Display panel and display device

Abstract

The invention provides a display panel and a display device, the display panel is provided with a display area and a non-display area, and the display panel comprises a substrate, a dam, a first power line and a bridging line; the first power line is located on the substrate and comprises a first connecting section and a second connecting section which are arranged at intervals, the first connecting section is located on the side, away from the display area, of the dam, and the second connecting section is located on the side, close to the display area, of the dam; the bridging line is located between at least part of the dam and the substrate, and the bridging line is electrically connected with the first connecting section and the second connecting section. According to the display panel provided by the invention, the packaging effect can be improved, so that the use performance / process performance can be further improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and more specifically, to a display panel and a display device. Background Art

[0002] Display devices using organic light emitting diode (OLED) technology have the advantages of good display effect, good heat dissipation, low cost, and small thickness.

[0003] However, the performance and process performance of OLED display devices need to be further improved. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a display panel and a display device to further improve the performance / process performance.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] In a first aspect, a display panel is provided, having a display area and a non-display area, the display panel comprising a substrate, a dam, a first power line and a bridge line; the first power line is located on the substrate, the first power line comprises a first connecting segment and a second connecting segment arranged at intervals, the first connecting segment is located on a side of the dam away from the display area, and the second connecting segment is located on a side of the dam close to the display area; the bridge line is located between at least a portion of the dam and the substrate, and the bridge line is electrically connected to the first connecting segment and the second connecting segment, respectively.

[0007] Through the above technical solution, the display panel provided in the present application utilizes a bridge line to connect the first connection segment and the second connection segment of the first power line, and the bridge line is located between at least a portion of the dam and the substrate, which is beneficial to avoid the first power line being exposed in the packaging area, thereby avoiding the formation of a channel for water vapor intrusion at the first power line, which is beneficial to improving the packaging effect.

[0008] Therefore, the display panel provided by the present application can improve the packaging effect, thereby further improving the usage performance / process performance.

[0009] In some embodiments, the first connection segment and the bridge line are arranged in different layers, and / or the second connection segment and the bridge line are arranged in different layers, the bridge line is connected to the first connection segment through a first via, and the bridge line is connected to the second connection segment through a second via.

[0010] In this way, the bridge wire can connect the first connection segment and the second connection segment of the first power line, and the bridge wire and at least one of the first connection segment and the second connection segment are arranged in a different layer, which is beneficial to avoid the exposed area before packaging, thereby preventing the formation of a channel for water vapor intrusion and improving the packaging effect.

[0011] Optionally, the thickness of the bridge line along the thickness direction of the substrate is smaller than the thickness of the first connecting section along the thickness direction of the substrate; and / or the thickness of the bridge line along the thickness direction of the substrate is smaller than the thickness of the second connecting section along the thickness direction of the substrate.

[0012] Optionally, the non-display area includes a binding area, at least a portion of the first connecting section is located between the binding area and the display area, and the first connecting section is connected to a pin of the binding area.

[0013] Optionally, the first power line includes a first sub-conductive layer, a second sub-conductive layer and a third sub-conductive layer stacked in sequence along the thickness direction of the substrate, and the etching resistance of the material of the second sub-conductive layer is lower than that of the materials of the first sub-conductive layer and the third sub-conductive layer.

[0014] Optionally, the first power line includes a titanium metal layer, an aluminum metal layer and a titanium metal layer which are sequentially stacked along a thickness direction of the substrate.

[0015] In some embodiments, the display panel provided in the present application further includes a second power line, a projection of the second power line on the substrate overlaps with an orthographic projection of the bridge line on the substrate, and the bridge line is located between the second power line and the substrate.

[0016] In this way, the bridge line can bypass the second power line, and there is no need to set a break in the second power line, so that the second power line is continuous, which is beneficial to improving the packaging effect.

[0017] Optionally, the bridge wire and the second power line are insulated.

[0018] Optionally, an orthographic projection of the second power line on the substrate overlaps with an orthographic projection of the dam on the substrate.

[0019] In some embodiments, the second power line is located between the dam and the substrate, the second power line includes a third connecting segment and a fourth connecting segment, the third connecting segment is located on a side of the fourth connecting segment away from the display area, the third connecting segment is located on a side of the dam away from the display area, the fourth connecting segment extends along an edge of the display area, the third connecting segment is connected to the fourth connecting segment, and an orthographic projection of the fourth connecting segment on the substrate overlaps with an orthographic projection of the bridging line on the substrate.

[0020] In this way, the second power line can be connected to other devices through the third connecting segment, and the fourth connecting segment extends along the edge of the display area, which is beneficial to avoid the formation of a channel for water vapor intrusion during packaging and is beneficial to improving the packaging effect.

[0021] Optionally, the orthographic projection of the fourth connecting segment on the substrate is a closed ring.

[0022] Optionally, the fourth connecting segment is arranged around the display area.

[0023] Optionally, the orthographic projection of the fourth connecting segment on the substrate has the same shape as the orthographic projection of the dam on the substrate.

[0024] Optionally, the first connecting segment is located on a side of the fourth connecting segment away from the display area.

[0025] Optionally, the second connecting segment is located on a side of the fourth connecting segment close to the display area.

[0026] Optionally, the first power line and the second power line are arranged on the same layer.

[0027] Optionally, the non-display area includes a binding area, at least a portion of the third connecting segment is located between the binding area and the display area, and the third connecting segment is connected to a pin of the binding area.

[0028] In some embodiments, an outer peripheral edge of the fourth connecting segment away from the display area is located on a side of the dam away from the display area, and an inner peripheral edge of the fourth connecting segment close to the display area is located on a side of the dam close to the display area; or, the display panel provided in the present application also includes a packaging groove, the packaging groove includes a first side wall surface and a second side wall surface, the first side wall surface is located on a side of the second side wall surface close to the peripheral area, the outer peripheral edge of the fourth connecting segment is located on a side of the first side wall surface away from the second side wall surface, and the inner peripheral edge of the fourth connecting segment is located on a side of the second side wall surface away from the first side wall surface; or, the outer peripheral edge of the fourth connecting segment is located on a side of the first side wall surface away from the second side wall surface, the orthographic projection of the inner peripheral edge of the fourth connecting segment on the substrate is located within the orthographic projection of the packaging groove on the substrate, and the inner peripheral edge of the fourth connecting segment is located between the first side wall surface and the second side wall surface; or, the orthographic projection of the outer peripheral edge of the fourth connecting segment on the substrate is located within the orthographic projection of the packaging groove on the substrate, the inner peripheral edge of the fourth connecting segment is located on a side of the second side wall surface away from the first side wall surface, and the outer peripheral edge of the fourth connecting segment is located between the first side wall surface and the second side wall surface.

[0029] In this way, at least one of the inner peripheral edge and the outer peripheral edge of the fourth connecting segment is not in the packaging groove of the packaging area. Even if there is a side carving in the part of the fourth connecting segment in the packaging groove, after packaging, the gap formed by the side carving will not pass through the packaging area and will not cause water vapor intrusion.

[0030] Optionally, at least part of the dam is located within the encapsulation groove.

