Multilayer structure, outer cover of electronic device, and electronic device

Abstract

Disclosed herein are a multilayer structure, an outer cover for an electronic device, and an electronic device including the same. The multilayer structure may include: a first pigment layer including TiO2 and an extender pigment; a white layer comprising TiO2 on the first pigment layer; and a second pigment layer comprising TiO2 and an extender pigment on the white layer.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a multilayer structure, an outer cover of an electronic device, and an electronic device including the same. Background Art

[0002] An electronic device generally refers to a device that performs a specific function according to a loaded program, such as a household appliance, an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet personal computer (PC), a video / audio device, a desktop / laptop computer, a vehicle navigation system, etc. For example, such an electronic device can output stored information as sound or an image. As electronic devices have become highly integrated and high-speed and large-capacity wireless communications have been widely used, various functions have been installed in a single electronic device such as a mobile communication terminal. For example, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, scheduling functions and electronic wallet functions, and communication functions have been integrated into a single electronic device.

[0003] Electronic devices are being made thin and light for portable purposes. Since the electronic devices may be damaged due to external physical impact, the electronic devices may be used with an outer cover (or housing) covering the exterior of the electronic devices. The outer cover covering the exterior of the electronic devices not only provides a function of protecting the electronic devices, but also may exhibit an effect of showing aesthetic appeal to users. Summary of the invention

[0004] Technical Solution

[0005] According to an embodiment of the present disclosure, a multilayer structure may include: a first pigment layer including TiO 2 and extender pigments; including TiO 2 a white layer on the first pigment layer; and a layer comprising TiO 2 and a second pigment layer of extender pigment, on top of the white layer.

[0006] According to an embodiment of the present disclosure, an outer cover of an electronic device may include: a shielding layer; a multi-layer structure layer on the shielding layer; and a base material layer on the multi-layer structure layer, wherein the multi-layer structure layer may include: a first pigment layer including TiO 2 and extender pigments; including TiO 2 a white layer on the first pigment layer; and a layer comprising TiO 2 and a second pigment layer of extender pigment, on top of the white layer.

[0007] According to an embodiment of the present disclosure, an electronic device may include the multilayer structure according to an embodiment of the present disclosure or an outer cover of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a block diagram illustrating electronic devices in a network environment according to an embodiment of the present disclosure.

[0009] Figure 2 is a diagram illustrating a front surface of an electronic device according to an embodiment of the present disclosure.

[0010] Figure 3 is a diagram illustrating a rear surface of an electronic device according to an embodiment of the present disclosure.

[0011] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0012] Figure 5 According to an embodiment of the present disclosure, Figure 2 A sectional view taken along line AA and an enlarged view of a portion thereof.

[0013] Figure 6 is a cross-sectional view illustrating a multi-layer structure according to an embodiment of the present disclosure.

[0014] Figure 7 is a cross-sectional view illustrating an external cover of an electronic device according to an embodiment of the present disclosure.

[0015] Figure 8a is a cross-sectional view illustrating an external cover of an electronic device according to an embodiment of the present disclosure.

[0016] Figure 8b is a cross-sectional view illustrating an external cover of an electronic device according to an embodiment of the present disclosure.

[0017] Figure 9a 1 is a perspective view showing a state where a multi-layer structure mounted on a front surface of an electronic device is viewed from the front, top, and side according to an embodiment of the present disclosure.

[0018] Figure 9b 1 is a perspective view illustrating a state where a multi-layer structure or an outer cover mounted on a rear surface of an electronic device is viewed from the front, top, and side according to an embodiment of the present disclosure. Specific embodiments

[0019] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. When describing the embodiments with reference to the accompanying drawings, the same reference numerals refer to the same elements, and repeated descriptions thereof will be omitted.

[0020] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment.

[0021] Reference Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be integrated into a single integrated component (eg, display module 160).

[0022] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently of the main processor 121 or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or implemented as part of the main processor 121.

[0023] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, by an electronic device 101 in which artificial intelligence is executed, or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may include, for example, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0024] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0025] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0026] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0027] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker, or implemented as part of the speaker.

[0028] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to sense a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0029] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an external electronic device (e.g., the electronic device 102, such as a speaker or earphone) directly or wirelessly connected to the electronic device 101.

[0030] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0031] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 to an external electronic device (e.g., electronic device 102) directly (e.g., via a wire) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0032] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his or her sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0034] The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0035] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0036] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network such as the first network 198 or the second network 199 using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0038] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0039] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiation element including a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may be transmitted or received between the communication module 190 and the external electronic device via at least one selected antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as a part of the antenna module 197.

[0040] According to an embodiment, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board or adjacent to the first surface and is capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board or adjacent to the second surface and are capable of transmitting or receiving signals in the specified high frequency band.

[0041] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0042] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the external electronic devices 102 and 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed by the electronic device 101 may be executed at one or more of the external electronic devices (e.g., the external devices 102, 104, and the server 108). For example, if the electronic device 101 needs to automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and may transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0043] Figure 2 is a perspective view of a front surface of a mobile electronic device according to an embodiment.

[0044] Figure 3 According to the embodiment of the present disclosure Figure 1 A perspective view of a rear surface of an electronic device.

[0045] Reference Figure 2 and Figure 3, the electronic device 100 according to the embodiment may include a housing 110 including a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding a space between the first surface 110A and the second surface 110B.

[0046] According to an embodiment (not shown), the housing may also refer to a Figure 1 The structure of the first surface 110A, the second surface 110B and the part of the side surface 110C. According to one embodiment, the first surface 110A can be formed by the front plate 102 (for example, a glass plate or a polymer plate including various coatings), and at least a portion of the front plate 102 is substantially transparent. The second surface 110B can be formed by a substantially opaque rear plate 111. For example, the rear plate 111 can be formed by coated or colored glass, ceramic, polymer, metal material (for example, aluminum, stainless steel (SS) or magnesium) or a combination of at least two of the above materials. The side surface 110C can be connected to the front plate 102 and the rear plate 111, and can be formed by a side frame structure (or "side member") 118 including metal and / or polymer. In one embodiment, the rear plate 111 and the side frame structure 118 can be formed integrally and can include the same material (for example, a metal material, such as aluminum).

[0047] In the illustrated embodiment, the front plate 102 may include two first regions 110D at both ends of the long side of the front plate 102, which are bent from the first surface 110A toward the rear plate 111 and extend seamlessly. Figure 2 ), the rear plate 111 may include two second regions 110E at both ends of the long side of the rear plate 111, which are bent from the second surface 110B toward the front plate 102 and extend seamlessly. In some embodiments, the front plate 102 (or the rear plate 111) may include only one of the first regions 110D (or the second regions 110E). In some embodiments, some of the first regions 110D or the second regions 110E may not be included.

[0048] According to one embodiment, in a side view of the electronic device 100, the side frame structure 118 may have a first thickness (or width) at a side where the first region 110D or the second region 110E is not included, and may have a second thickness that is less than the first thickness at a side where the first region 110D or the second region 110E is included.

[0049] In an embodiment, the first region 110D or the second region 110E may be formed to be flat rather than curved to form a substantially single plane with the first surface 110A or the second surface 110B.

[0050] According to an embodiment, the electronic device 100 may include at least one of the display 101, audio modules 103, 107, and 114, sensor modules 104, 116, and 119, camera modules 105, 112, and 113, a key input device 117, a light emitting element 106, and connector holes 108 and 109. In some embodiments, the electronic device 100 may not include at least one of the above components (e.g., the key input device 117 or the light emitting element 106), or may additionally include other components.

