Through-flow device and PCB device

Abstract

The invention provides a through-flow device and a PCB device. The through-flow device is used for the PCB and comprises a cable assembly, the cable assembly comprises a plurality of cables which are arranged side by side and insulated from one another, and the cable assembly is arranged above the PCB; and the two switching assemblies are connected to the two ends of the cable assembly respectively, the two ends of the multiple cables are connected to the corresponding switching assemblies, and the two switching assemblies are used for connecting the cables to the PCB. According to the through-flow device provided by the embodiment of the invention, through-flow is carried out by using the cable assembly so as to share part of current on the PCB and relieve the through-flow pressure of the PCB, and connection between the cable assembly and the PCB is realized through the switching assemblies located at the two ends of the cable assembly, so that the through-flow requirement of the PCB can be met under the condition that the number of layers of the PCB is not increased.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to a flow-through device and a PCB device. Background Art

[0002] Printed Circuit Board (PCB), also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called a "printed" circuit board.

[0003] When the power supply current is too large to meet the PCB's requirements, the only way is to increase the number of PCB layers to meet the current requirements. However, increasing the number of PCB layers requires a high cost, and some PCBs cannot have an unlimited number of layers due to thickness limitations.

[0004] Therefore, how to meet the current demand without increasing the number of PCB layers is an urgent problem to be solved. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a flow-through device and a PCB device, which can connect a cable assembly to a PCB board through a switching assembly, so as to utilize multiple cables in the cable assembly for flow-through, and can meet the flow-through demand without increasing the number of layers of the PCB board. Moreover, the cable assembly is "suspended" and spaced above the PCB board, which can prevent the cable assembly from affecting the layout of components on the PCB board.

[0006] To achieve the above-mentioned purpose, an embodiment of the present invention provides a flow-through device for a PCB board, the flow-through device comprising: a cable assembly, the cable assembly comprising a plurality of cables arranged side by side and insulated from each other, the cable assembly being arranged above the PCB board; two adapter assemblies, the two adapter assemblies being respectively connected to the two ends of the cable assembly, the two ends of the plurality of cables being connected to the corresponding adapter assemblies, the two adapter assemblies being used to connect the cable assembly to the PCB board.

[0007] In some embodiments, the adapter assembly includes a housing and a first connection structure connected to the housing, and the first connection structure is used for fixed connection with the PCB board.

[0008] In some embodiments, the first connection structure includes a plurality of protrusions arranged at intervals, the protrusions extending from the housing toward the PCB board, and the protrusions are used for welding to the PCB board to achieve welding connection between the first connection structure and the PCB board.

[0009] In some embodiments, the adapter assembly also includes: a second connecting structure, the shell has a accommodating cavity, the second connecting structure is arranged in the accommodating cavity, the second connecting structure is insulated and connected to the inner wall of the shell and conductively connected to part of the cables in the cable assembly; wherein the second connecting structure contacts the power copper foil of the PCB board when the first connecting structure is connected to the PCB board, and the second connecting structure is used to realize the power connection between the cable and the PCB board.

[0010] In some embodiments, the second connection structure includes a plurality of arc-shaped spring pieces that are insulated from each other, and the plurality of arc-shaped spring pieces are the same in number and connected one-to-one with a plurality of cables connected to the second connection structure.

[0011] In some embodiments, the adapter assembly also includes: a third connecting structure, the third connecting structure is arranged in the accommodating cavity, the third connecting structure is conductively connected to the inner wall of the shell and the remaining cables in the cable assembly, and the shell is conductively connected to the first connecting structure; wherein the third connecting structure is in contact with the reference ground copper foil of the PCB board when the first connecting structure is connected to the PCB board, and the third connecting structure is used to realize the return current connection between the cable and the PCB board.

[0012] In some embodiments, the third connection structure includes a plurality of arc-shaped spring pieces that are insulated from each other, and the plurality of arc-shaped spring pieces are the same in number and connected one-to-one with a plurality of cables connected to the third connection structure.

[0013] In some embodiments, the third connecting structure includes a group of connecting members, the connecting members include multiple arc-shaped spring leaves, and the connecting members are arranged on one side of the second connecting structure; or the third connecting structure includes multiple groups of connecting members, each group of connecting members includes multiple arc-shaped spring leaves, and the multiple groups of connecting members are respectively arranged on both sides of the second connecting structure.