[0031] Optionally, the display panel also includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer which are stacked in sequence in a direction away from the substrate, the organic encapsulation layer is located on a side of the dam close to the display area, the first inorganic encapsulation layer and the second inorganic encapsulation layer are located on a side of the dam away from the substrate, and the orthographic projection of the contact area of ​​the first inorganic encapsulation layer and the second inorganic encapsulation layer on the substrate overlaps with the orthographic projection of the dam on the substrate.

[0032] Optionally, an orthographic projection of a contact area between the first inorganic packaging layer and the second power line on the substrate overlaps with an orthographic projection of the packaging groove on the substrate.

[0033] Optionally, at least part of an overlapping area between an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line and an orthographic projection of the encapsulation groove on the substrate is located on a side of the orthographic projection of the dam on the substrate away from the display area.

[0034] Optionally, at least part of an overlapping area of ​​an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line and an orthographic projection of the encapsulation groove on the substrate is located on a side of the orthographic projection of the dam on the substrate close to the display area.

[0035] Optionally, there are at least two dams, and at least part of the overlapping area of ​​the orthographic projection of the contact area of ​​the first inorganic packaging layer and the second power line on the substrate and the orthographic projection of the packaging groove on the substrate is located between the orthographic projections of adjacent dams arranged at intervals on the substrate.

[0036] Optionally, the dam includes a first dam and a second dam, the second dam is located on a side of the first dam away from the display area, the encapsulation groove includes a first groove located between the first dam and the second dam; an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the first groove on the substrate;

[0037] And / or, the encapsulation groove includes a second groove located on a side of the first dam close to the display area and adjacent to the first dam, and an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the second groove on the substrate;

[0038] And / or, the encapsulation groove includes a third groove located on a side of the second dam away from the display area and adjacent to the second dam, and the orthographic projection of the contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with the orthographic projection of the third groove on the substrate.

[0039] Optionally, the first side wall surface is a side wall surface of the third groove away from the display area; and the second side wall surface is a side wall surface of the second groove close to the display area.

[0040] Optionally, the display panel further includes a light-emitting device layer located between the film layer where the first power line and / or the second power line is located and the first inorganic encapsulation layer;

[0041] The light emitting device layer includes a first electrode layer, a light emitting layer and a second electrode layer which are sequentially stacked in a direction away from the substrate, and the second electrode layer is electrically connected to the second power line.

[0042] Optionally, the display panel further includes a pixel circuit, wherein the film layer where the pixel circuit is located is located between the light-emitting device layer and the substrate, the pixel circuit is electrically connected to the first power line, and the pixel circuit is electrically connected to the first electrode layer.

[0043] In some embodiments, the display panel further includes a transistor, and the bridge wire is disposed on the same layer as the gate of the transistor;

[0044] Alternatively, the display panel further includes a storage capacitor, and the bridge wire is arranged in the same layer as the capacitor plate of the storage capacitor;

[0045] Alternatively, the display panel further includes a first transistor and a second transistor having different channel types, and the bridge wire is arranged at the same layer as the gate of the first transistor; alternatively, the bridge wire is arranged at the same layer as the gate of the second transistor.

[0046] Optionally, the film layer where the channel of the second transistor is located is located on the side of the film layer where the channel of the first transistor is located away from the substrate; the second transistor includes a first gate and a second gate which are stacked in sequence in a direction away from the substrate and are located on both sides of the channel of the second transistor, and the bridge line is arranged on the same layer as the first gate or the second gate of the second transistor.

[0047] Optionally, the material of the bridge line includes molybdenum metal.

[0048] Optionally, the second power line includes a fourth sub-conductive layer, a fifth sub-conductive layer and a sixth sub-conductive layer stacked in sequence along the thickness direction of the substrate, and the etching resistance of the material of the fifth sub-conductive layer is lower than that of the materials of the fourth sub-conductive layer and the sixth sub-conductive layer.

[0049] Optionally, the second power line includes a titanium metal layer, an aluminum metal layer and a titanium metal layer which are sequentially stacked along the thickness direction of the substrate.

[0050] Optionally, one of the first power line and the second power line is used to transmit a high voltage, and the other is used to transmit a low voltage.

[0051] Optionally, the display panel also includes a driving device layer, which includes a first active layer, a first conductive layer, a second conductive layer, a second active layer, a third conductive layer, a fourth conductive layer and a fifth conductive layer which are stacked in sequence along a direction away from the substrate and insulated from each other, the first power line and the second power line are located in the fifth conductive layer, and the bridge line is located in one of the first conductive layer, the second conductive layer and the third conductive layer.

[0052] In a second aspect, the present application provides another display panel having a display area and a non-display area, the display panel comprising a substrate, a dam, and a second power line, the dam being located on the substrate and in the non-display area; the second power line being located between the dam and the substrate, the second power line comprising a fourth connecting segment, and the fourth connecting segment extending around an edge of the display area.

[0053] In this way, the fourth connection segment extends along the edge of the display area for a circle, which is beneficial to avoiding the formation of a channel for water vapor to invade during packaging, and is beneficial to improving the packaging effect.

[0054] In some embodiments, the second power line further includes a third connection segment; the third connection segment is connected to the fourth connection segment, the third connection segment is located on a side of the fourth connection segment away from the display area, and the third connection segment is located on a side of the dam away from the display area.

[0055] Optionally, an orthographic projection of the fourth connecting segment on the substrate overlaps with an orthographic projection of the dam on the substrate.

[0056] Optionally, the orthographic projection of the fourth connecting segment on the substrate is a closed ring.

[0057] Optionally, the fourth connecting segment is arranged around the display area.

[0058] Optionally, the orthographic projection of the fourth connecting segment on the substrate has the same shape as the orthographic projection of the dam on the substrate.

[0059] Optionally, the non-display area includes a binding area, the third connecting segment is located between the binding area and the display area, and the third connecting segment is connected to the pin of the binding area; the outer peripheral edge of the fourth connecting segment away from the display area is located on a side of the dam away from the display area, and the inner peripheral edge of the fourth connecting segment close to the display area is located on a side of the dam close to the display area;

[0060] Alternatively, the array substrate further includes a packaging groove, the packaging groove includes a first side wall surface and a second side wall surface, the first side wall surface is located on a side of the second side wall surface away from the display area, the outer peripheral edge of the fourth connecting segment is located on a side of the first side wall surface away from the second side wall surface, and the inner peripheral edge of the fourth connecting segment is located on a side of the second side wall surface away from the first side wall surface;

[0061] Alternatively, the outer peripheral edge of the fourth connecting segment is located on a side of the first side wall surface away from the second side wall surface, and the orthographic projection of the inner peripheral edge of the fourth connecting segment on the substrate is located within the orthographic projection of the packaging groove on the substrate; the inner peripheral edge of the fourth connecting segment is located between the first side wall surface and the second side wall surface,

[0062] Alternatively, the orthographic projection of the outer peripheral edge of the fourth connecting segment on the substrate is located within the orthographic projection of the packaging groove on the substrate, and the inner peripheral edge of the fourth connecting segment is located on the side of the second side wall surface away from the first side wall surface; the outer peripheral edge of the fourth connecting segment is located between the first side wall surface and the second side wall surface.

