Display device and method of manufacturing same

Abstract

A display device and a method of manufacturing the same are provided. The display device includes a display panel including a panel pad portion. The display device includes a circuit board below the display panel and including a circuit pad portion at least partially exposed from the display panel in a plan view. The display device includes a connection member electrically connecting the panel pad portion and the circuit pad portion.

Description

Technical Field

[0001] The present disclosure relates to a display device, and more particularly to a display device having a chip-on-film structure and a method for manufacturing the display device. Background Art

[0002] Typically, a spliced ​​display device may include multiple display devices for realizing a large screen. In some cases, a frame located at a boundary between display devices may be visible to a user, which may degrade the display quality of the spliced ​​display device. Summary of the invention

[0003] The embodiment provides a display device with improved display quality.

[0004] Embodiments provide a method for manufacturing a display device having improved display quality.

[0005] According to an embodiment, a display device includes a display panel, a circuit board, and a connecting member, the display panel includes a panel pad portion, the circuit board is below the display panel and includes a circuit pad portion, wherein the circuit pad portion is at least partially exposed from the display panel in a plan view, and the connecting member electrically connects the panel pad portion and the circuit pad portion.

[0006] In an embodiment, one end of the connection member may be bonded to an upper surface of the panel pad portion, and the other end of the connection member may be bonded to an upper surface of a portion of the circuit pad portion exposed from the display panel.

[0007] In an embodiment, the connection member may extend from an upper surface of the panel pad portion to an upper surface of the circuit pad portion along a side surface of the panel pad portion.

[0008] In an embodiment, a side surface of the panel pad portion may define a portion of an outline of the display panel in a plan view.

[0009] In an embodiment, the portion of the outline located on the circuit board may have a straight line shape, a curved line shape, a concave-convex shape, or a zigzag shape in a plan view.

[0010] In an embodiment, the connection member may not be arranged on the lower surface of the display panel.

[0011] In an embodiment, the connection member may include an electrically conductive material.

[0012] In an embodiment, at least a portion of the circuit pad portion may overlap the display panel in a plan view.

[0013] In an embodiment, the circuit pad part may be attached to a lower surface of the display panel.

[0014] In an embodiment, the circuit pad portion may be located below the panel pad portion.

[0015] In an embodiment, at least a portion of the circuit pad portion may be exposed from the panel pad portion in a plan view.

[0016] In an embodiment, at least a portion of the circuit pad portion may overlap the panel pad portion in a plan view.

[0017] In an embodiment, the display device may further include a protection member disposed on the connection member and covering at least a portion of the connection member.

[0018] In an embodiment, a circuit board may include a flexible film having a circuit pad part arranged thereon and a driving chip mounted on the flexible film.

[0019] A method for manufacturing a display device according to an embodiment includes: cutting a portion of a display panel by irradiating a display panel including a panel pad portion with a laser based on a cutting line. The method includes forming a connecting member having one end engaged with an upper surface of the panel pad portion and another end engaged with an upper surface of a circuit pad portion below the display panel, wherein the circuit pad portion is at least partially exposed from the display panel.

[0020] In an embodiment, cutting a portion of the display panel may include cutting a portion of the panel pad portion.

[0021] In an embodiment, at least one side surface of the panel pad portion may be defined by cutting a portion of the panel pad portion, and the forming of the connection member may include forming the connection member so that the connection member extends along the side surface of the panel pad portion.

[0022] In an embodiment, the connection member may be formed of a conductive material.

[0023] In an embodiment, the method may further include attaching a circuit board including a circuit pad portion to the display panel under the display panel, and the attaching of the circuit board may be performed before the forming of the connection member.

[0024] In an embodiment, the portion of the outline located on the circuit board may have a straight line shape, a curved line shape, a concave-convex shape, or a zigzag shape in a plan view, wherein the portion of the outline corresponds to the portion of the cutting line.

[0025] The display device according to the embodiment may include a circuit board arranged below the display panel. Therefore, for example, the dead zone of the display device can be reduced. In some aspects, the embodiments of the present disclosure support preventing the boundaries between adjacent display devices among the display devices included in the spliced ​​display device from being visible from the outside or reducing the size of these boundaries. Therefore, for example, the display quality of the spliced ​​display device can be improved.

[0026] In some aspects, at least a portion of the circuit pad portion of the circuit board can be exposed from the display panel (or the panel pad portion of the display panel) in a plan view. Therefore, for example, even for a case where the circuit board is located below the display panel, embodiments of the present disclosure support performing a front bonding process on the panel pad portion and the circuit board. Therefore, embodiments of the present disclosure support implementing a display device without forming a separate structure associated with bonding the panel pad portion and the circuit board at the bottom of the display panel (e.g., a hole extending through the lower surface of the display panel, a conductive line mounted on a substrate, etc.) in the display device. Therefore, for example, embodiments of the present disclosure support providing a display device with a simplified structure compared to some other display devices.

[0027] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0029] Figure 1 is a plan view illustrating a spliced ​​display device according to an embodiment.

[0030] Figure 2 is a block diagram illustrating a display device according to an embodiment.

[0031] Figure 3 is a plan view illustrating a display device according to an embodiment.

[0032] Figure 4 is along Figure 3 A cross-sectional view taken along line II'.

[0033] Figure 5 According to the embodiment Figure 3 Magnified view of area A.

[0034] Figure 6 According to the embodiment Figure 5 A cross-sectional view taken along line II-II'.

[0035] Figure 7 According to the embodiment Figure 5 A cross-sectional view taken along line II-II'.

[0036] Figure 8 yes Figure 6 Magnified view of area B.

[0037] Fig. 9 is a flowchart illustrating a method of manufacturing a display device according to an embodiment.

[0038] Figures 10 to 15 It is a graphic Fig. 9 FIG. 1 is a diagram of a method of manufacturing a display device.

[0039] Fig.16 is a flowchart illustrating a method of manufacturing a display device according to an embodiment.

[0040] Figures 17 to 20 It is a graphic Fig.16 FIG. 1 is a diagram of a method of manufacturing a display device.

[0041] Fig.21 According to the embodiment Figure 3 Magnified view of area A.

[0042] Fig. 22 is along Fig.21 A cross-sectional view taken along line III-III'.

[0043] Figure 23 to Figure 26 According to other embodiments Figure 3 Magnified view of area A. DETAILED DESCRIPTION

[0044] Hereinafter, a display device according to an embodiment will be described in more detail with reference to the accompanying drawings. In the accompanying drawings, the same reference numerals are used for the same components, and redundant descriptions of the same components will be omitted.

[0045] Figure 1 is a plan view illustrating a spliced ​​display device according to an embodiment.

[0046] refer to Figure 1 The display device according to the embodiment may be a spliced ​​display device TD including a plurality of display devices 10 (e.g., a first display device 10a to a ninth display device 10i). The display device 10 may display separate images, or divide and display one image. The display device 10 may include display panels of the same type, structure, size, or method, but is not limited thereto.

[0047] In an embodiment, the display device 10 may be arranged in a matrix form along a first direction DR1 and a second direction DR2 intersecting the first direction DR1. For example, the second direction DR2 may be perpendicular to the first direction DR1. Figure 1As shown in , the spliced ​​display device TD may include a first display device 10a to a ninth display device 10i arranged in a 3×3 shape in a plan view. The first display device 10a to the ninth display device 10i may display a first image to a ninth image, respectively. A user may watch an image combining the first image to the ninth image. However, the embodiments supported by the present disclosure are not limited thereto, and the spliced ​​display device TD may include 2 to 8 display devices 10, 10 or more display devices 10, etc.