[0051] According to an embodiment, the display 101 may be exposed through, for example, some portion of the front plate 102. In some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 constituting the first surface 110A and the first region 110D of the side surface 110C. In some embodiments, the edge of the display 101 may be formed to be substantially the same shape as the adjacent outer edge of the front plate 102. In an embodiment (not shown), the distance between the outer edge of the display 101 and the outer edge of the front plate 102 may be substantially the same so as to expand the exposed area of ​​the display 101.

[0052] In an embodiment (not shown), the electronic device 100 may have a groove or opening formed in a portion of the screen display area of ​​the display 101, and may include at least one of the audio module 114, the sensor module 104, the camera module 105, and the light emitting device 106 aligned with the groove or opening. In an embodiment (not shown), the electronic device 100 may include at least one of the audio module 114, the sensor module 104, the camera module 105, the fingerprint sensor 116, and the light emitting element 106 on the rear surface of the screen display area of ​​the display 101. In an embodiment (not shown), the display 101 may be connected to a touch sensing circuit, a pressure sensor for measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic stylus, or be disposed adjacent thereto. In some embodiments, at least a portion of the sensor modules 104 and 119 and / or at least a portion of the key input device 117 may be disposed in the first area 110D and / or the second area 110E.

[0053] In an embodiment (not shown), the audio modules 103, 107, and 114 may include a microphone hole 103 and speaker holes 107 and 114. A microphone for acquiring external sound may be provided in the microphone hole 103. In some embodiments, a plurality of microphones may be provided to detect the direction of the sound. The speaker holes 107 and 114 may include an external speaker hole 107 and a receiver hole 114 for calling. In some embodiments, the speaker holes 107 and 114 and the microphone hole 103 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without the speaker holes 107 and 114.

[0054] According to an embodiment, the sensor modules 104, 116, and 119 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 100. The sensor modules 104, 116, and 119 may include, for example, a first sensor module 104 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 110A of the housing 110 and / or a third sensor module 119 (e.g., a heart rate monitoring (HRM) sensor) and / or a fourth sensor module 116 (e.g., a fingerprint sensor) disposed on a second surface 110B of the housing 110. The fingerprint sensor may be disposed on both the first surface 110A (e.g., the display 101) and the second surface 110B of the housing 110. According to an embodiment, the electronic device 100 may further include at least one of a sensor module (e.g., a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 104) not shown.

[0055] According to an embodiment, the camera modules 105, 112, and 113 may include a first camera device 105 disposed on a first surface 110A of the electronic device 100, a second camera device 112 disposed on a second surface 110B, and / or a flash 113. According to an embodiment, the camera devices 105 and 112 may include one or more lenses, image sensors, and / or ISPs. The flash 113 may include, for example, a light emitting diode (LED) or a xenon lamp. In some embodiments, two or more lenses (e.g., an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 100.

[0056] According to an embodiment, the key input device 117 may be provided on the side surface 110C of the housing 110. In an embodiment, the electronic device 100 may not include some or all of the above-mentioned key input devices 117. The key input device 117 not included may be implemented in another form, such as a soft key on the display 101. In some embodiments, the key input device may include a sensor module 116 provided on the second surface 110B of the housing 110.

[0057] According to an embodiment, the light emitting element 106 may be disposed, for example, on the first surface 110A of the housing 110. The light emitting element 106 may provide, for example, status information of the electronic device 100 in the form of light. In an embodiment, the light emitting element 106 may provide, for example, a light source associated with the operation of the camera module 105. The light emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.

[0058] According to one embodiment, the connector holes 108 and 109 may include a first connector hole 108 and / or a second connector hole 109 (e.g., a headphone jack), wherein the first connector hole 108 is used to accommodate a connector (e.g., a USB connector) for sending power and / or data to an external electronic device and receiving power and / or data from an external electronic device, and the second connector hole 109 is used to accommodate a connector for sending audio signals to an external electronic device and receiving audio signals from an external electronic device.

[0059] Figure 4 yes Figure 1 An exploded perspective view of an electronic device. Figure 4 , the electronic device 300 may include a side frame structure 310, a first support member 311 (e.g., a bracket), a front panel 320, a display 330, a printed circuit board (PCB) 340, a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a rear panel 380. In some embodiments, the electronic device 300 may omit at least one of the above components (e.g., the first support member 311 or the second support member 360), or may additionally include other components. At least one of the components of the electronic device 300 may be identical to the components of the electronic device 300. Figure 1 or Figure 2 At least one of the components of the electronic device 100 is the same or similar, and a repeated description thereof will be omitted below.

[0060] According to an embodiment, the first support member 311 may be disposed inside the electronic device 300 and connected to the side frame structure 310, or may be integrally formed with the side frame structure 310. The first support member 311 may be formed of, for example, a metal material and / or a non-metal material (e.g., a polymer). The display 330 may be coupled to one surface of the first support member 311, and the PCB 340 may be coupled to the other surface of the first support member 311.

[0061] According to one embodiment, the PCB 340 may be provided with a processor, a memory and / or an interface mounted thereon. The processor may include, for example, one or more of a CPU, an AP, a GPU, an ISP, a sensor hub processor and a CP. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, an HDMI, a USB interface, an SD card interface and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / multimedia card (MMC) connector or an audio connector.

[0062] According to an embodiment, the battery 350, which is a device for supplying power to at least one component of the electronic device 300, may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of the battery 350 may be disposed on substantially the same plane as the PCB 340. The battery 350 may be integrally disposed inside the electronic device 300, or may be detachably disposed from the electronic device 300.

[0063] According to an embodiment, the antenna 370 may be provided between the rear plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device, or may wirelessly transmit and receive power required for charging to and from an external device.

[0064] In one embodiment, the antenna structure may be formed by a portion of the side frame structure 310 and / or the first supporting member 311 or a combination thereof.

[0065] The electronic device 100 according to an embodiment of the present disclosure may include electronic devices such as a bar type, a foldable type, a rollable type, a slidable type, a wearable type, and a tablet personal computer (PC) and / or a notebook PC.

[0066] The electronic device 100 according to an embodiment of the present disclosure is not limited to the above-mentioned examples, and may include various other electronic devices.

[0067] Figure 5 It is along Figure 2 A sectional view taken along line AA and an enlarged view of a portion thereof.

[0068] Reference Figure 5 , the electronic device 300 (eg Figure 4 The electronic device 300 may have a first support member 311 (e.g., a bracket) fixed to the housing to support the substrate and the display. The display 330 may be fixed to the front surface of the first support member 311 (e.g., a bracket), and the front plate 320 may be disposed on the upper portion thereof. Figure 2 On the front surface 110A of the housing, the front plate 320 may be fixed by being attached to the first supporting member 311 (e.g., a bracket) by a first adhesive member. The front plate 320 may be fixed by being attached to the first supporting member 311 (e.g., a bracket) by a first adhesive member corresponding to the shape at the end of the housing. The front plate 320 may be formed in a shape having a uniform thickness and a certain curvature. In an embodiment, the front plate 320 may include a flat portion 1011 and a left curved portion 1012 and a right curved portion 1013, all of which may be formed to have a uniform thickness.

[0069] According to one embodiment, the rear surface (eg, Figure 2 The rear plate 380 on the rear surface 110B of the battery pack may also be fixed to the housing by a second adhesive member. The rear plate 380 may be formed in a shape that becomes thinner toward the left and right edges (e.g., a shape formed in a 2.5-dimensional manner). It may include a battery 350 and a second supporting member 360 (e.g., a rear case). The rear plate 380 may have a flat surface.

