Circuit board heat dissipation structure and heat pump water heater

Abstract

The invention relates to a circuit board heat dissipation structure and a heat pump water heater, the circuit board heat dissipation structure comprises a heat exchanger, the heat exchanger comprises a shell, a containing cavity is formed in the shell, and the containing cavity is used for containing water to be subjected to heat exchange; the heat conduction structure is installed on the shell, and one part of the heat conduction structure is configured to make contact with water in the containing cavity; the circuit board assembly is installed on the heat conduction structure, and the heat conduction structure makes contact with the circuit board assembly and is used for conducting cooling and heat dissipation on the circuit board assembly. By means of the arrangement, heat of the circuit board assembly can be conducted to water in the heat exchanger through the heat conduction structure, and therefore cooling and heat dissipation of the circuit board assembly are achieved. The heat dissipation mode is not affected by the environment temperature, and the good heat dissipation effect can still be achieved even under the condition that the environment temperature is high. Therefore, the damage risk of the heating element in the circuit board assembly can be reduced.

Description

Technical Field

[0001] The present application relates to the field of heat pump technology, and in particular to a circuit board heat dissipation structure and a heat pump water heater. Background Art

[0002] In a heat pump water heater, a circuit board assembly is an essential device used to control the start and stop and working mode of the heat pump water heater. The circuit board assembly includes a circuit board and multiple heating elements located thereon. When the circuit board assembly is working, these heating elements will generate a lot of heat. If the heat is not dissipated in time, the temperature of the heating elements will be too high and damaged.

[0003] One heat dissipation method in the related art is to install a heat sink on the fan cavity side of the circuit board assembly to dissipate the heat. However, when the ambient temperature is high, the heat conduction effect of the heat sink is poor, and the heating elements of the circuit board assembly are still at a high risk of damage. Summary of the invention

[0004] The embodiments of the present application propose a circuit board heat dissipation structure and a heat pump water heater, which are intended to improve the heat dissipation effect of the circuit board assembly to reduce the risk of damage to the heating elements in the circuit board assembly.

[0005] An embodiment of the first aspect of the present application proposes a circuit board heat dissipation structure, which includes: a heat exchanger, which includes a shell, and a housing cavity is formed inside the shell, and the housing cavity is used to accommodate water to be exchanged; a heat-conducting structure, which is installed on the shell, and a part of the heat-conducting structure is configured to contact the water in the housing cavity; and a circuit board assembly, which is installed on the heat-conducting structure, and the heat-conducting structure is in contact with the circuit board assembly, and is used to cool and dissipate heat for the circuit board assembly.

[0006] The circuit board heat dissipation structure in the embodiment of the present application is provided with a heat-conducting structure, the heat-conducting structure is installed in the shell of the heat exchanger, a part of the heat-conducting structure is in contact with the water in the accommodating cavity of the shell, and the circuit board assembly is installed in the heat-conducting structure, and the heat-conducting structure is also in contact with the circuit board assembly. With such an arrangement, the heat of the circuit board assembly can be transferred to the water in the heat exchanger through the heat-conducting structure, thereby realizing the cooling and heat dissipation of the circuit board assembly. It can be understood that as long as the temperature of the water in the heat exchanger is lower than the temperature of the circuit board assembly, the process of transferring the heat of the circuit board assembly to the water can be realized. Therefore, this heat dissipation method is not affected by the ambient temperature, and even when the ambient temperature is high, it can still have a good heat dissipation effect. As a result, the risk of damage to the heating element in the circuit board assembly can be reduced.

[0007] In addition, while the water in the heat exchanger is used to cool and dissipate the heat of the circuit board assembly, the heat of the circuit board assembly also has a certain heating effect on the water, which is also beneficial to improving the heating effect of the heat pump water heater.

[0008] In some of the embodiments, the heat-conducting structure forms a heat-conducting surface, which is located outside the accommodating cavity; the circuit board assembly includes a circuit board and a heating element arranged on the circuit board, the circuit board is fixedly connected to the heat-conducting structure, and the heating element is in contact with the heat-conducting surface.

