Transmission control method, device and transmission control system of thin film deposition equipment

Abstract

The invention relates to a transmission control method and device of thin film deposition equipment, a transmission control system, a computer readable storage medium and a computer program product. The method comprises the following steps: acquiring distribution information of a plurality of support plates carrying substrates in thin film deposition equipment, wherein the distribution information comprises identification information of material cavities where the support plates are located; according to the distribution information, a corresponding opening instruction is obtained, the opening instruction is used for indicating that a target gate valve in the multiple gate valves is opened at the same time, and the target gate valve is determined according to the combination of the identification information; state information of the material cavity is obtained; and in response to the condition that the state information of the multiple material cavities meets the corresponding opening condition, the opening instruction is executed, the multiple material cavities are controlled to convey the carrier plate, and the opening condition is associated with the cavity types of the material cavities. By adopting the method, the film deposition efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the field of vacuum thin film deposition technology, and in particular to a transmission control method, device, transmission control system, readable storage medium and program product for thin film deposition equipment. Background Art

[0002] In the field of vacuum thin film deposition technology, a multi-cavity linear arrangement is usually used to form a film layer on the surface of a silicon wafer. The transmission process of the multi-cavity linear arrangement involves the following steps: loading the silicon wafer to be processed onto the carrier of the thin film deposition equipment; sending the carrier into the process chamber through a transmission device (for example, a conveyor belt); the carrier remains stationary in the process chamber, and a thin film is deposited on the surface of the silicon wafer using chemical vapor deposition, physical vapor deposition and other technologies; when the thin film deposition process is completed, the transmission device sends the carrier out of the process chamber.

[0003] However, in the conveying process of the vacuum thin film deposition device, the conveying time of the carrier is relatively long. Therefore, there is an urgent need for a conveying control method of the thin film deposition device that can improve the thin film deposition efficiency. Summary of the invention

[0004] Based on this, it is necessary to provide a conveying control method, device and conveying control system, computer-readable storage medium and computer program product for a thin film deposition device that can improve the thin film deposition efficiency in order to address the above technical problems.

[0005] In a first aspect, the present application provides a conveying control method for a thin film deposition device, wherein the thin film deposition device comprises a plurality of chambers and a plurality of gate valves spaced apart from the plurality of chambers, the method comprising:

[0006] Obtaining distribution information of a plurality of carriers carrying substrates in the thin film deposition device, wherein the distribution information includes identification information of a cavity containing a material where the carriers are located;

[0007] According to the distribution information, a corresponding opening instruction is acquired, where the opening instruction is used to instruct to simultaneously open a target gate valve among the multiple gate valves, where the target gate valve is determined according to a combination of the identification information;

[0008] Obtaining status information of the cavity containing material;

[0009] In response to the state information of the plurality of cavities with material satisfying the corresponding opening conditions, the opening instruction is executed and the plurality of cavities with material are controlled to transfer the carrier plates, and the opening conditions are associated with the cavity types of the cavities with material.

[0010] In one embodiment, the multiple cavities include a first cavity, a second cavity, and a third cavity arranged in sequence in a preset transmission direction, the multiple gate valves include a first gate valve located at an inlet side of the first cavity, a second gate valve located between the first cavity and the second cavity, a third gate valve located between the second cavity and the third cavity, and a fourth gate valve located at an outlet side of the third cavity, and before obtaining a corresponding opening instruction according to the distribution information, the method includes:

[0011] In a case where the distribution information includes identification information of the first cavity and identification information of the second cavity, determining that the opening instruction corresponding to the distribution information includes identification information of the second gate valve and identification information of the third gate valve;

[0012] In the case that the distribution information includes the identification information of the second cavity and the identification information of the third cavity, it is determined that the opening instruction corresponding to the distribution information includes the identification information of the third gate valve and the identification information of the fourth gate valve.

[0013] In one embodiment, the state information includes current instruction information, intracavity environment information and functional state information, and after obtaining the state information of the cavity with material, the following steps are included:

[0014] According to the current instruction information, the intra-cavity environment information and the functional status information, a judgment result of the opening condition corresponding to the cavity with material is determined.

