System and method compatible with wireless chip burning and testing

Abstract

The invention relates to a system and method compatible with wireless chip burning and testing, and the system comprises a burning machine table which is used for placing a chip to be burnt and transmitting a burning preparation signal; the burner is in communication connection with the burning machine and is used for receiving the burning preparation signal, providing a chip power supply for the to-be-burnt chip, cutting off power and outputting a burning result signal after firmware is burnt on the to-be-burnt chip; the auxiliary control board is in communication connection with the burning machine table and the burner and is used for receiving the burning preparation signal and the burning result signal and sending a burning success signal or a burning failure signal to the burning machine table according to the burning result signal; and sending a test instruction to the to-be-tested chip which is burnt successfully and restarted, and receiving a transmit-receive test result of the to-be-tested chip. The auxiliary control board is matched with the burner and the burning machine, so that the wireless transceiving test of the chip is realized, the function test of the chip and the burning of the chip are integrated, the accuracy of the chip burning firmware can be ensured, and the normal function of the shipment chip is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing and testing, and in particular to a system and method for compatible wireless chip burning and testing. Background Art

[0002] With the popularization of the Internet of Things, the application scenarios of low-cost and simple wireless chips are increasing, especially in industries with strict cost control requirements. Such chips have great application potential. However, in these fields, although many companies have the ability to develop related hardware, they have shortcomings in the development of wireless-related software.

[0003] For the above-mentioned enterprises, simply selling chips can no longer meet their actual requirements. In order to allow users to use the products more conveniently, in addition to providing them with chips, they also need to assist in the development of firmware and complete the firmware burning work. By providing a complete one-stop service, we ensure that after completing the hardware development, users can directly use the products by simply soldering the chips.

[0004] At present, the common situation in the industry is that after the firmware of the chip is burned, it is shipped directly without testing its related functions. The relevant tests are only carried out after the actual user's chip is made into a finished product, which leads to a series of problems. On the one hand, it is difficult to hold the responsible party for the problematic products, and it is impossible to determine whether the chip has quality problems when it is shipped, or whether the improper behavior of the user during the production process has caused the chip to be damaged; on the other hand, there may be errors in the burning of the firmware version, causing batch product problems.

[0005] Therefore, it is an urgent problem to provide a system and method for programming and testing a compatible wireless chip, integrate chip function testing into the chip programming process, and ensure chip quality. Summary of the invention

[0006] In view of this, the main purpose of the present invention is to provide a system and method for compatible wireless chip burning and testing, which effectively solves the attribution and batch problems caused by direct shipment of chip burning firmware by integrating chip function testing into the chip burning process.

[0007] In a first aspect, an embodiment of the present application provides a system for programming and testing a compatible wireless chip, including:

[0008] The burning machine is used to place the chip to be burned and send the signal to prepare for burning;

[0009] A burner, which is in communication connection with the burner station, is used to receive the burn-ready signal, and provide chip power to the chip to be burned, and after burning the firmware of the chip to be burned, it cuts off the power and outputs a corresponding burn result signal;

[0010] an auxiliary control board, which is in communication connection with the burner station and the burner, and is used to receive the burn preparation signal and the burn result signal, and send a corresponding burn success signal or burn failure signal to the burner station according to the burn result signal; and

[0011] The auxiliary control board is also used to send a test instruction to the chip under test that has been successfully burned and restarted, and receive a wireless transceiver test result of the chip under test.

[0012] In some of the embodiments, the burner table is provided with a burner seat;

[0013] The programming seat is located at the front side of the programming machine and is used for clamping the chip to be programmed.

[0014] In some embodiments, it also includes:

[0015] A power supply, one end of which is communicatively connected to the auxiliary control board and the other end of which is communicatively connected to the chip under test, for receiving a control signal from the auxiliary control board and providing chip power to the chip under test according to the control signal to restart the chip under test;

[0016] The control signal is obtained by the auxiliary control board based on the combination of the preparation signal for burning and the successful burning signal.

[0017] In some embodiments, the programmer is further provided with a programming interface, and the programmer is communicatively connected with the chip to be programmed via the programming interface.

