Temperature detection device for food materials and control circuit board thereof

Abstract

According to the food material temperature detection device and the control circuit board thereof, the control circuit board is provided with a main body part and an extension part, and an antenna and an onboard conductor wire are respectively and fixedly arranged on the extension part, so that the antenna and the onboard conductor wire can be kept at fixed relative positions, the consistency of the positions of the antenna and the onboard conductor wire is improved, and the detection accuracy is improved. And interference on antenna communication signals caused by shaking of the antenna and the onboard conductor wire is reduced. Moreover, compared with the mode that the antenna and the onboard conductor wire are arranged on the same base material layer, the extension part is provided with at least two layers of base material layers which are stacked and fixed, the antenna and the onboard conductor wire are further fixedly arranged on different base material layers, the space in the stacking direction of the base material layers is fully utilized, the distance between the antenna and the onboard conductor wire is increased, and the antenna and the onboard conductor wire are separated from each other. The antenna communication effect is improved. Meanwhile, the width size of the base material layer can be reduced, so that the width of the extension part can be further reduced, and more space is reserved for other parts in the temperature detection device.

Description

Temperature detection device for food and control circuit board thereof Technical Field

[0001] The present application relates to the field of food cooking, and in particular to a temperature detection device for detecting the temperature of food. Background Art

[0002] With the advancement of technology and the increasing demand for taste and nutrition of food, people expect to more accurately control the temperature elements in the cooking process, such as more precise control of the temperature of food.

[0003] In meat or other similar ingredients, there is often a large difference between the surface temperature and the internal temperature, especially the temperature in the center of the ingredient is usually the lowest. In order to detect the temperature near the center of the ingredient, the temperature detection device is usually designed to be insertable into the ingredient, such as a needle-shaped structure, so that it can be inserted into the interior of the ingredient to obtain the temperature of the interior of the ingredient (such as the center area).

[0004] Usually, in order to continuously obtain the temperature of the ingredients, during the cooking process of the ingredients, the temperature detection device remains inserted into the ingredients and remains in the cooking space (such as an oven, steamer, fryer, etc.) together with the ingredients. The temperature detection device communicates wirelessly with external devices (such as a cooking host, mobile terminal, etc.) through the antenna inside it. The antenna is usually electrically connected to the control circuit board of the temperature detection device in the form of a cable. In this structure, other movable conductive cables are also provided around the antenna, such as the connecting cable of the temperature sensor (such as NTC) for detecting the ambient temperature of the cooking space, and the charging cable, etc. These conductive cables will interfere with the communication signal of the antenna, resulting in poor communication or inaccurate information transmission. Technical Issues

[0005] This application mainly provides a temperature detection device for food and a control circuit board thereof, which are used to improve the communication effect of the antenna. Technical Solution

[0006] Based on the above purpose, an embodiment of the present application provides a temperature detection device for food, comprising:

[0007] A shell having a front end capable of being inserted into food and a rear end opposite to the front end, wherein the shell forms a mounting cavity;

[0008] and a control circuit board, wherein the control circuit board is arranged in the installation cavity;

[0009] The control circuit board has a main body and an extension part extending backward from the main body, the main body has a control circuit, and the control circuit has an antenna signal processing unit; the extension part has at least two stacked and fixed substrate layers, the extension part is provided with an antenna and an on-board conductive wire, and the antenna and the on-board conductive wire are respectively fixed on different substrate layers; the antenna is electrically connected to the antenna signal processing unit; the on-board conductive wire is used to electrically connect the control circuit with other components.

[0010] In one embodiment, the substrate layer provided with the antenna is an antenna layer, and in the stacking direction of the substrate layers, the antenna layer is located at the outermost side.

[0011] In one embodiment, the substrate layer is at least three layers, and in the stacking direction of the substrate layers, the two outermost substrate layers are both the antenna layers, and the antennas on the two antenna layers are electrically connected to each other;

[0012] The substrate layer provided with the on-board conductive wires is located between the two antenna layers.

[0013] In one embodiment, a substrate layer located between the two antenna layers is provided with a first conductive via, and the first conductive vias are conductively connected to each other to electrically connect the antennas on the two antenna layers.

[0014] In one embodiment, one antenna layer is a first antenna layer, and the other antenna layer is a second antenna layer; on the first antenna layer, its antenna is electrically connected to the antenna signal processing unit through a conductive wire.

[0015] In one embodiment, the first antenna layer is provided with a first impedance matching structure, and the first impedance matching structure is provided on both sides of the conductive line.

[0016] In one embodiment, a second impedance matching structure is provided on the second antenna layer, the second impedance matching structure corresponds to the position of the first impedance matching structure, and is electrically connected to the first impedance matching structure through a second conductive via.

[0017] In one embodiment, it further comprises an environment temperature detection unit, which is disposed on the housing and is used to detect the temperature of the cooking environment of the food;

[0018] The on-board conductive wire has a first detection unit wire and a second detection unit wire, which electrically connect the ambient temperature detection unit with the control circuit. The substrate layer where the first detection unit wire and the second detection unit wire are located is located on the inner side of the antenna layer. The antenna layer has a first contact and a second contact for electrically connecting the ambient temperature detection unit. The first contact is electrically connected to the first detection unit wire, and the second contact is electrically connected to the second detection unit wire.

[0019] In one embodiment, the first detection unit wire and the second detection unit wire are fixed on the same substrate layer or are respectively fixed on different substrate layers, the first detection unit wire is electrically connected to the first contact through a third conductive via, and the second detection unit wire is electrically connected to the second contact through a fourth conductive via.

[0020] In one embodiment, the substrate layer provided with the first detection unit wire is the first detection unit wire layer, and the substrate layer provided with the second detection unit wire is the second detection unit wire layer. The first detection unit wire layer and the second detection unit wire layer are different substrate layers and are stacked on each other.

[0021] In one embodiment, the first detection unit conductor layer has a third impedance matching structure, and the third impedance matching structure is arranged on both sides of the first detection unit conductor; and / or the second detection unit conductor layer has a fourth impedance matching structure, and the fourth impedance matching structure is arranged on both sides of the second detection unit conductor.

[0022] In one embodiment, the on-board conductive wire has a charging wire, the control circuit has a charging circuit, and the charging wire is electrically connected to the charging circuit; the substrate layer provided with the charging wire is a charging wire layer, the charging wire layer is located on the inner side of the antenna layer, and the antenna layer has a charging connection end, and the charging connection end is electrically connected to the charging wire.

[0023] In one embodiment, the shell includes a metal segment and an insulating segment, the insulating segment is provided with a metal conductive member, the metal conductive member is electrically connected to the charging connection end, the metal segment is electrically connected to the charging circuit, and the metal conductive member and the metal segment respectively serve as one of the positive and negative electrodes of the charging circuit to achieve charging.

[0024] In one embodiment, the metal conductive component is exposed outside the insulating section; the metal conductive component extends to the charging connection end of the antenna layer and is electrically connected to the charging connection end.

[0025] In one embodiment, the charging connection terminal has a fifth conductive via, the metal conductive member has a mounting hole, and the charging connection terminal and the metal conductive member are fixed and electrically connected by passing a conductive screw through the fifth conductive via and the mounting hole.

