Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a plurality of sub-pixels, a pixel definition layer, isolation columns and a packaging layer. Each sub-pixel comprises a first electrode, a light-emitting layer and a second electrode which are arranged in a stacked mode. The pixel definition layer includes a plurality of pixel openings. The isolation columns are arranged on the side, away from the substrate, of the pixel definition layer, the isolation columns are configured to isolate the light emitting layers of the two adjacent sub-pixels, and the two adjacent sub-pixels comprise the first sub-pixel and the second sub-pixel. The packaging layer comprises a first packaging structure and a second packaging structure, the first packaging structure covers the first sub-pixels, the second packaging structure covers the second sub-pixels, and the first packaging structure and the second packaging structure are arranged at the positions of the isolation columns in an overlapping mode.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and in particular relates to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) technology has the advantages of low cost, short response time, high brightness, low driving voltage and flexible light source. It can be applied to display fields such as smart phones, computers, and televisions.

[0003] In order to protect OLED devices from the influence of moisture and oxygen, OLEDs need to be packaged. Due to the unreasonable design of the packaging film layer of traditional OLED devices, the display screen may have orange peel or streaking problems, thus causing poor display. Summary of the invention

[0004] The embodiments of the present disclosure provide a display panel and a method for preparing the same, as well as a display device, thereby preventing the light-emitting layer material of the sub-pixel from remaining on the encapsulation layer, which in turn causes the problem of orange peel or mura on the display screen, thereby improving product yield and reliability, and improving display effects.

[0005] Other features and advantages of the present disclosure will become apparent from the following detailed description, or may be learned in part by the practice of the present disclosure.

[0006] A first aspect of the present disclosure provides a display panel, comprising:

[0007] substrate substrate;

[0008] A plurality of sub-pixels are arranged on one side of the base substrate, wherein the sub-pixels include a first electrode, a light-emitting layer and a second electrode which are stacked;

[0009] A pixel definition layer, disposed on one side of the base substrate, comprising a plurality of pixel openings, wherein the pixel openings are configured to define a light emitting area of ​​the sub-pixel;

[0010] An isolation column, disposed on a side of the pixel definition layer away from the base substrate, the isolation column being configured to isolate the light-emitting layers of the two adjacent sub-pixels, the two adjacent sub-pixels comprising a first sub-pixel and a second sub-pixel;

[0011] The encapsulation layer includes a first encapsulation structure and a second encapsulation structure, wherein the first encapsulation structure covers the first sub-pixel, the second encapsulation structure covers the second sub-pixel, and the first encapsulation structure and the second encapsulation structure are overlapped at the position of the isolation column.

[0012] Optionally, the plurality of sub-pixels include first color sub-pixels, second color sub-pixels, and third color sub-pixels, and the plurality of sub-pixels are arranged in an array in the first direction and the second direction to form a plurality of pixel rows and a plurality of pixel columns;

[0013] The plurality of pixel columns include a first pixel column, a second pixel column, and a third pixel column arranged at intervals along the first direction, the first pixel column includes a plurality of first color sub-pixels, the second pixel column includes a plurality of second color sub-pixels, and the third pixel column includes a plurality of third color sub-pixels;

[0014] The first sub-pixel and the second sub-pixel are two of the first color sub-pixel, the second color sub-pixel, and the third color sub-pixel.

[0015] Optionally, the first sub-pixel is any one of the first color sub-pixel, the second color sub-pixel and the third color sub-pixel, and in the first direction, the first encapsulation structures are interconnected and arranged in the same layer; or

[0016] The second sub-pixel is any one of the first color sub-pixel, the second color sub-pixel and the third color sub-pixel. In the first direction, the second encapsulation structures are connected to each other and are arranged in the same layer.

[0017] Optionally, the plurality of sub-pixels include first color sub-pixels, second color sub-pixels, and third color sub-pixels, and the plurality of sub-pixels are arranged in an array in a first direction and a second direction to form a plurality of pixel rows and a plurality of pixel columns;

[0018] The plurality of pixel columns include a first pixel column, a second pixel column, and a third pixel column arranged at intervals along the first direction, the first pixel column and the second pixel column respectively include a plurality of first color sub-pixels and a plurality of second color sub-pixels arranged alternately along the first direction, the sub-pixels in the first pixel column and the second pixel column located in the same pixel row have different colors, and the third pixel column includes a plurality of third color sub-pixels arranged at intervals along the first direction;

[0019] The first sub-pixel and the second sub-pixel are two of the first color sub-pixel, the second color sub-pixel, and the third color sub-pixel.

[0020] Optionally, the first sub-pixel is the third color sub-pixel, and in the first direction, each of the first encapsulation structures is connected to each other and arranged in the same layer; or

[0021] The second sub-pixel is the third color sub-pixel, and in the first direction, each of the second encapsulation structures is connected to each other and is disposed in the same layer.

[0022] Optionally, the second pixel column is located between the first pixel column and the third pixel column, the first color sub-pixel is a red sub-pixel, the second color sub-pixel is a green sub-pixel, and the third color sub-pixel is a blue sub-pixel.

[0023] Optionally, the third pixel column is located between the first pixel column and the second pixel column, the first color sub-pixel is a red sub-pixel, the second color sub-pixel is a blue sub-pixel, and the third color sub-pixel is a green sub-pixel.

[0024] Optionally, among the plurality of sub-pixels, the isolation columns between adjacent sub-pixels are connected to each other, the orthographic projection of the isolation columns on the base substrate is a mesh region, and the orthographic projection of the light-emitting region of the sub-pixel on the base substrate is located within an opening of the mesh region;

[0025] The isolation column comprises a first isolation portion and a second isolation portion stacked together;

[0026] The first encapsulation structure includes a first encapsulation part, which covers at least a portion of the top of the second isolation part. The second encapsulation structure includes a second encapsulation part, which covers at least a portion of the top of the second isolation part. The first encapsulation part and the second encapsulation part are overlapped on the top of the second isolation part.

[0027] Optionally, the plurality of sub-pixels are arranged in an array in the first direction and the second direction;

[0028] The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel;

[0029] In the second direction, a side of the first encapsulation portion away from the first pixel opening has a first distance from a side of the second isolation portion close to the first pixel opening, a side of the second encapsulation portion away from the second pixel opening has a second distance from a side of the second isolation portion close to the second pixel opening, and a side of the second encapsulation portion away from the second pixel opening has a third distance from a side of the first encapsulation portion away from the first pixel opening;

[0030] The sum of the first distance, the second distance, and the third distance is equal to the width of a pixel opening gap, and the pixel opening gap is a gap between the first pixel opening and the second pixel opening.

[0031] Optionally, the plurality of sub-pixels are arranged in an array in the first direction and the second direction;

[0032] The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel;

[0033] In the second direction, a side of the first encapsulation portion away from the first pixel opening has a first distance from a side of the second isolation portion close to the first pixel opening, a side of the second electrode of the first sub-pixel close to the first isolation portion has a fourth distance from a side of the second isolation portion close to the first pixel opening, and a side of the light-emitting layer of the first sub-pixel close to the first isolation portion has a fifth distance from a side of the second isolation portion close to the first pixel opening;

[0034] The first distance is greater than the fourth distance, and the fourth distance is greater than the fifth distance.

[0035] Optionally, the plurality of sub-pixels are arranged in an array in the first direction and the second direction;

[0036] The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel;

[0037] In the second direction, a side of the second encapsulation portion away from the second pixel opening has a second distance from a side of the second isolation portion close to the second pixel opening, a side of the second electrode of the second sub-pixel close to the first isolation portion has a sixth distance from a side of the second isolation portion close to the second pixel opening, and a side of the light-emitting layer of the second sub-pixel close to the first isolation portion has a seventh distance from a side of the second isolation portion close to the second pixel opening;

[0038] The second distance is greater than the sixth distance, and the sixth distance is greater than the seventh distance.

[0039] Optionally, the plurality of sub-pixels are arranged in an array in the first direction and the second direction;

[0040] The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel;

[0041] In the second direction, a side of the first encapsulation portion away from the first pixel opening has a first distance from a side of the second isolation portion close to the first pixel opening, and a side of the second encapsulation portion away from the second pixel opening has a second distance from a side of the second isolation portion close to the second pixel opening;

[0042] The sum of the first distance and the second distance is greater than a width of a pixel opening gap, and the pixel opening gap is a gap between the first pixel opening and the second pixel opening.

[0043] Optionally, in the plurality of sub-pixels, the isolation columns of adjacent sub-pixels are disconnected from each other, and an isolation groove is provided between two adjacent isolation columns;

[0044] The isolation column comprises a first isolation column arranged around the first sub-pixel and a second isolation column arranged around the second sub-pixel, the first isolation column comprises a stacked third isolation portion and a fourth isolation portion, and the second isolation column comprises a stacked fifth isolation portion and a sixth isolation portion;

[0045] The first packaging structure includes a third packaging part, which covers the top of the fourth isolation part and at least a portion of the isolation groove. The second packaging structure includes a fourth packaging part, which covers the top of the sixth isolation part and at least a portion of the isolation groove. The third packaging part and the fourth packaging part are overlapped in the isolation groove.

[0046] Optionally, the plurality of sub-pixels are arranged in an array in the first direction and the second direction;

[0047] The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel;

[0048] In the second direction, a side of the fourth isolation portion close to the first pixel opening has an eighth distance from a side of the third isolation portion close to the first pixel opening, a side of the fourth isolation portion away from the first pixel opening has a ninth distance from a side of the third isolation portion away from the first pixel opening, and the eighth distance is greater than the ninth distance; and / or

[0049] A side of the sixth isolation portion close to the second pixel opening has a tenth distance from a side of the fifth isolation portion close to the second pixel opening, a side of the sixth isolation portion away from the second pixel opening has an eleventh distance from a side of the fifth isolation portion away from the second pixel opening, and the tenth distance is greater than the eleventh distance.

[0050] Optionally, the plurality of sub-pixels are arranged in an array in the first direction and the second direction;

[0051] The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel;

[0052] In the second direction, a side of the third encapsulation portion away from the first pixel opening has a twelfth distance from a side of the fourth isolation portion close to the first pixel opening, a side of the fourth encapsulation portion away from the second pixel opening has a thirteenth distance from a side of the sixth isolation portion close to the second pixel opening, and a side of the third encapsulation portion away from the first pixel opening has a fourteenth distance from a side of the fourth encapsulation portion away from the second pixel opening;

[0053] The sum of the twelfth distance and the thirteenth distance is greater than the fourteenth distance, the width of the isolation groove, and the width of a pixel opening gap, where the pixel opening gap is a gap between the first pixel opening and the second pixel opening.

[0054] Optionally, the plurality of sub-pixels are arranged in an array in the first direction and the second direction;

[0055] The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel;

[0056] In the second direction, a side of the third encapsulation portion away from the first pixel opening has a twelfth distance from a side of the fourth isolation portion close to the first pixel opening, a side of the fourth isolation portion away from the first pixel opening has a ninth distance from a side of the third isolation portion away from the first pixel opening, a side of the second electrode of the first sub-pixel close to the third isolation portion has a fifteenth distance from a side of the fourth isolation portion close to the first pixel opening, and a side of the light-emitting layer of the first sub-pixel close to the third isolation portion has a sixteenth distance from a side of the fourth isolation portion close to the first sub-pixel opening;

[0057] The twelfth distance is greater than the ninth distance, the ninth distance is greater than the fifteenth distance, and the fifteenth distance is greater than the sixteenth distance.

[0058] Optionally, the plurality of sub-pixels are arranged in an array in the first direction and the second direction;

[0059] The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel;

[0060] In the second direction, a side of the fourth encapsulation portion away from the second pixel opening has a thirteenth distance from a side of the sixth isolation portion close to the second pixel opening, a side of the sixth isolation portion away from the second pixel opening has an eleventh distance from a side of the fifth isolation portion away from the second pixel opening, a side of the second electrode of the second sub-pixel close to the fifth isolation portion has a seventeenth distance from a side of the sixth isolation portion close to the second pixel opening, and a side of the light-emitting layer of the second sub-pixel close to the fifth isolation portion has an eighteenth distance from a side of the sixth isolation portion close to the second sub-pixel opening;

[0061] The thirteenth distance is greater than the eleventh distance, the eleventh distance is greater than the seventeenth distance, and the seventeenth distance is greater than the eighteenth distance.

[0062] Optionally, the plurality of sub-pixels are arranged in an array in the first direction and the second direction;

[0063] The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel;

[0064] In the second direction, a side of the third encapsulation portion away from the first pixel opening has a twelfth distance from a side of the fourth isolation portion close to the first pixel opening, and a side of the fourth encapsulation portion away from the second pixel opening has a thirteenth distance from a side of the sixth isolation portion close to the second pixel opening;

[0065] A sum of the twelfth distance and the thirteenth distance is greater than a width of the pixel opening gap, and the pixel opening gap is a gap between the first pixel opening and the second pixel opening.

[0066] Optionally, in a direction perpendicular to the base substrate, the total thickness of the overlapping third encapsulation portion and the fourth encapsulation portion is greater than the thickness of the third encapsulation portion covering the first pixel opening, and the thickness of the third encapsulation portion covering the first pixel opening is greater than the thickness of the third encapsulation portion covering the fourth isolation portion; and / or

[0067] In the direction perpendicular to the base substrate, the total thickness of the overlapping third encapsulation part and the fourth encapsulation part is greater than the thickness of the fourth encapsulation part covering the second pixel opening, and the thickness of the fourth encapsulation part covering the second pixel opening is greater than the thickness of the fourth encapsulation part covering the sixth isolation part.