[0018] In some embodiments, the auxiliary control panel comprises:

[0019] A processing chip, whose input signal terminal is used to receive the burning result signal of the burner, and whose control signal terminal is used to output the burning success signal or the burning failure signal to the burner;

[0020] A switching circuit, one end of which is communicatively connected to the wireless output end of the processing chip, and the other end of which is communicatively connected to the chip to be tested via a radio frequency transceiver component;

[0021] A conversion circuit has one end connected to the communication interface of the processing chip and the other end connected to the communication interface of the chip to be tested.

[0022] In some embodiments, the processing chip is a SoC chip.

[0023] In some embodiments, the radio frequency transceiver component is any one of an antenna and a radio frequency cable.

[0024] In a second aspect, an embodiment of the present application provides a method for burning and testing a compatible wireless chip, which is implemented by using any of the above-mentioned systems for burning and testing a compatible wireless chip, and includes the following steps:

[0025] After placing the chip to be burned on the burning seat of the burning machine, the burning machine sends a signal to prepare burning to the burner and the auxiliary control board;

[0026] After receiving the signal for preparing to burn, the burner outputs chip power to the chip to be burned, burns firmware to the chip to be burned through the burning interface, and actively cuts off power after burning is completed, and sends a burning result signal to the auxiliary control board;

[0027] The auxiliary control board sends a burning success signal or a burning failure signal to the burning machine according to the burning result signal, and sends a test instruction to the chip to be tested that has been burned successfully and restarted through the communication interface;

[0028] After receiving the test instruction, the chip to be tested performs a wireless signal transceiving test through a radio frequency transceiving component, and returns the corresponding wireless transceiving test result to the auxiliary control board through a communication interface.

[0029] In some embodiments, it also includes:

[0030] The auxiliary control board controls the burning machine to perform centralized chip packaging according to the receiving and sending test results;

[0031] When the receiving and sending test result is a test failure, the burning machine classifies the tested chip as an NG chip and performs centralized packaging;

[0032] When the receiving and sending test result is a success, the burning machine classifies the tested chips as OK chips and performs centralized packaging.

[0033] In some embodiments, the restart of the chip under test is achieved based on the auxiliary control board controlling the power supply in combination with the ready-to-burn signal and the successful-burn signal.

[0034] Technical effects of the present invention:

[0035] The present application combines a burning machine, a burner and an auxiliary control board. Specifically, the burning machine is used to place the chip to be burned and send a signal to prepare for burning; the burner is connected to the burning machine for receiving the signal to prepare for burning and providing chip power to the chip to be burned, and after burning the firmware of the chip to be burned, it is powered off and outputs a corresponding burning result signal; the auxiliary control board is connected to the burning machine and the burner for receiving the signal to prepare for burning and the burning result signal, and sends a corresponding burning success signal or burning failure signal to the burning machine according to the burning result signal; and the auxiliary control board is also used to send a test instruction to the chip to be tested that has been burned successfully and restarted, and receive the wireless transceiver test result of the chip to be tested. The burner and the burning machine are controlled by the auxiliary control board, and the wireless transceiver test of the chip is realized by the auxiliary control board, so that the functional test of the chip can be integrated with the burning of the chip, which can not only ensure the accuracy of the chip burning firmware, but also ensure the normal function of the shipped chip.

[0036] Further features and aspects of the present disclosure will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the disclosure and, together with the description, serve to explain the principles of the disclosure.

[0038] Figure 1 A schematic diagram showing the composition of a system for programming and testing a compatible wireless chip according to an embodiment of the present application is shown;

[0039] Figure 2 A schematic diagram showing the composition of an auxiliary control board according to an embodiment of the present application is shown;

[0040] Figure 3 A schematic circuit diagram of a conversion circuit according to an embodiment of the present application is shown;

[0041] Figure 4 A schematic circuit diagram of a conversion circuit according to another embodiment of the present application is shown;

[0042] Figure 5 A schematic circuit diagram of a conversion circuit according to another embodiment of the present application is shown;

[0043] Figure 6 A schematic circuit diagram of a switching circuit according to an embodiment of the present application is shown;

[0044] Figure 7 A schematic diagram showing the steps of a method for burning and testing a compatible wireless chip according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0045] Various exemplary embodiments, features and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0046] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0047] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present disclosure can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the main purpose of the present disclosure.

