A laser-assisted stamping method and processing device for high-silicon steel sheets

Abstract

The present invention relates to a laser-assisted stamping processing method for high-silicon steel sheets. First, laser pre-cutting is performed on segmented high-silicon steel strips, and the depth of the laser pre-cutting is 25-50% of the thickness of the high-silicon steel strips. Then, the pre-cut high-silicon steel strips are sent to a stamping platform through a conveyor belt for stamping operations. At the same time, the next section of high-silicon steel strips is undergoing laser pre-cutting, and the cutting machine and the stamping machine tool work synchronously and coordinately. During the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, reducing the contact stress between the die and the high-silicon steel strips during stamping. First, laser cutting is used to pre-cut the high-silicon steel strips to reduce the influence of the deterioration of magnetic properties caused by laser cutting; then stamping is used to reduce the stress of the material, thereby obtaining a product with a complete edge, reducing burrs and cracks at the edge, obtaining a product with high precision, improving the processing efficiency at the same time, reducing the rejection rate, and lowering the cost.

Description

Technical Field

[0001] The invention relates to the technical field of high silicon steel sheet processing, in particular to a laser-assisted stamping processing method and a processing device for high silicon steel sheets. Background Art

[0002] High silicon steel is a key soft magnetic material in the field of power electronics. Current mainstream processing technologies have significant limitations when dealing with high silicon steel materials: the mechanical blanking process is limited by the lack of ductility of the material at room temperature, which can easily cause micro-cracks on the cross section and edge delamination defects, seriously affecting the material forming accuracy and yield rate; cracks and fractures are prone to occur during the direct stamping process on existing stamping equipment, resulting in an extremely low yield rate, making it difficult to obtain complete products, and making it impossible to directly stamp and produce them; conventional sawing processing leads to frequent edge collapse due to concentrated cutting stress, making it difficult to meet the requirements of precision device processing.

[0003] If the laser cutting process is adopted, the rapid cooling of the material caused by local high temperature during direct laser cutting can easily lead to cracks or local damage at the cutting edge, which will not only reduce the mechanical properties of the material, but also cause significant deterioration of the magnetic properties due to microstructural changes affected by heat, ultimately affecting the comprehensive performance indicators of the product.

[0004] Therefore, the market is in urgent need of an improved laser-assisted stamping processing method for high-silicon steel and high-brittle soft magnetic materials. The high-silicon steel and high-brittle soft magnetic materials here refer to silicon steel sheets with a silicon content between 3.2% and 6.5%, and are high-brittle materials that are prone to fracture and failure due to their elongation less than 5%. Summary of the invention

[0005] The purpose of the present invention is to provide an improved laser-assisted stamping processing method and processing device for high-silicon steel sheets. By improving the processing technology and structure, the cracks and fractures generated during the stamping process are solved, the yield rate of high-silicon steel sheets is improved, the cost is reduced, and the processing accuracy is improved.

[0006] In order to achieve the above-mentioned purpose, the technical solution of the present invention is: a laser-assisted stamping processing method for high-silicon steel sheets, characterized in that: the processing method comprises the following steps: a. laser pre-cutting the segmented high-silicon steel strip, and the depth of the laser pre-cutting is 25-50% of the thickness of the high-silicon steel strip; b. the pre-cut high-silicon steel strip is sent to the stamping platform via a conveyor belt for stamping operation, and at the same time, the next section of high-silicon steel strip is laser pre-cut, and the laser cutting and the stamping machine work synchronously and coordinatedly; c. during the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, which optimizes the contact surface between the die and the material during stamping and reduces the contact stress between the die and the high-silicon steel strip during stamping.