[0014] The present invention also provides a PCB device, comprising a PCB board and the above-mentioned flow-through device; wherein the PCB board comprises a stacked structure stacked along a preset direction, the stacked structure having a layout surface facing the preset direction; the stacked structure comprises a power layer, the layout surface is provided with a power copper foil connected to the power layer; the stacked structure also comprises a ground layer stacked on one side of the power layer, the layout surface is provided with a reference ground copper foil connected to the ground layer.

[0015] In some embodiments, a connection hole is provided on the PCB board, the opening of which is located on the layout surface and penetrates at least one layer in the laminated structure. The opening of the connection hole is provided on the reference ground copper foil, and the connection hole is used to connect the adapter component.

[0016] The current-passing device in this embodiment uses a cable assembly to pass current to share part of the current on the PCB board, relieve the current-passing pressure of the PCB board, and realizes the connection between the cable assembly and the PCB board through the adapter assemblies located at both ends of the cable assembly, so that the current-passing demand can be met without increasing the number of layers of the PCB board. Moreover, since the adapter assemblies are respectively arranged at both ends of the cable assembly, the cable assembly can be connected to the PCB board without being attached to the layout surface of the PCB board, that is, there is a gap between the cable assembly and the layout surface of the PCB board, thereby avoiding the cable assembly affecting the arrangement of components on the layout surface of the PCB board.

[0017] Other objects and features of the present invention will become apparent by reading the specification, claims and drawings of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 It is a structural schematic diagram of a flow-through device according to an embodiment of the related art.

[0020] Figure 2 It is a schematic structural diagram of a flow-through device according to an embodiment of the present invention.

[0021] Figure 3 1 is a top view of a flow device according to an embodiment of the present invention.

[0022] Figure 4 It is a top view of the connection between the adapter assembly and the cable assembly of the flow device according to the embodiment of the present invention.

[0023] Figure 5 It is an axial view of the connection between the adapter assembly and the cable assembly of the flow-through device according to the embodiment of the present invention.

[0024] Figure 6 It is a side view of the connection between the adapter assembly and the cable assembly of the flow-through device according to the embodiment of the present invention.

[0025] Figure 7 It is a bottom view of the connection between the adapter assembly and the cable assembly of the flow device according to the embodiment of the present invention.

[0026] Figure 8 is a top view of a PCB board of a flow-through device according to an embodiment of the present invention.

[0027] Fig. 9 It is a bottom view of the adapter assembly of the flow device according to the embodiment of the present invention.

[0028] Description of main component symbols:

[0029] 1. Flow-through device; 2. Flow-through bar; 3. PCB board;

[0030] 10. Flow-through device;

[0031] 100, PCB board; 110, layout surface; 120, connection hole; 130, power copper foil; 140, reference ground copper foil;

[0032] 200. Cable assembly; 210. Cable;

[0033] 300, adapter assembly;

[0034] 310. housing; 311. first opening;

[0035] 320, first connection structure; 321, protrusion;

[0036] 330. second connection structure; 331. arc-shaped spring leaf;

[0037] 340. A third connecting structure; 341. A connecting member; 342. An arc-shaped spring leaf. DETAILED DESCRIPTION

[0038] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0040] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0043] When the power supply current is too high to meet the requirements, the only way to meet the current requirement is to increase the number of PCB layers. However, increasing the number of PCB layers requires a high cost, and some PCBs cannot increase the number of layers indefinitely due to thickness limitations. Therefore, how to meet the current requirement without increasing the number of PCB layers is an urgent problem to be solved.

[0044] In order to solve the above technical problems, the related art proposes to set a surface-mount auxiliary component on the surface of the PCB board 2 and use the surface-mount auxiliary component for flow. In some embodiments, the surface-mount auxiliary component can be a flow block or a flow bar.

[0045] Regarding the relative position relationship between surface-mount auxiliary parts such as flow blocks or flow strips and the PCB board, the flow strip is specifically described below.

[0046] Figure 1 is a structural schematic diagram of a flow-through device according to a related art embodiment. Figure 1 The flow-through device 1 for the PCB board 3 in the related art implementation includes a flow-through bar 2, which is attached to the PCB board 3, so the flow-through bar 2 can be called a surface-mounted auxiliary component. Figure 1 In the actual use of the through-flow device 1 shown in the figure, the through-flow bar 2 is fixedly connected to the surface copper foil of the PCB board 3. The fixed connection between the two can be welding or screw connection. Of course, other fixed connection methods can also be used. The through-flow bar 2 can pass the flow and relieve the through-flow pressure of the PCB board.

