Display device, manufacturing method thereof and display equipment

Abstract

The embodiment of the invention provides a display device, a manufacturing method thereof and display equipment, and belongs to the technical field of display devices. The display device comprises a display panel, a cover plate, a grounding piece and a protection frame, wherein the cover plate is located on a light emitting surface of the display panel; the grounding piece is located on the backlight surface of the display panel; the protection frame is located on the periphery of the display panel and connected with the edge of the cover plate, the protection frame comprises an insulation body and a conductive structure, the conductive structure is embedded in the insulation body, and the conductive structure is connected with the edge of the cover plate and electrically connected with the grounding piece. According to the embodiment of the invention, edge greening and other defects can be reduced, and the yield of the display device is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of display devices, and in particular to a display device and a manufacturing method thereof, and a display equipment. Background Art

[0002] With the rapid development of the display industry, display devices are widely used in people's daily lives, such as in mobile phones, monitors, tablet computers and other devices.

[0003] In the related art, a display device includes a display panel, a cover glass (CG), and an edge-sealed injection-molded protection frame, etc. The CG cover is disposed on the light-emitting surface of the display panel, and the edge-sealed injection-molded protection frame is disposed around the edge of the display panel and connected to the CG.

[0004] However, when static charge is generated on the CG, since the edge-sealed injection-molded protection frame connected to the CG is generally made of insulating material, it cannot effectively dissipate the static charge on the surface of the CG. In electrostatic discharge (ESD) related tests such as copper rod friction and electrostatic field, the display device will have defects such as green edges, resulting in a low yield of the display device. Summary of the invention

[0005] The embodiments of the present disclosure provide a display device and a manufacturing method thereof, and a display device, which can reduce defects such as edge greening and improve the yield of the display device. The technical solution is as follows:

[0006] On the one hand, a display device is provided, including a display panel, a cover plate, a grounding member and a protective frame, wherein the cover plate is located on the light emitting surface of the display panel; the grounding member is located on the backlight surface of the display panel; the protective frame is located around the display panel and connected to the edge of the cover plate, the protective frame includes an insulating body and a conductive structure, the conductive structure is embedded in the insulating body, the conductive structure is connected to the edge of the cover plate, and is electrically connected to the grounding member.

[0007] Optionally, the conductive structure includes at least one connecting member, the connecting member includes a first connecting structure and a second connecting structure, one end of the second connecting structure is connected to the first connecting structure, and one side of the first connecting structure is fitted and connected to an edge of the cover plate.

[0008] Optionally, the conductive structure further includes a third connecting structure, wherein the third connecting structure is connected to an end of the second connecting structure away from the first connecting structure and is connected to the grounding member.

[0009] Optionally, the grounding member is attached to the backlight surface of the display panel, and one side surface of the third connection structure is bonded and connected to a surface of the grounding member away from the display panel.

[0010] Optionally, the third connection structure is a buckle, a bolt or a nut.

[0011] Optionally, the conductive structure includes a plurality of connectors, and the plurality of connectors are arranged at intervals around the display panel.

[0012] Optionally, the conductive structure comprises a plurality of conductive particles, and the plurality of conductive particles are uniformly distributed in the insulating body.

[0013] Optionally, the grounding element includes at least one of a copper foil in an ultra-clean foam layer, a metal support layer, or a middle frame of the entire machine.

[0014] Optionally, the display panel includes a back film layer and a display layer, the display layer has a relative light-emitting surface and a backlight surface, the light-emitting surface of the display layer is in the same direction as the light-emitting surface of the display panel, the backlight surface of the display layer is in the same direction as the backlight surface of the display panel, and the back film layer is located on the backlight surface of the display layer.

[0015] Optionally, the display device further includes a shading structure, wherein the shading structure is located on a surface of the cover plate close to the display panel and at an edge of the cover plate, and the shading structure is connected to the conductive structure.

[0016] Optionally, the insulating body is made by an in-mold injection molding process or a 3D printing process.

[0017] On the other hand, a method for manufacturing a display device is provided, comprising: connecting a cover plate to a display panel, the cover plate being located on a light emitting surface of the display panel; forming a grounding member on a backlight surface of the display panel; forming a protective frame around the display panel, the protective frame being connected to an edge of the cover plate, the protective frame comprising an insulating body and a conductive structure, the conductive structure being embedded in the insulating body, the conductive structure being connected to an edge of the cover plate, and being electrically connected to the grounding member.