[0048] like Figure 1 As shown, in the first aspect, the embodiment of the present application provides a system for compatible wireless chip burning and testing, including:

[0049] The burning machine 100 is used to place the chip to be burned and send a signal to prepare for burning;

[0050] The burner 200 is connected to the burner station 100 for receiving a signal for preparing to burn, and providing chip power to the chip to be burned, and after burning the firmware to the chip to be burned, it cuts off the power and outputs a corresponding burning result signal;

[0051] The auxiliary control board 300 is connected to the burner 100 and the burner 200 for receiving a burn preparation signal and a burn result signal, and sending a corresponding burn success signal or a burn failure signal to the burner 100 according to the burn result signal; and

[0052] The auxiliary control board 300 is also used to send a test instruction to the chip under test that has been successfully burned and restarted, and receive the wireless transmission and reception test results of the chip under test.

[0053] In this embodiment, an auxiliary control board 300 is added. The auxiliary control board 300 cooperates with the burner 200 and the burning machine 100 to combine chip burning with testing. While ensuring the accuracy of the chip burning firmware, it can also ensure that the shipped chips function normally, avoiding batch problems or unclear responsibilities of client products.

[0054] Specifically, the burning machine 100 provides a stable physical platform for burning and testing chips. After the packaged chip to be burned is placed on the burning machine 100, the burning machine 100 sends a signal to prepare for burning to the burner 200 and the auxiliary control board 300 at the same time. After receiving the signal to prepare for burning, the burner 200 outputs power to the chip to be burned and burns the firmware to the chip. At this time, the auxiliary control board 300 receives the signal to prepare for burning and does not operate temporarily. That is, it ensures that the burner 200 can carry out the burning work under the appropriate power supply conditions, and at the same time, it can avoid the auxiliary control board 300 from operating incorrectly.

[0055] Furthermore, when the burning is completed, the burner 200 actively cuts off the power and sends a burning result signal to the auxiliary control board 300. If the burning result is a burning abnormality, the auxiliary control board 300 directly sends a burning failure signal to the burning machine 100; if the burning result is a burning success, the auxiliary control board 300 combines the previously received preparation burning signal and the current burning success signal, and controls the chip to restart by controlling the power supply. At this time, the auxiliary control board 300 delays for a period of time, and the specific length of time can be defined according to the actual situation. Different chips may require different restart times. Reasonable delay time can avoid starting subsequent tests before the chip is completely restarted, thereby ensuring the accuracy of the test results. After the chip restart is completed, that is, it can restart normally, the auxiliary control board 300 sends a test instruction to the chip to be tested.

[0056] When the chip under test receives the test instruction, it performs a wireless signal receiving and sending test with the auxiliary control board 300, and then feeds back the result of the wireless receiving and sending test to the auxiliary control board 300, so that the auxiliary control board 300 can control the burning machine 100 accordingly according to the received feedback result.

[0057] It can be seen that the present embodiment combines the burning machine 100, the burner 200 and the auxiliary control board 300, controls the burner 200 and the burning machine 100 through the auxiliary control board 300, and implements the test of wireless transmission and reception of the chip through the auxiliary control board 300, so that the functional test of the chip can be integrated with the burning of the chip, which can ensure the accuracy of the chip burning firmware and ensure that the shipped chip functions normally.

[0058] In some of the embodiments, a burning seat is provided on the burning machine; the burning seat is located at the front side of the burning machine and is used to clamp the chip to be burned.

[0059] In this embodiment, a burning seat 110 is provided on the burning machine 100, and when the packaged chip to be burned is placed in the burning machine, the burning machine 100 will automatically introduce the chip to be burned into the burning seat 110. After the burning seat 110 clamps the chip to be burned, the burning machine 100 starts to send a signal to prepare for burning. In this embodiment, the burning seat 110 is used to build a small workable hardware system for the chip, providing a stable physical basis for subsequent burning and testing, thereby realizing the automation of chip production and testing.

[0060] Furthermore, in some of the embodiments, the burning machine 100 is also provided with a feeding mechanism and a material dividing structure;

[0061] The feeding mechanism is located at the top of the burning machine 100 and is used to introduce the chip to be burned into the burning seat;

[0062] The material sorting structure is located at the front bottom of the burning machine 100, and is used to sort the chips according to the wireless transceiver test results after the test is completed.

