Wiring board, electronic device, and electronic module

Abstract

The wiring substrate includes: an insulating substrate having a first surface and a second surface; first and third external electrodes located at opposite corners of the first surface along a first diagonal line; a second external electrode and a fourth external electrode located at opposite corners along a second diagonal line; a first connection electrode connected to the first external electrode via a first through conductor at least partially overlapping the first external electrode and extending from the first surface toward the bottom surface of the recess; and a second connection electrode connected to the third external electrode via a second through conductor at least partially overlapping the third external electrode and extending from the first surface toward the bottom surface of the recess.

Description

Technical Field

[0001] The present disclosure relates to a wiring substrate, an electronic device, and an electronic module for mounting electronic components. Background Art

[0002] As a package-shaped wiring substrate used for connection with an external device, various types of wiring substrates that can be surface-mounted on a mounting substrate together with electronic circuit components have been proposed.

[0003] Patent Document 1 discloses a wiring board having external electrodes located on a first surface of a rectangular insulating substrate and connection electrodes located on a second surface of the insulating substrate, and having a rectangular electronic component mounted thereon in a plan view.

[0004] The connecting electrode includes a first connecting electrode and a second connecting electrode arranged along one side of the electronic component. The external electrodes include first to fourth external electrodes located at four corners of the insulating substrate. The insulating substrate is provided with: an inclined wiring that electrically connects the second external electrode and the fourth external electrode located on the diagonal line of the first surface in a plan view and includes a portion inclined relative to the second surface; and an embedded wiring that extends from the second connecting electrode corresponding to the second external electrode toward the third external electrode in a plan view.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: International Publication No. 2019 / 146699 Pamphlet Summary of the invention

[0008] A wiring substrate according to one embodiment of the present disclosure comprises: an insulating substrate having a first surface, a second surface located on a side opposite to the first surface, and a recessed portion opened on the second surface, and the insulating substrate is rectangular in a plan view; an external electrode located on the first surface; and a connecting electrode located on a bottom surface of the recessed portion, the external electrode comprising: a first external electrode and a third external electrode located at opposite corners of the first surface along a first diagonal line and electrically connected to the connecting electrode; and a second external electrode and a fourth external electrode located at opposite corners of the first surface along a second diagonal line, the second external electrode and the fourth external electrode being located inside the insulating substrate and comprising The wiring substrate is connected to the connecting wiring portion inclined relative to the first surface, and the wiring substrate also has: a first through conductor, at least a portion of which overlaps with the first external electrode when viewed from above, and extends from the first surface toward the bottom surface; and a second through conductor, at least a portion of which overlaps with the third external electrode when viewed from above, and extends from the first surface toward the bottom surface, the connecting electrodes include: a first connecting electrode, which is connected to the first external electrode via the first through conductor; and a second connecting electrode, which is connected to the third external electrode via the second through conductor, and the first connecting electrode and the second connecting electrode are located along the first diagonal line when viewed from above.

[0009] An electronic device according to one aspect of the present disclosure includes the wiring substrate according to one aspect of the present disclosure and an electronic component connected to the wiring substrate.

[0010] An electronic module according to one aspect of the present disclosure includes the electronic device according to one aspect of the present disclosure and a module substrate connected to the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is an overall perspective view of the electronic device according to Embodiment 1 with the cover removed.

[0012] Figure 2 This is a perspective view of the wiring substrate of the electronic device as viewed from the bottom surface side.

[0013] Figure 3 It is a top view of a wiring substrate provided in the above-mentioned electronic device.

[0014] Figure 4 This is a perspective view of the structure of the lower surface of the wiring substrate as viewed from above.

[0015] Figure 5 This is a perspective view in which the structure of the upper surface and the structure of the lower surface of the wiring substrate are overlapped and observed.

[0016] Figure 6 yes Figure 3 A cross-sectional view of the wiring substrate taken along line VI-VI is shown.

[0017] Figure 7 yes Figure 3 and Figure 4 A cross-sectional view of the wiring substrate taken along line VII-VII is shown.

[0018] Figure 8 yes Figure 4 A cross-sectional view of the wiring substrate taken along line VIII-VIII is shown.

[0019] Fig. 9 This is a top view of a wiring substrate according to the second embodiment.

[0020] Fig.10 yes Fig. 9 A cross-sectional view of the wiring substrate taken along line XX shown.

[0021] Fig.11 It is a top view of the wiring substrate involved in Embodiment 3.

[0022] Fig.12 yes Fig.11 A cross-sectional view of the wiring substrate taken along line XII-XII shown.

[0023] Fig.13 This is a cross-sectional view of a wiring substrate according to a fourth embodiment.

[0024] Fig.14 This is a perspective view showing the structure of the upper surface and the structure of the lower surface of the wiring substrate according to the fifth embodiment overlapped with each other.

[0025] Fig.15 This is a perspective view showing the structure of the upper surface and the structure of the lower surface of the wiring substrate according to the sixth embodiment overlapped with each other.

[0026] Fig.16 This is a top view of a wiring substrate according to a seventh embodiment.

[0027] Fig.17 It is a top view of a modified example of the above wiring substrate.

[0028] Fig.18 It is a top view of another modified example of the above wiring substrate.

[0029] Fig.19 It is a top view of still another modified example of the above wiring substrate. DETAILED DESCRIPTION

[0030] [Implementation method 1]

[0031] Hereinafter, an embodiment of the present disclosure will be described based on the accompanying drawings. It is desirable to have a wiring substrate having a structure that can ensure insulation between internal wirings even when the thickness is further reduced. Moreover, according to one embodiment of the present disclosure, insulation between internal wirings can be ensured even when the thickness is further reduced.

[0032] The distinction between upper and lower in the following description is for convenience and does not limit the upper and lower when the wiring substrate and the electronic device are actually used. In this specification, in the insulating substrate 110 or the wiring substrate 100, the surface on the side where the electronic component 150 is mounted is defined as the upper surface. In addition, in the drawings, the positive direction of the Z-axis direction is set as the upper direction. The X-axis direction is the long axis direction of the insulating substrate 110 or the wiring substrate 100, and the Y-axis is an axis perpendicular to the X-axis and the Z-axis.

