Driving backboard, display panel, spliced display screen and electronic equipment

Abstract

The invention provides a driving backboard, a display panel, a spliced display screen and electronic equipment. The driving backboard comprises a driving functional layer, a driving layer and a driving layer, the plurality of bonding electrode groups are positioned on one side of the driving function layer; the plurality of bonding electrode groups form a plurality of bonding electrode columns which extend along the second direction and are arranged along the first direction; in the plurality of bonding electrode columns, in the first bonding electrode column closest to the first side face, the standby bonding electrodes of at least part of the bonding electrode groups are located on the sides, away from the first side face, of the main bonding electrodes. By adjusting the positions of the main bonding electrode and the standby bonding electrode in the first bonding electrode array, the distance from the bonding electrode, closest to the first side face of the driving backboard, in the first bonding electrode array to the first side face of the driving backboard can be increased, and a larger process space is reserved for side edge wiring, so that the yield of the driving backboard is improved. When the display panel with higher pixel density is manufactured, the side edge routing has higher error-tolerant rate, so that the yield of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a driving backplane, a display panel and an electronic device. Background Art

[0002] With the development of display device manufacturing technology, mini light-emitting diodes (Mini LED) and micro-light-emitting diodes (Micro-LED) are widely used because of their superior brightness, resolution, contrast, energy consumption, service life, response speed and thermal stability. However, due to the limitations of the mass transfer process, Mini LED or Micro-LED display panels cannot be made into an enlarged integral screen, so it is necessary to splice multiple smaller display panels into a larger screen. In order to achieve seamless splicing, the spliced ​​display panel needs to use side wiring to connect the front and back circuits of the screen. However, the side wiring needs to occupy part of the space on the front of the screen. When the pixel density (Pixels Per Inch, PPI) of the display panel is large, the side wiring manufacturing tolerance is low, resulting in a low yield of the display panel. Summary of the invention

[0003] In order to overcome the above-mentioned deficiencies in the prior art, the object of the present application is to provide a driving backplane, the driving backplane comprising:

[0004] A driving function layer, the driving function layer comprising a bonding surface and a first side surface and a second side surface located on both sides of the bonding surface in a first direction; the first side surface is used for bonding and splicing with other display panels;

[0005] A plurality of bonding electrode groups located on the bonding surface, each of the bonding electrode groups comprising a main bonding electrode and a spare bonding electrode arranged along the first direction;

[0006] The plurality of bonding electrode groups form a plurality of bonding electrode columns extending along a second direction and arranged along the first direction; the second direction intersects the first direction;

[0007] Among the multiple bonding electrode columns, in the first bonding electrode column closest to the first side surface, at least part of the backup bonding electrodes of the bonding electrode group are located on the side of the main bonding electrode away from the first side surface, and in other second bonding electrode columns except the first bonding electrode column, the backup bonding electrodes of the bonding electrode group are located on the side of the main bonding electrode close to the first side surface.

[0008] In a possible implementation manner, in the first direction, the intervals between the main bonding electrodes in two adjacent bonding electrode columns are equal.

[0009] In a possible implementation, the driving backplane includes a first side wiring, and the first side wiring extends from the bonding surface close to the first side surface through the first side surface to the back side of the bonding surface;

[0010] Preferably, the driving backplane further includes a second side routing, and the second side routing extends from the bonding surface close to the second side surface through the second side surface to the back side of the bonding surface.

[0011] In a possible implementation manner, in the first bonding electrode column, the backup bonding electrodes of all the bonding electrode groups are all located on a side of the main bonding electrode away from the first side surface.

[0012] In a possible implementation manner, in the first bonding electrode column, along the second direction, the backup bonding electrodes of at least some of the adjacent bonding electrode groups are located on a side of the main bonding electrode away from the first side surface.

[0013] Preferably, in the first bonding electrode column, the backup bonding electrode of the bonding electrode group corresponding to the first side wiring position is located on a side of the main bonding electrode away from the first side.

[0014] In a possible implementation manner, in the same bonding electrode column, bonding electrode groups corresponding to light-emitting devices of at least two different colors are arranged alternately in sequence in the second direction.

[0015] Another object of the present application is to provide a display panel, which includes the driving backplane provided in the present application and a light-emitting device electrically connected to the bonding surface of the driving backplane.