[0063] In this embodiment, the packaged chips to be burned are automatically introduced into the burning seat 110 through the feeding mechanism. After the chips to be burned are placed in the feeding mechanism, they automatically enter the burning seat 110 along the material belt under the drive of the motor to wait for burning. When the burning seat 110 clamps the chip to be burned, burning begins. In addition, a material dividing mechanism is also provided at the front bottom of the burning machine 100. When the auxiliary control board 300 receives the chip feedback information, the material dividing mechanism on the burning machine 100 is controlled. That is, the auxiliary control board 300 controls the material dividing interface according to the chip feedback information received by the communication interface, so that the material dividing mechanism processes and classifies the chips according to the test results after the test, and discharges them from the discharge pipe after clearly distinguishing OK chips and NG chips, which is convenient for production management and provides a clear basis for responsibility tracing for possible quality problems, solving the problem of unclear responsibilities in traditional processes. Specifically, if the test fails, the burning machine 100 is notified to classify the tested chips as NG chips and to carry out centralized packaging; if the test succeeds, the burning machine 100 is notified to classify the chips as OK chips and to carry out centralized packaging. In this way, the chips have been strictly tested and classified before leaving the factory, and unqualified chips can be discovered and isolated in time, reducing the cost increase caused by product maintenance or scrapping.

[0064] In some embodiments, it also includes:

[0065] A power supply 400, one end of which is in communication connection with the auxiliary control board 300 and the other end of which is in communication connection with the chip to be tested, for receiving a control signal from the auxiliary control board 300 and providing chip power to the chip to be tested according to the control signal, so as to restart the chip to be tested;

[0066] The control signal is obtained by the auxiliary control board 300 based on the combination of the preparation signal for burning and the successful burning signal.

[0067] In this embodiment, since the chip may be in an uncertain state after the firmware is burned, the chip needs to be restarted. It should be noted that the power supply of the chip can be provided by the burner 200, or it can be provided by the external power supply 400 controlled by the auxiliary control board 300. In this embodiment, the power supply is preferably set, and the power supply is controlled by the auxiliary control board 300 to restart the chip, which can ensure that the chip is initialized with a normal startup process, thereby ensuring that the chip can enter a normal working state after the restart, and prepare for subsequent functional testing.

[0068] In some of the embodiments, a programming interface is provided on the programmer 200, and the programmer 200 is communicatively connected with the chip to be programmed via the programming interface.

[0069] In the present embodiment, a dedicated channel is provided for data transmission when burning firmware by setting the burning interface, and the burning interface of the burner 200 is connected to the burning interface on the chip to be burned, which is distinguished from other functional interfaces of the chip, which helps to accurately and stably transmit to the chip when burning firmware, and avoids mutual interference with other functional signals of the chip. It should be noted that the burner 200 performs power supply and firmware burning at the same time, ensuring that the chip to be burned can burn firmware under suitable electrical conditions, and the power supply and burning are carried out simultaneously, which can also make the chip to be burned be in a stable electrical environment set by the burner 200 at the beginning. Since firmware burning is a process with high requirements for the electrical environment, the burner 200 needs accurate timing and signal control when writing data to the chip to be burned through the burning interface. The burner 200 burns while providing power to ensure that the timing requirements are met, and the power signal and the burning signal can be better coordinated.

[0070] like Figure 2 As shown, in some embodiments, the auxiliary control board 300 includes:

[0071] The processing chip 310, whose input signal terminal is used to receive the burning result signal of the burner 200, and whose control signal terminal is used to output a burning success signal or a burning failure signal to the burner station 100;

[0072] A switching circuit 320, one end of which is communicatively connected to the wireless output end of the processing chip 310, and the other end of which is communicatively connected to the chip to be tested via a radio frequency transceiver component;

[0073] The conversion circuit 330 has one end connected to the communication interface of the processing chip 310 and the other end connected to the communication interface of the chip to be tested.

[0074] In this embodiment, the processing chip 310 in the auxiliary control board 300 is provided with an input signal terminal and a control signal terminal, and is electrically connected to a power supply. Among them, the input signal terminal is used to receive the burning result signal of the burner 200, and the control signal terminal is used to output a burning success signal or a burning failure signal to the burning machine 100. It should be noted that the number of the input signal terminal and the control signal terminal on the processing chip 310 can be adjusted according to the number of control signals or input signals increased or decreased according to the burning or testing situation. At the same time, the auxiliary control board 300 is also provided with a switching circuit 320, and the processing chip 310 is also provided with a wireless output terminal, and the wireless output terminal can select to use the corresponding radio frequency transceiver component to communicate with the chip to be tested through the switching circuit 320.

