Thermoplastic resin composition for light emitting diode reflector and molded article comprising same

Abstract

The thermoplastic resin composition for a light emitting diode reflector of the present invention is characterized by comprising: about 100 parts by weight of a polyester resin comprising a repeating unit represented by Chemical Formula 1; about 5 to about 50 parts by weight of glass fibers; about 0.1 part by weight to about 7 parts by weight of an isobutylene-containing aromatic vinyl-based polymer; about 0.1 to about 4 parts by weight of a hindered amine light stabilizer having a weight average molecular weight of about 2,100 g / mol to about 4,000 g / mol; from about 0.1 to about 4 parts by weight of a sodium phosphate salt; and about 0.1 to about 7 parts by weight of talc. The thermoplastic resin composition for a light emitting diode reflector has excellent heat resistance, transparency, moldability, and the balance of these properties.

Description

Technical Field

[0001] The present invention relates to a thermoplastic resin composition for a light emitting diode reflector and a molded product containing the same. More specifically, the present invention relates to a thermoplastic resin composition for a light emitting diode reflector having excellent heat resistance, transparency, molding processability and a balance of these properties and a molded product containing the same. Background Art

[0002] Light emitting diodes (LEDs) and organic light emitting diodes (OLEDs) are rapidly replacing conventional light sources and are attracting much attention due to their superior energy efficiency and long life. Usually, a light emitting diode is packaged with a reflector, a reflector cup, a scrambler, a housing, and other component materials to maximize light efficiency through high reflectivity. In the past, a high-heat-resistant polyester resin composition with a high whiteness was developed for use in such component materials.

[0003] However, recently, for reasons of processability and productivity, high heat resistance and high transmittance have been required to be satisfied simultaneously, and there has been a problem that conventional polyester resin compositions have difficulty satisfying such conditions.

[0004] Therefore, in order to be used as a material for light-emitting diode components that simultaneously satisfies high heat resistance and high transmittance, it is necessary to develop a thermoplastic resin composition for light-emitting diode reflectors that is excellent in heat resistance, transparency, molding processability, and a balance of these properties.

[0005] The background art of the present invention is disclosed in Korean Patent Publication No. 10-2013-0076733 and the like. Summary of the invention

[0006] An object of the present invention is to provide a thermoplastic resin composition for a light emitting diode reflector having excellent heat resistance, transparency, moldability, and a balance between these properties.

[0007] Another object of the present invention is to provide a reflector formed of the above-mentioned thermoplastic resin composition and a semiconductor device including the same.

[0008] The above objects and other objects of the present invention will be fully achieved by the present invention described below.

[0009] 1. One aspect of the present invention relates to a thermoplastic resin composition for a light emitting diode reflector. The thermoplastic resin composition for a light emitting diode reflector comprises: about 100 parts by weight of a polyester resin comprising a repeating unit represented by the following chemical formula 1; about 5 parts by weight to about 50 parts by weight of glass fiber; about 0.1 parts by weight to about 7 parts by weight of an isobutylene-containing aromatic vinyl polymer; about 0.1 parts by weight to about 4 parts by weight of a hindered amine light stabilizer having a weight average molecular weight of about 2,100 g / mol to about 4,000 g / mol; about 0.1 parts by weight to about 4 parts by weight of a sodium phosphate salt; and about 0.1 parts by weight to about 7 parts by weight of talc.

[0010] [Chemical formula 1]

[0011]

[0012] In the above Chemical Formula 1, Ar is an arylene group having 6 to 18 carbon atoms, R1 and R3 are each independently a linear alkylene group having 1 to 10 carbon atoms, and R2 is a cyclic alkylene group having 5 to 12 carbon atoms.

[0013] 2. In the specific example of 1 above, the polyester resin may include a repeating unit represented by the following chemical formula 1a:

[0014] [Chemical formula 1a]

[0015]

[0016] 3. In the specific example of 1 or 2 above, the isobutylene-containing aromatic vinyl polymer may be a polymer of a reaction mixture comprising an aromatic vinyl monomer and isobutylene.

[0017] 4. In the specific examples 1 to 3 above, the isobutylene-containing aromatic vinyl polymer may include at least one of a styrene-isobutylene block copolymer and a styrene-isobutylene-styrene block copolymer.

