Display substrate

Abstract

The embodiment of the invention provides a display substrate, which is applied to the technical field of display equipment and comprises a binding area, a first device area, a driving chip and a display area, the binding area, the first device area and the driving chip are located on the first direction side of the display substrate; the binding area is located on the first direction side of the driving chip; the first device region is located on the second direction side and / or the third direction side of the driving chip; the second direction is opposite to the third direction; the first direction is perpendicular to the second direction and the third direction. Through the scheme of the embodiment of the invention, the first device region can be arranged on the second direction side and / or the third direction side of the driving chip on one side of the binding region, so that the space on the other side of the binding region is saved, and the layout space of the battery compartment is conveniently increased.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to a display substrate. Background Art

[0002] At present, battery capacity, as an important indicator to measure the performance of display devices, has always been the focus of consumers. How to increase battery capacity has also become the focus of display device design. At the same time, in the field of FPC (Flexible Printed Circuit), because the FPC shape occupies a large space, and the IC (microchip) in the display device is often located above the binding area, and the device area is arranged below the binding area, and the wiring is connected to the device area, which occupies a lot of space below the binding area, thereby limiting the layout of the battery compartment below the binding area. Summary of the invention

[0003] The purpose of the embodiment of the present invention is to provide a display substrate to solve the problem that the IC and device areas occupy a large space and affect the layout of the battery compartment. The specific technical solution is as follows:

[0004] An embodiment of the present application provides a display substrate, the display substrate comprising a binding area, a first device area, a driving chip and a display area;

[0005] The binding area, the first device area and the driving chip are located on the first direction side of the display substrate; the binding area is located on the first direction side of the driving chip; the first device area is located on the second direction side and / or the third direction side of the driving chip;

[0006] The second direction is opposite to the third direction; the first direction is perpendicular to the second direction and the third direction respectively.

[0007] In a possible implementation manner, the display substrate further includes a second device region;

[0008] The second device region is located at the first direction side of the binding region.

[0009] In a possible implementation manner, the number of the first device areas is three, and the number of the driving chips is two;

[0010] The three first device regions and the two driving chips are arranged alternately.

[0011] In a possible implementation manner, the display substrate further includes a test point;

[0012] The test point is located on the second direction side and / or the third direction side of the driving chip.

[0013] In a possible implementation manner, the test points are in two groups and the driving chips are in two groups;

[0014] Both groups of test points are located outside the two driver chips.

[0015] In a possible implementation, the display substrate is a flexible circuit board FPC;

[0016] The distance between the first device area and the driving chip in the second direction or the third direction is not less than 4 mm.

[0017] In a possible implementation manner, the distance between the edge of the display substrate and the driving chip in the second direction or the third direction is not less than 1.5 mm;

[0018] The distance between the edge of the display substrate and the driving chip in the first direction is not less than 0.9 mm.

[0019] In a possible implementation, the display substrate is a flexible circuit board FPC;

[0020] Sealant is provided around the driving chip;

[0021] A sealant is arranged on the chevron-shaped edge of the display substrate close to the driving chip.

[0022] In a possible implementation, the display substrate further includes a TIC chip, a low-voltage driving power supply ELVSS, a positive power supply voltage ELVDD, and a power supply voltage ELAVDD of an auxiliary circuit;

[0023] The TIC chip is located at the second direction side of the display substrate; at least one of the ELVSS, ELVDD and ELAVDD is located at the first device area at the second direction side of the three first device areas;

[0024] or,

[0025] The TIC chip is located on the third direction side of the display substrate; at least one of the ELVSS, ELVDD and ELAVDD is located in a first device region on the third direction side among the three first device regions.

[0026] In a possible implementation, the display substrate further includes a battery;

[0027] The battery is located on the first direction side of the binding area and is adjacent to the binding area.

