Wafer test probe card and wafer test device

Abstract

The invention relates to the technical field of wafer testing, and discloses a wafer testing probe card and a wafer testing device. The discharging opening is formed in the outer surface wall of the machine shell; the control panel is fixedly installed on the side face of the machine shell. The movable seat is movably mounted on the inner bottom wall of the machine shell; the lifting seat is fixedly mounted on the top surface of the moving seat; and the detection seat is arranged at the top end of the lifting seat. Through the arrangement of the air blowing assembly, when the detection seat drives the wafer to move up and down, the pressing plate compresses or stretches the air guide bag along with pressing and releasing of the supporting plate, periodic compression and stretching of the air guide bag are controlled through the one-way valve between the guide pipe and the nozzle, intermittent air blowing to the probe is formed, extra energy supply is not needed, and the detection efficiency is improved. And moreover, the real-time performance and continuity of probe cleaning are realized, continuous cleaning of the surface of the probe in the test process is ensured, and test errors and chip damage caused by probe pollution are effectively prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and in particular to a wafer testing probe card and a wafer testing device. Background Art

[0002] Wafer testing is an important part of the semiconductor manufacturing process. It is used to verify whether the chips on the wafer meet the specifications and performance requirements. In this process, probe cards and wafer testing equipment play a vital role. Wafer testing machines are large mechanical equipment used to connect wafers to testing equipment. These machines usually have a lifting function that enables the wafer to contact the test head and test multiple chips without damaging the wafer.

[0003] After searching, the Chinese patent with the announcement number CN117147928A discloses a wafer test probe card and a wafer test device, including a PCB board and a probe, a cavity is provided on the second side of the PCB board, an air inlet is provided on the side of the cavity, a block is placed in the cavity, the block at least partially blocks the air inlet, and a first through hole is provided on the PCB board; wherein, when the wafer moves to a certain distance in the direction close to the probe, the wafer blocks the outflow of the airflow at the first through hole, so that the air pressure in the cavity below the block increases, the block is pushed to move away from the PCB board, and the air inlet is fully opened. By setting the block, the block contacts the bottom of the cavity under the action of gravity, the block blocks a part of the air inlet, so that the airflow is small, when the wafer moves to a certain distance in the direction close to the probe, the wafer blocks the outflow of the airflow, so that the air pressure in the cavity below the block increases, the block is pushed to move upward, the air inlet is fully opened, and a high pressure environment is provided for the test to avoid sparks. However, the above scheme still has the following shortcomings when it is actually used: During the wafer testing process, the probe will repeatedly contact the chip, which may cause foreign matter to stick to the probe. The air blowing device can effectively clean these foreign matter by using dry compressed air, thereby keeping the probe clean. However, although the air blowing device is effective in removing foreign matter, the airflow generated during its operation may also lift up foreign matter that has been separated from the probe and scatter it in the air to form tiny pollutant particles. These tiny particles have extremely strong adhesion. Once they encounter a relatively static or slow wafer surface, they are very likely to be deposited and attached to it again, becoming a potential source of pollution. This secondary pollution problem poses a considerable hidden danger to the subsequent processing of the wafer.

[0004] Therefore, it is necessary to design a wafer testing probe card and a wafer testing device to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a wafer testing probe card and a wafer testing device.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions: A wafer testing device, comprising: chassis; A discharge port is arranged on the outer wall of the casing; A control panel, fixedly mounted on the side of the casing; A movable seat, movably mounted on the inner bottom wall of the casing; A lifting seat, fixedly mounted on the top surface of the moving seat; A detection seat, arranged on the top of the lifting seat; A test seat, fixedly mounted on the inner bottom wall of the housing and located at the side of the movable seat; A mounting shell, fixedly mounted on the bottom surface of the test seat; A through opening is provided at the center of the bottom surface of the mounting shell; An air blowing assembly, arranged on one side of the bottom surface of the mounting shell, for blowing and cleaning the probe card; An adsorption component, arranged on the other side of the bottom surface of the mounting shell, for adsorbing foreign matter; The driving component is arranged on the adsorption component and is used in conjunction with the adsorption component to clean and collect foreign matter.

