Ultrasonic transducer, medical device, and method for manufacturing ultrasonic transducer

Abstract

An ultrasonic transducer is provided with: a piezoelectric element layer having a piezoelectric element for transmitting and receiving ultrasonic waves; a de-matching layer that is laminated on the piezoelectric element layer, reflects at least a portion of the ultrasonic waves, and has a first member and a second member having higher conductivity than the first member; and a lead electrically connected to the second member. As a result, provided is an ultrasonic transducer in which noise is reduced and poor connection is prevented.

Description

Technical Field

[0001] The present invention relates to an ultrasonic vibrator, a medical device and a method for manufacturing the ultrasonic vibrator. Background Art

[0002] Conventionally, an ultrasonic transducer having a piezoelectric element for transmitting and receiving ultrasonic waves is known (for example, see Patent Document 1). In the ultrasonic transducer of Patent Document 1, a dematching layer for reflecting ultrasonic waves and an FPC (Flexible Printed Circuits) for transmitting and receiving electric signals with respect to the piezoelectric element are stacked on the back side of the piezoelectric element.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-77940 Summary of the invention

[0006] Problems to be solved by the invention

[0007] However, when an FPC is stacked on the back side of the piezoelectric element, ultrasonic waves reflected by the FPC become noise, which may degrade the quality of ultrasonic images.

[0008] Alternatively, a conductive electrode layer may be formed on the surface of the dematching layer by plating, and a lead wire may be soldered to the electrode layer. However, when soldering the lead wire, the electrode layer may melt and be absorbed by the solder (corroded by the solder), which may result in poor connection.

[0009] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an ultrasonic vibrator, a medical device, and a method for manufacturing the ultrasonic vibrator, which can reduce noise and prevent poor connection.

[0010] Means for solving problems

[0011] In order to solve the above-mentioned problems and achieve the purpose, an ultrasonic vibrator of one embodiment of the present invention comprises: a piezoelectric element layer, which has a piezoelectric element for transmitting and receiving ultrasonic waves; a dematching layer, which is stacked on the piezoelectric element layer, reflects at least a part of the ultrasonic waves, and has a first component and a second component with higher conductivity than the first component; and a lead, which is electrically connected to the second component.

[0012] Furthermore, in the ultrasonic transducer according to one aspect of the present invention, the lead wire is made of a material different from that of the second member.

[0013] Furthermore, in the ultrasonic transducer according to one aspect of the present invention, the lead wire is electrically connected to the second member by solder.

[0014] Furthermore, in an ultrasonic transducer according to one aspect of the present invention, the ultrasonic transducer includes a backing member, the lead wire is provided in the backing member, and the backing member absorbs or attenuates the ultrasonic wave.

[0015] Furthermore, in the ultrasonic transducer according to one aspect of the present invention, the first member is made of a material having a higher acoustic impedance than that of the second member.

[0016] In addition, in an ultrasonic vibrator of one embodiment of the present invention, the second component has: a first surface located between the piezoelectric element layer and the first component; a second surface located on the opposite side of the first surface across the first component; and a third surface connected to the first surface and the second surface.

[0017] Furthermore, in the ultrasonic transducer according to one aspect of the present invention, the thickness of the second surface is equal to or less than 1 / 3 of the thickness of the dematching layer.

[0018] Furthermore, in the ultrasonic vibrator according to one aspect of the present invention, the thickness of the second surface is thicker than the thickness of the first surface and the thickness of the third surface, and the lead wire is electrically connected to the second surface.

[0019] Furthermore, in the ultrasonic vibrator according to one aspect of the present invention, the thickness of the third surface is thicker than the thickness of the first surface and the thickness of the second surface, and the lead wire is electrically connected to the third surface.

[0020] Furthermore, in the ultrasonic transducer according to one aspect of the present invention, a concavo-convex surface is formed between the first member and the second member, and the lead wire is electrically connected to a surface of the second member on which the concavo-convex surface is formed.

[0021] Furthermore, in the ultrasonic transducer according to one aspect of the present invention, the first member and the second member are made of the same material, and the concentration of the conductive material contained in the second member is higher than the concentration of the conductive material contained in the first member.

[0022] In addition, in an ultrasonic vibrator according to one embodiment of the present invention, the first component includes at least one of tungsten (W), cobalt (Co), nickel (Ni), titanium (Ti), chromium (Cr), molybdenum (Mo), tantalum (Ta), and carbon (C).

[0023] In addition, in an ultrasonic vibrator of one embodiment of the present invention, the second component includes at least one of gold (Au), silver (Ag), copper (Cu), cobalt (Co), nickel (Ni), titanium (Ti), chromium (Cr), molybdenum (Mo), tantalum (Ta), and carbon (C).

[0024] Furthermore, a medical device according to one aspect of the present invention includes: an ultrasonic transducer; and an insertion portion that is inserted into a subject and has the ultrasonic transducer disposed at a distal end.

[0025] Furthermore, a medical device according to one aspect of the present invention includes an imaging unit that captures an image of the inside of the subject.

[0026] In addition, a method for manufacturing an ultrasonic vibrator according to one embodiment of the present invention includes: preparing a piezoelectric element layer and a dematching layer, wherein the piezoelectric element layer has a piezoelectric element for transmitting and receiving ultrasonic waves, the dematching layer reflects at least a portion of the ultrasonic waves and has a first component and a second component having a higher conductivity than the first component; stacking the dematching layer on the piezoelectric element layer; and electrically connecting a lead wire to the second component.

[0027] In addition, in a method for manufacturing an ultrasonic vibrator of one embodiment of the present invention, the second component has: a first surface located between the piezoelectric element layer and the first component; a second surface located on the opposite side of the first surface across the first component; and a third surface connected to the first surface and the second surface.