[0016] Another object of the present application is to provide a spliced ​​display screen, which includes at least two display panels provided in the present application, and the first side surface of the driving backplane of at least one of the display panels is spliced ​​and bonded to the first side surface or the second side surface of the driving backplane of at least one other display panel.

[0017] In a possible implementation, in the first direction, in two adjacent display panels spliced ​​together, a spacing between two adjacent active bonding electrodes at a splicing position is equal to a spacing between the active bonding electrodes between adjacent second bonding electrode columns in the same display panel.

[0018] Another object of the present application is to provide an electronic device, which includes the spliced ​​display screen provided in this community.

[0019] Compared with the prior art, this application has the following beneficial effects:

[0020] The driving backplane, display panel and electronic device provided by the present application can increase the distance from the bonding electrode closest to the first side of the driving backplane in the first bonding electrode column to the first side of the driving backplane by adjusting the positions of the main bonding electrode and the spare bonding electrode in the first bonding electrode column closest to the first side of the driving backplane, thereby reserving a larger process space for side wiring. In this way, when manufacturing a display panel with a higher pixel density, the side wiring can be made with a higher fault tolerance, thereby improving the yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 One of the schematic diagrams of a driving backplane in the prior art;

[0023] Figure 2 One of the cross-sectional schematic diagrams of the driving backplane provided in this embodiment;

[0024] Figure 3 One of the schematic diagrams of the binding surface of the drive backplane provided in this embodiment;

[0025] Figure 4 The second schematic diagram of the binding surface of the drive backplane provided in this embodiment;

[0026] Figure 5 A second cross-sectional schematic diagram of the driving backplane provided in this embodiment;

[0027] Figure 6 The third schematic diagram of the binding surface of the drive backplane provided in this embodiment;

[0028] Figure 7 A fourth schematic diagram of the binding surface of the drive backplane provided in this embodiment;

[0029] Figure 8 A fifth schematic diagram of the binding surface of the drive backplane provided in this embodiment;

[0030] Fig. 9 This is the second schematic diagram of a driving backplane in the prior art.

[0031] Fig.10 The sixth schematic diagram of the binding surface of the drive backplane provided in this embodiment.

[0032] Icon: 100-driving function layer; 10-bonding surface; 11-first side surface; 12-second side surface; 211-main bonding electrode; 212-spare bonding electrode; 210-bonding electrode group; -side routing; 310-first side routing; 320-second side routing; 200-bonding electrode column; 201-first bonding electrode column; 202-second bonding electrode column; D1-first direction; D2-second direction. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0035] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0036] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0037] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0038] See also Figure 1In some single display panels constituting a spliced ​​display screen, in order to ensure the lighting yield of the light-emitting device, a spare bonding electrode 212' is usually set for each main bonding electrode 211' used to bond the light-emitting device. When a light-emitting device bonded to the main bonding electrode 211' is detected to be faulty, a new light-emitting device is set on the spare bonding electrode 212' through a repair process to replace the faulty light-emitting device.

[0039] At the same time, in order to achieve seamless splicing of the display panel, the frame of the display panel needs to be reduced as much as possible. Therefore, the circuit on the front of the display panel usually needs to be connected to the driving circuit on the back of the display panel through the side wiring 300 ′.

[0040] However, the side wiring 300' will occupy a certain space on the front of the display panel. If the side wiring space is too small, the side wiring process yield will be affected. Therefore, it is difficult to further reduce the pixel density of the display panel.

[0041] In view of this, the present embodiment provides a solution that can reserve a larger wiring space for side wiring and thereby increase the pixel density of the display panel. The solution provided by the present embodiment is described in detail below.

[0042] See also Figure 2 , Figure 2 This is a cross-sectional schematic diagram of a display panel provided in this embodiment. The display panel may include a driving function layer 100 and a plurality of bonding electrode groups 210 located on one side of the driving function layer 100 .

[0043] The driving function layer 100 includes a bonding surface 10 and a first side surface 11 and a second side surface 12 located on both sides of the bonding surface 10 in a first direction D1. In this embodiment, the driving function layer 100 may include a plurality of film layer structures, such as a substrate, a buffer layer, an active layer, a plurality of metal layers, a plurality of insulating layers and a planarization layer. The plurality of film layer structures of the driving function layer 100 may form a plurality of thin film transistors (TFTs) at different positions of the driving function layer 100, and the thin film transistors cooperate with each other to form a plurality of driving units, and the driving units are used to drive the light-emitting device to emit light.

