Bonding structure and display device
By designing a retaining wall structure on the overlap terminals of electronic products, the loss of conductive particles is solved, and the problem of limited conductivity of the overlap terminals is achieved, and better electrical connection performance is achieved.
Patent Information
- Application Number
- CN202510097757.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2025-05-02
AI Technical Summary
In electronic products, the increase in the number and density of overlapping terminals leads to limited conductivity and even problems such as poor contact or circuit breakage.
A bond structure is adopted, which includes a base, overlap terminals and retaining walls. The retaining wall is arranged around the overlap terminals and blocks the loss of conductive particles when the conductive glue is pressurized, thereby improving the conductive performance of the overlap terminals.
Through the design of the retaining wall, the number of conductive particles remaining on the overlapping terminals is improved, the electrical connection performance between the overlapping terminals is enhanced, and the problems of poor contact and circuit breakage are avoided.
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Figure CN119923047A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of bonding technology, and in particular, to a bonding structure and a display device. Background Art
[0002] During the preparation of electronic products, the circuits of some components need to be overlapped, and the terminals used for overlapping need to be aligned with each other to ensure the connectivity of the circuits.
[0003] In current electronic products, based on the demands for improved functionality, relative miniaturization, narrow bezels, and thinness, the terminals of components used to connect to external circuits need to be sufficient in number but need to occupy a small enough space, that is, the number and arrangement density of the terminals are usually relatively large. When designing the terminal connection, it cannot be guaranteed that while further reducing the terminal size to increase the terminal arrangement density, problems such as poor contact of the terminals can be effectively avoided. Summary of the invention
[0004] The first aspect of the present disclosure provides a bonding structure, which includes a substrate, a plurality of overlapping terminals and a plurality of retaining walls located on the substrate. The substrate includes a bonding area, the overlapping terminals are located on the substrate and in the bonding area, the overlapping terminals are arranged in at least one row, each row has a plurality of overlapping terminals, the retaining walls are located on the substrate and in the bonding area, the retaining walls are arranged around the overlapping terminals, and the distance from the end of the retaining wall away from the substrate to the substrate is greater than the distance from the edge of the surface of the overlapping terminal away from the substrate to the substrate.
[0005] When the bonding process is carried out on the overlapping terminals of the bonding structure, conductive glue is required to be pressed and connected. When the conductive glue is deformed (or called flowing) under pressure, the conductive particles therein will move, so that a large number of conductive particles will be lost from the overlapping terminals, which leads to limited conductivity between the overlapping terminals, and even poor conductivity or short circuit. In the above scheme, the retaining wall can block the conductive particles in the conductive glue to a certain extent, thereby increasing the number of conductive particles remaining on the overlapping terminals during the bonding process, so as to improve the electrical connection performance (low impedance) between the overlapping terminals.
[0006] In a specific embodiment of the first aspect of the present disclosure, the retaining walls correspond to the overlapping terminals respectively, each retaining wall surrounds the corresponding overlapping terminal, and each retaining wall includes a notch. In the bonding process, the notch can allow the conductive adhesive to flow out when pressed, so as to avoid the conductive adhesive (part thereof except the conductive particles) from gathering and hindering the pressing process of the bonding process, thereby ensuring the connection between the overlapping terminals.
[0007] Optionally, the retaining wall covers at least a portion of the side surface of the overlapping terminal, and the thickness of the portion of the side surface of the overlapping terminal covered by the retaining wall is 2 micrometers to 3 micrometers.
[0008] In a specific embodiment of the first aspect of the present disclosure, the retaining wall includes a plurality of sub-retaining walls, the sub-retaining walls are spaced apart from each other, and the gaps between the sub-retaining walls are gaps. Thus, a plurality of gaps are arranged around each lap terminal for flowing out the conductive adhesive, thereby being more conducive to lap connection of the lap terminal.
[0009] In a specific implementation of the first aspect of the present disclosure, along the row direction, the sub-blocking walls are located on both sides of the overlapping terminals.
[0010] Optionally, the overlapping terminal includes a long side and a short side, and the sub-retaining wall covers the long side of the overlapping terminal. In this way, while ensuring that the conductive glue can flow out from the overlapping terminal, the retaining wall is more conducive to binding more conductive particles on the overlapping terminal.
