Display device

Abstract

A display device is provided. The display apparatus includes a substrate including a display area and a peripheral area, a display layer in the display area and including a pixel circuit and a light emitting device, an encapsulation layer covering the display layer and in which a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer are stacked, an optical control layer on the encapsulation layer and including an organic layer in which a plurality of light blocking lines are arranged, and an intermediate layer above or below a second inorganic encapsulation layer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0150271 filed in the Korean Intellectual Property Office on November 2, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Aspects of one or more embodiments relate to a display device. Background Art

[0004] Recently, display devices have been used for various purposes. In addition, as time goes by, display devices have become thinner and lighter, thereby being widely used, and as display devices are used in various fields, consumers' demand for display devices that provide high-quality images is increasing. Recently, display devices are arranged inside vehicles to provide videos to users sitting in a driver's seat or a passenger seat. Light emitted from a display device arranged inside a vehicle is reflected on a window of the vehicle and reaches the user.

[0005] The above information disclosed in this Background section is only for enhancement of background understanding and therefore the information discussed in this Background section does not necessarily constitute prior art. Summary of the invention

[0006] Light emitted from a display device disposed inside a vehicle may be reflected on a window of the vehicle and reach a user.

[0007] One or more embodiments relate to a display device with improved display quality to ensure that the user's field of view is not blocked. However, this feature is only an example, and the scope of the embodiments according to the present disclosure is not limited thereto.

[0008] Additional aspects will be set forth in part in the detailed description which follows and, in part, will be obvious from the description, or may be learned by practice of the disclosed embodiments.

[0009] According to some embodiments, a display device includes: a substrate including a display area and a peripheral area, a display layer arranged in the display area and including a pixel circuit and a light-emitting device, an encapsulation layer covering the display layer and in which a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer are stacked, an optical control layer on the encapsulation layer and including a plurality of light-blocking organic layers arranged therein, and an intermediate layer above or below the second inorganic encapsulation layer.

[0010] According to some embodiments, the display device may further include a wiring portion disposed in the peripheral region and including a wiring extending from the display region, wherein the intermediate layer overlaps the wiring portion.

[0011] According to some embodiments, the intermediate layer may include a transparent conductive material.

[0012] According to some embodiments, the organic layer may include a first organic layer and a second organic layer on the first organic layer, and each of the plurality of blocking light rays may be filled in the opening of the second organic layer and the opening or groove of the first organic layer.

[0013] According to some embodiments, a thickness of the second organic layer may be greater than a thickness of the first organic layer.

[0014] According to some embodiments, the second organic layer may have a thickness of about 30 μm to about 40 μm.

[0015] According to some embodiments, the display device may further include a dam disposed in the peripheral region at the same layer as the first organic layer and spaced apart from the first organic layer.

[0016] According to some embodiments, the display device may further include a light blocking member on the dam and including the same material as that of the plurality of light blocking lines.

[0017] According to some embodiments, the organic layer may include a plurality of openings or grooves, and the plurality of light-blocking rays may be filled in the plurality of openings or grooves, respectively.

[0018] According to some embodiments, the plurality of light-blocking lines may be spaced apart from each other at regular first intervals along one direction.

[0019] According to some embodiments, the intermediate layer may be on the second inorganic encapsulation layer and extend from the display region to the peripheral region.

[0020] According to some embodiments, the intermediate layer may be below the second inorganic encapsulation layer and extend from the display region to the peripheral region.

[0021] According to some embodiments, the intermediate layer may be disposed in the peripheral region and may not be disposed in the display region.

[0022] According to some embodiments, in the peripheral region, the intermediate layer may be on the second inorganic encapsulation layer.

[0023] According to some embodiments, in the peripheral region, the intermediate layer may be disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

[0024] According to some embodiments, a display device includes: a substrate including a display area and a peripheral area, a display layer arranged in the display area and including a pixel circuit and a light-emitting device, a wiring portion arranged in the peripheral area and including a wiring extending from the display area, an encapsulation layer covering the display layer and in which a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer are stacked, an optical control layer on the encapsulation layer and including an organic layer in which a plurality of blocking light rays are respectively filled in a plurality of openings or grooves, and a protective layer above or below the second inorganic encapsulation layer and including a transparent conductive oxide.

[0025] According to some embodiments, the organic layer may include a first organic layer and a second organic layer on the first organic layer, wherein a thickness of the second organic layer is greater than a thickness of the first organic layer.

[0026] According to some embodiments, the display device may further include a dam disposed in the peripheral region at the same layer as the first organic layer and spaced apart from the first organic layer.

[0027] According to some embodiments, the plurality of light-blocking lines may be spaced apart from each other at regular first intervals along one direction.

[0028] According to some embodiments, the protection layer may overlap the wiring portion in the peripheral region. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other aspects, features and characteristics of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0030] Figure 1 schematically illustrates the exterior of a vehicle according to some embodiments;

[0031] Figure 2A schematically illustrates the interior of a vehicle according to some embodiments;

[0032] Figure 2B schematically illustrates the interior of a vehicle according to some embodiments;

[0033] Figure 3A is a schematic perspective view of a display device according to some embodiments;

[0034] Figure 3B is a schematic plan view of a display device according to some embodiments;

[0035] Figure 4 is an equivalent circuit diagram schematically illustrating a sub-pixel and a pixel circuit driving the sub-pixel according to some embodiments;

[0036] Figure 5 It is shown Figure 3Ba plan view showing further details of area I of the apparatus;

[0037] Figure 6 It is taken along line II-II' Figure 3B A schematic cross-sectional view of a display device;

[0038] FIG. 7A to FIG. 7G is a schematic cross-sectional view for describing a method for manufacturing a display device according to some embodiments;

[0039] Fig. 8A is a schematic cross-sectional view of a portion of a display device according to some embodiments;

[0040] Figure 8B is a schematic cross-sectional view of a portion of a display device according to some embodiments;

[0041] Fig. 9 is a schematic cross-sectional view of a portion of a display device according to some embodiments; and

[0042] Fig.10 is a schematic cross-sectional view of a portion of a display device according to some embodiments. DETAILED DESCRIPTION

[0043] The embodiments of the present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings, in which the same reference numerals always refer to the same elements. In this respect, the present embodiment may have different forms and should not be construed as being limited to the description set forth herein. Accordingly, the embodiments are described below only by reference to the figures to explain the various aspects of the present description. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items. Throughout the disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0044] Since the present disclosure may have diversified modified embodiments, the embodiments are shown in the drawings and described in the detailed description. When referring to the embodiments described with reference to the drawings, the effects and features of the present disclosure and the methods for achieving these will be apparent. However, the present disclosure may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein.