[0075] In addition, the auxiliary control board 300 of this embodiment is also provided with a conversion circuit 330, and the processing chip 310 is also connected to a communication interface, and the communication interface of the processing chip 310 is connected to the communication interface of the chip under test through the conversion circuit 330. It should be noted that the addition of the conversion circuit 330 can realize the conversion between different levels, and can also prevent the level of the chip under test from being crosstalked from the auxiliary control board 300 to the chip end through the communication interface when the power is off, causing power-on timing problems.

[0076] Furthermore, the auxiliary control board of this embodiment is also connected with a signal connection line, and the number of the signal connection line is at least one. In actual application, the function of the corresponding interface can be detected by adding a signal connection line and connecting it to the interface of the chip. Specifically, after determining the interface to be detected, a signal connection line adapted thereto is selected to meet various detection requirements.

[0077] It can be seen that the chip communication interface and wireless transceiver testing are implemented through the auxiliary control board 300 of this embodiment, and the processing chip 310 on the auxiliary control board 300 of this embodiment is also provided with a signal connection line, which can be connected with other functional interfaces on the chip to be tested according to actual needs, to build a physical connection path, and further test the functional integrity of the chip.

[0078] The structures of the conversion circuit and the switching circuit will be described in detail below.

[0079] 1. Conversion circuit

[0080] The A end of the conversion circuit is connected to the communication interface RX of the chip under test, the B end is connected to the communication interface TX of the processing chip, the C end is connected to the communication interface TX of the chip under test, and the D end is connected to the communication interface RX of the processing chip. The resistance value and each device model in the conversion circuit can be adjusted according to the actual situation. Specifically:

[0081] like Figure 3As shown, in the circuit structure of this embodiment, the chip to be tested is directly connected to the communication interface of the processing chip 310 on the auxiliary control board, and a current limiting resistor R37 and a current limiting resistor R38 are reserved in the middle. Specifically, the two ends of the current limiting resistor R37 are respectively connected to the communication interface RX of the chip to be tested and the communication interface TX of the processing chip 310, and the resistance value is 510R; the two ends of the current limiting resistor R38 are respectively connected to the communication interface TX of the chip to be tested and the communication interface RX of the processing chip 310, and the resistance value is 510R.

[0082] like Figure 4 As shown, in the circuit structure of this embodiment, Schottky diode D4 and Schottky diode D5 are connected in series between the chip to be tested and the communication interface of the processing chip 310 on the auxiliary control board. Specifically, the anode of Schottky diode D4 is connected to the communication interface RX of the chip to be tested, and the cathode of Schottky diode D4 is connected to the communication interface TX of the processing chip 310; the anode of Schottky diode D5 is connected to the communication interface RX of the processing chip 310, and the cathode of Schottky diode D5 is connected to the communication interface TX of the chip to be tested. It should be noted that the conversion circuit of this embodiment can, to a certain extent, avoid the voltage crosstalk from the auxiliary control board end to the chip to be tested when the chip to be tested is powered off, thereby affecting the restart and reset of the chip to be tested.

[0083] like Figure 5 As shown, in the circuit structure of this embodiment, the collector of the NPN transistor Q3 is connected to one end of the resistor R36, and the other end of the resistor R36 is connected to the communication interface RX of the chip to be tested; the base of the NPN transistor Q3 is connected to one end of the resistor R35, and the other end of the resistor R35 is connected to the 3V3 power supply, one end of the resistor R34 is grounded, and the other end is connected between the resistor R35 and the base of the NPN transistor Q3; the emitter of the NPN transistor Q3 is connected to the communication interface TX of the processing chip 310. At the same time, the circuit structure of this embodiment also reserves a position for the capacitor C14 between the output terminal A and the ground, and a capacitor of appropriate capacitance can be connected according to the actual application situation. In addition, the resistance value of the resistor R36 in this embodiment is 120R, the resistance value of the resistor R35 is 1K, and the resistance value of the resistor R34 is 5.1K;