[0015] In one embodiment, the intracavity environment information includes air pressure, and the determination result of the opening condition corresponding to the material cavity according to the current instruction information, the intracavity environment information and the functional state information includes:

[0016] Acquiring the air pressure of a transfer cavity, wherein the transfer cavity is the next cavity of the cavity with material in a direction close to an adjacent target gate valve;

[0017] When the difference between the air pressure of the material cavity and the air pressure of the transmission cavity is greater than or equal to a preset threshold, the corresponding vacuum device is started until the difference is less than the preset threshold;

[0018] When the difference is smaller than the preset threshold, the judgment result of the opening condition corresponding to the material cavity is determined according to the current instruction information and the functional status information.

[0019] In one embodiment, the cavity with material is used to execute a process recipe, and the judgment result of determining the opening condition corresponding to the cavity with material according to the current instruction information, the cavity environment information and the functional state information includes:

[0020] When it is determined according to the identification information of the cavity with material that the cavity with material has a carrier lifting function, and the carrier in the cavity with material is not located at a preset initial height position, a lifting and lowering instruction for the cavity with material is executed until the carrier in the cavity with material is located at the preset initial height position;

[0021] When it is determined according to the identification information of the cavity with material that the cavity with material does not have the function of lifting the carrier plate, or when it is determined according to the identification information of the cavity with material that the cavity with material has the function of lifting the carrier plate, and the carrier plate in the cavity with material is located at a preset initial height position, the judgment result of the opening condition corresponding to the cavity with material is determined according to the current instruction information and the intra-cavity environment information.

[0022] In one embodiment, the determination result of the opening condition corresponding to the material cavity according to the current instruction information, the cavity environment information and the functional state information includes:

[0023] In the case where the current instruction information includes a stop instruction, in response to a release operation of the stop instruction, a judgment result of the opening condition corresponding to the cavity with material is determined according to the intra-cavity environment information and the functional status information.

[0024] In a second aspect, the present application further provides a conveying control device for a thin film deposition device, wherein the thin film deposition device comprises a plurality of cavities and a plurality of gate valves spaced apart from the plurality of cavities, and the device comprises:

[0025] A distribution information acquisition module, used to acquire distribution information of a plurality of carriers carrying substrates in the thin film deposition device, wherein the distribution information includes identification information of a cavity containing a material where the carrier is located;

[0026] an instruction acquisition module, used for acquiring a corresponding opening instruction according to the distribution information, wherein the opening instruction is used for instructing to simultaneously open a target gate valve among the plurality of gate valves, wherein the target gate valve is determined according to a combination of the identification information;

[0027] A status information acquisition module, used to acquire status information of the cavity with material;

[0028] The instruction execution module is used to execute the opening instruction and control the multiple cavities with material to transfer the carrier in response to the status information of the multiple cavities with material satisfying the corresponding opening conditions, and the opening conditions are associated with the cavity type of the cavity with material.

[0029] In a third aspect, the present application further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of any of the above-described methods when executing the computer program.

[0030] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program implements the steps of any of the methods described above when executed by a processor.

[0031] In a fifth aspect, the present application also provides a computer program product, including a computer program, which implements the steps of any of the methods described above when executed by a processor.

[0032] The above-mentioned conveying control method, device, conveying control system, readable storage medium and program product of the thin film deposition equipment can adapt to different production requirements and process flows by detecting the positions of multiple carriers in real time, and dynamically adjusting the operation strategy of the gate valve according to the distribution of the carriers in multiple cavities, thereby enhancing the flexibility of the thin film deposition equipment; by real-time detection of the status of multiple cavities, it is ensured that the gate valve is opened and conveyed after the status of each cavity meets the opening conditions, thereby realizing precise control of the transmission process, shortening the cycle time of the thin film deposition equipment, and reducing the idle time of the cavity, thereby optimizing the production process and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 A schematic flow chart of a method for controlling the transport of a thin film deposition device in one embodiment;

[0035] Figure 2 A schematic diagram of a chamber structure of a thin film deposition device in one embodiment;

[0036] Figure 3 A schematic flow chart of a conveying control method for a thin film deposition device in another embodiment;