[0048] Figure 2 is a block diagram illustrating a display device according to an embodiment. For example, Figure 2 The display device 10 can represent Figure 1 Any one of the first display device 10a to the ninth display device 10i.

[0049] refer to Figure 2 The display device 10 may include a display panel DP and a driver. The driver may include a driving controller CON, a gate driver GDV, and a data driver DDV.

[0050] The display panel DP may include pixels PX, gate lines GL, and data lines DL. The pixels PX may be arranged in a display area where an image is displayed. The pixels PX may be electrically connected to the gate lines GL and the data lines DL. For example, the pixels PX may be arranged in a matrix form along a first direction DR1 and a second direction DR2. Each of the pixels PX may include a transistor and a light emitting element. The light emitting element may generate light. The light emitting element may be an inorganic light emitting diode or an organic light emitting diode.

[0051] The gate lines GL and the data lines DL may intersect each other. For example, each of the gate lines GL may generally extend in the second direction DR2 and may be arranged along the first direction DR1. Each of the data lines DL may generally extend in the first direction DR1 and may be arranged along the second direction DR2.

[0052] The driving controller CON may generate a gate control signal GCTRL, a data control signal DCTRL, and an output image data ODAT based on the input image data IDAT and the input control signal CTRL provided from the external device. For example, the input image data IDAT may be RGB data including red image data, green image data, and blue image data. The input control signal CTRL may include a master clock signal and an input data enable signal. The input control signal CTRL may further include a vertical synchronization signal and a horizontal synchronization signal.

[0053] The gate driver GDV may generate a gate signal based on a gate control signal GCTRL provided from the driving controller CON. For example, the gate control signal GCTRL may include a vertical start signal and a gate clock signal. The gate driver GDV may sequentially output the gate signal to the gate lines GL of the display panel DP.

[0054] The data driver DDV may generate a data signal based on the data control signal DCTRL and the output image data ODAT provided from the drive controller CON. For example, the data control signal DCTRL may include an output data enable signal, a horizontal start signal, and a load signal. The data driver DDV may output the data signal to the data line DL of the display panel DP.

[0055] In an embodiment, the gate driver GDV and the data driver DDV may be implemented as integrated circuits. The gate driver GDV and the data driver DDV may include an IC chip, a film on which the IC chip is mounted, or the like.

[0056] Figure 3 is a plan view illustrating a display device according to an embodiment, Figure 4 is along Figure 3 A cross-sectional view taken along line II' of Figure 5 According to the embodiment Figure 3 is an enlarged view of region A, and Figure 6 According to the embodiment Figure 5 For example, Figure 3 The display device 10 can represent Figure 1 Any one of the first display device 10a to the ninth display device 10i.

[0057] refer to Figures 3 to 6 , the display device 10 according to the embodiment may include a display panel DP and a circuit board CB. In the example, the display device 10 is illustrated as including a plurality of circuit boards CB, but the embodiments of the present disclosure are not limited thereto.

[0058] The display panel DP may include a substrate 100 , a transistor layer 200 , a light emitting element layer 300 , and an encapsulation layer 400 .

[0059] The substrate 100 may be a transparent insulating substrate. The substrate 100 may be formed of a flexible material, and at least a portion of the substrate 100 may be flexible and bendable. In an example, the substrate 100 may have a multilayer structure including at least one organic layer and at least one inorganic layer. Examples of organic materials that can be used as the organic layer may include polyimide (PI), polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose acetate propionate (CAP), etc. Examples of inorganic materials that can be used as the inorganic layer may include silicon oxide, silicon nitride, silicon oxynitride, etc.

[0060] The transistor layer 200 may be disposed on the substrate 100. The transistor layer 200 may include at least one transistor. The light emitting element layer 300 may be disposed on the transistor layer 200. The light emitting element layer 300 may include at least one light emitting element electrically connected to the transistor. The encapsulation layer 400 may be disposed on the light emitting element layer 300. Figure 8 A detailed description of the transistor layer 200 , the light emitting element layer 300 , and the encapsulation layer 400 is described.

[0061] The display panel DP may further include a panel pad portion DP-PD. The panel pad portion DP-PD may be arranged in the pad area PA of the display panel DP. In an embodiment, the display panel DP may include a plurality of panel pad portions DP-PD arranged along the second direction DR2. However, the embodiments supported by the present disclosure are not necessarily limited thereto. The panel pad portion DP-PD may be electrically connected to the transistor of the transistor layer 200. The panel pad portion DP-PD may include a conductive material such as, for example, a metal.

[0062] The circuit board CB may be arranged below the display panel DP. For example, the circuit board CB may be attached (eg, coupled) to the lower surface of the display panel DP so that the circuit board CB overlaps the pad area PA of the display panel DP. The circuit board CB may be electrically connected to the display panel DP.

[0063] In an example in which the circuit board CB is attached to the lower surface of the display panel DP, in a plan view, the width of the area of ​​the circuit board CB exposed from the display panel DP in the first direction DR1 can be reduced. For example, embodiments of the present disclosure support reducing the exposed area of ​​the circuit board CB (for example, in the first direction DR1 and the second direction DR2). Therefore, for example, embodiments of the present disclosure support preventing the inclusion of Figure 1The boundaries between adjacent display devices among the display devices 10a to 10i in the spliced ​​display device TD shown in FIG. 1 are made visible from the outside or the sizes of these boundaries are reduced. Therefore, for example, the display quality of the spliced ​​display device TD can be improved.

[0064] The circuit board CB may include a flexible film FF, a driving chip DC, and a circuit pad portion CB-PD.

[0065] In an embodiment, the circuit pad portion CB-PD may refer to a circuit pad terminal. However, the embodiments supported by the present disclosure are not necessarily limited thereto. For example, in an embodiment, the circuit pad portion CB-PD may be interpreted as including a circuit pad terminal and a signal lead connected to the circuit pad terminal.

[0066] The flexible film FF may include an insulating material. In an example, the flexible film FF may be formed of a flexible material, and at least a portion of the flexible film FF may be flexible and bendable. The circuit pad portion CB-PD and the driving chip DC may be disposed on the flexible film FF.

[0067] The driving chip DC may be mounted on the flexible film FF. For example, the display device 10 may have a chip on film (COF) structure in which the driving chip DC is mounted on the flexible film FF and connected to the display panel DP through the flexible film FF. For example, the driving chip DC may be Figure 2 However, the embodiments supported by the present disclosure are not necessarily limited thereto.

[0068] In an embodiment, the circuit pad portion CB-PD may be attached (e.g., coupled) to the lower surface of the display panel DP. For example, the circuit pad portion CB-PD may be attached to the display panel DP by an adhesive member or the like. Examples of adhesive members may include a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), an optically clear resin (OCR), an anisotropic conductive film (ACF), etc. However, the method of attaching the display panel DP and the circuit pad portion CB-PD according to one or more embodiments of the present disclosure is not necessarily limited thereto.

[0069] In a plan view, at least a portion of the circuit pad portion CB-PD may overlap with the display panel DP. In some aspects, at least a portion of the circuit pad portion CB-PD may be exposed from the display panel DP in a plan view. Specifically, for example, an upper surface S1 of the circuit pad portion CB-PD may be exposed from the display panel DP.