[0070] According to one embodiment, the back plate 380 may be attached to the second support member 360 (e.g., back shell). The second support member 360 (e.g., back shell) may have a surface having a similar curvature to the back plate 380, and at least a portion of the one surface may additionally include an adhesive layer. The adhesive layer may be attached by fixing the back plate 380 to the second support member 360 (e.g., back shell). According to one embodiment, the back plate 380 may also include an antenna module (not shown) on the back surface. For example, the antenna module may be an NFC, wireless charging antenna, MST antenna. The back plate 380 may also include a through hole (not shown) for assembling peripheral components such as a camera, an HRM sensor, a flash, etc.

[0071] Figure 6 is a cross-sectional view showing a multi-layer structure 400 according to an embodiment of the present disclosure.

[0072] According to one embodiment, Figure 6 It can be applied to electronic devices (e.g. Figure 2 and Figure 3The front panel 102 and the rear panel 111 of the electronic device 100) or (for example, Figure 4 and Figure 5 4 is a cross-sectional view of a multi-layer structure 400 including a front plate 320 and a rear plate 380 of an electronic device 300.

[0073] According to one embodiment, Figure 6 The multi-layer structure 400 may include a first pigment layer 410 , a white layer 420 , and a second pigment layer 430 .

[0074] According to one embodiment, the first pigment layer 410 may include TiO 2 According to one embodiment, the first pigment layer 410 may be applied to at least a portion of the exterior portion of the electronic device (eg, Figure 2 and Figure 3 The front panel 102 and the rear panel 111 of the electronic device 100) or (for example, Figure 4 and Figure 5 On a colored layer (eg, a shielding layer) of a front panel 320 of the electronic device 300 or a component (eg, an outer cover) of the electronic device.

[0075] According to one embodiment, the TiO in the first pigment layer 410 2 is a white pigment, and the TiO in the first pigment layer 410 2 The content may be about 10 wt % to about 40 wt %. In some embodiments, the TiO 2 The content may be lower than that of TiO contained in the white layer 420, the second pigment layer 430, or both. 2 In some embodiments, the TiO in the first pigment layer 410 2 The content may be a first content selected from: about 40 wt % or less; about less than 40 wt %; about 35 wt % or less; about 20 wt % to about 35 wt %; about 25 wt % to about 35 wt %; or about 25 wt % to about 30 wt %. In some embodiments, the first pigment layer 410 may improve the adhesion of the multilayer structure 400 while providing a whiteness function by applying the first content.

[0076] According to one embodiment, the TiO in the first pigment layer 410 2 The particle size may be about 100 nm (nanometer) to about 50 μm (micrometer); about 100 nm to about 30 μm; about 100 nm to about 20 μm; about 1 μm to about 10 μm; or about 4 μm to about 8 μm. For example, depending on the shape of the particle, the particle size may represent a diameter, a radius, a length, a thickness, etc. For example, the TiO 2 The particle size of the TiO2 The particle sizes may be the same or different.

[0077] According to one embodiment, in the first pigment layer 410, the extender pigment may be combined with the white pigment TiO 2 The first pigment layer 410 is combined to achieve white, thereby enhancing the hiding power and achieving a shielding effect. For example, the body pigment can control the amount of light that passes through the colored layer (e.g., the lower layer) (e.g., the shielding layer). For example, a shielding effect for a dark color (e.g., black or gray) (e.g., the color of the shielding layer) can be achieved while maintaining the white color of the first pigment layer 410.

[0078] According to one embodiment, the content of the extender pigment in the first pigment layer 410 may be about 10 wt % to about 50 wt %. In some embodiments, the content of the extender pigment in the first pigment layer 410 may be greater than the content of the extender pigment contained in the second pigment layer 430. In some embodiments, the content of the extender pigment in the first pigment layer 410 may be a second content selected from: about 10 wt % or more; about greater than 10 wt %; about 15 wt % to about 40 wt %; about 20 wt % to about 40 wt %; about 25 wt % to about 40 wt %; about 25 wt % to about 35 wt %; or about 30 wt % to about 40 wt %. In some embodiments, the first pigment layer 410 may improve whiteness by increasing the proportion of the extender pigment by applying the second content. For example, a dark color (e.g., black or gray) or light transmitted or reflected from a colored layer (e.g., a lower layer) (e.g., a shielding layer) may be shielded or offset to maintain whiteness.

[0079] According to one embodiment, the body pigment in the first pigment layer 410 may be a lactate, a silicate, an oxide, a hydroxide, a carbonate, a halogen salt, etc. including at least one or a combination of Ba, Ca, Al, Si, or Mg. For example, the body pigment may be a non-coloring body pigment. For example, the body pigment may include, but is not limited to, titanium dioxide, antimony oxide, zinc oxide, barium carbonate, calcium carbonate, aluminum silicate, silicon dioxide (SiO 2 ), silicic acid compounds (e.g., silicic acid), magnesium carbonate, magnesium salts (e.g., magnesium silicate, magnesium hydroxide silicate, or magnesium chloride), talc, barium sulfate, aluminum oxide, aluminum hydroxide, or kaolin (white clay, clay), or a combination thereof. In some embodiments, the light reflectivity and TiO 2 The extender pigment in the first pigment layer 410 is selected based on a combination of to achieve whiteness and increase the shielding performance of the projected light or color. In some embodiments, the extender pigment in the first pigment layer 410 may include magnesium silicate, magnesium silicate hydroxide, or magnesium chloride.

[0080] According to one embodiment, the body pigment in the first pigment layer 410 may include the following particle sizes: about 100 nm to about 50 μm; about 100 nm to about 30 μm; about 100 nm to about 20 μm; about 1 μm to about 10 μm; or about 4 μm to about 8 μm. For example, depending on the shape of the particles, the particle size may represent a diameter, a radius, a length, a thickness, etc.

[0081] According to an embodiment, the thickness of the first pigment layer 410 may be: about 0.5 μm to about 150 μm; about 0.5 μm to about 100 μm; about 1 μm to about 50 μm; about 1 μm to about 40 μm; about 1 μm to about 30 μm; about 1 μm to about 20 μm; about 1 μm to about 15 μm; about 1 μm to about 10 μm; about 5 μm to about 30 μm; about 5 μm to about 20 μm; about 5 μm to about 10 μm; or about 10 μm to about 20 μm. The thickness range described in some embodiments may be applied to improve the diffuse reflection function or adhesion. In addition, a dark color (e.g., black or gray) of a colored layer (e.g., a shielding layer) may be prevented from being projected.

[0082] According to an embodiment, the white layer 420 may include a white pigment TiO 2 According to an embodiment, the white layer 420 may be included between the first pigment layer 410 and the second pigment layer 430. This may form a sandwich structure of the white layer 420, the first pigment layer 410 and the second pigment layer 430 to prevent the inclusion of a large TiO 2 The white layer 420 with a high content of the pigment may be peeled off, thereby improving the adhesion of the multilayer structure 400. In some examples, the white layer 420 may be formed on (eg, on a surface of) the first pigment layer 410, and the second pigment layer 430 may be formed on (eg, on a surface of) the white layer 420.

