Matching method of detachable high-frequency connector in engineering application

Abstract

The invention discloses a matching method of a detachable high-frequency connector in engineering application, which can be better matched with a high-frequency insulator and a connector by optimizing and adjusting a microstrip line and a structure so as to achieve the purpose of optimizing a radio-frequency microwave signal transmission index. Comprising the steps that the size of a microstrip line port is adjusted according to the standing wave deterioration degree caused by impedance abrupt change, the shape of the microstrip line port is optimized, and a traditional insulator through-wall structure mode is changed. And the connector is a 2.4 mm high-frequency connector of which the frequency can reach 50GHz. And the connector is plugged with the insulator through the jack to feed in a signal. The optimization design is carried out by comprehensively using a real object comparison test and 3D simulation software. Through innovative adjustment on the microstrip line and the cavity structure, good matching among the connector, the insulator and the microstrip line is realized, and impedance mismatching caused by high-frequency-band impedance mutation in a traditional matching method is overcome, so that the standing wave and insertion loss performance of a product is greatly improved, high-frequency connector matching in convenient engineering application is realized, and the product quality is improved. And the radio frequency performance is improved.

Description

Technical Field

[0001] The invention relates to the field of communication technology, and in particular to a matching method of a detachable high-frequency connector in engineering applications. Background Art

[0002] Traditional connectors are equipped with built-in probes, but in actual use, the connector often rotates. Since the probe and connector are integrated, the rotation of the connector will drive the probe to rotate, causing damage to the microstrip line welded to the probe. Using a detachable connector that is separated from the probe to replace the traditional built-in probe connector can avoid this risk, but the high difficulty of matching the detachable connector in the high frequency band has become a problem that needs to be solved urgently.

[0003] The 2.4mm connector is a precision millimeter wave connector, which can be used up to 50GHz in terms of technology. Two 2.4mm detachable connectors with relatively superior performance were selected from the market. They were not connected to the circuit, but directly plugged through the glass insulator, eliminating the influence of the structure and circuit on it. Their test standing wave was within 1.25. However, in actual engineering applications, if the 2.4mm connector is connected to the circuit according to the conventional method of use, and the 50Ω microstrip line is directly overlapped through the glass insulator for matching, and the structure is also conventionally slotted according to the size of the insulator, the test standing wave of the finished product is not satisfactory; when the glass insulator is overlapped with the 50Ω microstrip line, although in theory the insulator and the microstrip line are both 50Ω and are completely matched, there is actually an impedance mutation at the connection point between the probe and the microstrip line. This mutation has little effect on the low-frequency end, but the high-frequency end will be more sensitive to this mutation, resulting in a large standing wave. The standing wave at the high-frequency end near the 50GHz frequency even rises to more than 3;

[0004] Therefore, a good matching method is urgently needed to solve this problem. Summary of the invention

[0005] In view of this, an embodiment of the present invention provides a structural solution that perfectly matches a detachable high-frequency connector, including a microstrip line tap structure and a connector through-wall structure. The improved structure greatly improves the port standing wave and solves the problem that traditional connectors with probes are prone to damaging the microstrip line.

[0006] In a first aspect, a matching method of a detachable high-frequency connector in an engineering application is provided, comprising a microstrip board, an insulator and a connector, wherein the matching method comprises the following steps:

[0007] S1: Detecting the degree of standing wave deterioration caused by the impedance mutation at the connection position between the probe of the insulator and the microstrip line on the microstrip board;

[0008] S2: adjusting the size of the microstrip line port according to the degree of standing wave deterioration caused by the impedance mutation;

[0009] S3: adjusting and optimizing the shape of the microstrip line port according to the standing wave curve calculated by the 3D simulation software;

[0010] S4: Determine the influence of the insulator through-the-wall structure on the standing wave according to the actual comparative test to optimize the structural form of the insulator through-the-wall structure.

[0011] As a preferred technical solution of this embodiment, the connector is a 2.4mm detachable high-frequency connector with an operating frequency of up to 50GHz, and the inner conductor of the high-frequency connector includes a jack;

[0012] The insulator is sintered in a cavity; the cavity is grooved on the top surface and equipped with a microstrip plate, and a transmission microstrip line is arranged in the microstrip plate; the microstrip line feeding end of the cavity is also grooved and equipped with an insulator; the groove size of the cavity is adapted to the microstrip plate and the insulator according to the process requirements;

[0013] The connector is plugged into the insulator through the jack to feed the radio frequency microwave signal into the radio frequency microwave circuit;

[0014] The microstrip board sets the width and impedance of the microstrip line according to the radio frequency index requirements of the connector to match the feeding end of the insulator.

