Optical module, optical communication equipment and system

Abstract

The invention discloses an optical module, the optical module is provided with a single-fiber bidirectional optical port, multiple paths of optical signals with different wavelengths can be emitted through the optical port, and the multiple paths of optical signals with different wavelengths can be received through the optical port, so that optical signal transmission of multiple PON modes (such as GPON, XG-PON and 50G-PON) can be supported at the same time. In order to meet the requirements of low cost and high precision of optical path design, the optical module is packaged in a mixed packaging mode. For example, a plurality of laser chips in the light emitting assembly are respectively packaged in a plurality of first packaging bodies, then the light emitting assembly is assembled based on the plurality of first packaging bodies so as to reduce the cost, and each sub-assembly in the light receiving assembly is integrated in a second packaging body so as to improve the precision of a light receiving signal light path. Based on the optical module provided by the invention, the invention further provides optical communication equipment and a system.

Description

Technical Field

[0001] The present application relates to the field of optical fiber communication technology, and in particular to an optical module, optical communication equipment and system. Background Art

[0002] The advent of the cloud era has promoted the vigorous development of various Internet applications, and the resulting exponential growth of network traffic has put forward higher requirements on the bandwidth, latency, power consumption, reliability, scalability and flexibility of the data center behind it. In order to obtain high bandwidth, lower latency and lower power consumption, optical networks will be considered to be deployed in data centers. Optical modules are a standard module used in optical communication equipment, generally used as a standard accessory for equipment such as optical routers. In recent years, with the increasing demand for bandwidth from users and the popularization of fiber to the home, the optical module market has grown by leaps and bounds.

[0003] With the explosive growth of human demand for data traffic, global operators have accelerated the upgrade of gigabit passive optical network (GPON) to 10G passive optical network (10G passive optical net, XG-PON) in recent years, and XG-PON has entered the stage of large-scale commercial deployment. The 50G passive optical network (50G passive optical net, 50G-PON) has a bandwidth capacity 5 times that of XG-PON and has ultra-wide, low latency, low jitter and other precision characteristics. It can widely meet the future application scenarios such as ultra-high bandwidth access for homes / enterprises, deterministic network construction for enterprise parks, and mobile xHaul, effectively improving bandwidth quality, network quality and service experience. Due to the long tail cycle of GPON delivery, the three PON modes of GPON, XG-PON and 50G-PON will coexist in the next few years, and optical modules that support multiple PON modes need to be designed accordingly.

[0004] Optical signals of different PON modes generally occupy different wavelength bands, which means that the optical module needs to transmit and receive multiple optical signals of different wavelengths. Therefore, compared with optical modules that transmit and receive one wavelength, optical modules that transmit and receive multiple wavelengths have more components, require higher costs, and place higher requirements on the accuracy of optical path design. How to design optical modules that transmit and receive multiple wavelengths to balance cost and accuracy requirements has become an urgent problem to be solved in the field of optical modules. Summary of the invention

[0005] The present application provides an optical module and a system for reducing costs while taking into account the accuracy requirements of optical path design.

[0006] In the first aspect, the present application provides an optical module. The optical module may include an optical transmitting component, an optical receiving component, an optical component and an optical signal interface. The optical module may support a variety of PON technologies, and accordingly, may transmit and receive optical signals of multiple wavelengths. The optical transmitting component includes a plurality of optical transmitting subcomponents and a multiplexing subcomponent, and the optical receiving component includes a plurality of optical receiving subcomponents and a demultiplexing subcomponent. Each of the optical transmitting subcomponents is used to convert an electrical signal into an optical signal, and then emit the converted optical signal. The present application does not limit the implementation mode or form of the optical transmitting subcomponents, for example, the optical transmitting subcomponent may be a laser chip. The multiplexing subcomponent is used to combine the multiple optical signals emitted by the plurality of optical transmitting subcomponents to obtain an optical transmitting signal, wherein the wavelengths of the optical signals emitted by at least two of the optical transmitting subcomponents are different. The optical component is used to transmit the optical transmitting signal to the optical signal interface. The optical signal interface is used to connect an optical signal medium (e.g., a single optical fiber), input the optical transmitting signal into the optical signal medium, and receive the optical receiving signal from the optical signal medium. The optical signal interface may be a single-fiber bidirectional optical interface. The optical component is also used to transmit the optical receiving signal to the demultiplexing subcomponent. The demultiplexing subcomponent is used to separate multiple optical signals from the optical receiving signal, and the wavelengths of at least two optical signals in the multiple optical signals are different. Each of the optical receiving subcomponents is used to receive one optical signal separated by the demultiplexing subcomponent and convert it into an electrical signal. The present application does not limit the implementation method or form of the optical receiving subcomponent. For example, the optical receiving subcomponent can be a photodetector chip. The optical module can realize single-fiber bidirectional multi-mode optical signal transmission.

[0007] For ease of description, the optical transmitting subassembly and the optical receiving subassembly can also be collectively referred to as optical subassemblies. The packaging method of the optical module is an important factor affecting the performance of the optical module. Using packaged optical subassemblies to package optical modules is a mature and low-cost packaging method, which is conducive to reducing the cost of optical modules. However, when using optical subassemblies with packaging bodies to build optical paths, the accuracy of the optical paths is low.

[0008] Considering that the optical signals of multiple modes (called downstream optical signals) sent by the optical line terminal OLT to the optical line terminal OLT usually occupy multiple adjacent wavebands, and the optical signals of multiple modes (called upstream optical signals) sent by the ONU to the OLT usually occupy multiple adjacent wavebands, and the intervals between the multiple wavebands of the short-wave band are usually small, therefore, the optical module generally only has high requirements for the accuracy of the optical transmission signal optical path or the optical reception signal optical path. Taking the example that the waveband interval of the downstream optical signals of multiple modes is greater than the waveband interval of the upstream optical signals of multiple modes, for the OLT supporting multiple PON modes, it is necessary to ensure the accuracy of the optical reception signal optical path in the optical module, and for the ONU supporting multiple PON modes, it is necessary to ensure the accuracy of the optical transmission signal optical path in the optical module. In order to take into account both low cost and accuracy requirements, the present application proposes to use a hybrid packaging method to package the optical module.

[0009] In the first hybrid packaging method, the multiple optical transmission sub-assemblies can be respectively packaged inside multiple first packaging bodies, and then the optical transmission assembly can be assembled based on the multiple first packaging bodies to reduce costs, and the sub-assemblies in the optical receiving assembly can be integrated and packaged inside the second packaging body to improve the accuracy of the optical path of the optical receiving signal. By adopting the first hybrid packaging method to package the optical module in the OLT, it is not only beneficial to reduce the overall cost of the optical module, but also beneficial to optimize the signal quality of the upstream optical signal received by the OLT.

