Electrolytic copper foil suitable for new generation AI and communication industry and manufacturing method thereof

Abstract

The invention discloses an electrolytic copper foil suitable for a new generation AI and communication industry, and also discloses a manufacturing method of the copper foil, and the manufacturing method comprises the following steps: adding a raw material copper into sulfuric acid, stirring and dissolving, filtering, mixing with an additive to obtain an electrolyte, and transferring the electrolyte into an electrolytic cell of a crude foil machine; preparing a Cr anti-rust solution, filtering, and then transferring the Cr anti-rust solution into a chromium anti-oxidation tank of a crude foil engine; a current is applied to a cathode roller and an anode plate which are separately arranged, the surface of the anode plate is provided with a honeycomb-shaped precise micro pattern, copper is electrically deposited on the surface of the cathode roller, Cr anti-rust treatment is conducted through a roll-to-roll manufacturing process, and then the electrolytic copper foil is obtained after rolling and baking are conducted. The electrolytic copper foil provided by the invention has the characteristics of low roughness, ultrathin thickness and high mechanical strength.

Description

Technical Field

[0001] The present invention belongs to the technical field of copper foil and its manufacturing method, and relates to an electrolytic copper foil suitable for the new generation AI and communication industries. The present invention also relates to a manufacturing method of the above copper foil. Background Art

[0002] Recently, the rapid development of artificial intelligence (AI) technology is leading to a huge change in the entire industry. AI is widely used in many fields such as manufacturing, finance, medical care, and communications by processing large-scale data, identifying patterns, autonomous learning, and executing decisions. In particular, AI technology based on deep learning has performed well in image recognition, speech recognition, and natural language processing. These AI systems require large-scale computing during learning and reasoning, so high-performance hardware is indispensable. High-speed parallel computing devices such as GPUs (graphics processing units) and TPUs (tensor processing units) use tens to hundreds of cores to achieve real-time data computing, and high-speed signal transmission and power efficiency are also important factors. Therefore, the high-density circuit boards that constitute these devices require conductive materials with excellent signal transmission characteristics, among which copper foil plays a very critical role as a core material. Copper foil, as a conductive material in the circuit, is used to transmit electrical signals. In a high-speed, high-frequency signal environment, its performance has a significant impact on the stability and efficiency of the entire system. In particular, in AI computing devices and high-speed communication devices, the required copper foil must simultaneously meet extremely low surface roughness, precise film properties, and excellent mechanical properties. If the surface roughness is large, signal loss will increase due to the skin effect of high-frequency current flowing along the conductor surface; if the film properties are insufficient, it will be difficult to achieve high-density circuits. In addition, the next-generation communication technology 6G (sixth generation) aims to achieve data transmission speeds of more than 1Tbps and ultra-low latency of less than 1ms using ultra-high frequency bands from 100GHz to a maximum of 1THz. However, at such a high frequency band, signal attenuation and propagation loss will increase sharply, so in order to minimize signal loss in the circuit, the surface state and thickness accuracy of the conductive material become more important. Therefore, in order to achieve stable transmission of ultra-high frequency signals, ultra-low roughness and thin filmization of copper foil are essential, however, the current commercial electrolytic copper foil technology still has many technical limitations in fully meeting these high-performance requirements. First, the existing electrolytic copper foil has technical limitations in the manufacturing process to reduce the surface roughness below a certain level, which leads to increased signal loss in high-frequency circuits. In addition, as the copper foil is thinned, its mechanical strength and thermal stability decrease, and physical defects such as peeling or cracks may occur during the circuit manufacturing process. Ultimately, the existing electrolytic copper foil is difficult to simultaneously meet the ultra-low roughness, thin film and mechanical stability required by AI high-speed computing systems and 6G high-frequency communication circuits, and there are technical limitations. Therefore, the present invention aims to solve these problems and propose a next-generation copper foil manufacturing technology that can reduce the surface roughness to an extremely low level while maintaining excellent mechanical properties. Summary of the invention

[0003] The purpose of the present invention is to provide an electrolytic copper foil suitable for the new generation AI and communication industries, which has the characteristics of low roughness, ultra-thinness and high mechanical strength.

