一种感光树脂组合物、感光覆盖膜和电子元器件
By adding epoxy resin and elastomer with a softening point of less than 65°C to the photosensitive resin composition and adjusting the intrinsic viscosity, the problem of insufficient followability of the interlayer insulating film is solved, and the adhesion effect and reliability of the photosensitive cover film are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
- Filing Date
- 2024-12-13
- Publication Date
- 2026-07-17
AI Technical Summary
Existing interlayer insulating films have insufficient followability, which leads to reduced reliability, and followability assessment is costly and time-consuming.
A photosensitive resin composition is provided, comprising an epoxy resin with a softening point of less than 65°C and an elastomer, and an intrinsic viscosity of >5*103 Pa·S below 45°C and <4*103 Pa·S above 75°C. By limiting the proportion and type of components, the adhesion and bonding properties of the photosensitive cover film are improved.
It improves the conformability of the photosensitive cover film, enhances its adhesion to the substrate, and strengthens the reliability of the photosensitive cover film in different environments.
Smart Images

Figure CN119937245B_ABST