[0010] The plurality of first packages may be disposed outside the second package, and the first package and the second package respectively have light guide ports for transmitting optical signals between the outside and the inside.

[0011] The multiplexed subassembly may be encapsulated outside the first package. Assuming that the optical emission assembly includes N optical emission subassemblies, the N optical emission subassemblies may be encapsulated inside N first packages, each first package may only encapsulate one optical emission subassembly, and different first packages may encapsulate different optical emission subassemblies. Wherein, N is a positive integer greater than 1. Alternatively, assuming that the optical emission assembly includes N optical emission subassemblies, the N optical emission subassemblies may be encapsulated inside M first packages, N is a positive integer greater than 2, M is a positive integer greater than 1 and less than N, and at least two optical emission subassemblies may be encapsulated in at least one first package.

[0012] Optionally, the optical component is packaged inside the second packaging body, which is helpful to reduce the volume of the optical module and reduce the interference of the interfering light signal on the optical emission sub-component.

[0013] The second package body may have a first light guide port and a second light guide port. The first light guide port is used to transmit optical signals between the multiplexing subassembly outside the second package body and the optical assembly inside the second package body, and the second light guide port is used to transmit optical signals between the optical signal interface and the optical assembly.

[0014] Optionally, the plurality of first packages and the second packages are fixed together by a connector, and the connector has a cavity inside, and the cavity is used to connect the light guide port of each first package and the first light guide port. In this way, it is beneficial to reduce the volume of the optical module and improve the overall stability and airtightness of the optical module. The multiplexing subassembly can be arranged in the cavity.

[0015] In the second hybrid packaging method, the multiple optical receiving subassemblies can be respectively packaged inside the multiple first packaging bodies to reduce costs, and the optical transmitting assembly can be packaged inside the second packaging body to improve the accuracy of the optical path of the optical transmission signal. By adopting the second hybrid packaging method to package the optical module in the ONU, it is not only beneficial to reduce the overall cost of the optical module, but also beneficial to optimize the signal quality of the upstream optical signal transmitted by the ONU.

[0016] The plurality of first packages are disposed outside the second package, and the first package and the second package respectively have light guide ports for transmitting optical signals between the outside and the inside.

[0017] For the second hybrid packaging method, the demultiplexing subassembly can be encapsulated outside the first packaging body. Assuming that the optical receiving component includes N optical receiving subassemblies, the N optical receiving subassemblies can be encapsulated inside N first packaging bodies, each first packaging body can only encapsulate one optical receiving subassembly, and different first packaging bodies encapsulate different optical receiving subassemblies. Wherein, N is a positive integer greater than 1. Alternatively, assuming that the optical receiving component includes N optical receiving subassemblies, the N optical receiving subassemblies can be encapsulated inside M first packaging bodies, N is a positive integer greater than 2, M is a positive integer greater than 1 and less than N, and at least two optical receiving subassemblies can be encapsulated in at least one first packaging body.

[0018] Optionally, the optical component is encapsulated inside the second encapsulation body. In this way, it is beneficial to reduce the volume of the optical module and reduce the interference of the interfering optical signal on the optical emission subassembly. The second encapsulation body has a first light guide port and a second light guide port. The first light guide port is used to transmit optical signals between the demultiplexing subassembly outside the second encapsulation body and the optical component inside the second encapsulation body, and the second light guide port is used to transmit optical signals between the optical signal interface and the optical component.

[0019] Optionally, the plurality of first packages and the second package are fixed together by a connector, and the connector has a cavity inside, and the cavity is used to connect the light guide port of each first package and the first light guide port. In this way, it is beneficial to reduce the volume of the optical module and improve the overall stability and airtightness of the optical module. The demultiplexing subassembly can be arranged in the cavity.

[0020] Or, optionally, the optical component may be encapsulated in a cavity of the connector, and accordingly, the cavity is also used to connect the optical signal interface, the light guiding port of the first encapsulation body, and the light guiding port of the second encapsulation body.

[0021] The present application does not limit the specific form or packaging process of the first package and the second package. For example, the first package can be a transistor TO-type package or a butterfly-type package, and the second package can be a box-type package. The first package encapsulating the optical transmitting subassembly can also be called a transmitting optical submodule TOSA, and the first package encapsulating the optical receiving subassembly can also be called a receiving optical submodule ROSA.

[0022] Since the optical signal interface is not only used to input the optical transmission signal into the optical fiber, but also used to receive the optical reception signal from the optical fiber, the optical component needs to separate the optical path of the optical transmission signal and the optical path of the optical reception signal. The present application does not limit the implementation method of the optical component. For example, the optical component is a circulator, which is conducive to reducing the crosstalk between the optical reception signal and the optical transmission signal. The circulator has a first port, a second port and a third port. The circulator is used to receive the optical transmission signal from the multiplexing subassembly through the first port, and send the optical transmission signal to the optical signal interface through the second port. The circulator is also used to receive the optical reception signal from the optical signal interface through the second port, and send the optical reception signal to the demultiplexing subassembly through the third port.

[0023] The present application does not limit the implementation of the multiplexing subassembly and the demultiplexing subassembly. For example, the multiplexing subassembly or the demultiplexing subassembly can be a "z" block type filter. The paths of light beams of different wavelengths in the filter are zigzag, thereby achieving light combination or light splitting.

[0024] The present application does not limit the specific structure of the filter. For example, the filter includes a glass carrier, one side of the glass carrier is coated with a reflective film, and the other side is provided with multiple filters. By providing multiple filters on the same glass carrier, it is helpful to reduce assembly errors, improve the accuracy of the incident angle of the optical signal on the filter, and thus improve the accuracy of light combination or light splitting.

[0025] The optical receiving assembly may also include more components. Optionally, the optical receiving assembly may also include multiple lens subassemblies. For example, each of the lens subassemblies may be used to couple a path of optical signals separated by the demultiplexing subassembly to the corresponding optical receiving subassembly. Each lens subassembly may include one or more lenses. Optionally, the optical receiving assembly may also include an electronic assembly, for example, the optical receiving assembly may also include a transimpedance amplifier.

[0026] The light emitting assembly may also include more components. Optionally, the light emitting assembly may include multiple lens subassemblies. For example, the lens subassembly may be used to collimate the optical signal emitted by the light emitting subassembly. Optionally, the light emitting assembly may also include a laser driver.

[0027] The optical module may also include more components.

[0028] Optionally, the optical module may further include a circuit board. An electrical signal interface may be provided on the circuit board. The electrical signal interface, or electrical connector, may be used to connect a host (e.g., a host of an OLT or an ONU). Multiple optical transmitting subassemblies may be respectively connected to the electrical signal interface to receive electrical signals from the host through the electrical signal interface. Multiple optical receiving subassemblies may be respectively connected to the electrical signal interface to send electrical signals to the host through the electrical signal interface.