[0083] According to one embodiment, the TiO in the white layer 420 2 The content may be about 40 wt % to about 70 wt %. In some embodiments, the TiO in the white layer 420 2 The content may be greater than that of TiO in the first pigment layer 410, the second pigment layer 430, or both. 2 In some embodiments, the white layer 420 may be a layer for forming a white pigment layer by including a higher content of TiO than the first pigment layer 410 or the second pigment layer 430. 2 In some embodiments, the TiO in the first pigment layer 410 2The content may be a third content selected from: about 40 wt % or more; about 50 wt % or more; about 40 wt % to about 70 wt %; about 55 wt % to about 70 wt %; or about 60 wt % to about 70 wt %. In some embodiments, the first pigment layer 410 may be improved in whiteness by applying the third content. In some embodiments, the multilayer structure 400 may form a sandwich structure, wherein a high content of TiO 2 The white layer 420 is positioned at a relatively low content of TiO 2 The first pigment layer 410 and the second pigment layer 430 are provided between the first pigment layer 410 and the second pigment layer 430, thereby achieving improved adhesion through the first pigment layer 410 and the second pigment layer 430, and at the same time, by having a high content of TiO 2 The white layer 420 maintains whiteness.

[0084] According to one embodiment, the TiO in the white layer 420 2 The particle size may be about 100 nm to about 50 μm; about 100 nm to about 30 μm; about 100 nm to about 20 μm; about 1 μm to about 10 μm; or about 4 μm to about 8 μm. For example, depending on the shape of the particle, the particle size may represent a diameter, a radius, a length, a thickness, etc. For example, the TiO 2 The particle size of the pigment layer 410 may be the same as or different from the particle size of the first pigment layer 410 or the second pigment layer 430 .

[0085] According to an embodiment, the thickness of the white layer 420 may be: about 0.5 μm to about 150 μm; about 0.5 μm to about 100 μm; about 1 μm to about 50 μm; about 1 μm to about 40 μm; about 1 μm to about 30 μm; about 1 μm to about 20 μm; about 1 μm to about 15 μm; about 1 μm to about 10 μm; about 5 μm to about 30 μm; about 5 μm to about 20 μm; about 5 μm to about 10 μm; about 10 μm to about 40 μm; about 10 μm to about 30 μm, or about 10 μm to about 20 μm. In some embodiments, the thickness of the white layer 420 may be thicker than the thickness of the first pigment layer 410, the second pigment layer 430, or both. In some embodiments, the white layer 420 may improve hiding power to achieve whiteness by applying the above-mentioned thickness range.

[0086] According to one embodiment, the second pigment layer 430 may include TiO 2 According to an embodiment, the second pigment layer 430 may be formed on the white layer 420 (eg, on the surface).

[0087] According to one embodiment, the TiO in the second pigment layer 430 2 is a white pigment, and the TiO in the second pigment layer 430 2The content may be about 30 wt % to about 50 wt %. In some embodiments, the TiO 2 The content can be higher than that of TiO in the first pigment layer 410. 2 In some embodiments, the TiO in the second pigment layer 430 2 The content may be a fourth content selected from: about more than 30 wt %; about 35 wt % or more; about 35 wt % to about 50 wt %; or about 40 wt % to about 50 wt %. In some embodiments, the second pigment layer 430 may improve the adhesion of the multilayer structure 400 while achieving whiteness by applying the fourth content.

[0088] According to one embodiment, the TiO in the second pigment layer 430 2 The particle size may be about 100 nm to about 50 μm; about 100 nm to about 30 μm; about 100 nm to about 20 μm; about 1 μm to about 10 μm; or about 4 μm to about 8 μm. For example, depending on the shape of the particle, the particle size may represent a diameter, a radius, a length, a thickness, etc. For example, the TiO in the second pigment layer 430 2 The particle size of the white layer 420 or the first pigment layer 410 may be the same as or different from the particle size of the white layer 420 or the first pigment layer 410 .

[0089] In one embodiment, the content of the extender pigment in the second pigment layer 430 may be about 5 wt % to about 30 wt %. In some embodiments, the content of the extender pigment in the second pigment layer 430 may be lower than the content of the extender pigment contained in the first pigment layer 410. In some embodiments, the content of the extender pigment in the second pigment layer 430 may be a fifth content selected from: about 20 wt % or less; about 15 wt % or less; about 5 wt % to about 15 wt %; about 10 wt % to about 15 wt %; or about 5 wt % to about 10 wt %. In some embodiments, by applying the fifth content, the second pigment layer 430 can reduce the proportion of the extender pigment, reduce the hiding power, and reflect the whiteness achieved in the white layer 420.

[0090] According to one embodiment, the body pigment in the second pigment layer 430 may be a lactate, a silicate, an oxide, a hydroxide, a carbonate, a halogen salt, etc. including at least one or a combination of Ba, Ca, Al, Si, or Mg. For example, the body pigment may be a non-coloring body pigment. For example, the body pigment may include, but is not limited to, titanium dioxide, antimony oxide, zinc oxide, barium carbonate, calcium carbonate (e.g., lime), aluminum silicate, silicon dioxide (SiO 2), silica-based compounds (e.g., silicic acid), magnesium carbonate, magnesium salts (e.g., magnesium silicate, magnesium hydroxide silicate, or magnesium chloride), talc, barium sulfate, aluminum oxide, aluminum hydroxide, or kaolin (white clay, clay), or a combination thereof. In some embodiments, the extender pigment of the second pigment layer 430 may include a pigment having a ratio of TiO 2 The extender pigment with low reflectivity can include, for example, talc, calcium carbonate (e.g., lime), aluminum oxide (Al 2 O 3 ) or a silicate-based compound (e.g., silicic acid), or at least one or more of a combination thereof.

[0091] According to one embodiment, the body pigment in the second pigment layer 430 may have the following particle size: about 100 nm to about 50 μm; about 100 nm to about 30 μm; about 100 nm to about 20 μm; about 1 μm to about 10 μm; or about 4 μm to about 8 μm. For example, depending on the shape of the particles, the particle size may represent a diameter, a radius, a length, a thickness, etc. In some embodiments, the particle size of the body pigment in the second pigment layer 430 may be the same as or different from the particle size of the first pigment layer 410.

[0092] According to one embodiment, the second pigment layer 410 may further include a coloring pigment. In some embodiments, by reflecting the high content of TiO 2 The whiteness reflectance of the white layer 420 is generated while reducing the hiding power between the extender pigments, and the coloring pigments can improve the whiteness of the multilayer structure 400. In some embodiments, the second pigment layer 410 can express the color generated by the coloring pigment while maintaining the whiteness generated by the white layer 420.

[0093] According to an embodiment, the coloring dye in the second pigment layer 410 may be about 0.1 wt % to about 10 wt %. In some embodiments, within the content range of the coloring dye described herein, color may be expressed while maintaining whiteness projected from the underlying layer (eg, white layer 420 ).

[0094] According to one embodiment, the coloring pigment may include an inorganic coloring pigment, an organic coloring pigment, or both. For example, the inorganic coloring pigment may include, but is not limited to, red iron oxide (e.g., Fe 2 O 3 ), bright red oxides (such as Pb 3 O 4 ), cadmium red (e.g. CdS+CdSe), manganese violet (e.g. NH 4 MnP 2 O 7 ), Prussian blue (e.g. Fe(NH 4 )Fe(CN) 6 xH2 O), ultramarine (such as Na 6-8 Al 6 Si 6 O 24 S 2-4 ), cobalt blue (such as CoO·Al 2 O 3 ), chrome green (e.g. lead chromate + blue), emerald green (e.g. Cu(CH 3 CO 2 ) 2 ·3Cu(AsO 2 ) 2 )), chromium orange (such as PbCrO 4 ·PbO), molybdenum orange (such as PbCrO 4 ·PbMoO 4 ·PbSO 4 ), at least one or more or a combination of white lead or zinc oxide.