[0007] Preferably, in step a, according to different thicknesses t mm of the high-silicon steel strip, and silicon content mass fraction s wt%, different laser pre-cutting thicknesses h mm are set, and the piecewise function among the three is as follows:

[0008]

[0009] Furthermore, in step b, in order to make the laser cutting machine and the stamping machine work synchronously and coordinately, the relationship between the set laser cutting time T1, the time T2 for stamping one piece, and the number N of laser cuts is as follows:

[0010] Laser cutting path length: ; where the outer radius of the motor stator mm, the inner radius of the stator mm, the number of slots , the slot opening width mm, the total length of the inner wall of the slot mm;

[0011] Laser cutting time: ; where the laser cutting speed mm / s;

[0012] Time for stamping one piece: ;

[0013] Number of laser cuts: , where is the time for the next high-silicon steel strip to move to the specified position after the machine tool has stamped one piece.

[0014] Furthermore, in step c, the radius of the stamping die is set , where the laser cutting radius is mm, and the width of the laser cut mark is mm.

[0015] A processing device for a laser-assisted stamping processing method for high-silicon steel sheets, characterized in that: the processing device includes a coil strip unwinding rack, a shearing machine, a cutting platform, and a stamping platform. The shearing machine and the cutting platform, and the cutting platform and the stamping platform are connected by conveyor belts; at least 2 cutting machines are arranged in parallel on the cutting platform, and a stamping machine is arranged on one side of the stamping platform to cooperate with it.

[0016] Preferably, a roller drive mechanism is arranged on the stamping platform. The stamping machine is provided with a stamping head, and a stamping die is arranged below the stamping head. The stamping die and the stamping head are connected by a slider assembly; a first flywheel and a second flywheel are respectively arranged on both sides of the stamping head, and a group of air cylinders for controlling the slider assembly are arranged above the stamping head.

[0017] Furthermore, the radius of the stamping die , where the laser cutting radius is mm, and the laser cut width is mm.

[0018] Furthermore, the cutting platform includes a machine tool bed and machine tool support feet provided below the machine tool bed, and a transmission mechanism is provided on the machine tool bed; each cutting machine is provided with two cutting heads arranged in parallel, and the cutting heads perform laser pre-cutting on the high-silicon steel strip placed on the machine tool bed along the Z-axis direction under the control of the cutting machine.

[0019] Even further, a protruding rotating shaft is provided on one side of the coiling and unwinding rack, and the coiled high-silicon steel strip is sleeved on the rotating shaft; a material inlet is provided on one side of the guillotine shear, and a material sorting rack is provided at the material inlet, and one end of the high-silicon steel strip is placed into the material inlet after passing through the material sorting rack.

[0020] Compared with the prior art, the technical solution of the present invention includes not only improvements in the overall technical solution, but also many improvements in details. Specifically, it has the following beneficial effects:

[0021] 1. In the improvement solution of the present invention, a composite processing technology of laser pre-cutting and then stamping is adopted for the high-silicon steel strip. First, the high-silicon steel strip is pre-cut by laser cutting to reduce the influence of magnetic property deterioration caused by laser cutting; then stamping is used to reduce the stress of the material, so as to obtain a product with a complete edge, reduce burrs and cracks at the edge, obtain a high-precision product, improve the processing efficiency at the same time, reduce the scrap rate, and reduce the cost;

[0022] 2. In the technical solution of the present invention, laser pre-cutting is performed on the segmented high-silicon steel strip, and the depth of laser pre-cutting is 25-50% of the thickness of the high-silicon steel strip. Since the cutting depth is relatively shallow, the laser cutting speed can be significantly increased, thereby reducing the processing time and improving the processing efficiency; at the same time, the relatively shallow cutting depth helps to reduce the thermal influence of laser cutting on the high-silicon steel strip, further reducing the deterioration of magnetic properties and ensuring the quality of the finished product;

[0023] 3. In the process of the present invention, the pre-cut high-silicon steel strip is sent to the stamping platform for stamping operation through a conveyor belt. At the same time, the next section of the high-silicon steel strip is being laser pre-cut, and the cutting machine and the stamping machine tool work synchronously and coordinately, significantly improving the processing efficiency and reducing the production cost;

