the preparation process of the reference electrode can be obtained under the conditions of standard charging current, normal roughness, and normal electrolyte concentration. Exemplarily, at this time, the reference electrode is formed by placing a smooth copper wire between the positive electrode plate and the negative electrode plate, and performing in - situ lithium plating on the positive electrode and the negative electrode, forming a lithium plating structure as shown in Figure 2 . The surface of the lithium plating layer is uniform and flat without obvious defects. Among them, the diameter of the copper wire is 40 μm, and the lithium plating thickness is about 15 μm. The 15 μm is the lithium plating layer thickness read from the equipment after deducting the copper wire diameter. The specific method is as follows: First, charge and discharge the three - electrode battery after capacitance division at a constant current of 0.33C to adjust it to a 50% state of charge. Among them, 0.33C indicates that the charge - discharge rate of the three - electrode battery is 0.33. Then, use a charging current of 20 μA to perform lithium plating on the reference electrode through the positive electrode for 2 h, then store it for 6 h, and use the same current and the same time to perform lithium plating on the reference electrode through the negative electrode. During the preparation process of the reference electrode, obtain the voltage data in real - time, and then store it for 6 h.

[0057] Figure 3 is a schematic diagram of the lithium plating layer of a reference electrode when the charging current is too large according to an embodiment of the present invention. Refer to Figure 3 , the voltage data during the preparation process of the reference electrode can also be obtained under the conditions of too large charging current, normal roughness, and normal electrolyte impurity concentration. Exemplarily, at this time, the reference electrode is formed by placing a smooth copper wire between the positive electrode plate and the negative electrode plate, and performing in - situ lithium plating on the positive electrode and the negative electrode, forming a structure as shown in Figure 3The lithium-plated structure shown has severe uneven deposition and massive deposition on the surface of the lithium-plated layer. Among them, the diameter of the copper wire is 40 μm, and the lithium-plated thickness is about 30 μm. The 30 μm is the lithium-plated layer thickness read from the device after deducting the copper wire diameter. Since lithium plating was uniformly carried out by time during the experiment, at the same time, the greater the current, the thicker the lithium-plated layer. The specific method is as follows: First, charge and discharge the three-electrode battery cell after formation at a constant current of 0.33C to adjust the state of charge to 50%. Then, use a charging current of 200 μA to carry out lithium plating on the reference electrode through the positive electrode for 2 h, then leave it standing for 6 h, and carry out lithium plating on the reference electrode through the negative electrode with the same current and the same time, and obtain voltage data in real time during the preparation process of the reference electrode, and then leave it standing for 6 h.

[0058] Figure 4 is a schematic diagram of the lithium-plated layer of a reference electrode when the roughness is too large, refer to Figure 4 , it is also possible to obtain voltage data during the preparation process of the reference electrode under the conditions of standard charging current, relatively large roughness, and normal electrolyte impurity concentration. Exemplarily, the reference electrode is formed by placing a copper wire with rough and severely burry surface between the positive electrode plate and the negative electrode plate, and performing in-situ lithium plating on the positive electrode and the negative electrode, forming a lithium-plated structure as shown in Figure 4 The lithium-plated structure shown has unplated lithium defects where there are burrs on the surface of the lithium-plated layer. Among them, the diameter of the copper wire is 40 μm, and the lithium-plated thickness is about 15 μm. The 15 μm is the lithium-plated layer thickness read from the device after deducting the copper wire diameter. The specific method is as follows: First, charge and discharge the three-electrode battery cell after formation at a constant current of 0.33C to adjust the state of charge to 50%. Then, use a charging current of 20 μA to carry out lithium plating on the reference electrode through the positive electrode for 2 h, then leave it standing for 6 h, and carry out lithium plating on the reference electrode through the negative electrode with the same current and the same time, and obtain voltage data in real time during the preparation process of the reference electrode, and then leave it standing for 6 h.