[0018] Optionally, forming the protective frame includes: forming at least one connecting member around the display panel, the connecting member including a first connecting structure and a second connecting structure, one end of the second connecting structure is connected to the first connecting structure, and one side of the first connecting structure is fit-connected to the edge of the cover plate; using an in-mold injection molding process or a 3D printing process to form the insulating body to obtain the protective frame.

[0019] Optionally, forming the protection frame includes: adding a plurality of conductive particles into an insulating material so that the plurality of conductive particles are evenly distributed in the insulating material; and forming the protection frame based on the insulating material using an in-mold injection molding process or a 3D printing process.

[0020] On the other hand, a display device is provided, comprising the aforementioned display apparatus and a power supply, wherein the display apparatus is electrically connected to the power supply.

[0021] The technical solution provided by the embodiments of the present disclosure has the following beneficial effects:

[0022] In the disclosed embodiment, the grounding member is located on the backlight surface of the display panel, the protection frame is located around the display panel and connected to the edge of the cover plate, the protection frame includes an insulating body and a conductive structure, the conductive structure is embedded in the insulating body, the conductive structure is connected to the edge of the cover plate, and is electrically connected to the grounding member. When static charge is generated on the cover plate, the conductive structure in the protection frame can transfer the static charge to the grounding member for grounding, promote the diffusion of static charge, reduce defects such as greening of the edge caused by the accumulation of static charge on the edge of the cover plate, and thus improve the yield of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 It is a structural schematic diagram of a display device in the related art;

[0025] Figure 2 is a schematic diagram of a display device with green edges in the related art;

[0026] Figure 3 is a structural schematic diagram of a display device provided by an embodiment of the present disclosure;

[0027] Figure 4 is a schematic structural diagram of another display device provided by an embodiment of the present disclosure;

[0028] Figure 5 is a structural schematic diagram of another display device provided by an embodiment of the present disclosure;

[0029] Figure 6 is a structural schematic diagram of another display device provided by an embodiment of the present disclosure;

[0030] Figure 7 is a structural schematic diagram of another display device provided by an embodiment of the present disclosure;

[0031] Figure 8 is a flow chart of a method for manufacturing a display device provided by an embodiment of the present disclosure;

[0032] Fig. 9is a flow chart of another method for manufacturing a display device provided by an embodiment of the present disclosure;

[0033] Fig.10 is a structural schematic diagram of a display device during manufacturing provided by an embodiment of the present disclosure;

[0034] Fig.11 is a structural schematic diagram of another display device during manufacturing process provided by an embodiment of the present disclosure;

[0035] Fig.12 is a flow chart of another method for manufacturing a display device provided by an embodiment of the present disclosure;

[0036] Fig.13 It is a structural schematic diagram of a display device provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0037] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0038] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by persons with ordinary skills in the field to which the present disclosure belongs. The words "first", "second", "third" and similar words used in the patent application specification and claims of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantity limitation, but indicate the existence of at least one. Words such as "include" or "comprise" and similar words mean that the elements or objects appearing before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right", "top", "bottom" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the previously and subsequently associated objects are in an "or" relationship.

[0039] Figure 1 Schematic diagram of a display device in the related art. Figure 1As shown, the display device includes a display panel 10, a cover plate 20, a protection frame 30 and a light shielding structure 40. The cover plate 20 is located on the light emitting surface of the display panel 10, the protection frame 30 is located around the display panel 10 and connected to the edge of the cover plate 20, and the light shielding structure 40 is located on the surface of the cover plate 20 close to the display panel 10 and at the edge of the cover plate 20.

[0040] When static electricity is generated on the cover plate 20, since the protection frame 30 connected to the cover plate 20 is generally made of insulating material, it cannot effectively evacuate the static electricity on the surface of the cover plate 20. In ESD-related tests such as copper rod friction and electrostatic field, the display device will have defects such as green edges, resulting in a low yield of the display device.