[0024] 4. In the process method of the present invention, during the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, which optimizes the contact surface between the die and the material during stamping, reduces the appearance of burrs on the stamping section, and reduces the contact stress between the die and the material during stamping, thereby extending the service life of the die; further, the smaller die size reduces the difficulty of material processing and improves the processing accuracy; due to the previous pre-cutting process, the effective stamping depth of the high silicon steel strip is reduced in the stamping process, the punching force required by the stamping machine is reduced, the energy consumption of the equipment is reduced, and the service life is extended;

[0025] 5. In the structure of the present invention, the processing device includes a coil unwinding rack, a shearing machine, a cutting platform and a punching platform. The shearing machine and the cutting platform, as well as the cutting platform and the punching platform are connected by conveyor belts. The entire equipment has a compact and reasonable layout and efficient operation, which can meet the needs of high-quality mass production, further improve the integrity and yield rate of the product, and has great market promotion and utilization value. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the present invention.

[0027] Figure 2 It is another structural schematic diagram of the present invention.

[0028] Figure 3 It is a schematic structural diagram of the cooperation between the plate shearing machine and the coil unwinding rack of the present invention.

[0029] Figure 4 It is a schematic structural diagram of the punching machine of the present invention.

[0030] Figure 5 It is a schematic structural diagram of the cutting platform of the present invention.

[0031] Figure 6 It is a schematic diagram of a section of processed high silicon steel strip according to the present invention.

[0032] Figure 7 for Figure 6 A partial enlarged schematic diagram of .

[0033] Figure 8 It is a schematic diagram of the processing cooperation between the stamping die and the high silicon steel strip of the present invention.

[0034] Reference numerals:

[0035] 1 coil unwinding rack, 2 shearing machine, 3 cutting platform, 4 stamping platform, 5 high silicon steel strip;

[0036] 11 rotating shaft;

[0037] 21 Material storage rack;

[0038] 31 Machine tool bed, 32 Machine tool support feet, 33 Transmission mechanism, 34 Cutting head;

[0039] 40 Roller transmission mechanism, 41 Stamping head, 42 Stamping die, 43 Slide block assembly, 44 First flywheel, 45 Second flywheel, 46 Cylinder, 47 Electrical control system, 48 Pneumatic clutch, 49 Press. Detailed implementation mode

[0040] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative work shall fall within the protection scope of the present invention.

[0041] The present invention provides a laser-assisted stamping processing method for high-silicon steel sheets. The processing method includes the following steps: a. Laser pre-cut the segmented high-silicon steel strips, and the depth of the laser pre-cut is 25%-50% of the thickness of the high-silicon steel strips; b. Send the pre-cut high-silicon steel strips to the stamping platform through a conveyor belt for stamping operations. At the same time, the next segment of high-silicon steel strips is being laser pre-cut, and the cutting machine and the stamping machine tool work synchronously and coordinately; c. During the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, reducing the contact stress between the die and the high-silicon steel strips during stamping.

[0042] Through the laser pre-cutting and stamping composite processing technology, the present invention effectively reduces the mechanical stress caused by stamping, reduces the deterioration of magnetic properties, and improves the processing efficiency and product quality. Specifically, the laser pre-cutting of the present invention calculates a reasonable pre-cutting depth according to the thickness and silicon content mass fraction of the high-silicon steel strips. Since the depth is 25%-50% of the thickness of the high-silicon steel strips, the cutting thickness is relatively shallow, which can significantly improve the cutting speed, reduce the processing time, further improve the processing efficiency, and at the same time ensure the smoothness and dimensional accuracy of the cutting edge, reducing the difficulty and defect rate of subsequent stamping processing.

[0043] In the stamping process of the present invention, a stamping die with special specifications is designed. The size of the stamping die can be designed to be half a laser cut width smaller than the size of the pre-cut marks. This design optimizes the contact surface between the die and the material during stamping, reduces the burrs on the stamping section, improves the processing accuracy, and at the same time reduces the contact stress between the die and the material during stamping, thereby extending the service life of the die. By using the collaborative operation of laser cutting and stamping processes, an efficient processing flow is realized, and the production efficiency is significantly improved.