[0033] Figure 1 This is an overall perspective view of the electronic device 10 according to the present embodiment when the cover 120 is removed. Figure 1 This is a diagram viewed from the upper surface of the side to which the cover body 120 is joined. Figure 2 This is a perspective view of the wiring substrate 100 of the electronic device 10 as viewed from the lower surface on the side opposite to the side joined to the cover body 120 .

[0034] The electronic device 10 includes a wiring substrate 100, an electronic component 150, a cover 120, etc. The wiring substrate 100 includes an insulating substrate 110, electrodes (connection electrodes 113 and external electrodes 114), wiring, and the like.

[0035] The insulating substrate 110 has a first surface S1 located on the side opposite to the side joined to the cover 120, a second surface S2 located on the side opposite to the first surface S1, and a concave area opened on the second surface S2, i.e., a concave portion 111. The insulating substrate 110 has a flat base portion 110b and a frame portion 110a located on the upper surface of the base portion 110b.

[0036] The electronic component 150 is located inside the recess 111. The frame 110a defines the open surface of the recess 111, the bottom surface 7 on the side opposite to the open surface (the mounting surface of the electronic component 150), and the side surface of the recess 111. The side surfaces of the recess 111 are parallel to the z direction. In this specification, the description of "parallel" means that it does not intersect with the reference plane or reference line at a visually recognizable level, and it is not required to be strictly parallel.

[0037] The frame-shaped metallization layer 112 is located on the upper surface of the frame portion 110a, that is, on the joint surface between the frame portion 110a and the cover 120. The frame-shaped metallization layer 112 is joined to the cover 120 using a sealing material such as a gold-tin alloy (AuSn) or a silver solder. Although not particularly limited, here, the size of the wiring substrate 100 is about 0.8 to 10.0 mm on one side in the xy plane, and the thickness in the z direction is about 0.1 to 2.0 mm. The wiring substrate 100 involved in this embodiment is particularly useful when it is difficult to ensure insulation, the thickness of the wiring substrate 100 is less than 0.2 mm, and the thickness of the base 110b is less than 0.1 mm.

[0038] The first connection electrode 1131 and the second connection electrode 1132 are located on the bottom surface 7 of the recess 111. The first connection electrode 1131 and the second connection electrode 1132 are sometimes collectively referred to as the connection electrode 113. By mounting the electronic component 150 on the connection electrode 113, that is, by connecting the electronic component 150 to the wiring substrate 100, the electronic device 10 having the wiring substrate 100 and the electronic component 150 is formed.

[0039] The electronic component 150 is connected to the connection electrode 113 via a bonding material 160 as a conductive adhesive. The bonding material 160 may be, for example, a resin to which conductive particles such as silver are added. When the bonding material 160 is a thermosetting material, the bonding material 160 is pre-applied to the connection electrode 113, and the electronic component 150 is heated in a state where the electronic component 150 is positioned and arranged relative to the connection electrode 113 (bonding material 160), so that the electronic component 150 is connected to the connection electrode 113 via the bonding material 160. The connection electrode 113 may also have a convex shape relative to the bottom surface 7 of the recess 111. Thus, the electronic component 150 is fixed separately from the bottom surface 7 in the recess 111. In the case where the electronic component 150 generates vibration during operation, the thickness of the connection electrode 113 and the bonding material 160 may be determined in such a way that the electronic component 150 does not contact the bottom surface and the cover 120 in the recess 111 during vibration.

[0040] The connecting electrode 113 may also be embedded in the bottom surface 7 of the recess 111, and the upper surface of the connecting electrode 113 may be located on the same plane as the bottom surface 7. Thus, the wiring substrate 100 can be further thinned. In this case, the bonding material is located on the upper surface of the connecting electrode 113, and the electronic component 150 is located on the bonding material. Thus, the electronic component 150 is fixed in the recess 111 separately from the bottom surface 7.

[0041] The first external electrode 1141, the second external electrode 1142, the third external electrode 1143, and the fourth external electrode 1144 are respectively located at the four corners of the first surface S1 on the side opposite to the recess 111 of the base 110b. The first external electrode 1141, the second external electrode 1142, the third external electrode 1143, and the fourth external electrode 1144 are sometimes collectively referred to as the external electrode 114. The external electrode 114 is an external electrode bonded to the module substrate 200. The first external electrode 1141 and the third external electrode 1143 of the external electrode 114 are electrodes to which a potential corresponding to the supply voltage to the electronic component 150 is applied, and the second external electrode 1142 and the fourth external electrode 1144 are grounded electrodes.

[0042] The electronic device 10 is included in the module 1 together with the module substrate 200 to which the external electrodes 114 are bonded using solder 210 (see Figure 6 and Figure 7 ). Examples of the electronic component 150 include a piezoelectric vibration element used in an oscillator or a vibrator, a crystal vibrator, and the like. In addition, a plurality of electronic components 150 may be located in one recess 111 as required.

[0043] The insulating substrate 110 is made of a ceramic material, such as an alumina sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. Here, it is assumed that the insulating substrate 110 is an alumina sintered body (alumina sintered body) for description. The frame portion 110a and the base portion 110b of the insulating substrate 110 are an integral structure.

[0044] The cover 120 is made of a conductive metal and is bonded to the frame-shaped metallization layer 112 to hermetically seal the recess 111. A conductive sealing member (sealing material) such as AuSn or silver solder is used for sealing. The cover 120 may also be grounded. By grounding the cover 120, the propagation of external noise into the recess 111 can be reduced. The cover 120 is connected to the frame-shaped metallization layer 112 via a conductive sealing member. Figure 8 As shown, the frame-shaped metallization layer 112 is connected to the second external electrode 1142 of the wiring substrate 100 via the frame wiring 116 and the through-hole conductor 1153. The frame wiring 116 and the through-hole conductor 1153 will be described later. By grounding the second external electrode 1142, the cover 120 is grounded.