[0070] The circuit pad portion CB-PD may be arranged below the panel pad portion DP-PD. In a plan view, at least a portion of the circuit pad portion CB-PD may overlap with the panel pad portion DP-PD. In some aspects, in a plan view, at least a portion of the circuit pad portion CB-PD may be exposed from the panel pad portion DP-PD. Specifically, for example, in a plan view, an upper surface S1 of the circuit pad portion CB-PD may be exposed from the panel pad portion DP-PD. Figure 5 In the figure, a portion of the circuit pad portion CB-PD that overlaps with the display panel DP and is blocked by the display panel DP is omitted.

[0071] The display device 10 may further include a connection member CM electrically connecting the panel pad portion DP-PD and the circuit pad portion CB-PD. For example, the panel pad portion DP-PD and the circuit pad portion CB-PD may be electrically and physically connected by the connection member CM.

[0072] In an embodiment, the display device 10 may include a plurality of connection members CM arranged along the second direction DR2. For example, the plurality of connection members CM may correspond to the plurality of panel pad portions DP-PD on a one-to-one basis. In some aspects, the plurality of connection members CM may correspond to the plurality of circuit pad portions CB-PD on a one-to-one basis. In other words, any one of the plurality of connection members CM may electrically connect the corresponding panel pad portion DP-PD to the corresponding circuit pad portion CB-PD. However, the embodiments supported by the present disclosure are not necessarily limited thereto.

[0073] The connection member CM may include a conductive material such as a metal. For example, the connection member CM may be formed by pressing a conductive material on (or against) the panel pad portion DP-PD and the circuit pad portion CB-PD. In an embodiment, the connection member CM may be an anisotropic conductive film (ACF). However, the embodiments supported by the present disclosure are not necessarily limited thereto.

[0074] In an embodiment, one end of the connecting member CM may be bonded to the upper surface S2 of the panel pad portion DP-PD, and the other end of the connecting member CM may be bonded to the upper surface S1 of the circuit pad portion CB-PD. Specifically, for example, the other end of the connecting member CM may be bonded to the upper surface S1 of the circuit pad portion CB-PD exposed from the display panel DP. That is, in a plan view, at least a portion of the circuit pad portion CB-PD may be exposed from the display panel DP, and the panel pad portion DP-PD and the circuit pad portion CB-PD may be electrically connected by the connecting member CM located in front of the panel pad portion DP-PD and the circuit pad portion CB-PD. In other words, since at least a portion of the circuit pad portion CB-PD is exposed from the display panel DP in a plan view, the embodiments of the present disclosure may support a front bonding process for the panel pad portion DP-PD and the circuit board CB.

[0075] The connection member CM may extend along the side surface S3 of the panel pad portion DP-PD. Specifically, for example, the connection member CM may extend from the upper surface S2 of the panel pad portion DP-PD to the upper surface S1 of the circuit pad portion CB-PD along the side surface S3 of the panel pad portion DP-PD. In other words, the connection member CM may be arranged on the upper surface S2 of the panel pad portion DP-PD, the side surface S3 of the panel pad portion DP-PD, and the upper surface S1 of the circuit pad portion CB-PD.

[0076] like Figure 6 As shown in, in an embodiment, the connecting member CM may contact the side surface S3 of the panel pad portion DP-PD. However, the embodiments supported by the present disclosure are not necessarily limited thereto, and the connecting member CM may extend along the side surface S3 of the panel pad portion DP-PD to be spaced apart from the side surface S3 of the panel pad portion DP-PD at a predetermined interval.

[0077] In some embodiments, the connection member CM may be arranged so that the connection member CM is not on the lower surface of the display panel DP. For example, the connection member CM may not extend to the lower surface of the display panel DP. As described herein, when a front bonding process for the panel pad portion DP-PD and the circuit board CB is performed, the connection member CM may be located in front of the panel pad portion DP-PD and the circuit pad portion CB-PD. Thus, for example, the connection member CM may be arranged so that the connection member CM is not on the lower surface of the display panel DP.

[0078] In the display device 10 according to the embodiment, the side surface S3 of the panel pad portion DP-PD may define a portion of the outline OTL of the display panel DP in a plan view. For example, the outline OTL of the display panel DP may be a line defining the planar shape of the display panel DP. Specifically, for example, a cutting process of the display panel DP using a laser to be described later may include cutting the panel pad portion DP-PD to define the side surface S3 of the panel pad portion DP-PD, so that the side surface S3 of the panel pad portion DP-PD defines a portion of the outline OTL of the display panel DP in a plan view. Example aspects of the cutting process will be described in more detail herein later.

[0079] In some embodiments, the portion of the outline OTL located on the circuit board CB may have a straight line shape in a plan view, but is not limited thereto. For example, a portion (or other portion) of the outline OTL may have a straight line shape, a curved shape, a concave-convex shape, or a zigzag shape in a plan view. In some aspects, the portion of the outline OTL of the display panel DP may be defined by the side surface of the transistor layer 200 on the circuit board CB and the side surface S3 of the panel pad portion DP-PD on the circuit board CB. Specifically, for example, the portion of the outline OTL located on the circuit board CB may correspond to a cutting line irradiated with a laser in a cutting process of the display panel DP using a laser, which will be described later. Example aspects of the cutting process, cutting line, and outline OTL will be described in more detail later in this article.

[0080] In the display device 10 according to the embodiment, the circuit board CB may be arranged below the display panel DP. Therefore, for example, the dead zone of the display device 10 may be reduced. In some aspects, the embodiments of the present disclosure support preventing the inclusion of Figure 1 The boundaries between adjacent display devices among the display devices 10a to 10i in the spliced ​​display device TD shown in FIG. 1 are made visible from the outside or the sizes of these boundaries are reduced. Therefore, for example, the display quality of the spliced ​​display device TD can be improved.

[0081] In some aspects, at least a portion of the circuit pad portion CB-PD may be exposed from the display panel DP (or the panel pad portion DP-PD) in a plan view. Therefore, for example, even for a case where the circuit board CB is located below the display panel DP, embodiments of the present disclosure may support the front bonding process of the panel pad portion DP-PD and the circuit board CB. For example, the panel pad portion DP-PD and the circuit pad portion CB-PD may be electrically connected by a connecting member CM located in front of the panel pad portion DP-PD and the circuit pad portion CB-PD. Therefore, embodiments of the present disclosure support the realization of the display device 10 without forming a separate structure associated with bonding the panel pad portion DP-PD and the circuit board CB at the bottom of the display panel DP in the display device 10 (e.g., a hole extending through the lower surface of the display panel DP, a conductive line mounted on the substrate 100, etc.). Therefore, for example, the structure of the display device 10 may be more simplified compared to some other display devices.

[0082] In an embodiment, the display device 10 may further include a protective member PM disposed on the connection member CM. The protective member PM may cover at least a portion of the connection member CM. For example, Figure 6 As shown in , the protective member PM may cover the upper surface of the connection member CM. In an embodiment, the protective member PM may completely cover the connection member CM. The protective member PM may protect the connection member CM from moisture, oxygen, impurities or external physical impact.

