A printed circuit board forming process

Abstract

The present invention relates to the technical field of printed circuit board production, and particularly to a printed circuit board forming process. This circuit board forming process uses a printed circuit board forming device, which includes a slitting table, a slitting machine, a limiting partition, a suction cup rod, a power component, a first carrier plate, and a second carrier plate; a slitting machine for cutting the circuit board is movably connected to the slitting table; a limiting partition for blocking debris is fixedly connected to the slitting table; several suction cup rods for supporting and fixing the entire circuit board are slidably connected to the limiting partition; a power component is arranged on the slitting table; several first carrier plates for supporting the suction cup rods are connected to the power component; several second carrier plates are connected to the power component; each first carrier plate is attached to the upper side of the second carrier plate; based on looking from top to bottom, all the first carrier plates and all the second carrier plates are arranged in a horizontal and vertical staggered state.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board production, and in particular to a printed circuit board forming process. Background Art

[0002] The printed circuit board slitting and forming process refers to the process of cutting a large-sized whole printed circuit board into multiple small-sized single printed circuit boards for subsequent assembly, testing, and use. When the whole printed circuit board is slit currently, a numerical control machine tool is generally used to perform cutting and forming processing on the whole printed circuit board.

[0003] When a numerical control machine tool is used to perform cutting and forming processing on the whole printed circuit board, since the fixed base of the existing numerical control machine tool is a flat plate, after the whole printed circuit board is fixed, the lower side of the whole printed circuit board fits with the fixed base. During the process of cutting the printed circuit board, in order to prevent the fixed base from being damaged by the cutting, the cutting tool will not completely cut through the printed circuit board. After the whole printed circuit board is cut into multiple single printed circuit boards, a separate step is still required to separate the separated single printed circuit boards from each other, which affects the overall production efficiency.

[0004] Furthermore, when slitting the whole printed circuit board, debris is easily sputtered into the reserved holes on the printed circuit board for subsequent installation of electrical components, resulting in the reserved holes being blocked by the debris, which affects the subsequent installation of electrical components. Summary of the Invention

[0005] In order to overcome the disadvantages that the existing numerical control machine tool does not completely cut through the printed circuit board during the cutting process, resulting in the need for subsequent separation of the printed circuit board, which affects the overall production efficiency, and at the same time, the cut debris splashes into the reserved holes, affecting the subsequent installation of electrical components, the present invention provides a printed circuit board forming process.

[0006] The technical implementation solution of the present invention is as follows: A printed circuit board forming process, characterized by including the following steps:

[0007] Step 1: Clamp the whole printed circuit board by setting a fixing unit on the forming device. In the fixing unit, a plurality of alternately arranged peeling units are matrixed to support and fix the whole printed circuit board;

[0008] Step 2: Each time a single printed circuit board is cut and separated, the corresponding peeling unit timely peels off the single printed circuit board, and the cut and separated single printed circuit board is timely peeled off by the peeling unit;

[0009] Step 3: Set a convenient blanking unit on the forming device to carry the cut and separated single printed circuit boards, so as to realize the rapid collection and blanking of the cut single printed circuit boards.

[0010] The forming equipment described in the first step of the forming process. The forming equipment includes a slitting table, a slitter, and a suction device; a slitter for cutting a circuit board is movably connected to the slitting table; a cutting knife is provided on the slitter; a suction device for sucking cutting debris is arranged outside the cutting knife of the slitter; it also includes a limiting partition board, a suction cup rod, a power component, a first bearing plate, and a second bearing plate; a limiting partition board for blocking debris is fixedly connected to the slitting table; several suction cup rods for supporting and fixing the entire circuit board are slidably connected to the limiting partition board; all the suction cup rods are connected to an external air pump; a power component is arranged on the slitting table; several first bearing plates for supporting the suction cup rods are connected to the power component; each suction cup rod is located above the corresponding first bearing plate; the long side of one side of each first bearing plate is set as an inclined surface; several second bearing plates are connected to the power component; the long side of one side of each second bearing plate is set as an inclined surface; each first bearing plate is attached to the upper side of the second bearing plate; based on looking from top to bottom, all the first bearing plates and all the second bearing plates are set in a horizontal and vertical staggered state.