[0041] Figure 2 FIG. 1 is a schematic diagram of a display device with green edges in the related art. Figure 2 As shown, after the ESD test of the display device in the related art, the static charge cannot be effectively dispersed and accumulates at the edge of the display device, which affects the display effect of the display device and causes the edge of the display device to turn green.

[0042] Figure 3 is a schematic diagram of the structure of a display device provided by an embodiment of the present disclosure. Figure 3 As shown, the display device includes a display panel 10, a cover plate 20, a grounding member and a protection frame 30. The cover plate 20 is located on the light emitting surface of the display panel 10; the grounding member is located on the backlight surface of the display panel 10; the protection frame 30 is located around the display panel 10 and connected to the edge of the cover plate 20, and the protection frame 30 includes an insulating body 31 and a conductive structure 32, the conductive structure 32 is embedded in the insulating body 31, the conductive structure 32 is connected to the edge of the cover plate 20, and is electrically connected to the grounding member.

[0043] In the embodiment of the present disclosure, the grounding member is located on the backlight surface of the display panel 10, the protection frame 30 is located around the display panel 10 and connected to the edge of the cover plate 20, the protection frame 30 includes an insulating body 31 and a conductive structure 32, the conductive structure 32 is embedded in the insulating body 31, the conductive structure 32 is connected to the edge of the cover plate 20, and is electrically connected to the grounding member. When static charge is generated on the cover plate 20, the conductive structure 32 in the protection frame 30 can transfer the static charge to the grounding member for grounding, promote the diffusion of static charge, reduce defects such as greening of the edge caused by the accumulation of static charge on the edge of the cover plate 20, and thus improve the yield of the display device.

[0044] Optionally, the cover plate 20 may be a transparent cover plate such as CG, a plastic plate, etc.

[0045] Optionally, the insulating body 31 is made by an in-mold injection molding process or a 3D printing process.

[0046] Exemplarily, the material of the insulating body 31 may be silicone or plastic.

[0047] Optionally, the conductive structure 32 may be a metal conductor. Metal conductors have a better effect of dissipating static charges. Exemplarily, the material of the metal conductor may be gold, silver, copper, aluminum, zinc, iron or nickel.

[0048] like Figure 3 As shown, the display panel 10 includes a back film layer 11 and a display layer 12, the display layer 12 has a light emitting surface and a backlight surface opposite to each other, the light emitting surface of the display layer 12 is in the same direction as the light emitting surface of the display panel 10, the backlight surface of the display layer 12 is in the same direction as the backlight surface of the display panel 10, and the back film layer 11 is located on the backlight surface of the display layer 12. The back film layer 11 can play a supporting role, and the display layer 12 is used for luminous display.

[0049] Optionally, the display panel 10 may be an organic light-emitting diode (OLED) display panel, a quantum dot light-emitting diode (QLED) display panel, a micro light-emitting diode (Micro LED) display panel, etc.

[0050] Optionally, taking an OLED display panel as an example, the display layer 12 may include a base substrate, a driving circuit layer and a light-emitting functional layer stacked in sequence.

[0051] Optionally, the substrate may be a flexible substrate or a non-flexible substrate, and the non-flexible substrate may be a glass substrate or a plastic substrate, etc. Optionally, the substrate may be a single-layer structure or a multi-layer structure.

[0052] Optionally, the driving circuit layer includes a plurality of pixel driving circuits, which are sequentially stacked on the substrate. Each pixel driving circuit may include at least one thin film transistor (TFT) and a light shielding structure corresponding to the at least one TFT.

[0053] The light-emitting functional layer includes a plurality of light-emitting units, each of which is connected to a corresponding pixel driving circuit. Exemplarily, each light-emitting unit includes an anode, a light-emitting layer and a cathode.

[0054] Optionally, the light-emitting functional layer may include an anode layer, a pixel definition layer, a light-emitting layer, a cathode layer and a plurality of pixel units. The pixel definition layer has a plurality of openings, and a light-emitting unit is disposed in each opening. At least part of the anode of the light-emitting unit is located in the opening, and the light-emitting layer of the light-emitting unit is located in the opening. The cathodes of the light-emitting units are interconnected to form a cathode layer. Exemplarily, the anode layer may be a metal layer, such as Cu, Ag, Ti, etc. Exemplarily, the light-emitting layer may include an electron injection layer (EIL), an electron transport layer (ETL), a hole blocking layer (HBL), a light-emitting material layer, a hole transport layer (HTL), a hole injection layer (HIL), and an electron blocking layer (EBL) stacked in sequence. Exemplarily, the cathode layer may be a transparent conductive layer, such as an indium tin oxide (ITO) layer or an indium zinc oxide (IZO) layer.

