Precision mold for semiconductor packaging

Abstract

The invention belongs to the field of semiconductor manufacturing equipment, and discloses a precision mold for semiconductor packaging, which comprises an upper mold, a lower mold and a base, a material injection port is arranged in the upper mold, a cutting device is movably arranged on the inner wall of the upper mold, and an electric heating wire is fixedly arranged on the inner wall of the upper mold; the invention solves the problems that the heat dissipation design of a traditional mold is relatively backward, a large amount of heat generated in the packaging process cannot be timely and effectively dissipated, and in the product taking-out link, the design of the traditional mold is lack of humanization and high efficiency, so that the product taking-out process is difficult, the product is very easy to damage, and the production cost is low. And finished products are all in a connected sheet shape due to the influence of packaging, so that the taking-out effect is influenced, and the method is suitable for the semiconductor packaging mold.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing equipment, in particular to a precision mold for semiconductor packaging. Background Art

[0002] With the rapid development of the semiconductor industry, the requirements for the precision, efficiency and quality of semiconductor packaging are becoming increasingly stringent. In the context of fierce market competition and technological iteration, traditional semiconductor packaging molds have exposed many problems that need to be solved, which seriously restricts the further upgrading and development of the industry.

[0003] In terms of heat dissipation, the heat dissipation design of traditional molds is relatively backward and cannot dissipate the large amount of heat generated during the packaging process in a timely and effective manner. Excessive temperature will cause the performance of semiconductor materials to deteriorate, thereby reducing the overall performance and service life of the product, becoming a key bottleneck restricting the improvement of semiconductor packaging quality.

[0004] In addition, in the product removal process, the design of traditional molds lacks humanity and efficiency, making the product removal process difficult and easily causing product damage. In addition, the finished products are all in the form of connected sheets due to the influence of packaging, which affects the removal effect. This not only reduces production efficiency, but also increases production costs.

[0005] The precision mold for semiconductor packaging of the present invention is aimed at the pain points and difficulties of the above-mentioned traditional molds, and provides a precision mold for semiconductor packaging through innovative structural design and technical improvement. Summary of the invention

[0006] The present invention aims to provide a precision mold for semiconductor packaging to solve the problems that the heat dissipation design of traditional molds is relatively backward and cannot timely and effectively dissipate the large amount of heat generated in the packaging process. In addition, in the product removal process, the design of traditional molds lacks humanity and efficiency, making the product removal process difficult and easily causing product damage. In addition, the finished product is in the form of sheets connected together due to the influence of the packaging, which affects the removal effect.

[0007] In order to achieve the above object, the present invention provides the following technical solutions: The technical solution provided by the present invention is: a precision mold for semiconductor packaging, comprising an upper mold, a lower mold and a base, wherein an injection port is arranged in the upper mold, a cutting device is movably arranged on the inner wall of the upper mold, and an electric heating wire is fixedly arranged on the inner wall of the upper mold; The inner wall of the lower mold is provided with a pop-up device, and the inner wall of the lower mold is provided with a heat dissipation device; An upper cross forming groove is provided on the lower surface of the upper mold, and connecting rods are symmetrically provided below the upper mold; A lower cross forming groove is provided on the upper surface of the lower mold, a triangular plate is fixed in the lower cross forming groove, connecting grooves are symmetrically provided at the four corners of the lower mold, an opening is provided on one side of the connecting groove, and handrails are symmetrically provided at both ends of the lower mold.

[0008] Furthermore, the cutting device includes a cutting lifting plate movably installed on the inner wall of the upper mold, a cutting pressure plate is fixedly provided above the cutting lifting plate, a cutting cross plate is fixedly provided below the cutting lifting plate, a cutting damping rod is fixedly provided above the cutting cross plate, the cutting damping rod is fixedly installed on the inner wall of the upper mold, and a plurality of cutting plates are evenly arranged below the cutting cross plate.

[0009] Further, the cutting plate can be in contact with the set square.

[0010] Furthermore, the pop-up device includes a pop-up cross movably installed in the lower mold, a plurality of pop-up rods are evenly arranged above the pop-up cross, the pop-up rods penetrate the lower cross forming groove, pop-up plates are fixedly arranged above the pop-up rods, the pop-up plates are movably adapted to the lower cross forming groove, pop-up support rods are fixedly arranged at both ends of the pop-up cross, a pop-up cross bar is fixedly arranged below the pop-up support rod, the pop-up cross bar is movably adapted to the opening, pop-up lifting plates are fixedly arranged at both ends of the pop-up cross bar, the pop-up lifting plates are movably adapted to the inner wall of the connecting groove, a pop-up damping rod is fixedly arranged below the pop-up lifting plate, and the pop-up damping rod is fixedly installed on the inner wall of the connecting groove.