[0011] Optionally, the retaining walls corresponding to adjacent overlapping terminals in each row are spaced apart from each other, so that the space occupied by the retaining walls at the gaps between the overlapping terminals can be reduced, so as to facilitate the conductive glue flowing out of the overlapping terminals to gather at the gaps between the overlapping terminals.
[0012] Optionally, the retaining walls corresponding to the adjacent overlapping terminals in each row are connected to each other. Optionally, the retaining walls include insulating materials. In this way, the retaining walls corresponding to the overlapping terminals can be connected to each other to increase the stability of the retaining walls and reduce the risk of the retaining walls falling off.
[0013] In a specific embodiment of the first aspect of the present disclosure, the retaining wall covers the edge portion of the surface of the overlapping terminal away from the substrate. Thus, when the conductive particles are located at the edge of the overlapping terminal, the portion of the retaining wall covering the overlapping terminal will guide the movement of the conductive particles so that the conductive particles move toward the center direction of the overlapping terminal, thereby facilitating the overlapping of the overlapping terminals.
[0014] Optionally, on the surface of the overlapping terminal facing away from the substrate, the ratio of the distance between the edge of the retaining wall and the edge of the overlapping terminal to the size of the overlapping terminal along the row direction is 1 / 5 to 2 / 5.
[0015] In a specific embodiment of the first aspect of the present disclosure, the surface of the overlapping terminal away from the substrate is convex. In this way, the surface area of the overlapping terminal away from the substrate can be increased, thereby reducing the area used for docking when the overlapping terminal is bonded, so as to reduce the impedance at the docking point; in addition, this design can also increase the contact area between the surface of the overlapping terminal away from the substrate and the conductive particles, thereby being more conducive to the impedance between the overlapping terminal and the conductive particles.
[0016] Optionally, the difference between the distance from the center of the surface of the bonding terminal facing away from the substrate to the substrate and the distance from the edge of the surface of the bonding terminal facing away from the substrate to the substrate is 1 micrometer to 2 micrometers.
[0017] Optionally, the maximum value of the distance from the convex surface to the substrate is less than or equal to the distance from the end of the retaining wall away from the substrate to the substrate. In this way, after the bonding process, the middle portion of the surface of the overlapping terminal away from the substrate can be used for overlapping, and a gap can be formed between the middle portion and the retaining wall for the conductive glue to pass through and overflow to the gap of each overlapping terminal.
[0018] Optionally, the maximum value of the distance from the convex surface to the substrate and the distance from the end of the retaining wall away from the substrate to the substrate differ by 2 to 3 microns, that is, the retaining wall will be higher than the lap terminal to increase the barrier effect of the retaining wall on the conductive particles.
[0019] Optionally, along a direction perpendicular to the surface where the base is located, the cross-sectional shape of the convex surface is an arc shape.
[0020] In a specific embodiment of the first aspect of the present disclosure, a surface of the bonding terminal facing away from the substrate includes a first area and a second area, and the first area surrounds the second area.
[0021] Optionally, the distance between the first region and the substrate gradually increases from the edge of the surface of the bonding terminal facing away from the substrate to the center, and the second region is a concave surface. In this way, the conductive particles can be more easily moved to the central area of the bonding terminal to ensure the contact area between the bonding terminal and the conductive particles (after the bonding process).
[0022] Optionally, the first region is a plane parallel to the surface where the substrate is located, and the second region is a concave surface.
[0023] Optionally, along a direction perpendicular to the surface where the base is located, the cross-section of the concave surface is an arc shape.
[0024] In a specific embodiment of the first aspect of the present disclosure, a surface of the connecting terminal facing away from the substrate is a concave surface.
[0025] Optionally, along a direction perpendicular to the surface where the base is located, the cross-section of the concave surface is an arc shape.
[0026] In a specific embodiment of the first aspect of the present disclosure, along a direction perpendicular to the surface where the base is located, the cross-sectional shape of the concave surface includes a sawtooth shape or a wave shape.
[0027] The second aspect of the present disclosure provides a display device, which includes a first bonding structure, a second bonding structure and a conductive adhesive, wherein the first bonding structure includes a plurality of first bonding terminals, the second bonding structure includes a plurality of second bonding terminals, and the conductive adhesive is located between the first bonding terminal and the second bonding terminal. The first bonding terminal and the second bonding terminal correspond to each other, the conductive adhesive includes a plurality of conductive particles, and the first bonding terminal is connected to the corresponding second bonding terminal through the conductive particles in the conductive adhesive. At least one of the first bonding structure and the second bonding structure includes the bonding structure in the first aspect above, and the first bonding terminal and / or the second bonding terminal are bonding terminals of the bonding structure.