[0055] Optionally, the display layer 12 may be bonded to the cover plate 20 via an adhesive layer 50. The adhesive layer 50 may make the display layer 12 and the cover plate 20 more firmly bonded. Exemplarily, the adhesive layer 50 may be an optically clear adhesive (OCA) layer or a thermally-melt optically clear adhesive (TOCA) layer.

[0056] like Figure 3 As shown, the display device further includes a light shielding structure 40, which is located on the surface of the cover plate 20 close to the display panel 10 and at the edge of the cover plate 20, and the light shielding structure 40 is connected to the conductive structure 32. In this way, the light shielding structure 40 can shield the edge of the display device, prevent light leakage from the edge of the display device, and improve the display effect of the display device. The static charge generated on the cover plate 20 can be transmitted from the edge of the cover plate 20 to the conductive structure 32 through the light shielding structure 40, which is conducive to dissipating the static charge.

[0057] Optionally, the light shielding structure 40 may be light shielding ink. Of course, the light shielding structure 40 may also be made of other light shielding materials, which is not limited in the present disclosure.

[0058] like Figure 3 As shown, the display device further includes a heat dissipation layer 60, and the heat dissipation layer 60 is located on the backlight surface of the display panel 10. The heat dissipation layer 60 can promote heat dissipation of the display panel 10.

[0059] Optionally, the heat dissipation layer 60 may be a Super Clean Foam (SCF) layer or a composite film layer. The SCF layer can provide buffering, light shielding and heat dissipation for the display panel 10. The SCF layer may include a copper foil, a foam layer and an adhesive layer arranged in sequence from bottom to top in the thickness direction of the display device, that is, the copper foil is arranged on the surface of the SCF layer in the backlight direction of the display panel 10. The copper foil has conductive, heat dissipating and shielding functions, the foam layer can play a buffering role, and the adhesive layer may be an EMBO textured adhesive with bonding and laminating exhaust functions.

[0060] In some examples, the display device may further include a metal support layer, which is located on the backlight surface of the display panel 10. The metal support layer has a certain support property, can support the display panel 10 to a certain extent, ensure the shape of the display device, and can be conductive.

[0061] For example, the metal support layer may be a stainless steel (SUS) layer, and the SUS layer is located on the backlight surface of the display panel 10. The SUS layer has good conductivity and can be connected to the third connection structure of the conductive structure 32, which is conducive to dissipating static charges.

[0062] Optionally, the grounding element includes at least one of a copper foil in the SCF layer, a metal support layer, or a middle frame of the whole machine. Figure 3 The middle heat dissipation layer 60 is an SCF layer, and the grounding member is the copper foil in the SCF layer. Of course, the grounding member can also be the whole machine middle frame, or include both the copper foil in the SCF layer and the whole machine middle frame, or only include the metal support layer, etc. The metal support layer and the whole machine middle frame can ensure the stability and reliability of the display device, and the copper foil in the SCF layer, the metal support layer or the whole machine middle frame can transfer the static charge generated on the cover plate 20 to the ground, which is conducive to evacuating the static charge.

[0063] like Figure 3 As shown, the conductive structure 32 includes at least one connecting member, and the connecting member includes a first connecting structure 321 and a second connecting structure 322, one end of the second connecting structure 322 is connected to the first connecting structure 311, and one side of the first connecting structure 321 is connected to the edge of the cover plate 20. There is a gap between the second connecting structure 322 and the side wall of the display panel 10.

[0064] Figure 3 In the embodiment, the first connection structure 321 is a strip structure, and the length direction of the first connection structure 321 is parallel to the surface of the cover plate 20, that is, in the Figure 3In the structural schematic diagram of the display device shown, the plan view of the connector can be T-shaped or inverted L-shaped, and the length direction of the first connection structure 321 is parallel to the surface of the cover plate 20, which can increase the contact area between the conductive structure 32 and the cover plate 20, and further accelerate the diffusion of static charge. Of course, the first connection structure 321 can also be other plate-shaped structures such as a circular plate, an elliptical plate or a rectangular plate, and the plate surface of the plate-shaped structure is in contact with the edge of the cover plate 20, and the present disclosure does not limit this.