[0037] Figure 4 A schematic flow chart of a conveying control method for a thin film deposition device in yet another embodiment;

[0038] Figure 5 is a flow chart of step S1071 in one embodiment;

[0039] Figure 6 is a flow chart of step S1071 in another embodiment;

[0040] Figure 7 This is a flow chart of step S1071 in another embodiment;

[0041] Figure 8 This is a flow chart of step S1071 in yet another embodiment;

[0042] Fig. 9 is a structural block diagram of a conveying control device of a thin film deposition device in one embodiment;

[0043] Fig.10 is an internal structure diagram of a computer device in one embodiment;

[0044] Fig.11 The figure is a data flow diagram of a transmission control system in one embodiment. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0046] In the related art, a multi-cavity linear arrangement is used to form a film layer on the surface of the silicon wafer. The carrier remains stationary during the thin film deposition process, resulting in uneven film deposition on the surface of the silicon wafer, and the carrier's transmission speed is slow, resulting in a long film deposition cycle. Alternatively, in the related art, plasma enhanced chemical vapor deposition (PECVD) technology is used for single-cavity dynamic thin film deposition. During the thin film deposition process, the plasma equipment is kept running continuously, and the carrier moves in the cavity at a certain speed. However, in this process, the sensor that determines the state of the carrier entering and exiting the cavity is easily affected by environmental factors, stray signals, etc., resulting in a long time spent on deposition in the same cavity; different gases are used during thin film deposition, and different processes are performed, resulting in a long time spent on switching between different processes; the cycle time is long, affecting production efficiency. Based on the current industry demand for improving the production efficiency of thin film deposition, the present disclosure provides a method for controlling the transmission of thin film deposition equipment.

[0047] In one embodiment, Figure 1 As shown, a transmission control method is provided. This embodiment uses the method applied to a control system as an example. The controller may be, but is not limited to, a programmable logic controller (PLC) system. In this embodiment, the method includes the following steps:

[0048] Step S102, obtaining distribution information of a plurality of carriers carrying substrates in a thin film deposition device, wherein the distribution information includes identification information of a cavity containing material where the carriers are located.

[0049] The distribution information can be used to determine the position of the carrier, and the position of the carrier can include the cavity where the carrier is located and the specific position of the carrier in the cavity. For example, during the movement of the carrier in multiple cavities of the thin film deposition equipment, the position detection device continuously detects the position of the carrier and feeds back to the control system in real time. In the actual production process, there is a situation where there is no material in the cavity.

[0050] Step S104, obtaining a corresponding opening instruction according to the distribution information, the opening instruction is used to instruct to simultaneously open a target gate valve among the multiple gate valves, and the target gate valve is determined according to a combination of identification information.

[0051] Exemplarily, the control system can determine whether there is a carrier in each cavity at the current moment according to the acquired distribution information, and then analyze the next action of the carrier through logical operations. For example, the first cavity (front cavity), the second cavity (current cavity) and the third cavity (rear cavity) arranged in sequence in the preset transmission direction may include: the front cavity has material, the current cavity has material, and the rear cavity has material; the front cavity has material, the current cavity has material, and the rear cavity has no material; the front cavity has material, the current cavity has no material, and the rear cavity has no material; the front cavity has no material, the current cavity has material, and the rear cavity has material; the front cavity has no material, the current cavity has material, and the rear cavity has material; the front cavity has no material, the current cavity has no material, and the rear cavity has material; the front cavity has no material, the current cavity has no material, and the rear cavity has material; the front cavity has no material, the current cavity has material, and the rear cavity has material. It can be understood that the number of cavities included in the thin film deposition equipment can also be greater than three. At this time, the situation of whether there is a carrier in each cavity can be pre-integrated to establish a corresponding relationship with the opening instruction. Among them, the next action of the carrier may include: controlling the state of each cavity with material, opening the target gate valve, and transmitting the carrier to the specified position through the transmission device.

[0052] Optionally, the control system may also determine a corresponding start instruction based on the state of the carrier in the cavity (including: carrier request incoming, carrier incoming in place, carrier request out).

[0053] Step S106, obtaining status information of the cavity containing material.

