Endoscopic systems, image optimization methods and related devices

Abstract

This application discloses an endoscope system, an image optimization method, and related apparatus, belonging to the field of endoscope technology. The endoscope system includes an endoscope and a processing unit; the endoscope includes an image sensor, a first interface, a power generation component, and an illumination module; the endoscope is used to acquire images and obtain image signals through the image sensor; the power generation component is used to generate the power supply voltage required by the image sensor; the illumination module is used for illumination; the processing unit includes a second interface, an electrical isolation component, and an image processing component; the second interface is connected to the electrical isolation component; the electrical isolation component includes multiple electrical isolation modules corresponding to image sensors of different interface types; the image processing component is used to optimize the image signals after electrical isolation. The endoscope system in this application is not only compatible with image sensors of various interface types but also capable of electrical isolation for different image signals, achieving safer electrical isolation.

Description

Technical Field

[0001] This invention relates to the field of endoscopy technology, specifically to an endoscopy system, an image optimization method, and related devices. Background Technology

[0002] With the development of medical technology, endoscopic treatment is becoming increasingly common. Different endoscopes may use different types of image sensor interfaces. Endoscopic systems acquire image signals through image sensors within the endoscope, process them, and display them. However, current endoscopic systems only support endoscopes using analog interface image sensors and endoscopes using MIPI (Mobile Industry Processor Interface) image sensors. Furthermore, due to limitations in the components within endoscopic systems, it is necessary to convert the image signals corresponding to the analog interface to those corresponding to the MIPI interface before processing can proceed, increasing the cost of the endoscopic system. Summary of the Invention

[0003] This application provides an endoscope system, an image optimization method, and related devices. The endoscope system is not only compatible with image sensors of various interface types, but also provides electrical isolation for image signals corresponding to different interfaces, thereby achieving low-cost and safe electrical isolation. The technical solution is as follows:

[0004] On the one hand, an endoscope system is provided, including one or more endoscopes and a processing unit;

[0005] The endoscope includes an image sensor, a first connector, a power generation component, and an illumination module. One or more of the endoscopes may include image sensors with different interface types. The endoscope is used to acquire images and obtain image signals through the image sensor. One end of the first connector is connected to the image sensor, and the other end is used to connect to the processing unit. The power generation component is connected to the image sensor and is used to generate the power voltage required by the image sensor. The illumination module is used to provide illumination during image acquisition.

[0006] The processing unit includes a second plug interface that matches the first plug interface in terms of plugging, an electrical isolation component, and an image processing component;

[0007] The second connector has multiple pins, and the second connector and the first connector are pluggable. The multiple pins of the second connector can be multiplexed by image sensors of different interface types. The power supply pin of the second connector is connected to the power generation component through the first connector, allowing the power generation component to adjust the voltage supplied to the power supply pin. The second connector is also connected to the electrical isolation component, allowing the electrical isolation component to receive image signals sent by the image sensor. The electrical isolation component is also connected to the image processing component, which includes multiple electrical isolation modules corresponding to image sensors of different interface types. Each electrical isolation module is used to perform electrical isolation operations on the image signals of the corresponding interface type image sensor. The image processing component, after receiving the electrically isolated image signal, optimizes the electrically isolated image signal based on the image parameters corresponding to the endoscope, thereby optimizing the image acquired by the endoscope.

[0008] Optionally, the interface of the image sensor is one or more of MIPI, LVDS (Low-Voltage Differential Signaling) interface, analog interface, and SerDes (Serializer and Deserializer) interface.

[0009] When the image sensor interface is MIPI, the image signal is a first signal. The electrical isolation module corresponding to the MIPI image sensor includes a signal separation submodule, a first isolation submodule, and a second isolation submodule. The signal separation submodule is connected to the second interface, the first isolation submodule, and the second isolation submodule, respectively. The first isolation submodule and the second isolation submodule are also connected to the image processing component. The signal separation submodule is used to separate a low-power signal and a high-speed signal from the received first signal, and send the low-power signal to the first isolation submodule and the high-speed signal to the second isolation submodule. The first isolation submodule is used to electrically isolate the low-power signal and send the electrically isolated low-power signal to the image processing component. The second isolation submodule is used to electrically isolate the high-speed signal and send the electrically isolated high-speed signal to the image processing component.

[0010] And / or,

[0011] When the image sensor interface is either the analog interface or the SerDes interface, the image signal is a second signal. The electrical isolation module corresponding to the image sensor with the analog interface and the image sensor with the SerDes interface includes a signal conversion submodule and a first isolation submodule. The signal conversion submodule is connected to the second connector and the first isolation submodule, respectively. The first isolation submodule is also connected to the image processing component. The signal conversion submodule is used to convert the received second signal into a DVP (Digital Video Port) signal and send the DVP signal to the first isolation submodule. The first isolation submodule is used to electrically isolate the DVP signal and send the electrically isolated DVP signal to the image processing component.

[0012] And / or,

[0013] When the image sensor interface is the LVDS interface, the image signal is a third signal. The electrical isolation module corresponding to the image sensor with the LVDS interface includes a second isolation submodule. The second isolation submodule is connected to the second connector and the image processing component respectively. The second isolation submodule is used to electrically isolate the third signal and send the electrically isolated third signal to the image processing component.

[0014] Optionally, the electrical isolation module corresponding to the image sensor of MIPI and the electrical isolation modules corresponding to the image sensors of the analog interface and the image sensors of the SerDes interface share the same first isolation submodule; the electrical isolation module corresponding to the image sensor of MIPI and the electrical isolation module corresponding to the image sensor of the LVDS interface share the same second isolation submodule.