[0065] Optionally, the conductive structure 32 further includes a third connection structure 323 , which is connected to an end of the second connection structure 322 away from the first connection structure 321 and is connected to a grounding member.

[0066] like Figure 3 As shown, the grounding member is attached to the backlight surface of the display panel 10, and one side of the third connection structure 323 is connected to the surface of the grounding member away from the display panel 10. The static charge generated on the cover plate 20 can be transmitted from the edge of the cover plate 20 to the conductive structure 32 and then transmitted to the grounding member through the third connection structure 323, which is conducive to dissipating the static charge and reducing defects such as greening of the edge.

[0067] Figure 3 In the embodiment, the third connection structure 323 is connected to the grounding piece on the backlight surface of the display panel 10, and the third connection structure 323 is a strip structure, and its length direction is parallel to the surface of the heat dissipation layer 60. In this way, the contact area between the conductive structure 32 and the grounding piece can be increased, and the diffusion of static charge can be further accelerated. Of course, the third connection structure 323 can also be other plate-like structures such as a circular plate, an elliptical plate or a rectangular plate, and the plate surface of the plate-like structure is in contact with the surface of the grounding piece away from the display panel 10, and the present disclosure does not limit this.

[0068] Optionally, the third connection structure 323 is a buckle, a bolt or a nut. These structures can ensure that the conductive structure 32 is reliably connected to the whole machine middle frame, and the static charge generated on the cover plate 20 can be transmitted from the edge of the cover plate 20 to the conductive structure 32 and then transmitted to the whole machine middle frame for grounding through the third connection structure 323, which is conducive to evacuating static charge and reducing defects such as greening of edges.

[0069] Figure 4 It is a schematic diagram of the structure of another display device provided in an embodiment of the present disclosure. Figure 4 The display device shown is Figure 3 The difference between the display devices shown is that the third connection structure 323 is different. Figure 4One end of the second connection structure 322 away from the first connection structure 321 protrudes from the surface of the insulating body 31 in the backlight direction of the display panel 10. The third connection structure 323 is a buckle, which is a strip structure, and its length direction is parallel to the surface of the heat dissipation layer 60. The middle frame of the whole machine can include a corresponding buckle, and the middle frame of the whole machine is reliably connected to the third connection structure 323 through the corresponding buckle.

[0070] Figure 5 It is a structural schematic diagram of another display device provided in an embodiment of the present disclosure. Figure 5 The display device shown is Figure 3 , Figure 4 The difference between the display devices is that the third connection structure 323 is different. Figure 5 The third connection structure 323 is a nut, which is embedded in the insulating body 31 and is flush with the surface of the insulating body 31 in the backlight direction of the display panel 10. At this time, the middle frame of the whole machine may include corresponding connecting bolts, and the middle frame of the whole machine is connected to the third connection structure 323 through the corresponding connecting bolts.

[0071] Figure 4 and Figure 5 The third connection structure 323 is beneficial for connecting the conductive structure 32 with the entire machine middle frame and for dissipating static charges.

[0072] Optionally, the conductive structure 32 includes a plurality of connectors, and the plurality of connectors are arranged at intervals around the display panel 10. Exemplarily, the conductive structure may include 12 connectors, and the display panel 10 has two long sides and two short sides. Four connectors may be arranged at the same interval on each long side of the display panel 10, and two connectors may be arranged at the same interval on each short side of the display panel 10, so that the 12 connectors are evenly arranged around the display panel 10. Of course, the connectors may also be arranged in other numbers or in other intervals, and the present disclosure is not limited thereto.

[0073] In other embodiments, Figures 3 to 5 The conductive structure 32 may include only one connector, which is a ring-shaped structure surrounding the display panel 10 and is embedded in the insulating body 31. This can also promote the diffusion of static charge and reduce the greening of the edge caused by the accumulation of static charge on the edge of the cover plate 20.

