Packaging structure of chip circuit board

Abstract

The invention discloses a packaging structure of a chip circuit board, and relates to the technical field of chip circuit board equipment.The packaging structure of the chip circuit board comprises a packaging cover and further comprises a mounting base mounted at the bottom of the packaging cover. The wiring terminals and the wiring pins are used for assisting the chip circuit board in normal use, and the top mounting plate and the second heat dissipation metal plate are used for conducting auxiliary temperature conduction on the interior of the packaging cover, so that the auxiliary heat dissipation effect is achieved; the supporting bottom plate is arranged, multiple heat dissipation treatment is carried out through the second heat dissipation metal plate, the first heat dissipation metal plate and the heat dissipation fan, the service life of internal elements is prolonged, meanwhile, the installation height can be conveniently adjusted, and when a sealing state needs to be achieved, the installation is convenient. And the second mounting grooves reserved in the two supporting bottom plates and the two mounting bottom plates are matched with the insertion plates for packaging treatment, so that the use flexibility of the whole equipment is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip circuit board equipment, and in particular to a packaging structure of a chip circuit board. Background Art

[0002] With the development of science and technology, many smart electronic products have appeared around us, enriching our lives and improving the quality of life. Most of these electronic products work by manipulating the internal chips. Chips are relatively small and complex electronic products. If they are to be used for a long time, they must be packaged and protected. Chip packaging technology is to wrap the chip to avoid contact with the outside world and prevent damage to the chip body. Impurities and bad gases in the air, and even water vapor, will corrode the precision circuits on the chip, causing the electrical performance to deteriorate. Different packaging technologies vary greatly in manufacturing processes and processes, and packaging also plays a vital role in the performance of the memory chip itself.

[0003] Chinese patent announcement number CN 209963048 U discloses a chip circuit board packaging structure, including a sealing body, a substrate is arranged on the inner side of the sealing body, a chip body is arranged on the top of the substrate, and metal pin bodies are mounted on both sides of the sealing body at positions corresponding to the chip body, and the metal pin bodies and the chip body are electrically connected through leads, and a heat dissipation groove is opened on the front side of the sealing body at a position corresponding to the chip body, and a cooling pipe is arranged in the heat dissipation groove. The utility model, through the mutual cooperation between the heat dissipation groove, the cooling pipe, the elastic capsule, the anti-collision strip and the silicone block, under the joint action of the heat dissipation groove and the cooling pipe, can further improve the heat dissipation capacity of the sealing body, the elastic capsule has the function of shock absorption and isolation, slowing down the impact of external force on the substrate through the sealing body, avoiding the loosening of the chip body due to the impact of external force, and extending the service life.

[0004] However, the above scheme still has the following problems: the auxiliary chip circuit board heat dissipation is performed in a single manner, resulting in poor heat dissipation efficiency. At the same time, when the heat dissipation device fails, it will affect the normal heat dissipation of the chip circuit board, thereby reducing the service life of the equipment. The operation is cumbersome when switching from the packaging state to the maintenance state, and it is difficult to quickly disassemble and assemble the equipment, which lengthens the normal maintenance cycle. It is impossible to fine-tune the height of the equipment according to the installation and use scenarios. The overall flexibility of use is low and cannot meet the needs of normal use. Therefore, the present invention needs to design a chip circuit board packaging structure to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a chip circuit board packaging structure to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a chip circuit board packaging structure, including a packaging cover, and also including:

[0007] A mounting base is installed at the bottom of the packaging cover;

[0008] A battery pack is disposed inside the packaging cover, and a chip circuit board extending to the inside of the mounting base is installed below the battery pack;

[0009] A collecting box is installed inside the mounting base, a guide plate is installed on one side of the collecting box, a mounting sleeve is installed below the collecting box, a connecting sleeve is installed at one end of the mounting sleeve, a valve is installed on the outside of the connecting sleeve, a feed sleeve is installed at the other end of the mounting sleeve, and the mounting sleeve is used to collect leaked liquid inside the packaging cover and the mounting base;

[0010] A symmetrically distributed supporting packaging mechanism is installed at the bottom of the mounting base, and the supporting packaging mechanism is used to support the packaging cover and the mounting base.

[0011] As a preferred embodiment of the present invention, the interior of the mounting base is provided with an installation cavity for cooperating with the installation of the collection box, the top of the collection box is provided with a plurality of equidistantly distributed filter holes, and one side of the collection box is provided with a guide groove for cooperating with the guide plate, the guide groove is used to collect the leaked liquid until it enters the interior of the collection box, and the guide groove can be designed as an inclined structure to reduce the situation where residual liquid stays.