[0004] Another object of the present invention is to provide a method for producing the above copper foil.

[0005] The technical solution adopted by the present invention is a method for manufacturing electrolytic copper foil suitable for the new generation of AI and communication industries, which is specifically implemented according to the following steps: Step 1, adding raw copper into sulfuric acid, stirring and dissolving, filtering, and then mixing with additives to obtain an electrolyte, and transferring the electrolyte to an electrolytic cell of a foil machine; Step 2, preparing a Cr anti-rust liquid, filtering it, and then transferring it to a chromium anti-oxidation tank of a foil machine; Step 3, applying current to the cathode roller and the anode plate which are separately arranged, electro-depositing copper on the surface of the cathode roller, and performing Cr anti-rust treatment through a roll-to-roll manufacturing process, and then winding and baking to obtain an electrolytic copper foil; Among them, the surface of the anode plate is provided with a honeycomb-shaped precision micro-pattern.

[0006] The present invention is also characterized in that: In step 1, the electrolyte is obtained by mixing and dissolving pure copper wire and sulfuric acid, and then adding additives; wherein the concentration of copper ions is 85~100g / L, and the concentration of sulfate ions is 90~120g / L; the additives include polishing agents, speed reducers, flattening agents and roughness regulators.

[0007] The polishing agent is one of bis(3-sulfopropyl)-disulfide disodium salt, 3-[(amino-iminomethyl)sulfur]-1-propanesulfonic acid sodium salt, and 3-(benzothiazolyl-2-mercapto)-propanesulfonic acid sodium salt, and the addition amount thereof is 15.0-50.0 mg / L; The speed reducer is one of hydroxyethyl cellulose, octanol polyalkoxy ether, polyvinyl alcohol, polyethylene propylene glycol, and oleic acid polyethylene glycol ether, and the addition amount thereof is 7.0~22.0 mg / L; The flattening agent is 2-mercaptobenzimidazole, and its addition amount is 0.1~2.0mg / L; The roughness regulator is an arylene ether oligomer, and the addition amount thereof is 2.0-10.0 mg / L.

[0008] In step 2, the preparation method of Cr anti-rust liquid is: Chromium trioxide and glucose are added into ultrapure water and stirred to dissolve to obtain the product; wherein the chromium ion concentration is 0.40-0.60 mg / L.

[0009] During the electrodeposition process of step 3, the electrolyte temperature is 45~55℃ and the current density is 28~43A / dm 2 , flow rate is 45~65m 3 / hr.

[0010] During the Cr anti-rust treatment in step 3, the temperature of the anti-rust liquid is 20~22℃ and the flow rate is 3~6m 3 / hr, pH value is below 3.5.

[0011] The baking process of step 3 is specifically as follows: heat treatment is performed in an oven at 50-65°C.

[0012] The honeycomb precision micro-pattern on the anode plate is composed of an array of regular hexagonal patterns, the side length of the regular hexagon is 10 μm, the spacing between adjacent regular hexagons is 10 μm, and the pattern depth is 3 μm.

[0013] Another technical solution adopted by the present invention is an electrolytic copper foil suitable for the new generation of AI and communication industries, which is prepared by the above method, has a thickness of 3~5μm, a surface roughness Ra of 0.05~0.1μm, a tensile strength of 350MPa~400MPa at room temperature after heat treatment, and an elongation of 3.0~4.5% at room temperature after heat treatment.