[0009] In some of the embodiments, the circuit board heat dissipation structure further includes a heat-conducting medium, and the heat-conducting medium is in contact with both the heating element and the heat-conducting surface.

[0010] In some of the embodiments, the heat-conducting structure includes a main board body and a mounting portion connected to the main board body, the mounting portion is connected to the shell and in contact with the water in the accommodating cavity; the mounting portion is located on one side of the main board body, the circuit board assembly is located on the other side of the main board body, and the circuit board assembly is connected to the main board body.

[0011] In some of the embodiments, the shell is provided with an opening, the mounting portion is provided at the opening, and the mounting portion is sealed and connected to the shell; the shell and the mounting portion jointly define the accommodating cavity.

[0012] In some embodiments, the mounting portion is provided with heat exchange fins, and the heat exchange fins are located in the accommodating cavity.

[0013] In some embodiments, the mounting portion is a metal piece, the main board body is a metal plate, and the mounting portion and the main board body are an integrated structure.

[0014] In some of the embodiments, the mounting portion is a metal piece, the main board body is a temperature averaging board, and the temperature averaging board includes a metal shell and a working fluid located inside the metal shell.

[0015] In some embodiments, the heat-conducting structure includes a main board body, which is inserted into the shell, a portion of the main board body is located in the accommodating cavity and in contact with the water in the accommodating cavity, and another portion of the main board body is located outside the accommodating cavity; the circuit board assembly is connected to the portion of the main board body located outside the accommodating cavity.

[0016] In some of the embodiments, the main board body is a metal plate.

[0017] In some embodiments, the main board body is a temperature averaging board, and the temperature averaging board includes a metal shell and a working fluid located inside the metal shell.

[0018] An embodiment of the second aspect of the present application proposes a heat pump water heater, which includes: a box body; a compressor; and a circuit board heat dissipation structure in any of the above embodiments, wherein the heat exchanger is connected to the compressor, and the heat exchanger, the compressor and the circuit board assembly are all located in the box body.

[0019] In the heat pump water heater in the embodiment of the present application, the circuit board heat dissipation structure is provided with a heat-conducting structure, the heat-conducting structure is installed in the shell of the heat exchanger, a part of the heat-conducting structure is in contact with the water in the accommodating cavity of the shell, and the circuit board assembly is installed in the heat-conducting structure, and the heat-conducting structure is also in contact with the circuit board assembly. In this way, the heat of the circuit board assembly can be transferred to the water in the heat exchanger through the heat-conducting structure, thereby realizing the cooling and heat dissipation of the circuit board assembly. It can be understood that as long as the temperature of the water in the heat exchanger is lower than the temperature of the circuit board assembly, the process of transferring the heat of the circuit board assembly to the water can be realized. Therefore, this heat dissipation method is not affected by the ambient temperature, and even in the case of high ambient temperature, it can still have a good heat dissipation effect. Thus, the risk of damage to the heating element in the circuit board assembly can be reduced. In addition, while using the water in the heat exchanger to cool and dissipate the heat of the circuit board assembly, the heat of the circuit board assembly also has a certain heating effect on the water, which is also conducive to improving the heating effect of the heat pump water heater. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of the three-dimensional structure of a circuit board heat dissipation structure provided in one embodiment of the present application;

[0022] Figure 2 A schematic front view of a circuit board heat dissipation structure provided in one embodiment of the present application;

[0023] Figure 3 A schematic side view of a circuit board heat dissipation structure provided in one embodiment of the present application;

[0024] Figure 4 A schematic top view of a circuit board heat dissipation structure provided in one embodiment of the present application;

[0025] Figure 5 A schematic diagram of the three-dimensional structure of a circuit board heat dissipation structure provided by another embodiment of the present application;

[0026] Figure 6 A schematic front view of a circuit board heat dissipation structure provided in another embodiment of the present application;

[0027] Figure 7 A schematic side view of a circuit board heat dissipation structure provided by another embodiment of the present application;

[0028] Figure 8 A schematic top view of a circuit board heat dissipation structure provided in another embodiment of the present application;

[0029] Fig. 9 A schematic diagram of the structure of a heat pump water heater provided in one embodiment of the present application.

