Display module and display device

Abstract

The invention provides a display module and a display device. The display module comprises a screen body, a cover plate and a first heat dissipation layer, and the cover plate is arranged on one side of the screen body; the first heat dissipation layer is arranged between the screen body and the cover plate. According to the display module provided by the invention, the first heat dissipation layer is arranged between the screen body and the cover plate, and the heat generated by the screen body is led out by the first heat dissipation layer, so that the heat dissipation effect of the screen body is improved, circuit damage caused by heating of the screen body is prevented, the heating problem of the high-brightness screen body is solved, and the display performance of the display module is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) is an active light-emitting device with a sandwich structure consisting of multiple organic layers and electrodes on both sides. At present, display screens based on AMOLED (Active-matrix organic light-emitting diode) have been commercialized in the fields of smart phones, watches and laptops.

[0003] However, the performance of existing displays needs to be improved. Summary of the invention

[0004] In view of this, the purpose of this application is to provide a display module to solve the problem of screen heating.

[0005] Based on the above purpose, the present application provides a display module having a display area and a non-display area, which includes:

[0006] Screen body;

[0007] A cover plate, the cover plate being arranged on one side of the screen body;

[0008] A first heat dissipation layer is arranged between the screen body and the cover plate.

[0009] In one embodiment, the cover plate includes a first heat dissipation structure, and the first heat dissipation structure is arranged in the non-display area;

[0010] Preferably, the non-display area includes a lower frame area, and the first heat dissipation structure is located in the lower frame area;

[0011] Preferably, the cover plate includes a black matrix portion, the black matrix portion is at least partially located in the non-display area, and the first heat dissipation structure is located in the black matrix portion;

[0012] Preferably, the first heat dissipation structure is connected to the first heat dissipation layer;

[0013] Preferably, the first heat dissipation layer is made of a transparent heat dissipation material;

[0014] Preferably, the transparent heat dissipation material includes at least one of graphene, metal grid, indium tin oxide, and nanosilver.

[0015] In one embodiment, the cover plate has a first opening, the first opening is located on a side of the cover plate close to the screen body, and the first heat dissipation structure is arranged in the first opening;

[0016] Preferably, the first heat dissipation structure comprises a black heat dissipation material;

[0017] Preferably, the color of the first heat dissipation structure is the same as the color of the screen body in the screen-off state. In one embodiment, the display module further includes:

[0018] An optical adhesive layer, the optical adhesive layer is disposed between the first heat dissipation layer and the cover plate, the optical adhesive layer comprises a second heat dissipation structure, and the second heat dissipation structure connects the first heat dissipation structure and the first heat dissipation layer;

[0019] Preferably, the optical adhesive layer comprises a through hole, and the second heat dissipation structure is arranged in the through hole; preferably, the optical adhesive layer comprises a transparent optical adhesive;

[0020] Preferably, the thickness of the optical adhesive layer is 3 μm-10 μm;

[0021] Preferably, the screen body, the first heat dissipation layer, the optical adhesive layer and the cover plate are stacked in sequence;

[0022] Preferably, the display module further comprises a first supporting film layer and a second supporting film layer which are arranged on a side of the screen body away from the cover plate, and the second supporting film layer is located on a side of the first supporting film layer away from the screen body.

[0023] In one embodiment, the first heat dissipation layer includes heat dissipation adhesive, one side of the first heat dissipation layer is bonded to the screen body, and the other side of the first heat dissipation layer is bonded to the cover plate.

[0024] In one embodiment, the screen body includes a display portion, a bending portion, and a bonding portion connected in sequence, the bending portion connects the display portion and the bonding portion, and the bonding portion is bent to one side of the display portion through the bending portion.

[0025] In one embodiment, the display module further includes:

[0026] a second heat dissipation layer, the second heat dissipation layer being located between the display portion and the bonding portion;

[0027] a third heat dissipation layer, the third heat dissipation layer being located between the second heat dissipation layer and the bonding portion;

[0028] Preferably, the second heat dissipation layer is in contact with a surface of the display portion close to the bonding portion;

[0029] Preferably, the third heat dissipation layer contacts a surface of the bonding portion close to the display portion.