[0028] In a specific implementation of the second aspect of the present disclosure, the display device may further include a display panel and a circuit board, the display panel includes a first bonding structure, and the circuit board includes a second bonding structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 Shown is a schematic diagram of a planar structure of a display device provided by an embodiment of the present disclosure.
[0030] Figure 2 for Figure 1 A cross-sectional view of the display device shown.
[0031] Figure 3 for Figure 1 The display device is shown in a cross-sectional view along line M1 - N1 .
[0032] Figure 4 for Figure 1 The diagram shows a planar structure of a bonding structure included in the display device under one design.
[0033] Figure 5 for Figure 4 A cross-sectional view of the bonding structure along M2-N2 is shown.
[0034] Fig. 6A for Figure 1 A schematic diagram of a planar structure of a bonding structure provided by an embodiment of the present disclosure under another design.
[0035] Figure 6B for Fig. 6A The bonding structure is shown in a cross-sectional view along M3-N3.
[0036] Fig. 7A for Figure 1 A schematic diagram of a planar structure of a bonding structure provided by an embodiment of the present disclosure under another design.
[0037] Figure 7B for Fig. 7A The bonding structure is shown in cross-section along M4-N4.
[0038] Fig. 8A A cross-sectional view of another design of a bonding structure provided in one embodiment of the present disclosure.
[0039] Figure 8B for Fig. 8A Schematic diagram of the working principle of the bonding structure shown.
[0040] Fig. 9 A cross-sectional view of another design of a bonding structure provided in one embodiment of the present disclosure.
[0041] Fig.10 A cross-sectional view of another design of a bonding structure provided in one embodiment of the present disclosure.
[0042] Fig.11 A cross-sectional view of another design of a bonding structure provided in one embodiment of the present disclosure.
[0043] Description of reference numerals:
[0044] 10-first bonding structure; 20-second bonding structure;
[0045] 11-display area; 12-frame area; 13-binding area;
[0046] 100-bonding structure; 110-substrate; 120-lapping terminal; 121-first area; 122-second area; 110a-first substrate; 110b-second substrate; 120a-first lapping terminal; 120b-second lapping terminal; 101-display function structure; 102-packaging structure; 130-retaining wall; 131-sub-retaining wall; 132-gap; 140-conductive glue; 141-colloid; 142-conductive particles. DETAILED DESCRIPTION
[0047] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.
[0048] The display device includes a display panel and a flexible circuit board bonded together, the display panel and the flexible circuit board both include a bonding area and a bonding terminal located in the bonding area, the bonding terminal of the display panel and the bonding terminal of the flexible circuit board are butted against each other to achieve electrical connection between the two. In the bonding process, the bonding area of the component to be bonded is pressurized and heated by a pressing head, so that the bonding terminals of the display panel and the flexible circuit board are pressed together by a conductive adhesive, wherein the conductive adhesive includes conductive particles, and the bonding terminals of the display panel and the bonding terminals of the flexible circuit board are electrically connected by the conductive particles.
[0049] As the functional requirements for display devices increase, the overlapping terminals need to be designed with smaller widths to increase the number and density of the overlapping terminals. Accordingly, this limits the number of conductive particles on the overlapping terminals, making it difficult to reduce the impedance at the connection points of the overlapping terminals, and even causing problems such as poor contact.
[0050] The present disclosure provides a bonding structure and a display device to at least solve the above-mentioned technical problems. The bonding structure includes a substrate and a plurality of overlapping terminals and a plurality of retaining walls located on the substrate. The substrate includes a bonding area, the overlapping terminals are located on the substrate and in the bonding area, the overlapping terminals are arranged in at least one row, and each row has a plurality of overlapping terminals. The retaining walls are located on the substrate and in the bonding area, the retaining walls are arranged around the overlapping terminals, and the distance from the end of the retaining wall away from the substrate to the substrate is greater than the distance from the edge of the surface of the overlapping terminal away from the substrate to the substrate. When the overlapping terminals of the bonding structure are subjected to the bonding process, conductive adhesive will need to be used for compression connection, and when the conductive adhesive is deformed (or called flowing) under pressure, the conductive particles therein will move, so that the conductive particles will be lost from the overlapping terminals in large quantities, which leads to limited conductivity between the overlapping terminals, and even poor conductivity or open circuit. In the above solution, the retaining wall can block the conductive particles in the conductive adhesive to a certain extent, thereby increasing the number of conductive particles remaining on the overlapping terminals during the bonding process, so as to improve the electrical connection performance (low impedance) between the overlapping terminals.