[0045] Hereinafter, aspects of some embodiments will be described in more detail with reference to the accompanying drawings, wherein the same or corresponding elements are always denoted by the same reference numerals and their repeated description is omitted.

[0046] In the specification, the terms “first” and “second” are not used in a limited sense, and are used to distinguish one component from another component.

[0047] As used herein, the singular expressions “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0048] It should be further understood that the terms “comprises” and / or “comprising” used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0049] It will be understood that when a layer, region or element is referred to as being formed “on” another layer, region or element, it can be directly or indirectly formed on the other layer, region or element. That is, for example, intervening layers, regions or elements may be present.

[0050] In the drawings, the size of components may be exaggerated or reduced for the convenience of description. In other words, since the size and thickness of elements in the drawings are arbitrarily shown for the convenience of description, the following embodiments are not limited thereto.

[0051] When a specific embodiment can be implemented in different ways, the specific process order can be performed differently from the described order. For example, two processes described in succession can be performed substantially simultaneously or in the reverse order of the described order.

[0052] In the embodiments below, it will be understood that when an element, region or layer is referred to as being connected to another element, region or layer, it can be directly and / or indirectly connected to another element, region or layer. For example, it will be understood in this specification that when an element, region or layer is referred to as being in contact with or electrically connected to another element, region or layer, it can be directly and / or indirectly in contact with or electrically connected to another element, region or layer.

[0053] Figure 1 The exterior of a vehicle 1000 is schematically shown according to some embodiments. Figure 2A and Figure 2B The interior of a vehicle 1000 is schematically shown according to some embodiments.

[0054] Reference Figure 1 , Figure 2A and Figure 2B The vehicle 1000 may refer to various devices that move objects such as people, articles, or animals from a starting point to a destination. The vehicle 1000 may include, for example, a vehicle that can travel on roads or tracks, a ship that can sail on the sea or rivers, and / or an aircraft that can fly in the sky using the action of air.

[0055] The vehicle 1000 may travel on a road or a track. The vehicle 1000 may move in a specific direction according to the rotation of at least one wheel. For example, the vehicle 1000 may include a three-wheeled or four-wheeled vehicle, a construction machine, a two-wheeled vehicle, a driving machine, a bicycle, and a train traveling on a track.

[0056] The vehicle 1000 may include a body including an interior and an exterior, and the rest of the body, that is, a chassis in which the machinery required for driving is installed. The exterior of the body may include a front panel, a bonnet, a roof, a rear panel, a trunk, and fillers installed at the boundaries between the doors. The chassis of the vehicle 1000 may include a power generation device, a power transmission device, a drive device, a steering device, a brake device, a suspension device, a transmission device, a fuel device, and front and rear wheels.

[0057] The vehicle 1000 may include side window glasses 1100 , a front window glass 1200 , side mirrors 1300 , a cluster 1400 , a center fascia 1500 , a passenger seat dashboard 1600 , and a display device 1 .

[0058] The side window glass 1100 and the front window glass 1200 may be divided by a filler located between the side window glass 1100 and the front window glass 1200 .

[0059] The side window glass 1100 may be mounted on a side surface of the vehicle 1000. According to some embodiments, the side window glass 1100 may be mounted on a door of the vehicle 1000. A plurality of side window glasses 1100 may be provided and may face each other. According to some embodiments, the side window glass 1100 may include a first side window glass 1110 and a second side window glass 1120. The first side window glass 1110 may be arranged adjacent to the instrument panel 1400. The second side window glass 1120 may be adjacent to the passenger seat instrument panel 1600.

[0060] The plurality of side window glasses 1100 may be separated from each other in a first direction (eg, x direction). For example, the first side window glass 1110 and the second side window glass 1120 may be spaced apart from each other in the x direction. In other words, a virtual connection line L connecting the plurality of side window glasses 1100 may extend in the first direction (eg, x direction).

[0061] The front window glass 1200 may be installed at the front of the vehicle 1000. The front window glass 1200 may be arranged between a plurality of side window glasses 1100 facing each other.

[0062] The side mirror 1300 may provide a rear view of the vehicle 1000. The side mirror 1300 may be mounted on the exterior of the vehicle body. A plurality of side mirrors 1300 may be provided. One of the plurality of side mirrors 1300 may be disposed on the exterior of the first side window glass 1110. Another of the plurality of side mirrors 1300 may be disposed on the exterior of the second side window glass 1120.

[0063] Instrument panel 1400 may be arranged in the front of the steering wheel. Instrument panel 1400 may include a tachometer, a speedometer, a coolant temperature gauge, a fuel gauge, a turn signal indicator, a high beam indicator, a warning light, a seat belt warning light, an odometer, a trip odometer, an automatic shift selector lever indicator, a door open warning light, an engine oil warning light, and / or a low fuel warning light.

[0064] The center console 1500 may include an audio device, an air conditioning device, and a control panel on which a plurality of buttons for controlling heaters of seats are arranged. The center console 1500 may be arranged on one side of the instrument panel 1400 .

[0065] The passenger seat instrument panel 1600 may be spaced apart from the instrument panel 1400 via the center console 1500. According to some embodiments, the instrument panel 1400 may be arranged to correspond to the driver's seat, and the passenger seat instrument panel 1600 may be arranged to correspond to the passenger seat. According to some embodiments, the instrument panel 1400 may be adjacent to the first side window glass 1110, and the passenger seat instrument panel 1600 may be adjacent to the second side window glass 1120.

[0066] The display device 1 may be arranged inside the vehicle 1000. The display device 1 may be arranged between the plurality of side window glasses 1100. The display device 1 may display an image. According to some embodiments, the display device 1 may be arranged in at least one of the instrument panel 1400, the center console 1500, and the passenger seat instrument panel 1600.

[0067] The display device 1 may include a liquid crystal display device, an electrophoretic display device, an organic light-emitting display device, an inorganic light-emitting display device, a field emission display device, a surface conduction electron emitter display device, a quantum dot display device, a plasma display device, a cathode ray display device, etc. Hereinafter, an organic light-emitting display device is described as an example of the display device 1 according to some embodiments, but various display devices as described above may be used for one or more embodiments.