[0011] As a further preferred solution, it also includes ball bearings; a ball bearing for reducing the vibration of the suction cup rod is rotatably connected to the lower side of each suction cup rod.

[0012] As a further preferred solution, a first limiting groove for enhancing the stability of the suction cup rod is formed on each first bearing plate; each ball bearing rolls in the corresponding first limiting groove; a second limiting groove is formed on each second bearing plate.

[0013] As a further preferred solution, each first limiting groove is set in an inclined state with the left side higher than the right side; each second limiting groove is set in an inclined state with the rear side higher than the front side.

[0014] As a further preferred solution, it also includes a baffle; a baffle for enhancing the stability of the circuit board is fixedly connected to each suction cup rod; each baffle is attached to the lower side of the circuit board; a blocking layer for blocking debris is arranged on each baffle.

[0015] As a further preferred solution, the blocking layer is made of a breathable material.

[0016] As a further preferred solution, it also includes a carrying frame; a carrying frame for convenient blanking is connected to the slitting table; several avoidance grooves for avoiding the baffle are formed on the carrying frame.

[0017] As a further preferred solution, several convex strips for limiting the single circuit board are arranged inside the carrying frame.

[0018] As a further preferred solution, it also includes a corrugated pipe; a corrugated pipe for blocking debris is fixedly connected to the upper side of the limiting partition board; each corrugated pipe is located outside the corresponding suction cup rod; the upper side of each corrugated pipe is fixedly connected to the upper end of the suction cup rod.

[0019] The beneficial effects are as follows: The present invention realizes the lowering of the cut circuit single board through the first carrier plate and the second carrier plate, enabling the separation of the circuit single boards immediately after cutting, eliminating the need for subsequent peeling work between the circuit single boards, and improving the overall production efficiency of the circuit board;

[0020] The limit partition plate blocks the debris that falls to the lower side of the circuit board, preventing the debris from falling onto the first carrier plate and the second carrier plate and avoiding affecting the separation work of the circuit single boards;

[0021] The blocking layer intercepts the debris carried in the air flow, preventing the debris carried in the air flow from flowing through the reserved holes from the lower side of the circuit single board, avoiding the blockage of the reserved holes by the debris, and ensuring the normal progress of the subsequent assembly work of the circuit board and electrical components;

[0022] The carrier frame carries the circuit single boards, realizing the rapid collection of the cut circuit single boards and further improving the production efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional structural schematic diagram of the printed circuit board forming process of the present invention;

[0024] Figure 2 It is a three-dimensional combined structural schematic diagram of the slitting table, power assembly, limit partition plate and carrier frame of the present invention;

[0025] Figure 3 It is a three-dimensional combined structural schematic diagram of the power assembly, first carrier plate, second carrier plate, limit partition plate, suction cup rod and bellows of the present invention;

[0026] Figure 4 It is a three-dimensional combined structural schematic diagram of the first carrier plate, second carrier plate, suction cup rod, baffle and bellows of the present invention;

[0027] Figure 5 It is a side view of the combination of the first carrier plate, second carrier plate, limit partition plate, suction cup rod, ball and bellows of the present invention;

[0028] Figure 6 It is a three-dimensional structural schematic diagram of the carrier frame of the present invention;

[0029] Figure 7 It is a sectional view of the carrier frame of the present invention.

[0030] Names of the reference numerals in the figure: 1 - slitting table, 2 - slitter, 3 - suction device, 4 - first bearing plate, 4001 - first limiting groove, 5 - second bearing plate, 5001 - second limiting groove, 101 - first slide rail, 102 - first electric slider, 103 - second slide rail, 104 - second electric slider, 201 - limiting partition, 202 - suction cup rod, 203 - ball, 204 - baffle plate, 20401 - blocking layer, 301 - bearing frame, 30101 - avoidance groove, 30102 - rib, 401 - bellows. Detailed implementation manners

[0031] The preferred technical solutions of the present invention will be described in detail below with reference to the accompanying drawings.