[0051] In the following, the structure of the bonding structure and the display device in at least one embodiment of the present disclosure is described in conjunction with the accompanying drawings. In addition, since the display device may include the bonding structure, in the following embodiments, the structure of the display device is described to simultaneously describe the specific design of the bonding structure.
[0052] In these drawings, a spatial rectangular coordinate system is established based on the surface where the bonding structure is located (for example, the surface where the substrate is located as described below) as a reference to illustrate the position of each structure. In this spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the surface where the bonding structure is located, and the X-axis is parallel to the first reference line, the direction of the overlapping terminal arrangement, the Y-axis is parallel to the second reference line, and the Z-axis is perpendicular to the surface where the bonding structure is located.
[0053] like Figure 1 to Figure 5 As shown, the display device includes a first bonding structure 10 and a second bonding structure 20, and a conductive glue 140 is arranged between the first bonding structure 10 and the second bonding structure 20. The first bonding structure 10 includes a plurality of first bonding terminals 120a, and the second bonding structure 20 includes a plurality of second bonding terminals 120b. The conductive glue 140 is located between the first bonding terminals 120a and the second bonding terminals 120b. The first bonding terminals 120a and the second bonding terminals 120b correspond to each other, respectively, and the conductive glue 140 includes a colloid 141 and a plurality of conductive particles 142 doped in the colloid 141, and the first bonding terminal 120a is connected to the corresponding second bonding terminal 120b through the conductive particles 142 in the conductive glue 140.
[0054] During the crimping process of the bonding process, as the first lapping terminal 120a and the second lapping terminal 120b squeeze the conductive adhesive 140, at least part of the adhesive 141 between the first lapping terminal 120a and the second lapping terminal 120b is squeezed to both sides. In this process, the pressure generated by the relative movement of the first lapping terminal 120a and the second lapping terminal 120b will squeeze the conductive particles 142. When the size of the first lapping terminal 120a and / or the second lapping terminal 120b is reduced, the conductive particles 142 will be easily squeezed out from the gap between the first lapping terminal 120a and the second lapping terminal 120b, resulting in a limited number of conductive particles 142 existing in the gap between the first lapping terminal 120a and the second lapping terminal 120b.
[0055] In the embodiments of the present disclosure, Figures 3 to 5 As shown, a barrier wall 130 is provided around the first bonding terminal 120a and / or the second bonding terminal 120b to block the conductive particles 142, so that the conductive particles 142 are more likely to remain in the gap between the first bonding terminal 120a and the second bonding terminal 120b.
[0056] For example, the bonding structure 100 includes a substrate 110 and a plurality of bonding terminals 120 and a plurality of retaining walls 130 located on the substrate 110. The substrate 110 includes a bonding area 13, the bonding terminals 120 are located on the substrate 110 and in the bonding area 13, the bonding terminals 120 are arranged in at least one row, each row has a plurality of bonding terminals 120, the retaining walls 130 are located on the substrate 110 and in the bonding area 13, the retaining walls 130 are arranged around the bonding terminals 120, and the distance from the end of the retaining wall 130 away from the substrate 110 to the substrate 110 is greater than the distance from the edge of the surface of the bonding terminal 120 away from the substrate 110 to the substrate 110, that is, the height of the retaining wall 130 is greater than the height of the edge portion of the bonding terminal 120. When the bonding process is performed on the bonding terminals 120 of the bonding structure 100, the conductive adhesive 140 needs to be used for compression connection. When the conductive adhesive 140 is deformed (or called flowing) under pressure, the conductive particles 142 therein will move, so that a large amount of the conductive particles 142 will be lost from the bonding terminals 120, which leads to limited conductivity between the bonding terminals 120, and even poor conductivity or short circuit. In the above scheme, the retaining wall 130 can block the conductive particles 142 in the conductive adhesive 140 to a certain extent, thereby increasing the number of conductive particles 142 remaining on the bonding terminals 120 during the bonding process, so as to improve the electrical connection performance (low impedance) between the bonding terminals 120.
