Display panel and display device

Abstract

The invention discloses a display panel and a display device, the display panel is provided with a display area and a non-display area, and the display panel comprises a substrate, a light emitting device layer, a first inorganic packaging layer, a voltage power line and an auxiliary electrode; the light-emitting device layer comprises a first electrode, a light-emitting layer and a second electrode which are sequentially arranged in the direction away from the substrate. The first inorganic packaging layer is arranged on the side, away from the substrate, of the light-emitting device layer; the voltage power line is located in the non-display area; the auxiliary electrode is arranged on the side, away from the substrate, of the first inorganic packaging layer and connected with the second electrode through the via hole, and the voltage power line is connected with the auxiliary electrode. Wiring of the frame is reduced, so that the width of the frame can be reduced, and the narrow-frame design of the display panel is realized.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display panel and a display device. Background Art

[0002] Organic Light Emitting Display (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] The purpose of the present application is to provide a display panel, a display device and a method for manufacturing a display panel, which can improve the performance of the display panel.

[0005] In a first aspect, the present application provides a display panel, which has a display area and a non-display area, and the display panel includes a substrate, a light-emitting device layer, a first inorganic packaging layer, a voltage power supply line and an auxiliary electrode; the light-emitting device layer includes a first electrode, a light-emitting layer and a second electrode arranged in sequence in a direction away from the substrate; the first inorganic packaging layer is arranged on a side of the light-emitting device layer away from the substrate; the voltage power supply line is located in the non-display area; the auxiliary electrode is arranged on a side of the first inorganic packaging layer away from the substrate, the auxiliary electrode is connected to the second electrode through a via, and the voltage power supply line is connected to the auxiliary electrode.

[0006] In some embodiments, the display panel further includes a gate drive circuit signal line, and the gate drive circuit signal line is located in the display area.

[0007] In some embodiments, the display panel further includes an organic encapsulation layer and a first dam, wherein the organic encapsulation layer is disposed on a side of the first inorganic encapsulation layer away from the substrate; the first dam is located in the non-display area and is disposed on the periphery of the organic encapsulation layer.

[0008] In some embodiments, the non-display area includes a first non-display sub-area, a bending area, and a second non-display sub-area sequentially arranged in a direction away from the display area, the second non-display sub-area is bound to the back surface of the display panel, and the first dam is located in the second non-display sub-area;

[0009] Preferably, the display panel further comprises a second dam located in the non-display area, and the first dam is farther away from the display area than the second dam;

[0010] Preferably, the height of the second dam is less than the height of the first dam;

[0011] Preferably, both the display area and the bending area have multiple metal layers, and the number of metal layers in the bending area is smaller than the number of metal layers in the display area.

[0012] In some embodiments, the display panel further includes an isolation column disposed in the first non-display sub-area, and at least a portion of the organic encapsulation layer is surrounded by the isolation column;

[0013] Preferably, at least part of the auxiliary electrodes are reused as isolation columns;

[0014] Preferably, the material of the isolation column includes a non-metallic material;

[0015] Preferably, the substrate is provided with a first groove structure in the bending area;

[0016] Preferably, the second dam is located in the second non-display sub-region, or the second dam is located in the first non-display sub-region, and the second dam is far away from the display region relative to the isolation column.

[0017] In some embodiments, the orthographic projection of the organic encapsulation layer on the substrate does not overlap with the orthographic projection of the bending region on the substrate;

[0018] Preferably, the substrate is provided with a first groove structure in the bending area.

[0019] In some embodiments, the non-display area includes a corner area, the corner area includes a third non-display sub-area and a bending area arranged in sequence along a direction away from the display area, the bending area is bent to the side of the display panel, and the thickness of the bending area is less than the thickness of the third non-display sub-area.

[0020] In some embodiments, the bending region is provided with a second groove structure;

[0021] Preferably, the second groove structure includes groove rows and groove columns, the groove rows include a plurality of grooves arranged along the radial direction of the bending zone, and the groove columns include a plurality of grooves arranged along the circumferential direction of the bending zone;

[0022] Preferably, the bending zone includes groove areas arranged at intervals along the circumferential direction, and the second groove structure is arranged in the groove area.