[0026] In one embodiment, the charging line layer is located between the antenna layer and the first detection unit wire layer, or between the antenna layer and the second detection unit wire layer, and the charging connection end is electrically connected to the charging line through a fifth conductive hole.

[0027] In one embodiment, the substrate layer adjacent to the antenna layer is a clearance layer, and the clearance layer is not provided with an antenna and an on-board conductive wire.

[0028] In one embodiment, the antenna and the on-board conductive wire are attached to the surface of the substrate layer.

[0029] In one embodiment, the antenna and the on-board conductive wire are fixed on the surface of the substrate layer by a printing or spraying process.

[0030] In one embodiment, the shell has a safety zone mark, the control circuit is located in front of the safety zone mark, and the antenna, the ambient temperature detection unit and the charging connection terminal are located in the rear of the safety zone mark.

[0031] In one embodiment, the shell includes a metal segment and an insulating segment, the insulating segment is located behind the metal segment, the safety zone mark is located on the metal segment, and the antenna is located in the insulating segment.

[0032] Based on the above purpose, an embodiment of the present application provides a temperature detection device for food, comprising:

[0033] A shell having a front end capable of being inserted into food and a rear end opposite to the front end, wherein the shell forms a mounting cavity;

[0034] and a control circuit board, wherein the control circuit board is arranged in the installation cavity;

[0035] The control circuit board has a main body and an extension part extending backward from the main body, the main body having a control circuit, and the control circuit having an antenna signal processing unit; the extension part has at least two stacked and fixed substrate layers, the extension part is provided with an antenna and an on-board conductive wire, and the antenna and the on-board conductive wire are fixed on the extension part; the antenna is electrically connected to the antenna signal processing unit; the on-board conductive wire is used to electrically connect the control circuit with other components.

[0036] Based on the above purpose, an embodiment of the present application provides a control circuit board of a temperature detection device, including a main body and an extension part extending backward from the main body, the main body having a control circuit, the control circuit having an antenna signal processing unit; the extension part having at least two stacked and fixed substrate layers, the extension part being provided with an antenna and an on-board conductive wire, the antenna and the on-board conductive wire being respectively fixed on different substrate layers; the antenna is electrically connected to the antenna signal processing unit; the on-board conductive wire is used to electrically connect the control circuit with other components. Beneficial Effects

[0037] According to the temperature detection device of some of the above embodiments, its control circuit board has a main body and an extension part, and the antenna and the onboard conductive wire are fixedly arranged on the extension part respectively, so that the antenna and the onboard conductive wire can be kept in a fixed relative position, thereby improving the consistency of the positions of the antenna and the onboard conductive wire, and reducing the interference to the antenna communication signal caused by the shaking of the antenna and the onboard conductive wire. Moreover, compared with setting the antenna and the onboard conductive wire on the same substrate layer, the extension part has at least two layers of stacked and fixed substrate layers, and the antenna and the onboard conductive wire are further fixedly arranged on different substrate layers, making full use of the space in the stacking direction of the substrate layers, increasing the distance between the antenna and the onboard conductive wire, and improving the antenna communication effect. At the same time, the width of the substrate layer can also be reduced, so the width of the extension part can be further reduced, reserving more space for other components in the temperature detection device.

[0038] According to some of the above-mentioned embodiments of the temperature detection device, the control circuit board thereof has a main body and an extension portion, and the antenna and the onboard conductive wire are respectively fixed on the extension portion, so that the antenna and the onboard conductive wire can be kept in a fixed relative position, avoiding the shaking of the antenna and the onboard conductive wire, improving the consistency of the position of the antenna and the onboard conductive wire, and reducing the interference to the antenna communication signal caused by the shaking of the antenna and the onboard conductive wire.

[0039] According to the control circuit board of some of the above embodiments, the control circuit board has a main body and an extension extending backward from the main body, the main body has a control circuit, and the control circuit has an antenna signal processing unit. The extension has at least two layers of laminated and fixed substrate layers, the extension is provided with an antenna and an onboard conductive wire, the antenna and the onboard conductive wire are respectively fixed on different substrate layers to keep the antenna and the onboard conductive wire in a fixed relative position, and at the same time, the structure can also reduce the width of the extension, and reserve more installation space for other components around the extension. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] FIG1 is a schematic diagram of the appearance structure of a temperature detection device in one embodiment of the present application;

[0041] FIG2 is an exploded schematic diagram of a temperature detection device in one embodiment of the present application;

[0042] FIG3 is an exploded schematic diagram of a control circuit board, an ambient temperature detection unit, and a metal conductive member in one embodiment of the present application;

[0043] FIG4 is a schematic diagram of the structure of a control circuit board in one embodiment of the present application;

[0044] FIG5 is a cross-sectional schematic diagram of a housing, a control circuit board, an ambient temperature detection unit, and a metal conductive member in an embodiment of the present application;

[0045] FIG6 is a schematic diagram of a stacked structure of substrate layers of an extension portion of a control circuit board in an embodiment of the present application;

[0046] FIG. 7 is a schematic diagram of circuits on each substrate layer on the extension portion in one embodiment of the present application. The figure omits each substrate layer and shows the circuits of each substrate layer in the same plane to facilitate the overall electrical connection between the temporary antenna and the onboard conductive wire;

[0047] FIG8 is a schematic diagram of a circuit on a first antenna layer in an embodiment of the present application;

[0048] FIG9 is a schematic diagram of a circuit on a clearance layer in one embodiment of the present application;

[0049] FIG10 is a schematic diagram of a circuit on a first detection unit conductor layer in an embodiment of the present application;

[0050] FIG11 is a schematic diagram of a circuit on a conductor layer of a second detection unit in one embodiment of the present application;

[0051] FIG12 is a schematic diagram of a circuit on a charging line layer in one embodiment of the present application;

[0052] FIG13 is a schematic diagram of a circuit on a second antenna layer in an embodiment of the present application;

[0053] FIG. 14 is a schematic diagram of electrical connections between an antenna signal processing unit and a charging circuit and other structures in a control circuit in an embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention

[0054] The present application is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are intended to enable the present application to be better understood. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the present application are not shown or described in the specification, in order to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0055] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations. At the same time, the steps or actions in the method description can also be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment and are not meant to be a required sequence, unless otherwise specified that a certain sequence must be followed.

[0056] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0057] The present application provides a temperature detection device for food, which can be inserted into the food during the cooking process to detect the temperature inside the food, especially to obtain the lowest temperature inside the food as accurately as possible. The food can be in any cooking state, including but not limited to: steaming, boiling, baking, roasting, frying, deep-frying, etc. or heat-treated by any other means. Of course, the temperature detection device can be directly placed in the measured environment for temperature measurement. The measured environment includes but is not limited to: cooking environment, etc.

[0058] 1-5, the temperature detection device 1 includes a housing 100, a control circuit board 200, and an ambient temperature detection unit 300. Of course, in some embodiments, the temperature detection device 1 may also include other related components according to other functional requirements, such as a food temperature detection unit 400 for detecting the temperature of food, or a battery for power supply, etc.