[0015] Optionally, the signal separation submodule includes at least one transistor, the first isolation submodule includes a digital isolator, the second isolation submodule includes an LVDS isolator, and the signal conversion submodule includes a decoding chip.

[0016] Optionally, the first connector is a microHDMI (micro High Definition Multimedia Interface) male connector, and the second connector is a microHDMI female connector.

[0017] Optionally, the power generation component includes multiple voltage regulators;

[0018] Multiple voltage regulators are connected to the power supply pins of the first and second connectors via the first connector. The multiple voltage regulators are also connected to the image sensor to adjust the voltage output from the power supply pins to generate the voltage required by the image sensor.

[0019] Optionally, the second connector further includes a function pin, a lighting power supply pin, a first data transmission pin, and a second data transmission pin;

[0020] The functional pins can be connected to the image sensor of MIPI, the image sensor of LVDS interface, the image sensor of analog interface, or the image sensor of SerDes interface, so that the endoscope can perform related functions;

[0021] The illumination power supply pin can be connected to the image sensor of MIPI, the image sensor of LVDS interface, the image sensor of analog interface, or the image sensor of SerDes interface to provide power to the illumination module included in the endoscope.

[0022] Both the first data transmission pin and the second data transmission pin can establish a connection with the MIPI image sensor or the LVDS interface image sensor to realize the data transmission of the image sensor described above.

[0023] The first data transmission pin or the second data transmission pin can be connected to the image sensor of the SerDes interface to realize data transmission of the image sensor of the SerDes interface.

[0024] On the other hand, an image optimization method is provided for use in an endoscope system, the endoscope system including one or more endoscopes, each endoscope including an image sensor, the image optimization method comprising:

[0025] It acquires image signals in response to the user's photo-taking action;

[0026] The target electrical isolation operation is determined based on the type of the image signal, and the image signal is electrically isolated according to the target electrical isolation operation. The target electrical isolation method is one of a plurality of electrical isolation operations, and the type of the image signal is related to the interface type of the image sensor.

[0027] The image signal after electrical isolation is optimized based on the image parameters corresponding to the endoscope, so as to optimize the image acquired by the endoscope.

[0028] On the other hand, a computer-readable storage medium is provided, wherein a computer program is stored therein, and the computer program can be executed by a processor to implement the steps of the image optimization method described above.

[0029] On the other hand, a computer program product containing instructions is provided, which, when run on a computer, cause the computer to perform the steps of the image optimization method described above.

[0030] The technical solution provided in this application can bring at least the following beneficial effects:

[0031] The endoscope system in this embodiment includes image sensors with different interface types, meaning the endoscope system is compatible with image sensors of different interface types, thus broadening its application scenarios. Furthermore, the endoscope also includes a power generation component, and the second interface of the processing unit includes a power supply pin. This power generation component is connected to both the image sensor and the power supply pin, adjusting the voltage from the power supply pin to the required power voltage for the image sensor, thus meeting the power needs of the image sensor. Only one power supply pin is needed to provide the appropriate power voltage to the endoscope, saving resources. In addition, the electrical isolation component in the processing unit includes multiple electrical isolation modules corresponding to image sensors of different interface types. Each electrical isolation module can perform electrical isolation operations on the image signals sent by the corresponding interface type image sensor. That is, the electrical isolation of image signals sent by image sensors of different interface types is separate, thereby providing more targeted electrical isolation of the image signals. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of an endoscope system provided in an embodiment of this application;

[0033] Figure 2 This is a schematic diagram of the structure of an electrical isolation module provided in an embodiment of this application;

[0034] Figure 3 This is a schematic diagram of another electrical isolation module provided in an embodiment of this application;

[0035] Figure 4 This is a schematic diagram of another electrical isolation module provided in an embodiment of this application;

[0036] Figure 5 This is a schematic diagram of another electrical isolation module provided in an embodiment of this application;

[0037] Figure 6 This is a schematic diagram of another electrical isolation module provided in an embodiment of this application;

[0038] Figure 7 This is a schematic diagram of the connection relationship of a power generation component provided in an embodiment of this application;

[0039] Figure 8 This is a schematic diagram of the structure of a second insertion interface provided in an embodiment of this application;

[0040] Figure 9 This is a flowchart of an image optimization method provided in an embodiment of this application. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of this application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to this application are not shown or described in the specification. This is to avoid obscuring the core parts of this application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0042] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0043] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0044] With the development of medical technology, endoscopic treatment is becoming increasingly common. Different endoscopes may use different types of image sensor interfaces. Endoscopic systems are mainly divided into three parts based on their functional modules: an image acquisition module, an electrical isolation module, and an image processing module. The image acquisition module is primarily used by the endoscope to acquire images. That is, the endoscopic system obtains image signals through the image sensor in the endoscope. The image signals then pass through the electrical isolation module and are sent to the image processing module. The image processing module then optimizes the image before projecting it onto the display screen.

[0045] Current endoscope systems only support endoscopes using image sensors with analog interfaces and endoscopes using image sensors with MIPI (Mobile Industry Processor Interface). Moreover, due to the limitations of the electrical isolation module on the interface type, the image signal corresponding to the analog interface needs to be converted into parallel data before it can pass through the isolation module, and the image signal corresponding to MIPI also needs to be converted into other signals before it can pass through the isolation module, which increases the isolation cost.

