Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel includes: a substrate; the functional layer is arranged on one side of the substrate, and the functional layer comprises a driving module; the second metal layer is located on the side, away from the substrate, of the functional layer, and the second metal layer comprises at least one first signal line; wherein the at least two driving modules are located between orthographic projections of the adjacent first signal lines on the substrate; the functional layer comprises mark structures, the mark structures are arranged corresponding to the driving modules, and the mark structures corresponding to the adjacent driving modules have different mark states. By adopting the display panel, the productivity waste in the repair process of the display panel can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Display panels are usually equipped with multiple layers of wiring. To avoid abnormal operation of the subsequent panel, foreign object detection is required after each layer of wiring is laid. Usually, taking the metal layer wiring as an example, the signal line where the foreign object is detected needs to be cut off for repair.

[0003] However, there may be some target positions where panel operation will not be affected even if cutting and repairing is not performed, and cutting and repairing may affect the function of the entire layer of signal lines. However, the relevant technology cannot determine which are the target positions, resulting in excessive repair and waste of production capacity. Summary of the invention

[0004] Based on this, it is necessary to provide a display panel and a display device that can reduce the waste of production capacity during the display panel repair process in order to solve the above technical problems.

[0005] In a first aspect, the present application provides a display panel, the display panel comprising:

[0006] substrate;

[0007] A functional layer is disposed on one side of the substrate, and the functional layer includes a driving module;

[0008] A second metal layer is located on a side of the functional layer away from the substrate, wherein the second metal layer includes at least one first signal line; wherein at least two driving modules are located between orthographic projections of adjacent first signal lines on the substrate;

[0009] The functional layer includes a marking structure, which is arranged corresponding to the driving module, and the marking structures corresponding to adjacent driving modules have different marking states.

[0010] In one embodiment, the marking state includes a marking body and a marking position of the marking body relative to the driving module in a reference direction; the marking state of the marking structure corresponding to the adjacent driving module is at least one of the following:

[0011] The shape and size of the marker body are the same, and in the reference direction, the layout angles of the marker body and the adjacent driving modules are different;

[0012] The shape of the marking bodies is the same. In the reference direction, the relative position of any marking body and the corresponding driving module is consistent, and the sizes of the marking bodies corresponding to adjacent driving modules are different.

[0013] The marking bodies have the same size. In the reference direction, the relative positions of any marking body and the corresponding driving module are consistent, and the marking bodies corresponding to adjacent driving modules have different shapes.

[0014] In one embodiment, the functional layer includes a semiconductor layer located on one side of the substrate and a first metal layer located on a side of the semiconductor layer facing away from the substrate;

[0015] The second metal layer is located on a side of the first metal layer away from the semiconductor layer, and the marking structure is located on the first metal layer;

[0016] The orthographic projections of the marking structures corresponding to the adjacent driving modules on the substrate have different marking states respectively;

[0017] Preferably, the first metal layer includes an upper plate of a capacitor, and the second metal layer includes at least one of a source structure and a drain structure;

[0018] Preferably, the first metal layer includes at least one of a lower plate and a gate structure of the capacitor, and the second metal layer includes at least one of a source structure and a drain structure.

[0019] In one embodiment, the functional layer includes a semiconductor layer located on one side of the substrate and a first metal layer located on a side of the semiconductor layer away from the substrate; the second metal layer is located on a side of the first metal layer away from the semiconductor layer, and the marking structure is located in the semiconductor layer.

[0020] In one embodiment, the display panel also includes a plurality of light-emitting units located on the side of the second metal layer facing away from the substrate, and any light-emitting unit is electrically connected to a driving circuit, and the driving circuit includes a driving transistor and at least one switching transistor; wherein the driving module is a driving transistor, a switching transistor, or a combination of a driving transistor and a switching transistor in the same driving circuit.