[0059] The housing 100 is used to protect and install components that realize the functions of the temperature detection device 1 (such as the food temperature detection unit 400, the control circuit board 200, the battery and / or the ambient temperature detection unit 300, etc.). The housing 100 forms an installation cavity for accommodating and installing other components. In some embodiments, the housing 100 can be a structure with a cavity inside, and the functional components of the temperature detection device 1 can be arranged in the cavity inside the housing 100. In some embodiments, there can be one cavity inside the housing 100, and the functional components of the temperature detection device 1 can be arranged in the cavity; there can also be multiple cavities inside the housing 100, and one or more functional components of the temperature detection device 1 can be arranged in each cavity. One or more cavities can be of any shape as long as they do not affect the installation of the functional components of the temperature detection device 1.

[0060] 1-5 , in some embodiments, the housing 100 may be assembled from a plurality of parts. In other embodiments, the housing 100 may also be formed from one part.

[0061] In some embodiments, the housing 100 may wrap the functional components of the temperature detection device 1, that is, the housing 100 may be located at the outermost layer of the temperature detection device 1 to block the outside from contacting the components inside the housing 100. In some embodiments, the housing 100 may not completely wrap the functional components of the temperature detection device 1, for example, part of the ambient temperature detection unit 300 may be located outside the housing 100 to facilitate temperature measurement.

[0062] Please refer to Figures 1-5. In some embodiments, the housing 100 has a front end that can be inserted into the food and a rear end opposite to the front end. For example, one end of the housing 100 having a pointed protrusion is the front end, and the pointed protrusion can facilitate the insertion of the temperature detection device 1 into the object to be measured for temperature measurement. In some embodiments, the housing 100 can be formed into a long strip structure, for example, a tubular structure. In some embodiments, the front end diameter of the long strip structure of the housing 100 gradually decreases until it is close to 0, forming a closed sharp front end. In some embodiments, the housing 100 can be a hollow tubular structure with one end closed, and the functional components of the temperature detection device 1 can be installed inside the hollow tubular structure. In some embodiments, the cross-section of the housing 100 can be circular, elliptical, triangular, rectangular, polygonal or special-shaped. In some embodiments, in order to facilitate the handheld temperature detection device 1 to measure temperature, one end (such as the rear end) of the housing 100 can be provided with a handle portion that is easy to hold, and in some embodiments, the handle portion can be arranged away from the front end. In some embodiments, the material of the housing 100 can have a certain hardness to maintain the shape of the housing 100 and play a certain role in protecting the internal functional components.

[0063] The control circuit board 200 is arranged in the installation cavity of the housing 100, and can be fixed on the housing 100 directly or indirectly. The control circuit board 200 has a control circuit 211, and the control circuit 211 is used to control part or all of the functions of the temperature detection device 1, such as but not limited to the control of each sensor, the reception, processing and transmission of temperature signals, the communication control with other devices, and / or the charging of the device. The control circuit 211 can adopt various circuits and / or structures that can realize information processing and logical judgment, such as a processor, a memory and other devices.

[0064] The environment temperature detection unit 300 is electrically connected to the control circuit 211, and the environment temperature detection unit 300 is used to detect the temperature of the measured environment (such as the cooking environment). The food temperature detection unit 400 is electrically connected to the control circuit 211, and the food temperature detection unit 400 is used to detect the temperature of the food. The measured environment temperature can be used to help but not limited to the control circuit 211 to better judge the real temperature of the food, etc., which can be achieved by the existing technology and will not be repeated here. The environment temperature detection unit 300 is arranged in the housing 100, which can be completely built into the housing 100, or partially exposed from the housing 100 to detect the temperature of the cooking environment. The food temperature detection unit 400 and the environment temperature detection unit 300 have a structure that can directly or indirectly detect the temperature, and any feasible solution can be used to realize the temperature detection. For example, in some embodiments, the food temperature detection unit 400 and the environment temperature detection unit 300 have an element for sensing heat to obtain temperature information. In some embodiments, the food temperature detection unit 400 and the environment temperature detection unit 300 can be sensors that detect temperature or temperature-related signals and convert them into usable output signals.

[0065] In some embodiments, the sensor may be a thermocouple (TC), a resistance temperature detector (RTD), a thermistor, or any combination thereof. In some embodiments, in order to make the temperature measurement speed fast, the sensor may be a thermocouple. A thermocouple is composed of two conductors of different components connected at both ends to form a loop, wherein one end directly used to measure the temperature is the temperature measuring end, and the other end is the compensation end. In some embodiments, the sensor may be a negative temperature coefficient (NTC) type thermistor. The thermistor is composed of a thermistor probe (temperature measuring end), a conductive connection end, and a housing 100.

[0066] Please refer to FIG4 , in some embodiments, the control circuit board 200 has a main body 210 and an extension 220 extending backward from the main body 210. The main body 210 and the extension 220 form an integrated structure, which includes a fixed connection between the two (such as welding, bonding, clamping, screw fixing, etc.), and also includes an integral structure in which the two are manufactured as one (that is, the main body 210 and the extension 220 are different regions of the same circuit board).

[0067] The control circuit 211 is disposed on the main body 210, and the control circuit 211 can be used as the main control part of the entire control circuit board 200. For example, in some embodiments, please refer to FIG. 14, the control circuit 211 can have an antenna signal processing unit 2111, etc., to realize data processing and instruction sending. The antenna signal processing unit 2111 can be used to control the signal transmission and reception of the antenna and process the antenna signal.

[0068] Please refer to Figures 4 and 6. In some embodiments, the extension part 220 has at least two layers of laminated and fixed substrate layers 221. Each substrate layer 221 is used to set a corresponding circuit. The substrate layer 221 is made of insulating material. For example, in some embodiments, various materials that can be used as circuit board substrates can be selected. Of course, the main body 210 can also be made of the same material as the extension part 220 to form the final main body 210. In some embodiments, the main body 210 can adopt the same substrate layer 221 laminated structure as the extension part 220. The same layer of substrate layer 221 corresponding to each other on the main body 210 and the extension part 220 can be the same complete substrate, that is, at least two layers of substrate layers 221 are laminated to form the entire control circuit board 200, and the control circuit board 200 divides each area into the main body 210 and the extension part 220 according to the different circuit structures. Of course, in some other embodiments, the main body 210 and the extension part 220 can also be two separate components, which are manufactured separately. The main body 210 may not have the same stacked structure as the extension portion 220. In some embodiments, the control circuit 211 of the main body 210 may be arranged on the same substrate layer 221. As long as the control circuit 211 on the main body 210 can perform related functions, such as realizing the signal reception and transmission of the antenna, the detection of ambient temperature, and the charging of the device, the structure of the main body 210 may adopt any feasible scheme.

[0069] In some embodiments, the extension portion 220 is provided with an antenna 222 and an onboard conductive wire 223, and the antenna 222 is electrically connected to the antenna signal processing unit 2111. The onboard conductive wire 223 refers to a conductive circuit fixedly arranged on the extension portion 220 of such an onboard structure, and the conductive circuit is used to electrically connect the control circuit 211 with other components, and other components may be, for example, but not limited to, an ambient temperature detection unit 300 and / or a charging electrode, etc. The antenna 222 and the onboard conductive wire 223 are fixedly arranged on the extension portion 220, which not only ensures the stability of the position of the antenna 222, but also ensures the stability of the position of the onboard conductive wire 223, and keeps the antenna 222 and the onboard conductive wire 223 at fixed relative positions, thereby improving the consistency of the positions of the antenna 222 and the onboard conductive wire 223, avoiding the shaking of the antenna 222 and the onboard conductive wire 223, thereby reducing the interference to the communication signal of the antenna 222 caused by the shaking of the antenna 222 and the onboard conductive wire 223, and improving the communication effect of the antenna 222.