[0083] In an embodiment, the protection member PM may include an insulating material. For example, the protection member PM may include an organic material. Examples of organic materials that can be used as the protection member PM may include photoresists, polyacrylic resins, polyimide resins, siloxane resins, acrylic resins, epoxy resins, etc. The embodiments of the present disclosure support the use of organic materials alone or in combination with each other. In some embodiments, the protection member PM may include an inorganic material.

[0084] In an embodiment, the protection member PM may include a light blocking material. Since the protection member PM includes a light blocking material, aspects of the protection member PM support preventing the connection member CM from being visible from the outside. In an example, the protection member PM may include a black pigment, a black dye, carbon black, or the like.

[0085] In some embodiments, for ease of illustration, Figure 5 The protective member PM is omitted. In an embodiment, the protective member PM may be completely arranged in Figure 5 On the multiple connecting members CM shown in , but the embodiments supported by the present disclosure are not necessarily limited to this.

[0086] Figure 7 According to the embodiment Figure 5 A cross-sectional view taken along line II-II'. Figure 7 The cross-sectional view can be compared with Figure 6 corresponds to the cross-sectional view of .

[0087] refer to Figure 7 The embodiment of the display device 10 described can be compared with the reference Figure 6 The embodiments of the display device 10 described are substantially the same. In some examples, reference Figure 7 The display device 10 described in reference Figure 6 The display device 10 described may differ in that, with reference to Figure 7 The display device 10 described includes a conductive ball CNB (or a plurality of conductive balls CNB). Figures 3 to 6 The description of the repeated component is replaced by the description of the

[0088] In an embodiment, the display device 10 may further include a conductive ball CNB. The conductive ball CNB may be arranged between the panel pad portion DP-PD and the connection member CM and between the circuit pad portion CB-PD and the connection member CM. For example, one end of the panel pad portion DP-PD and the connection member CM may be joined by the conductive ball CNB, and the other end of the circuit pad portion CB-PD and the connection member CM may be joined by the conductive ball CNB.

[0089] Figure 8 yes Figure 6 Magnified view of area B.

[0090] refer to Figure 6 and Figure 8 In an embodiment, the transistor layer 200 may include a transistor TFT, a data line DL, a buffer layer 210, a gate insulating layer 220, an interlayer insulating layer 230, a first protective layer 240, and a first planarization layer 250. The transistor TFT may include an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0091] The buffer layer 210 may be disposed on the substrate 100. The buffer layer 210 may include an inorganic insulating material. The buffer layer 210 may prevent impurities from diffusing from the substrate 100 into the active layer ACT.

[0092] The active layer ACT may be arranged on the buffer layer 210. In an example, the active layer ACT may include a silicon semiconductor, an oxide semiconductor, etc. The silicon semiconductor may include amorphous silicon, polycrystalline silicon, etc. The active layer ACT may include a source region, a drain region, and a channel region. The source region and the drain region may be doped with impurities. The channel region may be arranged between the source region and the drain region.

[0093] The gate insulating layer 220 may be disposed on the buffer layer 210. The gate insulating layer 220 may cover the active layer ACT. The gate insulating layer 220 may include an inorganic insulating material.

[0094] The gate electrode GE may be disposed on the gate insulating layer 220. The gate electrode GE may overlap the channel region of the active layer ACT. The gate electrode GE may include metal, alloy, conductive metal oxide, conductive metal nitride, transparent conductive material, or the like.

[0095] The interlayer insulating layer 230 may be disposed on the gate insulating layer 220. The interlayer insulating layer 230 may cover the gate electrode GE. The interlayer insulating layer 230 may include an inorganic insulating material.

[0096] The source electrode SE and the drain electrode DE may be disposed on the interlayer insulating layer 230. The source electrode SE and the drain electrode DE may be connected to the source region and the drain region of the active layer ACT, respectively, through contact holes. The source electrode SE and the drain electrode DE may include metal, alloy, conductive metal oxide, conductive metal nitride, transparent conductive material, etc.

[0097] The data line DL may be arranged on the interlayer insulating layer 230. The data line DL may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc. The data line DL may be electrically connected to the panel pad portion DP-PD. The data line DL may receive a data signal through the panel pad portion DP-PD. For example, the data line DL may be electrically connected to the source electrode SE and may transmit a data signal to the source electrode SE.

[0098] In some embodiments, an example in which the data line DL is electrically connected to the panel pad portion DP-PD is described, but the embodiments supported by the present disclosure are not limited thereto. For example, a gate line, a power transmission line, an initialization voltage line, or other data lines, power lines, or voltage lines may be electrically connected to the panel pad portion DP-PD. The gate line, the power transmission line, the initialization voltage line, or other data lines, power lines, or voltage lines may be located on the buffer layer 210, the gate insulation layer 220, or the interlayer insulation layer 230.

[0099] The first protective layer 240 may cover the transistor TFT. The first protective layer 240 may protect the transistor TFT.

[0100] The first planarization layer 250 may be disposed on the first protection layer 240. The first planarization layer 250 may have a substantially flat upper surface without generating a step (also referred to herein as a step portion) around the transistor TFT. The first planarization layer 250 may include an organic insulating material.

[0101] The light emitting element layer 300 may be arranged on the transistor layer 200. In an embodiment, the light emitting element layer 300 may include a light emitting unit EMU, a first bank 310, a second bank 320, a wavelength converter WLC, a second protective layer 330, a second planarization layer 340, a light blocking layer 350, a color filter layer CF, and a third protective layer 360. The light emitting unit EMU may include a first electrode AE, a second electrode CE, and a light emitting element ED. Although Figure 8 , one luminous area LA is illustrated in the figure, but the embodiments of the present disclosure are not limited thereto, and the display device 10 may include first to third luminous areas that are repeatedly arranged. The first to third luminous areas may respectively emit light having different colors. For example, the first luminous area may emit red light, the second luminous area may emit green light, and the third luminous area may emit blue light. In some aspects, in Figure 8 , for convenience, the light blocking area BA is illustrated as having a relatively wide width. However, the light blocking area BA may also have a relatively narrow width.

[0102] The first bank 310 and the second bank 320 may be arranged on the first planarization layer 250. The second bank 320 may have an opening exposing the light emitting area LA. For example, the second bank 320 may surround the light emitting area LA in a plan view. That is, the light emitting area LA may be defined by the second bank 320. The second bank 320 may include an organic insulating material. The second bank 320 may further include a light blocking material to prevent color mixing between adjacent light emitting areas.

[0103] The first bank 310 (or a plurality of first banks 310, such as Figure 8 The first bank 310 may be arranged in the opening of the second bank 320. That is, the first bank 310 may overlap the light emitting area LA. The first bank 310 and the second bank 320 may each include an organic insulating material.

[0104] The first electrode AE ​​may be disposed on the first planarization layer 250. The first electrode AE ​​may overlap the light emitting area LA and may cover the first bank 310. The first electrode AE ​​may be electrically connected to the drain electrode DE through a contact hole formed in the first protection layer 240 and the first planarization layer 250.

[0105] The second electrode CE may be disposed on the first planarization layer 250. The second electrode CE may overlap the light emitting region LA and may cover the first bank 310. For example, the second electrode CE may receive a common voltage supplied to the pixel. The first electrode AE ​​and the second electrode CE may be insulated from each other by an insulating layer covering a portion of the first electrode AE ​​and a portion of the second electrode CE adjacent to each other.