[0012] As a preferred embodiment of the present invention, the supporting packaging mechanism includes a supporting base plate and an installing base plate. The bottom of the installing base is installed with symmetrically distributed installing base plates. Support base plates are installed under the two installing base plates. The bottoms of the two installing base plates are threadedly connected with symmetrically distributed first positioning bolts extending to the inner wall of the installing base. The supporting packaging mechanism and the installing base are reinforced and installed by the first positioning bolts, which facilitates quick disassembly and assembly during maintenance and reduces the labor intensity of manual maintenance.

[0013] As a preferred embodiment of the present invention, the tops of the two support base plates are fixedly connected with symmetrically distributed support columns, the top of each support column is slidably connected with a sliding support rod, and one end of the top of each sliding support rod is fixedly connected to the bottom of the corresponding support column.

[0014] As a preferred embodiment of the present invention, the interior of the two support base plates are both threadedly connected with a second positioning bolt, the second positioning bolt is located on one side of the support column, and the side where the two support base plates are close to each other and the side where the two mounting base plates are close to each other are both provided with a second mounting groove. An insert plate is installed inside the two second mounting grooves on the same side, and the insert plate is used to encapsulate the packaging cover and the bottom of the mounting base. The overall equipment is positioned and installed by cooperating with the support base plate and the second positioning bolt, which improves the overall stability during use. The height of the packaging cover can be adjusted according to the different installation height requirements of the use scenario, the limit pin is removed, and the sliding support rod is pulled out upward from the inside of the support column to adjust the height until the required height is reached, and the limit pin is used to re-position it to meet the requirements.

[0015] As a preferred embodiment of the present invention, a conveying inner pipe is installed inside the installation sleeve, one end of the conveying inner pipe is installed with a connecting channel extending to the inside of the feed sleeve, and a buzzer is fixedly connected to one side of the installation base; the liquid level sensor is used to monitor the leakage of liquid inside the connecting channel in real time, and when the set value is reached, an external buzzer is used for timely warning.

[0016] As a preferred embodiment of the present invention, an external pipe is installed on one side of the feed sleeve, an emergency discharge pipe extending to the interior of the mounting sleeve is installed inside the feed sleeve, a sealing sleeve is provided between the mounting sleeve and the connecting sleeve, a connecting pipe is provided between the feed sleeve and the collecting box, and the collecting box and the feed sleeve are connected through the connecting pipe, so that the collected leaked liquid is transported to the interior of the mounting sleeve through the collecting box, and auxiliary early warning processing is performed while collecting, thereby reducing safety hazards and facilitating timely manual cleaning.

[0017] As a preferred embodiment of the present invention, a mounting frame is installed inside the packaging cover and below the battery pack, a cooling fan is installed inside the mounting frame, the inner wall of the packaging cover is provided with equidistantly distributed first mounting grooves, and both sides of the packaging cover are fixedly connected with a plurality of equidistantly distributed first cooling metal plates, the first cooling metal plates match the positions of the first mounting grooves, the first cooling metal plates and the first mounting grooves are used for auxiliary heat dissipation treatment inside the packaging cover, and auxiliary internal heat dissipation treatment is performed by the cooling fan, the cooling fan is a bidirectional fan, and the blowing direction can be adjusted as needed during use, thereby improving flexibility during use.

[0018] As a preferred embodiment of the present invention, a plurality of equally spaced metal patches are installed on the outside of the battery pack, a plurality of equally spaced connection terminals are installed on the top of the chip circuit board, and a plurality of equally spaced connection pins are installed on the bottom of the chip circuit board. The connection terminals and connection pins are used to assist the normal use of the chip circuit board.

[0019] As a preferred embodiment of the present invention, the top of the packaging cover is fixedly connected to a top mounting plate, and a plurality of equally spaced second heat dissipating metal plates are mounted on the top of the top mounting plate, and the bottom end of each second heat dissipating metal plate extends to the interior of the top mounting plate and close to the battery pack, and the top mounting plate and the second heat dissipating metal plate are used for auxiliary temperature conduction inside the packaging cover to achieve an auxiliary heat dissipation effect.