[0070] At the same time, compared with setting the antenna 222 and the onboard conductive wire 223 on the same substrate layer 221, in some embodiments, the antenna 222 and the onboard conductive wire 223 are further fixedly set on different substrate layers 221, making full use of the space in the stacking direction of the substrate layer 221 (as shown in a2 in Figure 6), which can not only increase the distance between the antenna 222 and the onboard conductive wire 223 and improve the communication effect of the antenna 222. In addition, the width of the substrate layer 221 can be reduced (as shown in a1 in Figures 4 and 6), and the width of the entire extension part 220 can also be further reduced, reserving more space for other components in the temperature detection device 1, which is conducive to reducing the size of the entire temperature detection device 1 in the width direction.

[0071] Of course, in other embodiments, the antenna 222 and the onboard conductive wire 223 may also be disposed on the same substrate layer 221, so as to reduce the thickness of the extension 220 and the difficulty of processing and manufacturing. For example, in some embodiments, the extension 220 has a substrate layer 221, and the antenna 222 and the onboard conductive wire 223 are fixedly disposed on one or both sides of the substrate layer 221.

[0072] In order to fix the antenna 222 and the onboard conductive wire 223 on the substrate layer 221, in some embodiments, the antenna 222 and the onboard conductive wire 223 are attached to the surface of the substrate layer 221. In some embodiments, the antenna 222 and the onboard conductive wire 223 can be fixed to the surface of the substrate layer 221 by printing or spraying, so that the antenna 222 and the onboard conductive wire 223 are attached to the surface of the substrate layer 221. Of course, in other embodiments, other feasible methods can also be used to fix the antenna 222 and the onboard conductive wire 223 on the surface of the substrate layer 221.

[0073] Further, when the antenna 222 and the onboard conductive wire 223 are arranged on different substrate layers 221, when the stacking arrangement is specifically performed, the antenna 222 and the onboard conductive wire 223 can be arranged on any different layers of the substrate layer 221. The antenna 222 can be arranged on the outermost substrate layer 221, or on the middle substrate layer 221. Similarly, the onboard conductive wire 223 can also be arranged on the outermost substrate layer 221 or the middle substrate layer 221. The onboard conductive wire 223 can be one or more types depending on the connection object, for example, it can be one or two of the charging wire and the conductor of the ambient temperature detection unit. When there are more than two types of onboard conductive wires 223, these different types of onboard conductive wires 223 can be partially or completely arranged on the same layer of substrate layer 221, or different types of onboard conductive wires 223 can be independently dispersed on different substrate layers 221.

[0074] Please refer to Figures 6, 8 and 13. In some embodiments, the base layer 221 provided with the antenna 222 is an antenna layer (such as 2211, 2216). In the stacking direction of the base layer 221, the antenna layer is located at the outermost side. As shown in Figure 6, the outermost side can be the uppermost side in the illustrated direction (such as 2211) or the lowermost side in the illustrated direction (such as 2216). When the antenna layer is arranged at the outermost side, it can better ensure that the antenna 222 can receive and send signals more efficiently.

[0075] In some embodiments, when the antenna layer is located at the outermost side, the onboard conductive line 223 may be disposed on one or more substrate layers 221 inside the antenna layer. When the antenna layer is one of the outermost substrate layers (the uppermost substrate layer 221 as shown in FIG. 6 ), the onboard conductive line 223 may be disposed on another outermost substrate layer (the lowermost substrate layer 221 as shown in FIG. 6 ).

[0076] Of course, in some embodiments, the onboard conductive wire 223 may also be disposed on the antenna layer.

[0077] Further, please refer to Figures 6, 8 and 13. In some embodiments, the substrate layer 221 is at least three layers. In the stacking direction of the substrate layer 221, the two outermost substrate layers 221 are both antenna layers (such as 2211 and 2216), and the antennas 222 on the two antenna layers (such as 2211 and 2216) are electrically connected to each other. The advantage of setting two antenna layers is that, without changing the width of the substrate layer 221 and the extension portion 220 (as shown in a1 in Figures 4 and 6), the space in the stacking direction (as shown in a2 in Figure 6) can be used to increase the area of ​​the antenna 222, thereby improving the ability of the antenna 222 to send and receive signals and the communication effect. In other embodiments, more substrate layers 221 can also be set as antenna layers, such as using one or more intermediate substrate layers 221 as antenna layers.

[0078] Further, please refer to Figures 8 and 13. In some embodiments, in order to further increase the area of ​​the antenna 222 and thus improve the communication effect, the antenna 222 can be configured as a planar antenna, one end of which is an arc surface, to facilitate signal conduction and radiation. Of course, in other embodiments, the antenna 222 can also be configured as other planar structures other than Figures 8 and 13, and can also be configured as other shapes and structures that can realize wireless signal transmission and reception.

[0079] Further, please refer to FIG. 6 and FIG. 8-13. In order to realize the conductive connection of two or more antenna layers in the stacking direction, in some embodiments, the antenna layer (such as 2211, 2216) and the substrate layer 221 located between the two antenna layers (such as 2211, 2216) are provided with a first conductive via 2251. The first conductive vias 2251 are conductively connected to each other to electrically connect the antennas 222 on the two antenna layers (such as 2211, 2216). Specifically, the first conductive vias 2251 on each substrate layer 221 are arranged through the substrate layer 221, and the hole wall of the first conductive via 2251 is provided with a conductive material. After each substrate layer 221 is stacked, the first conductive vias 2251 of adjacent substrate layers 221 can be conductively connected together in sequence.

[0080] Of course, in other embodiments, the antenna layer may also be electrically connected in other ways, such as by a cable.

[0081] Further, please refer to Figures 6, 8, 13 and 14. In some embodiments, one antenna layer is a first antenna layer 2211, and the other antenna layer is a second antenna layer 2216. The first antenna layer 2211 can be either the uppermost layer shown in Figure 6 or the lowermost layer shown in Figure 6. On the first antenna layer 2211, the antenna 222 is electrically connected to the antenna signal processing unit 2111 through a conductive line 2221. The antenna 222 on the second antenna layer 2216 can also be electrically connected to the antenna signal processing unit 2111 through the conductive line 2221 and the first antenna layer 2211.

[0082] Please refer to FIG8 , in some embodiments, in order to facilitate the antenna 222 signal to be better transmitted in a set direction, the first antenna layer 2211 is provided with a first impedance matching structure 2241, and the first impedance matching structure 2241 is provided on both sides of the conductive line. The first impedance matching structure 2241 can help the antenna 222 signal to be transmitted in a set direction, for example, to the rear end of the housing 100.