[0018] 5. In the specific examples 1 to 4 above, the hindered amine light stabilizer may include one or more of the following substances: an oligomeric condensate of 2,4-dichloro-6-[(2,2,6,6-tetramethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-2,2,6,6-tetramethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine; a oligomeric condensate of 2,4-dichloro-6-[(1,2,2,6,6-pentamethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-1,2,2,6,6-pentamethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine; An oligomeric condensate of oxazine; an oligomeric condensate of 2,4-dichloro-6-[(1-propoxy-2,2,6,6-tetramethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-1-propoxy-2,2,6,6-tetramethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine; and an oligomeric condensate of 2,4-dichloro-6-[(1-acyloxy containing 2,2,6,6-tetramethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-1-acyloxy-2,2,6,6-tetramethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine.

[0019] 6. In the specific examples 1 to 5 above, the sodium phosphate salt may include one or more of sodium pyrophosphate, sodium tripolyphosphate, sodium tetrapolyphosphate, sodium pentapolyphosphate and sodium hexametaphosphate.

[0020] 7. In the above specific examples 1 to 6, according to ASTM D648, under a load of 18.56 kgf / cm 2 The heat deformation temperature (HDT) of a 6.4 mm thick specimen of the thermoplastic resin composition for a light emitting diode reflector measured under the condition of a heating rate of 120° C. / hour may be about 230° C. to about 270° C.

[0021] 8. In the specific examples 1 to 7 above, the light transmittance of a 1 mm thick specimen of the thermoplastic resin composition for a light emitting diode reflector measured according to ASTM D1003 may be about 55% to about 80%.

[0022] 9. In the specific examples 1 to 8 above, the thermoplastic resin composition for a light emitting diode reflector may satisfy the following formula 1:

[0023] [Formula 1]

[0024] Ta-Tb<15%

[0025] In the above formula 1, Ta is the light transmittance of a 1 mm thick sample measured according to ASTM D1003, and Tb is the light transmittance measured according to ASTM D1003 after the sample is kept at 270° C. for 10 minutes.

[0026] 10. In the specific examples 1 to 9 above, when a circular specimen of the thermoplastic resin composition for a light-emitting diode reflector having a diameter of 100 mm and a thickness of 2 mm is injection molded at an injection molding temperature of 300° C. and a mold temperature of 120° C., the pressure required for mold demolding may be about 170 N to about 200 N.

[0027] 11. Another aspect of the present invention relates to a reflector, wherein the reflector is formed from the thermoplastic resin composition for a light emitting diode reflector according to any one of 1 to 9 above.

[0028] 12. Another aspect of the present invention relates to a semiconductor device, wherein the semiconductor device includes the reflector.

[0029] The present invention has the following effects: namely, providing a thermoplastic resin composition for a light-emitting diode reflector having excellent heat resistance, transparency, moldability and a balance of these properties, as well as a reflector formed from the composition and a semiconductor device including the reflector. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a cross-sectional view of a semiconductor device including a reflector formed of the thermoplastic resin composition for a light emitting diode reflector according to an embodiment of the present invention. DETAILED DESCRIPTION

[0031] Hereinafter, the present invention is described in detail as follows.

[0032] The thermoplastic resin composition for a light emitting diode reflector of the present invention comprises: (A) a polyester resin; (B) glass fiber; (C) an isobutylene-containing aromatic vinyl polymer; (D) a hindered amine light stabilizer; (E) sodium phosphate; and (F) talc.

[0033] In the present specification, “a to b” indicating a numerical range is defined as “≥a and ≤b”.

[0034] (A) Polyester resin

[0035] The polyester resin of a specific example of the present invention is a material that can improve the heat resistance, impact resistance, mechanical strength such as rigidity, etc. of the thermoplastic resin composition even at high temperatures, and may include a repeating unit represented by the following Chemical Formula 1.

[0036] [Chemical formula 1]

[0037]

[0038] In the above chemical formula 1, Ar is an arylene group having 6 to 18 carbon atoms, R1 and R3 are each independently a linear alkylene group having 1 to 10 carbon atoms, and R2 is a cyclic alkylene group having 5 to 12 carbon atoms. Among them, -R1-R2-R3- is derived from alicyclic diol, and the total number of carbon atoms may be 7 to 22. The polyester resin includes a cyclic structure in its main chain, and thus has a relatively high melting temperature, for example, may be above about 200° C., but is not limited thereto.

[0039] In a specific example, the polyester resin can be prepared from a dicarboxylic acid component including an aromatic dicarboxylic acid and its derivatives and a diol component including an alicyclic diol by a known polycondensation method.

[0040] In specific examples, the dicarboxylic acid component may be terephthalic acid, isophthalic acid, 1,2-naphthalene dicarboxylic acid, 1,4-naphthalene dicarboxylic acid, 1,5-naphthalene dicarboxylic acid, 1,6-naphthalene dicarboxylic acid, 1,7-naphthalene dicarboxylic acid, 1,8-naphthalene dicarboxylic acid, 2,3-naphthalene dicarboxylic acid, 2,6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid, etc., but is not limited thereto. These may be used alone or in combination.