[0029] Other electronic components may also be arranged on the circuit board, for example, circuit traces, electronic components (such as capacitors, resistors, and transistors, etc.) and one or more chips may also be arranged on the circuit board. The present application does not limit the type of circuit in the chip, for example, the one or more chips may include at least one of a laser driving circuit, a limiting amplifier circuit, a clock data recovery circuit, a power management circuit, and a data processing circuit, etc.

[0030] Optionally, the optical module may also include a shell having an opening, and the components in the optical module (such as the optical transmitting component, the optical receiving component and the optical component, etc.) may be arranged in a cavity within the shell, and the optical signal interface is used to connect the optical signal medium through the opening.

[0031] In a second aspect, the present application also provides an optical communication device, which includes a host and an optical module as described in the first aspect. As described above, the optical module is used to connect an optical signal medium. The host can be used to send an electrical signal to the optical module. The optical module is used to convert the electrical signal sent by the host into an optical signal, and then send the converted electrical signal to the optical signal medium. The optical module is also used to receive an optical signal from the optical signal medium, and then convert the received optical signal into an electrical signal. The host is also used to receive the converted electrical signal from the optical module.

[0032] The present application does not limit the type of the optical communication device. For example, the optical communication device may be an optical line terminal OLT or an optical network terminal ONU.

[0033] In a third aspect, the present application further provides a system, comprising a plurality of optical communication devices, at least one of the plurality of optical communication devices being as described in the second aspect, and different optical communication devices among the plurality of optical communication devices being connected via an optical interconnection network. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 and Figure 2 The possible structures of the optical network are schematically shown respectively;

[0035] Figure 3 Another possible system architecture of an optical network is schematically shown;

[0036] Figure 4 Schematically showing the upstream transmission band and the downstream transmission band of each mode in the scenario where three generations of PON modes coexist;

[0037] Figure 5 A possible structure of the optical module provided by the present application is schematically shown;

[0038] Figure 6 A possible optical path structure of the optical module provided in the present application is schematically shown. DETAILED DESCRIPTION

[0039] Table 1 introduces the abbreviations of key terms used in this application.

[0040] Table 1

[0041]

[0042]

[0043] The present application scheme can be applied to optical networks. Optical networks have advantages such as high switching speed, low optical power loss, low latency, low cost, and no wavelength competition. Optical networks can be applied to DCN, metropolitan area network, PON or OTN, etc., without specific limitation.

[0044] Figure 1 A possible structure of an optical network is shown schematically. Figure 1 The optical network includes but is not limited to three optical communication devices and an optical interconnection network, and optical signals can be transmitted between different optical communication devices through the optical interconnection network. The optical network can include more or fewer optical communication devices.

[0045] Figure 1The devices or networks represented by different rectangular boxes may be deployed in different or the same geographical locations. For example, an optical network may be deployed in a single cabinet or multiple cabinets in a data center. Figure 2 A possible deployment of an optical network is shown schematically. Figure 2 , the optical network can be located in a cabinet in a data center, which is used to fix various optical communication equipment and optical interconnection networks.

[0046] The optical internetwork may include one or more optical links (eg, optical fibers). Optionally, the optical internetwork may also include one or more optical switching devices, which are used to switch optical signals.

[0047] The present application does not limit the type of optical communication equipment. For example, the optical communication equipment may be an OLT, an ONU, a router, a switch, a server, an OTN transmission equipment, a computer equipment, etc.

[0048] The optical communication device may include a host and an optical module. The host includes a mainboard and an optical module interface. The optical module interface is used to access the optical module to connect the optical module and the mainboard. Optionally, the host may also include a network cable interface, which is used to access the network cable to connect the network cable and the mainboard. The optical module may be provided with an optical signal interface (referred to as optical port) and an electrical signal interface (referred to as electrical port). The optical port is used to access the optical fiber, and the electrical port is used to access the optical module interface.

[0049] The host can be used to send electrical signals to the optical module, for example, to transmit electrical signals from a network cable to the electrical port of the optical module. The optical module is used to convert the electrical signals sent by the host into optical signals, and then send the converted electrical signals to the optical signal medium. The optical module is also used to receive optical signals from the optical signal medium, and then convert the received optical signals into electrical signals. The host is also used to receive the converted electrical signals from the optical module.

[0050] The optical port of the optical module can be a single-fiber bidirectional interface, which is used to connect a single optical fiber. One optical fiber can be used to transmit and receive optical signals, thereby improving the efficiency of optical fiber use and transmission bandwidth, achieving high-speed transmission, saving optical fiber resources, greatly reducing system costs, and improving system reliability.

[0051] The present application does not limit the PON mode type supported by the optical module in the optical communication device. For example, the optical module can support at least one of EPON, GPON, XG-PON (or 10G-PON) and 50G PON.

[0052] With the explosive growth of human demand for data traffic, global operators have accelerated the pace of upgrading GPON to XG-PON in recent years, and XG-PON has entered the stage of large-scale commercial deployment. With bandwidth capabilities 5 times that of XG-PON and precision features such as ultra-wide, low latency, and low jitter, 50G-PON can widely meet future home / enterprise ultra-high bandwidth access, enterprise campus deterministic network construction, mobile xHaul and other application scenarios, effectively improving bandwidth quality, network quality and service experience.

[0053] In view of the future smooth evolution architecture design towards 50G-PON, China Telecom took the lead in initiating the G.9805Amd1 standard research project at the ITU-T SG15 plenary meeting in September 2022, and proposed for the first time a three-generation PON system coexistence technical architecture and solution based on GPON / XG(S)-PON / 50G-PON three-mode MPM optical modules, supporting the coexistence and smooth evolution of three-generation PON technologies such as GPON, XG-PON, and 50G-PON in the same ODN. Based on the industry's forecast of the delivery of three-generation PON technologies in the existing network, GPON has a long delivery tail cycle, and GPON, XG-PON, and 50G-PON will coexist in a few years. It can be seen that how to achieve three-mode coexistence has become a problem that needs to be solved urgently. Three-mode coexistence refers to three-mode optical modules. Three-mode optical modules can transmit optical signals of the three modes of GPON, XG-PON, and 50G-PON through the same optical port (or PON port), and share ODN.