[0011] Furthermore, the heat dissipation device includes a heat dissipation plate fixedly installed on the inner wall of the lower mold, a heat dissipation filter is fixedly provided in the heat dissipation plate, a circulation box is fixedly provided above the heat dissipation filter, a circulation impeller is movably provided in the circulation box, a water inlet and a water outlet are fixedly provided on one side of the circulation box, a circulation shaft is fixedly provided at the axial position of the circulation impeller, heat dissipation blades are fixedly provided below the circulation shaft, and a heat dissipation channel is opened below the heat dissipation blades.

[0012] The beneficial effects of this technical solution are: (1) Through the cooperation of the cutting plate and the triangular plate in the cutting device, accurate cutting of the packaging material can be achieved, reducing the production process of subsequent steps. At the same time, it is easier to remove the single packaged semiconductor after cutting.

[0013] (2) The heat dissipation device adopts a combination of circulating water and heat dissipation blades. The water flow drives the heat while driving the impeller to rotate, which drives the heat dissipation blades to rotate, further dissipating the heat of the lower mold, effectively reducing the mold temperature and ensuring the stable performance of the semiconductor during the packaging process. The circulating water can quickly take away the heat generated by the mold, and the heat dissipation blades can further enhance the heat dissipation effect by accelerating air circulation.

[0014] (3) The ejection device can easily eject the formed semiconductor product, avoiding damage to the product when it is taken out and improving production efficiency. Traditional molds are prone to damage to the product when taking out the parts, while the ejection device of this mold is reasonably designed. By removing the upper mold after cooling is completed, the connecting rod is disengaged from the connecting groove. Through the coordinated action of the ejection lifting plate, the ejection cross bar and other components, the product can be ejected smoothly and quickly, reducing the time for taking out the parts. At the same time, it reduces the risk of product damage caused by improper taking out, which is conducive to realizing automated production and improving the overall production efficiency of the enterprise. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a precision mold for semiconductor packaging proposed by the present invention; Figure 2 This is one of the schematic diagrams of the unfolded structure of a precision mold for semiconductor packaging proposed by the present invention; Figure 3 This is a second schematic diagram of the unfolded structure of a precision mold for semiconductor packaging proposed by the present invention; Figure 4 This is a schematic diagram of the expanded cross-sectional structure of a precision mold for semiconductor packaging proposed by the present invention; Figure 5 A schematic cross-sectional structure diagram of a precision mold for semiconductor packaging proposed by the present invention; Figure 6 This is a schematic cross-sectional structure diagram of a heat dissipation device for a precision mold for semiconductor packaging proposed by the present invention; Figure 7 This is a schematic diagram of the cross-sectional plan structure of a heat dissipation device of a precision mold for semiconductor packaging proposed by the present invention; Figure 8 This is a schematic diagram of the unfolded cross-sectional plan structure of a precision mold for semiconductor packaging proposed by the present invention; Fig. 9 This is a schematic diagram of the cross-sectional plan structure of a precision mold for semiconductor packaging proposed by the present invention.

