High-speed solid state disk and data processing method thereof

Abstract

The invention provides a high-speed solid state disk and a data processing method thereof. A flash memory chip in the solid state disk is a TLC flash memory particle, the interface speed of the flash memory chip reaches 2400MB / s, and the solid state disk adopts a pcie4.0 bus technology to provide a high-speed sequential read-write speed of 7000MB / s, so that the requirements of a computer system on data transmission speed and capacity are met. In the read-write process of the solid state disk, the main control chip obtains the working temperature in the shell and judges whether the working temperature is higher than a set threshold value or not. If the working temperature is higher than the set threshold value, the main control chip controls the transmission wheel to rotate and drives the heat dissipation barrel to rotate, so that the blades on the outer ring surface of the heat dissipation barrel rotate to bring heat around the flash memory chips out of the shell, and the flash memory chips are cooled in a targeted manner; therefore, the solid state disk is prevented from being damaged due to too high temperature in the high-speed read-write process, and the stability and reliability of the solid state disk during high-speed read-write are improved.

Description

Technical Field

[0001] The present invention relates to the field of solid state hard disk structures, and in particular to a high-speed solid state hard disk and a data processing method thereof. Background Art

[0002] When the solid-state drive is read and written at high speed, it is inevitable that it will easily heat up due to various reasons such as its working principle, components, and read and write speed. For example, the flash memory chip will generate a lot of heat when reading and writing at high speed. This has a great impact on the normal use of the hard disk. At present, the common heat dissipation method is to build a small fan into the solid-state drive to achieve heat dissipation. This type of heat dissipation method generally only sets a fan in the middle of the front of the solid-state drive, and cannot achieve targeted partition heat dissipation for the location of each flash memory chip. Therefore, the heat dissipation effect is relatively general, which is easy to affect the stability of the solid-state drive reading and writing. Summary of the invention

[0003] In view of the deficiencies of the above background technology, the present invention provides a high-speed solid state hard disk and a data processing method thereof.

[0004] The present invention adopts the following technical solution: In a first aspect, the present invention provides a high-speed solid-state hard disk, the solid-state hard disk comprising: A housing, a PCB board of the solid state drive is fixed in the housing, a plurality of flash memory chips are integrated on the PCB board, and a hollow heat dissipation window is provided on a side of the housing facing away from the PCB board at a position corresponding to each of the flash memory chips; A fixed disk, the fixed disk is fixed in the housing, and the fixed disk is provided with a yield groove at a position corresponding to each of the flash memory chips; A transmission wheel, the transmission wheel is adapted to be connected to rotate on one side of the fixed disk, and a plurality of driving columns are distributed in an annular manner on a side of the transmission wheel facing away from the fixed disk; A heat dissipation tube, wherein both ends of the heat dissipation tube penetrate to form guide holes, a spiral transmission groove is arranged on the annular surface inside the guide hole, and blades are distributed on the annular surface outside the heat dissipation tube; Wherein, the heat dissipation tube is arranged at each of the said clearance grooves, and the said guide hole of the said heat dissipation tube is sleeved on the side of the said clearance groove close to the outside of the said fixed disk and the outside of the side of the said transmission wheel, and the axial direction of the heat dissipation tube is restricted to be fixed relative to the said fixed disk, so that the said heat dissipation tube can only rotate relative to the said fixed disk, and when the said transmission wheel rotates and drives the said driving column to move to penetrate into the said transmission groove, the said driving column pushes the said transmission groove and drives the said heat dissipation tube to rotate.

[0005] In a possible implementation of the first aspect, the solid state drive also includes a transmission gear and a micro motor, the transmission gear is fixed between the fixed disk and the transmission wheel, the micro motor is fixed in the housing, and the output shaft of the micro motor fixes the driving gear, and the driving gear and the transmission gear are meshed.

[0006] In a possible implementation of the first aspect, the heat dissipation tube is connected by at least two bearing bushings with arc-shaped cross-sections to form a complete cylindrical structure, and each of the bearing bushings is sleeved on the outer side of the fixed plate and the outside of the transmission wheel and then fixedly connected to each other.