[0059] Figure 5 is a schematic diagram of the lithium-plated layer of a reference electrode when the electrolyte impurity concentration is relatively high, refer to Figure 5 , it is also possible to obtain voltage data during the preparation process of the reference electrode under the conditions of standard charging current, normal roughness, and relatively high electrolyte impurity concentration. Exemplarily, the reference electrode is formed by placing a smooth copper wire between the positive electrode plate and the negative electrode plate. When the impurity elements in the electrolyte exceed the standard, for example, the impurity is Na2SO4 and its proportion in the electrolyte is <5%, and at this time, in-situ lithium plating is carried out on the positive electrode and the negative electrode, forming a structure as shown in Figure 5The lithium-plated structure shown has white contaminants on the surface of the lithium-plated layer. Among them, the diameter of the copper wire is 40 μm, and the lithium-plated thickness is about 20 μm. The 20 μm is the lithium-plated layer thickness read from the device after deducting the copper wire diameter. The specific method is as follows: First, charge and discharge the three-electrode battery cell after grading at a constant current of 0.33C to a state of charge of 50%. Then, use a charging current of 20 μA to plate lithium on the reference electrode through the positive electrode for 2 hours, then let it stand for 6 hours, and use the same current and the same time to plate lithium on the reference electrode through the negative electrode. During the preparation process of the reference electrode, voltage data is obtained in real time, and then it is left standing for 6 hours.

[0060] Exemplarily, the battery cell used in this embodiment is a lithium battery cell with a capacity of 2 Ah and a size of 143 mm * 93 mm with a three-electrode reference. The positive electrode material is a high-nickel ternary material, and the negative electrode material is a graphite system. However, the monitoring method provided in this embodiment is not limited to this battery system, and it is also applicable to the quality judgment of the lithium-plated layer of other battery systems.

[0061] S120. Establish a reference electrode standard library based on the voltage data during the preparation process of the reference electrode and the voltage data during the standing process of the reference electrode under different lithium plating influencing factors.

[0062] Specifically, the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the standing process can be determined according to the voltage data during the preparation process of the reference electrode, and a reference electrode standard library is established based on the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the standing process.

[0063] S130. Obtain the voltage monitoring data of the reference electrode being monitored.

[0064] Among them, the voltage monitoring data can be the voltage data of the reference electrode in the monitoring state detected in real time.

[0065] S140. Compare the voltage monitoring data with the voltage data in the reference electrode standard library, and evaluate the reference electrode being monitored according to the comparison result.

[0066] Specifically, the voltage monitoring data of the reference electrode being monitored can be compared with the voltage data in the reference electrode standard library, and the reference electrode being monitored can be evaluated based on the comparison result. Exemplarily, if the voltage monitoring data of the reference electrode being monitored matches the voltage data in the reference electrode standard library under the standard charging current, normal roughness, and normal electrolyte concentration, it indicates that the quality of the lithium plating layer of the reference electrode being monitored is good; if the voltage monitoring data of the reference electrode being monitored matches the voltage data in the reference electrode standard library under an excessive charging current, normal roughness, and normal electrolyte concentration, it indicates that the quality of the lithium plating layer of the reference electrode being monitored is abnormal, and the reason for the abnormality is caused by an excessive charging current; if the voltage monitoring data of the reference electrode being monitored matches the voltage data in the reference electrode standard library under the standard charging current, larger roughness, and normal electrolyte impurity concentration, it indicates that the quality of the lithium plating layer of the reference electrode being monitored is abnormal, and the reason for the abnormality is caused by the rough surface of the reference electrode; if the voltage monitoring data of the reference electrode being monitored matches the voltage data in the reference electrode standard library under the standard charging current, normal roughness, and a higher electrolyte impurity concentration, it indicates that the quality of the lithium plating layer of the reference electrode being monitored is abnormal, and the reason for the abnormality is caused by a higher electrolyte impurity concentration.

[0067] The method for monitoring the lithium plating layer of the reference electrode provided by the embodiment of the present invention obtains the voltage data during the preparation process of the reference electrode and the voltage data during the shelving process of the reference electrode under different lithium plating influencing factors, and establishes a reference electrode standard library based on the voltage data during the preparation process of the reference electrode and the voltage data during the shelving process of the reference electrode under different lithium plating influencing factors. Then, the voltage monitoring data of the reference electrode being monitored is obtained, the voltage monitoring data is compared with the voltage data in the reference electrode standard library, and the reference electrode being monitored is evaluated based on the comparison result. Compared with the prior art where it is necessary to disassemble the battery to take out the reference electrode for morphological characterization of the quality of the lithium plating layer, the embodiment of the present invention can determine whether the quality of the lithium plating layer of the reference electrode is good only by obtaining the voltage monitoring data of the reference electrode being monitored and comparing the voltage monitoring data with the voltage data in the reference electrode standard library. The operation is simple, the recognition is high, and the cost is low.