[0032] Embodiment 1

[0033] A printed circuit board forming process, characterized in that it includes the following steps:

[0034] Step 1: Clamp the whole circuit board by setting a fixing unit on the forming device. In the fixing unit, a plurality of alternately arranged peeling units are matrix - arranged for supporting and fixing the whole circuit board;

[0035] Step 2: Every time a circuit single board is cut and separated, the corresponding peeling unit timely peels off the circuit single board. By timely peeling off the cut - separated circuit single board through the peeling unit, the overall production efficiency of the circuit board is improved;

[0036] Step 3: By setting a convenient blanking unit on the forming device, carry the cut - separated circuit single board to realize the rapid collection and blanking of the cut - completed circuit single board.

[0037] A printed circuit board forming process, as Figures 1-7 shown, the forming device described in step 1 of the forming process. The forming device includes a slitting table 1, a slitter 2 and a suction device 3; the slitter 2 is movably connected to the slitting table 1; a cutting knife is provided on the slitter 2; a suction device 3 for sucking cutting debris is provided outside the cutting knife of the slitter 2;

[0038] It further includes a limit partition plate 201, a suction cup rod 202, a power assembly, a first carrier plate 4 and a second carrier plate 5; a limit partition plate 201 is fixedly connected to the slitting table 1; a plurality of suction cup rods 202 arranged in a rectangular array are slidably connected to the limit partition plate 201; all the suction cup rods 202 are connected to an external air pump; a power assembly is arranged on the slitting table 1; a plurality of first carrier plates 4 are connected to the power assembly; each suction cup rod 202 is located above the corresponding first carrier plate 4; one long side of each first carrier plate 4 is set as an inclined surface; a plurality of second carrier plates 5 are connected to the power assembly; one long side of each second carrier plate 5 is set as an inclined surface; each first carrier plate 4 is attached to the upper side of the second carrier plate 5; based on looking from top to bottom, all the first carrier plates 4 and all the second carrier plates 5 are set in a horizontal and vertical staggered state.

[0039] The power assembly includes a first slide rail 101, an electric slider 102, a second slide rail 103 and an electric slider 104; two first slide rails 101 which are symmetrically arranged front and back are fixedly connected to the slitting table 1; a plurality of electric sliders 102 are slidably connected to each first slide rail 101; every two front and back opposite electric sliders 102 are jointly fixedly connected to a first carrier plate 4; two second slide rails 103 which are symmetrically arranged left and right are fixedly connected to the slitting table 1; a plurality of electric sliders 104 are slidably connected to each second slide rail 103; every two left and right opposite electric sliders 104 are jointly fixedly connected to a second carrier plate 5.

[0040] It further includes a ball 203; a ball 203 is rotatably connected to the lower side of each suction cup rod 202.

[0041] A first limit groove 4001 is formed on each first carrier plate 4; each ball 203 rolls in the corresponding first limit groove 4001; a second limit groove 5001 is formed on each second carrier plate 5.

[0042] Each first limit groove 4001 is set in an inclined state with the left side higher than the right side; each second limit groove 5001 is set in an inclined state with the back side higher than the front side, which is beneficial to reducing the falling height difference when the suction cup rod 202 separates from the first carrier plate 4 and the second carrier plate 5, reducing the vibration of the suction cup rod 202 after separation and falling, enhancing the fixing effect of the suction cup rod 202 on the circuit board, and facilitating the subsequent shoveling of the suction cup rod 202 by the first carrier plate 4 and the second carrier plate 5 for resetting.

[0043] It further includes a baffle 204; a baffle 204 is fixedly connected to each suction cup rod 202; each baffle 204 is attached to the lower side of the circuit board; a blocking layer 20401 is arranged on each baffle 204.

[0044] The barrier layer 20401 is made of a breathable material, which allows the suction airflow to pass through the barrier layer 20401 to blow out the debris in the reserved holes on the circuit board, thereby preventing the debris from clogging the reserved holes on the circuit board and avoiding affecting the subsequent circuit board assembly.

[0045] It also includes a carrying frame 301 ; the carrying frame 301 is detachably connected to the slitting table 1 ; and a plurality of avoidance grooves 30101 are provided on the carrying frame 301 .

[0046] A plurality of convex strips 30102 are arranged in the carrying frame 301 .