[0068] Reference Figure 2A , the display device 1 may be arranged in the center console 1500. According to some embodiments, the display device 1 may display navigation information. According to some embodiments, the display device 1 may display information related to audio, video or vehicle settings.

[0069] The light emitted from the display device 1 may travel in a specific direction. For example, the light emitted from the display device 1 may travel toward the driver's seat. The light emitted from the display device 1 may travel toward the passenger seat. The light emitted from the display device 1 may not travel toward the front window glass 1200. Alternatively, the light emitted from the display device 1 may travel toward the front window glass 1200 at a relatively low ratio. If the light emitted from the display device 1 travels toward the front window glass 1200, the light emitted from the display device 1 may be reflected by the front window glass 1200 and reaches the driver's seat. Therefore, the driver may recognize the image of the display device 1 formed in the front window glass 1200, and may not recognize the object in front, and therefore, it may be unsafe during operation. According to some embodiments, the light emitted from the display device 1 arranged in the center console 1500 may travel in a specific direction. Therefore, the light traveling toward the front window glass 1200 can be minimized or relatively reduced.

[0070] Reference Figure 2B , the display device 1 may be arranged in the instrument panel 1400. In this case, the instrument panel 1400 may display operation information and the like through the display device 1. That is, the instrument panel 1400 may be implemented digitally. The digital instrument panel 1400 may display vehicle information and driving information as images. For example, the pointer and gauge of the tachometer and various warning icons may be displayed through digital signals.

[0071] The light emitted from the display device 1 may travel in a specific direction. For example, the light emitted from the display device 1 may travel toward the driver's seat. The light emitted from the display device 1 may not travel toward the front window glass 1200. Alternatively, the light emitted from the display device 1 may travel toward the front window glass 1200 at a relatively low ratio. If the light emitted from the display device 1 travels toward the front window glass 1200, the light emitted from the display device 1 may be reflected by the front window glass 1200 and reach the driver's seat. Therefore, the driver may recognize the image of the display device 1 formed in the front window glass 1200, which may cause safety problems during operation. According to some embodiments, the light emitted from the display device 1 arranged in the instrument panel 1400 may travel in a specific direction. Therefore, the light traveling toward the front window glass 1200 can be minimized or relatively reduced.

[0072] Figure 3A is a schematic perspective view of a display device 1 according to some embodiments. Figure 3B is a schematic plan view of a display device 1 according to some embodiments.

[0073] Reference Figure 3A and Figure 3B, the display device 1 may include a display area DA and a peripheral area PA. The display device 1 may include a substrate 100 and multiple layers on the substrate 100. The display area DA and the peripheral area PA may be defined in the substrate 100 and / or the multiple layers. For example, the substrate 100 may define the display area DA and the peripheral area PA. In other words, the substrate 100 may include the display area DA and the peripheral area PA.

[0074] A plurality of sub-pixels P may be arranged in the display area DA. According to some embodiments, the sub-pixels P may be arranged in the front surface FS1 of the display device 1 .

[0075] A plurality of sub-pixels P may be arranged in the display area DA to display an image. The sub-pixel P may be implemented as a light-emitting device. Light emitted from the sub-pixel P may travel in a specific direction from the front surface FS1 of the display device 1. Light emitted from the sub-pixel P may travel in any specific direction from the front surface FS1 of the display device 1. According to some embodiments, light emitted from the sub-pixel P may travel in a vertical direction (e.g., z direction) relative to the front surface FS1 of the display device 1. According to some embodiments, light emitted from the sub-pixel P may travel in an inclined direction (e.g., a direction intersecting the z direction) relative to the front surface FS1 of the display device 1. According to some embodiments, the light emitted from the sub-pixel P may not include a component in at least one of the first direction (e.g., x direction) and the second direction (e.g., y direction).

[0076] The sub-pixel P may emit red light, green light, or blue light by using a light emitting device. According to some embodiments, the sub-pixel P may release red light, green light, blue light, or white light by using a light emitting device. The sub-pixel P may be defined as an emission area of ​​the light emitting device that emits any one of red light, green light, blue light, and white light.

[0077] The sub-pixel P may include a light emitting diode as a light emitting device configured to emit light of a specific color. The light emitting diode may include an organic light emitting diode including an organic material as an emission layer. Alternatively, the light emitting diode may include an inorganic light emitting diode. Alternatively, the light emitting diode may include quantum dots as an emission layer. According to some embodiments, the size of the light emitting diode may be micrometer-scale or nanometer-scale. For example, the light emitting diode may be a micro light emitting diode. Alternatively, the light emitting diode may be a nano light emitting diode. The nano light emitting diode may include gallium nitride (GaN). According to some embodiments, a color conversion layer may be located on the nano light emitting diode. The color conversion layer may include quantum dots. Hereinafter, for the convenience of explanation, a case is described in which the light emitting diode includes an organic light emitting diode.

[0078] The pixel circuit configured to drive the sub-pixel P may be connected to the scan line SL extending in a first direction (eg, x-direction) and the data line DL extending in a second direction (eg, y-direction).

[0079] The peripheral area PA may not display an image. The peripheral area PA may be arranged outside the display area DA (for example, in the periphery of the display area DA or outside the coverage area). The peripheral area PA may surround at least a portion of the display area DA. According to some embodiments, the peripheral area PA may surround the entire display area DA. A scan driver configured to provide a scan signal to each sub-pixel P may be arranged in the peripheral area PA. A data driver configured to provide a data signal to each sub-pixel P may be arranged in the peripheral area PA. The peripheral area PA may include a pad area PADA. According to some embodiments, a pad PAD may be arranged in the pad area PADA. The pad PAD may be exposed without being covered by an insulating layer and electrically connected to a printed circuit board or a driver IC.

[0080] In the peripheral area PA, a wiring portion WA may be arranged between the pad area PADA and the display area DA. The wiring portion WA may include a plurality of wirings WL. The plurality of wirings WL may be configured to transmit a signal and / or voltage received from a printed circuit board or a driver IC through the pad PAD to a pixel circuit that drives a sub-pixel P arranged in the display area DA. Figure 3B As shown in , a plurality of wirings WL may extend from the display area DA.

