Display device and display circuit board

Abstract

The present application relates to a display device and a display circuit board, the display device including: a display panel including a plurality of panel protrusions protruding from an edge of a display area and disposed spaced apart from each other along the edge of the display area; and a display circuit board, the display circuit board comprises a main body part which is separated from the edge of the display area and extends along the edge of the display area. A plurality of connecting portions spaced apart in an extension direction of the main body portion and overlapping the plurality of panel protrusions, respectively; and a plate protrusion protruding from the main body portion toward a recessed region defined between the plurality of panel protrusions.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all benefits arising from Korean Patent Application No. 10-2023-0146995, filed on October 30, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Embodiments relate to a display device and a display circuit board, and more particularly, to a display device and a display circuit board having a reduced non-display area. Background Art

[0004] Recently, electronic devices are increasingly being used. Electronic devices are widely used in various forms such as portable configurations and fixed configurations. These electronic devices include display devices that can provide users with visual information such as static images or dynamic images and support various functions.

[0005] With recent advances in miniaturization of components for driving display devices, display devices tend to become increasingly important in electronic devices, and thus, it is desirable to reduce a non-display area while increasing a display area.

[0006] The display circuit board may be connected to the display panel of the display device to provide an electrical signal. In this case, it is necessary to ensure that the non-display area does not increase according to the placement of the display circuit board. Summary of the invention

[0007] Embodiments include a display device and a display circuit board in which a non-display area is reduced.

[0008] However, this is merely one of the embodiments, and the scope of the present disclosure is not limited thereto.

[0009] Additional features will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0010] In an embodiment of the present disclosure, a display device includes: a display panel, the display panel including a plurality of panel protrusions protruding from an edge of a display area and arranged spaced apart from each other along the edge of the display area; and a display circuit board, the display circuit board including a main body portion spaced apart from the edge of the display area and extending along the edge of the display area, a plurality of connecting portions spaced apart in an extension direction of the main body portion and respectively overlapping with the plurality of panel protrusions, and a board protrusion protruding from the main body portion toward a recessed area defined between the plurality of panel protrusions.

[0011] In an implementation, the plurality of panel protrusions may include a first pad, the plurality of connection portions may include a second pad on portions of the plurality of connection portions overlapping the plurality of panel protrusions, and the first pad may contact and be electrically connected to the second pad.

[0012] In an embodiment, a plurality of connection portions may protrude from the body portion and may be connected to the plurality of panel protrusions.

[0013] In an embodiment, a protruding length of the plate protrusion may be greater than a protruding length of the plurality of connection portions.

[0014] In an embodiment, a plurality of connection portions may be provided in a number corresponding to the number of the plurality of panel protrusions, and the board protrusion may be provided between the plurality of connection portions.

[0015] In an embodiment, the body portion, the plurality of connection portions, and the plate protrusion may be integral with one another.

[0016] In an embodiment, the board protrusion may not overlap with the display panel in a plan view and may be spaced apart from the display panel.

[0017] In an embodiment, the plate protrusion may have a tapered shape having a width that decreases away from the body portion in a plan view.

[0018] In an embodiment, in a plan view, the plate protrusion may have a quadrilateral shape, for example, a quadrilateral shape, for example, a rectangular shape having a uniform width away from the main body portion.

[0019] In an embodiment, the length of the extension of the body portion may be smaller than the length of the edge of the display area.

[0020] In an embodiment, the main body portion and the multiple connecting portions may include multiple conductive layers stacked in a thickness direction of the main body portion and each of the multiple connecting portions, and a conductive layer which is the lowest conductive layer among the multiple conductive layers of the multiple connecting portions may contact and be electrically connected to the multiple panel protrusions.

[0021] In an embodiment, the main body portion and the multiple connecting portions may each include at least one conductive layer stacked in a thickness direction of the main body portion and each of the multiple connecting portions, and the number of at least one conductive layer in the multiple connecting portions may be smaller than the number of at least one conductive layer in the main body portion.

[0022] In an embodiment, at least one conductive layer of the body portion may be provided in plurality, and one of the plurality of conductive layers of the body portion may protrude from the body portion to form a plurality of connection portions and may contact and be electrically connected to a plurality of panel protrusions.

[0023] In an embodiment, the conductive layer protruding from the body portion may be an uppermost conductive layer among the plurality of conductive layers.

[0024] In an embodiment, the conductive layer protruding from the body portion may be a lowermost conductive layer among the plurality of conductive layers.

[0025] In an embodiment, the conductive layer protruding from the body portion may be a middle conductive layer among the plurality of conductive layers.

[0026] In an embodiment of the present disclosure, a display circuit board connectable to a display panel includes: a main body portion extending in one direction; a plurality of connection portions protruding from the main body portion and spaced apart from each other in the extension direction of the main body portion; and a board protrusion protruding from the main body portion between the plurality of connection portions, wherein the plurality of connection portions include pads electrically connected to the display panel.

[0027] In an embodiment, a protruding length of the plate protrusion may be greater than a protruding length of the plurality of connection portions.

[0028] In an embodiment, the body portion, the plurality of connection portions, and the plate protrusion may be integral with one another.

[0029] In an implementation, the body portion may include a plurality of conductive layers stacked in a thickness direction, and one of the plurality of conductive layers may protrude from the body portion to form the plurality of connection portions.

[0030] Other features and advantages in addition to those described above will become apparent from the following detailed description, claims, and accompanying drawings for implementing the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other features and advantages of exemplary embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 is a schematic plan view of an embodiment of a portion of a display device,

[0033] Figure 2 is a schematic side view of an embodiment of a portion of a display device,

[0034] Figure 3 It is along Figure 1 A schematic cross-sectional view of an embodiment of a portion of a display device is taken along line III-III' and shows the embodiment of the display device.