[0054] The status information of the cavity with material may include but is not limited to: initialization status information, process recipe information, process execution status information, current instruction information, cavity environment information, functional status information, etc.

[0055] Step S108, in response to the state information of the plurality of cavities with material satisfying the corresponding opening conditions, executing the opening instruction and controlling the plurality of cavities with material to transfer the carriers, the opening conditions being associated with the cavity types of the cavities with material.

[0056] For example, the control system can coordinate the state of each cavity, and under the condition that the cavities related to the next action of the carrier plate meet the specific opening conditions, a synchronous dynamic transmission method is adopted to allow the carrier plate to be transferred into the cavity at the same time as the cavity is transferred into the carrier plate. The opening conditions can be flexibly adjusted according to production requirements. For example, the opening conditions may include the absence of specified state information, the presence of specified state information, or the specified state information falling within a preset range.

[0057] Optionally, after executing the start command, the control system can select different transmission modes according to different transmission modes, so that the carrier can reach the specified position quickly and accurately. Among them, the transmission mode may include: synchronous mode (multiple carriers are transmitted in linkage at the same time) and asynchronous mode (single carrier transmission). The transmission mode may include: speed mode, relative positioning mode and interrupt positioning mode.

[0058] Optionally, the control system can stop rotating and close the corresponding target valve in response to the carrier reaching the specified position. If the carrier does not reach the specified position, the host computer can automatically pop up a re-transmission alignment frame, and click the alignment frame button to restart the transmission device until the carrier reaches the specified position and closes the corresponding target valve.

[0059] In the transmission control method of the above-mentioned thin film deposition equipment, by real-time detection of the positions of multiple carriers, the operation strategy of the gate valve is dynamically adjusted according to the distribution of the carriers in multiple cavities, so that the thin film deposition equipment can adapt to different production needs and process flows, thereby enhancing the flexibility of the thin film deposition equipment; by real-time detection of the status of multiple cavities, it is ensured that the gate valve is opened and transmitted after the status of each cavity meets the opening conditions, thereby achieving precise control of the transmission process, shortening the cycle time of the thin film deposition equipment, and reducing the idle time of the cavity, thereby optimizing the production process and improving production efficiency.

[0060] In an exemplary embodiment, please refer to Figure 2, the multiple chambers may include a first chamber (front chamber) D1, a second chamber (main chamber) D2, and a third chamber (rear chamber) D3 arranged in sequence in a preset transmission direction, and the multiple gate valves include a first gate valve A1 located at the inlet side of the first chamber D1, a second gate valve A2 located between the first chamber D1 and the second chamber D2, a third gate valve A3 located between the second chamber D2 and the third chamber D3, and a fourth gate valve A4 located at the outlet side of the third chamber D3. Among them, A1, A2, A3, A4 can represent the front gate valve or the rear gate valve of the chamber, the rear gate valve of the previous chamber is also the front gate valve of the next chamber (for example, A2 is also the rear gate valve of D1 and the front gate valve of D2), and each chamber is separated by a gate valve; B1, B2, B3, B4, B5, B6 are transmission shafts used to perform the transmission of the carrier and realize the forward or reverse movement of the carrier; C1, C2, C3 are carriers used to carry silicon wafers. The chamber types of D1, D2, and D3 can be the same or different. For example, the chamber types of D1, D2, and D3 can be a loading chamber, a process chamber, and a process chamber, respectively. The chamber types of D1, D2, and D3 can also be any one of the following: an isolation chamber, a process chamber, a process chamber; a process chamber, a process chamber, an unloading chamber; a process chamber, a process chamber, a process chamber; a process chamber, a process chamber, and an isolation chamber.

[0061] In this case, if Figure 3 As shown, before the above step S104, the following may be included:

[0062] Step S1031: when the distribution information includes identification information of the first cavity and identification information of the second cavity, determining that the opening instruction corresponding to the distribution information includes identification information of the second gate valve and identification information of the third gate valve.

