Device and method for inducing failure of adhesive film of double-glass photovoltaic module
By combining the image recognition system and laser scanning system in the dual-glass photovoltaic module recovery device and combined with auxiliary heat sources for heating, the problem of poor layering of the dual-glass photovoltaic module is solved, efficient and precise layering is achieved, and recycling quality and efficiency are improved.
Patent Information
- Application Number
- CN202411837591.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-05-02
AI Technical Summary
The prior art is difficult to achieve accurate, complete and efficient layering of glass, EVA/POE/TPE and silicon cell in dual-glass photovoltaic modules, and there are problems of high energy consumption, high pollution and poor separation effects.
The device including a workbench, component heating system, image recognition system and laser scanning system is adopted to identify the silicon wafer area and non-silicon wafer area through the image recognition system, plan the scanning path, and heat the photovoltaic modules with auxiliary heat sources to achieve precise control of laser scanning.
It is possible to achieve the overall area of the dual-glass photovoltaic module to be layered in place to avoid stress concentration, prevent glass cracking, and improve the layering efficiency and the quality of material recovery.
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Figure CN119923009A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of photovoltaic power generation equipment, and specifically, relates to a device method for inducing failure of the adhesive film of a double-glass photovoltaic module. Background Art
[0002] Photovoltaic solar power generation is a sunrise industry that has attracted much attention in today's society. Photovoltaic modules, as key components, are one of the focuses of major research and production institutions in the field of new energy. Generally, photovoltaic modules are layered structures composed of glass, packaging materials and crystalline silicon. Under long-term service conditions, materials such as adhesive films are prone to aging, which affects the power generation efficiency of photovoltaic modules, so they need to be decommissioned. The current mainstream processes for processing discarded photovoltaic modules are thermal separation, chemical separation and physical separation. However, these process methods have problems such as high energy consumption, high pollution, high separation cost and unsatisfactory separation effect. The crystalline silicon after separation cannot remain intact and it is difficult to achieve efficient recycling. Specifically, the existing technology has the following shortcomings:
[0003] 1. Existing recycling devices and processes are complex and have low recycling efficiency. Existing technologies (such as mechanical treatment, high-temperature incineration and chemical solvent methods) often rely on complex mechanical equipment and cumbersome process steps, which are not only time-consuming and labor-intensive, but also increase recycling costs and require a large amount of energy and chemical reagents.
[0004] 2. The quality of recycling by existing technologies is unstable. Existing technologies may not be able to achieve precise control during the stratification process of photovoltaic modules, resulting in poor stratification effect. For example, physical separation methods often cannot completely separate each single component, and chemical dissolution methods may damage silicon wafers due to improper control of reaction conditions; due to poor stratification effect, the quality of recycled materials is often uneven. This not only affects the reuse value of recycled materials, but may also have an adverse impact on subsequent processing processes.
[0005] 3. The existing technology has potential safety hazards and environmental problems. Some chemical reagents used in the existing technology are corrosive or flammable and explosive, which poses a safety hazard. In addition, the high-temperature heat treatment process may also cause dangers such as fire or explosion; if the waste liquid, waste gas and other pollutants generated in the recycling process of the existing technology are not properly handled, they may pollute the environment. For example, the waste liquid generated by the inorganic acid dissolution method needs to undergo complex neutralization treatment before it can be discharged, and the heat treatment method may produce harmful gases.
[0006] 4. Existing technologies lack flexibility and scalability. Existing technologies can only process certain types or specifications of photovoltaic modules (such as single-glass modules) and lack flexibility. With the continuous development of photovoltaic technology, new photovoltaic modules continue to emerge, and existing technologies may not be able to adapt to the recycling needs of these new modules. Existing recycling equipment and processes are often difficult to expand or upgrade to meet the recycling needs of larger scales or more types of photovoltaic modules. This limits the development and progress of the recycling industry.
[0007] Therefore, it is necessary to develop new photovoltaic module control methods that are low-energy, damage-free, clean and pollution-free.
[0008] Laser processing is an emerging processing technology with technical advantages such as high precision and non-contact processing, and has been widely used in the field of material processing. A Chinese patent (patent number: 202410140813.4) discloses a photovoltaic module recycling system and control method based on laser separation of laminates, which irradiates the photovoltaic module with laser, so that the three-dimensional mesh structure of the EVA adhesive layer changes, loses the bonding, fixing and connection functions, and then realizes the separation of glass and solar panels. However, the application object of the recycling system and control method is a single-glass module, which is a layered structure of "glass / adhesive film / silicon wafer / adhesive film / backplane", in which the glass is basically transparent to the laser beam. Among the other three materials, the absorption rate of the adhesive film to the laser beam is significantly lower than that of the backplane and silicon wafer. The energy that induces the failure of the EVA adhesive film under the action of the laser actually comes mainly from the thermal effect of the silicon wafer or backplane after absorbing the laser energy. For single-glass modules, the glass, adhesive film and backplane are all fully covered, and the silicon wafer is partially covered according to different arrangements. Therefore, the uniform absorption of the laser beam by the backplane can achieve the failure of the adhesive film within the full size range of the single-glass module, and then achieve the delamination and separation of the single-glass module. This is a low-energy, damage-free, clean and pollution-free photovoltaic module control method.