[0057] It should be noted that at least one of the first bonding structure 10 and the second bonding structure 20 may include the above-mentioned bonding structure 100 , and accordingly, the first bonding terminal 120 a and / or the second bonding terminal 120 b are bonding terminals 120 of the bonding structure 100 .
[0058] In the embodiment of the present disclosure, the above technical problem can be solved as long as one of the first bonding structure 10 and the second bonding structure 20 is configured to include the above bonding structure 100. On this basis, the specific types of the first bonding structure 10 and the second bonding structure 20 are not limited.
[0059] For example, in at least one embodiment of the present disclosure, the first bonding structure 10 may be a display panel, and the second bonding structure may be a flexible circuit board. Figure 1 and Figure 2The display panel may include a display area 11 and a frame area 12 (i.e., a non-display area) surrounding the display area 11, a bonding area 13 is divided in the frame area 12, the display panel includes a first substrate 110a, and a portion of the first substrate 110a located in the bonding area 13 serves as a substrate 110 of a bonding structure 100 included in the first bonding structure 10; the flexible circuit board may include a second substrate 110b and a driving circuit (including a driving chip 210) located on the second substrate 110b, a bonding area 13 is also divided on the second substrate 110b, and a portion of the second substrate 110b located in the bonding area 13 serves as a substrate 110 of a bonding structure 100 included in a second bonding structure 20.
[0060] In the embodiments of the present disclosure, the specific structure of the display panel is not limited and can be designed according to actual needs. For example, in at least one embodiment, Figure 2 As shown, the display panel 10 may include a display function structure 101 located in the display area 11 and a packaging structure 102 covering the display function structure 101. The display function structure 101 may include light-emitting devices arranged in an array so that the display panel has a display function. For example, the first substrate 110a may be an array substrate, and the substrate 110 of the bonding structure 100 included in the display panel may be formed by extending a portion of the film layer of the array substrate (such as a substrate and a portion of the film layer thereon) to the bonding area 13.
[0061] In at least one embodiment of the present disclosure, the retaining wall 130 may surround the bonding terminal 120 , but a notch may be provided in the retaining wall 130 for glue overflow, so that the first bonding terminal 120 a and the second bonding terminal 120 b can be butted against each other.
[0062] In at least one embodiment of the present disclosure, Figure 4 and Fig. 6A As shown, the retaining walls 130 correspond to the connecting terminals 120 respectively, each retaining wall 130 surrounds the corresponding connecting terminal 120, and each retaining wall 130 includes a notch 132, that is, the retaining wall 130 is a non-closed figure. In the bonding process, the notch 132 can make the conductive adhesive 140 flow out when pressed, so as to avoid the conductive adhesive 140 (except the conductive particles 142) from gathering and hindering the pressing process of the bonding process, thereby ensuring the connection between the connecting terminals 120.
[0063] In the embodiments of the present disclosure, the size of the gap is not limited and can be designed according to actual process requirements. For example, in at least one embodiment, the width of the gap can be designed to be no larger than the diameter of the conductive particles 142, thereby further reducing the probability of the conductive particles 142 overflowing from the surface of the bonding terminal 120.
[0064] In at least one embodiment of the present disclosure, Figure 5 As shown, the retaining wall 130 covers at least part of the side surface of the connecting terminal 120, and the thickness of the part of the retaining wall 130 covering the side surface of the connecting terminal 120 is 2 microns to 3 microns. In this way, the structural strength of the retaining wall 130 can be ensured to block the conductive particles.
[0065] In at least one embodiment of the present disclosure, Fig. 6A and Figure 6B As shown, the retaining wall 130 includes a plurality of sub-retaining walls 131, which are spaced apart from each other, and the gaps between the sub-retaining walls 131 are notches 132. Thus, a plurality of notches 132 are arranged around each bridging terminal 120 for flowing out the conductive adhesive 140, thereby facilitating the bridging of the bridging terminal 120.
[0066] In at least one embodiment of the present disclosure, Fig. 6A and Figure 6B As shown, along the row direction (the arrangement direction of each row of the overlapping terminals 120, also equivalent to the X-axis direction), the sub-blocking walls 131 are located on both sides of the overlapping terminals 120.