[0106] The light emitting element ED may be arranged between the first electrode AE ​​and the second electrode CE on the first planarization layer 250. The light emitting element ED may be arranged on the insulating layer. One end of the light emitting element ED may be connected to the first electrode AE, and the other end of the light emitting element ED may be connected to the second electrode CE. In an example, the light emitting element ED may include an active layer and emit light in the same wavelength range or light of the same color. For example, the light emitting element ED may emit blue light having a peak wavelength range from about 440 nm to about 480 nm.

[0107] In an example where the light emitting area LA is the first light emitting area or the second light emitting area (for example, the light emitting area LA emits red light or green light), the wavelength converter WLC may be arranged on the light emitting unit EMU. The wavelength converter WLC may be surrounded by the second embankment 320. The wavelength converter WLC may include a base resin BR, a scatterer SCT, and a wavelength shifter WLS.

[0108] The base resin BR may include a material having a relatively high light transmittance. The base resin BR may be formed of a transparent organic material. In an example, the base resin BR may include at least one of organic materials such as epoxy resin, acrylic resin, cardo resin, imide resin, etc.

[0109] The scatterer SCT may have a different refractive index from the base resin BR, and may form an optical interface with the base resin BR.

[0110] The wavelength shifter WLS can convert or shift the peak wavelength of the incident light. For example, the wavelength shifter WLS can convert blue light into red light or green light and emit red light or green light. The wavelength shifter WLS can include quantum dots, quantum rods or phosphors. Quantum dots can be granular materials that emit light of a specific color when electrons transition from the conduction band to the valence band.

[0111] The light emitted by the wavelength shifter WLS may have a full width at half maximum (FWHM) of an emission wavelength spectrum of about 45 nm or less, about 40 nm or less, or about 30 nm or less. Thus, for example, color reproducibility of the display device 10 may be improved.

[0112] When the light emitting area LA is the third light emitting area (for example, when the light emitting area LA emits blue light), the transmission part may be arranged on the light emitting unit EMU. The transmission part may be surrounded by the second bank 320. The transmission part may include a base resin BR and a scatterer SCT, and in some aspects, may not include a wavelength shifter WLS. The transmission part may transmit the blue light emitted from the light emitting unit EMU without converting the wavelength.

[0113] The second protective layer 330 may cover the wavelength converter WLC and the second bank 320. The second protective layer 330 may protect the wavelength converter WLC and the second bank 320.

[0114] The second planarization layer 340 may be disposed on the second protection layer 330. The second planarization layer 340 may have a substantially flat upper surface without generating a step around the wavelength converter WLC. The second planarization layer 340 may include an organic insulating material.

[0115] The light blocking layer 350 may be disposed on the second planarization layer 340. The light blocking layer 350 may overlap the second bank 320. The light blocking layer 350 may have an opening overlapping the light emitting area LA.

[0116] The color filter layer CF may be disposed in the light emitting area LA on the second planarization layer 340. The color filter layer CF may be disposed in the opening of the light blocking layer 350. For example, the color filter layer CF may be surrounded by the light blocking layer 350 in a plan view. The color filter layer CF may selectively transmit light having a specific color, and block or absorb light having a color different from the specific color.

[0117] The third protective layer 360 may cover the color filter layer CF and the light blocking layer 350. The third protective layer 360 may protect the color filter layer CF and the light blocking layer 350.

[0118] The encapsulation layer 400 may be disposed on the third protective layer 360. For example, the encapsulation layer 400 may include at least one inorganic layer and at least one organic layer.

[0119] In the display device 10 according to the embodiment, the circuit board CB may be arranged below the display panel DP. Therefore, for example, the dead zone of the display device 10 may be reduced. In some aspects, the embodiments of the present disclosure support preventing the inclusion of Figure 1 The boundaries between adjacent display devices among the display devices 10a to 10i in the spliced ​​display device TD shown in FIG. 1 are made visible from the outside or the sizes of these boundaries are reduced. Therefore, for example, the display quality of the spliced ​​display device TD can be improved.

[0120] In some aspects, at least a portion of the circuit pad portion CB-PD may be exposed from the display panel DP (or the panel pad portion DP-PD) in a plan view. Therefore, for example, even for a case where the circuit board CB is located below the display panel DP, embodiments of the present disclosure support a front bonding process for the panel pad portion DP-PD and the circuit board CB. For example, the panel pad portion DP-PD and the circuit pad portion CB-PD may be electrically connected by a connecting member CM located in front of the panel pad portion DP-PD and the circuit pad portion CB-PD. Therefore, embodiments of the present disclosure support the realization of the display device 10 without forming a separate structure associated with bonding the panel pad portion DP-PD and the circuit board CB at the bottom of the display panel DP in the display device 10 (e.g., a hole extending through the lower surface of the display panel DP, a conductive line mounted on the substrate 100, etc.). Therefore, for example, the structure of the display device 10 may be more simplified compared to some other display devices.

[0121] In the description of the methods and processes herein, operations may be performed in a sequence different from the illustrated and / or described sequence, or may be performed in a different sequence or at different times. Certain operations may also be excluded from the methods and processes, and one or more operations may be repeated, or other operations may be added. According to the example aspects described herein, descriptions of elements "may be arranged," "may be formed," "may be cut," "may be pressed," etc. include methods, processes, and techniques for arranging, forming, placing, pressing, and modifying elements, etc.

[0122] Fig. 9 is a flowchart illustrating a method of manufacturing a display device according to one or more embodiments of the present disclosure. Figures 10 to 15 is a diagram illustrating one or more embodiments of the present disclosure Fig. 9 FIG. 1 is a diagram of a method of manufacturing a display device.

[0123] In the example, refer to Figures 9 to 15 The method of manufacturing a display device described may include manufacturing a reference Figures 3 to 6 Various aspects of the embodiments of the method of the display device 10 are described. Therefore, detailed descriptions of repeated components will be omitted.

[0124] refer to Fig. 9 , the method of manufacturing the display device 10 according to the embodiment may include cutting a portion of a display panel ( S100 ), attaching a circuit board under the display panel ( S200 ), and forming a connection member ( S300 ).

[0125] refer to Figures 10 to 13 Describe various aspects of S100.

[0126] refer to Figures 10 to 13, the method may include cutting a portion of the display panel DP by irradiating the display panel DP with laser light LB provided from the laser unit LU. The method may include irradiating the display panel DP with the laser light LB along the cutting line CL. The description of irradiating an element (e.g., the display panel DP) herein includes emitting the laser light LB by the laser unit LU so that the laser light LB is incident on one or more portions of the element.

[0127] The cutting line CL may pass through one or more of the panel pad portions DP-PD. For example, the cutting line CL may pass through each of the panel pad portions DP-PD. The description of the panel pad portion DP-PD herein may be implemented with respect to a plurality of panel pad portions DP-PD. That is, cutting a portion of the display panel DP (S100) may include cutting a portion of the panel pad portion DP-PD. Specifically, for example, the method may include: cutting a portion of each of the substrate 100, the transistor layer 200, and the panel pad portion DP-PD by irradiating the cutting line CL with a laser LB (for example, irradiating one or more zones according to the cutting line CL). Therefore, for example, cutting a portion of the display panel DP-PD may define a side surface S3 of the panel pad portion DP-PD. Therefore, for example, the side surface S3 of the panel pad portion DP-PD may define a portion of the outline OTL of the display panel DP in a plan view.