[0054] For example, OLT supports multiple PON modes and ONU supports one PON mode. Figure 3 A possible system architecture of an optical network is schematically shown. Figure 3 The optical network shown may be an ODN. Figure 3 As shown, the optical network includes an OLT and multiple ONUs. Among them, the multiple ONUs include ONUs supporting GPON technology, ONUs supporting XG(S)-PON technology, and ONUs supporting 50G-PON technology. The OLT supports GPON, XG(S)-PON, and 50G-PON technologies. In order to simplify the attached figure, Figure 3 The optical module connected to the OLT is only schematically shown. The optical module can be connected to a single interface of the OLT through an electrical port, and can be connected to a single optical fiber through an optical port to achieve single-fiber bidirectional signal transmission.

[0055] The optical module can transmit optical signals of three modes, namely GPON, XG(S)-PON and 50G-PON, into the optical fiber through the optical port. For example, the optical module is provided with a GPON optical transmitting subassembly, an XG-PON optical transmitting subassembly, a 50G-PON optical transmitting subassembly and an optical multiplexing subassembly. The optical module can receive optical signals of three modes, namely GPON, XG(S)-PON and 50G-PON, from the optical fiber. For example, the optical module is provided with a GPON optical receiving subassembly, an XG-PON optical receiving subassembly, a 50G-PON optical receiving subassembly and a demultiplexing subassembly. For the convenience of description, Figure 3 A rectangle marked with a PON mode represents an optical transmission subassembly and an optical receiving subassembly of the corresponding mode. For example, a rectangle marked with a GPON represents a GPON optical transmission subassembly and a GPON optical receiving subassembly. To simplify the drawings, Figure 3 The optical multiplexing subassembly and demultiplexing subassembly are represented by trapezoidal shapes.

[0056] like Figure 3 As shown, the GPON optical transmission subassembly is used to transmit an optical signal of GPON mode to the optical multiplexer, for example, to transmit an optical signal of 1490nm to the optical multiplexing subassembly. The XG-PON optical transmission subassembly is used to transmit an optical signal of XG-PON mode (or optical transmission signal) to the optical multiplexing subassembly, for example, to transmit an optical signal of 1577nm. The 50G-PON optical transmission subassembly is used to transmit an optical signal of 50G-PON mode to the optical multiplexing subassembly, for example, to transmit an optical signal of 1342nm. The optical multiplexing subassembly is used to combine the received optical signals of each mode into the optical fiber. The present application does not limit the signal source of the light signal emitted by the optical transmission subassembly. For example, the optical transmission subassembly can receive an electrical signal from the OLT through an electrical port, and then convert the electrical signal into an optical signal.

[0057] Continue to refer Figure 3 , the demultiplexing subassembly is used to separate the optical signals of each mode from the optical signal received by the optical fiber, and send the optical signals of each mode to the optical receiving subassembly of the corresponding mode. The GPON optical receiving subassembly is used to receive the optical signal of GPON mode (or optical receiving signal) from the demultiplexing subassembly, such as the optical signal with an upstream wavelength of 1310nm. The XG-PON optical receiving subassembly is used to receive the optical signal of XG-PON mode from the demultiplexing subassembly, for example, to receive the optical signal of 1270nm. The 50G-PON optical receiving subassembly is used to receive the optical signal of 50G-PON mode from the demultiplexing subassembly, for example, to receive the optical signal of 1286nm. The present application does not limit the processing method of the optical receiving subassembly after receiving the optical signal. For example, after receiving the optical signal, the optical receiving subassembly can convert the optical signal into an electrical signal, and then transmit the electrical signal to the OLT through the electrical port.

[0058] The wavelength of the optical signal transmitted upstream corresponding to each mode is usually located in a wavelength range / band (referred to as the upstream band), and similarly, the wavelength of the optical signal transmitted downstream corresponding to each mode is usually located in a wavelength range / band (referred to as the downstream band). The above only schematically lists the center wavelengths of the upstream band and the downstream band of each mode. Figure 4 The schematic diagram shows the upstream and downstream bands of each mode in the scenario where three generations of PON modes coexist. Figure 4 Taking the uplink transmission of 50G-PON mode as an example, the occupied wavelength band is 1284nm~1288nm.

[0059] In order to support the smooth evolution of PON modes, the present application provides an optical module. The optical module can be a multimode optical module, supporting multiple PON modes, and accordingly, the optical module can transmit and receive multi-channel optical signals of different wavelengths. The present application does not limit the specific type of PON mode supported by the multimode optical module. For example, in addition to supporting the PON mode introduced above, the multimode optical module can also support other PON modes (such as the next generation PON mode). The present application does not limit the number of PON modes supported by the multimode optical module. For example, the multimode optical module can support 2 or 3 or more PON modes.

[0060] The optical module may include an optical transmitting component, an optical receiving component, an optical component and an optical signal interface (abbreviated as optical port). The optical transmitting component includes multiple optical transmitting sub-components and multiplexing sub-components, and the optical receiving component includes multiple optical receiving sub-components and demultiplexing sub-components. Figure 5 The structure of the optical module is schematically shown. Figure 6 The optical path of the optical module is schematically shown.

[0061] Each optical emission component is used to convert an electrical signal into an optical signal, and then emit the converted optical signal. The present application does not limit the implementation method or form of the optical emission subcomponent. For example, the optical emission subcomponent may be a laser chip. The laser chip may be, but is not limited to, a laser diode (LD). The following text takes the optical emission subcomponent as a laser chip as an example for introduction. Figure 5 Three laser chips are schematically shown, which are respectively denoted as laser chip 11, laser chip 12 and laser chip 13. The wavelengths of the optical signals emitted by at least two of the multiple optical emission subassemblies are different. Taking the optical module supporting GPON, XG-PON and 50G-PON as an example, the center wavelengths of the optical signals emitted by laser chip 11, laser chip 12 and laser chip 13 can be 1490nm, 1577nm and 1342nm respectively.

[0062] The multiplexing subassembly is used to combine multiple optical signals emitted by multiple optical emission subassemblies to obtain an optical emission signal. This application does not limit the implementation of the multiplexing subassembly. For example, the multiplexing subassembly may include multiple filters, such as Figure 5 The filter 14 and filter 15 shown. Figure 5 As shown, the filter 14 is used to receive the optical signal (recorded as optical signal t1) emitted by the laser chip 11 and transmit the optical signal t1. The filter 14 is also used to receive the optical signal (recorded as optical signal t2) emitted by the laser chip 12 and reflect the optical signal t2, thereby combining the optical signal t1 and the optical signal t2, and the light beam obtained by combining the optical signal t1 and the optical signal t2 is recorded as the optical signal T12. The filter 15 is used to receive the optical signal T12 and transmit it. The filter 15 is also used to receive the optical signal (recorded as optical signal t3) emitted by the laser chip 13 and reflect the optical signal t3, thereby combining the optical signal T12 and the optical signal t3, and the light beam obtained by combining the optical signal t123, that is, the optical emission signal mentioned above. The present application does not limit the incident angle of the optical signal on the filter 14 and the filter 15. Figure 5 Take the incident angle of 45D as an example.