[0041] In a specific example, as the alicyclic diol, an alicyclic diol having 7 to 22 carbon atoms, such as 1,4-cyclohexanedimethanol (CHDM), etc. can be used, but it is not limited thereto.

[0042] In a specific example, the polyester resin may be a polycyclohexylene dimethylene terephthalate (PCT) resin including a repeating unit represented by the following Chemical Formula 1a.

[0043] [Chemical formula 1a]

[0044]

[0045] In a specific example, the polyester resin may include a repeating unit represented by the above Chemical Formula 1a, wherein the repeating unit represented by the above Chemical Formula 1a accounts for about 50 mol% to about 100 mol% of all repeating units (100 mol%). Within the above range, the thermoplastic resin composition for a light emitting diode reflector may have excellent injection molding processability, impact resistance, rigidity, and the like.

[0046] In a specific example, the polyester resin may have a weight average molecular weight of about 3,000 g / mol to about 200,000 g / mol, such as about 5,000 g / mol to about 150,000 g / mol, as measured by gel permeation chromatography (GPC) in a hexafluoroisopropanol (HFIP) solvent. Within the above range, the thermoplastic resin composition for a light emitting diode reflector may have excellent injection molding processability, impact resistance, rigidity, and the like.

[0047] (B) Glass fiber

[0048] The glass fiber of a specific example of the present invention can be applied to the polyester resin together with an isobutylene-containing aromatic vinyl polymer, a hindered amine light stabilizer with a specific molecular weight, a sodium phosphate salt and talc, so as to improve the heat resistance, transparency, molding processability and balance of these properties of the thermoplastic resin composition used for the light-emitting diode reflector. The glass fiber can include circular cross-sectional glass fiber, flat-shaped glass fiber and a combination thereof.

[0049] In a specific example, the circular cross-section glass fiber may be a glass fiber having an average diameter of about 5 μm to about 15 μm, such as about 6 μm to about 14 μm, of the circular cross-section measured by an optical microscope. Within the above range, the thermoplastic resin composition for the light emitting diode reflector may have excellent rigidity, impact resistance, and the like.

[0050] In a specific example, the aspect ratio of the cross section of the flat glass fiber measured by an optical microscope may be about 1.5 to about 4, for example, about 2 to about 4, and the short diameter may be about 6 μm to about 10 μm, for example, about 6 μm to about 9 μm. Within the above range, the thermoplastic resin composition for the light emitting diode reflector may have excellent rigidity, impact resistance, etc.

[0051] In a specific example, the average length of the glass fiber before extrusion may be about 1 mm to about 5 mm, and the average length after extrusion (processing) may be about 100 μm to about 700 μm, for example, about 110 μm to about 690 μm. Within the above range, the thermoplastic resin composition for the light emitting diode reflector may have excellent impact resistance, rigidity, appearance characteristics, etc.

[0052] In a specific example, the glass fiber may be coated with a surface treatment agent to increase the bonding strength with thermoplastic resin composition components such as polyester resin. The surface treatment agent may be a silane compound, a carbamate compound, an epoxy compound, etc., but is not limited thereto.

[0053] In a specific example, the glass fiber may be included in an amount of, for example, about 5 parts by weight to about 50 parts by weight, for example, about 10 parts by weight to about 45 parts by weight, relative to about 100 parts by weight of the polyester resin. When the content of the glass fiber is less than about 5 parts by weight relative to about 100 parts by weight of the polyester resin, the heat resistance of the thermoplastic resin composition for the light-emitting diode reflector may be reduced, and when the content exceeds about 50 parts by weight, the transparency, molding processability, etc. of the thermoplastic resin composition for the light-emitting diode reflector may be reduced.

[0054] (C) Isobutylene-containing aromatic vinyl polymers

[0055] The isobutylene-containing aromatic vinyl polymer of a specific example of the present invention can be applied to the polyester resin together with glass fiber, a hindered amine light stabilizer having a specific molecular weight, sodium phosphate salt and talc, so as to improve the heat resistance, transparency, molding processability and balance of these physical properties of the thermoplastic resin composition used for the light-emitting diode reflector. As the isobutylene-containing aromatic vinyl polymer, a polymer containing a reaction mixture of an aromatic vinyl monomer and isobutylene can be used.

[0056] In a specific example, the isobutylene-containing aromatic vinyl polymer may include a styrene-isobutylene block copolymer, a styrene-isobutylene-styrene block copolymer, and a combination thereof.