[0030] In one embodiment, the display module further includes:

[0031] a third heat dissipation structure, wherein the third heat dissipation structure is partially disposed between the cover plate and the bending portion, partially disposed on a side of the bonding portion away from the display portion, and partially disposed on a side of the bending portion away from the display portion;

[0032] Preferably, a protective adhesive layer is provided on a side of the bending portion away from the display portion, and the protective adhesive layer is located between the third heat dissipation structure and the bending portion.

[0033] Preferably, a driving chip is provided on a side of the bonding portion away from the display portion, and the driving chip is located between the third heat dissipation structure and the bonding portion.

[0034] In one embodiment, the display module further includes:

[0035] A copper foil layer, wherein the copper foil layer is located between the display portion and the bonding portion, and the copper foil layer is spaced apart from the bending portion;

[0036] A fourth heat dissipation structure is disposed between the bending portion and the copper foil layer.

[0037] Based on the same inventive concept, the present application also provides a display device, which includes any one of the display modules described above.

[0038] Compared with the prior art, the display module provided in the present application sets a first heat dissipation layer between the screen body and the cover plate, and the first heat dissipation layer conducts the heat generated by the screen body to the outside, thereby improving the heat dissipation effect of the screen body and preventing the circuit from being damaged due to heat generation of the screen body, thereby solving the heating problem of the high-brightness screen body and further improving the display performance of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0040] Figure 1 is a schematic diagram of a related display module;

[0041] Figure 2 for Figure 1The schematic diagram of the layer structure of the module is shown in the figure;

[0042] Figure 3 A schematic diagram of the layer structure of a display module provided in one embodiment of the present application;

[0043] Figure 4 A schematic diagram of the layer structure of a display module provided in another embodiment of the present application;

[0044] Figure 5 A schematic diagram of the layer structure of a display module provided in another embodiment of the present application;

[0045] Figure 6 A schematic diagram of the layer structure of a display module provided in another embodiment of the present application;

[0046] Figure 7 A schematic diagram of a screen provided in another embodiment of the present application;

[0047] Figure 8 A schematic diagram of the layer structure of a display module provided in another embodiment of the present application;

[0048] Fig. 9 A schematic diagram of the layer structure of a display module provided in another embodiment of the present application.

[0049] Marking Description:

[0050] 100. Display module; 101. Display area; 102. Non-display area; 1. Screen body; 11. Display part; 12. Bending part; 13. Bonding part; 14. Second heat dissipation layer; 15. Copper foil layer; 16. Third heat dissipation layer; 17. First support film layer; 18. Foam layer; 19. Second support film layer; 2. Cover plate; 21. Visible part; 22. Black matrix part; 23. First heat dissipation structure; 3. First heat dissipation layer; 4. Optical adhesive layer; 41. Second heat dissipation structure; 5. Polarizer; 6. Third heat dissipation structure; 7. Fourth heat dissipation structure; 8. Driver chip; 9. Protective adhesive layer. DETAILED DESCRIPTION

[0051] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0052] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0053] As outdoor display applications become more and more widespread, the demand for OLED (Organic Light-Emitting Diode) display devices with wide color gamut, low power consumption, high contrast, and high brightness is increasing. Figure 1 and Figure 2 As shown, a related display module 100 includes a screen body 1 and a cover plate 2. The cover plate 2 is arranged on one side of the screen body 1. The display module 100 has a display area 101 and a non-display area 102. The non-display area 102 is arranged around the display area 101. A polarizer 5 and an optical adhesive layer 4 are arranged between the screen body 1 and the cover plate 2. The polarizer 5 is attached to the cover plate 2 through the optical adhesive layer 4.

[0054] The applicant has found through research that in order to achieve a higher visual effect and improve the luminous efficiency of the display device, the wiring heat of the screen body 1 will increase simultaneously, resulting in serious heating of the screen body 1, and the heat is mainly concentrated in the lower frame of the cover plate 2 in the display module. At present, because OLED products generate little heat energy, there is no solution to the problem of screen heat dissipation in the prior art.