[0046] Based on this, the embodiments of this application provide an endoscope system that is not only compatible with image sensors of various interface types, but also capable of electrical isolation for image signals corresponding to different interfaces, thereby achieving low-cost and safe electrical isolation.

[0047] The endoscope system provided in the embodiments of this application will now be described in detail.

[0048] Please refer to Figure 1 , Figure 1This is a schematic diagram of an endoscope system provided in an embodiment of this application. The endoscope system includes one or more endoscopes 1 and a processing unit 2; the endoscope 1 includes an image sensor 11, a first connector 12, a power generation component 13, and an illumination module 14, and the image sensors 11 included in one or more endoscopes 1 have different interface types; the endoscope 1 is used to acquire images and obtain image signals through the image sensor 11; one end of the first connector 12 is connected to the image sensor 11, and the other end of the first connector 12 is used to connect to the processing unit 2; the power generation component 13 is connected to the image sensor 11 and is used to generate the power supply voltage required by the image sensor 11; the illumination module 14 is used to provide illumination when acquiring images. Processing unit 2 includes a second connector 21 that mates with the first connector 12 in a plug-in configuration, an electrical isolation component 22, and an image processing component 23. The second connector 21 has multiple pins, and the second connector 21 and the first connector 12 are pluggable. The multiple pins of the second connector 21 can be multiplexed by image sensors 11 of different interface types. The power supply pin 211 of the second connector 21 is connected to the power generation component 13 via the first connector 12, allowing the power generation component 13 to adjust the voltage supplied to the power supply pin 211. The second connector 21 is also connected to the electrical isolation component 22 to ensure electrical isolation. The isolation component 22 receives the image signal sent by the image sensor 11; the electrical isolation component 22 is also connected to the image processing component 23. The electrical isolation component 22 includes multiple electrical isolation modules 221 corresponding to the image sensors 11 with different interface types. Each electrical isolation module 221 is used to perform electrical isolation operation on the image signal of the image sensor 11 with the corresponding interface type. The image processing component 23 is used to optimize the image signal after receiving the image signal after electrical isolation based on the image parameters corresponding to the endoscope 1, so as to optimize the image acquired by the endoscope 1.

[0049] One or more endoscopes 1 include image sensors 11 with different interface types, that is, the endoscope system supports image sensors with multiple interface types.

[0050] Since the power supply pin 221 of the second connector 21 is connected to the power generation component 13 through the first connector 12, and the power generation component 13 is also connected to the image sensor 11, when the first connector 12 and the second connector 21 are connected, the power generation component 13 can obtain voltage from the power supply pin 221, and the power generation component 13 can adjust the obtained voltage to generate the voltage required by the image sensor 11, so that the image sensor 11 can acquire image signals.

[0051] Since the endoscope 1 also includes a first connector 12, one end of which is connected to the image sensor 11, and the processing unit 2 also includes a second connector 21 that matches the first connector 12, and the second connector 21 is also connected to the electrical isolation component 22, the first connector 12 and the second connector 21 are detachable. Therefore, when the first connector 12 and the second connector 21 are connected, the image sensor 11 can send the acquired image signal to the processing unit 2, and the electrical isolation component 22 can receive the image signal sent by the image sensor 11. When the first connector 12 and the second connector 21 are not connected, the electrical isolation component 22 cannot receive the image signal sent by the image sensor 11.

[0052] Continuing the description above, after the electrical isolation component 22 receives the image signal, it can perform an electrical isolation operation on the received image signal. Furthermore, the electrical isolation component 22 includes multiple electrical isolation modules 221 corresponding to image sensors 11 with different interface types. That is, since the types of image signals sent by image sensors 11 with different interface types are also different, the electrical isolation component 22 needs to perform different electrical isolation operations for different image signals. Therefore, the electrical isolation component 22 includes multiple electrical isolation modules 221, each corresponding to a different type of image signal. Specifically, each of the multiple electrical isolation modules 221 is used to perform an electrical isolation operation on the corresponding image signal.

[0053] Since the electrical isolation component 22 is also connected to the image processing component 23, the image processing component 23 can receive the electrically isolated image signal after the electrical isolation component 22 performs an electrical isolation operation on the image signal. Then, the image signal can be optimized according to the image parameters corresponding to the endoscope 1. Since the image signal is obtained based on the image acquired by the endoscope 1, optimizing the image signal can optimize the image acquired by the endoscope 1.

[0054] In some embodiments, the first interface 12 further includes a first encryption circuit that stores the identifier of the endoscope 1 and image parameters; and the second interface 21 further includes a second encryption circuit that can be bound to the first encryption circuit. Thus, when the second interface 21 receives an image signal, it can obtain the image parameters corresponding to that image signal, thereby enabling the image processing component 23 to optimize the image signal according to the image parameters corresponding to the endoscope 1 in subsequent processes. Furthermore, because the first encryption circuit and the second encryption circuit are bound together, unauthorized replacement of parts in the endoscope system can be prevented, achieving secure management of the endoscope system.

[0055] In some embodiments, the interface of the image sensor 11 is one or more of MIPI, LVDS, analog, and SerDes interfaces.

[0056] In other words, the image sensor 11 used by the endoscope 1 in this endoscope system can have an interface such as MIPI, LVDS, analog, or SerDes. Of course, in practice, the image sensor 11 can also have other interfaces, and this embodiment does not limit this.

[0057] Next, the electrical isolation submodules corresponding to the MIPI, LVDS, analog, and SerDes interfaces of the image sensor will be described respectively.