[0057] In a specific example, the content of isobutylene in the isobutylene-containing aromatic vinyl polymer may account for about 70 wt % to about 90 wt %, for example, about 75 wt % to about 85 wt % in 100 wt % of the total isobutylene-containing aromatic vinyl polymer. Within the above range, the thermoplastic resin composition for the light emitting diode reflector may have excellent impact resistance, molding processability, etc.

[0058] In a specific example, the melt flow index of the isobutylene-containing aromatic vinyl polymer measured at 230° C. using a 2.16 kg drop weight according to ASTM D1238 may be about 0.1 g / 10 min to about 30 g / 10 min, for example, about 0.1 g / 10 min to about 20 g / 10 min. Within the above range, the thermoplastic resin composition for a light emitting diode reflector may have excellent impact resistance, molding processability, and the like.

[0059] In a specific example, about 0.1 to about 7 parts by weight, for example, about 1 to about 6 parts by weight of the isobutylene-containing aromatic vinyl polymer may be included relative to about 100 parts by weight of the polyester resin. When the content of the isobutylene-containing aromatic vinyl polymer is less than about 0.1 parts by weight relative to about 100 parts by weight of the polyester resin, the heat resistance (light transmittance decreases at high temperatures), molding processability, etc. of the thermoplastic resin composition for light emitting diode reflectors may decrease, and when it exceeds about 7 parts by weight, the transparency, heat resistance (light transmittance decreases at high temperatures), molding processability, etc. of the thermoplastic resin composition for light emitting diode reflectors may decrease.

[0060] (D) Hindered amine light stabilizer

[0061] A specific example of a hindered amine light stabilizer (HALS) of the present invention can be applied to the polyester resin together with glass fiber, isobutylene-containing aromatic vinyl polymer, sodium phosphate salt and talc, so as to improve the heat resistance, transparency, molding processability and balance of these properties of the thermoplastic resin composition used for the light emitting diode reflector. The hindered amine light stabilizer having a weight average molecular weight of about 2,100 g / mol to about 4,000 g / mol can be used.

[0062] In a specific example, the weight average molecular weight of the hindered amine light stabilizer measured by gel permeation chromatography (GPC) may be about 2,100 g / mol to about 4,000 g / mol, for example, about 2,100 g / mol to about 3,500 g / mol. When the weight average molecular weight of the hindered amine light stabilizer is less than about 2,100 g / mol, the heat resistance (light transmittance decrease at high temperature) of the thermoplastic resin composition for the light emitting diode reflector may decrease, and when it exceeds about 4,000 g / mol, the anti-discoloration property of the thermoplastic resin composition for the light emitting diode reflector may decrease.

[0063] In a specific example, the hindered amine light stabilizer may include a triazine compound, for example, an oligomeric condensate of 2,4-dichloro-6-[(2,2,6,6-tetramethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-2,2,6,6-tetramethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine; an oligomeric condensate of 2,4-dichloro-6-[(1,2,2,6,6-pentamethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-1,2,2,6,6-pentamethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine; An oligomeric condensate of 2,4-dichloro-6-[(1-propoxy-2,2,6,6-tetramethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-1-propoxy-2,2,6,6-tetramethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine; and an oligomeric condensate of 2,4-dichloro-6-[(1-acyloxy-2,2,6,6-tetramethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-1-acyloxy-2,2,6,6-tetramethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine; and combinations thereof, etc.

[0064] In a specific example, about 0.1 to about 4 parts by weight, such as about 0.2 to about 3 parts by weight, of the hindered amine light stabilizer may be included relative to about 100 parts by weight of the polyester resin. When the content of the hindered amine light stabilizer is less than about 0.1 parts by weight relative to about 100 parts by weight of the polyester resin, the heat resistance (light transmittance decreases at high temperatures) of the thermoplastic resin composition for the light emitting diode reflector may decrease, and when it exceeds about 4 parts by weight, the transparency and anti-discoloration properties of the thermoplastic resin composition for the light emitting diode reflector may decrease.

[0065] (E) Sodium phosphate

[0066] The sodium phosphate salt of a specific example of the present invention can be applied to the polyester resin together with glass fiber, isobutylene-containing aromatic vinyl polymer, hindered amine light stabilizer with a specific molecular weight and talc, so as to improve the heat resistance, transparency, molding processability and balance of these physical properties of the thermoplastic resin composition used for the light-emitting diode reflector. Conventional sodium phosphate salts used for thermoplastic resin compositions can be used.