[0055] Based on this, the present application provides a display module solution to solve the above problems.

[0056] Please refer to Figure 1 , Figure 3 As shown, a display module 100 is provided in an embodiment of the present application. The display module 100 has a display area 101 and a non-display area 102. The non-display area 102 is arranged around the display area 101. The display module 100 includes a screen body 1, a cover plate 2 and a first heat dissipation layer 3. The cover plate 2 is arranged on one side of the screen body 1, and the first heat dissipation layer 3 is arranged between the screen body 1 and the cover plate 2.

[0057] The display module 100 provided in the embodiment of the present application dissipates heat on the screen body 1 by setting a first heat dissipation layer 3 between the screen body 1 and the cover plate 2, thereby dissipating heat on the screen body 1 to the outside, improving the heat dissipation effect of the screen body 1, and preventing damage to the screen body circuit, thereby meeting the demand for improving the brightness of the display screen.

[0058] Specifically, in the display module 100 provided in this embodiment, the screen body 1 is a high-brightness screen body, and the screen body 1 includes a light-emitting surface and a backlight surface, with the side where the light-emitting surface is located as the outer side, and the side where the backlight surface is located as the inner side, and the cover plate 2 and the first heat dissipation layer 3 are located on the side where the light-emitting surface of the screen body 1 is located, that is, the outer side of the screen body 1. Due to its high power and high brightness characteristics, the screen body 1 will generate more heat, so the heat dissipation problem is particularly important. In this application, the polarizer 5 on the screen body 1 is removed and replaced with a heat dissipation material, thereby improving the heat dissipation effect of the display screen.

[0059] Specifically, the first heat dissipation layer 3 is made of a transparent heat dissipation material, and the transparent heat dissipation material includes at least one of graphene, metal grid, indium tin oxide, and nano silver. The first heat dissipation layer 3 is made of a transparent heat dissipation material, which can achieve the heat dissipation function while avoiding affecting the display effect of the screen body 1.

[0060] Please refer to Figure 3 , Figure 4 As shown, in one embodiment, the cover plate 2 includes a first heat dissipation structure 23, and the first heat dissipation structure 23 is disposed in the non-display area 102. Specifically, the non-display area 102 includes a lower frame area, and the first heat dissipation structure 23 is located in the lower frame area.

[0061] Preferably, the cover plate 2 includes a visible portion 21 and a black matrix portion 22, and the black matrix portion 22 is arranged around the visible portion 21. The visible portion 21 is located in the display area 101, the black matrix portion (Black Matrix, BM area) is located in the non-display area 102, and the first heat dissipation structure 23 is arranged in the black matrix portion 22.

[0062] In other embodiments, the black matrix portion 22 may also be partially located in the display area 101 and partially located in the non-display area 102 .

[0063] The main function of the black matrix part 22 is to prevent light leakage from the screen. By providing the first heat dissipation structure 23 on the black matrix part 22 of the cover plate 2, the display effect of the display area 101 will not be affected, and the heat dissipation effect of the display module can be further improved.

[0064] Please continue to refer to Figure 4As shown, in one embodiment, the cover plate 2 has a first opening, the first opening is located on the side of the cover plate 2 close to the screen body 1, and the first heat dissipation structure 23 is arranged in the first opening and fills the first opening. Correspondingly, the first opening is also located in the lower frame area of ​​the non-display area 102 and in the black matrix part 22. Among them, by setting the first opening on the side of the cover plate 2 facing the screen body 1 and setting the first heat dissipation structure 23 in the first opening, the heat in the lower frame area of ​​the cover plate 2 is dissipated, and the overall thickness of the display module is avoided from increasing due to the setting of the first heat dissipation structure.

[0065] In one embodiment, the first heat dissipation structure 23 includes a black heat dissipation material. The black heat dissipation material is filled in the first opening to form the first heat dissipation structure 23. Specifically, the first heat dissipation structure 23 and the black matrix portion are of the same color, which has an aesthetic effect.

[0066] In one embodiment, the color of the first heat dissipation structure 23 is the same as the color of the screen body 1 in the screen-off state. In the screen-off state, the first heat dissipation structure 23 located in the non-display area 102 is the same color as the screen body 1 to achieve an integrated black effect, which is more beautiful visually.