[0128] In an embodiment, the cutting line CL may have a straight line shape in a plan view. However, the embodiments supported by the present disclosure are not necessarily limited thereto. For example, one or more portions of the cutting line CL may have a straight line shape, a curved line shape, a concave-convex shape, or a zigzag shape in a plan view.

[0129] refer to Figure 14 to Figure 15 Describe various aspects of S200.

[0130] refer to Fig.14 and Fig.15 , the method may include attaching the circuit board CB to the cut display panel DP below the display panel DP. For example, the circuit pad portion CB-PD may be attached to the lower surface of the display panel DP. The circuit pad portion CB-PD may be attached to the display panel DP by a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), an optically clear resin (OCR), an anisotropic conductive film (ACF), etc., but the embodiments supported by the present disclosure are not necessarily limited thereto.

[0131] The method may include attaching the circuit board CB to the display panel DP so that at least a portion of the circuit pad portion CB-PD is exposed from the display panel DP in a plan view. Specifically, for example, the circuit board CB may be attached to the display panel DP so that at least a portion of the circuit pad portion CB-PD is exposed from the panel pad portion DP-PD in a plan view. Thus, for example, in association with attaching the circuit board CB to the display panel DP (e.g., in a state in which the circuit board CB is attached to the display panel DP), the upper surface S1 of the circuit pad portion CB-PD may be exposed from the panel pad portion DP-PD in a plan view.

[0132] Afterwards, refer to Fig. 9 The S300 and Figure 5 and Figure 6 As shown in , the method may include pressing a conductive material on (or against) the panel pad portion DP-PD and the circuit pad portion CB-PD to form a connecting member CM. Thus, for example, the connecting member CM may electrically connect the panel pad portion DP-PD and the circuit pad portion CB-PD.

[0133] The method may include bonding one end of the connection member CM to the upper surface S2 of the panel pad portion DP-PD, and the method may include bonding the other end of the connection member CM to the upper surface S1 of the circuit pad portion CB-PD. Specifically, for example, the method may include bonding the other end of the connection member CM to the upper surface S1 of the circuit pad portion CB-PD exposed from the display panel DP. That is, since at least a portion of the circuit pad portion CB-PD is exposed from the display panel DP in a plan view, the method may include performing a front bonding process in association with bonding the panel pad portion DP-PD and the circuit board CB.

[0134] The method may include forming a connection member CM so that the connection member CM extends along the side surface S3 of the panel pad portion DP-PD. Specifically, for example, the connection member CM may extend from the upper surface S2 of the panel pad portion DP-PD to the upper surface S1 of the circuit pad portion CB-PD along the side surface S3 of the panel pad portion DP-PD.

[0135] Fig.16 is a flowchart illustrating a method of manufacturing a display device according to an embodiment. Figures 17 to 20 is a diagram illustrating one or more embodiments of the present disclosure Fig.16 FIG. 1 is a diagram of a method of manufacturing a display device.

[0136] In the example, refer to Figures 16 to 20 The method of manufacturing a display device described may include manufacturing a reference Figures 3 to 6Various aspects of the embodiments of the method of the display device 10 are described. Therefore, detailed descriptions of repeated components will be omitted.

[0137] In some respects, reference Figures 16 to 20 The method for manufacturing a display device described herein can be used in conjunction with reference Figures 9 to 15 In some examples, reference Figures 16 to 20 Described methods and references Figures 9 to 15 The method described may differ in that, reference Figures 16 to 20 The described method may include performing a process of attaching a circuit board CB under the display panel DP before cutting a portion of the display panel DP. Figures 9 to 15 The description replaces the description of the duplicate content.

[0138] refer to Fig.16 , the method of manufacturing the display device 10 according to the embodiment may include attaching a circuit board under a display panel ( S100 ′), cutting a portion of the display panel ( S200 ′), and forming a connection member ( S300 ′).

[0139] refer to Fig.17 , the method may include attaching the circuit board CB below the cut display panel DP. For example, the circuit pad portion CB-PD may be attached to the lower surface of the display panel DP. The circuit pad portion CB-PD may be attached to the display panel DP by a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), an optically clear resin (OCR), an anisotropic conductive film (ACF), etc., but the embodiments supported by the present disclosure are not necessarily limited thereto.

[0140] refer to Fig.18 and Fig.19 The method may include cutting a portion of the display panel DP by irradiating the display panel DP with laser light LB provided from the laser unit LU. The method may include irradiating the display panel DP with the laser light LB along a cutting line CL.

[0141] The cutting line CL may pass through one or more of the panel pad portions DP-PD. For example, the cutting line CL may pass through each of the panel pad portions DP-PD. The description herein about the panel pad portion DP-PD may be implemented with respect to a plurality of panel pad portions DP-PD. That is, cutting a portion of the display panel DP (S200') may include cutting a portion of the panel pad portion DP-PD. Specifically, for example, the method may include: cutting a portion of each of the substrate 100, the transistor layer 200, and the panel pad portion DP-PD by irradiating the cutting line CL with a laser LB. Therefore, for example, cutting a portion of the display panel DP-PD may define a side surface S3 of the panel pad portion DP-PD. Therefore, for example, the side surface S3 of the panel pad portion DP-PD may define a portion of the outline OTL of the display panel DP in a plan view.

[0142] In an embodiment, the cutting line CL may have a straight line shape in a plan view. However, embodiments supported by the present disclosure are not necessarily limited thereto.

[0143] By cutting a portion of the display panel DP, at least a portion of the circuit pad portion CB-PD can be exposed from the display panel DP in a plan view. Specifically, for example, a portion of the panel pad portion DP-PD can be cut so that at least a portion of the circuit pad portion CB-PD is exposed from the panel pad portion DP-PD in a plan view. Therefore, for example, in association with (e.g., as a result of) cutting a portion of the display panel DP, the upper surface S1 of the circuit pad portion CB-PD can be exposed from the panel pad portion DP-PD in a plan view.

[0144] Afterwards, refer to Fig.16 The S300' and Figure 5 and Figure 6 As shown in , the method may include pressing a conductive material on (or against) the panel pad portion DP-PD and the circuit pad portion CB-PD to form a connecting member CM. Thus, for example, the panel pad portion DP-PD and the circuit pad portion CB-PD may be electrically connected. The formation of the connecting member CM (S300′) may be similar to the reference Figures 9 to 15 The forming of the connection member CM ( S300 ) in the described method of manufacturing the display device is substantially the same.

[0145] In the method for manufacturing the display device 10 according to the embodiment, the method may include cutting a portion of the panel pad portion DP-PD by cutting a portion of the display panel DP by laser (e.g., using laser LB). Therefore, for example, even if the circuit board CB is located below the display panel DP, at least a portion of the circuit pad portion CB-PD may be exposed from the display panel DP (or the panel pad portion DP-PD). Therefore, for example, the method may include performing a front bonding process associated with bonding the panel pad portion DP-PD and the circuit board CB. For example, the method may include electrically connecting the panel pad portion DP-PD and the circuit pad portion CB-PD by forming a connection member CM in which one end of the connection member CM is bonded to the upper surface of the panel pad portion DP-PD and the other end of the connection member CM is bonded to the upper surface of the circuit pad portion CB-PD. Therefore, for example, the embodiments of the present disclosure support the realization of the display device 10 without implementing a separate process for bonding the panel pad portion DP-PD and the circuit board CB at the bottom of the display panel DP. Therefore, for example, the manufacturing process of the display device 10 can be more simplified compared to some other processes for manufacturing the display device.

