Method for accelerating settling velocity of micro powder in production process of superhard material electroplated product
By using an ultrasonic generator to generate ultrasonic waves in the plating solution during the production of ultrahard material electroplating products, the problem of difficult subsidence of ultrahard material micropowder is solved, and the effect of accelerating settlement and increasing the content of the product micropowder is achieved, and the service life of the product is extended.
Patent Information
- Application Number
- CN202510112544.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2025-05-06
AI Technical Summary
In the production process of superhard material electroplating products, due to the large buoyancy of superhard material micropowders with particle size ≤20μm, it is difficult to settle to the surface of the metal matrix through gravity, resulting in a low content of superhard material micropowder in the plating layer, affecting the function and life of the product.
Ultrasonic waves are generated in the plating solution by using ultrasonic cavitation, and holes are formed around the superhard material fine powder, promoting the flow of the plating solution, increasing the sinking force of the fine powder, causing it to accelerate the settlement to the metal matrix and co-deposit with nickel.
It effectively accelerates the settlement speed of superhard material fine powder, increases the content of fine powder in the product, extends the service life of the product by at least 10%, and avoids the disadvantages of increasing the concentration of the plating solution and the use of special additives.
Smart Images

Figure CN119932674A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of superhard material electroplating product production, and in particular relates to a method for accelerating the sedimentation rate of micro powder in the production process of superhard material electroplating products. Background Art
[0002] Superhard material electroplating products refer to a type of tool formed by consolidating superhard materials on a metal substrate with a certain shape through the method of metal electrodeposition. Superhard materials have a high specific gravity (generally 1.76g / cm 3 ) can fall on the metal layer substrate by natural sedimentation in the plating solution to achieve co-deposition with nickel, but for superhard materials with a particle size of ≤20μm, due to the irregular shape of the powder and the large specific surface area, the buoyancy in the plating solution is large, and it is difficult to settle to the surface of the metal substrate by gravity alone, so it is impossible to achieve co-deposition with nickel, resulting in a low or even no content of superhard material powder in the plating layer. The superhard material products produced in this way have no cutting, grinding, polishing and other functions and become waste. In order to accelerate the sedimentation of superhard material powder, a low-concentration plating solution formula is used to reduce the viscosity of the plating solution, so that the buoyancy of the superhard material powder is reduced and the sedimentation is accelerated. However, the low concentration of the plating solution allows the use of a small cathode current density, which is low in production efficiency and the deterioration of the plating layer quality, which also affects the service life of the product; there is also a process that uses special additives to accelerate the sedimentation of superhard material powder. Although there is a certain effect, it means that the use of additives increases production costs and increases the difficulty of plating solution management. In addition, the effect of using superhard material powder with a particle size of ≤5μm is not very obvious.
[0003] In order to accelerate the sedimentation rate of micropowders in the production process of superhard material electroplating products, the buoyancy of the micropowders remains unchanged without changing the concentration of the plating solution or using special additives. This can only be achieved by increasing the sinking force of the micropowders. The sinking force of the micropowders can be increased by generating centrifugal force or ultrasonic impact force. In the production process of superhard material electroplating products, if you want to use a centrifuge to generate centrifugal force, it will be very difficult to achieve, and the gains will not outweigh the losses. Then, ultrasonic waves are used to form cavities around the superhard material micropowders by utilizing the special energy and acoustic cavitation of ultrasonic waves, allowing the plating solution to flow, thereby accelerating the sedimentation of the superhard material micropowders to the metal matrix and forming a co-deposition with nickel. Therefore, the present invention proposes a method for accelerating the sedimentation rate of micropowders in the production process of superhard material electroplating products. Summary of the invention
[0004] The purpose of the present invention is to provide a method for accelerating the sedimentation rate of micropowders in the production process of superhard material electroplating products, using an ultrasonic generator to utilize ultrasonic cavitation to directly push superhard material micropowders to settle (collide) on a metal substrate, thereby achieving co-deposition with nickel.
[0005] To achieve the above object, the present invention provides the following technical solution: a method for accelerating the sedimentation rate of micro powder in the production process of superhard material electroplating products, the specific steps comprising: S1: immersing an ultrasonic generator in a plating solution, and the ultrasonic sound intensity is reversely perpendicular to the working surface of the metal substrate of the superhard material product;
[0006] S2: When the metal substrate is placed in the plating solution and the power is turned on, the superhard material powder is then added and the ultrasonic generator is turned on. After the working time is reached, the ultrasonic generator stops working for 5-10 minutes and then automatically turns on again;
[0007] S3: The cycle is continued until the electroplating time required by the process is reached, that is, the entire superhard material product production process is completed.
[0008] Preferably, the working frequency and working time of the ultrasonic generator are determined according to the powder size of the superhard material powder, the type and concentration of the plating solution, and the process parameters of the electroplating.
[0009] Preferably, the ultrasonic generator is a multi-head pure titanium ultrasonic generator with a frequency of 20-200KHZ.
