Steel plate spring modeling method and device, electronic equipment and storage medium
By establishing the steel leaf spring parameter table and adjusting the initial sketch, the problem of redrawing of the steel leaf spring model adjustment in the existing technology is solved, and rapid update and efficient modeling are achieved.
Patent Information
- Application Number
- CN202411998411.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-05-06
AI Technical Summary
The existing steel sheet spring modeling method cannot be updated through parameterization, resulting in the need to be re-drawn when adjusting the model, wasting a lot of modeling time.
By obtaining multiple spring parameters of the target steel sheet spring, calculating the curvature radius value and the target angle value, establishing a steel sheet spring parameter table, drawing the initial sketch in turn and adjusting it to generate the target steel sheet spring model.
It realizes rapid update of the steel leaf spring model, saves the time and effort spent on remodeling, and improves work efficiency.
Smart Images

Figure CN119939808A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of automobile components, and in particular to a modeling method, device, electronic device and storage medium for a leaf spring. Background Art
[0002] Leaf spring suspension is a common suspension structure for automobiles. Leaf springs, as important load-bearing components of chassis suspension, affect the appearance, size and posture of the vehicle and need to meet regulatory requirements. In the early stage of vehicle model development, frequent adjustments to the leaf spring posture, size specifications and structure type are essential to meet the vehicle posture and load requirements.
[0003] At present, the modeling method of leaf springs is usually to use 3D software to form the outline of the leaf spring using line segments in the sketch module, and then generate a digital model through operations such as stretching and thickening. However, the existing modeling method is to draw the leaf spring model according to the layout position of the whole vehicle. When the model needs to be adjusted, it can only be redrawn, and it cannot be updated in a parametric way, which leads to a lot of waste of modeling time. Summary of the invention
[0004] In order to solve the above technical problems, the embodiments of the present application provide a modeling method, device, electronic device and storage medium for a leaf spring.
[0005] In a first aspect, an embodiment of the present application provides a modeling method for a leaf spring, the method comprising: obtaining a plurality of spring parameters of a target leaf spring;
[0006] Obtaining a plurality of curvature radius values and a plurality of target angle values respectively according to the spring parameters;
[0007] Establishing a leaf spring parameter table according to each of the curvature radius values, each of the target angle values and each of the spring parameters;
[0008] A plurality of initial sketches are drawn in sequence according to the leaf spring parameter table, and each of the initial sketches is adjusted, and a target leaf spring model is generated according to the adjusted target sketch.
[0009] In one embodiment, the spring parameters include: a spring leaf length value, a spring height value, and an arc height value;
[0010] A plurality of curvature radius values are obtained according to the spring parameters, including:
[0011] The spring leaf length value, the spring height value and the arc height value of the first leaf spring are calculated according to the curvature radius calculation formula to obtain the curvature radius value of the first leaf spring, wherein the curvature radius calculation formula is:
[0012]
[0013] Wherein, R0 is the curvature radius value of the first leaf spring, L1 is the spring leaf length value of the first leaf spring, and H0 is the arc height value of the first leaf spring;
[0014] The curvature radius value of the i-th leaf spring is determined according to the spring parameters and the curvature radius value of the i-1th leaf spring, where i≥2.
[0015] In one embodiment, a plurality of target angle values are obtained according to each of the spring parameters, including:
[0016] Calculate the curvature radius of the j-th leaf spring according to the angle calculation formula to obtain the target angle value of the j-th leaf spring, j≥1;
[0017] The angle calculation formula is:
[0018]
[0019] Wherein, θ is the target angle of the j-th leaf spring, L j is the length of the spring leaf of the j-th leaf spring, and R0 is the radius of curvature of the j-th leaf spring.
[0020] In one embodiment, the spring parameters further include: a spring thickness value;
[0021] The sum of the spring thickness value and the curvature radius value of the i-1th sheet is determined as the curvature radius value of the i-th sheet.
[0022] In one implementation, the length value of the spring piece of the j-th piece is determined according to the length value of the spring piece of the j-1th piece and a preset suspension offset frequency.
[0023] In one embodiment, the spring parameters further include: a spring width value;
[0024] Draw a plurality of initial sketches in sequence according to the curvature radius values and the target angle values;
[0025] The initial sketches are adjusted in sequence according to the spring width value and the spring thickness value, and the target leaf spring model is generated according to the adjusted multiple target sketches.