[0058] When the interface of image sensor 11 is MIPI, the image signal is the first signal, such as... Figure 2 As shown, the electrical isolation module 221 corresponding to the MIPI image sensor 11 includes a signal separation submodule 2211, a first isolation submodule 2212, and a second isolation submodule 2213. The signal separation submodule 2211 is connected to the second connector 21, the first isolation submodule 2212, and the second isolation submodule 2213, respectively. The first isolation submodule 2212 and the second isolation submodule 2213 are also connected to the image processing component 23. The signal separation submodule 2211 is used to separate a low-power signal and a high-speed signal from the received first signal, and send the low-power signal to the first isolation submodule 2212 and the high-speed signal to the second isolation submodule 2213. The first isolation submodule 2212 is used to electrically isolate the low-power signal and send the electrically isolated low-power signal to the image processing component 23. The second isolation submodule 2213 is used to electrically isolate the high-speed signal and send the electrically isolated high-speed signal to the image processing component 23.

[0059] In some embodiments, the image signal sent by the MIPI-interfaced image sensor 11 is the first signal, and the electrical isolation component 22 includes a plurality of electrical isolation modules 221 corresponding to image sensors with different interface types. Therefore, the electrical isolation component 22 also includes an electrical isolation module 221 corresponding to the MIPI-interfaced image sensor, and the electrical isolation module 221 is used to perform electrical isolation operation on the first signal.

[0060] Since the image signal sent by the MIPI-interfaced image sensor 11 may include low-power signals and high-speed signals, and the electrical isolation operations required for the two types of signals are different, the electrical isolation module 221 corresponding to the MIPI-interfaced image sensor 11 may include a signal separation submodule 2211. The signal separation submodule 2211 is also connected to the second interface. Therefore, when the endoscope 1 using the MIPI-interfaced image sensor 11 is connected to the processing unit 2, the signal separation submodule 2211 can receive the first signal and separate the low-power signals and high-speed signals therein after receiving the first signal, so as to perform electrical isolation operations separately in subsequent processes.

[0061] Continuing the description above, since low-power signals and high-speed signals need to be electrically isolated separately, the electrical isolation module 221 corresponding to the MIPI interface image sensor 11 may include a first isolation submodule 2212 for electrically isolating low-power signals and a second isolation submodule 2213 for electrically isolating high-speed signals. Furthermore, the signal separation submodule 2211 is connected to both the first isolation submodule 2212 and the second isolation submodule 2213. Thus, the first isolation submodule 2212 can receive low-power signals, and the second isolation submodule 2213 can receive high-speed signals, thereby enabling the first isolation submodule 2212 and the second isolation submodule 2213 to perform electrical isolation operations on the corresponding signals.

[0062] Furthermore, the first isolation module 2212 and the second isolation module 2213 are also connected to the image processing component 23. Therefore, the image processing component 23 can receive low-power signals and high-speed signals after electrical isolation and optimize both of them.

[0063] Since only the low-power signal and the high-speed signal in the first signal need to be electrically isolated separately, without converting the first signal, the cost of electrical isolation for the first signal can be reduced.

[0064] It should be noted that the above description is based on the electrical isolation module 221 corresponding to the MIPI interface image sensor 11, which includes a signal separation submodule 2211, a first isolation submodule 2212, and a second isolation submodule 2213. Alternatively, in applications, the electrical isolation module 221 corresponding to the MIPI interface image sensor 11 may also include other components, and this application embodiment does not limit this.

[0065] When the interface of image sensor 11 is an analog interface or a SerDes interface, the image signal is a second signal, such as... Figure 3As shown, the electrical isolation module 221 corresponding to the analog interface image sensor 11 and the SerDes interface image sensor 11 includes a signal conversion submodule 2214 and a first isolation submodule 2212. The signal conversion submodule 2214 is connected to the second interface 21 and the first isolation submodule 2212 respectively, and the first isolation submodule 2212 is also connected to the image processing component 23. The signal conversion submodule 2214 is used to convert the received second signal into a DVP signal and send the DVP signal to the first isolation submodule 2212. The first isolation submodule 2212 is used to electrically isolate the DVP signal and send the electrically isolated DVP signal to the image processing component 23.

[0066] In some embodiments, the image signal sent by the image sensor 11 with an analog interface is a second signal, and the image signal sent by the image sensor 11 with a SerDes interface is also a second signal. Therefore, the electrical isolation module 221 corresponding to the image sensor 11 with an analog interface and the image sensor 11 with a SerDes interface can be the same. That is to say, the electrical isolation module 221 corresponding to the image sensor 11 with an analog interface and the image sensor 11 with a SerDes interface is used to electrically isolate the second signal.

[0067] Due to limitations of electrical isolation devices, the second signal needs to be converted before the corresponding electrical isolation operation can be performed. Therefore, the electrical isolation module 221 corresponding to the analog interface image sensor 11 and the SerDes interface image sensor 11 may include a signal conversion submodule 2214. Since the signal conversion submodule 2214 is connected to the second interface 21, when using the analog interface image sensor 11 or connecting the endoscope 1 and processing unit 2 using the SerDes interface image sensor 11, the signal conversion submodule 2214 can receive the second signal and convert it into a DVP signal, thereby performing electrical isolation operation on the DVP signal in subsequent processes, that is, performing electrical isolation operation on the second signal.