[0015] The jack of the inner conductor of the connector is plugged into and matched with the probe of the insulator; the connector is fixed to the cavity by means of mounting screws through two mounting holes of the connector.

[0016] As a preferred technical solution of this embodiment, the probe of the insulator passes through the center of the cylindrical dielectric body of the insulator, and the probe extends out from both ends of the dielectric body respectively;

[0017] The insulator is sintered into the slot on the end surface of the cavity, the probe at one end of the insulator is plugged into the inner conductor jack of the connector, and the other end of the probe is connected to the microstrip line on the microstrip board;

[0018] The aperture of the jack of the inner conductor of the connector is matched with the diameter of the probe of the insulator, and the impedance of the insulator and the microstrip line are both 50 ohms.

[0019] As a preferred technical solution of this embodiment, the slot depth of the insulator arranged on the end surface of the cavity is shallower than the wall penetration depth of the insulator.

[0020] As a preferred technical solution of this embodiment, one end of the microstrip line interface where the probe and the microstrip line meet is set in the shape of a gradient line;

[0021] The impedance matching condition is determined according to the 3D simulation result, and the size of the gradient line is adjusted according to the matching condition.

[0022] In summary, according to the above materials, a detachable high-frequency connector and a matching method thereof have the following good effects:

[0023] 1. Detachable connection: The connector can be detachably connected to the insulator through the probe hole, which is convenient for assembly, disassembly and maintenance; it also avoids the microstrip line being damaged by the slight rotation of the connector.

[0024] 2. Optimization of high-frequency transmission performance: By detecting the standing wave change amplitude caused by the impedance mutation at the connection point between the probe and the microstrip line, and combining 3D simulation software to adjust and optimize the size and shape of the microstrip line port, the performance of high-frequency signal standing wave and insertion loss indicators can be improved.

[0025] 3. Perfect structural matching: When the insulator is burned into the cavity insulator slot, it is not perfectly perpendicular to the cavity wall, but slightly tilted. We structurally make the slot depth of the insulator on the cavity slightly shallower than the slot depth of the insulator. Even if the insulator is slightly tilted, it can ensure that the connector can fit perfectly with the insulator end face during installation, and will not be affected by the insulator tilt. Ensure the stability and consistency of the connection, and avoid high-frequency signal loss and deterioration of standing waves.

[0026] In summary, the optimized cavity structure and microstrip line structure can have good impedance matching with the insulator and detachable high-frequency connector, thereby optimizing the standing wave and insertion loss performance. In the wide frequency band of DC-50GHz, the standing wave reaches an excellent index of 1.4, which is suitable for high-frequency connection requirements in engineering applications.

[0027] With reference to the following description and accompanying drawings, specific embodiments of the present invention are disclosed in detail, indicating the manner in which the principles of the present invention can be adopted. It should be understood that the embodiments of the present invention are not limited in scope. Within the spirit and scope of the appended claims, the embodiments of the present invention include many changes, modifications and equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0029] Figure 1 The invention is a schematic diagram of an assembly of a connector, an insulator, a cavity, and a microstrip board in a matching method of a detachable high-frequency connector in an engineering application;

[0030] Figure 2 The present invention is a three-dimensional schematic diagram of a detachable high-frequency connector in a matching method of the detachable high-frequency connector in engineering applications;

[0031] Figure 3 It is a schematic diagram of an insulator in a matching method of a detachable high-frequency connector in engineering applications;

[0032] Figure 4 It is a front view and a side view of a cavity in a matching method of a detachable high-frequency connector in an engineering application;

[0033] Figure 5 A plan view of a microstrip board in a matching method of a detachable high-frequency connector in an engineering application

[0034] Figure 6 This is a comparison chart between the traditional microstrip line interface and the optimized microstrip line interface;

[0035] Figure 7 This is a comparison chart of the traditional insulator penetrating the wall and the optimized insulator penetrating the wall;

[0036] Parts and numbers in the picture:

[0037] 1-connector, 2-insulator, 3-cavity, 4-microstrip board. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described in conjunction with the drawings in the embodiment of the present invention. It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. Moreover, the term "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such a process, method, article or device. In the absence of further restrictions, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article or device comprising the elements. If there is no conflict, the various features in the embodiments and examples of the present invention can be combined with each other, all within the scope of protection of the present invention.