[0067] In specific examples, sodium pyrophosphate, sodium tripolyphosphate, sodium tetrapolyphosphate, sodium pentapolyphosphate, sodium hexametaphosphate, and combinations thereof can be used as the sodium phosphate salt.

[0068] In a specific example, about 0.1 to about 4 parts by weight, for example, about 0.5 to about 3 parts by weight of the sodium phosphate salt may be included relative to about 100 parts by weight of the polyester resin. When the content of the sodium phosphate salt is less than about 0.1 parts by weight relative to about 100 parts by weight of the polyester resin, the heat resistance (light transmittance decreases at high temperatures), anti-discoloration, etc. of the thermoplastic resin composition for the light emitting diode reflector may decrease, and when it exceeds about 4 parts by weight, the transparency, impact resistance, etc. of the thermoplastic resin composition for the light emitting diode reflector may decrease.

[0069] (F) Talc

[0070] The talc of a specific example of the present invention can be applied to the polyester resin together with glass fiber, isobutylene-containing aromatic vinyl polymer, hindered amine light stabilizer with a specific molecular weight and sodium phosphate salt, so as to improve the heat resistance, transparency, molding processability and balance of these properties of the thermoplastic resin composition used for the light-emitting diode reflector, and conventional plate-shaped talc used for thermoplastic resin compositions can be used.

[0071] In a specific example, the average particle size of the talc measured by a particle size measuring instrument (Malvern Panalytical, Mastersizer 3000) can be about 5 μm to about 20 μm, for example, about 9 μm to about 13 μm. Within the above range, the thermoplastic resin composition for the light emitting diode reflector can be excellent in heat resistance, transparency, and balance of these properties.

[0072] In a specific example, about 0.1 to about 7 parts by weight, for example, about 0.2 to about 6 parts by weight of the talc may be included relative to about 100 parts by weight of the polyester resin. When the content of the talc is less than about 0.1 parts by weight relative to about 100 parts by weight of the polyester resin, the heat resistance, heat resistance (light transmittance decreases at high temperatures), and molding processability of the thermoplastic resin composition for the light emitting diode reflector may decrease. When it exceeds about 7 parts by weight, the transparency, molding processability, and impact resistance of the thermoplastic resin composition for the light emitting diode reflector may decrease.

[0073] The thermoplastic resin composition for a light emitting diode reflector of a specific example of the present invention may further contain conventional additives according to the purpose within the range that does not impair the target effect. Examples of the additives include antioxidants, flame retardants, flame retardant aids, anti-drip agents, nucleating agents, release agents, antibacterial agents, surfactants, coupling agents, plasticizers, compatibilizers, lubricants, antistatic agents, and combinations thereof, but are not limited thereto.

[0074] In a specific example, when the additive is used, the content of the additive may be about 20 parts by weight or less, for example, about 0.1 parts by weight to about 15 parts by weight, relative to about 100 parts by weight of the polyester resin, but is not limited thereto.

[0075] The thermoplastic resin composition for a light emitting diode reflector of a specific example of the present invention can be prepared by a known method. For example, the components and additives added as needed can be mixed by a Henschel mixer, a V-type mixer, a drum mixer, a ribbon mixer, etc., and melt-extruded at a temperature of about 250° C. to about 350° C. using a single-screw extruder or a twin-screw extruder to form pellets.

[0076] In a specific example, according to ASTM D648, at a load of 18.56 kgf / cm 2 The heat deformation temperature (HDT) of a 6.4 mm thick specimen of the thermoplastic resin composition for a light emitting diode reflector measured at a heating rate of 120° C. / hour may be about 230° C. to about 270° C., for example, about 240° C. to about 260° C.

[0077] In a specific example, the light transmittance of a 1 mm thick specimen of the thermoplastic resin composition for a light emitting diode reflector measured according to ASTM D1003 may be about 55% to about 80%, for example, about 55% to about 70%.

[0078] In a specific example, the thermoplastic resin composition for a light emitting diode reflector may satisfy the following formula 1:

[0079] [Formula 1]

[0080] Ta-Tb<15%

[0081] In the above formula 1, Ta is the light transmittance of a sample with a thickness of 1 mm measured according to ASTM D1003, and Tb is the light transmittance of the sample after being kept at 270° C. for 10 minutes and measured according to ASTM D1003.

[0082] In a specific example, when a circular specimen of the thermoplastic resin composition for a light emitting diode reflector having a diameter of 100 mm and a thickness of 2 mm is injection molded at an injection temperature of 300° C. and a mold temperature of 120° C., the pressure required for mold demolding may be about 170N to about 200N, for example, about 180N to about 195N.