[0063] Exemplarily, the control system can first determine whether there is material in the front chamber D1. If it is determined that there is no material in the front chamber D1, then when the current chamber D2 transfers material, only the rear gate valve A3 is opened, and the front gate valve A2 is not opened. If it is determined that there is material in the front chamber D1, then when the current chamber D2 transfers the carrier plate, the front gate valve A2 is opened and transferred synchronously with the front chamber D1.

[0064] Step S1032: when the distribution information includes identification information of the second cavity and identification information of the third cavity, determine that the opening instruction corresponding to the distribution information includes identification information of the third gate valve and identification information of the fourth gate valve.

[0065] Exemplarily, the control system can determine whether there is material in the rear chamber D3 while the current chamber D2 is transferring material. If it is determined that there is material in the rear chamber D3, then when a discharge request is received from the rear chamber D3, the rear door valve A4 of the rear chamber D3 is opened to discharge the material together. If it is determined that there is no material in the rear chamber D3, a direct request is made to open the rear door valve A3 of the current chamber D2 to discharge the material.

[0066] In an exemplary embodiment, the state information of the cavity may include current instruction information, intracavity environment information and functional state information, such as Figure 4 As shown, after the above step S106, the following steps may be included:

[0067] Step S1071, determining the judgment result of the opening condition corresponding to the cavity with material according to the current instruction information, the cavity environment information and the functional status information.

[0068] Exemplarily, in the case where a material chamber is used to execute a process recipe, it can first respond to an initialization state (for example, the carrier is transferred into the process chamber and stops), execute the process recipe (for example, lifting the carrier to a predetermined position, temperature measurement mode, idle run mode, H2 treatment, etc.), and then perform a judgment on the start conditions.

[0069] In an exemplary embodiment, the intracavity environment information may include air pressure, such as Figure 5 As shown, step S1071 may include:

[0070] Step A1, obtaining the air pressure of the transfer chamber, where the transfer chamber is the next chamber of the chamber with material in the direction close to the adjacent target gate valve.

[0071] Step A2: when the difference between the air pressure of the material cavity and the air pressure of the transmission cavity is greater than or equal to a preset threshold, start the corresponding vacuum pumping device until the difference is less than the preset threshold.

[0072] Step A3, when the difference is less than a preset threshold, determine the judgment result of the opening condition corresponding to the material cavity according to the current instruction information and the functional status information.

[0073] For example, please refer to Figure 6 , Figure 6 Schematic diagram of the flow of step S1071 in an embodiment. For example, it can be determined whether the pressure difference between adjacent cavities is less than or equal to 30%. If so, jump to execute other determination steps; if not, execute the vacuuming logic (automatically turn on the vacuuming device connected between the cavity and the vacuum pump) until the pressure difference between adjacent cavities is less than 30%, and then re-determine.

[0074] In an exemplary embodiment, the material chamber may include a process chamber for executing a process recipe, and the process recipe may include: with jacking, without jacking, temperature measurement recipe, cleaning recipe, deposition recipe, H2 treatment recipe, etc. Figure 7 As shown, step S1071 may include:

[0075] Step B1, when it is determined based on the identification information of the material cavity that the material cavity has a carrier lifting function, and the carrier in the material cavity is not located at a preset initial height position, execute the lifting and lowering instructions for the material cavity until the carrier in the material cavity is located at a preset initial height position.

[0076] For example, in the process recipe of the i-chamber, there is no need to lift the carrier plate, while in the process recipe of the doping layer, it is necessary to lift the carrier plate to a predetermined position (the distance between the carrier plate and the cathode) to perform the deposition process.

[0077] Step B2, when it is determined according to the identification information of the material cavity that the material cavity does not have the carrier lifting function, or when it is determined according to the identification information of the material cavity that the material cavity has the carrier lifting function, and the carrier in the material cavity is located at a preset initial height position, determine the judgment result of the opening condition corresponding to the material cavity according to the current command information and the intra-cavity environment information.

[0078] For example, please refer to Figure 6 , it can be determined first whether the process chamber has the function of lifting the carrier plate. If not, jump to execute other judgment steps; if it has the function of lifting the carrier plate, determine whether the carrier plate is at the initial height position; if it is at the initial height position, jump to execute other judgment steps; if it is not at the initial height position, automatically execute the lifting and lowering instructions until the carrier plate is at the initial height position, and re-judge.