[0026] In one embodiment, the leaf spring of each of the initial sketches is stretched according to the spring width value;
[0027] Performing thickening processing on the leaf spring of each of the initial sketches according to the spring thickness value;
[0028] The leaf spring of each of the initial sketches is rounded according to the spring thickness value.
[0029] In a second aspect, an embodiment of the present application provides a modeling device for a leaf spring, the modeling device for a leaf spring comprising:
[0030] An acquisition module, used for acquiring multiple spring parameters of a target leaf spring;
[0031] A calculation module, used for respectively obtaining a plurality of curvature radius values and a plurality of target angle values according to each of the spring parameters;
[0032] An establishing module, used for establishing a leaf spring parameter table according to each of the curvature radius values, each of the target angle values and each of the spring parameters;
[0033] The adjustment module is used to draw a plurality of initial sketches in sequence according to the leaf spring parameter table, adjust each of the initial sketches, and generate a target leaf spring model according to the adjusted target sketch.
[0034] In a third aspect, an embodiment of the present application provides an electronic device, including a memory and a processor, wherein the memory is used to store a computer program, and when the computer program is run by the processor, the modeling method of the leaf spring provided in the first aspect is executed.
[0035] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium storing a computer program, which, when executed on a processor, executes the leaf spring modeling method provided in the first aspect.
[0036] The present application provides a leaf spring modeling method, device, electronic device and storage medium, wherein the method includes: obtaining multiple spring parameters of the target leaf spring; obtaining multiple curvature radius values and multiple target angle values according to each of the spring parameters; establishing a leaf spring parameter table according to each of the curvature radius values, each of the target angle values and each of the spring parameters; drawing multiple initial sketches in sequence according to the leaf spring parameter table, and adjusting each of the initial sketches, and generating a target leaf spring model according to the adjusted target sketch. Through the provided solution, the leaf spring model can be updated in a timely manner through parameters, saving time and energy consumed by remodeling, and further improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0037] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present application and should not be regarded as limiting the scope of protection of the present application. In each of the drawings, similar components are numbered similarly.
[0038] Figure 1 A schematic diagram of a process of a leaf spring modeling method provided in an embodiment of the present application is shown;
[0039] Figure 2 A schematic diagram of an initial sketch of a modeling method for a leaf spring provided in an embodiment of the present application is shown;
[0040] Figure 3 Another initial sketch diagram of the modeling method of the leaf spring provided in the embodiment of the present application is shown;
[0041] Figure 4 Another initial sketch diagram of the modeling method of the leaf spring provided in the embodiment of the present application is shown;
[0042] Figure 5 A schematic diagram of a target leaf spring model is shown in a modeling method of a leaf spring provided in an embodiment of the present application;
[0043] Figure 6 A structural schematic diagram of a modeling device for a leaf spring provided in an embodiment of the present application is shown;
[0044] Figure 7 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application is shown.
[0045] Icons: 600 - modeling device of leaf spring, 601 - acquisition module, 602 - calculation module, 603 - establishment module, 604 - adjustment module, 700 - electronic device, 701 - transceiver, 702 - processor, 703 - memory. DETAILED DESCRIPTION
[0046] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.
[0047] The components of the embodiments of the present application generally described and shown in the drawings herein may be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.
[0048] Hereinafter, the terms "including", "having" and their cognates, which may be used in various embodiments of the present application, are intended only to indicate specific features, numbers, steps, operations, elements, components, or combinations of the foregoing items, and should not be understood as first excluding the existence of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing items or adding the possibility of one or more features, numbers, steps, operations, elements, components, or combinations of the foregoing items.
[0049] Furthermore, the terms “first”, “second”, “third”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.
[0050] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as those generally understood by those skilled in the art to which the various embodiments of the present application belong. The terms (such as those defined in generally used dictionaries) will be interpreted as having the same meanings as the contextual meanings in the relevant technical field and will not be interpreted as having idealized meanings or overly formal meanings unless clearly defined in the various embodiments of the present application.
[0051] Example 1
[0052] An embodiment of the present application provides a modeling method for a leaf spring.
[0053] See also Figure 1 , the modeling methods of leaf springs include:
[0054] S101, obtaining multiple spring parameters of a target leaf spring.
[0055] In this embodiment, the leaf spring is set according to the overall requirements of the vehicle, such as total mass, front and rear axle loads, wheelbase, offset frequency and ground clearance, and the set leaf spring is used as the target leaf spring, and various parameters of the target leaf spring are collected.