[0035] Figure 4 It is along Figure 1 A schematic cross-sectional view of an embodiment of the display device is taken along line IV-IV' and shows the embodiment of the display device, and

[0036] Figures 5 to 7 is with Figure 4 Schematic cross-sectional view of an embodiment of a display device similar to an embodiment of FIG. DETAILED DESCRIPTION

[0037] Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein similar reference numerals represent identical elements throughout. In this regard, the embodiments shown may have different forms and should not be construed as being limited to the descriptions set forth herein. Therefore, embodiments are described below only by reference to the accompanying drawings to illustrate the features of this specification. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items. Throughout this disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0038] Since the present disclosure contemplates various changes and numerous embodiments, specific embodiments will be shown in the drawings and described in detail in the written description. Reference is made to the drawings used to illustrate the embodiments in order to obtain a full understanding of the present disclosure, its advantages, and the purposes achieved by implementing the present disclosure. However, the present disclosure can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein.

[0039] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote the same elements, and repeated descriptions are omitted.

[0040] It will be understood that although the terms “first,” “second,” etc. may be used herein to describe various elements, these elements should not be limited by these terms and these terms are only used to distinguish one element from another.

[0041] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0042] It will also be understood that the terms “comprises” and / or “comprising” as used herein specify the presence of stated features or elements, but do not preclude the presence or addition of one or more other features or elements.

[0043] It will be understood that when a layer, region or element is referred to as being “formed on” another layer, region or element, it may be directly or indirectly formed on the other layer, region or element. That is, for example, intervening layers, regions or elements may be present.

[0044] For the convenience of explanation, the size of the elements in the drawings may be exaggerated. In other words, since the size and thickness of the elements in the drawings are arbitrarily shown for the convenience of explanation, the following disclosure is not limited thereto.

[0045] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0046] When the exemplary embodiments can be implemented differently, a specific process order can be performed differently from the described order. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the described order.

[0047] Figure 1 is a schematic plan view of an embodiment of a portion of a display device.

[0048] refer to Figure 1 , the display device 1 can display dynamic images or static images, and can be used as a display screen for various products (for example, portable electronic devices such as mobile phones, smart phones, tablet personal computers ("PCs"), mobile communication terminals, personal digital assistants, e-book terminals, portable multimedia players ("PMPs"), navigation devices, or ultra-mobile PCs ("UMPCs"), televisions ("TVs"), laptops, monitors, billboards, Internet of Things ("IoT") devices, etc.). In addition, in an embodiment, the display device 1 can be used in wearable devices such as smart watches, watch phones, glasses-type displays, and head-mounted displays ("HMDs"). In addition, in an embodiment, the display device 1 can be used as a display in a dashboard of a vehicle, a central information display ("CID") set (for example, installed) on a central instrument box or dashboard of a vehicle, an interior mirror display that replaces a side mirror of a vehicle, or a car headrest display that provides entertainment for rear seats.

[0049] like Figure 1 As shown in , the shape of the display device 1 can be substantially rectangular. Figure 1 As shown in, for example, the display device 1 may have a quadrilateral planar shape, for example, a rectangular planar shape having a long side extending in a first direction (e.g., the x direction or the -x direction) and a short side extending in a second direction (e.g., the y direction or the -y direction). In an embodiment, the portion where the long side extending in the first direction (e.g., the x direction or the -x direction) intersects with the short side extending in the second direction (e.g., the y direction or the -y direction) may have a right angle shape or a rounded shape with a predetermined curvature. The planar shape of the display device 1 is not limited to a rectangle, and may be a polygon, a circle, or an ellipse.

[0050] The display device 1 may include a display area DA and a peripheral area PA. In the display area DA, an image may be displayed. In the display area DA, a plurality of pixels PX may be arranged. The display device 1 may provide an image by light emitted from the pixel PX. Each pixel PX may emit light through a display element. In an embodiment, each pixel PX may emit red light, green light, or blue light. In an embodiment, each pixel PX may emit red light, green light, blue light, or white light.

[0051] The peripheral area PA is an area where no image is displayed, and may be a non-display area. The peripheral area PA may at least partially surround the display area DA. In an embodiment, for example, the peripheral area PA may surround the entire display area DA. In the peripheral area PA, a driver that provides an electrical signal to the pixel PX, a power line that supplies power to the pixel PX, etc. may be arranged. In an embodiment, for example, a scan driver that applies a scan signal to the pixel PX may be provided in the peripheral area PA. In addition, a data driver that applies a data signal to the pixel PX may be provided in the peripheral area PA.

[0052] In an implementation, the peripheral area PA may include a pad area PDA to which the display circuit board 40 is connected.

[0053] Figure 2 is a schematic side view of an embodiment of a portion of a display device.

[0054] refer to Figure 2 The display device 1 may include a display panel 10 , a cover window 20 , a display driver 30 , a display circuit board 40 , a pad layer 50 , and a protective film PTF.

[0055] The display panel 10 may display information processed in the display device 1. In an embodiment, for example, the display panel 10 may display information about an execution screen of an application executed on the display device 1 or user interface ("UI") information or graphical user interface ("GUI") information according to the information about the execution screen.

[0056] The display panel 10 may include a display element. In an embodiment, for example, the display panel 10 may be an organic light emitting display panel using an organic light emitting diode ("OLED"), a micro light emitting diode ("LED") display panel using micro LEDs, a quantum dot light emitting display panel using a quantum dot LED including a quantum dot emission layer, or an inorganic light emitting display panel using an inorganic LED including an inorganic semiconductor. Hereinafter, a case where the display panel 10 is an organic light emitting display panel using an OLED as a display element is described in detail.