[0007] In a possible implementation of the first aspect, the solid state hard disk also includes a limit seat, the fixed disk fixes the limit seat at the position of each of the give way grooves, a through rotation groove is formed in the middle of the limit seat, and the limit seat is provided with rotation holes on both sides of the rotation groove; both ends of the heat dissipation tube are provided with a reduced diameter portion, the heat dissipation tube is embedded in the rotation groove, and the reduced diameter portions at both ends of the heat dissipation tube are respectively embedded in the rotation holes at both ends of the limit seat, so that the axial direction of the heat dissipation tube is limited to be fixed relative to the fixed disk.

[0008] In a possible implementation of the first aspect, the limiting seat includes an upper seat body and a lower seat body, and arc-shaped limiting ribs are arranged at one end of the upper seat body and the lower seat body. The upper seat body is fixed to one side of the fixed plate, and the lower seat body is fixed to the other side of the fixed plate, so that the limiting ribs of the upper seat body and the limiting ribs of the lower seat body are combined to form the rotating hole.

[0009] In a possible implementation of the first aspect, the inner annular surface of the transmission wheel is recessed to form an annular groove, and a plurality of rollers are distributed annularly on a side of the fixed disk facing the flash memory chip, and one side of each roller is embedded in the annular groove.

[0010] In a possible implementation manner of the first aspect, the fixing plate fixes a mounting pin at a position between two adjacent clearance grooves, and the roller is connected to the mounting pin.

[0011] In a possible implementation of the first aspect, a protruding connecting column is provided at the center of one side of the fixed disk facing the flash memory chip, and the outer shell is also provided with a fastening pin from the outside to the inside. The fastening pin is inserted into the outer shell and is adapted to be spirally connected with the connecting column to keep the fixed disk fixed in the outer shell.

[0012] In a possible implementation of the first aspect, the fastening pin is sequentially provided with a threaded column, a shoulder and a screw head along its axial direction, and a mounting hole and a heat dissipation hole are respectively provided on both sides of the outer shell. The fastening pin is inserted into the outer shell along the mounting hole so that the screw head is blocked outside the outer shell, and the threaded column is spirally inserted into the connecting column. After the shoulder abuts against the end face of the connecting part, the connecting column and the fastening pin are connected and fixed so that a gap is formed between the blades of the heat dissipation tube and the flash memory chip; when the fastening pin is removed from the outer shell, the threaded column is inserted into the outer shell from the heat dissipation hole and pressed against the fixed disk, so that the heat dissipation tube is pressed against the flash memory chip to crush the flash memory chip.

[0013] In a second aspect, the present invention further provides a data processing method for the solid state drive, which is as follows: The flash memory chip is read and written according to the continuity of the physical address; Acquire the operating temperature in the housing, and determine whether the operating temperature is higher than a set threshold, wherein the set threshold includes a first threshold and a second threshold, and the second threshold is higher than the first threshold; If the operating temperature is higher than the first threshold, the transmission wheel rotates, driving the heat sink to rotate, so that the blades on the outer annular surface of the heat sink rotate to bring the heat generated by the high-speed reading and writing of the flash memory chip out of the housing; If the operating temperature is higher than the second threshold, the transmission wheel stops and the solid state hard disk sends out an alarm signal.

[0014] From the above description of the structure of the present invention, it can be seen that compared with the prior art, the present invention has the following advantages: during the reading and writing process of the solid-state hard disk of the present invention, the main control chip obtains the operating temperature inside the shell and determines whether the operating temperature is higher than the set threshold value. If the operating temperature is higher than the first threshold value in the set threshold value, the main control chip controls the micro motor to rotate to drive the transmission wheel to rotate, and the transmission wheel drives each heat dissipation tube to rotate, so that the blades on the outer ring surface of the heat dissipation tube rotate and the heat around the flash memory chip is brought out of the shell through the heat dissipation window, so as to achieve targeted cooling of each flash memory chip by heat dissipation, so as to avoid damage to the solid-state hard disk due to excessive temperature during high-speed reading and writing, which is beneficial to improving the stability and reliability of the solid-state hard disk during high-speed reading and writing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the solid state hard disk of the present invention.

[0016] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the AA direction.

[0017] Figure 3 for Figure 2 Enlarged schematic diagram at C in the middle.

[0018] Figure 4 for Figure 1 Schematic diagram of the enlarged BB in the middle.