[0068] Furthermore, the lithium plating influencing factors include the charging current during the lithium plating process of the reference electrode, the surface roughness of the reference electrode, and the impurity concentration of the reference electrode electrolyte.

[0069] Furthermore, establishing a reference electrode standard library based on the voltage data during the preparation process of the reference electrode and the voltage data during the shelving process of the reference electrode under different lithium plating influencing factors includes:

[0070] Determine the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the shelving process according to the voltage data during the preparation process of the reference electrode and the voltage data during the shelving process of the reference electrode;

[0071] Establish a reference electrode standard library according to the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the shelving process.

[0072] Specifically, determine the corresponding relationship between the positive electrode reference voltage and time according to the positive electrode voltage data during the lithium plating process of the reference electrode, and also determine the corresponding relationship between the negative electrode reference voltage and time according to the negative electrode voltage data during the lithium plating process of the reference electrode. Exemplarily, Figure 6 is a schematic diagram of the corresponding relationship between the positive electrode reference voltage and time provided by an embodiment of the present invention, Figure 7 is a schematic diagram of the corresponding relationship between the negative electrode reference voltage and time provided by an embodiment of the present invention, as Figure 6 and Figure 7As shown, during the lithium plating on the positive electrode and the negative electrode, the voltage shows: the voltage value corresponding to an excessive charging current > the voltage value corresponding to a larger roughness > the voltage value corresponding to normal lithium plating > the voltage value corresponding to a higher electrolyte impurity concentration. This voltage magnitude relationship is for the comparison after the lithium plating on the reference electrode stabilizes. Among them, the corresponding time after stabilization is the time after about 500 s, and actually, within the first 200 s is the process of lithium crystal nucleus formation. It can be seen from the curve that the potential relationship during the crystal nucleus formation process is: the potential corresponding to an excessive charging current > the potential corresponding to a larger roughness > the potential corresponding to normal lithium plating > the potential corresponding to a higher electrolyte impurity concentration, which is consistent with the above voltage relationship. The possible reason is that the initial deposition substrate is a copper wire, and its surface does not contain any lithium. Therefore, when depositing lithium on the copper surface, it is necessary to overcome the equilibrium potential of electrochemical deposition of lithium on copper, that is, sufficient electrochemical polarization needs to be provided, and polarization is a prerequisite for the smooth progress of electrochemical energy. When the polarization is satisfied, first, lithium crystal nuclei are formed on the copper substrate (i.e., lithium nucleation), and then the crystal nuclei grow. Different factors have different degrees of influence on the nucleation potential of the crystal nuclei. The factor corresponding to the largest nucleation potential is an excessive charging current because the larger the charging current, the stronger the polarization, so the lithium deposition kinetics is strong and the nucleation potential is the largest. Then it is normal lithium plating. Because the charging current of normal lithium plating is smaller than that of an excessive charging current, the lithium deposition power is relatively weak, and the nucleation potential is also relatively small. Next is a larger roughness. Because the surface with a larger roughness is uneven, this unevenness will cause additional lithium deposition impedance compared with normal lithium plating, and a higher potential is required to deposit on copper, so the nucleation potential is higher than that of normal lithium plating. Finally, it is the impurity group. When the impurity content is high, the impurities further dilute the lithium ion concentration in the electrolyte. Compared with normal lithium plating and a larger roughness, polarization can occur only when the lithium ion concentration near the copper wire is sufficient. Therefore, the lithium deposition power is relatively weak, and the nucleation potential is also relatively small. Then, according to the corresponding relationship between the positive electrode reference voltage and time during the preparation process, the positive electrode lithium plating nucleation potential is determined, and according to the corresponding relationship between the positive electrode reference voltage and time during the storage process, the positive electrode average depolarization rate is determined.