[0068] Optionally, the base substrate includes a display area and a frame area, and the frame area is arranged around the display area;

[0069] The display area is provided with the plurality of sub-pixels and the plurality of edge sub-pixels, the plurality of edge sub-pixels and the plurality of sub-pixels are arranged in an array in a first direction and a second direction to form a plurality of pixel rows and a plurality of pixel columns, and the plurality of edge sub-pixels are arranged in the outermost pixel rows and the outermost pixel columns;

[0070] The light emitting area of ​​the edge sub-pixel is smaller than the light emitting area of ​​the sub-pixel.

[0071] Optionally, the encapsulation layer also covers the edge sub-pixel, and in a direction perpendicular to the substrate, an edge of the encapsulation layer is flush with an edge of the edge sub-pixel.

[0072] A second aspect of the present disclosure provides a display device, comprising a display panel as described in any one of the first aspects.

[0073] A third aspect of the present disclosure provides a method for preparing a display panel, comprising:

[0074] providing a substrate base plate;

[0075] Forming a plurality of sub-pixels, a pixel definition layer, an isolation column and an encapsulation layer on the base substrate;

[0076] The plurality of sub-pixels are arranged on one side of the base substrate, and the sub-pixels include a first electrode, a light-emitting layer and a second electrode which are stacked;

[0077] The pixel definition layer is disposed on one side of the base substrate and includes a plurality of pixel openings, wherein the pixel openings are configured to define the light emitting areas of the sub-pixels;

[0078] The isolation column is disposed on a side of the pixel definition layer away from the base substrate, and the isolation column is configured to isolate the light-emitting layers of the two adjacent sub-pixels, wherein the two adjacent sub-pixels include a first sub-pixel and a second sub-pixel;

[0079] The encapsulation layer includes a first encapsulation structure and a second encapsulation structure, wherein the first encapsulation structure covers the first sub-pixel, the second encapsulation structure covers the second sub-pixel, and the first encapsulation structure and the second encapsulation structure are overlapped at the position of the isolation column.

[0080] Optionally, a plurality of sub-pixels, a pixel definition layer, an isolation column and an encapsulation layer are formed on the substrate, including:

[0081] forming first electrodes of the plurality of sub-pixels on the base substrate;

[0082] forming the pixel definition layer on the base substrate, wherein the pixel definition layer includes the plurality of pixel openings;

[0083] forming an isolation column material layer on the pixel definition layer, and etching the isolation column material layer in a first region to obtain isolation columns around the first sub-pixel;

[0084] Vapor depositing a first light emitting material layer, a first electrode material layer and a first packaging material layer on the isolation column material layer;

[0085] Etching the first light-emitting material layer, the first electrode material layer and the first packaging material layer in the second region to obtain the light-emitting layer and the second electrode of the first sub-pixel and the first packaging structure;

[0086] Performing etching in the third area to obtain isolation columns around the second sub-pixel;

[0087] Vapor depositing a second light emitting material layer, a second electrode material layer and a second packaging material layer on the isolation column material layer;

[0088] The second light-emitting material layer, the second electrode material layer and the second packaging material layer are etched in the fourth region to obtain the light-emitting layer and the second electrode of the second sub-pixel and the second packaging structure.

[0089] The display panel provided by the embodiment of the present disclosure includes a substrate, a pixel definition layer, a spacer and an encapsulation layer. A plurality of sub-pixels are arranged on one side of the substrate, and the sub-pixels include a first electrode, a light-emitting layer and a second electrode arranged in a stacked manner; the pixel definition layer is arranged on one side of the substrate, and includes a plurality of pixel openings, and the pixel openings are configured to define the light-emitting area of ​​the sub-pixels; the spacer is arranged on the side of the pixel definition layer away from the substrate, and the spacer is configured to separate the light-emitting layers of two adjacent sub-pixels, and the two adjacent sub-pixels include a first sub-pixel and a second sub-pixel; the encapsulation layer includes a first encapsulation structure and a second encapsulation structure, the first encapsulation structure covers the first sub-pixel, the second encapsulation structure covers the second sub-pixel, and the first encapsulation structure and the second encapsulation structure are overlapped at the position of the spacer. In this way, it is possible to avoid the existence of residues of the light-emitting layer material of the sub-pixel on the encapsulation layer, which in turn causes the problem of orange peel or mura on the display screen, thereby improving the product yield and reliability, and improving the display effect.

[0090] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0091] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0092] Figure 1 A partial cross-sectional structural schematic diagram of a display panel in the related art is shown;

[0093] Figure 2 A partial cross-sectional schematic diagram of a display panel according to some embodiments of the present disclosure is shown;

[0094] Figure 3 A schematic plan view of a display panel according to an embodiment of the present disclosure is shown;

[0095] Figure 4 A schematic diagram of a first pixel arrangement of some embodiments of the present disclosure is shown;

[0096] Figure 5 A second pixel arrangement schematic diagram of some embodiments of the present disclosure is shown;

[0097] Figure 6 A third pixel arrangement schematic diagram of some embodiments of the present disclosure is shown;

[0098] Figure 7 Shows Figure 2 A first partial enlarged view within the dotted frame in FIG.

[0099] Figure 8 Shows Figure 2 A second partial enlarged view within the dotted frame in FIG.

[0100] Fig. 9 Shows Figure 2 A third partial enlarged view within the dotted frame in FIG.

[0101] Fig.10 Shows Figure 2 A fourth partial enlarged view within the dotted frame in FIG.

[0102] Fig.11 A fourth pixel arrangement schematic diagram of some embodiments of the present disclosure is shown;

[0103] Fig.12 shows a fifth pixel arrangement schematic diagram of some embodiments of the present disclosure;

[0104] Fig.13 shows a sixth pixel arrangement schematic diagram of some embodiments of the present disclosure;

[0105] Fig.14 Another partial cross-sectional schematic diagram of a display panel according to some embodiments of the present disclosure is shown;

[0106] Fig.15 Shows Fig.14 A first partial enlarged view within the dotted frame in FIG.

[0107] Fig.16 Shows Fig.14 A second partial enlarged view within the dotted frame in FIG.

[0108] Fig.17 Shows Fig.14 A third partial enlarged view within the dotted frame in FIG.

[0109] Fig.18 Shows Fig.14 A fourth partial enlarged view within the dotted frame in FIG.

[0110] Fig.19 Shows Fig.14 A fifth partial enlarged view within the dotted frame in FIG.

[0111] Fig. 20 shows a seventh pixel arrangement schematic diagram of some embodiments of the present disclosure;

[0112] Fig.21 A structural block diagram of a display device according to some embodiments of the present disclosure is shown;

[0113] Fig. 22 A flow chart showing a method for preparing a display panel in the related art is shown;

[0114] 23( a ), 23 ( b ) and 23 ( c ) show flow charts of methods for preparing a display panel according to some embodiments of the present disclosure.

[0115] Among them, 100-display panel; 10-substrate; 11-sub-pixel; 11A-first electrode; 11B-light-emitting layer; 11C-second electrode; 12-pixel definition layer; 13-isolation column; 14-packaging layer; 101-anode; 102-pixel definition material layer; 103-isolation column material layer; 104-red light-emitting material layer; 105-packaging material layer; 106-cathode.

[0116] 200-display panel; 21-substrate; 22-subpixel; 22A-first electrode; 22B-light-emitting layer; 22C-second electrode; 221-first subpixel; 222-second subpixel; 223-first color subpixel; 224-second color subpixel; 225-third color subpixel; 226-edge subpixel; 23-isolation column; 23A-first isolation part; 23B-second isolation part; 231-first isolation column; 231A-third isolation part; 231B-fourth isolation part; 232-second isolation column, 232A-fifth isolation part; 232B-sixth isolation part; 233-isolation groove; 24-encapsulation layer; 24A-first isolation part A packaging structure; 24A1-first packaging part; 24A2-third packaging part; 24B-second packaging structure; 24B1-second packaging part; 24B2-fourth packaging part; 25-pixel definition layer; 251-pixel opening; 251A-first pixel opening; 251B-second pixel opening; 201-isolation column material layer; 201A-first sublayer; 201B-second sublayer; 202-first light-emitting material layer; 203-first electrode material layer; 204-first packaging material layer; 205-second light-emitting material layer; 206-second electrode material layer; 207-second packaging material layer; 208-organic packaging layer; 209-second inorganic packaging layer.

[0117] 300-display device. DETAILED DESCRIPTION

[0118] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure.

[0119] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities may be implemented in software form, or in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0120] The flowcharts shown in the accompanying drawings are only exemplary and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps can be decomposed, and some operations / steps can be combined or partially combined, so the actual execution order may change according to actual conditions.

[0121] It should also be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the objects used in this way can be interchanged where appropriate, so that the embodiments of the present disclosure described herein can be implemented in an order other than those shown or described.

[0122] As used herein, "about," "approximately," "substantially" includes the stated value and the average value that is within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0123] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0124] The proportions of the drawings in this disclosure can be used as a reference in the actual process, but are not limited to this. For example: the width-to-length ratio of the channel, the thickness and spacing of each film layer, the width and spacing of each signal line can be adjusted according to actual needs. The number of pixels in the display substrate and the number of sub-pixels in each pixel are not limited to the numbers shown in the figures. The drawings described in this disclosure are only structural schematic diagrams, and one method of this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0125] In this specification, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.

[0126] In this specification, "film" and "layer" may be interchanged. For example, "conductive layer" may be replaced by "conductive film". Similarly, "insulating film" may be replaced by "insulating layer".

[0127] It should be understood that when a layer or element is referred to as being on another layer or substrate, the layer or element may be directly on the other layer or substrate, or there may be an intermediate layer between the layer or element and the other layer or substrate. "The orthographic projection of B is within the orthographic projection range of A" means that the boundary of the orthographic projection of B falls within the boundary range of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0128] Figure 1 A partial cross-sectional structural schematic diagram of a display panel in the related art is shown.

[0129] Exemplarily, the display panel 100 includes: a base substrate 10, a plurality of sub-pixels 11, a pixel definition layer 12, an isolation column 13 and an encapsulation layer 14. The plurality of sub-pixels 11 are arranged on one side of the base substrate 10, and the sub-pixels 11 include a first electrode 11A, a light-emitting layer 11B and a second electrode 11C which are stacked. The pixel definition layer 12 is arranged on one side of the base substrate 10, and includes a plurality of pixel openings, and the pixel openings are configured to define the light-emitting area of ​​the sub-pixel 11. The isolation column 13 is arranged on the side of the pixel definition layer 12 away from the base substrate 10, and the isolation column 13 is located between two adjacent sub-pixels 11 and is arranged around the sub-pixel 11, and the isolation column 13 is configured to separate the light-emitting layer 11B of the two adjacent sub-pixels 11. The encapsulation layer 14 is configured to cover the two adjacent sub-pixels 11, and the etching boundary of the encapsulation layer 14 is located in the middle of the two adjacent sub-pixels 11.

[0130] like Figure 1 As shown, since the etching boundary of the encapsulation layer 14 is located in the middle of two adjacent sub-pixels 11, there is a gap (Gap) between the encapsulation layers 14 on the two adjacent sub-pixels 11. Figure 1 As shown in the dotted box. For example: there is a gap between the encapsulation layer 14 on the red sub-pixel and the green sub-pixel, resulting in the etching liquid entering the red sub-pixel and / or the green sub-pixel along the gap between the encapsulation layer 14 of the red sub-pixel and the encapsulation layer 14 of the green sub-pixel during the etching process of preparing the green sub-pixel, resulting in interlayer separation (peeling) in the already encapsulated red sub-pixel and / or green sub-pixel. When evaporating the blue sub-pixel, the light-emitting layer 11B material of the blue sub-pixel will remain in the gap, resulting in the residual light-emitting material in the gap during the etching process of the blue sub-pixel affecting the curing of the organic encapsulation layer (IJP), resulting in the poor film-forming property of the organic encapsulation layer, and then forming orange peel or mura problems on the display screen, causing poor display.

[0131] In view of this, the first aspect of the embodiments of the present disclosure provides a display panel that can avoid the residue of the light-emitting layer material of the sub-pixel on the packaging layer, which in turn causes the problem of orange peel or mura on the display screen, thereby improving product yield and reliability and improving display effect.

[0132] The display panel provided by the embodiments of the present disclosure is described in detail below with reference to the accompanying drawings.

[0133] Figure 2 A partial cross-sectional schematic diagram of a display panel according to some embodiments of the present disclosure is shown.

[0134] It should be noted that Figure 2 The display panel shown is only for illustration and does not limit the shape and size of the display panel. The shape and size of the display panel are determined according to the needs of the display product in actual application. For example, the display panel provided in the embodiment of the present disclosure can be applied to small-sized products, such as mobile phones, and can also be applied to medium-sized and large-sized products such as tablet computers, notebook computers, display screens, and televisions, and the present disclosure does not limit this.

[0135] In a first aspect, the present disclosure provides a display panel 200, comprising: a base substrate 21, a plurality of sub-pixels 22, a pixel definition layer 25, an isolation column 23, and an encapsulation layer 24. A plurality of sub-pixels 22 are arranged on one side of the base substrate 21, and the sub-pixels 22 include a first electrode 22A, a light-emitting layer 22B, and a second electrode 22C arranged in a stacked manner. The pixel definition layer 25 is arranged on one side of the base substrate 21, and includes a plurality of pixel openings 251, and the pixel openings 251 are configured to define the light-emitting area of ​​the sub-pixels 22. An isolation column 23 is arranged on a side of the pixel definition layer 25 away from the base substrate 21, for example, the isolation column 23 is located between two adjacent sub-pixels 22 and is arranged around the sub-pixels 22, and the isolation column 23 is configured to isolate the light-emitting layer 22B of the two adjacent sub-pixels 22 to avoid crosstalk between the adjacent sub-pixels 22, and the two adjacent sub-pixels 22 include a first sub-pixel 221 and a second sub-pixel 222. The encapsulation layer 24 includes a first encapsulation structure 24A and a second encapsulation structure 24B, wherein the first encapsulation structure 24A covers the first sub-pixel 221, and the second encapsulation structure 24B covers the second sub-pixel 222, and the first encapsulation structure 24A and the second encapsulation structure 24B are overlapped at the position of the isolation column 23. It should be noted that the position of the isolation column 23 refers to the position of the isolation column 23 in a direction perpendicular to the base substrate 21.