[0084] At the same time, the collector of the NPN transistor Q4 is connected to one end of the resistor R41, and the other end of the resistor R4 is connected to the communication interface RX of the processing chip 310; the base of the NPN transistor Q4 is connected to one end of the resistor R40, and the other end of the resistor R40 is connected to the 3V3 power supply, one end of the resistor R39 is grounded, and the other end is connected between the resistor R40 and the base of the NPN transistor Q4, and the bias circuit thus formed provides a suitable bias voltage for the base of the NPN transistor Q4 so that it can work normally; the emitter of the NPN transistor Q4 is connected to the communication interface TX of the processing chip 310. At the same time, the circuit structure of this embodiment also reserves a position for the capacitor C15 between the output terminal D and the ground, and a capacitor with a suitable capacitance can be connected according to the actual application situation. In addition, the resistance value of the resistor R41 is 120R, the resistance value of the resistor R40 is 1K, and the resistance value of the resistor R39 is 5.1K. The conversion circuit of this embodiment can, to a certain extent, prevent the voltage at the auxiliary control board end from crosstalking to the chip under test end when the chip under test is powered off, thereby affecting the restart and reset of the chip under test.

[0085] 2. Switching circuit

[0086] like Figure 6 As shown, the present embodiment reserves a π-type circuit, including a capacitor C20, a capacitor C21 and an inductor L3, and one end of the π-type circuit is connected to the RF_IO interface of the processing chip 310, and the other end adjusts the matching of the RF signal according to the actual situation, wherein, if an antenna is selected for RF communication test, the other end of the π-type circuit is connected to a 10pF capacitor C22, and the capacitor C22 is connected to the antenna E1 ANTENNA for transmitting and receiving RF signals, and the position of C23 on the circuit is suspended at this time; if an RF coaxial line is selected for RF communication test, the other end of the π-type circuit is connected to a 10pF capacitor C23, and the capacitor C23 is connected to pin 1 of the SMA connector, and pins 2 and 3 of the SMA connector are grounded, and the position of C22 on the circuit is suspended at this time, thereby realizing flexible switching of the circuit under different test conditions, and selecting the RF coaxial line to communicate with the chip to be tested according to the actual situation, or switching to the antenna to communicate with the chip to be tested wirelessly.

[0087] In some embodiments, the processing chip 310 is a SoC chip.

[0088] In this embodiment, the processing chip 310 is a wireless chip with a microprocessor, and is preferably a SoC chip. By using the SoC chip on the auxiliary control board 300, the complexity of the peripheral circuit and the area of ​​the circuit board can be reduced, the hardware design is simplified, and the efficiency of the entire chip burning and testing can be improved.

[0089] In some embodiments, the radio frequency transceiver component is any one of an antenna and a radio frequency cable.

[0090] In this embodiment, the processing chip selects to use an antenna or a radio frequency cable to communicate with the chip under test through a switching circuit. The use of an antenna does not require a physical connection, which provides more spatial freedom for chip testing and can better simulate the real environment. The radio frequency cable can provide a more stable and reliable signal transmission path, reduce signal loss and external interference during transmission, and ensure that the chip performance meets the design requirements. The antenna or radio frequency cable can be flexibly selected according to actual needs to ensure a comprehensive and accurate test of the wireless function of the chip.

[0091] In some embodiments, the number of input signal terminals on the processing chip 310 is at least one, and the number of control signal terminals on the processing chip 310 is at least one.

[0092] In this embodiment, the number of input signal terminals and control signal terminals on the processing chip 310 can be adjusted according to the number of control signals or input signals that are increased or decreased according to the burning or testing conditions. For example, different burners may provide different numbers and types of signals. By setting at least one input signal terminal, it can be adapted to various burners according to actual conditions, so that the processing chip 310 can more accurately grasp the burning conditions.

[0093] like Figure 7 As shown, in the second aspect, the embodiment of the present application provides a method for burning and testing a compatible wireless chip, which is implemented by using any of the above-mentioned systems for burning and testing a compatible wireless chip, and through the mutual cooperation between the burning machine 100, the burner 200 and the auxiliary control board 300, the chip firmware burning and testing are ensured to proceed smoothly, and the method specifically includes the following steps:

[0094] S100, after placing the chip to be burned on the burning seat 110 of the burning machine 100, the burning machine 100 sends a signal to prepare burning to the burner 200 and the auxiliary control board 300;

[0095] In this step, the burning machine 100 automatically imports the chip into the burning seat 110, realizing the automation of the preparation work before burning, improving the operation efficiency and accuracy, and laying the foundation for the subsequent stable burning and testing process of the chip. This step is the beginning of building a working hardware system to ensure that the chip starts burning and testing in the correct position.