[0063] Optionally, at least part of the dam is located within the encapsulation groove.

[0064] Optionally, the display panel also includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer which are stacked in sequence in a direction away from the substrate, the organic encapsulation layer is located on a side of the dam close to the display area, the first inorganic encapsulation layer and the second inorganic encapsulation layer are located on a side of the dam away from the substrate, and the orthographic projection of the contact area of ​​the first inorganic encapsulation layer and the second inorganic encapsulation layer on the substrate overlaps with the orthographic projection of the dam on the substrate.

[0065] Optionally, an orthographic projection of a contact area between the first inorganic packaging layer and the second power line on the substrate overlaps with an orthographic projection of the packaging groove on the substrate.

[0066] Optionally, at least part of an overlapping area between an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line and an orthographic projection of the encapsulation groove on the substrate is located on a side of the orthographic projection of the dam on the substrate away from the display area.

[0067] and / or, at least part of an overlapping area of ​​an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate and an orthographic projection of the encapsulation groove on the substrate is located on a side of the orthographic projection of the dam on the substrate close to the display area;

[0068] And / or, there are at least two dams, and at least part of the overlapping area of ​​the orthographic projection of the contact area of ​​the first inorganic packaging layer and the second power line on the substrate and the orthographic projection of the packaging groove on the substrate is located between the orthographic projections of adjacent dams arranged at intervals on the substrate.

[0069] Optionally, the dam includes a first dam and a second dam, the second dam is located on a side of the first dam away from the display area, the encapsulation groove includes a first groove located between the first dam and the second dam; an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the first groove on the substrate;

[0070] And / or, the encapsulation groove includes a second groove located on a side of the first dam close to the display area and adjacent to the first dam, and an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the second groove on the substrate;

[0071] And / or, the encapsulation groove includes a third groove located on a side of the second dam away from the display area and adjacent to the second dam, and the orthographic projection of the contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with the orthographic projection of the third groove on the substrate.

[0072] Optionally, the first side wall surface is a side wall surface of the third groove away from the display area; and the second side wall surface is a side wall surface of the second groove close to the display area.

[0073] In some embodiments, the display panel also includes a first power line located on the substrate, the first power line including a first connecting segment and a second connecting segment spaced apart, the first connecting segment being located on a side of the dam away from the display area, and the second connecting segment being located on a side of the dam close to the display area.

[0074] Optionally, the display panel further includes a light-emitting device layer, and the light-emitting device layer is located between the film layer where the first power line and / or the second power line is located and the first inorganic encapsulation layer;

[0075] The light emitting device layer includes a first electrode layer, a light emitting layer and a second electrode layer which are sequentially stacked in a direction away from the substrate, and the second electrode layer is electrically connected to the second power line.

[0076] Optionally, the display panel further includes a pixel circuit, wherein the film layer where the pixel circuit is located is located between the light-emitting device layer and the substrate, the pixel circuit is electrically connected to the first power line, and the pixel circuit is electrically connected to the first electrode layer.

[0077] Optionally, the first connecting segment is located on a side of the fourth connecting segment away from the display area; and the second connecting segment is located on a side of the fourth connecting segment close to the display area.

[0078] Optionally, the first power line and the second power line are arranged on the same layer.

[0079] In a third aspect, a display device is provided, comprising the display panel of the above embodiment. The display device provided in this application has the same technical effect as the above display panel, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0080] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0081] Figure 1 is a structural schematic diagram of an array substrate in the related art;

[0082] Figure 2 For along Figure 1 The cross-sectional structure diagram along the AA line;

[0083] Figure 3 This is one of the planar structural schematic diagrams of the array substrate provided in the embodiment of the present application;

[0084] Figure 4 A schematic cross-sectional view of the array substrate provided in an embodiment of the present application;

[0085] Figure 5 for Figure 4 A partial enlarged view of point B in the middle;

[0086] Figure 6 The second schematic diagram of the planar structure of the array substrate provided in the embodiment of the present application;

[0087] Figure 7 For along Figure 6 One of the cross-sectional structural diagrams of the CC line;

[0088] Figure 8 For along Figure 6 The second cross-sectional structure diagram of the CC line;

[0089] Fig. 9 For along Figure 6 The third cross-sectional structure diagram of the CC line;

[0090] Fig.10 The third schematic diagram of the planar structure of the array substrate provided in the embodiment of the present application;

[0091] Fig.11 A fourth schematic diagram of the planar structure of the array substrate provided in an embodiment of the present application;

[0092] Fig.12 For along Figure 6 Sectional structure diagram of CC line in the middle (IV);

[0093] Fig.13 For along Figure 6 The fifth cross-sectional structure diagram of the CC line.

[0094] Among them, the reference numerals in the figure are:

[0095] 100-display panel; 110-display area; 120-non-display area; 121-peripheral area; 122-packaging area; 1221-packaging groove; 1222-first side wall surface; 1223-second side wall surface; 130-first power line; 131-first connecting section; 132-second connecting section; 140-second power line; 141-third connecting section; 142-fourth connecting section; 150-packaging layer; 160-gap; 170-bridge line;

[0096] 1-substrate; 2-first gate dielectric layer; 3-capacitor dielectric layer; 4-buffer layer; 5-second gate dielectric layer; 6-interlayer dielectric layer; 7-first flat layer; 8-second flat layer; 9-pixel definition layer; 10-light-emitting device layer; 101-first electrode layer; 102-light-emitting layer; 103-second electrode layer; 11-bottom shading layer; 12-first active layer; 13-first conductive layer; 14-second conductive layer; 15-second active layer; 16-third conductive layer; 17-fourth conductive layer; 18-fifth conductive layer; 191-first inorganic encapsulation layer; 192-organic encapsulation layer; 193-second inorganic encapsulation layer; 20-dam; 21-first dam; 22-second dam. DETAILED DESCRIPTION

[0097] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0098] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0099] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0100] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0101] The embodiment of the present application provides a display device, which may be a mobile phone, a television, a tablet computer, a laptop computer, a desktop computer, a vehicle-mounted display terminal, a wearable device, an advertising display device, etc. The display device may include a display panel, which may be an organic light-emitting diode (OLED) display panel or a micro light-emitting diode (Micro Light Emitting Diode, Micro LED / μLED) display panel.

[0102] The display panel provided in the embodiment of the present application may adopt low temperature polycrystalline oxide (LTPO) technology, which has a better energy saving effect. However, the use performance / process performance of the OLED display device provided in the embodiment of the present application needs to be further improved.

[0103] For example, see also Figure 1 and Figure 2 In the related art, the first power line 130 of the display panel 100 needs to pass through the packaging area 122, and the second power line 140 is provided with a break for the first power line 130 to pass through. When the first power line 130 and the second power line 140 are etched before the display panel 100 is packaged, a side-etched structure will be generated, that is, a notch is etched on the side. When the display panel 100 is packaged, the packaging material cannot reach the above-mentioned notch. After the display panel 100 is packaged, a gap 160 is formed between the packaging layer 150 and the sides of the first power line 130 and the second power line 140. The gap 160 allows water vapor to pass easily, forming a channel for water vapor to invade, resulting in water vapor invading the display area 110.