[0044] The technical solution of the present invention breaks through the limitations of traditional processing methods in the mass production of high silicon steel and high brittle soft magnetic materials, and can achieve efficient and high-quality production of high brittle soft magnetic materials. At the same time, the technical solution successfully retains the magnetic properties of the material, ensures the integrity and yield rate of the product, further improves the processing accuracy of the product, and reduces the production cost.

[0045] Example 1

[0046] In this embodiment, the processing method includes the following steps: a. Pre-cut the segmented high silicon steel strip by laser, and the depth of the laser pre-cutting is 25-50% of the thickness of the high silicon steel strip. Due to the shallow cutting depth, the laser cutting speed can be significantly improved, thereby reducing the processing time and improving the processing efficiency. At the same time, the shallow cutting depth helps to reduce the thermal impact of laser cutting on the material and further reduce the deterioration of magnetic properties; b. The pre-cut high silicon steel strip is sent to the stamping platform through a conveyor belt for stamping. At the same time, the next section of high silicon steel strip is being pre-cut by laser, and the cutting machine and the stamping machine work synchronously and coordinately. Specifically, the laser cutting equipment is equipped with N laser heads, each laser head accurately cuts a pre-cut part on this section of the strip within T minutes, and the cut strip is sent to the stamping machine. At the same time, the shearing machine transfers a new section of strip and continues the cutting and stamping operations, thereby realizing the synchronous operation of stamping and laser cutting and significantly improving the processing efficiency; c. During the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, which reduces the contact stress between the die and the high-silicon steel strip during stamping and extends the service life.

[0047] Specifically, in step a, different laser pre-cutting thicknesses h mm are set according to different high silicon steel strip thicknesses t mm, silicon content mass fractions s wt%, and the piecewise function between the three is as follows:

[0048]

[0049] In step b, in order to make the cutting machine and the punching machine work synchronously and coordinately, the relationship between the laser cutting time T1, the time for punching one sheet T2, and the number of laser cutting N is set as follows:

[0050] Laser cutting path length: ; Among them, the outer radius of the motor stator mm, stator inner radius mm, number of slots , slot width mm, total length of the inner wall of the groove mm;

[0051] Laser cutting time: ; Among them, the laser cutting speed mm / s;

[0052] Time for stamping one piece: ;

[0053] Number of laser cuttings: , where is the time for the machine tool to wait for the next high-silicon steel strip to move to the designated position after stamping one piece.

[0054] In step c, set the radius of the stamping die , where the laser cutting radius is mm, and the width of the laser cut mark is mm.

[0055] In summary, this embodiment adopts a laser pre-cutting and stamping composite processing technology. First, the high-silicon steel sheet is pre-cut by laser cutting, which not only improves the cutting speed and quality, but also reduces the influence of magnetic property deterioration caused by laser cutting. Then, the pre-cut high-silicon steel sheet is sent to the stamping process through the conveying mechanism. During the stamping process, a stamping die is used to reduce the stress between the die and the material, obtaining a complete and high-quality product, and realizing the improvement of processing efficiency and quality.

[0056] Embodiment 2

[0057] In this embodiment, a processing device for a laser-assisted stamping processing method for high-silicon steel sheets is described. The processing device includes a coil strip unwinding rack, a guillotine shear, a cutting platform, and a stamping platform. Between the guillotine shear and the cutting platform, and between the cutting platform and the stamping platform, they are connected by conveyor belts for conveying the high-silicon steel strip to be processed; at least two cutting machines are arranged in parallel on the cutting platform to synchronously laser pre-cut the high-silicon steel strip placed on the cutting platform; on one side of the stamping platform, there is a matching stamping machine for stamping the high-silicon steel strip placed on the stamping platform.

[0058] Specifically, on one side of the coil strip unwinding rack 1, there is a protruding rotating shaft 11, and the coiled high-silicon steel strip is sleeved on the rotating shaft; on one side of the guillotine shear 2, there is a material inlet, and at the material inlet, there is a material sorting rack 21. One end of the high-silicon steel strip is put into the material inlet after passing through the material sorting rack, and then the guillotine shear cuts the high-silicon steel strip into segments. The segmented high-silicon steel strip is sent to the cutting platform through the conveyor belt for subsequent laser pre-cutting.