[0079] In an exemplary embodiment, Figure 8 As shown, step S1071 may also include:

[0080] Step C1, in the case where the current instruction information includes a stop instruction, in response to a release operation for the stop instruction, a judgment result of an opening condition corresponding to the cavity with material is determined according to the cavity environment information and the functional status information.

[0081] For example, please refer to Figure 6 , it can be determined first whether there is a stop command (for example, the command can be a manual instruction). If not, jump to execute other judgment steps; if so, wait for the manual release of the stop command and then re-judge.

[0082] Figure 6 Taking the judgment steps of whether the stop command is triggered during the transmission process, whether the air pressure between adjacent cavities is less than 30%, and whether it has the function of lifting and lowering as an example, it should be noted that the embodiment of the present application does not limit the order of execution of these judgment steps.

[0083] To summarize, the transmission control method of the above-mentioned thin film deposition equipment, by real-time detection of the positions of multiple carriers, dynamically adjusts the operation strategy of the gate valve according to the distribution of the carriers in multiple cavities, so that the thin film deposition equipment can adapt to different production needs and process flows, thereby enhancing the flexibility of the thin film deposition equipment; by real-time detection of the status of multiple cavities, ensuring that the gate valve is opened and transmitted after the status of each cavity meets the opening conditions, precise control of the transmission process is achieved, the cycle time of the thin film deposition equipment is shortened, and the idle time of the cavity is reduced, thereby optimizing the production process and improving production efficiency.

[0084] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0085] Based on the same inventive concept, the embodiment of the present application also provides a conveying control device for a thin film deposition device for implementing the conveying control method for the thin film deposition device involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in the embodiments of the conveying control device for one or more thin film deposition devices provided below can refer to the limitations of the conveying control method for the thin film deposition device above, and will not be repeated here.

[0086] In an exemplary embodiment, Fig. 9 As shown, a conveying control device 200 of a thin film deposition device is provided, comprising: a distribution information acquisition module 201, an instruction acquisition module 202, a state information acquisition module 203 and an instruction execution module 204, wherein:

[0087] The distribution information acquisition module 201 is used to acquire the distribution information of a plurality of carriers carrying substrates in a thin film deposition device, wherein the distribution information includes identification information of a cavity containing a material where the carriers are located.

[0088] The instruction acquisition module 202 is used to acquire a corresponding opening instruction according to the distribution information. The opening instruction is used to instruct to simultaneously open a target valve among multiple valves. The target valve is determined according to a combination of identification information.

[0089] The status information acquisition module 203 is used to acquire the status information of the cavity with material.

[0090] The instruction execution module 204 is used to execute the opening instruction and control the multiple cavities with material to transfer the carrier in response to the state information of the multiple cavities with material meeting the corresponding opening conditions. The opening conditions are associated with the cavity type of the cavity with material.

[0091] In an exemplary embodiment, the plurality of chambers include a first chamber, a second chamber, and a third chamber arranged in sequence in a preset transmission direction, the plurality of gate valves include a first gate valve located at an inlet side of the first chamber, a second gate valve located between the first chamber and the second chamber, a third gate valve located between the second chamber and the third chamber, and a fourth gate valve located at an outlet side of the third chamber, and the transmission control device 200 of the thin film deposition apparatus further includes:

[0092] The first instruction determination module is used to determine that the opening instruction corresponding to the distribution information includes the identification information of the second gate valve and the identification information of the third gate valve when the distribution information includes the identification information of the first cavity and the identification information of the second cavity.

[0093] The second instruction determination module is used to determine that the opening instruction corresponding to the distribution information includes the identification information of the third gate valve and the identification information of the fourth gate valve when the distribution information includes the identification information of the second cavity and the identification information of the third cavity.

[0094] In an exemplary embodiment, the state information includes current instruction information, intra-cavity environment information and functional state information, and the conveying control device 200 of the thin film deposition device further includes:

[0095] The condition judgment module is used to determine the judgment result of the opening condition corresponding to the material cavity according to the current instruction information, the cavity environment information and the functional status information.