[0007] As a preferred technical solution of the present invention, the blowing assembly comprises: An air guide bag is fixedly mounted on the bottom surface of the mounting shell, and an air suction port is provided on the air guide bag; Two guide rods are fixedly mounted on the bottom surface of the mounting shell and are located on both sides of the air guide bag; A pressure plate, slidably mounted on the two guide rods; Two support springs are respectively sleeved on the two guide rods, and two ends of the support springs are respectively fixedly connected to the pressure plate and the mounting shell; The nozzle is fixedly mounted on the bottom surface of the mounting shell at the side of the through opening through a connecting frame; A conduit is arranged on the air guide bag, and two ends of the conduit are respectively connected with the air guide bag and the nozzle; The support plate is fixedly mounted on the side edge of the top surface of the detection seat.

[0008] As a preferred technical solution of the present invention, the air inlet and the interior of the conduit are provided with one-way valves with opposite flow directions, and the support plate is semicircular.

[0009] As a preferred technical solution of the present invention, the adsorption component includes: A bracket, fixedly mounted on the bottom surface of the mounting shell at a symmetrical position with respect to the air guide bag; Two guide grooves are symmetrically arranged on the inner side wall of the bracket; A sliding pull plate, slidably mounted on the inner side walls of the two guide grooves; A winding roller, rotatably mounted on an end of the bracket away from the through opening; A dust collecting cloth is arranged on the winding roller, and one end of the dust collecting cloth away from the winding roller is fixedly connected to the side surface of the sliding pull plate; The cleaning mechanism is arranged at one end of the bracket away from the through opening.

[0010] As a preferred technical solution of the present invention, the cleaning mechanism comprises: A fixing frame, fixedly mounted on an end of the bracket away from the through opening, and the fixing frame is located below the winding roller; A cleaning roller, rotatably mounted on the inner side of the fixing frame; A collection box, fixedly mounted on the bottom surface of the fixing frame; The combing plate is fixedly mounted on the inner side wall of the opening of the collecting box.

[0011] As a preferred technical solution of the present invention, the top opening of the collecting box is configured to be an arc shape that matches the cleaning roller.

[0012] As a preferred technical solution of the present invention, the driving assembly includes: Two rope winding rollers are symmetrically mounted on one end of the bracket away from the winding roller; Two groups of connecting cables are respectively arranged on the two rope winding rollers; A guide roller is rotatably mounted on an end of the bracket away from the winding roller, and an end of the connecting cable away from the rope winding roller passes through the guide roller and is fixedly connected to the sliding pull plate; The transmission rod is fixedly installed at a position between the two rope winding rollers.

[0013] As a preferred technical solution of the present invention, the driving assembly further includes: A servo motor is fixedly mounted on the bottom surface of the mounting shell; Two driving wheels, mounted on the output end of the servo motor; Two driven wheels are rotatably mounted on two ends of the bracket, and the two driven wheels are fixedly connected to the winding roller and the rope winding roller respectively; Two synchronous belts are respectively mounted on the driven wheel and the driving wheel on the same side.

[0014] A wafer test probe card comprises a mounting frame arranged inside the mounting shell, a printed circuit board is arranged on the bottom surface of the mounting frame, and a probe adapted to the through port is arranged on a side of the printed circuit board away from the mounting frame.

[0015] As a preferred technical solution of the present invention, the lowest positions of the nozzle and the bracket are at least higher than the lowest position of the probe.