[0073] According to the positive electrode voltage data of the reference electrode during the storage process, the corresponding relationship between the positive electrode reference voltage and time during the storage process is determined. Also, according to the negative electrode voltage data of the reference electrode during the storage process, the corresponding relationship between the negative electrode reference voltage and time during the storage process is determined. Exemplarily, Figure 8 is a schematic diagram of the corresponding relationship between the positive electrode reference voltage and time during the storage process provided by an embodiment of the present invention. Figure 9 is a schematic diagram of the corresponding relationship between the negative electrode reference voltage and time during the storage process provided by an embodiment of the present invention, as Figure 8 and Figure 9As shown, during the storage stage after lithium plating of the reference electrode through the positive and negative electrodes, the voltage reduction rate shows: the voltage reduction rate corresponding to an excessive charging current > the voltage reduction rate corresponding to a larger roughness > the voltage reduction rate corresponding to a higher electrolyte impurity concentration > the voltage reduction rate corresponding to normal lithium plating. This is caused by the difference in the stability of the lithium plating layer. The possible reason is that when the morphology of the lithium plating layer is poor, its specific surface area is large, the contact area with the electrolyte becomes larger, the stability of the lithium plating layer becomes worse, and the rate of depolarization will become faster. The lithium plating layer formed by a large current is relatively loose, with the worst stability and the fastest voltage reduction rate. The lithium plating layer formed with a larger roughness has defective lithium plating, with general stability and the second-fastest voltage reduction rate. When the electrolyte impurity concentration is high, the surface lithium deposition morphology is flatter compared to that with a large charging current and a large roughness, and the voltage reduction rate is slightly smaller. For normal lithium plating, due to the good surface flatness and no defects, the voltage reduction rate is the smallest.

[0074] Furthermore, establish a reference electrode standard library based on the correspondence between the reference voltage and time during the preparation process and the correspondence between the reference voltage and time during the storage process, including:

[0075] Determine the lithium plating nucleation potential according to the correspondence between the reference voltage and time during the preparation process;

[0076] Determine the average depolarization rate according to the correspondence between the reference voltage and time during the storage process;

[0077] Establish a reference electrode standard library based on the lithium plating nucleation potential and the average depolarization rate.

[0078] Among them, the lithium plating nucleation potential includes the positive electrode lithium plating nucleation potential and the negative electrode lithium plating nucleation potential. The positive electrode lithium plating nucleation potential can be understood as Figure 6 the peak voltage in Figure 7 and the negative electrode lithium plating nucleation potential can be understood as the peak voltage in During the metal deposition process, it includes the formation of crystal nuclei and the growth of grains. The formation of crystal nuclei occurs first. That is, after a certain current or voltage is applied to the system, ions begin to aggregate to form crystal nuclei. At this time, the potential corresponding to this process is the nucleation potential, that is, the peak potential of the curve. The average depolarization rate includes the positive electrode average depolarization rate and the negative electrode average depolarization rate. The average depolarization rate can be determined according to the reference voltage data at the end of storage, the reference voltage data at the initial stage of storage, and the storage time.

[0079] Furthermore, according to the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode, determine the correspondence between the reference voltage and time during the preparation process and the correspondence between the reference voltage and time during the storage process. After that, it also includes:

[0080] Determine the corresponding relationship between the first-order potential and time during the preparation process according to the corresponding relationship between the reference voltage and time during the preparation process of the reference electrode;

[0081] Determine the corresponding relationship between the first-order potential and time during the shelving process according to the corresponding relationship between the reference voltage and time during the shelving process of the reference electrode.

[0082] Specifically, under the conditions of standard charging current, normal roughness, and normal electrolyte concentration, voltage data during the shelving process of the reference electrode can be obtained. Also, under the conditions of excessive charging current, normal roughness, and normal electrolyte impurity concentration, voltage data during the shelving process of the reference electrode can be obtained. Additionally, under the conditions of standard charging current, larger roughness, and normal electrolyte impurity concentration, voltage data during the shelving process of the reference electrode can be obtained. Moreover, under the conditions of standard charging current, normal roughness, and higher electrolyte impurity concentration, voltage data during the shelving process of the reference electrode can be obtained. Among them, the voltage data includes positive electrode voltage data and negative electrode voltage data.