[0063] The optical component is used to receive the optical transmission signal from the multiplexing subassembly and transmit the optical transmission signal to the optical port, and the optical component is also used to receive the optical signal from the optical port and transmit the optical reception signal to the demultiplexing subassembly. The present application does not limit the implementation method of the optical component. For example, the optical component is a circulator and can include one or more polarization splitting elements, which is conducive to reducing the crosstalk between the optical reception signal and the optical transmission signal.

[0064] like Figure 5 As shown, the circulator 2 has a first port 21, a second port 22 and a third port 23. The circulator 2 is used to receive an optical transmission signal (e.g., optical signal T123) from the filter 15 through the first port 21, and send the optical transmission signal to the optical port 3 through the second port 22. The circulator 2 is also used to receive an optical reception signal from the optical port 3 through the second port 22, and send the optical reception signal to the demultiplexing subassembly 41 through the third port 23. Figure 5 Taking a free space circulator as an example, the present application does not limit the specific implementation method of the circulator 2 .

[0065] By using a circulator in the optical module to separate the optical paths of the optical transmission signal and the optical reception signal, compared with using multiple filters, isolators and reflectors as splitters, it is helpful to reduce the crosstalk between the optical transmission signal and the optical reception signal, and no additional isolators are required, reducing the cost and complexity of the optical module. In addition, the use of a circulator to separate the optical reception signal and the optical transmission signal increases the tolerance of the circulator to the incident angle by more than 10 times compared to the conventional use of filters and reflectors for splitting, reducing the difficulty of the process.

[0066] The optical port 3 is used to connect an optical signal medium (eg, a single optical fiber), input an optical transmit signal to the optical fiber, and receive an optical receive signal from the optical fiber, thereby realizing single-fiber bidirectional optical signal transmission. Figure 5 Taking the case where the optical paths of the optical transmission signal and the optical reception signal in the optical port are the same as an example, optionally, the optical paths of the two may not overlap. The optical signal interface is also called an optical connector or an optical fiber connector. As an example, the optical port may include a glass ferrule, and a lens and an optical fiber may be arranged inside the glass ferrule. The present application does not limit the material used for the lens, and those skilled in the art can design it according to actual needs. Exemplarily, the lens path is made of glass or resin material.

[0067] The demultiplexing subassembly 41 is used to separate multiple optical signals from the optical receiving signal, and at least two of the multiple optical signals have different wavelengths. Taking the optical module supporting GPON, XG-PON and 50G-PON as an example, the demultiplexing subassembly 41 can separate three optical signals from the optical receiving signal, and the central wavelengths of the three optical signals are 1310nm, 1270nm and 1286nm respectively.

[0068] This application does not limit the implementation of the demultiplexing subcomponent 41. For example, refer to Figure 5 The demultiplexing subassembly 41 can be a "z" block type filter or a filter type demultiplexer. The paths of light beams of different wavelengths in the filter are in a zigzag shape, thereby achieving light combination or light splitting. The present application does not limit the specific structure of the filter. For example, the filter includes a glass carrier, and a plurality of filter sheets (for example, Figure 5The filter sheets 411, 412 and 413 are shown in the figure, and the other side is coated with a reflective film 414. The present application does not limit the fixing method of the filter sheets on the glass carrier. For example, the filter sheets can be fixed on the glass carrier by bonding. Assume that filter 411, filter 412 and filter 413 are used to transmit optical signals of GPON band, XG-PON band and 50G-PON band respectively, the optical receiving signal is incident from circulator 2 to filter 411 in the filter, the optical signal of GPON band is transmitted from filter 411 to PD 42, the optical signal of XG-PON band and the optical signal of 50G-PON band are reflected to filter 412 via filter 411 and reflective film 414 in turn, the optical signal of XG-PON band is transmitted to PD 43 from filter 412, the optical signal of 50G-PON band is reflected to filter 413 via filter 412 and reflective film 414 in turn, and is transmitted to PD 44 via filter 413. By arranging multiple filters on the same glass carrier, it is beneficial to reduce assembly errors, improve the accuracy of the incident angle of the optical signal on the filter, and thus improve the accuracy of light combination or light splitting.

[0069] Each optical receiving subassembly is used to receive an optical signal separated by the demultiplexing subassembly and convert it into an electrical signal. The wavelengths of the optical signals received by at least two of the multiple optical receiving subassemblies are different. The present application does not limit the implementation method or form of the optical receiving subassembly. For example, the optical receiving subassembly can be a photodetector chip. The photodetector chip can be integrated with but is not limited to a photodiode (PD). The following text takes the optical receiving subassembly as a photodetector chip as an example. Figure 5 Three photodetector chips are schematically shown, which are respectively denoted as PD 42, PD 43 and PD 44. Figure 5 As shown, PD 42 is used to receive an optical signal emitted from filter 411, PD 43 is used to receive an optical signal emitted from filter 412, and PD 44 is used to receive an optical signal emitted from filter 413. Assuming that filter 411, filter 412, and filter 413 are used to transmit optical signals of the GPON band, the XG-PON band, and the 50G-PON band, respectively, the center wavelengths of the optical signals received by PD42, PD43, and PD44 may be 1310 nm, 1270 nm, and 1286 nm, respectively.

[0070] The optical receiving assembly may also include more components. Optionally, the optical receiving assembly may also include multiple lens subassemblies. For example, each lens subassembly may be used to couple a path of optical signals separated by the demultiplexing subassembly to a corresponding optical receiving subassembly. Each lens subassembly may include one or more lenses. Optionally, the optical receiving assembly may also include an electrical subassembly, for example, the optical receiving assembly may also include a transimpedance amplifier.

[0071] The light emitting assembly may also include more components. Optionally, the light emitting assembly may include multiple lens subassemblies (such as Figure 5 The lens subassembly 16, lens subassembly 17 and lens subassembly 18 are shown). For example, the lens subassembly can be used to collimate the optical signal emitted by the optical emission subassembly. Optionally, the optical emission assembly can also include an electrical subassembly. For example, the optical emission assembly can include a laser driver. The laser driver can be a driver chip (driver), which can couple the DC bias current of the laser chip with the high-frequency modulation current to provide a modulated drive current for it. At the same time, the laser driver can also amplify the input signal and control the DC bias current and the high-frequency modulation current to put the laser chip in the best working state. Those skilled in the art can select the type of optical emission subassembly and the corresponding driver according to actual needs, and the present application is not limited to this.

[0072] An optical module may also include more components.