[0067] Please refer to Figure 5 As shown, in one embodiment, the display module 100 further includes an optical adhesive layer 4, which is disposed between the first heat dissipation layer 3 and the cover plate 2, and the optical adhesive layer 4 includes a second heat dissipation structure 41, and the second heat dissipation structure 41 connects the first heat dissipation structure 23 and the first heat dissipation layer 3. Among them, heat dissipation structures are respectively disposed in the cover plate 2, in the optical adhesive layer 4, and on the screen body 1 to form multi-layer heat dissipation, and the first heat dissipation structure 23 and the first heat dissipation layer 3 are connected together through the second heat dissipation structure 41, so that the heat on the screen body 1 can be introduced into the first heat dissipation structure 23 along the first heat dissipation layer 3 and the second heat dissipation structure 41, and can be conducted outwardly by the first heat dissipation structure 23, which can effectively improve the heat dissipation capacity and enhance the heat dissipation effect on the screen. At the same time, since the first heat dissipation structure 23 is located in the non-display area 102, it can avoid affecting the display effect of the display area 101.

[0068] In one embodiment, the optical adhesive layer 4 includes a through hole, and the second heat dissipation structure 41 is disposed in the through hole. By providing a through hole in the optical adhesive layer 4 and filling the second heat dissipation structure 41 in the through hole, the first heat dissipation structure 23 located on both sides of the optical adhesive layer 4 can be conveniently connected to the first heat dissipation layer 3 to achieve heat transfer and enhance the heat dissipation effect.

[0069] Optionally, the through hole may be replaced by an open slot at least one side of which communicates with the outside, and the second heat dissipation structure 41 may be disposed in the open slot to directly dissipate heat to the outside.

[0070] In one embodiment, the optical adhesive layer 4 includes transparent optical adhesive. Optical Clear Adhesive (OCA) is a special adhesive used to bond transparent optical elements. It usually has a high degree of transparency to ensure that light can pass through without hindrance to maintain the clarity and brightness of the screen. At the same time, the transparent optical adhesive has good bonding strength to ensure that the optical elements can be firmly bonded to prevent them from falling off or shifting during use. In addition, the optical adhesive layer 4 can also improve the display effect to a certain extent like a polarizer by absorbing light in a specific direction, reducing light leakage and reflection, etc., so as to achieve replacement.

[0071] In one embodiment, the thickness of the optical adhesive layer 4 is 3 μm-10 μm, for example, 3 μm, 5 μm, 7 μm or 10 μm, etc. Specifically, the thickness of the optical adhesive layer 4 is preferably 5 μm, and the optical adhesive layer 4 is located between the cover plate 2 and the first heat dissipation layer 3. The first heat dissipation layer 3 is fixed to the cover plate 2 by coating an ultra-thin transparent optical adhesive on the transparent heat dissipation material of the first heat dissipation layer 3.

[0072] Please refer to Figure 5 , Figure 6 As shown, in one embodiment, the display module 100 also includes a first supporting film layer 17, a copper foil layer 15, a foam layer 18, and a second supporting film layer 19 located on the side of the screen body 1 away from the cover plate 2. The first supporting film layer 17, the copper foil layer 15, the foam layer 18, and the second supporting film layer 19 are stacked in sequence in the direction of the screen body 1 away from the cover plate 2, and the second supporting film layer 19 is located on the side of the first supporting film layer 17 away from the screen body 1.

[0073] Please refer to Figure 6 As shown, in another embodiment, the first heat dissipation layer 3 includes heat dissipation adhesive, one side of the first heat dissipation layer 3 is bonded to the screen body 1, and the other side is bonded to the cover plate 2. Among them, by setting the first heat dissipation layer 3 as a single layer of heat dissipation adhesive to replace the transparent heat dissipation material and the optical adhesive layer 4, the optical adhesive layer 4 is not required, which can achieve heat dissipation and achieve bonding and fixing between the first heat dissipation layer 3 and the screen body 1 and the cover plate 2, and can also save a certain thickness size.