[0045] The frame-shaped metallization layer 112 is made of a conductive metal and is printed on the bonding surface of the frame portion 110a. The frame-shaped metallization layer 112, the exposed surface of the connecting electrode 113, and the exposed surface of the external electrode 114 can be covered with a nickel and / or gold plating layer. For example, nickel can be plated on the exposed surface with a thickness of 1 to 20 μm, and a gold layer can be plated on the nickel plating with a thickness of 0.1 to 3.0 μm. In this way, the possibility of oxidative corrosion on the surface can be reduced, and in addition, the frame-shaped metallization layer 112 located on the upper surface of the insulating substrate 110 as an insulator and the cover body 120 as a metal conductor can be easily and firmly connected.

[0046] Next, the electrical wiring in wiring substrate 100 will be described.

[0047] Figure 3 1 is a top view of wiring substrate 100 . Figure 4 This is a perspective view of the structure of the first surface S1 of the wiring substrate 100 as viewed from the second surface S2 side. Figure 5 This is a perspective view in which the structure of the second surface S2 of the wiring substrate is overlapped with the structure of the first surface S1 and observed. Figure 6 yes Figure 3 The wiring substrate 100 is shown in a cross-sectional view taken along line VI-VI. Figure 7 yes Figure 3 and Figure 4 The wiring substrate 100 is shown in a cross-sectional view taken along line VII-VII. Figure 8 yes Figure 4 The wiring substrate 100 is a cross-sectional view taken along the line VIII-VIII shown in FIG. Figure 6 and Figure 7 , the entire electronic module 1 is shown, which includes an electronic component 150 connected to a connection electrode 113, a cover 120 joined to a frame-shaped metallization layer 112, and a module substrate 200 connected to an external electrode 114 via solder 210 (as an electronic module 1, an electronic device 10 is mounted on the module substrate 200).

[0048] like Figure 6 As shown, the first connection electrode 1131 located at the bottom surface 7 of the recess 111 is connected to the first external electrode 1141 directly below through a first through conductor 1151 that passes through the insulating substrate 110 (base 110b) from top to bottom. The second connection electrode 1132 is connected to the third external electrode 1143 directly below through a second through conductor 1152 that passes through the insulating substrate 110 (base 110b) from top to bottom.

[0049] The convex floating island portion 2 may also be located on the bottom surface of the recessed portion 111. The first connecting electrode 1131 may be provided on the floating island portion 2. The floating island portion 2 may be formed of the same material as the insulating substrate 110, or may be an integral structure with the insulating substrate 110. The thickness (length in the Z direction) of the floating island portion 2 may be appropriately adjusted according to the characteristics and shape of the electronic component 150 carried thereon.

[0050] like Figure 8 As shown, the frame-shaped metallization layer 112 is connected to the second external electrode 1142 via the frame wiring 116 and the through-hole conductor 1153 located inside the frame portion 110a and the base portion 110b. The second external electrode 1142 and the fourth external electrode 1144 are located on the diagonal line of the wiring substrate 100, and are connected to each other through the connection wiring 117 (wiring provided inside the insulating substrate 110) located inside the base portion 110b. The connection wiring 117 is a wiring required for conduction when the exposed surfaces of the second external electrode 1142 and the fourth external electrode 1144 are covered with a plating layer. On the other hand, the first external electrode 1141 and the third external electrode 1143 electrically connected to the electronic component 150 are also located on the diagonal line of the wiring substrate 100.

[0051] By arranging the connection electrodes and the grounding electrodes on diagonal lines, even if the electronic device 10 is mistakenly mounted on the module substrate 200 in a 180-degree rotated posture, the possibility of malfunction of the module substrate 200 due to the polarity of the electronic device 10 can be reduced.

[0052] like Figure 6 and Figure 7 As shown, the first connection electrode 1131 is connected to the first external electrode 1141 through the first through conductor 1151. A coating 110f made of the same material as the insulating substrate 110, that is, a ceramic paste of aluminum oxide, is provided on the first surface S1 of the insulating substrate 110 (base 110b). The ends of the first external electrode 1141 and the fourth external electrode 1144 enter the interior of the insulating substrate 110 through the coating 110f.

[0053] Figure 81 is a cross-sectional view of the wiring substrate 100 along the section line VIII-VIII including the second external electrode 1142, the fourth external electrode 1144, and the connection wiring 117. The first end of the in-frame wiring 116 contacts the side of the frame-shaped metallization layer 112 opposite to the bonding surface of the cover 120, and the in-frame wiring 116 is covered by the coating 110e provided facing the recess 111 and is not exposed to the outside. The in-frame wiring 116 is connected to the upper end of the through-hole conductor 1153 near the second end on the side opposite to the above-mentioned first end. The lower end of the through-hole conductor 1153 is connected to the second external electrode 1142. The material of the coating 110e can be the same material as the coating 110f.

[0054] The two ends of the connection wiring 117 connecting the second external electrode 1142 and the fourth external electrode 1144 are respectively in contact with the second external electrode 1142 and the fourth external electrode 1144, thereby electrically connecting the second external electrode 1142 and the fourth external electrode 1144. The portion other than the two ends of the connection wiring 117 enters the interior of the insulating substrate 110 through the coating layer 110f.

[0055] The connecting wiring 117 includes a portion in which its extension direction (i.e., the direction connecting the second external electrode 1142 and the fourth external electrode 1144) is inclined in an inclined direction relative to the first surface S1 of the insulating substrate 110. That is, the distance of the connecting wiring 117 from the lower surface of the insulating substrate 110 (the thickness of the coating 110f) changes along the extension direction of the connecting wiring 117. The thickness of the coating 110f gradually increases toward the center. As a result, the connecting wiring 117 enters the interior of the base insulating substrate 110 obliquely from both ends relative to the lower surface of the insulating substrate 110. The inclination angle of the connecting wiring 117 relative to the lower surface of the insulating substrate 110 and the length of the inclined portion can be appropriately determined according to the length of the wiring length and / or the positional relationship with other wirings. In addition, it is not necessary for the inclination angle to be constant (i.e., the connecting wiring 117 is a straight line shape in cross-section), and here, the connecting wiring 117 has a curved shape in cross-section.

[0056] Thus, the wiring substrate 100 includes an insulating substrate 110 having a rectangular shape in a plan view and having a first surface S1, a second surface S2 located on the side opposite to the first surface S1, and a recess 111 opened on the second surface S2. In addition, the wiring substrate 100 includes an external electrode 114 located on the first surface S1 and a connection electrode 113 located on the bottom surface of the recess 111.