[0095] For example, the organic coloring pigment may include, but is not limited to, at least one or more of anthraquinone pigments, azo pigments, aniline azo pigments, triphenylmethane pigments, pyrazole azo pigments, pyridine azo pigments, atrapyridone pigments, oxanol pigments, benzyl pigments, xanthene pigments, phthalocyanine pigments, thioindigo pigments, perindigo pigments, perylene pigments, or quinacridone pigments, or a combination thereof.

[0096] According to an embodiment, the thickness of the second pigment layer 430 may be: about 0.5 μm to about 150 μm; about 0.5 μm to about 100 μm; about 1 μm to about 50 μm; about 1 μm to about 40 μm; about 1 μm to about 30 μm; about 1 μm to about 20 μm; about 1 μm to about 10 μm; about 1 μm to about 5 μm; about 5 μm to about 30 μm; about 5 μm to about 20 μm; about 5 μm to about 15 μm; about 5 μm to about 10 μm; or about 10 μm to about 20 μm. In some embodiments, the thickness of the second pigment layer 430 may be thinner than the thickness of the first pigment layer 410 or the white layer 420. In some embodiments, by applying the thickness range described herein, the whiteness projected from the white layer 420 may be maintained and adhesion may be improved.

[0097] According to an embodiment, if necessary, the first pigment layer 410, the white layer 420, and the second pigment layer 430 may each further include a base resin, such as a curable (e.g., a thermosetting resin or a photocurable resin) resin, a transparent resin, etc. For example, it may include, but is not limited to, a resin such as an acrylonitrile butadiene styrene (ABS) copolymer resin, a polyurethane-based resin, an acrylate-based resin, a polyurethane acrylate-based resin, a (meth)acrylate-based resin, a silicone acrylate-based resin, an epoxy acrylate-based resin, an epoxy-based resin (e.g., a bisphenol A type epoxy resin, a cresol novolac type epoxy resin, a phenol novolac type epoxy resin, and a multifunctional epoxy resin); or a silicone-based resin or a transparent resin, etc.

[0098] According to an embodiment, the first pigment layer 410, the white layer 420, and the second pigment layer 430 may each be a single layer or multiple layers. In some embodiments, the multiple layers may have layers comprising the same or different compositions. In some embodiments, the multiple layers may include the following number of layers: about 2 or more; about 4 or more; or about 2 to about 10.

[0099] According to one embodiment, the multilayer structure 400 may have a light transmittance of about 1% or less; about 0.1% or less; or about 0.01% or less. In some embodiments, the multilayer structure 400 may have a black transmittance of about 0.01% or less. In some embodiments, the multilayer structure 400 may have a light shielding rate of about 99.7% or more. According to one embodiment, the multilayer structure 400 may have a whiteness (brightness) of L95 or more (e.g., a wavelength range of about 400nm to about 700nm in the visible light region). In some embodiments, the multilayer structure 400 may be used as a base material (e.g., an exterior decorative material) that achieves whiteness while minimizing or having little or no effect on the color or light of the projected coloring layer (e.g., a shielding layer) and enabling the expression of various colors or decorations (e.g., patterns) to achieve aesthetic effects.

[0100] According to an embodiment, a cured structure (e.g., a multilayer structure 400) is manufactured by baking (e.g., at about 50° C. to about 100° C.) after performing a lamination process by a continuous printing process using printing ink according to the configuration of Table 1 shown below. That is, the cured structure has a low boiling point solvent of a quick-drying form and a urea reaction cured structure of a room temperature cured structure.

[0101] According to an embodiment, Table 1 shows the components and layer composition, reflectance, and brightness (L) value (a means for determining brightness and whiteness) of each layer of the multilayer structure 400. In Table 1, it can be confirmed that whiteness with an L value (brightness, CIE L*) of 96 or more is achieved. That is, the multilayer structure 400 can maintain whiteness regardless of the presence or absence of a color (e.g., gray) for the shielding layer, and can maintain whiteness while shielding 99.7% or more of light.

[0102] [Table 1]

[0103]

[0104] Figure 7 is a cross-sectional view showing an outer cover 500 of an electronic device according to an embodiment of the present disclosure.

[0105] According to one embodiment, Figure 7 It can be applied to electronic devices (e.g. Figure 2 and Figure 3 The rear panel 111 of the electronic device 100) or (for example, Figure 4 and Figure 5 2 is a cross-sectional view of an outer cover 500 of a rear plate 380 of an electronic device 300.

[0106] According to one embodiment, Figure 7 The outer cover 500 in the embodiment may include a base material layer 530 , a multi-layer structure layer 520 and a shielding layer 510 .

[0107] According to an embodiment, the base material layer 530 is the outermost layer of the outer cover 500 and may include a base material layer 530 for implementing an electronic device (eg, Figures 1 to 3 The electronic device 100 and Figure 4 and Figure 5 The electronic device 300 may include a layer having a function required by the electronic device 300 (eg, an aesthetic function or a protective function).

[0108] According to one embodiment, the base material layer 530 may include but is not limited to a coating or printed layer, a membrane, a film, a foil or a sheet comprising at least one or a combination of an organic material (e.g., a resin, a polymer or a plastic), an inorganic material (e.g., an oxide or a ceramic), a metallic material (e.g., a metal, an alloy or an intermetallic compound) or an organic-inorganic composite material.

[0109] According to an embodiment, the base material layer 530 may include a single layer or multiple layers. According to an embodiment, the base material layer 530 may have a thickness of about 0.5 μm to about 150 μm, which may be the thickness of each layer or the entire base material layer 530 .

[0110] According to an embodiment, the base material layer 530 may be formed of, but not limited to, acrylonitrile butadiene styrene-based (ABS) copolymer resin, polyurethane-based resin, acrylate-based resin, polyurethane acrylate-based resin, (meth)acrylate-based resin, silicone acrylate-based resin, epoxy acrylate-based resin, or epoxy-based resin (e.g., bisphenol A-type epoxy resin, cresol novolac-type epoxy resin, phenol novolac-type epoxy resin, and multifunctional epoxy resin); resin such as silicone-based resin; transparent resin, glass, oxide such as ZrO 2 、SiO 2 、Al 2 O 3 ; Silane-based compounds; Siloxane-based compounds, aluminum, stainless steel (STS), magnesium, magnesium alloys (e.g., Mg-Al-Z based alloys), etc.

[0111] For example, the transparent resin may include, but is not limited to, at least one or more of polyester, polyethylene, polyethylene terephthalate (PET), polypropylene, polydimethylsiloxane (PDMS), poly-4-vinylphenol, polymethyl methacrylate, polyvinylidene fluoride, polystyrene, polycarbonate, polyimide (PI), cellulose, polyvinyl chloride, polytetrafluoroethylene, polyvinyl alcohol and / or polyurethane (e.g., TPU), or a combination thereof.

[0112] According to an embodiment, the base material layer 530 may include at least one or more of a transparent layer, a semi-transparent layer, an opaque layer, or a combination thereof For example, it may include a transparent film layer or a transparent adhesive layer.

[0113] According to an embodiment, the base material layer 530 may include an adhesive layer (not shown), a primer layer (not shown), or a surface modification layer (not shown). For example, the adhesive layer, the primer layer, or the surface modification layer may each include at least one or more of an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure sensitive adhesive (PSA), an epoxy-based adhesive, a silicone-based adhesive, an acrylic adhesive, and / or a urethane-based adhesive, or a combination thereof, but is not limited thereto. For example, the adhesive layer may be a transparent adhesive layer. For example, the adhesive layer, the primer layer, or the surface modification layer may each include at least one or more of the organic material (e.g., resin, polymer, or plastic), inorganic material (e.g., oxide or ceramic), metallic material (e.g., metal, alloy, or intermetallic compound), or organic-inorganic composite material described above for the base material layer 530, or a combination thereof.