[0021] In one embodiment, the marking structure is located in a semiconductor layer, and the semiconductor layer also includes a channel region of a driving module; preferably, the marking structure is a channel region of a driving transistor, and in a reference direction, adjacent driving transistor channel regions have different shapes and the same size; preferably, the first signal line is arranged along a first direction and extends along a second direction, and the channel regions of adjacent driving modules respectively have a first protrusion and a second protrusion, and the protruding direction of the first protrusion is opposite to the protruding direction of the second protrusion.

[0022] In a second aspect, the present application further provides a display panel. The display panel includes:

[0023] substrate;

[0024] The semiconductor layer comprises a first channel region and a second channel region arranged along a first direction, wherein the first channel region and the second channel region are arranged at an interval;

[0025] A second metal layer includes a plurality of first signal lines, wherein the first signal lines extend along a first direction and are arranged along a second direction;

[0026] Adjacent first signal lines include adjacently arranged first channel regions and second channel regions between orthographic projections of the semiconductor layer;

[0027] The first channel region and the second channel region have different shapes.

[0028] In one embodiment, the display panel further includes: a first metal layer located on the side of the semiconductor layer facing away from the substrate; adjacent first signal lines include adjacently arranged driving modules between the orthographic projections of the first metal layer; wherein the driving modules are arranged corresponding to the marking structures, and the marking structures corresponding to the adjacently arranged driving modules have different marking states.

[0029] In one embodiment, the different morphologies of the first channel region and the second channel region refer to at least one of the following: the first channel region and the second channel region have different shapes; the first channel region and the second channel region have different sizes; the first channel region and the second channel region have different layout angles.

[0030] In a third aspect, the present application further provides a display device, comprising a display panel as described in any one of the first and second aspects above.

[0031] The above-mentioned display panel and display device, the display panel includes a substrate, a functional layer including a driving module arranged on one side of the substrate, and a second metal layer located on the side of the functional layer away from the substrate. Among them, the second metal layer includes at least one first signal line; at least two driving modules are located between the orthographic projections of adjacent first signal lines on the substrate; the functional layer includes a marking structure arranged corresponding to the driving module, and the marking structures corresponding to adjacent driving modules have different marking states. In this way, by setting different marking states for the marking structures corresponding to adjacent driving modules, the place that needs to be repaired in the functional layer can be located based on the marking state, and the state that needs to be repaired in the functional layer can be repaired based on the marking state, so that accurate repair can be performed without affecting the function of the display panel, thereby avoiding waste of production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 is a schematic cross-sectional view of a display panel in one embodiment;

[0034] Figure 2 A schematic diagram of the layout of the M2 layer and the M3 layer in one embodiment;

[0035] Figure 3 is a cross-sectional schematic diagram of another display panel in one embodiment;

[0036] Figure 4 is a cross-sectional schematic diagram of another display panel in one embodiment;

[0037] Figure 5 FIG. 1 is a schematic diagram of the layout of channel regions of adjacent driving modules in an embodiment.

[0038] Reference numerals:

[0039] Substrate 1; functional layer 2; second metal layer 3; semiconductor layer 21; first metal layer 22;

[0040] A first intermediate metal layer 221 ; and a second intermediate metal layer 222 . DETAILED DESCRIPTION

[0041] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It should be understood that many specific details are set forth in the following description to facilitate a full understanding of the present application, but the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0043] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0044] In this document, spatially related terms such as "upper" and "lower" are defined with reference to the accompanying drawings. Therefore, it will be understood that "upper" and "lower" are used interchangeably. It will be understood that when a layer is referred to as being "on" another layer, it can be directly formed on the other layer, or intervening layers may also be present. Therefore, it will be understood that when a layer is referred to as being "directly on" another layer, there are no intervening layers interposed therebetween.

[0045] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as being "on" another layer or substrate, the layer or element may be directly on the other layer or substrate, or there may be an intermediate layer. In addition, it is also understood that when a layer is referred to as being "between" two layers, the layer may be the only layer between the two layers, or there may be one or more intermediate layers. In addition, the same reference numerals always represent the same elements.