[0016] The names of the corresponding marks in the accompanying drawings are: 1, upper mold; 2, lower mold; 3, base; 4, injection port; 5, cutting device; 6, electric heating wire; 7, ejection device; 8, heat dissipation device; 101, upper cross forming groove; 102, connecting rod; 201, lower cross forming groove; 202, triangle plate; 203, handrail; 204, connecting groove; 205, opening; 501, cutting lifting plate; 502, cutting pressing plate; 503, cutting cross plate; 504 , cutting damping rod; 505, cutting plate; 701, pop-up cross; 702, pop-up rod; 703, pop-up plate; 704, pop-up support rod; 705, pop-up cross bar; 706, pop-up lifting plate; 707, pop-up damping rod; 801, heat sink; 802, heat sink filter; 803, circulation box; 804, circulation impeller; 805, water inlet; 806, water outlet; 807, circulation shaft; 808, heat sink; 809, heat dissipation channel. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] The specific implementation process is as follows: Embodiment 1: See also Figure 1-9The present invention provides a technical solution: a precision mold for semiconductor packaging, including an upper mold 1, a lower mold 2 and a base 3, an upper cross molding groove 101 is opened on the lower surface of the upper mold 1, a connecting rod 102 is symmetrically installed at the lower surface of the upper mold 1, a lower cross molding groove 201 is opened on the upper surface of the lower mold 2, the lower cross molding groove 201 cooperates with the upper cross molding groove 101 of the upper mold 1 to form a specific molding space, a triangle plate 202 is fixedly installed in the lower cross molding groove 201, four corners of the lower mold 2 are symmetrically opened with connecting grooves 204, one side of the connecting groove 204 is opened with an opening 205, handrails 203 are symmetrically installed at both ends of the lower mold 2 for easy handling and operation, an injection port 4 is installed in the upper mold 1, and the injection port 4 is used to inject packaging materials. A cutting device 5 is movably installed on the inner wall of the upper mold 1. The cutting device 5 can accurately cut the connected sheet materials after encapsulation, so that the semiconductor materials after encapsulation are independently ejected. The cutting device 5 includes a cutting lifting plate 501 movably installed on the inner wall of the upper mold 1, a cutting pressure plate 502 is fixedly installed above the cutting lifting plate 501, and a cutting cross plate 503 is fixedly installed below the cutting lifting plate 501. The cutting plate 505 can contact the triangular plate 202, and a cutting damping rod 504 is fixedly installed above the cutting cross plate 503 to play a role in buffering and stabilizing cutting. The cutting damping rod 504 is fixedly installed on the inner wall of the upper mold 1, and a plurality of cutting plates 505 are evenly installed below the cutting cross plate 503. The inner wall of the upper mold 1 is fixedly installed with a heating wire 6. The mold can be heated to ensure that the packaging material is formed at a suitable temperature. An ejection device 7 is movably installed on the inner wall of the lower mold 2 to facilitate ejecting the formed semiconductor product. The ejection device 7 includes an ejection cross 701 movably installed in the lower mold 2. A plurality of ejection rods 702 are evenly installed above the ejection cross 701. The ejection rods 702 penetrate the lower cross molding groove 201. An ejection plate 703 is fixedly installed above the ejection rods 702. The ejection plate 703 is movably adapted to the lower cross molding groove 201. An ejection support rod 704 is fixedly installed at both ends of the ejection cross 701. An ejection cross bar 705 is fixedly installed below the ejection support rod 704. The ejection cross bar 705 is movably adapted to the opening 205. An ejection lifting plate 70 is fixedly installed at both ends of the ejection cross bar 705. 6. The pop-up lifting plate 706 is movably adapted to the inner wall of the connecting groove 204. A pop-up damping rod 707 is fixedly installed below the pop-up lifting plate 706. The pop-up damping rod 707 is fixedly installed on the inner wall of the connecting groove 204. A heat dissipation device 8 is fixedly installed on the inner wall of the lower mold 2 to ensure the heat dissipation of the mold during operation. The heat dissipation device 8 includes a heat dissipation plate 801 fixedly installed on the inner wall of the lower mold 2, a heat dissipation filter 802 is fixedly installed in the heat dissipation plate 801, a circulation box 803 is fixedly installed above the heat dissipation filter 802, a circulation impeller 804 is movably installed in the circulation box 803, a water inlet 805 and a water outlet 806 are fixedly installed on one side of the circulation box 803, a circulation shaft 807 is fixedly installed at the axial position of the circulation impeller 804, and a heat dissipation blade 808 is fixedly installed below the circulation shaft 807.A heat dissipation channel 809 is provided below the heat dissipation blade 808; When in use, the lower mold 2 is placed on the base 3, and then the upper mold 1 is placed on the surface of the lower mold 2. The connecting rod 102 is inserted into the connecting groove 204 to achieve a tight and sealed connection of the molds. In this process, the connecting rod 102 applies pressure to the pop-up lifting plate 706 in the connecting groove 204, so that the pop-up lifting plate 706 is pressed to push the pop-up damping rod 707 downward. At this time, the movement of the pop-up lifting plate 706 drives the pop-up cross bar 705 to move. The pop-up cross bar 705 drives the pop-up support rod 704 and the pop-up cross 701, and then drives the pop-up plate 703 to move downward in the lower cross molding groove 201, so as to prepare for the subsequent packaging operation. After the mold is installed, the semiconductor packaging material is injected into the mold cavity through the injection port 4 in the upper mold 1. While injecting the material, the heating wire 6 fixed on the inner wall of the upper mold 1 is started. After the heating wire 6 is energized, heat is generated and evenly transferred to the mold, so that the packaging material in the mold begins to be initially cured and formed under a suitable temperature environment, providing basic conditions for subsequent cutting and molding operations; After the injection molding is completed, the operation of the electric heating wire 6 is stopped, and the injection molding material is cooled down; the heat dissipation device 8 is controlled by the control device to operate, and circulating water is injected into the circulation box 803 from the water inlets 805 at both ends. The circulating water flows in the circulation box 803, and the water source drives the circulation impeller 804 to rotate. The circulation impeller 804 drives the heat dissipation blades 808 below to rotate through the circulation shaft 807 at the axial position, thereby accelerating the circulation of air in the heat dissipation channel 809, maintaining stable and efficient heat dissipation performance, and improving the cooling time after the injection molding is completed, so that it can complete the demoulding work more quickly; After the cooling is completed, the cutting plate 502 is pressed, so that the cutting plate 502 drives the cutting lifting plate 501 to descend, and the lifting of the cutting lifting plate 501 drives the cutting cross plate 503 to move, and the cutting cross plate 503 drives the cutting plate 505 to descend, so that the descending cutting plate 505 cuts the injection-molded material and contacts the triangular plate 202 to increase the cutting efficiency; after the injection molding is cut into a single material, the triangular plate 202 automatically rises by the elastic restoring force of the cutting damping rod 504 itself; After the cutting is completed, the upper mold 1 is removed to disengage the connecting rod 102 from the connecting groove 204; due to the detachment of the connecting rod 102, the pop-up lifting plate 706 cancels the pressure it is subjected to, so that the pop-up damping rod 707 pushes the pop-up lifting plate 706 to rise, and the pop-up lifting plate 706 drives the pop-up support rod 704 and the pop-up cross 701 to drive the pop-up plate 703 to move upward in the lower cross molding groove 201, and pushes out the injection-molded material for easy collection.