[0104] See also Figure 3 In order to solve the above technical problems, an embodiment of the present application provides a display panel 100, which has a display area 110 (Active Area, AA) and a non-display area 120 (Non Display Area, NA).

[0105] Optionally, the non-display area 120 includes a package area (PA) 122 connected to the display area 110 and a surrounding area (SA) 121 surrounding the package area 122 .

[0106] Optionally, the non-display area 120 may be an area of ​​the display area 110 close to the frame, and at least a portion of the non-display area 120 surrounds the display area 110 .

[0107] Optionally, the non-display area 120 may also be a hole area.

[0108] The display panel 100 provided in the embodiment of the present application is described by taking the non-display area 120 as an area of ​​the display area 110 close to the frame as an example.

[0109] Please also read Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 The display panel 100 provided in the embodiment of the present application includes a substrate 1, a dam 20, a first power line 130 and a bridge line 170. The first power line 130 is located on the substrate 1, and includes a first connection segment 131 and a second connection segment 132 arranged at intervals. The first connection segment 131 is located on a side of the dam 20 away from the display area 110, and the second connection segment 132 is located on a side of the dam 20 close to the display area 110; the bridge line 170 is located between at least part of the dam 20 and the substrate 1, and the bridge line 170 is electrically connected to the first connection segment 131 and the second connection segment 132 respectively.

[0110] Through the above technical solution, the display panel 100 provided in the present application utilizes a bridge line 170 to connect the first connection segment 131 and the second connection segment 132 of the first power line 130, and the bridge line 170 is located between at least a portion of the dam 20 and the substrate 1, which is beneficial to avoid the first power line 130 from being exposed in the packaging area 122, thereby avoiding the formation of a channel for water vapor intrusion at the first power line 130, which is beneficial to improving the packaging effect.

[0111] Therefore, the display panel 100 provided in the embodiment of the present application can improve the packaging effect, thereby further improving the usage performance / process performance.

[0112] In some embodiments, the first connecting section 131 and the bridging line 170 are arranged in different layers, and / or the second connecting section 132 and the bridging line 170 are arranged in different layers, the bridging line 170 is connected to the first connecting section 131 through a first via, and the bridging line 170 is connected to the second connecting section 132 through a second via.

[0113] In this way, the bridge wire 170 can connect the first connection segment 131 and the second connection segment 132 of the first power line 130, and the bridge wire 170 and at least one of the first connection segment 131 and the second connection segment 132 are arranged in a different layer, which is beneficial to avoid the exposed area before packaging, thereby preventing the formation of a channel for water vapor intrusion and improving the packaging effect.

[0114] Optionally, the thickness of the bridge line 170 along the thickness direction of the substrate 1 is less than the thickness of the first connecting section 131 along the thickness direction of the substrate 1; and / or, the thickness of the bridge line 170 along the thickness direction of the substrate 1 is less than the thickness of the second connecting section 132 along the thickness direction of the substrate 1.

[0115] It can be understood that the thickness of the bridge line 170 along the thickness direction of the substrate 1 is less than the thickness of the first connecting section 131 and / or the second connecting section 132 along the thickness direction of the substrate 1, which is beneficial to reducing the thickness of the film layer and thus helps to reduce the overall thickness of the display panel 100.

[0116] Optionally, the non-display area 120 includes a binding area, at least a portion of the first connecting segment 131 is located between the binding area and the display area 110 , and the first connecting segment 131 is connected to a pin of the binding area.

[0117] Optionally, the first power line 130 includes a first sub-conductive layer, a second sub-conductive layer and a third sub-conductive layer stacked in sequence along the thickness direction of the substrate 1, and the etching resistance of the material of the second sub-conductive layer is lower than that of the materials of the first sub-conductive layer and the third sub-conductive layer.

[0118] Optionally, the first power line 130 includes a titanium metal layer, an aluminum metal layer and a titanium metal layer stacked in sequence along the thickness direction of the substrate 1 .

[0119] Please also read Figure 6 , Figure 7 , Figure 8 and Fig. 9 In some embodiments, the display panel 100 provided in the embodiment of the present application further includes a second power line 140 , the projection of the second power line 140 on the substrate 1 overlaps with the orthographic projection of the bridge line 170 on the substrate 1 , and the bridge line 170 is located between the second power line 140 and the substrate 1 .

[0120] In this way, the bridge line 170 can bypass the second power line 140, and there is no need to set a break in the second power line 140, so that the second power line 140 can be continuous, which is beneficial to improving the packaging effect.

[0121] Optionally, the bridge line 170 and the second power line 140 are insulated from each other.

[0122] Optionally, the orthographic projection of the second power line 140 on the substrate 1 overlaps with the orthographic projection of the dam 20 on the substrate 1 .

[0123] In some embodiments, the second power line 140 is located between the dam 20 and the substrate 1, and the second power line 140 includes a third connecting segment 141 and a fourth connecting segment 142. The third connecting segment 141 is located on a side of the fourth connecting segment 142 away from the display area 110. The third connecting segment 141 is located on a side of the dam 20 away from the display area 110, and the fourth connecting segment 142 extends along an edge of the display area 110. The third connecting segment 141 is connected to the fourth connecting segment 142, and the orthographic projection of the fourth connecting segment 142 on the substrate 1 overlaps with the orthographic projection of the bridging line 170 on the substrate 1.

[0124] In this way, the second power line 140 can be connected to other devices (such as the ELVSS signal line) through the third connecting segment 141, and the fourth connecting segment 142 extends along the edge of the display area 110, which is beneficial to avoid forming a channel for water vapor intrusion during packaging and is beneficial to improving the packaging effect.

[0125] Optionally, the first power line 130 may be used to connect to an ELVDD signal line.

[0126] Optionally, the orthographic projection of the fourth connecting segment 142 on the substrate 1 is a closed ring. That is, the fourth connecting segment 142 is a continuous ring body, and the fourth connecting segment 142 does not need to be provided with a port, which is conducive to improving the packaging effect.

[0127] Optionally, the fourth connecting segment 142 is disposed around the display area 110 .

[0128] Optionally, the orthographic projection of the fourth connecting segment 142 on the substrate 1 has the same shape as the orthographic projection of the dam 20 on the substrate 1 .

[0129] Optionally, the first connection segment 131 is located on a side of the fourth connection segment 142 away from the display area 110. For example, the first connection segment 131 may be located in the non-display area 120. For example, the first connection segment 131 may be located in the peripheral area 121.

[0130] Optionally, the second connecting segment 132 is located on a side of the fourth connecting segment 142 close to the display area 110 . Exemplarily, the second connecting segment 132 may be located within the display area 110 .

[0131] In this way, the first connecting section 131 and the second connecting section 132 can be prevented from being exposed before packaging, which is beneficial to improving the packaging effect.

[0132] Optionally, the first power line 130 and the second power line 140 are arranged in the same layer.

[0133] Optionally, the non-display area 120 includes a binding area, at least a portion of the third connection segment 141 is located between the binding area and the display area 110 , and the third connection segment 141 is connected to a pin of the binding area.