[0046] Hereinafter, although terms such as "first", "second", etc. may be used to describe various components, these components are not necessarily limited to the above terms. The above terms are only used to distinguish one component from another component. It will also be understood that expressions used in the singular form include plural expressions, unless the expression in the singular form has a significantly different meaning in the context. In addition, in the following embodiments, it will also be understood that the terms "comprising" and / or "having" used herein illustrate the presence of the stated features or components, but do not exclude the presence or addition of one or more other features or components.

[0047] In the following embodiments, when a layer, region, or element is "connected", it can be interpreted that the layer, region, or element is not only directly connected but also connected through other constituent elements placed therebetween. For example, when a layer, region, element, etc. is described as being connected or electrically connected, the layer, region, element, etc. can be connected or electrically connected not only directly or directly, but also through another layer, region, element, etc. placed therebetween.

[0048] It should also be understood that the terms “include / comprises” or “having” and the like specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0049] Furthermore, in the specification, the phrase “planar distribution schematic diagram” refers to a drawing when a target portion is viewed from above, and the phrase “cross-sectional schematic diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.

[0050] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0051] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately", "approximately" or "substantially" can mean within one or more standard deviations, which are not limited here.

[0052] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0053] Display panels are usually equipped with multiple layers of wiring. To avoid abnormal operation of the subsequent panel, foreign object detection is required after each layer of wiring is laid. Usually, taking the metal layer wiring as an example, the signal line where the foreign object is detected needs to be cut off for repair.

[0054] However, there may be some target positions where panel operation will not be affected even if cutting and repairing is not performed, and cutting and repairing may affect the function of the entire layer of signal lines. However, the relevant technology cannot determine which are the target positions, resulting in excessive repair and waste of production capacity.

[0055] In view of this, an embodiment of the present application provides a display panel that can effectively reduce production capacity waste during foreign matter detection and repair of the display panel.

[0056] In one embodiment, Figure 1 A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application is shown, and the display panel provided in an embodiment of the present application includes a substrate 1, a functional layer 2 and a second metal layer 3. The functional layer is arranged on one side of the substrate 1; the second metal layer 3 is located on the side of the functional layer 2 away from the substrate 1.

[0057] The functional layer 2 includes a driving module, and the second metal layer 3 includes at least one first signal line; and at least two driving modules are located between orthographic projections of adjacent first signal lines on the substrate 1 .

[0058] The functional layer 2 includes a marking structure, which is arranged corresponding to the driving module, and the marking structures corresponding to adjacent driving modules have different marking states.

[0059] Optionally, the functional layer 2 also includes at least one wiring. The signal line distribution layout of each layer can be designed in advance, so that each layer can be prepared according to the layout of each layer.

[0060] Among them, the functional layer 2 includes the target metal layer, and the second metal layer 3 is located on one side of the target metal layer, and there is no intermediate layer between the target metal layer and the second metal layer 3. Therefore, it can be seen that if there is foreign matter between the overlapping metal traces of the second metal layer 3 and the target metal layer, foreign matter repair is required.

[0061] Therefore, in an embodiment of the present application, a marking structure is designed in the functional layer 2 so that when foreign matter detection is performed on the target metal layer, the area in the target metal layer where foreign matter detection needs to be performed is determined according to the marking structure of the functional layer 2.

[0062] In an optional implementation, taking the display panel in the AMOLED display structure as an example, the metal layer in the display panel includes an M1 layer, an M2 layer and an M3 layer. Among them, the M1 layer includes at least one of the lower plate and the gate structure of the capacitor, and the gate structure refers to the gate of the TFT (Thin Film Transistor). The M2 layer includes the upper plate of the capacitor. The M3 layer includes at least one of the source structure and the drain structure, and the M3 layer can be connected to the anode and the external circuit; similarly, the source structure and the drain structure are the source and drain of the TFT.

[0063] The M1 layer is located on a side of the semiconductor layer away from the substrate 1 , the M2 layer is located on a side of the M1 layer away from the semiconductor layer, and the M3 layer is located on a side of the M2 layer away from the M1 layer.