[0047] When the whole circuit board is being formed, the staff first places the carrying frame 301 on the slitting table 1, so that the bottom of the carrying frame 301 is in contact with the upper side of the limiting partition 201, and then the staff places the whole circuit board to be cut on the upper side of all the suction cup rods 202, and each circuit single board is in contact with the upper side of a suction cup rod 202, and then controls the external air pump to suck and fix the whole circuit board through the suction cup rod 202. After the whole circuit board is fixed, the slitting machine 2 is controlled to move from back to front on the slitting table 1, so that the cutter on the slitting machine 2 cuts the whole circuit board from back to front. During the cutting process, the suction device 3 is controlled to absorb and collect the debris cut from the circuit board. At the same time, the limiting partition 201 is used to block the debris falling to the lower side of the circuit board to prevent the debris from falling onto the carrying plate 1 4 and the carrying plate 2 5, so as to avoid affecting the subsequent separation of the circuit single board;

[0048] After the slitting machine 2 cuts the left side of the whole circuit board into a long circuit board composed of several single circuit boards, the electric slider 102 is controlled to drive the carrier plate 4 to move to the left on the slide rail 101, and the support of the carrier plate 4 on the left suction cup rod 202 is released, so that the left suction cup rod 202 drops on the limiting partition 201 under the action of gravity, thereby driving the cut long circuit board to drop and separate from the whole circuit board, and the left suction cup rod 202 is received by the carrier plate 25, and then the slitting machine 2 is controlled to drive the suction device 3 to move from front to back between the long circuit board and the whole circuit board. In this process, since the interval between the long circuit board and the whole circuit board increases after it drops and separates, it is convenient for airflow and debris to pass through, and the suction device 3 is sucked. When the device 3 passes by, it is beneficial to suck and collect the debris that falls on the limiting partition 201, reduce the residual debris accumulated on the lower side of the circuit board, and help to reduce the subsequent cleaning work of the equipment. When the slitting machine 2 drives the suction device 3 to move backward and reset to the rear side of the entire circuit board, the slitting machine 2 is controlled to drive the suction device 3 to move to the right, ready to cut the entire circuit board from back to front again. After each long circuit board is cut out, the electric slider 102 drives the carrier plate 4 to slide to the left on the slide rail 101, so that the suction cup rod 202 drives the cut long circuit board to descend and separate from the entire circuit board under the action of gravity, and the suction cup rod 202 is received by the carrier plate 2 5, which is convenient for the suction device 3 to suck and collect the debris.

[0049] When the whole circuit board is cut into several long strip circuit boards by the cutting machine 2 from the back to the front, control the cutting machine 2 to move to the front left side of all the long strip circuit boards, and then control the cutting machine 2 to move from left to right on the cutting table 1, so that the cutting knife on the cutting machine 2 cuts the long strip circuit boards into several circuit single boards from left to right. During the cutting process, control the suction device 3 to suck and collect the cut debris. When the cutting machine 2 cuts the long strip circuit boards into several circuit single boards, at this time, control the electric slider two 104 to drive the bearing plate two 5 to move backward on the slide rail two 103, release the bearing of the bearing plate two 5 on the sucker rod 202, so that the sucker rod 202 descends again on the limit partition 201, thereby driving the circuit single board to descend and separate from the long strip circuit board. Then control the cutting machine 2 to drive the suction device 3 to move from right to left between the circuit single board and the long strip circuit board. During this process, since the interval between the circuit single board and the long strip circuit board increases after the circuit single board descends and separates, it is beneficial for the air flow and debris to pass through, which is convenient for the suction device 3 to suck and collect the debris falling on the limit partition 201 during the movement, which is beneficial to reducing the subsequent cleaning work of the equipment. At the same time, in the present invention, the cut circuit single boards are lowered through the bearing plate one 4 and the bearing plate two 5, so that the circuit single boards are separated immediately after the cutting is completed, and there is no need to perform subsequent peeling work between the circuit single boards, thus improving the overall production efficiency of the circuit board.