[0057] The external electrodes 114 include first and third external electrodes 1141 and 1143 located at first diagonally opposite corners of the first surface S1 and electrically connected to the connection electrode 113. Also, the external electrodes 114 include second and fourth external electrodes 1142 and 1144 located at second diagonally opposite corners of the first surface S1.

[0058] The second external electrode 1142 and the fourth external electrode 1144 are connected by a connection wiring 117 that is located inside the insulating substrate 110 and includes a portion that is inclined with respect to the first surface S1 .

[0059] The wiring substrate 100 further includes a first through conductor 1151 which at least partially overlaps with the first external electrode 1141 in a plan view and extends from the first surface S1 toward the bottom surface 7. Furthermore, the wiring substrate 100 further includes a second through conductor 1152 which at least partially overlaps with the third external electrode 1143 in a plan view and extends from the first surface S1 toward the bottom surface 7.

[0060] The connection electrode 113 includes a first connection electrode 1131 connected to the first external electrode 1141 via a first through conductor 1151 , and a second connection electrode 1132 connected to the third external electrode 1143 via a second through conductor 1152 .

[0061] In a top view, the first connection electrode 1131 and the second connection electrode 1132 are located along a first diagonal line.

[0062] According to the above structure, in a perspective view from above, the first external electrode 1141 and the third external electrode 1143 are located at the opposite corners of the first surface S1 along the first diagonal line. In addition, the second external electrode 1142 and the fourth external electrode 1144 are located at the opposite corners of the first surface S1 along the second diagonal line. The second external electrode 1142 and the fourth external electrode 1144 are connected by a connection wiring 117 located inside the insulating substrate 110 and including a portion inclined relative to the first surface S1. In addition, the first connection electrode 1131 and the second connection electrode 1132 are located along the first diagonal line in a perspective view from above. Thus, the wiring connecting the first connection electrode 1131 to the first external electrode 1141 and the wiring connecting the second connection electrode 1132 to the third external electrode 1143 do not overlap with the connection wiring 117 in a perspective view from above. As a result, the insulation between the wiring for connecting the connection electrode 113 to the external electrode 114 and the connection wiring 117 for grounding can be ensured and the wiring substrate 100 can be made thinner.

[0063] Furthermore, since the first connection electrodes 1131 and the second connection electrodes 1132 for connecting the electronic component 150 are arranged along a diagonal line, the posture of the electronic component 150 is easily stabilized when the electronic component 150 is mounted.

[0064] like Figure 3 As shown, the recess 111 has four inner walls 111a, 111b, 111c and 111d. In a top view, the first through conductor 1151 may also be located inside the first external electrode 1141 and offset from the center of the first connection electrode 1131 to the direction opposite to the inner wall 111a and / or the inner wall 111d of the four inner walls close to the first connection electrode 1131. In addition, in a top view, the second through conductor 1152 may also be located inside the second external electrode 1143 and offset from the center of the second connection electrode 1132 to the direction opposite to the inner wall 111b and / or the inner wall 111c of the four inner walls close to the second connection electrode 1132.

[0065] In this case, a portion of the first through conductor 1151 is connected to the first connection electrode 1131 . In addition, a portion of the first through conductor 1151 is exposed on the side surface of the floating island portion 2 and the bottom surface 7 of the recessed portion 111 .

[0066] According to the above configuration, since the first through conductor 1151 is located away from the side wall of the recess 111 to which thermal stress is applied when the wiring substrate 100 is sealed with the cover 120 , the possibility of cracks starting from the first through conductor 1151 due to the thermal stress can be reduced.

[0067] The first connection electrode 1151 may also be offset from at least the center of the first connection electrode 1131 in a direction opposite to the inner wall 111a. Figure 3 In the case of a rectangle that is longer in the X direction than in the Y direction when viewed from above, as shown in FIG. 1 , the thermal stress in the long side direction (X direction) becomes larger. Therefore, offsetting the first connection electrode 1151 from the center of the first connection electrode 1131 along the X direction in the direction opposite to the inner wall 111a is effective in reducing the possibility of the above-mentioned cracks.

[0068] In a plan view, at least a portion of the first through conductor 1151 may be located outside the first connection electrode 1131 .

[0069] According to the above configuration, the possibility of cracks being generated starting from the first through conductor 1151 due to thermal stress when the wiring substrate 100 is sealed by the cover 120 can be further reduced.

[0070] The convex floating island portion 2 may be located on the bottom surface of the concave portion 111 , and the first connection electrode 1131 may be located on the floating island portion 2 .

[0071] According to the above structure, the first connection electrode 1131 is located on the convex floating island portion 2 on the bottom surface of the recess 111 , so that the shape of the first connection electrode 1131 is easily maintained when the recess 111 of the insulating substrate 110 is formed.

[0072] Next, an example of a method for manufacturing wiring substrate 100 will be described.

[0073] First, through holes are provided in a ceramic green sheet as the insulating substrate 110 and a conductor is injected to form the first through conductor 1151 , the second through conductor 1152 , and the via conductor 1153 .

[0074] Then, a metallization paste is applied using a mask to the position of the connection electrode 113 on the upper surface of the ceramic green sheet and the position range suitable for forming the in-frame wiring 116. Next, a ceramic paste made of the same material as the ceramic green sheet is applied using a mask to the appropriate position range covering the portion of the metallization paste corresponding to the in-frame wiring 116. The application of the metallization paste and the application of the ceramic paste are performed, for example, by screen printing.

[0075] After that, on the lower surface side of the ceramic green sheet, a metallization paste is applied to each position of the external electrode 114 using a mask. The second external electrode 1142 and the fourth external electrode 1144 are connected by the metallization paste applied to the position of the connection wiring 117 when viewed from above. From the gap portion of the external electrode 114 (including the portion coated with the metallization paste) to the vicinity of the inner boundary of the external electrode 114, the ceramic paste is further applied in an overlapping manner using a mask. At this time, the amount of ceramic paste applied can be increased or decreased or made uneven according to the inclination angle of the connection wiring 117, etc.