[0064] Since the intermediate insulating layer between the M2 layer and the M3 layer is relatively thin, the preparation of the M2 layer requires foreign body detection and repair to prevent foreign bodies from puncturing the insulating layer and causing a short circuit between the M2 layer and the M3 layer. Therefore, in the embodiment of the present application, the M3 layer can be used as the second metal layer 3, and correspondingly, the M2 layer can be used as the target metal layer.

[0065] Optionally, other layers may be further formed on the side of the second metal layer 3 facing away from the functional layer 2 , which are not fully illustrated here.

[0066] The functional layer 2 includes a driving module in the display panel. Exemplarily, the driving module acts on the display unit in the display panel during operation. For example, the driving module acts on the light-emitting unit in the display panel during light emission.

[0067] Optionally, the functional layer 2 is composed of multiple layers such as an active layer, a gate insulating layer, etc. Different layers are provided with different structures of the driving module, thereby forming a driving module.

[0068] Optionally, in addition to the driver module, other wirings are also provided in the functional layer 2, which are not fully illustrated here.

[0069] The second metal layer 3 includes at least one first signal line.

[0070] In an optional implementation, the first signal line is connected to the anode of the light-emitting unit and is used to reset the anode to eliminate the residual voltage of the previous display. Exemplarily, the first signal line is a ref signal line. The Ref signal line is an important line in the display panel for providing a reference voltage or a reference current.

[0071] In an optional implementation, in addition to the first signal line, the second metal layer 3 also includes other metal wirings. For example, the second metal layer 3 may include at least one second signal line, which is connected to the driving module and is used to provide a data signal to the driving module so that the driving module works according to the data signal; exemplarily, the second signal line is a data line. For another example, the second metal layer 3 may include at least one power line, i.e., a vdd signal line. For example, Figure 2 The schematic diagram of the layout of the M2 layer and the M3 layer is shown as an example, and the distribution positions of the ref signal line, the vdd signal line and the driving module are indicated.

[0072] In an optional implementation, the driving modules included in the functional layer 2 may be regularly distributed, and the at least one first signal line included in the second metal layer 3 may be irregularly distributed. Therefore, the relative position of the first signal line and the driving module can be determined by comparing the design layout of the functional layer 2 with the design layout of the second metal layer 3, and then different marking states can be designed for the marking structure of the driving module so that the repair personnel can determine the location of the first signal line based on the marking state, so that the location of the first signal line can be repaired to avoid missed repair and over-repair.

[0073] Among them, at least two driving modules are located between the orthographic projections of adjacent first signal lines on the substrate 1, and the marking structures corresponding to the adjacent driving modules have different marking states. In this way, after preparing the target metal layer, the layout of the functional layer 2 can be observed. When it is found that the marking structures corresponding to two adjacent driving modules in the functional layer 2 have different marking states, the position of the first signal line on the substrate 1 relative to the nearest driving module after preparing the second metal layer 3 is determined to locate the specific position of the first signal line.

[0074] It can be seen that after preparing the substrate 1, the functional layer 2 and the target metal layer, when repairing foreign matter on the target metal layer, the prepared functional layer 2 can be observed. When it is determined that the marking structure corresponding to the adjacent driving module in the functional layer 2 has a different marking state, it is known that the adjacent driving module is located between the positive projections of the adjacent first signal line of the unprepared second metal layer 3 on the substrate 1. It can be known that the two sides of the adjacent driving module are the areas including the location of the first signal line. Moreover, since the routing mode of a single first signal line is determined, the routing mode of any first signal line can be determined in this area according to the marking structure of the adjacent driving module, so that the metal line with foreign matter in this area of ​​the target metal layer can be repaired.

[0075] It should be noted that, as mentioned above, the second metal layer 3 also includes other signal lines such as the second signal line and the power line. These other signal lines have a distribution pattern. Therefore, after preparing the target metal layer, the positions where other signal lines overlap with the metal routings in the target metal layer can be determined according to the distribution pattern of other signal lines, and foreign matter repair can be performed on these positions.