[0136] It should be noted that the overlapping arrangement of the first packaging structure 24A and the second packaging structure 24B at the position of the isolation column 23 may mean that: the orthographic projection of the first packaging structure 24A on the base substrate 21 at least partially overlaps with the orthographic projection of the second packaging structure 24B on the base substrate 21, and the overlapping area is located within the orthographic projection of the isolation column 23 on the base substrate 21.

[0137] Therefore, by overlapping the first encapsulation structure 24A covering the first sub-pixel 221 and the second encapsulation structure 24B covering the second sub-pixel 222 at the position of the isolation column 23, for example, the second encapsulation structure 24B is stacked on the first encapsulation structure 24A, so that there is no gap between the first encapsulation structure 24A and the second encapsulation structure 24B, and then when other sub-pixels 22 are prepared, for example, the first sub-pixel 221 is a red sub-pixel, the second sub-pixel 222 is a green sub-pixel, and the third sub-pixel 22 is a blue sub-pixel, the light-emitting material of the blue sub-pixel will not enter the already encapsulated red sub-pixel and / or green sub-pixel through the gap, thereby not affecting the curing and leveling of other subsequently prepared encapsulation layers 24 (for example, the organic encapsulation layer 208IJP (Inkjet Printing) and the inorganic encapsulation layer 24CVD2), and will not form orange peel or streaking problems due to poor moldability, thereby improving product yield and reliability, and improving display effects.

[0138] Figure 3 FIG. 2 is a schematic plan view of a display panel 200 according to an embodiment of the present disclosure.

[0139] like Figure 3 As shown, the display panel 200 may include: a display area and a frame area. The frame area is arranged around the display area. Alternatively, the frame area is located on at least one side of the display area, for example, the non-display area may be located on one side of the display area, or may be located on multiple sides of the display area, such as the non-display area may surround the outside of the display area.

[0140] In some embodiments, the display area may include a plurality of pixel units P arranged in an array. Figure 3 As shown, the display area is provided with a plurality of pixel units P arranged in an array in a first direction and a second direction. For example, the first direction can be Figure 3 The Y axis in the figure is represented by Figure 3 For example, multiple pixels P can be arranged into M rows and N columns, where M and N are integers greater than 2. Figure 3 Only a few pixel units P are shown as an example of arrangement, and ellipsis indicates other pixel units not shown. The first direction Y indicates the pixel column direction, and the second direction X indicates the pixel row direction. The first direction Y and the second direction X intersect, for example, are perpendicular to each other. It should be noted that Figure 3The arrangement of the pixel units shown in the figure is for illustration only and is not intended to be limiting. The actual arrangement is determined according to the needs of the product.

[0141] In some embodiments, each pixel unit P may include a plurality of sub-pixels 22, and each sub-pixel 22 may display a single color. For example, the plurality of sub-pixels 22 may include a sub-pixel p1, a sub-pixel p2, and a sub-pixel p3, and the sub-pixel p1, the sub-pixel p2, and the sub-pixel p3 are sub-pixels 22 of different colors, such as red, green, and blue. The brightness (grayscale) of the sub-pixels 22 of different colors in each pixel unit can be adjusted, and the display of multiple colors can be realized by color combination and superposition, thereby realizing full-color display.

[0142] Each sub-pixel 22 may include a light-emitting device and a pixel driving circuit for driving the light-emitting device. For example, the light-emitting device may be an organic light-emitting diode (OLED) or a quantum dot organic light-emitting diode (QLED). For example, a red sub-pixel may include a light-emitting device for emitting red light, a green sub-pixel may include a light-emitting device for emitting green light, and a blue sub-pixel may include a light-emitting device for emitting blue light.

[0143] The pixel driving circuit may include electronic components such as multiple transistors and capacitors. For example, the pixel driving circuit may include three transistors and one capacitor, forming a 3T1C (i.e., a driving transistor, two switching transistors and a capacitor). It may also include more than three transistors and at least one capacitor, such as a 4T1C (i.e., a driving transistor, three switching transistors and a capacitor), a 5T1C (i.e., a driving transistor, four switching transistors and a capacitor) or a 7T1C (i.e., a driving transistor, six switching transistors and a capacitor), etc. Among them, the transistor may be a thin film transistor (Thin Film Transistor, referred to as TFT), a field effect transistor (metal oxide semiconductor, referred to as MOS) or other switching devices with the same characteristics.

[0144] It can be understood that the transistor may include a control electrode, a first electrode, and a second electrode. The control electrode is the gate of the transistor, the first electrode is one of the source and drain of the transistor, and the second electrode is the other of the source and drain of the transistor. Since the source and drain of the transistor may be symmetrical in structure, the source and drain may be structurally indistinguishable, so the source of the transistor is called the first electrode, and may also be called the second electrode.

[0145] In some embodiments, the substrate 21 may be a rigid substrate, which may include, for example, a glass substrate, a PMMA (Polymethyl methacrylate) substrate, a silicon substrate, etc. In this case, the display panel 200 may be a rigid display panel 200 .

[0146] In some other embodiments, the substrate 21 may be a flexible substrate. The flexible substrate may include, for example, a PET (Polyethylene terephthalate) substrate, a PEN (Polyethylenenaphthalate diformic acid glycol ester) substrate, or a PI (Polyimide) substrate. In this case, the display panel 200 may be a flexible display panel 200.

[0147] The display panel 200 further includes a driving circuit layer (not shown in the figure) stacked between the first electrode 22A and the base substrate 21. The driving circuit layer is configured to form the above-mentioned pixel driving circuit of each sub-pixel 22. For example, the driving circuit layer may include a plurality of pixel driving circuits distributed in an array in the first direction Y and the second direction X. For example, in addition to the pixel driving circuit, the driving circuit layer may also be used to form a sensing element such as an ambient light sensor and its driving element integrated under the screen, which is specifically set according to actual needs, and this embodiment does not limit this.

[0148] like Figure 2 As shown, the pixel opening 251 exposes at least a portion of the first electrode 22A. For example, the orthographic projection of the pixel opening 251 on the base substrate 21 is located within the orthographic projection range of the first electrode 22A on the base substrate 21.

[0149] The isolation column 23 is arranged on the side of the pixel defining layer away from the base substrate 21. The isolation column 23 is located between two adjacent sub-pixels 22 and is arranged around the sub-pixel 22, that is, it is located between the light-emitting areas of the two adjacent sub-pixels 22 and is arranged around the light-emitting area of ​​the sub-pixel 22. For example, the positive projection of the isolation column 23 on the base substrate 21 is a mesh area, and the positive projection of the light-emitting area of ​​each sub-pixel 22 on the base substrate 21 is located in the opening of the mesh area. The isolation column 23 has an undercut structure similar to an "inverted trapezoid" or "I-shaped". The isolation column 23 can be used to separate the material of the light-emitting layer 22B in the subsequent process, so as to realize the separate evaporation and packaging of each sub-pixel 22. In some embodiments, the isolation column 23 can be formed by a plurality of stacked metal layers, such as a Ti (titanium)-Al (aluminum)-Ti (titanium) stacked structure. In other embodiments, the isolation column 23 can also be formed by an inorganic insulating layer and / or an organic layer, which is not limited by the present disclosure.

[0150] The light emitting layer 22B is disposed on a side of the first electrode 22A away from the base substrate 21. For example, a portion of the light emitting layer 22B is located in the corresponding pixel opening 251, is electrically connected to the corresponding first electrode 22A, and can extend from the side wall of the pixel defining layer facing the pixel opening 251 to the isolation column 23 located on the top of the pixel defining layer, and is separated by the undercut structure of the isolation column 23.

[0151] In some embodiments, the light-emitting layer 22B may include a light-emitting material layer (EML) and a functional material layer stacked with the light-emitting material layer. For example, the functional material layer may include: one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL), which may be specifically configured according to actual needs, and the present disclosure does not limit this.

[0152] The second electrode 22C is stacked on the side of the light-emitting layer 22B away from the base substrate 21. The light-emitting device of each sub-pixel 22 includes a second electrode 22C stacked on the light-emitting layer 22B of the sub-pixel 22. In some embodiments, the isolation column 23 has a conductive property, and the isolation columns 23 surrounding each sub-pixel 22 are mutually conductive, such as Figure 2 As shown, the second electrode 22C of each sub-pixel 22 is overlapped on the isolation column 23 and is conductive with the isolation column 23, so that the second electrode 22C of each sub-pixel 22 can be conductive through the isolation column 23, so as to input electrical signals to the second electrode 22C layer.

[0153] One of the first electrode 22A and the second electrode 22C is the anode of the light-emitting device, and the other is the cathode of the light-emitting device. Taking the first electrode 22A as the anode and the second electrode 22C as the cathode as an example, the first electrode 22A can be, for example, a composite structure composed of a transparent conductive oxide film / metal film / transparent conductive oxide film stacked in sequence. The material of the transparent conductive oxide film is, for example, any one of ITO (Indium tin oxide) and IZO (Indium zinc oxide), and the material of the metal film is, for example, any one of gold (Au), silver (Ag), nickel (Ni) and platinum (Pt). Alternatively, the first electrode 22A can also be a single-layer structure, and the material of the single-layer structure can be any one of ITO, IZO, Au, Ag, Ni, and Pt. The second electrode 22C113 can be, for example, a metal film with a certain transmittance, such as any one of aluminum (Al), silver (Ag) and magnesium (Mg), or any one of a magnesium-silver alloy and an aluminum-lithium alloy.

[0154] Figure 4 A first pixel arrangement schematic diagram of some embodiments of the present disclosure is shown.

[0155] In some embodiments, the plurality of sub-pixels 22 include a first color sub-pixel 223, a second color sub-pixel 224, and a third color sub-pixel 225, and the plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction to form a plurality of pixel rows and a plurality of pixel columns; the plurality of pixel columns include a first pixel column, a second pixel column, and a third pixel column arranged at intervals along the first direction, the first pixel column includes a plurality of the first color sub-pixels 223, the second pixel column includes a plurality of the second color sub-pixels 224, and the third pixel column includes a plurality of the third color sub-pixels 225. That is, the above-mentioned pixel arrangement form can be a Real RGB slit arrangement. The first sub-pixel 221 and the second sub-pixel 222 are two of the first color sub-pixel 223, the second color sub-pixel 224, and the third color sub-pixel 225.

[0156] It can be understood that each pixel unit may include: a first color sub-pixel 223, a second color sub-pixel 224 and a third color sub-pixel 225. The first sub-pixel 221 may be one of the three color sub-pixels 22, and the second sub-pixel 222 may be another of the three color sub-pixels 22, for example: the first sub-pixel 221 is the first color sub-pixel 223, and the second sub-pixel 222 is the second color sub-pixel 224; or, the first sub-pixel 221 is the second color sub-pixel 224, and the second sub-pixel 222 is the third color sub-pixel 225; or, the first sub-pixel 221 is the third color sub-pixel 225, and the second sub-pixel 222 is the first color sub-pixel 223. Therefore, in the Real RGB slit pixel arrangement, two adjacent sub-pixels 22 (the first sub-pixel 221 and the second sub-pixel 222) are sub-pixels 22 of different colors, and the packaging structures of the two adjacent sub-pixels 22 of different colors are overlapped at the position of the isolation column 23, thereby avoiding the problem of gaps between the above-mentioned packaging structures.

[0157] In some embodiments, the first sub-pixel 221 is any one of the first color sub-pixel 223, the second color sub-pixel 224, and the third color sub-pixel 225, and in the first direction, the first encapsulation structures 24A are connected to each other and arranged in the same layer. Alternatively, the second sub-pixel 222 is any one of the first color sub-pixel 223, the second color sub-pixel 224, and the third color sub-pixel 225, and in the first direction, the second encapsulation structures 24B are connected to each other and arranged in the same layer.

[0158] It can be understood that the sub-pixels 22 of the same color are arranged along the first direction. In the preparation process, the sub-pixels 22 of the same color can be simultaneously evaporated on the base substrate 21. Therefore, in order to improve the process efficiency, in the first direction, the packaging structures on the sub-pixels 22 of the same color can be prepared on the same layer, that is, the packaging structure is formed on each sub-pixel 22 of the same color at the same time through the same process, so that each packaging structure is interconnected and arranged on the same layer, that is, the first packaging structures 24A are interconnected and arranged on the same layer, and the second packaging structures 24B are interconnected and arranged on the same layer.

[0159] In some embodiments, the plurality of sub-pixels 22 include first color sub-pixels 223, second color sub-pixels 224, and third color sub-pixels 225. The plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction to form a plurality of pixel rows and a plurality of pixel columns. The plurality of pixel columns include a first pixel column, a second pixel column, and a third pixel column arranged at intervals along the first direction. The first pixel column and the second pixel column respectively include a plurality of first color sub-pixels 223 and a plurality of second color sub-pixels 224 staggered along the first direction. In the first pixel column and the second pixel column, the colors of the sub-pixels 22 located in the same pixel row are different. The third pixel column includes a plurality of third color sub-pixels 225 arranged at intervals along the first direction. The first sub-pixel 221 and the second sub-pixel 222 are two of the first color sub-pixel 223, the second color sub-pixel 224, and the third color sub-pixel 225.