[0076] Then, the ceramic green sheet coated with the metallizing paste and the ceramic paste on both sides is placed on a flat plate, and is pressed from the upper surface side using a press jig having concave and convex shapes corresponding to the concave portion 111, the frame portion 110a, the floating island portion 2, and the connecting electrode 113. As a result, the concave portion 111 is formed, and the metallizing paste as the connecting electrode 113 is pressed down toward the bottom surface 7 of the concave portion 111, forming the floating island portion 2 and the connecting electrode 113 located on the bottom surface 7. In addition, the portion of the in-frame wiring 116 in the metallizing paste extending approximately parallel to the bottom surface 7 of the concave portion 111 is sandwiched between the coating 110e and the ceramic green sheet and buried. The through-hole conductor 1153 is formed in a shape in which the upper end is pressed downward by the metallizing paste and the ceramic paste as the in-frame wiring 116, and does not penetrate from the lower surface of the insulating substrate 110 to the bottom surface of the concave portion 111.

[0077] On the other hand, while the convex part of the press jig forms the concave part 111, the ceramic green sheet, the metallizing paste, and the ceramic paste are deformed and filled into the concave part of the press jig in the area outside the concave part 111. Thus, the metallizing paste that becomes the in-frame wiring 116 sandwiched between the coating layer 110e and the ceramic green sheet is buried in the frame part 110a.

[0078] In addition, on the lower surface side of the ceramic green sheet, the metallization paste and the ceramic paste are formed into a planar shape, and four external electrodes 114 are formed. The inner end of the external electrode 114 is pressed into the inside of the insulating substrate 110 by the ceramic paste. The metallization paste connecting the second external electrode 1142 and the fourth external electrode 1144 is pressed into the inside of the insulating substrate 110 by the ceramic paste to form a connection wiring 117.

[0079] In this way, the coating layers 110f and 110e are integrated with the ceramic green sheet. Then, the wiring substrate 100 is obtained by firing treatment, in which the metallization paste sandwiched therebetween becomes the frame wiring 116 and the connection wiring 117 which are not exposed except at the bonding surfaces with the frame-shaped metallization layer 112, the connection electrode 113 and the external electrode 114. Then, plating treatment, firing treatment, mounting of the electronic component 150, bonding of the cover 120, etc. are performed as needed.

[0080] When the wiring substrate 100 is manufactured by the above-described manufacturing method, when the recess 111 is formed, the conductive material that becomes the first through conductor 1151 may flow toward the wall surface side of the recess 111. By designing the position of the first through conductor 1151 after completion to be away from the side wall of the recess 111, the possibility that the conductive material of the first through conductor 1151 is separated from the range that can be connected to the first connection electrode 1131 can be reduced.

[0081] [Implementation method 2]

[0082] For convenience of description, the same reference numerals are given to components having the same functions as those described in the above embodiment, and their description will not be repeated.

[0083] Fig. 9 It is a plan view of the wiring substrate 100A according to the second embodiment. Fig.10 yes Fig. 9 A cross-sectional view of the wiring substrate taken along line XX shown.

[0084] The wiring substrate 100A includes a first through conductor 1151A and a second through conductor 1152A.

[0085] Alternatively, a portion of the end surface of the first through conductor 1151A on the side of the bottom surface 7 may be connected to the first connection electrode 1131, and the insulating covering portion 3 may be located between the remaining portion of the end surface of the first through conductor 1151A and the bottom surface 7 of the recess 111. For example, the end surface (upper end surface) of the first through conductor 1151A that overlaps with the first connection electrode 1131 in a plan view may be connected to the lower surface of the first connection electrode 1131. On the other hand, the end surface (upper end surface) of the first through conductor 1151A that does not overlap with the first connection electrode 1131 in a plan view may abut against the lower surface of the covering portion 3 located between the bottom surface 7 of the recess 111.

[0086] Alternatively, a portion of the end surface (upper end surface) of the second through conductor 1152A on the bottom surface 7 side is connected to the second connecting electrode 1132 , and the insulating covering portion 3 is located between the remaining portion of the end surface of the second through conductor 1152A and the bottom surface 7 of the recess 111 .

[0087] According to this structure, the first and second through conductors 1151A and 1152A are covered by the covering portion 3 and are not exposed on the bottom surface 7 of the recessed portion 111. Therefore, the exposed surfaces of the first and second through conductors 1151A and 1152A are not plated on the bottom surface 7 of the recessed portion 111. Therefore, the possibility of the first and second through conductors 1151A and 1152A protruding from the bottom surface 7 of the recessed portion 111 can be reduced. As a result, the possibility of the first and second through conductors 1151A and 1152A contacting the electronic component 150 is reduced.

[0088] [Implementation method 3]

[0089] Fig.11 It is a plan view of wiring substrate 100B according to the third embodiment. Fig.12 yes Fig.11 The wiring substrate 100B is shown in a cross-sectional view taken along line XII-XII.

[0090] The wiring substrate 100B includes a first through conductor 1151B and a second through conductor 1152B.

[0091] The wiring substrate 100B may also have an internal wiring 4, which is connected to the end face on the bottom surface 7 side of the first through conductor 1151B and at least partially extends along a surface substantially parallel to the first surface S1, and the first through conductor 1151B is located inside the internal wiring 4 when viewed from above. In addition, the wiring substrate 100B may also have a covering portion 3, which is located between the internal wiring 4 and the bottom surface 7 of the recess 111 and is adjacent to the first connecting electrode 1131 when viewed from above. The internal wiring 4 is a wiring that connects the first through conductor 1151B and the first connecting electrode 1131. When viewed from above, the internal wiring 4 overlaps with at least a portion of the first connecting electrode 1131. Fig.11 In the illustrated example, a portion of the first through conductor 1151B overlaps with the first connection electrode 1131 in a plan perspective view. However, the first through conductor 1151B and the first connection electrode 1131 do not necessarily need to overlap.