[0083] The molded product (reflector) of the present invention is formed from the thermoplastic resin composition for light emitting diode reflectors. For example, the thermoplastic resin composition for light emitting diode reflectors can be used to manufacture a molded product by a known molding method such as injection molding, two-color injection molding, and thermoforming.

[0084] In a specific example, the molded product has excellent heat resistance, transparency, molding processability and balance of these properties, etc., improves the phenomenon of light transmittance decrease at high temperature, and has processability and productivity, etc. Therefore, as long as the characteristics of high heat resistance and high transmittance are required to be satisfied at the same time, and light transmission is required, the molded product can be applied without restriction. For example, it can be used as a reflector or housing for light-emitting devices of various electrical and electronic products, indoor and outdoor lighting, automotive lighting, display equipment, etc., and is particularly suitable for reflectors for light-emitting diodes (LEDs).

[0085] Figure 1 is a cross-sectional view of a semiconductor device including a reflector formed of a thermoplastic resin composition for a light emitting diode reflector according to a specific example of the present invention. Figure 1 As shown, the thermoplastic resin composition for the light emitting diode reflector of the present invention can be formed into a cup-shaped reflector, and can also be formed into various other shapes. The semiconductor device is formed with an electrode 2 on a substrate 3, and a light emitting diode (LED) 6 is mounted on the electrode 2. The light emitting diode (LED) 6 is connected to the electrode 2 through a wire 5. The reflector 1 has a cup shape and has a groove to accommodate the light emitting diode (LED) 6. The groove is encapsulated by a sealing resin 4 so that the light emitting diode (LED) 6 can be protected from the outside. A person with general knowledge in the field to which the present invention belongs can make various modifications and deformations to the above structure according to the above description.

[0086] The present invention is described in more detail below by way of examples. However, these examples are for illustrative purposes only and are not to be construed as limiting the present invention.

[0087] Example

[0088] The specifications of the components used in the following Examples and Comparative Examples are as follows.

[0089] (A) Polyester resin

[0090] Polycyclohexylene dimethylene terephthalate resin (manufacturer: SK Chemicals, product name: Skypura 0502) was used.

[0091] (B) Glass fiber

[0092] A circular cross-section glass fiber (manufacturer: Sanit Gobang, product name: EC10 3MM 910) was used.

[0093] (C) Isobutylene-containing aromatic vinyl polymers

[0094] A styrene-isobutylene-styrene block copolymer (manufacturer: Kaneka, product name: SIBSTAR102T) was used.

[0095] (D) Hindered amine light stabilizer

[0096] (D1) A hindered amine light stabilizer with a weight average molecular weight of about 2,830 g / mol (an oligomeric condensate of 2,4-dichloro-6-[(2,2,6,6-tetramethylpiperidin-4-yl)butylamino]-s-triazine terminated with 4,4'-hexamethylenebis(amino-2,2,6,6-tetramethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine, manufactured by BASF, product name: chimassorb 944) was used.

[0097] (D2) A hindered amine light stabilizer having a weight average molecular weight of about 1,980 g / mol (manufacturer: ADK, product name: LA-63P) was used.

[0098] (D3) A hindered amine light stabilizer having a weight average molecular weight of about 430 g / mol (manufacturer: Clariant, product name: Nylostab S-EED) was used.

[0099] (E) Sodium phosphate

[0100] Sodium pyrophosphate (manufacturer: Innophos, product name: SAPP) was used.

[0101] (F) Talc

[0102] Talc (manufacturer: IMIFABI, product name: HTP05L) was used.

[0103] Examples 1 to 11 and Comparative Examples 1 to 12

[0104] After adding the above components in the amounts shown in Tables 1, 2, 3 and 4 below, pellets were prepared by extrusion at about 300°C. A twin-screw extruder with L / D=36 and a diameter of 45 mm was used for extrusion. The prepared pellets were dried at about 100°C for more than 4 hours and then injection molded in a 6oz injection molding machine (molding temperature: about 300°C, mold temperature: about 120°C) to prepare a thermoplastic resin composition sample for a light-emitting diode reflector. The physical properties of the prepared samples were measured by the following methods, and the results are shown in Tables 1, 2, 3 and 4.

[0105] Physical property measurement method

[0106] (1) Heat Deformation Temperature (HDT, unit: °C): According to ASTM D648, under a load of 18.56 kgf / cm2 The heat deformation temperature of a 6.4 mm thick sample was measured at a heating rate of 120°C / hour.

[0107] (2) Light transmittance (unit: %): According to ASTM D1003, the light transmittance of a sample with a thickness of 1 mm was measured using an NDH-5000 haze meter.