[0160] For example, the first sub-pixel 221 may be one of the three colors of the sub-pixel 22, and the second sub-pixel 222 may be another of the three colors of the sub-pixel 22, for example: the first sub-pixel 221 is the first color sub-pixel 223, and the second sub-pixel 222 is the second color sub-pixel 224; or, the first sub-pixel 221 is the second color sub-pixel 224, and the second sub-pixel 222 is the third color sub-pixel 225; or, the first sub-pixel 221 is the third color sub-pixel 225, and the second sub-pixel 222 is the first color sub-pixel 223. Thus, the two adjacent sub-pixels 22 (the first sub-pixel 221 and the second sub-pixel 222) are sub-pixels 22 of different colors, and the encapsulation structures of the two adjacent and different color sub-pixels 22 are overlapped at the position of the isolation column 23, thereby avoiding the problem of gaps between the above-mentioned encapsulation structures.

[0161] In some embodiments, the first sub-pixel 221 is the third color sub-pixel 225, and in the first direction, the first encapsulation structures 24A are connected to each other and arranged in the same layer. Alternatively, the second sub-pixel 222 is the third color sub-pixel 225, and in the first direction, the second encapsulation structures 24B are connected to each other and arranged in the same layer.

[0162] It can be understood that the third pixel column includes a plurality of third color sub-pixels 225, that is, the third pixel column is arranged along the first direction for sub-pixels 22 of the same color, and in the preparation process, the sub-pixels 22 of the same color can be simultaneously evaporated on the base substrate 21. In the first direction, the encapsulation structure on the sub-pixels 22 of the same color can be prepared in the same layer, that is, the encapsulation structure is formed on each sub-pixel 22 of the same color at the same time through the same process, so that each encapsulation structure is connected to each other and arranged in the same layer, that is, the encapsulation structure on the adjacent sub-pixels 22 of the same color is not separately etched, thereby improving the process efficiency.

[0163] Figure 5 A second pixel arrangement schematic diagram of some embodiments of the present disclosure is shown.

[0164] In some embodiments, the second pixel column is located between the first pixel column and the third pixel column, the first color sub-pixel 223 is a red sub-pixel, the second color sub-pixel 224 is a green sub-pixel, and the third color sub-pixel 225 is a blue sub-pixel.

[0165] That is to say, the above-mentioned pixel arrangement form can be a slot real RGB arrangement. When the slotreal RGB pixels are arranged, in the first direction, the first encapsulation structures 24A between the blue sub-pixels are interconnected and arranged in the same layer, or the second encapsulation structures 24B between the blue sub-pixels are interconnected and arranged in the same layer, that is, the encapsulation structures on the blue sub-pixels are not etched separately, thereby improving the process efficiency.

[0166] Figure 6 A third pixel arrangement schematic diagram of some embodiments of the present disclosure is shown.

[0167] In some embodiments, the third pixel column is located between the first pixel column and the second pixel column, the first color sub-pixel 223 is a red sub-pixel, the second color sub-pixel 224 is a blue sub-pixel, and the third color sub-pixel 225 is a green sub-pixel.

[0168] That is to say, the above-mentioned pixel arrangement form can be an SPR RGB (RGB sub-pixel 22 reconstruction) arrangement. When the SPR RGB pixel is arranged, in the first direction, the first encapsulation structures 24A between the green sub-pixels are interconnected and arranged in the same layer, or the second encapsulation structures 24B between the green sub-pixels are interconnected and arranged in the same layer, that is, the encapsulation structures on each green sub-pixel are not etched separately, thereby improving the process efficiency.

[0169] It should be noted that Figures 4 to 6The pixel arrangement and the shape of each sub-pixel 22 shown in the figure are for illustration only and are not intended to be limiting. The shape of the sub-pixel 22 can be a single shape or a combination of multiple shapes such as a strip, square, diamond, pentagon, hexagon, circle or ellipse.

[0170] Continue to see Figures 2 to 6 In some embodiments, among the plurality of sub-pixels 22, the isolation columns 23 between adjacent sub-pixels 22 are connected to each other, the orthographic projection of the isolation column 23 on the base substrate 21 is a mesh region, and the orthographic projection of the light-emitting area of ​​the sub-pixel 22 on the base substrate 21 is located within the opening of the mesh region. The isolation column 23 includes a first isolation portion 23A and a second isolation portion 23B stacked together; the first encapsulation structure 24A includes a first encapsulation portion 24A1, the first encapsulation portion 24A1 covers at least a portion of the top of the second isolation portion 23B, the second encapsulation structure 24B includes a second encapsulation portion 24B1, the second encapsulation portion 24B1 covers at least a portion of the top of the second isolation portion 23B, and the first encapsulation portion 24A1 and the second encapsulation portion 24B1 are overlapped at the top of the second isolation portion 23B. It should be noted that the top of the second isolation portion 23B refers to the surface of the second isolation portion 23B away from the base substrate 21. That is, the orthographic projection of the first encapsulation portion 24A1 on the base substrate 21 at least partially overlaps with the orthographic projection of the second encapsulation portion 24B1 on the base substrate 21 , and the overlapping region of the orthographic projections is located within the orthographic projection of the second isolation portion 23B on the base substrate 21 .

[0171] That is to say, in the above-mentioned isolation column 23 setting, the isolation column 23 between two adjacent sub-pixels 22 is shared. Exemplarily, the second electrode 22C can be a cathode, and the isolation column 23 can be a metal isolation column 23, that is, the isolation column 23 has conductivity, so that the second electrode 22C can be overlapped on the isolation column 23, and the second electrodes 22C of each sub-pixel 22 can be electrically connected through the isolation column 23, so that the second electrodes 22C of multiple sub-pixels 22 can be applied with the same electrical signal, so that the second electrodes 22C are shared.

[0172] Exemplarily, the orthographic projection of the first isolation portion 23A on the base substrate 21 is located within the orthographic projection of the second isolation portion 23B on the base substrate 21. At this time, the isolation column 23 forms a bottom concave structure with a narrower lower layer and a wider upper layer, that is, a bottom cut structure (for example, a "T"-shaped structure), which is convenient for isolating adjacent sub-pixels 22 to avoid crosstalk between adjacent sub-pixels 22.

[0173] like Figure 2As shown, the first encapsulation structure 24A covers the first sub-pixel 221, and the light-emitting layer 22B and the second electrode 22C of the first sub-pixel 221 are partially formed on the top of the second isolation portion 23B. In order to encapsulate the light-emitting layer 22B and the second electrode 22C of the first sub-pixel 221, the first encapsulation structure 24A is provided with a first encapsulation portion 24A1, and the first encapsulation portion 24A1 covers at least a portion of the top of the second isolation portion 23B; similarly, the second encapsulation structure 24B covers the second sub-pixel 222, and the light-emitting layer 22B and the second electrode 22C of the second sub-pixel 222 are The electrode 22C is partially formed on the top of the second isolation portion 23B. In order to encapsulate the light-emitting layer 22B and the second electrode 22C of the second sub-pixel 222, the first encapsulation structure 24A is provided with a second encapsulation portion 24B1, and the second encapsulation portion 24B1 covers at least a partial area of ​​the top of the second isolation portion 23B. In order to avoid the orange peel problem of the display screen caused by the gap between the first encapsulation portion 24A1 and the second encapsulation portion 24B1, the first encapsulation portion 24A1 and the second encapsulation portion 24B1 are overlapped on the top of the second isolation portion 23B.

[0174] Figure 7 Shows Figure 2 The first partial enlarged view within the dotted box in .

[0175] In some embodiments, the plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction. The plurality of pixel openings 251 include a first pixel opening 251A and a second pixel opening 251B. The first pixel opening 251A is configured to define a light-emitting area of ​​the first sub-pixel 221, and the second pixel opening 251B is configured to define a light-emitting area of ​​the second sub-pixel 222. In the second direction, a first distance L1 is provided between a side of the first encapsulation portion 24A1 away from the first pixel opening 251A and a side of the second isolation portion 23B close to the first pixel opening 251A, a second distance L2 is provided between a side of the second encapsulation portion 24B1 away from the second pixel opening 251B and a side of the second isolation portion 23B close to the second pixel opening 251B, and a third distance L3 is provided between a side of the second encapsulation portion 24B1 away from the second pixel opening 251B and a side of the first encapsulation portion 24A1 away from the first pixel opening 251A. The sum of the first distance L1 and the second distance L2 is equal to the sum of the third distance L3 and the width of the gap of the pixel opening 251, that is, L1+L2=L3+W1, and the gap of the pixel opening 251 is the gap between the first pixel opening 251A and the second pixel opening 251B.

[0176] It can be understood that the third distance L3 can refer to the width of the overlapping area of ​​the first encapsulation part 24A1 and the second encapsulation part 24B1 on the second isolation part 23B, and the sum of the first distance L1 and the second distance L2 can refer to the sum of the width of the second isolation part 23B and the third distance L3. That is, the width of the second isolation part 23B can be equal to the gap of the pixel opening 251, so that the first encapsulation structure 24A and the second encapsulation structure 24B are overlapped on the top of the second isolation part 23B to prevent the problem of orange peel; because the width of the second isolation part 23B can determine the width of the encapsulation structure covering it, therefore, when the width of the second isolation part 23B can be equal to the gap of the pixel opening 251, the encapsulation effectiveness of the encapsulation layer 24 and the increase of the effective luminous area (the area actually used for luminescence of each sub-pixel 22) and the enhancement of the display effect can be taken into account (the narrower isolation column 23 means more space for the luminous material, thereby increasing the effective luminous area of ​​each sub-pixel 22). In addition, the resolution of the display product (the number of pixels per unit area, usually expressed in pixels per inch (PPI)) can also be improved. In addition, optical crosstalk (ie, light leakage between adjacent sub-pixels 22, which may cause color mixing and contrast reduction) can also be reduced.

[0177] Figure 8 Shows Figure 2 The second partial enlarged view within the dotted box in .

[0178] In some embodiments, the plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction. The plurality of pixel openings 251 include a first pixel opening 251A and a second pixel opening 251B, wherein the first pixel opening 251A is configured to define a light-emitting area of ​​the first sub-pixel 221, and the second pixel opening 251B is configured to define a light-emitting area of ​​the second sub-pixel 222. In the second direction, a first distance L1 is provided between a side of the first encapsulation portion 24A1 away from the first pixel opening 251A and a side of the second isolation portion 23B close to the first pixel opening 251A, a fourth distance L4 is provided between a side of the second electrode 22C of the first sub-pixel 221 close to the first isolation portion 23A and a side of the second isolation portion 23B close to the first pixel opening 251A, and a fifth distance L5 is provided between a side of the light-emitting layer 22B of the first sub-pixel 221 close to the first isolation portion 23A and a side of the second isolation portion 23B close to the first pixel opening 251A. The first distance L1 is greater than the fourth distance L4, and the fourth distance L4 is greater than the fifth distance L5.

[0179] It is understandable that the second electrode 22C may be a cathode, the isolation column 23 may be a metal isolation column 23, and the end of the second electrode 22C may overlap the metal isolation column 23, so that the second electrodes 22C of each sub-pixel 22 are electrically connected to each other and the cathode is shared. On this basis, the light-emitting layer 22B of the first sub-pixel 221 is partially overlapped on the pixel definition layer 25 (not at the position of the pixel opening 251), so that the second electrode 22C of the first sub-pixel 221 can overlap with the metal isolation column 23. Since the first encapsulation structure 24A covers the first sub-pixel 221, the coverage width L1 of the first encapsulation part 24A1 at the top of the second isolation part 23B is greater than the distance L4 between the boundary of the second electrode 22C in the first sub-pixel 221 and the boundary of the second isolation part 23B. The distance L4 between the boundary of the second electrode 22C in the first sub-pixel 221 and the boundary of the second isolation part 23B is greater than the distance between the boundary of the light-emitting layer 22B in the first sub-pixel 221 and the boundary of the first isolation part 23A. Therefore, while ensuring that the cathode of the first sub-pixel 221 can overlap with the metal isolation column 23, the first encapsulation structure 24A can effectively encapsulate the light-emitting layer 22B of the first sub-pixel 221.

[0180] Fig. 9 Shows Figure 2 The third partial enlarged view within the dotted box in FIG.

[0181] In some embodiments, the plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction. The plurality of pixel openings 251 include a first pixel opening 251A and a second pixel opening 251B, wherein the first pixel opening 251A is configured to define a light-emitting area of ​​the first sub-pixel 221, and the second pixel opening 251B is configured to define a light-emitting area of ​​the second sub-pixel 222. In the second direction, a side of the second encapsulation portion 24B1 away from the second pixel opening 251B and a side of the second isolation portion 23B close to the second pixel opening 251B have a second distance L2, a side of the second electrode 22C of the second sub-pixel 222 close to the first isolation portion 23A and a side of the second isolation portion 23B close to the second pixel opening 251B have a sixth distance L6, and a side of the light-emitting layer 22B of the second sub-pixel 222 close to the first isolation portion 23A and a side of the second isolation portion 23B close to the second pixel opening 251B have a seventh distance L7. The second distance L2 is greater than the sixth distance L6, and the sixth distance L6 is greater than the seventh distance L7.

[0182] It is understandable that the second electrode 22C may be a cathode, the isolation column 23 may be a metal isolation column 23, and the end of the second electrode 22C may overlap the metal isolation column 23, so that the second electrodes 22C of each sub-pixel 22 are electrically connected to each other and the cathode is shared. On this basis, the light-emitting layer 22B of the second sub-pixel 222 is partially overlapped on the pixel definition layer 25 (not at the position of the pixel opening 251), so that the second electrode 22C of the second sub-pixel 222 can overlap with the metal isolation column 23. Since the second encapsulation structure 24B covers the second sub-pixel 222, the coverage width L2 of the second encapsulation part 24B1 at the top of the second isolation part 23B is greater than the distance L6 between the boundary of the second electrode 22C in the second sub-pixel 222 and the boundary of the second isolation part 23B. The distance L6 between the boundary of the second electrode 22C in the second sub-pixel 222 and the boundary of the second isolation part 23B is greater than the distance between the boundary of the light-emitting layer 22B in the second sub-pixel 222 and the boundary of the first isolation part 23A. Therefore, while ensuring that the cathode of the second sub-pixel 222 can overlap with the metal isolation column 23, the second encapsulation structure 24B can effectively encapsulate the light-emitting layer 22B of the second sub-pixel 222.