[0016] The present invention has the following beneficial effects: 1. By setting up the blowing component, when the test seat drives the wafer to move up and down, the pressure plate will compress or stretch the air bag as the support plate is pressed and released. The periodic compression and stretching of the air bag is controlled by the one-way valve between the conduit and the nozzle, forming an intermittent blowing of the probe. Not only does it not require additional energy supply, but it also realizes the real-time and continuity of the probe cleaning, ensuring the continuous cleaning of the probe surface during the test process, and effectively preventing the test error and chip damage caused by probe contamination; 2. By setting the adsorption component and the drive component, and controlling the forward and reverse rotation of the servo motor, the reeling and unreeling of the vacuum cloth can be precisely controlled. When the vacuum cloth needs to be cleaned, the servo motor drives the reel roller and the rope winding roller to rotate synchronously in the forward direction to realize the automatic reeling and cleaning of the vacuum cloth. When the vacuum cloth is cleaned and needs to be reset, the servo motor drives the reel roller and the rope winding roller to rotate in the reverse direction, so that the vacuum cloth can be unfolded and restored to its original position. At the same time, the vacuum cloth, as a key component for collecting foreign matter, is located near the nozzle and can effectively capture the blown foreign matter to prevent it from drifting into the test environment. 3. By setting up a cleaning mechanism, the bristles on the cleaning roller are in close contact with the surface of the vacuum cloth. During the rolling process of the vacuum cloth, they can penetrate deep into the fiber gaps and effectively brush off the tiny foreign matter adhering to the vacuum cloth. The combing plate is located under the cleaning roller. When the cleaning roller rotates to the bottom, the combing plate will comb the bristles on it, comb out the foreign matter in the bristles and drop it into the collection box. This not only improves the cleaning efficiency of the vacuum cloth, but also ensures the cleanliness of the cleaning roller itself, avoiding the re-adhesion of foreign matter during the cleaning process. At the same time, the coordinated use of the combing plate and the collection box enables the cleaned foreign matter to be collected and processed in a centralized manner, preventing secondary contamination of foreign matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of a wafer testing device proposed by the present invention; Figure 2 This is a schematic diagram of the overall partial cross-section structure of a wafer testing device proposed by the present invention; Figure 3 A schematic diagram of the structure of a detection seat and a test seat of a wafer testing device proposed by the present invention; Figure 4 A schematic diagram of the multi-angle structure of a detection seat and a test seat of a wafer testing device proposed by the present invention; Figure 5 A schematic diagram of the structure of a mounting shell of a wafer testing device proposed by the present invention; Figure 6 A schematic diagram of a support structure of a wafer testing device proposed by the present invention; Figure 7 A schematic diagram of the multi-angle structure of a support of a wafer testing device proposed by the present invention; Figure 8 For the present invention Figure 7 A schematic diagram of the enlarged structure at point A; Fig. 9 The figure is a schematic diagram of the overall structure of a wafer test probe card proposed by the present invention.

[0018] In the figure: 1, casing; 2, discharge port; 3, control panel; 4, moving seat; 5, lifting seat; 6, detection seat; 7, test seat; 8, mounting shell; 9, through port; 101, air guide bag; 102, guide rod; 103, pressure plate; 104, support spring; 105, nozzle; 106, guide tube; 107, support plate; 111, bracket; 112, guide groove; 113, sliding plate; 114, winding roller; 115, dust cloth; 116, fixing frame; 117, cleaning roller; 118, collecting box; 119, combing plate; 121, rope winding roller; 122, connecting cable; 123, guide roller; 124, transmission rod; 125, servo motor; 126, driving wheel; 127, driven wheel; 128, synchronous belt; 13, mounting frame; 14, printed circuit board; 15, probe. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] Reference Figure 1-8A wafer testing device comprises a casing 1; a discharge port 2, which is arranged on the outer wall of the casing 1; a control panel 3, which is fixedly mounted on the side of the casing 1; a moving seat 4, which is movably mounted on the inner bottom wall of the casing 1; a lifting seat 5, which is fixedly mounted on the top surface of the moving seat 4; a detection seat 6, which is arranged on the top of the lifting seat 5; a test seat 7, which is fixedly mounted on the inner bottom wall of the casing 1 and located at the side position of the moving seat 4; a mounting shell 8, which is fixedly mounted on the bottom surface of the test seat 7; a through port 9, which is opened at the center position of the bottom surface of the mounting shell 8; an air blowing component, which is arranged on one side of the bottom surface of the mounting shell 8 and is used to blow and clean the probe card; an adsorption component, which is arranged on the other side of the bottom surface of the mounting shell 8 and is used to adsorb foreign matter; a driving component, which is arranged on the adsorption component and is used in conjunction with the adsorption component to clean and collect foreign matter, and the wafer to be tested can be introduced into the interior of the casing 1 through the discharge port 2, so that the wafer can be located on the detection seat 6, and then the test seat 7, the moving seat 4 and the lifting seat 5 are opened through the control panel 3 to detect the wafer.