[0028] In the method for manufacturing an ultrasonic transducer according to one aspect of the present invention, the dematching layer is prepared such that the thickness of the second surface is thicker than the thickness of the first surface and the thickness of the third surface, and the lead wire is electrically connected to the second surface.

[0029] In one embodiment of the present invention, in a method for manufacturing an ultrasonic vibrator, the thickness of the second surface of the stacked body formed by stacking the dematching layer on the piezoelectric element layer is made thicker than the thickness of the first surface and the thickness of the third surface by plating, and the lead is electrically connected to the second surface.

[0030] Effects of the Invention

[0031] According to the present invention, it is possible to realize an ultrasonic transducer, a medical device, and a method for manufacturing an ultrasonic transducer in which noise is reduced and connection failure is prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram showing the entire endoscope system.

[0033] Figure 2 It is a perspective view showing the front end of the insertion portion.

[0034] Figure 3 This is a cross-sectional view showing the structure of the ultrasonic transducer having the ultrasonic transducer according to the first embodiment.

[0035] Figure 4 is with Figure 3The cross-sectional view corresponding to the AA lead.

[0036] Figure 5 This is a flowchart showing an outline of the process of the method for manufacturing the ultrasonic transducer according to the first embodiment.

[0037] Figure 6 It is a figure which shows the state of preparing components.

[0038] Figure 7 It is a diagram showing a state of stacking each component.

[0039] Figure 8 It is a figure which shows the state of connecting a lead wire.

[0040] Fig. 9 This is a flowchart showing an outline of the process of the method for manufacturing an ultrasonic vibrator according to the second embodiment.

[0041] Fig.10 It is a figure which shows the state of preparing components.

[0042] Fig.11 It is a diagram showing a state of stacking each component.

[0043] Fig.12 This is a cross-sectional view of an ultrasonic transducer according to the third embodiment.

[0044] Fig.13 It is a figure which shows the state of preparing components.

[0045] Fig.14 It is a diagram showing a state in which each component is stacked.

[0046] Fig.15 It is a figure which shows the state of connecting a lead wire.

[0047] Fig.16 This is a flowchart showing an outline of the process of the method for manufacturing an ultrasonic vibrator according to the fourth embodiment.

[0048] Fig.17 This is a cross-sectional view of an ultrasonic transducer according to the fifth embodiment.

[0049] Fig.18 It is a figure which shows the state of preparing components.

[0050] Fig.19 It is a diagram showing a state of stacking each component.

[0051] Fig. 20 It is a figure which shows the state of connecting a lead wire.

[0052] Fig.21 This is a flowchart showing an outline of the process of the method for manufacturing an ultrasonic vibrator according to the sixth embodiment.

[0053] Fig. 22 It is a figure which shows the state of preparing components.

[0054] Fig.23 It is a diagram showing a state of stacking each component.

[0055] Fig.24 This is a cross-sectional view of an ultrasonic transducer according to the seventh embodiment.

[0056] Fig.25 This is a cross-sectional view of an ultrasonic transducer according to the eighth embodiment.

[0057] Fig.26 This is a cross-sectional view of an ultrasonic transducer according to a ninth embodiment. DETAILED DESCRIPTION

[0058] Hereinafter, embodiments of the ultrasonic vibrator, medical device, and method for manufacturing the ultrasonic vibrator of the present invention will be described with reference to the accompanying drawings. In addition, the present invention is not limited to these embodiments. The present invention can generally be applied to ultrasonic vibrators, medical devices, and methods for manufacturing ultrasonic vibrators.

[0059] In addition, in the description of the drawings, the same or corresponding elements are appropriately marked with the same reference numerals. In addition, it should be noted that the drawings are schematic, and the relationship between the dimensions of the elements, the ratio of the elements, etc. may be different from the actual. The drawings may also contain parts with different relationship between the dimensions and ratios.

[0060] (Implementation Method 1)

[0061] [Schematic structure of endoscope system]

[0062] Figure 1 1 is a schematic diagram showing the entire endoscope system. The endoscope system 1 as a medical device is a system that uses an ultrasonic endoscope to perform ultrasonic diagnosis and treatment inside a human subject. Figure 1 As shown, the endoscope system 1 includes an ultrasonic endoscope 2 , an ultrasonic observation device 3 , an endoscope observation device 4 , and a display device 5 .

[0063] The ultrasonic endoscope 2 can be partially inserted into the subject, and has the functions of transmitting ultrasonic pulses (sound pulses) toward the body wall in the subject, receiving ultrasonic echoes reflected by the subject and outputting echo signals, and photographing the inside of the subject and outputting image signals. In addition, the detailed structure of the ultrasonic endoscope 2 will be described later.

[0064] The ultrasonic observation device 3 is electrically connected to the ultrasonic endoscope 2 via the ultrasonic cable 31, outputs pulse signals to the ultrasonic endoscope 2 via the ultrasonic cable 31, and inputs echo signals from the ultrasonic endoscope 2 to the ultrasonic observation device 3. The ultrasonic observation device 3 performs predetermined processing on the echo signals to generate ultrasonic images.

[0065] An endoscope connector 9 of the ultrasonic endoscope 2 is detachably connected to the endoscope observation device 4. Figure 1 As shown, the endoscope observation device 4 includes a video processor 41 and a light source device 42 .

[0066] The image signal from the ultrasonic endoscope 2 is input to the video processor 41 via the endoscope connector 9. Then, the video processor 41 performs predetermined processing on the image signal to generate an endoscopic image.

[0067] The light source device 42 supplies illumination light for illuminating the inside of the subject to the ultrasonic endoscope 2 via the endoscope connector 9 .

[0068] The display device 5 is formed using liquid crystal, organic EL (Electro Luminescence), CRT (Cathode Ray Tube) or a projector, and displays ultrasonic images generated by the ultrasonic observation device 3 and endoscopic images generated by the endoscopic observation device 4 .