[0057] The display panel 10 may include a substrate 100 and a multilayer film disposed on the substrate 100. In an embodiment, the display panel 10 may include the substrate 100, the display layer DSL, the encapsulation layer 300, the touch sensor layer TSL, and the optical function layer OFL. In this case, the display area DA and the peripheral area PA may be defined in the substrate 100 and / or the multilayer film. In an embodiment, for example, the substrate 100 may be described as including the display area DA and the peripheral area PA. In addition, the peripheral area PA may include a pad area PDA protruding from one side of the display area DA.

[0058] The substrate 100 may include a polymer resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, triacetyl cellulose, or cellulose acetate propionate. In an embodiment, the substrate 100 may have a multilayer structure including a base layer including the above polymer resin and a barrier layer (not shown). The substrate 100 including the polymer resin may be flexible, rollable, or bendable.

[0059] The display layer DSL may be disposed on the substrate 100. The display layer DSL may include a pixel circuit and a display element. In this case, each pixel circuit may be connected to each display element. The pixel circuit may include a thin film transistor and a storage capacitor. Therefore, the display layer DSL may include a plurality of display elements, a plurality of thin film transistors, and a plurality of storage capacitors. In addition, the display layer DSL may further include a plurality of insulating layers interposed therebetween.

[0060] The encapsulation layer 300 may be disposed on the display layer DSL. The encapsulation layer 300 may be disposed on the display element and cover the display element. In an embodiment, the encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. The at least one inorganic encapsulation layer may include a selected from aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), zinc oxide (ZnO), silicon oxide (SiO 2 ), silicon nitride (SiN x ) and one or more inorganic materials of silicon oxide nitride (SiON). At least one organic encapsulation layer may include a polymer-based material. The polymer-based material may include an acrylic resin, an epoxy-based resin, polyimide, polyethylene, etc. In an embodiment, at least one organic encapsulation layer may include an acrylate.

[0061] The touch sensor layer TSL may be disposed on the encapsulation layer 300. The touch sensor layer TSL may sense coordinate information according to an external input (e.g., a touch event). The touch sensor layer TSL may include a sensor electrode and a touch line connected to the sensor electrode. The touch sensor layer TSL may sense an external input in a self-capacitance manner or a mutual-capacitance manner.

[0062] The touch sensor layer TSL may be formed on the encapsulation layer 300. In an alternative embodiment, after the touch sensor layer TSL is separately formed on the touch substrate, the touch sensor layer TSL may be coupled to the encapsulation layer 300 through an adhesive layer such as an optically clear adhesive ("OCA"). In an embodiment, the touch sensor layer TSL may be directly formed on the encapsulation layer 300, and in this case, an adhesive layer may not be interposed between the touch sensor layer TSL and the encapsulation layer 300.

[0063] The optical function layer OFL may be disposed on the touch sensor layer TSL. The optical function layer OFL may reduce the reflectivity of light (external light) incident from the outside toward the display device 1, and / or may improve the color purity of light emitted from the display device 1. In an embodiment, the optical function layer OFL may include a retarder and a polarizer. The retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The retarder and the polarizer may also include a protective film.

[0064] In another embodiment, the optical functional layer OFL may include a black matrix and a color filter. The color filter may be arranged in consideration of the color of light emitted from the pixels PX of the display device 1, respectively. Each color filter may include a red, green, or blue pigment or dye. In an optional embodiment, in addition to the above pigments or dyes, each color filter may also include quantum dots. In an optional embodiment, some of the color filters may not include the above pigments or dyes, and may include a material such as TiO 2 of scattered particles.

[0065] In another embodiment, the optical function layer OFL may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer arranged in different layers. The first reflected light and the second reflected light respectively reflected from the first reflective layer and the second reflective layer may destructively interfere with each other, and the reflectivity of the external light may be reduced accordingly.

[0066] The cover window 20 may be disposed on the display panel 10. The cover window 20 may protect the display panel 10. In an embodiment, the cover window 20 may be a flexible window. The cover window 20 may be easily bent by an external force without generating cracks, etc., thereby providing protection for the display panel 10. The cover window 20 may include at least one of glass, sapphire, and plastic. The cover window 20 may be, for example, ultra-thin glass ("UTG") or colorless polyimide ("CPI"). In an embodiment, the cover window 20 may have a structure in which a flexible polymer layer is disposed on one surface of a glass substrate, or may include only a polymer layer.

[0067] The cover window 20 may be attached to the display panel 10 by an adhesive member. The adhesive member may be a colorless adhesive member such as OCA. In addition, the adhesive member may include a known adhesive material. Such an adhesive member may be formed on the upper portion of the display panel 10 in various ways; for example, a film-type adhesive member may be attached to the upper portion of the display panel 10, or a material-type adhesive member may be applied to the upper portion of the display panel 10.

[0068] The display driver 30 may be disposed on the display panel 10 (e.g., the substrate 100). The display driver 30 may receive a control signal and a power voltage, and generate and output a signal and a voltage for driving the display panel 10. The display driver 30 may include an integrated circuit ("IC"). In an embodiment, the display driver 30 may be disposed in the peripheral area PA (e.g., the pad area PDA).

[0069] The display circuit board 40 may be electrically connected to the display panel 10. In an embodiment, the display circuit board 40 may be connected to the display panel 10 in a pad area PDA of the display panel 10. In an embodiment, the display circuit board 40 may be a rigid printed circuit board ("PCB") that is rigid and thus difficult to bend. However, the present disclosure is not limited thereto, and does not exclude the possibility that the display circuit board 40 is a flexible printed circuit board ("FPCB").