[0083] Please refer to FIG. 13 . In some embodiments, in order to better constrain the transmission of the antenna 222 signal, when there is a second antenna layer 2216, a second impedance matching structure 2242 is provided on the second antenna layer 2216. The second impedance matching structure 2242 corresponds to the position of the first impedance matching structure 2241. For example, on a plane perpendicular to the stacking direction of the substrate layer 221 (as shown by a2 in FIG. 6 ), the projections of the second impedance matching structure 2242 and the first impedance matching structure 2241 partially overlap or completely overlap. The second impedance matching structure 2242 and the first impedance matching structure 2241 can be electrically connected to the first impedance matching structure 2241 through the second conductive via 2252.

[0084] Further, referring to FIG. 6 and FIG. 8-13, in some embodiments, the substrate layer 221 provided with the on-board conductive wires 223 is located between two antenna layers (such as 2211 and 2216) to facilitate the use of the outermost substrate layer 221 as an antenna layer. The substrate layer 221 where these on-board conductive wires 223 are located can be provided with a first conductive via 2251 to achieve conductive connection of the antenna layer.

[0085] Please refer to FIG. 6 and FIG. 8-13. In some embodiments, the onboard conductive wire 223 has a first detection unit wire 2231 and a second detection unit wire 2232 (i.e., the wire of the ambient temperature detection unit). The first detection unit wire 2231 and the second detection unit wire 2232 electrically connect the ambient temperature detection unit 300 to the control circuit 211. The substrate layer 221 where the first detection unit wire 2231 and the second detection unit wire 2232 are located is located on the inner side of the antenna layer, and the antenna layer has a first contact 2261 and a second contact 2262 for electrically connecting the ambient temperature detection unit 300. As shown in FIG. 8, in one embodiment, the first contact 2261 and the second contact 2262 are arranged on the first antenna layer 2211. In other embodiments, the first contact 2261 and the second contact 2262 may also be arranged on the second antenna layer 2216. The first contact 2261 is electrically connected to the first detection unit wire 2231, and the second contact 2262 is electrically connected to the second detection unit wire 2232.

[0086] Please refer to Figures 3 and 8. In some embodiments, the ambient temperature detection unit 300 can be electrically connected to the first contact 2261 and the second contact 2262 on the first antenna layer 2211. For example, the conductive connection end of the ambient temperature detection unit 300 is electrically connected to the first contact 2261 and the second contact 2262 by welding or other fixing methods.

[0087] Please refer to Figures 2-5. In some embodiments, the conductive connection end 310 of the ambient temperature detection unit 300 is welded and fixed to the first contact 2261 and the second contact 2262 (collectively referred to as conductive contacts) and electrically connected. Considering that during the use of the device, the solder joints of the conductive connection end 310 of the ambient temperature detection unit 300 and the first contact 2261 and the second contact 2262 are located in the cooking environment and need to withstand the high temperature test in the cooking environment. The materials commonly used for circuit welding are easy to melt at high temperatures and cause the electrical connection to fail. For example, when the cooking environment is higher than 300°C, the electrical connection between the conductive connection end 310 of the ambient temperature detection unit 300 and the first contact 2261 and the second contact 2262 is easy to detach and fail. Therefore, in some embodiments, the solder joint between the conductive connection end 310 and the first contact 2261 and the second contact 2262 is wrapped by an adhesive layer 500, and the failure temperature of the adhesive layer 500 is higher than the failure temperature of the solder joint between the conductive connection end 310 and the first contact 2261 and the second contact 2262, thereby preventing the solder joint from being damaged in a high temperature environment and ensuring the reliability of the electrical connection.

[0088] In some embodiments, the material of the adhesive layer 500 is high temperature inorganic glue or high temperature organic glue.

[0089] In some embodiments, the failure temperature threshold of the high temperature organic glue is greater than or equal to 300°C.

[0090] In some embodiments, the failure temperature threshold of the high temperature inorganic adhesive is greater than or equal to 400°C.

[0091] In some embodiments, the high temperature inorganic glue may specifically be, but is not limited to, a mixture of phosphate and aluminate.

[0092] Further, please refer to FIGS. 8-13 , in some embodiments, the first detection unit wire 2231 and the second detection unit wire 2232 are respectively fixed on different substrate layers 221. The first detection unit wire 2231 is electrically connected to the first contact 2261 through the third conductive via 2253, and the second detection unit wire 2232 is electrically connected to the second contact 2262 through the fourth conductive via 2254. Of course, in other embodiments, the first detection unit wire 2231 and the second detection unit wire 2232 can also be fixed on the same substrate layer 221.

[0093] 11 shows the routing of the first detection unit wire 2231 on the substrate layer 221. FIG12 shows the routing of the second detection unit wire 2232 on the substrate layer 221. In other embodiments, the onboard conductive wire 223 shown in FIG11 may be set as the second detection unit wire 2232, and the onboard conductive wire 223 shown in FIG12 may be set as the first detection unit wire 2231.

[0094] In some embodiments, the substrate layer 221 provided with the first detection unit wire 2231 is called the first detection unit wire layer 2214, and the substrate layer 221 provided with the second detection unit wire 2232 is called the second detection unit wire layer 2215. As shown in FIG6, in some embodiments, the first detection unit wire layer 2214 and the second detection unit wire layer 2215 are different substrate layers 221 and are stacked on each other.

[0095] In order to better constrain the transmission of the antenna 222 signal, in some embodiments, please refer to FIG. 11, the first detection unit wire layer 2214 has a third impedance matching structure 2243, and the third impedance matching structure 2243 is arranged on both sides of the first detection unit wire 2231. And / or, please refer to FIG. 12, the second detection unit wire layer 2215 has a fourth impedance matching structure 2244, and the fourth impedance matching structure 2244 is arranged on both sides of the second detection unit wire 2232. The third impedance matching structure 2243 and the fourth impedance matching structure 2244 are electrically connected to the second impedance matching structure 2242 and the first impedance matching structure 2241 through the second conductive via 2252, thereby forming an integral impedance matching structure on the multi-layer substrate layer 221 structure, and better constraining the transmission direction of the antenna 222 signal.

[0096] Further, the onboard conductive wire 223 can also be a conductive wire for other purposes. For example, when the device has a charging requirement, the onboard conductive wire 223 can also have a charging wire. Referring to FIG. 14 , the control circuit 211 has a charging circuit 2112, and the charging wire 2233 can be one or two, the purpose of which is to electrically connect at least one of the charging positive electrode and the charging negative electrode used for charging to the charging circuit 2112 to achieve the charging purpose.

[0097] Please refer to Figures 6 and 10. In some embodiments, the substrate layer 221 provided with the charging line 2233 is called the charging line layer 2213, and the charging line layer 2213 is located on the inner side of the antenna layer. The antenna layer has at least one charging connection terminal 2263. As shown in Figure 8, in one embodiment, the charging connection terminal 2263 is provided on the first antenna layer 2211. In other embodiments, the charging connection terminal 2263 may also be provided on the second antenna layer 2216. The charging connection terminal 2263 is electrically connected to the charging line 2233, and the charging connection terminal 2263 can be used to achieve electrical connection with at least one of the charging positive electrode and the charging negative electrode, for example, electrically connected to the metal conductive member 130 described later. The charging connection terminal 2263 has a conductive structure, for example, it can be a conductive contact or other structure.