[0076] In addition, optionally, the second metal layer 3 may include an irregularly distributed third signal line in addition to at least one first signal line and the second signal line, power line and other signal lines with the above-mentioned distribution pattern. Accordingly, the marking state of the marking structure of the driving module can be designed according to the relative relationship between the third signal line and the driving module, so as to identify the position of the third signal line based on the driving module.

[0077] Optionally, the design of the marking state of the driving module used to mark the location of the first signal line is different from the marking state of the driving module used to mark the location of the third signal line. In this way, the first signal line and the third signal line can be distinguished at the same time.

[0078] Optionally, the marking structure may be the routing of each pole in the driving module, which is not fully illustrated here.

[0079] Optionally, for two adjacent driving modules whose corresponding marking structures have different marking states, the adjacent driving modules only have appearance differences due to the different marking states, and have no functional differences.

[0080] It can be understood that in some optional implementations, the first signal line exists in some positions of the second metal layer 3, and does not exist in other positions. Therefore, correspondingly, in the functional layer 2, there are two adjacent driving modules whose corresponding marking structures have different marking states, and there are also two adjacent driving modules whose corresponding marking structures have the same marking state.

[0081] The display panel comprises a substrate 1, a functional layer 2 including a driving module disposed on one side of the substrate 1, and a second metal layer 3 disposed on the side of the functional layer 2 away from the substrate 1. The second metal layer 3 comprises at least one first signal line; at least two driving modules are disposed between the orthographic projections of adjacent first signal lines on the substrate 1; the functional layer 2 comprises a marking structure disposed corresponding to the driving module, and the marking structures corresponding to adjacent driving modules have different marking states. In this way, by setting different marking states for the marking structures corresponding to the adjacent driving modules, the places in the functional layer 2 that need to be repaired are located based on the marking states, and the states in the functional layer 2 that need to be repaired are repaired based on the marking states, so that accurate repairs can be performed without affecting the functions of the display panel, thereby avoiding waste of production capacity and improving the efficiency of foreign body detection and repair.

[0082] In one embodiment, the display panel further includes a plurality of light-emitting units located on a side of the second metal layer 3 facing away from the substrate 1, and any light-emitting unit is electrically connected to a driving circuit, and the driving circuit includes a driving transistor and at least one switching transistor. The driving module is a driving transistor, a switching transistor, or a combination of a driving transistor and a switching transistor in the same driving circuit.

[0083] The driving circuit is used to drive the corresponding light-emitting unit to emit light. The driving transistor in the driving circuit is used to provide a driving current to the light-emitting unit to drive the light-emitting unit to emit light, and the switch transistor acts as a switch.

[0084] In other words, the driving module is a driving transistor; or, the driving module is a driving transistor and is one or more switching transistors; or, the driving module is a driving transistor and at least one switching transistor.

[0085] In the embodiment of the present application, full use is made of the array distribution pattern of the driving module. By changing the marking structure of the existing driving module in the display panel, the function of using the driving module to mark the position where foreign matter repair is required is realized without affecting the function of the driving module. This can reduce the difficulty of preparation and help achieve effective foreign matter detection.

[0086] The functional layer 2 is exemplarily described below.

[0087] In one embodiment, Figure 3 A cross-sectional schematic diagram of another display panel is shown. The functional layer 2 includes a semiconductor layer 21 located on one side of the substrate 1 and a first metal layer 22 located on the side of the semiconductor layer away from the substrate 1; the second metal layer is located on the side of the first metal layer 22 away from the semiconductor layer 21, and the marking structure is located on the first metal layer 22. The orthographic projections of the marking structures corresponding to adjacent driving modules on the substrate 1 have different marking states.