[0059] Further, the cutting platform 3 includes a machine tool bed 31 and machine tool support feet 32 provided below the machine tool bed. A transmission mechanism 33 is provided on the machine tool bed for transmitting the high-silicon steel strip to be cut. Each cutting machine is provided with two cutting heads 34 arranged in parallel. The cutting heads move up and down along the Z-axis direction under the control of the cutting machine, so as to perform laser pre-cutting on the high-silicon steel strip placed on the machine tool bed. The high-silicon steel strip after laser pre-cutting is sent to the subsequent stamping platform through a conveyor belt.

[0060] A roller transmission mechanism 40 is provided on the stamping platform 4. A stamping machine head 41 is provided on the stamping machine. A stamping die 42 is provided below the stamping machine head. The stamping die is connected to the stamping machine head through a slider assembly 43. First and second flywheels 44 and 45 are respectively provided on both sides of the stamping machine head. A set of air cylinders 46 for controlling the slider assembly is provided above the stamping machine head. During specific operation, the air cylinders drive the control slider assembly to move downward, and the slider assembly drives the stamping die to stamp the high-silicon steel strip downward to complete the processing of the product. Among them, the radius of the stamping die , where the laser cutting radius is mm, and the laser cut width is mm. The radius of the stamping die is smaller than the laser cutting radius, which optimizes the contact surface between the die and the material during stamping, reduces the appearance of burrs on the stamping section, and at the same time reduces the contact stress between the die and the material during stamping, thereby extending the service life of the die. Further, the smaller die size reduces the material processing difficulty and improves the processing accuracy. Due to the previous pre-cutting process of the high-silicon steel strip, the effective stamping depth is reduced during the stamping process, the punching force required by the stamping machine is reduced, the equipment energy consumption is reduced, and the service life is extended.

[0061] Embodiment 3

[0062] In this embodiment, first, laser pre-cutting is performed on the high-silicon steel strip. The laser pre-cutting depth is 25% - 50% of the thickness of the silicon steel strip. Since the cutting depth is relatively shallow, the laser cutting speed can be significantly increased, thereby reducing the processing time and improving the processing efficiency. At the same time, the relatively shallow cutting depth helps to reduce the thermal influence of laser cutting on the material and further reduces the deterioration of magnetic properties. In addition, the high-precision characteristics of laser cutting can ensure the smoothness and dimensional accuracy of the cutting edge, reducing the difficulty and defect rate of subsequent stamping processing; specifically, the higher the silicon content, the more brittle the material, and the greater the required pre-cutting depth. It is found in the experiment that for the high-silicon steel strip with a thickness of 0.02 - 0.2 mm, the high-silicon steel strip with a mass fraction of 3.2 wt% can be pre-cut by 25% of the thickness; the high-silicon steel strip with a mass fraction of 5 wt% can be pre-cut by 33.3% of the thickness, and the high-silicon steel strip with a mass fraction of 5 wt% can be pre-cut by 40% of the thickness. For the high-silicon steel strip with a thickness of 0.2 - 0.02 mm, the high-silicon steel strip with a mass fraction of 3.2 wt% can be pre-cut by 30% of the thickness; the high-silicon steel strip with a mass fraction of 5 wt% can be pre-cut by 40% of the thickness; the high-silicon steel strip with a mass fraction of 5 wt% can be pre-cut by 50% of the thickness, and a linear relationship is presented in the remaining range, specifically as follows:

[0063] When :

[0064] It is known that when S = 3.2, h = 0.25t; when S = 5, h = 1 / 3t; when s = 6.5, h = 0.4t;

[0065] When , according to the linear interpolation formula:

[0066] ,

[0067] Here x = s, x1 = 3.2, y1 = 0.25t, y2 = 1 / 3t, and we can get:

[0068]

[0069]