[0183] Fig.10 Shows Figure 2 The fourth partial enlarged view within the dotted box in FIG.

[0184] In some embodiments, the plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction. The plurality of pixel openings 251 include a first pixel opening 251A and a second pixel opening 251B, wherein the first pixel opening 251A is configured to define a light-emitting area of ​​the first sub-pixel 221, and the second pixel opening 251B is configured to define a light-emitting area of ​​the second sub-pixel 222. In the second direction, a first distance L1 is provided between a side of the first encapsulation portion 24A1 away from the first pixel opening 251A and a side of the second isolation portion 23B close to the first pixel opening 251A, and a second distance L2 is provided between a side of the second encapsulation portion 24B1 away from the second pixel opening 251B and a side of the second isolation portion 23B close to the second pixel opening 251B. The sum of the first distance L1 and the second distance L2 is greater than a width W1 of a gap between the pixel openings 251, and the gap between the pixel openings 251 is the gap between the first pixel opening 251A and the second pixel opening 251B.

[0185] It can be understood that the sum of the first distance L1 and the second distance L2 may refer to the sum of the width of the second isolation portion 23B and the third distance L3, that is, the total width of the encapsulation layer 24 covering the second isolation portion 23B is greater than the width of the gap of the pixel opening 251, thereby increasing the width of the encapsulation layer 24 so that the first encapsulation structure 24A and the second encapsulation structure 24B are overlapped on the top of the second isolation portion 23B, thereby preventing orange peel and streak problems.

[0186] It should be noted that, in order to increase the effective light emitting area and the resolution, the gap between the pixel openings 251 can be set as small as possible. For example, the minimum value of the gap between the pixel openings 251 can be determined by the following formula:

[0187]

[0188] Among them, PDLgap represents the pixel opening gap, MaskPPA (Pixel Pattern Alignment) represents the pixel pattern alignment accuracy, CD (Critical Dimension) refers to the critical dimension on PDL (Pixel Definition Layer) used to define each sub-pixel area, usually the width or diameter of the sub-pixel opening. This dimension determines the effective light-emitting area of ​​each sub-pixel and the isolation distance between adjacent sub-pixels, Aligner represents the accuracy of the alignment machine, TP represents the touch panel parameters, Overlay represents the width of the overlapping area of ​​the first packaging structure and the second packaging structure, that is, the third distance L3, Temp represents the evaporation temperature, Shadow represents the shadow accuracy, and PS EFF (Pattern Shadow Efficiency) represents the pattern shadow efficiency.

[0189] In some embodiments, the width of each of the first distance L1 and the second distance L2 can be determined by the width and material of the isolation column 23. For example, if the minimum width of the isolation column 23 is 2 microns, then the width of the first distance L1 and the second distance L2 can be 0.5-1 microns. Then, the width of the overlapping area of ​​the first packaging structure 24A and the second packaging structure 24B, that is, the third distance L3 can be: 0.5μm<L3<Mμm, where M=minimum PDLGap-CD value.

[0190] In some embodiments, when two adjacent sub-pixels 22 share an isolation column 23, the etching cross-sections of the light-emitting layer 22B material, the cathode material, and the packaging structure material (the material of the first packaging structure 24A and the material of the second packaging structure 24B) on the isolation column 23 are related to the material properties and the etching rate. For example, when the etching rates of different materials are different, the cross-sectional morphologies obtained by etching are different.

[0191] In some embodiments, the slope angle between the side wall of the first isolation portion 23A and / or the second isolation portion 23B and the plane of the substrate 21 is greater than or equal to 70 degrees, for example, 70 degrees, 75 degrees, 80 degrees, 85 degrees, etc.; the slope angle between the side wall of the light-emitting layer 22B and the plane of the substrate 21 is in the range of 50 degrees to 70 degrees, for example, 50 degrees, 55 degrees, 60 degrees, 70 degrees, etc.; the slope angle between the side wall of the first encapsulation structure 24A and / or the second encapsulation structure 24B and the plane of the substrate 21 is greater than or equal to 70 degrees and less than or equal to 90 degrees, for example, 70 degrees, 75 degrees, 80 degrees, 85 degrees, 90 degrees, etc.

[0192] Fig.11 A fourth pixel arrangement schematic diagram of some embodiments of the present disclosure is shown; Fig.12 shows a fifth pixel arrangement schematic diagram of some embodiments of the present disclosure; Fig.13 shows a sixth pixel arrangement schematic diagram of some embodiments of the present disclosure, Fig.14 Another partial cross-sectional schematic diagram of the display panel 200 according to some embodiments of the present disclosure is shown.

[0193] like Figures 11 to 14 As shown, in some embodiments, among the multiple sub-pixels 22, the isolation columns 23 of adjacent sub-pixels 22 are disconnected from each other, and an isolation groove 233 is provided between two adjacent isolation columns 23. That is, an independent isolation column 23 is provided around each sub-pixel 22, and the isolation columns 23 between adjacent sub-pixels 22 are not shared, and the isolation columns 23 of adjacent sub-pixels 22 are spaced from each other, thereby forming an isolation groove 233.

[0194] The isolation column 23 includes a first isolation column 231 disposed around the first sub-pixel 221 and a second isolation column 232 disposed around the second sub-pixel 222. The first isolation column 231 includes a third isolation portion 231A and a fourth isolation portion 231B stacked together. The second isolation column 232 includes a fifth isolation portion 232A and a sixth isolation portion 232B stacked together. The first encapsulation structure 24A includes a third encapsulation portion 24A2, the third encapsulation portion 24A2 covers the top of the fourth isolation portion 231B and at least a portion of the isolation groove 233. The second encapsulation structure 24B includes a fourth encapsulation portion 24B2, the fourth encapsulation portion 24B2 covers the top of the sixth isolation portion 232B and at least a portion of the isolation groove 233. The third encapsulation portion 24A2 and the fourth encapsulation portion 24B2 are overlapped in the isolation groove 233. That is, the orthographic projection of the third encapsulation portion 24A2 on the base substrate 21 at least partially overlaps with the orthographic projection of the fourth encapsulation portion 24B2 on the base substrate 21 , and the overlapping region of the orthographic projections is located within the orthographic projection of the isolation trench 233 on the base substrate 21 .

[0195] That is to say, in the above-mentioned isolation column 23 setting, the isolation column 23 between two adjacent sub-pixels 22 is not shared. Exemplarily, the second electrode 22C can be a cathode, and the isolation column 23 can be a metal isolation column 23, that is, the isolation column 23 is conductive, so that the second electrode 22C can be overlapped on the metal isolation column 23. Since the isolation column 23 of two adjacent sub-pixels 22 is not shared, the cathodes of the two adjacent sub-pixels 22 are also not shared, that is, independent cathodes.

[0196] Exemplarily, the orthographic projection of the third isolation portion 231A on the base substrate 21 is located within the orthographic projection of the fourth isolation portion 231B on the base substrate 21. At this time, the isolation column 23 forms a bottom concave structure with a narrower lower layer and a wider upper layer, that is, a bottom cut structure (for example, a trapezoidal structure), which is convenient for isolating adjacent sub-pixels 22 to avoid crosstalk between adjacent sub-pixels 22.

[0197] like Fig.14 As shown, the first encapsulation structure 24A covers the first sub-pixel 221, and the light-emitting layer 22B and the second electrode 22C of the first sub-pixel 221 partially cover the fourth isolation portion 231B and at least a portion of the isolation groove 233. In order to encapsulate the light-emitting layer 22B and the second electrode 22C of the first sub-pixel 221, the first encapsulation structure 24A is provided with a third encapsulation portion 24A2, and the third encapsulation portion 24A2 covers at least a portion of the fourth isolation portion 231B and the isolation groove 233; similarly, the second encapsulation structure 24B covers the second sub-pixel 222, and the light-emitting layer 22B and the second electrode 22C of the second sub-pixel 222 cover at least a portion of the fourth isolation portion 231B and the isolation groove 233. The second electrode 22C partially covers the sixth isolation portion 232B and at least a portion of the isolation groove 233. In order to encapsulate the light-emitting layer 22B and the second electrode 22C of the second sub-pixel 222, the second encapsulation structure 24B is provided with a fourth encapsulation portion 24B2. The fourth encapsulation portion 24B2 covers at least a portion of the sixth isolation portion 232B and the isolation groove 233. In order to avoid the orange peel problem of the display screen caused by the gap between the third encapsulation portion 24A2 and the fourth encapsulation portion 24B2, the third encapsulation portion 24A2 and the fourth encapsulation portion 24B2 are overlapped in the isolation groove 233.

[0198] Fig.15 Shows Fig.14 The first partial enlarged view within the dotted box in .

[0199] In some embodiments, the plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction.

[0200] The plurality of pixel openings 251 include a first pixel opening 251A and a second pixel opening 251B, wherein the first pixel opening 251A is configured to define a light emitting area of ​​the first sub-pixel 221, and the second pixel opening 251B is configured to define a light emitting area of ​​the second sub-pixel 222. In the second direction, a side of the fourth isolating portion 231B close to the first pixel opening 251A and a side of the third isolating portion 231A close to the first pixel opening 251A have an eighth distance L8, and a side of the fourth isolating portion 231B far from the first pixel opening 251A and a side of the third isolating portion 231A far from the first pixel opening 251A have a ninth distance L9, and the eighth distance L8 is greater than the ninth distance L9. And / or, the side of the sixth isolation portion 232B close to the second pixel opening 251B and the side of the fifth isolation portion 232A close to the second pixel opening 251B have a tenth distance L10, the side of the sixth isolation portion 232B away from the second pixel opening 251B and the side of the fifth isolation portion 232A away from the second pixel opening 251B have an eleventh distance L11, and the tenth distance L10 is greater than the eleventh distance L11.

[0201] It can be understood that the eighth distance L8 is the width of the side of the first spacer 231 close to the light-emitting area of ​​the first sub-pixel 221, the ninth distance L9 is the width of the non-light-emitting area of ​​the first spacer 231 close to the adjacent two sub-pixels 22, the tenth distance L10 is the width of the side of the second spacer 232 close to the light-emitting area of ​​the second sub-pixel 222, and the eleventh distance L11 is the width of the non-light-emitting area of ​​the second spacer 232 close to the adjacent two sub-pixels 22. Since the light-emitting layer 22B material and the cathode material can be evaporated or not in the non-light-emitting area, if the light-emitting layer 22B material and the cathode material are not evaporated in the non-light-emitting area, the encapsulation structure (CVD) on the spacer 23 does not need to be covered too wide; in addition, if the width of the spacer 23 on one side of the non-light-emitting area is too large, it will affect the overall size of the display product and the resolution. On this basis, the embodiment of the present disclosure sets the eighth distance L8 to be greater than the ninth distance L9, and / or sets the tenth distance L10 to be greater than the eleventh distance L11.

[0202] Fig.16 Shows Fig.14 The second partial enlarged view within the dotted box in .

[0203] In some embodiments, the plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction.

[0204] The plurality of pixel openings 251 include a first pixel opening 251A and a second pixel opening 251B, wherein the first pixel opening 251A is configured to define a light emitting area of ​​the first sub-pixel 221, and the second pixel opening 251B is configured to define a light emitting area of ​​the second sub-pixel 222. In the second direction, a side of the third encapsulation portion 24A2 away from the first pixel opening 251A and a side of the fourth isolation portion 231B close to the first pixel opening 251A have a twelfth distance L12, a side of the fourth encapsulation portion 24B2 away from the second pixel opening 251B and a side of the sixth isolation portion 232B close to the second pixel opening 251B have a thirteenth distance L13, and a side of the third encapsulation portion 24A2 away from the first pixel opening 251A and a side of the fourth encapsulation portion 24B2 away from the second pixel opening 251B have a fourteenth distance L14. The sum of the twelfth distance L12 and the thirteenth distance L13 is greater than the sum of the fourteenth distance L14, the width W2 of the isolation groove 233 and the width W1 of the gap of the pixel opening 251, and the gap of the pixel opening 251 is the gap between the first pixel opening 251A and the second pixel opening 251B.

[0205] It can be understood that the sum of the twelfth distance L12 and the thirteenth distance L13 can refer to the sum of the width of the fourth isolation part 231B, the width of the isolation groove 233, the width of the sixth isolation part 232B and the width of the overlapping area, which is greater than the sum of the fourteenth distance L14, the width W2 of the isolation groove 233 and the width W1 of the gap of the pixel opening 251, so that the third encapsulation part 24A2 and the fourth encapsulation part 24B2 are overlapped in the isolation groove 233 to prevent the orange peel problem, and the encapsulation layer 24 can effectively encapsulate the light-emitting layer 22B, increase the effective light-emitting area (the area actually used for light emission of each sub-pixel 22) and enhance the display effect (the narrower isolation column 23 means more space for the light-emitting material, thereby increasing the effective light-emitting area of ​​each sub-pixel 22). In addition, the resolution of the display product (the number of pixels per unit area, usually expressed in pixels per inch (PPI)) can also be improved. In addition, optical crosstalk (i.e., light leakage between adjacent sub-pixels 22, which may cause color mixing and contrast reduction) can also be reduced.

[0206] Fig.17 Shows Fig.14 The third partial enlarged view within the dotted box in FIG.

[0207] In some embodiments, the plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction.