[0088] Optionally, as mentioned above, in the display panel in the AMOLED display structure, a substrate 1 is first prepared, and then a semiconductor layer 21 is prepared on one side of the substrate 1, and then an M1 layer is prepared on the side of the semiconductor layer 21 away from the substrate 1, and then an M2 layer is prepared on the side of the M1 layer away from the semiconductor layer 21, and then an M3 layer is prepared on the side of the M2 layer away from the M2 layer. In other words, the substrate 1, the semiconductor layer 21, the M1 layer, the M2 layer and the M3 layer are prepared in sequence. Therefore, in the embodiment of the present application, the first metal layer 22 can be the M1 layer or the M2 layer. In other words, Figure 4 A cross-sectional schematic diagram of another display panel is shown, wherein the first metal layer 22 includes a first intermediate metal layer 221 and a second intermediate metal layer 222, wherein the first intermediate metal layer 221 is an M1 layer, and the second intermediate metal layer 222 is an M2 layer.

[0089] Therefore, in an optional implementation, the first metal layer 22 includes a capacitor upper plate, and the second metal layer 3 includes at least one of a source structure and a drain structure. That is, the first metal layer 22 is an M2 layer including a capacitor upper plate, and the second metal layer 3 is an M3 layer including at least one of a source structure and a drain structure. In other words, the M2 layer can be used as both the first metal layer 22 and the target metal layer.

[0090] In another optional implementation, the first metal layer 22 includes at least one of the lower plate and gate structure of the capacitor, and the second metal layer 3 includes at least one of the source structure and the drain structure. That is, the first metal layer 22 is an M1 layer including at least one of the lower plate and gate structure of the capacitor, and the second metal layer 3 is an M3 layer.

[0091] In an embodiment of the present application, marking structures with different marking states can be made on the driving modules in multiple metal layers, so that when detecting foreign objects in the target metal layer, the area that needs to be detected and repaired can be determined to avoid excessive repair, and the detection in this area can be strengthened to avoid missed detection. This not only effectively improves the accuracy of foreign object detection in the preparation process of the metal layer of the display panel and reduces the missed detection rate, but also greatly improves the flexibility of marking the area that needs to be repaired.

[0092] In one embodiment, the marking state includes a marking body and a marking position of the marking body relative to the driving module in a reference direction; the marking state of the marking structure corresponding to the adjacent driving module is at least one of the following:

[0093] 1. The shape and size of the marker body are the same, but in the reference direction, the layout angles of the marker body and the adjacent drive module are different. For example, the layout angles of the two marker bodies differ by 180°.

[0094] 2. The shape of the marking body is the same. In the reference direction, the relative position of any marking body and the corresponding driving module is consistent, and the sizes of the marking bodies corresponding to adjacent driving modules are different.

[0095] 3. The marking bodies have the same size. In the reference direction, the relative positions of any marking body and the corresponding driving module are consistent, and the marking bodies corresponding to adjacent driving modules have different shapes. Optionally, the marking bodies corresponding to adjacent driving modules may be symmetrical.

[0096] Therefore, the marking states of the two driving modules can be different by changing the size, shape, layout angle, etc., so as to improve the flexibility of the marking method and reduce the complexity of the repair personnel in determining the repair area.

[0097] In one embodiment, the functional layer 2 includes a semiconductor layer 21 located on one side of the substrate 1 and a first metal layer 22 located on the side of the semiconductor layer 21 away from the substrate 1 ; the second metal layer 3 is located on the side of the first metal layer 22 away from the semiconductor layer 21 , and the marking structure is located in the semiconductor layer 21 .

[0098] That is, since the semiconductor layer 21 is located between the second metal layer 3 and the substrate 1 , and part of the structure in the driving module is located in the semiconductor layer 21 , the marking structure can be located in the semiconductor layer 21 in addition to the first metal layer 22 .

[0099] Optionally, the semiconductor layer 21 is an active layer. Taking the display panel in the AMOLED display structure as an example, the active layer can be a P-Si layer, which is used for P-Si patterning and ion doping to form a channel region.

[0100] Optionally, if there are other layers related to the driving module between the substrate 1 and the second metal layer 3 , the other layers may also serve as the functional layer 2 .

[0101] It should be noted that the cross-section of each layer may not be flat, and the interface schematic diagrams of each display panel in the embodiments of the present application are only used as examples to illustrate the hierarchical distribution relationship, and are not used to limit the present application.