[0030] Description of reference numerals:

[0031] 10. Circuit board heat dissipation structure;

[0032] 100, heat exchanger; 110, shell; 111, water inlet; 112, water outlet; 113, refrigerant inlet; 114, refrigerant outlet;

[0033] 200, heat conduction structure; 201, heat conduction surface; 210, main board; 220, mounting portion; 230, connecting column; 240, screw;

[0034] 300, circuit board assembly; 310, circuit board; 320, heating element;

[0035] 20. Heat pump water heater;

[0036] 21. Box body;

[0037] 22. Compressor;

[0038] 23. Fan assembly. DETAILED DESCRIPTION

[0039] The principles and features of the present application are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present application and are not used to limit the scope of the present application.

[0040] In a heat pump water heater, a circuit board assembly is an essential device used to control the start and stop and working mode of the heat pump water heater. The circuit board assembly includes a circuit board and multiple heating elements located thereon. When the circuit board assembly is working, these heating elements will generate a lot of heat. If the heat is not dissipated in time, the temperature of the heating elements will be too high and damaged.

[0041] One heat dissipation method in the related art is to install a heat sink on the fan cavity side of the circuit board assembly to dissipate the heat. However, when the ambient temperature is high, the heat conduction effect of the heat sink is poor, and the heating elements of the circuit board assembly are still at a high risk of damage.

[0042] The embodiment of the first aspect of the present application provides a circuit board heat dissipation structure, Figure 1 This is a schematic diagram of the three-dimensional structure of a circuit board heat dissipation structure provided in an embodiment of the present application. Figure 2 This is a schematic front view of a circuit board heat dissipation structure provided in one embodiment of the present application. Figure 3 A schematic side view of a circuit board heat dissipation structure provided in an embodiment of the present application. Figure 4 This is a top view schematic diagram of a circuit board heat dissipation structure provided in one embodiment of the present application. Figure 1 , Figure 2 , Figure 3 as well as Figure 4 As shown, the circuit board heat dissipation structure 10 includes a heat exchanger 100, a heat conductive structure 200 and a circuit board assembly 300. Specifically, the heat exchanger 100 includes a housing 110, and a receiving cavity is formed inside the housing 110, and the receiving cavity is used to receive water to be heat exchanged. The heat conductive structure 200 is mounted on the housing 110, and a part of the heat conductive structure 200 is configured to contact the water in the receiving cavity. The circuit board assembly 300 is mounted on the heat conductive structure 200, and the heat conductive structure 200 contacts the circuit board assembly 300, and is used to cool and dissipate heat for the circuit board assembly 300.

[0043] Specifically, the heat exchanger 100 is the heat exchanger in the heat pump water heater 20. Generally speaking, the heat pump water heater includes a compressor 22, a first heat exchanger, a throttling device and a second heat exchanger. The above components are connected in sequence to form a refrigerant circulation loop. In the process of refrigerant circulation, the refrigerant releases heat when passing through the first heat exchanger, and absorbs heat in the air when passing through the second heat exchanger. Among them, the first heat exchanger is the heat exchanger 100 in the circuit board heat dissipation structure 10. The heat exchanger 100 also includes a refrigerant pipe located inside the shell 110, the accommodating cavity is used to accommodate water, and the refrigerant pipe is used for the refrigerant to pass through. The refrigerant releases heat in the process of passing through the refrigerant pipe, and the heat is transferred to the water in the accommodating cavity, thereby heating the water. It is understandable that the heat exchanger 100 has a water inlet 111, a water outlet 112, a refrigerant inlet 113 and a refrigerant outlet 114, wherein the water inlet 111 and the water outlet 112 are both connected to the accommodating chamber, the water inlet 111 is used to allow the water to be heated to enter the accommodating chamber, and the water outlet 112 is used to allow the heated water to be output from the accommodating chamber. The refrigerant inlet 113 and the refrigerant outlet 114 are both connected to the refrigerant pipe, respectively allowing the refrigerant to enter and leave the refrigerant pipe. Exemplarily, the heat exchanger 100 is a titanium tube heat exchanger 100, that is, the refrigerant tube adopts a titanium tube, and the titanium tube heat exchanger 100 has the advantages of small size and strong heat exchange capacity.