[0134] It is understandable that, since the fourth connecting segment 142 is a continuous annular body, the gap 160 passing through the packaging area 122 will not be formed. The fourth connecting segment 142 can be designed in a variety of ways according to specific circumstances and has a wide range of applications.

[0135] Optionally, an outer edge of the fourth connecting segment 142 away from the display area 110 is located on a side of the dam 20 away from the display area 110 , and an inner edge of the fourth connecting segment 142 close to the display area 110 is located on a side of the dam 20 close to the display area 110 .

[0136] For example, see Figure 3 and Figure 6 , the outer peripheral edge of the fourth connecting segment 142 may be located in the peripheral area 121, and the inner peripheral edge of the fourth connecting segment 142 may be located in the display area 110. In this way, the inner edge and the outer peripheral edge of the fourth connecting segment 142 are not in the packaging area 122. When the display panel 100 provided in the embodiment of the present application is etched before packaging, the fourth connecting segment 142 will not generate a side-etched structure, and will not generate a gap 160 for water vapor to pass through, thereby preventing water and oxygen from invading.

[0137] For example, see Fig.10 In some embodiments, the outer peripheral edge of the fourth connecting segment 142 is located in the peripheral area 121 , and the inner peripheral edge of the fourth connecting segment 142 is located in the packaging area 122 .

[0138] For example, see Fig.11 In some embodiments, the outer edge of the fourth connecting segment 142 is located in the packaging area 122 , and the inner edge of the fourth connecting segment 142 is located in the display area 110 .

[0139] For example, see Figure 6 , Figure 7 , Figure 8 and Fig. 9 The display panel 100 provided in the embodiment of the present application also includes a packaging groove 1221, the packaging groove 1221 includes a first side wall surface 1222 and a second side wall surface 1223, the first side wall surface 1222 is located on the side of the second side wall surface 1223 close to the peripheral area 121, the outer peripheral edge of the fourth connecting section 142 is located on the side of the first side wall surface 1222 away from the second side wall surface 1223, and the inner peripheral edge of the fourth connecting section 142 is located on the side of the second side wall surface 1223 away from the first side wall surface 1222.

[0140] For example, see Fig.12The outer peripheral edge of the fourth connecting section 142 is located on the side of the first side wall surface 1222 away from the second side wall surface 1223, the orthographic projection of the inner peripheral edge of the fourth connecting section 142 on the substrate 1 is located within the orthographic projection of the packaging groove 1221 on the substrate 1, and the inner peripheral edge of the fourth connecting section 142 is located between the first side wall surface 1222 and the second side wall surface 1223.

[0141] For example, see Fig.13 The orthographic projection of the outer edge of the fourth connecting section 142 on the substrate 1 is located within the orthographic projection of the packaging groove 1221 on the substrate 1, the inner edge of the fourth connecting section 142 is located on the side of the second side wall surface 1223 away from the first side wall surface 1222, and the outer edge of the fourth connecting section 142 is located between the first side wall surface 1222 and the second side wall surface 1223.

[0142] In this way, at least one of the inner peripheral edge and the outer peripheral edge of the fourth connecting segment 142 is not within the packaging groove 1221 of the packaging area 122. Even if there is a side engraving in the portion of the fourth connecting segment 142 within the packaging groove 1221, after packaging, the gap 160 formed by the side engraving will not pass through the packaging area 122 and will not cause water vapor intrusion.

[0143] Optionally, at least a portion of the dam 20 is located within the packaging groove 1221 .

[0144] See also Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 In some embodiments, the display panel 100 provided in the embodiment of the present application further includes a first inorganic encapsulation layer 191, an organic encapsulation layer 192, and a second inorganic encapsulation layer 193 which are stacked in sequence along a direction away from the substrate 1, the organic encapsulation layer 192 is located on a side of the dam 20 close to the display area 110, the first inorganic encapsulation layer 191 and the second inorganic encapsulation layer 193 are located on a side of the dam 20 away from the substrate 1, and the orthographic projection of the contact area of ​​the first inorganic encapsulation layer 191 and the second inorganic encapsulation layer 193 on the substrate 1 overlaps with the orthographic projection of the dam 20 on the substrate 1.

[0145] Optionally, an orthographic projection of a contact area between the first inorganic encapsulation layer 191 and the second power line 140 on the substrate 1 overlaps with an orthographic projection of the encapsulation groove 1221 on the substrate 1 .

[0146] Optionally, at least part of the overlapping area between the orthographic projection of the contact area between the first inorganic encapsulation layer 191 and the second power line 140 on the substrate 1 and the orthographic projection of the encapsulation groove 1221 on the substrate 1 is located on the side of the orthographic projection of the dam 20 on the substrate 1 away from the display area 110 .

[0147] Optionally, at least part of the overlapping area of ​​the orthographic projection of the contact area between the first inorganic encapsulation layer 191 and the second power line 140 on the substrate 1 and the orthographic projection of the encapsulation groove 1221 on the substrate 1 is located on the side of the orthographic projection of the dam 20 on the substrate 1 close to the display area 110 .

[0148] Optional, see Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 There are at least two dams 20, and at least part of the overlapping area between the orthographic projection of the contact area of ​​the first inorganic encapsulation layer 191 and the second power line 140 on the substrate 1 and the orthographic projection of the encapsulation groove 1221 on the substrate 1 is located between the orthographic projections of adjacent dams 20 arranged at intervals on the substrate 1.

[0149] Optionally, the dam 20 includes a first dam 21 and a second dam 22, the second dam 22 is located on a side of the first dam 21 away from the display area 110, and the encapsulation groove 1221 includes a first groove located between the first dam 21 and the second dam 22; the orthographic projection of the contact area between the first inorganic encapsulation layer 191 and the second power line 140 on the substrate 1 overlaps with the orthographic projection of the first groove on the substrate 1.

[0150] Optionally, the encapsulation groove 1221 includes a second groove located on a side of the first dam 21 close to the display area 110 and adjacent to the first dam 21, and the orthographic projection of the contact area between the first inorganic encapsulation layer 191 and the second power line 140 on the substrate 1 overlaps with the orthographic projection of the second groove on the substrate 1;

[0151] Optionally, the encapsulation groove 1221 includes a third groove located on the side of the second dam 22 away from the display area 110 and adjacent to the second dam 22, and the orthographic projection of the contact area between the first inorganic encapsulation layer 191 and the second power line 140 on the substrate 1 overlaps with the orthographic projection of the third groove on the substrate 1.

[0152] Optionally, the first side wall surface 1222 is a side wall surface of the third groove away from the display area 110 ; and the second side wall surface 1223 is a side wall surface of the second groove close to the display area 110 .

[0153] In some embodiments, see Figure 5 The display panel 100 provided by the present application further includes a light-emitting device layer 10, which is located between the film layer where the first power line 130 and / or the second power line 140 are located and the first inorganic encapsulation layer 191. The light-emitting device layer 10 includes a first electrode layer 101, a light-emitting layer 102, and a second electrode layer 103, which are sequentially stacked in a direction away from the substrate 1, and the second electrode layer 103 is electrically connected to the second power line 140.

[0154] Optionally, the display panel 100 further includes a pixel circuit, the film layer where the pixel circuit is located is located between the light-emitting device layer 10 and the substrate 1 , the pixel circuit is electrically connected to the first power line 130 , and the pixel circuit is electrically connected to the first electrode layer 101 .