[0208] The plurality of pixel openings 251 include a first pixel opening 251A and a second pixel opening 251B. The first pixel opening 251A is configured to define a light emitting area of ​​the first sub-pixel 221 , and the second pixel opening 251B is configured to define a light emitting area of ​​the second sub-pixel 222 . In the second direction, a side of the third encapsulation part 24A2 away from the first pixel opening 251A and a side of the fourth isolation part 231B close to the first pixel opening 251A have a twelfth distance L12, a side of the fourth isolation part 231B away from the first pixel opening 251A and a side of the third isolation part 231A away from the first pixel opening 251A have a ninth distance L9, a side of the second electrode 22C of the first sub-pixel 221 close to the third isolation part 231A and a side of the fourth isolation part 231B close to the first pixel opening 251A have a fifteenth distance L15, and a side of the light-emitting layer 22B of the first sub-pixel 221 close to the third isolation part 231A and a side of the fourth isolation part 231B close to the opening of the first sub-pixel 221 have a sixteenth distance L16. The twelfth distance L2 is greater than the ninth distance L9, the ninth distance L9 is greater than the fifteenth distance L15, and the fifteenth distance L15 is greater than the sixteenth distance L16.

[0209] It can be understood that the second electrode 22C can be a cathode, the isolation column 23 can be a metal isolation column 23, and the end of the second electrode 22C can overlap the metal isolation column 23. On this basis, the light-emitting layer 22B of the first sub-pixel 221 is partially overlapped on the pixel definition layer 25 (not the position of the pixel opening 251), so that the second electrode 22C of the first sub-pixel 221 can overlap with the metal isolation column 23. Since the first packaging structure 24A covers the first sub-pixel 221, the third packaging part 24A2 covers the top of the fourth isolation part 231B and the width L12 of the isolation groove 233 is greater than the width L9 of the first isolation column 231 close to the light-emitting area of ​​the first sub-pixel 221, and the first isolation column 231 close to the first sub-pixel 221 is greater than the width L9 of the side. The width L9 of one side of the light-emitting area is greater than the distance L15 between the boundary of the second electrode 22C in the first sub-pixel 221 and the boundary of the fourth isolation part 231B, and the distance L15 between the boundary of the second electrode 22C in the first sub-pixel 221 and the boundary of the fourth isolation part 231B is greater than the distance L16 between the boundary of the light-emitting layer 22B in the first sub-pixel 221 and the boundary of the third isolation part 231A, so that the first encapsulation structure 24A can effectively encapsulate the light-emitting layer 22B of the first sub-pixel 221 while ensuring that the cathode of the first sub-pixel 221 can overlap with the metal isolation column 23.

[0210] Fig.18 Shows Fig.14The fifth partial enlarged view within the dotted box in FIG.

[0211] In some embodiments, the plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction.

[0212] The plurality of pixel openings 251 include a first pixel opening 251A and a second pixel opening 251B. The first pixel opening 251A is configured to define a light emitting area of ​​the first sub-pixel 221 , and the second pixel opening 251B is configured to define a light emitting area of ​​the second sub-pixel 222 . In the second direction, the side of the fourth encapsulation part 24B2 away from the second pixel opening 251B and the side of the sixth isolation part 232B close to the second pixel opening 251B have a thirteenth distance L13, the side of the sixth isolation part 232B away from the second pixel opening 251B and the side of the fifth isolation part 232A away from the second pixel opening 251B have an eleventh distance L11, the side of the second electrode 22C of the second sub-pixel 222 close to the fifth isolation part 232A and the side of the sixth isolation part 232B close to the second pixel opening 251B have a seventeenth distance L17, and the side of the light-emitting layer 22B of the second sub-pixel 222 close to the fifth isolation part 232A and the side of the sixth isolation part 232B close to the second sub-pixel 222 opening have an eighteenth distance L18. The thirteenth distance L13 is greater than the eleventh distance L11, the eleventh distance L11 is greater than the seventeenth distance L17, and the seventeenth distance L17 is greater than the eighteenth distance L18.

[0213] It can be understood that the second electrode 22C can be a cathode, the isolation column 23 can be a metal isolation column 23, and the end of the second electrode 22C can overlap with the metal isolation column 23. On this basis, the light-emitting layer 22B of the second sub-pixel 222 is partially overlapped on the pixel definition layer 25 (not the position of the pixel opening 251), so that the second electrode 22C of the second sub-pixel 222 can overlap with the metal isolation column 23. Since the second packaging structure 24B covers the second sub-pixel 222, the fourth packaging part 24B2 covers the top of the sixth isolation part 232B and the width L13 of the isolation groove 233 is greater than the width L17 of the second isolation column 232 on the side close to the light-emitting area of ​​the second sub-pixel 222, and the second isolation column 232 on the side close to the light-emitting area of ​​the second sub-pixel 222 is larger than the width L17 of the second isolation column 232 on the side close to the light-emitting area of ​​the second sub-pixel 222. The width L17 of one side of the light zone is greater than the distance L18 between the boundary of the second electrode 22C in the second sub-pixel 222 and the boundary of the sixth isolation part 232B, and the distance L18 between the boundary of the second electrode 22C in the second sub-pixel 222 and the boundary of the sixth isolation part 232B is greater than the distance L19 between the boundary of the light-emitting layer 22B in the second sub-pixel 222 and the boundary of the fifth isolation part 232A, so that the second encapsulation structure 24B can effectively encapsulate the light-emitting layer 22B of the second sub-pixel 222 while ensuring that the cathode of the second sub-pixel 222 can overlap with the metal isolation column 23.

[0214] Fig.19 Shows Fig.14 The sixth partial enlarged view within the dotted box in FIG.

[0215] In some embodiments, the plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction.

[0216] The plurality of pixel openings 251 include a first pixel opening 251A and a second pixel opening 251B, wherein the first pixel opening 251A is configured to define a light emitting area of ​​the first sub-pixel 221, and the second pixel opening 251B is configured to define a light emitting area of ​​the second sub-pixel 222. In the second direction, a side of the third encapsulation portion 24A2 away from the first pixel opening 251A and a side of the fourth isolation portion 231B close to the first pixel opening 251A have a twelfth distance L12, and a side of the fourth encapsulation portion 24B2 away from the second pixel opening 251B and a side of the sixth isolation portion 232B close to the second pixel opening 251B have a thirteenth distance L13. The sum of the twelfth distance L12 and the thirteenth distance is greater than the width W1 of the gap of the pixel opening 251, and the gap of the pixel opening 251 is the gap between the first pixel opening 251A and the second pixel opening 251B.

[0217] It can be understood that the sum of the twelfth distance L12 and the thirteenth distance L13 may refer to the sum of the width of the fourth isolation portion 231B, the width of the isolation groove 233, the width of the overlapping region, and the width of the sixth isolation portion 232B, that is, the sum of the width of the fourth isolation portion 231B, the width of the isolation groove 233, the width of the overlapping region, and the width of the sixth isolation portion 232B is greater than the width of the gap of the pixel opening 251. Thus, by increasing the width of the encapsulation layer 24, the first encapsulation structure 24A and the second encapsulation structure 24B are overlapped in the isolation groove 233, thereby preventing orange peel and streaking problems.

[0218] In some embodiments, the widths of the twelfth distance L12 and the thirteenth distance L13 may be determined by the width and material of the isolation column 23 . For example, the minimum width of the isolation column 23 is 6 micrometers, and the minimum PDL gap 10 is micrometers.

[0219] In some embodiments, in a direction perpendicular to the base substrate 21, the total thickness H of the third encapsulation part 24A2 and the fourth encapsulation part 24B2 after overlapping is greater than the thickness of the third encapsulation part 24A2 covering the first pixel opening 251A, and the thickness of the third encapsulation part 24A2 covering the first pixel opening 251A is greater than the thickness of the third encapsulation part 24A2 covering the fourth isolation part 231B. And / or, in a direction perpendicular to the base substrate 21, the total thickness of the third encapsulation part 24A2 and the fourth encapsulation part 24B2 after overlapping is greater than the thickness of the fourth encapsulation part 24B2 covering the second pixel opening 251B, and the thickness of the fourth encapsulation part 24B2 covering the second pixel opening 251B is greater than the thickness of the fourth encapsulation part 24B2 covering the sixth isolation part 232B.

[0220] It can be understood that when the third packaging part 24A2 and the fourth packaging part 24B2 overlap, the total thickness is greater than the thickness of the packaging part in the pixel. Since there is a step difference between the pixel opening 251 and the isolation column 23, the thickness of the packaging part in the pixel will be greater than the thickness of the packaging part on the isolation column 23.

[0221] In some embodiments, the slope angle between the side wall of the third isolation portion 231A and / or the fourth isolation portion 231B and the plane of the substrate substrate 21 is greater than or equal to 70 degrees, for example, 70 degrees, 75 degrees, 80 degrees, 85 degrees, etc.; the slope angle between the side wall of the fifth isolation portion 232A and / or the sixth isolation portion 232B and the plane of the substrate substrate 21 is greater than or equal to 70 degrees, for example, 70 degrees, 75 degrees, 80 degrees, 85 degrees, etc.; the slope angle between the side wall of the light-emitting layer 22B and the plane of the substrate substrate 21 ranges from 50 degrees to 70 degrees, for example, 50 degrees, 55 degrees, 60 degrees, 70 degrees, etc.; the slope angle between the side wall of the first encapsulation structure 24A and / or the second encapsulation structure 24B and the plane of the substrate substrate 21 is greater than or equal to 70 degrees and less than or equal to 90 degrees, for example, 70 degrees, 75 degrees, 80 degrees, 85 degrees, 90 degrees, etc.

[0222] At present, in some display products, due to unreasonable pixel design, color fringing may occur in the display image. That is, the color separation phenomenon occurs in the human eye when viewing the image at a certain angle. There are obvious red and cyan ghosting at the edge of the content or the border of the projected image. When viewing white image content, the color fringing phenomenon is more obvious.

[0223] In view of this, the embodiments of the present disclosure propose the following pixel design, which aims to reduce or even eliminate the color fringing problem to a certain extent.

[0224] Fig. 20 A seventh pixel arrangement schematic diagram of some embodiments of the present disclosure is shown.

[0225] In some embodiments, the base substrate 21 includes a display area and a frame area, and the frame area is arranged around the display area. The display area is provided with the plurality of sub-pixels 22 and a plurality of edge sub-pixels 226, and the plurality of edge sub-pixels 226 and the plurality of sub-pixels 22 are arranged in an array in the first direction and the second direction to form a plurality of pixel rows and a plurality of pixel columns, and the plurality of edge sub-pixels 226 are arranged in the outermost pixel rows and the outermost pixel columns. The light-emitting area of ​​the edge sub-pixel 226 is smaller than the light-emitting area of ​​the sub-pixel 22.

[0226] Therefore, the embodiment of the present disclosure sets the light-emitting area of ​​the edge sub-pixel 226 in the display area to be smaller than the light-emitting area of ​​other sub-pixels 22, so that the light-emitting brightness of the edge sub-pixel 226 is smaller than the light-emitting brightness of other sub-pixels 22, thereby reducing the color edge problem of the edge sub-pixel 226 in the display image and improving the display quality.

[0227] It should be noted that Fig.21The pixel arrangement and the shape of the edge sub-pixel 226 shown in the figure are for illustration only and are not intended to be limiting. The shape of the edge sub-pixel 226 can be a single shape or a combination of multiple shapes such as a strip, square, diamond, pentagon, hexagon, circle or ellipse.

[0228] In some embodiments, the encapsulation layer 24 further covers the edge sub-pixel 226 , and in a direction perpendicular to the base substrate 21 , an edge of the encapsulation layer 24 is flush with an edge of the edge sub-pixel 226 .

[0229] It can be understood that the encapsulation layer 24 on the edge sub-pixel 226 is closest to the border area. In order to effectively encapsulate the edge sub-pixel 226 and avoid being disturbed by the border area, the edge of the encapsulation layer 24 is flush with the edge of the edge sub-pixel 226 to effectively encapsulate the edge sub-pixel 226.

[0230] It can be understood that the encapsulation layer 24 mentioned above may be an inorganic encapsulation layer 24 . For the sake of distinction, the encapsulation layer 24 is referred to as the first inorganic encapsulation layer 24 hereinafter.

[0231] In some embodiments, the display panel 200 may further include an organic encapsulation layer 208, which is disposed on a side of the first inorganic encapsulation layer 24 away from the base substrate 21. For example, the organic encapsulation layer 208 may be prepared by an inkjet printing process (Ink Jet Printing, IJP). The thickness of the organic encapsulation layer 208 may be greater than that of the first inorganic encapsulation layer 24, so as to achieve encapsulation and play a flat role at the same time.

[0232] The display panel 200 may further include a second inorganic encapsulation layer 209, which is disposed on a side of the organic encapsulation layer 208 away from the base substrate 21. The second inorganic encapsulation layer 209 is configured to form a thin film encapsulation (TFE) layer of the light-emitting device in combination with the organic encapsulation layer 208 and the first inorganic encapsulation layer 24, and encapsulates the light-emitting device of the sub-pixel 22 to prevent the light-emitting device from being corroded by water and oxygen and affecting the light emission.

[0233] Fig.21 A structural block diagram of a display device according to some embodiments of the present disclosure is shown.

[0234] A second aspect of the present disclosure provides a display device 300 , comprising a display panel 200 as described in any one of the first aspects.

[0235] The display device 300 provided in the embodiment of the present application includes the display panel 200 in any of the above embodiments, and the display device 200 can be any product or component with a display function, such as a mobile phone, a tablet computer, a digital photo frame, an electronic paper, etc. The display device 300 provided in the embodiment of the present application has all the beneficial effects of the display panel 200 provided in the embodiment of the present application, and the specific description of the display panel 200 in the above embodiments can be referred to, and this embodiment will not be repeated here.

[0236] Fig. 22 A flow chart of a method for preparing a display panel in the related art is shown.