[0092] According to this structure, the internal wiring 4 is connected to the end of the first through conductor 1151B, so that the connection reliability between the first connection electrode 1131 and the first through conductor 1151B can be improved. In addition, since the first through conductor 1151B is covered by the covering portion 3 and is not exposed on the bottom surface 7 of the recess 111, the exposed surface of the first through conductor 1151B is not plated on the bottom surface 7 of the recess 111. Therefore, the possibility of the first through conductor 1151B protruding from the bottom surface 7 of the recess 111 can be reduced.

[0093] The wiring substrate 100B may also include an internal wiring 4, which is connected to the end surface of the second through conductor 1152B on the bottom surface 7 side and at least partially extends along a surface substantially parallel to the first surface S1, and the second through conductor 1152B is located inside the internal wiring 4 in a plan view. In addition, the wiring substrate 100B may also include a covering portion 3, which is located between the internal wiring 4 and the bottom surface 7 of the recessed portion 111 and is adjacent to the first connection electrode 1131 in a plan view.

[0094] [Implementation method 4]

[0095] Fig.13 It is a cross-sectional view of a wiring substrate 100C according to the fourth embodiment.

[0096] The wiring substrate 100C includes a first through conductor 1151C.

[0097] The wiring substrate 100C may also include a first internal wiring 5 connected to the end surface of the first through conductor 1151C on the bottom surface 7 side of the recess 111, and at least a portion thereof extends along a surface substantially parallel to the first surface S1, and the first through conductor 1151C is located inside the first internal wiring 5 in a plan view. In addition, the wiring substrate 100C may also include a cover 3C located between the first internal wiring 5 and the bottom surface 7 of the recess 111, and the first through conductor 1151C is located inside the cover 3C in a plan view; and a second internal wiring 6 connecting the first internal wiring 5 and the first connection electrode 1131. In the wiring substrate 100C, at least a portion of the cover 3C is located below the first connection electrode 1131. In a plan view of the wiring substrate 100C, the first through conductor 1151C is located inside the cover 3C. The first internal wiring 5 is a wiring that connects the second internal wiring 6 and the first through conductor 1151C. The shape of the second internal wiring 6 in a plan view may be substantially the same as that of the first connection electrode 1131 .

[0098] According to this structure, since the entire end surface of the first through conductor 1151C is covered by the covering portion 3C, the possibility that the first through conductor 1151C protrudes from the bottom surface 7 of the recessed portion 111 is further reduced.

[0099] [Implementation method 5]

[0100] Fig.14 This is a perspective view showing the structure of the upper surface and the structure of the lower surface of the wiring substrate 100D according to the fifth embodiment overlapped with each other.

[0101] The wiring substrate 100D includes a first connection electrode 1131D, a second connection electrode 1132D, a first through conductor 1151D, a second through conductor 1152D, and an internal wiring 4D.

[0102] The first connection electrode 1131D and the second connection electrode 1132D may be located at positions that are point-symmetrical with respect to the center of the second surface S2 .

[0103] According to this structure, the first connection electrode 1131D and the second connection electrode 1132D at point-symmetrical positions are moved according to the shape / size of the electronic component 150, thereby improving the degree of freedom when mounting the electronic component 150 on the wiring substrate 100D. Since the first connection electrode 1131D and the second connection electrode 1132D are located at point-symmetrical positions, if the electronic component 150 is also point-symmetrical in shape, the electronic component 150 can be stably mounted on the first connection electrode 1131D and the second connection electrode 1132D.

[0104] In a plan view, the connection wiring 117 may extend linearly from the second external electrode 1142 to the fourth external electrode 1144. Thus, the structure of the connection wiring 117 becomes simple and compact.

[0105] The shape of the first connection electrode 1131D and the shape of the second connection electrode 1132D may be different in a plan view.

[0106] When the first connection electrode 1131D and the second connection electrode 1132D have the same shape and are located at a point-symmetrical position, it is difficult to determine the directionality of the wiring substrate 100D. Therefore, the shape of the first connection electrode 1131D and the shape of the second connection electrode 1132D may be different when viewed from above. Thus, either the first connection electrode 1131D or the second connection electrode 1132D can be used as an alignment mark, making it easy to determine the directionality of the wiring substrate 100D.

[0107] In addition, even if the shape of the first connection electrode 1131D is the same as the shape of the second connection electrode 1132D, as shown in FIG. Fig.14 As shown, a portion of the internal wiring 4D connected to the second connecting electrode 1132D may be exposed at the bottom surface 7 of the recess 111, and a portion of the internal wiring 4D may be plated in the same manner as the second connecting electrode 1132D. The internal wiring 4D and the second connecting electrode 1132D are connected inside the insulating substrate 110, and may be in contact with each other when viewed from above, or may be separated from each other by sandwiching a ceramic coating therebetween. Furthermore, the internal wiring 4D connected to the first connecting electrode 1131D is not exposed at the bottom surface 7 of the recess 111. The internal wiring 4D and the first connecting electrode 1131D are connected inside the insulating substrate 110.

[0108] In this way, when a portion of the internal wiring 4D connected to the second connection electrode 1132D is exposed on the bottom surface 7 of the recess 111 and the internal wiring 4D connected to the first connection electrode 1131D is not exposed on the bottom surface 7 of the recess 111, the first connection electrode 1131D, the second connection electrode 1132D, and the exposed internal wiring 4D are no longer rotationally symmetrical with respect to the center of the second surface S2. That is, when the first connection electrode 1131D is rotated 180 degrees with the center of the second surface S2 as the rotation axis, the first connection electrode 1131D does not overlap with the second connection electrode 1132D and the exposed internal wiring 4D.

[0109] Thus, a part of the internal wiring 4D can be used as an alignment mark, and the directionality of the wiring substrate 100D can be easily determined.

[0110] In a top view, the first through conductor 1151D may be located inside the first external electrode 1141 and offset from the center of the first connection electrode 1131D toward the inner wall of the recess 111. In a top view, the second through conductor 1152D may be located inside the third external electrode 1143 and offset from the center of the second connection electrode 1132D toward the inner wall of the recess 111.

[0111] [Implementation method 6]

[0112] Fig.15 This is a perspective view showing the structure of the upper surface and the structure of the lower surface of a wiring substrate 100E according to the sixth embodiment overlapped with each other.