[0047] However, the flow bar 2 in the flow device 1 in the related art implementation is attached to the surface of the PCB board 3 , which will occupy a large amount of surface space of the PCB board 3 and affect the layout of components on the surface of the PCB board 3 .

[0048] The operation of each chip on the PCB is inseparable from the function of each power network. As the competition in the electronic product market intensifies, the cost control requirements for PCB boards are also gradually increasing, the number of layers of PCB boards is compressed, and the power network space is more tight. As the working current of the chip continues to increase, the current of the PCB board has gradually become an issue that needs to be paid attention to in the design of the power network. While meeting the current requirements of the PCB board, how to make full use of the space on the surface of the PCB and above to reduce the loss of the power network when transmitting current cannot be ignored.

[0049] In order to solve the above-mentioned problems in the related art, this embodiment proposes a flow-through device 10 for a PCB board 100, and the flow-through device 10 includes a cable assembly 200 and two adapter assemblies 300. In this embodiment, the cable assembly 200 is used for flow-through to share part of the current on the PCB board 100, relieve the flow-through pressure of the PCB board 100, and realize the connection between the cable assembly 200 and the PCB board 100 through the adapter assemblies 300 located at both ends of the cable assembly 200, so that the flow-through demand of the PCB board 100 can be met without increasing the number of layers of the PCB board 100. Furthermore, since adapter assemblies 300 are respectively provided at both ends of the cable assembly 200, the cable assembly 200 can be connected to the PCB board 100 without being attached to the layout surface 110 of the PCB board 100. That is to say, there is a distance between the cable assembly 200 and the layout surface 110 of the PCB board 100, thereby preventing the cable assembly 200 from affecting the arrangement of components on the layout surface 110 of the PCB board 100. When designing the PCB board 100, the space on the surface of the PCB and above can be fully utilized to reduce the loss of the power supply network when transmitting current, thereby solving the above-mentioned problems in the related technology.

[0050] In order to better explain this embodiment, the following is described in combination with the drawings. It should be noted that the structure in the drawings is only for schematic illustration and does not specifically limit the structure in this embodiment. Other structures derived therefrom are also within the protection scope of the present invention. Figure 2 Schematic diagram of the structure of the flow device 10 according to the embodiment of the present invention. Figure 3 FIG. 1 is a top view of a flow device 10 according to an embodiment of the present invention. Figure 2 and Figure 3 The flow device 10 includes a cable assembly 200 and two adapter assemblies 300. The PCB board 100 includes a laminated structure, and the laminated structure is stacked along a preset direction, wherein the preset direction can be Figure 2 The direction indicated by X in the figure should be noted that the preset direction may also be the opposite direction of X.

[0051] It should be noted that the laminated structure can be understood as the PCB board 100 including a multi-layer circuit board and the multi-layer circuit boards are stacked and formed, and the multi-layer circuit board includes at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized in the insulating board. The electrical connection between them is usually achieved through the plated through holes on the cross section of the circuit board. Unless otherwise specified, the multi-layer printed circuit board is generally a plated through hole board like the double-sided board. The multi-layer circuit board is manufactured by stacking two or more circuits on each other, and there is a reliable pre-set mutual connection between them.

[0052] In some embodiments, the laminated structure may include a top layer, a power layer, a ground layer and a bottom layer stacked along a preset direction. Of course, the laminated structure may also include other layer structures. The number of layers of the top layer, the power layer, the ground layer and the bottom layer may be 1 layer or 2 layers. The number of layers of the laminated structure and the specific layer structure are not limited here.

[0053] See also Figure 2 and Figure 3 The laminated structure has a layout surface 110 facing a preset direction, and components of the PCB board 100 can be arranged on the layout surface 110, wherein the layout surface 110 can also be understood as the above-mentioned surface layer of the PCB board 100.