[0044] The heat pump water heater 20 is a device that can provide hot water. For example, it can be used to heat swimming pool water. For example, the water inlet 111 and the water outlet 112 of the heat exchanger 100 are respectively connected to the swimming pool through pipes. In this way, the swimming pool water can be introduced into the heat exchange device to heat the swimming pool water.

[0045] The circuit board heat dissipation structure 10 in the embodiment of the present application is provided with a heat-conducting structure 200, the heat-conducting structure 200 is installed on the housing 110 of the heat exchanger 100, a part of the heat-conducting structure 200 is in contact with the water in the accommodating cavity of the housing 110, and the circuit board assembly 300 is installed on the heat-conducting structure 200, and the heat-conducting structure 200 is also in contact with the circuit board assembly 300. With such a configuration, the heat of the circuit board assembly 300 can be transferred to the water in the heat exchanger 100 through the heat-conducting structure 200, thereby realizing the cooling and heat dissipation of the circuit board assembly 300. It can be understood that as long as the temperature of the water in the heat exchanger 100 is lower than the temperature of the circuit board assembly 300, the process of transferring the heat of the circuit board assembly 300 to the water can be realized. Therefore, this heat dissipation method is not affected by the ambient temperature, and even when the ambient temperature is high, it can still have a good heat dissipation effect. As a result, the risk of damage to the heating element 320 in the circuit board assembly 300 can be reduced.

[0046] In addition, while the water in the heat exchanger 100 is used to cool and dissipate the heat of the circuit board assembly 300 , the heat of the circuit board assembly 300 also has a certain heating effect on the water, which is also beneficial to improving the heating effect of the heat pump water heater 20 .

[0047] In some embodiments, Figure 2 , Figure 3 as well as Figure 4 As shown, the heat-conducting structure 200 is formed with a heat-conducting surface 201, which is located outside the accommodating cavity. The circuit board assembly 300 includes a circuit board 310 and a heating element 320 arranged on the circuit board 310. The circuit board 310 is fixedly connected to the heat-conducting structure 200, and the heating element 320 is in contact with the heat-conducting surface 201.

[0048] The heat of the circuit board assembly 300 mainly comes from the heating element 320 located on the circuit board 310, such as a rectifier bridge stack, an intelligent power module, an inverter module, etc. Therefore, by fixing the circuit board 310 to the heat-conducting structure 200 and making the heating element 320 contact the heat-conducting surface 201, the heat generated by the heating element 320 can be more efficiently transferred to the water in the heat exchanger 100, thereby improving the heat dissipation effect.

[0049] Furthermore, if Figure 2 , Figure 3As shown, the circuit board 310 can be connected to the heat-conducting structure 200 by screws 240, and the connection method is simple and the cost is low. Specifically, the heat-conducting structure 200 is provided with a connecting column 230, and the connecting column 230 is provided with a threaded hole. Correspondingly, the circuit board 310 is provided with a connecting hole, and the screw 240 passes through the connecting hole and is fixedly installed in the threaded hole, thereby fixing the circuit board 310 on the heat-conducting structure 200. In addition, by providing the connecting column 230, a certain distance can be maintained between the circuit board 310 and the heat-conducting surface 201 of the heat-conducting structure 200, so that a certain placement space can be provided for the heating element 320 on the circuit board 310, so that the heating element 320 can contact the heat-conducting surface 201.