[0019] Figure 5 for Figure 4 Schematic diagram of the enlarged view at D in the middle.

[0020] Figure 6 It is a schematic diagram of the three-dimensional structure of the solid state hard disk after being decomposed.

[0021] Figure 7 This is a schematic diagram of the solid state hard disk of the present invention after the upper housing is hidden.

[0022] Figure 8 It is a schematic diagram of the three-dimensional structure when looking up after the fixed plate is connected to the transmission wheel and the heat dissipation tube.

[0023] Fig. 9 for Figure 8 Schematic diagram of the left side of the fixed plate.

[0024] Fig.10 It is a schematic diagram of the three-dimensional structure of the heat dissipation tube.

[0025] Fig.11 It is a schematic diagram of the three-dimensional structure of the bearing shell.

[0026] Fig.12 It is a schematic diagram of the three-dimensional structure after the limit seat is decomposed.

[0027] Fig.13 It is a schematic diagram of the three-dimensional structure of the fastening pin. DETAILED DESCRIPTION

[0028] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0029] In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0030] In addition, in the present application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to the changes in the orientation of the components in the drawings.

[0031] The present invention provides a high-speed solid state hard disk and a data processing method thereof, as shown in the attached Figures 1 to 4As shown, the solid state drive comprises a housing 1, a fixed disk 2, a transmission wheel 3, a heat sink 4 and a limit seat 5. The fixed disk 2, the transmission wheel 3, the heat sink 4 and the limit seat 5 are all arranged in the housing 1, and the PCB board 6 of the solid state drive is also fixed in the housing 1, the flash memory chip 61 is arranged on the PCB board 6, and the housing 1 is provided with hollow heat dissipation windows 101 at positions corresponding to each flash memory chip 61 on one side of the housing 1 facing away from the fixed PCB board 6.

[0032] Preferably, the structure of the housing 1 can be as shown in the attached Figures 4 to 6 As shown, it includes an upper shell 11 and a lower shell 12, wherein a protruding first column 111 is set at each corner of the upper shell 11 facing the lower shell 12, and a protruding second column 121 is set at each corner of the lower shell 12 facing the upper shell 11, and each second column 121 is adapted to be spirally connected with a fixing screw 13. Each corner of the PCB board 6 is provided with a fixing hole (not marked in the drawings) for installation and fixation. When installing the PCB board 6, the PCB board 6 is embedded in the lower shell 12, and the fixing holes of the PCB board 6 are respectively sleeved on the second cylinders 121. Then, the upper shell 11 is covered on the lower shell 12, so that the first cylinders 111 are respectively sleeved on the outside of the second cylinders 121. Finally, the fixing screws 13 are inserted from the upper shell 11 into the first cylinders 111 and are screwed to the second cylinders 121 for fastening. The upper shell 11 and the lower shell 12 are fixed to each other, and the first cylinders 111 are pressed on the PCB board 6 to fix the PCB board 6 in the shell 1.

[0033] Preferably, the flash memory chip 61 is a TLC flash memory particle, and the TLC flash memory particle can be a long memory X3-9070 and a Micron B58R, and its interface speed reaches 2400MT / s. In addition, the solid state drive of the present invention adopts pcie4.0 bus technology to provide high-speed data transmission and sufficient bandwidth, thereby meeting the requirements of data transmission speed and capacity in the computer system. At the same time, in order to solve the stability and error correction capability during high-speed reading and writing, the firmware of the solid state drive can also be tested in the following way: 1. Place the SSD in a high temperature environment or a low temperature and high humidity environment to test the performance of the SSD in these extreme environments to verify the adaptability and reliability of the SSD firmware under different environmental conditions; 2. Simulate a sudden power outage to check whether the SSD can protect data from loss under abnormal circumstances, so as to verify the reliability of the firmware in power management; 3. Read the same data and compare it with the original data to ensure that the data has not been changed or damaged during the writing process, so as to verify the reliability of the firmware in data processing.