[0054] See also Figure 3 The cable assembly 200 includes a plurality of cables 210, which are arranged side by side and insulated from each other, wherein the plurality of cables 210 are arranged side by side in sequence along a setting direction, and the setting direction may be parallel to the layout surface 110, that is, the plurality of cables 210 are arranged side by side in a plane parallel to the layout surface 110. It should be noted that the cable 210 includes a conductor and an insulating layer coated outside the conductor, and the conductor may be made of copper or copper-tin alloy. The structure of the cable 210 has been disclosed relatively completely in the relevant technology, and will not be repeated here. Figure 3The multiple cables 210 are arranged to be insulated from each other, which can be understood as the conductors of each cable 210 are insulated from each other by an insulation layer.

[0055] The cable assembly 200 is disposed above the PCB board 100. Specifically, the cable assembly 200 is disposed above the layout surface 110. For details, see Figure 2 The relative positional relationship between the cable assembly 200 and the layout surface 110 is shown. It should be noted that the cable assembly 200 is not attached to the layout surface 110, and it can be understood that the cable assembly 200 is "suspended" above the layout surface 110, so that components can be arranged between the cable assembly 200 and the layout surface 110, thereby avoiding the existence of the cable assembly 200 affecting the arrangement of components on the layout surface 110, so that the PCB board 100 can be designed to fully utilize the surface layer of the PCB and the space above it to reduce the loss of the power supply network when transmitting current.

[0056] See also Figure 2 and Figure 3 , two adapter assemblies 300 are respectively connected to the two ends of the cable assembly 200, in other words, the two ends of the cable assembly 200 are respectively provided with adapter assemblies 300. The cable assembly 200 includes a plurality of cables 210, wherein both ends of the plurality of cables 210 are connected to corresponding adapter assemblies 300. The two adapter assemblies 300 can be connected to the PCB board 100, and the two adapter assemblies 300 are used to connect the cables 210 to the PCB board 100, so that the cable assembly 200 can pass current.

[0057] The current passing device 10 in this embodiment uses the cable assembly 200 to pass the current, so as to share part of the current on the PCB board 100, relieve the current passing pressure of the PCB board 100, and realize the connection between the cable assembly 200 and the PCB board 100 through the adapter assembly 300 located at both ends of the cable assembly 200, so that the current passing demand can be met without increasing the number of layers of the PCB board 100. Moreover, since the adapter assembly 300 is respectively arranged at both ends of the cable assembly 200, the cable assembly 200 can be connected to the PCB board 100 without being attached to the layout surface 110 of the PCB board 100, that is, there is a gap between the cable assembly 200 and the layout surface 110 of the PCB board 100, so as to avoid the cable assembly 200 affecting the arrangement of components on the layout surface 110 of the PCB board 100.

[0058] Figure 4 1 is a top view of the connection between the adapter assembly 300 and the cable assembly 200 of the flow device 10 according to the embodiment of the present invention. Figure 5 It is an axial view of the connection between the adapter assembly 300 and the cable assembly 200 of the flow device 10 according to the embodiment of the present invention. Figure 6FIG. 1 is a side view of the connection between the adapter assembly 300 and the cable assembly 200 of the flow device 10 according to the embodiment of the present invention. Figures 4 to 6 The adapter assembly 300 includes a housing 310 and a first connection structure 320. The first connection structure 320 can be connected to the housing 310. For example, the first connection structure 320 can be conductively connected to the housing 310 or insulatedly connected to the housing 310. The first connection structure 320 is used to be fixedly connected to the PCB board 100.

[0059] The PCB board 100 is provided with a connection hole, the opening of the connection hole is located on the layout surface 110, and the connection hole penetrates at least one layer in the laminated structure, for example, the connection hole can penetrate one layer, two layers, three layers, four layers, or all layers in the laminated structure. Preferably, in order to facilitate the preparation of the connection hole on the PCB board 100 and the versatility of the connection hole, without adaptively changing according to the length of the first connection structure 320, the connection hole can penetrate all layers in the laminated structure, that is, the connection hole is set as a through-hole structure on the PCB board 100.

[0060] In some embodiments, the first connection structure 320 is disposed in the connection hole to be fixedly connected to the PCB board 100. The fixed connection between the first connection structure 320 and the PCB board 100 can be achieved by welding or other connection structures.

[0061] In some embodiments, see Figure 6 The first connection structure 320 may include a plurality of protrusions 321, and the protrusions 321 are used for welding with the PCB board 100. The plurality of protrusions 321 are arranged at intervals, and the intervals between the plurality of protrusions 321 may be the same or different. The protrusions 321 extend from the housing 310 toward the PCB board 100 to facilitate insertion into the connection hole, wherein the axis of the connection hole is perpendicular to the layout surface 110.