[0074] Please refer to Figure 7As shown, in one embodiment, the screen body 1 includes a display portion 11, a bending portion 12 and a bonding portion 13 connected in sequence, the bending portion 12 connects the display portion 11 and the bonding portion 13, and the bonding portion 13 is bent to one side of the display portion 11, specifically the backlight side, through the bending portion 12, so that the display portion 11 and the bonding portion 13 are stacked and spaced from each other. Among them, the display portion 11 is used for display, the bending portion 12 and the bonding portion 13 are used for wiring, and the display of the display portion 11 is controlled by the wiring on the bending portion 12 and the bonding portion 13. The display portion 11 of the screen body 1 corresponds to the visible portion 21 of the cover plate 2 in position, the bending portion 12 is located in the non-display area 102, the bonding portion 13 is located in the display area 101 and / or the non-display area 102, and the black matrix portion 22 of the cover plate 2 covers the bending portion 12 downward, specifically, the black matrix portion 22 is made of ink material to shield the light emitted by the display portion 11 and prevent light leakage from the edge.

[0075] Please refer to Figure 8 As shown, in one embodiment, the display module 100 further includes a second heat dissipation layer 14 and a third heat dissipation layer 16, wherein the second heat dissipation layer 14 is located between the display portion 11 and the bonding portion 13, and the third heat dissipation layer 16 is located between the second heat dissipation layer 14 and the bonding portion 13. The second heat dissipation layer 14 and the third heat dissipation layer 16 are located between the display portion 11 and the bonding portion 13 of the screen body 1, and the second heat dissipation layer 14 is in contact with the surface of the display portion 11 on the side close to the bonding portion 13, and the third heat dissipation layer 16 is in contact with the surface of the bonding portion 13 on the side close to the display portion 11, and the display portion 11 and the bonding portion 13 can be respectively dissipated from the backlight surface of the screen body 1, thereby improving the heat dissipation effect. In this embodiment, the second heat dissipation layer 14 and the third heat dissipation layer 16 replace the first support film layer 17, the foam layer 18, and the second support film layer 19, and can support and protect the screen body 1 while meeting the heat dissipation requirements.

[0076] Please refer to Fig. 9 As shown, in one embodiment, the display module 100 further includes a third heat dissipation structure 6, which is partially disposed between the cover plate 2 and the bending portion 12, partially disposed on the side of the bonding portion 13 away from the display portion 11, and partially disposed on the side of the bending portion 12 away from the display portion 11. The third heat dissipation structure 6 is located on the same side of the bending portion 12 and the bonding portion 13, specifically on the side of the bending portion 12 and the bonding portion 13 away from the display portion 11, which helps to conduct the heat emitted by the screen body 1 to the outside.

[0077] Specifically, the third heat dissipation structure 6 at least covers the bending portion 12 and the bonding portion 13 , and also connects the first heat dissipation structure 23 and the first heat dissipation layer 3 , so as to effectively conduct and dissipate the heat generated at various locations of the screen body 1 .

[0078] In one embodiment, a protective adhesive layer 9 is provided on the side of the bending portion 12 away from the display portion 11, and the protective adhesive layer 9 is located between the third heat dissipation structure 6 and the bending portion 12. The protective adhesive layer 9 is mainly used to protect the screen body 1 from the external environment, such as moisture, dust, chemicals, etc. Exemplarily, the protective adhesive layer 9 may include silicone, epoxy adhesive, polyurethane adhesive, etc., and the selection of these materials depends on the specific application environment and requirements of the display module 100.

[0079] In one embodiment, a driver chip 8 is provided on the side of the bonding part 13 away from the display part 11, and the driver chip 8 is located between the third heat dissipation structure 6 and the bonding part 13. The driver chip is also called an IC (Integrated Circuit). The driver chip 8 is electrically connected to the internal circuit of the screen body 1, and the display module 100 usually controls the display of the screen body 1 through the driver chip 8. During use, the heat generated by the electronic devices in the display module 100 that generate more heat, such as the driver chip 8, will accumulate at the corresponding position of the screen body 1. The high temperature generated by the accumulated heat may reduce the life of the luminescent material inside the screen body 1. The present application wraps the driver chip 8 through the third heat dissipation structure 6 to dissipate heat from the driver chip 8 to prevent heat accumulation from damaging the screen body.