[0237] It should be noted that photolithography OLED technology is a key technology for preparing OLED display products. In the process of related technologies, in order to protect OLED devices from the influence of moisture and oxygen, encapsulation treatment is usually performed, that is, OLED devices of each luminous color and inorganic encapsulation layer 14 are prepared in sequence, such as CVD1 (Chemical Vapor Deposition), to achieve full-color OLED products. For example: after forming an anode 101, a pixel definition material layer 102 and an isolation column material layer 103 on the base substrate 10, firstly, etching is performed to obtain a pixel opening of a red sub-pixel and an isolation column 13 around the red sub-pixel, and then a red light-emitting material layer 104, a cathode material layer and a packaging material layer 105 are evaporated on the isolation column material layer 103, and then the red light-emitting material layer 104, the cathode material layer, the packaging material layer 105 and the isolation column material layer 103 are synchronously etched to obtain a light-emitting layer 11B and a cathode 106 of a red sub-pixel, an inorganic packaging layer 14 (CVD1) on the red sub-pixel and isolation columns 13 around a green sub-pixel, and then the light-emitting layer 11B and the cathode 106 of the green sub-pixel, the inorganic packaging layer 14 on the green sub-pixel and the isolation columns 13 around the blue sub-pixel are prepared according to the above method, and the light-emitting layer 11B and the cathode 106 of the blue sub-pixel, and the inorganic packaging layer 14 on the blue sub-pixel are prepared.

[0238] Depend on Fig. 22It can be seen that the etching boundary of the encapsulation layer is located in the middle of two adjacent sub-pixels. As a result, there is a gap (Gap) between the encapsulation layers 14 on the two adjacent sub-pixels 11, for example, the etching liquid enters the red sub-pixel and / or the green sub-pixel along the gap between the encapsulation layer 14 of the red sub-pixel and the encapsulation layer 14 of the green sub-pixel, resulting in interlayer separation (peeling) in the already encapsulated red sub-pixel and / or the green sub-pixel. When evaporating the blue sub-pixel, the light-emitting layer 11B material of the blue sub-pixel will remain in the gap, which will cause the residual light-emitting material in the gap to affect the curing of the organic encapsulation layer (IJP) during the etching process of the blue sub-pixel, resulting in the deterioration of the film-forming property of the organic encapsulation layer, and then forming orange peel or mura problems on the display screen, causing poor display. In addition, since the light-emitting material layer, the cathode material layer, the encapsulation material layer and the isolation column material layer are etched synchronously, it is easy to cause the isolation column to be damaged, so that the cathode of the blue sub-pixel and the isolation column are poorly overlapped, so that the blue sub-pixel cannot be lit.

[0239] In view of this, the present disclosure proposes the following method for preparing a display panel, which aims to solve the above-mentioned problem to a certain extent.

[0240] Figures 23(a), 23(b) and 23(c) show flow charts of methods for preparing display panels according to some embodiments of the present disclosure. It should be noted that Figures 23(a), 23(b) and 23(c) together show a complete flow chart of the method for preparing a display panel according to an embodiment of the present disclosure. For the sake of clarity, the method flow chart is split here. Figures (a) to (m) respectively show staged schematic diagrams of the display panel after each step is completed.

[0241] A third aspect of the present disclosure provides a method for preparing a display panel, comprising:

[0242] Step S1. Providing a substrate 21;

[0243] Step S2. Form a plurality of sub-pixels 22, a pixel definition layer 25, a spacer 23 and an encapsulation layer 24 on the base substrate 21. The plurality of sub-pixels 22 are arranged on one side of the base substrate 21, and the sub-pixels 22 include a first electrode 22A, a light-emitting layer 22B and a second electrode 22C that are stacked. The pixel definition layer 25 is arranged on one side of the base substrate 21, and includes a plurality of pixel openings 251, and the pixel openings 251 are configured to define the light-emitting area of ​​the sub-pixels 22.

[0244] The isolation column 23 is arranged on a side of the pixel definition layer 25 away from the base substrate 21. The isolation column 23 is located between two adjacent sub-pixels 22 and is arranged around the sub-pixels 22. The isolation column 23 is configured to separate the light-emitting layer 22B of the two adjacent sub-pixels 22. The two adjacent sub-pixels 22 include a first sub-pixel 221 and a second sub-pixel 222.

[0245] The encapsulation layer 24 includes a first encapsulation structure 24A and a second encapsulation structure 24B. The first encapsulation structure 24A covers the first sub-pixel 221 , and the second encapsulation structure 24B covers the second sub-pixel 222 . The first encapsulation structure 24A and the second encapsulation structure 24B are overlapped at the position of the isolation column 23 .

[0246] It should be noted that the base substrate 21 may further include one or more other structures, and may include corresponding circuit wiring for electrically connecting with the pixels and controlling the light emission thereof.

[0247] Therefore, the display panel 200 prepared by the preparation method of the embodiment of the present disclosure can avoid the residue of the light-emitting layer 22B material of the sub-pixel 22 on the encapsulation layer 24, which in turn causes the problem of orange peel or mura on the display screen, thereby improving product yield and reliability and improving display effect.

[0248] For ease of understanding, the following is the preparation Figure 2 Taking the illustrated display panel 200 as an example, an exemplary preparation process of the display panel 200 is described.

[0249] In some embodiments, a plurality of sub-pixels 22, a pixel definition layer 25, a spacer column 23 and an encapsulation layer 24 are formed on the base substrate 21, including:

[0250] Step S21. Forming the first electrodes 22A of the plurality of sub-pixels 22 on the base substrate 21;

[0251] Step S22. Forming the pixel definition layer 25 on the base substrate 21, wherein the pixel definition layer 25 includes the plurality of pixel openings 251, and the pixel openings 251 expose the first electrode 22A;

[0252] Step S23. Forming a spacer column material layer 201 on the pixel definition layer 25, and etching the spacer column material layer 201 in the first region to obtain the spacer columns 23 around the first sub-pixel 221;

[0253] Exemplarily, the isolation column material layer 201 includes a first sublayer 201A and a second sublayer 201B. When the isolation column material layer 201 is etched in the first region, the first sublayer 201A and the second sublayer 201B are etched at the same time. The etching method may be photolithography, for example, using photoresist, so as to obtain the isolation column 23 around the first sub-pixel 221. The isolation column 23 includes a first isolation portion 23A and a second isolation portion 23B stacked. It is understandable that when adjacent sub-pixels 22 share the isolation column 23, at this time, only the side of the isolation column 23 around the first sub-pixel 221 close to the first sub-pixel 221 is etched, and the side away from the first sub-pixel 221 has not been etched.

[0254] Step S24. Vapor-depositing a first light-emitting material layer 202, a first electrode material layer 203 and a first packaging material layer 204 on the isolation column material layer 201;

[0255] It is understood that the first light-emitting material layer 202 may be a red light-emitting material layer, the first electrode material layer 203 may be a cathode material layer, and the red light-emitting material layer and the cathode material layer may be deposited by full-surface evaporation. Then, the first encapsulation material layer 204 (CVD1-R) of the red sub-pixel is deposited on the entire surface.

[0256] Step S25. Etching the first light-emitting material layer 202, the first electrode material layer 203 and the first packaging material layer 204 in the second region to obtain the light-emitting layer 22B and the second electrode 22C of the first sub-pixel 221 and the first packaging structure 24A;

[0257] Exemplarily, the encapsulation mask corresponding to the red sub-pixel (i.e., CVD1-R mask) is used to precisely control the removal and retention of CVD-R by exposure and development, that is, the CVD-R at the red sub-pixel is retained, and the CVD-R at other color sub-pixels 22 is removed to achieve CVD-R patterning. In addition, at the position where the CVD-R is etched, the light-emitting layer 22B material and the cathode material can be etched away simultaneously, and at the same time, the CVD-R can be effectively combined with the isolation column 23 at the undercut structure of the isolation column 23, forming an effective encapsulation of the light-emitting layer 22B and the cathode in the red sub-pixel, thereby completing the preparation of the light-emitting layer 22B, cathode and first encapsulation structure 24A of the red sub-pixel. After covering the isolation column 23 around the light-emitting area of ​​the red sub-pixel with CVD-R, a convex structure with a trapezoidal cross-section can be formed, and its slope angle can be 50° to 70°.

[0258] In the above process, one of the two relative etching boundaries of CVD-R can be located at the middle boundary between the red sub-pixel and one of the adjacent sub-pixels 22, and the other etching boundary can exceed the middle boundary between the red sub-pixel and another adjacent sub-pixel 22, and CVD-R is removed at the remaining positions.

[0259] Step S26. Etching is performed in the third region to obtain the isolation column 23 around the second sub-pixel 222;

[0260] The method for etching the third region here can refer to step S23, which will not be described in detail here.

[0261] Step S27. Vapor-depositing a second light-emitting material layer 205, a second electrode material layer 206 and a second packaging material layer 207 on the isolation column material layer 201;

[0262] It is understandable that the second light-emitting material layer 205 may be a green light-emitting material layer, the second electrode material layer 206 may be a cathode material layer, and the green light-emitting material layer and the cathode material layer may be deposited by full-surface evaporation. Then, the second encapsulation material layer 207 (CVD1-G) of the green sub-pixel is deposited on the entire surface.

[0263] Step S28. Etching the second light-emitting material layer 205, the second electrode material layer 206 and the second packaging material layer 207 in the fourth region to obtain the light-emitting layer 22B and the second electrode 22C of the second sub-pixel 222 and the second packaging structure 24B.

[0264] Exemplarily, the encapsulation mask corresponding to the green sub-pixel (i.e., CVD1-G mask) is used to precisely control the removal and retention of CVD-G by exposure and development, that is, the CVD-G at the green sub-pixel is retained, and the CVD-G at the other color sub-pixels 22 is removed to achieve the patterning of CVD-G. In addition, at the position where CVD-G is etched, the light-emitting layer 22B material and the cathode material can be etched away simultaneously, and at the same time, CVD-G can be effectively combined with the isolation column 23 at the undercut structure of the isolation column 23, forming an effective encapsulation of the light-emitting layer 22B and the cathode in the green sub-pixel, thereby completing the preparation of the light-emitting layer 22B, cathode, and second encapsulation structure 24B of the green sub-pixel. After covering the isolation column 23 around the light-emitting area of ​​the green sub-pixel with CVD-G, a raised structure with a trapezoidal cross-section can be formed, and its slope angle can be 50° to 70°.

[0265] In the above process, of the two relative etching boundaries of CVD-G, one etching boundary exceeds the middle boundary between the red sub-pixel and the green sub-pixel and is closer to the red sub-pixel, and the other etching boundary is located at the middle boundary between the green sub-pixel and the blue sub-pixel, and CVD-G is removed from the remaining positions, that is, CVD-G is partially overlapped on CVD-R, thereby avoiding the orange peel or streak problem caused by the presence of a gap between CVD-G and CVD-R.

[0266] It is understandable that the preparation method of the blue sub-pixel and the inorganic encapsulation material (CVD-B) of the blue sub-pixel is similar to the preparation method of the green sub-pixel and the red sub-pixel, and will not be repeated here.

[0267] The film materials of CVD-R, CVD-G and CVD-B can be the same and have the same thickness. The slope angles of the convex structures with trapezoidal cross sections formed at the isolation columns 23 around the sub-pixels 22 of different colors can be different.

[0268] Next, an organic encapsulation layer 208 is prepared by an IJP process, and an inorganic encapsulation material is deposited on the organic encapsulation layer 208 to form a second inorganic encapsulation layer 209. Then, a touch structure layer is prepared on the second inorganic encapsulation layer 209, that is, a first touch metal layer TMA, a touch insulating layer TLD, and a second touch metal layer TMB are formed in sequence. After the second touch metal layer TMB is formed, a light shielding layer (BM) is prepared first, and after the light shielding layer is completed, a protective layer is prepared.

[0269] Based on the above, the embodiment of the present disclosure etches the isolation column material layer asynchronously with the light-emitting material layer, the electrode material layer and the inorganic packaging material, thereby making the etching of the isolation column more refined and reducing the risk of damage to the isolation column, thereby avoiding damage to the isolation column leading to poor overlap between the blue sub-pixel and the metal isolation column, thereby improving product yield.

[0270] Fig.14 The manufacturing process of the display panel 200 is shown in FIG. Figure 2 The manufacturing process of the illustrated display panel 200 is roughly similar, and the main difference is that when preparing the isolation columns 23 , isolation columns 23 are arranged around each sub-pixel 22 , and the isolation columns 23 between adjacent sub-pixels 22 are not shared.

[0271] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention may be implemented by means of hardware comprising a number of different elements and by means of a suitably programmed computer. In a unit claim enumerating a number of devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

[0272] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display panel, characterized in that: include: substrate substrate; A plurality of sub-pixels are arranged on one side of the base substrate, wherein the sub-pixels include a first electrode, a light-emitting layer and a second electrode which are stacked; A pixel definition layer, disposed on one side of the base substrate, comprising a plurality of pixel openings, wherein the pixel openings are configured to define a light emitting area of ​​the sub-pixel; An isolation column, disposed on a side of the pixel definition layer away from the base substrate, the isolation column being configured to isolate the light-emitting layers of the two adjacent sub-pixels, the two adjacent sub-pixels comprising a first sub-pixel and a second sub-pixel; The encapsulation layer includes a first encapsulation structure and a second encapsulation structure, wherein the first encapsulation structure covers the first sub-pixel, the second encapsulation structure covers the second sub-pixel, and the first encapsulation structure and the second encapsulation structure are overlapped at the position of the isolation column.