[0039] Example 1

[0040] See also Figures 1 to 7 The embodiment of the present invention provides a matching method of a detachable high-frequency connector in an engineering application, comprising a microstrip board 4, an insulator 2 and a connector 1, characterized in that the matching method comprises the following steps:

[0041] S1: Detecting the degree of standing wave deterioration caused by the impedance mutation at the connection position between the probe of the insulator 2 and the microstrip line on the microstrip plate 4;

[0042] The impedance of the insulator 2 and the microstrip line 4 are both 50Ω, which is theoretically completely matched. However, in reality, there is an impedance mutation at the location where the probe connects to the microstrip line. This mutation has little effect on the low-frequency end, but the high-frequency end is more sensitive to this impedance mutation, resulting in a large standing wave, so the extent of its impact must be detected.

[0043] S2: adjusting the size of the microstrip line port according to the degree of standing wave deterioration caused by the impedance mutation;

[0044] According to S1, we can only offset this impedance mutation by adjusting the size of the port of the 50Ω microstrip line at the junction with the insulator;

[0045] S3: adjusting and optimizing the shape of the microstrip line port according to the standing wave curve calculated by the 3D simulation software;

[0046] The microstrip line port at the probe connection with the insulator 2 is set to a gradient line shape to achieve a good match between the microstrip line and the insulator 2;

[0047] S4: Based on the actual comparative test, the influence of the insulator through-the-wall structure on the standing wave is determined to optimize the structural form of the insulator through-the-wall.

[0048] The slot depth of the insulator 2 at the end face of the cavity 3 is shallower than the wall penetration depth of the insulator 2; according to the adjustment and optimization of the actual 3D simulation software and the adaptation of the shape of the microstrip line port, the slot depth of the insulator 2 at the end face of the cavity 3 is set to be 0.1 mm shallower than the actual wall penetration depth of the insulator 2;

[0049] As a preferred technical solution of this embodiment, the connector 1 uses a 2.4mm detachable high-frequency connector with an operating frequency of up to 50GHz, and the inner conductor of the high-frequency connector is configured as a jack instead of a traditional probe;

[0050] The insulator 2 is sintered in a cavity 3; the cavity 3 is grooved on the top surface and equipped with a microstrip plate 4, and a transmission microstrip line is arranged in the microstrip plate 4; the microstrip line feeding end of the cavity 3 is also grooved and equipped with an insulator 2; the groove size of the cavity 3 is adapted to the microstrip plate 4 and the insulator 2 according to the process requirements;

[0051] The connector 1 is plugged into the insulator 2 through the jack to feed the radio frequency microwave signal into the radio frequency microwave circuit;

[0052] The microstrip board 4 sets the width and impedance of the microstrip line according to the radio frequency index requirements of the connector 1 to match the feeding end of the insulator 2 .

[0053] The jack of the inner conductor of the connector 1 is plugged into and matched with the probe of the insulator 2; the connector 1 is fixed to the cavity by means of mounting screws through two mounting holes, thereby achieving good radio frequency indicators;

[0054] As a preferred technical solution of this embodiment, the probe of the insulator passes through the center of the cylindrical dielectric body of the insulator, and extends a probe length at each end of the dielectric body;

[0055] The insulator is sintered into the insulator slot on the end surface of the cavity, a probe at one end of the insulator is plugged into the inner conductor jack of the connector, and the other end of the probe is connected to the microstrip line on the microstrip board;

[0056] The diameter of the inner conductor jack of the connector 1 matches the diameter of the probe of the insulator 2, and the impedance of the insulator 2 and the microstrip line are both 50 ohms; the connector 1 and the insulator 2 can be plugged into and disassembled with each other, so it is called a detachable connector. This non-integrated detachable structure of the connector 1 and the insulator 2 effectively avoids the risk of the microstrip line being damaged due to the slight rotation of the connector during use, which drives the insulator 2 to rotate together.

[0057] As a preferred technical solution of this embodiment, the groove depth of the insulator 2 arranged on the side of the cavity is shallower than the penetration depth of the insulator 2 through the wall.

[0058] As a preferred technical solution of this embodiment, one end of the microstrip line interface where the probe connects with the microstrip line is set to a gradient line shape; wherein the impedance matching condition is judged according to the 3D simulation result, and then the size of the gradient line is adjusted according to the matching condition.