[0069] 〔Structure of Ultrasonic Endoscope〕

[0070] Next, the structure of the ultrasonic endoscope 2 will be described. Figure 1 As shown, the ultrasonic endoscope 2 includes an insertion portion 6 , an operation portion 7 , a universal cable 8 , and an endoscope connector 9 .

[0071] Figure 2 It is a stereoscopic diagram showing the front end of the insertion portion. In addition, below, when describing the structure of the insertion portion 6, the front end side of the insertion portion 6 (the front end side of the insertion direction into the subject) is simply recorded as the "front end side", and the base end side of the insertion portion 6 (the side away from the front end of the insertion portion 6) is recorded as the "base end side".

[0072] The insertion portion 6 is a portion inserted into the subject. Figure 1 or Figure 2 As shown, the insertion portion 6 comprises: an ultrasonic probe 10 disposed at the front end; a rigid member 61 connected to the proximal end side of the ultrasonic probe 10; a bending portion 62 connected to the proximal end side of the rigid member 61 and capable of bending; and a flexible tube 63 ( Figure 1 ).

[0073] In addition, inside the insertion portion 6, the operating portion 7, the universal cable 8 and the endoscope connector 9, there are optical waveguides for transmitting the illumination light supplied from the light source device 42, transducer cables for transmitting pulse signals or echo signals, and signal cables for transmitting image signals, and pipelines for circulating fluids are provided.

[0074] The hard component 61 is a hard component made of a resin material or the like. Figure 2 As shown, an illumination unit 611 for irradiating illumination light into the subject, an imaging unit 612 for imaging the subject, and a treatment instrument channel 613 for allowing a treatment instrument to protrude from the front end of the insertion portion 6 are provided at the front end of the rigid member 61 .

[0075] The illumination unit 611 is disposed at the distal end and includes a light guide that transmits illumination light outputted from the light source device 42 to the distal end of the insertion portion 6 and an illumination lens that irradiates the illumination light emitted from the emission end of the light guide into the subject.

[0076] The imaging unit 612 captures images of the inside of the subject. The imaging unit 612 includes an objective optical system that converges light (subject image) irradiated into the inside of the subject and reflected inside the subject, and an imaging element that captures the subject image converged by the objective optical system. The image signal captured by the imaging element is transmitted to the endoscope observation device 4 (video processor 41) via a signal cable.

[0077] The treatment instrument channel 613 is a passage through which a treatment instrument such as a puncture needle inserted into the insertion portion 6 is protruded to the outside.

[0078] The operation portion 7 is a portion connected to the base end side of the insertion portion 6 and receives various operations from a doctor or the like. Figure 1 As shown in FIG. 1 , the operation section 7 includes a bending knob 71 for performing a bending operation on the bending section 62 and a plurality of operation members 72 for performing various operations.

[0079] Furthermore, the operation portion 7 is provided with a treatment instrument insertion port 73 ( Figure 1 ), the treatment instrument insertion port 73 is connected to the treatment instrument channel 613 via a tube provided inside the bending portion 62 and the flexible tube 63, and is used to insert the treatment instrument into the tube.

[0080] The universal cable 8 extends from the operation unit 7 and is a cable in which a light guide, a transducer cable, a signal cable, and a tube constituting a part of a conduit are arranged.

[0081] The endoscope connector 9 is provided at the end of the universal cable 8. The endoscope connector 9 is connected to the ultrasonic cable 31, and is connected to the video processor 41 and the light source device 42 by being inserted into the endoscope observation device 4.

[0082] 〔Structure of ultrasonic probe〕

[0083] Next, the structure of the ultrasonic probe 10 will be described. Figure 3 FIG. 2 is a cross-sectional view showing the structure of an ultrasonic probe having an ultrasonic transducer according to Embodiment 1. Figure 3 As shown, the ultrasonic probe 10 is a convex ultrasonic transducer including a plurality of ultrasonic transducers 100 arranged in an arc shape, but may be a radial type or a linear type ultrasonic transducer.

[0084] [Structure of ultrasonic vibrator]

[0085] Next, the structure of the ultrasonic vibrator 100 will be described. Figure 4 is with Figure 3 The cross-sectional view corresponding to the AA line. Figure 4 As shown, the ultrasonic transducer 100 includes a piezoelectric element layer 101 , a dematching layer 102 , a lead wire 103 , a backing member 104 , a first acoustic matching layer 105 , and a second acoustic matching layer 106 .

[0086] The piezoelectric element layer 101 has piezoelectric elements for transmitting and receiving ultrasonic waves. Figure 4 The piezoelectric element layer 101 is a rectangular parallelepiped with the left and right sides of the piezoelectric element being the long sides. The piezoelectric element layer 101 converts the pulse signal input via the lead 103 and the dematching layer 102 into an ultrasonic pulse and transmits it to the subject. In addition, the piezoelectric element layer 101 converts the ultrasonic echo reflected by the subject into an electrical echo signal represented by a voltage change and outputs it to the lead 103 via the dematching layer 102.

[0087] The piezoelectric element is formed using PMN-PT single crystal, PMN-PZT single crystal, PZN-PT single crystal, PIN-PZN-PT single crystal or relaxor material. In addition, PMN-PT single crystal is the abbreviation of the solid solution of lead magnesium niobate and lead titanate. PMN-PZT single crystal is the abbreviation of the solid solution of lead magnesium niobate and lead zirconate titanate. PZN-PT single crystal is the abbreviation of the solid solution of lead zinc niobate and lead titanate. PIN-PZN-PT single crystal is the abbreviation of the solid solution of lead indium niobate, lead zinc niobate and lead titanate. Relaxor material is a general term for a three-component piezoelectric material formed by adding a lead composite perovskite as a relaxor material to lead zirconate titanate (PZT) for the purpose of increasing the piezoelectric constant and dielectric constant. The lead composite perovskite is represented by Pb(B1, B2)O3, B1 is any one of magnesium, zinc, indium and scandium, and B2 is any one of niobium, tantalum and tungsten. These materials have excellent piezoelectric effect, so the value of electrical impedance can be reduced even when miniaturized.