[0114] According to an embodiment, the multi-layer structure layer 520 may include a multi-layer structure according to an embodiment of the present disclosure (eg, Figure 6 According to one embodiment, the multilayer structure (eg, Figure 6The multilayer structure 400 has a sandwich structure containing a high content of TiO 2 The white layer (e.g. Figure 5 The white layer 420) is located in a relatively low TiO 2 The first pigment layer (e.g. Figure 6 The first pigment layer 410 and the second pigment layer (eg, Figure 6 The first pigment layer and the second pigment layer 430 are interposed between them, so that the first pigment layer and the second pigment layer can respectively achieve excellent adhesion to the base material layer 530 and the shielding layer 510 that are in contact with each other. According to one embodiment, a multilayer structure (for example, Figure 6 The multi-layer structure 400) is used to improve hiding power to achieve whiteness with little effect on the color projected from the shielding layer 510, and to express color or decorative effects.

[0115] According to an embodiment, the shielding layer 520 may include at least one or more of a dark (e.g., gray or black) inorganic material, an organic material, or a metal material or a combination thereof having a light shielding function. In some embodiments, the shielding layer may be a coating layer, a printing layer, or a film. In some embodiments, the thickness of the shielding layer 520 may be about 0.5 μm to about 10 μm.

[0116] According to one embodiment, the shielding layer 510 may have the following light transmittance: about 1% or less; about 0.1% or less; or about 0.01% or less. In some embodiments, the multilayer structure 520 may have the following light transmittance: about 1% or less; about 0.1% or less; or about 0.01% or less. In some embodiments, the multilayer structure 520 may have a black transmittance of about 0.01% or less. In some embodiments, the shielding layer 510 may have a light shielding rate of about 99.7% or more. In some embodiments, the multilayer structure 520 may have a light shielding rate of about 99.7% or more.

[0117] According to an embodiment, the multilayer structure 520 may have a whiteness (brightness) of L95 or greater (e.g., a wavelength range of about 400 nm to about 700 nm in the visible light region). In some embodiments, the multilayer structure 520 may be used as a base material (e.g., an exterior decoration material) that achieves whiteness while minimizing or having little effect on the color or light of a projected coloring layer (e.g., shielding layer 510), and enables the expression of various colors or decorations (e.g., patterns) to achieve aesthetic effects.

[0118] According to one embodiment, Figure 8a and Figure 8b The present invention is a diagram showing an embodiment of the present invention. Figure 7 500 is a cross-sectional view of the outer cover. Figure 8a and Figure 8bis applied to electronic devices (e.g. Figure 2 and Figure 3 The rear panel 111 of the electronic device 100) or (for example, Figure 4 and Figure 5 2 is a cross-sectional view of an outer cover 500 of a rear plate 380 of an electronic device 300.

[0119] According to one embodiment, Figure 8a The outer cover 500 in the embodiment may include a base material layer 530, a multi-layer structure layer 520, and a shielding layer 510, and the base material layer 530 may include a film layer 531, a transparent adhesive layer 532, and a high hardness layer 533. In some embodiments, the film layer 531 may have a thickness of about 75 μm to about 125 μm, and each of the transparent adhesive layer 532 and the high hardness layer 533 may have a thickness of about 10 μm to about 20 μm, respectively. In some examples, the high hardness layer 533 may be a coating film, a film, a sheet, a thin film, a foil, or a sheet including plastic, metal, glass, or a hard coating.

[0120] According to one embodiment, Figure 8b The outer cover 500 in the embodiment may include a base material layer 530, a multilayer structure layer 520 and a shielding layer 510, and the base material layer 530 may include a transparent resin layer 531 and a high hardness layer 533. In some embodiments, the transparent resin layer 531 may have a thickness of about 1 μm to about 5 μm, and the high hardness layer 533 may have a thickness of about 10 μm to about 20 μm. In some embodiments, the transparent resin layer 531 may be a thin film pretreatment layer of an acrylate-based resin for adhesion. In some embodiments, the transparent resin layer 531 may contain a silane-based compound or a silane-based resin for bonding. In some embodiments, the high hardness layer 533 may be a coating film, a film, a film, a foil or a sheet containing plastic, metal, glass or a hard coating. In some embodiments, the high hardness layer 533 may contain glass, plastic or metal.

[0121] According to one embodiment, the outer cover (e.g. Figure 7 The outer cover 500) may be provided by the following manufacturing process.

[0122] According to an embodiment, the manufacturing process of the outer cover may include: forming a base material layer (eg, Figure 7 forming a multi-layer structure layer (eg, Figure 7 The multi-layer structure layer 520) (for example, Figure 6 and forming a shielding layer (eg, Figure 7 In some embodiments, the process may include: forming a base material layer; forming a multi-layer structure layer on the base material layer; and forming a shielding layer on the multi-layer structure layer.

[0123] According to one embodiment, the step of forming a base material layer includes forming a base material layer that can be used as an outer cover (e.g., Figure 7 The outermost functional layer of the outer cover 500) may be formed by coating, printing, adhering, depositing and bonding steps.

[0124] According to one embodiment, a multi-layer structure (eg Figure 7 The multi-layer structure layer 520) (e.g. Figure 6 The step of forming a multilayer structure 400 may include: forming a first pigment layer (eg Figure 6 forming a first pigment layer 410); forming a white layer (eg, Figure 6 and forming a second pigment layer (eg, Figure 6 In some embodiments, the process may include the step of forming a first pigment layer, the step of forming a white layer on the first pigment layer, and the step of forming a second pigment layer on the white layer. In some embodiments, the process may include the step of forming a second pigment layer, the step of forming a white layer on the second pigment layer, and the step of forming the first pigment layer on the white layer. In some embodiments, the multilayer structural layer may be directly printed or bonded to a portion of the base material. In some embodiments, the multilayer structural layer may be directly printed or bonded to a shielding layer. In some embodiments, an additional base material (e.g., a sacrificial substrate) (e.g., a release film) may be used to coat or print the multilayer structural layer.

[0125] According to one embodiment, the step of forming a multilayer structural layer may utilize a coating step or a printing step. According to one embodiment, the step of forming a multilayer structural layer may include a curing step. In some embodiments, the curing step may be performed after forming the first pigment layer, the second pigment layer, and the second pigment layer in sequential operations. In some embodiments, the curing process may include thermal curing, photocuring, or both, and, if necessary, a suitable curing agent or curing catalyst may be further added according to the curing step. For example, thermal curing can be performed by baking at a temperature of: about 50°C to about 100°C; about 60°C to about 80°C; or about 65°C to about 75°C, and the process time is: about 1 minute or longer; about 10 minutes or longer; about 30 minutes or longer; about 1 hour or longer, or about 2 hours or longer. For example, photocuring can be performed at about 10mJ / cm 2 About 1000mJ / cm 2 The process time may be about 1 minute or more, about 10 minutes or more, about 30 minutes or more, about 1 hour or more, or about 2 hours or more. The minimum and maximum process times may be selected from the process times described herein.

[0126] According to one embodiment, when forming a shielding layer (eg, Figure 7 In the step of forming a shielding layer 510), the multilayer structure layer (for example, Figure 7 The multi-layer structure layer 520) (for example, Figure 6 In some embodiments, in the step of forming the shielding layer, the shielding layer may be formed on the first pigment layer (eg, Figure 6 The first pigment layer 410) or the first pigment layer (eg, Figure 6 The first pigment layer 410) may be bonded to the shielding layer.