[0081] Figure 4 is an equivalent circuit diagram schematically illustrating a sub-pixel P and a pixel circuit PC driving the sub-pixel P according to some embodiments.

[0082] Reference Figure 4 , the sub-pixel P may include a pixel circuit PC and an organic light emitting diode OLED as a light emitting device. The pixel circuit PC may include a driving transistor T1, a switching transistor T2, and a storage capacitor Cst. Each sub-pixel P may emit light, such as red light, green light, or blue light, or emit red light, green light, blue light, or white light through the organic light emitting diode OLED.

[0083] The switching transistor T2 may be connected to the scan line SL and the data line DL, and may transfer a data signal or a data voltage input from the data line DL to the driving transistor T1 based on a scan signal or a switching voltage input from the scan line SL. The storage capacitor Cst may be connected to the switching transistor T2 and the driving voltage line PL, and may store a voltage corresponding to a difference between a voltage received from the switching transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0084] The driving transistor T1 may be connected to the driving voltage line PL and the storage capacitor Cst, and may control a driving current flowing into the organic light emitting diode OLED through the driving voltage line PL corresponding to a voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED may emit light having a specific brightness according to the driving current. A common electrode (e.g., a cathode) of the organic light emitting diode OLED may receive a second power supply voltage ELVSS.

[0085] Figure 4 A pixel circuit PC including two transistors and one storage capacitor is shown, but in some embodiments, the pixel circuit PC may include three or more transistors. According to various embodiments, the pixel circuit PC may include additional components or circuit elements without departing from the spirit and scope of the embodiments according to the present disclosure.

[0086] Figure 5 It is shown Figure 3B A plan view showing further details of area I of the apparatus.

[0087] Reference Figure 5 , the first subpixel P1, the second subpixel P2, and the third subpixel P3 may be located on the substrate 100. Here, the first subpixel P1, the second subpixel P2, and the third subpixel P3 may be defined by emission areas EA of light emitting devices of the first subpixel P1, the second subpixel P2, and the third subpixel P3, respectively.

[0088] The first subpixel P1 may emit light in a first wavelength band. For example, the first subpixel P1 may emit light having a wavelength ranging from about 450 nm to about 495 nm. The second subpixel P2 may emit light in a second wavelength band. For example, the second subpixel P2 may emit light having a wavelength ranging from about 630 nm to about 780 nm. The third subpixel P3 may emit light in a third wavelength band. For example, the third subpixel P3 may emit light having a wavelength ranging from about 495 nm to about 570 nm.

[0089] The first subpixel P1, the second subpixel P2, and the third subpixel P3 may have a quadrilateral shape among polygonal shapes. In this article, a polygon or a quadrilateral also includes a shape with rounded vertices. The first subpixel P1, the second subpixel P2, and the third subpixel P3 may have a quadrilateral shape with rounded vertices. According to some embodiments, the first subpixel P1, the second subpixel P2, and the third subpixel P3 may have a circular or elliptical shape.

[0090] The sizes of the first subpixel P1, the second subpixel P2, and the third subpixel P3 may be different from each other. For example, the area of ​​the second subpixel P2 may be smaller than the area of ​​the first subpixel P1 and the area of ​​the third subpixel P3, and the area of ​​the first subpixel P1 may be larger than the area of ​​the third subpixel P3. However, embodiments according to the present disclosure are not limited thereto. The sizes of the first subpixel P1, the second subpixel P2, and the third subpixel P3 may be substantially the same as each other, and various modifications may be made.

[0091] A plurality of first sub-pixels P1 may be provided, and the plurality of first sub-pixels P1 may be separated from each other in a first direction (x direction). A plurality of second sub-pixels P2 and third sub-pixels P3 may be repeatedly arranged to be separated from each other in the first direction (x direction). A pixel row including a plurality of first pixels P1 arranged in the first direction (x direction) and a pixel row including second sub-pixels P2 and third sub-pixels P3 alternately arranged in the first direction (x direction) may be repeatedly arranged to be separated from each other in a second direction (y direction). Embodiments according to the present disclosure are not limited thereto, and the first sub-pixels P1, the second sub-pixels P2, and the third sub-pixels P3 may be arranged in various pixel array structures, such as structure, stripe structure, mosaic structure or delta structure.

[0092] The display device according to some embodiments may include a plurality of light-blocking rays 530 that reflect or absorb light emitted from the first subpixel P1, the second subpixel P2, and the third subpixel P3. Figure 5 As shown in , one sub-pixel may overlap with a plurality of blocking lines 530. The plurality of blocking lines 530 may be arranged to extend in a first direction (x direction).

[0093] A plurality of blocking lines 530 may be separated from each other at regular intervals (i.e., first intervals 530int). The first interval 530int may be the shortest interval between adjacent blocking lines. For example, the first interval 530int may be the distance from the edge of the first blocking line to the edge of the second blocking line adjacent to the first blocking line. The first interval 530int may have a range of about 10 μm to about 60 μm. The width 530w of each blocking line 530 may be about 2 μm to about 10 μm.

[0094] The plurality of blocking light lines 530 may limit specific directional components of light emitted from the first subpixel P1, the second subpixel P2, and the third subpixel P3. For example, when the second directional component of light emitted from the first subpixel P1, the second subpixel P2, and the third subpixel P3 exceeds a specific value and has an emission angle of at least a cut-off angle, the emitted light may be blocked by the blocking light lines 530.

[0095] Figure 6 It is taken along line II-II' Figure 3BSchematic cross-sectional view of a display device 1.

[0096] Reference Figure 6 , the display device 1 may include a substrate 100 , a display layer 200 , an encapsulation layer 300 , an optical control layer 500 , and an intermediate layer 400 .

[0097] The display layer 200 may be located on the substrate 100. The display layer 200 may include a pixel circuit layer 210 and a light emitting device layer 220. The pixel circuit layer 210 may include a buffer layer 211, a first gate insulating layer 213, a second gate insulating layer 215, an interlayer insulating layer 217, an organic insulating layer 219, and a pixel circuit PC. The pixel circuit PC may include a thin film transistor TFT and a storage capacitor Cst. The thin film transistor TFT may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE.

[0098] The buffer layer 211 may be positioned on the substrate 100. The buffer layer 211 may include an inorganic insulating material such as silicon nitride (SiN x ), silicon oxynitride (SiON) and silicon oxide (SiO 2 ), and may have a single-layer or multi-layer structure including the above-mentioned inorganic insulating material.