[0020] As a preferred embodiment of the present invention, a wireless signal transceiver is installed on the outside of the mounting base, the buzzer is located on one side of the wireless signal transceiver, the buzzer is connected to the mounting base through a positioning bolt, the inside of the wireless signal transceiver is fixedly connected to a main control board, the outside of the main control board is fixedly connected to a control chip, and the cooling fan, battery pack wireless signal transceiver, buzzer, liquid level sensor, valve and chip circuit board are all electrically connected to the control chip.

[0021] As a preferred embodiment of the present invention, the control chip is used to control the operation of the cooling fan, battery pack, wireless signal transceiver, buzzer, liquid level sensor, valve and chip circuit board, thereby realizing unified management of power equipment.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The present invention is provided with a packaging cover, a mounting base, a top mounting plate and a chip circuit board. When in use, a guide groove used in conjunction with a guide plate is provided on one side of the collection box. The guide groove is used to collect leaked liquid until it enters the interior of the collection box. The guide groove can be designed as an inclined structure to reduce the situation where residual liquid stays. The liquid level sensor is used to monitor the leakage of liquid in the connection channel in real time. When the set value is reached, an external buzzer is used for timely early warning. A sealing sleeve is installed between the feed sleeve and the collection box, and the collection box and the feed sleeve are sealed and connected by the sealing sleeve. The overall equipment is positioned and installed by the support bottom plate and the second positioning bolt, which improves the overall stability during use. The height of the packaging cover can be adjusted according to the different installation height requirements of the use scenario. The limit pin is removed, and the sliding support rod is pulled out from the inside of the support column to the upper side to adjust the height until the required height is reached. The limit pin is used to re-position it to meet the requirements. The wiring terminals and wiring pins are used to assist the normal use of the chip circuit board. The top mounting plate and the second heat dissipation metal plate are used to assist temperature conduction inside the packaging cover to achieve an auxiliary heat dissipation effect.

[0024] 2. The present invention is provided with a supporting base plate. During actual installation, the whole is installed in the order of the top mounting plate, the packaging cover, the mounting base and the two supporting base plates. The battery pack, the mounting frame and the chip circuit board are placed in the packaging cover and the interior in turn for overall installation. During use, the guide plate inside the mounting base guides the leakage to the inside of the collection box, and the leakage is transported to the inside of the mounting sleeve through the collection box. The connecting channel monitors the leakage flow in real time, and an external buzzer is used for early warning when the set value is exceeded. Multiple heat dissipation treatments are performed through the second heat dissipation metal plate, the first heat dissipation metal plate and the heat dissipation fan, which prolongs the service life of the internal components and meets the needs during use. The supporting packaging mechanism is used to assist in positioning and installing the whole, and the installation height is conveniently adjusted. When a sealed state is required, the second mounting grooves reserved inside the two supporting base plates and the two mounting base plates are used in conjunction with the plug-in board for packaging treatment, thereby improving the flexibility of use of the overall equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of the three-dimensional structure of a chip circuit board packaging structure in one direction provided by an embodiment of the present invention;

[0026] Figure 2 A schematic diagram of the three-dimensional structure of the chip circuit board packaging structure provided by an embodiment of the present invention in another direction;

[0027] Figure 3 A schematic diagram of the exploded structure of a chip circuit board packaging structure in one direction provided by an embodiment of the present invention;

[0028] Figure 4 A schematic diagram of the exploded structure of the chip circuit board packaging structure provided by an embodiment of the present invention in another direction;

[0029] Figure 5 An enlarged three-dimensional structural schematic diagram of a mounting base in one direction provided by an embodiment of the present invention;

[0030] Figure 6 An enlarged bottom view of the mounting base provided in an embodiment of the present invention;

[0031] Figure 7 An enlarged three-dimensional structural schematic diagram of a mounting sleeve provided in an embodiment of the present invention;

[0032] Figure 8 A schematic diagram of an enlarged internal structure of a mounting sleeve provided in an embodiment of the present invention;

[0033] Fig. 9 for Figure 3 A schematic diagram of the enlarged structure at A in the middle;

[0034] Fig.10 for Figure 3A schematic diagram of the enlarged structure at B in the middle;

[0035] Fig.11 This is a schematic diagram of an enlarged three-dimensional structure of a mounting base in another direction provided by an embodiment of the present invention.