[0067] In at least one embodiment of the present disclosure, Fig. 6A and Figure 6B As shown, the bridge terminal 120 includes a long side and a short side, and the sub-blocking wall 131 covers the long side of the bridge terminal 120. In this way, while ensuring that the conductive glue 140 can flow out from the bridge terminal 120, it is more conducive for the blocking wall 130 to bind more conductive particles 142 on the bridge terminal 120.
[0068] In some embodiments of the present disclosure, Figure 3 and Figure 4 , Fig. 6A and Figure 6B As shown, the retaining walls 130 corresponding to the adjacent connecting terminals 120 in each row are spaced apart from each other. In this way, the space occupied by the retaining walls 130 at the gaps between the connecting terminals 120 can be reduced, so that the conductive adhesive 140 flowing out of the connecting terminals 120 can be gathered at the gaps between the connecting terminals 120.
[0069] In some embodiments of the present disclosure, Fig. 7A and Figure 7B As shown, the retaining walls 130 corresponding to the adjacent bridging terminals 120 in each row are connected to each other. Optionally, the retaining walls 130 include insulating materials. In this way, the retaining walls 130 corresponding to the respective bridging terminals 120 can be connected to each other to increase the stability of the retaining walls 130 and reduce the risk of the retaining walls 130 falling off.
[0070] For example, the retaining wall 130 can be an inorganic film layer including materials such as silicon oxide and silicon nitride. The thickness of the inorganic film layer is relatively small, for example, the thickness is smaller than the thickness of the overlapping terminal 120. Therefore, even if the connected parts of each retaining wall 130 cover the gaps between each overlapping terminal 120, a certain space will be reserved for accommodating the conductive adhesive.
[0071] In at least one embodiment of the present disclosure, it is possible to refer to Figure 5 The retaining wall 130 covers the edge portion of the surface of the connecting terminal 120 away from the substrate 110. In this way, when the conductive particles 142 are located at the edge of the connecting terminal 120, the portion of the retaining wall 130 covering the connecting terminal 120 will guide the movement of the conductive particles 142, so that the conductive particles 142 move toward the center direction of the connecting terminal 120, thereby facilitating the connecting of the connecting terminal 120.
[0072] In at least one embodiment of the present disclosure, it is possible to refer to Figure 5 On the surface of the bonding terminal 120 facing away from the substrate, the ratio of the distance D1 between the edge of the retaining wall 130 and the edge of the bonding terminal 120 to the dimension D2 of the bonding terminal 120 along the row direction (X-axis direction) is 1 / 5 to 2 / 5, so that the conductive particles can be guided to move toward the central area of the upper surface of the bonding terminal 120.
[0073] In the embodiments of the present disclosure, the overlapping surface of the overlapping terminal can be modified so that the surface can more easily capture the conductive particles and can have a larger contact area with the conductive particles. The specific design can be designed according to the actual process requirements and is not limited here. Several designs are exemplified below.
[0074] In at least one embodiment of the present disclosure, Fig. 8A and Figure 8B As shown, the surface of the connecting terminal 120 away from the substrate 110 is convex. In this way, the surface area of the connecting terminal 120 away from the substrate 110 can be increased, thereby reducing the area used for docking when the connecting terminal 120 is bonded, so as to reduce the impedance at the docking point; in addition, this design can also increase the contact area between the surface of the connecting terminal 120 away from the substrate 110 and the conductive particles 142, thereby being more conducive to the impedance between the connecting terminal 120 and the conductive particles 142. Specifically, as Figure 8B As shown, the jumper terminal 120 will squeeze the conductive particles 142 during the bonding process. The pressure will cause at least one of the jumper terminal 120 and the conductive particles 142 to deform. Under the above convex design, there will be a larger contact area between the jumper terminal 120 and the conductive particles 142.
[0075] In at least one embodiment of the present disclosure, Fig. 8A and Figure 8B As shown, the difference between the distance D3 from the center of the surface of the strapping terminal 120 facing away from the substrate 110 to the substrate 110 and the distance D4 from the edge of the surface of the strapping terminal 120 facing away from the substrate 110 to the substrate 110 is 1 micron to 2 microns, thereby ensuring that there is a sufficient contact area between the strapping terminal 120 and the conductive particles 142.