[0099] The semiconductor layer Act may be located on the buffer layer 211. The semiconductor layer Act may include polycrystalline silicon. Alternatively, the semiconductor layer Act may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer Act may include a channel region and a drain region and a source region respectively arranged on both sides of the channel region.

[0100] The first gate insulating layer 213 may be located on the semiconductor layer Act and the buffer layer 211. The first gate insulating layer 213 may include an inorganic insulating material such as SiO 2 、SiN x , SiON, Alumina (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO X ). ZnO X It may include zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ).

[0101] The gate electrode GE may be located on the first gate insulating layer 213. The gate electrode GE may overlap the channel region. The gate electrode GE may include a low-resistance metal material. The gate electrode GE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may include a multilayer or a single layer including the above conductive materials.

[0102] The second gate insulating layer 215 may be located on the gate electrode GE and the first gate insulating layer 213. Similar to the first gate insulating layer 213, the second gate insulating layer 215 may include an inorganic insulating material such as SiO 2 、SiN x 、SiON、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 、ZnO X or similar.

[0103] The upper electrode CE2 of the storage capacitor Cst may be positioned on the second gate insulating layer 215. The upper electrode CE2 may overlap the gate electrode GE thereunder. In this case, the gate electrode GE and the upper electrode CE2 overlapping each other across the second gate insulating layer 215 may be included in the storage capacitor Cst. That is, the gate electrode GE may serve as the lower electrode CE1 of the storage capacitor Cst. According to some embodiments, the storage capacitor Cst may overlap with the thin film transistor TFT. According to some embodiments, the storage capacitor Cst may not overlap with the thin film transistor TFT. The upper electrode CE2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may have a single-layer or multi-layer structure including the above materials.

[0104] The interlayer insulating layer 217 may be located on the upper electrode CE2 and the second gate insulating layer 215. The interlayer insulating layer 217 may include an inorganic insulating material such as SiO 2 、SiN x 、SiON、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 、ZnO x The interlayer insulating layer 217 may have a single-layer or multi-layer structure including the above-mentioned inorganic insulating material.

[0105] The drain electrode DE and the source electrode SE may each be located on the interlayer insulating layer 217. The drain electrode DE and the source electrode SE may each be electrically connected to the semiconductor layer Act. The drain electrode DE and the source electrode SE may include a material having high conductivity. The drain electrode DE and the source electrode SE may include a conductive material including Mo, Al, Cu, Ti, etc., and may include a multilayer or a single layer including the above conductive materials. According to some embodiments, the drain electrode DE and the source electrode SE may have a multilayer structure of Ti / Al / Ti.

[0106] The organic insulating layer 219 may be located on the drain electrode DE, the source electrode SE, and the interlayer insulating layer 217. The organic insulating layer 219 may include an organic insulating material such as a general polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and a blend thereof. In some embodiments, the organic insulating layer 219 may include a first organic insulating layer and a second organic insulating layer.

[0107] The light emitting device layer 220 may be located on the pixel circuit layer 210. The light emitting device layer 220 may be located on the organic insulating layer 219. The light emitting device layer 220 may include a light emitting device that implements a sub-pixel. The light emitting device may be an organic light emitting diode OLED.

[0108] The organic light emitting diode OLED may include a pixel electrode 221, an interlayer 222, and an opposite electrode 223. The pixel electrode 221 may be electrically connected to the thin film transistor TFT through a contact hole of the organic insulating layer 219. The pixel electrode 221 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). According to some embodiments, the pixel electrode 221 may include a reflective layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a compound thereof. In some embodiments, the pixel electrode 221 may also include a reflective layer including ITO, IZO, ZnO or In above / below the reflective layer. 2 O 3 For example, the pixel electrode 221 may have a multi-layer structure of ITO / Ag / ITO.

[0109] The pixel defining layer 225 may cover the edge of the pixel electrode 221. The pixel defining layer 225 may include an opening portion OP. The opening portion OP may expose the central portion of the pixel electrode 221. The opening portion OP may define an emission region of light emitted from the organic light emitting diode OLED. According to some embodiments, the width Ew of the emission region may be defined as the size of the opening portion OP in the second direction (e.g., the y direction). The width Ew of the emission region may be about 117 μm. According to some embodiments, the pixel defining layer 225 may include an organic material and / or an inorganic material. According to some embodiments, the pixel defining layer 225 may be transparent. According to some embodiments, the pixel defining layer 225 may include a black matrix. In this case, the pixel defining layer 225 may be opaque.

[0110] The interlayer 222 may include an emission layer including an organic material. The emission layer may include a high molecular weight organic material or a low molecular weight organic material that emits light of a specific color. According to some embodiments, a first functional layer and a second functional layer as a common layer arranged as a whole in the display area may be located above and / or below the emission layer. The first functional layer may include, for example, a hole transport layer (HTL) and / or a hole injection layer (HIL). The second functional layer may include an electron transport layer (ETL) and / or an electron injection layer (EIL). In some embodiments, the second functional layer may be omitted.

[0111] The opposing electrode 223 may be located on the interlayer 222. The opposing electrode 223 may include a conductive material having a low work function. For example, the opposing electrode 223 may include a transparent (or transflective) layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, or an alloy thereof. Alternatively, the opposing electrode 223 may also include a layer on the transparent (or transflective) layer including the above materials, such as ITO, IZO, ZnO, or In 2 O 3 .

[0112] In some embodiments, a capping layer may be further disposed on the opposite electrode 223. The capping layer may include LiF, an inorganic material, and / or an organic material.

[0113] The wiring portion WA is arranged in the peripheral area PA, and a plurality of wirings WL may be arranged in the wiring portion WA. The wiring WL may transmit an electrical signal or voltage to the pixel circuit PC located in the display area DA. According to some embodiments, some of the wirings WL may be provided in the same layer as the gate electrode GE of the thin film transistor TFT, and include the same material as the gate electrode GE of the thin film transistor TFT. According to some embodiments, some of the wirings WL may be provided in the same layer as the source electrode SE and the drain electrode DE of the thin film transistor TFT, and include the same material as the source electrode SE and the drain electrode DE of the thin film transistor TFT. According to some embodiments, some of the wirings WL may be provided in the same layer as the upper electrode CE2 or the lower electrode CE1 of the storage capacitor Cst, and include the same material as the upper electrode CE2 or the lower electrode CE1 of the storage capacitor Cst.