[0098] Please refer to Figures 2-5. In some embodiments, in order to form a charging positive electrode and a charging negative electrode that are easy to charge, the shell 100 includes a metal segment 110 and an insulating segment 120. The metal segment 110 and the insulating segment 120 are both cylindrical structures. The insulating segment 120 can be docked at the rear end of the metal segment 110. The metal segment 110 and the insulating segment 120 can be used to jointly enclose at least a part of the accommodating cavity of the shell 100. The metal segment 110 can be made of metal materials such as copper and nickel or alloy materials such as stainless steel. The insulating segment 120 can be made of ceramic or other insulating materials. The insulating segment 120 is provided with a metal conductive member 130, and the metal conductive member 130 is electrically connected to the charging connection terminal 2263. The metal segment 110 is electrically connected to the charging circuit 2112. Among them, the metal conductive member 130 and the metal segment 110 respectively serve as one of the charging positive electrode and the charging negative electrode of the charging circuit 2112, for example, the metal conductive member 130 serves as the charging positive electrode and the metal segment 110 serves as the charging negative electrode, or the metal conductive member 130 serves as the charging negative electrode and the metal segment 110 serves as the charging positive electrode, to achieve charging.

[0099] Please refer to Figures 2-5. In some embodiments, the control circuit board 200 is provided with an elastic ejector pin 212, which is made of a conductive material, one end of which is electrically connected to the charging circuit 2112, and the other end of which is electrically connected to the inner wall of the metal segment 110, so as to electrically connect the metal segment 110 of the housing 100 to the charging circuit 2112. Of course, the elastic ejector pin 212 can also be replaced by other materials, such as a conductive spring.

[0100] Please refer to Figures 2-5. In some embodiments, the metal conductive member 130 is exposed outside the insulating section 120, wherein the metal conductive member 130 extends to the charging connection end 2263 of the antenna layer and is electrically connected to the charging connection end 2263, and then electrically connected to the charging circuit 2112 through the charging line 2233. The metal conductive member 130 can be fixed to the charging connection end 2263 by welding, clamping, bonding, etc., and maintain electrical connection.

[0101] During the use of the device, when the device is inserted into the food, the area where the insulating section 120 is located is usually located outside the food and needs to withstand the high temperature test in the cooking environment. In some cooking environments, the temperature in the space can even reach above 300°C. For example, the cooking environment temperature in the oven can reach above 200°C, and the cooking environment temperature in the BBQ oven can reach above 500°C. In order to ensure that the electrical connection between the metal conductive part 130 and the charging connection end 2263 is reliable, in some embodiments, please refer to Figures 2-5 and Figures 7 and 8, the charging connection end 2263 has a fifth conductive via 2255, the metal conductive part 130 has a mounting hole 131, and the charging connection end 2263 and the metal conductive part 130 are fixed and electrically connected by a conductive screw 133 passing through the fifth conductive via 2255 and the mounting hole 131. The conductive screw 133 not only realizes the locking and fixing of the charging connection end 2263 and the metal conductive part 130, but also plays a conductive role. The conductive screw 133 itself is resistant to high temperatures, so this connection structure is not only firm and reliable, but also its electrical connection effect can withstand the test of high temperatures. For example, at 300°C, the conductive screw 133 can still ensure good electrical connection between the charging connection terminal 2263 and the metal conductive part 130.

[0102] Please refer to Figures 2-5. In some embodiments, the metal conductive member 130 extends from the rear end to the rear end of the insulating section 120. Since the metal conductive member 130 is made of conductive metal, it has good thermal conductivity. Therefore, in these embodiments, the ambient temperature detection unit 300 is at least partially disposed in the metal conductive member 130, and the metal conductive member 130 is used for heat transfer to achieve temperature detection. The metal conductive member 130 can be directly exposed in the cooking environment to better sense and transmit the temperature information in the cooking environment. Of course, the metal conductive member 130 can also indirectly contact the hot air in the cooking environment to form a heat conduction structure.

[0103] Please refer to Figures 2-5. In some embodiments, the metal conductive member 130 has an inner cavity, and the rear end of the extension portion 220 extends into the inner cavity, which not only facilitates the docking of the ambient temperature detection unit 300 and the extension portion 220, but also utilizes the good strength of the metal to protect the ambient temperature detection unit 300 placed in the metal conductive member 130.

[0104] Please refer to Figures 2-5. In some embodiments, the metal conductive member 130 is also a part of the housing 100, and its outer wall, the metal segment 110 and the insulating segment 120 together form the outer wall of the housing 100. In some embodiments, the metal conductive member 130 has an outer shape matching the insulating segment 120, such as a cylindrical shape or other shapes, so as to form a smooth transition with the insulating segment 120 in the axial direction of the housing 100. The inner cavity of the metal conductive member 130 and the cavity of the metal segment 110 and the insulating segment 120 together form a mounting cavity.

[0105] In addition, referring to FIGS. 2-5 , in some embodiments, the metal conductive member 130 can be screwed into the cavity of the insulating segment 120, and can be screwed and fixed by the external thread of the metal conductive member 130 and the internal thread of the cavity of the insulating segment 120. Of course, in other embodiments, the metal conductive member 130 and the extension portion 220 can also be fixed by other means, such as welding, clamping, etc.

[0106] Please refer to Figures 2-5. In some embodiments, a rear cover 140 may be further provided at the rear end of the metal conductive member 130. The rear cover 140 is fixed to the metal conductive member 130, for example, by screwing the threaded hole of the rear cover 140 to the raised threaded portion 132 on the metal conductive member 130. Of course, in other embodiments, the metal conductive member 130 and the rear cover 140 may also be fixed by other means, such as welding, clamping, etc.

[0107] Further, please refer to FIG. 6 , in some embodiments, the charging line layer 2213 is located between the antenna layer (such as the first antenna layer 2211) and the first detection unit wire layer 2214. Or, in other embodiments, the charging line layer 2213 may also be located between the antenna layer (such as the second antenna layer 2216) and the second detection unit wire layer 2215. The charging connection end 2263 is electrically connected to the charging line 2233 through the fifth conductive hole 2255.

[0108] Further, please refer to FIG6 , in some embodiments, the adjacent substrate layer 221 of the antenna layer is a clearance layer 2212, and the clearance layer 2212 is not provided with the antenna 222 and the onboard conductive wire 223, so as to ensure that in the stacking direction, the substrate layer 221 where the onboard conductive wire 223 is located can form a sufficient space distance with the first antenna layer 2211. Of course, the number of the clearance layer 2212 is more than one, and in other embodiments, the clearance layer 2212 can also be more than two layers.

[0109] Of course, in other embodiments, the first antenna layer 2211, the clearance layer 2212, the charging line layer 2213, the first detection unit wire layer 2214, the second detection unit wire layer 2215 and the second antenna layer 2216 may also be arranged in other stacking methods and are not limited to the stacking order shown in FIG. 6 .