[0028] Beneficial effects of the embodiments of the present invention:

[0029] A display substrate provided by an embodiment of the present invention comprises a binding area, a first device area, a driver chip and a display area; the binding area, the first device area and the driver chip are located on the first direction side of the display substrate; the binding area is located on the first direction side of the driver chip; the first device area is located on the second direction side of the driver chip, and / or the third direction side; the second direction and the third direction are opposite; the first direction is perpendicular to the second direction and the third direction, respectively. Through the solution of the embodiment of the present application, the first device area can be set on one side of the driver chip in the binding area, on the second direction side and / or the third direction side of the driver chip, thereby saving space on the other side of the binding area, solving the problem that the IC and the device area occupy a large space and affect the layout of the battery compartment, and increasing the layout space of the battery compartment.

[0030] Of course, it is not necessary to achieve all of the advantages described above at the same time to implement any product or method of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0032] Figure 1 A schematic diagram of a design of a conventional display substrate provided in an embodiment of the present application;

[0033] Figure 2 A schematic diagram of a display substrate provided in an embodiment of the present application;

[0034] Figure 3 Another schematic diagram of a display substrate provided in an embodiment of the present application;

[0035] Figure 4 Another schematic diagram of a display substrate provided in an embodiment of the present application;

[0036] Figure 5 An example diagram of a display substrate provided in an embodiment of the present application;

[0037] Figure 6 A schematic diagram of a sealing glue for a display substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field based on this application belong to the scope of protection of the present invention.

[0039] In order to illustrate the solution of the embodiment of the present application, the layout of a conventional display substrate is first described. Figure 1 , Figure 1 A design schematic diagram of a conventional display substrate provided for an embodiment of the present application. In the design of the conventional project module FPC (Flexible Printed Circuit), the binding area is a single-layer board, which is connected to the panel binding area through ACF (Anisotropic Conductive Film). The lower side of the FPC binding area is designed as a multi-layer board, and the device area and test points are all in the multi-layer board area. It also includes IC (microchip), and the IC can be a D-IC (digital chip). This design will cause all routing to be in the multi-layer board position, there are many routings, and the routing needs to avoid the device area, etc., resulting in a significant increase in the Y-direction width of the multi-layer board. ‌ Among them, the FPC binding area‌ refers to the contact area between the FPC and the target substrate during the FPC binding process. The binding area is a key part to ensure a good electrical connection between the two. Because the multi-layer board itself is thicker, and the back of the device area needs to be affixed with a steel sheet and adhesive, the Z-direction height of the FPC multi-layer board is often larger. In order to consider the overall Z-direction thickness of the whole machine, the battery cannot be designed in the Z-direction of the FPC multilayer board, so it can only be designed outside the FPC multilayer board, which greatly compresses the battery compartment space of the whole machine.

[0040] In order to solve the problem that the IC and device areas occupy a large space and affect the layout of the battery compartment, the present application embodiment provides a display substrate, see Figure 2 , Figure 2 A schematic diagram of a display substrate provided in an embodiment of the present application; the display substrate includes a binding area 201, a first device area 202, a driving chip 203, and a display area 204;

[0041] The binding area, the first device area and the driving chip are located on the first direction side of the display substrate; the binding area is located on the first direction side of the driving chip; the first device area is located on the second direction side and / or the third direction side of the driving chip;

[0042] The second direction is opposite to the third direction; the first direction is perpendicular to the second direction and the third direction respectively.