[0155] Optionally, the first electrode layer 101 may include a plurality of first electrodes. Optionally, the second electrode layer 103 may include a plurality of second electrodes. Optionally, the second electrode layer 103 may be a second electrode that is evaporated on the entire surface.

[0156] Optionally, the first electrode may be an anode and the second electrode may be a cathode.

[0157] Optionally, the light-emitting layer 102 may include a plurality of light-emitting units that emit light of different colors. For example, the light-emitting layer 102 includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit that emit light of different colors.

[0158] In some embodiments, the display panel 100 provided by the present application further includes a transistor, and the bridge line 170 is disposed in the same layer as the gate of the transistor.

[0159] Optionally, the display panel 100 further includes a storage capacitor, and the bridge line 170 is disposed on the same layer as the capacitor plate of the storage capacitor.

[0160] Optionally, the display panel 100 further includes a first transistor and a second transistor having different channel types, wherein the bridge line 170 is disposed at the same layer as the gate of the first transistor, or the bridge line 170 is disposed at the same layer as the gate of the second transistor.

[0161] Optionally, the film layer where the channel of the second transistor is located is located on the side of the film layer where the channel of the first transistor is located away from the substrate 1; the second transistor includes a first gate and a second gate which are stacked in sequence in a direction away from the substrate 1 and are located on both sides of the channel of the second transistor, and the bridge line 170 is arranged on the same layer as the first gate or the second gate of the second transistor.

[0162] Optionally, the material of the bridge line 170 includes molybdenum metal.

[0163] Optionally, the second power line 140 includes a fourth sub-conductive layer, a fifth sub-conductive layer and a sixth sub-conductive layer stacked in sequence along the thickness direction of the substrate 1, and the etching resistance of the material of the fifth sub-conductive layer is lower than that of the materials of the fourth sub-conductive layer and the sixth sub-conductive layer.

[0164] Optionally, the second power line 140 includes a titanium metal layer, an aluminum metal layer and a titanium metal layer which are sequentially stacked along the thickness direction of the substrate 1 .

[0165] Optionally, one of the first power line 130 and the second power line 140 is used to transmit a high voltage, and the other is used to transmit a low voltage.

[0166] For example, the first power line 130 may be a voltage drain drain (VDD) line, and the second power line 140 may be a voltage source supply (VSS) line.

[0167] In some embodiments, please refer to Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 The display panel 100 provided in the embodiment of the present application also includes a driving device layer, which includes a first active layer 12 (Polysilicon, PSI), a first conductive layer 13 (M1), a second conductive layer 14 (M2), a second active layer 15 (Indium Gallium Zinc Oxide, IGZO), a third conductive layer 16 (M3), a fourth conductive layer 17 (M4) and a fifth conductive layer 18 (M5) which are sequentially stacked and insulated from each other in a direction away from the substrate 1, a first power line 130 and a second power line 140 are located in the fifth conductive layer 18, and a bridge line 170 is located in one of the first conductive layer 13, the second conductive layer 14 and the third conductive layer 16.

[0168] For example, see Figure 7 , the bridge line 170 may be located on the third conductive layer 16 .

[0169] For example, see Figure 8 , the bridge line 170 may be located on the first conductive layer 13 .

[0170] For example, see Fig. 9 , the bridge line 170 may be located on the second conductive layer 14 .

[0171] It can be understood that the display panel 100 provided in the embodiment of the present application can use the conductive layer of the driving device layer as the first power line 130, the second power line 140, and the bridge line 170, which is conducive to simplifying the processing technology.

[0172] Optionally, see Figure 4 and Figure 5The display panel 100 provided in the embodiment of the present application also includes a plurality of insulating film layers, which include a first gate dielectric layer 2 (Gate Insulator 1, GL1), a capacitor dielectric layer 3 (CI), a buffer layer 4 (Buffer), a second gate dielectric layer 5 (Gate Insulator 1, GL2), an interlayer dielectric layer 6 (Inter Layer Dielectric, ILD), a first planarization layer 7 (Planarization 1, PLN1), a second planarization layer 8 (Planarization2, PLN2), and a pixel definition layer 9 (PDL) which are sequentially arranged in a direction away from the substrate 1.

[0173] Among them, the first conductive layer 13 is arranged between the first gate dielectric layer and the capacitor dielectric layer 3, the second conductive layer 14 is arranged between the capacitor dielectric layer 3 and the buffer layer 4, the third conductive layer 16 is arranged between the second gate dielectric layer 5 and the interlayer dielectric layer 6, the fourth conductive layer 17 is arranged between the interlayer dielectric layer 6 and the first planarizing layer 7, and the fifth conductive layer 18 is arranged between the first planarizing layer 7 and the second planarizing layer 8.

[0174] In addition, the first active layer 12 is disposed between the substrate 1 and the first gate dielectric layer 2, the second active layer 15 is disposed between the buffer layer 4 and the second gate dielectric layer 5, the first electrode layer 101 is disposed between the second planar layer 8 and the pixel definition layer 9, and the pixel definition layer 9 is provided with a pixel opening exposing a portion of the first electrode layer 101. In addition, the substrate 1 is provided with a bottom light shielding layer 11 opposite to the first active layer 12.

[0175] The embodiment of the present application also provides another display panel 100, which also has a display area 110 and a non-display area 120. The display panel 100 includes a substrate 1, a dam 20 and a second power line 140. The dam 20 is located on the substrate 1 and in the non-display area 120; the second power line 140 is located between the dam 20 and the substrate 1, and the second power line 140 includes a fourth connecting segment 142, which extends along the edge of the display area 110.

[0176] In this way, the fourth connecting segment 142 extends along the edge of the display area 110 for a circle, which is beneficial to avoid the formation of a channel for water vapor to invade during packaging, and is beneficial to improving the packaging effect.

[0177] In some embodiments, the second power line 140 also includes a third connecting segment 141; the third connecting segment 141 is connected to the fourth connecting segment 142, and the third connecting segment 141 is located on the side of the fourth connecting segment 142 away from the display area 110, and the third connecting segment 141 is located on the side of the dam 20 away from the display area 110.

[0178] In some embodiments, the display panel 100 provided in the embodiments of the present application also includes a first power line 130, which is located on the substrate 1. The first power line 130 includes a first connecting segment 131 and a second connecting segment 132 that are spaced apart. The first connecting segment 131 is located on a side of the dam 20 away from the display area 110, and the second connecting segment 132 is located on a side of the dam 20 close to the display area 110.

[0179] This embodiment can be combined with some or all of the features of the above embodiments, which will not be described in detail here.

[0180] It can be understood that the structure of the display panel 100 provided in the embodiment of the present application is the same as the structure of the first display surface described above, and will not be described in detail here.

[0181] Figure 3 , Figure 6 , Fig.10 , Fig.11 In the figure, the two annular black dotted lines may be the inner and outer boundaries of the packaging area, or the two annular black dotted lines may be the first side wall surface 1222 and the second side wall surface 1223 of the packaging groove; the two annular gray dotted lines may be the inner and outer boundaries of the fourth connecting section 142.