[0070] Although not shown, various drivers may be arranged on the display circuit board 40. In an embodiment, for example, a touch sensor driver may be provided on the display circuit board 40. The touch sensor driver may include an IC. The touch sensor driver may be electrically connected to the sensor electrode of the touch sensor layer TSL of the display panel 10 through the display circuit board 40.

[0071] In addition to this, a power source may be additionally provided on the display circuit board 40. The power source may supply a driving voltage for driving the pixels PX of the display panel 10 and the display driver 30.

[0072] The protection film PTF may be patterned and attached to the lower surface of the substrate 100. That is, the protection film PTF may be disposed between the substrate 100 and the pad layer 50.

[0073] In an implementation, the cushion layer 50 may be disposed under the display panel 10 (particularly, the substrate 100). The cushion layer 50 may prevent damage to the display panel 10 by absorbing external impact. The cushion layer 50 may include a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or an elastic material (e.g., sponge) obtained by foaming rubber, a urethane-based material, or an acryl-based material.

[0074] Figure 3 It is along Figure 1 A schematic cross-sectional view of an embodiment of a portion of a display device is taken along line III-III' and illustrates the same.

[0075] refer to Figure 3 , the display device 1 may include a display panel 10. The display panel 10 may include a substrate 100, a display layer DSL, an encapsulation layer 300, a touch sensor layer TSL, and an optical function layer OFL. Figure 3 In the figure, for the convenience of explanation, the touch sensor layer TSL and the optical function layer OFL are omitted.

[0076] The display layer DSL may be disposed on the substrate 100. The display layer DSL may include a buffer layer 111, a pixel circuit layer PCL, and a display element layer DEL.

[0077] The substrate 100 may include glass or a polymer resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, triacetyl cellulose, or cellulose acetate propionate. The substrate 100 including the polymer resin may be flexible, rollable, or bendable. The substrate 100 may have a multilayer structure including a base layer including the above polymer resin and a barrier layer (not shown).

[0078] The buffer layer 111 may include SiN x , SiON and SiO 2 of inorganic insulating material, and may be one layer or more layers including the inorganic insulating material.

[0079] The pixel circuit layer PCL may be disposed on the buffer layer 111. The pixel circuit layer PCL may include a transistor TFT included in a pixel circuit and an inorganic insulating layer IIL disposed below and / or above the components of the transistor TFT, a first planarization layer 115, and a second planarization layer 116. The inorganic insulating layer IIL may include a first gate insulating layer 112, a second gate insulating layer 113, and an interlayer insulating layer 114.

[0080] The transistor TFT may include a semiconductor layer A, and the semiconductor layer A may include polycrystalline silicon. In an alternative embodiment, the semiconductor layer A may include amorphous silicon, an oxide semiconductor, an organic semiconductor, etc. The semiconductor layer A may include a channel region and a source region and a drain region located on opposite sides of the channel region. The gate electrode G may overlap the channel region.

[0081] The gate electrode G may include a low resistance metal material. The gate electrode G may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and may be one or more layers including the above materials.

[0082] The first gate insulating layer 112 between the semiconductor layer A and the gate electrode G may include SiO 2 、SiN x 、SiON、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 or ZnO x Inorganic insulating materials. ZnO x It can be ZnO and / or ZnO 2 .

[0083] The second gate insulating layer 113 may cover the gate electrode G. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include a silicon-based material such as SiO 2 、SiN x 、SiON、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 or ZnO x Inorganic insulating materials. ZnO x It can be ZnO and / or ZnO 2 .

[0084] The upper electrode CE2 of the storage capacitor Cst may be disposed on the second gate insulating layer 113. The upper electrode CE2 may overlap with the gate electrode G disposed below the upper electrode CE2. In this case, the gate electrode G and the upper electrode CE2, which are spaced apart from each other and have the second gate insulating layer 113 therebetween, may form a storage capacitor Cst of the pixel circuit. That is, the gate electrode G may serve as the lower electrode CE1 of the storage capacitor Cst. As described, the storage capacitor Cst may overlap with the transistor TFT. In some embodiments, the storage capacitor Cst may not overlap with the transistor TFT.

[0085] The upper electrode CE2 may include Al, platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), Mo, Ti, tungsten (W) and / or Cu, and may be one or more layers including the above materials.

[0086] The interlayer insulating layer 114 may cover the upper electrode CE2. The interlayer insulating layer 114 may include SiO 2 、SiN x 、SiON、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 、ZnO x Etc. ZnO x It can be ZnO and / or ZnO 2 The interlayer insulating layer 114 may be one or more layers including the above inorganic insulating materials.

[0087] The drain electrode D and the source electrode S may each be disposed on the interlayer insulating layer 114. The drain electrode D and the source electrode S may each include a material having relatively good conductivity. The drain electrode D and the source electrode S may each include a conductive material including Mo, Al, Cu, or Ti, and may be one or more layers including the above materials. In an embodiment, the drain electrode D and the source electrode S may have a multilayer structure of Ti / Al / Ti.

[0088] The first planarization layer 115 may cover the drain electrode D and the source electrode S. The first planarization layer 115 may include an organic insulating layer. The first planarization layer 115 may include an organic insulating material such as a general polymer such as polymethyl methacrylate ("PMMA") or polystyrene ("PS"), a polymer derivative having a phenol-based group, an acryl-based polymer, an imide-based polymer, a polyarylether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and any combination thereof.

[0089] The connection electrode CML may be disposed on the first planarization layer 115. In this case, the connection electrode CML may be connected to the drain electrode D or the source electrode S through a contact hole in the first planarization layer 115. The connection electrode CML may include a material having relatively good electrical conductivity. The connection electrode CML may include a conductive material including Mo, Al, Cu, or Ti, and may be one or more layers including the above materials. In an embodiment, the connection electrode CML may have a multilayer structure of Ti / Al / Ti.