[0080] Please refer to Fig. 9 As shown, in one embodiment, the display module 100 further includes a copper foil layer 15, which is disposed between the second heat dissipation layer 14 and the third heat dissipation layer 16. The copper foil layer 15 has mechanical support and heat dissipation functions, and the copper foil layer 15 can provide mechanical support for the screen body 1 to ensure stability. Especially in flexible display screens, the high strength and good plasticity of the copper foil ensure that the screen body 1 can still maintain a stable structure and performance when bent or stretched. In addition, as a material with good thermal conductivity, the copper foil can effectively play a heat dissipation function and quickly conduct and dissipate the heat.

[0081] The display module 100 further includes a fourth heat dissipation structure 7, which is disposed between the bent portion 12 and the copper foil layer 15. Specifically, one side of the fourth heat dissipation structure 7 is connected to the bent portion 12, and the other side is connected to the second heat dissipation layer 14, the copper foil layer 15 and the third heat dissipation layer 16, thereby connecting the heat dissipation structures at various locations on the backlight side of the screen body 1, which is helpful for heat dissipation.

[0082] Since the bending portion 12 is in a bent state, the heat dissipation requirement is more critical. In the embodiment provided in the present application, the third heat dissipation structure 6 is distributed on one side of the bending portion 12 of the screen body 1, and the fourth heat dissipation structure 7 is distributed on the other side of the bending portion 12. Heat dissipation materials are distributed on both the inner and outer sides of the bending portion 12, which can effectively conduct heat away from the bending portion 12.

[0083] Specifically, the third heat dissipation structure 6 is connected to the fourth heat dissipation structure 7. By connecting the third heat dissipation structure 6 to the fourth heat dissipation structure 7, the heat dissipation structures can be connected together to form a reasonable heat dissipation channel, which helps to effectively transfer heat, thereby improving heat dissipation efficiency and reducing heat accumulation inside the display module 100.

[0084] The third heat dissipation structure 6 and the fourth heat dissipation structure 7 both include flexible heat dissipation materials, such as graphene, thermally conductive silicone, etc. These materials have excellent thermal conductivity and flexibility, and can maintain good thermal conductivity when bent.

[0085] The display module 100 provided in the present application is provided with heat dissipation structures in all directions of the screen body 1, and the module component layers in the existing display module 100 are eliminated or thinned as much as possible. Specifically, on the outside of the screen body 1, a first heat dissipation layer 3 corresponding to the display part 11 and a third heat dissipation structure 6 corresponding to the bending part 12 and the bonding part 13 are provided, and the first heat dissipation layer 3 is connected to the first heat dissipation structure 23; on the inside of the screen body 1, a fourth heat dissipation structure 7 corresponding to the bending part 12 is provided, and a second heat dissipation layer 14, a copper foil layer 15 and a third heat dissipation layer 16 are also provided between the display part 11 and the bonding part 13, forming a complete heat dissipation system, thereby achieving all-round heat dissipation from inside and outside of the screen body 1, and effectively conducting the heat generated inside the screen body 1, and ensuring that the heat can be smoothly dissipated to the surrounding environment. In addition, each heat dissipation structure is distributed in each layer of module components of the display module 100, which can further improve the heat dissipation effect of the screen body 1.

[0086] Based on the same inventive concept, another embodiment of the present application further provides a display device, which includes the display module in the above embodiment. Further, the display device includes a mobile phone, VR equipment, computer, television, car display equipment, etc.

[0087] A display device provided in this embodiment has a display module 100 in which a first heat dissipation layer 3 is provided between a screen body 1 and a cover plate 2 and a heat dissipation structure is added to the screen body 1. This allows heat on the screen body 1 to be conducted outward, thereby improving the heat dissipation effect of the screen body 1 and preventing damage to the circuits of the screen body 1. This satisfies the need to increase the brightness of the display screen and is beneficial to improving the performance of the display device.