[0043] In the embodiment of the present application, compared with the conventional design in which the binding area is located on the first direction side of the driver chip and the first device area is set on the first direction side of the binding area, the first device area is set on the second direction side and / or the third direction side of the driver chip in the embodiment of the present application. For example, when the X direction of the display substrate represents the horizontal direction, from left to right, and the Y direction represents the vertical direction, from top to bottom; in the traditional design, the driver chip is set on the reverse side of the Y direction of the binding area, and the device area is set on the positive side of the Y direction of the binding area. However, through the method of the embodiment of the present application, when the binding area is located on the first direction side of the driver chip, the first device area is located on the second direction side of the driver chip, and / or the third direction side. In one case, when the first direction is the positive direction of the Y direction, the second direction can be the positive direction of the X direction, and the third direction is the reverse direction of the X direction, or, when the first direction is the positive direction of the Y direction, the second direction can be the reverse direction of the X direction, and the third direction is the positive direction of the X direction. In yet another case, when the first direction is in the opposite direction of the Y direction, the second direction may be in the positive direction of the X direction, and the third direction may be in the opposite direction of the X direction, or, when the first direction is in the opposite direction of the Y direction, the second direction may be in the opposite direction of the X direction, and the third direction may be in the positive direction of the X direction. In yet another case, when the first direction is in the positive direction of the X direction, the second direction may be in the positive direction of the Y direction, and the third direction may be in the opposite direction of the Y direction, or, when the first direction is in the positive direction of the X direction, the second direction may be in the opposite direction of the Y direction, and the third direction may be in the positive direction of the Y direction. In yet another case, when the first direction is in the opposite direction of the X direction, the second direction may be in the positive direction of the Y direction, and the third direction may be in the opposite direction of the Y direction, or, when the first direction is in the opposite direction of the X direction, the second direction may be in the opposite direction of the Y direction, and the third direction may be in the positive direction of the Y direction. For details, see Figure 2 ,‌In the traditional design, the driver chip is arranged on the upper side of the binding area, and the device area is arranged on the lower side of the binding area. Through the method of the embodiment of the present application, when the binding area is located at the lower edge of the display substrate, the binding area is located at the lower side of the driver chip, and the first device area is located on the left side and / or the right side of the driver chip. Or, when the binding area is located at the upper edge of the display substrate, the binding area is located on the upper side of the driver chip, and the first device area is located on the left side and / or the right side of the driver chip. Or, when the binding area is located at the left edge of the display substrate, the binding area is located on the left side of the driver chip, and the first device area is located on the upper side and / or the lower side of the driver chip. Or, when the binding area is located at the right edge of the display substrate, the binding area is located on the right side of the driver chip, and the first device area is located on the upper side and / or the lower side of the driver chip.

[0044] See also Figure 2, through the method of the embodiment of the present application, when the binding area is located at the lower edge of the display substrate, the binding area is located at the lower side of the driver chip, and the first device area is located on the left and / or right side of the driver chip. Because in actual use, the battery compartment is located on the side of the binding area opposite to the driver chip, and will not be on the same side as the driver chip. Through the design of the present application, the space on both sides of the driver chip can be fully utilized, and the device area is set on the upper side of the binding area, on one side or both sides of the driver chip, thereby saving the space on the lower side of the binding area, which is conducive to increasing the space of the battery compartment arranged on the lower side of the binding area. Correspondingly, when the binding area is located at the upper edge of the display substrate, the binding area is located on the upper side of the driver chip, and the first device area is located on the left and / or right side of the driver chip, thereby saving the space on the upper side of the binding area, which is conducive to increasing the space of the battery compartment arranged on the upper side of the binding area. In a possible implementation, the display substrate also includes a battery; the battery is located on the first direction side of the binding area and is adjacent to the binding area. Adjacent here means that the present application request includes a design in which the device area may not be set on the first direction side of the binding area. Through the method of the embodiment of the present application, the space on both sides of the driver chip can be used to solve the problem that the IC and device area occupy a large space and affect the layout of the battery compartment, and the layout space of the battery compartment can be increased. In addition, since the battery capacity of current electronic devices has a great impact on the performance of the device, for example, the battery capacity of a smartphone directly affects the standby time of the smartphone, therefore, by increasing the layout space of the battery compartment, it is beneficial to increase the capacity of the battery, improve the performance of the mobile phone and improve the user experience.