[0050] Furthermore, there are multiple connecting posts 230, which are spaced apart from each other, and the number of screws 240 is the same as that of the connecting posts 230, and there is a one-to-one correspondence between the screws 240 and the connecting posts 230. In addition, the screws 240 are distributed at the edge of the circuit board 310.

[0051] There are multiple connecting posts 230 and multiple screws 240, so that there are multiple connecting points between the circuit board 310 and the heat-conducting structure 200, which is beneficial to improve the installation stability of the circuit board assembly 300. In addition, the screws 240 are distributed at the edge of the circuit board 310, so that the screws 240 and the connecting posts 230 can avoid the heating element 320 on the circuit board 310, thereby avoiding interference between the connecting posts 230 and the heating element 320.

[0052] In one embodiment, the circuit board heat dissipation structure 10 further includes a heat-conducting medium (not shown in the figure), and the heat-conducting medium is in contact with both the heating element 320 and the heat-conducting surface 201 .

[0053] Exemplarily, the heat-conducting medium may be thermal grease, thermal silica gel, or the like.

[0054] Since it is difficult to make the heights of the heating elements 320 uniform, it is difficult to make all the heating elements 320 keep in contact with the heat-conducting surface 201. Based on the above situation, the circuit board heat dissipation structure 10 also includes a heat-conducting medium (not shown in the figure), which can fill the gap between the heating element 320 and the heat-conducting surface 201, so that the heating element 320 and the heat-conducting structure 200 have a better heat conduction effect.

[0055] In some embodiments, Figures 1 to 4As shown, the heat-conducting structure 200 includes a main board body 210 and a mounting portion 220 connected to the main board body 210, wherein the mounting portion 220 is connected to the housing 110 and contacts the water in the accommodating cavity. The mounting portion 220 is located on one side of the main board body 210, and the circuit board assembly 300 is located on the other side of the main board body 210, and the circuit board assembly 300 is connected to the main board body 210.

[0056] The mounting portion 220 is mainly used to connect with the housing 110 of the heat exchanger 100, so as to realize the installation between the heat-conducting structure 200 and the heat exchanger 100. In addition, a part of the surface of the mounting portion 220 faces the accommodating cavity, and the part of the surface can directly contact the water in the accommodating cavity, so as to directly conduct heat to the water.

[0057] The mounting portion 220 is connected to the main board body 210, so that heat can be conducted between the main board body 210 and the mounting portion 220. The main board body 210 is a plate-shaped structure, so that the surface of the main board body 210 away from the mounting portion 220 is a heat-conducting surface 201, which makes the heat-conducting structure 200 have a larger heat-conducting surface 201, so that the heating elements 320 in the circuit board assembly 300 can all contact the heat-conducting surface 201.

[0058] In one embodiment, the shell 110 is provided with an opening, the mounting portion 220 is disposed at the opening, the mounting portion 220 is sealedly connected to the shell 110 , and the shell 110 and the mounting portion 220 jointly define a accommodating cavity.

[0059] In this embodiment, the mounting portion 220 and the shell 110 are sealed and connected, and the mounting portion 220 and the shell 110 jointly enclose an inner cavity of the heat exchanger 100. This is beneficial for the mounting portion 220 to have a larger contact area with water to improve the heat conduction efficiency, and on the other hand, the mounting portion 220 does not occupy the space in the shell 110, thereby ensuring that the accommodating cavity has a relatively large volume, which is beneficial for improving the heating effect of the heat pump water heater 20 during operation.

[0060] Furthermore, the mounting portion 220 is provided with heat exchange fins (not shown in the figure), and the heat exchange fins are located in the accommodating cavity. By providing the heat exchange fins, the contact area between the mounting portion 220 and water can be increased, thereby improving the heat conduction efficiency between the heat conduction structure 200 and water.

[0061] In one embodiment, the mounting portion 220 is a metal piece, the main board body 210 is a metal plate, and the mounting portion 220 and the main board body 210 are an integrated structure.