[0068] Continuing the description above, after the signal conversion submodule 2214 converts the second signal into a DVP signal that meets the requirements of the electrical isolation device, it is also necessary to electrically isolate the DVP signal, thereby electrically isolating the second signal. Therefore, the electrical isolation module 221 corresponding to the analog interface image sensor 11 and the SerDes interface image sensor 11 may also include a first isolation submodule 2212. Moreover, the signal conversion submodule 2214 is also connected to the first isolation submodule 2212. Therefore, the first isolation submodule 2212 can receive the DVP signal and perform corresponding electrical isolation operations on the DVP signal.

[0069] Furthermore, the first isolation module 2212 is also connected to the image processing component 23, so the image processing component 23 can receive the electrically isolated DVP signal and optimize it.

[0070] It should be noted that the above description is based on the electrical isolation module 221 corresponding to the analog interface image sensor 11 and the SerDes interface image sensor 11, which includes a signal conversion submodule 2214 and a first isolation submodule 2212. Alternatively, in applications, the electrical isolation module 221 corresponding to the analog interface image sensor 11 and the SerDes interface image sensor 11 may also include other components, and this application embodiment does not limit this.

[0071] When the interface of the image sensor 11 is an LVDS interface, the image signal is a third signal, such as... Figure 4 As shown, the electrical isolation module 221 corresponding to the image sensor 11 with the LVDS interface includes a second isolation submodule 2213; the second isolation submodule 2213 is connected to the second interface 21 and the image processing component 23 respectively; the second isolation submodule 2213 is used to electrically isolate the third signal and send the electrically isolated third signal to the image processing component 23.

[0072] In some embodiments, the image signal sent by the image sensor 11 with the LVDS interface is a third signal. Therefore, the electrical isolation component 22 also includes an electrical isolation module 221 corresponding to the image sensor 11 with the LVDS interface, and the electrical isolation module 221 is used to perform electrical isolation operation on the third signal.

[0073] Since the third signal can be directly electrically isolated, the electrical isolation module 221 of the LVDS interface image sensor 11 only needs to include the second isolation submodule 2213. The second isolation submodule 2213 is connected to the second connector 21. Therefore, when the endoscope 1 using the LVDS interface image sensor 11 is connected to the processing unit 2, the second isolation submodule 2213 can receive the third signal and perform corresponding electrical isolation operations on it. The second isolation submodule 2213 is also connected to the image processing component 23. Therefore, the image processing component 23 can receive the electrically isolated third signal and optimize it.

[0074] It should be noted that the above description is based on the electrical isolation module 221 corresponding to the LVDS interface image sensor 11, which includes the second isolation submodule 2213. Alternatively, in applications, the electrical isolation module 221 corresponding to the LVDS interface image sensor 11 may also include other components, and this application embodiment does not limit this.

[0075] In some embodiments, such as Figure 5 As shown, the electrical isolation module 221 corresponding to the MIPI image sensor 11 and the electrical isolation modules 221 corresponding to the analog interface image sensor 11 and the SerDes interface image sensor 11 share the same first isolation submodule 2212; the electrical isolation module 221 corresponding to the MIPI image sensor 11 and the electrical isolation module 221 corresponding to the LVDS interface image sensor 11 share the same second isolation submodule 2213.

[0076] To reduce the size of the endoscope system and save on electrical isolation costs, the first isolation submodule 2212 in the electrical isolation module 221 corresponding to the MIPI image sensor 11 is the same isolation submodule 2212 in the electrical isolation module 221 corresponding to the analog interface image sensor 11 and the SerDes interface image sensor 11. Therefore, the first isolation submodule 2212 can perform electrical isolation operations on both low-power signals and DVP signals. That is, when the processing unit 2 is connected to the endoscope 1 using the MIPI image sensor 11, the first isolation submodule 2212 can perform corresponding electrical isolation operations on the first signal; when the processing unit 2 is connected to the endoscope 1 using either the analog interface image sensor 11 or the SerDes interface image sensor 11, the first isolation submodule 2212 can also perform corresponding electrical isolation operations on the second signal.

[0077] The second isolation submodule 2213 in the electrical isolation module 221 corresponding to the MIPI image sensor 11 and the second isolation submodule 2213 in the electrical isolation module 221 corresponding to the LVDS interface image sensor 11 are the same isolation submodule. Therefore, the second isolation submodule 2213 can perform electrical isolation operations on both high-speed signals and third signals. That is, when the processing unit 2 is connected to the endoscope 1 using the MIPI image sensor 11, the second isolation submodule 2213 can perform corresponding electrical isolation operations on the first signal; when the processing unit 2 is connected to the endoscope 1 using the LVDS interface image sensor 11, the second isolation submodule 2213 can perform corresponding electrical isolation operations on the third signal.

[0078] In some embodiments, such as Figure 6 As shown, the signal separation submodule 2211 includes at least one transistor Q1, the first isolation submodule 2212 includes a digital isolator QS1, the second isolation submodule includes an LVDS isolator QS2, and the signal conversion submodule 2214 includes a decoding chip C1.

[0079] By using transistor Q1 to separate the first signal into a low-power signal and a high-speed signal, low-cost electrical isolation of the first signal can be achieved.

[0080] The QS1 digital isolator is a chip used in endoscope systems to provide high resistance isolation when digital or analog signals are transmitted, thereby isolating the endoscope system from the user, improving safety, and reducing ground loop noise.

[0081] An LVDS isolator is an electronic device used to isolate LVDS signals, or low-voltage differential signals. It transmits data over two wires via differential signal pairs and has the advantages of low power consumption, low electromagnetic interference, and high transmission rate.