[0146] Fig.21 According to the embodiment Figure 3 is an enlarged view of region A, and Fig. 22 is along Fig.21 A cross-sectional view taken along line III-III'. Fig.21 The enlarged image can be compared with Figure 5 corresponds to the enlarged view of .

[0147] refer to Fig.21 and Fig. 22 The embodiment of the display device 10 described can be compared with the reference Figures 3 to 5 and Figure 7 The embodiments of the display device 10 described are substantially the same. In some examples, reference Fig.21 and Fig. 22 The display device 10 described in reference Figures 3 to 5 and Figure 7 The display device 10 described may differ in that the connection member CM' is in the form of a substrate on which the pads are arranged. Thus, for example, the reference Figures 3 to 5 and Figure 7 The description of the repeated component is replaced by the description of the

[0148] In an embodiment, the display device 10 may include a connection member CM' electrically connecting the panel pad portion DP-PD and the circuit pad portion CB-PD. For example, the panel pad portion DP-PD and the circuit pad portion CB-PD may be electrically and physically connected by the connection member CM'.

[0149] The connection member CM' may be arranged on the panel pad portion DP-PD and the circuit pad portion CB-PD. For example, an embodiment of the present disclosure may include forming the connection member CM' by pressing a conductive material on (or against) the panel pad portion DP-PD and the circuit pad portion CB-PD. The connection member CM' may include a base film BF and a connection pad portion CN-PD.

[0150] The base film BF may include an insulating material. In an example, the base film BF may be formed of a flexible material, and at least a portion of the base film BF may be flexible and support bending. The connection pad portion CN-PD may be disposed on the base film BF.

[0151] In an embodiment, the connection member CM' may include a plurality of connection pad portions CN-PD arranged along the second direction DR2. For example, the plurality of connection pad portions CN-PD may correspond to the plurality of panel pad portions DP-PD on a one-to-one basis. In some aspects, the plurality of connection pad portions CN-PD may correspond to the plurality of circuit pad portions CB-PD on a one-to-one basis. In other words, any one of the plurality of connection pad portions CN-PD may electrically connect the corresponding panel pad portion DP-PD to the corresponding circuit pad portion CB-PD. However, the embodiments supported by the present disclosure are not necessarily limited thereto.

[0152] In an embodiment, one end of the connecting pad portion CN-PD may be bonded to the upper surface S2 of the panel pad portion DP-PD, and the other end of the connecting pad portion CN-PD may be bonded to the upper surface S1 of the circuit pad portion CB-PD. That is, at least a portion of the circuit pad portion CB-PD may be exposed from the display panel DP in a plan view, and the panel pad portion DP-PD and the circuit pad portion CB-PD may be electrically connected through the connecting pad portion CN-PD located in front of the panel pad portion DP-PD and the circuit pad portion CB-PD. In other words, since at least a portion of the circuit pad portion CB-PD is exposed from the display panel DP in a plan view, an embodiment of the present disclosure may support a front bonding process for the panel pad portion DP-PD and the circuit board CB. The connecting pad portion CN-PD may include a conductive material such as a metal as an example.

[0153] The connection pad portion CN-PD may extend along the side surface S3 of the panel pad portion DP-PD. Specifically, for example, the connection pad portion CN-PD may extend from the upper surface S2 of the panel pad portion DP-PD to the upper surface S1 of the circuit pad portion CB-PD along the side surface S3 of the panel pad portion DP-PD. In other words, the connection pad portion CN-PD may be arranged on the upper surface S2 of the panel pad portion DP-PD, the side surface S3 of the panel pad portion DP-PD, and the upper surface S1 of the circuit pad portion CB-PD. In some embodiments, the connection pad portion CN-PD may be arranged so that the connection pad portion CN-PD is not on the lower surface of the display panel DP.

[0154] In an embodiment, the conductive ball CNB may be arranged between the panel pad portion DP-PD and the connection pad portion CN-PD and between the circuit pad portion CB-PD and the connection pad portion CN-PD. For example, an embodiment of the present disclosure supports joining one end of the panel pad portion DP-PD and the connection pad portion CN-PD through the conductive ball CNB, and in some aspects, supports joining the other end of the circuit pad portion CB-PD and the connection pad portion CN-PD through the conductive ball CNB. However, the embodiments supported by the present disclosure are not necessarily limited to this, and in some examples, the conductive ball CNB may be omitted.

[0155] In the embodiment in which the display device 10 includes a connection member CM', refer to Figure 6 The described protection member PM may be omitted.

[0156] Figure 23 to Figure 26 According to other embodiments Figure 3 Magnified view of area A. Figure 23 to Figure 26 The enlarged image can be compared with Figure 5 For the sake of convenience, Figure 23 to Figure 26 The connecting components are omitted (see Figure 5 (CM).

[0157] refer to Figure 23 to Figure 26 The various embodiments of the display device 10 described can be used with reference to Figures 3 to 6 The embodiments of the display device 10 described are substantially the same except for one or more features described herein. In some examples, given the planar shape of the portion of the outline OTL located on the circuit board CB, reference Figure 23 to Figure 26 The display device 10 described can be used with reference Figures 3 to 6 The display device 10 described is different. Thus, for example, reference Figures 3 to 6 The description of the repeated component is replaced by the description of the

[0158] For example, embodiments of the present disclosure support realizing the reference image by modifying or changing the cutting line to be irradiated with the laser LB in association with the cutting process of the display panel DP as described herein. Figure 23 to Figure 26 Various planar shapes of the portion of the outline OTL located on the circuit board CB are described.

[0159] refer to Fig.23 In an embodiment, the portion of the outline OTL located on the circuit board CB may have a concave-convex shape in a plan view. For example, the portion of the outline OTL defined by the side surface of the transistor layer 200 on the circuit board CB and the side surface of the panel pad portion DP-PD on the circuit board CB (see Figure 6 The portion of the outline OTL defined in step S3) may not be aligned along a straight line. Expressed in another way, the portion of the outline OTL may be offset from the second portion of the outline OTL in the first direction (e.g., higher or lower than the second portion of the outline OTL). Thus, for example, the portion of the outline OTL located on the circuit board CB may have a concave-convex shape having concave portions and convex portions in a plan view.

[0160] refer to Fig.24 In an embodiment, the portion of the outline OTL located on the circuit board CB may have a curved shape in a plan view. For example, the portion of the outline OTL located on the circuit board CB may have a shape in which a curved portion protruding in the first direction DR1 and a curved portion protruding in a direction opposite to the first direction DR1 are repeated. For example, the side surface of the panel pad portion DP-PD on the circuit board CB (see Figure 6 In the embodiment S3, a bent portion protruding in the first direction DR1 may be defined, and a bent portion protruding in a direction opposite to the first direction DR1 from a side surface of the transistor layer 200 on the circuit board CB may be defined. However, embodiments supported by the present disclosure are not necessarily limited thereto.