[0036] The following are marked in the figure:

[0037] 1. Packaging cover; 11. Mounting frame; 12. Cooling fan; 13. First mounting slot; 14. Battery pack; 15. Metal patch; 16. First heat dissipation metal plate; 17. Wireless signal transceiver; 18. Buzzer;

[0038] 2. Mounting base; 21. Mounting inner cavity; 22. Collection box; 221. Guide groove; 23. Mounting sleeve; 231. Conveying inner pipe; 232. Connecting channel; 233. Liquid level sensor; 234. Connecting pipe; 235. Conveying port; 24. Sealing sleeve; 25. Feeding sleeve; 26. External pipe; 27. Connecting sleeve; 28. Valve; 29. ​​Emergency discharge pipe;

[0039] 3. Support base plate; 31. Mounting base plate; 32. Support column; 33. Sliding support rod; 34. Limiting pin; 35. First positioning bolt; 36. Second positioning bolt; 37. Second mounting slot;

[0040] 4. Top mounting plate; 41. Second heat dissipation metal plate;

[0041] 5. Chip circuit board; 51. Wiring terminal; 52. Wiring pin;

[0042] 6. Guide plate. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0044] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0045] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0047] See also Figures 1 to 11 As shown, the present invention provides a technical solution: a packaging structure of a chip circuit board, comprising a packaging cover 1, and also comprising: a mounting base 2 is installed at the bottom of the packaging cover 1; a battery pack 14 is arranged inside the packaging cover 1, and a chip circuit board 5 extending to the inside of the mounting base 2 is installed below the battery pack 14; a collecting box 22 is installed inside the mounting base 2, a guide plate 6 is installed on one side of the collecting box 22, a mounting sleeve 23 is installed below the collecting box 22, a connecting sleeve 27 is installed at one end of the mounting sleeve 23, a valve 28 is installed on the outer side of the connecting sleeve 27, a feed sleeve 25 is installed at the other end of the mounting sleeve 23, and the mounting sleeve 23 is used to collect leaked liquid inside the packaging cover 1 and the mounting base 2; symmetrically distributed supporting packaging mechanisms are installed at the bottom of the mounting base 2, and the supporting packaging mechanisms are used to support the packaging cover 1 and the mounting base 2. The top of the packaging cover 1 is fixedly connected to a top mounting plate 4, and a plurality of equally spaced second heat dissipating metal plates 41 are mounted on the top of the top mounting plate 4, and a bottom end of each of the second heat dissipating metal plates 41 extends into the interior of the top mounting plate 4 and is close to the battery pack 14.

[0048] A chip circuit board packaging structure provided by an embodiment of the present invention, when in use, is installed as a whole in the order of a top mounting plate 4, a packaging cover 1, a mounting base 2 and two supporting bottom plates 3, a battery pack 14, a mounting frame 11 and a chip circuit board 5 are sequentially placed inside the packaging cover 1 for overall installation, when in use, a guide plate 6 inside the mounting base 2 guides leakage to the inside of a collection box 22, and the leakage is transported to the inside of the mounting sleeve 23 through the collection box 22, the connection channel 232 monitors the leakage flow in real time, and when the set value is exceeded, an early warning is performed through the external buzzer 18, multiple heat dissipation treatments are performed through the second heat dissipation metal plate 41, the first heat dissipation metal plate 16 and the heat dissipation fan 12, thereby extending the service life of the internal components and meeting the needs during use, the supporting packaging mechanism cooperates to assist in positioning and installing the whole, and at the same time facilitates the adjustment of the installation height, and when a sealed state is required, the second mounting groove 37 reserved inside the two supporting bottom plates 3 and the two mounting bottom plates 31 cooperates with the plug board for packaging treatment, thereby improving the flexibility of use of the overall device.

[0049] A chip circuit board packaging structure provided by an embodiment of the present invention is shown in FIG. Figures 1 to 8 The interior of the mounting base 2 is provided with an installation cavity 21 for installing the collecting box 22. The top of the collecting box 22 is provided with a plurality of equidistantly distributed filter holes. One side of the collecting box 22 is provided with a guide groove 221 for use with the guide plate 6. The guide groove 221 is used to collect the leaked liquid until it enters the interior of the collecting box 22. The guide groove 221 can be designed as an inclined structure to reduce the situation where residual liquid stays. The interior of the mounting sleeve 23 is provided with a conveying inner pipe 231. One end of the conveying inner pipe 231 is provided with a connecting channel 232 extending to the interior of the feed sleeve 25. A buzzer 18 is fixedly connected to one side of the mounting base 2. The liquid level sensor 233 is used to monitor the leakage of liquid inside the connecting channel 232 in real time. When the set value is reached, the external buzzer 18 is used for early warning. An external pipe 26 is installed on one side of the feed sleeve 25. An emergency discharge pipe 29 extending to the inside of the mounting sleeve 23 is installed inside the feed sleeve 25. The emergency discharge pipe 29 is used for auxiliary liquid discharge during maintenance. When not in use, a sealing plug is provided at the end of the emergency discharge pipe 29 to seal the emergency discharge pipe 29. A sealing sleeve 24 is sleeved between the mounting sleeve 23 and the connecting sleeve 27. The sealing sleeve 24 is used to seal the connection sleeve 27 and the mounting sleeve 23 to achieve a sealing effect.