[0056] S102, respectively obtaining a plurality of curvature radius values and a plurality of target angle values according to the spring parameters.
[0057] In the embodiment of the present application, various parameters of the target leaf spring are collected by establishing an EXCEL table, the curvature radius value and the target angle value are calculated by the various parameters, and the curvature radius value and the target angle value are filled in the table, thereby completing the establishment of the table. In other embodiments, data collection can be performed through other documents that can record data, which is not limited in this application.
[0058] In one embodiment, the spring parameters include: a spring length value, a spring height value, and an arc height value; and a plurality of curvature radius values are obtained according to each of the spring parameters, including:
[0059] The spring leaf length value, the spring height value and the arc height value of the first leaf spring are calculated according to the curvature radius calculation formula to obtain the curvature radius value of the first leaf spring, wherein the curvature radius calculation formula is:
[0060]
[0061] Wherein, R0 is the curvature radius value of the first leaf spring, L1 is the spring leaf length value of the first leaf spring, and H0 is the arc height value of the first leaf spring;
[0062] The curvature radius value of the i-th leaf spring is determined according to the spring parameters and the curvature radius value of the i-1th leaf spring, where i≥2.
[0063] Optionally, the sum of the spring thickness value and the curvature radius value of the (i-1)th sheet is determined as the curvature radius value of the i-th sheet.
[0064] It should be noted that the spring parameters also include the number of leaf springs that need to be modeled. For example, if a digital model of eight leaf springs needs to be established, the curvature radius value of the first leaf spring is calculated using the curvature radius calculation formula, and the curvature radius values of the remaining second to eighth leaf springs are determined by the sum of the spring thickness value and the curvature radius value of the previous leaf spring.
[0065] It is further explained that the spring thickness values of each leaf spring are equal, and the corresponding angle can be calculated by obtaining the curvature diameter, where the curvature diameter value is twice the curvature radius value.
[0066] In one embodiment, the curvature radius of the j-th leaf spring is calculated according to an angle calculation formula to obtain the target angle value of the j-th leaf spring, where j≥1;
[0067] The angle calculation formula is:
[0068]
[0069] Wherein, θ is the target angle of the j-th leaf spring, L j is the length of the spring leaf of the j-th leaf spring, and R0 is the radius of curvature of the j-th leaf spring.
[0070] It should be noted that the sketch is established in sequence according to the leaf spring parameter table based on the target angle value and curvature radius value of the leaf spring. For example, if the spring parameter setting has eight leaf springs, the initial sketch is established in sequence from the first leaf spring to the eighth leaf spring through the leaf spring parameter table.
[0071] In one implementation, the length value of the spring piece of the j-th piece is determined according to the length value of the spring piece of the j-1th piece and a preset suspension offset frequency.
[0072] It should be noted that the length of the spring leaf of the first leaf and the length of the spring leaf of the second leaf are set to the same length value, and the spring parameters also include: suspension mass and suspension frequency deviation. The leaf spring stiffness is calculated according to the formula, and then the leaf spring thickness and leaf spring width are estimated based on the leaf spring stiffness.
[0073] The calculation formula of leaf spring stiffness is:
[0074]
[0075] Among them, n is the suspension offset frequency, m is the suspension mass, and C is the leaf spring stiffness.
[0076] According to the main leaf spring length L and leaf spring thickness h, the length of each leaf spring is calculated using the drawing method. Specifically, the leaf spring length value, the suspension frequency deviation and the center distance of the leaf spring on the bridge housing are determined by the spring parameters, where the leaf spring length value is the length value of the first leaf spring. The ordinate in the drawing method is the cube of the spring thickness value, the abscissa is half of the length of the first leaf spring, and the length of the last horizontal line is half of the center distance of the leaf spring on the bridge housing. By connecting the end of the last line and the end of the second line, the horizontal length of the intersection of the horizontal line and the oblique line is half of the length of the corresponding leaf spring. The distance between the intersection and the ordinate is the length of the corresponding spring leaf.
[0077] S103, establishing a leaf spring parameter table according to the curvature radius values, the target angle values and the spring parameters. Specifically, as shown in Table 1:
[0078] Table 1 Leaf spring parameters
[0079]
[0080]
[0081] S104, drawing a plurality of initial sketches in sequence according to the leaf spring parameter table, adjusting each of the initial sketches, and generating a target leaf spring model according to the adjusted target sketch.