[0021] Reference Figure 4 , Figure 5 The blowing assembly includes: an air guide bag 101, which is fixedly mounted on the bottom surface of the mounting shell 8, and an air suction port is arranged on the air guide bag 101; two guide rods 102, which are fixedly mounted on the bottom surface of the mounting shell 8 and are located on both sides of the air guide bag 101; a pressure plate 103, which is slidably mounted on the two guide rods 102; two support springs 104, which are respectively mounted on the two guide rods 102, and the two ends of the support springs 104 are respectively fixedly connected to the pressure plate 103 and the mounting shell 8; a nozzle 105, which is fixedly mounted on the bottom surface of the mounting shell 8 at the side of the through port 9 through a connecting frame; a conduit 106, which is arranged on the air guide bag 101, and the two ends of the conduit 106 are respectively connected to the air guide bag 101 and the nozzle 105, and the air suction port and the inside of the conduit 106 are provided with a one-way valve with opposite flow directions; a support plate 107 , fixedly installed at the side position of the top surface of the detection seat 6, the support plate 107 is semicircular; when the detection seat 6 moves upward, the support plate 107 can press the pressure plate 103, so that the air bag 101 can be compressed by the pressure plate 103, and the support plate 107 can be separated from the pressure plate 103 during the downward movement of the detection seat 6. At this time, under the action of the support spring 104, the pressure plate 103 can slide downward along the guide rod 102, thereby stretching the air bag 101. During the whole process, since the one-way valve with opposite flow directions is installed in the air intake port and the conduit 106, the air can be ejected through the conduit 106 and the nozzle 105 when the air bag 101 is compressed, so as to clean the probe 15, and when the air bag 101 is stretched, the air can enter the air bag 101 through the air intake port for standby use.

[0022] Reference Figure 5-Figure 8The adsorption component includes: a bracket 111, which is fixedly mounted on the bottom surface of the mounting shell 8 and at a symmetrical position with the air guide bag 101; two guide grooves 112, which are symmetrically opened on the inner side wall of the bracket 111; a sliding plate 113, which is slidably mounted on the inner side walls of the two guide grooves 112; a winding roller 114, which is rotatably mounted on the end of the bracket 111 away from the opening 9; a dust-absorbing cloth 115, which is arranged on the winding roller 114, and the end of the dust-absorbing cloth 115 away from the winding roller 114 is fixedly connected to the side of the sliding plate 113; a cleaning mechanism, which is arranged at the end of the bracket 111 away from the opening 9; as the gas is blown out, the attached foreign matter can be blown off and float with the air flow, and attached to the dust-absorbing cloth 115, so that the blown foreign matter can be collected, and driven by the driving component, the dust-absorbing cloth 115 can be rolled up by the winding roller 114, so that the sliding plate 113 slides in the guide groove 112.