[0023] In some embodiments, the non-display area includes a first frame, a second frame, a third frame, and a fourth frame connected end to end in sequence, the first frame and the third frame are arranged opposite to each other, the second frame and the fourth frame are arranged opposite to each other, at least a portion of the first frame, the second frame, and the third frame are bent to the side of the display panel, and a portion of the fourth frame is bent to the back of the display panel;

[0024] Preferably, the display panel further comprises a fixed block disposed on the substrate, and the first frame, the second frame, and the third frame are respectively connected to the side of the fixed block; or, the display panel further comprises a composite film disposed on the back of the substrate, and the first frame, the second frame, and the third frame are respectively connected to the side of the composite film;

[0025] Preferably, the display panel further comprises a padding block arranged on the back side of the substrate, and the fourth frame is connected to the back side of the padding block.

[0026] In a second aspect, an embodiment of the present application further provides a display device, comprising a display panel according to any of the above embodiments.

[0027] The embodiments of the present application provide a display panel and a display device. By providing an auxiliary electrode on the side of the first inorganic encapsulation layer away from the substrate, the auxiliary electrode is connected to the second electrode of the light-emitting device layer through a via hole, and the auxiliary electrode is connected to the voltage power line, it is not necessary to provide a metal wiring in the frame of the display panel to connect the second electrode and the voltage power line, thereby reducing the wiring of the frame, thereby reducing the width of the frame, and realizing a narrow frame design of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 A schematic cross-sectional view of a display panel provided in some embodiments of the present application;

[0030] Figure 2 A top view of a display panel provided in some embodiments of the present application;

[0031] Figure 3-Figure 12 A schematic cross-sectional view of a display panel provided in some other embodiments of the present application;

[0032] Fig.13 A top view of a display panel provided in some other embodiments of the present application;

[0033] Fig.14 A schematic cross-sectional view of a display panel provided in some other embodiments of the present application;

[0034] Fig.15 A schematic diagram of a corner area provided for some embodiments of the present application;

[0035] Fig.16 Schematic diagram of the unfolding of the display panel when it is not bent and bent according to some embodiments of the present application;

[0036] Fig.17 A schematic cross-sectional view of a display device provided in some embodiments of the present application;

[0037] Fig.18 A schematic cross-sectional view of a display device provided in some other embodiments of the present application;

[0038] Fig.19 Schematic cross-sectional views of display devices provided in some further embodiments of the present application.

[0039] Description of reference numerals:

[0040] 100, display panel; AA, display area; NA, non-display area; NA1, first non-display sub-area; NA2, bending area; NA3, second non-display sub-area; NA4, first frame; NA5, second frame; NA6, third frame; NA7, fourth frame; 10, substrate; 20, pixel definition layer; 21, pixel defining portion; 22, pixel opening; 30, light-emitting device layer; 31, first electrode; 32, light-emitting layer; 33, second electrode; 41, first inorganic seal packaging layer; 42, organic packaging layer; 43, second inorganic packaging layer; 50, auxiliary electrode; 51, via; 52, isolation column; 60, gate drive circuit signal line; 71, first dam; 72, second dam; 81, first groove structure; 82, second groove structure; 821, groove row; 822, groove column; R, corner area; R1, third non-display sub-area; R2, bending area; R21, groove area; 91, fixed block; 92, composite film; 93, padding block. DETAILED DESCRIPTION

[0041] The following detailed description of the embodiments of the present invention is provided in conjunction with the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments.

[0042] In the description of the present invention, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inside", "outside", etc. indicate positions or positional relationships only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. "Vertical" is not strictly vertical, but is within the allowable error range. "Parallel" is not strictly parallel, but is within the allowable error range.

[0043] Reference to "embodiments" in the present invention means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present invention may be combined with other embodiments.

[0044] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the present invention. In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0045] Organic Electroluminescent Display (OLED) has gradually become the mainstream in the display field due to its excellent performance such as low power consumption, color saturation, wide viewing angle, thin thickness, and flexibility. It can be widely used in terminal products such as smart phones, tablets, and TVs. With the advancement of technology and the improvement of consumer aesthetics, terminal displays need to be thinner and lighter and the frame is further compressed. At present, the frame of OLED display module products is relatively large, and reducing the frame has become an urgent problem to be solved.