[0088] The dematching layer 102 is stacked on the piezoelectric element layer 101 and reflects at least a part of ultrasonic waves. The dematching layer 102 includes a first member 121 and a second member 122 .

[0089] The first component 121 is made of a material having a higher acoustic impedance than the second component 122. The first component 121 is, for example, tungsten carbide having a high acoustic impedance, but may also include at least one of tungsten (W), cobalt (Co), nickel (Ni), titanium (Ti), chromium (Cr), molybdenum (Mo), tantalum (Ta), and carbon (C).

[0090] The second member 122 has higher conductivity than the first member 121. The second member 122 is, for example, gold (Au), but may also include at least one of silver (Ag), copper (Cu), cobalt (Co), nickel (Ni), titanium (Ti), chromium (Cr), molybdenum (Mo), tantalum (Ta), and carbon (C).

[0091] In addition, the second component 122 has a first surface 1221 located between the piezoelectric element layer 101 and the first component 121, a second surface 1222 located on the side of the first component 121 opposite to the first surface 1221, and a third surface 1223 connected to the first surface 1221 and the second surface 1222. The thickness of the second surface 1222 is thicker than the thickness of the first surface 1221 and the thickness of the third surface 1223. In addition, the thickness of the second surface 1222 is preferably less than 1 / 2 of the thickness of the dematching layer 102, and more preferably less than 1 / 3. By not making the thickness of the second surface 1222 too thick, the effect of the dematching layer 102 reflecting ultrasonic waves can be prevented from being reduced. In addition, the thickness of the second surface 1222 refers to the size of the second surface 1222 in the direction perpendicular to the second surface 1222. Similarly, the thickness of the first surface 1221 and the thickness of the third surface 1223 refer to the dimensions of the first surface 1221 and the third surface 1223 in the direction perpendicular to the first surface 1221 and the third surface 1223. In addition, the thickness of the dematching layer 102 refers to the dimension of the dematching layer 102 in the direction in which the dematching layer 102 and the piezoelectric element layer 101 are stacked.

[0092] One end of the lead wire 103 is electrically connected to the second surface 1222 of the second component 122 by solder, but it can also be electrically connected by ultrasonic welding or brazing. In addition, the other end of the lead wire 103 is electrically connected to the ultrasonic observation device 3 via the universal cable 8 and the ultrasonic cable 31, but in Figure 4 The lead wire 103 transmits a pulse signal output from the ultrasonic observation device 3 to each piezoelectric element layer 101 , and transmits an echo signal output from each piezoelectric element layer 101 to the ultrasonic observation device 3 . The lead wire 103 is made of a material different from that of the second member 122 .

[0093] The lead wire 103 is provided in the backing member 104, and the backing member 104 absorbs or attenuates the unnecessary ultrasonic wave generated by the operation of the piezoelectric element layer 101. The backing member 104 is formed using a material with a large absorption rate or attenuation rate, such as an epoxy resin in which fillers such as aluminum oxide and zirconium oxide are dispersed, or a rubber in which the above fillers are dispersed. In addition, depending on the characteristics of the piezoelectric element layer 101 and the observed object, the backing member 104 may not be provided.

[0094] The first acoustic matching layer 105 and the second acoustic matching layer 106 are located relative to the piezoelectric element layer 101 in the direction in which the piezoelectric element layer 101 transmits ultrasonic waves ( Figure 4 In addition, if Figure 3 As shown in FIG. 1 , the first acoustic matching layer 105 and the second acoustic matching layer 106 are formed continuously along the arrangement direction of the plurality of piezoelectric element layers 101, and each piezoelectric element layer 101 is kept in an arc shape. In order to allow sound (ultrasound) to be efficiently transmitted between the piezoelectric element layer 101 and the object of observation, the first acoustic matching layer 105 and the second acoustic matching layer 106 match the acoustic impedance between the piezoelectric element layer 101 and the object of observation. The first acoustic matching layer 105 and the second acoustic matching layer 106 are made of different materials. In addition, in the first embodiment, the structure having two acoustic matching layers (the first acoustic matching layer 105 and the second acoustic matching layer 106) is described, but depending on the characteristics of the piezoelectric element layer 101 and the object of observation, no acoustic matching layer may be provided, one acoustic matching layer may be provided, or three or more acoustic matching layers may be provided.

[0095] [Method for manufacturing ultrasonic vibrator]

[0096] Next, a method for manufacturing an ultrasonic vibrator will be described. Figure 5 This is a flowchart showing an outline of the process of the method for manufacturing the ultrasonic transducer according to the first embodiment.

[0097] like Figure 5 As shown, components for manufacturing the ultrasonic vibrator 100 are prepared (step S1). Figure 6 FIG. 1 is a diagram showing the state of preparing components. Figure 6 As shown in FIG. 1 , a piezoelectric element layer 101, a dematching layer 102, a backing member 104, a first acoustic matching layer 105, and a second acoustic matching layer 106 are prepared. At this time, the thickness of the second surface 1222 of the second member 122 is thicker than the thickness of the first surface 1221 and the thickness of the third surface 1223. This can be achieved by performing plating or sputtering, etc., so that the thickness of the second surface 1222 is thicker than the thickness of the first surface 1221 and the thickness of the third surface 1223 when the second member 122 is formed by plating on the surface of the first member 121.

[0098] Next, the piezoelectric element layer 101, the dematching layer 102, the backing member 104, the first acoustic matching layer 105, and the second acoustic matching layer 106 are stacked with an adhesive or the like (step S2). Figure 7 is a diagram showing the state of stacking various components. Figure 7 As shown, a stacked body including the dematching layer 102 to the second acoustic matching layer 106 is formed.