[0082] In one embodiment, the spring parameters also include: a spring width value; drawing a plurality of initial sketches in sequence according to each of the curvature radius values and each of the target angle values; adjusting each of the initial sketches in sequence according to the spring width value and the spring thickness value, and generating the target leaf spring model according to the adjusted plurality of target sketches.
[0083] Optionally, the leaf spring of each of the initial sketches is stretched according to the spring width value; the leaf spring of each of the initial sketches is thickened according to the spring thickness value; and the leaf spring of each of the initial sketches is rounded according to the spring thickness value.
[0084] In this embodiment, the conditioning is performed in the following steps in sequence: Figure 2 As shown in the figure, stretch the width of the initial sketch to the spring width value in the leaf spring parameter table, such as Figure 3 As shown in the figure, the initial sketch after stretching is thickened to the spring thickness value in the leaf spring parameter table, as shown in the figure. Figure 4 As shown in the figure, the initial sketch that has been thickened is rounded according to half the spring thickness value to finally obtain the target sketch.
[0085] It should be noted that according to the leaf number sequence of the leaf spring parameter table, the leaf spring is sketched and stretched, thickened, and rounded in sequence, and the digital modeling of multiple leaf springs is generated in sequence to generate the target leaf spring model. Figure 5 shown.
[0086] It is further explained that if the vehicle demand changes, resulting in changes in the leaf spring parameters, the leaf spring values in the leaf spring parameter table will be adjusted.
[0087] For example: when the layout of the whole vehicle is difficult, if it is required to reduce the length of the leaf spring, then the length value of the leaf spring leaf should be reduced, and the remaining length value of the leaf spring leaf will change accordingly; when the total weight of the whole vehicle changes, the spring thickness value and spring width value in the leaf spring parameter table are adjusted; when the height of the whole vehicle from the ground changes, the spring curvature height value is adjusted.
[0088] If the value is adjusted, the curvature radius and target angle of each leaf spring need to be recalculated in the leaf spring parameter table. When the data in the leaf spring parameter table is updated, the digital model needs to be updated. In the initial sketch, the curvature radius and target angle values are adjusted piece by piece according to the values in the leaf spring parameter table. The digital model will be updated in time according to the parameters without the need to rebuild the model.
[0089] The modeling method of the leaf spring provided in this embodiment includes: obtaining multiple spring parameters of the target leaf spring; obtaining multiple curvature radius values and multiple target angle values according to each of the spring parameters; establishing a leaf spring parameter table according to each of the curvature radius values, each of the target angle values and each of the spring parameters; drawing multiple initial sketches in sequence according to the leaf spring parameter table, and adjusting each of the initial sketches, and generating a target leaf spring model according to the adjusted target sketch. Through the provided scheme, the model of the leaf spring can be updated in time through parameters, saving time and energy consumed by remodeling, and further improving work efficiency.
[0090] Example 2
[0091] In addition, an embodiment of the present application provides a modeling device for a leaf spring.
[0092] like Figure 6 As shown, the modeling device 600 of the leaf spring includes:
[0093] An acquisition module 601 is used to acquire multiple spring parameters of a target leaf spring;
[0094] A calculation module 602, used for respectively obtaining a plurality of curvature radius values and a plurality of target angle values according to the spring parameters;
[0095] Establishing module 603, used for establishing a leaf spring parameter table according to each of the curvature radius values, each of the target angle values and each of the spring parameters;
[0096] The adjustment module 604 is used to draw a plurality of initial sketches in sequence according to the leaf spring parameter table, adjust each of the initial sketches, and generate a target leaf spring model according to the adjusted target sketch.
[0097] The leaf spring modeling device 600 provided in this embodiment can implement the leaf spring modeling method provided in Example 1, and will not be described again here to avoid repetition.
[0098] The modeling device of the leaf spring provided in this embodiment includes the following methods: obtaining multiple spring parameters of the target leaf spring; obtaining multiple curvature radius values and multiple target angle values according to each of the spring parameters; establishing a leaf spring parameter table according to each of the curvature radius values, each of the target angle values and each of the spring parameters; drawing multiple initial sketches in sequence according to the leaf spring parameter table, and adjusting each of the initial sketches, and generating a target leaf spring model according to the adjusted target sketch. Through the provided scheme, the model of the leaf spring can be updated in time through parameters, saving the time and energy consumed by remodeling, and further improving work efficiency.