[0073] Optionally, the optical module may also include a circuit board. Electronic components may be arranged on the circuit board. For example, circuit traces, electronic components (such as capacitors, resistors, and transistors, etc.) and one or more chips may be arranged on the circuit board. At least one chip may be used to process the electrical signal received through the electrical port and send it to the optical transmitting subassembly, and / or to process the electrical signal received from the optical receiving subassembly and send it to the electrical port. The present application does not limit the type of circuit in the chip. For example, the one or more chips may include at least one of a laser driving circuit, a limiting amplifier circuit, a clock data recovery circuit, a power management circuit, and a data processing circuit.

[0074] The circuit board is generally a rigid circuit board, and the rigid circuit board can also realize the load-bearing function due to its relatively hard material. An electrical signal interface (abbreviated as electrical port) or electrical connector can be set on the circuit board, which can be used to connect a host (such as an OLT or ONU host). Multiple optical transmitting subassemblies can be connected to the electrical signal interface respectively to receive electrical signals from the host through the electrical signal interface. Multiple optical receiving subassemblies can be connected to the electrical signal interface respectively to send electrical signals to the host through the electrical signal interface. The electrical port can be used to insert into the electrical connector in the cage of the host computer (i.e., the host). Specifically, a metal pin / gold finger is formed on the end surface of one side of the circuit board for connecting to the electrical connector.

[0075] The light emitting subassembly and the light receiving subassembly can be connected to the electrical assembly respectively. For example, the light emitting subassembly and the light receiving subassembly can be connected to the electrical assembly on the circuit board respectively through the circuit traces in the circuit board, or can be connected to the electrical assembly on the circuit board through the lines outside the circuit board (such as the traces in the flexible circuit board).

[0076] The packaging method of the optical module is an important factor affecting the performance of the optical module. The packaging method of the optical module is introduced below, taking the case where the wavelength interval of optical signals of different modes received by the optical module is smaller than the wavelength interval of optical signals of different modes transmitted as an example. Assuming that the wavelength interval of multiple modes of downstream optical signals is larger than the wavelength interval of multiple modes of upstream optical signals, the optical module can be used to access the OLT accordingly.

[0077] In the first implementation, each laser chip and each photodetector chip can be packaged in a TO packaging manner to obtain multiple TOSAs and ROSAs, and then a multi-pass connector is used to connect each package and optical port, and other optical components (such as multiple filters) are assembled in the internal cavity of the connector.

[0078] like Figure 4 As shown, the intervals between the downlink wavebands of different modes are larger, which places lower requirements on the accuracy of the multiplexing sub-component. The multiplexing sub-component can receive the optical signal at a larger angle (for example, 45D), or in other words, the incident angle of the optical signal in the multiplexing sub-component can be 45D, and the accuracy requirements on the incident angle are lower.

[0079] Continue to refer Figure 4, because the intervals between the upstream wavebands of different modes are small, and the upstream waveband of 50G-PON has only 4nm redundancy, the precision of the demultiplexing subassembly is required to be high. The optical signal needs to be incident on the demultiplexing subassembly at a small and precise incident angle (for example, less than 8D), or the demultiplexing subassembly needs to receive the optical signal at a small and precise angle, which places high requirements on the assembly precision of the demultiplexing subassembly (for example, the mounting precision is less than + / -0.1D). However, the optical path is constructed using a photodetector chip with a package, and the optical path precision is low. In addition, the angle tolerance of mounting the filter in the multi-pass connector is difficult to control and easily accumulates. The minimum splitting capability is far beyond 4nm. The optical receiving subassembly of 50G-PON cannot meet the central wavelength and bandwidth requirements, and it is difficult to meet the precision requirements of the multi-mode optical module for the demultiplexing subassembly, which leads to low coupling efficiency and product yield.

[0080] In the second implementation, a box packaging method can be used to package the optical emitting component and the optical receiving component in the same housing. The optical path is constructed in the same housing using a photodetector chip and a laser chip without a package body. The optical path has a high precision, which is conducive to meeting the precision requirements of the multi-mode optical module for the demultiplexing sub-assembly. However, in order to couple (or guide) the optical signal emitted by each laser chip to the corresponding incident position of the multiplexing sub-assembly, and to couple each optical signal separated by the multiplexing sub-assembly to the corresponding photodetector chip, it is necessary to assemble multiple groups of lenses in the optical path for separate coupling, and the coupling efficiency is low and the coupling cost is high. In addition, the optical emitting sub-assembly and the optical receiving sub-assembly are packaged in the same housing, and there is strong optical interference (or crosstalk) between the two, which deteriorates the product performance.

[0081] In order to balance low cost, high performance and high manufacturability, the present application provides a packaging method for an optical module. Multiple optical emitting subassemblies can be respectively packaged inside multiple first packaging bodies to reduce costs, and the optical receiving assembly can be packaged inside the second packaging body to improve the accuracy of the optical path of the optical receiving signal. Multiple first packaging bodies can be arranged outside the second packaging body, which is beneficial to reducing the crosstalk between the optical emitting signal and the optical receiving signal. By adopting this hybrid packaging method to package the optical module, it is not only beneficial to reduce the overall cost of the optical module, but also beneficial to optimize the signal quality of the optical signal received by the optical module.

[0082] The present application does not limit the specific form or packaging process of the first package. For example, the first package can be a transistor TO-type package or a butterfly-shaped package. The packaged optical emission subassembly can also be called an emission optical submodule TOSA. Figure 5 Three TOSAs 5 are schematically shown. Figure 5As shown, laser chips 11 to 13 are respectively packaged in different TOSAs 5. Taking the TOSA 5 corresponding to the laser chip 11 as an example, refer to Figure 5 The TOSA 5 includes a TO tube base 51, a lead 52 and a TO tube cap 53. The TO tube base 51 serves as a base of the laser chip 11. The lead 52 is used to electrically connect the pins of the laser chip 11. The TO tube cap 53 is used to provide a stable optical signal transmission for the laser chip 11 and provide a light guide port for transmitting optical signals between the inside and outside of the TOSA 5. The TO tube cap 53 and the TO tube base 51 together form a sealed package for the laser chip 11.

[0083] Figure 5 Taking the example that only one laser chip can be packaged in each first package, optionally, at least two light emitting sub-components can be packaged in at least one first package.

[0084] The present application does not limit the specific form or packaging process of the second packaging body. For example, the second packaging body can be a packaging body of a box shape. Figure 5 A second packaging body of the box type is schematically shown. Figure 5 As shown, the demultiplexing subassembly 41, PD 42, PD 43 and PD 44 can be integrated and packaged in the cavity of the second package body 6. Optionally, PD 42, PD 43 and PD 44 can be arranged on a base 61 in the second package body 6. The demultiplexing subassembly 41 can be arranged on a base with an adjustable height in the second package body 6 to adjust the optical path in the second package body 6. The second package body has at least one light guide port (e.g. Figure 5 The light guide port 62 and the light guide port 63 are shown to transmit optical signals between the outside and the inside.