[0114] The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. Figure 6 An encapsulation layer 300 including a first inorganic encapsulation layer 310 , an organic encapsulation layer 320 , and a second inorganic encapsulation layer 330 , which are sequentially stacked, is shown.

[0115] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include Al 2 O 3 、TiO 2 、 2 O 5 、ZnO X 、SiO 2 At least one inorganic material selected from SiNx and SiON. ZnO X It may include zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ).

[0116] The organic encapsulation layer 320 may include a polymer-based material. Examples of the polymer-based material may include acrylic resin, epoxy resin, polyimide, and polyethylene. According to some embodiments, the organic encapsulation layer 320 may include acrylate.

[0117] The encapsulation layer 300 is configured to protect the organic light emitting diode OLED arranged in the display area DA, and only a portion of the encapsulation layer 300 may be arranged in the peripheral area PA. For example, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may extend to the wiring portion WA of the peripheral area PA and contact each other in the wiring portion WA. The organic encapsulation layer 320 may extend only to the peripheral area PA between the display area DA and the wiring portion WA.

[0118] The optical control layer 500 may be located on the encapsulation layer 300, and include an organic layer 520 and a plurality of light-blocking lines 530 arranged in the organic layer 520. The organic layer 520 may include a plurality of openings or grooves GV. The plurality of openings or grooves GV may be arranged at regular intervals.

[0119] The organic layer 520 may include a first organic layer 521 and a second organic layer 523. The first organic layer 521 may include a light-transmitting organic material. In addition, the first organic layer 521 and the second organic layer 523 may include a material having high spreadability on the encapsulation layer 300 to ensure coatability. The first organic layer 521 may include a photosensitive organic material.

[0120] In some embodiments, the first organic layer 521 may be an organic material such as an epoxy resin, an acrylic resin, or an imide resin. In some embodiments, the first organic layer 521 may be an ethylene glycol di(meth)acrylate-based polymer, a diethylene glycol di(meth)acrylate-based polymer, a triethylene glycol di(meth)acrylate-based polymer, a 1,6-hexanediol di(meth)acrylate polymer, a pentaerythritol tri(meth)acrylate polymer, a pentaerythritol tetra(meth)acrylate polymer, a dipentaerythritol penta(meth)acrylate polymer, a dipentaerythritol hexa(meth)acrylate polymer, a bisphenol A epoxy(meth)acrylate polymer, an ethylene glycol monomethyl ether(meth)acrylate polymer, a trimethylolpropane tri(meth)acrylate polymer, a triacryloxyethyl phosphate polymer, and a cardo epoxy diacrylate polymer.

[0121] The first organic layer 521 may be arranged in a portion of the display area DA and the peripheral area PA. The first organic layer 521 may be located on the wiring portion WA. A dam 521D may be arranged outside the first organic layer 521. The dam 521D may be separated from the first organic layer 521. The dam 521D may include the same material as that of the first organic layer 521. The dam 521D may prevent the flow of the organic material included in the second organic layer 523. The dam 521D may overlap the wiring WL of the wiring portion WA on the second inorganic encapsulation layer 330.

[0122] The second organic layer 523 may be located on the first organic layer 521 and may be thicker than the first organic layer 521. The thickness t1 of the first organic layer 521 may be several μm or less, for example, about 5 μm or less. The thickness t2 of the second organic layer 523 may be in the range of about 30 μm to about 40 μm.

[0123] The second organic layer 523 is an organic material that can be formed by an inkjet method, and may include acrylic resin (e.g., polymethyl methacrylate, polyacrylic acid, etc.), ethylhexyl acrylate, pentafluoropropyl acrylate, poly(ethylene glycol) dimethacrylate, ethylene glycol dimethacrylate, or the like. The second organic layer 523 may be arranged in the dam 521D. The first organic layer 521 and the second organic layer 523 may include materials having the same or similar refractive index.

[0124] A plurality of blocking lines 530 may be filled in a plurality of openings or grooves GV, respectively. A plurality of blocking lines 530 may be separated from each other at regular intervals (i.e., first intervals 530int). The first interval 530int may have a range of about 10 μm to about 60 μm. The width 530w of each blocking line 530 in the second direction (e.g., y direction) may be about 2 μm to about 10 μm. A plurality of blocking lines 530 may include a light-blocking material. For example, the light-blocking material may include a black dye, Cr particles, or a metal oxide (such as molybdenum oxide). Although the blocking lines 530 are arranged vertically relative to the upper surface of the substrate 100 in the drawings, the present disclosure is not limited thereto. The side surfaces of the blocking lines 530 may be inclined relative to the upper surface of the substrate 100.

[0125] The width Ew of the emission area in the second direction (eg, y direction) may be an integer multiple of the first interval 530int as the interval between the blocking lines 530. In this case, moire generation may be reduced or prevented. Therefore, the quality of the display device 1 may be relatively improved.

[0126] In addition, according to some embodiments, the vertical distance d between the interlayer 222 and the plurality of blocking lines 530 may be minimized to minimize the size of the double imaging. Therefore, the quality of the display device 1 may be improved. As the vertical distance d between the interlayer 222 and the plurality of blocking lines 530 increases, the size of the double imaging may increase.

[0127] The peripheral area PA may include a light blocking member BM including the same material as that of the blocking line 530. The light blocking member BM may be located on the dam 521D. The light blocking member BM may overlap the wiring WL arranged in the wiring portion WA. The light blocking member BM may overlap the wiring WL arranged in the wiring portion WA, and thus, the wiring WL may not be visible from the outside.

[0128] When the optical control layer 500 is separately prepared in the form of a film to be attached to the display device 1, the optical control layer 500 may be attached to the upper portion of a different member (eg, a polarizing film) or may be attached by using an adhesive layer. Accordingly, the distance between the blocking line 530 and the interlayer 222 may be increased.

[0129] According to some embodiments, since the optical control layer 500 is not prepared as a separate film but is formed after the encapsulation layer 300, the vertical distance d between the interlayer 222 and the plurality of blocking lines 530 can be significantly reduced, thereby minimizing the width of the double phase so as not to be visible to the user. The vertical distance d can be about 10 μm to about 50 μm.