[0046] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel, or other types of display panels, such as a micro light emitting diode (Micro Light Emitting Diode, Micro-LED) or a quantum dot light emitting diode (Quantum Light Emitting Diode, QLED) display panel.

[0047] In a first aspect of the present application, a display panel 100 is provided, having a display area AA and a non-display area NA, wherein the display panel 100 comprises a substrate 10, a light-emitting device layer 30, a first inorganic encapsulation layer 41, a voltage power supply line (not shown) and an auxiliary electrode 50; the light-emitting device layer 30 comprises a first electrode 31, a light-emitting layer 32 and a second electrode 33 arranged in sequence in a direction away from the substrate 10; the first inorganic encapsulation layer 41 is arranged on a side of the light-emitting device layer 30 away from the substrate 10; the voltage power supply line is located in the non-display area NA; the auxiliary electrode 50 is arranged on a side of the first inorganic encapsulation layer 41 away from the substrate 10, the auxiliary electrode 50 is connected to the second electrode 33 through a via 51, and the voltage power supply line is connected to the auxiliary electrode 50.

[0048] The display area AA refers to an area where images can be displayed and is provided with pixel units; the non-display area NA refers to an area where images cannot be displayed and is generally used for routing or placing binding terminals, test terminals, VSR circuits, etc. The non-display area NA may surround the display area AA in a circumferential direction, or may be provided on any one side or two opposite sides of the display area AA, for example, the non-display area NA may be provided at the bottom or side of the display panel 100.

[0049] Among them, the substrate 10 includes a substrate and an array layer arranged on the substrate. The substrate can be a hard substrate made of materials such as glass or plastic, or a flexible substrate made of materials such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC) or cellulose acetate propionate (CAP). A driving circuit for controlling the light emission of the light-emitting unit is arranged in the array layer. The array layer is generally composed of inorganic film layers such as a metal layer, a semiconductor layer (active layer), and an insulating layer. By patterning these inorganic film layers, a driving circuit for controlling the light emission of the light-emitting unit can be formed. There are many implementation methods for its specific circuit structure, which will not be repeated here.

[0050] One of the first electrode 31 and the second electrode 33 can be used as the anode of the sub-pixel, and the other can be used as the cathode of the sub-pixel. In the embodiment of the present application, the first electrode 31 is used as the anode of the sub-pixel, and the second electrode 33 is used as the cathode of the sub-pixel. When the first electrode 31 and the second electrode 33 are energized, the electrons and holes migrate to the light-emitting layer 32 respectively, and meet in the light-emitting layer 32 to form excitons to excite the light-emitting molecules, thereby generating visible light to achieve the purpose of display.

[0051] The first inorganic encapsulation layer 41 may be formed by chemical vapor deposition, and the material may be silicon oxynitride, silicon nitride, silicon oxide, etc. The first inorganic encapsulation layer 41 is usually dense and hard, and can effectively block gas and moisture, and prevent external environmental factors such as water vapor and oxygen from penetrating.

[0052] An organic encapsulation layer 42 may be provided on the side of the first inorganic encapsulation layer 41 away from the substrate 10 . The organic encapsulation layer 42 is made of organic material, is relatively soft and elastic, and has a certain buffering capacity. The organic encapsulation layer 42 covers the auxiliary electrode 50 .

[0053] A second inorganic encapsulation layer 43 may be further disposed on the side of the organic encapsulation layer 42 facing away from the substrate 10 . The second inorganic encapsulation layer 43 is made of the same material and prepared using the same process as the first inorganic encapsulation layer 41 , thereby further enhancing the encapsulation effect.

[0054] The auxiliary electrode 50 can be made of metal materials such as TiAl and TiCu, and can be formed into an inverted trapezoidal isolation column 52 by dry etching. The orthographic projection of the auxiliary electrode 50 on the substrate 10 does not overlap with the orthographic projection of each sub-pixel on the substrate 10, so as not to affect the luminescence of the sub-pixel. The display panel 100 may also include a pixel definition layer 20, the pixel definition layer 20 includes a pixel defining portion 21 and a pixel opening 22 between the pixel defining portions 21, and the pixel defining portion 21 separates each sub-pixel. The orthographic projection of the auxiliary electrode 50 on the substrate 10 is located within the orthographic projection of the pixel defining portion 21 on the substrate 10, and the orthographic projection of the auxiliary electrode 50 on the substrate 10 does not overlap with the orthographic projection of the pixel opening 22 on the substrate 10.