[0108] (3) Evaluation of light transmittance reduction phenomenon at high temperature: A sample for measuring light transmittance of a thermoplastic resin composition for a light emitting diode reflector was prepared, and it was confirmed whether the following formula 1 was satisfied.

[0109] [Formula 1]

[0110] Ta-Tb<15%

[0111] In the above formula 1, Ta is the light transmittance of a 1 mm thick sample measured according to ASTM D1003, and Tb is the light transmittance measured according to ASTM D1003 after the sample is kept at 270° C. for 10 minutes.

[0112] (4) Evaluation of molding processability (injection molding, demolding properties): When a circular specimen with a diameter of 100 mm and a thickness of 2 mm is injection molded at an injection temperature of 300°C and a mold temperature of 120°C, the pressure required for demolding (mold demolding pressure: the resistance value generated by the ejector pin at the center of the specimen measured by a pressure sensor) is measured (unit: N).

[0113] [Table 1]

[0114]

[0115] [Table 2]

[0116]

[0117] [Table 3]

[0118]

[0119] [Table 4]

[0120]

[0121] From the above results, it can be seen that the thermoplastic resin composition for light emitting diode reflectors of the present invention has excellent heat resistance (heat deformation temperature), transparency (light transmittance), molding processability (mold release pressure) and the balance of these properties, and improves the phenomenon of light transmittance decrease at high temperature (heat resistance).

[0122] On the other hand, when the amount of glass fiber used is lower than the content range of the present invention (Comparative Example 1), it is known that the heat resistance of the thermoplastic resin composition for light-emitting diode reflectors is reduced; when the amount of glass fiber used exceeds the content range of the present invention (Comparative Example 2), it is known that the transparency and molding processability of the thermoplastic resin composition for light-emitting diode reflectors are reduced. When the amount of the isobutylene-containing aromatic vinyl polymer used is lower than the content range of the present invention (Comparative Example 3), it is known that the heat resistance (light transmittance decreases at high temperatures) and molding processability of the thermoplastic resin composition for light-emitting diode reflectors are reduced; when the amount of the isobutylene-containing aromatic vinyl polymer used exceeds the content range of the present invention (Comparative Example 4), it is known that the transparency, heat resistance (light transmittance decreases at high temperatures) and molding processability of the thermoplastic resin composition for light-emitting diode reflectors are reduced. When the amount of the hindered amine light stabilizer of the present invention is lower than the content range of the present invention (Comparative Example 5), it is known that the heat resistance of the thermoplastic resin composition for light emitting diode reflectors (the light transmittance decreases at high temperatures) is reduced; when the amount of the hindered amine light stabilizer of the present invention exceeds the content range of the present invention (Comparative Example 6), it is known that the transparency of the thermoplastic resin composition for light emitting diode reflectors is reduced. When the hindered amine light stabilizer (D2) is used instead of the hindered amine light stabilizer (D1) of the present invention (Comparative Example 7), it is known that the heat resistance of the thermoplastic resin composition for light emitting diode reflectors (the light transmittance decreases at high temperatures) is reduced; when the hindered amine light stabilizer (D3) is used (Comparative Example 8), it is known that the heat resistance of the thermoplastic resin composition for light emitting diode reflectors (the light transmittance decreases at high temperatures) is reduced. When the amount of sodium phosphate salt is lower than the content range of the present invention (Comparative Example 9), it can be seen that the heat resistance (light transmittance decreases at high temperatures) of the thermoplastic resin composition for light-emitting diode reflectors decreases; when the amount of sodium phosphate salt exceeds the content range of the present invention (Comparative Example 10), it can be seen that the transparency of the thermoplastic resin composition for light-emitting diode reflectors decreases. In addition, when the amount of talc is lower than the content range of the present invention (Comparative Example 11), it can be seen that the heat resistance, heat resistance (light transmittance decreases at high temperatures) and molding processability of the thermoplastic resin composition for light-emitting diode reflectors decrease; when the amount of talc exceeds the content range of the present invention (Comparative Example 12), it can be seen that the transparency and molding processability of the thermoplastic resin composition for light-emitting diode reflectors decrease.

[0123] The present invention has been described above with the embodiments as the center. A person with general knowledge in the technical field to which the present invention belongs should understand that the present invention can be implemented by modified forms within the scope of the essential characteristics of the present invention. Therefore, the disclosed embodiments should be considered from an illustrative point of view rather than a restrictive point of view. The scope of the present invention is reflected in the claims rather than the foregoing description, and all differences within the scope equivalent to the claims should be interpreted as included in the present invention.