2. The display panel according to claim 1, characterized in that: The plurality of sub-pixels include first color sub-pixels, second color sub-pixels, and third color sub-pixels, and the plurality of sub-pixels are arranged in an array in a first direction and a second direction to form a plurality of pixel rows and a plurality of pixel columns; The plurality of pixel columns include a first pixel column, a second pixel column, and a third pixel column arranged at intervals along the first direction, the first pixel column includes a plurality of first color sub-pixels, the second pixel column includes a plurality of second color sub-pixels, and the third pixel column includes a plurality of third color sub-pixels; The first sub-pixel and the second sub-pixel are two of the first color sub-pixel, the second color sub-pixel, and the third color sub-pixel.

3. The display panel according to claim 2, characterized in that: The first sub-pixel is any one of the first color sub-pixel, the second color sub-pixel and the third color sub-pixel, and in the first direction, the first encapsulation structures are connected to each other and are arranged in the same layer; or The second sub-pixel is any one of the first color sub-pixel, the second color sub-pixel and the third color sub-pixel. In the first direction, the second encapsulation structures are connected to each other and are arranged in the same layer.

4. The display panel according to claim 1, characterized in that: The plurality of sub-pixels include first color sub-pixels, second color sub-pixels, and third color sub-pixels, and the plurality of sub-pixels are arranged in an array in a first direction and a second direction to form a plurality of pixel rows and a plurality of pixel columns; The plurality of pixel columns include a first pixel column, a second pixel column, and a third pixel column arranged at intervals along the first direction, the first pixel column and the second pixel column respectively include a plurality of first color sub-pixels and a plurality of second color sub-pixels arranged alternately along the first direction, the sub-pixels in the first pixel column and the second pixel column located in the same pixel row have different colors, and the third pixel column includes a plurality of third color sub-pixels arranged at intervals along the first direction; The first sub-pixel and the second sub-pixel are two of the first color sub-pixel, the second color sub-pixel, and the third color sub-pixel.

5. The display panel according to claim 4, characterized in that: The first sub-pixel is the third color sub-pixel, and in the first direction, the first encapsulation structures are connected to each other and are arranged in the same layer; or The second sub-pixel is the third color sub-pixel, and in the first direction, each of the second encapsulation structures is connected to each other and is disposed in the same layer.

6. The display panel according to claim 5, characterized in that: The second pixel column is located between the first pixel column and the third pixel column, the first color sub-pixel is a red sub-pixel, the second color sub-pixel is a green sub-pixel, and the third color sub-pixel is a blue sub-pixel.

7. The display panel according to claim 5, characterized in that: The third pixel column is located between the first pixel column and the second pixel column, the first color sub-pixel is a red sub-pixel, the second color sub-pixel is a blue sub-pixel, and the third color sub-pixel is a green sub-pixel.

8. The display panel according to claim 1, characterized in that: Among the plurality of sub-pixels, the isolation columns between adjacent sub-pixels are connected to each other, the orthographic projection of the isolation columns on the base substrate is a mesh region, and the orthographic projection of the light-emitting region of the sub-pixel on the base substrate is located within an opening of the mesh region; The isolation column comprises a first isolation portion and a second isolation portion stacked together; The first encapsulation structure includes a first encapsulation part, which covers at least a portion of the top of the second isolation part. The second encapsulation structure includes a second encapsulation part, which covers at least a portion of the top of the second isolation part. The first encapsulation part and the second encapsulation part are overlapped on the top of the second isolation part.

9. The display panel according to claim 8, characterized in that: The plurality of sub-pixels are arranged in an array in a first direction and a second direction; The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel; In the second direction, a side of the first encapsulation portion away from the first pixel opening has a first distance from a side of the second isolation portion close to the first pixel opening, a side of the second encapsulation portion away from the second pixel opening has a second distance from a side of the second isolation portion close to the second pixel opening, and a side of the second encapsulation portion away from the second pixel opening has a third distance from a side of the first encapsulation portion away from the first pixel opening; The sum of the first distance and the second distance is equal to the sum of the third distance and the width of a pixel opening gap, and the pixel opening gap is the gap between the first pixel opening and the second pixel opening.

10. The display panel according to claim 8, characterized in that: The plurality of sub-pixels are arranged in an array in a first direction and a second direction; The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel; In the second direction, a side of the first encapsulation portion away from the first pixel opening has a first distance from a side of the second isolation portion close to the first pixel opening, a side of the second electrode of the first sub-pixel close to the first isolation portion has a fourth distance from a side of the second isolation portion close to the first pixel opening, and a side of the light-emitting layer of the first sub-pixel close to the first isolation portion has a fifth distance from a side of the second isolation portion close to the first pixel opening; The first distance is greater than the fourth distance, and the fourth distance is greater than the fifth distance.

11. The display panel according to claim 8, characterized in that: The plurality of sub-pixels are arranged in an array in a first direction and a second direction; The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel; In the second direction, a side of the second encapsulation portion away from the second pixel opening has a second distance from a side of the second isolation portion close to the second pixel opening, a side of the second electrode of the second sub-pixel close to the first isolation portion has a sixth distance from a side of the second isolation portion close to the second pixel opening, and a side of the light-emitting layer of the second sub-pixel close to the first isolation portion has a seventh distance from a side of the second isolation portion close to the second pixel opening; The second distance is greater than the sixth distance, and the sixth distance is greater than the seventh distance.

12. The display panel according to claim 8, characterized in that: The plurality of sub-pixels are arranged in an array in a first direction and a second direction; The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel; In the second direction, a side of the first encapsulation portion away from the first pixel opening has a first distance from a side of the second isolation portion close to the first pixel opening, and a side of the second encapsulation portion away from the second pixel opening has a second distance from a side of the second isolation portion close to the second pixel opening; The sum of the first distance and the second distance is greater than a width of a pixel opening gap, and the pixel opening gap is a gap between the first pixel opening and the second pixel opening.

13. The display panel according to claim 1, characterized in that: Among the plurality of sub-pixels, the isolation columns of adjacent sub-pixels are disconnected from each other, and an isolation groove is provided between two adjacent isolation columns; The isolation column comprises a first isolation column arranged around the first sub-pixel and a second isolation column arranged around the second sub-pixel, the first isolation column comprises a stacked third isolation portion and a fourth isolation portion, and the second isolation column comprises a stacked fifth isolation portion and a sixth isolation portion; The first packaging structure includes a third packaging part, which covers the top of the fourth isolation part and at least a portion of the isolation groove. The second packaging structure includes a fourth packaging part, which covers the top of the sixth isolation part and at least a portion of the isolation groove. The third packaging part and the fourth packaging part are overlapped in the isolation groove.

14. The display panel according to claim 13, characterized in that: The plurality of sub-pixels are arranged in an array in a first direction and a second direction; The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel; In the second direction, a side of the fourth isolation portion close to the first pixel opening has an eighth distance from a side of the third isolation portion close to the first pixel opening, a side of the fourth isolation portion away from the first pixel opening has a ninth distance from a side of the third isolation portion away from the first pixel opening, and the eighth distance is greater than the ninth distance; and / or A side of the sixth isolation portion close to the second pixel opening has a tenth distance from a side of the fifth isolation portion close to the second pixel opening, a side of the sixth isolation portion away from the second pixel opening has an eleventh distance from a side of the fifth isolation portion away from the second pixel opening, and the tenth distance is greater than the eleventh distance.

15. The display panel according to claim 13, characterized in that: The plurality of sub-pixels are arranged in an array in a first direction and a second direction; The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel; In the second direction, a side of the third encapsulation portion away from the first pixel opening has a twelfth distance from a side of the fourth isolation portion close to the first pixel opening, a side of the fourth encapsulation portion away from the second pixel opening has a thirteenth distance from a side of the sixth isolation portion close to the second pixel opening, and a side of the third encapsulation portion away from the first pixel opening has a fourteenth distance from a side of the fourth encapsulation portion away from the second pixel opening; The sum of the twelfth distance and the thirteenth distance is equal to the fourteenth distance, the width of the isolation groove, and the width of a pixel opening gap, and the pixel opening gap is a gap between the first pixel opening and the second pixel opening.

16. The display panel according to claim 13, characterized in that: The plurality of sub-pixels are arranged in an array in a first direction and a second direction; The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel; In the second direction, a side of the third encapsulation portion away from the first pixel opening has a twelfth distance from a side of the fourth isolation portion close to the first pixel opening, a side of the fourth isolation portion away from the first pixel opening has a ninth distance from a side of the third isolation portion away from the first pixel opening, a side of the second electrode of the first sub-pixel close to the third isolation portion has a fifteenth distance from a side of the fourth isolation portion close to the first pixel opening, and a side of the light-emitting layer of the first sub-pixel close to the third isolation portion has a sixteenth distance from a side of the fourth isolation portion close to the first sub-pixel opening; The twelfth distance is greater than the ninth distance, the ninth distance is greater than the fifteenth distance, and the fifteenth distance is greater than the sixteenth distance.

17. The display panel according to claim 13, characterized in that: The plurality of sub-pixels are arranged in an array in a first direction and a second direction; The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel; In the second direction, a side of the fourth encapsulation portion away from the second pixel opening has a thirteenth distance from a side of the sixth isolation portion close to the second pixel opening, a side of the sixth isolation portion away from the second pixel opening has an eleventh distance from a side of the fifth isolation portion away from the second pixel opening, a side of the second electrode of the second sub-pixel close to the fifth isolation portion has a seventeenth distance from a side of the sixth isolation portion close to the second pixel opening, and a side of the light-emitting layer of the second sub-pixel close to the fifth isolation portion has an eighteenth distance from a side of the sixth isolation portion close to the second sub-pixel opening; The thirteenth distance is greater than the eleventh distance, the eleventh distance is greater than the seventeenth distance, and the seventeenth distance is greater than the eighteenth distance.

18. The display panel according to claim 13, characterized in that: The plurality of sub-pixels are arranged in an array in a first direction and a second direction; The plurality of pixel openings include a first pixel opening and a second pixel opening, the first pixel opening being configured to define a light emitting area of ​​the first sub-pixel, and the second pixel opening being configured to define a light emitting area of ​​the second sub-pixel; In the second direction, a side of the third encapsulation portion away from the first pixel opening has a twelfth distance from a side of the fourth isolation portion close to the first pixel opening, and a side of the fourth encapsulation portion away from the second pixel opening has a thirteenth distance from a side of the sixth isolation portion close to the second pixel opening; A sum of the twelfth distance and the thirteenth distance is greater than a width of the pixel opening gap, and the pixel opening gap is a gap between the first pixel opening and the second pixel opening.

19. The display panel according to any one of claims 13 to 18, characterized in that: In a direction perpendicular to the base substrate, the total thickness of the third encapsulation portion and the fourth encapsulation portion after overlapping is greater than the thickness of the third encapsulation portion covering the first pixel opening, and the thickness of the third encapsulation portion covering the first pixel opening is greater than the thickness of the third encapsulation portion covering the fourth isolation portion; and / or In the direction perpendicular to the base substrate, the total thickness of the overlapping third encapsulation part and the fourth encapsulation part is greater than the thickness of the fourth encapsulation part covering the second pixel opening, and the thickness of the fourth encapsulation part covering the second pixel opening is greater than the thickness of the fourth encapsulation part covering the sixth isolation part.

20. The display panel according to claim 1, characterized in that: The base substrate comprises a display area and a frame area, and the frame area is arranged around the display area; The display area is provided with the plurality of sub-pixels and the plurality of edge sub-pixels, the plurality of edge sub-pixels and the plurality of sub-pixels are arranged in an array in a first direction and a second direction to form a plurality of pixel rows and a plurality of pixel columns, and the plurality of edge sub-pixels are arranged in the outermost pixel rows and the outermost pixel columns; The light emitting area of ​​the edge sub-pixel is smaller than the light emitting area of ​​the sub-pixel.

21. The display panel according to claim 20, characterized in that: The encapsulation layer also covers the edge sub-pixel, and in a direction perpendicular to the substrate, the edge of the encapsulation layer is flush with the edge of the edge sub-pixel.

22. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-21.

23. A method for preparing a display panel, characterized in that: include: providing a substrate base plate; Forming a plurality of sub-pixels, a pixel definition layer, an isolation column and an encapsulation layer on the base substrate; The plurality of sub-pixels are arranged on one side of the base substrate, and the sub-pixels include a first electrode, a light-emitting layer and a second electrode which are stacked; The pixel definition layer is disposed on one side of the base substrate and includes a plurality of pixel openings, wherein the pixel openings are configured to define the light emitting areas of the sub-pixels; The isolation column is disposed on a side of the pixel definition layer away from the base substrate, and the isolation column is configured to isolate the light-emitting layers of the two adjacent sub-pixels, wherein the two adjacent sub-pixels include a first sub-pixel and a second sub-pixel; The encapsulation layer includes a first encapsulation structure and a second encapsulation structure, wherein the first encapsulation structure covers the first sub-pixel, the second encapsulation structure covers the second sub-pixel, and the first encapsulation structure and the second encapsulation structure are overlapped at the position of the isolation column.

24. The preparation method according to claim 23, characterized in that: A plurality of sub-pixels, a pixel definition layer, an isolation column and an encapsulation layer are formed on the substrate, including: forming first electrodes of the plurality of sub-pixels on the base substrate; forming the pixel definition layer on the base substrate; forming an isolation column material layer on the pixel definition layer, and etching the isolation column material layer in a first region to obtain isolation columns around the first sub-pixel; Vapor depositing a first light emitting material layer, a first electrode material layer and a first packaging material layer on the isolation column material layer; Etching the first light-emitting material layer, the first electrode material layer and the first packaging material layer in the second region to obtain the light-emitting layer and the second electrode of the first sub-pixel and the first packaging structure; Performing etching in the third region to obtain isolation columns around the second sub-pixel; Vapor depositing a second light emitting material layer, a second electrode material layer and a second packaging material layer on the isolation column material layer; The second light-emitting material layer, the second electrode material layer and the second packaging material layer are etched in the fourth region to obtain the light-emitting layer and the second electrode of the second sub-pixel and the second packaging structure.

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