[0070] When , x1 = 5, x2 = 6.5, y1 = 1 / 3t, y2 = 0.4t, then:

[0071]

[0072]

[0073] When ,

[0074] When s = 3.2, h = 0.3t; when s = 5, h = 0.4t; when s = 6.5, h = 0.5t;

[0075] When According to the linear interpolation formula, with x1 = 3.2, x2 = 5, y1 = 0.3t, and y2 = 0.4t, we can obtain:

[0076]

[0077]

[0078] When x1 = 5, x2 = 6.5, y1 = 0.4t, and y2 = 0.5t, then:

[0079]

[0080]

[0081] Finally, the complete piecewise function is obtained:

[0082]

[0083] Then, the pre-cut high-silicon steel strip is sent to the stamping platform through a conveyor belt for stamping operations. At the same time, the next section of the high-silicon steel strip is being laser pre-cut, and the cutting machine and the stamping machine work synchronously and coordinately. For example, when stamping a high-silicon steel strip with N pre-cut positions, the stamping takes about T minutes, and the laser cutting equipment can also complete the corresponding cutting task within T minutes. Specifically, the laser cutting equipment is equipped with N laser heads, and each laser head precisely cuts one pre-cut position on this high-silicon steel strip within T minutes and conveys the cut strip to the stamping machine. At the same time, the shearing machine conveys a new section of the strip to continue the cutting and stamping operations, thus realizing the synchronous operation of stamping and laser cutting and significantly improving the processing efficiency.

[0084] Specifically, the laser cutting path length: ; where the outer radius of the motor stator (mm), the inner radius of the stator (mm), the number of slots , the slot opening width (mm), the total length of the inner wall of the slot (mm);

[0085] The laser cutting time: ; where the laser cutting speed (mm / s);

[0086] The time for stamping 1 piece: ;

[0087] Number of laser cutting: , where is the time for the machine tool to wait for the next high-silicon steel strip to move to the specified position after punching 1 piece.

[0088] Next, during the stamping operation, the radius of the stamping die is smaller than that of the laser cutting, reducing the contact stress between the die and the high-silicon steel strip during stamping. This design optimizes the contact surface between the die and the material during stamping, reduces the burrs on the stamping section, and at the same time reduces the contact stress between the die and the material during stamping, thereby extending its service life. At the same time, the smaller die size reduces the difficulty of material processing and improves the processing accuracy. In addition, the pre-cutting process reduces the effective stamping depth, reduces the force required for stamping, reduces the energy consumption of the equipment, and further improves the processing efficiency and economy.

[0089] Set the radius of the stamping die , where the laser cutting radius is (mm), and the width of the laser cut mark is (mm).

[0090] The advantages of the present invention are as follows:

[0091] An automated production line suitable for high-silicon steel is built, realizing an efficient cutting process for high-brittle soft magnetic materials, and high-quality silicon steel sheets can be obtained.

[0092] By setting the laser pre-cutting process, the laser cutting speed is significantly increased, the processing time is reduced, and the processing efficiency is improved. At the same time, the shallower cutting depth reduces the thermal impact of laser cutting on the material and reduces the deterioration of the magnetic properties of the high-silicon steel strip. In addition, the high-precision characteristic of laser cutting ensures the smoothness and dimensional accuracy of the cutting edge of the strip, reduces the difficulty of subsequent stamping processing, and reduces the defect rate.

[0093] The laser pre-cutting and stamping processes are used in collaborative operation. By reasonably arranging the order of laser cutting and stamping, an efficient processing flow is realized. For example, after stamping a certain length of strip, the laser cutting equipment completes the corresponding cutting task during this period, and conveys the cut strip to the stamping machine tool. At the same time, the shearing machine conveys a new section of strip, and continues the cutting and stamping operations, realizing the synchronous and efficient operation of stamping and laser cutting.