[0045] Wherein, the first device area is located on the second direction side and / or the third direction side of the driver chip. Specifically, the second direction and the third direction are opposite in direction; the first direction is perpendicular to the second direction and the third direction respectively. In one example, the first direction is the opposite direction of the Y direction, and the second direction and the third direction are respectively the positive direction and the negative direction of the X direction, or the first direction is the positive direction of the Y direction, and the second direction and the third direction are respectively the positive direction and the negative direction of the X direction, or the first direction is the positive direction of the X direction, and the second direction and the third direction are respectively the positive direction and the negative direction of the Y direction, or the first direction is the opposite direction of the X direction, and the second direction and the third direction are respectively the positive direction and the negative direction of the Y direction. See. Figure 2, when the first direction is the positive direction of the Y direction, and the second direction and the third direction are the positive direction and the reverse direction of the X direction respectively, the driver chip is arranged on the reverse side of the Y direction of the binding area, and the first device area is located on one side or both sides of the X direction of the driver chip. It should also be noted that the first device area in the embodiment of the present application can be one or more. In one case, when there is one driver chip, the first device area is located on any side of the second direction and the third direction of the driver chip, or there are two first device areas, and the two first device areas can be located on both sides of the driver chip at the same time. In another case, when there are two driver chips, if there is one first device area, it can be located on any side of the second direction and the third direction of the two driver chips, and if there are two first device areas, it can be located on the outside of the two driver chips. In another case, when there are three driver chips, the first device area can be set both on the outside of the two driver chips and in the middle of the two driver chips. For another example, when there are multiple driver chips, refer to the case of two, and the first device area can be set both on the outside of the driver chip and in the middle of the driver chip. Therefore, not only the space on both sides of the driving chip can be utilized, but also the space on the first direction side of the binding area can be saved, which is beneficial to increase the layout space of the battery compartment.

[0046] It can be seen that through the solution of the embodiment of the present application, a first device area can be set on the second direction side and / or the third direction side of the driving chip on one side of the binding area, thereby saving space on the other side of the binding area, thereby facilitating the increase of the layout space of the battery compartment.

[0047] In a possible implementation, the display substrate further includes a second device area; the second device area is located on the first direction side of the binding area. Through the solution of the embodiment of the present application, the first device area can be set, and the second device area can be set on the first direction side of the binding area, so as to prevent the situation where the space of the first device area is insufficient and increase the spatial position of the device setting. At the same time, it should be noted that the device should be set in the first device area first, and the second device area should be set only when the first device area is insufficient. When the first device area is sufficient to place the device, a battery compartment can be set on the first direction side of the binding area without setting the device area, so that the space of the battery compartment can be increased. When the space of the first device area is insufficient to place all the devices, the second device area is set on the first direction side of the binding area. At the same time, compared with the prior art, even if the second device area is set on the first direction side of the binding area, the device can be placed preferentially in the first device area. Therefore, even if the second device area is set on the first direction side of the binding area, the space of the second device area will be smaller than that of the device area in the conventional design, so as to facilitate the increase of the space of the battery compartment on the first direction side of the binding area, thereby helping to increase the battery capacity and improve the performance of the device.

[0048] In a possible implementation manner, there are three first device areas and two driver chips; the three first device areas and the two driver chips are arranged alternately. Figure 3 , Figure 3 Another schematic diagram of a display substrate provided for an embodiment of the present application. The display substrate includes a binding area 201, a display area 204, three first device areas 202 and two driver chips 203, which are arranged alternately. As shown in the figure, in one case, when the first device area and the driver chip are arranged in the positive direction along the X direction, the first device area, the driver chip, the first device area, the driver chip, and the first device area are respectively arranged in the X direction. And in the positive direction along the Y direction, the driver chip and the first device area on both sides can be included, and then the binding area. Combined with the above embodiment, the positive direction of the Y direction of the binding area can also include the second device area and the battery compartment. In another case, when the first device area and the driver chip are arranged in the positive direction along the Y direction, the first device area, the driver chip, the first device area, the driver chip, and the first device area are respectively arranged in the Y direction. And in the positive direction along the X direction, the driver chip and the first device area on both sides can be included, and then the binding area, or, the reverse direction along the X direction can include the driver chip and the first device area on both sides, and then the binding area. Through the solution of the embodiment of the present application, two driver chips can be set up, and the space on both sides of the driver chips and the space in the middle of the two driver chips can be fully utilized. The first device area is set on the outside of the two driver chips and in the middle of the two driver chips, thereby improving space utilization and increasing the space of the battery compartment on the first direction side of the binding area, which helps to increase the battery capacity and improve equipment performance.