[0127] According to one embodiment, the step of forming the shielding layer may include a curing step. In some embodiments, the curing step may include thermal curing, photocuring, or both, and if necessary, additional curing agents or curing catalysts may be further added according to the curing step. For example, thermal curing can be performed by baking at a temperature of about 50°C to about 100°C; about 60°C to about 80°C; or about 65°C to about 75°C, with a process time of about 1 minute or more; about 10 minutes or more; about 30 minutes or more; about 1 hour or more, or about 2 hours or more. For example, photocuring can be performed at about 10mJ / cm 2 About 1000mJ / cm 2 The following process times are performed at a light dose (e.g., a wavelength of about 400 nm or less): about 1 minute or more; about 10 minutes or more; about 30 minutes or more; about 1 hour or more, or about 2 hours or more. The minimum and maximum process times can be selected from the process times described herein.

[0128] In one embodiment, the “printing” here may be but is not limited to pad printing, screen printing, gravure printing, etc.

[0129] According to one embodiment, the "coating" here may include but is not limited to spin coating, spray coating, flow coating, rod coating, die coating, slit coating, doctor blade coating, blade coating, reverse coating, transfer roller coating, gravure roller coating, cast coating, slit hole coating, calendering coating, etc.

[0130] According to one embodiment, the ink composition can be used in the "printing" step and the "coating" step herein, for example, the ink composition can be selected to have appropriate components and contents of solvents for the steps, which are not specifically mentioned herein.

[0131] According to one embodiment, a multilayer structure (e.g., Figure 6 The multi-layer structure 400) or the outer cover (e.g., Figure 7 , Figure 8a and Figure 8bThe outer cover 500) may be provided on the front surface, the rear surface, or each of the front surface and the rear surface of the electronic device.

[0132] For example, Figure 9a 1 is a perspective view showing a state where a multi-layer structure mounted on a front surface of an electronic device is viewed from the front, top, and side according to an embodiment of the present disclosure.

[0133] According to one embodiment, Figure 9a The multi-layer structure in Figure 6 The multilayer structure 400) may be mounted on a front panel 600A of an electronic device (eg, Figure 2 and Figure 3 The front panel 102 of the electronic device 100) or (for example, Figure 4 and Figure 5 The border printed lines 610, 620 and 630 of the display window 601 of the front panel 320 of the electronic device 300 are printed to achieve white (eg, pure white).

[0134] According to an embodiment, the front panel 600A may include a flat frame region 610 and a curved portion based on the display region 601, in which an upper frame region 620 on the upper side of the flat frame region 610 and a lower frame region 630 on the lower side of the flat frame region 610 are curved. A multilayer structure having a shape corresponding thereto (e.g., Figure 6 Multilayer structure 400).

[0135] For example, Figure 9b 1 is a perspective view illustrating a state where a multi-layer structure or an outer cover mounted on a rear surface of an electronic device is viewed from the front, top, and side according to an embodiment of the present disclosure.

[0136] According to one embodiment, Figure 9b The outer cover in the Figure 7 The outer cover 500 may be mounted on a rear panel 600B (eg, Figure 2 and Figure 3 The rear panel 111 of the electronic device 100) or (for example, Figure 4 and Figure 5 On a rear panel 380 of the electronic device 300 ).

[0137] According to an embodiment, the rear plate 600B may include a flat portion 640 and each of the curved left region 660, right region 670, upper region 680, and lower region 690. An outer cover having a shape corresponding thereto (eg, Figure 7 outer cover 500).

[0138] According to one embodiment, the embodiments of the present disclosure may relate to a multilayer structure including a white pigment (e.g., Figure 6The multilayer structure 400 of the present disclosure and the outer cover of the electronic device including the multilayer structure of the present disclosure (eg, Figure 7 In addition, embodiments of the present disclosure may relate to an electronic device (eg, Figure 2 and Figure 3 electronic device 100) or (for example, Figure 4 and Figure 5 electronic device 300).

[0139] In the related art, the outer cover can be made by applying ink to a material such as plastic (e.g., transparent plastic), glass, or film using pad printing, screen printing, etc. to produce a decorative exterior with color. The ink used at this time is applied once or several times to produce a printed surface with a desired hiding power. In the printing process, repeated printing layers are stacked to obtain hiding power. However, in the case of white (e.g., TiO 2 ) layer, it is difficult to ensure hiding power for white alone. When the white layer has insufficient hiding power, multiple colored layers (e.g., shielding layers) may be configured (e.g., back configuration) or a dark shielding layer may be configured. However, due to insufficient hiding power of the white layer in the multilayer structure, the color of the shielding layer may be transmitted and the whiteness may be reduced.

[0140] Therefore, according to the embodiment, the multilayer structure can provide a material (or component) that realizes aesthetics (e.g., color expression or color pattern) and functional performance suitable for the appearance of the electronic device (or required for the appearance of the electronic device), which can improve the hiding power of the white pigment and thus enhance the whiteness. However, the purpose of the present disclosure is not limited to the above description.

[0141] According to one embodiment, a multilayer structure (e.g., Figure 6 The multilayer structure 400 may include: 2 and a first pigment layer 410 of a filler pigment; a first pigment layer 410 containing TiO 2 and a white layer 420 comprising TiO 2 and a second pigment layer 430 of a extender pigment.

[0142] According to an embodiment, the first pigment layer 410 , the white layer 420 , and the second pigment layer 430 may be laminated structure layers formed through a coating step or a printing step.

[0143] According to one embodiment, the TiO in the white layer 420 2 The content may be higher than TiO in the first pigment layer 410, the second pigment layer 430, or both. 2 According to some embodiments, the TiO in the white layer 420 2The content may be higher than that of TiO in the first pigment layer 410 and the second pigment layer 430. 2 content.

[0144] According to one embodiment, the TiO 2 The content may be higher than that of TiO in the first pigment layer 410. 2 content.

[0145] According to one embodiment, the TiO in the first pigment layer 410 2 The content may be 10wt% to 40wt%. According to some embodiments, the TiO in the first pigment layer 410 2 The content may be 25 wt % to about 35 wt %.

[0146] According to one embodiment, the TiO 2 The content may be about 30 wt % to about 50 wt %. According to some embodiments, the TiO 2 The content may be about 40 wt % to about 50 wt %.

[0147] According to one embodiment, the TiO in the white layer 420 2 The content may be about 40 wt % to about 70 wt %. According to some embodiments, the TiO in the white layer 420 2 The content may be about 60 wt % to about 70 wt %.

[0148] According to an embodiment, the content of the extender pigment in the first pigment layer 410 may be higher than the content of the extender pigment in the second pigment layer 430 .

[0149] According to one embodiment, the content of the extender pigment in the first pigment layer 410 may be 10 wt % to 50 wt % According to some embodiments, the content of the extender pigment in the first pigment layer 410 may be 30 wt % to 40 wt %.

[0150] According to one embodiment, the content of the extender pigment in the second pigment layer 430 may be 5 wt % to 30 wt %. According to some embodiments, the content of the extender pigment in the second pigment layer 430 may be 5 wt % to 10 wt %.

[0151] According to an embodiment, the thickness of the second pigment layer 430 may be thinner than the thickness of the first pigment layer 410 or the white layer 420 .

[0152] According to an embodiment, each of the thicknesses of the first pigment layer 410 , the second pigment layer 430 , and the white layer 420 may be 0.5 μm to 150 μm.