[0099] Then, the stacked body formed in step S2 is cut by a dicing saw (step S3 ). Thus, the dematching layer 102 and the piezoelectric element layer 101 are cut, and the plate-like piezoelectric element layer 101 becomes a rectangular parallelepiped.

[0100] Then, wiring is mounted on the ultrasonic vibrator 100 (step S4). Figure 8 FIG. 1 is a diagram showing the state of connecting leads. Figure 8 As shown, the lead 103 is electrically connected to the second side 1222 of the second component 122 by solder.

[0101] Finally, the first acoustic matching layer 105 and the second acoustic matching layer 106 are bent into Figure 3 In the arc-shaped state shown, the backing member 104 is filled on the side of the piezoelectric element layer 101 on which the dematching layer 102 is stacked (step S5). As a result, the ultrasonic probe 10 having a plurality of ultrasonic transducers 100 is manufactured.

[0102] According to the first embodiment described above, in step S4, when the lead 103 is electrically connected to the second surface 1222 of the second member 122 by solder, the thickness of the second surface 1222 is increased. As a result, the second member 122 can be prevented from being melted and absorbed by the solder (corroded by the solder), and poor connection can be prevented.

[0103] Furthermore, according to the first embodiment, since the ultrasonic transducer 100 does not include an FPC (flexible printed circuit), it is possible to prevent the generation of noise due to reflection of the FPC.

[0104] In addition, according to Embodiment 1, the dematching layer 102 and the piezoelectric element layer 101 are cut by dicing, and the piezoelectric elements are bent with reference to the first acoustic matching layer 105 and the second acoustic matching layer 106 located outside the piezoelectric elements. Thus, the interval between the piezoelectric elements can be maintained during bending. In contrast, when the piezoelectric element layer 101, the first acoustic matching layer 105, and the second acoustic matching layer 106 are cut by dicing, and the piezoelectric elements are bent with reference to the FPC located inside the piezoelectric elements, the interval between the piezoelectric elements increases during bending, and thus the interval cannot be maintained.

[0105] (Implementation Method 2)

[0106] The structure of the ultrasonic vibrator 100 according to the second embodiment is the same as that of the first embodiment, and therefore the description thereof will be omitted. Fig. 9 This is a flowchart showing an outline of the process of the method for manufacturing an ultrasonic vibrator according to the second embodiment.

[0107] like Fig. 9 As shown, components for manufacturing the ultrasonic vibrator 100 are prepared (step S11). Fig.10 FIG. 1 is a diagram showing the state of preparing components. Fig.10 As shown, a piezoelectric element layer 101, a dematching layer 102, a backing member 104, a first acoustic matching layer 105, and a second acoustic matching layer 106 are prepared. The first surface 1221, the second surface 1222, and the third surface 1223 of the prepared second member 122 have the same thickness. In addition, the thickness of each surface refers to the dimension of each surface in the direction perpendicular to each surface.

[0108] Next, the piezoelectric element layer 101, the dematching layer 102, the backing member 104, the first acoustic matching layer 105, and the second acoustic matching layer 106 are stacked with an adhesive or the like (step S2). Fig.11 is a diagram showing the state of stacking various components. Fig.11 As shown, a stacked body including the dematching layer 102 to the second acoustic matching layer 106 is formed.

[0109] Then, the stacked body formed in step S2 is cut by a dicing saw (step S3 ). Thus, the dematching layer 102 and the piezoelectric element layer 101 are cut, and the plate-like piezoelectric element layer 101 becomes a rectangular parallelepiped.

[0110] Here, the thickness of the second surface 1222 of the dematching layer 102 is increased (step S12). This can be achieved by plating or sputtering the back side of the stack. Figure 7 The subsequent steps are the same as those of the first embodiment, and thus the description thereof is omitted.

[0111] As in the second embodiment described above, the thickness of the second surface 1222 of the second member 122 may be increased after the layers are stacked. In this case, as in the first embodiment, the second member 122 can be prevented from being melted and absorbed by the solder (corroded by the solder), thereby preventing poor connection.

[0112] (Implementation 3)

[0113] Fig.12 2 is a cross-sectional view of an ultrasonic vibrator according to Embodiment 3. Fig.12As shown, in the dematching layer 102A of the ultrasonic transducer 100A of Embodiment 3, a concavoconvex surface is formed between the first member 121A and the second member 122A. Furthermore, the lead wire 103 is electrically connected to the second surface 1222A of the second member 122A where the concavoconvex surface is formed.

[0114] Next, a method for manufacturing the ultrasonic vibrator 100A is described. The method for manufacturing the ultrasonic vibrator according to the third embodiment is as follows. Figure 5 Same process.

[0115] like Figure 5 As shown in FIG. 1 , components for manufacturing the ultrasonic transducer 100A are prepared (step S1 ). Fig.13 FIG. 1 is a diagram showing the state of preparing components. Fig.13 As shown in FIG. 1 , a piezoelectric element layer 101, a dematching layer 102A, a backing member 104, a first acoustic matching layer 105, and a second acoustic matching layer 106 are prepared. At this time, a concave-convex surface is formed between the first member 121A and the second member 122A of the dematching layer 102A. This can be achieved by performing plating on the surface of the first member 121A on which the concave-convex surface is formed so as to fill the concave portion when the second member 122A is formed by plating.

[0116] Next, the piezoelectric element layer 101, the dematching layer 102A, the backing member 104, the first acoustic matching layer 105, and the second acoustic matching layer 106 are stacked with an adhesive or the like (step S2). Fig.14 is a diagram showing the state of stacking various components. Fig.14 As shown, a stacked body including the dematching layer 102A to the second acoustic matching layer 106 is formed.