[0014] The beneficial effects of the present invention are: (1) The method of the present invention adopts an anode plate with a hexagonal (honeycomb) micro-pattern structure surface treatment in the manufacture of electrolytic copper foil, which is different from the traditional technology, so as to maximize the uniformity of current distribution and prevent current concentration, significantly reducing the surface defects that may occur during the deposition of the coating. This structural design significantly improves the surface roughness of the electrolytic copper foil and enables it to have optimized performance in high-frequency applications requiring high-speed signal transmission; (2) The method of the present invention suppresses the formation of protrusions and peaks in the metal structure by adding additive C (flattening agent) and additive D (roughness regulator) to the electrolyte in the electrolytic cell under optimal conditions, while ensuring the roughness uniformity and mechanical stability of the coating. Additive C improves the mechanical properties of the electrolytic copper foil, especially the tensile strength, through flattening, while additive D forms a smooth coating without micro defects by more evenly controlling the current distribution. These two additives become the key elements for achieving high-performance electrolytic copper foil through synergistic effects; (3) The copper foil of the present invention has the following excellent physical properties: thickness of 3~5 microns, surface roughness Ra of 0.05~0.1 microns, tensile strength at room temperature after heat treatment of 350MPa~400MPa, and elongation at room temperature after heat treatment of 3.0~4.5%. Under the same thickness conditions, the electrolytic copper foil is not inferior to the existing commercial copper foil, and even becomes a material suitable for the new generation of high-speed signal processing by achieving extremely low roughness and ultra-thin thickness at the same time. Therefore, the electrolytic copper foil of the present invention can be widely used in core component materials such as AI industry, 6G high-frequency communication industry, high-performance electronic equipment, ultra-precision circuit boards, and as a high-function material for long-term stable operation in fields requiring high-speed transmission and high reliability. In addition, this technology is not limited to specific industries, but is also expected to be widely used as a key material for a new generation of high-performance products in a variety of application fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a process flow chart of the method for manufacturing electrolytic copper foil of the present invention. DETAILED DESCRIPTION

[0016] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] The present invention is applicable to the manufacturing method of electrolytic copper foil for the new generation AI and communication industries as follows: like Figure 1 As shown, in order to manufacture the above-mentioned electrolytic copper foil, pure copper wire and sulfuric acid are injected into the dissolving tank, then dissolved and stirred, and then the electrolyte is circulated and mixed through the dirty liquid tank and the dissolving tank and the concentration is controlled. In order to prevent the electrolyte from flowing in the pipeline during the circulation and causing heat loss and crystallization, the temperature is controlled by a heat exchanger. Then, the impurities in the electrolyte are filtered through a diatomaceous earth filter and injected into the clean liquid tank. Next, the additives required for stable production of electrolytic copper foil and the additives required for high mechanical properties are placed in each additive tank, dissolved and stirred with ultrapure water, and then placed in the clean liquid tank. The electrolyte mixed with the additives in the clean liquid tank is filtered through a fine filter, and after adjusting the electrolyte temperature through a heat exchanger, it is moved to the electrolytic tank of the raw foil machine. Then, the Cr salt and ultrapure water are dissolved and stirred in the Cr dissolving tank, and after dissolving, they are transferred to the Cr supply tank to prepare a rust-proof liquid to prevent oxidation of the surface of the electrolytic copper foil, and then filtered through a fine filter, and then moved to the chromium anti-oxidation tank in the raw foil machine. In the electrolyte solution in the electrolytic cell, current is applied to the cathode roller and anode plate spaced apart from each other, and the electrolytic copper foil is electrodeposited on the surface of the cathode roller, and Cr anti-rust treatment is performed through the roll-to-roll manufacturing process, and then rolled up to complete the manufacturing. Finally, in order to eliminate stress, the finished electrolytic copper foil needs to be heat treated at 50 to 65°C in an oven to complete the final processing.

[0018] In the above-mentioned manufacturing method, the core of the present invention lies in the surface structure design of the anode plate used for the manufacture of electrolytic copper foil. A hexagonal (honeycomb) precision micro-pattern is constructed on the surface of the anode plate. This structure plays a decisive role in the uniform dispersion of current flow during the electrolytic plating process. Specifically, the hexagonal honeycomb pattern overcomes the limitation that the planar structure is prone to current concentration, and by guiding the current to be evenly distributed on the anode surface, the thickness uniformity and surface roughness characteristics of the deposited layer are significantly improved. Ordinary flat anode plates are prone to excessive current concentration in local areas, resulting in protrusions or depressions on the surface of the electrolytic copper foil, which may reduce the electrical properties. In contrast, the honeycomb pattern of the present invention fundamentally avoids these shortcomings and is an optimized structure that can achieve the ultra-low roughness characteristics required for high-frequency and ultra-precision circuits. The honeycomb pattern used in the method of the present invention is composed of regular hexagonal units with a side length of 10 microns, the spacing between adjacent units is 10 microns, and the pattern depth (D) is 3 microns. At this time, the ratio of depth to unit size (D / W) is designed to be 0.3, which is an optimized ratio based on the current distribution and ion diffusion characteristics during the electrolysis process. It is the core technology for achieving the effect of reducing roughness and inducing stable deposition at the same time.