[0062] Exemplarily, the mounting portion 220 is an aluminum member, and the main board body 210 is an aluminum plate; alternatively, the mounting portion 220 is a copper member, and the main board body 210 is a copper plate.

[0063] Metal has good thermal conductivity, the mounting portion 220 is a metal piece, and the main board body 210 is a metal plate, so that the heat-conducting structure 200 has good thermal conductivity. In addition, the mounting portion 220 and the main board body 210 are an integrated structure, that is, the mounting portion 220 and the main board body 210 are integrated during the manufacturing process, so that an assembly environment can be reduced during assembly, which is conducive to improving production efficiency.

[0064] In another embodiment, the mounting portion 220 is a metal piece, and the main board body 210 is a temperature averaging board, which includes a metal shell and a working fluid located inside the metal shell.

[0065] The temperature spreader is also called a heat conducting plate or a super heat conducting plate. Usually, the temperature spreader uses a metal shell with high thermal conductivity. A closed inner cavity is formed inside the metal shell, and a liquid wick is attached to the side wall of the inner cavity. The working principle of the temperature spreader is as follows: when heat is applied to the bottom of the temperature spreader, the working fluid evaporates as the heat increases, and condensation occurs when the vapor rises to the top of the inner cavity, and the vapor returns to the evaporation surface to form a cycle by relying on the liquid wick. The temperature spreader has a small diffusion thermal resistance and a high temperature uniformity characteristic, and is an efficient heat conducting device.

[0066] In this embodiment, the mounting portion 220 is made of metal, and the main board body 210 is made of a temperature averaging plate. By utilizing the high thermal conductivity of the temperature averaging plate, the thermal conductive structure 200 can have good thermal conductivity and high thermal conductivity.

[0067] Furthermore, the shell 110 of the heat exchanger 100 may be a plastic shell 110, such as a PVC (polyvinyl chloride) shell 110. When the mounting portion 220 is a metal part, the mounting portion 220 and the shell 110 may be connected by a sealant to achieve sealing during the connection.

[0068] Figure 5 This is a schematic diagram of the three-dimensional structure of a circuit board heat dissipation structure provided by another embodiment of the present application. Figure 6 This is a schematic front view of a circuit board heat dissipation structure provided in another embodiment of the present application. Figure 7 A schematic side view of a circuit board heat dissipation structure provided in another embodiment of the present application, Figure 8 This is a top view schematic diagram of a circuit board heat dissipation structure provided by another embodiment of the present application. Figure 5 , Figure 6 , Figure 7 as well as Figure 8 As shown, in some embodiments, the heat-conducting structure 200 includes a main board body 210, the main board body 210 is disposed through the housing 110, a portion of the main board body 210 is located in the accommodating cavity and in contact with the water in the accommodating cavity, and another portion of the main board body 210 is located outside the accommodating cavity. The circuit board assembly 300 is connected to the portion of the main board body 210 located outside the accommodating cavity.

[0069] In this embodiment, the heat-conducting structure 200 includes a main board body 210, which is disposed through the housing 110 of the heat exchanger 100, so that a portion of the main board body 210 is located in the accommodating cavity, and another portion is located outside the accommodating cavity. The portion of the main board body 210 located in the accommodating cavity can be in direct contact with the water in the accommodating cavity, and the circuit board assembly 300 can be installed on the portion of the main board body 210 located outside the accommodating cavity. The heat generated by the circuit board assembly 300 during operation can be directly conducted to the water in the accommodating cavity through the main board body 210, thereby cooling and dissipating the circuit board assembly 300.