[0009] However, unlike single-glass modules, double-glass photovoltaic modules are a five-layer fully enclosed structure that is tightly combined from top to bottom, including a glass front panel, a front adhesive film layer (EVA / POE / TPE), a silicon wafer, a back adhesive film layer (EVA / POE / TPE), and a glass cover. When laser scanning double-glass photovoltaic modules, the silicon wafer mainly relies on the absorption of the laser beam by the silicon wafer to induce film failure. However, the silicon wafer in the double-glass photovoltaic module is not fully covered, which leads to a large difference in the laser scanning stratification and separation effect between the silicon wafer cell area and the non-silicon wafer cell area. If the laser scanning process is not properly controlled, the lack of stratification in the local area will cause stress concentration, resulting in problems such as glass breakage, which greatly reduces the recycling value of the glass. Summary of the invention
[0010] The technical problem solved by the present application is: how to provide a device for inducing film failure of double-glass photovoltaic modules that can achieve accurate, complete and efficient stratification of glass, EVA / POE / TPE and silicon cells in double-glass photovoltaic modules.
[0011] The present application provides a device for inducing failure of a double-glass photovoltaic module adhesive film, the device comprising:
[0012] A workbench, which is used for loading, unloading and positioning double-glass photovoltaic modules;
[0013] A component heating system, wherein the component heating system is used to heat the double-glass photovoltaic components;
[0014] An image recognition system, wherein the image recognition system is used to identify the silicon wafer area and the non-silicon wafer area of the double-glass photovoltaic module;
[0015] A laser scanning system is used to plan a scanning path according to a silicon wafer area and a non-silicon wafer area, and to scan a double-glass photovoltaic module according to the scanning path.
[0016] Optionally, the device further comprises:
[0017] A motion system, wherein the motion system is used to drive the image recognition system and the laser scanning system to move.
[0018] Optionally, the workbench comprises:
[0019] Base;
[0020] A conveying roller, the conveying roller is installed on the base, and the conveying roller is used to convey the double-glass photovoltaic module;
[0021] A lifting device, the lifting device is installed on the base, and the lifting device is used to lift the double-glass photovoltaic module;
[0022] A centering device, the centering device is mounted on the base;
[0023] A blocking device is installed on the base, and the centering device and the blocking device are used together to position the double-glass photovoltaic module.
[0024] Optionally, the component heating system comprises:
[0025] A heating platform, the heating platform is installed on the base, and the heating platform is used to carry and heat the double-glass photovoltaic module;
[0026] A temperature control device is used to control the heating process of the heating platform.
[0027] Optionally, the image recognition system includes:
[0028] A short-focus CCD, which is installed in the motion system to collect a large-field-of-view image of a double-glass photovoltaic module;
[0029] A telephoto CCD, the telephoto CCD is installed in the motion system for collecting high-resolution images of the double-glass photovoltaic module;
[0030] An identification unit is used to determine the size and position of the silicon wafer area, the non-silicon wafer area, and the silicon wafer area and the non-silicon wafer area according to the large field of view image and the high resolution image.
[0031] Optionally, the laser scanning system comprises:
[0032] A plurality of laser generators, wherein the laser generators are installed on the motion system;
[0033] A laser scanning optical system, the laser scanning optical system is used to emit a light beam to the double-glass photovoltaic module and receive a reflected light beam;
[0034] A laser scanning path planning system, wherein the double-glass photovoltaic module is used to plan scanning paths of different laser generators according to the size and position of the silicon wafer area and the non-silicon wafer area;
[0035] A control system is used to control the plurality of laser generators to move along a scanning path.
[0036] Optionally, the motion system includes a dual-module gantry, which is installed on the top of the base.
[0037] Optionally, the device further comprises:
[0038] A flipping device is used to flip the double-glass photovoltaic module.