[0161] refer to Fig.25 In an embodiment, the portion of the outline OTL located on the circuit board CB may have a zigzag shape in a plan view. For example, the portion of the outline OTL located on the circuit board CB may have a shape in which an inclined portion protruding in the first direction DR1 and an inclined portion protruding in a direction opposite to the first direction DR1 are repeated. For example, the side surface of the panel pad portion DP-PD on the circuit board CB (see Figure 6 In the embodiment S3), an inclined portion protruding in the first direction DR1 may be defined, and an inclined portion protruding in a direction opposite to the first direction DR1 from a side surface of the transistor layer 200 on the circuit board CB may be defined. However, embodiments supported by the present disclosure are not necessarily limited thereto.

[0162] refer to Fig.26In an embodiment, the portion of the outline OTL located on the circuit board CB may have a concave-convex shape in a plan view. For example, a portion of the panel pad portion DP-PD may be cut so that the panel pad portion DP-PD has a hammer shape in a plan view. Therefore, for example, the portion of the outline OTL located on the circuit board CB may have a concave-convex shape having a concave portion and a convex portion in a plan view.

[0163] According to one or more embodiments of the present disclosure, the planar shape of the portion of the outline OTL located on the circuit board CB is not limited to Figure 5 and Figure 23 to Figure 26 The shapes shown in FIG. 1 and may be variously changed according to the embodiments.

[0164] The present disclosure can be applied to display panel inspection devices of various display devices. For example, the present disclosure is applicable to display panel inspection devices of various display devices such as display devices for vehicles, ships and aircraft, portable communication devices, display devices for display or information transmission, medical display devices, etc.

[0165] Terms such as first, second, etc. can be used to describe various components, but these components should not be limited by these terms. Terms as used in this article can distinguish a component from other components without being limited by these terms. For example, without departing from the scope of the present disclosure, a first component can be referred to as a second component, and similarly, a second component can also be referred to as a first component. Unless otherwise specified, terms in the singular form may also include plural forms.

[0166] The terms used herein are for the purpose of describing specific embodiments, and are not intended to be limited. As used herein, "one", "the", "at least one" do not represent the limitation of quantity, and are intended to include both the singular and the plural, unless the context clearly indicates otherwise. For example, unless the context clearly indicates otherwise, "element" has the same meaning as "at least one element". "At least one" is not interpreted as being limited to "one" or "one". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the items listed in the association. It will be further understood that the term "comprising" and / or "comprising", or "comprising" / and or "comprising" specifies the presence of the features, regions, wholes, steps, operations, elements and / or components when used in this specification, but does not exclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components and / or their groups.

[0167] The terms "about" or "approximately" as used herein include the stated value, and include a suitable range of deviations from the particular value determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of a particular quantity. For example, the term "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0168] As used herein, the term "substantially" means approximately or substantially equal (e.g., within a threshold percentage of being equal). As used herein, the term "substantially simultaneously" means approximately or substantially at the same time (e.g., within a threshold percentage of being equal). As used herein, the term "substantially the same" means approximately or substantially the same (e.g., within a threshold difference amount).

[0169] For ease of description, spatially relative terms such as "below," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figure. It will be understood that, in addition to the orientation depicted in the figure, spatially relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as being "below" or "below" other elements or features will be oriented as being "above" the other elements or features. Therefore, the term "below" can encompass both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.

[0170] Embodiments are described herein with reference to cross-sectional illustrations, which are schematic illustrations of example embodiments. Thus, variations from the illustrated shapes may be expected as a result of, for example, manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be interpreted as being limited to the specific shapes of the zones illustrated herein, but will include deviations in shapes caused by, for example, manufacturing. For example, a zone illustrated or described as flat may typically have rough and / or nonlinear features. In addition, illustrated sharp corners may be rounded. Therefore, the zones illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the zones and are not intended to limit the scope of the claims.

[0171] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will be further understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0172] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, and include various changes, equivalents or replacements for corresponding embodiments. With respect to the description of the accompanying drawings, similar reference numerals may be used to indicate similar or related elements. It should be understood that, unless otherwise clearly indicated by the relevant context, the singular form of the noun corresponding to the entry may include one or more things. As used herein, each of such phrases as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any one or all possible combinations of the entries listed together in the corresponding phrases in these phrases.

[0173] It should be understood that if an element (e.g., a first element) is referred to as being “coupled,” “coupled to,” “connected,” or “connected to” another element (e.g., a second element), with or without the term “operably” or “communicatively,” it means that the element can be coupled to the other element directly (e.g., wired), wirelessly, or via a third element.

[0174] The foregoing is an illustration of example embodiments and should not be construed as limiting the example embodiments. Although some embodiments have been described, it will be readily appreciated by those skilled in the art that many modifications are possible in the embodiments that do not essentially depart from the novel teachings and advantages of the aspects and features supported by the present disclosure. Thus, for example, all such modifications are intended to be included within the scope of the aspects and features supported by the present disclosure as defined in the claims. Therefore, it should be understood that the foregoing is an illustration of various example embodiments and is not to be construed as being limited to the specific embodiments disclosed, and modifications to the disclosed embodiments as well as other embodiments are intended to be included within the scope of the appended claims.

Claims

1. A display device, comprising: A display panel, the display panel comprising a panel pad portion; a circuit board under the display panel and including a circuit pad portion, wherein the circuit pad portion is at least partially exposed from the display panel in a plan view; as well as A connection member electrically connects the panel pad portion and the circuit pad portion.

2. The display device according to claim 1, wherein: One end of the connection member is bonded to an upper surface of the panel pad portion, and the other end of the connection member is bonded to an upper surface of a portion of the circuit pad portion exposed from the display panel.

3. The display device according to claim 2, wherein: The connecting member extends from the upper surface of the panel pad portion to the upper surface of the circuit pad portion along the side surface of the panel pad portion, wherein the side surface of the panel pad portion defines a portion of an outline of the display panel in a plan view, and The portion of the contour located on the circuit board has a straight line shape, a curved line shape, a concave-convex shape, or a zigzag shape in the plan view.

4. The display device according to claim 1, wherein: The connection member is not arranged on a lower surface of the display panel.

5. The display device according to claim 1, wherein: The connection member includes a conductive material.

6. The display device according to claim 1, wherein: At least a portion of the circuit pad portion overlaps the display panel in a plan view.

7. The display device according to claim 1, wherein: The circuit pad portion is attached to a lower surface of the display panel.

8. The display device according to claim 1, wherein: The circuit pad portion is located below the panel pad portion.

9. The display device according to claim 8, wherein: At least a portion of the circuit pad portion is exposed from the panel pad portion in a plan view.

10. The display device according to claim 8, wherein: At least a portion of the circuit land portion overlaps the panel land portion in a plan view.

11. A method for manufacturing a display device, the method comprising: cutting a portion of the display panel by irradiating the display panel including the panel pad portion with laser based on a cutting line; as well as A connecting member is formed, the connecting member comprising: One end connected to the upper surface of the panel pad portion; as well as The other end is joined to an upper surface of a circuit pad portion below the display panel, wherein the circuit pad portion is at least partially exposed from the display panel.

12. The method according to claim 11, wherein: The cutting of the portion of the display panel includes cutting a portion of the panel pad portion.

13. The method according to claim 12, wherein: defining at least one side surface of the panel pad portion by the cutting of the portion of the panel pad portion; and The forming of the connection member includes forming the connection member such that the connection member extends along the side surface of the panel pad portion.

14. The method according to claim 11, further comprising: attaching a circuit board including the circuit pad portion to the display panel below the display panel, wherein said attaching of said circuit board is performed before said forming of said connection member.

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