[0050] A chip circuit board packaging structure provided by an embodiment of the present invention has a connecting pipe 234 installed between a feed sleeve 25 and a collection box 22. Specifically, a delivery port 235 is provided on the feed sleeve 234, and the delivery port 235 is connected to the delivery inner pipe 231, and one end of the connecting pipe 234 is communicated with the delivery port. The collection box 22 and the feed sleeve 25 are connected through the connecting pipe 234, so that the collected leaked liquid is transported to the inside of the installation sleeve 23 through the collection box 22, and auxiliary early warning processing is performed while collecting, thereby reducing safety hazards and facilitating manual cleaning in a timely manner.

[0051] A chip circuit board packaging structure provided by an embodiment of the present invention is shown in FIG. Figures 1 to 4 , Fig. 9 The support packaging mechanism includes a support base plate 3 and an installation base plate 31. A symmetrically distributed installation base plate 31 is installed at the bottom of the installation base 2. A support base plate 3 is installed under the two installation base plates 31. The bottoms of the two installation base plates 31 are threadedly connected with first positioning bolts 35 that are symmetrically distributed and extend to the inner wall of the installation base 2. The support packaging mechanism and the installation base 2 are reinforced and installed by the first positioning bolts 35, which are convenient for quick disassembly and assembly during maintenance, and reduce the labor intensity of manual maintenance. The tops of the two support base plates 3 are fixedly connected with symmetrically distributed support columns 32, and the tops of the support columns 32 are slidably connected with sliding support rods 33. One side of the support columns 32 is installed with a limiting pin 34 used to cooperate with the sliding support rod 33. The top ends of the sliding support rods 33 are fixedly connected to the bottoms of the corresponding support columns 32. The interiors of the two support base plates 3 are threadedly connected with second positioning bolts 36, and the second positioning bolts 36 are located on one side of the support columns 32.

[0052] A chip circuit board packaging structure provided by an embodiment of the present invention has a second installation groove 37 formed on one side of the two supporting base plates 3 and one side of the two mounting base plates 31. Insert plates are installed inside the two second mounting grooves 37 on the same side. The insert plates are used to package the packaging cover 1 and the bottom of the mounting base 2. The supporting base plate 3 and the second positioning bolt 36 cooperate to position and install the entire device, thereby improving the overall stability during use. The height of the packaging cover 1 can be adjusted according to the different installation height requirements of the use scenario, the limit pin 34 is removed, and the sliding support rod 33 is pulled upward from the inside of the support column 32 to adjust the height until the required height is reached, and the limit pin 34 is used to re-position the device to meet the requirements.

[0053] A chip circuit board packaging structure provided by an embodiment of the present invention is shown in FIG. Figures 1 to 4 , Fig.10As shown, a mounting frame 11 is installed inside the packaging cover 1 and below the battery pack 14, a cooling fan 12 is installed inside the mounting frame 11, a plurality of equidistantly distributed first mounting grooves 13 are formed on the inner wall of the packaging cover 1, and a plurality of equidistantly distributed first heat dissipation metal plates 16 are fixedly connected to both sides of the packaging cover 1.

[0054] A chip circuit board packaging structure provided by an embodiment of the present invention matches the position of a first heat dissipation metal plate 16 with a first mounting groove 13. The first heat dissipation metal plate 16 and the first mounting groove 13 are used to perform auxiliary heat dissipation treatment on the inside of the packaging cover 1. A heat dissipation fan 12 is used to perform auxiliary internal heat dissipation treatment. The heat dissipation fan 12 is a bidirectional fan. The blowing direction can be adjusted as needed during use, thereby improving flexibility during use.