[0039] The present application also provides a control method for a device for inducing failure of a double-glass photovoltaic module adhesive film, the control method comprising:
[0040] Using a workbench to transport double-glass photovoltaic modules and position the double-glass photovoltaic modules at a predetermined position;
[0041] Start the module heating system to heat the double-glass photovoltaic modules;
[0042] Use an image recognition system to capture images of double-glass photovoltaic modules and identify silicon wafer areas and non-silicon wafer areas;
[0043] A laser scanning system is used to plan a scanning path according to the silicon wafer area and the non-silicon wafer area, and the double-glass photovoltaic module is scanned according to the scanning path.
[0044] Optionally, scanning the double-glass photovoltaic module according to the scanning path includes:
[0045] Perform multiple laser scans on the non-silicon wafer area at the edge of the double-glass photovoltaic module;
[0046] A laser is used to perform a laser scan at a predetermined speed on the silicon wafer area inside the double-glass photovoltaic module and the transparent area at the silicon wafer splicing;
[0047] A laser is used to perform a second laser scan on the transparent area at the silicon wafer joints inside the component.
[0048] The present application provides a device for inducing failure of the adhesive film of a double-glass photovoltaic module and a control method thereof, which has the following technical effects:
[0049] On the one hand, by preheating the photovoltaic module through the auxiliary heat source, the temperature rise of the adhesive film is higher and the strength is significantly reduced under the same laser scanning parameters. Combined with the subsequent mechanical separation, the "glass / adhesive film / glass" interface can be easily separated; on the other hand, by introducing an auxiliary heat source, the scanning efficiency can be further improved; furthermore, by introducing a more balanced preheating temperature for the photovoltaic module through the auxiliary heat source, the stress concentration caused by the rapid laser scanning can be effectively alleviated, and problems such as glass cracking can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS
[0050] Figure 1 A schematic diagram of the three-dimensional structure of a device for inducing failure of a double-glass photovoltaic module adhesive film according to one or more embodiments;
[0051] Figure 2 The present invention is a flow chart of a control method of an apparatus for inducing adhesive film failure of a double-glass photovoltaic module according to one or more embodiments. DETAILED DESCRIPTION
[0052] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0053] Before describing in detail the various embodiments of the present application, the technical concept of the present application is first briefly described: At present, when using laser technology to recycle photovoltaic modules, good results have been achieved on single-glass photovoltaic modules. However, when applied to double-glass photovoltaic modules, there will be local non-stratification, which will cause stress concentration and lead to technical problems such as glass breakage. For this reason, the device for inducing failure of the adhesive film of double-glass photovoltaic modules provided by the present application first uses an image recognition system to identify the silicon wafer area and non-silicon wafer area of the double-glass photovoltaic module, plans different scanning paths according to different areas, performs targeted scanning, and combines heating with auxiliary heat sources to ensure that the overall area of the double-glass photovoltaic module can be stratified in place, avoiding problems such as stress concentration and preventing problems such as glass cracking. The specific principles of the device for inducing failure of the adhesive film of double-glass photovoltaic modules and its control method of the present application are described in combination with more embodiments below.
[0054] Specifically, Figure 1 As shown, the device for inducing failure of the adhesive film of a double-glass photovoltaic module of the first embodiment includes a workbench 10, a module heating system 20, an image recognition system 30 and a laser scanning system 40. The workbench 10 is used for loading and unloading and positioning the double-glass photovoltaic module, the module heating system 20 is used for heating the double-glass photovoltaic module, the image recognition system 30 is used for identifying the silicon wafer area and the non-silicon wafer area of the double-glass photovoltaic module, and the laser scanning system 40 is used for planning a scanning path according to the silicon wafer area and the non-silicon wafer area, and scanning the double-glass photovoltaic module according to the scanning path.
[0055] In one or more embodiments, the device for inducing failure of the adhesive film of a double-glass photovoltaic module further includes a motion system 50 , and the motion system 50 is used to drive the image recognition system 30 and the laser scanning system 40 to move.
[0056] In one or more embodiments, the workbench 10 includes a base 11, a conveying roller 12, a lifting device 13, a centering device 14, and a blocking device 15. The conveying roller 12 is installed on the base 11, and the conveying roller 12 is used to convey the double-glass photovoltaic module. The lifting device 13 is installed on the base 11, and the lifting device 13 is used to lift the double-glass photovoltaic module. The centering device 14 is installed on the base 11, and the blocking device 15 is installed on the base 11. The centering device 14 and the blocking device 15 are used together to position the double-glass photovoltaic module.