[0096] S200, after receiving the signal for preparing to burn, the burner 200 outputs chip power to the chip to be burned, burns the firmware to the chip to be burned through the burning interface, and actively cuts off the power after the burning is completed, and sends a burning result signal to the auxiliary control board 300;

[0097] In this step, power supply and firmware burning are carried out simultaneously by the burner 200 to ensure that the chip to be burned can burn firmware under suitable electrical conditions. The burner 200 can provide suitable voltage and current according to the electrical specification requirements of the chip, and the burning of the power supply can also make the chip to be burned be in a stable electrical environment set by the burner 200 at the beginning. Firmware burning is a process that has high requirements for the electrical environment. The burner 200 needs accurate timing and signal control when writing data to the chip to be burned through the burning interface. The burner 200 burns while providing power to ensure that the timing requirements are met, and the power signal and the burning signal can be better coordinated. The setting of the burning interface ensures the accuracy and stability of data transmission, and provides a dedicated channel for chip burning.

[0098] S300, the auxiliary control board 300 sends a burning success signal or a burning failure signal to the burning machine 100 according to the burning result signal, and sends a test instruction to the chip to be tested that has been burned successfully and restarted through the communication interface;

[0099] In this step, the auxiliary control board 300 sends a corresponding failure or success signal to the burning machine 100 according to the received burning result signal, and also controls the power supply to restart the chip that has been successfully burned, simulating the startup process in the actual use scenario, preparing for the subsequent functional test, and ensuring that the chip enters the test phase in a normal state. Here, it should be noted that the chip to be burned in step S200 is successfully burned with firmware by the burner 200, and the restart is completed, which is the chip to be tested in this step. In addition, the auxiliary control board 300 sends the test instruction by delaying, and performs a wireless signal receiving and sending test after the chip restarts, and comprehensively detects the wireless function of the chip, thereby providing a guarantee for the function of the shipped chip.

[0100] S400, after receiving the test instruction, the chip to be tested performs a wireless signal transmission and reception test through the radio frequency transceiver component, and returns the corresponding wireless transmission and reception test result to the auxiliary control board 300 through the communication interface.

[0101] In this step, after the chip to be tested receives the test instruction sent by the communication interface of the auxiliary control board 300, it performs a transceiver test with the auxiliary control board 300 through an antenna or a radio frequency cable, and the chip feeds back the wireless transceiver test result to the auxiliary control board 300 through the communication interface, so that the auxiliary control board 300 can receive the feedback information of the chip. That is, by integrating the functional test of the chip into the chip burning process, the accuracy of the chip burning firmware can be guaranteed, and the function of the shipped chip can be ensured to avoid the batch problem of the client product or the problem of unclear responsibility.

[0102] In some embodiments, it also includes:

[0103] S500, the auxiliary control board 300 controls the burning machine 100 to perform centralized chip packaging according to the receiving and sending test results;

[0104] When the result of the receiving and sending test is a test failure, the burning machine 100 classifies the tested chip as an NG chip and performs centralized packaging;

[0105] When the result of the transceiver test is that the test is successful, the burning machine 100 classifies the tested chips as OK chips and performs centralized packaging.

[0106] In this embodiment, after the auxiliary control board 300 receives the feedback information of the chip through the communication interface, it controls the burning machine 100, processes, classifies and packages the chips according to the test results after the test, and clearly distinguishes between OK chips and NG chips, which is convenient for production management and provides a clear basis for responsibility tracing for possible quality problems, solving the problem of unclear responsibilities in traditional processes.

[0107] In some of the embodiments, the restart of the chip under test is achieved based on the auxiliary control board 300 controlling the power supply in combination with the ready-to-burn signal and the successful-burn signal.

[0108] In this embodiment, before testing the chip, it is necessary to restart the chip to initialize it so that it can enter the subsequent test phase in a stable state. The chip restart is determined by the auxiliary control board 300 in combination with the initially received preparation for burning signal and the current burning success signal, and the power supply is controlled to restart the chip to avoid the accuracy of the test result being affected by the temporary state or residual information during the burning process.

