一种感光树脂组合物、感光覆盖膜和电子元器件
By adding epoxy resin and elastomer with a softening point of less than 65°C to the photosensitive resin composition and adjusting the intrinsic viscosity, the problem of insufficient followability of the interlayer insulating film is solved, and the adhesion effect and reliability of the photosensitive cover film are improved.
CN119937245BActive Publication Date: 2026-07-17HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
Patent Information
- Application Number
- CN202411840651.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2026-07-17
- Estimated Expiration
- 2044-12-13
AI Technical Summary
Technical Problem
Existing interlayer insulating films have insufficient followability, which leads to reduced reliability, and followability assessment is costly and time-consuming.
Method used
A photosensitive resin composition is provided, comprising an epoxy resin with a softening point of less than 65°C and an elastomer, and an intrinsic viscosity of >5*103 Pa·S below 45°C and <4*103 Pa·S above 75°C. By limiting the proportion and type of components, the adhesion and bonding properties of the photosensitive cover film are improved.
Benefits of technology
It improves the conformability of the photosensitive cover film, enhances its adhesion to the substrate, and strengthens the reliability of the photosensitive cover film in different environments.
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Figure CN119937245B_ABST
Abstract
本发明涉及印刷线路板技术领域，尤其涉及一种感光树脂组合物、感光覆盖膜和电子元器件，感光树脂组合物包括碱溶性树脂、环氧树脂、固化剂、光敏单体、光引发剂、填料和弹性体；环氧树脂至少包含一种软化点小于65℃的环氧树脂，且软化点小于65℃的环氧树脂与弹性体的质量之和占感光树脂组合物总体固形份的质量百分数不低于3%；感光树脂组合物在45℃以下的特性粘度＞5*103 Pa•S，在75℃以上的特性粘度<4*103 Pa•S。本发明通过调整感光树脂组合物的特性粘度在合理的范围值内，能有效改善由其制备的感光覆盖膜的追从性。
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Citation Information
Patent Citations
Curable resin composition, dry film, cured product, and printed wiring board
JP2018173609A