[0062] The PCB board 100 is provided with a plurality of connection holes, and the plurality of protrusions 321 and the plurality of connection holes are the same in number and are arranged one-to-one, so that each protrusion 321 can be connected to the PCB board 100, thereby improving the reliability of the connection between the adapter assembly 300 and the PCB board 100.

[0063] Specifically, the protrusion 321 is inserted into the connection hole and connected to the connection hole by welding, that is, the first connection structure 320 is disposed in the connection hole and welded to the inner wall of the connection hole to achieve welding connection between the first connection structure 320 and the PCB board 100 .

[0064] In some other embodiments, the protrusion 321 is directly connected to the PCB board 100 by welding.

[0065] The flow-through device 10 of the present embodiment realizes the connection between the adapter assembly 300 and the PCB board structure through the mutual cooperation between the first connection structure 320 and the connection hole. Since the cable assembly 200 is fixedly connected to the adapter assembly 300, the cable assembly 200 and the adapter assembly 300 can be prevented from shaking on the PCB board 100, thereby improving the reliability of the cable assembly 200 and the adapter assembly 300 on the PCB board 100.

[0066] Figure 7 It is a bottom view of the connection between the adapter assembly 300 and the cable assembly 200 of the flow device 10 according to the embodiment of the present invention. Figure 8 FIG. 1 is a top view of a PCB board 100 of a flow-through device 10 according to an embodiment of the present invention. Figure 7 and Figure 8 The housing 310 has a receiving cavity, and the adapter assembly 300 further includes a second connection structure 330, which is disposed in the receiving cavity. The second connection structure 330 is used to realize the power connection between the cable 210 and the PCB board 100.

[0067] The second connection structure 330 can be insulated and connected to the inner wall of the housing 310. For example, an insulating material is provided between the second connection structure 330 and the inner wall of the housing 310, the second connection structure 330 is connected to the insulating material, and the insulating material is connected to the inner wall of the housing 310, so as to achieve an insulated connection between the second connection structure 330 and the inner wall of the housing 310. The second connection structure 330 is conductively connected to a portion of the cables 210 in the cable assembly 200, and the cables 210 can be connected to the second connection structure 330 through the connection structure.

[0068] The laminated structure includes a power layer. The layout surface 110 is provided with a power copper foil 130 connected to the power layer. The power copper foil 130 can be connected to the power layer by vias.

[0069] The second connection structure 330 and the power copper foil 130 are used to contact each other when the first connection structure 320 is connected to the PCB board 100 , so as to achieve contact connection between the second connection structure 330 and the power copper foil 130 .

[0070] Fig. 9 FIG. 3 is a bottom view of the adapter assembly 300 of the flow device 10 according to an embodiment of the present invention. Fig. 9 In some embodiments, the housing 310 may be provided with a through hole penetrating the wall thickness thereof, the through hole forming a first opening 311 on the outer wall surface of the housing 310, the first opening 311 being arranged toward the layout surface 110, and at least a portion of the second connection structure 330 may extend out of the accommodation cavity through the first opening 311 to be contact-connected with the power copper foil 130. In some embodiments, the top cover of the housing 310 (not provided with the first opening 311 and facing the layout surface 110 of the PCB board 100) may be provided with an insulating material.

[0071] In order to reduce the resistance of the adapter assembly 300 when connected, the second connection structure 330 may be made of copper.

[0072] Specifically, the second connection structure 330 includes a plurality of arc-shaped spring pieces 331 insulated from each other, and the shape of the arc-shaped spring pieces 331 is an arc. The number of the plurality of arc-shaped spring pieces 331 is the same as the number of the plurality of cables 210 connected to the second connection structure 330, and they are connected one-to-one. In other words, each cable 210 is connected to a single arc-shaped spring piece 331. The arc-shaped spring piece 331 is used to realize the connection between each cable 210 and the power supply on the PCB board 100, so as to realize the current diversion of the plurality of cables 210.

[0073] In order to reduce the resistance of the adapter assembly 300 when connected, the arc-shaped spring piece 331 can be made of copper.

[0074] See also Figure 7 and Figure 8 The adapter assembly 300 further includes a third connection structure 340, which is also disposed in the accommodating cavity. The third connection structure 340 is used to realize the return current connection between the cable 210 and the PCB board 100.