[0102] In the embodiment of the present application, by setting different marking states for the marking structure corresponding to the driving module of the front layer, the purpose of predicting the layout of the first signal line of the rear layer can be achieved in the front layer, and ultimately the effect of determining the area in the target metal layer that requires foreign body detection and repair can be achieved, thereby improving detection efficiency and repair effectiveness.

[0103] In one embodiment, as mentioned above, the marking structure is located in the semiconductor layer 21. The semiconductor layer 21 also includes a channel region of the driving module.

[0104] In an optional implementation, the marking structure is a channel region of a driving transistor, and in a reference direction, the channel regions of adjacent driving transistors have different shapes and the same size.

[0105] In another optional implementation, the first signal line is arranged along the first direction and extends along the second direction; illustratively, the first direction and the second direction are orthogonal, for example, taking the first signal line as a ref signal as an example, Figure 2 The arrangement and extension direction of the first signal line are shown. In addition, in the semiconductor layer 21, the channel regions of adjacent driving modules have a first protrusion and a second protrusion respectively, and the protrusion direction of the first protrusion is opposite to that of the second protrusion.

[0106] That is, the layout angles of the channel regions of adjacent driving modules are different, and on this basis, the sizes of the two can be the same to ensure the functional uniformity of the driving modules. Figure 5 A schematic diagram of the layout of the channel regions of adjacent driving modules is shown. Here, it can be seen that the first protrusion is flipped 180 degrees to become the second protrusion, and the protrusion directions of the two are opposite.

[0107] It can be understood that, in addition to the arrangement in which the protruding direction of the first protrusion is opposite to the protruding direction of the second protrusion, other arrangements in which the protruding direction of the first protrusion is different from the protruding direction of the second protrusion are also possible.

[0108] In the embodiment of the present application, the channel regions of adjacent driving modules may be designed differently, thereby further improving the flexibility of the mark band repair area.

[0109] In one embodiment, a display panel is also provided, the display panel comprising: a substrate, a semiconductor layer and a second metal layer. The semiconductor layer 21 comprises a first channel region and a second channel region arranged along a first direction, and the first channel region and the second channel region are arranged at intervals. The second metal layer comprises a plurality of first signal lines, the first signal lines extend along the first direction and are arranged along the second direction; adjacent first signal lines comprise adjacently arranged first channel regions and second channel regions between the orthographic projections of the semiconductor layer 21; wherein the first channel region and the second channel region have different morphologies.

[0110] Optionally, the first channel region and the second channel region may belong to different driving modules.

[0111] In this way, by designing different forms for the first channel region and the second channel region, the places that need to be repaired in the functional layer can be located based on the different forms. Based on the marked state, the state that needs to be repaired in the functional layer can be repaired, so that accurate repair can be performed without affecting the function of the display panel, thereby avoiding waste of production capacity and improving the efficiency of foreign matter detection and repair.

[0112] In one embodiment, the first channel region and the second channel region have different morphologies, which means at least one of the following:

[0113] 1. The shapes of the first channel region and the second channel region are different;

[0114] 2. The first channel region and the second channel region have different sizes;

[0115] 3. The layout angles of the first channel region and the second channel region are different.

[0116] Therefore, the two channel areas can be visually distinguished by changing the size, shape, layout angle, etc., which improves the flexibility of the marking method and reduces the complexity for repair personnel to determine the repair area.

[0117] In one embodiment, the display panel further includes: a first metal layer located on the side of the semiconductor layer facing away from the substrate; adjacent first signal lines include adjacently arranged driving modules between the orthographic projections of the first metal layer; wherein the driving modules are arranged corresponding to the marking structures, and the marking structures corresponding to the adjacently arranged driving modules have different marking states.

[0118] For other limitations on the display panel, please refer to the description of the display panel in the above embodiments, which will not be repeated here.

[0119] In one embodiment, the present application further provides a display device, which includes a display panel as described in any of the above embodiments.