[0055] A via hole 51 may be provided on the first inorganic encapsulation layer 41, and the auxiliary electrode 50 is electrically connected to the second electrode 33 through the via hole 51. Exemplarily, the second electrode 33 is a cathode, and the voltage power line is a negative power line (Vss power line), and the voltage power line may be provided in the lower frame. The auxiliary electrode 50 avoids the sub-pixel and is finally extended to be connected to the voltage power line.

[0056] It is not necessary to set a metal wiring in the frame of the display panel 100 to connect the second electrode 33 and the voltage power line, which reduces the wiring of the frame, thereby reducing the width of the frame and realizing a narrow frame design of the display panel 100.

[0057] like Figure 2 As shown, in some embodiments, the display panel 100 further includes a gate driving circuit signal line 60 , and the gate driving circuit signal line 60 is located in the display area AA.

[0058] The gate drive circuit (GIP) signal line is connected to the gate of the transistor of the pixel circuit of the sub-pixel. In conventional technology, the gate drive circuit signal line 60 is generally arranged at the left and right frames of the display panel 100 and extends in the vertical direction. In the embodiment of the present application, the gate drive circuit signal line 60 is moved to the display area AA, which can reduce the routing of the left and right frames, thereby reducing the width of the left and right frames, and further realizing the design of the narrow frame of the display panel 100.

[0059] like Figure 3 As shown, in some embodiments, the display panel 100 also includes an organic encapsulation layer 42 and a first dam 71, the organic encapsulation layer 42 is arranged on the side of the first inorganic encapsulation layer 41 away from the substrate 10; the first dam 71 is located in the non-display area NA, and the first dam 71 is arranged on the periphery of the organic encapsulation layer 42.

[0060] The first bank 71 may be made of organic material and formed into a regular trapezoidal structure. The first bank 71 may be annular and arranged around the entire periphery of the organic encapsulation layer 42 ; or the first bank 71 may be arranged along a portion of the periphery of the organic encapsulation layer 42 .

[0061] Since the organic material of the organic encapsulation layer 42 is easy to overflow during the preparation process, the first dam 71 can prevent the organic material from overflowing to the outside of the display panel 100 and affecting the performance of the display panel 100 .

[0062] In some embodiments, the non-display area NA includes a first non-display sub-area NA1, a bending area NA2, and a second non-display sub-area NA3 which are arranged in sequence along a direction away from the display area AA, the second non-display sub-area NA3 is bent to the back side of the display panel 100, and the first dam 71 is located in the second non-display sub-area NA3.

[0063] The first non-display sub-area NA1 may be the lower frame of the display panel 100. The first non-display sub-area NA1 is a bending area, and the bending area NA2 is an area where bending occurs. After the lower frame is bent, the second non-display sub-area NA3 is located on the back of the display panel 100, and a chip, a flexible circuit board, etc. may be disposed on the second non-display sub-area NA3.

[0064] Disposing the first dam 71 in the second non-display area NA can facilitate the bending of the bending area NA2 and reduce the width of the lower frame, thereby further realizing a narrow frame design.

[0065] Preferably, the display panel 100 further includes a second dam 72 located in the non-display area NA, and the first dam 71 is farther away from the display area AA than the second dam 72 .

[0066] The second bank 72 may also be made of organic material and formed into a regular trapezoidal structure. The second bank 72 may be annular and arranged around the entire periphery of the organic encapsulation layer 42 ; or, the second bank 72 may be arranged along a portion of the periphery of the organic encapsulation layer 42 .

[0067] The second dam 72 may be located in the first non-display sub-area NA1 or the second non-display sub-area NA3 . The overflow risk of the organic material of the organic encapsulation layer 42 can be further reduced by intercepting the second dam 72 and the first dam 71 together.

[0068] Preferably, the height of the second dam 72 is smaller than the height of the first dam 71 .