[0110] Further, please refer to Figures 2-5. In some embodiments, the housing 100 has a safety zone mark 101, and the area from the front end of the housing 100 to the safety zone mark 101 is the safety zone, and the food temperature detection unit 40030 is arranged within the range of the safety zone. In some embodiments, the safety zone mark 101 can be a line or a concave and convex three-dimensional engraved line with a surface color that is obviously different from that of other areas of the housing 100, which is used to indicate to the user the depth of the temperature detection device 1 inserted into the object to be measured (for example, food). Since the range of the safety zone is designed to allow full insertion into the food when in use, and the temperature in the food is lower than that of cooking outside, it can avoid the high temperature in the cooking environment (for example, an oven above 200°C, a BBQ oven above 500°C, etc.) from damaging the electronic components of the temperature detection device 1. In addition, the safety zone mark 101 can also prevent the housing 100 from being damaged due to the temperature detection device 1 entering the object to be measured too deeply and avoid burns to the operator. In some embodiments, the safety zone mark 101 can be set on the outer wall of the housing 100. In some embodiments, the safety zone marking 101 may be disposed around the outer wall of the housing 100 .

[0111] In some embodiments, the battery can be a rechargeable battery or a disposable battery. The battery is disposed in the housing 100 and is located within the safety zone. The battery is used to power various electrical components in the temperature detection device 1.

[0112] 1-5 , in some embodiments, the control circuit board 200 is located within the safety zone, in the longitudinal direction of the housing 100 . The battery is located at the front end of the control circuit board 200 .

[0113] Further, please refer to Figures 1-5. In some embodiments, in order to better obtain the signal of the antenna 222, the antenna 222 is arranged on the rear side of the safety zone mark 101, that is, during the use of the temperature detection device 1, the antenna 222 is outside the food to prevent the food from affecting the signal transmission and reception of the antenna 222. In some embodiments, the ambient temperature detection unit 300 is arranged on the rear side of the safety zone mark 101, that is, during the use of the temperature detection device 1, the ambient temperature detection unit 300 is outside the food, so as to better detect the temperature of the cooking environment. In some embodiments, the metal conductive member 130 is arranged behind the safety zone mark 101 to prevent the metal conductive member 130 from being damaged by repeated insertion of food. The charging connection terminal 2263 is also arranged on the rear side of the safety line to facilitate docking with the metal conductive member 130.

[0114] Further, please refer to Figures 1-5, in some embodiments, the safety zone mark 101 is located on the metal segment 110, that is, in this embodiment, a part of the metal segment 110 and the insulating segment 120 and the metal conductive member 130 are all located on the rear side of the safety zone mark 101. The antenna 222 is located in the insulating segment 120 to ensure the communication effect of the antenna 222.

[0115] During the use of the temperature detection device 1, the area of ​​the device located behind the safety zone mark 101 is usually exposed to a higher temperature. The extension part 220 is also located behind the safety zone mark 101. Since the antenna 222, the onboard conductive wire 223 and the conductive via on the extension part 220 are only conductive parts disposed on the substrate layer 221, they are less deformed under the high temperature of the cooking environment, thereby ensuring a stable electrical connection effect.

[0116] On the other hand, in addition to being used in the above-mentioned temperature detection device 1, in other embodiments, the control circuit board 200 can also be applied to other temperature detection devices 1 that need to realize wireless communication, especially temperature detection devices 1 that need to be used at high temperatures.

[0117] This document is described with reference to various exemplary embodiments. However, those skilled in the art will recognize that changes and modifications may be made to the exemplary embodiments without departing from the scope of this document. For example, various operating steps and components for performing the operating steps may be implemented in different ways (e.g., one or more steps may be deleted, modified, or combined into other steps) depending on the specific application or considering any number of cost functions associated with the operation of the system.

[0118] Although the principles of this invention have been shown in various embodiments, many modifications of structures, arrangements, proportions, elements, materials and components particularly suitable for specific environments and operational requirements can be used without departing from the principles and scope of this invention. The above modifications and other changes or amendments will be included in the scope of this invention.

[0119] The foregoing specific description has been described with reference to various embodiments. However, those skilled in the art will recognize that various modifications and changes can be made without departing from the scope of the present disclosure. Therefore, the consideration of the present disclosure will be in an illustrative rather than a restrictive sense, and all these modifications will be included in its scope. Similarly, the advantages, other advantages and solutions to the problems of various embodiments are as above. However, the benefits, advantages, solutions to the problems and any elements that can produce these, or solutions that make them more clear should not be interpreted as critical, necessary or necessary. The term "include" and any other variants used in this article are all non-exclusive inclusions, so that the process, method, article or device including the list of elements not only includes these elements, but also includes other elements that are not explicitly listed or do not belong to the process, method, system, article or device. In addition, the term "coupled" and any other variants used in this article refer to physical connections, electrical connections, magnetic connections, optical connections, communication connections, functional connections and / or any other connections.

[0120] Those skilled in the art will appreciate that many changes can be made to the details of the above embodiments without departing from the basic principles of the present application. Therefore, the scope of the present application should be determined according to the following claims.