[0075] The third connection structure 340 can be conductively connected to the inner wall of the housing 310, for example, the third connection structure 340 is welded to the inner wall of the housing 310 by a conductive material to achieve a conductive connection between the third connection structure 340 and the inner wall of the housing 310. The third connection structure 340 is conductively connected to the remaining cables 210 in the cable assembly 200, and the housing 310 is conductively connected to the first connection structure 320. In other words, the third connection structure 340 is conductively connected to the first connection structure 320 and the remaining cables 210 in the cable assembly 200.

[0076] The stacked structure also includes a ground layer, which is stacked on one side of the power layer. For example, the ground layer is Figure 1 The preset direction in the above power layer, or along Figure 1 The preset direction in the circuit is set below the power layer. The layout surface 110 is provided with a reference ground copper foil 140 connected to the ground layer, and the reference ground copper foil 140 can be connected to the ground layer by way of vias.

[0077] See also Figure 8 The opening of the connection hole is set at the reference ground copper foil 140. The third connection structure 340 contacts the reference ground copper foil 140 when the first connection structure 320 is connected to the PCB board 100, so as to achieve contact connection between the third connection structure 340 and the reference ground copper foil 140.

[0078] Similarly, see Fig. 9In some embodiments, the shell 310 may be provided with a through hole penetrating the wall thickness thereof, and the through hole forms a first opening 311 on the outer wall surface of the shell 310, and the first opening 311 is arranged toward the layout surface 110. At least part of the third connection structure 340 can extend out of the accommodating cavity through the first opening 311 to be in contact connection with the reference ground copper foil 140.

[0079] In order to reduce the resistance of the adapter assembly 300 when connected, the third connection structure 340 may be made of copper.

[0080] Specifically, the third connection structure 340 includes a plurality of arc-shaped spring pieces 342 insulated from each other, and the shape of the arc-shaped spring pieces 342 is an arc. The number of the plurality of arc-shaped spring pieces 342 is the same as the number of the plurality of cables 210 connected to the third connection structure 340, and they are connected one-to-one. In other words, each cable 210 is connected to a single arc-shaped spring piece 342. The arc-shaped spring piece 342 is used to realize the connection between each cable 210 and the power supply on the PCB board 100, so as to realize the shunting of the plurality of cables 210.

[0081] In order to reduce the resistance of the adapter assembly 300 when connected, the arc-shaped spring piece 342 can be made of copper.

[0082] In some embodiments, the arc-shaped spring piece 331 of the second connection structure 330 and the arc-shaped spring piece 342 of the third connection structure 340 may have the same structure.

[0083] In some embodiments, the third connection structure 340 includes a group of connection members 341, the connection members 341 include a plurality of arc-shaped spring pieces 342, and the connection members 341 are disposed on one side of the second connection structure 330. For example, the connection members 341 can be disposed on the left side of the second connection structure 330. Alternatively, the connection members 341 can also be disposed on the right side of the second connection structure 330.

[0084] In some other embodiments, the third connection structure 340 includes a plurality of groups of connection members 341 , each group of connection members 341 includes a plurality of arc-shaped spring leaves 342 , and the plurality of groups of connection members 341 are respectively disposed on both sides of the second connection structure 330 .

[0085] For details, see Figure 7 The third connection structure 340 may include two groups of connection members 341, each group of connection members 341 includes a plurality of arc-shaped spring pieces 342, and the two groups of connection members 341 are respectively arranged on both sides of the second connection structure 330. Each group of connection members 341 may include 6 arc-shaped spring pieces 342.

[0086] It should be noted that the number and type of cables 210 in the cable assembly 200 are related to the PCB board 100, and different numbers and types are used in different embodiments. However, the steps for determining the number and type of cables 210 in the cable assembly 200 in different embodiments are the same. For ease of understanding, a specific embodiment is used for specific description below.

[0087] First: simulate the PCB board 100.

[0088] According to the design requirements of the PCB board 100, the PCB board 100 is simulated by a simulation device. When the simulation results show that the current through the power plane on the PCB board 100 does not meet the requirements and the power consumption is too large, the PCB board 100 needs to be circulated so that the current through the PCB board 100 meets the requirements.