[0057] In one or more embodiments, the component heating system 20 includes a heating platform and a temperature control device. The heating platform is installed on the base 11. The heating platform is used to carry and heat the double-glass photovoltaic component, or to keep the double-glass photovoltaic component warm. The temperature control device is used to control the heating process of the heating platform. Exemplarily, the heating platform can adopt a resistance wire heating platform, an infrared heating platform or a microwave heating platform. The heating platform adopts an array design. According to the size of the transported double-glass photovoltaic component, the corresponding position and the corresponding number of heating platforms can be opened for heating. The heating or insulation temperature is 100°C-400°C.
[0058] In one or more embodiments, the image recognition system 30 includes a short-focus CCD 31, a long-focus CCD 32, and a recognition unit. The short-focus CCD 31 is installed on the motion system 50 for collecting a large field of view image of the double-glass photovoltaic module, and the long-focus CCD 32 is installed on the motion system 50 for collecting a high-resolution image of the double-glass photovoltaic module. The recognition unit is used to determine the size and position of the silicon wafer area, the non-silicon wafer area, and the silicon wafer area and the non-silicon wafer area according to the large field of view image and the high-resolution image. Among them, the large field of view image can be used for image stitching to determine the size and position of the component, and the high-resolution image can be used for feature extraction and determination of the silicon wafer area.
[0059] In one or more embodiments, the laser scanning system 40 includes a plurality of laser generators, a laser scanning optical system, a laser scanning path planning system, and a control system. The laser generator is installed on the motion system. The laser scanning optical system is used to emit a light beam to the double-glass photovoltaic module and receive a reflected light beam. The double-glass photovoltaic module is used to plan the scanning paths of different laser generators according to the size and position of the silicon wafer area and the non-silicon wafer area. The control system is used to control the movement of the plurality of laser generators along the scanning path. Exemplarily, the laser generator is an infrared pulse laser with a central wavelength of 500-2000μm, a pulse width of 10ns-500ns, an average output power of 200-2000W, and a pulse width of 50kHz-1000kHz; the laser scanning optical system is mainly composed of a beam collimation device, an optical galvanometer, an f-θ focusing mirror and a protective mirror, etc., with a scanning range of 100mm*100mm~700mm*700mm; the laser scanning path planning and control system is mainly composed of a galvanometer control board and galvanometer control software. Based on the size of the photovoltaic module and the distribution characteristics of the silicon wafer, the scanning areas and scanning paths of different laser processing heads are planned, and by controlling multiple laser heads to work together, full-size laser rapid scanning of the photovoltaic module is achieved.
[0060] In one or more embodiments, the motion system 50 includes a dual-module gantry, which is installed on the top of the base 11. The laser generator and the short-focus CCD 31 and the long-focus CCD 3 can move along the dual-module gantry.
[0061] In one or more embodiments, the device for inducing failure of the adhesive film of the double-glass photovoltaic module further includes a flipping device, which is used to flip the double-glass photovoltaic module so that both sides of the double-glass photovoltaic module can be scanned.
[0062] In one or more embodiments, Figure 2 As shown, the control method of the device for inducing failure of the adhesive film of a double-glass photovoltaic module includes the following steps:
[0063] Step S10, using a workbench to transport the double-glass photovoltaic module and positioning the double-glass photovoltaic module at a predetermined position;
[0064] Step S20, starting the component heating system to heat the double-glass photovoltaic component;
[0065] Step S30, using an image recognition system to collect images of the double-glass photovoltaic module and identify the silicon wafer area and the non-silicon wafer area;
[0066] Step S40: using a laser scanning system to plan a scanning path according to the silicon wafer area and the non-silicon wafer area, and scanning the double-glass photovoltaic module according to the scanning path.
[0067] Among them, in step S40, the method of scanning the double-glass photovoltaic module according to the scanning path includes: performing multiple laser scanning processes on the non-silicon wafer area at the edge of the double-glass photovoltaic module until the film in this area becomes a non-transparent color such as black / yellow and is obviously softened; using a laser to perform a laser scan on the silicon wafer area inside the double-glass photovoltaic module and the transparent area at the silicon wafer joint at a predetermined speed, so that the film surface at the silicon wafer / film interface is carbonized and the silicon wafer is separated from the film; using a laser to perform a second laser scan on the transparent area at the silicon wafer joint inside the module to soften the film there.
[0068] The device for inducing failure of the adhesive film of a double-glass photovoltaic module and the control method thereof provided in this embodiment, on the one hand, preheats the photovoltaic module through an auxiliary heat source, so that under the same laser scanning parameters, the temperature rise of the adhesive film is higher and the strength is significantly reduced. Combined with subsequent mechanical separation, the "glass / adhesive film / glass" interface can be easily separated; on the other hand, the scanning efficiency can be further improved by introducing an auxiliary heat source; furthermore, by introducing a more balanced preheating temperature for the photovoltaic module through the auxiliary heat source, the stress concentration caused by the rapid laser scanning can be effectively alleviated, and problems such as glass cracking can be avoided.