[0019] [Depth to cell size ratio (D / W) = pattern depth (D) / cell size (W)] In addition, the honeycomb anode plate of the present invention is not limited to controlling the roughness, but also stabilizes the flow of ions in the electrolyte through the regularity and repeatability of the pattern, thereby more accurately controlling the microcrystalline structure of the coating. This minimizes the possibility of local thickness deviation or surface micro-defects of the electrolytic copper foil, especially in application fields requiring precise electrical properties, such as high-frequency signal processing circuits or circuit boards for AI high-performance chips, providing a key technical foundation for stable operation without signal loss.

[0020] The electrolyte used to manufacture the above electrolytic copper foil is a copper sulfate solution mixed with copper and sulfuric acid and added with additives. The concentration of copper ions is 85-100 g / L, the concentration of sulfate ions is 90-120 g / L, and the copper requires the use of high-purity copper wire with a purity greater than 99.9%. The electrolyte temperature is 45-55°C, and the current density is 28-43 A / dm 2 , flow rate is 45~65m 3 / hr.

[0021] The additives added to the above-mentioned electrolytic copper foil electrolyte include a polishing agent (additive A), a speed reducer (additive B), a flattening agent (additive C) and a roughness regulator (additive D), especially additives C and additives D are another important technical feature of the present invention.

[0022] The polishing agent (additive A) can use one of bis(3-sulfopropyl)-disulfide disodium salt, 3-[(amino-iminomethyl)sulfur]-1-propanesulfonic acid sodium salt, and 3-(benzothiazolyl-2-mercapto)-propanesulfonic acid sodium salt, and the addition amount is 15.0~50.0mg / L. Additive A can increase the electrodeposition rate and enhance the surface gloss when used in an appropriate amount. However, when the addition amount is less than 15.0mg / L, the surface gloss will decrease, and when the addition amount exceeds 50.0mg / L, it may cause the surface roughness to increase or the tensile strength to decrease.

[0023] The speed reducer (additive B) can be one of hydroxyethyl cellulose, octanol polyalkoxy ether, polyvinyl alcohol, polyethylene glycol, and oleic acid polyethylene glycol ether, and the addition amount is 7.0~22.0 mg / L. When additive B is used in an appropriate amount, it can reduce the electrodeposition rate, thereby preventing a sharp increase in surface roughness. However, if the addition amount is less than 7.0 mg / L, the surface roughness may increase sharply; in addition, after the addition amount exceeds 22.0 mg / L, the effect will not be enhanced compared with the appropriate amount, but will lead to an increase in manufacturing costs, resulting in economic waste.

[0024] The flattening agent (additive C) can use 2-mercaptobenzimidazole, and the addition amount is 0.1~2.0mg / L. When used in an appropriate amount, additive C can inhibit the formation of large protrusions or peaks in the metal structure, thereby flattening the surface and improving the tensile strength and density by inducing a fine grain structure. At the same time, additive C can also relieve the local stress distribution inside the coating by adjusting the unevenness of the metal growth rate. However, if the addition amount is less than 0.1mg / L, it is difficult to achieve the flattening effect of the metal structure; if the addition amount exceeds 2.0mg / L, it may cause excessive increase in surface roughness or decrease in tensile strength.

[0025] The roughness regulator (additive D) uses arylene ether oligomers, and the addition amount is 2.0~10.0mg / L. When used in an appropriate amount, additive D can make the current distribution more uniform, thereby guiding the uniform deposition of the coating, and shows excellent effects in reducing roughness and reducing micro defects. However, if the addition amount is less than 2.0mg / L, the current distribution will be uneven, which may cause local over-plating, resulting in uneven electroplating, increased surface roughness and decreased tensile strength; if the addition amount exceeds 10.0mg / L, pinholes may be generated on the surface of the electrolytic copper foil and interfere with the interaction of other additives.