[0019] The above is only an embodiment of the present invention, and the common knowledge such as the known specific technical solutions or characteristics in the solution is not described in detail here. It should be pointed out that for those skilled in the art, several modifications and improvements can be made without departing from the technical solution of the present invention, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A precision mold for semiconductor packaging, comprising an upper mold (1), a lower mold (2) and a base (3), characterized in that: The upper mold (1) is provided with a material injection port (4), the inner wall of the upper mold (1) is movably provided with a cutting device (5), and the inner wall of the upper mold (1) is fixedly provided with an electric heating wire (6); An ejection device (7) is movably provided on the inner wall of the lower mold (2), and a heat dissipation device (8) is fixedly provided on the inner wall of the lower mold (2); An upper cross-shaped groove (101) is provided on the lower surface of the upper mold (1), and connecting rods (102) are symmetrically provided below the upper mold (1); A lower cross-shaped groove (201) is provided on the upper surface of the lower mold (2), a triangular plate (202) is fixedly provided in each of the lower cross-shaped grooves (201), connecting grooves (204) are symmetrically provided at four corners of the lower mold (2), an opening (205) is provided on one side of the connecting groove (204), and handrails (203) are symmetrically provided at both ends of the lower mold (2).

2. The semiconductor packaging precision mold according to claim 1, characterized in that: The cutting device (5) comprises a cutting lifting plate (501) movably mounted on the inner wall of the upper mold (1); a cutting pressing plate (502) is fixedly mounted above the cutting lifting plate (501); a cutting cross plate (503) is fixedly mounted below the cutting lifting plate (501); a cutting damping rod (504) is fixedly mounted above the cutting cross plate (503); the cutting damping rod (504) is fixedly mounted on the inner wall of the upper mold (1); and a plurality of cutting plates (505) are evenly mounted below the cutting cross plate (503).

3. The precision mold for semiconductor packaging according to claim 2, characterized in that: The cutting plate (505) is capable of contacting the set square (202).

4. The semiconductor packaging precision mold according to claim 1, characterized in that: The ejection device (7) comprises an ejection cross (701) movably mounted in the lower mold (2), a plurality of ejection rods (702) are evenly arranged above the ejection cross (701), the ejection rods (702) penetrate the lower cross molding groove (201), an ejection plate (703) is fixedly arranged above the ejection rods (702), the ejection plate (703) is movably adapted to the lower cross molding groove (201), and ejection support rods (704) are fixedly arranged at both ends of the ejection cross (701). ), a pop-up cross bar (705) is fixedly provided below the pop-up support rod (704), the pop-up cross bar (705) is movably adapted to the opening (205), pop-up lifting plates (706) are fixedly provided at both ends of the pop-up cross bar (705), the pop-up lifting plates (706) are movably adapted to the inner wall of the connecting groove (204), and a pop-up damping rod (707) is fixedly provided below the pop-up lifting plates (706), the pop-up damping rod (707) is fixedly mounted on the inner wall of the connecting groove (204).

5. The semiconductor packaging precision mold according to claim 1, characterized in that: The heat dissipation device (8) comprises a heat dissipation plate (801) fixedly mounted on the inner wall of the lower mold (2); a heat dissipation filter (802) is fixedly arranged inside the heat dissipation plate (801); a circulation box (803) is fixedly arranged above the heat dissipation filter (802); a circulation impeller (804) is movably arranged inside the circulation box (803); a water inlet (805) and a water outlet (806) are fixedly arranged on one side of the circulation box (803); a circulation shaft (807) is fixedly arranged at the axial center position of the circulation impeller (804); a heat dissipation blade (808) is fixedly arranged below the circulation shaft (807); and a heat dissipation channel (809) is provided below the heat dissipation blade (808).

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