[0069] The specific implementation methods of the present application are described in detail above. Although some embodiments have been shown and described, those skilled in the art should understand that these embodiments can be modified and improved without departing from the principles and spirit of the present application whose scope is defined by the claims and their equivalents. These modifications and improvements should also be within the scope of protection of the present application.
Claims
1. A device for inducing failure of the adhesive film of a double-glass photovoltaic module, characterized in that: The device comprises: A workbench, which is used for loading, unloading and positioning double-glass photovoltaic modules; A component heating system, wherein the component heating system is used to heat the double-glass photovoltaic components; An image recognition system, wherein the image recognition system is used to identify the silicon wafer area and the non-silicon wafer area of the double-glass photovoltaic module; A laser scanning system is used to plan a scanning path according to a silicon wafer area and a non-silicon wafer area, and to scan a double-glass photovoltaic module according to the scanning path.
2. The device for inducing failure of the adhesive film of a double-glass photovoltaic module according to claim 1, characterized in that: The device also includes: A motion system, wherein the motion system is used to drive the image recognition system and the laser scanning system to move.
3. The device for inducing failure of the adhesive film of a double-glass photovoltaic module according to claim 1, characterized in that: The workbench comprises: Base; A conveying roller, the conveying roller is installed on the base, and the conveying roller is used to convey the double-glass photovoltaic module; A lifting device, the lifting device is installed on the base, and the lifting device is used to lift the double-glass photovoltaic module; A centering device, the centering device is mounted on the base; A blocking device is installed on the base, and the centering device and the blocking device are used together to position the double-glass photovoltaic module.
4. The device for inducing failure of the adhesive film of a double-glass photovoltaic module according to claim 1, characterized in that: The component heating system comprises: A heating platform, the heating platform is installed on the base, and the heating platform is used to carry and heat the double-glass photovoltaic module; A temperature control device is used to control the heating process of the heating platform.
5. The device for inducing failure of the adhesive film of a double-glass photovoltaic module according to claim 2, characterized in that: The image recognition system comprises: A short-focus CCD, which is installed in the motion system to collect a large-field-of-view image of a double-glass photovoltaic module; A telephoto CCD, the telephoto CCD is installed in the motion system for collecting high-resolution images of the double-glass photovoltaic module; An identification unit is used to determine the size and position of the silicon wafer area, the non-silicon wafer area, and the silicon wafer area and the non-silicon wafer area according to the large field of view image and the high resolution image.
6. The device for inducing failure of the adhesive film of a double-glass photovoltaic module according to claim 2, characterized in that: The laser scanning system comprises: A plurality of laser generators, wherein the laser generators are installed on the motion system; A laser scanning optical system, the laser scanning optical system is used to emit a light beam to the double-glass photovoltaic module and receive a reflected light beam; A laser scanning path planning system, wherein the double-glass photovoltaic module is used to plan scanning paths of different laser generators according to the size and position of the silicon wafer area and the non-silicon wafer area; A control system is used to control the plurality of laser generators to move along a scanning path.
7. The device for inducing failure of the adhesive film of a double-glass photovoltaic module according to claim 5 or 6, characterized in that: The motion system comprises a dual-module gantry, and the dual-module gantry is installed on the top of the base.
8. The device for inducing failure of the adhesive film of a double-glass photovoltaic module according to claim 1, characterized in that: The device also includes: A flipping device is used to flip the double-glass photovoltaic module.
9. A control method for the device for inducing failure of the adhesive film of a double-glass photovoltaic module according to any one of claims 1 to 8, characterized in that: The control method comprises: Using a workbench to transport double-glass photovoltaic modules and position the double-glass photovoltaic modules at a predetermined position; Start the module heating system to heat the double-glass photovoltaic modules; Use an image recognition system to capture images of double-glass photovoltaic modules and identify silicon wafer areas and non-silicon wafer areas; A laser scanning system is used to plan a scanning path according to the silicon wafer area and the non-silicon wafer area, and the double-glass photovoltaic module is scanned according to the scanning path.
10. The control method of the device for inducing failure of the double-glass photovoltaic module adhesive film according to claim 1, characterized in that: Scanning the double-glass photovoltaic module according to the scanning path includes: Perform multiple laser scans on the non-silicon wafer area at the edge of the double-glass photovoltaic module; A laser is used to perform a laser scan at a predetermined speed on the silicon wafer area inside the double-glass photovoltaic module and the transparent area at the silicon wafer splicing; A laser is used to perform a second laser scan on the transparent area at the silicon wafer joints inside the component.