[0034] As attached Figure 2As shown, the fixed disk 2 is fixed to the housing 1, and the fixed disk 2 is provided with a clearance groove 201 at the position corresponding to each flash memory chip 61. Further, the fixing method of the fixed disk 2 can be connected by a fastening pin 7, and the details can be referred to in the attached Figure 6 A protruding connection column 21 is provided at the center of the side of the fixed disk 2 facing the flash memory chip 61, and the fastening pin 7 penetrates from the outside to the inside of the shell 1 and is screwed with the connection column 21, so that the fixed disk 2 remains fixed in the shell 1. Furthermore, a positioning hole 103 can be provided on the surface of the upper shell 11 of the shell 1, and a positioning column 25 is formed by a protrusion on the side of the fixed disk 2 facing away from the flash memory chip 61. The positioning column 25 is a hexagonal prism, and the positioning hole 103 is a hexagonal through hole into which the positioning column 25 is inserted. After the upper shell 11 covers the lower shell 12, the positioning hole 103 is fitted on the positioning column 25 so that each heat dissipation tube 4 connected to the fixed disk 2 corresponds to each flash memory chip 61.

[0035] As attached Figure 7 and 8 As shown, the transmission wheel 3 is adapted to be connected to one side of the fixed disk 2 for rotation, and the driving column 31 is distributed in an annular manner on the side of the transmission wheel 3 facing away from the fixed disk 2. The transmission wheel 3 can be connected to the fixed disk 2 in the following manner: Figure 4 As shown, the inner annular surface of the transmission wheel 3 is concave to form an annular groove 301, and a plurality of rollers 22 are distributed annularly on one side of the fixed disk 2 facing the flash memory chip 61, and one side of each roller 22 is embedded in the annular groove 301, so that each roller 22 is stuck in the annular groove 301 of the transmission wheel 3 to limit the transmission wheel 3 to rotate on one side of the fixed disk 2, and the roller 22 is also helpful to reduce the friction resistance of the rotation during the rotation of the transmission wheel 3. Further, the fixed disk 2 is fixed with mounting pins 23 at the position between two adjacent yielding grooves 201, and each roller 22 is connected to each mounting pin 23 respectively. Specifically, the roller 22 can be a bearing, and after the mounting pin 23 passes through the inner ring of the bearing and is fixed to the inner ring, the mounting pin 23 passes through the fixed disk 2 with an interference fit, and then a retaining spring 24 is assembled on one side of the fixed disk 2 to form a restriction of the mounting pin 23, so that the roller 22 is limited to rotate on one side of the fixed disk 2.

[0036] Please refer to the attached Figure 4 and 7The solid state hard disk of the present invention also includes a transmission gear 32 and a micro motor 33. The transmission gear 32 is fixed between the fixed disk 2 and the transmission wheel 3. The fixing method in this embodiment can be connected and fixed by screwing. The micro motor 33 is fixed in the housing 1, and can be specifically fixed to the PCB board 6 or the upper shell 11, and the output shaft of the micro motor 33 is fixed to the driving gear 34. The driving gear 34 and the transmission gear 32 are meshed, so that the micro motor 33 can drive the fixed disk 2 and the transmission wheel 3 to rotate. Furthermore, the solid state hard disk of the present invention also integrates a main control chip and a temperature sensor (not shown in the drawings) on the PCB board 6. The temperature sensor is used to sense the temperature inside the housing 1, and sends the temperature information to the main control chip, so that the main control chip controls the opening and closing of the micro motor 33 according to the obtained temperature signal.

[0037] As attached Figure 1 and 7 As shown, each of the clearance grooves 201 is provided with a heat dissipation tube 4, which is a cylindrical structure, and the two ends of the heat dissipation tube 4 penetrate to form a guide hole 401 inside, and the annular surface inside the guide hole 401 is provided with a spiral transmission groove 402. In addition, blades 41 are distributed on the annular surface outside the heat dissipation tube 4. Fig.10 and 11 As shown, the heat dissipation tube 4 is connected by at least two bearing bushes 42 with arc-shaped cross sections to form a complete cylindrical structure, and each bearing bush 42 is sleeved on the outer side of the fixed plate 2 and the outside of the transmission wheel 3 and then fixedly connected to each other, so that the guide hole 401 of the heat dissipation tube 4 is sleeved on the side of the clearance groove 201 close to the outside of the fixed plate 2 and the side of the transmission wheel 3. In this embodiment, preferably, two bearing bushes 42 are spliced ​​to form the heat dissipation tube 4, and the cross sections of the two bearing bushes 42 are both semicircular arcs.