[0023] Reference Figure 8 The cleaning mechanism includes: a fixed frame 116, which is fixedly mounted on the end of the bracket 111 away from the through-hole 9, and the fixed frame 116 is located below the winding roller 114; a cleaning roller 117, which is rotatably mounted on the inner side of the fixed frame 116; a collecting box 118, which is fixedly mounted on the bottom surface of the fixed frame 116, and the top opening of the collecting box 118 is set to be an arc shape adapted to the cleaning roller 117; a combing plate 119, which is fixedly mounted on the inner side wall of the opening of the collecting box 118; as the dust-absorbing cloth 115 slides, its outer surface fits the cleaning roller 117, so the cleaning roller 117 can be driven to rotate during the sliding process of the dust-absorbing cloth 115, and the bristles on the cleaning roller 117 can clean the foreign matter on the dust-absorbing cloth 115, and as the cleaning roller 117 rotates, it can contact the combing plate 119 in the bottom collecting box 118, so that the foreign matter in the bristles on the cleaning roller 117 is combed down and enters the collecting box 118 for collection.

[0024] Reference Figure 5-Figure 8The drive assembly includes: two rope winding rollers 121, which are symmetrically rotatably mounted on the end of the bracket 111 away from the winding roller 114; two sets of connecting cables 122 are respectively arranged on the two rope winding rollers 121; a guide roller 123, which is rotatably mounted on the end of the bracket 111 away from the winding roller 114, and the end of the connecting cable 122 away from the rope winding roller 121 passes through the guide roller 123 and is fixedly connected to the sliding pull plate 113; a transmission rod 124, which is fixedly mounted at a position between the two rope winding rollers 121; the drive assembly also includes: a servo motor 125, which is fixedly mounted on the bottom surface of the mounting shell 8; two driving wheels 126, which are sleeved on the output end of the servo motor 125; two driven wheels 127, which are respectively rotatably mounted on the two ends of the bracket 111, and the two driven wheels 127 are respectively fixedly connected to the winding roller 114 and the rope winding roller 121; two synchronous belts 128, which are respectively sleeved on the driven wheel 127 and the driving wheel 126 on the same side; The servo motor 125 is turned on and drives the winding roller 114 and the rope winding roller 121 to rotate synchronously through the driven wheel 127, the driving wheel 126 and the synchronous belt 128. When the winding roller 114 rotates, the dust suction cloth 115 can be rolled up, and the sliding pull plate 113 at the end can be driven to slide along the guide groove 112. At this time, when the rope winding roller 121 rotates, the connecting cable 122 can be unwound. After the dust suction cloth 115 is cleaned, the servo motor 125 can be reversed. At this time, the winding roller 114 and the rope winding roller 121 can rotate in the opposite direction. When the winding roller 114 rotates in the opposite direction, the dust suction cloth 115 can be unwound, and when the rope winding roller 121 rotates in the opposite direction, the connecting cable 122 can be rolled up, so that the connecting cable 122 can pull the sliding pull plate 113 to slide in the opposite direction along the guide groove 112, and then the dust suction cloth 115 can be unfolded and reset, so that the dust suction cloth 115 continues to absorb the blown foreign matter.

[0025] Reference Fig. 9 A wafer test probe card includes a mounting frame 13 arranged on the inner side of a mounting shell 8, a printed circuit board 14 is arranged on the bottom surface of the mounting frame 13, a probe 15 adapted to a through hole 9 is arranged on a side of the printed circuit board 14 away from the mounting frame 13, and the lowest positions of a nozzle 105 and a bracket 111 are at least higher than the lowest position of the probe 15; during the detection process, the probe 15 directly contacts the pad or bump on the chip, and the chip signal generated by the test machine (ATE) is applied to the device under test, and the feedback signal in the device under test is transmitted back to the ATE, thereby completing the entire test.