[0050] It is also considered that since reserved holes for subsequent installation of electrical components are provided on each circuit single board, when the suction device 3 sucks the debris on the lower side of the circuit board, part of the air flow carries the debris and flows through the reserved holes from the lower side of the circuit single board, and there is a situation where the reserved holes are blocked by the debris, which affects the subsequent assembly work of the circuit board and electrical components. The specific solution process is as follows:

[0051] When the cutting machine 2 cuts the whole circuit board, by making the baffle 204 fit against the lower side of the circuit single board, it is beneficial to enhance the fixing effect on the circuit single board, prevent the circuit single board from tilting and shifting on the sucker rod 202, and improve the stability of the circuit single board during the cutting process. When the suction device 3 sucks the debris on the lower side of the circuit board, the blocking layer 20401 made of breathable material is used to intercept the debris carried in the air flow, prevent the debris carried in the air flow from flowing through the reserved holes from the lower side of the circuit single board, and avoid the reserved holes being blocked by the debris. At the same time, the air flow passes through the blocking layer 20401 and blows out upward through the reserved holes after flowing through the reserved holes, preventing the debris sputtered on the upper side of the circuit single board from falling into the reserved holes, avoiding the reserved holes being blocked by the debris, and ensuring the normal progress of the subsequent assembly work of the circuit board and electrical components.

[0052] When the carrier plate 1-4 and the carrier plate 2-5 move and separate from the suction cup rod 202, the ball 203 reduces the friction between the carrier plate 1-4 and the carrier plate 2-5 and the lower side of the suction cup rod 202 during movement, reducing the jerks caused by hard friction between the suction cup rod 202 and the carrier plate 1-4 and the carrier plate 2-5 during the moving separation process, which is beneficial to reducing the impact on the circuit board cutting. At the same time, by setting the limiting groove 1-4001 in a left-high and right-low inclined state and the limiting groove 2-5001 in a rear-high and front-low inclined state to limit the ball 203, and then limiting the suction cup rod 202, the stability effect of the carrier plate 1-4 and the carrier plate 2-5 on the suction cup rod 202 during movement is improved. At the same time, it is beneficial to reduce the falling height difference when the suction cup rod 202 separates from the carrier plate 1-4 and the carrier plate 2-5, reduce the vibration of the suction cup rod 202 after separating and falling on the carrier plate 1-4 and the carrier plate 2-5, enhance the fixing effect of the suction cup rod 202 on the circuit board, and further reduce the impact on the circuit board cutting.

[0053] After the whole circuit board is cut into circuit single boards, the slitter 2 is controlled to drive the suction device 3 to move to the rear of the cutting table 1, and the external air pump is stopped, and the circuit single boards are sucked and fixed by the suction cup rod 202. Subsequently, the operator lifts the carrier frame 301 from the cutting table 1, so that the avoidance groove 30101 passes through the baffle 204 to carry the circuit single boards, realizing the rapid collection of the cut circuit single boards, further improving the production efficiency of the circuit board. When using the carrier frame 301 to transfer the circuit single boards, each circuit single board is separated by the convex strip 30102, preventing the circuit single boards from stacking and rubbing against each other during transportation, preventing the circuit single boards from being worn, and improving the quality of the produced circuit boards. When the circuit single board is removed from the suction cup rod 202, the electric slider 2-104 is controlled to drive the carrier plate 2-5 to slide forward, and the inclined surface on the front side of the carrier plate 2-5 is used to shovel up the suction cup rod 202. Subsequently, the electric slider 1-102 is controlled to drive the carrier plate 1-4 to move to the right, and the inclined surface on the right side of the carrier plate 1-4 is used to shovel up the suction cup rod 202 from the carrier plate 2-5 for resetting. During this process, by setting the limiting groove 1-4001 in a left-high and right-low inclined state and the limiting groove 2-5001 in a rear-high and front-low inclined state, the ball 203 rolls more smoothly on the carrier plate 1-4 and the carrier plate 2-5, facilitating the carrier plate 1-4 and the carrier plate 2-5 to shovel up the suction cup rod 202 for resetting and preparing for the next circuit board cutting work.

[0054] Embodiment 2

[0055] On the basis of Embodiment 1, as Figures 3-5 shown, it further includes a bellows 401; the bellows 401 is fixedly connected to the upper side of the limiting partition 201; each bellows 401 is located outside the corresponding suction cup rod 202; the upper side of each bellows 401 is fixedly connected to the upper end of the suction cup rod 202.