[0085] By using BOX packaging to package the optical receiving component, it is helpful to meet the requirements of 4nm bandwidth and 30dB isolation of the optical receiving signal of 50G-PON, and meet the precision requirements of the demultiplexing subcomponent of the multi-mode optical module. On the other hand, by using TO packaging to package the optical transmitting subcomponents in the optical module to obtain multiple TOSAs, and then assembling the optical transmitting components based on TOSA, a mature and low-cost solution is retained, reducing the overall cost. Moreover, compared with the second implementation method, it is helpful to reduce the number of lenses in the optical module, improve coupling efficiency, and reduce coupling costs.

[0086] Optionally, the optical component is packaged inside the second package. The second package may have a first light guide port (e.g., light guide port 62) and a second light guide port (e.g., light guide port 63). The first light guide port is used to transmit optical signals between the multiplexing subassembly outside the second package and the optical component inside the second package, and the second light guide port is used to transmit optical signals between the optical port and the optical component. Figure 5 , the circulator 2 can be integrated with the optical receiving component in the cavity of the second package body 6, receive the optical transmission signal from the filter 15 through the light guide port 62, send the optical transmission signal to the optical port 3 through the light guide port 63, and receive the optical reception signal from the optical port 3. In this way, it is not only helpful to reduce the volume of the optical module, but also helpful to reduce the interference of the interference light signal to the optical transmission sub-component. Figure 5 As shown, optionally, the optical port 3 can be packaged in a receptacle manner and inserted into the second light guide port, which is beneficial to improving the overall airtightness.

[0087] Optionally, the plurality of first packaging bodies and the second packaging bodies are fixed together by a connector, and the connector has a cavity inside, and the cavity is used to connect the light guide port of each first packaging body and the first light guide port. Figure 5 As shown, the three TOSAs 5 where the laser chips 12 to 13 are located and the second package 6 are fixed together by a four-way connector 7. The four-way connector 7 is provided with four through holes. The three TOSAs 5 and the second package 6 are respectively fixed in the four through holes. The optical signals emitted by the laser chips 12 to 13 can be transmitted to the second package 6 through the cavity inside the four-way connector 7. In this way, it is beneficial to reduce the volume of the optical module and improve the overall stability and airtightness of the optical module.

[0088] Optionally, the multiplexing subassembly may be disposed in the cavity of the connector. Figure 5 As shown, the filter 14 and the filter 15 can be arranged inside the cavity of the four-way connector 7 , and the optical signals emitted by the laser chips 12 to 13 are combined in the cavity of the four-way connector 7 and then incident into the cavity of the second package 6 .

[0089] Or, optionally, the optical component may be packaged in the cavity of the connector, and accordingly, the cavity of the connector is also used to connect the optical port, the light guiding port of the first package body and the light guiding port of the second package body.

[0090] Figure 6 Schematically shown Figure 5 The schematic diagram or simplified diagram of the optical module shown in FIG. Figure 6As shown, the laser chips 11 to 13 are respectively packaged as three TOSAs 5 using TO, and the demultiplexing subassembly 41, PD 42, PD 43, PD 44 and circulator 2 are integrated and packaged in the cavity of the second package body 6. The three optical signals emitted by the three TOSAs 5 are wavelength multiplexed through the filter set by 45D, and the optical transmission signal is obtained by combining the light. The optical transmission signal enters the circulator from the port 21 of the circulator 2, and is emitted to the optical port 3 through the port 22 of the circulator. The optical port 3 is used as a common port for the optical receiving signal and the optical transmitting signal, and is also used to receive the optical receiving signal. The optical receiving signal enters the circulator through the port 22 of the circulator 2, and is emitted to the incident end of the demultiplexing subassembly 41 through the port 23 of the circulator. The demultiplexing subassembly 41 outputs the three optical signals obtained by separation from the three output ends, and the three optical signals are respectively incident on PD 42, PD 43 and PD 44.

[0091] The following describes the packaging method of the optical module by taking the example that the wavelength interval of optical signals of different modes emitted by the optical module is smaller than the wavelength interval of optical signals of different modes received. Assuming that the wavelength interval of multiple modes of downstream optical signals is larger than the wavelength interval of multiple modes of upstream optical signals, the optical module can be used to access the ONU accordingly.

[0092] In order to balance low cost, high performance and high manufacturability, multiple optical receiving subassemblies can be respectively packaged inside multiple first packaging bodies to reduce costs, and the optical transmitting assembly can be packaged inside the second packaging body to improve the accuracy of the optical path of the optical transmitting signal. Multiple first packaging bodies can be arranged outside the second packaging body, which is conducive to reducing the crosstalk between the optical transmitting signal and the optical receiving signal. By adopting this hybrid packaging method to package the optical module, it is not only conducive to reducing the overall cost of the optical module, but also conducive to optimizing the signal quality of the optical signal transmitted by the optical module.

[0093] The present application does not limit the specific form or packaging process of the first package. For example, the first package can be a transistor-shaped TO-type package or a butterfly-shaped package as described above. The packaged optical receiving subassembly can also be called a TOSA. The structure of the TOSA can refer to the TOSA 5 described above, except that the laser chip packaged in the TOSA 5 needs to be replaced with a photodetector chip.

[0094] The present application does not limit each first package to encapsulate only one photodetector chip. Optionally, at least two photodetector chips may be encapsulated in at least one first package.

[0095] The present application does not limit the specific form or packaging process of the second package. For example, the second package can be a package of the box shape type described above. The second package can refer to the second package 6 described above, except that the light receiving component in the second package 6 is replaced by a light emitting component.

[0096] By using BOX packaging to package the optical transmitting component, it is helpful to meet the requirements of 4nm bandwidth and 30dB isolation for transmitting the uplink signal of 50G-PON, and meet the precision requirements of the multiplexing sub-components of the multi-mode optical module. On the other hand, by using TO packaging to package the optical receiving sub-components in the optical module to obtain multiple ROSAs, and then assembling the optical receiving components based on ROSA, it retains a mature and low-cost solution, reduces the overall cost, and, compared with the second implementation method, is helpful to reduce the number of lenses in the optical module, improve coupling efficiency, and reduce coupling costs.

[0097] Optionally, as described above, the optical component can be encapsulated inside the second package body. The second package body can have a first light guide port and a second light guide port. The first light guide port is used to transmit optical signals between the demultiplexing subassembly outside the second package body and the optical component inside the second package body, and the second light guide port is used to transmit optical signals between the optical port and the optical component. In this way, it is beneficial to reduce the volume of the optical module. Optionally, the optical port can use a receptacle packaging method and be inserted in the second light guide port, which is beneficial to improve the overall airtightness.