[0094] After pre-cutting treatment, the size of the stamping die can be designed to be half a laser cut width smaller than the size of the pre-cut marks, reducing the burrs on the stamping section. At the same time, the contact stress between the die and the material during stamping is reduced, effectively reducing die wear and extending its service life. Meanwhile, the smaller die size reduces the material processing difficulty, improves the processing accuracy, reduces the force required for stamping, and lowers the equipment energy consumption. Due to the coordinated operation of laser pre-cutting and stamping processing, the production rate of the production line is equivalent to the traditional direct stamping rate, thus realizing the high-efficiency batch production of high-brittle soft magnetic materials.

[0095] The above content is a further detailed description of the present invention in combination with specific preferred embodiments. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention belongs, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should all be regarded as belonging to the protection scope of the present invention.

Claims

1. A laser-assisted stamping method for high-silicon steel sheets, characterized in that: The described processing method includes the following steps: a. Laser pre-cut the segmented high-silicon steel strip, and the depth of the laser pre-cut is 25 - 50% of the thickness of the high-silicon steel strip; b. Send the pre-cut high-silicon steel strip to the stamping platform through a conveyor belt for stamping operation. At the same time, the next segment of the high-silicon steel strip is undergoing laser pre-cutting, and the cutting machine and the stamping machine work in synchronous coordination; c. During the stamping operation, the radius of the stamping die is smaller than the radius of the laser cutting, reducing the contact stress between the die and the high-silicon steel strip during stamping. In step a, according to different thicknesses t mm of the high-silicon steel strip and silicon content mass fraction s wt%, different laser pre-cutting thicknesses h mm are set, and the piecewise function among the three is as follows: 。 2. The laser-assisted stamping method for high-silicon steel sheets according to claim 1, characterized in that: In step b, in order to make the cutting machine and the stamping machine work in synchronous coordination, the relationship between the set laser cutting time T1, the time T2 for stamping one piece, and the number N of laser cuttings is as follows: Laser cutting path length: ; where, the outer radius of the motor stator mm, the inner radius of the stator mm, the number of slots , the slot opening width mm, the total length of the inner wall of the slot mm; Laser cutting time: ; wherein, the laser cutting speed mm / s; Stamping piece 1 piece Time: ; Laser cutting quantity: , where is the time when the machine tool waits for the next high-silicon steel strip to move to the specified position after punching 1 piece.

3. A laser-assisted stamping method for high-silicon steel sheets according to claim 1, characterized in that: In step c, set the radius of the stamping die , where the laser cutting radius is mm, and the laser scoring width is mm.

4. A processing device for implementing the laser-assisted stamping processing method for high-silicon steel sheets as described in claim 1, characterized in that: The processing device includes a coil feeding rack, a shearing machine, a cutting platform, and a stamping platform. The shearing machine is connected to the cutting platform, and the cutting platform is connected to the stamping platform through conveyor belts; At least 2 cutting machines are arranged in parallel on the cutting platform, and a stamping machine is provided on one side of the stamping platform to cooperate with it.

5. The processing device according to claim 4, wherein: A roller drive mechanism is provided on the stamping platform. The stamping machine is provided with a stamping head, and a stamping die is provided below the stamping head. The stamping die is connected to the stamping head through a slider assembly; A first flywheel and a second flywheel are respectively provided on both sides of the stamping head, and a set of air cylinders for controlling the slider assembly is provided above the stamping head.

6. The processing device according to claim 4, characterized in that: The cutting platform includes a machine tool bed body and machine tool support feet provided below the machine tool bed body. A drive mechanism is provided on the machine tool bed body; Each cutting machine is provided with two cutting heads arranged in parallel, and the cutting heads perform laser pre-cutting on the high-silicon steel strip placed on the machine tool bed body along the Z-axis direction under the control of the cutting machine.

7. The processing device according to claim 4, characterized in that: A protruding rotating shaft is provided on one side of the coil feeding rack, and the coiled high-silicon steel strip is sleeved on the rotating shaft; A material inlet is provided on one side of the shearing machine, and a material sorting rack is provided at the material inlet. One end of the high-silicon steel strip is placed into the material inlet after passing through the material sorting rack.

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