[0074] Figure 6 It is a structural schematic diagram of another display device provided in an embodiment of the present disclosure. Figure 6 The display device shown is Figures 3 to 5 The difference between the display devices is the difference in the conductive structure 32. Figure 6As shown, the conductive structure 32 of the display device includes a plurality of conductive particles 324, and the plurality of conductive particles 324 are evenly distributed in the insulating body 31. Figure 6 In the structural diagram of the display device shown, the insulating body 31 is a ring-shaped structure, surrounding the display panel 10, and covering the surface edge of the heat dissipation layer 60 in the backlight direction of the display panel 10, and the insulating body 31 is connected to the edge of the cover plate 20. In this way, the protection frame 30 includes a plurality of conductive particles, and the plurality of conductive particles are evenly distributed in the insulating body 31, which can reduce the impedance of the protection frame and accelerate the dissipation of static charge.

[0075] Optionally, the conductive particles 324 include at least one of metal particles, graphene particles or carbon nanotube particles. These particles have a better effect of dissipating static charges. Among them, the metal particles may include one or more of gold, silver, copper, aluminum, zinc, iron and nickel particles. Exemplarily, the conductive particles 324 may be silver particles and copper particles.

[0076] Figure 7 FIG. 1 is a schematic diagram of the structure of another display device provided by an embodiment of the present disclosure. Figure 7 As shown, the display device includes a display layer 11, a first back film layer 121, a second back film layer 122, a cover plate 20, a protection frame 30, an adhesive layer 50, a heat dissipation layer 60, a micro coating layer (MCL) glue 71, a flexible printed circuit (FPC) 72, a pressure sensitive adhesive (PSA) layer 73, and an integrated circuit (IC) chip 74. Among them, the display layer 11 can be a flexible display layer, the heat dissipation layer 60 can be a SCF layer, and the adhesive layer 50 can be a TOCA layer.

[0077] Figure 7 The middle display layer 11 is bent along a specific direction so that the light emitting surface faces outward, and the display layer 11 is divided into three different areas along the dotted line, namely the display part 111, the bending part 112 and the binding part 113. The upper surface of the display part 111 in the figure is the light emitting surface. Figure 7The FPC 72, the binding portion 113 of the display layer 11, the second back film layer 122, the PSA layer 73, the heat dissipation layer 60, the first back film layer 121, and the display portion 111 of the display layer 11 are stacked in sequence from bottom to top, and the display portion 111 of the display layer 11 is connected to the cover plate 20 through the adhesive layer 50. The protection frame 30 is located around the flexible circuit board 72, the display layer 11, the second back film layer 122, the PSA layer 73, the heat dissipation layer 60, the first back film layer 121 and the adhesive layer 50 and is connected to the edge of the cover plate 20. The protection frame includes an insulating body 31 and a plurality of conductive particles 324, and the plurality of conductive particles 324 are evenly distributed in the insulating body 31. The MCL glue 71 is located in the insulating body 31 and is located on the light-emitting surface of the curved portion 112 of the display layer 11. The IC chip 74 is located in the middle of the FPC 72 and is located on the surface of the binding portion 113 of the display layer 11 away from the second back film layer 122. The plurality of conductive particles are evenly distributed in the insulating body 31 , which can reduce the impedance of the protection frame and accelerate the dissipation of static charges.

[0078] Figure 8 FIG. 1 is a flow chart of a method for manufacturing a display device provided by an embodiment of the present disclosure. Figure 8 As shown, the production method includes:

[0079] Step S101: Connecting the cover plate to the display panel.

[0080] Wherein, the cover plate is located on the light emitting surface of the display panel.

[0081] Step S102: forming a grounding member on the backlight surface of the display panel.

[0082] Step S103: forming a protection frame around the display panel.

[0083] The protection frame is connected to the edge of the cover plate, and includes an insulating body and a conductive structure, wherein the conductive structure is embedded in the insulating body, and the conductive structure is connected to the edge of the cover plate and is electrically connected to the grounding member.

[0084] In the disclosed embodiment, the grounding member is located on the backlight surface of the display panel, the protection frame is located around the display panel and connected to the edge of the cover plate, the protection frame includes an insulating body and a conductive structure, the conductive structure is embedded in the insulating body, the conductive structure is connected to the edge of the cover plate, and is electrically connected to the grounding member. When static charge is generated on the cover plate, the conductive structure in the protection frame can transfer the static charge to the grounding member for grounding, promote the diffusion of static charge, reduce defects such as greening of the edge caused by the accumulation of static charge on the edge of the cover plate, and thus improve the yield of the display device.