[0153] According to one embodiment, the second pigment layer 430 may further include a coloring dye. According to one embodiment, the second pigment layer 430 may further include a coloring dye, and the coloring dye may include an inorganic dye, an organic dye, or both.

[0154] According to an embodiment, the content of the coloring dye in the second pigment layer 430 may be about 0.1 wt % to about 10 wt %.

[0155] According to one embodiment, an outer cover of an electronic device (eg, Figure 7 , Figure 8a or Figure 8b The outer cover 500 may include: a shielding layer 510; a multilayer structure layer 520 on the shielding layer 510 (for example, on the surface); and a base material layer 510 on the multilayer structure layer 520 (on the surface), and the multilayer structure layer 530 may include: a layer including TiO 2 and a first pigment layer of a body pigment; on the first pigment layer 410 including TiO 2 and a white layer comprising TiO 2 and a second pigment layer of body pigment.

[0156] According to an embodiment, the multi-layer structure layer 520 in the outer cover of the electronic device may include the multi-layer structure according to an embodiment of the present disclosure (eg, Figure 6 Multilayer structure 400).

[0157] According to an embodiment, the base material layer 530 may include a single layer or multiple layers including at least one or a combination of polymer, glass, or metal.

[0158] According to an embodiment, the base material layer 530 may include a single layer or multiple layers including at least one or more or a combination of a coating layer (eg, a printing layer), a film, or a thin film.

[0159] According to an embodiment, the base material layer 530 may include an adhesive layer, a primer layer, or a surface modification layer.

[0160] According to an embodiment, the base material layer 530 may include at least one or more or a combination of a transparent layer, a semi-transparent layer, or an opaque layer.

[0161] According to an embodiment, the base material layer 530 may have a thickness of about 0.5 μm to about 150 μm.

[0162] According to an embodiment, the shielding layer 510 may have a thickness of about 0.5 μm to about 10 μm.

[0163] According to one embodiment, an electronic device (eg, Figure 2 and Figure 3electronic device 100) or (for example, Figure 4 and Figure 5 The electronic device 300 may include a multilayer structure according to an embodiment of the present disclosure (eg, Figure 6 The multi-layer structure 400) or the outer cover (e.g., Figure 7 , Figure 8a or Figure 8b outer cover 500).

[0164] According to one embodiment, a multilayer structure (e.g., Figure 6 The multi-layer structure 400) or the outer cover (e.g., Figure 7 , Figure 8a or Figure 8b The outer cover 500) may be included in at least a portion of the exterior of the electronic device.

[0165] According to an embodiment, the electronic device may include a multi-layer structure (eg, Figure 6 The multi-layer structure 400) or the outer cover (e.g., Figure 7 , Figure 8a or Figure 8b outer cover 500).

[0166] According to an embodiment, the electronic device may include a multi-layer structure (eg, Figure 6 Multilayer structure 400).

[0167] According to an embodiment, the electronic device may be a mobile electronic device.

[0168] According to an embodiment, the electronic device may be a portable electronic device.

[0169] The electronic device according to the embodiments disclosed herein may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance device. According to the embodiments of the present disclosure, the electronic device is not limited to those described above.

[0170] It should be understood that the embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, and include various changes, equivalents or replacements of the corresponding embodiments. In conjunction with the description of the accompanying drawings, the same reference numerals may be used for similar or related parts. It will be understood that, unless the relevant context clearly indicates otherwise, the singular form of the noun corresponding to an item may include one or more things. As used herein, each of "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one of the items listed together in the corresponding one in the phrase or all possible combinations thereof. Terms such as "first" or "second" are only used to distinguish a component from another component, and do not limit components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled”, “coupled to”, “connected to” or “connected to” another element (e.g., a second element), with or without the term “operably” or “communicatively”, it means that the element can be coupled to the other element directly (e.g., by wire), wirelessly or via a third element.

[0171] As used in conjunction with embodiments of the present disclosure, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "component," or "circuit"). A module may be a single integrated component or its smallest unit or portion adapted to perform one or more functions. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0172] The embodiments as set forth herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138), which may be read by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of a machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute it. This allows the machine to be operated to perform at least one function according to at least one instruction called. One or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" merely means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0173] According to an embodiment, the method according to the embodiments disclosed herein may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or via an application store (e.g., PlayStore). TM ) online distribution (e.g., download or upload), or directly between two user devices (e.g., smartphones). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a relay server).

[0174] According to an embodiment, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be individually arranged in different components. According to an embodiment, one or more of the above-mentioned components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as performed by a corresponding one of the multiple components before integration. According to an embodiment, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or heuristically, or one or more of the operations may be performed or omitted in a different order, or one or more other operations may be added.

Claims

1. A multilayer structure comprising: A first pigment layer (410) comprising TiO2 and a body pigment; a white layer (420) comprising TiO2, on the first pigment layer (410); as well as A second pigment layer (430) comprising TiO2 and an extender pigment is on the white layer (420).

2. The multilayer structure of claim 1, wherein the TiO2 content in the white layer (420) is higher than the TiO2 content in the first pigment layer (410), the second pigment layer (430), or both.

3. The multilayer structure according to claim 1 or 2, wherein the TiO2 content of the second pigment layer (430) is higher than the TiO2 content of the first pigment layer (410).

4. The multilayer structure according to claim 1, wherein The TiO2 content in the first pigment layer (410) is 10wt% to 40wt%, or The TiO2 content of the second pigment layer (430) is 30wt% to 50wt%.

5. The multilayer structure according to one of claims 1 to 4, wherein the TiO2 content in the white layer (420) is 40 wt% to 70 wt%.

6. The multilayer structure according to one of claims 1 to 5, wherein the content of the extender pigment in the first pigment layer (410) is higher than the content of the extender pigment in the second pigment layer (430).

7. The multilayer structure according to claim 1, wherein The content of the extender pigment in the first pigment layer (410) is 10wt% to 50wt%, or The content of the extender pigment in the second pigment layer (430) is 5wt% to 30wt%.

8. The multilayer structure according to one of claims 1 to 7, wherein the thickness of the second pigment layer (430) is thinner than the thickness of the first pigment layer (410) or the white layer (420).

9. The multilayer structure according to one of claims 1 to 8, wherein each of the thicknesses of the first pigment layer (410), the second pigment layer (430) and the white layer (420) is 0.5 micrometers (μm) to 150 μm.

10. The multilayer structure according to one of claims 1 to 9, wherein the second pigment layer (430) further comprises a coloring dye.

11. The multilayer structure according to one of claims 1 to 10, wherein the content of the coloring dye in the second pigment layer (430) is 0.1 wt% to 10 wt%.

12. An outer cover of an electronic device, comprising: Shielding layer (510); A multi-layer structure layer (520) on the shielding layer; as well as a base material layer (530) on the multi-layer structure layer (520), The multi-layer structure layer (520) comprises: A first pigment layer (410) comprising TiO2 and an extender pigment; a white layer (420) comprising TiO2 on the first pigment layer (410); and A second pigment layer (430) comprising TiO2 and a filler pigment is disposed on the white layer (420).

13. The outer cover according to claim 12, wherein the multilayer structural layer (520) comprises a multilayer structure according to one of claims 1 to 11.

14. An electronic device comprising the multilayer structure according to one of claims 1 to 11 or the outer cover according to one of claims 13 to 17.

15. The electronic device according to claim 14, comprising: The multi-layer structure, on the frame of the front surface, or The outer cover is on the rear surface.

Images