[0044] Each of the bonding electrode groups 210 (such as Figure 2The main bonding electrode 211 and the backup bonding electrode 212 may be arranged along the first direction D1. The main bonding electrode 211 and the backup bonding electrode 212 may be electrically connected to the driving unit in the driving function layer 100. After the light emitting device is bonded to the main bonding electrode 211 or the backup bonding electrode 212, the electric energy provided by the driving unit may be transmitted to the light emitting device through the main bonding electrode 211 or the backup bonding electrode 212.

[0045] The main bonding electrode 211 is preferentially used for bonding with the light emitting device. When the light emitting device bonded with the main bonding electrode 211 fails, a new light emitting device is bonded with the backup bonding electrode 212 corresponding to the main bonding electrode 211 to replace the failed light emitting device.

[0046] Please refer to Figure 3 , Figure 3 The top view of the driving backplane provided in this embodiment, the plurality of bonding electrode groups 210 (such as Figure 3 A plurality of bonding electrode columns 200 extending along a second direction D2 and arranged along the first direction D1 may be formed (as shown in the dashed box). The second direction D2 intersects the first direction D1.

[0047] Furthermore, among the plurality of bonding electrode arrays 200 , the array closest to the first side surface 11 is a first bonding electrode array 201 , and the other bonding electrode arrays 200 except the first bonding electrode array 201 are second bonding electrode arrays 202 .

[0048] In the first bonding electrode array 201, at least part of the backup bonding electrodes 212 of the bonding electrode group 210 are located on a side of the main bonding electrode 211 away from the first side surface 11. In the second bonding electrode array 202, the backup bonding electrodes 212 of the bonding electrode group 210 are located on a side of the main bonding electrode 211 close to the first side surface 11.

[0049] That is, the column originally closest to the first side surface 11 is all the backup bonding electrodes 212, and in the present embodiment, the position of at least part of the backup bonding electrodes 212 in the column is adjusted to be located on the side of the corresponding main bonding electrode 211 away from the first side surface 11, so that the space originally occupied by the part of the backup bonding electrodes 212 is used to set the side routing.

[0050] Based on the above design, in this embodiment, by adjusting the positions of the main bonding electrode 211 and the spare bonding electrode 212 in the first bonding electrode column 201 near the first side surface 11 of the driving backplane, the distance from the bonding electrode closest to the first side surface 11 in the first bonding electrode column 201 to the first side surface 11 of the driving backplane can be increased, thereby reserving a larger process space for side wiring. In this way, when manufacturing a display panel with a higher pixel density, the side wiring can be made with a higher fault tolerance, thereby improving the yield of the display panel.

[0051] In a possible implementation, in the first direction D1, the distances between the main bonding electrodes 211 in two adjacent bonding electrode columns 200 are equal. Figure 4 In any two adjacent bonding electrode columns 200, the distance between the two adjacent main bonding electrodes 211 in the first direction D1 is W0. In this way, after the light-emitting devices are bonded to the main bonding electrodes 211, the distances between the light-emitting devices bonded to the main bonding electrodes 211 are equal, thereby ensuring the display uniformity of the display panel and avoiding deformation of the displayed image.

[0052] In one possible implementation, please refer again to Figure 2 and Figure 3 The side routing of the driving backplane may include a first side routing 310 , and the first side routing 310 extends from the bonding surface 10 close to the first side surface 11 through the first side surface 11 to the back side of the bonding surface 10 .

[0053] Optionally, see Figure 5 and Figure 6 The driving backplane further includes a second side routing line 320 , and the second side routing line 320 extends from the bonding surface 10 close to the second side surface 12 through the second side surface 12 to the back side of the bonding surface 10 .

[0054] Through the first side wiring 310 and / or the second side wiring 320, the circuit of the bonding surface 10 of the driving backplane can be connected to the side of the driving backplane away from the bonding surface 10, so as to be connected to the driving chip or other circuits. In this way, the frame of the driving backplane can be reduced as much as possible, so that the display panel using the driving backplane can be seamlessly spliced.

[0055] In a possible implementation, in the first bonding electrode array 201, the backup bonding electrodes 212 of all the bonding electrode groups 210 are located on a side of the main bonding electrode 211 away from the first side surface 11. For example, please refer again to Figure 3In all bonding electrode groups 210 of the first bonding electrode array 201 , the spare bonding electrodes 212 are arranged on a side of the main bonding electrode 211 away from the first side surface 11 .