[0038] Continue to refer to the attached Figure 7 and 8 The heat dissipation tube 4 is restricted to rotate relative to the fixed disk 2 and the transmission wheel 3 through the connection of the limit seat 5. Fig. 9 and 12The middle of the limit seat 5 is formed with a rotation groove 501, and the limit seat 5 is provided with rotation holes 502 on both sides of the rotation groove 501. The limit seat 5 is formed by connecting an upper seat body 51 and a lower seat body 52, and the upper seat body 51 and the lower seat body 52 are formed by dividing the limit seat 5 into two. The upper seat body 51 and the lower seat body 52 are both provided with arc-shaped limiting ribs 53 at one end. When installing the heat sink 4, after the bearing is sleeved on the outside of the fixed plate 2 and the outside of the transmission wheel 3, the upper seat body 51 and the lower seat body 52 are respectively fitted on the two sides of the fixed plate 2 at the position of the clearance groove 201, and the heat sink 4 is embedded in the rotation groove 501, and then the upper seat body 51 is fixed to one side of the fixed plate 2 by screwing screws from the upper seat body 51 to the lower seat body 52, and the lower seat body 52 is fixed to the other side of the fixed plate 2. At the same time, the limiting ribs 53 of the upper seat body 51 and the limiting ribs 53 of the lower seat body 52 are combined to form a rotation hole 502 to limit the reduced diameter portion 43 of the heat sink 4, forming a structure in which the reduced diameter portions 43 at both ends of the heat sink 4 are respectively embedded in the rotation holes 502 at both ends of the limiting seat 5, so that the axial direction of the heat sink 4 is limited to be fixed relative to the fixed plate 2, and the heat sink 4 can only rotate relative to the fixed plate 2 and the transmission wheel 3. When the transmission wheel 3 rotates until the driving column 31 moves to penetrate the transmission slot 402, the driving column 31 pushes the transmission slot 402 to drive the heat dissipation tube 4 to rotate, so that the blades 41 of the heat dissipation tube 4 rotate to discharge the heat generated by the flash memory chip 61 in the process of processing data out of the housing 1. Furthermore, the transmission wheel 3 can simultaneously drive each heat dissipation tube 4 to rotate, thereby achieving targeted heat dissipation of each flash memory chip 61 at the same time, which is particularly suitable for the attached Figure 7 The 2×2 flash memory chip array distribution shown has a better heat dissipation effect.

[0039] In addition, the distance between two adjacent transmission grooves 402 in the arc direction along the transmission groove 402 on the end surface of the heat dissipation tube 4 is consistent with the distance between two adjacent driving columns 31 of the transmission wheel 3 in the arc direction, so that when one driving column 31 moves into the transmission groove 402 to push the heat dissipation tube 4 to rotate until the end surface of the subsequent transmission groove 402 corresponds to the transmission wheel 3, another driving column 31 adjacent to the driving column 31 can move into the subsequent transmission groove 402 accordingly. In this way, the transmission wheel 3 rotates while continuously driving each driving column 31 to move into each transmission groove 402 in sequence, and driving the heat dissipation tube 4 to keep rotating in the same direction.

[0040] After adopting the above structure, the data processing method of the solid state hard disk of the present invention is as follows: The flash memory chip 61 reads and writes sequentially according to the continuity of the physical address; The temperature sensor senses in real time to obtain the working temperature in the housing 1 and sends it to the main control chip. The main control chip determines whether the working temperature is higher than a set threshold value by receiving the temperature signal of the temperature sensor. The set threshold value is a temperature value preset in the program of the main control chip, including a first threshold value and a second threshold value, wherein the second threshold value is higher than the first threshold value; If the operating temperature is higher than the first threshold, the main control chip controls the micro motor 33 to rotate to drive the transmission wheel 3 to rotate, and the transmission wheel 3 drives each heat sink 4 to rotate, so that the blades 41 on the outer ring surface of the heat sink 4 rotate to bring the high temperature around the flash memory chip 61 out of the outer shell 1, thereby achieving targeted cooling of each flash memory chip 61 to avoid damage to the solid-state hard disk due to excessive temperature during high-speed reading and writing, which is beneficial to improving the stability and reliability of the solid-state hard disk during high-speed reading and writing.