[0070] It is understandable that after the circuit board assembly 300 is installed on the main board body 210, the circuit board 310 in the circuit board assembly 300 and the main board body 210 are in a state of being parallel to each other or nearly parallel to each other. Therefore, in this embodiment, since the main board body 210 is inserted into the shell 110 of the heat exchanger 100, the plane where the circuit board 310 is located will also pass through the shell 110 of the heat exchanger 100. In the embodiment in which the main board body 210 is connected to the shell 110 through the mounting portion 220, the circuit board assembly 300 is arranged on the side of the main board body 210 away from the mounting portion 220. In this case, the plane where the circuit board 310 is located will not pass through the shell 110 of the heat exchanger 100. Therefore, in the two embodiments, the installation position of the circuit board assembly 300 relative to the heat exchanger 100 is different. In actual application, a suitable setting method can be selected according to the actual application environment. For example, a suitable solution can be selected according to the internal layout of the actual heat pump water heater 20 product to avoid interference between the circuit board assembly 300 and other structures.

[0071] Furthermore, a seal is provided between the main board body 210 and the shell 110. For example, a sealant is provided at the position where the main board body 210 passes through the shell 110, thereby ensuring a sealed connection between the main board body 210 and the shell 110, thereby preventing the heat exchanger 100 from leaking.

[0072] In one embodiment, the main board body 210 is a metal plate, such as an aluminum plate or a copper plate. A portion of the metal plate is located in the accommodating cavity and is in direct contact with the water in the accommodating cavity, and the circuit board assembly 300 is installed on the portion of the metal plate located outside the accommodating cavity. The good thermal conductivity of the metal plate is utilized to transfer the heat of the circuit board assembly 300 to the water in the heat exchanger 100, so as to cool and dissipate the heat of the circuit board assembly 300.

[0073] In another embodiment, the main board body 210 is a temperature averaging board, which includes a metal shell and a working fluid located inside the metal shell. As can be seen from the above content, the temperature averaging board has a small diffusion thermal resistance and a high temperature averaging characteristic, and is an efficient heat conducting device. Therefore, the heat of the circuit board assembly 300 can also be transferred to the water in the heat exchanger 100 through the temperature averaging board to obtain better heat conduction efficiency.

[0074] The embodiment of the second aspect of the present application provides a heat pump water heater, Fig. 9 A schematic diagram of the structure of a heat pump water heater provided in an embodiment of the present application is shown in FIG. Fig. 9 As shown, the heat pump water heater 20 includes a housing 21, a compressor 22; and a circuit board heat dissipation structure 10 in any of the above embodiments, wherein the heat exchanger 100 is connected to the compressor 22, and the heat exchanger 100, the compressor 22 and the circuit board assembly 300 are all located in the housing 21.

[0075] In the heat pump water heater 20 in the embodiment of the present application, the circuit board heat dissipation structure 10 is provided with a heat-conducting structure 200, the heat-conducting structure 200 is installed on the housing 110 of the heat exchanger 100, a part of the heat-conducting structure 200 is in contact with the water in the accommodating cavity of the housing 110, and the circuit board assembly 300 is installed on the heat-conducting structure 200, and the heat-conducting structure 200 is also in contact with the circuit board assembly 300. With such a configuration, the heat of the circuit board assembly 300 can be transferred to the water in the heat exchanger 100 through the heat-conducting structure 200, thereby realizing the cooling and heat dissipation of the circuit board assembly 300. It can be understood that as long as the temperature of the water in the heat exchanger 100 is lower than the temperature of the circuit board assembly 300, the process of transferring the heat of the circuit board assembly 300 to the water can be realized. Therefore, this heat dissipation method is not affected by the ambient temperature, and even when the ambient temperature is high, it can still have a good heat dissipation effect. As a result, the risk of damage to the heating element 320 in the circuit board assembly 300 can be reduced.

[0076] In addition, while the water in the heat exchanger 100 is used to cool and dissipate the heat of the circuit board assembly 300 , the heat of the circuit board assembly 300 also has a certain heating effect on the water, which is also beneficial to improving the heating effect of the heat pump water heater 20 .

[0077] In some embodiments, the heat pump water heater 20 further includes a fan assembly 23 and a second heat exchanger, both of which are disposed in a box body 21, and a vent is provided on the box body 21, which connects the internal space of the box body 21 with the external space.