[0069] The second dam 72 can intercept most of the organic materials first, and a small amount of overflowing organic materials can be intercepted by the first dam 71. Since the first dam 71 is higher, it can ensure that the organic materials will not overflow.

[0070] The cooperation between the first dam 71 and the second dam 72 of inconsistent heights can prevent the organic material from overflowing and save materials.

[0071] Preferably, both the display area AA and the bending area NA2 have multiple metal layers, and the number of metal layers in the bending area NA2 is less than that in the display area AA.

[0072] Exemplarily, the metal layer of the array layer can be connected through vias 51, and then the number of metal layers can be reduced by etching in the bending area NA2, so that the film layer in the bending area NA2 becomes less and the thickness becomes narrower, thereby facilitating the bending of the bending area NA2 and reducing the bending stress.

[0073] For example, if the substrate 10 is a double-layer substrate, the bending stress of the bending area NA2 can be adjusted by thinning the first layer of the substrate in the bending area NA2. The thickness of the first layer of the substrate is determined according to the product specifications. If a smaller bending radius is required, it needs to be thinned more. At present, the thickness of the first layer of polyimide substrate is generally 10um. To achieve a bending radius R ≤ 0.1mm, it needs to be thinned by at least 5um. Among them, thinning can be achieved in two ways. The first way is to use a laser to perform laser cutting thinning. The second way is to add a sacrificial layer of different gradient thicknesses between the cover plate and the first layer of the substrate to achieve the thickness thinning of the bending area NA2.

[0074] In addition, the organic film layer may be etched by dry etching gas to form a special pattern in the bending area NA2, thereby reducing the bending stress. The organic encapsulation layer 42 in the bending area NA2 may also be thinned by dry etching gas etching, thereby reducing the bending stress.

[0075] In some embodiments, the display panel 100 further includes a spacer column 52 disposed in the first non-display sub-area NA1 , and at least a portion of the organic encapsulation layer 42 is surrounded by the spacer column 52 .

[0076] The isolation column 52 can be made of metal material to form an inverted trapezoidal structure, or can be made of a stack of inorganic film layers and organic film layers to form a regular trapezoidal structure.

[0077] The isolation column 52 can block a portion of the organic material of the organic encapsulation layer 42 from entering the bending area NA2, thereby reducing the thickness of the organic encapsulation layer 42 in the bending area NA2 and facilitating the bending of the bending area NA2.

[0078] Preferably, at least part of the auxiliary electrodes 50 are reused as isolation columns 52 .

[0079] The isolation column 52 is formed by PVD (nanoimprinting) to form an inverted trapezoidal isolation column 52. The material can be titanium, aluminum, titanium or other metals, and it is connected to the second electrode 33, so as to be compatible with the auxiliary electrode 50 and the isolation column 52, thereby achieving the purpose of reducing the metal routing of the frame and serving as a cutoff for the organic encapsulation layer 42.

[0080] like Figure 4 As shown, preferably, the material of the isolation column 52 includes a non-metallic material.

[0081] The isolation column 52 is formed by chemical vapor deposition using non-metallic materials such as inorganic materials, and serves to intercept the organic encapsulation layer 42 .

[0082] Please refer to Figure 5 and Figure 6 Preferably, the substrate 10 is provided with a first groove structure 81 in the bending area NA2.

[0083] The first groove structure 81 may include a plurality of grooves arranged at intervals. The first groove structure 81 may be disposed in an array layer of the substrate 10 , and specifically may be used to etch an organic film layer or an inorganic film layer of the array layer.

[0084] The bending area NA2 is thinned locally by dry etching, thereby reducing the bending stress and achieving an extremely small bending radius.

[0085] Preferably, the second bank 72 is located in the second non-display sub-area NA3.

[0086] The first dam 71 and the second dam 72 may be disposed in the second non-display sub-area NA3. Disposing the second dam 72 in the second non-display sub-area NA3 can reduce the width of the first non-display sub-area NA1, thereby further reducing the width of the frame.

[0087] Alternatively, please refer to Figure 7-10 In another embodiment, the second dam 72 is located in the first non-display sub-area NA1 , and the second dam 72 is away from the display area AA relative to the isolation column 52 .