[0082] The decoding chip C1 is an integrated circuit used to convert digital signals into visual, audible, or perceptible signals, enabling the decoding and playback of multimedia data.

[0083] It should be noted that the above description uses the signal separation submodule 2211 as an example, which includes at least one transistor Q1. Alternatively, in applications, the signal separation submodule may also include a MIPI-to-LVDS bridge chip. Similarly, the above description uses the first isolation submodule 2212, which includes a digital isolator QS1, the second isolation submodule, which includes an LVDS isolator QS2, and the signal conversion submodule 2214, which includes a decoding chip C1. Alternatively, in applications, all three may include other components. This application does not limit the scope of these components.

[0084] In some embodiments, the first connector 12 is a microHDMI male connector, and the second connector 21 is a microHDMI female connector. Since the microHDMI interface can handle video signals up to 1080p, it can provide users with high-quality, high-definition resolution when using the endoscope system. Furthermore, because the microHDMI interface is smaller, it reduces the area occupied by the endoscope system's interfaces.

[0085] In some embodiments, such as Figure 7 As shown, the power generation component 13 includes multiple voltage regulators 131 (three voltage regulators 131 are illustrated in the figure); the multiple voltage regulators 131 are connected to the power supply pin 211 of the second interface 21 through the first interface 12, and the multiple voltage regulators 131 are also connected to the image sensor 11 respectively to adjust the voltage output by the power supply pin 211 to generate the voltage required by the image sensor 11.

[0086] Since each of the multiple voltage regulators 131 can be connected to the power supply pin 211 via the first connector 12, when the endoscope 1 is connected to the processing unit 2, each of the multiple voltage regulators 131 can receive voltage from the power supply pin 211 and adjust this voltage to different magnitudes to meet the power requirements of the image sensor 11. Furthermore, each of the multiple voltage regulators 131 is also connected to the image sensor 11, thus, after adjusting the voltage from the power supply pin 211, the multiple voltage regulators 131 can output the adjusted voltage to the image sensor 11. For example, please refer to... Figure 7 ,from Figure 7 As can be seen, the power generation component 13 includes three voltage regulators 131, and the three voltage regulators 131 can adjust the voltage from the power supply pin 211 to 2.8V, 1.8V and 1.2V, and all of them are connected to the image sensor 11. Thus, the image sensor 11 can obtain voltages of 2.8V, 1.8V and 1.2V to meet its own power needs.

[0087] It should be noted that the voltage regulator 131 can be an LDO (low dropout regulator), or other voltage regulators, and this application embodiment does not limit this.

[0088] In some embodiments, such as Figure 8 As shown, the second interface 21 also includes a function pin 212, an illumination power supply pin 213, a first data transmission pin 214, and a second data transmission pin 215. The function pin 212 can be connected to the MIPI image sensor 11, the LVDS interface image sensor 11, the analog interface image sensor 11, or the SerDes interface image sensor 11 to enable the endoscope 1 to perform related functions. The illumination power supply pin 213 can be connected to the MIPI image sensor 11, the LVDS interface image sensor 11, the analog interface image sensor 11, or the SerDes interface image sensor 11 to power the illumination module 14 included in the endoscope 1. The first data transmission pin 214 and the second data transmission pin 215 can both be connected to the MIPI image sensor 11 or the LVDS interface image sensor 11 to realize the data transmission of the image sensor 11. The first data transmission pin 214 or the second data transmission pin 215 can be connected to the SerDes interface image sensor 11 to realize the data transmission of the SerDes interface image sensor 11.

[0089] In other words, when the endoscope 1 is connected to the processing unit 2, the endoscope 1 can perform various functions through the function pin 212, and the illumination module 14 in the endoscope 1 can be powered through the illumination power supply pin 213.

[0090] Since the first signal transmitted by the MIPI image sensor 11 and the third signal transmitted by the LVDS interface image sensor 11 are differential signals, and both the first and third signals require two sets of transmission pins, when the processing unit 2 is connected to the endoscope 1 using the MIPI image sensor 11, both the first data transmission pin 214 and the second data transmission pin 215 can establish a connection with the MIPI image sensor 11 through the second connector 21, thereby enabling the transmission of the first signal. Similarly, when the processing unit 2 is connected to the endoscope 1 using the LVDS interface image sensor 11, both the first data transmission pin 214 and the second data transmission pin 215 can also establish a connection with the LVDS interface image sensor 11 through the second connector 21, thereby enabling the transmission of the third signal.

[0091] Since the second signal sent by the image sensor 11 with the SerDes interface is also a differential signal, but only one set of transmission pins is needed to transmit the second signal, when the processing unit 2 is connected to the endoscope 1 using the image sensor 11 with the SerDes interface, only one of the first data transmission pin 214 and the second data transmission pin 215 needs to be connected to the image sensor 11 with the SerDes interface through the second connector 21 to realize the transmission of the second signal.

[0092] In some embodiments, the endoscope 1 further includes a pressure sensor and a charge pump, wherein the charge pump is connected to a power supply pin 211 and the pressure sensor, respectively, and the charge pump is used to adjust the voltage from the power supply pin 211 to the required voltage of the pressure sensor so that the pressure sensor can detect the pressure when the endoscope 1 is used.

[0093] In addition, in some embodiments, the endoscope also includes a filtering circuit that can filter out interference with the image signal.