[0096] In an exemplary embodiment, the intracavity environment information includes air pressure, and the condition judgment module is further used to:

[0097] Acquiring the air pressure of the transfer cavity, where the transfer cavity is the next cavity of the cavity with material in the direction close to the adjacent target gate valve;

[0098] When the difference between the air pressure of the material cavity and the air pressure of the transmission cavity is greater than or equal to a preset threshold, the corresponding vacuum device is started until the difference is less than the preset threshold;

[0099] When the difference is smaller than a preset threshold, the judgment result of the opening condition corresponding to the material cavity is determined according to the current instruction information and the functional status information.

[0100] In an exemplary embodiment, the material chamber is used to execute the process recipe, and the condition judgment module is also used to:

[0101] When it is determined according to the identification information of the cavity with material that the cavity with material has a carrier lifting function, and the carrier in the cavity with material is not located at a preset initial height position, a lifting and lowering instruction for the cavity with material is executed until the carrier in the cavity with material is located at a preset initial height position;

[0102] When it is determined according to the identification information of the cavity with material that the cavity with material does not have the function of lifting the carrier plate, or when it is determined according to the identification information of the cavity with material that the cavity with material has the function of lifting the carrier plate, and the carrier plate in the cavity with material is located at a preset initial height position, the judgment result of the opening condition corresponding to the cavity with material is determined according to the current instruction information and the environmental information in the cavity.

[0103] In an exemplary embodiment, the condition judgment module is further used to:

[0104] In the case where the current instruction information includes a stop instruction, in response to a release operation for the stop instruction, a judgment result of an opening condition corresponding to the cavity with material is determined according to the cavity environment information and the functional status information.

[0105] Each module in the above-mentioned conveying control device of the thin film deposition device can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0106] In an exemplary embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as shown in FIG. Fig.10 As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. Among them, the processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a transmission control method for a thin film deposition device is implemented.

[0107] Those skilled in the art will understand that Fig.10 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0108] In an exemplary embodiment, a transmission control system 300 is provided, comprising a control system 301, a transmission device 302, and a position detection device 303 electrically connected to each other, wherein:

[0109] The control system 301 is used to implement the steps in the above-mentioned method embodiments when executing a computer program.

[0110] The transmission device 302 is used to transmit the carrier board.

[0111] The position detection device 303 is used to determine the position of the carrier.

[0112] For example, please refer to Fig.11 , Fig.11 301 is a data flow diagram of a transmission control system in an embodiment. The control system 301 may be a PLC system. For example, during the movement of the carrier in the process chamber, the position detection device 303 will continuously detect the position of the carrier and feed back the position information to the PLC control system in real time; after receiving the position information, the PLC system analyzes the next action of the carrier through logical operations, and then transmits the action information to the transmission device 302, while controlling the state of each process chamber; after receiving the information transmitted by the PLC system, the transmission device 302 transmits the carrier to the specified position, and the carrier is detected by the position detection device 303 again.

[0113] In this embodiment, the real-time data interaction between the position detection device and the control system can accurately determine the real-time position of the carrier plate, which helps to improve the transmission rhythm.

[0114] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above method embodiments are implemented.

[0115] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0116] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., but are not limited to this.

[0117] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0118] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for controlling the conveyance of a thin film deposition device, wherein the thin film deposition device comprises a plurality of chambers and a plurality of gate valves spaced apart from the plurality of chambers, characterized in that: The method comprises: Obtaining distribution information of a plurality of carriers carrying substrates in the thin film deposition device, wherein the distribution information includes identification information of a cavity containing a material where the carriers are located; According to the distribution information, a corresponding opening instruction is acquired, where the opening instruction is used to instruct to simultaneously open a target gate valve among the multiple gate valves, where the target gate valve is determined according to a combination of the identification information; Obtaining status information of the cavity containing material; In response to the state information of the plurality of cavities with material satisfying the corresponding opening conditions, the opening instruction is executed and the plurality of cavities with material are controlled to transfer the carrier plates, and the opening conditions are associated with the cavity types of the cavities with material.