[0113] The wiring substrate 100E includes a first connection electrode 1131E, a second connection electrode 1132E, a first through conductor 1151E, a second through conductor 1152E, and an internal wiring 4E.

[0114] The first connection electrode 1131E and the second connection electrode 1132E may be located at positions that are point-symmetrical with respect to the center of the second surface S2 .

[0115] The first connection electrode 1131E may be located at a position not to overlap the first external electrode 1141 in a plan view. The first connection electrode 1131E is connected to the first external electrode 1141 via the internal wiring 4E and a first through conductor 1151E extending from the first surface S1 toward the bottom surface 7 .

[0116] The second connection electrode 1132E may be located at a position not overlapping the third external electrode 1143 in a plan view. The second connection electrode 1132E is connected to the third external electrode 1143 via the internal wiring 4E and a second through conductor 1152E extending from the first surface S1 toward the bottom surface 7 .

[0117] The connection wiring 117E may include a first portion extending in a direction from the second external electrode 1142 toward the third external electrode 1143 in a plan view. Furthermore, the connection wiring 117E may include a second portion extending in a direction from the third external electrode 1143 toward the fourth external electrode 1144 in a plan view, and a third portion extending in a direction from the first external electrode 1141 toward the fourth external electrode 1144 in a plan view. In this way, the connection wiring 117E may be configured in a crank shape.

[0118] If the connection wiring 117E is configured in this way, even if the first connection electrode 1131E is moved to a position smaller than Fig.14 The first connection electrode 1131D shown is closer to the second external electrode 1142, so that the second connection electrode 1132E moves to a position smaller than Fig.14The second connecting electrode 1132D shown is closer to the position of the fourth external electrode 1144, which can also reduce the possibility of short circuit between the connecting wiring 117E and the first connecting electrode 1131E, and between the connecting wiring 117E and the second connecting electrode 1132E, thereby improving the freedom of wiring design of the wiring substrate 100E.

[0119] The connection wiring 117E may extend from the second external electrode 1142 to the fourth external electrode 1144 in a plan view and may include a first portion that is bent and extended so as to be away from the first connection electrode 1131E in a plan view. Furthermore, the connection wiring 117E may include a second portion that is bent and extended so as to be away from the second connection electrode 1132E in a plan view. In this way, the connection wiring E may also be configured in a curved S-shape.

[0120] In this way, the connection wiring 117E is configured to be bent or curved between the second external electrode 1142 and the fourth external electrode 1144. In this way, even when the first connection electrode 1131E is configured to be offset from the corner of the bottom surface 7 of the recess 111 to the central side, or when the first connection electrode 1131E is changed to a shape extending to the central side, or when the inner end of the first connection electrode 1131E is located closer to the central side, the distance between the first connection electrode 1131E and the connection wiring 117E can be lengthened compared to the straight connection wiring 117. Therefore, the insulation between the connection wiring 117E and the first connection electrode 1131E can be ensured.

[0121] [Implementation method 7]

[0122] Fig.16 It is a top view of a wiring substrate 100F according to the seventh embodiment.

[0123] The wiring substrate 100F further includes a pillow portion 130. The pillow portion 130 is provided at each corner of the recess 111 along one of the diagonals of the bottom surface 7 of the recess 111 in a plan view, and two pillow portions 130 are provided in total. The pillow portion 130 has a rectangular shape in a plan view and is an insulator protruding from the bottom surface 7 of the recess 111. The outer edge of the pillow portion 130 may be adjacent to the frame portion 110a.

[0124] The pillow portion 130 may have a height substantially equal to the upper surface of the first connection electrode 1131 . Alternatively, the pillow portion 130 may have a height substantially equal to the height obtained by adding the thickness of the first connection electrode 1131 and the bonding material 160 .

[0125] The pillow portion 130 may be made of an insulating inorganic material. Examples of the insulating inorganic material include ceramics such as alumina sintered body (alumina ceramics), aluminum nitride sintered body, mullite sintered body, or glass ceramic sintered body.

[0126] The pillow portion 130 is located at a position separated from the wall surface of the recess 111. In other words, the pillow portion 130 may be a floating island. When the first and second connection electrodes 1131 and 1132 and the two pillow portions 130 are respectively located on the floating island portion 2, the floating islands are respectively located at the four corners, and the top view shape of the four floating islands of the wiring substrate 100F is symmetrical, so the flatness is excellent.

[0127] The piezoelectric vibration element can be mounted horizontally and stably by the pillow portion 130. The pillow portion 130 can reduce the possibility of damage to the piezoelectric vibration element when an impact is applied to the electronic device 10.

[0128] Fig.17 It is a plan view of a modification of the wiring substrate 100F.

[0129] The wiring substrate 100F may also include a pillow portion 130A. The pillow portion 130A and the frame portion 110a of the insulating substrate 110 (see Figure 1 ) are integrally connected, and one is provided at each corner of the recess 111 along one of the diagonals of the bottom surface 7 of the recess 111, and a total of two are provided. The pillow 130A is integrally connected to the frame 110a, and therefore has superior strength compared to the pillow 130.

[0130] Fig.18 It is a plan view of another modified example of the wiring substrate 100F.

[0131] The wiring substrate 100F may also have a pillow portion 130B. The pillow portion 130B is located at a position separated from the wall surface of the recess 111. In other words, the pillow portion 130B may be a floating island. Two pillow portions 130B are provided opposite to each other along the short sides of the bottom surface 7 of the recess 111. And, the first and second connecting electrodes 1131 and 1132 are located on the pillow portion 130B. In addition, the upper surfaces of the first and second connecting electrodes 1131 and 1132 may be flush with the pillow portion 130B. In other words, a portion of either of the two pillow portions 130B may be the floating island portion 2 (refer to Figure 6 ), and the remaining portion can be a portion that functions as a pillow portion that supports the piezoelectric vibration element. In other words, in the wiring substrate 100F, the first and second connection electrodes 1131 and 1132 are located on the floating island portion 2, and the pillow portion 130B can be integrated with the floating island and extend along the short side direction of the bottom surface 7.

[0132] In this way, since the pillow portion 130B integrally includes the floating island portion 2 where the first and second connection electrodes 1131 and 1132 are located, the pillow portion 130B is stronger than the pillow portion 130A.