[0056] In another possible implementation, see Figure 7 In the first bonding electrode array 201 , along the second direction D2 , at least some of the backup bonding electrodes 212 of the adjacent bonding electrode groups 210 are located on a side of the main bonding electrode 211 away from the first side surface 11 .

[0057] Furthermore, in the first bonding electrode array 210 , the backup bonding electrode 212 of the bonding electrode group 210 corresponding to the position of the first side wiring 310 is located at a side of the main bonding electrode 211 away from the first side surface 11 .

[0058] That is, in the first bonding electrode array 201 , only in a portion of the bonding electrode groups 210 corresponding to the first side wiring 310 , the backup bonding electrodes 212 are all disposed on a side of the main bonding electrode 211 away from the first side surface 11 .

[0059] In one possible implementation, see Figure 8 In the same bonding electrode column 200, the bonding electrode groups 210 corresponding to the light emitting devices of at least two different colors are alternately arranged in sequence along the second direction D2. For example, in the scheme shown in FIG8 , a dotted line frame corresponds to a pixel, which includes a main bonding electrode 211 and a spare bonding electrode 212 for bonding the light emitting devices corresponding to the three-color sub-pixels of red R, green G and blue B.

[0060] In this way, the bonding electrode groups 210 corresponding to light emitting devices of different colors are arranged alternately in sequence along the second direction D2, and the bonding electrode groups 210 corresponding to light emitting devices of the same color are adjacent in the first direction D1. When the main bonding electrodes 211 and the spare bonding electrodes 212 are arranged along the first direction D1, the main bonding electrodes 211 corresponding to light emitting devices of the same color can be prevented from being too far apart in the first direction D1, thereby avoiding the appearance of stripes when displaying a single color.

[0061] The present application also provides a display panel, which includes the driving backplane provided in the present application and a light-emitting device electrically connected to the bonding surface 10 of the driving backplane.

[0062] The present application also provides a spliced ​​display screen, which includes at least two of the display panels provided in the present application, and the first side surface 11 of the driving backplane of at least one of the display panels is spliced ​​and bonded to the first side surface 11 or the second side surface 12 of the driving backplane of at least one other display panel.

[0063] Preferably, in the two display panels spliced ​​together along the first direction D1, the first side surface 11 of one display panel is spliced ​​and bonded to the second side surface 12 of the other display panel.

[0064] See also Fig. 9 , Fig. 9 Reason Figure 1 The spliced ​​display screen formed by splicing the existing display panels shown in the figure includes a first display panel 01' and a second display panel 02', wherein the first side surface of the first display panel 01' and the second side surface of the second display panel 02' are spliced ​​and bonded to each other. When the light-emitting devices are all bonded to the main bonding electrode 211', at the splicing position, in the first direction D1, the bonding electrode of the first display panel 01' closest to the second display panel 02' is the standby bonding electrode 212', the bonding electrode of the second display panel 02' closest to the first display panel 01' is the main bonding electrode 211', and the minimum spacing between the standby bonding electrode 212' of the first display panel 01' closest to the second display panel 02' and the main bonding electrode 211' of the second display panel 02' closest to the first display panel 01' is W1. In addition, the width of the light emitting device in the first direction D1 is W2, and the distance between the main bonding electrode 211' and the spare bonding electrode 212' in the same second bonding electrode column is W3.

[0065] Please refer to Fig.10 , Fig.10The spliced ​​display screen is formed by splicing the display panels provided by the present embodiment, and the spliced ​​display screen includes a third display panel 03 and a fourth display panel 04, wherein the first side surface of the third display panel 03 and the second side surface of the fourth display panel 04 are spliced ​​and bonded to each other. When the light-emitting devices are all bonded to the main bonding electrode 211, at the splicing position, in the first direction D1, the bonding electrode of the third display panel 03 closest to the fourth display panel 04 is the main bonding electrode 211, and the bonding electrode of the fourth display panel 04 closest to the third display panel 03 is also the main bonding electrode 211, and the minimum spacing between the main bonding electrode 211 of the third display panel 03 closest to the fourth display panel 04 and the main bonding electrode 211 of the fourth display panel 04 closest to the third display panel 03 is W4, and W4=W1+W2+W3. That is, in the spliced ​​display screen formed by splicing the display panels provided by the present embodiment, a larger process space is reserved for side wiring at the splicing position.