[0090] The second planarization layer 116 may cover the connection electrode CML. The second planarization layer 116 may include an organic insulating layer. The second planarization layer 116 may include an organic insulating material such as a general polymer (such as PMMA or PS), a polymer derivative having a phenol-based group, an acryl-based polymer, an imide-based polymer, a polyarylether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and any combination thereof.

[0091] The display element layer DEL may be disposed on the pixel circuit layer PCL. The display element layer DEL may include a display element DE. The display element DE may be an organic light emitting diode ("OLED"). The pixel electrode 211 of the display element DE may be electrically connected to the connection electrode CML through a contact hole in the second planarization layer 116.

[0092] The pixel electrode 211 may include indium tin oxide ("ITO"), indium zinc oxide ("IZO"), ZnO, indium oxide (In 2 O 3 ), indium gallium oxide ("IGO"), or zinc aluminum oxide ("AZO"). In an embodiment, the pixel electrode 211 may include a reflective film including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or any combination thereof. In another embodiment, the pixel electrode 211 may also include a conductive oxide including ITO, IZO, ZnO, or In on / under the above reflective film. 2 O 3 membrane.

[0093] The pixel defining layer 118 defining the opening 118OP may be disposed above the pixel electrode 211, and the opening 118OP exposes the central portion of the pixel electrode 211. The pixel defining layer 118 may include an organic insulating material and / or an inorganic insulating material. The opening 118OP may define an emission area EA (hereinafter, also referred to as an emission area) of light emitted from the display element DE. In an embodiment, for example, the width of the opening 118OP may correspond to the width of the emission area EA of the display element DE.

[0094] The spacer 119 may be disposed on the pixel defining layer 118. In the method of manufacturing the display device, the spacer 119 may prevent damage to the substrate 100. When manufacturing the display panel 10, a deposition material may be deposited on the substrate 100 using a mask sheet. In this case, the spacer 119 may prevent defects (such as damage to a portion of the substrate 100 or breakage of the substrate 100) that may occur when the mask sheet enters the opening 118OP of the pixel defining layer 118 or adheres to the pixel defining layer 118.

[0095] The spacer 119 may include an organic insulating material such as polyimide. In an alternative embodiment, the spacer 119 may include an organic insulating material such as SiN x or SiO 2 inorganic insulating material or both organic insulating material and inorganic insulating material.

[0096] In an embodiment, the spacer 119 may include a material different from that of the pixel defining layer 118. In an alternative embodiment, in another embodiment, the spacer 119 may include the same material as that of the pixel defining layer 118, and in this case, the pixel defining layer 118 and the spacer 119 may be formed together by a mask process using a half-tone mask or the like.

[0097] The intermediate layer 212 may be disposed on the pixel defining layer 118. The intermediate layer 212 may include an emission layer 212b disposed in the opening 118OP of the pixel defining layer 118. The emission layer 212b may include a high molecular weight or low molecular weight organic material that emits light of a predetermined color.

[0098] The first functional layer 212a and the second functional layer 212c may be disposed below and above the emission layer 212b. The first functional layer 212a may include, for example, a hole transport layer ("HTL") or both an HTL and a hole injection layer ("HIL"). The second functional layer 212c may be disposed above the emission layer 212b and is optional. The second functional layer 212c may include an electron transport layer ("ETL") and / or an electron injection layer ("EIL"). Similar to the relative electrode 213 described below, the first functional layer 212a and / or the second functional layer 212c may each be a common layer formed to cover the entirety of the substrate 100.

[0099] The opposing electrode 213 may include a conductive material having a relatively low work function. In an embodiment, for example, the opposing electrode 213 may include a transparent (or translucent) layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), calcium (Ca) or any alloy thereof. In an optional embodiment, the opposing electrode 213 may also include a transparent (or translucent) layer including ITO, IZO, ZnO or In on the transparent (or translucent) layer including the above materials. 2 O 3 layer.

[0100] In some embodiments, a capping layer (not shown) may be further disposed on the counter electrode 213. The capping layer may include LiF, an inorganic material, and / or an organic material.

[0101] The encapsulation layer 300 may be disposed on the opposite electrode 213. The encapsulation layer 300 may be disposed on the display element layer DEL and cover the display element layer DEL. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer, and in an embodiment, Figure 3 It is shown that the encapsulation layer 300 includes a first inorganic encapsulation layer 310 , an organic encapsulation layer 320 , and a second inorganic encapsulation layer 330 which are sequentially stacked.

[0102] The first inorganic encapsulating layer 310 and the second inorganic encapsulating layer 330 may each include a selected from Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 、ZnO x 、SiO 2 、SiN x and one or more inorganic materials of SiON. The organic encapsulation layer 320 may include a polymer-based material. The polymer-based material may include an acryl-based resin, an epoxy-based resin, polyimide, polyethylene, etc. In an embodiment, the organic encapsulation layer 320 may include acrylate. The organic encapsulation layer 320 may be formed by curing a monomer or applying a polymer. The organic encapsulation layer 320 may be transparent.

[0103] Although not shown on the encapsulation layer 300 , the above-described touch sensor layer TSL may be provided, and the optical function layer OFL may be provided over the touch sensor layer TSL.

[0104] Figure 4 It is along Figure 1 A schematic cross-sectional view of an embodiment of the display device is taken along line IV-IV' and illustrates the same.