[0094] The endoscope in the embodiment of this application includes image sensors with different interface types, meaning the endoscope system is compatible with image sensors of different interface types, thus broadening its application scenarios. Furthermore, the endoscope also includes a power generation component, and the second interface of the processing unit includes a power supply pin. The power generation component is connected to both the image sensor and the power supply pin, adjusting the voltage from the power supply pin to the required power voltage for the image sensor, thus meeting the power needs of the image sensor. Therefore, only one power supply pin is needed to provide the appropriate power voltage to the endoscope, saving resources. In addition, the electrical isolation component in the processing unit includes multiple electrical isolation modules corresponding to image sensors of different interface types. Each electrical isolation module can be used to perform electrical isolation operations on the image signals sent by the corresponding interface type image sensor. That is, the electrical isolation of image signals sent by image sensors of different interface types is separate, thereby providing more targeted electrical isolation of the image signals.

[0095] Furthermore, the first interface may also include a first encryption circuit storing the identifier of the endoscope 1 and image parameters. The second interface also includes a second encryption circuit that can be bound to the first encryption circuit. Thus, the second interface can obtain the image parameters corresponding to the image signal, allowing the image processing component to optimize the image signal according to the image parameters corresponding to the endoscope in subsequent processes. Moreover, since the first and second encryption circuits are bound together, unauthorized replacement of parts in the endoscope system can be prevented, achieving secure management of the endoscope system. The image sensor interface can be one or more of MIPI, LVDS, analog, and SerDes interfaces. When the image sensor interface is MIPI, the corresponding electrical isolation module includes a signal separation submodule. This signal separation submodule can include transistors, enabling the separation of low-power and high-speed signals in the first signal and providing electrical isolation to each. This not only eliminates the need for signal conversion but also achieves low-cost and secure electrical isolation.

[0096] Next, the image optimization method provided in the embodiments of this application will be described in detail.

[0097] Figure 9 This is a flowchart of an image optimization method provided in an embodiment of this application. The method is applied to an endoscope system, which includes one or more endoscopes, each of which includes an image sensor. The image optimization method includes:

[0098] Step 901: In response to the user's photo-taking action, acquire the image signal.

[0099] In some embodiments, when the endoscope is used by the user, the endoscope system can acquire corresponding image signals in response to the user's photo-taking operation.

[0100] Step 902: Determine the target electrical isolation operation based on the type of the image signal, and perform electrical isolation on the image signal according to the target electrical isolation operation. The target electrical isolation method is one of multiple electrical isolation operations, and the type of the image signal is related to the interface type of the image sensor.

[0101] In some embodiments, because the image sensors included in the endoscope have different interface types, the types of image signals acquired may also be different. Furthermore, the electrical isolation operations corresponding to image sensors with different interface types are also different; that is, different image signal types correspond to different electrical isolation operations. Therefore, after acquiring the image signal, it is necessary to determine how to electrically isolate the image signal based on its type, i.e., to determine the target electrical isolation operation from multiple electrical isolation operations. Then, the image signal is electrically isolated according to the target electrical isolation operation.

[0102] Step 903: Optimize the image signal after electrical isolation based on the image parameters corresponding to the endoscope, so as to optimize the image acquired by the endoscope.

[0103] In some embodiments, the endoscope system further includes an encryption circuit that stores the endoscope's identifier and image parameters. Therefore, the endoscope system can directly obtain the image parameters corresponding to the endoscope and optimize the electrically isolated image signal based on the image parameters, thereby optimizing the image acquired by the endoscope.

[0104] This application embodiment acquires image signals. Since the type of the image signal is related to the interface type of the image sensor, and different types of image signals correspond to different electrical isolation operations, it is necessary to determine the target electrical isolation operation based on the type of the image signal. Thus, it can be seen that different types of image signals correspond to different electrical isolation operations, which can achieve more targeted electrical isolation and improve the safety of the endoscope system when it is used.

[0105] Those skilled in the art will understand that all or part of the functions of the various methods in the above embodiments can be implemented by hardware or by computer programs. When all or part of the functions in the above embodiments are implemented by computer programs, the program can be stored in a computer-readable storage medium, which may include: read-only memory, random access memory, disk, optical disk, hard disk, etc., and the program is executed by a computer to achieve the above functions. For example, the program can be stored in the memory of a device, and when the program in the memory is executed by the processor, all or part of the above functions can be achieved. In addition, when all or part of the functions in the above embodiments are implemented by computer programs, the program can also be stored in a server, another computer, disk, optical disk, flash drive, or external hard drive, etc., and can be downloaded or copied to the memory of a local device, or the system of the local device can be updated. When the program in the memory is executed by the processor, all or part of the functions in the above embodiments can be achieved.

[0106] The above examples illustrate the present invention only to aid in understanding it and are not intended to limit the scope of the invention. Those skilled in the art can make various simple deductions, modifications, or substitutions based on the principles of this invention.