[0130] The display device 1 according to some embodiments includes an intermediate layer 400. Hereinafter, the intermediate layer 400 may be referred to as an etch stop layer 400. The etch stop layer 400 may be a material having an etching rate different from that of the organic layer 520. The etch stop layer 400 may include a transparent conductive material such as a transparent conductive oxide. For example, the etch stop layer 400 may include a conductive oxide such as ITO, IZO, ZnO, indium tin zinc oxide (ITZO), In 2 O 3 , IGO or AZO. The etch stop layer 400 may be a protective layer including a conductive material such as a transparent conductive oxide.

[0131] The etch stop layer 400 may be located on the encapsulation layer 300 or disposed in the encapsulation layer 300. The etch stop layer 400 may be located on the second inorganic encapsulation layer 330. The etch stop layer 400 may be disposed between the second inorganic encapsulation layer 330 and the optical control layer 500. Figure 6 As shown in FIG. 4 , the etch stop layer 400 may be disposed in the display area DA. The etch stop layer 400 may overlap the wiring WL in the wiring portion WA.

[0132] Since the etching stop layer 400 is included, the structure below the etching stop layer 400 can be prevented from being damaged in the process of etching the organic layer 520. For example, the etching stop layer 400 can prevent the encapsulation layer 300 or the wiring portion WA from being damaged. Alternatively, when the touch screen layer is located on the encapsulation layer 300, the etching stop layer 400 can be located on the touch screen layer to prevent the touch screen layer from being damaged.

[0133] FIG. 7A to FIG. 7G is a schematic cross-sectional view for describing a method of manufacturing the display device 1 according to some embodiments.

[0134] Reference Fig. 7A , a display layer 200 is formed in the display area DA of the substrate 100, wirings WL are formed in the peripheral area PA of the substrate 100, and an encapsulation layer 300 covering the display layer 200 and the wirings WL is formed.

[0135] Then, a first organic layer 521 and a dam 521D are formed on the encapsulation layer 300. A photosensitive organic material having high spreadability is coated and applied, and then hardened and developed to form the first organic layer 521 and the dam 521D. The first organic layer 521 may be included to obtain coatability of a second organic layer 523 to be formed on the first organic layer 521. The dam 521D is formed separately from the first organic layer 521, and can prevent the material of the second organic layer 523 from flowing to the edge of the substrate 100.

[0136] According to some embodiments, the first organic layer 521 may be an organic material such as epoxy resin, acrylic resin, or imide resin. According to some embodiments, the thickness t1 of the first organic layer 521 may be several μm or less, for example, about 5 μm or less.

[0137] Reference Figure 7B , a second organic layer 523 is formed on the first organic layer 521. The second organic layer 523 may be formed by inkjet coating. The second organic layer 523 may be an organic material such as an acrylic resin. The thickness t2 of the second organic layer 523 may be about 30 μm to about 40 μm. The second organic layer 523 may extend from the display area DA to reach the dam 521D of the peripheral area PA.

[0138] Reference Figure 7C A metal pattern layer MP1 is formed on the second organic layer 523. The metal pattern layer MP1 may include regularly spaced openings MP1 OP. The metal pattern layer MP1 may include a metal such as aluminum.

[0139] Then, refer to Fig.7D , the first organic layer 521 and the second organic layer 523 may be etched by using the metal pattern layer MP1 as a mask. The etching may be dry etching. Accordingly, a plurality of openings or grooves GV corresponding to the openings MP1 OP of the metal pattern layer MP1 may be formed in the first organic layer 521 and the second organic layer 523. The plurality of openings or grooves of the organic layer 520 include an opening of the second organic layer 523 overlapping with the opening of the first organic layer 521, but the opening of the second organic layer 523 may overlap with the groove of the first organic layer 521. Here, the groove of the first organic layer 521 refers to the remaining portion of the lower surface of the first organic layer 521 that is not pierced.

[0140] Then, refer to Fig. 7E , the metal pattern layer MP1 is removed by etching. The metal pattern layer MP1 may be removed by dry etching. The conditions for etching the metal pattern layer MP1 may be different from the conditions for etching the first organic layer 521 and the second organic layer 523 .

[0141] Then, refer to Figure 7F, an organic material BM′ including a light blocking material is applied on the organic layer 520 to fill the opening or groove GV of the organic layer 520 arranged in the display area DA and overlap with the wiring portion WA of the peripheral area PA. The light blocking material may include black dye, Cr particles, or metal oxides such as molybdenum oxide. The organic material BM′ may be hardened after being applied.

[0142] Then, refer to Figure 7G The upper surface of the organic layer 520 is exposed by chemical mechanical polishing of the organic material BM' including the light blocking material. Accordingly, a plurality of blocking lines 530 corresponding to the display area DA and a light blocking member BM corresponding to the peripheral area PA may be formed.

[0143] Fig. 8A and Figure 8B is a schematic cross-sectional view of a portion of a display device 1 according to some embodiments. Fig. 8A and Figure 8B In, with Figure 6 The same reference numerals as those in the drawings represent the same components.

[0144] Reference Fig. 8A and Figure 8B , the display device 1 may include: a substrate 100 including a display area DA and a peripheral area PA, a display layer 200 disposed in the display area DA and including a pixel circuit PC and a light emitting device, an encapsulation layer 300 covering the display layer 200 and in which a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330 are stacked, an optical control layer 500 located on the encapsulation layer 300 and including an organic layer 520 in which a plurality of blocking light lines 530 are arranged, and an etch stop layer 400 located above or below the second inorganic encapsulation layer 330. The plurality of blocking light lines 530 may be filled in an opening or groove GV included in the organic layer 520.

[0145] According to some embodiments, the etch stop layer 400 may be disposed in the encapsulation layer 300. For example, the etch stop layer 400 may be located below the second inorganic encapsulation layer 330. In the display area DA, the etch stop layer 400 may be disposed between the organic encapsulation layer 320 and the second inorganic encapsulation layer 330. In the peripheral area PA, the etch stop layer 400 may be disposed between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330. The etch stop layer 400 may extend from the display area DA to the peripheral area PA. The etch stop layer 400 may include a transparent conductive material such as a transparent conductive oxide.

[0146] Since the etch stop layer 400 is disposed in or on the encapsulation layer 300 in the display area DA, components below the etch stop layer 400 may be protected during the etching process of the organic layer 520. Since the etch stop layer 400 overlaps with the wiring portion WA disposed in the peripheral area PA, the wiring WI may be prevented from being damaged during the etching process of the organic layer 520.