[0105] refer to Figure 1 and Figure 4 As described above, the display device 1 may include a display area DA and a peripheral area PA surrounding at least a portion of the display area DA. In an embodiment, the display area DA may have a quadrilateral shape (e.g., a rectangular shape). In this case, the display area DA may be composed of a plurality of portions extending in a first direction (e.g., Figure 1 A pair of parallel first edges extending in the x-direction and a pair of parallel first edges extending in the second direction (eg, Figure 1 The peripheral area PA may be defined by a pair of parallel second edges extending in the y direction of the display area DA. The peripheral area PA may be arranged to surround the first edge and the second edge of the display area DA. In this case, the peripheral area PA may include an edge of the display area DA, for example, a pad area PDA protruding from the first edge. In the pad area PDA, the display panel 10 (for example, the substrate 100) may be electrically connected to the display circuit board 40.

[0106] The display panel 10 (e.g., substrate 100) may include a panel protrusion 60 protruding outward from a portion of the periphery of the display area DA (e.g., the first edge S1). In an embodiment, the panel protrusion 60 may be provided in plurality, and in this case, the panel protrusions 60 may be spaced apart from each other along the first edge S1. In an embodiment, as shown in FIG. Figure 1 As shown in FIG. 5 , for example, there may be two panel protrusions 60 or two or more panel protrusions 60. Hereinafter, for convenience of explanation, there are two panel protrusions 60.

[0107] like Figure 1 As shown in , the panel protrusion 60 may have a substantially gradually narrowed quadrilateral shape, but is not limited thereto. The panel protrusion 60 may have various shapes, for example, a semi-elliptical shape protruding from the first edge S1 and having a reduced width. In addition, the panel protrusion 60 may also have a quadrilateral shape, for example, a rectangular shape having a uniform width.

[0108] As described above, the display driver 30 may be disposed on the panel protrusion 60. In addition, the first pad 60P may be disposed on the panel protrusion 60. The first pad 60P may contact and be electrically connected to a second pad 42P described below.

[0109] The display circuit board 40 may contact and be electrically connected to the panel protrusion 60. In an embodiment, the display circuit board 40 may be a rigid PCB that is rigid and difficult to bend. The display circuit board 40 may include a body portion 41, a connection portion 42, and a board protrusion 43.

[0110] The body portion 41 may extend along a portion of the periphery of the display area DA. In an embodiment, for example, the body portion 41 may extend along a first direction (eg, Figure 1 In this case, the main body portion 41 may extend in a second direction (eg, in the x direction) intersecting the extending direction of the first edge S1. Figure 1 The main body portion 41 may extend parallel to the first edge S1. In an embodiment, the main body portion 41 may extend in parallel with the first edge S1. In addition, in an embodiment, the length of the extension of the main body portion 41 in the first direction may be less than the length of the first edge S1 in the first direction. As described below, when the display device 1 is coupled to an electronic device, such a length may provide a space where components such as a hinge can be connected.

[0111] The connection portion 42 may extend to the body portion 41 and overlap the panel protrusion 60. The connection portion 42 may include a second pad 42P on a portion of the connection portion 42 overlapping the panel protrusion 60. The second pad 42P may contact the first pad 60P and electrically connect the connection portion 42 to the panel protrusion 60. In addition, the connection portion 42 may be electrically connected to the display panel 10 through the panel protrusion 60.

[0112] In an embodiment, the connection portion 42 may have a shape protruding from the body portion 41. However, the present disclosure is not limited thereto, and in another embodiment, the connection portion 42 may not protrude and may be integrated into the body portion 41. In this case, it may be described that the second pad 42P may be provided on the body portion 41.

[0113] The number of connecting portions 42 may correspond to the number of panel protrusions 60. In an embodiment, for example, when the number of panel protrusions 60 is as follows: Figure 1 When two are shown in FIG. 1 , the number of the connecting portions 42 may also be two. In this case, the connecting portions 42 may be spaced apart from each other in the extending direction of the main body portion 41 (ie, the first direction). Figure 1 As shown in FIG. 4 , the connection portion 42 may have a substantially gradually narrowed quadrilateral shape, but the shape is not limited thereto.

[0114] The plate protrusion 43 may protrude from the body portion 41. In an embodiment, the plate protrusion 43 may protrude toward a recessed area CA defined between the plurality of panel protrusions 60. In other words, the plate protrusion 43 may be disposed between the panel protrusions 60. Furthermore, the plate protrusion 43 may be disposed between the connection portions 42. Figure 1One plate protrusion 43 is shown, but when there are a plurality of panel protrusions 60 (for example, three panel protrusions 60), there may be two plate protrusions 43 arranged between the three panel protrusions 60. In this case, the panel protrusions 60 and the plate protrusions 43 may be arranged alternately. The connecting portions 42 and the plate protrusions 43 may also be arranged alternately.

[0115] In a plan view, the board protrusion 43 may not contact or overlap with the display panel 10, and may be disposed in a space between the panel protrusions 60. On the board protrusion 43, various components PT that may be disposed (e.g., mounted) on the display circuit board 40 may be arranged. Therefore, the dead zone in the second direction may be reduced. In addition, the protruding length L1 of the board protrusion 43 from the main body portion 41 may be greater than the protruding length L2 of the connection portion 42 from the main body portion 41. Therefore, a larger area may be secured on the board protrusion 43 to mount the components PT.

[0116] In addition, in a plan view, the plate protrusion 43 has a gradually narrowing shape having a width that decreases away from the main body portion 41, for example, the plate protrusion 43 may have a substantially gradually narrowing quadrilateral shape according to the shape of the panel protrusion 60, but the present disclosure is not limited thereto. The plate protrusion 43 may have various shapes, for example, a semi-elliptical shape that protrudes from the main body portion 41 and has a reduced width. In addition, the plate protrusion 43 may also have a quadrilateral shape, for example, in a plan view, the plate protrusion 43 has a rectangular shape having a uniform width away from the main body portion 41.