[0117] Then, the stacked body formed in step S2 is cut by a dicing saw (step S3 ). Thus, the dematching layer 102A and the piezoelectric element layer 101 are cut, and the plate-like piezoelectric element layer 101 becomes a rectangular parallelepiped.

[0118] Then, wiring is mounted on the ultrasound transducer 100A (step S4). Fig.15 FIG. 1 is a diagram showing the connection of leads. Fig.15 As shown, the lead 103 is electrically connected to the second side 1222A of the second component 122A by solder.

[0119] Finally, the first acoustic matching layer 105 and the second acoustic matching layer 106 are bent into Figure 3 In the arc-shaped state shown, the backing member 104 is filled on the side of the piezoelectric element layer 101 on which the dematching layer 102A is stacked (step S5). As a result, an ultrasonic probe having a plurality of ultrasonic transducers 100A is manufactured.

[0120] According to the third embodiment described above, in step S4, when the lead 103 is electrically connected to the second surface 1222A of the second component 122A by solder, a concave-convex surface is formed between the first component 121A and the second surface 1222A. As a result, the second component 122A can be prevented from melting and being absorbed by the solder (corroded by the solder), and poor connection can be prevented.

[0121] (Implementation 4)

[0122] The structure of the ultrasound vibrator 100A according to the fourth embodiment is the same as that of the third embodiment, and therefore the description thereof will be omitted. Fig.16 This is a flowchart showing an outline of the process of the method for manufacturing an ultrasonic vibrator according to the fourth embodiment.

[0123] like Fig.16 As shown, until step S3, the Fig. 9 The same treatment, such as Fig.11 As shown, the dematching layer 102 and the piezoelectric element layer 101 are cut to form a stacked body composed of the dematching layer 102 to the second acoustic matching layer 106. In this stacked body, the first surface 1221, the second surface 1222, and the third surface 1223 of the second member 122 have the same thickness. In addition, the thickness of each surface refers to the dimension of each surface in the direction perpendicular to each surface.

[0124] Next, a concave-convex surface is formed between the first component 121A and the second component 122A of the dematching layer 102A (step S21). This can be achieved by forming a concave-convex surface on the back side of the laminate by etching, laser irradiation, sandblasting, etc., and performing plating processing to fill the concave portion, or attaching a highly conductive component on the back side. Fig.14 The subsequent steps are the same as those in Embodiment 3, and thus the description thereof is omitted.

[0125] As in the fourth embodiment described above, a concave-convex surface may be formed between the first component 121A and the second component 122A of the second component 122A after laminating the layers. In this case, as in the third embodiment, the second component 122A can be prevented from melting and being absorbed by the solder (corroded by the solder), thereby preventing poor connection.

[0126] (Implementation 5)

[0127] Fig.17 2 is a cross-sectional view of an ultrasonic vibrator according to Embodiment 5. Fig.17 As shown, the dematching layer 102B of the ultrasonic transducer 100B according to the fourth embodiment includes a first member 121B and a second member 122B stacked on the surface of the first member 121B on the side opposite to the piezoelectric element layer 101 .

[0128] The first component 121B and the second component 122B are made of the same material, but the concentration of the conductive material in the second component 122B is higher than that in the first component 121B, and the conductivity of the second component 122B is higher than that in the first component 121B. Specifically, the first component 121B and the second component 122B are formed by adding a conductive filler to tungsten carbide, for example, but the concentration of the filler in the second component 122B is higher than that in the first component 121B. In addition, the thickness of the second component 122B is increased so as to prevent it from being absorbed by the solder when the lead 103 is connected. The thickness of the second component 122B is preferably less than 1 / 2 of the thickness of the dematching layer 102B, and more preferably less than 1 / 3. In addition, the thickness of the dematching layer 102B and the thickness of the second component 122B are the respective dimensions in the direction in which the first component 121B and the second component 122B are arranged. In other words, the dimension in the direction perpendicular to the surface to be soldered is taken as the thickness of the dematching layer 102B and the thickness of the second component 122B.

[0129] In addition, in order to make the concentration of the conductive material of the second component 122B higher than that of the first component 121B, for example, the concentration of the binder may be increased in a part of the tungsten carbide to form the second component 122B. That is, a part of the tungsten carbide may be used as the second component 122B, and a part with a relatively low concentration of the binder may be used as the first component 121B. Furthermore, the first component 121B and the second component 122B may be formed separately and joined. That is, it may be formed in such a way that two tungsten carbides with different concentrations of the binder or filler are formed and joined.

[0130] Next, a method for manufacturing an ultrasonic vibrator is described. The method for manufacturing an ultrasonic vibrator of Embodiment 5 is as follows: Figure 5 Same process.

[0131] like Figure 5 As shown, components for manufacturing the ultrasonic transducer 100B are prepared (step S1). Fig.18 FIG. 1 is a diagram showing the state of preparing components. Fig.18 As shown, a piezoelectric element layer 101, a dematching layer 102B, a backing member 104, a first acoustic matching layer 105, and a second acoustic matching layer 106 are prepared. The dematching layer 102B has a first member 121B and a second member 122B having higher conductivity than the first member 121B.

[0132] Next, the piezoelectric element layer 101, the dematching layer 102B, the backing member 104, the first acoustic matching layer 105, and the second acoustic matching layer 106 are stacked with an adhesive or the like (step S2). Fig.19 is a diagram showing the state of stacking various components. Fig.19 As shown, a stacked body including the dematching layer 102B to the second acoustic matching layer 106 is formed.

[0133] Then, the stacked body formed in step S2 is cut by a dicing saw (step S3 ). Thus, the dematching layer 102B and the piezoelectric element layer 101 are cut, and the plate-like piezoelectric element layer 101 becomes a rectangular parallelepiped.