[0026] In addition, the above-mentioned additives C and D are effective when used independently, and when used together at appropriate concentrations, they can exert excellent synergistic effects in terms of coating uniformity, physical stability, and roughness reduction. First, when used together, the two have a dual inhibitory effect on crystal growth. Additive C inhibits the growth rate of surface metal crystals, while additive D prevents current concentration and blocks excessive deposition at specific locations, thereby jointly forming a coating with a uniform microcrystalline structure, thereby preparing an electrolytic copper foil with a smooth surface and excellent durability; secondly, additive D uniformly adjusts the ion distribution in the electrolyte, while additive C controls the metal precipitation reaction rate, so that the current density and reaction uniformity in the electrolytic system are optimized, thereby obtaining a coating with a more accurate thickness distribution and a more precise surface layer.

[0027] In order to prevent the surface of the electrolytic copper foil from being oxidized after the electrolytic copper foil electrodeposition process is completed by the electrolyte, chromium anti-rust treatment is required. The chromium anti-rust liquid uses chromium trioxide, but because it is highly toxic and may be harmful to the environment, glucose is added as a reducing agent. The concentration of chromium ions in the chromium anti-rust liquid is 0.40~0.60mg / L, the temperature of the anti-rust liquid is 20~22℃, and the flow rate is 3~6m 3 / hr, pH value is below 3.5. Finally, heat treatment is performed in an oven at 50~65°C to reduce the internal stress of the electrolytic copper foil, thereby reducing the curling degree of the electrolytic copper foil. The thickness of the electrolytic copper foil prepared by the above manufacturing method is 3~5μm, which can produce extremely low roughness and ultra-thin electrolytic copper foil suitable for the needs of the new generation of AI and communication industries.

[0028] Example 1 In the electrolyte solution in the electrolytic cell, current is applied to the cathode rollers spaced apart from each other and the anode plates with a hexagonal (honeycomb) regular structure on the surface, and the electrolytic copper foil is electrodeposited on the surface of the cathode roller, and subjected to a Cr anti-rust treatment process through a roll-to-roll manufacturing process, and finally rolled up for manufacturing. In order to eliminate stress, the manufactured electrolytic copper foil needs to be heat treated in an oven at 60°C for 12 hours. In the electrolyte used to manufacture the above-mentioned electrolytic copper foil, the copper ion concentration is 85.0g / L and the sulfate ion concentration is 115.0g / L. The electrolyte temperature is 53.0±1.0°C, the current density is 37A / dm², and the electrolyte flow rate is 55m 3 The additives added to the electrolytic copper foil electrolyte were dissolved in each additive tank with ultrapure water and stirred.

[0029] The types and contents of the electrolyte additives used in this embodiment are: Polishing agent (additive A) – bis(3-sulfopropyl)-disulfide disodium salt 15.0 mg / L Moderator (Additive B) – Hydroxyethylcellulose 7.0 mg / L Flattening agent (additive C) – 2-mercaptobenzimidazole 0.1 mg / L Roughness regulator (additive D) – arylene ether oligomer 2.0 mg / L In addition, the anti-rust liquid used for chromium anti-rust treatment was prepared by reducing chromium trioxide with glucose, dissolving it with ultrapure water and stirring it. The Cr concentration was 0.55 mg / L, the anti-rust liquid temperature was 21.0±1.0℃, and the flow rate was 4.2m 3 / hr, pH value is kept below 3.5.

[0030] An electrolytic copper foil having a thickness of 4 μm was manufactured by the above-mentioned manufacturing method and additives.

[0031] Example 2 The types and contents of additives in the electrolytic copper foil electrolyte of this embodiment are: Polishing agent (additive A) – 3-(benzothiazolyl-2-mercapto)propanesulfonic acid sodium salt 23.7 mg / L Speed ​​reducer (additive B) – polyvinyl alcohol 10.7 mg / L Leveling agent (additive C) – 2-mercaptobenzimidazole 0.5 mg / L Roughness regulator (additive D) – arylene ether oligomer 4.0 mg / L An electrolytic copper foil was prepared in the same manner as in Example 1 except for the difference in additives and addition amounts.