[0117] In addition, the board protrusion 43, the connection portion 42 and the main body portion 41 may be integrated with each other. The description that the board protrusion 43, the connection portion 42 and the main body portion 41 are integrated may mean that the board protrusion 43, the connection portion 42 and the main body portion 41 include a stacked structure of the display circuit board 40 including at least one conductive layer and at least one insulating layer, and are continuously connected.

[0118] Reference again Figure 4 , the display circuit board 40 may include at least one conductive layer and at least one insulating layer. In an embodiment, the display circuit board 40 may include a plurality of conductive layers in a thickness direction of the display circuit board 40 (eg, Figure 4 In other words, the first insulating layer IL1 may be disposed between the first conductive layer CL1 and the second conductive layer CL2, and the second insulating layer IL2 may be disposed to cover the second conductive layer CL2. Figure 4The display circuit board 40 is shown to include two conductive layers and two insulating layers, but the present disclosure is not limited thereto. In an embodiment, for example, it is understood that the display circuit board 40 may include two or more conductive layers and two or more insulating layers.

[0119] The first insulating layer IL1 and the second insulating layer IL2 may maintain the rigidity of the display circuit board 40 and protect signals from the outside. In addition, the first insulating layer IL1 and the second insulating layer IL2 may prevent cracks from being generated in the first conductive layer CL1 and the second conductive layer CL2. The first insulating layer IL1 and the second insulating layer IL2 may include polyimide.

[0120] The first conductive layer CL1 and the second conductive layer CL2 may include a conductive material. In an embodiment, for example, the first conductive layer CL1 and the second conductive layer CL2 may include Cu.

[0121] In an embodiment, the stacking structure may be applied uniformly throughout the body portion 41, the connection portion 42, and the plate protrusion 43. In other words, the body portion 41, the connection portion 42, and the plate protrusion 43 may include a first conductive layer CL1, a first insulating layer IL1, a second conductive layer CL2, and a second insulating layer IL2. In addition, the corresponding conductive layers of the body portion 41, the connection portion 42, and the plate protrusion 43 may extend continuously.

[0122] In this case, the first conductive layer CL1 of the connection portion 42 may include the second pad 42P and contact the first pad 60P of the panel protrusion 60, thereby being electrically connected to the first pad 60P. In addition, the component PT may be disposed (e.g., mounted) on a surface (e.g., a lower surface (at the bottom) of the first conductive layer CL1 of the body portion 41. Figure 4 The component PT may also be disposed (eg, mounted) on a surface (eg, a lower surface) of the first conductive layer CL1 of the plate protrusion 43 .

[0123] Figures 5 to 7 is with Figure 4 Schematic cross-sectional view of an embodiment of a display device similar to the embodiment of FIG. The display device in the illustrated embodiment is similar to the display device described above, and therefore, mainly the differences therebetween are described.

[0124] refer to Figure 5 , the display circuit board 40 may include at least one conductive layer and at least one insulating layer. In an embodiment, the main body portion 41 may include a thickness direction of the main body portion 41 (eg, Figure 5The first conductive layer CL1, the first insulating layer IL1, the second conductive layer CL2, and the second insulating layer IL2 are sequentially arranged in the z direction of the main body 41. That is, the first insulating layer IL1 may be disposed between the first conductive layer CL1 and the second conductive layer CL2, and the second insulating layer IL2 may be disposed to cover the second conductive layer CL2. In addition, the plate protrusion 43 may have the same stacking structure as the main body portion 41. Figure 5 The main body portion 41 is shown to include two conductive layers and two insulating layers, but the present disclosure is not limited thereto. In an embodiment, for example, it is understood that the main body portion 41 may include two or more conductive layers and two or more insulating layers. Figure 5 situation.

[0125] The connection portion 42 may be formed by extending at least one of the conductive layers included in the body portion 41 and the plate protrusion 43. In an embodiment, for example, Figure 5 As shown in , the main body portion 41 may include a first conductive layer CL1, a first insulating layer IL1, a second conductive layer CL2, and a second insulating layer IL2. The lowest conductive layer (e.g., the first conductive layer CL1) among the conductive layers may protrude from the main body portion 41 and form a connection portion 42. In addition, the first insulating layer IL1 covering the first conductive layer CL1 may protrude from the main body portion 41 and form a connection portion 42. In this case, the other conductive layers (e.g., the second conductive layer CL2) may not protrude from the main body portion 41 and may not form a connection portion 42.

[0126] As a result, the thickness of the connection portion 42 may be less than the thickness of the main body portion 41. As the number of layers forming the connection portion 42 increases, the modulus and elongation may increase. Therefore, when the display circuit board 40 is attached and connected to the display panel 10 through the connection portion 42, a connection defect such as separation of the first pad 60P from the second pad 42P may occur due to increased shrinkage and expansion. In an embodiment, since the connection portion 42 is formed to be thinner than the main body portion 41, that is, formed to include a conductive layer less in number than the main body portion 41, when the display circuit board 40 is attached, the modulus and elongation may be reduced and the contact and connection characteristics may be improved.

[0127] refer to Figure 6 , the connection portion 42 may be formed by extending at least one of the conductive layers included in the body portion 41 and the plate protrusion 43. In an embodiment, for example, Figure 6As shown in , the main body portion 41 may include a first conductive layer CL1, a first insulating layer IL1, a second conductive layer CL2, and a second insulating layer IL2. The uppermost conductive layer (e.g., the second conductive layer CL2) among the conductive layers may protrude from the main body portion 41 and form a connection portion 42. In addition, the second insulating layer IL2 covering the second conductive layer CL2 may protrude from the main body portion 41 and form a connection portion 42. In this case, the other conductive layers (e.g., the first conductive layer CL1) may not protrude from the main body portion 41 and may not form a connection portion 42.