[0088] The first dam 71 is disposed in the second non-display sub-area NA3, and the second dam 72 is disposed in the first non-display sub-area NA1. Disposing the second dam 72 in the first non-display sub-area NA1 can prevent the organic material of the organic encapsulation layer 42 from overflowing to the bending area NA2, reduce the bending stress of the bending area NA2, and facilitate the bending of the bending area NA2, compared with disposing the second dam 72 in the second non-display sub-area NA3.

[0089] like Fig.11 As shown, in some embodiments, the orthographic projection of the organic encapsulation layer 42 on the substrate 10 does not overlap with the orthographic projection of the bending area NA2 on the substrate 10 .

[0090] The organic encapsulation layer 42 of the bending area NA2 is etched, for example, by laser etching or Plasma, to completely remove the organic encapsulation layer 42 of the bending area NA2. After etching, a second inorganic encapsulation layer 43 is prepared, and then the bending area NA2 is bent.

[0091] like Fig.12 As shown, preferably, the substrate 10 is provided with a first groove structure 81 in the bending area NA2.

[0092] The first groove structure 81 may include a plurality of grooves arranged at intervals. The first groove structure 81 may be disposed in an array layer of the substrate 10 , and specifically may be used to etch an organic film layer or an inorganic film layer of the array layer.

[0093] The bending area NA2 is thinned locally by dry etching, thereby reducing the bending stress and achieving an extremely small bending radius.

[0094] Please refer to Fig.13 and Fig.14 In some embodiments, the non-display area NA includes a corner area R, the corner area R includes a third non-display sub-area R1 and a bending area R2 which are sequentially arranged in a direction away from the display area AA, the bending area R2 is bent to the side of the display panel 100, and the thickness of the bending area R2 is less than the thickness of the third non-display sub-area R1.

[0095] The corner region R refers to the intersection of different edges of the display panel 100, that is, the R corner region, such as the intersection between the left frame and the upper frame, the intersection between the right frame and the upper frame, etc. For example, if the display panel 100 is a rectangle, there are four corner regions R.

[0096] The third non-display sub-region R1 is closer to the display region AA than the bending region R2, and the third non-display sub-region R1 is a bending region. By thinning the bending region R2, the thickness of the bending region R2 is less than the thickness of the third non-display sub-region R1. Specifically, the connection between the second electrode 33 and the voltage power supply line can be realized by means of the auxiliary electrode 50, so that the metal wiring of the bending region R2 can be reduced, and some inorganic film layers in the bending region R2 can be removed by dry etching, and the first substrate or other film layers of the substrate 10 in the bending region R2 can be removed by laser cutting, so that only 4 or 5 film layers are left in the bending region R2, which is easy to bend the bending region R2 and realizes bending with a very small radius.

[0097] In some embodiments, the bending region R2 is provided with a second groove structure 82 .

[0098] The second groove structure 82 may include a plurality of grooves arranged at intervals, and may be used to etch the organic film layer or the inorganic film layer of the bending region R2.

[0099] The bending area R2 can realize the second groove structure 82 by dry engraving, which is similar to the shape of a city wall, can reduce the bending stress, and is beneficial to reducing the wrinkles of the bending area R2 after bending.

[0100] like Fig.15 As shown, preferably, the second groove structure 82 includes a groove row 821 and a groove column 822, the groove row 821 includes a plurality of grooves arranged radially along the bending region R2, and the groove column 822 includes a plurality of grooves arranged circumferentially along the bending region R2.

[0101] The groove rows 821 and the groove columns 822 are arranged in a crisscross pattern, and a plurality of groove rows 821 and a plurality of groove columns 822 may be arranged in the bending region R2.

[0102] Through the transverse and longitudinal interlacing design of the groove rows 821 and the groove columns 822, the folds after bending are regularly formed, thereby reducing the separation between the film layers after bending.

[0103] The groove rows 821 and the groove columns 822 may be evenly and regularly arranged in the bending region R2, so that the second groove structure 82 in the bending region R2 is a regular shape, further reducing the separation between the film layers after bending.

[0104] Preferably, the bending region R2 includes groove areas R21 arranged at intervals along the circumferential direction, and the second groove structure 82 is arranged in the groove area R21.