Claims

1. An endoscope system, characterized in that, Includes one or more endoscopes and processing units; The endoscope includes an image sensor, a first connector, a power generation component, and an illumination module. One or more of the endoscopes may include image sensors with different interface types. The endoscope is used to acquire images and obtain image signals through the image sensor. One end of the first connector is connected to the image sensor, and the other end is used to connect to the processing unit. The power generation component is connected to the image sensor and is used to generate the power voltage required by the image sensor. The illumination module is used to provide illumination during image acquisition. The processing unit includes a second plug interface that matches the first plug interface in terms of plugging, an electrical isolation component, and an image processing component; The second connector has multiple pins, and the second connector and the first connector are pluggable. The multiple pins of the second connector can be multiplexed by image sensors of different interface types. The power supply pin of the second connector is connected to the power generation component through the first connector, allowing the power generation component to adjust the voltage supplied to the power supply pin. The second connector is also connected to the electrical isolation component, allowing the electrical isolation component to receive image signals sent by the image sensor. The electrical isolation component is also connected to the image processing component, which includes multiple electrical isolation modules corresponding to image sensors of different interface types. Each electrical isolation module is used to perform electrical isolation operations on the image signals of the corresponding interface type image sensor. The image processing component, after receiving the electrically isolated image signal, optimizes the electrically isolated image signal based on the image parameters corresponding to the endoscope, thereby optimizing the image acquired by the endoscope. Wherein, when the image sensor interface is MIPI, the image signal is a first signal, and the electrical isolation module corresponding to the MIPI image sensor includes a signal separation submodule, a first isolation submodule, and a second isolation submodule; the signal separation submodule is connected to the second interface, the first isolation submodule, and the second isolation submodule, respectively, and the first isolation submodule and the second isolation submodule are also connected to the image processing component; the signal separation submodule is used to separate a low-power signal and a high-speed signal from the received first signal, and send the low-power signal to the first isolation submodule and the high-speed signal to the second isolation submodule; the first isolation submodule is used to electrically isolate the low-power signal and send the electrically isolated low-power signal to the image processing component; the second isolation submodule is used to electrically isolate the high-speed signal and send the electrically isolated high-speed signal to the image processing component; When the image sensor interface is an analog interface or a SerDes interface, the image signal is a second signal. The electrical isolation module corresponding to the image sensor with the analog interface and the image sensor with the SerDes interface includes a signal conversion submodule and a first isolation submodule. The signal conversion submodule is connected to the second connector and the first isolation submodule, respectively. The first isolation submodule is also connected to the image processing component. The signal conversion submodule is used to convert the received second signal into a DVP signal and send the DVP signal to the first isolation submodule. The first isolation submodule is used to electrically isolate the DVP signal and send the electrically isolated DVP signal to the image processing component.

2. The endoscope system as described in claim 1, characterized in that, The image sensor interface is one or more of MIPI, LVDS, analog, and SerDes interfaces. When the image sensor interface is the LVDS interface, the image signal is a third signal. The electrical isolation module corresponding to the image sensor with the LVDS interface includes a second isolation submodule. The second isolation submodule is connected to the second connector and the image processing component respectively. The second isolation submodule is used to electrically isolate the third signal and send the electrically isolated third signal to the image processing component.

3. The endoscope system as described in claim 2, characterized in that, The electrical isolation module corresponding to the image sensor of MIPI and the electrical isolation modules corresponding to the image sensors of the analog interface and the SerDes interface share the same first isolation submodule; the electrical isolation module corresponding to the image sensor of MIPI and the electrical isolation module corresponding to the image sensor of the LVDS interface share the same second isolation submodule.

4. The endoscope system as described in claim 2, characterized in that, The signal separation submodule includes at least one transistor, the first isolation submodule includes a digital isolator, the second isolation submodule includes an LVDS isolator, and the signal conversion submodule includes a decoding chip.

5. The endoscope system as described in claim 1, characterized in that, The first connector is a microHDMI male connector, and the second connector is a microHDMI female connector.

6. The endoscope system according to any one of claims 1-5, characterized in that, The power generation component includes multiple voltage regulators; Multiple voltage regulators are connected to the power supply pins of the first and second connectors via the first connector. The multiple voltage regulators are also connected to the image sensor to adjust the voltage output from the power supply pins to generate the voltage required by the image sensor.

7. The endoscope system according to any one of claims 1-5, characterized in that, The second connector also includes a function pin, a lighting power supply pin, a first data transmission pin, and a second data transmission pin; The functional pins can be connected to the image sensor of MIPI, the image sensor of LVDS interface, the image sensor of analog interface, or the image sensor of SerDes interface, so that the endoscope can perform related functions; The illumination power supply pin can be connected to the image sensor of MIPI, the image sensor of LVDS interface, the image sensor of analog interface, or the image sensor of SerDes interface to provide power to the illumination module included in the endoscope. Both the first data transmission pin and the second data transmission pin can establish a connection with the MIPI image sensor or the LVDS interface image sensor to realize the data transmission of the image sensor mentioned above. The first data transmission pin or the second data transmission pin can be connected to the image sensor of the SerDes interface to realize data transmission of the image sensor of the SerDes interface.

8. An image optimization method, characterized in that, Applied to an endoscope system as described in any one of claims 1-7, the endoscope system comprising one or more endoscopes, each endoscope including an image sensor, the image optimization method comprising: It acquires image signals in response to the user's photo-taking action; The target electrical isolation operation is determined based on the type of the image signal, and the image signal is electrically isolated according to the target electrical isolation operation. The target electrical isolation method is one of a plurality of electrical isolation operations, and the type of the image signal is related to the interface type of the image sensor. The image signal after electrical isolation is optimized based on the image parameters corresponding to the endoscope, so as to optimize the image acquired by the endoscope.

9. A computer-readable storage medium, characterized in that, The medium stores a computer program that can be executed by a processor to implement the method as described in claim 8.

10. A computer program product comprising a computer program and / or instructions, characterized in that, When the computer program and / or instructions are executed by the processor, they implement the method of claim 8.

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