[0032] Example 3 The types and contents of additives in the electrolytic copper foil electrolyte of this embodiment are: Polishing agent (additive A) – 3-(benzothiazolyl-2-mercapto)-propanesulfonic acid sodium salt 32.5 mg / L Speed ​​reducer (additive B) – oleic acid polyglycol ether 14.5 mg / L Leveling agent (additive C) – 2-mercaptobenzimidazole 1.0 mg / L Roughness regulator (additive D) – arylene ether oligomer 6.0 mg / L An electrolytic copper foil was prepared in the same manner as in Example 1 except for the difference in additives and addition amounts.

[0033] Example 4 The types and contents of additives in the electrolytic copper foil electrolyte of this embodiment are: Polishing agent (additive A) – 3-[(amino-iminomethyl)thio]-1-propanesulfonic acid sodium salt 41.2 mg / L Speed ​​reducer (additive B) – Polyethylene propylene glycol 18.2 mg / L Flattening agent (additive C) – 2-mercaptobenzimidazole 1.5 mg / L Roughness regulator (additive D) – arylene ether oligomer 8.0 mg / L An electrolytic copper foil was prepared in the same manner as in Example 1 except for the difference in additives and addition amounts.

[0034] Example 5 The types and contents of additives in the electrolytic copper foil electrolyte of this embodiment are: Polishing agent (additive A) – 3-[(amino-iminomethyl)thio]-1-propanesulfonic acid sodium salt 50.0 mg / L Speed ​​reducer (additive B) – octanol polyalkoxy ether 22.0 mg / L Leveling agent (additive C) – 2-mercaptobenzimidazole 2.0 mg / L Roughness regulator (additive D) – arylene ether oligomer 10.0 mg / L An electrolytic copper foil was prepared in the same manner as in Example 1 except for the difference in additives and addition amounts.

[0035] Comparative Example 1 This comparative example is substantially the same as Example 1, except that the anode plate used is a commercial flat anode plate.

[0036] Comparative Example 2 This comparative example is substantially the same as Example 1, except that the addition amounts of the flattening agent (additive C) and the roughness regulator (additive D) are different.

[0037] The types and contents of additives in the electrolytic copper foil electrolyte of this comparative example are: Polishing agent (additive A) – bis(3-sulfopropyl)-disulfide disodium salt 15.0 mg / L Moderator (Additive B) – Hydroxyethylcellulose 7.0 mg / L Flattening agent (additive C) – 2-mercaptobenzimidazole 0.05 mg / L Roughness modifier (Additive D) - arylene ether oligomer 1.0 mg / L.

[0038] Comparative Example 3 This comparative example is substantially the same as Example 2, except that no flattening agent (additive C) is added.

[0039] Comparative Example 4 This comparative example is substantially the same as Example 3, except that no roughness regulator (additive D) is added.

[0040] Comparative Example 5 This comparative example is substantially the same as Example 4, except that the flattening agent (additive C) and the roughness regulator (additive D) are not added.

[0041] Comparative Example 6 This comparative example is substantially the same as Example 5, except that the addition amounts of the flattening agent (additive C) and the roughness regulator (additive D) are different.

[0042] The types and contents of additives in the electrolytic copper foil electrolyte of this comparative example are: Polishing agent (additive A) – 3-[(amino-iminomethyl)thio]-1-propanesulfonic acid sodium salt 50.0 mg / L Speed ​​reducer (additive B) – octanol polyalkoxy ether 22.0 mg / L Leveling agent (additive C) – 2-mercaptobenzimidazole 4.0 mg / L Roughness regulator (Additive D) - arylene ether oligomer 20.0 mg / L.

[0043] Comparative Example 7 This comparative example is substantially the same as Example 5, except that the anode plate used is a commercial flat anode plate.

[0044] Table 1 shows the types, contents and anode plate structures of additives used in preparing copper foils of Examples 1-5 and Comparative Examples 1-7. The thickness, surface roughness (Ra), tensile strength at room temperature after heat treatment, elongation at room temperature after heat treatment and appearance of the electrolytic copper foil prepared in each case were measured and inspected, and the results are shown in Table 2.