[0109] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0110] Unless otherwise defined, the technical terms or scientific terms involved in this application should be understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "one", "the" and the like involved in this application do not indicate a quantitative limitation and may represent the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in this application are intended to cover non-exclusive inclusions. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but include electrical connections, whether direct or indirect. The "multiple" involved in this application refers to two or more, and "and / or" describes the association relationship of associated objects, indicating that three relationships may exist. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. The terms "first", "second", "third" and the like involved in this application are merely to distinguish similar objects and do not represent a specific ordering of objects.

[0111] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but the limitation of the scope of the invention patent cannot be understood as a result. It should be pointed out that, for a person of ordinary skill in the art, several variations or improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A system compatible with wireless chip burning and testing, characterized in that: include: The burning machine is used to place the chip to be burned and send the signal to prepare for burning; A burner, which is in communication connection with the burner station, is used to receive the burn-ready signal, and provide chip power to the chip to be burned, and after burning the firmware of the chip to be burned, it cuts off the power and outputs a corresponding burn result signal; an auxiliary control board, which is in communication connection with the burner station and the burner, and is used to receive the burn preparation signal and the burn result signal, and send a corresponding burn success signal or burn failure signal to the burner station according to the burn result signal; and The auxiliary control board is also used to send a test instruction to the chip under test that has been successfully burned and restarted, and receive a wireless transceiver test result of the chip under test.

2. The system for programming and testing compatible wireless chips according to claim 1, characterized in that: The burning machine is provided with a burning seat; The programming seat is located at the front side of the programming machine and is used for clamping the chip to be programmed.

3. The system for programming and testing compatible wireless chips according to claim 1, characterized in that: Also includes: A power supply, one end of which is communicatively connected to the auxiliary control board and the other end of which is communicatively connected to the chip under test, for receiving a control signal from the auxiliary control board and providing chip power to the chip under test according to the control signal to restart the chip under test; The control signal is obtained by the auxiliary control board based on the combination of the preparation signal for burning and the successful burning signal.

4. The system for programming and testing compatible wireless chips according to claim 1, characterized in that: The programmer is provided with a programming interface, and the programmer is connected to the chip to be programmed through the programming interface.

5. The system for programming and testing compatible wireless chips according to any one of claims 1 to 4, characterized in that: The auxiliary control panel comprises: A processing chip, whose input signal terminal is used to receive the burning result signal of the burner, and whose control signal terminal is used to output the burning success signal or the burning failure signal to the burner; A switching circuit, one end of which is communicatively connected to the wireless output end of the processing chip, and the other end of which is communicatively connected to the chip to be tested via a radio frequency transceiver component; A conversion circuit has one end connected to the communication interface of the processing chip and the other end connected to the communication interface of the chip to be tested.

6. The system for programming and testing compatible wireless chips according to claim 5, characterized in that: The processing chip is a SoC chip.

7. The system for programming and testing compatible wireless chips according to claim 5, characterized in that: The radio frequency transceiver component is any one of an antenna and a radio frequency cable.

8. A method for programming and testing a compatible wireless chip, implemented by the system for programming and testing a compatible wireless chip according to any one of claims 1 to 7, characterized in that: The steps include: After placing the chip to be burned on the burning seat of the burning machine, the burning machine sends a signal to prepare burning to the burner and the auxiliary control board; After receiving the signal for preparing to burn, the burner outputs chip power to the chip to be burned, burns firmware to the chip to be burned through the burning interface, and actively cuts off power after burning is completed, and sends a burning result signal to the auxiliary control board; The auxiliary control board sends a burning success signal or a burning failure signal to the burning machine according to the burning result signal, and sends a test instruction to the chip to be tested that has been burned successfully and restarted through the communication interface; After receiving the test instruction, the chip to be tested performs a wireless signal transceiving test through a radio frequency transceiving component, and returns the corresponding wireless transceiving test result to the auxiliary control board through a communication interface.

9. The method for programming and testing a compatible wireless chip according to claim 8, characterized in that: Also includes: The auxiliary control board controls the burning machine to perform centralized chip packaging according to the receiving and sending test results; Wherein, when the result of the receiving and sending test is a test failure, the burning machine classifies the tested chip as an NG chip and performs centralized packaging; When the receiving and sending test result is a success, the burning machine classifies the tested chips as OK chips and performs centralized packaging.

10. The method for burning and testing compatible wireless chips according to claim 8, wherein the restart of the chip to be tested is achieved based on the auxiliary control board controlling the power supply in combination with the preparation burning signal and the burning success signal.

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