[0085] Fig. 9 FIG. 1 is a flow chart of another method for manufacturing a display device provided by an embodiment of the present disclosure. Fig. 9 As shown, the production method includes:

[0086] Step S201: providing a cover plate.

[0087] Step S202: forming a light shielding structure on the cover plate.

[0088] Step S203: Connect the cover plate to the display panel.

[0089] Fig.10 FIG. 1 is a schematic diagram of a structure of a display device during manufacturing process provided by an embodiment of the present disclosure. Fig.10 As shown, the light shielding structure 40 is located on a surface of the cover plate 20 close to the display panel 10 and is located at an edge of the cover plate 20 .

[0090] Optionally, the structure and material of the display panel 10 refer to Figures 3 to 5 The detailed description of the related embodiments is omitted here.

[0091] Step S204: forming a heat dissipation layer on the backlight surface of the display panel.

[0092] like Fig.10 As shown, the heat dissipation layer 60 is located on the backlight surface of the display panel 10 .

[0093] Optionally, the heat dissipation layer 60 is a SCF layer, a surface of the SCF layer in the backlight direction of the display panel 10 is a copper foil, and the grounding member is the copper foil in the SCF layer.

[0094] Step S205: forming at least one connecting member around the display panel to obtain a conductive structure.

[0095] The connecting member includes a first connecting structure and a second connecting structure, one end of the second connecting structure is connected to the first connecting structure, and one side surface of the first connecting structure is fitted and connected to the edge of the cover plate.

[0096] Optionally, after forming at least one connecting member, the step further includes forming a third connecting structure, wherein the third connecting structure is connected to an end of the second connecting structure away from the first connecting structure and is connected to a grounding member.

[0097] Optionally, the shapes and positions of the connecting member and the third connecting structure refer to Figures 3 to 5 The detailed description of the related embodiments is omitted here.

[0098] Step S206: using an in-mold injection molding process or a 3D printing process to form an insulating body to obtain a protection frame.

[0099] Fig.11 FIG. 1 is a schematic diagram of another structure of a display device during manufacturing process provided by an embodiment of the present disclosure. Fig.11As shown, when the in-mold injection molding process is adopted, the step S206 can be mold closing, that is, the upper mold 81 and the lower mold 82 are first put together, and the gap between the molds is the space required for the insulating body, and then injection molding is performed in the mold. After shaping, demolding is performed to form the insulating body, obtain the protective frame, and the conductive structure 32 is embedded in the insulating body.

[0100] Through the above steps S201 to S206, we can finally get Figure 3 , Figure 4 or Figure 5 The display device shown.

[0101] Fig.12 FIG. 1 is a flow chart of another method for manufacturing a display device provided by an embodiment of the present disclosure. Fig.12 As shown, the production method includes:

[0102] Step S301: providing a cover plate.

[0103] Step S302: forming a light shielding structure on the cover plate.

[0104] Step S303: Connect the cover plate to the display panel.

[0105] The light shielding structure is located on the surface of the cover plate close to the display panel and is located at the edge of the cover plate.

[0106] Optionally, the structure and material of the display panel refer to Figure 6 The detailed description of the related embodiments is omitted here.

[0107] Step S304: forming a heat dissipation layer on the backlight surface of the display panel.

[0108] Optionally, the heat dissipation layer is a SCF layer, a surface of the SCF layer in the backlight direction of the display panel is a copper foil, and the grounding element is the copper foil in the SCF layer.

[0109] Step S305: adding a plurality of conductive particles into the insulating material so that the plurality of conductive particles are evenly distributed in the insulating material.

[0110] Optionally, the conductive particles include at least one of metal particles, graphene particles or carbon nanotube particles.

[0111] Step S306: using an in-mold injection molding process or a 3D printing process to form a protection frame based on insulating material.

[0112] Through the above steps S301 to S306, we can finally get Figure 6 The display device shown.