[0105] No second groove structure 82 is provided between adjacent groove regions R21, so as to facilitate positioning when a jig is used to press downward to perform a bending action.

[0106] The number, shape and location of the groove rows 821 and the groove columns 822 in each groove region can be the same. The spacing between the groove regions R21 can also be the same, that is, the groove regions R21 are evenly spaced, so that regular folds are obtained after bending, reducing the separation between the film layers.

[0107] like Fig.16 As shown, in some embodiments, the non-display area NA includes a first frame NA4, a second frame NA5, a third frame NA6 and a fourth frame NA7 which are connected end to end in sequence, the first frame NA4 and the third frame NA6 are arranged opposite to each other, the second frame NA5 and the fourth frame NA7 are arranged opposite to each other, at least part of the first frame NA4, the second frame NA5 and the third frame NA6 are respectively bent to the side of the display panel 100, and part of the fourth frame NA7 is bent to the back of the display panel 100.

[0108] The first frame NA4, the second frame NA5, and the third frame NA6 may be the left frame, the upper frame, and the right frame, respectively, and the fourth frame NA7 may be the lower frame. The first frame NA4, the second frame NA5, and the third frame NA6 are only bent, and are not bent to the back of the display panel 100, while the fourth frame NA7 is not only bent, but also bent to the back of the display panel 100. The first frame NA4, the second frame NA5, and the third frame NA6 may be provided with some metal traces, and the fourth frame NA7 may be provided with metal traces, chips, flexible circuit boards, etc.

[0109] In the embodiment of the present application, the first frame NA4 , the second frame NA5 , and the third frame NA6 are bent, and the fourth frame NA7 is folded, so that the frame around the display panel 100 can be reduced to the greatest extent.

[0110] like Fig.17 As shown, preferably, the display panel 100 further includes a fixing block 91 disposed on the substrate 10 , and the first frame NA4 , the second frame NA5 , and the third frame NA6 are respectively connected to the sides of the fixing block 91 .

[0111] The fixing block 91 may be disposed at the edge of the back side of the display panel 100 , and may be disposed around the circumference of the display panel 100 , or a plurality of fixing blocks 91 may be disposed at intervals along the edge of the display panel 100 .

[0112] The first frame NA4, the second frame NA5, and the third frame NA6 are bent and fixed to the fixing block 91, which can be fixed by bonding, clamping, etc. The fixing block 91 can support and fix the first frame NA4, the second frame NA5, and the third frame NA6 to improve stability.

[0113] Or, if Fig.18 As shown, the display panel 100 further includes a composite film 92 disposed on the back side of the substrate 10 , and the first frame NA4 , the second frame NA5 , and the third frame NA6 are respectively connected to the side portions of the composite film 92 .

[0114] The composite film 92 (super clean foam, SCF) may include an adhesive layer, a buffer layer, and a heat dissipation layer stacked in sequence in a direction away from the substrate 10. The composite film 92 buffers the stress acting on the display panel 100, and can dissipate the heat generated when the display panel 100 is working, thereby providing a certain protective effect on the display panel 100.

[0115] After the first frame NA4 , the second frame NA5 , and the third frame NA6 are bent, glue may be filled in the gaps between each frame and the side of the composite film 92 , and the glue may be bonded and fixed after solidification.

[0116] In the embodiment of the present application, the composite film 92 is fixed to the first frame NA4 , the second frame NA5 , and the third frame NA6 , and there is no need to provide a fixing block 91 , thereby reducing the thickness of the display panel 100 .

[0117] like Fig.19 As shown, preferably, the display panel 100 further includes a padding block 93 disposed on the back side of the substrate 10 , and the fourth frame NA7 is connected to the back side of the padding block 93 .

[0118] The raising block 93 may be disposed at the edge of the back side of the display panel 100 , and may be disposed in a surrounding manner along the circumference of the display panel 100 , or a plurality of raising blocks 93 may be disposed at intervals along the edge of the display panel 100 .

[0119] The fourth frame NA7 is bent to the back of the display panel 100 and fixed to the back of the padding block 93. The padding block 93 can be fixed by bonding, clamping, etc. to support and fix the fourth frame NA7, thereby improving stability.