[0147] Since the etching stop layer 400 is located below the second inorganic encapsulation layer 330, Figure 8B As shown in FIG, the second inorganic encapsulation layer 330 on the etch stop layer 400 may be partially removed when forming the opening or groove GV of the organic layer 520. According to some embodiments, the second inorganic encapsulation layer 330 may include an opening or groove corresponding to the blocking line 530, and a portion of the blocking line 530 may be disposed in the opening or groove.

[0148] Fig. 9 and Fig.10 is a schematic cross-sectional view of a portion of a display device 1 according to some embodiments. Fig. 9 and Fig.10 In, with Figure 6 The same reference numerals as those in the drawings represent the same components.

[0149] Reference Fig. 9 and Fig.10 The display device 1 may include: a substrate 100 including a display area DA and a peripheral area PA, a display layer 200 arranged in the display area DA and including a pixel circuit PC and a light-emitting device, an encapsulation layer 300 covering the display layer 200 and in which a first inorganic encapsulation layer 310, an organic encapsulation layer 320 and a second inorganic encapsulation layer 330 are stacked, an optical control layer 500 located on the encapsulation layer 300 and including an organic layer 520 in which a plurality of blocking light lines 530 are arranged, and an etching stop layer 400 located above or below the second inorganic encapsulation layer 330.

[0150] In the present embodiment, the etch stop layer 400 may not be disposed in the display area DA and overlap the wiring portion WA of the peripheral area PA.

[0151] like Fig. 9 As shown in , the etch stop layer 400 may be located on the second inorganic encapsulation layer 330 in the peripheral area PA. Fig.10 As shown in FIG. 4 , the etch stop layer 400 may be disposed between the first inorganic encapsulating layer 310 and the second inorganic encapsulating layer 330 in the peripheral area PA.

[0152] Since the etch stop layer 400 overlaps the wiring portion WA arranged in the peripheral area PA, the wiring WL may be prevented from being damaged during the etching process of the organic layer 520 .

[0153] like Fig.10 As shown in , when the etch stop layer 400 is located below the second inorganic encapsulation layer 330, the second inorganic encapsulation layer 330 may include an opening or a groove corresponding to the blocking line 530, and a portion of the blocking line 530 may be disposed in the opening or the groove.

[0154] As described above, in one or more embodiments, since an optical control layer including a plurality of blocking light rays is provided instead of a polarizing layer, the quality of a display device may be relatively improved.

[0155] It should be understood that the embodiments described herein should be considered in a descriptive sense only, and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered to be applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made without departing from the spirit and scope of the embodiments according to the present disclosure as defined in the appended claims and their equivalents.

Claims

1. A display device, comprising: A substrate, the substrate comprising a display area and a peripheral area; A display layer, the display layer being in the display area and comprising a pixel circuit and a light emitting device; an encapsulation layer, the encapsulation layer covering the display layer, and in which a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer are stacked; an optical control layer, the optical control layer being on the encapsulation layer and comprising an organic layer in which a plurality of blocking light lines are arranged; as well as An intermediate layer is above or below the second inorganic encapsulation layer.

2. The display device according to claim 1, further comprising: A wiring portion is in the peripheral region and includes a wiring extending from the display region, wherein the intermediate layer overlaps the wiring portion.

3. The display device according to claim 1, wherein: The intermediate layer includes a transparent conductive material.

4. The display device according to any one of claims 1 to 3, wherein: The organic layer includes a first organic layer and a second organic layer on the first organic layer, and each of the plurality of blocking light rays is filled in an opening of the second organic layer and an opening or a groove of the first organic layer.

5. The display device according to claim 4, wherein: The second organic layer has a thickness greater than that of the first organic layer.

6. The display device according to claim 4, wherein: The thickness of the second organic layer is in the range of 30 μm to 40 μm.

7. The display device according to claim 4, further comprising: A dam is disposed in the peripheral region at the same layer as the first organic layer and spaced apart from the first organic layer.

8. The display device according to claim 7, further comprising: A light blocking member is on the dam and includes a same material as that of the plurality of blocking lines.

9. The display device according to any one of claims 1 to 3, wherein: The organic layer includes a plurality of openings or grooves, and the plurality of blocking light rays are filled in the plurality of openings or grooves, respectively.

10. The display device according to any one of claims 1 to 3, wherein: The plurality of light-blocking lines are spaced apart from one another at regular first intervals along one direction.

11. The display device according to any one of claims 1 to 3, wherein: The intermediate layer is on the second inorganic encapsulation layer and extends from the display area to the peripheral area.

12. The display device according to any one of claims 1 to 3, wherein: The intermediate layer is below the second inorganic encapsulation layer and extends from the display area to the peripheral area.

13. The display device according to any one of claims 1 to 3, wherein: The intermediate layer is arranged in the peripheral region and is not arranged in the display region.

14. The display device according to claim 13, wherein: In the peripheral region, the intermediate layer is on the second inorganic encapsulating layer.

15. The display device according to claim 13, wherein: In the peripheral region, the intermediate layer is between the first inorganic encapsulating layer and the second inorganic encapsulating layer.

16. A display device comprising: A substrate, the substrate comprising a display area and a peripheral area; A display layer, the display layer being in the display area and comprising a pixel circuit and a light emitting device; a wiring portion in the peripheral region and including wiring extending from the display region; an encapsulation layer, the encapsulation layer covering the display layer, and in which a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer are stacked; an optical control layer, the optical control layer being on the encapsulation layer and comprising an organic layer, in which a plurality of blocking light rays are respectively filled in a plurality of openings or grooves; as well as A protective layer is on or below the second inorganic encapsulation layer and includes a transparent conductive oxide.

17. The display device according to claim 16, wherein: The organic layer includes a first organic layer and a second organic layer on the first organic layer, wherein a thickness of the second organic layer is greater than a thickness of the first organic layer.

18. The display device according to claim 17, further comprising: A dam is disposed in the peripheral region at the same layer as the first organic layer and spaced apart from the first organic layer.

19. The display device according to claim 16, wherein: The plurality of light-blocking lines are spaced apart from one another at regular first intervals along one direction.

20. The display device according to claim 16, wherein: The protective layer partially overlaps the wiring in the peripheral region.

Images