[0120] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0121] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; A functional layer, disposed on one side of the substrate, wherein the functional layer includes a driving module; A second metal layer is located on a side of the functional layer away from the substrate, wherein the second metal layer includes at least one first signal line; wherein at least two of the driving modules are located between orthographic projections of adjacent first signal lines on the substrate; The functional layer includes a marking structure, and the marking structure is arranged corresponding to the driving module. The marking structures corresponding to adjacent driving modules have different marking states.

2. The display panel according to claim 1, characterized in that: The marking state includes a marking body and a marking position of the marking body relative to the driving module in a reference direction; the marking state of the marking structure corresponding to the adjacent driving module is at least one of the following: The marking bodies have the same shape and size, and in the reference direction, the marking bodies are arranged at different angles to the adjacent driving modules; The marking bodies have the same shape, and in the reference direction, the relative positions of any marking body and the corresponding driving module are consistent, and the marking bodies corresponding to adjacent driving modules have different sizes; The marking bodies have the same size, and in a reference direction, the relative positions of any marking body and the corresponding driving module are consistent, and the marking bodies corresponding to adjacent driving modules have different shapes.

3. The display panel according to claim 1, characterized in that: The functional layer comprises a semiconductor layer located on one side of the substrate and a first metal layer located on a side of the semiconductor layer away from the substrate; The second metal layer is located on a side of the first metal layer away from the semiconductor layer, and the marking structure is located on the first metal layer; The orthographic projections of the marking structures corresponding to the adjacent driving modules on the substrate have different marking states respectively; Preferably, the first metal layer includes an upper plate of a capacitor, and the second metal layer includes at least one of a source structure and a drain structure; Preferably, the first metal layer includes at least one of a lower plate and a gate structure of a capacitor, and the second metal layer includes at least one of a source structure and a drain structure.

4. The display panel according to claim 2, characterized in that: The functional layer comprises a semiconductor layer located on one side of the substrate and a first metal layer located on a side of the semiconductor layer away from the substrate; The second metal layer is located on a side of the first metal layer away from the semiconductor layer, and the marking structure is located on the semiconductor layer.

5. The display panel according to claim 3 or 4, characterized in that: The display panel further comprises a plurality of light emitting units located on a side of the second metal layer away from the substrate, any one of the light emitting units being electrically connected to a driving circuit, wherein the driving circuit comprises a driving transistor and at least one switching transistor; The driving module is the driving transistor, the switching transistor, or a combination of the driving transistor and the switching transistor in the same driving circuit.

6. The display panel according to claim 4, characterized in that: The marking structure is located in the semiconductor layer, and the semiconductor layer also includes a channel region of the driving module; Preferably, the marking structure is a channel region of the driving transistor, and in a reference direction, adjacent channel regions of the driving transistor have different shapes and the same size; Preferably, the first signal lines are arranged along the first direction and extend along the second direction, the channel regions of adjacent driving modules respectively have a first protruding portion and a second protruding portion, and the protruding direction of the first protruding portion is opposite to that of the second protruding portion.

7. A display panel, characterized in that: include: substrate; The semiconductor layer comprises a first channel region and a second channel region arranged along a first direction, wherein the first channel region and the second channel region are arranged at an interval; A second metal layer, comprising a plurality of first signal lines, wherein the first signal lines extend along a first direction and are arranged along the second direction; Adjacent first signal lines include adjacently arranged first channel regions and second channel regions between orthographic projections of the semiconductor layer; The first channel region and the second channel region have different shapes.

8. The display panel according to claim 7, characterized in that: The display panel further comprises: a first metal layer located on a side of the semiconductor layer away from the substrate; Adjacent first signal lines include adjacently arranged driving modules between orthographic projections of the first metal layer; The driving modules are arranged corresponding to the marking structures, and the marking structures corresponding to the adjacently arranged driving modules have different marking states.

9. The display panel according to claim 7, characterized in that: The first channel region and the second channel region have different morphologies, which refers to at least one of the following: The first channel region and the second channel region have different shapes; The first channel region and the second channel region have different sizes; The first channel region and the second channel region are arranged at different angles.

10. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 9.

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