[0056] When the slitter 2 cuts the whole circuit board, the outer side of the sucker rod 202 is masked by the corrugated pipe 401 to prevent debris from adhering to the outer side of the sucker rod 202, avoiding the sucker rod 202 from being stuck by the debris adhering to the outer side of the sucker rod 202 when the sucker rod 202 descends on the limit partition plate 201, and further avoiding the sucker rod 202 from being unable to drive the circuit single board to separate from the whole circuit board, thus ensuring the normal progress of the separation work between the circuit boards.

[0057] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A printed circuit board forming process, characterized in that, It includes the following steps: Step 1: Clamp the entire circuit board by setting a fixing unit on the forming device. In the fixing unit, a plurality of alternately arranged peeling units are matrix - arranged for supporting and fixing the entire circuit board; Step 2: Every time a single circuit board is cut and separated, the corresponding peeling unit promptly peels off the single circuit board, and the cut - separated single circuit board is promptly peeled off by the peeling unit; Step 3: By setting a convenient blanking unit on the forming device, the cut - separated single circuit boards are carried, realizing the rapid collection and blanking of the cut - completed single circuit boards; The forming device includes a slitting table (1), a slitter (2) and a suction device (3); a slitter (2) for cutting the circuit board is movably connected to the slitting table (1); a cutting knife is arranged on the slitter (2); a suction device (3) for sucking cutting debris is arranged outside the cutting knife of the slitter (2); it is characterized in that it further includes a limiting partition (201), a suction cup rod (202), a power assembly, a first bearing plate (4) and a second bearing plate (5); a limiting partition (201) for blocking debris is fixedly connected to the slitting table (1); a plurality of suction cup rods (202) for supporting and fixing the entire circuit board are slidably connected to the limiting partition (201); all suction cup rods (202) are connected to an external air pump; a power assembly is arranged on the slitting table (1); a plurality of first bearing plates (4) for supporting the suction cup rods (202) are connected to the power assembly; each suction cup rod (202) is located above the corresponding first bearing plate (4); the long side of one side of each first bearing plate (4) is set as an inclined surface; a plurality of second bearing plates (5) are connected to the power assembly; the long side of one side of each second bearing plate (5) is set as an inclined surface; each first bearing plate (4) is attached to the upper side of the second bearing plate (5); based on looking down from top to bottom, all first bearing plates (4) and all second bearing plates (5) are set in a horizontal and vertical staggered state.

2. A printed circuit board forming process according to claim 1, characterized in that, It further includes balls (203); a ball (203) for reducing the vibration of the suction cup rod (202) is rotatably connected to the lower side of each suction cup rod (202).

3. A printed circuit board forming process according to claim 1, characterized in that, A first limiting groove (4001) for enhancing the stability of the suction cup rod (202) is opened on each first bearing plate (4); each ball (203) rolls in the corresponding first limiting groove (4001); a second limiting groove (5001) is opened on each second bearing plate (5).

4. A printed circuit board forming process according to claim 2, characterized in that, Each first limiting groove (4001) is set in an inclined state with the left side higher than the right side; each second limiting groove (5001) is set in an inclined state with the rear side higher than the front side.

5. A printed circuit board forming process according to claim 3, characterized in that, It further includes a baffle (204); a baffle (204) for enhancing the stability of the circuit board is fixedly connected to each suction cup rod (202); each baffle (204) is attached to the lower side of the circuit board; a blocking layer (20401) for blocking debris is arranged on each baffle (204).

6. A printed circuit board forming process according to claim 4, characterized in that, The blocking layer (20401) is made of a breathable material.

7. A printed circuit board forming process according to claim 5, characterized in that, It further includes a carrying frame (301); a carrying frame (301) for convenient blanking is connected to the slitting table (1); a plurality of avoidance grooves (30101) for avoiding the baffle plate (204) are formed in the carrying frame (301).

8. A printed circuit board forming process according to claim 6, characterized in that, A plurality of convex strips (30102) for limiting the circuit single board are arranged in the carrying frame (301).

9. A printed circuit board forming process according to claim 7, characterized in that, It further includes a corrugated pipe (401); a corrugated pipe (401) for blocking debris is fixedly connected to the upper side of the limit partition plate (201); each corrugated pipe (401) is located outside the corresponding suction cup rod (202); the upper side of each corrugated pipe (401) is fixedly connected to the upper end of the suction cup rod (202).

Images