[0026] The specific working principle of the present invention is as follows: First, the wafer to be tested can be put into the housing 1 through the discharge port 2 so that the wafer can be placed on the test seat 6. Then, the test seat 7, the moving seat 4 and the lifting seat 5 are turned on through the control panel 3 to test the wafer. During the test, the probe 15 directly contacts the pad or bump on the chip, and the chip signal generated by the test machine (ATE) is applied to the device under test, and the feedback signal in the device under test is transmitted back to the ATE, thereby completing the entire test; When the detection seat 6 moves and drives the wafer to move, the detection seat 6 can press the pressure plate 103 through the support plate 107 when it moves upward, so that the air bag 101 can be compressed by the pressure plate 103, and when the detection seat 6 moves downward, the support plate 107 can be separated from the pressure plate 103. At this time, under the action of the support spring 104, the pressure plate 103 can slide downward along the guide rod 102, so as to stretch the air bag 101. During the whole process, since the air intake port and the conduit 106 are equipped with a one-way valve with opposite flow directions, the air can be ejected through the conduit 106 and the nozzle 105 when the air bag 101 is compressed, so as to clean the probe 15, and when the air bag 101 is stretched, the air can enter the air bag 101 through the air intake port for standby use, so as to realize intermittent blowing of the probe 15, so as to clean the foreign matter on the probe 15. During the whole process, the support plate 107 is designed to be semicircular, so that it can ensure contact with the pressure plate 103 when the detection seat 6 rotates; As the gas is blown out, foreign matter attached to the probe 15 can be blown off and float with the air flow and attached to the dust cloth 115, so that the blown foreign matter can be collected. As the wafer test proceeds, when foreign matter accumulates on the dust cloth 115, the staff can turn on the servo motor 125 and drive the winding roller 114 and the rope winding roller 121 to rotate synchronously through the driven wheel 127, the driving wheel 126 and the synchronous belt 128. When the winding roller 114 rotates, the dust cloth 115 can be rolled up, and the sliding pull plate 113 at the end can be driven along the guide groove 112 to move forward. The cleaning roller 117 is slidable, and the rope winding roller 121 can unwind the connecting rope 122 when rotating. As the dust collecting cloth 115 slides, its outer surface fits with the cleaning roller 117. Therefore, the cleaning roller 117 can be driven to rotate during the sliding of the dust collecting cloth 115. The bristles on the cleaning roller 117 can clean the foreign matter on the dust collecting cloth 115. As the cleaning roller 117 rotates, it can contact the combing plate 119 in the bottom collecting box 118, so as to comb the foreign matter in the bristles on the cleaning roller 117 and enter the collecting box 118 for collection. After the dust cloth 115 is cleaned, the servo motor 125 can be reversed. At this time, the winding roller 114 and the rope winding roller 121 can rotate in the opposite direction. When the winding roller 114 rotates in the opposite direction, the dust cloth 115 can be unwound, and when the rope winding roller 121 rotates in the opposite direction, the connecting cable 122 can be wound up, so that the connecting cable 122 can pull the sliding plate 113 to slide in the opposite direction along the guide groove 112, and then the dust cloth 115 can be unfolded and reset, so that the dust cloth 115 can continue to absorb the blown foreign matter.

[0027] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer testing device, characterized in that: include: Housing (1); A discharge port (2) is arranged on the outer wall of the casing (1); A control panel (3) fixedly mounted on a side of the housing (1); A movable seat (4) movably mounted on the inner bottom wall of the housing (1); A lifting seat (5) is fixedly mounted on the top surface of the moving seat (4); A detection seat (6) is arranged on the top of the lifting seat (5); A test seat (7) fixedly mounted on the inner bottom wall of the housing (1) and located at a side edge of the movable seat (4); A mounting shell (8) fixedly mounted on the bottom surface of the test seat (7); A through opening (9) is provided at the center of the bottom surface of the mounting shell (8); An air blowing component, arranged on one side of the bottom surface of the mounting shell (8), and used for blowing and cleaning the probe card; An adsorption component, arranged on the other side of the bottom surface of the mounting shell (8) and used for adsorbing foreign matter; The driving component is arranged on the adsorption component and is used in conjunction with the adsorption component to clean and collect foreign matter.