[0182] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

[0183] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display panel, characterized in that: The display panel has a display area and a non-display area, and includes: substrate; A dam, located on the substrate and in the non-display area; a first power line, located on the substrate, the first power line comprising a first connecting section and a second connecting section arranged at intervals, the first connecting section being located on a side of the dam away from the display area, and the second connecting section being located on a side of the dam close to the display area; A bridge line is located between at least a portion of the dam and the substrate, and the bridge line is electrically connected to the first connecting segment and the second connecting segment respectively.

2. The display panel according to claim 1, wherein: The first connecting section and the bridge wire are arranged in different layers, and / or the second connecting section and the bridge wire are arranged in different layers, The bridge wire is connected to the first connection section through a first via hole, and the bridge wire is connected to the second connection section through a second via hole; Optionally, the thickness of the bridge line along the thickness direction of the substrate is smaller than the thickness of the first connecting section along the thickness direction of the substrate; and / or, the thickness of the bridge line along the thickness direction of the substrate is smaller than the thickness of the second connecting section along the thickness direction of the substrate; Optionally, the non-display area includes a binding area, at least a portion of the first connecting segment is located between the binding area and the display area, and the first connecting segment is connected to a pin of the binding area; Optionally, the first power line includes a first sub-conductive layer, a second sub-conductive layer and a third sub-conductive layer which are sequentially stacked along the thickness direction of the substrate, and the etching resistance of the material of the second sub-conductive layer is lower than that of the materials of the first sub-conductive layer and the third sub-conductive layer; Optionally, the first power line includes a titanium metal layer, an aluminum metal layer and a titanium metal layer which are sequentially stacked along the thickness direction of the substrate.

3. The display panel according to claim 1 or 2, characterized in that: Also comprising a second power line, the orthographic projection of the second power line on the substrate overlaps with the orthographic projection of the bridge line on the substrate, and the bridge line is located between the second power line and the substrate; Optionally, the bridge wire and the second power line are insulated; Optionally, an orthographic projection of the second power line on the substrate overlaps with an orthographic projection of the dam on the substrate.

4. The display panel according to claim 3, wherein: The second power line is located between the dam and the substrate, The second power line includes a third connecting section and a fourth connecting section, the third connecting section is located at a side of the fourth connecting section away from the display area, the third connecting section is located at a side of the dam away from the display area, the fourth connecting section extends along an edge of the display area, the third connecting section is connected to the fourth connecting section, and an orthographic projection of the fourth connecting section on the substrate overlaps with an orthographic projection of the bridge line on the substrate; The orthographic projection of the fourth connecting segment on the substrate overlaps with the orthographic projection of the dam on the substrate; Optionally, the orthographic projection of the fourth connecting segment on the substrate is a closed ring; Optionally, the fourth connecting segment is arranged around the display area; Optionally, the orthographic projection of the fourth connecting segment on the substrate is the same as the orthographic projection of the dam on the substrate; Optionally, the first connecting segment is located on a side of the fourth connecting segment away from the display area; The second connecting segment is located at a side of the fourth connecting segment close to the display area; Optionally, the first power line and the second power line are arranged on the same layer; Optionally, the non-display area includes a binding area, at least a portion of the third connecting segment is located between the binding area and the display area, and the third connecting segment is connected to a pin of the binding area.

5. The display panel according to claim 4, wherein: The outer edge of the fourth connecting segment away from the display area is located on the side of the dam away from the display area, and the inner edge of the fourth connecting segment close to the display area is located on the side of the dam close to the display area; Alternatively, the display panel further comprises a packaging groove, the packaging groove comprises a first side wall surface and a second side wall surface, the first side wall surface is located on a side of the second side wall surface away from the display area, the outer peripheral edge of the fourth connecting segment is located on a side of the first side wall surface away from the second side wall surface, and the inner peripheral edge of the fourth connecting segment is located on a side of the second side wall surface away from the first side wall surface; Alternatively, the outer peripheral edge of the fourth connecting segment is located on a side of the first side wall surface away from the second side wall surface, the orthographic projection of the inner peripheral edge of the fourth connecting segment on the substrate is located within the orthographic projection of the packaging groove on the substrate, and the inner peripheral edge of the fourth connecting segment is located between the first side wall surface and the second side wall surface; Alternatively, the orthographic projection of the outer peripheral edge of the fourth connecting section on the substrate is located within the orthographic projection of the packaging groove on the substrate, the inner peripheral edge of the fourth connecting section is located on the side of the second side wall surface away from the first side wall surface, and the outer peripheral edge of the fourth connecting section is located between the first side wall surface and the second side wall surface; Optionally, at least part of the dam is located within the packaging groove; Optionally, the display panel further comprises a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer which are sequentially stacked in a direction away from the substrate, the organic encapsulation layer is located on a side of the dam close to the display area, the first inorganic encapsulation layer and the second inorganic encapsulation layer are located on a side of the dam away from the substrate, and an orthographic projection of a contact area between the first inorganic encapsulation layer and the second inorganic encapsulation layer on the substrate overlaps with an orthographic projection of the dam on the substrate; Optionally, an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the encapsulation groove on the substrate; Optionally, at least part of an overlapping area of ​​an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate and an orthographic projection of the encapsulation groove on the substrate is located on a side of the orthographic projection of the dam on the substrate away from the display area; And / or, at least part of the overlapping area of ​​the orthographic projection of the contact area between the first inorganic encapsulation layer and the second power line on the substrate and the orthographic projection of the encapsulation groove on the substrate is located on a side of the orthographic projection of the dam on the substrate close to the display area; And / or, there are at least two dams, and at least part of the overlapping area between the orthographic projection of the contact area between the first inorganic encapsulation layer and the second power line on the substrate and the orthographic projection of the encapsulation groove on the substrate is located between the orthographic projections of adjacent dams arranged at intervals on the substrate; Optionally, the dam includes a first dam and a second dam, the second dam is located on a side of the first dam away from the display area, the encapsulation groove includes a first groove located between the first dam and the second dam; an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the first groove on the substrate; And / or, the encapsulation groove includes a second groove located on a side of the first dam close to the display area and adjacent to the first dam, and an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the second groove on the substrate; And / or, the encapsulation groove includes a third groove located on a side of the second dam away from the display area and adjacent to the second dam, and an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the third groove on the substrate; Optionally, the first side wall surface is a side wall surface of the third groove away from the display area; The second side wall surface is a side wall surface of the second groove close to the display area; Optionally, the display panel further includes a light emitting device layer located between the film layer where the first power line and / or the second power line is located and the first inorganic encapsulation layer; The light emitting device layer includes a first electrode layer, a light emitting layer, and a second electrode layer which are sequentially stacked in a direction away from the substrate, wherein the second electrode layer is electrically connected to the second power line. Optionally, the display panel further includes a pixel circuit, wherein the film layer where the pixel circuit is located is located between the light-emitting device layer and the substrate, the pixel circuit is electrically connected to the first power line, and the pixel circuit is electrically connected to the first electrode layer.