[0134] Then, wiring is mounted on the ultrasonic transducer 100B (step S4). Fig. 20 FIG. 1 is a diagram showing the connection of leads. Fig. 20 As shown, the lead 103 is electrically connected to the second component 122B by solder.

[0135] Finally, the first acoustic matching layer 105 and the second acoustic matching layer 106 are bent into Figure 3 In the arc-shaped state shown, the backing member 104 is filled on the side of the piezoelectric element layer 101 on which the dematching layer 102B is stacked (step S5). As a result, an ultrasonic probe having a plurality of ultrasonic transducers 100B is manufactured.

[0136] According to the fifth embodiment described above, in step S4, when the lead 103 and the second member 122B are electrically connected by solder, the thickness of the second member 122B is increased. As a result, the second member 122B can be prevented from being melted and absorbed by the solder (corroded by the solder), thereby preventing poor connection.

[0137] (Implementation 6)

[0138] The structure of the ultrasound vibrator 100B according to the sixth embodiment is the same as that of the fifth embodiment, and therefore the description thereof will be omitted. Fig.21 This is a flowchart showing an outline of the process of the method for manufacturing an ultrasonic vibrator according to the sixth embodiment.

[0139] like Fig.21 As shown, components for manufacturing the ultrasonic transducer 100B are prepared (step S11). Fig. 22 FIG. 1 is a diagram showing the state of preparing components. Fig. 22 As shown, the piezoelectric element layer 101, the first member 121B, the backing member 104, the first acoustic matching layer 105, and the second acoustic matching layer 106 are prepared.

[0140] Next, the piezoelectric element layer 101, the first member 121B, the backing member 104, the first acoustic matching layer 105, and the second acoustic matching layer 106 are stacked with an adhesive or the like (step S2). Fig.23 is a diagram showing the state of stacking various components. Fig.23 As shown, a stacked body including the first member 121B to the second acoustic matching layer 106 is formed.

[0141] Then, the stacked body formed in step S2 is cut by a dicing saw (step S3 ). Thus, the first member 121B and the piezoelectric element layer 101 are cut, and the plate-like piezoelectric element layer 101 becomes a rectangular parallelepiped.

[0142] Here, the second component 122B of the dematching layer 102B is formed (step S31). This can be achieved by plating, sputtering, dipping, or attaching a highly conductive component to the back side of the stack. Figure 7 The subsequent steps of the same laminated body may be the same as those of the first embodiment, and thus the description thereof will be omitted.

[0143] As in the sixth embodiment described above, the second member 122B may be formed after laminating the layers. In this case, the second member 122B can be prevented from being melted and absorbed by the solder (corroded by the solder), thereby preventing poor connection.

[0144] (Implementation 7)

[0145] Fig.24 2 is a cross-sectional view of an ultrasonic vibrator according to Embodiment 7. Fig.24 As shown, the dematching layer 102C of the ultrasonic transducer 100C of the seventh embodiment includes a first component 121C and a second component 122C. Furthermore, the thickness of the third surface 1223C of the second component 122C is thicker than the thickness of the first surface 1221 and the thickness of the second surface 1222C. The lead wire 103 is electrically connected to the third surface 1223C. In addition, the thickness of each surface refers to the dimension of each surface in the direction perpendicular to each surface.

[0146] According to the seventh embodiment described above, when the lead 103 is electrically connected to the third surface 1223C of the second member 122 by solder, the thickness of the third surface 1223C is increased. As a result, the second member 122C can be prevented from melting and being absorbed by the solder (corrosion by the solder), thereby preventing poor connection.

[0147] (Implementation 8)

[0148] Fig.25 2 is a cross-sectional view of an ultrasonic vibrator according to Embodiment 8. Fig.25 As shown, in the dematching layer 102D of the ultrasonic transducer 100D of the eighth embodiment, a concavoconvex surface is formed between the first component 121D and the second component 122D. Furthermore, the lead wire 103 is electrically connected to the third surface 1223D of the second component 122D on which the concavoconvex surface is formed. In addition, the second surface 1222D has the same thickness as the first surface 1221. The thickness of each surface refers to the dimension of each surface in the direction perpendicular to each surface.

[0149] According to the eighth embodiment described above, when the lead 103 is electrically connected to the third surface 1223D of the second component 122D by solder, a concave-convex surface is formed between the first component 121D and the third surface 1223D. As a result, the second component 122D can be prevented from melting and being absorbed by the solder (corroded by the solder), thereby preventing poor connection.

[0150] (Implementation method 9)

[0151] Fig.26 : is a cross-sectional view of an ultrasonic vibrator according to Embodiment 9. Fig.26 As shown, the dematching layer 102E of the ultrasonic transducer 100E according to the ninth embodiment includes a first member 121E and a second member 122E formed on the side surface of the first member 121E.

[0152] The first component 121E and the second component 122E are made of the same material, but the concentration of the conductive material in the second component 122E is higher than that in the first component 121E, and the conductivity of the second component 122E is higher than that of the first component 121E. In addition, the thickness of the second component 122E is increased so as to prevent it from being absorbed by the solder when the lead 103 is connected. The thickness of the second component 122E is preferably less than 1 / 2 of the thickness of the dematching layer 102E, and more preferably less than 1 / 3. In addition, the thickness of the dematching layer 102E and the thickness of the second component 122E are the respective dimensions in the direction in which the first component 121E and the second component 122E are arranged. In other words, the dimension in the direction perpendicular to the surface to be soldered is taken as the thickness of the dematching layer 102E and the thickness of the second component 122E.

[0153] According to the ninth embodiment described above, when the lead 103 and the second member 122E are electrically connected by solder, the thickness of the second member 122E is increased. As a result, the second member 122E can be prevented from being melted and absorbed by the solder (corroded by the solder), thereby preventing poor connection.