[0083] According to the corresponding relationship between the reference voltage of the positive electrode and time during the preparation process of the reference electrode, determine the corresponding relationship between the first-order potential of the positive electrode and time during the preparation process. And according to the corresponding relationship between the reference voltage of the negative electrode and time during the preparation process of the reference electrode, determine the corresponding relationship between the first-order potential of the negative electrode and time during the preparation process. Exemplarily, Figure 10 is a schematic diagram of the corresponding relationship between the first-order potential of the positive electrode and time provided by an embodiment of the present invention, as Figure 10 shown. Through the first-order differential curve of lithium plating on the positive electrode, the process change degree (severity) of lithium deposition from the appearance of polarization (nucleation) to the growth of crystal nuclei can be presented, corresponding to the fluctuations within the first 250 s on the curve. After 250 s, when lithium deposition is stable, the curve has almost no significant fluctuations. That is, the fluctuation amplitude corresponding to excessive charging current > the fluctuation amplitude corresponding to larger roughness > the fluctuation amplitude corresponding to higher electrolyte impurity concentration > the fluctuation amplitude corresponding to normal lithium plating. The possible reason is that the three influencing factors of excessive charging current, larger roughness, and higher electrolyte impurity concentration have a certain impact on the formation and growth of lithium crystal nuclei, thus presenting a phenomenon with greater fluctuations than normal lithium plating. This is consistent with Figures 2 - 5 the conclusion of the lithium deposition morphology; Figure 11 is a schematic diagram of the corresponding relationship between the first-order potential of the negative electrode and time provided by an embodiment of the present invention, as Figure 11As shown, the first-order differential curve of lithium plating on the negative electrode presents the degree of change (severity) of the process of lithium deposition from the appearance of polarization (nucleation) to the growth of crystal nuclei, corresponding to the fluctuations within the first 100 s on the curve. After 100 s, when the lithium deposition becomes stable, there are almost no significant fluctuations in the curve. That is, the fluctuation amplitude corresponding to an excessive charging current > the fluctuation amplitude corresponding to a larger roughness > the fluctuation amplitude corresponding to a higher electrolyte impurity concentration > the fluctuation amplitude corresponding to normal lithium plating. The reason for the above is the same as the reason for the difference in the fluctuation amplitude of lithium deposition during the positive electrode lithium plating process. It should be noted that since the positive electrode lithium plating is carried out first, a small amount of lithium is deposited on the side of the copper wire of the reference electrode opposite to the negative electrode. Therefore, this size relationship is not Figure 10 so obvious. For the above reasons, when the surface of the reference electrode is rough and has burrs, during the positive electrode lithium plating, a small amount of lithium is plated on the negative electrode. At this time, the small amount of lithium plating on the negative electrode fills part of the uneven substrate of the burrs, weakening the difference from other cases.

[0084] According to the correspondence between the reference voltage of the positive electrode and time during the shelving process of the reference electrode, determine the correspondence between the first-order potential of the positive electrode and time during the shelving process, and according to the correspondence between the reference voltage of the negative electrode and time during the shelving process of the reference electrode, determine the correspondence between the first-order potential of the negative electrode and time during the shelving process. Exemplarily, Figure 12 is a schematic diagram of the correspondence between the first-order potential of the positive electrode and time during the shelving process provided by an embodiment of the present invention, Figure 13 is a schematic diagram of the correspondence between the first-order potential of the negative electrode and time during the shelving process provided by an embodiment of the present invention. Through the first-order differential curve of the shelving process of positive electrode lithium plating or negative electrode lithium plating, the degree of change (severity) of the electrolyte tending to equilibrium on the surface of the deposited lithium reference electrode can be presented, corresponding to the fluctuations within the first 100 s on the curve. After 100 s, when the deposited lithium reference electrode reaches stability for the electrolyte, there are almost no significant fluctuations in the curve. Refer to Figure 12 and Figure 13 , during the shelving stage after lithium plating on the reference electrode through the positive electrode and the negative electrode, since most of the values in the differential curve are negative, after converting to absolute values for comparison, the voltage reduction rate shows: the fluctuation amplitude corresponding to an excessive charging current > the fluctuation amplitude corresponding to a larger roughness > the fluctuation amplitude corresponding to a higher electrolyte impurity concentration > the fluctuation amplitude corresponding to normal lithium plating.