[0049] In a possible implementation, the display substrate further includes a test point; the test point is located on the second direction side and / or the third direction side of the driver chip. Among them, the functions of the test point may include: 1. Fault diagnosis and repair: The test point can help engineers quickly locate and repair faults on the circuit board. By connecting the test instrument, engineers can quickly identify the problem and repair it, thereby improving the repair efficiency; 2. Performance verification: The test point can be used to verify the correctness and performance of the design. By connecting the test equipment, it can be ensured that each part of the circuit board works according to the specifications; 3. Firmware / software development: Test points are also very important for developing firmware and software, and can be used to monitor signals, debug code, and verify communication protocols; 4. Product quality control: In mass production, test points can be used for quality control. By performing tests on each circuit board, manufacturing defects can be captured and product quality can be ensured; 5. Automated testing: Test points facilitate the operation of automated testing equipment, and signals can be collected and tested through tools such as probes, greatly improving test efficiency; 6. Signal capture and debugging: Test points allow the test leads of measuring instruments to directly contact key points on the circuit board, making it convenient for debuggers to capture signals such as voltage, short circuit, impedance, etc., which serve as an important reference for judging hardware quality. Compared with conventional designs, in which the test points are set in the first direction of the binding area, which encroaches on the space of the battery compartment, the solution of the embodiment of the present application can set the binding area in the first direction of the test points and be located on the second direction side of the driver chip, and / or the third direction side, thereby further saving space for the battery compartment and facilitating the increase of the size of the battery compartment. In one possible implementation, there are two groups of test points and two driver chips; both groups of test points are located on the outside of the two driver chips. See. Figure 4 , Figure 4 Another schematic diagram of a display substrate provided for an embodiment of the present application. As shown in the figure, the display substrate in the embodiment of the present application includes a binding area 201, a display area 204, a first device area 202, two driver chips 203, a test point and a second device area. The test point also includes two groups. The test point and the driver chip can be arranged along the X direction. Both groups of test points are located on the outside of the two driver chips. Along the X direction, they can be test points, driver chips, driver chips, and test points. Combined with the above-mentioned related schemes of the first device area and the second device area, as shown in the figure, along the X direction, they are: test points, first device area, driver chips, first device area, driver chips, first device area, test points, and along the Y direction, they also include a binding area and a second device area.

[0050] In one possible implementation, the display substrate is a flexible circuit board FPC; the distance between the first device area and the driver chip in the second direction or the third direction is not less than 4mm. In one possible implementation, the distance between the edge of the display substrate and the driver chip in the second direction or the third direction is not less than 1.5mm; the distance between the edge of the display substrate and the driver chip in the first direction is not less than 0.9mm. In one case, the distance between the first device area and the driver chip in the X direction is not less than 4mm. The distance between the edge of the display substrate and the driver chip in the X direction is not less than 1.5mm; the distance between the edge of the display substrate and the driver chip in the Y direction is not less than 0.9mm. In the embodiment of the present application, by setting the spacing requirements between the first device area and the driver chip, and the distance requirements between the edge of the display substrate and the driver chip, interference with IC binding can be prevented. At the same time, in order to set the distance between the binding area and the outer edge of the FPC, the FPC on the reverse side of the Y direction of the binding area is in the shape of a mountain, which can facilitate avoiding interference with IC binding. The main functions of the driver chip in the current display substrate can include signal conversion, control of the refresh rate and response time of the display screen, intelligent functions, etc. Among them, the display driver chip is the bridge between the display screen and the main controller, responsible for converting digital signals into images that can be presented by the display. Specifically, it can include: ‌Signal conversion‌: The main controller of a computer or other device generally outputs digital signals, while the display requires analog signals to display images. The driver chip processes the input digital signal and converts it into a format suitable for the display. This process involves not only signal conversion, but also image processing, such as color adjustment, brightness optimization, contrast adjustment, etc., to ensure image quality and clarity. ‌Control the refresh rate and response time of the display screen‌: Among them, the refresh rate refers to the number of times the display updates the image per second. A higher refresh rate can provide a smoother visual experience, which is especially important when playing games and videos. The response time can affect the dynamic performance of the image, reduce the phenomenon of smearing, and make fast-moving images clearer. Display driver chips usually have the characteristics of high refresh rate and low response time, which can meet users' needs for high-quality visual experience. Therefore, it is very important to set the distance between each chip to prevent interference and ensure the normal operation of the driver chip.