[0076] In at least one embodiment of the present disclosure, Fig. 8A and Figure 8B As shown, the maximum value of the distance D3 from the surface of the bonding terminal 120 away from the substrate 110 (for example, the center of the surface in the case of a convex surface) to the substrate 110 is less than or equal to the distance D4 from the end of the retaining wall 130 away from the substrate 110 to the substrate 110. In this way, after the bonding process, the middle portion of the surface of the bonding terminal 120 away from the substrate 110 can be used for bonding, and a gap (S1 region) can be formed between the middle portion and the retaining wall 130 for the conductive adhesive 140 to pass through and overflow to the gap of each bonding terminal 120.
[0077] In at least one embodiment of the present disclosure, Fig. 8A and Figure 8B As shown, the maximum value of the distance D3 from the surface of the connecting terminal 120 away from the substrate 110 (for example, the center of the surface in the case of a convex surface) to the substrate 110 is 2 microns to 3 microns different from the distance D4 from the end of the retaining wall 130 away from the substrate 110 to the substrate 110. That is, the retaining wall 130 is higher than the connecting terminal 120 to increase the blocking effect of the retaining wall 130 on the conductive particles 142.
[0078] In at least one embodiment of the present disclosure, Fig. 8A and Figure 8B As shown, along the direction perpendicular to the surface where the base 110 is located, the cross-sectional shape of the convex surface can be an arc or the like, and the arc can be an arc intercepted by a perfect circle, an arc intercepted by an ellipse, or other types of arcs.
[0079] In at least one embodiment of the present disclosure, Fig. 9As shown, the surface of the jumper terminal 120 that is away from the substrate 110 includes a first area 121 and a second area 122, and the first area 121 surrounds the second area 122, that is, the second area 122 is the middle area of the surface, and the first area 121 is the peripheral area of the surface. For example, from the edge to the center of the surface of the jumper terminal 120 that is away from the substrate 110, the distance from the first area 121 to the substrate 110 gradually increases, and the second area 122 is a concave surface. In this way, the conductive particles 142 can be moved to the central area of the jumper terminal 120 more easily, and the conductive particles 142 can be prevented from moving out during the extrusion process, thereby ensuring the contact area between the jumper terminal 120 and the conductive particles 142 (after the bonding process).
[0080] In at least one embodiment of the present disclosure, Fig. 9 As shown, the first region 121 is a plane parallel to the surface where the substrate 110 is located, and the second region 122 is a concave surface.
[0081] In at least one embodiment of the present disclosure, Fig. 9 As shown, along the direction perpendicular to the surface where the substrate 110 is located, the cross-sectional shape of the concave surface (the second region 122 ) is an arc.
[0082] In at least one embodiment of the present disclosure, Fig.10 As shown, the surface of the bonding terminal 120 facing away from the substrate 110 is concave, thereby further increasing the guiding (guiding to the center position) and capturing effect of the bonding terminal 120 on the conductive particles 142 , thereby increasing the contact area between the bonding terminal 120 and the conductive particles 142 .
[0083] In at least one embodiment of the present disclosure, Fig.10 As shown, when the surface of the connecting terminal 120 facing away from the substrate 110 is a concave surface, the cross-sectional shape of the concave surface is an arc along the direction perpendicular to the surface where the substrate 110 is located. For example, the arc can be an arc intercepted by a perfect circle, an arc intercepted by an ellipse, or other types of arcs.
[0084] In at least one embodiment of the present disclosure, Fig.11 As shown, along the direction perpendicular to the surface of the substrate 110, the cross-sectional shape of the jumper terminal 120 away from the substrate 110 is sawtooth-shaped, wavy-shaped, etc., so that the capture effect of the surface of the jumper terminal 120 on the conductive particles 142 can be further increased to increase the contact area between the jumper terminal 120 and the conductive particles 142.
[0085] In at least one embodiment of the present disclosure, the display device may be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigator, etc. For example, the display module may be used in products such as foldable mobile phones and tablets.
[0086] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.
[0087] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
[0088] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, etc. made within the spirit and principles of this specification should be included in the protection scope of this specification.