[0085] Furthermore, the average depolarization rate is determined according to the reference voltage data at the end of shelving, the reference voltage data at the beginning of shelving, and the shelving time.

[0086] Specifically, the average depolarization rate of the positive electrode and the average depolarization rate of the negative electrode can be calculated respectively according to the average depolarization rate formula. Among them, the calculation formula of the average depolarization rate is:

[0087] ;

[0088] Wherein, is the average depolarization rate during the shelving process, with the unit of mV·h -1 ; V t is the reference voltage at the end of shelving, with the unit of mV; V0 is the reference voltage at the beginning of shelving, with the unit of mV; t is the time of the entire shelving process, with the unit of h.

[0089] Specifically, the lithium plating nucleation potential of the positive electrode is determined according to the correspondence between the reference voltage of the positive electrode and time during the preparation process, and the average depolarization rate of the positive electrode is determined according to the correspondence between the reference voltage of the positive electrode and time during the shelving process; at the same time, the lithium plating nucleation potential of the negative electrode is determined according to the correspondence between the reference voltage of the negative electrode and time during the preparation process, and the average depolarization rate of the negative electrode is determined according to the correspondence between the reference voltage of the negative electrode and time during the shelving process. A reference electrode standard library is established based on the lithium plating nucleation potential of the positive electrode, the lithium plating nucleation potential of the negative electrode, the average depolarization rate of the positive electrode, and the average depolarization rate of the negative electrode.

[0090] Table 1 lists the lithium plating characteristic values under different lithium plating influencing factors. Among them, the lithium plating characteristic values include the lithium plating nucleation potential of the positive electrode, the lithium plating nucleation potential of the negative electrode, the average depolarization rate of the positive electrode, and the average depolarization rate of the negative electrode.

[0091] Table 1 Lithium Plating Characteristic Values under Different Lithium Plating Influencing Factors

[0092] Positive electrode lithium plating nucleation potential / V <![CDATA[Average anodic depolarization rate / mV·h -1 > Negative electrode lithium plating nucleation potential / V <![CDATA[Average depolarization rate of the negative electrode / mV·h -1 > Standard 3.9099~3.9238 1~2 0.2137~0.2235 1~2 High - current problem ≥3.9450 10~20 ≥0.2419 10~20 Roughness problem 3.9251~3.9389 5~6 0.2292~0.2390 5~6 High impurity concentration problem 3.9038~3.9177 3~4 0.2121~0.2220 3~4

[0093] After establishing a reference electrode standard library based on the lithium plating nucleation potential of the positive electrode, the lithium plating nucleation potential of the negative electrode, the average depolarization rate of the positive electrode, and the average depolarization rate of the negative electrode, voltage monitoring data of the reference electrode being monitored is obtained. Furthermore, the lithium plating nucleation potential of the positive electrode, the lithium plating nucleation potential of the negative electrode, the average depolarization rate of the positive electrode, and the average depolarization rate of the negative electrode of the reference electrode being monitored are formed based on the voltage monitoring data of the reference electrode being monitored, and the lithium plating nucleation potential of the positive electrode, the lithium plating nucleation potential of the negative electrode, the average depolarization rate of the positive electrode, and the average depolarization rate of the negative electrode of the reference electrode being monitored are compared with the data in the reference electrode standard library, so as to realize the evaluation of the reference electrode being monitored.

[0094] An embodiment of the present invention provides a device for monitoring the lithium plating layer of a reference electrode, Figure 14 is a schematic structural diagram of a device for monitoring the lithium plating layer of a reference electrode provided according to an embodiment of the present invention. Refer to Figure 14 , the device 200 for monitoring the lithium plating layer of a reference electrode includes:

[0095] A voltage data acquisition module 210, configured to acquire voltage data during the preparation process of a reference electrode and voltage data during the storage process of the reference electrode under different lithium plating influencing factors;

[0096] A standard library establishment module 220, configured to establish a reference electrode standard library according to the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode under different lithium plating influencing factors;

[0097] A voltage monitoring data acquisition module 230, configured to acquire voltage monitoring data of a reference electrode being monitored;

[0098] An evaluation module 240, configured to compare the voltage monitoring data with the voltage data in the reference electrode standard library, and evaluate the reference electrode being monitored according to the comparison result.