[0089] Generally speaking, the related art would think of solving the above problems by increasing the number of power layers or setting surface-mount auxiliary components. However, increasing the number of power layers will thicken the PCB board 100, which may make it impossible to install the PCB board 100 in the designated space, thereby affecting the use of the PCB board 100; the surface-mount auxiliary components will affect the surface layout of the PCB board 100.

[0090] This embodiment adopts a solution different from that in the related art to solve the above technical problems. This embodiment uses the cable assembly 200 for current flow to share part of the current on the PCB board 100, relieve the current flow pressure of the PCB board 100, and realizes the connection between the cable assembly 200 and the PCB board 100 through the adapter assembly 300 located at both ends of the cable assembly 200, so that the current flow demand of the PCB board 100 can be met without increasing the number of layers of the PCB board 100. Moreover, since the shape of the cable 210 is not fixed and is relatively soft, it does not need to be attached to the layout surface 110 of the PCB board 100, so it has relatively high flexibility in specific use.

[0091] Secondly: Calculate and simulate the number of cables 210 and the type of cables 210 required for the auxiliary current.

[0092] Step 1, obtaining the number of power supply layers specifically included in the stacked structure of the PCB board 100, and then calculating and obtaining the maximum current carrying capacity I of the PCB board 100 according to the number of power supply layers on the PCB board 100 pcb .

[0093] Step 2: Obtain the actual operating current I of the chip on the PCB board 100 total , and then calculate the actual working current I of the chip total The maximum current carrying capacity of the PCB board is 100 pcb The difference between ΔI (ΔI = I total -I pcb), the difference ΔI can be understood as the current value that requires the cable assembly 200 to assist in passing the current.

[0094] Step 3: Select a suitable type of cable 210 and determine the number of cables 210 in the cable assembly 200 according to the difference ΔI and the temperature rise condition.

[0095] Step 4: Simulate and obtain the DC resistance R of the power layer on the PCB board 100 pcb .

[0096] Step 5: Calculate the total DC resistance R of the cable assembly 200 and the adapter assembly 300 cable .

[0097] Step 6: Calculate the actual current I that can flow through the cable assembly 200 according to the current distribution principle. cable .

[0098] Among them, I pcb / I cable =R cable / R pcb

[0099] Step 7: Compare the actual current I that the cable assembly 200 can flow through cable And the current ΔI that needs auxiliary flow, if I cable >ΔI, the design of the cable assembly 200 (the design of the cable assembly 200 at least includes the number of cables 210 in the cable assembly 200 and the type of cables 210) is appropriate; if cable <ΔI, the auxiliary current carrying capacity of the cable assembly 200 cannot meet the current carrying requirement of the PCB board 100. In this case, it is necessary to increase the number of cables 210 in the cable assembly 200, or to reduce the DC resistance R of the cable 210 and the adapter assembly 300. cable To increase the actual flow capacity of the cable 210 cable .

[0100] Step 8: manufacturing a PCB board 100, which at least includes a laminated structure and vias.

[0101] Step 9, using a simulation device to simulate and verify whether the power consumption of the PCB board 100 in the above-mentioned flow-through device 10 meets the requirements after the cable assembly 200 passes the current, and whether the diversion size of the cable assembly 200 is appropriate.

[0102] Step 10, when the simulation verification scheme is feasible, the cable assembly 200 and the adapter assembly 300 are manufactured, and the PCB board 100 manufactured in step 8 is assembled with the cable assembly 200 and the adapter assembly 300 into a flow device 10.

[0103] Comparative Example

[0104] The current at the chip end is set to 500A, and the simulation results show that the total power consumption is 118.8W.

[0105] Example

[0106] The current at the chip end is set to 500A, and the simulation results show that the total power consumption is 97.1W.

[0107]

[0108] (The above table is the simulation results of comparative examples and embodiments)

[0109] From the above simulation results, it can be seen that by adopting the cable assembly 200 and the adapter assembly 300 described in this proposal, the total voltage drop is reduced by 10.6%, the power consumption on the PCB board 100 can be reduced by 18.3%, and the current is reduced by 21.6%, which has a significant improvement effect on the current and power consumption of the PCB board 100.