2. The method according to claim 1, characterized in that The multiple cavities include a first cavity, a second cavity, and a third cavity arranged in sequence in a preset transmission direction, the multiple gate valves include a first gate valve located at an inlet side of the first cavity, a second gate valve located between the first cavity and the second cavity, a third gate valve located between the second cavity and the third cavity, and a fourth gate valve located at an outlet side of the third cavity, and according to the distribution information, a corresponding opening instruction is obtained, which includes: In a case where the distribution information includes identification information of the first cavity and identification information of the second cavity, determining that the opening instruction corresponding to the distribution information includes identification information of the second gate valve and identification information of the third gate valve; In the case that the distribution information includes the identification information of the second cavity and the identification information of the third cavity, it is determined that the opening instruction corresponding to the distribution information includes the identification information of the third gate valve and the identification information of the fourth gate valve.

3. The method according to claim 1, characterized in that The state information includes current instruction information, intracavity environment information and functional state information. After obtaining the state information of the cavity with material, it includes: According to the current instruction information, the intra-cavity environment information and the functional status information, a judgment result of the opening condition corresponding to the cavity with material is determined.

4. The method according to claim 3, characterized in that The intra-cavity environment information includes air pressure, and the judgment result of determining the opening condition corresponding to the material cavity according to the current instruction information, the intra-cavity environment information and the functional state information includes: Acquiring the air pressure of a transfer cavity, wherein the transfer cavity is the next cavity of the cavity with material in a direction close to an adjacent target gate valve; When the difference between the air pressure of the material cavity and the air pressure of the transmission cavity is greater than or equal to a preset threshold, the corresponding vacuum device is started until the difference is less than the preset threshold; When the difference is smaller than the preset threshold, the judgment result of the opening condition corresponding to the material cavity is determined according to the current instruction information and the functional status information.

5. The method according to claim 3, characterized in that: The cavity with material is used to execute a process recipe, and the judgment result of determining the opening condition corresponding to the cavity with material according to the current instruction information, the cavity environment information and the functional state information includes: When it is determined according to the identification information of the cavity with material that the cavity with material has a carrier lifting function, and the carrier in the cavity with material is not located at a preset initial height position, a lifting and lowering instruction for the cavity with material is executed until the carrier in the cavity with material is located at the preset initial height position; When it is determined according to the identification information of the cavity with material that the cavity with material does not have the function of lifting the carrier plate, or when it is determined according to the identification information of the cavity with material that the cavity with material has the function of lifting the carrier plate, and the carrier plate in the cavity with material is located at a preset initial height position, the judgment result of the opening condition corresponding to the cavity with material is determined according to the current instruction information and the intra-cavity environment information.

6. The method according to claim 3, characterized in that The determination result of the opening condition corresponding to the material cavity according to the current instruction information, the cavity environment information and the functional state information includes: In the case where the current instruction information includes a stop instruction, in response to a release operation of the stop instruction, a judgment result of the opening condition corresponding to the cavity with material is determined according to the intra-cavity environment information and the functional status information.

7. A conveying control device for a thin film deposition device, the thin film deposition device comprising a plurality of chambers and a plurality of gate valves spaced apart from the plurality of chambers, characterized in that: The device comprises: A distribution information acquisition module, used to acquire distribution information of a plurality of carriers carrying substrates in the thin film deposition device, wherein the distribution information includes identification information of a cavity containing a material where the carrier is located; an instruction acquisition module, used for acquiring a corresponding opening instruction according to the distribution information, wherein the opening instruction is used for instructing to simultaneously open a target gate valve among the plurality of gate valves, wherein the target gate valve is determined according to a combination of the identification information; A status information acquisition module, used to acquire status information of the cavity with material; The instruction execution module is used to execute the opening instruction and control the multiple cavities with material to transfer the carrier in response to the status information of the multiple cavities with material satisfying the corresponding opening conditions, and the opening conditions are associated with the cavity type of the cavity with material.

8. A transmission control system, characterized in that: It includes a control system, a transmission device and a position detection device which are electrically connected to each other; The control system is used to implement the steps of any one of the methods of claims 1 to 6 when executing a computer program; The transmission device is used to transmit the carrier plate; The position detection device is used to determine the position of the carrier plate.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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