[0099] Further, the lithium plating influencing factors include excessive charging current during the lithium plating process of the reference electrode, rough surface of the reference electrode, and impurities in the electrolyte of the reference electrode.

[0100] Further, the standard library establishment module 220 includes:

[0101] A correspondence determination unit for the preparation process, configured to determine the correspondence between the reference voltage and time during the preparation process and the correspondence between the reference voltage and time during the storage process according to the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode;

[0102] A standard library establishment unit, configured to establish a reference electrode standard library according to the correspondence between the reference voltage and time during the preparation process and the correspondence between the reference voltage and time during the storage process.

[0103] Further, the standard library establishment unit includes:

[0104] A lithium plating nucleation potential determination subunit, configured to determine the lithium plating nucleation potential according to the correspondence between the reference voltage and time during the preparation process;

[0105] A depolarization rate determination subunit, configured to determine the average depolarization rate according to the correspondence between the reference voltage and time during the storage process;

[0106] A standard library establishment subunit, configured to establish a reference electrode standard library according to the lithium plating nucleation potential and the average depolarization rate.

[0107] Further, the standard library establishment module 220 further includes:

[0108] The first-order voltage data acquisition unit is configured to determine the correspondence between the reference voltage and time during the preparation process and the correspondence between the reference voltage and time during the shelving process based on the voltage data during the preparation process of the reference electrode and the voltage data during the shelving process of the reference electrode, and then determine the correspondence between the first-order potential and time during the preparation process according to the correspondence between the reference voltage and time during the preparation process of the reference electrode;

[0109] The first-order shelving voltage data acquisition unit is configured to determine the correspondence between the first-order potential and time during the shelving process according to the correspondence between the reference voltage and time during the shelving process of the reference electrode.

[0110] Furthermore, the average depolarization rate is determined based on the reference voltage data at the end of shelving, the reference voltage data at the beginning of shelving, and the shelving time.

[0111] The lithium plating layer monitoring device for the reference electrode provided by the embodiment of the present invention can execute the lithium plating layer monitoring method for the reference electrode provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects for executing the method.

[0112] Figure 15 The structural schematic diagram of the electronic device that can be used to implement the embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as, laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as, personal digital processors, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described herein and / or claimed.

[0113] As Figure 15 shown, the electronic device 10 includes at least one processor 11, and a memory communicatively connected to at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc. Among them, the memory stores a computer program executable by at least one processor. The processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 into the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. The input / output (I / O) interface 15 is also connected to the bus 14.

[0114] Multiple components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disc, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0115] The processor 11 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as the method for monitoring the lithium plating layer of the reference electrode.

[0116] In some embodiments, the method for monitoring the lithium plating layer of the reference electrode can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed onto the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the method for monitoring the lithium plating layer of the reference electrode described above can be executed. Alternatively, in other embodiments, the processor 11 can be configured to execute the method for monitoring the lithium plating layer of the reference electrode by any other suitable means (e.g., by means of firmware).

[0117] The various embodiments of the systems and technologies described above in this article can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-chip (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, the programmable processor can be a special or general-purpose programmable processor, can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit the data and instructions to the storage system, the at least one input device, and the at least one output device.

[0118] A computer program for implementing the method of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer programs are executed by the processor, the functions / operations specified in the flowchart and / or block diagram are implemented. The computer programs can be executed entirely on the machine, partially on the machine, as a stand-alone software package partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0119] In the context of the present invention, a computer-readable storage medium can be a tangible medium that can contain or store a computer program for use by or in connection with an instruction execution system, apparatus, or device. The computer-readable storage medium can include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, the computer-readable storage medium can be a machine-readable signal medium. More specific examples of the machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0120] In order to provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball) through which the user can provide input to the electronic device. Other kinds of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and the input from the user can be received in any form (including acoustic input, speech input, or tactile input).