[0099] Example 3
[0100] In addition, an embodiment of the present application provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and when the computer program runs on the processor, the modeling method of the leaf spring provided in Example 1 is executed.
[0101] For details, see Figure 7 The electronic device 700 includes: a transceiver 701, a bus interface and a processor 702, wherein the processor 702 is used to: obtain multiple spring parameters of a target leaf spring; obtain multiple curvature radius values and multiple target angle values according to each of the spring parameters; establish a leaf spring parameter table according to each of the curvature radius values, each of the target angle values and each of the spring parameters; draw multiple initial sketches in sequence according to the leaf spring parameter table, adjust each of the initial sketches, and generate a target leaf spring model according to the adjusted target sketches.
[0102] In one embodiment, the processor 702 is further configured to: the spring parameters include: a spring leaf length value, a spring height value, and an arc height value;
[0103] A plurality of curvature radius values are obtained according to the spring parameters, including:
[0104] The spring leaf length value, the spring height value and the arc height value of the first leaf spring are calculated according to the curvature radius calculation formula to obtain the curvature radius value of the first leaf spring, wherein the curvature radius calculation formula is:
[0105]
[0106] Among them, R0 is the curvature radius value of the first leaf spring, L1 is the spring leaf length value of the first leaf spring, and H0 is the curvature height value of the first leaf spring; the curvature radius value of the i-th leaf spring is determined according to the spring parameters and the curvature radius value of the i-1th leaf spring, where i≥2.
[0107] In one embodiment, the processor 702 is further configured to: calculate the curvature radius of the j-th leaf spring according to an angle calculation formula to obtain the target angle value of the j-th leaf spring, where j≥1;
[0108] The angle calculation formula is:
[0109]
[0110] Wherein, θ is the target angle of the j-th leaf spring, L j is the length of the spring leaf of the j-th leaf spring, and R0 is the radius of curvature of the j-th leaf spring.
[0111] In one embodiment, the processor 702 is further configured to: the spring parameters further include: a spring thickness value;
[0112] The step of determining the curvature radius value of the i-th leaf spring according to the spring parameter and the curvature radius value of the i-1th leaf spring comprises:
[0113] The sum of the spring thickness value and the curvature radius value of the i-1th sheet is determined as the curvature radius value of the i-th sheet.
[0114] In one implementation, the processor 702 is further configured to determine the length value of the spring piece of the j-th piece according to the length value of the spring piece of the j-1-th piece and a preset suspension offset frequency.
[0115] In one embodiment, the processor 702 is further configured to: the spring parameters further include: a spring width value;
[0116] Draw a plurality of initial sketches in sequence according to the curvature radius values and the target angle values;
[0117] The initial sketches are adjusted in sequence according to the spring width value and the spring thickness value, and the target leaf spring model is generated according to the adjusted multiple target sketches.
[0118] In one embodiment, the processor 702 is further configured to: perform stretching processing on the leaf spring of each of the initial sketches according to the spring width value;
[0119] Performing thickening processing on the leaf spring of each of the initial sketches according to the spring thickness value;
[0120] The leaf spring of each of the initial sketches is rounded according to the spring thickness value.
[0121] In the embodiment of the present application, the electronic device 700 further includes: a memory 703. Figure 7 In the embodiment, the bus architecture may include any number of interconnected buses and bridges, specifically connecting various circuits of one or more processors represented by processor 702 and memory represented by memory 703. The bus architecture may also connect various other circuits such as peripherals, voltage regulators, and power management circuits, which are well known in the art and are therefore not further described herein. The bus interface provides an interface. The transceiver 701 may be a plurality of components, i.e., including a transmitter and a receiver, providing a unit for communicating with various other devices on a transmission medium. The processor 702 is responsible for managing the bus architecture and general processing, and the memory 703 may store data used by the processor 702 when performing operations.
[0122] The electronic device 700 provided in the embodiment of the present application can execute the steps of the modeling method of the leaf spring provided in the above method embodiment 1, which will not be described again here to avoid repetition.
[0123] The electronic device provided in this embodiment can timely update the model of the leaf spring through parameters, saving the time and energy consumed in re-modeling, and further improving work efficiency.
[0124] Example 4
[0125] The present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the modeling method of the leaf spring provided in Example 1 is implemented.
[0126] In this embodiment, the computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.
[0127] The computer-readable storage medium provided in this embodiment can implement the modeling method of the leaf spring provided in Example 1, and will not be described again here to avoid repetition.