Claims

A temperature detection device for food, characterized in that: The invention comprises: a shell, the shell having a front end capable of being inserted into food and a rear end opposite to the front end, the shell forming a mounting cavity; And a control circuit board, which is arranged in the installation cavity; the control circuit board has a main body and an extension part extending backward from the main body, the main body has a control circuit, and the control circuit has an antenna signal processing unit; the extension part has at least two stacked and fixed substrate layers, the extension part is provided with an antenna and an on-board conductive wire, and the antenna and the on-board conductive wire are respectively fixed on different substrate layers; the antenna is electrically connected to the antenna signal processing unit; the on-board conductive wire is used to electrically connect the control circuit with other components. The temperature detection device according to claim 1, characterized in that The base layer provided with the antenna is an antenna layer, and in the stacking direction of the base layer, the antenna layer is located on the outermost side. The temperature detection device according to claim 2, characterized in that The substrate layer is at least three layers. In the stacking direction of the substrate layers, the two outermost substrate layers are both the antenna layers, and the antennas on the two antenna layers are electrically connected to each other; the substrate layer with the on-board conductive wires is located between the two antenna layers. The temperature detection device according to claim 3, characterized in that The substrate layer between the two antenna layers is provided with a first conductive via, and the first conductive vias are conductively connected to each other to electrically connect the antennas on the two antenna layers. The temperature detection device according to claim 3 or 4, characterized in that: One antenna layer is a first antenna layer, and the other antenna layer is a second antenna layer; on the first antenna layer, the antenna is electrically connected to the antenna signal processing unit through a conductive wire. The temperature detection device according to claim 5, characterized in that The first antenna layer is provided with a first impedance matching structure, and the first impedance matching structure is provided on both sides of the conductive line. The temperature detection device according to claim 6, characterized in that A second impedance matching structure is disposed on the second antenna layer. The second impedance matching structure corresponds to the position of the first impedance matching structure and is electrically connected to the first impedance matching structure through a second conductive via. The temperature detection device according to any one of claims 2 to 7, characterized in that: It also includes an ambient temperature detection unit, which is arranged in the shell and is used to detect the temperature of the cooking environment of the food; the on-board conductive wire has a first detection unit wire and a second detection unit wire, the first detection unit wire and the second detection unit wire electrically connect the ambient temperature detection unit with the control circuit, the substrate layer where the first detection unit wire and the second detection unit wire are located is located on the inner side of the antenna layer, and the antenna layer has a first contact and a second contact for electrically connecting the ambient temperature detection unit, the first contact is electrically connected to the first detection unit wire, and the second contact is electrically connected to the second detection unit wire. The temperature detection device according to claim 8, characterized in that The first detection unit wire and the second detection unit wire are fixed on the same substrate layer or on different substrate layers respectively, the first detection unit wire is electrically connected to the first contact through a third conductive via, and the second detection unit wire is electrically connected to the second contact through a fourth conductive via. The temperature detection device according to claim 9, characterized in that The substrate layer provided with the first detection unit wire is the first detection unit wire layer, and the substrate layer provided with the second detection unit wire is the second detection unit wire layer. The first detection unit wire layer and the second detection unit wire layer are different substrate layers and are stacked on each other. The temperature detection device according to any one of claims 2 to 10, characterized in that: The first detection unit conductor layer has a third impedance matching structure, which is arranged on both sides of the first detection unit conductor; and / or the second detection unit conductor layer has a fourth impedance matching structure, which is arranged on both sides of the second detection unit conductor. The temperature detection device according to any one of claims 2 to 11, characterized in that: The on-board conductive wire has a charging wire, the control circuit has a charging circuit, and the charging wire is electrically connected to the charging circuit; the base layer provided with the charging wire is a charging wire layer, the charging wire layer is located on the inner side of the antenna layer, the antenna layer has a charging connection end, and the charging connection end is electrically connected to the charging wire. The temperature detection device according to claim 12, characterized in that The shell includes a metal segment and an insulating segment, the insulating segment is provided with a metal conductive member, the metal conductive member is electrically connected to the charging connection end, the metal segment is electrically connected to the charging circuit, and the metal conductive member and the metal segment respectively serve as one of the positive and negative electrodes of the charging circuit to achieve charging. The temperature detection device according to claim 13, characterized in that The metal conductive member is exposed outside the insulating section; the metal conductive member extends to the charging connection end of the antenna layer and is electrically connected to the charging connection end. The temperature detection device according to claim 14, characterized in that The charging connection terminal has a fifth conductive via hole, the metal conductive member has a mounting hole, and the charging connection terminal and the metal conductive member are fixed and electrically connected by passing a conductive screw through the fifth conductive via hole and the mounting hole. The temperature detection device according to any one of claims 11 to 15, characterized in that: The charging line layer is located between the antenna layer and the first detection unit wire layer, or between the antenna layer and the second detection unit wire layer, and the charging connection end is electrically connected to the charging line through a fifth conductive hole. The temperature detection device according to any one of claims 2 to 16, characterized in that: The substrate layer adjacent to the antenna layer is a clearance layer, and the clearance layer is not provided with an antenna and an onboard conductive line. The temperature detection device according to any one of claims 1 to 17, characterized in that: The antenna and the on-board conductive wire are attached to the surface of the substrate layer. The temperature detection device according to any one of claims 1 to 18, characterized in that: The antenna and the on-board conductive wire are fixed on the surface of the substrate layer by a printing or spraying process. The temperature detection device according to any one of claims 1 to 19, characterized in that: The shell has a safety zone mark, the control circuit is located on the front side of the safety zone mark, and the antenna, the ambient temperature detection unit and the charging connection terminal are located on the rear side of the safety zone mark. The temperature detection device according to claim 20, characterized in that The shell includes a metal segment and an insulating segment, wherein the insulating segment is located behind the metal segment, the safety zone mark is located on the metal segment, and the antenna is located in the insulating segment. A temperature detection device for food, characterized in that: The invention comprises: a shell, the shell having a front end capable of being inserted into food and a rear end opposite to the front end, the shell forming a mounting cavity; And a control circuit board, which is arranged in the installation cavity; the control circuit board has a main body and an extension part extending backward from the main body, the main body has a control circuit, and the control circuit has an antenna signal processing unit; the extension part has at least two stacked and fixed substrate layers, the extension part is provided with an antenna and an on-board conductive wire, and the antenna and the on-board conductive wire are fixed on the extension part; the antenna is electrically connected to the antenna signal processing unit; the on-board conductive wire is used to electrically connect the control circuit with other components. A control circuit board of a temperature detection device, characterized in that: It includes a main body and an extension part extending backward from the main body, the main body has a control circuit, and the control circuit has an antenna signal processing unit; the extension part has at least two stacked and fixed substrate layers, the extension part is provided with an antenna and an on-board conductive wire, and the antenna and the on-board conductive wire are respectively fixed on different substrate layers; the antenna is electrically connected to the antenna signal processing unit; the on-board conductive wire is used to electrically connect the control circuit with other components. The control circuit board according to claim 23, characterized in that The base layer provided with the antenna is an antenna layer, and in the stacking direction of the base layer, the antenna layer is located on the outermost side. The control circuit board according to claim 24, characterized in that The substrate layer is at least three layers. In the stacking direction of the substrate layers, the two outermost substrate layers are both the antenna layers, and the antennas on the two antenna layers are electrically connected to each other; the substrate layer with the on-board conductive wires is located between the two antenna layers. The control circuit board according to claim 24 or 25, characterized in that: One antenna layer is the first antenna layer, and the other antenna layer is the second antenna layer; on the first antenna layer, its antenna is electrically connected to the antenna signal processing unit through a conductive line; the first antenna layer is provided with a first impedance matching structure, and the first impedance matching structure is provided on both sides of the conductive line. The control circuit board according to claim 26, characterized in that A second impedance matching structure is disposed on the second antenna layer. The second impedance matching structure corresponds to the position of the first impedance matching structure and is electrically connected to the first impedance matching structure through a second conductive via. The control circuit board according to any one of claims 24 to 27, characterized in that: The on-board conductive wire has a first detection unit wire and a second detection unit wire, which electrically connect the ambient temperature detection unit with the control circuit. The substrate layer where the first detection unit wire and the second detection unit wire are located is located on the inner side of the antenna layer. The antenna layer has a first contact and a second contact, the first contact is electrically connected to the first detection unit wire, and the second contact is electrically connected to the second detection unit wire. The control circuit board according to claim 28, characterized in that The substrate layer provided with the first detection unit wire is the first detection unit wire layer, the substrate layer provided with the second detection unit wire is the second detection unit wire layer, the first detection unit wire layer and the second detection unit wire layer are different substrate layers and are stacked on each other; the first detection unit wire layer has a third impedance matching structure, and the third impedance matching structure is arranged on both sides of the first detection unit wire; and / or the second detection unit wire layer has a fourth impedance matching structure, and the fourth impedance matching structure is arranged on both sides of the second detection unit wire. The control circuit board according to any one of claims 24 to 29, characterized in that: The on-board conductive wire has a charging wire, the control circuit has a charging circuit, and the charging wire is electrically connected to the charging circuit; the base layer provided with the charging wire is a charging wire layer, the charging wire layer is located on the inner side of the antenna layer, the antenna layer has a charging connection end, and the charging connection end is electrically connected to the charging wire. The control circuit board according to claim 30, characterized in that The charging connection end has a fifth conductive via hole, and the fifth conductive via hole is used for a conductive screw to pass through, so as to fix and electrically connect the charging connection end and the corresponding metal conductive part. The control circuit board according to any one of claims 24 to 31, characterized in that: The substrate layer adjacent to the antenna layer is a clearance layer, and the clearance layer is not provided with an antenna and an onboard conductive line. The control circuit board according to any one of claims 23 to 31, characterized in that: The antenna and the on-board conductive wire are attached to the surface of the substrate layer.

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