Claims
1. A bonding structure, characterized in that: include: The base, including the bonding area; A plurality of bonding terminals are located on the substrate and in the bonding area, wherein the bonding terminals are arranged in at least one row, and each row has a plurality of bonding terminals; A plurality of retaining walls are located on the base and in the bonding area, wherein the retaining walls are arranged around the jump terminals, and the distance from the end of the retaining wall facing away from the base to the base is greater than the distance from the edge of the surface of the jump terminal facing away from the base to the base.
2. The bonding structure according to claim 1, characterized in that: The retaining walls correspond to the overlapping terminals respectively, and each retaining wall surrounds the corresponding overlapping terminal, and Each of the retaining walls includes a notch; Preferably, the retaining wall covers at least a portion of the side surface of the overlapping terminal, and the thickness of the portion of the side surface of the overlapping terminal covered by the retaining wall is 2 micrometers to 3 micrometers.
3. The bonding structure according to claim 2, characterized in that: The retaining wall includes a plurality of sub-retaining walls, the sub-retaining walls are spaced apart from each other, and the gaps between the sub-retaining walls are the gaps.
4. The bonding structure according to claim 3, characterized in that: Along the row direction, the sub-retaining wall is located on both sides of the overlapping terminal; Preferably, the overlapping terminal comprises a long side and a short side, and the sub-retaining wall covers the long side of the overlapping terminal; Preferably, The retaining walls corresponding to the adjacent overlapping terminals in each row are spaced apart from each other; or The retaining walls corresponding to adjacent overlapping terminals in each row are connected to each other. Further preferably, the retaining walls include insulating material.
5. The bonding structure according to claim 4, characterized in that: The retaining wall covers the edge portion of the surface of the connecting terminal facing away from the substrate; Preferably, on the surface of the overlapping terminal facing away from the substrate, the ratio of the distance between the edge of the retaining wall and the edge of the overlapping terminal to the size of the overlapping terminal along the row direction is 1 / 5 to 2 / 5.
6. The bonding structure according to any one of claims 1 to 5, characterized in that: The surface of the bridging terminal facing away from the base is a convex surface; Preferably, the difference between the distance from the center of the surface of the bonding terminal facing away from the substrate to the substrate and the distance from the edge of the surface of the bonding terminal facing away from the substrate to the substrate is 1 micron to 2 microns; Preferably, the maximum value of the distance from the convex surface to the base is less than or equal to the distance from the end of the retaining wall away from the base to the base; Further preferably, the difference between the maximum value of the distance from the convex surface to the substrate and the distance from the end of the retaining wall away from the substrate to the substrate is 2 microns to 3 microns; Further preferably, along a direction perpendicular to the surface where the base is located, a cross-sectional shape of the convex surface is an arc.
7. The bonding structure according to any one of claims 1 to 5, characterized in that: The surface of the connecting terminal facing away from the substrate includes a first area and a second area, the first area surrounds the second area, and From the edge to the center of the surface of the bonding terminal facing away from the substrate, the distance between the first region and the substrate gradually increases, and the second region is a concave surface; or The first region is a plane parallel to the surface where the base is located, and the second region is a concave surface; Preferably, along a direction perpendicular to the surface where the base is located, the cross-section of the concave surface is an arc shape.
8. The bonding structure according to any one of claims 1 to 5, characterized in that: The surface of the bridging terminal facing away from the base is a concave surface. Preferably, along a direction perpendicular to the surface where the base is located, the cross-sectional shape of the concave surface is an arc; Along a direction perpendicular to the surface where the base is located, the cross-sectional shape of the concave surface includes a sawtooth shape or a wave shape.
9. A display device, characterized in that: The invention comprises a first bonding structure, a second bonding structure and a conductive adhesive, wherein the first bonding structure comprises a plurality of first bonding terminals, the second bonding structure comprises a plurality of second bonding terminals, and the conductive adhesive is located between the first bonding terminals and the second bonding terminals. The first bonding terminal and the second bonding terminal correspond to each other, the conductive glue comprises a plurality of conductive particles, and the first bonding terminal is connected to the corresponding second bonding terminal through the conductive particles in the conductive glue, and At least one of the first bonding structure and the second bonding structure comprises the bonding structure according to any one of claims 1 to 8, and the first bonding terminal and / or the second bonding terminal is the bonding terminal of the bonding structure.
10. The display device according to claim 9, characterized in that: It also includes a display panel and a circuit board, wherein the display panel includes the first bonding structure, and the circuit board includes the second bonding structure.