6. The display panel according to claim 3, wherein: The display panel further comprises a transistor, and the bridge wire is arranged at the same layer as the gate of the transistor; Alternatively, the display panel further comprises a storage capacitor, and the bridge wire is arranged in the same layer as a capacitor plate of the storage capacitor; Alternatively, the display panel further comprises a first transistor and a second transistor having different channel types, and the bridge wire is disposed at the same layer as the gate of the first transistor; or the bridge wire is disposed at the same layer as the gate of the second transistor; Optionally, the film layer where the channel of the second transistor is located is located on a side of the film layer where the channel of the first transistor is located away from the substrate; the second transistor includes a first gate and a second gate which are sequentially stacked in a direction away from the substrate and located on both sides of the channel of the second transistor, and the bridge wire is arranged in the same layer as the first gate or the second gate of the second transistor; Optionally, the material of the bridge wire includes molybdenum metal; Optionally, the second power line includes a fourth sub-conductive layer, a fifth sub-conductive layer and a sixth sub-conductive layer which are sequentially stacked in a thickness direction of the substrate, and the etching resistance of the material of the fifth sub-conductive layer is lower than that of the materials of the fourth sub-conductive layer and the sixth sub-conductive layer; Optionally, the second power line comprises a titanium metal layer, an aluminum metal layer and a titanium metal layer which are sequentially stacked along the thickness direction of the substrate; Optionally, one of the first power line and the second power line is used to transmit a high voltage, and the other is used to transmit a low voltage; Optionally, the display panel also includes a driving device layer, which includes a first active layer, a first conductive layer, a second conductive layer, a second active layer, a third conductive layer, a fourth conductive layer and a fifth conductive layer which are stacked in sequence and insulated from each other in a direction away from the substrate, the first power line and the second power line are located in the fifth conductive layer, and the bridging line is located in one of the first conductive layer, the second conductive layer and the third conductive layer.

7. A display panel, characterized in that: The display panel has a display area and a non-display area, and includes: substrate; A dam, located on the substrate and in the non-display area; The second power line is located between the dam and the substrate, and the second power line includes a fourth connecting segment, and the fourth connecting segment extends along the edge of the display area.

8. The display panel according to claim 7, wherein: The second power line further includes a third connecting section; the third connecting section is connected to the fourth connecting section, the third connecting section is located on a side of the fourth connecting section away from the display area, and the third connecting section is located on a side of the dam away from the display area. Optionally, an orthographic projection of the fourth connecting segment on the substrate overlaps with an orthographic projection of the dam on the substrate; Optionally, the orthographic projection of the fourth connecting segment on the substrate is a closed ring; Optionally, the fourth connecting segment is arranged around the display area; Optionally, the orthographic projection of the fourth connecting segment on the substrate is the same as the orthographic projection of the dam on the substrate; Optionally, the non-display area includes a binding area, the third connecting segment is located between the binding area and the display area, and the third connecting segment is connected to a pin of the binding area; The outer edge of the fourth connecting segment away from the display area is located on the side of the dam away from the display area, and the inner edge of the fourth connecting segment close to the display area is located on the side of the dam close to the display area; Alternatively, the display panel further comprises a packaging groove, the packaging groove comprises a first side wall surface and a second side wall surface, the first side wall surface is located on a side of the second side wall surface away from the display area, the outer peripheral edge of the fourth connecting segment is located on a side of the first side wall surface away from the second side wall surface, and the inner peripheral edge of the fourth connecting segment is located on a side of the second side wall surface away from the first side wall surface; Alternatively, the outer peripheral edge of the fourth connecting segment is located on a side of the first side wall surface away from the second side wall surface, and the orthographic projection of the inner peripheral edge of the fourth connecting segment on the substrate is located within the orthographic projection of the packaging groove on the substrate; the inner peripheral edge of the fourth connecting segment is located between the first side wall surface and the second side wall surface, Alternatively, the orthographic projection of the outer peripheral edge of the fourth connecting segment on the substrate is located within the orthographic projection of the packaging groove on the substrate, and the inner peripheral edge of the fourth connecting segment is located on the side of the second side wall surface away from the first side wall surface; the outer peripheral edge of the fourth connecting segment is located between the first side wall surface and the second side wall surface, Optionally, at least part of the dam is located within the packaging groove; Optionally, the display panel further comprises a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer which are sequentially stacked in a direction away from the substrate, the organic encapsulation layer is located on a side of the dam close to the display area, the first inorganic encapsulation layer and the second inorganic encapsulation layer are located on a side of the dam away from the substrate, and an orthographic projection of a contact area between the first inorganic encapsulation layer and the second inorganic encapsulation layer on the substrate overlaps with an orthographic projection of the dam on the substrate; Optionally, an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the encapsulation groove on the substrate; Optionally, at least part of an overlapping area of ​​an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate and an orthographic projection of the encapsulation groove on the substrate is located on a side of the orthographic projection of the dam on the substrate away from the display area; And / or, at least part of the overlapping area of ​​the orthographic projection of the contact area between the first inorganic encapsulation layer and the second power line on the substrate and the orthographic projection of the encapsulation groove on the substrate is located on a side of the orthographic projection of the dam on the substrate close to the display area; And / or, there are at least two dams, and at least part of the overlapping area between the orthographic projection of the contact area between the first inorganic encapsulation layer and the second power line on the substrate and the orthographic projection of the encapsulation groove on the substrate is located between the orthographic projections of adjacent dams arranged at intervals on the substrate; Optionally, the dam includes a first dam and a second dam, the second dam is located on a side of the first dam away from the display area, the encapsulation groove includes a first groove located between the first dam and the second dam; an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the first groove on the substrate; And / or, the encapsulation groove includes a second groove located on a side of the first dam close to the display area and adjacent to the first dam, and an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the second groove on the substrate; And / or, the encapsulation groove includes a third groove located on a side of the second dam away from the display area and adjacent to the second dam, and an orthographic projection of a contact area between the first inorganic encapsulation layer and the second power line on the substrate overlaps with an orthographic projection of the third groove on the substrate; Optionally, the first side wall surface is a side wall surface of the third groove away from the display area; The second side wall surface is a side wall surface of the second groove close to the display area.

9. The display panel according to claim 8, wherein: The display panel further comprises a first power line located on the substrate, the first power line comprising a first connecting section and a second connecting section arranged at intervals, the first connecting section being located on a side of the dam away from the display area, and the second connecting section being located on a side of the dam close to the display area; Optionally, the display panel further includes a light-emitting device layer, and the light-emitting device layer is located between the film layer where the first power line and / or the second power line are located and the first inorganic encapsulation layer; The light emitting device layer comprises a first electrode layer, a light emitting layer, and a second electrode layer which are sequentially stacked in a direction away from the substrate, and the second electrode layer is electrically connected to the second power line; Optionally, the display panel further includes a pixel circuit, the film layer where the pixel circuit is located is located between the light-emitting device layer and the substrate, the pixel circuit is electrically connected to the first power line, and the pixel circuit is electrically connected to the first electrode layer; Optionally, the first connecting segment is located on a side of the fourth connecting segment away from the display area; The second connecting segment is located at a side of the fourth connecting segment close to the display area; Optionally, the first power line and the second power line are arranged in the same layer.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 9.

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