[0098] Optionally, the plurality of first packages and the second packages are fixed together by a connector, and the connector has a cavity inside, and the cavity is used to connect the light guide port of each first package and the first light guide port. Figure 5 The four-way connector 7 shown, and Figure 5 The difference of the four-way connector 7 shown is that a demultiplexing subassembly can be arranged in the cavity of the connector, and the cavity of the connector is used to receive optical signals from the second package and transmit the optical signals to each first package.

[0099] Or, optionally, the optical component may be packaged in the cavity of the connector, and accordingly, the cavity of the connector is also used to connect the optical port, the light guiding port of the first package body and the light guiding port of the second package body.

[0100] The optical module may also include a shell having an opening, and the components in the optical module (such as an optical transmitting component, an optical receiving component, an optical component and a circuit board, etc.) may be arranged in a cavity inside the shell, and the optical signal interface is used to connect the optical signal medium including the shell through the opening.

[0101] The present application does not limit the application scenario of the optical module. Optionally, the optical module can be applied to any optical communication device. For example, as described above, the optical module provided by the present application can be applied to OLT, or the optical module provided by the present application can be applied to ONU, which is conducive to supporting the coexistence and smooth evolution of multiple generations of PON technology in the same ODN, and supporting the continuous improvement of signal transmission rate.

[0102] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method examples, and will not be repeated here. The "A and / or B" involved in the examples of this application can be understood to include the two schemes of "A and B" and "A or B". The terms "first", "second", "third", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable where appropriate, and this is merely a way of distinguishing the objects of the same attributes used in the examples of this application.

[0103] In the several examples provided in this application, it should be understood that the disclosed modules or devices or equipment can be implemented in other ways. For example, the device examples described above are only illustrative. Another point is that the coupling or direct coupling or communication connection between each other shown or discussed can be an indirect coupling or communication connection through some interface, device or unit, which can be electrical or other forms.

[0104] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optical module, characterized in that: The optical module includes an optical transmitting component, an optical receiving component, an optical component and an optical signal interface, the optical transmitting component includes a plurality of optical transmitting sub-components and a multiplexing sub-component, the optical receiving component includes a plurality of optical receiving sub-components and a demultiplexing sub-component, the plurality of optical transmitting sub-components are respectively packaged inside a plurality of first packaging bodies and the optical receiving component is packaged inside a second packaging body, or the plurality of optical receiving sub-components are respectively packaged inside a plurality of first packaging bodies and the optical transmitting component is packaged inside a second packaging body, wherein the plurality of first packaging bodies are arranged outside the second packaging body; Each of the optical emission subassemblies is used to convert an electrical signal into an optical signal, and then emit the converted optical signal; The multiplexing subassembly is used to combine the multiple optical signals emitted by the multiple optical emitting subassemblies to obtain an optical emitting signal, wherein the wavelengths of the optical signals emitted by at least two of the optical emitting subassemblies are different; The optical component is used to transmit the optical transmission signal to the optical signal interface; The optical signal interface is used to connect to an optical signal medium, input the optical transmission signal to the optical signal medium, and receive the optical reception signal from the optical signal medium; The optical component is also used to transmit the optical receiving signal to the demultiplexing subcomponent; The demultiplexing subassembly is used to separate multiple optical signals from the optical reception signal, wherein at least two optical signals of the multiple optical signals have different wavelengths; Each of the optical receiving subassemblies is used to receive one optical signal separated by the demultiplexing subassembly and convert it into an electrical signal.

2. The optical module according to claim 1, characterized in that: The demultiplexing subassembly / the multiplexing subassembly comprises a glass carrier, one side of the glass carrier is coated with a reflective film, and the other side of the glass carrier is provided with a plurality of filters.

3. The optical module according to claim 2, characterized in that: The light receiving assembly / the light transmitting assembly further comprises a plurality of lens subassemblies; The plurality of lens sub-assemblies are used to couple electrical signals between the plurality of filters and the plurality of light receiving sub-assemblies / the plurality of light emitting sub-assemblies.

4. The optical module according to any one of claims 1 to 3, characterized in that: The plurality of first packaging bodies and the second packaging body are fixed together by a connector, and the connector has a cavity inside, and the cavity of the connector is used to connect the light guide port of each of the first packaging bodies with the first light guide port of the second packaging body.

5. The optical module according to claim 4, characterized in that: The optical component is encapsulated in the second encapsulation body, and the second encapsulation body further has a second light guide port, and the second light guide port is used to connect to the optical signal interface; or, The optical component is encapsulated in the cavity of the connector, and the cavity of the connector is also used to connect the optical signal interface.

6. The optical module according to any one of claims 1 to 5, characterized in that: The first package is a transistor TO-type package, and the second package is a box-type package.

7. The optical module according to any one of claims 1 to 6, characterized in that: The optical component is a circulator having a first port, a second port and a third port; The circulator is used to receive the optical transmit signal from the multiplexing subassembly through the first port and send the optical transmit signal to the optical signal interface through the second port; The circulator is further configured to receive the optical receive signal from the optical signal interface through the second port, and send the optical receive signal to the demultiplexing subassembly through the third port.

8. The optical module according to any one of claims 1 to 7, characterized in that: The light emitting subassembly is a laser chip.

9. The optical module according to any one of claims 1 to 8, characterized in that: The light receiving subassembly is a photodetector chip.

10. The optical module according to any one of claims 1 to 9, characterized in that: The optical signal medium is an optical fiber.

11. The optical module according to any one of claims 1 to 10, characterized in that: The optical module further comprises a shell having an opening, the optical transmitting component, the optical receiving component and the optical component are arranged in a cavity in the shell, and the optical signal interface is used to connect the optical signal medium through the opening.

12. An optical communication device, characterized in that: The optical communication device comprises a host and an optical module according to any one of claims 1 to 11, wherein the optical module is used to connect an optical signal medium; The host is used to send an electrical signal to the optical module; The optical module is used to convert the electrical signal sent by the host into an optical signal, and then send the converted electrical signal to the optical signal medium; The optical module is also used to receive an optical signal from the optical signal medium, and then convert the received optical signal into an electrical signal; The host is also used to receive the converted electrical signal from the optical module.

13. The optical communication device according to claim 12, characterized in that: The optical communication equipment is an optical line terminal OLT or an optical network terminal ONU.

14. A system, characterized in that: The system comprises a plurality of optical communication devices, at least one of the plurality of optical communication devices is as described in claim 12 or 13, and different optical communication devices among the plurality of optical communication devices are connected via an optical interconnection network.

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