[0059] Example 2

[0060] See also Figures 1 to 7 , an embodiment of the present invention provides a matching method of a detachable high-frequency connector in engineering applications;

[0061] Among them, the connector 1 includes a 2.4mm connector; in terms of structural assembly, the fitting effect between the 2.4mm detachable connector 1 and the end face of the insulator 2 also has a relatively large impact on the standing wave at the high-frequency end. If a slot is made on the cavity according to the wall penetration depth of the insulator, the wall penetration direction of the insulator 2 and the cavity plane of the 2.4mm detachable connector 1 cannot be perfectly perpendicular during assembly, and there will always be a slight tilt. This slight tilt will cause the end face of the 2.4mm connector 1 to not fit well with the end face of the insulator 2 when the insulator 2 is plugged in, and there will be a slight gap. This tiny gap will greatly affect the standing wave near 50GHz. Therefore, in order to ensure the perfect fit between the detachable connector 1 and the insulator 2, the depth of the slot on the cavity 3 is 0.1mm shallower than the wall penetration depth of the insulator 2 during structural design. In this way, even if the insulator 2 is slightly tilted when it is inserted into the slot on the cavity 3, it can be ensured that the end face of the insulator 2 that is connected to the connector 1 can slightly protrude outside the surface of the cavity 3. In this way, when the connector 1 is assembled, the connector 1 can still be completely fitted with the end face of the insulator 2, ensuring that the test standing wave is within 1.4;

[0062] In summary, according to the above materials, the matching method has the following excellent effects:

[0063] 1. Detachable connection: The conductor jack and insulator inside the connector can be detachably connected, which is convenient for assembly, disassembly and maintenance; it also avoids the traditional connector with probe driving the microstrip line to rotate when rotating, thereby damaging the microstrip line.

[0064] 2. Achieve good matching between the insulator and the microstrip line: Combine the simulation curve of the 3D simulation software to determine the degree of standing wave deterioration caused by the impedance mutation at the connection position between the probe and the microstrip line, and adjust and optimize the size and shape of the microstrip line port to improve the matching between the microstrip line and the insulator.

[0065] 3. Achieve a good match between the connector and the insulator: By making the depth of the insulator slot on the cavity 0.1mm shallower than the depth of the insulator through the wall, the matching degree between the connector and the insulator in engineering use can be optimized.

[0066] 4. Optimization of high-frequency transmission performance: After the optimization adjustments made in 2 and 3 above, good impedance matching is achieved between the components, so that excellent standing wave and insertion loss performance indicators can be achieved in the high frequency band of 50GHz.

[0067] In summary, the detachable high-frequency connector and the matching method thereof have excellent effects such as good connection performance, signal transmission optimization, matching stability and convenient assembly and maintenance, and are suitable for high-frequency connection needs in engineering applications.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A matching method for a detachable high-frequency connector in an engineering application, comprising a microstrip board, an insulator and a connector, characterized in that: The matching method comprises the following steps: S1: Detecting the degree of standing wave deterioration caused by the impedance mutation at the connection position between the probe of the insulator and the microstrip line on the microstrip board; S2: adjusting the size of the microstrip line port according to the degree of standing wave deterioration caused by the impedance mutation; S3: adjusting and optimizing the shape of the microstrip line port according to the standing wave curve calculated by the 3D simulation software; S4: Determine the influence of the insulator through-the-wall structure on the standing wave according to the actual comparative test to optimize the structural form of the insulator through-the-wall structure.

2. The matching method according to claim 1, characterized in that: The connector is a 2.4 mm detachable high-frequency connector with an operating frequency of up to 50 GHz, and the inner conductor of the high-frequency connector includes a jack; The insulator is sintered in a cavity; the cavity is grooved on the top surface and equipped with a microstrip plate, and a transmission microstrip line is arranged in the microstrip plate; the microstrip line feeding end of the cavity is also grooved and equipped with an insulator; the groove size of the cavity is adapted to the microstrip plate and the insulator according to the process requirements; The connector is plugged into the insulator through the jack to feed the radio frequency microwave signal into the radio frequency microwave circuit; The microstrip board sets the width and impedance of the microstrip line according to the radio frequency index requirements of the connector to match the feeding end of the insulator. The jack of the inner conductor of the connector is plugged into and matched with the probe of the insulator; the connector is fixed to the cavity by means of mounting screws through two mounting holes of the connector.

3. The matching method according to claim 2, characterized in that: The probe of the insulator passes through the center of the cylindrical dielectric body of the insulator, and the probe extends out from both ends of the dielectric body respectively; The insulator is sintered into the slot on the end surface of the cavity, the probe at one end of the insulator is plugged into the inner conductor jack of the connector, and the other end of the probe is connected to the microstrip line on the microstrip board; The aperture of the jack of the inner conductor of the connector is matched with the diameter of the probe of the insulator, and the impedance of the insulator and the microstrip line are both 50 ohms.

4. The matching method according to claim 3, characterized in that: The slot depth of the insulator arranged on the end surface of the cavity is shallower than the wall penetration depth of the insulator.

5. The method according to claim 2, characterized in that: One end of the microstrip line interface where the probe and the microstrip line meet is configured in the shape of a gradient line; The impedance matching condition is determined according to the 3D simulation result, and the size of the gradient line is adjusted according to the matching condition.

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