[0055] A chip circuit board packaging structure provided by an embodiment of the present invention is shown in FIG. Figures 1 to 11 As shown, a plurality of equally spaced metal patches 15 are installed on the outside of the battery pack 14, a plurality of equally spaced wiring terminals 51 are installed on the top of the chip circuit board 5, and a plurality of equally spaced wiring pins 52 are installed on the bottom of the chip circuit board 5. The wiring terminals 51 and the wiring pins 52 are used to assist the normal use of the chip circuit board 5. The top of the packaging cover 1 is fixedly connected with a top mounting plate 4, and a plurality of equally spaced second heat dissipation metal plates 41 are installed on the top of the top mounting plate 4. The bottom end of each second heat dissipation metal plate 41 extends to the inside of the top mounting plate 4 and is close to the battery pack 14. The mounting plate 4 and the second heat dissipation metal plate 41 are used for auxiliary temperature conduction inside the packaging cover 1 to achieve auxiliary heat dissipation effect. A wireless signal transceiver 17 is installed on the outside of the mounting base 2. The buzzer 18 is located on one side of the wireless signal transceiver 17. The buzzer 18 is connected to the mounting base 2 through a positioning bolt. The inside of the wireless signal transceiver 17 is fixedly connected to a main control board, and the outside of the main control board is fixedly connected to a control chip. The cooling fan 12, battery pack 14, wireless signal transceiver 17, buzzer 18, liquid level sensor 233, valve 28 and chip circuit board 5 are all electrically connected to the control chip.

[0056] An embodiment of the present invention provides a chip circuit board packaging structure, in which a control chip is used to control the operation of a cooling fan 12, a battery pack 14, a wireless signal transceiver 17, a buzzer 18, a liquid level sensor 233, a valve 28 and a chip circuit board 5, thereby realizing unified management of power equipment. The liquid level sensor 233 measures whether there is excessive leakage inside the installation sleeve 23, converts the liquid into a signal and sends it to the control chip. The control chip receives and processes the signal and generates a corresponding control signal according to a preset control algorithm.

[0057] A chip circuit board packaging structure provided by an embodiment of the present invention has a guide groove for use with a guide plate on one side of a collection box during use. The guide groove is used to collect leaked liquid until it enters the interior of the collection box. The guide groove can be designed as an inclined structure to reduce the retention of residual liquid. A liquid level sensor is used to monitor the leakage of liquid in the connection channel in real time. When the set value is reached, an external buzzer is used for timely warning. A sealing sleeve is installed between the feed sleeve and the collection box, and the collection box and the feed sleeve are sealed and connected by the sealing sleeve. The overall equipment is positioned and installed by supporting the bottom plate and the second positioning bolt, thereby improving the overall stability during use. The height of the packaging cover can be adjusted according to the different installation height requirements of the use scenario. The limit pin is removed, and the sliding support rod is pulled out from the inside of the support column to the upper side to adjust the height until the required height is reached. The limit pin is used to re-position the rod to meet the requirements. The wiring terminals and wiring pins are used to assist the normal use of the chip circuit board. The top mounting plate and the second heat dissipation metal plate are used to assist temperature conduction inside the packaging cover to achieve an auxiliary heat dissipation effect.

[0058] A chip circuit board packaging structure provided by an embodiment of the present invention is installed as a whole in the order of a top mounting plate, a packaging cover, a mounting base and two supporting bottom plates during actual installation. The battery pack, the mounting frame and the chip circuit board are placed in the packaging cover and the inside in turn for overall installation. When in use, the guide plate inside the mounting base guides leakage to the inside of a collection box, and the leakage is transported to the inside of a mounting sleeve through the collection box. The connecting channel monitors the leakage flow in real time, and an external buzzer is used for early warning when the set value is exceeded. Multiple heat dissipation treatments are performed through the second heat dissipation metal plate, the first heat dissipation metal plate and the heat dissipation fan, thereby extending the service life of the internal components and meeting the needs during use. The supporting packaging mechanism is used to assist in positioning and installing the whole, and at the same time, the installation height can be adjusted conveniently. When a sealed state is required, the second mounting grooves reserved inside the two supporting bottom plates and the two mounting bottom plates are used in conjunction with the plug-in board for packaging treatment, thereby improving the flexibility of use of the overall equipment.