[0078] When the heat pump water heater 20 is working, the heat exchanger 100 releases heat to heat the water in the accommodating chamber. The second heat exchanger is used to absorb heat from the air. The fan assembly 23 is used to allow the outside air to enter the box 21, and to discharge the air in the box 21 to the outside of the box 21, that is, to form an air flow circulation inside and outside the box 21. The airflow entering the box 21 exchanges heat with the refrigerant passing through the second heat exchanger in the second heat exchanger, so that the refrigerant passing through the second heat exchanger can absorb heat from the air.

[0079] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0080] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0081] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0082] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0083] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0084] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A circuit board heat dissipation structure, characterized in that: include: A heat exchanger, the heat exchanger comprising a shell, the interior of the shell is formed with a receiving cavity, the receiving cavity is used to receive water to be heat exchanged; a heat-conducting structure, the heat-conducting structure being mounted on the housing, a portion of the heat-conducting structure being configured to contact the water in the accommodating cavity; as well as A circuit board assembly is mounted on the heat-conducting structure, and the heat-conducting structure is in contact with the circuit board assembly for cooling and dissipating heat for the circuit board assembly.

2. The circuit board heat dissipation structure according to claim 1, characterized in that: The heat-conducting structure is formed with a heat-conducting surface, and the heat-conducting surface is located outside the accommodating cavity; The circuit board assembly comprises a circuit board and a heating element arranged on the circuit board, the circuit board is fixedly connected to the heat-conducting structure, and the heating element contacts the heat-conducting surface.

3. The circuit board heat dissipation structure according to claim 2, characterized in that: The circuit board heat dissipation structure also includes a heat-conducting medium, and the heat-conducting medium is in contact with both the heating element and the heat-conducting surface.

4. The circuit board heat dissipation structure according to claim 1, characterized in that: The heat-conducting structure comprises a main board body and a mounting portion connected to the main board body, wherein the mounting portion is connected to the housing and in contact with the water in the accommodating cavity; The mounting portion is located on one side of the main board body, the circuit board assembly is located on the other side of the main board body, and the circuit board assembly is connected to the main board body.

5. The circuit board heat dissipation structure according to claim 4, characterized in that: The shell is provided with an opening, the mounting portion is provided at the opening, and the mounting portion is sealed and connected to the shell; the shell and the mounting portion jointly define the accommodating cavity.

6. The circuit board heat dissipation structure according to claim 5, characterized in that: The mounting portion is provided with heat exchange fins, and the heat exchange fins are located in the accommodating cavity.

7. The circuit board heat dissipation structure according to claim 4, 5 or 6, characterized in that: The mounting portion is a metal piece, the main board body is a metal plate, and the mounting portion and the main board body are an integrated structure.

8. The circuit board heat dissipation structure according to claim 4, 5 or 6, characterized in that: The mounting portion is a metal piece, the main board body is a temperature averaging board, and the temperature averaging board includes a metal shell and a working fluid located inside the metal shell.

9. The circuit board heat dissipation structure according to claim 1, characterized in that: The heat-conducting structure comprises a main board body, the main board body is disposed through the shell, a part of the main board body is located in the accommodating cavity and in contact with the water in the accommodating cavity, and another part of the main board body is located outside the accommodating cavity; The circuit board assembly is connected to a portion of the main board body located outside the accommodating cavity.

10. The circuit board heat dissipation structure according to claim 9, characterized in that: The main board body is a metal plate.

11. The circuit board heat dissipation structure according to claim 9, characterized in that: The main board body is a temperature averaging board, and the temperature averaging board includes a metal shell and a working fluid located inside the metal shell.

12. A heat pump water heater, characterized in that: include: Box; compressor; as well as In the circuit board heat dissipation structure according to any one of claims 1 to 11, the heat exchanger is connected to the compressor, and the heat exchanger, the compressor and the circuit board assembly are all located in the box.

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