[0045] Table 1 Types, amounts and anode plate structures of additives used in each case

[0046] Table 2 Performance test results of copper foil prepared in each case

[0047] As can be seen from Table 1 and Table 2, the technical effect of the method of the present invention is obvious. In Examples 1 to 5, hexagonal (honeycomb) pattern anode plates are used, and additives C (flattening agent) and additive D (roughness regulator) are used within an appropriate concentration range, so that the surface roughness (Ra) of the electrolytic copper foil is maintained at an extremely low level of 0.05 to 0.10 microns. In addition, the tensile strength after heat treatment is 350 to 400 MPa, and the elongation is 3.0 to 4.5%, showing excellent mechanical properties, and the appearance state also forms a uniform coating without micro-defects, which are all rated as good. This shows that the honeycomb pattern anode plate improves the uniformity of current distribution and reduces roughness by guiding current distribution, while additives C and D make the surface uniform by refining the grains and relieving internal stress in the organization, thereby improving the overall performance. In contrast, the phenomenon of performance degradation in Comparative Examples 1-7 is clearly visible due to changes in additive composition or anode plate structure.

[0048] In Comparative Example 1, the composition of the additives is the same as that of Example 1, but a flat anode plate is used, and its surface roughness (Ra) is 0.20 microns, which is higher than that of Example 1 (0.10 microns); the tensile strength is 309 MPa, and the elongation is 5.0%, which is relatively poor. Compared with Example 1, this shows that the uneven current distribution leads to a higher surface roughness (Ra), and also proves that the honeycomb pattern structure has a significant effect in current control and roughness stabilization.

[0049] In Comparative Example 2, the addition amount of additives C (flattening agent) and D (roughness regulator) was lower than the appropriate range, resulting in an increase in surface roughness (Ra) to 0.19 microns, a tensile strength of 312 MPa, and an elongation of 4.9%. The appearance state showed an uneven surface. This indicates that due to insufficient additives, grain control was not fully achieved, and there were limitations in ensuring roughness and coating uniformity.

[0050] In Comparative Example 3, additive C (flattening agent) was not added, and its surface roughness (Ra) was 0.16 microns, tensile strength was 329 MPa, and elongation was 4.6%. The appearance was good, which showed that the roughness, tensile strength and appearance uniformity were guaranteed to a certain extent by the effect of additive D alone, but it was still slightly insufficient compared with Example 2, indicating that there were certain limitations in the uniformity of metal grains.

[0051] In Comparative Example 4, additive D (roughness regulator) was not added, and its surface roughness (Ra) was 0.18 microns, tensile strength was 315 MPa, elongation was 4.8%, and appearance was good. However, both the roughness value and mechanical strength were lower than those of Example 3, indicating that there were limitations in roughness control when additive C (flattening agent) was used alone.

[0052] In Comparative Example 5, additive C (flattening agent) and additive D (roughness regulator) were not added, and the surface roughness (Ra) was 0.25 microns, reaching the highest level, and the tensile strength was 288 MPa, the lowest value. The elongation was 5.3%, but the appearance showed that the surface was uneven. This shows that in the absence of both additives, the metal grain control and coating uniformity were seriously reduced, resulting in quality problems.

[0053] In Comparative Example 6, the addition amount of additive C (flattening agent) and additive D (roughness regulator) exceeded the appropriate range, and the surface roughness (Ra) was 0.23 microns, the tensile strength was 301 MPa, the elongation was 3.5%, and the appearance had pinholes and surface unevenness. This indicates that excessive additives lead to interference between metal grains or excessive reaction.

[0054] Comparative Example 7 has the same additive composition as Example 5, but uses a flat anode plate, with a surface roughness (Ra) of 0.15 microns, a tensile strength of 332 MPa, an elongation of 4.5%, and a good appearance. However, despite the use of the same additives, the roughness is still higher than that of Example 5, which once again proves the significant effect of the anode plate structure on the uniformity of the coating and the reduction of roughness.

[0055] Based on the above results, it can be clearly proved that the hexagonal (honeycomb) pattern anode plate structure of the core technology of the present invention and the appropriate concentration of additives C (flattening agent) and D (roughness regulator) must be applied simultaneously to achieve extremely low roughness and excellent mechanical properties (tensile strength, elongation). The manufacturing method proposed in the present invention has significant technical advantages in the new generation of communications and AI industries with high-speed signal transmission and high-precision requirements, and is suitable for the production of high-performance electrolytic copper foil.