[0041] If the operating temperature is higher than the second threshold, the main control chip controls the WeChat motor 33 to stop so that the transmission wheel 3 stops. Then the main control chip controls the solid-state hard disk to send an alarm signal. The specific alarm signal can be a buzzer alarm integrated on the PCB board. That is, after the temperature value received by the main control chip is higher than the second threshold, the buzzer alarm is controlled to turn on to send an alarm signal to prevent the solid-state hard disk from being damaged due to continuous operation under ultra-high temperature conditions.

[0042] It can be seen from the above processing method that the present invention can also take protective measures for the flash memory chip in real time according to the heat generated when the solid-state hard disk is working at high speed reading and writing, thereby ensuring the high-speed reading and writing reliability of the hard disk and avoiding damage to the solid-state hard disk.

[0043] In addition, if attached Figure 2 and 13 As shown, the fastening pin 7 is provided with a threaded column 71, a shoulder 72 and a screw head 73 in sequence along its axial direction, and a mounting hole 102 and a positioning hole 103 are provided on both sides of the housing 1. After the heat dissipation tube 4 is connected to the fixed disk 2 and the fixed disk 2 is assembled in the housing 1, the fastening pin 7 is inserted into the housing 1 along the mounting hole 102, so that the screw head 73 is blocked outside the housing 1, and the threaded column 71 is spirally inserted into the connecting column 21, and after the shoulder 72 is pressed against the end face of the connecting part, the connecting column 21 and the fastening pin 7 can be spirally connected and fastened, and a gap is formed between the blade 41 of the heat dissipation tube 4 and the flash memory chip 61. When the flash memory chip 61 needs to be destroyed, the fastening pin 7 is removed from the housing 1, and the threaded column 71 is inserted into the housing 1 from the positioning hole 103 and pressed toward the fixed disk 2, so that the limit seat 5 is pressed toward the flash memory chip 61 and the flash memory chip 61 is crushed, thereby realizing the physical data destruction of the flash memory chip 61.

[0044] In summary, the solid-state drive adopts pcie4.0X4 bus technology to provide a high-speed sequential read and write speed of 7000MB / s to meet the needs of data transmission speed and capacity in computer systems. During the reading and writing process of the solid-state drive, the main control chip obtains the operating temperature in the shell 1 and determines whether the operating temperature is higher than the set threshold. If the operating temperature is higher than the set threshold, the main control chip controls the micro motor 33 to rotate to drive the transmission wheel 3 to rotate, and drives each heat dissipation tube 4 to rotate through the transmission wheel 3, so that the blades 41 on the outer ring surface of the heat dissipation tube 4 rotate and the heat around the flash memory chip 61 is brought out of the shell 1 from the heat dissipation window 101, so as to achieve targeted cooling of each flash memory chip 61 by heat dissipation, so as to avoid damage to the solid-state drive due to excessive temperature during high-speed reading and writing, which is conducive to improving the stability and reliability of the solid-state drive during high-speed reading and writing.

[0045] The above is only a specific implementation of the present invention, but the design concept of the present invention is not limited thereto. Any non-substantial changes to the present invention using this concept shall be deemed as an infringement of the protection scope of the present invention.

Claims

1. A high-speed solid-state hard disk, characterized in that: The SSD includes: A housing, a PCB board of the solid state drive is fixed in the housing, a plurality of flash memory chips are integrated on the PCB board, and a hollow heat dissipation window is provided on a side of the housing facing away from the PCB board at a position corresponding to each of the flash memory chips; A fixed disk, the fixed disk is fixed in the housing, and the fixed disk is provided with a yield groove at a position corresponding to each of the flash memory chips; A transmission wheel, the transmission wheel is adapted to be connected to rotate on one side of the fixed disk, and a plurality of driving columns are distributed in an annular manner on a side of the transmission wheel facing away from the fixed disk; A heat dissipation tube, wherein both ends of the heat dissipation tube penetrate to form guide holes, a spiral transmission groove is arranged on the annular surface inside the guide hole, and blades are distributed on the annular surface outside the heat dissipation tube; Wherein, the heat dissipation tube is arranged at each of the said clearance grooves, and the said guide hole of the said heat dissipation tube is sleeved on the side of the said clearance groove close to the outside of the said fixed disk and the outside of the side of the said transmission wheel, and the axial direction of the heat dissipation tube is restricted to be fixed relative to the said fixed disk, so that the said heat dissipation tube can only rotate relative to the said fixed disk, and when the said transmission wheel rotates and drives the said driving column to move to penetrate into the said transmission groove, the said driving column pushes the said transmission groove and drives the said heat dissipation tube to rotate.