[0059] The embodiment of the present invention provides a chip circuit board packaging structure, and its working principle is as follows:

[0060] When in use, a guide groove is provided on one side of the collection box 22 for use with the guide plate 6. The guide groove is used to collect the leaked liquid until it enters the collection box 22. The guide groove can be designed as an inclined structure to reduce the situation where residual liquid stays.

[0061] The liquid level sensor 233 is used to monitor the leakage of liquid inside the connecting channel 232 in real time, and to issue an early warning through the external buzzer 18 when the set value is reached;

[0062] A connecting pipe 234 is installed between the feed sleeve 25 and the collection box 22, and the collection box 22 and the feed sleeve 25 are connected through the connecting pipe 234, so that the collected leaked liquid is transported to the inside of the installation sleeve 23 through the collection box 22, and assists in early warning processing while collecting, reducing safety hazards and facilitating manual cleaning in a timely manner;

[0063] The first positioning bolts 35 are used to reinforce the support packaging mechanism and the mounting base 2, which facilitates quick disassembly and assembly during maintenance, thereby reducing the labor intensity of manual maintenance.

[0064] A second mounting groove 37 is provided on one side of the two supporting base plates 3 and the mounting base plate 31, and an insert plate is installed inside the two second mounting grooves 37 on the same side, and the insert plate is used to perform packaging processing on the bottom of the packaging cover 1 and the mounting base 2;

[0065] The overall device is positioned and installed by cooperating with the support base plate 3 and the second positioning bolt 36, which improves the overall stability during use. The height of the packaging cover 1 can be adjusted according to the different installation height requirements of the use scenario. The limit pin 34 is removed, and the sliding support rod 33 is pulled upward from the inside of the support column 32 to adjust the height until the required height is reached, and the limit pin 34 is used to re-position it to meet the requirements;

[0066] The connection terminals 51 and the connection pins 52 are used to assist the normal use of the chip circuit board 5, and the top mounting plate 4 and the second heat dissipation metal plate 41 are used to assist the temperature conduction inside the packaging cover 1 to achieve an auxiliary heat dissipation effect;

[0067] The first heat dissipation metal plate 16 matches the position of the first mounting groove 13. The first heat dissipation metal plate 16 and the first mounting groove 13 are used to assist in heat dissipation treatment inside the packaging cover 1. The heat dissipation fan 12 assists in internal heat dissipation treatment. The heat dissipation fan 12 is a bidirectional fan. When in use, the blowing direction can be adjusted as needed, thereby improving flexibility during use.

[0068] The control chip is used to control the operation of the cooling fan 12, the battery pack 14, the wireless signal transceiver 17, the buzzer 18, the liquid level sensor 233, the valve 28 and the chip circuit board 5, thereby realizing the unified management of the power equipment;

[0069] The liquid level sensor 233 is used to measure whether there is excessive liquid leakage inside the installation sleeve 23, and converts it into a signal and sends it to the control chip. The control chip receives and processes the signal and generates a corresponding control signal according to a preset control algorithm;

[0070] During actual installation, the whole is installed in the order of the top mounting plate 4, the packaging cover 1, the mounting base 2 and the two supporting bottom plates 3. The battery pack 14, the mounting frame 11 and the chip circuit board 5 are placed in the packaging cover 1 in turn for overall installation. When in use, the guide plate 6 inside the mounting base 2 guides the leakage to the inside of the collection box 22, and then transports it to the inside of the mounting sleeve 23 through the collection box 22. The connecting channel 232 monitors the leakage flow in real time. When it exceeds the set value, an external buzzer 18 is used for early warning. Multiple heat dissipation treatments are performed through the second heat dissipation metal plate 41, the first heat dissipation metal plate 16 and the heat dissipation fan 12, which prolongs the service life of the internal components and meets the needs during use. The supporting packaging mechanism is used to assist in positioning and installing the whole, and the installation height is conveniently adjusted. When it needs to be in a sealed state, the second mounting groove 37 reserved inside the two supporting bottom plates 3 and the two mounting bottom plates 31 is used in conjunction with the plug-in board for packaging treatment, which improves the flexibility of use of the overall equipment.