[0154] Although an ultrasonic endoscope has been described as the medical device so far, an ultrasonic catheter may be used, for example.

[0155] Those skilled in the art can easily derive further effects and variations. Therefore, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Therefore, various changes can be made without departing from the spirit or scope of the general inventive concept defined by the attached claims and their equivalents.

[0156] Description of symbols

[0157] 1: Endoscopic system;

[0158] 2: Ultrasonic endoscope;

[0159] 3: Ultrasonic observation device;

[0160] 4: Endoscopic observation device;

[0161] 5: Display device;

[0162] 6: Insertion part;

[0163] 7: Operation department;

[0164] 8: Universal cable;

[0165] 9: Connector for endoscope;

[0166] 10: Ultrasonic probe;

[0167] 31: Ultrasonic cable;

[0168] 41: Video processor;

[0169] 42: light source device;

[0170] 61: Hard parts;

[0171] 62: bending part;

[0172] 63: Flexible pipe;

[0173] 71: Bend knob;

[0174] 72: operating parts;

[0175] 73: Disposal instrument insertion port;

[0176] 100, 100A, 100B, 100C, 100D, 100E: ultrasonic vibrators;

[0177] 101: piezoelectric element layer;

[0178] 102, 102A, 102B, 102C, 102D, 102E: de-matching layer;

[0179] 103: Lead wire;

[0180] 104: backing member;

[0181] 105: first acoustic matching layer;

[0182] 106: second acoustic matching layer;

[0183] 121, 121A, 121B, 121C, 121D, 121E: first component;

[0184] 122, 122A, 122B, 122C, 122D, 122E: second component;

[0185] 611: Lighting Department;

[0186] 612: Camera Department;

[0187] 613: Disposal equipment channel;

[0188] 1221: first side;

[0189] 1222: Side 2;

[0190] 1223: The third side.

Claims

1. An ultrasonic vibrator, comprising: a piezoelectric element layer having piezoelectric elements for transmitting and receiving ultrasonic waves; a dematching layer, which is stacked on the piezoelectric element layer, reflects at least a portion of the ultrasonic wave, and has a first component and a second component having a higher conductivity than the first component; as well as A lead is electrically connected to the second component.

2. The ultrasonic vibrator according to claim 1, wherein: The lead is made of a material different from that of the second member.

3. The ultrasonic vibrator according to claim 1, wherein: The lead is electrically connected to the second member by solder.

4. The ultrasonic vibrator according to claim 1, wherein: The ultrasonic transducer has a backing member, the lead wire is provided in the backing member, and the backing member absorbs or attenuates the ultrasonic wave.

5. The ultrasonic vibrator according to claim 1, wherein: The first member is formed of a material having a higher acoustic impedance than the second member.

6. The ultrasonic vibrator according to claim 1, wherein: The second member has a first surface located between the piezoelectric element layer and the first member, a second surface located on the opposite side of the first surface across the first member, and a third surface connected to the first surface and the second surface.

7. The ultrasonic vibrator according to claim 6, wherein: The thickness of the second surface is less than 1 / 3 of the thickness of the dematching layer.

8. The ultrasonic vibrator according to claim 6, wherein: The thickness of the second surface is thicker than the thickness of the first surface and the thickness of the third surface, The lead is electrically connected to the second surface.

9. The ultrasonic vibrator according to claim 6, wherein: The thickness of the third surface is thicker than the thickness of the first surface and the thickness of the second surface, The lead is electrically connected to the third surface.

10. The ultrasonic vibrator according to claim 1, wherein A concave-convex surface is formed between the first component and the second component, The lead is electrically connected to the surface of the second member on which the concavo-convex surface is formed.

11. The ultrasonic vibrator according to claim 1, wherein The first component and the second component are made of the same material as each other, The concentration of the conductive material contained in the second member is formed to be higher than the concentration of the conductive material contained in the first member.

12. The ultrasonic vibrator according to claim 1, wherein: The first component includes at least one of tungsten (W), cobalt (Co), nickel (Ni), titanium (Ti), chromium (Cr), molybdenum (Mo), tantalum (Ta), and carbon (C).

13. The ultrasonic vibrator according to claim 1, wherein: The second component includes at least one of gold (Au), silver (Ag), copper (Cu), cobalt (Co), nickel (Ni), titanium (Ti), chromium (Cr), molybdenum (Mo), tantalum (Ta), and carbon (C).

14. A medical device, wherein: The medical equipment has: The ultrasonic vibrator according to claim 1; and The insertion portion is inserted into the subject and has the ultrasonic transducer disposed at the distal end.

15. The medical device according to claim 14, wherein: The medical device includes an imaging unit that captures images inside the subject.

16. A method for manufacturing an ultrasonic vibrator, wherein: The manufacturing method of the ultrasonic vibrator comprises: Preparing a piezoelectric element layer and a dematching layer, wherein the piezoelectric element layer has a piezoelectric element for transmitting and receiving ultrasonic waves, and the dematching layer reflects at least a part of the ultrasonic waves and has a first component and a second component having a higher conductivity than the first component; stacking the dematching layer on the piezoelectric element layer; and A lead is electrically connected to the second component.

17. The method for manufacturing an ultrasonic vibrator according to claim 16, wherein: The second member has a first surface located between the piezoelectric element layer and the first member, a second surface located on the opposite side of the first surface across the first member, and a third surface connected to the first surface and the second surface.

18. The method for manufacturing an ultrasonic vibrator according to claim 17, wherein: preparing the dematching layer whose second surface is thicker than the first surface and the third surface, The lead is electrically connected to the second surface.

19. The method for manufacturing an ultrasonic vibrator according to claim 17, wherein: The thickness of the second surface of the stacked body formed by stacking the dematching layer on the piezoelectric element layer is made thicker than the thickness of the first surface and the thickness of the third surface by plating. The lead is electrically connected to the second surface.

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