[0128] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or terminal including the element.
[0129] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for a terminal (which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods described in each embodiment of the present application.
[0130] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.
Claims
1. A modeling method for a leaf spring, characterized in that: The method comprises: Obtain multiple spring parameters of a target leaf spring; Obtaining a plurality of curvature radius values and a plurality of target angle values respectively according to the spring parameters; Establishing a leaf spring parameter table according to each of the curvature radius values, each of the target angle values and each of the spring parameters; A plurality of initial sketches are drawn in sequence according to the leaf spring parameter table, and each of the initial sketches is adjusted, and a target leaf spring model is generated according to the adjusted target sketch.
2. The modeling method of a leaf spring according to claim 1, characterized in that: The spring parameters include: spring leaf length value, spring height value and arc height value; The obtaining of a plurality of curvature radius values according to each of the spring parameters comprises: The spring leaf length value, the spring height value and the arc height value of the first leaf spring are calculated according to the curvature radius calculation formula to obtain the curvature radius value of the first leaf spring, wherein the curvature radius calculation formula is: Wherein, R0 is the curvature radius value of the first leaf spring, L1 is the spring leaf length value of the first leaf spring, and H0 is the arc height value of the first leaf spring; The curvature radius value of the i-th leaf spring is determined according to the spring parameters and the curvature radius value of the i-1th leaf spring, where i≥2.
3. The modeling method of a leaf spring according to claim 2, characterized in that: The step of obtaining a plurality of target angle values according to the spring parameters comprises: Calculate the curvature radius of the j-th leaf spring according to the angle calculation formula to obtain the target angle value of the j-th leaf spring, j≥1; The angle calculation formula is: Wherein, θ is the target angle of the j-th leaf spring, L j is the length of the spring leaf of the j-th leaf spring, and R0 is the radius of curvature of the j-th leaf spring.
4. The modeling method of a leaf spring according to claim 3, characterized in that: The spring parameters also include: spring thickness value; The step of determining the curvature radius value of the i-th leaf spring according to the spring parameter and the curvature radius value of the i-1th leaf spring comprises: The sum of the spring thickness value and the curvature radius value of the i-1th sheet is determined as the curvature radius value of the i-th sheet.
5. The modeling method of a leaf spring according to claim 4, characterized in that: The step of obtaining the length value of the spring leaf of the j-th leaf spring comprises: The length value of the spring piece of the j-th piece is determined according to the length value of the spring piece of the j-1th piece and a preset suspension offset frequency.
6. The modeling method of a leaf spring according to claim 5, characterized in that: The spring parameters also include: spring width value; The method of sequentially drawing a plurality of initial sketches according to the leaf spring parameter table, adjusting each of the initial sketches, and generating a target leaf spring model according to the adjusted target sketches includes: Draw a plurality of initial sketches in sequence according to the curvature radius values and the target angle values; The initial sketches are adjusted in sequence according to the spring width value and the spring thickness value, and the target leaf spring model is generated according to the adjusted multiple target sketches.
7. The modeling method of a leaf spring according to claim 6, characterized in that: The step of sequentially adjusting each of the initial sketches according to the spring width value and the spring thickness value includes: Performing stretching processing on the leaf spring of each of the initial sketches according to the spring width value; Performing thickening processing on the leaf spring of each of the initial sketches according to the spring thickness value; The leaf spring of each of the initial sketches is rounded according to the spring thickness value.
8. A modeling device for a leaf spring, characterized in that: The device comprises: An acquisition module, used for acquiring multiple spring parameters of a target leaf spring; A calculation module, used for respectively obtaining a plurality of curvature radius values and a plurality of target angle values according to each of the spring parameters; An establishing module, used for establishing a leaf spring parameter table according to each of the curvature radius values, each of the target angle values and each of the spring parameters; The adjustment module is used to draw a plurality of initial sketches in sequence according to the leaf spring parameter table, adjust each of the initial sketches, and generate a target leaf spring model according to the adjusted target sketch.
9. An electronic device, characterized in that: The invention comprises a memory and a processor, wherein the memory stores a computer program, and when the computer program is run on the processor, the modeling method of the leaf spring according to any one of claims 1 to 7 is executed.
10. A computer-readable storage medium, characterized in that: The computer program is stored therein, and when the computer program is run on a processor, the modeling method of the leaf spring according to any one of claims 1 to 7 is executed.
Citation Information
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