[0121] The systems and techniques described herein can be implemented in a computing system including backend components (e.g., as a data server), or a computing system including middleware components (e.g., an application server), or a computing system including frontend components (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with an implementation of the systems and techniques described herein), or a computing system including any combination of such backend components, middleware components, or frontend components. The components of the system can be interconnected with each other by digital data communication in any form or medium (e.g., a communication network). Examples of communication networks include: local area network (LAN), wide area network (WAN), blockchain network, and the Internet.

[0122] A computing system can include a client and a server. The client and the server are generally far from each other and typically interact through a communication network. The client-server relationship is created by computer programs running on respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or a cloud host, which is a host product in the cloud computing service system, solving the defects of difficult management and weak business scalability existing in traditional physical hosts and VPS services.

[0123] It should be understood that various forms of the processes shown above can be used, with steps reordered, added, or deleted. For example, the steps recited in the present invention can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved, and no limitation is imposed herein.

[0124] The above specific embodiments do not constitute a limitation on the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for monitoring the lithium plating layer of a reference electrode, characterized in that, Including: Obtain the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode under different lithium plating influencing factors; Establish a reference electrode standard library based on the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode under different lithium plating influencing factors; Obtain the voltage monitoring data of the reference electrode being monitored; Compare the voltage monitoring data with the voltage data in the reference electrode standard library, and evaluate the reference electrode being monitored according to the comparison result; The lithium plating influencing factors include the charging current during the lithium plating process of the reference electrode, the surface roughness of the reference electrode, and the impurity concentration in the reference electrode electrolyte; Establishing a reference electrode standard library based on the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode under different lithium plating influencing factors includes: Determine the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the storage process according to the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode; Establish a reference electrode standard library according to the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the storage process.

2. The method for monitoring the lithium plating layer of the reference electrode according to claim 1, wherein Establishing a reference electrode standard library according to the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the storage process includes: Determine the lithium plating nucleation potential according to the corresponding relationship between the reference voltage and time during the preparation process; Determine the average depolarization rate according to the corresponding relationship between the reference voltage and time during the storage process; Establish a reference electrode standard library according to the lithium plating nucleation potential and the average depolarization rate.

3. The method for monitoring the lithium plating layer of the reference electrode according to claim 1, wherein After determining the corresponding relationship between the reference voltage and time during the preparation process and the corresponding relationship between the reference voltage and time during the storage process according to the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode, it further includes: Determine the corresponding relationship between the first-order potential and time during the preparation process according to the corresponding relationship between the reference voltage and time during the preparation process of the reference electrode; Determine the corresponding relationship between the first-order potential and time during the storage process according to the corresponding relationship between the reference voltage and time during the storage process of the reference electrode.

4. The method for monitoring the lithium plating layer of the reference electrode according to claim 2, wherein The average depolarization rate is determined according to the reference voltage data at the end of storage, the reference voltage data at the beginning of storage, and the storage time.

5. A monitoring device for the lithium plating layer of a reference electrode, characterized in that, Including: A voltage data acquisition module for acquiring the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode under different lithium plating influencing factors; A standard library establishment module for establishing a reference electrode standard library based on the voltage data during the preparation process of the reference electrode and the voltage data during the storage process of the reference electrode under different lithium plating influencing factors; A voltage monitoring data acquisition module for acquiring the voltage monitoring data of the reference electrode being monitored; An evaluation module, configured to compare the voltage monitoring data with the voltage data in the reference electrode standard library, and evaluate the reference electrode being monitored according to the comparison result; The lithium plating layer monitoring device for the reference electrode is used to execute the lithium plating layer monitoring method for the reference electrode according to any one of claims 1-4.

6. An electronic device, characterized in that, The electronic device includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the lithium plating layer monitoring method for the reference electrode according to any one of claims 1-4.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions, and the computer instructions are used to implement the lithium plating layer monitoring method for the reference electrode according to any one of claims 1-4 when executed by a processor.

8. A computer program product, characterized in that, The computer program product includes a computer program, and the computer program implements the lithium plating layer monitoring method for the reference electrode according to any one of claims 1-4 when executed by a processor.

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