Claims

1. A thermoplastic resin composition for a light emitting diode reflector, characterized in that: Include: About 100 parts by weight of a polyester resin comprising a repeating unit represented by the following Chemical Formula 1; From about 5 parts by weight to about 50 parts by weight of glass fiber; From about 0.1 parts by weight to about 7 parts by weight of an isobutylene-containing aromatic vinyl polymer; about 0.1 parts by weight to about 4 parts by weight of a hindered amine light stabilizer having a weight average molecular weight of about 2,100 g / mol to about 4,000 g / mol; From about 0.1 parts by weight to about 4 parts by weight of a sodium phosphate salt; and about 0.1 to about 7 parts by weight of talc, [Chemical formula 1] In the above Chemical Formula 1, Ar is an arylene group having 6 to 18 carbon atoms, R1 and R3 are each independently a linear alkylene group having 1 to 10 carbon atoms, and R2 is a cyclic alkylene group having 5 to 12 carbon atoms.

2. The thermoplastic resin composition for a light emitting diode reflector according to claim 1, characterized in that: The polyester resin comprises a repeating unit represented by the following Chemical Formula 1a, [Chemical formula 1a] 3. The thermoplastic resin composition for a light emitting diode reflector according to claim 1 or 2, characterized in that: The isobutylene-containing aromatic vinyl polymer is a polymer obtained by reacting an aromatic vinyl monomer with isobutylene.

4. The thermoplastic resin composition for a light emitting diode reflector according to any one of claims 1 to 3, characterized in that: The isobutylene-containing aromatic vinyl polymer includes at least one of a styrene-isobutylene block copolymer and a styrene-isobutylene-styrene block copolymer.

5. The thermoplastic resin composition for a light emitting diode reflector according to any one of claims 1 to 4, characterized in that: The hindered amine light stabilizer comprises one or more of the following substances: an oligomeric condensate of 2,4-dichloro-6-[(2,2,6,6-tetramethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-2,2,6,6-tetramethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine; an oligomeric condensate of 2,4-dichloro-6-[(1,2,2,6,6-pentamethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-1,2,2,6,6-pentamethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine ; an oligomeric condensate of 2,4-dichloro-6-[(1-propoxy-2,2,6,6-tetramethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-1-propoxy-2,2,6,6-tetramethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine; and an oligomeric condensate of 2,4-dichloro-6-[(1-acyloxy-2,2,6,6-tetramethylpiperidin-4-yl)butylamino]-s-triazine terminated by 4,4'-hexamethylenebis(amino-1-acyloxy-2,2,6,6-tetramethylpiperidine) and 2-chloro-4,6-bis(dibutylamino)-s-triazine.

6. The thermoplastic resin composition for a light emitting diode reflector according to any one of claims 1 to 5, characterized in that: The sodium phosphate salt includes one or more of sodium pyrophosphate, sodium tripolyphosphate, sodium tetrapolyphosphate, sodium pentapolyphosphate and sodium hexametaphosphate.

7. The thermoplastic resin composition for a light emitting diode reflector according to any one of claims 1 to 6, characterized in that: According to ASTM D648, at a load of 18.56 kgf / cm 2 The heat deformation temperature HDT of a 6.4 mm thick specimen of the thermoplastic resin composition for a light emitting diode reflector measured under the conditions of a heating rate of 120° C. / hour is about 230° C. to about 270° C.

8. The thermoplastic resin composition for a light emitting diode reflector according to any one of claims 1 to 7, characterized in that: The light transmittance of a 1 mm thick specimen of the thermoplastic resin composition for a light emitting diode reflector measured according to ASTM D1003 is about 55% to about 80%.

9. The thermoplastic resin composition for a light emitting diode reflector according to any one of claims 1 to 8, characterized in that: The thermoplastic resin composition for a light emitting diode reflector satisfies the following formula 1: [Formula 1] Ta-Tb<15% In the above formula 1, Ta is the light transmittance of a 1 mm thick sample measured according to ASTM D1003, and Tb is the light transmittance measured according to ASTM D1003 after the sample is kept at 270° C. for 10 minutes.

10. The thermoplastic resin composition for a light emitting diode reflector according to any one of claims 1 to 9, characterized in that: When a circular test piece of the thermoplastic resin composition for a light emitting diode reflector having a diameter of 100 mm and a thickness of 2 mm is injection molded at an injection temperature of 300° C. and a mold temperature of 120° C., a pressure required for mold demolding is about 170N to about 200N.

11. A reflector formed from the thermoplastic resin composition for a light emitting diode reflector according to any one of claims 1 to 10.

12. A semiconductor device comprising the reflector according to claim 10.

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