[0113] Fig.13 Schematic diagram of a display device provided by an embodiment of the present disclosure. Fig.13 As shown, the display device includes the aforementioned display apparatus 1 and a power supply 2 , and the power supply 2 is electrically connected to the display apparatus 1 .

[0114] Optionally, the display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a monitor, etc.

[0115] The above description does not limit the present disclosure in any form. Although the present disclosure has been disclosed as above through the embodiments, it is not used to limit the present disclosure. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present disclosure. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present disclosure without departing from the content of the technical solution of the present disclosure still falls within the scope of the technical solution of the present disclosure.

Claims

1. A display device, characterized in that: Including display panel, cover plate, grounding piece and protective frame, The cover plate is located on the light emitting surface of the display panel; The grounding member is located on the backlight surface of the display panel; The protection frame is located around the display panel and connected to the edge of the cover plate. The protection frame includes an insulating body and a conductive structure. The conductive structure is embedded in the insulating body, connected to the edge of the cover plate, and electrically connected to the grounding member.

2. The display device according to claim 1, characterized in that The conductive structure includes at least one connecting member, and the connecting member includes a first connecting structure and a second connecting structure, one end of the second connecting structure is connected to the first connecting structure, and one side of the first connecting structure is fitted and connected to the edge of the cover plate.

3. The display device according to claim 2, characterized in that: The conductive structure further includes a third connection structure, which is connected to an end of the second connection structure away from the first connection structure and is connected to the grounding member.

4. The display device according to claim 3, characterized in that: The grounding member is attached to the backlight surface of the display panel, and one side surface of the third connection structure is bonded and connected to a surface of the grounding member away from the display panel.

5. The display device according to claim 3, characterized in that: The third connection structure is a buckle, a bolt or a nut.

6. The display device according to claim 2, characterized in that: The conductive structure includes a plurality of connecting members, and the plurality of connecting members are arranged at intervals around the display panel.

7. The display device according to claim 1, characterized in that: The conductive structure includes a plurality of conductive particles, and the plurality of conductive particles are uniformly distributed in the insulating body.

8. The display device according to any one of claims 1 to 7, characterized in that: The grounding element includes at least one of a copper foil in an ultra-clean foam layer, a metal support layer or a middle frame of the whole machine.

9. The display device according to any one of claims 1 to 7, characterized in that: The display panel includes a back film layer and a display layer, the display layer has a relative light emitting surface and a backlight surface, the light emitting surface of the display layer is in the same direction as the light emitting surface of the display panel, the backlight surface of the display layer is in the same direction as the backlight surface of the display panel, and the back film layer is located on the backlight surface of the display layer.

10. The display device according to any one of claims 1 to 7, characterized in that: The display device further includes a light shielding structure, which is located on a surface of the cover plate close to the display panel and at an edge of the cover plate, and is connected to the conductive structure.

11. The display device according to any one of claims 1 to 7, characterized in that: The insulating body is made by an in-mold injection molding process or a 3D printing process.

12. A method for manufacturing a display device, characterized in that: include: Connecting a cover plate to a display panel, wherein the cover plate is located on a light emitting surface of the display panel; forming a grounding member on a backlight surface of the display panel; A protection frame is formed around the display panel, the protection frame is connected to the edge of the cover plate, the protection frame includes an insulating body and a conductive structure, the conductive structure is embedded in the insulating body, the conductive structure is connected to the edge of the cover plate, and is electrically connected to the grounding member.

13. The manufacturing method according to claim 12, characterized in that: The forming of the protection frame comprises: At least one connecting member is formed around the display panel, the connecting member includes a first connecting structure and a second connecting structure, one end of the second connecting structure is connected to the first connecting structure, and one side of the first connecting structure is connected to the edge of the cover plate in a close fit; The insulating body is formed by an in-mold injection molding process or a 3D printing process to obtain the protection frame.

14. The manufacturing method according to claim 12, characterized in that: The forming of the protection frame comprises: Adding a plurality of conductive particles into an insulating material so that the plurality of conductive particles are uniformly distributed in the insulating material; The protection frame is formed based on the insulating material by using an in-mold injection molding process or a 3D printing process.

15. A display device, characterized in that: The device comprises a display device as claimed in any one of claims 1 to 11 and a power supply, wherein the display device is electrically connected to the power supply.

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