[0071] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip circuit board packaging structure, comprising a packaging cover (1), characterized in that: Also includes: A mounting base (2) is mounted on the bottom of the packaging cover (1); A battery pack (14) is arranged inside the packaging cover (1), and a chip circuit board (5) is installed below the battery pack (14); A collecting box (22) is installed inside the mounting base (2), a guide plate (6) is installed on one side of the collecting box (22), a mounting sleeve (23) is installed below the collecting box (22), a connecting sleeve (27) is installed at one end of the mounting sleeve (23), a valve (28) is installed on the outside of the connecting sleeve (27), and a feed sleeve (25) is installed at the other end of the mounting sleeve (23), and the mounting sleeve (23) is used to collect leaked liquid inside the packaging cover (1) and the mounting base (2); A symmetrically distributed supporting packaging mechanism is installed at the bottom of the installation base (2), and the supporting packaging mechanism is used to support the packaging cover (1) and the installation base (2); A mounting frame (11) is installed inside the packaging cover (1) and below the battery pack (14); a cooling fan (12) is installed inside the mounting frame (11); a plurality of first mounting grooves (13) distributed at equal intervals are formed on the inner wall of the packaging cover (1); and a plurality of first cooling metal plates (16) distributed at equal intervals are fixedly connected to both sides of the outside of the packaging cover (1); The top of the packaging cover (1) is fixedly connected to a top mounting plate (4), and a plurality of second heat dissipation metal plates (41) distributed at equal intervals are mounted on the top of the top mounting plate (4), and a bottom end of each of the second heat dissipation metal plates (41) extends to the inside of the top mounting plate (4) and close to the position of the battery pack (14).

2. The chip circuit board packaging structure according to claim 1, characterized in that: The interior of the installation base (2) is provided with an installation inner cavity (21) for use in conjunction with the collection box (22) for installation, the top of the collection box (22) is provided with a plurality of filter holes distributed at equal intervals, and one side of the collection box (22) is provided with a guide groove (221) for use in conjunction with the guide plate (6).

3. The chip circuit board packaging structure according to claim 2, characterized in that: The supporting packaging mechanism comprises a supporting base plate (3) and a mounting base plate (31); the mounting base (31) is symmetrically mounted at the bottom of the mounting base (2); a supporting base plate (3) is mounted below each of the two mounting base plates (31); and the bottoms of the two mounting base plates (31) are threadedly connected with first positioning bolts (35) that are symmetrically mounted and extend to the inner wall of the mounting base (2).

4. The chip circuit board packaging structure according to claim 3, characterized in that: The tops of the two support base plates (3) are fixedly connected to two symmetrically distributed support columns (32), the top of each support column (32) is slidably connected to a sliding support rod (33), and one end of the top of each sliding support rod (33) is fixedly connected to the bottom of the corresponding support column (32).

5. The chip circuit board packaging structure according to claim 4, characterized in that: The interiors of the two supporting base plates (3) are both threadedly connected with a second positioning bolt (36), and the second positioning bolt (36) is located on one side of the supporting column (32). A second mounting groove (37) is provided on the side where the two supporting base plates (3) are close to each other and on the side where the two mounting base plates (31) are close to each other.

6. The chip circuit board packaging structure according to claim 2, characterized in that: A conveying inner pipe (231) is installed inside the installation sleeve (23), and a connecting channel (232) extending to the inside of the feed sleeve (25) is installed at one end of the conveying inner pipe (231), and a buzzer (18) is fixedly connected to one side of the installation base (2).

7. The chip circuit board packaging structure according to claim 6, characterized in that: An external pipe (26) is installed on one side of the feed sleeve (25), and an emergency discharge pipe (29) extending to the inside of the installation sleeve (23) is installed inside the feed sleeve (25).

8. The chip circuit board packaging structure according to claim 7, characterized in that: A sealing sleeve (24) is sleeved between the installation sleeve (23) and the connecting sleeve (27), and a connecting pipe (234) is installed between the feed sleeve (25) and the collecting box (22).

9. The chip circuit board packaging structure according to claim 1, characterized in that: The outer side of the battery pack (14) is mounted with a plurality of equally spaced metal patches (15), the top of the chip circuit board (5) is mounted with a plurality of equally spaced connection terminals (51), and the bottom of the chip circuit board (5) is mounted with a plurality of equally spaced connection pins (52).

10. The chip circuit board packaging structure according to claim 7, characterized in that: A wireless signal transceiver (17) is installed on the outside of the mounting base (2), a main control board is fixedly connected to the inside of the wireless signal transceiver (17), a control chip is fixedly connected to the outside of the main control board, and the cooling fan (12), the battery pack (14), the wireless signal transceiver (17), the buzzer (18), the liquid level sensor (233), the valve (28) and the chip circuit board (5) are all electrically connected to the control chip.

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