Claims

1. A method for manufacturing an electrolytic copper foil suitable for the new generation of AI and communication industries, characterized in that: Follow the steps below to implement it: Step 1, adding raw copper into sulfuric acid, stirring and dissolving, filtering, and then mixing with additives to obtain an electrolyte, and transferring the electrolyte to an electrolytic cell of a foil machine; Step 2, preparing a Cr anti-rust liquid, filtering it, and then transferring it to a chromium anti-oxidation tank of a foil machine; Step 3, applying current to the cathode roller and the anode plate which are separately arranged, electro-depositing copper on the surface of the cathode roller, and performing Cr anti-rust treatment through a roll-to-roll manufacturing process, and then winding and baking to obtain an electrolytic copper foil; Wherein, the surface of the anode plate is provided with a honeycomb-shaped precision micro-pattern.

2. The method for manufacturing an electrolytic copper foil suitable for the new generation AI and communication industries according to claim 1, characterized in that: In step 1, the electrolyte is obtained by mixing and dissolving pure copper wire and sulfuric acid, and then adding additives; wherein the concentration of copper ions is 85-100 g / L, and the concentration of sulfate ions is 90-120 g / L; the additives include polishing agents, speed reducers, flattening agents and roughness regulators.

3. The method for manufacturing an electrolytic copper foil suitable for the new generation AI and communication industries according to claim 2, characterized in that: The polishing agent is one of bis(3-sulfopropyl)-disulfide disodium salt, 3-[(amino-iminomethyl)sulfur]-1-propanesulfonic acid sodium salt, and 3-(benzothiazolyl-2-mercapto)-propanesulfonic acid sodium salt, and the addition amount thereof is 15.0-50.0 mg / L; The speed reducer is one of hydroxyethyl cellulose, octanol polyalkoxy ether, polyvinyl alcohol, polyethylene propylene glycol, and oleic acid polyethylene glycol ether, and the addition amount thereof is 7.0-22.0 mg / L; The flattening agent is 2-mercaptobenzimidazole, and the addition amount thereof is 0.1-2.0 mg / L; The roughness regulator is an arylene ether oligomer, and the addition amount thereof is 2.0-10.0 mg / L.

4. The method for manufacturing an electrolytic copper foil suitable for the new generation AI and communication industries according to claim 1, characterized in that: In step 2, the preparation method of the Cr anti-rust liquid is: Chromium trioxide and glucose are added into ultrapure water and stirred to dissolve to obtain the product; wherein the chromium ion concentration is 0.40-0.60 mg / L.

5. The method for manufacturing an electrolytic copper foil suitable for the new generation AI and communication industries according to claim 1, characterized in that: During the electrodeposition process of step 3, the electrolyte temperature is 45~55℃ and the current density is 28~43A / dm 2 , flow rate is 45~65m 3 / hr.

6. The method for manufacturing electrolytic copper foil suitable for the new generation AI and communication industries according to claim 1, characterized in that: During the Cr anti-rust treatment in step 3, the temperature of the anti-rust liquid is 20~22℃ and the flow rate is 3~6m 3 / hr, pH value is below 3.

5.

7. The method for manufacturing electrolytic copper foil suitable for the new generation AI and communication industries according to claim 1, characterized in that: The baking process of step 3 is specifically as follows: heat treatment is performed in an oven at 50-65°C.

8. The method for manufacturing electrolytic copper foil suitable for the new generation AI and communication industries according to claim 1, characterized in that: The honeycomb-shaped precision micro-pattern on the anode plate is formed by an array of regular hexagonal patterns, the side length of the regular hexagon is 10 μm, the spacing between adjacent regular hexagons is 10 μm, and the pattern depth is 3 μm.

9. Electrolytic copper foil suitable for the new generation of AI and communication industries, characterized in that: The material is prepared by the method according to any one of claims 1 to 8, and has a thickness of 3 to 5 μm, a surface roughness Ra of 0.05 to 0.1 μm, a tensile strength of 350 MPa to 400 MPa at room temperature after heat treatment, and an elongation of 3.0 to 4.5% at room temperature after heat treatment.

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