[0066] In one possible implementation, please refer again to Fig.10 In the first direction D1, in two adjacent display panels spliced ​​together, the spacing between two adjacent active bonding electrodes 211 at the splicing position is W4, and the spacing between the active bonding electrodes 211 between adjacent second bonding electrode columns in the same display panel is W0, and W4=W0.

[0067] In this way, when all the light emitting devices are bonded to the main bonding electrode 211, the spacing between the light emitting devices at the splicing position and the spacing between the light emitting devices at other positions can be ensured to be equal, thereby ensuring the uniformity of image display.

[0068] The present application also provides an electronic device, the electronic device comprising the spliced ​​display screen provided in the present application. The electronic device may include a display, a television, a laptop, a mobile phone, a smart wearable device, and other devices with display functions.

[0069] In summary, the driving backplane, display panel and electronic device provided by the present application can increase the distance from the bonding electrode closest to the first side of the driving backplane in the first bonding electrode column to the first side of the driving backplane by adjusting the positions of the main bonding electrode and the spare bonding electrode in the first bonding electrode column near the first side of the driving backplane, thereby reserving a larger process space for side routing. In this way, when manufacturing a display panel with a higher pixel density, the yield of the display panel can be improved.

[0070] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0071] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A driving backplane, characterized in that: The driving backplane comprises: A driving function layer, the driving function layer comprising a bonding surface and a first side surface and a second side surface located on both sides of the bonding surface in a first direction; the first side surface is used for bonding and splicing with other display panels; A plurality of bonding electrode groups located on the bonding surface, each of the bonding electrode groups comprising a main bonding electrode and a spare bonding electrode arranged along the first direction; The plurality of bonding electrode groups form a plurality of bonding electrode columns extending along a second direction and arranged along the first direction; the second direction intersects the first direction; Among the multiple bonding electrode columns, in the first bonding electrode column closest to the first side surface, at least part of the backup bonding electrodes of the bonding electrode group are located on the side of the main bonding electrode away from the first side surface, and in other second bonding electrode columns except the first bonding electrode column, the backup bonding electrodes of the bonding electrode group are located on the side of the main bonding electrode close to the first side surface.

2. The driving backplane according to claim 1, characterized in that: In the first direction, the intervals between the main bonding electrodes in two adjacent bonding electrode columns are equal.

3. The driving backplane according to claim 1, characterized in that: The driving backplane includes a first side wiring, and the first side wiring extends from the bonding surface close to the first side surface through the first side surface to the back side of the bonding surface; Preferably, the driving backplane further includes a second side routing, and the second side routing extends from the bonding surface close to the second side surface through the second side surface to the back side of the bonding surface.

4. The driving backplane according to claim 3, characterized in that: In the first bonding electrode column, the backup bonding electrodes of all the bonding electrode groups are all located on a side of the main bonding electrode away from the first side surface.

5. The driving backplane according to claim 3, characterized in that: In the first bonding electrode array, along the second direction, at least part of the backup bonding electrodes of the adjacent bonding electrode groups are located on a side of the main bonding electrode away from the first side surface; Preferably, in the first bonding electrode column, the backup bonding electrode of the bonding electrode group corresponding to the first side wiring position is located on a side of the main bonding electrode away from the first side.

6. The driving backplane according to claim 1, characterized in that: In the same bonding electrode column, bonding electrode groups corresponding to light emitting devices of at least two different colors are alternately arranged in sequence along the second direction.

7. A display panel, characterized in that: The display panel comprises the driving backplane according to any one of claims 1 to 6 and a light emitting device electrically connected to the bonding surface of the driving backplane.

8. A spliced ​​display screen, characterized in that: The spliced ​​display screen comprises at least two display panels according to claim 7, and the first side surface of the driving backplane of at least one of the display panels is spliced ​​and bonded to the first side surface or the second side surface of the driving backplane of at least one other display panel.

9. The spliced ​​display screen according to claim 8, characterized in that: In the first direction, in two adjacent display panels spliced ​​together, the spacing between two adjacent active bonding electrodes at the splicing position is equal to the spacing between the active bonding electrodes between adjacent second bonding electrode columns in the same display panel.

10. An electronic device, characterized in that: The electronic device comprises the spliced ​​display screen according to claim 9.

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