[0051] In a possible implementation, the display substrate further includes a TIC chip, a low-voltage driving power supply ELVSS, a positive power supply voltage ELVDD, and a power supply voltage ELAVDD of an auxiliary circuit;

[0052] The TIC chip is located at the second direction side of the display substrate; at least one of the ELVSS, ELVDD and ELAVDD is located at the first device area at the second direction side of the three first device areas;

[0053] or,

[0054] The TIC chip is located on the third direction side of the display substrate; at least one of the ELVSS, ELVDD and ELAVDD is located in a first device region on the third direction side among the three first device regions.

[0055] In the embodiment of the present application, the first device region may be provided with at least one of ELVSS (low voltage driving power supply), ELVDD (positive power supply voltage) and ELAVDD (power supply voltage of auxiliary circuit), see Figure 4 , when there are three first device areas, one or more of ELVSS, ELVDD and ELAVDD can be set in the first device area closest to TIC (test interface controller) according to the principle of proximity of routing. Specifically, when the TIC chip is located on the second direction side of the display substrate, at least one of ELVSS, ELVDD and ELAVDD is located in the first device area on the second direction side of the three first device areas; when the TIC chip is located on the third direction side of the display substrate, at least one of ELVSS, ELVDD and ELAVDD is located in the first device area on the third direction side of the three first device areas. In one example, when the TIC chip is located on the leftmost side of the display substrate, one or more of ELVSS, ELVDD and ELAVDD are set in the leftmost first device area, and when the TIC chip is located on the rightmost side of the display substrate, one or more of ELVSS, ELVDD and ELAVDD are set in the rightmost first device area.

[0056] Therefore, see Figure 4 In the above embodiment of the present application, components are arranged on both sides of the FPC binding area, and the FPC on the opposite side of the Y direction of the binding area forms a mountain shape, which can avoid interference with the IC when binding. Figure 5 , when designing the FPC in a mountain shape, a reasonable distance from the D-IC design is required. The device is placed preferentially in the device area on the reverse side of the Y direction of the binding area. According to the principle of proximity of the FPC routing, the device is placed arbitrarily in the three areas on the reverse side of the Y direction of the binding area. As many devices as possible are placed on the reverse side of the Y direction of the binding area. At the same time, the relevant impedance test points and signal line test points are also moved to the reverse side of the Y direction of the binding area. The layout of devices on both sides of the binding area makes the routing more flexible, and also reduces the number of routings and devices on the positive side of the Y direction of the FPC binding side, effectively reducing the FPC multilayer board space on the reverse side of the Y direction of the FPC binding area, thereby further increasing the battery compartment space and improving the battery life of the whole machine.