[0110] In some embodiments, the PCB device includes a PCB board 100 and a flow device 10. The PCB board 100 includes a laminated structure stacked along a preset direction, and the laminated structure has a layout surface 110 facing the preset direction. The laminated structure includes a power layer, and the layout surface 110 is provided with a power copper foil 130 connected to the power layer. The laminated structure also includes a ground layer stacked on one side of the power layer, and the layout surface 110 is provided with a reference ground copper foil 140 connected to the ground layer.

[0111] The PCB board 100 is provided with a connection hole 120 whose opening is located on the layout surface 110 and penetrates at least one layer in the laminated structure. The opening of the connection hole 120 is set at the reference ground copper foil 140 . The connection hole 120 is used to connect the adapter component 300 .

[0112] Specifically, the connection hole 120 is used to connect the first connection structure 320 to achieve a fixed connection between the adapter assembly 300 and the PCB board 100 .

[0113] It should be noted that the above comparative examples and embodiments are only for illustrating the beneficial effects of the present embodiment, rather than limiting the present embodiment. The embodiments may be further optimized and will not be described in detail again.

[0114] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A flow-through device for a PCB board, characterized in that: The flow-through device comprises: A cable assembly, the cable assembly comprising a plurality of cables arranged side by side and insulated from each other, the cable assembly being arranged above the PCB board; Two adapter assemblies, the two adapter assemblies are respectively connected to the two ends of the cable assembly, the two ends of the multiple cables are connected to the corresponding adapter assemblies, and the two adapter assemblies are used to connect the cable assembly to the PCB board.

2. The flow device according to claim 1, characterized in that The adapter assembly includes a housing and a first connection structure connected to the housing, wherein the first connection structure is used for fixed connection with the PCB board.

3. The flow device according to claim 2, characterized in that The first connection structure includes a plurality of protrusions arranged at intervals, wherein the protrusions extend from the housing toward the PCB board, and the protrusions are used for welding with the PCB board to achieve welding connection between the first connection structure and the PCB board.

4. The flow device according to claim 2, characterized in that The switching component also includes: A second connection structure, the housing has a receiving cavity, the second connection structure is disposed in the receiving cavity, the second connection structure is insulatedly connected to the inner wall of the housing and conductively connected to a portion of the cables in the cable assembly; The second connection structure is in contact with the power copper foil of the PCB board when the first connection structure is connected to the PCB board, and the second connection structure is used to realize the power connection between the cable and the PCB board.

5. The flow device according to claim 4, characterized in that The second connection structure includes a plurality of arc-shaped spring pieces that are insulated from each other. The number of the arc-shaped spring pieces is the same as the number of the cables connected to the second connection structure and they are connected one-to-one.

6. The flow device according to claim 4, characterized in that The switching component also includes: a third connection structure, the third connection structure being disposed in the accommodating cavity, the third connection structure being conductively connected to an inner wall of the housing and the remaining cables in the cable assembly, and the housing being conductively connected to the first connection structure; The third connection structure is in contact with the reference ground copper foil of the PCB board when the first connection structure is connected to the PCB board, and the third connection structure is used to achieve a return current connection between the cable and the PCB board.

7. The flow device according to claim 6, characterized in that The third connection structure includes a plurality of arc-shaped spring pieces that are insulated from each other. The number of the arc-shaped spring pieces is the same as the number of the cables connected to the third connection structure and they are connected one-to-one.

8. The flow device according to claim 7, characterized in that The third connection structure comprises a group of connection members, the connection members comprise a plurality of the arc-shaped spring leaves, and the connection members are arranged on one side of the second connection structure; or The third connection structure includes a plurality of groups of connection members, each group of the connection members includes a plurality of the arc-shaped spring leaves, and the plurality of groups of the connection members are respectively arranged on both sides of the second connection structure.

9. A PCB device, characterized in that: A device comprising a PCB board and a flow-through device as claimed in any one of claims 1 to 8; Wherein, the PCB board comprises a stacked structure stacked along a preset direction, and the stacked structure has a layout surface facing the preset direction; The laminated structure includes a power supply layer, and the layout surface is provided with a power supply copper foil connected to the power supply layer; The laminated structure further includes a ground layer stacked on one side of the power layer, and the layout surface is provided with a reference ground copper foil connected to the ground layer.

10. The PCB device according to claim 9, characterized in that: The PCB board is provided with a connection hole whose opening is located on the layout surface and penetrates at least one layer in the laminated structure. The opening of the connection hole is arranged on the reference ground copper foil, and the connection hole is used to connect the adapter component.

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