[0120] In a second aspect, the present application also provides a display device, including the display panel 100 of any of the above embodiments. Since the display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0121] The display device may be any device with a display function, for example, a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. It may also be a non-mobile device such as a personal computer (PC), a television (TV), a teller machine, or an automated machine.

[0122] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the replacement of other connection methods described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel has a display area and a non-display area, and includes: substrate; A light-emitting device layer, comprising a first electrode, a light-emitting layer, and a second electrode arranged in sequence in a direction away from the substrate; A first inorganic encapsulation layer is disposed on a side of the light-emitting device layer away from the substrate; A voltage power supply line, located in the non-display area; An auxiliary electrode is arranged on a side of the first inorganic encapsulation layer away from the substrate, the auxiliary electrode is connected to the second electrode through a via hole, and the voltage power line is connected to the auxiliary electrode.

2. The display panel according to claim 1, characterized in that: The display panel further includes a gate drive circuit signal line, and the gate drive circuit signal line is located in the display area.

3. The display panel according to claim 1, characterized in that: The display panel further includes: an organic encapsulation layer, disposed on a side of the first inorganic encapsulation layer away from the substrate; The first dam is located in the non-display area, and the first dam is arranged at the periphery of the organic encapsulation layer.

4. The display panel according to claim 3, characterized in that: The non-display area comprises a first non-display sub-area, a bending area and a second non-display sub-area which are sequentially arranged in a direction away from the display area, the second non-display sub-area is bound to the back surface of the display panel, and the first dam is located in the second non-display sub-area; Preferably, the display panel further comprises a second dam located in the non-display area, and the first dam is farther away from the display area than the second dam; Preferably, the height of the second dam is less than the height of the first dam; Preferably, the display area and the bending area both have multiple metal layers, and the number of metal layers in the bending area is smaller than the number of metal layers in the display area.

5. The display panel according to claim 4, characterized in that: The display panel further comprises an isolation column disposed in the first non-display sub-area, and at least a portion of the organic encapsulation layer is surrounded by the isolation column; Preferably, at least part of the auxiliary electrodes are reused as the isolation columns; Preferably, the material of the isolation column includes non-metallic material; Preferably, the substrate is provided with a first groove structure in the bending area; Preferably, the second dam is located in the second non-display sub-region, or the second dam is located in the first non-display sub-region, and the second dam is far away from the display region relative to the isolation column.

6. The display panel according to claim 4, characterized in that: The orthographic projection of the organic encapsulation layer on the substrate does not overlap with the orthographic projection of the bending region on the substrate; Preferably, the substrate is provided with a first groove structure in the bending area.

7. The display panel according to claim 1, characterized in that: The non-display area includes a corner area, and the corner area includes a third non-display sub-area and a bending area which are arranged in sequence along a direction away from the display area, the bending area is bent to the side of the display panel, and the thickness of the bending area is less than the thickness of the third non-display sub-area.

8. The display panel according to claim 7, characterized in that: The bending area is provided with a second groove structure; Preferably, the second groove structure comprises a groove row and a groove column, wherein the groove row comprises a plurality of grooves arranged along the radial direction of the bending zone, and the groove column comprises a plurality of grooves arranged along the circumferential direction of the bending zone; Preferably, the bending zone includes groove areas arranged at intervals along the circumferential direction, and the second groove structure is arranged in the groove area.

9. The display panel according to claim 1, characterized in that: The non-display area includes a first frame, a second frame, a third frame and a fourth frame connected end to end in sequence, the first frame and the third frame are arranged opposite to each other, the second frame and the fourth frame are arranged opposite to each other, at least parts of the first frame, the second frame and the third frame are bent to the side of the display panel respectively, and part of the fourth frame is bent to the back of the display panel; Preferably, the display panel further comprises a fixed block disposed on the substrate, and the first frame, the second frame, and the third frame are respectively connected to the side of the fixed block; or, the display panel further comprises a composite film disposed on the back of the substrate, and the first frame, the second frame, and the third frame are respectively connected to the side of the composite film; Preferably, the display panel further comprises a padding block arranged on the back side of the substrate, and the fourth frame is connected to the back side of the padding block.

10. A display device, characterized in that: Comprising a display panel as described in any one of claims 1 to 9.

Images