2. The solid state drive according to claim 1, wherein: The solid state hard disk also includes a transmission gear and a micro motor, wherein the transmission gear is fixed between the fixed disk and the transmission wheel, the micro motor is fixed in the housing, and the output shaft of the micro motor fixes the driving gear, and the driving gear is meshed with the transmission gear.

3. The solid state drive according to claim 1, wherein: The heat dissipation cylinder is connected by at least two bearing bushes with arc-shaped cross-sections to form a complete cylindrical structure. The bearing bushes are sleeved on the outer side of the fixing plate and the outside of the transmission wheel and are fixedly connected to each other.

4. The solid state hard disk as claimed in claim 1 or 3, characterized in that: The solid state hard disk also includes a limit seat, the fixed disk fixes the limit seat at the position of each of the give way grooves, a through rotation groove is formed in the middle of the limit seat, and the limit seat is provided with rotation holes on both sides of the rotation groove; both ends of the heat dissipation tube are provided with a reduced diameter portion, the heat dissipation tube is embedded in the rotation groove, and the reduced diameter portions at both ends of the heat dissipation tube are respectively embedded in the rotation holes at both ends of the limit seat, so that the axial direction of the heat dissipation tube is limited to be fixed relative to the fixed disk.

5. The solid state drive according to claim 4, wherein: The limiting seat includes an upper seat body and a lower seat body, and one end of the upper seat body and the lower seat body are both provided with arc-shaped limiting ribs. The upper seat body is fixed to one side of the fixed plate, and the lower seat body is fixed to the other side of the fixed plate, so that the limiting ribs of the upper seat body and the limiting ribs of the lower seat body are combined to form the rotating hole.

6. The solid state drive according to claim 1, wherein: The inner annular surface of the transmission wheel is concave to form an annular groove. A plurality of rollers are distributed annularly on one side of the fixed disk facing the flash memory chip, and one side of each roller is embedded in the annular groove.

7. The solid state drive according to claim 6, wherein: The fixing plate fixes the mounting pin at a position between two adjacent clearance grooves, and the roller is connected to the mounting pin.

8. The solid state drive according to claim 1, wherein: A protruding connecting column is set at the center of one side of the fixed disk facing the flash memory chip, and the shell is also equipped with a fastening pin from the outside to the inside. The fastening pin is inserted into the shell and is screwed with the connecting column to keep the fixed disk fixed in the shell.

9. The solid state drive according to claim 8, wherein: The fastening pin is provided with a threaded column, a shaft shoulder and a screw head in sequence along its axial direction, and a mounting hole and a heat dissipation hole are provided on both sides of the shell respectively. The fastening pin is inserted into the shell along the mounting hole so that the screw head is blocked outside the shell, and the threaded column is spirally inserted into the connecting column until the shaft shoulder abuts against the end face of the connecting part, and the connecting column and the fastening pin are connected and fixed, so that a gap is formed between the blades of the heat dissipation tube and the flash memory chip; When the fastening pin is removed from the housing, the threaded column is inserted into the housing from the heat dissipation hole and pressed toward the fixing plate, so that the heat dissipation tube is pressed toward the flash memory chip to crush the flash memory chip.

10. A method for operating a solid state hard disk according to any one of claims 1 to 9, characterized in that: The method is as follows: The flash memory chip is read and written according to the continuity of the physical address; Acquire the operating temperature in the housing, and determine whether the operating temperature is higher than a set threshold, wherein the set threshold includes a first threshold and a second threshold, and the second threshold is higher than the first threshold; If the operating temperature is higher than the first threshold, the transmission wheel rotates, driving the heat sink to rotate, so that the blades on the outer annular surface of the heat sink rotate to bring the heat generated by the high-speed reading and writing of the flash memory chip out of the housing; If the operating temperature is higher than the second threshold, the transmission wheel stops and the solid state hard disk sends out an alarm signal.

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