[0088] Although the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description.

[0089] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0090] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. A display module having a display area and a non-display area, characterized in that: The display module comprises: Screen body; A cover plate, the cover plate being arranged on one side of the screen body; A first heat dissipation layer is arranged between the screen body and the cover plate.

2. The display module according to claim 1, characterized in that: The cover plate includes a first heat dissipation structure, and the first heat dissipation structure is arranged in the non-display area; Preferably, the non-display area includes a lower frame area, and the first heat dissipation structure is located in the lower frame area; Preferably, the cover plate includes a black matrix portion, the black matrix portion is at least partially located in the non-display area, and the first heat dissipation structure is located in the black matrix portion; Preferably, the first heat dissipation structure is connected to the first heat dissipation layer; Preferably, the first heat dissipation layer is made of a transparent heat dissipation material; Preferably, the transparent heat dissipation material includes at least one of graphene, metal grid, indium tin oxide, and nanosilver.

3. The display module according to claim 2, characterized in that: The cover plate has a first opening, the first opening is located on a side of the cover plate close to the screen body, and the first heat dissipation structure is arranged in the first opening; Preferably, the first heat dissipation structure comprises a black heat dissipation material; Preferably, the color of the first heat dissipation structure is the same as the color of the screen body in the screen-off state.

4. The display module according to claim 2, characterized in that: The display module also includes: An optical adhesive layer, the optical adhesive layer is disposed between the first heat dissipation layer and the cover plate, the optical adhesive layer comprises a second heat dissipation structure, and the second heat dissipation structure connects the first heat dissipation structure and the first heat dissipation layer; Preferably, the optical adhesive layer comprises a through hole, and the second heat dissipation structure is arranged in the through hole; preferably, the optical adhesive layer comprises a transparent optical adhesive; Preferably, the thickness of the optical adhesive layer is 3 μm-10 μm; Preferably, the screen body, the first heat dissipation layer, the optical adhesive layer and the cover plate are stacked in sequence; Preferably, the display module further comprises a first supporting film layer and a second supporting film layer which are arranged on a side of the screen body away from the cover plate, and the second supporting film layer is located on a side of the first supporting film layer away from the screen body.

5. The display module according to claim 1, characterized in that: The first heat dissipation layer includes heat dissipation adhesive. One side of the first heat dissipation layer is bonded to the screen body, and the other side of the first heat dissipation layer is bonded to the cover plate.

6. The display module according to claim 1, characterized in that: The screen body includes a display portion, a bending portion, and a bonding portion which are connected in sequence, the bending portion connects the display portion and the bonding portion, and the bonding portion is bent to one side of the display portion through the bending portion.

7. The display module according to claim 6, characterized in that: The display module also includes: a second heat dissipation layer, the second heat dissipation layer being located between the display portion and the bonding portion; a third heat dissipation layer, the third heat dissipation layer being located between the second heat dissipation layer and the bonding portion; Preferably, the second heat dissipation layer is in contact with a surface of the display portion close to the bonding portion; Preferably, the third heat dissipation layer contacts a surface of the bonding portion close to the display portion.

8. The display module according to claim 6, characterized in that: The display module also includes: a third heat dissipation structure, wherein the third heat dissipation structure is partially disposed between the cover plate and the bending portion, partially disposed on a side of the bonding portion away from the display portion, and partially disposed on a side of the bending portion away from the display portion; Preferably, a protective adhesive layer is provided on a side of the bent portion away from the display portion, and the protective adhesive layer is located between the third heat dissipation structure and the bent portion; Preferably, a driving chip is provided on a side of the bonding portion away from the display portion, and the driving chip is located between the third heat dissipation structure and the bonding portion.

9. The display module according to claim 6, characterized in that: The display module also includes: A copper foil layer, wherein the copper foil layer is located between the display portion and the bonding portion, and the copper foil layer is spaced apart from the bending portion; A fourth heat dissipation structure is disposed between the bending portion and the copper foil layer.

10. A display device, characterized in that: Comprising a display module as described in any one of claims 1-9.

Images