[0057] In a possible implementation, the display substrate is a flexible circuit board FPC; the driver chip is provided with sealant around its periphery; and the chevron-shaped edge of the display substrate near the driver chip is provided with sealant. Figure 6 , Figure 6 A schematic diagram of the sealing of the display substrate provided in the embodiment of the present application. In the embodiment of the present application, after the FPC binding process is completed, the sealing glue dispensing path around the D-IC is optimized, and the D-IC and the FPC mountain-shaped edge are sealed at the same time. The FPC sealing glue covers the FPC mountain-shaped edge, and the FPC back glue is added to completely seal the surrounding area of ​​the FPC binding, which can effectively improve the corrosion resistance of the binding area and the waterproof ability of the whole machine. At the same time, the dispensing can also play the following roles: ‌Reinforcement and sealing‌: Dispensing can enhance the connection strength between the chip and the substrate, prevent the chip from loosening when it is impacted and falls, thereby improving the anti-fall, anti-vibration, anti-fall, extrusion, bending and other performances of the whole machine. ‌Protect the chip‌: Dispensing can form a protective film to isolate the dust, moisture and chemicals from the outside world, prevent the chip from being corroded and oxidized, and thus extend the service life of the chip. ‌Insulation and moisture-proof‌: Dispensing can play the role of insulation and moisture-proof, protecting chips and electronic components from moisture, dust, external forces and other factors that cause failure. ‌Shielding interference signals‌: Dispensing glue can shield interference signals and prevent chip electronic components from being affected by electromagnetic interference and causing performance degradation‌. ‌Improving heat dissipation efficiency‌: Specific thermal conductive glue can not only protect the chip, but also enhance the heat conduction efficiency between the chip and the heat sink, ensuring that the device will not be degraded or damaged due to chip overheating during long-term operation.

[0058] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented by software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present invention is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from one website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or data center that includes one or more available media integrated. The available medium may be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive Solid State Disk (SSD)), etc.

[0059] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0060] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0061] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.

Claims

1. A display substrate, characterized in that: The display substrate comprises a binding area, a first device area, a driving chip and a display area; The binding area, the first device area and the driving chip are located on the first direction side of the display substrate; the binding area is located on the first direction side of the driving chip; the first device area is located on the second direction side and / or the third direction side of the driving chip; The second direction is opposite to the third direction; the first direction is perpendicular to the second direction and the third direction respectively.

2. The display substrate according to claim 1, characterized in that: The display substrate further includes a second device region; The second device region is located at the first direction side of the binding region.

3. The display substrate according to claim 1, characterized in that: The number of the first device areas is three, and the number of the driving chips is two; The three first device regions and the two driving chips are arranged alternately.

4. The display substrate according to claim 1, characterized in that: The display substrate further includes a test point; The test point is located on the second direction side and / or the third direction side of the driving chip.

5. The display substrate according to claim 4, characterized in that: There are two groups of test points and two driver chips; Both groups of test points are located outside the two driver chips.

6. The display substrate according to claim 1, characterized in that: The display substrate is a flexible circuit board FPC; The distance between the first device area and the driving chip in the second direction or the third direction is not less than 4 mm.

7. The display substrate according to claim 1, characterized in that: The distance between the edge of the display substrate and the driving chip in the second direction or the third direction is not less than 1.5 mm; The distance between the edge of the display substrate and the driving chip in the first direction is not less than 0.9 mm.

8. The display substrate according to claim 1, characterized in that: The display substrate is a flexible circuit board FPC; The driver chip is provided with sealant around its periphery; A sealant is arranged on the chevron-shaped edge of the display substrate close to the driving chip.

9. The display substrate according to claim 3, characterized in that: The display substrate further includes a TIC chip, a low voltage driving power supply ELVSS, a positive power supply voltage ELVDD and a power supply voltage ELAVDD of an auxiliary circuit; The TIC chip is located at the second direction side of the display substrate; at least one of the ELVSS, ELVDD and ELAVDD is located at the first device area at the second direction side of the three first device areas; or, The TIC chip is located on the third direction side of the display substrate; at least one of the ELVSS, ELVDD and ELAVDD is located in the first device region on the third direction side of the three first device regions.

10. The display substrate according to claim 1, characterized in that: The display substrate further includes a battery; The battery is located on the first direction side of the binding area and is adjacent to the binding area.

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