[0010] Preferably, the components of the plating solution include 300 g / L nickel sulfamate, 30 g / L nickel chloride and 40 g / L boric acid.
[0011] Preferably, after the power supply is turned on, S2 can perform air plating for 1-20 minutes.
[0012] Compared with the prior art, the present invention has the following beneficial effects:
[0013] The technical method of the present invention adopts an ultrasonic generator to utilize ultrasonic cavitation to directly push superhard material powder to settle (collide) on a metal substrate, thereby achieving co-deposition with nickel; it can accelerate the settling speed of superhard material powder in the plating solution, increase the content of powder in superhard material products, and increase the life of superhard material products by at least 10%. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the process of the present invention. DETAILED DESCRIPTION
[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0016] Example 1
[0017] See also Figure 1 , the present invention provides a technical solution: a method for accelerating the sedimentation rate of micro powder in the production process of superhard material electroplating products, the specific steps include: S1: immersing an ultrasonic generator in the plating solution, and the ultrasonic sound intensity is reversely perpendicular to the working surface of the metal substrate of the superhard material product;
[0018] S2: When the metal substrate is placed in the plating solution and the power is turned on, the superhard material powder is then added and the ultrasonic generator is turned on. After the working time is reached, the ultrasonic generator stops working for 5-10 minutes and then automatically turns on again;
[0019] S3: The cycle is continued until the electroplating time required by the process is reached, that is, the entire superhard material product production process is completed.
[0020] In this embodiment, preferably, the working frequency and working time of the ultrasonic generator are determined according to the powder size of the superhard material powder, the type and concentration of the plating solution, and the process parameters of the electroplating.
[0021] In this embodiment, preferably, the ultrasonic generator is a multi-head pure titanium ultrasonic generator with a frequency of 20-200KHZ.
[0022] In this embodiment, preferably, the components of the plating solution include 300 g / L nickel sulfamate, 30 g / L nickel chloride and 40 g / L boric acid.
[0023] In this embodiment, preferably, S2 can perform 20 minutes of empty plating after the power is turned on.
[0024] Example 2
[0025] See also Figure 1 , the present invention provides a technical solution: a method for accelerating the sedimentation rate of micro powder in the production process of superhard material electroplating products, the specific steps include: S1: immersing an ultrasonic generator in the plating solution, and the ultrasonic sound intensity is reversely perpendicular to the working surface of the metal substrate of the superhard material product;
[0026] S2: When the metal substrate is placed in the plating solution and the power is turned on, the superhard material powder is then added and the ultrasonic generator is turned on. After the working time is reached, the ultrasonic generator stops working for 5-10 minutes and then automatically turns on again;
[0027] S3: The cycle is continued until the electroplating time required by the process is reached, that is, the entire superhard material product production process is completed.
[0028] In this embodiment, preferably, the working frequency and working time of the ultrasonic generator are determined according to the powder size of the superhard material powder, the type and concentration of the plating solution, and the process parameters of the electroplating.
[0029] In this embodiment, preferably, the ultrasonic generator is a multi-head pure titanium ultrasonic generator with a frequency of 20-200KHZ.
[0030] In this embodiment, preferably, the components of the plating solution include 300 g / L nickel sulfamate, 30 g / L nickel chloride and 40 g / L boric acid.
[0031] In this embodiment, preferably, S2 can perform 20 minutes of empty plating after the power is turned on.
[0032] Although the embodiments of the present invention have been shown and described, as detailed above, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A method for accelerating the sedimentation rate of micro powder in the production process of superhard material electroplating products, characterized in that: The specific steps include: S1: immersing an ultrasonic generator in a plating solution, with the ultrasonic sound intensity being reversely perpendicular to the working surface of the metal substrate of the superhard material product; S2: When the metal substrate is placed in the plating solution and the power is turned on, the superhard material powder is then added and the ultrasonic generator is turned on. After the working time is reached, the ultrasonic generator stops working for 5-10 minutes and then automatically turns on again; S3: The cycle is continued until the electroplating time required by the process is reached, that is, the entire superhard material product production process is completed.
2. The method for accelerating the sedimentation rate of micro powder in the production process of superhard material electroplating products according to claim 1, characterized in that: The working frequency and working time of the ultrasonic generator are determined according to the powder size of the superhard material powder, the type and concentration of the plating solution and the process parameters of the electroplating.
3. The method for accelerating the sedimentation rate of micro powder in the production process of superhard material electroplating products according to claim 1, characterized in that: The ultrasonic generator is a multi-head pure titanium ultrasonic generator with a frequency of 20-200KHZ.
4. The method for accelerating the sedimentation rate of micro powder in the production process of superhard material electroplating products according to claim 1, characterized in that: The components of the plating solution include 300 g / L nickel sulfamate, 30 g / L nickel chloride and 40 g / L boric acid.
5. The method for accelerating the sedimentation rate of micro powder in the production process of superhard material electroplating products according to claim 1, characterized in that: After the S2 is powered on, it can perform air plating for 1-20 minutes.