[0128] refer to Figure 7 , the connection portion 42 may be formed by extending at least one of the conductive layers included in the body portion 41 and the plate protrusion 43. In an embodiment, for example, Figure 7 As shown in , the main body portion 41 may include a first conductive layer CL1, a first insulating layer IL1, a second conductive layer CL2, a second insulating layer IL2, a third conductive layer CL3, and a third insulating layer IL3. The second conductive layer CL2, which is a conductive layer disposed in the middle of the conductive layer and neither at the top nor at the bottom, may protrude from the main body portion 41 and form a connection portion 42. In addition, the second insulating layer IL2 covering the second conductive layer CL2 may protrude from the main body portion 41 and form a connection portion 42. In this case, other conductive layers (e.g., the first conductive layer CL1 and the third conductive layer CL3) may not protrude from the main body portion 41 and may not form a connection portion 42.

[0129] Figure 7 The number of conductive layers included in the body portion 41 is shown to be three, but the present disclosure is not limited thereto. In an embodiment, for example, when the body portion 41 includes four or more conductive layers (i.e., a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer), the second conductive layer or the third conductive layer disposed in the middle of the body portion 41 to form the connection portion 42 may protrude from the body portion 41. In an alternative embodiment, it is understood that both the second conductive layer and the third conductive layer may protrude from the body portion 41 and form the connection portion 42.

[0130] According to the embodiment, a non-display area can be reduced in a display device. In addition, an area for components disposed (eg, mounted) on a display circuit board can be ensured.

[0131] It should be understood that the embodiments described herein should be considered to be descriptive only and not for limiting purposes. The description of features or advantages within each embodiment should generally be considered to be applicable to other similar features or advantages in other embodiments. Although the embodiments have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope defined by the appended claims.

Claims

1. A display device, comprising: Display panel, including: a plurality of panel protrusions protruding from an edge of a display area and arranged spaced apart from each other along the edge of the display area; and Display circuit board, including: a main body portion spaced apart from the edge of the display area and extending along the edge of the display area; A plurality of connecting parts are spaced apart in the extending direction of the main body part, and respectively overlap with the plurality of panel protrusions; and A panel protrusion protrudes from the main body portion toward a recessed area defined between the plurality of panel protrusions.

2. The display device according to claim 1, wherein: The plurality of panel protrusions include first pads, the plurality of connection portions include second pads on portions of the plurality of connection portions overlapping the plurality of panel protrusions, and the first pads contact and are electrically connected to the second pads.

3. The display device according to claim 1, wherein: The plurality of connection portions protrude from the body portion and are connected to the plurality of panel protrusions.

4. The display device according to claim 3, wherein: The protruding length of the plate protrusion is greater than the protruding lengths of the plurality of connection portions.

5. The display device according to claim 1, wherein: The plurality of connection portions are provided in a number corresponding to the number of the plurality of panel protrusions, and the board protrusion is provided between the plurality of connection portions.

6. The display device according to claim 1, wherein: The body portion, the plurality of connection portions, and the plate protrusion are integral with each other.

7. The display device according to claim 1, wherein: The panel protrusion does not overlap the display panel and is spaced apart from the display panel in a plan view.

8. The display device according to claim 1, wherein: In a plan view, the plate protrusion has a tapered shape having a width that decreases away from the main body portion.

9. The display device according to claim 1, wherein: In a plan view, the plate protrusion has a rectangular shape having a uniform width away from the main body portion.

10. The display device according to claim 1, wherein: The main body portion extends over a length that is smaller than a length of the edge of the display area.

11. The display device according to claim 1, wherein: The main body portion and the multiple connecting portions include multiple conductive layers stacked in the thickness direction of the main body portion and each of the multiple connecting portions, and a conductive layer as the lowest conductive layer among the multiple conductive layers of the multiple connecting portions contacts and is electrically connected to the multiple panel protrusions.

12. The display device according to claim 1, wherein: The main body portion and the plurality of connection portions each include at least one conductive layer stacked in a thickness direction of the main body portion and each of the plurality of connection portions, and the number of the at least one conductive layer in the plurality of connection portions is smaller than the number of the at least one conductive layer in the main body portion.

13. The display device according to claim 12, wherein: The at least one conductive layer of the body portion is arranged as a plurality of conductive layers, and conductive layers among the plurality of conductive layers of the body portion protrude from the body portion to form the plurality of connection portions and contact and are electrically connected to the plurality of panel protrusions.

14. The display device according to claim 13, wherein: The conductive layer protruding from the body portion is an uppermost conductive layer among the plurality of conductive layers.

15. The display device according to claim 13, wherein: The conductive layer protruding from the body portion is a lowermost conductive layer among the plurality of conductive layers.

16. The display device according to claim 13, wherein: The conductive layer protruding from the main body portion is a middle conductive layer among the plurality of conductive layers.

17. A display circuit board capable of being connected to a display panel, the display circuit board comprising: A main body portion extending in one direction; a plurality of connection parts protruding from the main body part and spaced apart from each other in an extending direction of the main body part, the plurality of connection parts comprising: A solder pad electrically connected to the display panel; as well as A plate protrusion protrudes from the main body portion between the plurality of connection portions.

18. The display circuit board according to claim 17, wherein: The protruding length of the plate protrusion is greater than the protruding lengths of the plurality of connection portions.

19. The display circuit board according to claim 17, wherein: The body portion, the plurality of connection portions, and the plate protrusion are integral with each other.

20. The display circuit board according to claim 17, wherein: The body portion includes a plurality of conductive layers stacked in a thickness direction of the body portion, and one of the plurality of conductive layers protrudes from the body portion to form the plurality of connection portions.

Images