2. A wafer testing device according to claim 1, characterized in that: The blowing assembly comprises: An air guide bag (101) is fixedly mounted on the bottom surface of the mounting shell (8), and an air intake port is provided on the air guide bag (101); Two guide rods (102) are fixedly mounted on the bottom surface of the mounting shell (8) and are located on both sides of the air guide bag (101); A pressing plate (103) slidably mounted on the two guide rods (102); Two support springs (104) are respectively sleeved on the two guide rods (102), and two ends of the support springs (104) are respectively fixedly connected to the pressure plate (103) and the mounting shell (8); The nozzle (105) is fixedly mounted on the bottom surface of the mounting shell (8) at a side position of the through opening (9) via a connecting frame; A conduit (106) is arranged on the air guide bag (101), and two ends of the conduit (106) are respectively connected to the air guide bag (101) and the nozzle (105); The support plate (107) is fixedly mounted on a side edge of the top surface of the detection seat (6).

3. A wafer testing device according to claim 2, characterized in that: One-way valves with opposite flow directions are arranged inside the air intake port and the conduit (106), and the support plate (107) is semicircular.

4. The wafer testing device according to claim 3, characterized in that: The adsorption assembly comprises: A bracket (111) is fixedly mounted on the bottom surface of the mounting shell (8) at a position symmetrical to the air guide bag (101); Two guide grooves (112) are symmetrically arranged on the inner side wall of the bracket (111); A sliding pull plate (113) slidably mounted on the inner side walls of the two guide grooves (112); A winding roller (114) rotatably mounted on an end of the bracket (111) away from the through opening (9); A dust collecting cloth (115) is arranged on the winding roller (114), and one end of the dust collecting cloth (115) away from the winding roller (114) is fixedly connected to a side surface of the sliding pull plate (113); A cleaning mechanism is arranged at an end of the bracket (111) away from the through opening (9).

5. The wafer testing device according to claim 4, characterized in that: The cleaning mechanism comprises: A fixed frame (116) fixedly mounted on an end of the bracket (111) away from the through opening (9), and the fixed frame (116) is located below the winding roller (114); A cleaning roller (117) rotatably mounted on the inner side of the fixing frame (116); A collection box (118) fixedly mounted on the bottom surface of the fixing frame (116); The combing plate (119) is fixedly mounted on the inner side wall of the opening of the collecting box (118).

6. The wafer testing device according to claim 5, characterized in that: The top opening of the collection box (118) is arranged in an arc shape that matches the cleaning roller (117).

7. The wafer testing device according to claim 6, characterized in that: The drive assembly comprises: Two rope winding rollers (121) are symmetrically mounted on an end of the bracket (111) away from the winding roller (114); Two groups of connecting cables (122), respectively arranged on the two rope winding rollers (121); A guide roller (123) is rotatably mounted on an end of the bracket (111) away from the winding roller (114), and an end of the connecting cable (122) away from the rope winding roller (121) passes through the guide roller (123) and is fixedly connected to the sliding pull plate (113); The transmission rod (124) is fixedly mounted at a position between the two rope winding rollers (121).

8. The wafer testing device according to claim 7, characterized in that: The drive assembly also includes: A servo motor (125) is fixedly mounted on the bottom surface of the mounting shell (8); Two driving wheels (126) mounted on the output end of the servo motor (125); Two driven wheels (127) are rotatably mounted on two ends of the bracket (111), and the two driven wheels (127) are fixedly connected to the winding roller (114) and the rope winding roller (121) respectively; Two synchronous belts (128) are respectively mounted on the driven wheel (127) and the driving wheel (126) on the same side.

9. A wafer test probe card, using a wafer test device as claimed in any one of claims 1 to 8, characterized in that: It comprises a mounting frame (13) arranged inside the mounting shell (8), a printed circuit board (14) being arranged on the bottom surface of the mounting frame (13), and a probe (15) adapted to the through opening (9) being arranged on a surface of the printed circuit board (14) away from the mounting frame (13).

10. The wafer testing probe card according to claim 9, characterized in that: The lowest positions of the nozzle (105) and the bracket (111) are at least higher than the lowest position of the probe (15).

Images