[0133] Fig.19 It is a plan view of still another modified example of the wiring substrate 100F.

[0134] The wiring substrate 100F may also include a pillow portion 130C. The pillow portion 130C is integrated with the frame portion 110a. Fig.18 The pillow portion 130B shown is different. Two pillow portions 130C are provided along the short sides of the bottom surface 7 of the recessed portion 111 and are opposed to each other. Thus, the pillow portion 130C is integrated with the frame portion 110a, and thus has a higher strength than the pillow portion 130B.

[0135] The invention involved in the present disclosure is described above based on the drawings and embodiments. However, the invention involved in the present disclosure is not limited to the above-mentioned embodiments. That is, the invention involved in the present disclosure can be variously modified within the scope shown in the present disclosure, and the embodiments obtained by appropriately combining the technical solutions respectively disclosed in different embodiments are also included in the technical scope of the invention involved in the present disclosure. In other words, it should be noted that those skilled in the art can easily make various deformations or modifications based on the present disclosure. In addition, it should be noted that these deformations or modifications are included in the scope of the present disclosure.

[0136] Description of Reference Numerals

[0137] 1 Electronic module

[0138] 2 Floating Island Department

[0139] 3 covered part

[0140] 4 Internal wiring

[0141] 5. First internal wiring

[0142] 6 Second internal wiring

[0143] 7 bottom

[0144] 10 Electronic devices

[0145] 100 Wiring substrate

[0146] 110 Insulation substrate

[0147] 111 recess

[0148] 113 Connecting electrodes

[0149] 114 External Electrode

[0150] 117 Connection Wiring

[0151] 130 Occipital

[0152] 150 Electronic components

[0153] 200 Module Base Plate

[0154] 1131 First connection electrode

[0155] 1132 second connection electrode

[0156] 1141 First external electrode

[0157] 1142 second external electrode

[0158] 1143 Third external electrode

[0159] 1144 fourth external electrode

[0160] 1151 First through conductor

[0161] 1152 Second through conductor

[0162] S1 first side

[0163] S2 Side 2

Claims

1. A wiring substrate, wherein: have: An insulating substrate having a first surface, a second surface located on a side opposite to the first surface, and a recessed portion opened on the second surface, wherein the insulating substrate is rectangular in a plan view; an external electrode, located on the first surface; as well as A connecting electrode is located at the bottom surface of the recess, The external electrode comprises: a first external electrode and a third external electrode, located at opposite corners of the first surface along a first diagonal line and electrically connected to the connection electrode; and The second external electrode and the fourth external electrode are located at opposite corners of the first surface along a second diagonal line, The second external electrode and the fourth external electrode are connected by a connection wiring that is located inside the insulating substrate and includes a portion that is inclined with respect to the first surface. The wiring substrate further comprises: A first through conductor at least partially overlaps the first external electrode in a plan view and extends from the first surface toward the bottom surface; and The second through conductor at least partially overlaps the third external electrode in a plan view and extends from the first surface toward the bottom surface. The connecting electrode comprises: a first connection electrode connected to the first external electrode via the first through conductor; and a second connection electrode connected to the third external electrode via the second through conductor; In a top view, the first connecting electrode and the second connecting electrode are located along the first diagonal line.

2. The wiring substrate according to claim 1, wherein: In a plan view, the first through conductor is located inside the first external electrode and is offset from the center of the first connection electrode in a direction opposite to the inner wall of the recess.

3. The wiring substrate according to claim 2, wherein: In a plan view, at least a portion of the first through conductor is located outside the first connection electrode.

4. The wiring substrate according to any one of claims 1 to 3, wherein: The convex floating island portion is located on the bottom surface of the concave portion. The first connection electrode is located on the floating island portion.

5. The wiring substrate according to any one of claims 1 to 4, wherein: A portion of the end surface of the first through conductor on the bottom side is connected to the first connection electrode. The insulating covering portion is located between the remaining portion of the end surface of the first through-conductor and the bottom surface of the recessed portion.

6. The wiring substrate according to any one of claims 1 to 5, wherein: have: an internal wiring connected to an end surface of the first through conductor on the bottom surface side and at least partially extending along a surface substantially parallel to the first surface, wherein the first through conductor is located inside the internal wiring in a plan view; as well as The covering portion is located between the internal wiring and the bottom surface, and is adjacent to the first connection electrode in a plan view.

7. The wiring substrate according to any one of claims 1 to 6, wherein: have: a first internal wiring connected to an end surface of the first through conductor on the bottom surface side and at least partially extending along a surface substantially parallel to the first surface, wherein the first through conductor is located inside the first internal wiring in a plan view; a covering portion located between the first internal wiring and the bottom surface, wherein the first through conductor is located inside the covering portion in a perspective plan view; as well as The second internal wiring connects the first internal wiring and the first connection electrode.

8. The wiring substrate according to any one of claims 1 to 7, wherein: The first connection electrode and the second connection electrode are located at positions that are point-symmetrical with respect to the center of the second surface.

9. The wiring substrate according to any one of claims 1 to 8, wherein: In a plan view, the connection wiring extends linearly from the second external electrode to the fourth external electrode.

10. The wiring substrate according to any one of claims 1 to 9, wherein: The connection wiring extends from the second external electrode to the fourth external electrode in a plan view, and has a first portion that bends and extends so as to be separated from the first connection electrode in a plan view, and a second portion that bends and extends so as to be separated from the second connection electrode in a plan view.

11. The wiring substrate according to any one of claims 1 to 10, wherein: The connection wiring has: a first portion extending in a direction from the second external electrode toward the third external electrode in a plan view; and a second portion extending in a direction from the third external electrode toward the fourth external electrode in a plan view; and a third portion extending in a direction from the first external electrode toward the fourth external electrode in a plan view.

12. The wiring substrate according to claim 6, wherein: The shape of the first connection electrode is different from the shape of the second connection electrode in a plan view.

13. An electronic device, wherein: have: The wiring substrate according to any one of claims 1 to 12; and The electronic component is connected to the wiring substrate.

14. An electronic module, wherein: have: The electronic device of claim 13; and The module substrate is connected to the electronic device.

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